Aging test fixtures and methods

Abstract

This specification provides an aging test fixture and method. The aging test fixture includes a Xavier module, an Orin module, and a carrier board. The Xavier module and the Orin module are mounted on the carrier board. The carrier board includes a DIP switch and a control circuit. The first terminal of the DIP switch is electrically connected to the Xavier module, and the second terminal of the DIP switch is electrically connected to the Orin module. The control circuit is configured to send a power domain signal to the carrier board to power on and start it. The aging test fixture, including the Xavier module, the Orin module, and the carrier board, and the carrier board, can simulate the key power domain signals of the Xavier / Orin modules. After inserting the fixture, it can simulate the normal power-on and startup of the modules.

Description

TECHNICAL FIELD

[0001] Embodiments of the present specification relate to the technical field of device testing, in particular to an aging test tool. BACKGROUND

[0002] Currently, there is no aging test tool that can simulate the NVIDIA Jetson AGX series of Xavier and Orin modules on the market; for AI edge device suppliers with NVIDIA modules as the core, in the development and test, quality test and production test, the repeated insertion and removal of the core module often leads to damage of the module, causing certain economic losses.

[0003] Therefore, a better solution is urgently needed. SUMMARY

[0004] Therefore, the present specification provides an aging test tool. One or more embodiments of the present specification also relate to an aging test method, an aging test device, a computing device, a computer-readable storage medium, and a computer program to solve the technical defects in the prior art.

[0005] According to a first aspect of an embodiment of the present specification, an aging test tool is provided, comprising: a Xavier module, an Orin module and a carrier plate;

[0006] The Xavier module and the Orin module are installed on the carrier plate;

[0007] The carrier plate comprises a DIP switch and a control circuit;

[0008] The first end of the DIP switch is electrically connected with the Xavier module, and the second end of the DIP switch is electrically connected with the Orin module;

[0009] The control circuit is configured to send a power domain signal to the carrier plate to power on and start the carrier plate.

[0010] In a possible implementation, a load resistor is further included;

[0011] The load resistor is configured to simulate a load.

[0012] In a possible implementation, the carrier plate further comprises a first power supply and a second power supply;

[0013] The first power supply is configured to supply power to the Xavier module;

[0014] The second power supply is configured to supply power to the Orin module.

[0015] In a possible implementation, the carrier plate further comprises a power protection circuit;

[0016] The power protection circuit is configured to turn off the current loop when the current value of the first power supply or the second power supply exceeds a preset threshold.

[0017] In a possible implementation, the power supply protection circuit further comprises an indicator light module.

[0018] The indicator light module is configured to monitor the power supply state of the carrier board and control the indicator light state based on the power supply state.

[0019] In a possible implementation, the carrier board further comprises a heat dissipation fan.

[0020] The heat dissipation fan is configured to dissipate heat for the load resistor.

[0021] According to a second aspect of the embodiments of the present specification, an aging test method is provided, characterized in that it is applied to the simulation device, and the method comprises:

[0022] The Xavier module or the Orin module is selected as the test module through the DIP switch.

[0023] The power supply is turned on to perform the aging test on the test module.

[0024] The carrier board is powered on, and the circuit simulation power domain signal is controlled.

[0025] The working states of the power supplies are determined based on the indicator light state.

[0026] After the aging test time ends, the aging test result is recorded.

[0027] According to a third aspect of the embodiments of the present specification, an aging test device is provided, comprising:

[0028] The module selection module is configured to select the Xavier module or the Orin module as the test module through the DIP switch.

[0029] The aging test module is configured to turn on the power supply to perform the aging test on the test module.

[0030] The signal sending module is configured to power on the carrier board and control the circuit simulation power domain signal.

[0031] The state determination module is configured to determine the working states of the power supplies based on the indicator light state.

[0032] The result recording module is configured to record the aging test result after the aging test time ends.

[0033] According to a fourth aspect of the embodiments of the present specification, a computing device is provided, comprising:

[0034] A memory and a processor.

[0035] The memory is configured to store computer-executable instructions, and the processor is configured to execute the computer-executable instructions, which, when executed by the processor, implement the steps of the aging test method.

[0036] According to a fifth aspect of the embodiments of the present specification, a computer-readable storage medium is provided, which stores computer-executable instructions, which, when executed by a processor, implement the steps of the aging test method.

