Cleaning apparatus and process for reducing metal residue in a cassette

Abstract

The application provides a cleaning device and process for reducing metal residues in a wafer box, comprising a cleaning tank and a transfer device for transferring the built-in wafer box, wherein the transfer device comprises a first bearing body, a second bearing body rotatably connected to the inner wall of the first bearing body, the wafer box is arranged on the surface of the second bearing body, and a limiting bearing device for limiting the bearing of the top of the wafer is mounted on the outer side of the second bearing body; a hydraulic cleaning device is arranged below the second bearing body, the hydraulic cleaning device is controlled to extend into the bottom of the wafer box to limit the wafer and clean the inner wall of the wafer box, and the bottom of the wafer box has a through port. The application can deeply clean the inside of the wafer box, avoids the pollution of the wafer caused by the metal residues in the wafer box, and guarantees the cleaning quality of the wafer and the wafer box.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer box cleaning, in particular to a cleaning device and process for reducing metal residues in a wafer box. BACKGROUND

[0002] Most of the regenerated wafers are batch cleaned, and in the cleaning process, multiple wafers are placed in a wafer box, and the wafer box and the wafers are soaked in a cleaning liquid for chemical cleaning or ultrasonic cleaning. In the process of traditional cleaning equipment, the wafers and the wafer box are in a relatively static state at a predetermined position, and the bottom of the wafer is constantly in a state of bearing against the inner wall of the wafer box, so there is a difficult-to-clean dead angle.

[0003] The wafer box and the wafer in the dead angle are in a state of mutual adhesion, and by turning over the wafer box to control the wafer to move a predetermined distance relative to the wafer box, the dead angle can be exposed to the cleaning tank, improving the cleaning effect of the dead angle. However, the traditional cleaning equipment still needs to be assisted by ultrasonic equipment and cleaning liquid to clean the dead angle deeply, and the traditional cleaning method takes a long time, and the cleaning effect of the wafer box cannot meet the expected effect, affecting the quality of the finished wafers. SUMMARY

[0004] To solve the above problems, the present application provides a cleaning device and process for reducing metal residues in a wafer box, which can deeply clean the inside of the wafer box, avoid the pollution of the wafer caused by the metal residues in the wafer box, and ensure the cleaning quality of the wafer and the wafer box.

[0005] To solve the above problems, the technical solution adopted by the present application is as follows:

[0006] The cleaning device for reducing metal residues in a wafer box comprises a cleaning tank and a transfer device for transferring the wafer box with wafers inside, the transfer device comprises a first bearing body, a second bearing body is rotatably connected to the inner wall of the first bearing body, the wafer box is arranged on the surface of the second bearing body, and a limiting bearing device for limiting the top of the wafer is installed on the outer side of the second bearing body; a hydraulic cleaning device is arranged below the second bearing body to control the hydraulic cleaning device to extend into the bottom of the wafer box to limit the wafer and clean the inner wall of the wafer box, the bottom of the wafer box has a through hole, and the size of the through hole is larger than that of the hydraulic cleaning device to allow the hydraulic cleaning device to pass through.

[0007] Preferably, the hydraulic cleaning device comprises a cleaning bearing plate, a hydraulic cleaning assembly adapted to the wafer box is fixed to the upper end of the cleaning bearing plate, and a third adjusting assembly is installed between the cleaning bearing plate and the second bearing body.

[0008] Preferably, the hydraulic cleaning assembly includes a mounting frame and a cleaning end, the mounting frame has a U-shaped cross section, and the cleaning end includes a plurality of cleaning spray rods arranged at intervals, and cleaning spray holes are opened on the surface of the cleaning spray rods.

[0009] Preferably, the cleaning liquid spray rod extends between two adjacent wafers, the cleaning liquid spray hole is arranged obliquely outside the axis of the cleaning liquid spray rod, and an oblique angle is formed between the axis of the cleaning liquid spray hole and the axis of the cleaning liquid spray rod.

[0010] Preferably, the position-limiting bearing device comprises two bearing rods, the bearing rods extending along the length direction of the film box, the surfaces of the bearing rods being covered with flexible position-limiting sleeves filled with a position-limiting medium.

[0011] Preferably, the load-bearing and limiting medium is an electrorheological fluid, and the flexible limiting sleeve has a built-in conductive component.

[0012] Preferably, the position-limiting bearing device further comprises a first adjusting component for controlling the distance between the two bearing rods, and the distance between the two bearing rods is adjusted according to the size of the wafer to complete the position-limiting of the top of the wafer.

[0013] Preferably, the position-limiting bearing device further comprises a second adjusting component for controlling the distance between the two bearing rods and the film cassette.

[0014] Preferably, the first carrier body and the second carrier body are both hollow frame structures, the first carrier body includes an outer rectangular frame, the rectangular frame is rotatably connected to the second carrier body through a driving shaft, and an electric control component for controlling the rotation of the driving shaft is fixed to the outer wall of the rectangular frame.

[0015] A cleaning process for reducing metal residue in a wafer cassette includes the following steps: S1, fixing the wafer cassette on the upper surface of a second carrier body to complete a primary cleaning of the wafer cassette; S2, controlling a limit carrier device to descend and press against the upper end of a wafer, and then controlling the second carrier body to flip; S3, controlling a hydraulic cleaning device to extend into the bottom of the wafer cassette to limit the wafer and perform a secondary cleaning of the wafer cassette.

[0016] The beneficial effects of the present invention are:

[0017] Through the above structure, the position of the wafer can be supported and adjusted after the wafer and the cassette are flipped over, so that the dead corners of the bonding are completely exposed to the outside, which greatly improves the cleaning effect inside the cassette. The upper and lower limit methods can ensure the stability of the wafer during movement; and the hydraulic cleaning device can extend into the interior of the cassette from the bottom to complete deep and efficient cleaning of the interior of the cassette, further improving the cleaning effect of the dead corners of the bonding inside the cassette and avoiding the residue of metal impurities to the greatest extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0019] Figure 2 It is a schematic diagram of the three-dimensional structure of the transfer device of the present invention.

[0020] Figure 3 For the present invention Figure 2 Schematic diagram of the main structure.

[0021] Figure 4 For the present invention Figure 2 Schematic diagram of the top view structure.

[0022] Figure 5 For the present invention Figure 5 AA cross-sectional structural diagram.

[0023] Figure 6 For the present invention Figure 5 Enlarged structural diagram at C.

[0024] Figure 7 For the present invention Figure 5 BB-direction cross-sectional structural diagram.

[0025] Figure 8 It is a schematic diagram of the three-dimensional structure of the film box of the present invention.

[0026] Figure 9 Schematic diagram of the cleaning steps of the present invention.

[0027] In the figure: 100, cleaning tank; 200, wafer; 300, wafer box; 310, receiving slot; 400, first carrying body; 410, rectangular frame; 420, electronic control component; 421, driving shaft; 430, connecting piece; 500, second carrying body; 600, limiting carrying device; 610, flexible limiting sleeve; 620, carrying rod; 630, first adjusting component; 640, second adjusting component; 650, second rotating joint; 700, hydraulic cleaning device; 710, cleaning carrying plate; 720, hydraulic cleaning component; 721, mounting frame; 722, cleaning end; 730, third adjusting component. DETAILED DESCRIPTION

[0028] The present invention will be further described below with reference to the accompanying drawings and examples.

[0029] Recycled wafer technology can reuse waste wafers, reduce environmental pollution and reduce production costs.

[0030] The surface of most regenerated wafers contains a large amount of metal impurities, and deep processing and cleaning are required during the recycling process of regenerated wafers to remove the metal residues on the surface of the wafers and ensure the normal subsequent production and processing of the wafers.

[0031] Regenerated wafers are mostly cleaned in batches. During the cleaning process, multiple wafers are placed together in a cassette, and the cassette and wafers are immersed in cleaning liquid for chemical cleaning or ultrasonic cleaning. During the cleaning process of traditional cleaning equipment, the wafers and cassette are located in a predetermined position and are in a relatively static state. The bottom of the wafer is constantly in a supporting state and pressed against the inner wall of the cassette, resulting in dead corners that are difficult to clean deeply.

