A PCB assembly inspection system with assembly positioning marks

Abstract

This invention discloses a PCB assembly and inspection system with assembly positioning marks. This invention relates to the field of PCB board inspection technology and solves the problem that traditional methods of internal PCB inspection, which rely on simple data analysis to determine the presence of problems, are incomplete. This invention analyzes the acquired PCB board image and identifies the corresponding marking information of the components. This marking information allows for intuitive identification of faulty components. Simultaneously, the PCB board image is compared with the schematic diagram to determine if there are wiring errors. For both present and absent errors, separate analyses are performed, and fault analysis is conducted based on the PCB board's operating parameters. This achieves comprehensive PCB board inspection, determines the cause of PCB board faults, promptly locates specific influencing factors, discovers potential internal problems, and ensures the stable operation of the PCB board in the future.

Description

Technical Field

[0001] This invention relates to the field of PCB board inspection technology, specifically a PCB assembly inspection system with assembly positioning marks. Background Technology

[0002] PCBs are an essential component of electronic devices, such as computers, mobile phones, and refrigerators. The performance of modern electronic devices is not only affected by the quality and performance of the electronic components themselves, but also largely depends on the quality of the PCB. In particular, the two-dimensional PCB is the foundation of the entire electronic circuit, the first critical link affecting the quality of subsequent electronic products, and an important link affecting the quality of electronic systems and production cycles.

[0003] Chinese Patent Application No. CN202010699142.7 discloses a real-time automatic detection and classification device for two-dimensional PCB defects based on deep learning, comprising: an image acquisition module, a PCB positioning module, an image preprocessing module, a functional area annotation module, an image calibration module, an image sampling module, a serialized data module, a PCB defect library module, a CNN defect training module, a CNN defect point detection module, a CNN defect point classification module, a CNN defect point filtering module, and a statistics and display module. Images are acquired from the PCB production line and transmitted to a cloud-based detection device for real-time online detection. Suspected defects are identified and classified at the image level.

[0004] The aforementioned patent ensures the overall integrity of PCB boards by detecting defects based on images. However, some existing inspection systems, when inspecting PCBs during assembly, only check the appearance of the PCB board to determine its integrity. For internal inspections, they only judge the acquired data. This method results in incomplete detection and makes it difficult to identify the specific causes of anomalies, thus hindering subsequent judgment and processing. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a PCB assembly inspection system with assembly positioning marks, which solves the problem that the current method of determining the presence of problems through simple data detection for internal PCB inspection is incomplete.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a PCB assembly and inspection system with assembly positioning marks, comprising:

[0007] The component positioning and analysis unit is used to identify components in the acquired PCB image, analyze the characteristics of the components, and establish a corresponding coordinate system to mark and locate the components, generate identification information, and transmit the identification information to the detection information output unit.

[0008] The insertion detection and analysis unit analyzes the acquired PCB board image, determines the wiring status in the PCB board image, generates correct wiring signals and incorrect wiring signals, and transmits the correct wiring signals to the electrical test analysis unit. For the incorrect wiring signals, it further analyzes the impact of the wiring errors and generates corresponding analysis results, including open circuit information and short circuit information, and transmits the analysis results to the detection information output unit.

[0009] The electrical test analysis unit is used to analyze the acquired correct connection signals. By analyzing the transmission signals of the PCB board, it judges the changes in the transmission signals and generates normal and abnormal signals. For abnormal signals, it further analyzes them based on the impedance of the PCB board and determines the influencing factors of the transmission signals, generating influence information. At the same time, the influence information is transmitted to the detection information output unit.

[0010] As a further embodiment of the present invention, it also includes an information acquisition unit and a detection information output unit;

[0011] The information acquisition unit is used to acquire images of the PCB board and transmit the acquired images to the component positioning analysis unit and the assembly detection analysis unit.

[0012] The detection information output unit is used to display the acquired identification information, impedance cause information, environmental impact information, and self-cause information to the operator.

[0013] As a further aspect of the present invention: the specific method by which the component positioning analysis unit identifies and positions components to generate identification information is as follows:

[0014] The components in the acquired PCB image are identified. A CCD camera and a ring red light source are used to image the electronic components on the PCB circuit board, and the identified components are labeled as i, where i = 1, 2, ..., j, and j represents the quantity of the component. Then, the component features of component i are extracted, including the size, shape and color of the component. At the same time, the pixel coordinate system is converted to the physical world coordinate system, and component i is labeled and located in the physical world coordinate system to further generate identification information.

