Wafer flipping device and flipping method for vacuum environment

Abstract

This invention provides a wafer flipping device and method for use in a vacuum environment. The device includes: a concentric dual-axis component, a rotary driver, a first sliding frame, a second sliding frame, a fork, a guide sliding assembly, and a mounting frame. The first and second sliding frames have twisting fingers on their first sides and racks on their second sides. The first and second sliding frames are slidably connected to the top and bottom surfaces of the fork via the guide sliding assembly, forming a guide movement mechanism. The concentric dual-axis component is connected to the mounting frame. Its inner shaft has two ends that engage with the first drive end of the rotary driver and the fork, respectively; its outer shaft has a tail end that engages with the second drive end of the rotary driver; and its front end has gear teeth that simultaneously mesh with the racks between the first and second sliding frames, driving the guide movement mechanism to twist the twisting fingers. This allows the wafer to be held and flipped using a twisting finger structure, simplifying the required mechanical transmission structure and reducing its size.

Description

Technical Field

[0001] This invention relates to the field of semiconductor wafer processing technology, and in particular to a wafer flipping device and flipping method for use in a vacuum environment. Background Technology

[0002] Traditional wafer fabrication employs processes such as deposition, etching, and cleaning to fabricate various chip microcircuit structures on the wafer. During wafer fabrication, it is often necessary to flip the wafer between adjacent processes or within a single process. Therefore, a separate wafer flipping device is required to perform this step.

[0003] Currently, wafer flipping devices used in vacuum environments are mainly composed of mechanical linkage structures. For example, the prior art discloses "A Wafer Handling Robot" (application number: 2019211536472), which is mainly composed of wafer grippers, servo rotary motors, etc. The wafer flipping mechanism of this type typically uses wrist rotation to drive the fingertips to hold the wafer and rotate it 180° in place to complete the wafer flipping.

[0004] However, wafer flipping devices like these mainly use clamping jaws to hold the wafers, making their mechanical structure quite complex and bulky. To further reduce the size of the device and simplify the mechanical transmission structure, alternative approaches are needed. Summary of the Invention

[0005] Therefore, the main objective of this invention is to provide a wafer flipping device and flipping method for use in a vacuum environment, which uses a twisting structure to hold the wafer for flipping, thereby simplifying the required mechanical transmission structure and reducing its size.

[0006] To achieve the above objectives, according to one aspect of the present invention, a wafer flipping device for a vacuum environment is provided, comprising: a concentric dual-axis component, a rotary driver, a first sliding frame, a second sliding frame, a fork, a guide sliding assembly, and a mounting frame, wherein the first and second sliding frames are provided with a twisting finger on their first side and a rack on their second side, and the first and second sliding frames are slidably connected to the top and bottom surfaces of the fork via the guide sliding assembly, respectively, forming a guide moving mechanism; the concentric dual-axis component is connected to the mounting frame, with its inner shaft ends respectively engaging with the first driving end of the rotary driver and the fork, the tail end of its outer shaft engaging with the second driving end of the rotary driver, and the front end of the outer shaft being provided with gear teeth, so as to simultaneously mesh with each rack between the first and second sliding frames, driving the guide moving mechanism to twist the twisting finger.

[0007] In a possible preferred embodiment, the guide sliding assembly is any one of the following: carriage and groove, pulley and groove, pulley and rail mating assembly.

[0008] In a possible preferred embodiment, guide grooves are provided on the fork arms on both sides of the fork frame, and the fingertips of each of the twisting fingers are engaged with the guide grooves of the fork arms.

[0009] In a possible preferred embodiment, the twisting device includes: a finger frame and a finger key. The finger frame has cantilever arms on both sides, and the finger key is connected to the cantilever arms. The inner top surfaces of the first and second sliding frames are at least partially suspended to define a wafer transfer space between the fork frame and the first and second sliding frames. The finger key has a finger platform at its front end, and the finger platform and the finger key have a height difference to define a twisting space when the twisting device is twisted.

[0010] In a possible preferred embodiment, the twisting finger component includes: a finger frame and a finger key. The finger frame has cantilever arms on both sides, and the finger key is connected to the cantilever arms. The inner top surfaces of the first and second sliding frames are at least partially suspended to define a wafer transfer space between the fork frame and the first and second sliding frames. At least one end of the finger key of each twisting finger component overlaps with each other, and the front end of each finger key is provided with a finger platform. The finger platform and the finger key have a height difference to define a twisting space when the twisting finger components are twisted together.

[0011] In a possible preferred embodiment, the concentric biaxial component is a concentric biaxial magnetohydrodynamic seal.

[0012] In a possible preferred embodiment, the rotary drive is a concentric dual-axis motor.

[0013] In a possible preferred embodiment, the wafer flipping device for a vacuum environment further includes: a sealing cover, which is barrel-shaped, with its front end communicating with the vacuum transfer cavity and its rear end sealed to the mounting frame to house the guide moving mechanism flipping within its cavity.

[0014] To achieve the above objectives, according to another aspect of the present invention, a wafer flipping device for a vacuum environment is also provided, comprising: a concentric biaxial magnetohydrodynamic seal, a concentric biaxial motor, a first sliding frame, a second sliding frame, a fork, and a mounting bracket, wherein guide grooves are provided on the fork arms on both sides of the fork, and slides are provided at the top and bottom of the fork; a finger twisting element is provided on the first side of the first and second sliding frames, a rack is provided on the second side, and a slide groove is provided on the third side, the first and second sliding frames being respectively engaged with the top and bottom slides of the fork via the slide grooves, the finger twisting element comprising: a finger holder and a finger key, cantilever arms are provided on both sides of the finger holder, the finger key being connected to the cantilever arms, the first and second sliding frames being... The inner top surface of the frame is at least partially suspended to define a wafer transfer space between the fork and the first and second sliding frames. At least one end of each twisting finger is overlapping, each finger is engaged with a guide groove, and each finger has a finger platform at its front end. The finger platform and the finger have a height difference to define a twisting space when the twisting fingers are twisted, thus forming a guiding movement mechanism. The concentric biaxial magnetohydrodynamic seal is connected to the mounting frame. Its inner shaft ends are respectively connected to the inner drive end of the concentric biaxial motor and the fork, and the tail end of the outer shaft is connected to the outer drive end of the concentric biaxial motor. The front end of the outer shaft is provided with gear teeth to mesh with the racks of the first and second sliding frames simultaneously, driving the guiding movement mechanism to twist the twisting fingers.

[0015] To achieve the above objectives, corresponding to the aforementioned wafer flipping apparatus for a vacuum environment, according to another aspect of the present invention, a flipping method for a wafer flipping apparatus for a vacuum environment is also provided, the steps of which include:

[0016] The second drive end of the rotary driver drives the outer shaft of the concentric double-axis component to rotate, which in turn drives the guide moving mechanism to cause the first sliding frame and the second sliding frame to move in opposite directions until the finger twisting component is twisted apart.

[0017] After the wafer is placed on the twisting finger, the second drive end of the rotary driver is controlled to drive the outer shaft of the concentric dual-axis component to rotate, which in turn drives the guide moving mechanism to move the first sliding frame and the second sliding frame toward each other until the twisting finger engages and holds the wafer.

[0018] The first drive end of the rotary driver drives the outer shaft of the concentric dual-axis component to rotate, flipping the guide moving mechanism until the wafer is flipped.

[0019] The wafer flipping device and method for vacuum environments provided by this invention ingeniously proposes a transmission structure scheme for twisting and flipping wafers. This transmission structure differs from the traditional clamping jaw structure scheme, taking a different approach by using a guide moving mechanism to cooperate with the rotation control of concentric inner and outer dual axes to achieve the lateral twisting of the overlapping twisting fingers, thereby positioning the wafer by twisting it, and flipping the wafer as a whole with the guide moving mechanism. This not only creates a brand-new wafer positioning scheme, but also requires fewer transmission components, has a simple assembly structure, occupies less space, and has the characteristics of miniaturization and lightweight. It solves the shortcomings of the relatively complex and bulky mechanical structure of such wafer flipping devices in the traditional industry. Attached Figure Description

[0020] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0021] Figure 1 This is a schematic diagram of the wafer flipping device for a vacuum environment according to the present invention;

[0022] Figure 2 This is a schematic diagram of the assembly structure of the guide movement mechanism in the wafer flipping device for a vacuum environment according to the present invention.

[0023] Figure 3 This is a schematic diagram of the structure of the first sliding frame in the wafer flipping device for a vacuum environment according to the present invention;

[0024] Figure 4 This is a schematic diagram of the concentric biaxial magnetohydrodynamic seal and the concentric biaxial motor connection structure in the wafer flipping device for a vacuum environment according to the present invention.

[0025] Figure 5 This is a side view of the wafer flipping device for a vacuum environment according to the present invention.

[0026] Figure 6 This is a schematic diagram illustrating an example of a wafer flipping device for a vacuum environment according to the present invention, in which the keys face each other.

[0027] Figures 7 to 9 This is an exploded view of the linkage steps of the wafer flipping device for a vacuum environment according to the present invention during wafer flipping. Figure 8 The first sliding frame in Figure 9 The second sliding frame is in a see-through state;

[0028] Figures 10 to 11 This is a schematic diagram of the structure of the wafer flipping device for a vacuum environment of the present invention, wherein a sealing cover is provided and connected to an existing vacuum transfer cavity, wherein... Figure 11 The sealing cover and vacuum transfer chamber are transparent.

[0029] Explanation of reference numerals in the attached figures

[0030] 1. Concentric dual-axis component, 2. Rotary actuator, 3. First sliding frame, 4. Second sliding frame, 5. Fork, 6. Twisting finger component, 7. Mounting frame, 8. Rack, 9. Wafer, 11. Inner shaft, 12. Outer shaft, 13. Gear, 51. Slide, 52. Slide groove, 53. Fork arm, 54. Guide groove, 61. Finger holder, 62. Finger key, 63. Cantilever, 64. Finger platform, 65. Twisting space, 91. Mechanical finger, 92. Wafer transfer space, 93. Sealing cover, 94. Vacuum transfer chamber, 99. Guide movement mechanism. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0033] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0034] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance. The terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0035] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0036] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "lay out," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances and in conjunction with existing technology. Furthermore, unless otherwise specified, the embodiments and features in the embodiments of this invention can be combined with each other. One or more of the components shown in the figures may be necessary or not, and the relative positional relationships between the components shown in the figures can be adjusted according to actual needs.

[0037] To achieve wafer flipping via a twisting structure, thereby simplifying the required mechanical transmission structure and reducing its size, such as... Figures 1 to 5 As shown, the present invention provides a wafer flipping device for a vacuum environment, an example of which includes: a concentric dual-axis component 1, a rotary actuator 2, a first sliding frame 3, a second sliding frame 4, a fork 5, a guide sliding assembly, and a mounting bracket 7. Wherein... Figures 2 to 3 As shown, the first and second sliding frames 3 and 4 are provided with a twisting finger 6 on the first side and a rack 8 on the second side. The first and second sliding frames 3 and 4 are slidably connected to the top and bottom surfaces of the fork frame 5 via a guide sliding assembly, forming a guide moving mechanism 99.

[0038] In optional examples, the guide sliding assembly can be any of the following guide sliding schemes: carriage 51 and groove 52, pulley and groove 52, pulley and rail mating assembly. Those skilled in the art can also use other existing linear sliding schemes for alternative implementation. For ease of understanding, this example uses carriage 51 and groove 52 as an example. The carriage 51 is T-shaped and is set at the top and bottom of the fork 5. The groove 52 is set on the first and second sliding frames 3 and 4 near the rack 8. The first and second sliding frames 3 and 4 are mated with the carriage 51 at the top and bottom of the fork 5 respectively through the groove 52, so as to cover the upper and lower surfaces of the fork 5, thereby establishing the lateral displacement degree of freedom of the first and second sliding frames 3 and 4.

[0039] Among them, such as Figure 4As shown, the concentric dual-shaft component 1 in this example is a concentric dual-shaft magnetohydrodynamic seal, which has inner and outer concentric dual shafts, while the rotary actuator 2 in this example is a concentric dual-shaft motor, which has concentric inner and outer dual rotary output shafts. Wherein... Figure 5 As shown, the concentric dual-axis magnetohydrodynamic seal is fixedly connected to the concentric dual-axis motor. The concentric dual-axis magnetohydrodynamic seal is connected to the mounting bracket 7. The two ends of the inner shaft 11 of the concentric dual-axis magnetohydrodynamic seal are respectively connected to the first drive end (i.e., the inner rotary output shaft) of the concentric dual-axis motor and the fork 5. The tail end of the outer shaft 12 is connected to the second drive end (i.e., the outer rotary output shaft) of the rotary driver 2. The front end of the outer shaft 12 is provided with gear teeth 13.