[0032] The cassette and wafer in the dead corner of bonding are in a state of mutual bonding. By flipping the wafer cassette and controlling the wafer to move a predetermined distance relative to the cassette, the dead corner of bonding can be exposed to the cleaning tank, thereby improving the cleaning effect of the dead corner of bonding. However, traditional cleaning equipment still needs to rely on ultrasonic equipment and cleaning liquid to deeply clean the dead corner of bonding during the cleaning process. The traditional cleaning method takes a long time, and its cleaning effect on the inside of the cassette cannot meet expectations, affecting the quality of the finished wafer.

[0033] In order to solve the above problems, refer to the attached Figure 1 -Attached Figure 9 , a cleaning device for reducing metal residues in a wafer box, includes a cleaning pool 100 and a transfer device for transferring a wafer box 300 with a built-in wafer 200. The wafer box 300 and the wafer 200 in the wafer box 300 are transferred to the cleaning pool 100 through the transfer device for continuous cleaning to remove metal impurities remaining on the surface of the wafer 200.

[0034] The transfer device includes a first carrier body 400, the inner wall of the first carrier body 400 is rotatably connected to the second carrier body 500, the wafer box 300 is set on the surface of the second carrier body 500, and the outer side of the second carrier body 500 is installed with a limit carrier device 600 for limiting the top load of the wafer 200; a hydraulic cleaning device 700 is set below the second carrier body 500, and the hydraulic cleaning device 700 is controlled to extend into the bottom of the wafer box 300 to limit the wafer 200 and clean the inner wall of the wafer box 300. The bottom of the wafer box 300 has a through hole, the size of the through hole is larger than the hydraulic cleaning device 700 for the hydraulic cleaning device 700 0 passes through. During the cleaning process of the wafer 200 and the wafer box 300, the limiting carrying device 600 and the hydraulic cleaning device 700 are respectively located on both sides, which can efficiently and stably adjust the position of the wafer 200, so that the wafer 200 and the wafer box 300 are staggered, thereby achieving deep cleaning of the interior of the wafer box 300, and the hydraulic cleaning device 700 can spray cleaning liquid. The hydraulic cleaning device 700 actively extends into the interior from the bottom of the wafer box 300, which can be combined with traditional passive cleaning, greatly improving the cleaning effect of the wafer box 300 and avoiding the metal residue in the wafer box 300 from contaminating the surface of the wafer 200.

[0035] It should be noted here that the upper and lower sides of the wafer box 300 are both through-opening designs, and a plurality of receiving grooves 310 are opened on the inner wall of the wafer box 300. The width of the receiving groove 310 is slightly larger than the thickness of the wafer 200, so that the wafer 200 can smoothly enter the receiving groove 310 for positioning; at the same time, after the wafer 200 is flipped and lowered, the wafer 200 can swing left and right in the receiving groove 310 for a predetermined distance, further improving the cleaning effect of the contact area between the wafer 200 and the wafer box 300, and further avoiding the residue of metal impurities.

[0036] After flipping and cleaning, the limiting support device 600 can be controlled to move downward as a whole, changing the relative position of the wafer 200 in the wafer box 300, and exposing the cleaning dead corners in the wafer 200 and the wafer box 300 to the outside, so as to achieve efficient cleaning of the surface of the wafer 200.

[0037] In summary, through the above structure, the position of the wafer 200 can be supported and adjusted after the wafer 200 and the wafer box 300 are flipped, so that the dead corner of the bonding is completely exposed to the outside, which greatly improves the cleaning effect of the inside of the wafer box 300. The upper and lower limit methods can ensure the stability of the wafer 200 during the movement; and the hydraulic cleaning device 700 can extend from the bottom into the interior of the wafer box 300 to complete the deep and efficient cleaning of the interior of the wafer box 300, further improving the cleaning effect of the dead corner of the bonding in the wafer box 300, and avoiding the residual metal impurities to the greatest extent.