[0015] As a further aspect of the present invention: the specific method by which the insertion detection and analysis unit judges the connection status in the PCB board image and generates correct connection signals and incorrect connection signals is as follows:

[0016] The PCB board image is acquired, and the corresponding schematic diagram is also acquired. Here, the schematic diagram is the wiring diagram of the PCB board. The PCB board image and the schematic diagram are matched to determine whether there are wiring errors. If there are wiring errors, a wiring error signal is generated; otherwise, a wiring correct signal is generated.

[0017] As a further aspect of the present invention, the specific method for analyzing the generated wiring error signal is as follows:

[0018] The system acquires PCB board images and locates erroneous connections in the PCB board images using schematic diagrams. Simultaneously, it performs flying probe testing on the PCB board to obtain capacitance values, which are then compared with standard values. If the capacitance value is greater than the standard value, it indicates an open circuit in the PCB board, and open circuit information is generated. Conversely, if the capacitance value is less than the standard value, it indicates a short circuit in the PCB board, and short circuit information is generated.

[0019] As a further aspect of the present invention: the electrical test analysis unit analyzes the correct wiring signal to generate normal and abnormal signals in the following specific manner:

[0020] The system acquires the transmission signal of the PCB board within a time period t, the specific value of which is set by the operator. It analyzes the changes in the transmission signal and generates a normal signal when the transmission signal changes stably, and an abnormal signal when the transmission signal changes unstablely. The generated normal signal is then transmitted to the detection information output unit.

[0021] As a further aspect of the present invention, the specific method for analyzing abnormal signals is as follows:

[0022] The impedance of the PCB board is analyzed to obtain the impedance fluctuation graph within the time period t1. The fluctuation graph is analyzed. When the fluctuation graph shows a stable change, non-impedance cause information is generated. Conversely, when the fluctuation graph shows an unstable change, impedance cause information is generated.

[0023] Further analysis of the generated non-impedance cause information is performed, the PCB board testing environment is adjusted to obtain a normal testing environment, and the current testing environment is adjusted. Then, the changes in the PCB board transmission signal corresponding to the adjusted testing environment are analyzed. If the transmission signal changes stably, it indicates that the change in the testing environment has caused abnormal fluctuations in the transmission signal, and environmental influence cause information is generated. Conversely, if the transmission signal changes unstablely, it indicates that the PCB board itself has defects, and its own cause information is generated.

[0024] A PCB with assembly positioning marks, comprising an image information acquisition module 101, a PCB positioning module 102, a PCB detection and analysis module 103, and an information output module 104;

[0025] The image information acquisition module 101 includes an information acquisition unit, which is used to acquire images of the PCB board and the schematic diagram, and transmit the PCB board images and schematic diagram to the PCB positioning module 102.

[0026] PCB positioning module 102 includes a component positioning analysis unit, which is used to identify and position the components on the PCB board according to the acquired PCB board image and schematic diagram, and generate corresponding identification information, while transmitting the generated identification information to the information output module 104.

[0027] The PCB inspection and analysis module 103 includes an insertion inspection and analysis unit and an electrical test and analysis unit. It is used to judge the connection status corresponding to the PCB board image and generate connection correct signal and connection error signal. At the same time, it analyzes the connection correct signal and connection error signal respectively. The connection error signal is analyzed to generate analysis results, and the analysis results include open circuit information and short circuit information. The analysis results are transmitted to the information output module 104. The connection correct signal is analyzed by analyzing the changes in the transmitted signal and determining the cause of the influence of the transmitted signal according to the PCB board impedance to generate influence information. The influence information includes impedance cause information, environmental influence information and self-cause information. The generated influence information is transmitted to the information output module 104.

[0028] The information output module 104 is used to display the acquired analysis results and impact information to the corresponding testing personnel.

[0029] This invention provides a PCB assembly inspection system with assembly positioning marks. Compared with the prior art, it has the following advantages:

[0030] This invention analyzes acquired PCB board images and identifies the corresponding components to obtain their identification information. This identification information allows for intuitive identification of faulty components. Furthermore, the PCB board image is compared with the schematic diagram to determine if wiring errors exist. Analysis is performed separately for both present and absent errors, using the PCB board's operating parameters for fault analysis and combining this with normal parameters for a comprehensive PCB board inspection. This allows for the determination of the cause of PCB board faults, timely identification of specific influencing factors, and discovery of potential internal problems, ensuring the stable operation of the PCB board in the future. Attached Figure Description

[0031] Figure 1 This is a block diagram of the insertion detection system of the present invention;

[0032] Figure 2 This is a schematic diagram of the PCB module of the present invention;

[0033] In the diagram: 101, Image Information Acquisition Module; 102, PCB Positioning Module; 103, PCB Detection and Analysis Module; 104, Information Output Module. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] Example 1, please refer to Figure 1 This application provides a PCB assembly inspection system with assembly positioning marks, including: an information acquisition unit, a component positioning analysis unit, an assembly inspection analysis unit, an electrical test analysis unit, and an inspection information output unit.

[0036] The information acquisition unit is used to acquire images of the PCB board and transmit the acquired images to the component positioning and analysis unit. Specifically, a frame of PCB imaging image can be captured in real time by calling the camera API.

[0037] The component positioning and analysis unit is used to identify components in the acquired PCB image, analyze the characteristics of the components, and establish a corresponding coordinate system to locate and identify the components, generating identification information. The specific method for generating the identification information is as follows:

[0038] The system identifies components in the acquired PCB image by using a CCD camera and a ring-shaped red light source to image the electronic components on the PCB circuit board. The identified components are labeled as i, where i = 1, 2, ..., j, and j represents the quantity of the component. Then, the component features of component i are extracted, including the size, shape, and color of the component. At the same time, the pixel coordinate system is converted to the physical world coordinate system, and component i is labeled and located in the physical world coordinate system. Further, identification information is generated, which includes the component's label location and component feature information. The generated identification information is then transmitted to the detection information output unit.

[0039] Example 2 differs from Example 1 in that the information acquisition unit transmits the acquired PCB board image to the assembly detection and analysis unit, and then analyzes it through the assembly detection and analysis unit.

[0040] The insertion detection and analysis unit analyzes the acquired PCB board image, determines the wiring status in the PCB board image, generates correct wiring signals and incorrect wiring signals, and transmits the correct wiring signals to the electrical test analysis unit. For the incorrect wiring signals, the unit further analyzes the impact of the wiring errors and generates corresponding analysis results. These results include open circuit and short circuit information, and the specific method for generating the analysis results is as follows:

[0041] The PCB board image is acquired, and the corresponding schematic diagram is also acquired. Here, the schematic diagram is the wiring schematic diagram of the PCB board. The PCB board image and the schematic diagram are matched to determine whether there are wiring errors. If there are wiring errors, a wiring error signal is generated; otherwise, a wiring correct signal is generated.

[0042] First, the system needs to be able to acquire both an image of the PCB board and its corresponding wiring schematic. This could be achieved by digitizing the PCB board image using a high-resolution scanner or camera, while the wiring schematic can be directly exported from the design software. The acquired PCB board image may require preprocessing to improve the accuracy of subsequent processing. Preprocessing steps include noise reduction, contrast enhancement, and edge sharpening to make the circuits and components on the circuit board clearly visible.

[0043] The schematic diagram is converted into a comparable format, such as graphic vector data, for effective comparison with the PCB board image. The system extracts features from the PCB board image, such as circuit paths, solder joint locations, and component layouts, using image recognition technology and matches them with the converted schematic diagram. This process may employ machine learning or deep learning algorithms to improve recognition accuracy. If inconsistencies are found during the matching process, i.e., differences in wiring between the PCB board image and the schematic diagram, the system will mark the specific location of the error and generate a wiring error signal. Conversely, if everything matches correctly, the system generates a wiring correct signal.

[0044] Suppose that during the manufacturing of an amplifier circuit board, the system detects that a resistor in the original design should be connected to pin 5 of the IC chip, but on the PCB board image, the resistor is connected to pin 6. The system automatically identifies this wiring error through comparison and analysis and immediately generates a wiring error signal.

[0045] Next, the generated wiring error signals are analyzed, the PCB board image is acquired, and the location of the erroneous wiring in the PCB board image is located using the schematic diagram. At the same time, flying probe testing is performed on the PCB board to obtain the capacitance value, which is then compared with a standard value. If the capacitance value is greater than the standard value, it indicates that there is an open circuit on the PCB board, and open circuit information is generated. