Processing methods for laminar flow components

Abstract

The present application is applicable to the technical field of precision metering equipment, and proposes a processing method for a laminar flow component, comprising: obtaining a substrate; arranging at least two laminar flow units on the substrate and obtaining a laminar flow plate; stacking the laminar flow plates, connecting each adjacent laminar flow plate between two laminar flow plates through a vacuum diffusion welding process to form a stacked body, and making the laminar flow units on different laminar flow plates face each other; cutting the stacked body along the edge of the laminar flow unit to separate at least two laminar flow component rough blanks from a stacked body; polishing at least two laminar flow component rough blanks; the processing method provided by the present application enables at least two laminar flow components to be processed at one time, thereby improving the processing efficiency; the laminar flow component is formed by stacking a plurality of laminar flow units, so that the length of the laminar flow component can be adjusted by adjusting the number of layers of the laminar flow units, so that the processing method can adapt to different length requirements of laminar flow components.

Description

Technical Field

[0001] The present application relates to the technical field of precision metering equipment, and in particular to a processing method of a laminar flow component. Background Art

[0002] Mass Flow Controller (MFC) is a device that can accurately measure and control gas flow. After the gas enters the MFC, its flow state can be converted into a controllable and measurable laminar flow state, and the gas flow in the MFC flow channel can be controlled. After entering the MFC, the gas is divided into two gas paths, one of which flows through the laminar flow component flow channel, and the other flows through the sensor flow channel. The flow resistance of the sensor flow channel and the laminar flow component flow channel is designed to be a linear ratio. The gas flow through the sensor flow channel can be accurately measured by the sensor, and then the split ratio between the two is calculated to obtain the gas flow through the entire MFC.

[0003] In the current design of laminar flow components, in order to ensure that the gas flow is in a laminar state, a larger flow resistance is required so that the diversion ratio between the laminar flow component flow channel and the sensor flow channel has better linearity. Therefore, the ratio of the length and inner diameter of the fluid channel is usually large, and the fluid channel of the laminar flow component with a large aspect ratio is difficult to process, and the processing accuracy and test consistency are also poor; and the number and size characteristics of the fluid channels of the processed laminar flow component usually need to be designed according to the range of the MFC to adapt to the different flow capacity requirements of mass flow controllers of different specifications for the laminar flow component. Summary of the invention

[0004] In view of the above problems, the present application provides a method for processing a laminar flow component, which can reduce the processing difficulty of the laminar flow component, improve the processing accuracy and efficiency, and at the same time can adapt to the requirements of different ranges of different mass flow controllers.

[0005] The present application embodiment provides a method for processing a laminar flow component, comprising:

[0006] obtaining a substrate;

[0007] Arranging at least two laminar flow units on a substrate to obtain a laminar flow plate;

[0008] Stacking laminar flow plates, connecting adjacent laminar flow plates to form a stacked body by vacuum diffusion welding process, and making the laminar flow units on different laminar flow plates face each other;

[0009] Cutting the stack along the edge of the laminar flow unit to separate at least two laminar flow component rough blanks from the stack;

[0010] At least two laminar flow component rough blanks are polished.

[0011] In the technical solution of the present embodiment, a laminar flow unit is first formed on each laminar flow plate, and then the laminar flow assembly is formed by stacking a plurality of laminar flow units, thereby reducing the difficulty of processing the fluid channel of the laminar flow assembly; at least two laminar flow units can be arranged on a laminar flow plate, so that at least two laminar flow assemblies can be processed at one time, thereby improving the processing efficiency; the laminar flow assembly is formed by stacking a plurality of laminar flow units, so that the length of the laminar flow assembly can be adjusted by adjusting the number of layers of the laminar flow units, thereby enabling the processing method to adapt to the requirements of different measuring ranges of different mass flow controllers.

[0012] In some embodiments, the step of providing at least two laminar flow units on the substrate further includes: forming an anti-reflection structure and a positioning structure on the substrate;

[0013] The step of stacking the laminar flow plates also includes: making the anti-reverse structures of the laminar flow plates face each other, and making the positioning structures of the laminar flow plates face each other.

[0014] In the technical solution of this embodiment, an anti-reverse structure and a positioning structure are formed on the substrate so that each laminar plate can be aligned during the stacking process without prone to abnormal situations such as misalignment, thereby facilitating improved processing efficiency and product yield.

[0015] In some embodiments, the anti-reverse structure includes an anti-reverse through hole penetrating the substrate, the number of the anti-reverse through holes is at least two, and the at least two anti-reverse through holes are asymmetrically arranged around the center of the substrate.

[0016] In the technical solution of this embodiment, at least two anti-reverse through holes are asymmetrically arranged along the center of the substrate to better detect the inversion, rotation or other misalignment of the laminar plate, thereby further improving the processing efficiency and product yield.

[0017] In some embodiments, the positioning structure includes an alignment through hole penetrating the substrate, the number of the alignment through holes is at least two, and the at least two alignment through holes are arranged at intervals around the center of the substrate.

[0018] The technical solution of this embodiment provides some specific structures of the positioning structure, so that the positioning structures of the stacked laminar flow plates can be relative to each other, and it is convenient to fix the positions of the stacked laminar flow plates, thereby further improving the processing efficiency and product yield.

[0019] In some embodiments, in the step of disposing at least two laminar flow units on the substrate, the laminar flow units are formed by an etching process.

[0020] In the technical solution of this embodiment, the laminar flow unit is formed by an etching process to improve processing accuracy and processing efficiency.

[0021] In some embodiments, the step of stacking the laminar flow plates comprises:

[0022] Clean each laminar flow plate and welding pressure head;

[0023] Stacking the laminar flow plates to obtain a laminar flow plate assembly, wherein the laminar flow plates are oriented in the same direction;

[0024] placing the stacked laminar flow plate assembly into a vacuum chamber, and evacuating the vacuum chamber;

[0025] Preheat the stacked laminar plate assembly before welding;

[0026] Diffusion welding is performed on the stacked laminar plate assembly;

[0027] The diffusion-welded laminar plate assembly is cooled to obtain a stacked body.

[0028] In the technical solution of this embodiment, the laminar flow plates are connected to form a stack through a diffusion welding process to reduce the processing difficulty and dimensional consistency of the micropore size characteristics, while also facilitating automated control and improving efficiency; the technical solution of this embodiment further provides some specific methods of diffusion welding to facilitate better welding of the laminar flow plates to form a stack.

[0029] In some embodiments, after the step of stacking the laminar flow plates, the processing method further comprises: inspecting the stack;

[0030] After the step of stacking the laminar flow plates, the processing method further comprises: grinding the stacked body.

[0031] In the technical solution of this embodiment, a step of inspecting the stacked body is provided to inspect the quality of the stacked body, thereby facilitating timely discovery of product quality problems and facilitating improvement of the yield rate of laminar flow components; because a solder resist layer or other impurities are likely to remain on the surface of the stacked laminar boards, the technical solution of this embodiment also provides a grinding process step to reduce the solder resist or other impurities remaining on the stacked body, thereby reducing interference with subsequent processes and facilitating improvement of processing efficiency and the yield rate of laminar flow components.

[0032] In some embodiments, in the step of cutting the stacked body along the edge of the laminar flow unit, the stacked body is cut by a wire cutting process.

[0033] In the technical solution of this embodiment, the stacked body is processed by wire cutting process to improve the processing accuracy and the surface quality of the rough blank of the laminar flow component, and at the same time facilitate automatic control and improve processing efficiency.

[0034] In some embodiments, in the step of polishing the rough laminar flow component, the rough laminar flow component is polished by a plasma polishing process.

[0035] In some embodiments, the step of polishing the rough laminar flow component includes:

[0036] Clean the rough blank of laminar flow components;

[0037] Determine the processing parameters according to the material and surface roughness value of the laminar flow component blank;

[0038] At least two laminar flow component blanks are placed in the polishing machine and polished.

[0039] Because the rough laminar flow component is obtained after wire cutting the stack, it is easy for particles, burrs or other structures to remain on the rough laminar flow component. Therefore, in the technical solution of this embodiment, the rough laminar flow component is treated by a plasma polishing process to reduce the particles, burrs and other structures remaining on the laminar flow component, thereby meeting the laminar flow component's requirements for precision and cleanliness; the technical solution of this embodiment further provides some specific methods of ion polishing processes to facilitate better polishing of the rough laminar flow component and to better reduce the particles, burrs and other structures remaining on the laminar flow component.

[0040] In some embodiments, after the step of polishing the rough laminar flow component, the processing method further comprises: inspecting the polished rough laminar flow component for particles in micropores and surface roughness;

[0041] After the step of polishing the rough laminar flow component, the processing method further comprises: cleaning the polished rough laminar flow component.

[0042] In the technical solution of this embodiment, the polished laminar flow component is inspected to check whether the quality, appearance, etc. of the laminar flow component meet the processing requirements; the polished laminar flow component is cleaned to reduce the polishing agent and other substances remaining on the laminar flow component, so as to ensure the final quality and appearance of the laminar flow component.

[0043] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0045] Figure 1 A schematic diagram of the internal structure of a current mass flow controller.

[0046] Figure 2 A schematic top view of a laminar flow plate provided in some embodiments of the present application.

[0047] Figure 3 for Figure 2 A local enlarged schematic diagram of point A in the middle.

[0048] Figure 4 A three-dimensional schematic diagram of a stacked body provided in some embodiments of the present application.

[0049] Figure 5 A three-dimensional schematic diagram of a laminar flow component provided for some embodiments of the present application.

[0050] Figure 6 A schematic flow chart of a laminar flow component processing method provided for some embodiments of the present application.

[0051] Figure 7 A schematic flow chart of a method for stacking laminar flow plates in a laminar flow component processing method provided in some embodiments of the present application.

[0052] Figure 8 A schematic diagram of the process of polishing a laminar flow component rough blank in the laminar flow component processing method provided in some embodiments of the present application.

[0053] Fig. 9 A schematic flow chart of a laminar flow component processing method provided for some other embodiments of the present application.

[0054] The meanings of the marks in the figure are:

[0055] 100. Substrate;

[0056] 200, laminar flow plate; 201, external through groove; 21, laminar flow unit; 211, sub-plate; 212, internal through hole; 213, connecting part; 22, anti-reverse structure; 23, positioning structure;

[0057] 300, stacked body;

[0058] 400. Laminar flow components. DETAILED DESCRIPTION

[0059] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0060] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0061] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0062] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0063] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0064] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0065] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0066] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0067] Mass Flow Controller (MFC) is a device that can accurately measure and control gas flow. Figure 1 The figure shows the typical MFC structure. After the gas enters the MFC, it first flows through the flow sensor and the laminar flow component. The flow sensor can measure the mass flow in the flow channel and feed back the flow signal to the control printed circuit board (PCB); the PCB adjusts the flow rate by controlling the opening of the downstream control valve. The flow sensor consists of a capillary and a temperature sensing element. When the gas enters the MFC, it is split, with one part of the gas flowing through the laminar flow component and the other part of the gas flowing through the capillary. The capillary and laminar flow components need to keep the gas flowing through in a laminar state, so that the flow in the capillary and the split ratio between the capillary and the laminar flow component can be calculated through laminar flow. The capillary calculates the flow through the temperature changes of the two thermistors upstream and downstream and the thermal boundary temperature, and then calculates the total flow through the MFC through the split ratio. Whether the capillary and laminar flow components are in a laminar state can be judged by the Reynolds number Re. When the Reynolds number is less than 2000, it is considered to be laminar. For pipeline flow, the flow state is related to the pipeline diameter, length and pressure difference. Under laminar flow conditions, the pressure drop calculation formula is as follows, where ΔP is the pressure difference (piezoresistance) ， l is the length of the pipe, d is the diameter of the pipe, ρ is the density, is the average velocity in the pipeline. The longer the pipeline is and the larger the diameter is, the greater the pressure drop is. In order to ensure that the laminar flow components and the capillary split ratio have good linearity, a larger piezoresistance is required to ensure that the flow is in a laminar state, so the flow channel aspect ratio needs to be increased.

[0068]

[0069] However, the processing of fluid channels in laminar flow components with large aspect ratios is difficult, and the processing accuracy and test consistency are also poor; and the number and size characteristics of the fluid channels of the processed laminar flow units usually need to be designed according to the measuring range of the MFC to adapt to the different flow capacity requirements of mass flow controllers of different specifications for laminar flow units.

[0070] Moreover, in the current processing methods, the number and size characteristics of the fluid channels of the laminar flow component usually need to be changed according to the different measuring ranges of the mass flow controller to adapt to the different flow capacity requirements of the laminar flow component by mass flow controllers of different specifications, and the current processing methods are not easy to adjust the number of fluid channels and the length of the laminar flow component and other dimensions.

[0071] Based on the above considerations, in order to reduce the processing difficulty of laminar flow components and improve the processing accuracy and efficiency, an embodiment of the present application provides a processing method for a laminar flow component; at least two laminar flow units are formed on a thinner laminar flow plate to form an internal through hole for forming a fluid channel; the laminar flow plates are stacked, and the internal through holes of the laminar flow units can be relative to and preliminarily form the fluid channel of the laminar flow component; the stacked body is cut along the laminar flow unit to obtain a rough blank of the laminar flow component.

[0072] In such a processing method, the fluid channel of the laminar flow component is formed by splicing together the inner through holes, and the inner through holes are processed on a laminar plate with a relatively thin thickness, thereby reducing the processing difficulty and improving the processing accuracy; at the same time, at least two laminar flow units can be formed on a laminar plate, so that at least two laminar flow components can be obtained by one processing, thereby improving the processing efficiency; the laminar flow component rough blank is formed by cutting after the laminar plates are stacked, and the length of the laminar flow component can be controlled by adjusting the number of stacked layers, so that the processing method can adapt to the length requirements of various laminar flow components.

[0073] In order to illustrate the technical solution of the present application, a description is given below with reference to specific drawings and embodiments.

[0074] First, refer to Figures 3 to 6 Some embodiments of the present application provide a method for processing a laminar flow component 400 , which is used to process the laminar flow component 400 .

[0075] S510: Obtain a substrate 100 .

[0076] In this step, the substrate 100 can be cut manually or by machine to remove other process sheets on the outer circle of the substrate 100 .

[0077] In this step, the shape of the substrate 100 may be rectangular, circular or other shapes; the material of the substrate 100 is the same as that of the laminar flow component 400 , and the material of the substrate 100 may include metal, plastic or other materials.

[0078] The thickness of the substrate 100 should be relatively thin, so as to facilitate processing of the substrate 100 in subsequent steps and reduce the difficulty of processing the substrate 100 .

[0079] S520 : Arrange at least two laminar flow units 21 on the substrate 100 , and obtain a laminar flow plate 200 .

[0080] refer to Figure 2 , Figure 6 , Figure 2 Schematic top view of the laminar flow plate 200 obtained in S520.

[0081] In this step, the laminar flow unit 21 refers to a structure formed on the substrate 100, and multiple laminar flow units 21 can be stacked to form a laminar flow component 400; accordingly, the laminar flow unit 21 includes an internal through hole 212, and after the multiple laminar flow units 21 are stacked, the multiple internal through holes 212 can be relative to each other and form a fluid channel of the laminar flow component 400.

[0082] Two laminar flow units 21 may be disposed on the substrate 100 , or three or more laminar flow units 21 may be formed.

[0083] The laminar flow unit 21 may be formed on the substrate 100 by an etching process, or may be formed on the substrate 100 by cutting, hot pressing or other processes.

[0084] The laminar flow plate 200 refers to a structure formed after the laminar flow unit 21 is formed on the substrate 100 . The laminar flow plate 200 is an intermediate step product in the processing method of the laminar flow component 400 .

[0085] S530: stacking the laminar flow plates 200, connecting adjacent laminar flow plates 200 by vacuum diffusion welding process to form a stacked body 300, and making the laminar flow units 21 on different laminar flow plates 200 face each other.

[0086] refer to Figure 4 , Figure 6 , Figure 4 It is a three-dimensional schematic diagram of the stacked body 300 formed in S530.

[0087] In this step, the stacked body 300 refers to a structure formed by stacking the laminar flow plates 200 . The laminar flow plates 200 can be interconnected and stacked to form a whole through a vacuum diffusion welding process, and the whole is the stacked body 300 .

[0088] The stack 300 is an intermediate step product in the processing method of the laminar flow component 400.

[0089] In the stacking body 300, the laminar flow units 21 are opposite to each other, and the internal through holes 212 in each laminar flow unit 21 are also opposite to each other; in the process of stacking the laminar flow plates 200, the orientation of each laminar flow plate 200 should be kept consistent to reduce the misalignment of the laminar flow units 21 and facilitate subsequent processing steps.

[0090] In this step, the laminar plates 200 are stacked and adjacent laminar plates 200 are connected to obtain a stacked body 300. Two adjacent laminar plates 200 can be connected by a vacuum diffusion welding process. The heat affected zone of the vacuum diffusion welding process is smaller, which can reduce thermal deformation and stress concentration during welding. The vacuum diffusion welding process has high processing accuracy and can adapt to a variety of different materials. The operation of the vacuum diffusion welding process is relatively simple, which facilitates automated production.

[0091] In this step, the stack 300 has a certain thickness. The specific thickness of the stack 300 can be set according to the required length of the laminar flow component 400. The length of the stack 300 can be equal to or slightly greater than the required length of the laminar flow component 400.

[0092] S560 : Cutting the stacked body 300 along the edge of the laminar flow unit 21 to separate at least two laminar flow component blanks from one stacked body 300 .

[0093] In this step, the laminar flow component rough refers to a structure formed by stacking the laminar flow units 21 .

[0094] By cutting the stacking body 300 along the edge of the laminar flow unit 21, other structures outside the laminar flow units 21 in the stacking body 300 can be separated from the laminar flow units 21, and at least two laminar flow component rough blanks can be obtained; the number of laminar flow component rough blanks obtained by cutting a stacking body 300 is the same as the number of laminar flow units 21 on a laminar plate 200.

[0095] In this step, the stacked body 300 may be cut by mechanical cutting, laser cutting, plasma cutting or other cutting processes.

[0096] S570: Polishing the rough blank of laminar flow components.

[0097] This step is mainly used to improve the cleanliness and roughness of the rough laminar flow component to meet the cleanliness and roughness requirements of the laminar flow component 400; this step can be processed by plasma polishing, or by grinding or other polishing processes.

[0098] Taking plasma polishing as an example, plasma polishing is a process that processes the surface of a workpiece based on plasma characteristics. It uses polishing powder, steam, high-speed charged plasma and supporting media to stimulate the surface of the workpiece and reduce its roughness.

[0099] The plasma polishing process has the advantages of high processing efficiency and processing quality. It can effectively and efficiently reduce surface defects, oxides and contaminants on the rough blank of laminar flow components, thereby achieving the effect of reducing surface roughness and improving cleanliness.

[0100] The plasma polishing process also has the advantages of low energy consumption, environmental protection, wide application range, and high degree of automation. It can improve the polishing efficiency of laminar flow component rough blanks while reducing costs.

[0101] Since burrs are easily generated during the cutting process and the surface formed by the cutting process is usually rough, it is not easy to meet the surface roughness requirements of the laminar component 400; therefore, after the laminar component rough blank is formed, the laminar component rough blank is polished through step S550 to improve the surface roughness of the laminar component rough blank and reduce structures such as particles and burrs.

[0102] In the present embodiment, a laminar flow unit 21 is first formed on each laminar plate 200, and then the laminar flow component 400 is formed by stacking a plurality of laminar flow units 21, thereby reducing the difficulty of processing the fluid channel of the laminar flow component 400; at least two laminar flow units 21 can be arranged on a laminar flow plate, so that at least two laminar flow components 400 can be processed at one time, thereby improving the processing efficiency; the laminar flow component 400 is formed by stacking a plurality of laminar flow units 21, so that the length of the laminar flow component 400 can be adjusted by adjusting the number of layers of the laminar flow units 21, so that the processing method can adapt to different length requirements of the laminar flow components 400.

[0103] refer to Figure 2 , Figure 3 In some embodiments, in S520, an outer through groove 201 is formed on the substrate 100, and a laminar flow unit 21 is formed in the outer through groove 201 to obtain a laminar flow plate 200; the outer through groove 201 can be formed on the substrate 100 by an etching process, or can be formed on the substrate 100 by cutting, hot pressing or other processes. The outer through groove 201 can penetrate the substrate 100 and enclose the laminar flow unit 21 in the outer through groove 201.

[0104] The laminar flow unit 21 includes a sub-plate 211 , an inner through hole 212 , and a connecting portion 213 .

[0105] Among them, the sub-plate 211 refers to the part of the substrate 100 surrounded by the outer through groove 201; the shape of the sub-plate 211 can be circular, square or other shapes, and the shape of the sub-plate 211 can be set according to the shape of the laminar flow component 400; according to the shape of the sub-plate 211, the outer through groove 201 can be a circular area enclosed on the substrate 100 to form a circular sub-plate 211, or it can be a square area enclosed on the substrate 100 to form a square sub-plate 211.

[0106] The inner through hole 212 refers to a through hole formed on the sub-plate 211. The number of the inner through holes 212 can be one, or two or more. The shape of the inner through hole 212 can be circular, square or other shapes. The shape of the inner through hole 212 can be set according to the shape of the laminar flow component 400.

[0107] The connection portion 213 refers to a connection structure between the sub-plate 211 and the base plate 100 . The sub-plate 211 is connected to the base plate 100 via the connection portion 213 , so that the laminar flow unit 21 can be stacked together with the laminar flow plate 200 through step S530 .

[0108] Specifically, in the stacking body 300 formed after S530, each laminar flow unit 21 can be stacked synchronously with the stacking of the laminar plates 200; wherein, the sub-plates 211 of each laminar flow unit 21 are opposite to each other, and two adjacent sub-plates 211 are connected to form the main body of the laminar flow component 400; the inner through holes 212 of each sub-plate 211 are opposite to each other and connected to each other to form a fluid channel of the laminar flow component 400.

[0109] refer to Figure 2 , Figure 6 In some embodiments, in the step of disposing at least two laminar flow units 21 on the substrate 100 , that is, in S520 , the step further includes: forming an anti-reflection structure 22 and a positioning structure 23 on the substrate 100 .

[0110] The anti-reflection structure 22 refers to a structure on the substrate 100 for determining the orientation of the substrate 100 . When the substrate 100 is oriented in different directions, the anti-reflection structure 22 has different shapes and / or different positions. There may be one, two or more anti-reflection structures 22 .

[0111] For example, the anti-reflection structure 22 may include a pattern set on the substrate 100, such as an arrow or other pattern. In this case, the substrate 100 facing different directions will cause the anti-reflection structure 22 to be in different positions and facing different directions; taking the anti-reflection structure 22 including an arrow pattern as an example, the substrate 100 facing different directions will cause the arrow to face different directions.

[0112] For example, the anti-reflection structure 22 may also include a hole structure, a groove structure or other structures penetrating the substrate 100 . In this case, the anti-reflection structure 22 may be located at different positions when the substrate 100 faces different directions.

[0113] The positioning structure 23 refers to a structure on the substrate 100 used to determine the position of the substrate 100; the positioning structure 23 can be a hole structure, a groove structure or other structure that penetrates the substrate 100, and the positioning structure 23 can also be a protruding structure protruding from the substrate 100; there can be one positioning structure 23, or there can be two or more positioning structures.

[0114] In this step, the anti-reverse structure 22 and the positioning structure 23 can be formed simultaneously with the laminar flow unit 21, or can be formed separately.

[0115] In the step of stacking the laminar flow plates 200, that is, in S530, the step further includes: making the anti-reverse structures 22 of each laminar flow plate 200 face each other, and making the positioning structures 23 of each laminar flow plate 200 face each other.

[0116] In this step, the anti-reverse structures 22 of each laminar plate 200 are made to face each other so that the directions of each laminar plate 200 can be opposite, thereby making the laminar units 21 on each laminar plate 200 opposite to each other and making the internal through holes 212 in each laminar unit 21 opposite to each other and connected.

[0117] In this step, the positioning structures 23 of the laminar flow plates 200 are made to face each other so that the edges of the laminar flow plates 200 can be aligned and the laminar flow units 21 on the laminar flow plates 200 can be aligned, thereby meeting the accuracy requirement.

[0118] In this embodiment, an anti-reverse structure 22 and a positioning structure 23 are formed on the substrate 100 so that each laminar plate 200 can be aligned during the stacking process without prone to abnormal situations such as misalignment, thereby facilitating improved processing efficiency and product yield.

[0119] refer to Figure 2 , Figure 6 In some embodiments, the anti-reverse structure 22 includes an anti-reverse through hole penetrating the substrate 100 . The number of the anti-reverse through holes is at least two, and the at least two anti-reverse through holes are asymmetrically arranged around the center of the substrate 100 .

[0120] The anti-reverse through hole refers to a through hole opened on the substrate 100, and the anti-reverse through hole is used to confirm the orientation of each laminar flow plate 200 in S530; the anti-reverse through hole can be a circular hole, a square hole, or a hole structure of other shapes, the anti-reverse through hole can be a straight hole, or a conical hole, a stepped hole, or a hole structure of other shapes; the number of anti-reverse through holes can be two, or three or more.

[0121] The center of the substrate 100 refers to the center point of the geometric shape of the substrate 100; when the substrate 100 is a rectangular plate, the center of the substrate 100 is the intersection of the diagonals of the substrate 100; when the substrate 100 is a circular plate, the center of the substrate 100 is the center of the circle.

[0122] At least two anti-reverse through holes are asymmetrically arranged around the center of the substrate 100 , so that the anti-reverse through holes can be located at different positions when the substrate 100 faces different directions.

[0123] In S530, after the laminar plates 200 are stacked, the anti-reverse holes on the laminar plates 200 are opposite to each other and form an anti-reverse channel. At this time, the rod can be passed through the anti-reverse channel to determine whether the laminar plates 200 are in the same direction. If the rod can pass through the laminar plates 200 and contact the work table supporting the laminar plates 200, the laminar plates 200 are in the same direction. Otherwise, there are laminar plates 200 with different directions.

[0124] In this embodiment, at least two anti-reverse through holes are asymmetrically arranged along the center of the substrate 100, so as to better detect the inversion, rotation or other misalignment of the laminar plate 200, thereby further improving the processing efficiency and product yield.

[0125] refer to Figure 2 , Figure 6 In some embodiments, the positioning structure 23 includes an alignment through hole penetrating the substrate 100 . The number of the alignment through holes is at least two, and the at least two alignment through holes are spaced apart around the center of the substrate 100 .

[0126] The alignment through hole refers to a through hole opened on the substrate 100, and the alignment through hole is used to confirm the orientation of each laminar flow plate 200 in S530; the alignment through hole can be a circular hole, a square hole, or a hole structure of other shapes; the alignment through hole can be a straight hole, or a conical hole, a stepped hole, or a hole structure of other shapes; the number of the alignment through holes can be two, or three or more.

[0127] The center of the substrate 100 refers to the center point of the geometric shape of the substrate 100; when the substrate 100 is a rectangular plate, the center of the substrate 100 is the intersection of the diagonals of the substrate 100; when the substrate 100 is a circular plate, the center of the substrate 100 is the center of the circle.

[0128] At least two alignment through holes are arranged at intervals around the center of the substrate 100 so that after the laminar flow plates 200 are stacked and aligned, the alignment through holes of the laminar flow plates 200 can be opposite and connected.

[0129] In S530, after the laminar plates 200 are stacked, the alignment through holes on the laminar plates 200 are relative to each other and form an alignment channel. At this time, the rod can be passed through the alignment channel to determine whether the positions of the laminar plates 200 are aligned. If the rod can pass through the laminar plates 200 and contact the work table supporting the laminar plates 200, the laminar plates 200 are aligned, otherwise they are not aligned.

[0130] The present embodiment provides some specific structures of the positioning structures 23 so that the positioning structures 23 of the stacked laminar plates 200 can be relative to each other and facilitate fixing the positions of the stacked laminar plates 200, thereby further improving the processing efficiency and product yield.

[0131] In some embodiments, in the step of disposing at least two laminar flow units 21 on the substrate 100 , that is, in S520 , the laminar flow units 21 are formed by an etching process.

[0132] The etching process has higher precision and higher consistency. Since the inner diameter of the fluid channel in the laminar flow component 400 is usually small, and the fluid channel in the processing method of the laminar flow component 400 is formed by splicing the internal through holes 212 in each laminar flow unit 21, the laminar flow unit 21 formed by the etching process can meet the high requirements of the processing accuracy of the internal through holes 212.

[0133] At the same time, the etching process has a wide range of applicability and can be applied to various metal materials and most non-metallic materials; the etching process causes less damage to the substrate 100, so that the damage to the sub-plate 211 in the laminar unit 21 can be less, so that the step S520 can cause less damage to the laminar component 400; the etching process also has high efficiency.

[0134] In this embodiment, the laminar flow unit 21 is formed by an etching process to improve processing accuracy and processing efficiency.

[0135] refer to Figure 6 , Figure 7 In some embodiments, the step of stacking the laminar flow plates 200, i.e., step S530, includes the following steps:

[0136] S531: Cleaning each laminar flow plate 200 and welding pressure head.

[0137] In this step, alcohol, acetone or other solvents can be used to clean the laminar plate 200 and the welding pressure head of the diffusion welding equipment to reduce impurities such as oil, oxides, etc. on the laminar plate 200 and the welding pressure head, thereby reducing the negative impact of impurities on the diffusion welding quality.

[0138] S532: stacking the laminar plates 200 to obtain a laminar plate assembly, wherein the orientations of the laminar plates 200 are aligned.

[0139] In this step, each laminar plate 200 is stacked and a laminar plate assembly is obtained to facilitate diffusion welding of each laminar plate 200; the number of stacked laminar plates 200 can be set according to the length of the laminar assembly 400. For example, the number of stacked laminar plates 200 is greater than or equal to the ratio of the length of the laminar assembly 400 to the thickness of the laminar plates 200, so that the length of the rough blank of the laminar assembly 400 obtained after cutting in step S560 can be greater than or equal to the required length of the laminar assembly 400, thereby meeting the design requirements.

[0140] In this step, the orientations of the stacked laminar plates 200 should be consistent so that the laminar units 21 on the laminar plates 200 can be opposite to each other and the inner through holes 212 can be opposite to each other; for example, the anti-reverse structures 22 on the laminar plates 200 can be opposite to each other so that the orientations of the stacked laminar plates 200 are consistent.

[0141] In this step, each stacked laminar plate 200 should be aligned so that each laminar unit 21 on each laminar plate 200 can be aligned, and each internal through hole 212 can also be aligned; for example, the positioning structures 23 on each laminar plate 200 can be made relative to each other so that each stacked laminar plate 200 can be aligned.

[0142] S533: Place the stacked laminar plate assembly into a vacuum chamber, and evacuate the vacuum chamber.

[0143] In this step, after the stacked laminar plate assembly is placed in the vacuum chamber, the vacuum pump is started to form a vacuum state in the vacuum chamber to reduce the risks of oxidation and impurity contamination during the diffusion welding process.

[0144] When placing the stacked laminar flow plate assembly into the vacuum chamber, care should be taken to maintain the position of each laminar flow plate 200 to reduce the possibility of misalignment of each laminar flow plate 200 during placement.

[0145] S534: preheating the stacked laminar plates 200 before welding.

[0146] In this step, the laminar plate assembly after welding each stacked layer can be preheated by a thermocouple before welding, so that the laminar plate assembly reaches the required welding temperature.

[0147] In this step, only the parts of the laminar plate assembly that need to be welded can be preheated before welding, or the entire laminar plate assembly can be preheated before welding; it can be understood that while preheating before welding, attention should also be paid to maintaining the vacuum degree in the vacuum chamber.

[0148] S535: Diffusion welding is performed on the stacked laminar plates 200 .

[0149] In this step, under the action of vacuum and temperature, microscopic plastic rheology can occur on the surface of each laminar flow plate 200 to achieve close contact, so that the atoms of each laminar flow plate 200 diffuse greatly to each other and achieve welding.

[0150] In this step, welding parameters, such as current, voltage, and pressure head pressure, can be adjusted according to the material of the laminar plate 200 to improve welding stability and welding quality.

[0151] S536: Cooling down the laminar plate assembly after diffusion welding to obtain a stacked body 300.

[0152] In this step, after welding is completed, the temperature in the vacuum chamber is gradually lowered to make the composition and structure of the welding positions of each laminar plate 200 uniform for better bonding; at the same time, gradually lowering the temperature can also reduce the internal stress generated during the welding process and improve the stability of the welding between the laminar plates 200.

[0153] After S536, a stacked body 300 is obtained, in which the laminar flow plates 200 are connected to each other, and the corresponding laminar flow units 21 are also connected to each other.

[0154] This embodiment further provides some specific diffusion welding methods to facilitate better welding of the laminar flow plates 200 and forming a stacked body 300 .

[0155] refer to Fig. 9 In some embodiments, after the step of stacking the laminar flow plates 200, the processing method further comprises:

[0156] S540: inspecting the stack 300 .

[0157] In this step, the inspection of the stack 300 is mainly used to inspect the connection parts 213 of each laminar plate 200 to check the overall quality of welding; wherein, the connection parts 213 of each laminar plate 200 also include the connection parts 213 of each laminar unit 21.

[0158] In this step, the welding quality of the connection portion 213 of each laminar flow plate 200 may be detected by X-ray detection, ultrasonic detection, etc., or by other inspection methods.

[0159] In this embodiment, a step of inspecting the stacked body 300 is provided to inspect the quality of the stacked body 300 , thereby facilitating timely discovery of product quality problems and improving the yield of the laminar flow assembly 400 .

[0160] After the step of stacking the laminar flow plates 200, the processing method further comprises:

[0161] S550: grinding the stacked body 300.

[0162] Due to the influence of the diffusion soldering process, after S530, a layer of solder resist is likely to remain on the surface of the stacked body 300, which is likely to interfere with the subsequent cutting process in S560. Accordingly, in this step, the stacked body 300 is ground to reduce the solder resist remaining on the stacked body 300.

[0163] For example, the stacked body 300 can be ground by a polishing machine; during the grinding process, a relatively coarse grinding sandpaper (for example, 200-grit sandpaper) can be used for grinding first, and then the grinding sandpaper with gradually decreasing roughness can be replaced in sequence (for example, 1000-grit sandpaper can be used for grinding at the end); during the grinding process of the stacked body 300, the stacked body 300 is ground until the base color of its material is exposed.

[0164] For example, after the grinding process, the surface roughness of the stacked body 300 may be reduced to Ra 0.3.

[0165] Since a solder resist layer or other impurities are likely to remain on the surface of the stacked laminar plates 200, a grinding process step is provided in this embodiment to reduce the solder resist or other impurities remaining on the stacked body 300, thereby reducing interference with subsequent processes and facilitating improved processing efficiency and the yield of the laminar flow assembly 400.

[0166] refer to Fig. 9 In some embodiments, in the step of cutting the stacked body 300 along the edge of the laminar flow unit 21, that is, step S560, the stacked body 300 is cut by a wire cutting process.

[0167] Wire cutting is a processing method that uses a continuously moving wire electrode as a tool electrode to perform pulse spark discharge etching and cutting on the workpiece. The basic working principle of wire cutting is to use the sparks caused by electron discharge on the workpiece surface to generate high temperature and high pressure, so that the workpiece surface material can be quickly melted and quickly cut by the wire electrode.

[0168] The stacked body 300 is cut by a wire cutting process to separate the stacked laminar flow units 21 from the stacked body 300. The separated structure is a rough laminar flow component. The rough laminar flow component is a structure obtained by stacking the laminar flow units 21.

[0169] Since at least two laminar flow units 21 are disposed on the laminar flow plate 200 , at least two laminar flow component rough blanks can be obtained after step S560 .

[0170] For example, the wire cutting process cuts the connection portion 213 of the laminar flow unit 21 . The connection portion 213 can be cut by the wire cutting process to separate the sub-board 211 from the substrate 100 , thereby separating the stacked laminar flow unit 21 from the stacked body 300 .

[0171] The wire cutting process has high processing accuracy and high processing quality. It can reduce damage such as deformation of the laminar flow unit 21 during the cutting process, and the surface quality of the processing is also high. The heat impact generated by the wire cutting process is also small, which can reduce the negative impact on the laminar flow unit 21, thereby reducing the deformation of the laminar flow unit 21 during the cutting process, which is beneficial to improving the dimensional stability of the laminar flow unit 21. The wire cutting process has a high processing efficiency and can avoid problems such as tool wear in traditional cutting processes. At the same time, the wire cutting process also has a wider range of material adaptability and can adapt to cemented carbide, metal, ceramics or various other materials.

[0172] In this embodiment, the stacked body 300 is processed by a wire cutting process to improve processing accuracy and surface quality of the rough laminar flow component, and at the same time facilitate automated control and improve processing efficiency.

[0173] refer to Figure 8 , Fig. 9 In some embodiments, the step of polishing the rough laminar flow component, that is, the step of S570 includes:

[0174] S571: Clean the rough laminar flow component.

[0175] In this step, alcohol, acetone or other solvents may be used to clean the surface of the laminar flow component rough blank to reduce impurities such as oil stains and oxides on the surface of the laminar flow component rough blank.

[0176] In this step, the cleaning of the laminar flow component rough blank includes cleaning its outer surface, cleaning the inner wall of its inner through hole 212, etc.

[0177] S572: Determine processing parameters according to the material and surface roughness value of the laminar flow component blank.

[0178] In this step, the processing parameters of the laminar flow component rough blank are determined according to the material, size, shape and other parameters of the laminar flow component rough blank. The processing parameters include discharge power, discharge frequency, gas type, gas flow rate, polishing time and the like.

[0179] S573: Place at least two laminar flow component rough blanks into a polishing machine and polish them.

[0180] In this step, the polishing machine applies an electric field according to the processing parameters and ionizes the discharge medium, thereby generating charged particles, and then polishes the laminar flow component rough blank through the discharge channel; the cleaned laminar flow component rough blank is placed in the plasma generation area of ​​the polishing machine through a carrier device, and the plasma power supply is started to discharge the process.

[0181] In this step, the polishing machine can polish two or more laminar flow component rough blanks at a time, thereby improving the polishing efficiency; for example, multiple laminar flow component rough blanks can be placed on the carrier.

[0182] In this step, the discharge medium may be argon or other gas or liquid that can support electricity and generate plasma; the carrier may be a hanger or other tools, and the material of the carrier may be titanium alloy or other materials.

[0183] After this step, the surface roughness of the laminar flow component rough blank can be reduced to meet the requirements; for example, in this step, the surface roughness of the laminar flow component rough blank can be reduced from Rz3.4 to Rz0.6, so as to significantly reduce the pressure drop of the laminar flow component 400 and improve the flow capacity.

[0184] After S573, when the rough polishing of the laminar flow component is completed, the plasma power supply is turned off.

[0185] This embodiment provides some specific methods of the ion polishing process, so as to better polish the rough laminar flow component and better reduce the residual particles, burrs and other structures on the laminar flow component 400.

[0186] refer to Fig. 9 In some embodiments, after the step of polishing the rough laminar flow component, that is, after S570, the processing method further includes:

[0187] S580: Perform micropore particle inspection and surface roughness inspection on the polished laminar flow component rough blank.

[0188] In this step, after the plasma power is turned off, the polished laminar flow component rough blank is taken out from the polishing machine for quality inspection and appearance inspection.

[0189] In this step, the polished laminar flow component rough blank can be inspected by inspection equipment to check whether there are particles and burrs in its fluid channel, and to reduce the pressure to check whether there are defects such as edges and discoloration, thereby improving the yield of the product and making the polished laminar flow component rough blank closer to a mirror effect, with higher cleanliness and lower roughness.

[0190] In this step, if it is detected that impurities such as particles exist in the fluid channel of the polished laminar flow component rough blank, the impurities such as particles can be removed by a tool.

[0191] It is understandable that the inspection of the polished laminar flow component rough blank can be carried out by manual inspection or by other methods, such as by machine vision or other methods.

[0192] In this embodiment, the polished laminar flow component 400 is inspected to check whether the quality, appearance, etc. of the laminar flow component 400 meet the processing requirements.

[0193] After the step of polishing the rough laminar flow component, that is, after S580, the processing method further includes:

[0194] S590: Clean the rough laminar flow component after polishing.

[0195] In this step, the polished laminar flow component rough blank is cleaned to remove the polishing agent or other impurities remaining thereon, so as to improve the quality of the product and meet the cleanliness requirements of the product.

[0196] For example, the laminar flow component rough blank can be cleaned by an ultrasonic ultrapure water deionization process.

[0197] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for processing a laminar flow component, characterized in that: The laminar flow component is applied to a mass flow controller, and the processing method comprises: obtaining a substrate; At least two laminar flow units are arranged on the substrate to obtain a laminar flow plate; wherein the laminar flow unit comprises an inner through hole; wherein the laminar flow unit is formed by an etching process; The laminar flow plates are stacked, and the laminar flow plates are connected between two adjacent laminar flow plates by a vacuum diffusion welding process to form a stacked body, and the laminar flow units on different laminar flow plates are made to face each other; wherein the inner through holes in each laminar flow unit can face each other and form a fluid channel of the laminar flow component; wherein the number of the laminar flow plates is adjusted according to the required length of the laminar flow component, so that the length of the stacked body is equal to or slightly greater than the required length of the laminar flow component; Cutting the stacked body along the edge of the laminar flow unit to separate at least two laminar flow component rough blanks from one stacked body; At least two of the laminar flow component rough blanks are polished.

2. The processing method according to claim 1, characterized in that: The step of arranging at least two laminar flow units on the substrate further includes: forming an anti-reflection structure and a positioning structure on the substrate; The step of stacking the laminar flow plates further includes: making the anti-reverse structures of the laminar flow plates face each other, and making the positioning structures of the laminar flow plates face each other.

3. The processing method according to claim 2, characterized in that: The anti-reverse structure comprises an anti-reverse through hole penetrating the substrate, the number of the anti-reverse through holes is at least two, and the at least two anti-reverse through holes are asymmetrically arranged around the center of the substrate.

4. The processing method according to claim 2, characterized in that: The positioning structure comprises an alignment through hole penetrating the substrate, the number of the alignment through holes is at least two, and at least two of the alignment through holes are arranged at intervals around the center of the substrate.

5. The processing method according to any one of claims 1 to 4, characterized in that: The step of stacking the laminar flow plates comprises: Cleaning the laminar flow plates and welding heads; Stacking the laminar flow plates to obtain a laminar flow plate assembly, wherein the laminar flow plates are oriented in the same direction; placing the stacked laminar flow plate assembly into a vacuum chamber, and evacuating the vacuum chamber; Preheating the stacked laminar plate assembly before welding; Diffusion welding the stacked laminar plate assembly; The laminar plate assembly after diffusion welding is cooled down to obtain the stacked body.

6. The processing method according to any one of claims 1 to 4, characterized in that: After the step of stacking the laminar flow plates, the processing method further comprises: inspecting the stacked body; After the step of stacking the laminar plates, the processing method further comprises: grinding the stacked body.

7. The processing method according to any one of claims 1 to 4, characterized in that: In the step of cutting the stacked body along the edge of the laminar flow unit, the stacked body is cut by a wire cutting process.

8. The processing method according to any one of claims 1 to 4, characterized in that: The step of polishing the rough laminar flow component comprises: Cleaning the rough laminar flow component; Determining processing parameters according to the material and surface roughness value of the laminar flow component rough blank; At least two of the laminar flow assembly rough blanks are placed in a polishing machine and polished.

9. The processing method according to any one of claims 1 to 4, characterized in that: After the step of polishing the rough laminar flow component, the processing method further comprises: inspecting the particles in the micropores and the surface roughness of the polished rough laminar flow component; After the step of polishing the rough laminar flow component, the processing method further comprises: cleaning the polished rough laminar flow component.

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