[0040] Among them, such as Figure 5 As shown, the first and second sliding frames 3 and 4 are separated by a fork 5. The front end of the outer shaft 12 of the concentric biaxial magnetohydrodynamic seal extends into the gap so that its front end gear 13 meshes with the rack 8 of the first and second sliding frames 3 and 4. This drives the guide moving mechanism 99 to twist the twisting finger 6 laterally, thereby twisting the wafer 9. After the wafer 9 is twisted, the inner shaft 11 of the concentric biaxial magnetohydrodynamic seal drives the fork 5 and the first and second sliding frames 3 and 4 to rotate, thereby flipping the wafer 9 and realizing the flipping of the wafer 9.

[0041] In this example, such as Figures 2 to 3 As shown, the finger-twisting component 6 includes: a finger holder 61 and finger keys 62. The finger holder 61 has cantilever arms 63 on both sides. The finger keys 62 are connected to the cantilever arms 63 and are respectively disposed on both sides of the finger holder 61 and spaced apart from the finger holder 61. The inner top surfaces of the first and second sliding frames 3 and 4 are at least partially suspended to define a wafer transfer space 92 between the fork 5 and the first and second sliding frames 3 and 4, for the mechanical finger 91 to enter and exit for loading and unloading wafers 9. The first and second sliding frames 3 and 4... Each of the finger-twisting components 6 has one end of a key 62 that overlaps with each other, and the outer side of the key 62 on the overlapping side has a notch to allow for lateral displacement of the finger-twisting component 6 and to provide a distance for opening and closing the fingers. Each key 62 has a finger platform 64 at its front end, and the finger platform 64 has a height difference with the key 62 to define a twisting space 65 when the finger-twisting component 6 is twisted. Thus, the lateral displacement of the first and second sliding frames 3 and 4 drives the key 62 to twist, thereby restricting the wafer within the twisting space 65.

[0042] One noteworthy feature is the design where "one end of the finger key 62 on each of the first and second sliding frames 3 and 4 overlaps with each other." This design allows the first and second sliding frames 3 and 4 to shift laterally. After the finger key 62 is twisted to open and close, holding the wafer 9 and flipping it, it can basically return to its original position or near its original position when the wafer was loaded. Even if the wafer 9 deviates slightly from its loading position, when the finger key 62 is twisted open after flipping, the size of the two side finger platforms 64 and the twisting displacement distance can be designed to push the wafer 9 back to its original position at the drop point between the two side finger platforms 64 and the finger key 62, thus facilitating the subsequent unloading by the mechanical finger 91.

[0043] In another alternative implementation, such as Figure 6 As shown, the finger twister 6 includes: a finger frame 61 and finger keys 62. The finger frame 61 is provided with cantilever arms 63 on both sides. The finger keys 62 are connected to the cantilever arms 63 and are respectively provided on both sides of the finger frame 61 and spaced apart from the finger frame 61. The inner top surfaces of the first and second sliding frames 3 and 4 are at least partially suspended to define a wafer transfer space 92 between the fork 5 and the first and second sliding frames 3 and 4, so as to allow the mechanical finger 91 to enter and exit for loading and unloading wafers. The finger keys 62 at both ends of each finger twister 6 on the first and second sliding frames 3 and 4 are arranged facing each other. Each finger key 62 is provided with a finger platform 64 at its front end. The finger platform 64 and the finger key 62 have a height difference to define a twisting space 65 between the upper and lower finger platforms 64 when the finger twister 6 is laterally displaced and twisted.

[0044] One noteworthy feature is the design where the finger keys 62 at both ends of the twisting fingers 6 on the first and second sliding frames 3 and 4 face each other. This design ensures that the wafer 9 is always supported by the twisting fingers 6 located at the bottom after loading. As the finger keys 62 open and close to twist the wafer 9, the wafer moves laterally along with the first and second sliding frames 3 and 4. After flipping, by controlling the relative lateral movement direction and distance of the first and second sliding frames 3 and 4, the wafer 9 can be returned to its original position or near its original position when it was loaded, thus facilitating the subsequent unloading by the mechanical finger 91.

[0045] Furthermore, corresponding to the above example, in order to ensure the reliability of the displacement of the key 62 during the twisting process, such as Figure 2 As shown, in the optional example, guide grooves 54 are provided on the fork arms 53 on both sides of the fork 5. The fingertips of each of the finger twisters 6 are engaged with the guide grooves 54 of the fork arms 53. Guided by the guide grooves 54, the finger keys 62 are prevented from shaking during displacement, and the up and down keys 62 and the finger platform 64 are kept at a stable relative distance during movement.

[0046] Furthermore, such as Figures 10 to 11As shown, in order to adapt to vacuum equipment, the wafer flipping device for vacuum environment further includes: a sealing cover 93, which is barrel-shaped and has an inner diameter larger than the rotation diameter of the guide moving mechanism 99. The front end of the sealing cover 93 is connected to the vacuum transmission cavity 94, and the rear end is sealed to the mounting frame 7 to establish a vacuum environment in the inner cavity of the sealing cover 93 and to house the guide moving mechanism 99 flipping in its inner cavity.

[0047] Furthermore, for an example of a wafer flipping device for a vacuum environment as described above, please refer to [link to example]. Figures 7 to 9 As shown, the present invention also provides a wafer flipping method for a wafer flipping device in a vacuum environment, the steps of which include:

[0048] In step S100, the second drive end of the rotary driver 2 drives the outer shaft 12 of the concentric dual-axis component 1 to rotate in the forward direction, which in turn drives the guide moving mechanism 99 to move the first sliding frame 3 and the second sliding frame 4 in the opposite direction until the twisting finger component 6 is twisted open. At this time, the finger platform 64 of the twisting finger component 6 is exposed, and the mechanical finger 91 extends into the wafer 9 transfer space 92, loads the wafer 9 onto the finger platform 64, and then retracts.

[0049] In step S200, after the wafer is placed on the twisting finger 6, the second drive end of the rotary driver 2 drives the outer shaft 12 of the concentric dual-axis component 1 to rotate in the opposite direction, which in turn drives the guide moving mechanism 99 to move the first sliding frame 3 and the second sliding frame 4 towards each other until the twisting finger 6 twists and holds the wafer 9.

[0050] Step S300 controls the first drive end of the rotary driver 2 to drive the outer shaft 12 of the concentric dual-axis component 1 to rotate, flipping the guide moving mechanism 99 until the wafer 9 is flipped.

[0051] Step S400 controls the second drive end of the rotary driver 2 to drive the outer shaft 12 of the concentric dual-axis component 1 to rotate, which in turn drives the guide moving mechanism 99 to move the first sliding frame 3 and the second sliding frame 4 in opposite directions until the twisting finger component 6 is twisted open. At this time, the wafer 9 is released from the twisting space 65, and the mechanical finger 91 extends into the wafer transfer space 92 to complete the wafer 9 unloading.

[0052] In summary, the wafer flipping device and method for vacuum environments provided by this invention ingeniously proposes a transmission structure scheme for twisting and flipping wafers. This transmission structure differs from the traditional clamping jaw structure scheme, taking a different approach by using a guide moving mechanism 99 to cooperate with the rotational control of concentric inner and outer dual axes to achieve the lateral twisting of the overlapping twisting fingers 6, thereby positioning the wafer 9 by twisting and holding it, and flipping the wafer 9 as a whole with the guide moving mechanism 99. This not only creates a brand-new wafer positioning scheme, but also requires fewer transmission components, has a simple assembly structure, occupies less space, and has the characteristics of miniaturization and lightweight. It solves the shortcomings of the relatively complex and bulky mechanical structure of such wafer flipping devices in the traditional industry.

[0053] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the invention should be included within the protection scope of the invention.

[0054] Those skilled in the art will understand that, besides implementing the system, apparatus, unit, and its modules provided by this invention in purely computer-readable program code, the same program can be implemented in the form of logic gates, switches, application-specific integrated circuits, programmable logic controllers, and embedded microcontrollers by logically programming the method steps. Therefore, the system, apparatus, and its modules provided by this invention can be considered a hardware component, and the modules included therein for implementing various programs can also be considered structures within the hardware component; alternatively, modules for implementing various functions can be considered both software programs implementing the method and structures within the hardware component.

[0055] Furthermore, all or part of the steps in the methods of the above embodiments can be implemented by a program instructing related hardware. This program is stored in a storage medium and includes several instructions to cause a microcontroller, chip, or processor to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as a USB flash drive, a portable hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0056] Furthermore, various different implementations of the present invention can be combined arbitrarily, as long as they do not violate the spirit of the present invention, they should also be regarded as the content disclosed in the present invention.

Claims

1. A wafer flipping device for a vacuum environment, comprising: The system comprises a concentric dual-axis component, a rotary driver, a first sliding frame, a second sliding frame, a fork, a guide sliding assembly, and a mounting bracket. The first and second sliding frames are provided with a twisting finger on their first side and a rack on their second side. The first and second sliding frames are slidably connected to the top and bottom surfaces of the fork via the guide sliding assembly, respectively, to form a guide moving mechanism. The twisting device includes: a finger frame and a finger key. The finger frame has cantilever arms on both sides, and the finger key is connected to the cantilever arms. The inner top surfaces of the first and second sliding frames are at least partially suspended to define a wafer transfer space between the fork frame and the first and second sliding frames. At least one end of the finger key of each twisting device overlaps with each other, and the front end of each finger key is provided with a finger platform. The finger platform and the finger key have a height difference to define a twisting space when the twisting device is twisted. The concentric dual-shaft component is connected to the mounting frame. Its inner shaft ends are respectively connected to the first drive end of the rotary driver and the fork, the tail end of the outer shaft is connected to the second drive end of the rotary driver, and the front end of the outer shaft is provided with gear teeth so as to simultaneously mesh with each rack between the first and second sliding frames, driving the guide moving mechanism to twist the twisting finger component.

2. The wafer flipping device for a vacuum environment according to claim 1, wherein the guide sliding assembly is any one of the following: a carriage and a groove, a pulley and a groove, or a pulley and a rail mating assembly.

3. The wafer flipping device for a vacuum environment according to any one of claims 1 to 2, wherein the fork arms on both sides of the fork are provided with guide grooves, and each of the finger keys is engaged with the guide groove of the fork arm.

4. The wafer flipping device for a vacuum environment according to claim 1, wherein the concentric biaxial component is a concentric biaxial magnetohydrodynamic seal.

5. The wafer flipping device for a vacuum environment according to claim 1, wherein the rotary driver is a concentric dual-axis motor.

6. The wafer flipping apparatus for a vacuum environment according to claim 1, further comprising: The sealing cover is barrel-shaped, with its front end connected to the vacuum transmission chamber and its rear end sealed to the mounting bracket to house the guide moving mechanism that flips within its cavity.

7. A wafer flipping device for a vacuum environment, comprising: The system comprises a concentric dual-axis magnetohydrodynamic seal, a concentric dual-axis motor, a first sliding frame, a second sliding frame, a fork frame, and a mounting frame. The fork frame has guide grooves on its fork arms on both sides, and slides on its top and bottom. The first and second sliding frames have finger-twisting components on their first sides, racks on their second sides, and slide grooves on their third sides. The first and second sliding frames are respectively connected to the top and bottom slides of the fork frame via the slide grooves. Each finger-twisting component includes a finger holder and a finger key. The finger holder has cantilever arms on both sides, and the finger key is connected to the cantilever arms. At least a portion of the inner top surface of the first and second sliding frames is suspended to define a wafer transfer space between the fork frame and the first and second sliding frames. At least one end of the finger key of each finger-twisting component is overlapping, and each finger key is connected to the guide groove. Each finger key has a finger platform at its front end, and the finger platform and finger key have a height difference to define a twisting space when the finger-twisting components are twisted together, thus forming a guiding and moving mechanism. The concentric dual-axis magnetohydrodynamic seal is connected to the mounting frame. Its inner shaft ends are respectively connected to the inner drive end of the concentric dual-axis motor and the fork, and the tail end of the outer shaft is connected to the outer drive end of the concentric dual-axis motor. The front end of the outer shaft is provided with gear teeth to mesh with the racks of the first and second sliding frames at the same time, driving the guide moving mechanism to twist the twisting finger.

8. A wafer flipping method for a vacuum environment as described in any one of claims 1 to 6, comprising the steps of: The second drive end of the rotary driver drives the outer shaft of the concentric double-axis component to rotate, which in turn drives the guide moving mechanism to cause the first sliding frame and the second sliding frame to move in opposite directions until the finger twisting component is twisted apart. After the wafer is placed on the twisting finger, the second drive end of the rotary driver is controlled to drive the outer shaft of the concentric dual-axis component to rotate, which in turn drives the guide moving mechanism to move the first sliding frame and the second sliding frame toward each other until the twisting finger engages and holds the wafer. The first drive end of the rotary driver drives the outer shaft of the concentric dual-axis component to rotate, flipping the guide moving mechanism until the wafer is flipped.

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