[0038] The hydraulic cleaning device 700 includes a cleaning carrier plate 710, and a hydraulic cleaning component 720 adapted to the wafer box 300 is fixed on the upper end of the cleaning carrier plate 710. A third adjustment component 730 is installed between the cleaning carrier plate 710 and the second carrier body 500. The third adjustment component 730 can be used to adjust the distance between the cleaning carrier plate 710 and the second carrier body 500, and then adjust the distance between the hydraulic cleaning component 720 and the wafer 200 to achieve tight contact with the wafer 200, and at the same time allow the hydraulic cleaning component 720 to extend into the second side of the wafer 200 to achieve deep cleaning of the blind corner area of ​​the wafer 200. The hydraulic cleaning component 720 here has an outward convex design, which can be adapted to the bottom of the wafer box 300 and can extend into the wafer box 300 to clean the wafer 200.

[0039] The hydraulic cleaning assembly 720 includes a mounting frame 721 and a cleaning end 722. The mounting frame 721 has a U-shaped cross-section, and the cleaning end 722 includes a plurality of cleaning spray rods arranged at intervals. Cleaning spray holes are opened on the surface of the cleaning spray rods. The design of the cleaning spray rods and the cleaning spray holes can penetrate into the interior of the wafer box 300 to clean the wafers 200 on both sides. During the cleaning process, the wafers 200 are allowed to move slightly left and right within a certain range, and can be staggered from a constant position, so that the dead corners of the bonding can be exposed to the outside, thereby improving the cleaning effect of the interior of the receiving groove 310 of the wafer box 300.

[0040] The spacing of the cleaning spray rods here is adjusted according to the model of the wafer box 300, specifically according to the distribution of the receiving slots 310. When the hydraulic cleaning device 700 moves toward the wafer box 300, the cleaning spray rods can be located between two adjacent wafers 200, thereby improving the accuracy of cleaning control of multiple wafers 200.

[0041] Furthermore, the cleaning spray rod extends between two adjacent wafers 200, and the cleaning spray hole is arranged obliquely outside the axis of the cleaning spray rod. There is an oblique angle between the axis of the cleaning spray hole and the axis of the cleaning spray rod. The cleaning spray hole here can be arranged horizontally and obliquely. The cleaning medium sprayed from the cleaning spray hole can exert an opposite force to push the cleaning spray rod to rotate around its own axis. In this process, the liquid sprayed from the cleaning spray hole can periodically control the vibration of the wafer 200, further improving the cleaning effect on the dead corners of the wafer 200 and the wafer box 300.

[0042] The limiting bearing device 600 includes two bearing rods 620, which extend along the length direction of the wafer box 300. A flexible limiting sleeve 610 is provided on the surface of the bearing rod 620, and the flexible limiting sleeve 610 is filled with a bearing limiting medium. By setting the bearing limiting medium, the wafer 200 can be supported and limited, so that multiple wafers 200 can be in a more stable state when flipped and cleaned; at the same time, it can avoid direct rigid contact between the bearing rod 620 and the wafer 200, thereby avoiding damage to the surface of the wafer 200.

[0043] The load-bearing and limiting medium is an electrorheological fluid, and the flexible limiting sleeve 610 has a built-in conductive component, which can change the state of the electrorheological fluid. In the initial state, the electrorheological fluid is controlled to be in a non-conductive flexible state. At this time, the load-bearing and limiting medium can be deformed by the action of the extrusion force. At this time, the containing capsule containing the electrorheological fluid can detect adaptive deformation and adaptively contain and support the wafer 200; in the flipping and cleaning stage, the electrorheological fluid is controlled to be in a rigid state. At this time, the electrorheological fluid can stably support the wafer 200, avoiding the shaking of the overall structure of the load-bearing rod 620 during the up and down movement, thereby ensuring the stability of the wafer 200 during the cleaning process and the cleaning effect of the surface of the wafer 200.

[0044] In summary, by setting the load-bearing limiting medium to electrorheological fluid, multiple wafers 200 can be adaptively supported, and the rigidity and flexibility of the electrorheological fluid can be adjusted according to the cleaning status of the wafer 200, meeting the needs of adaptive cleaning; compared with traditional purely flexible limiting materials, this limiting load method is more suitable for flipping and cleaning the wafer 200, ensuring stable support and deep cleaning.