[0037] According to a sixth aspect of the embodiments of the present specification, a computer program is provided, which, when executed in a computer, causes the computer to perform the steps of the aging test method.

[0038] The embodiments of the present specification provide an aging test tool and method, wherein the aging test tool comprises: a Xavier module, an Orin module, and a carrier plate; the Xavier module and the Orin module are installed on the carrier plate; the carrier plate comprises a DIP switch and a control circuit; a first end of the DIP switch is electrically connected with the Xavier module, and a second end of the DIP switch is electrically connected with the Orin module; and the control circuit is configured to send a power domain signal to the carrier plate to enable the carrier plate to start. By means of the aging test tool comprising: a Xavier module, an Orin module, and a carrier plate; the Xavier module and the Orin module are installed on the carrier plate; the carrier plate comprises a DIP switch and a control circuit; a first end of the DIP switch is electrically connected with the Xavier module, and a second end of the DIP switch is electrically connected with the Orin module; and the control circuit is configured to send a power domain signal to the carrier plate to enable the carrier plate to start, the Xavier / Orin module power domain key signal can be simulated, and the module can be simulated to normally start after being inserted into the tool. BRIEF DESCRIPTION OF DRAWINGS

[0039] Figure 1 FIG. 1 is a structural schematic diagram of an aging test method provided by an embodiment of the present specification;

[0040] Figure 2 FIG. 2 is a module circuit schematic diagram of the aging test method provided by an embodiment of the present specification;

[0041] Figure 3 FIG. 3 is a resistance circuit schematic diagram of the aging test method provided by an embodiment of the present specification;

[0042] Figure 4 FIG. 4 is a signal simulation circuit schematic diagram of the aging test method provided by an embodiment of the present specification;

[0043] Figure 5 FIG. 5 is a protection circuit schematic diagram of the aging test method provided by an embodiment of the present specification;

[0044] Figure 6 is a schematic diagram of a pilot lamp circuit of an aging test method provided by an embodiment of the present specification;

[0045] Figure 7 is a schematic diagram of an overall structure of an aging test method provided by an embodiment of the present specification;

[0046] Figure 8 is a flow chart of an aging test method provided by an embodiment of the present specification;

[0047] Figure 9 is a schematic diagram of a structure of an aging test device provided by an embodiment of the present specification;

[0048] Figure 10 is a structural block diagram of a computing device provided by an embodiment of the present specification. DETAILED DESCRIPTION

[0049] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present specification. However, the present specification can be practiced without the specific details, other than in the examples provided herein, and it is understood that the scope of the present specification is not limited to the details below.

[0050] The terminology used in one or more embodiments of the present specification is for the purpose of describing particular embodiments only and is not intended to be limiting of one or more embodiments of the present specification. As used in one or more embodiments of the present specification and the accompanying claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in one or more embodiments of the present specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0051] It is to be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. It is to be understood that the term "and / or" as used in one or more embodiments of the present specification encompasses any and all possible combinations of one or more of the associated listed items, as well as the lack of any associated item. It is to be understood that although the terms first, second, etc. can be used herein to describe various information, these terms are not intended to denote a temporal sequence, but are used only to distinguish one piece of information from another.

[0052] In the present specification, an aging test tool is provided, and the present specification also relates to an aging test method, an aging test device, a computing device, and a computer-readable storage medium, which are described in detail one by one in the following embodiments.

[0053] Referring toFigure 1 Figure 1 A structural diagram of an aging test tool is provided according to an embodiment of the present specification. The aging test tool comprises: an Xavier module, an Orin module and a carrier plate.

[0054] Specifically, the Xavier module and the Orin module are installed on the carrier plate; the carrier plate comprises a DIP switch and a control circuit; a first end of the DIP switch is electrically connected with the Xavier module, and a second end of the DIP switch is electrically connected with the Orin module; the control circuit is configured to send a power domain signal to the carrier plate to start power-up.

[0055] In actual application, referring to Figure 2 Since the RTC power supply pins of the Xavier module and the Orin module are different, the DIP switch SW1 is needed to select whether the aging test of the Xavier module carrier plate or the aging test of the Orin module carrier plate is simulated. The interfaces P15 and P2 are designed redundantly, and the two interfaces can be connected separately or simultaneously, and the digital display screen can display the voltage of the RTC battery on the carrier plate in single or two-way, which is convenient for testers to observe.

[0056] The embodiment of the present specification is convenient to switch, and the Xavier module or the Orin module can be switched conveniently through the DIP switch. Moreover, the power of the RTC battery on the carrier plate can be tested and displayed through the digital display screen, which is convenient for testers to observe

[0057] In a possible implementation, the carrier plate further comprises a load resistor; the load resistor is configured to simulate a load.

[0058] In actual application, referring to Figure 3 The interfaces J2-J9 are used to externally connect power resistors. After the power resistors are connected to the circuit, 12V and 5V are connected to the circuit under the control of the DIP switch SW, and a current loop to GND is formed. At the same time, there are indicator lights in the circuit, which are bright when the power supply works normally, and are extinguished when a certain power supply fails. For HV and MV, different simulated load currents are selected by the number of the DIP switch SW.

[0059] The embodiment of the present specification can adjust the load according to the test requirements, and simulate the aging test of the carrier plate under various load conditions.

[0060] In a possible implementation, the carrier plate further comprises a first power supply and a second power supply; the first power supply is configured to supply power to the Xavier module; and the second power supply is configured to supply power to the Orin module.

[0061] In actual application, referring to Figure 4The key signals of the module power domain, MODULE_POWER_ON and VDDIN_PWR_BAD_N signals, are simulated by an LDO linear voltage regulator MIC5504-1.8YM5 and a buffer driver SN74LVC1G07DCK, so as to ensure that the aging test tool can simulate the power supply on the module start-up carrier board.

[0062] The embodiment of the present specification does not affect the normal operation of the carrier board, can simulate the power domain function of the module, and ensures that the power-on / shutdown operation of the measured carrier board is normal.

[0063] In a possible implementation, the carrier board further comprises a power protection circuit; the power protection circuit is configured to turn off the current loop when the current value of the first power supply or the second power supply exceeds a preset threshold.

[0064] In actual application, referring to Figure 5 Since the 12V and 5V power supplies for the module on the carrier board belong to the simulated test power supply, it is necessary to ensure that the aging test tool has no effect on the two power supplies, and a high-speed current sensing amplifier INA381A1IDGSR is used to sense and control the HV and MV power supplies. The maximum overcurrent capacity of the 12V power supply is 9A, and the maximum overcurrent capacity of the 5V power supply is 8A. When the limit value is exceeded, the circuit is closed, the current loop is turned off, and damage to the carrier board circuit is avoided.

[0065] In a possible implementation, an indicator light module is further included; the indicator light module is configured to monitor the power supply state of the carrier board and control the indicator light state based on the power supply state.

[0066] In actual application, referring to Figure 6 For other power supplies on the carrier board, three power indicator lights designed on the aging test tool are used to monitor the 12V, 5V and 3.3V power supplies on the carrier board. When these power supplies work normally, the indicator lights are normally lit; when a power supply is abnormal, the corresponding indicator light is extinguished, and the tester can accurately take measures and judge which power supply is faulty after finding it.

[0067] The embodiment of the present specification has multiple power indicator lights, which facilitates the observation of the working state of each power supply by the tester.

[0068] In a possible implementation, the carrier board further comprises a heat dissipation fan; the heat dissipation fan is configured to dissipate heat for the load resistor.

[0069] In actual application, referring to Figure 7In the case of normal operation of the aging test tool, the power resistor is cooled by a 12VDC cooling fan to prevent overheating and damage. Based on the cooling fan, the load power resistor can be effectively cooled. And all industrial-grade devices are used, fully supporting the industrial-grade operating temperature range of-40°C-85°C.

[0070] The embodiment of the present specification provides an aging test tool and method, wherein the aging test tool comprises: a Xavier module, an Orin module and a carrier plate; the Xavier module and the Orin module are installed on the carrier plate; the carrier plate comprises a DIP switch and a control circuit; the first end of the DIP switch is electrically connected with the Xavier module, and the second end of the DIP switch is electrically connected with the Orin module; the control circuit is configured to send a power domain signal to the carrier plate to start the power-up of the carrier plate. By the aging test tool comprising: a Xavier module, an Orin module and a carrier plate; the Xavier module and the Orin module are installed on the carrier plate; the carrier plate comprises a DIP switch and a control circuit; the first end of the DIP switch is electrically connected with the Xavier module, and the second end of the DIP switch is electrically connected with the Orin module; the control circuit is configured to send a power domain signal to the carrier plate to start the power-up of the carrier plate, the power domain key signal of the Xavier / Orin module can be simulated, and the normal power-up start of the module can be simulated after the tool is inserted.

[0071] Referring to FIG. 8, Figure 8 A flowchart of an aging test method according to an embodiment of the present specification is shown, which specifically comprises the following steps.

[0072] Step 801: selecting a Xavier module or an Orin module as a test module through a DIP switch;

[0073] Step 802: turning on the power to perform aging test on the test module;

[0074] Step 803: powering up the carrier plate, and the control circuit simulates the power domain signal;

[0075] Step 804: determining the working state of each power supply based on the state of the indicator light;

[0076] Step 805: recording the aging test result after the aging test time ends.

[0077] Specifically, A, selecting whether to simulate a Xavier module or an Orin module through a DIP switch on the aging test tool;

[0078] B, installing the aging test tool on the carrier plate to be aged, turning on the DIP switches of HV_12V and MV_5V, and selecting to perform aging test on the two groups of power supplies on the carrier plate;

[0079] C, power on the board, the power domain timing control circuit of the aging test tool simulates the key power domain signals of the simulation module to ensure that the board is powered on normally;

[0080] D, the aging test tool works normally, and the 12VDC cooling fan cools the power resistor to prevent the resistor from overheating and being damaged;

[0081] E, with the establishment of each power return circuit, the aging test tool has each power indicator light on, indicating whether each power supply is working normally;

[0082] F, the RTC battery on the tested board powers the digital display screen on the aging test tool, and the actual value of the RTC voltage is displayed on the display screen, so that the tester can observe the size of the RTC voltage;

[0083] G, after the specified aging test time is over, the tester records the aging test result, and turns off the power of the board, and the whole working process is over.

[0084] The aging test tool and method provided by the embodiments of the present specification, wherein the aging test tool comprises: a Xavier module, an Orin module and a board; the Xavier module and the Orin module are installed on the board; the board comprises a DIP switch and a control circuit; the first end of the DIP switch is electrically connected with the Xavier module, and the second end of the DIP switch is electrically connected with the Orin module; the control circuit is configured to send a power domain signal to the board to make the board power on and start. Through the aging test tool comprising: a Xavier module, an Orin module and a board; the Xavier module and the Orin module are installed on the board; the board comprises a DIP switch and a control circuit; the first end of the DIP switch is electrically connected with the Xavier module, and the second end of the DIP switch is electrically connected with the Orin module; the control circuit is configured to send a power domain signal to the board to make the board power on and start. It can simulate the key signals of the power domain of the Xavier / Orin module, and simulate the normal power-on start of the module after inserting the tool.

[0085] Corresponding to the above method embodiments, the present specification also provides aging test device embodiments, Figure 9 A structure diagram of an aging test device provided by an embodiment of the present specification is shown. As shown in the figure, Figure 9 The device comprises:

[0086] According to a third aspect of the embodiments of the present specification, an aging test device is provided, comprising:

[0087] The module selection module 901 is configured to select the Xavier module or the Orin module as the test module through the DIP switch;

[0088] The aging test module 902 is configured to turn on the power supply to perform the aging test on the test module.

[0089] The signal sending module 903 is configured to turn on the power supply of the carrier board and control the circuit simulation power domain signal.

[0090] The state determining module 904 is configured to determine the working state of each power supply based on the indicator light state.

[0091] The result recording module 905 is configured to record the aging test result after the aging test time ends.

[0092] The above is a schematic scheme of the aging test device of the embodiment. It should be noted that the technical scheme of the aging test device belongs to the same concept as the technical scheme of the aging test method described above, and the details of the technical scheme of the aging test device which are not described in detail can be referred to the description of the technical scheme of the aging test method.

[0093] Figure 10 A structural block diagram of a computing device 1000 according to an embodiment of the present specification is shown. The components of the computing device 1000 include but are not limited to a memory 1010 and a processor 1020. The processor 1020 is connected to the memory 1010 through a bus 1030, and a database 1050 is used to save data.

[0094] The computing device 1000 also includes an access device 1040 that enables the computing device 1000 to communicate via one or more networks 1060. Examples of such networks include a public switched telephone network (PSTN), a local area network (LAN), a wide area network (WAN), a personal area network (PAN), or combinations of such networks, such as the Internet. The access device 1040 can include one or more of any type of network interface (for example, a network interface card (NIC)) such as a wired or wireless network interface, such as an IEEE 802.11 wireless local area network (WLAN) wireless interface, a Worldwide Interoperability for Microwave Access (Wi-MAX) interface, an Ethernet interface, a Universal Serial Bus (USB) interface, a cellular network interface, a Bluetooth interface, a Near Field Communication (NFC).

[0095] In one embodiment of the present specification, the above-described components of the computing device 1000 and other components not shown in the Figure 10 may be connected to each other, such as through a bus. It should be understood that Figure 10 The computing device structure diagram shown is for the purpose of example only and is not intended to limit the scope of the present specification. Other components can be added or replaced as needed by those skilled in the art.

[0096] The computing device 1000 can be any type of stationary or mobile computing device, including a mobile computer or mobile computing device (for example, a tablet computer, a personal digital assistant, a laptop computer, a notebook computer, a netbook, and the like), a mobile phone (for example, a smartphone), a wearable computing device (for example, a smartwatch, smart glasses, and the like), or other types of mobile devices, or a stationary computing device such as a desktop computer or a personal computer (PC). The computing device 1000 can also be a mobile or stationary server.

[0097] The processor 1020 is configured to execute the following computer-executable instructions, which implement the steps of the above-mentioned aging test method when executed by the processor. The above is a schematic solution of the computing device of the embodiment. It should be noted that the technical solution of the computing device and the technical solution of the above-mentioned aging test method belong to the same concept, and the details of the technical solution of the computing device that are not described in detail can be referred to the description of the technical solution of the aging test method.

[0098] An embodiment of the present specification further provides a computer-readable storage medium storing computer-executable instructions, which implement the steps of the above-mentioned aging test method when executed by the processor.

[0099] The above is a schematic solution of the computer-readable storage medium of the embodiment. It should be noted that the technical solution of the storage medium and the technical solution of the above-mentioned aging test method belong to the same concept, and the details of the technical solution of the storage medium that are not described in detail can be referred to the description of the technical solution of the aging test method.

[0100] An embodiment of the present specification further provides a computer program, which causes a computer to execute the steps of the above-mentioned aging test method when the computer program is executed in the computer.

[0101] The above is a schematic solution of the computer program of the embodiment. It should be noted that the technical solution of the computer program and the technical solution of the above-mentioned aging test method belong to the same concept, and the details of the technical solution of the computer program that are not described in detail can be referred to the description of the technical solution of the aging test method.

[0102] The above describes specific embodiments of the present specification. Other embodiments are within the scope of the appended claims. In some cases, the acts or steps recited in the claims can be performed in a different order than the order in which they are recited and still accomplish desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order to achieve the desired results. In certain implementations, multitasking and parallel processing can be advantageous.

[0103] The computer readable medium can include any entity or apparatus capable of carrying the computer program code, recording medium, U disk, mobile hard disk, magnetic disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signal, telecommunication signal, software distribution medium, etc. It should be noted that the computer readable medium can include appropriate additions or subtractions according to the requirements of legislation and patent practice in the jurisdiction, for example, in some jurisdictions, according to legislation and patent practice, the computer readable medium does not include electrical carrier signals and telecommunication signals.

[0104] It should be noted that for the foregoing method embodiments, the descriptions are each simply a combination of a series of acts for the sake of brevity, but those skilled in the art should know that the present application is not limited by the order of the acts described, because some steps can be performed in other orders or at the same time in accordance with the present application. In addition, those skilled in the art should know that the embodiments described in the specification are all preferred embodiments, and the acts and modules involved are not necessarily essential to the present application.

[0105] In the above embodiments, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments.

[0106] The preferred embodiments of the present application disclosed above are only used to help explain the present application. The alternative embodiments do not describe all the details and limit the present application to the specific embodiments described. Obviously, according to the content of the present application, many modifications and changes can be made. The present application selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can well understand and use the present application. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. An aging test fixture, characterized by, The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof.

2. An aging test method characterized by, The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof. The application relates to an aging test device and a method thereof

Images