[0045] The position-limiting bearing device 600 further includes a first adjusting component 630 for controlling the distance between the two bearing rods 620. The distance between the two bearing rods 620 is adjusted according to the size of the wafer 200 to complete the load-limiting of the top of the wafer 200. When the size of the wafer 200 is large, the distance between the two bearing rods 620 is controlled to increase. On the contrary, when the size of the wafer 200 is small, the distance between the two bearing rods 620 is controlled to decrease. Adaptive adjustment is performed according to wafers 200 of different sizes.

[0046] Through the above-mentioned structural design, wafers 200 of different sizes can be adaptively supported, ensuring the stability of the wafer 200 during the flipping and cleaning process; at the same time, during the overall structural adjustment process, there is no need for staff to replace the limiting support device 600, and the overall adjustment operation process is carried out automatically without the need to disassemble and replace the internal structure, thereby improving the stability, adaptability and efficiency of the wafer 200 during the cleaning process.

[0047] The limiting bearing device 600 also includes a second adjustment component 640 for controlling the distance between the two bearing rods 620 and the wafer box 300. It should be noted here that by setting the second adjustment component 640, the height position of the two bearing rods 620 can be adjusted so that the two bearing rods 620 can be close to or away from the wafer 200. During the process of loading and unloading the wafer box 300 and the wafer 200, the bearing rod 620 is controlled to extend to the extreme position, so that the wafer box 300 can be replaced smoothly, further improving the overall cleaning efficiency.

[0048] The first carrier body 400 and the second carrier body 500 are both hollow frame structures. The first carrier body 400 includes an outer rectangular frame 410. The rectangular frame 410 and the second carrier body 500 are rotatably connected through a driving shaft 421. The outer wall of the rectangular frame 410 is fixed with an electronic control component 420 that controls the rotation of the driving shaft 421.

[0049] The second carrier body 500 can be controlled to flip 180° through the electronic control component 420. The hollow area formed by the outer rectangular frame 410 here is relatively large, which can allow the second carrier body 500 and the wafer box 300 on the surface of the second carrier body 500 to flip through. A connecting piece 430 is also fixed on the surface of the outer rectangular frame 410. The connecting piece 430 can be connected to an electric robotic arm to control the overall structure to enter and exit the cleaning tank 100 to achieve deep cleaning of multiple wafers 200.

[0050] The present invention is further described below in conjunction with the cleaning process.

[0051] A cleaning process for reducing metal residue in a film cassette, using the above-mentioned cleaning device for reducing metal residue in a film cassette, comprises the following steps:

[0052] S1. Fix the chip box 300 on the upper surface of the second carrier body 500 to complete a cleaning of the chip box 300. At this time, the chip box 300 is in a top-up position for cleaning.

[0053] S2. Control the limiting supporting device 600 to descend and press against the upper end of the wafer 200, and then control the second supporting body 500 to flip over; at this time, the top opening direction of the wafer box 300 is flipped and arranged downward, and the limiting supporting device 600 can support and limit the multiple wafers 200 in the wafer box 300.

[0054] S3. Control the hydraulic cleaning device 700 to extend into the bottom of the wafer cassette 300 to limit the wafer 200 and perform secondary cleaning on the wafer cassette 300. At this time, the wafer cassette 300 can be in a top-down state for secondary cleaning. During this process, the wafer 200 can also be controlled to continue to move downward and staggered with the wafer cassette 300, so that the dead angle of fitting between the wafer cassette 300 and the wafer 200 is completely exposed to the outside, and the active extension of the hydraulic cleaning device 700 improves the cleaning effect of the wafer cassette 300 and the wafer 200, thereby avoiding the residual metal impurities to the greatest extent.

[0055] The present invention can deeply clean the interior of the wafer box 300, thereby preventing metal residues in the wafer box 300 from contaminating the wafer 200 and ensuring the cleaning quality of the wafer 200 and the wafer box 300.

[0056] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A cleaning device for reducing metal residue in a cassette, comprising a cleaning pool (100) and a transfer device for transferring a cassette (300) containing a built-in wafer (200), characterized in that: The transfer device comprises a first carrier body (400), the inner wall of the first carrier body (400) is rotatably connected to a second carrier body (500), the wafer box (300) is arranged on the surface of the second carrier body (500), and a limiting carrier device (600) for limiting the top bearing position of the wafer (200) is installed on the outer side of the second carrier body (500); A hydraulic cleaning device (700) is provided below the second carrier body (500), and the hydraulic cleaning device (700) is controlled to extend into the bottom of the wafer box (300) to limit the wafer (200) and clean the inner wall of the wafer box (300). The bottom of the wafer box (300) has a through opening, and the size of the through opening is larger than the hydraulic cleaning device (700) so that the hydraulic cleaning device (700) can pass through. During the cleaning process of the wafer and the cassette, the limiting bearing device and the hydraulic cleaning device are respectively located on both sides to adjust the position of the wafer so that the wafer and the cassette are staggered.

2. The cleaning device for reducing metal residue in a film box according to claim 1, characterized in that: The hydraulic cleaning device (700) comprises a cleaning carrier plate (710), a hydraulic cleaning assembly (720) adapted to the film box (300) being fixed to the upper end of the cleaning carrier plate (710), and a third adjustment assembly (730) being installed between the cleaning carrier plate (710) and the second carrier body (500).

3. The cleaning device for reducing metal residue in a film box according to claim 2, characterized in that: The hydraulic cleaning assembly (720) comprises a mounting frame (721) and a cleaning end (722); the mounting frame (721) has a U-shaped cross section; the cleaning end (722) comprises a plurality of cleaning spray rods arranged at intervals; and cleaning spray holes are provided on the surfaces of the cleaning spray rods.

4. The cleaning device for reducing metal residue in a film box according to claim 3, characterized in that: The cleaning liquid spray rod extends between two adjacent wafers (200), the cleaning liquid spray hole is arranged obliquely outside the axis of the cleaning liquid spray rod, and an oblique angle is formed between the axis of the cleaning liquid spray hole and the axis of the cleaning liquid spray rod.

5. The cleaning device for reducing metal residue in a film box according to claim 1, characterized in that: The position-limiting bearing device (600) comprises two bearing rods (620), the bearing rods (620) extending along the length direction of the film box (300), the surfaces of the bearing rods (620) being provided with flexible position-limiting sleeves (610), and the flexible position-limiting sleeves (610) being filled with a position-limiting medium.

6. The cleaning device for reducing metal residue in a film box according to claim 5, characterized in that: The load-bearing and limiting medium is an electrorheological fluid, and the flexible limiting sleeve (610) has a built-in conductive component.

7. The cleaning device for reducing metal residue in a film box according to claim 5, characterized in that: The position-limiting bearing device (600) further includes a first adjusting component (630) for controlling the distance between the two bearing rods (620), and the distance between the two bearing rods (620) is adjusted according to the size of the wafer (200) to complete the position-limiting of the top of the wafer (200).

8. The cleaning device for reducing metal residue in a film box according to claim 5, characterized in that: The position-limiting bearing device (600) further comprises a second adjustment component (640) for controlling the distance between the two bearing rods (620) and the film box (300).

9. The cleaning device for reducing metal residue in a film box according to claim 1, characterized in that: The first supporting body (400) and the second supporting body (500) are both hollow frame structures. The first supporting body (400) includes an outer rectangular frame (410). The rectangular frame (410) and the second supporting body (500) are rotatably connected via a driving shaft (421). An electric control component (420) for controlling the rotation of the driving shaft (421) is fixed to the outer wall of the rectangular frame (410).

10. A cleaning process for reducing metal residue in a cassette, characterized in that: The cleaning device for reducing metal residue in a film box according to any one of claims 1 to 9 comprises the following steps: S1, fixing the film box (300) on the upper surface of the second carrier body (500) to complete a cleaning of the film box (300); S2, controlling the position-limiting bearing device (600) to descend and to abut against the upper end of the wafer (200), and then controlling the second bearing body (500) to flip; S3. Control the hydraulic cleaning device (700) to extend into the bottom of the wafer box (300) to limit the wafer (200) and perform secondary cleaning on the wafer box (300).

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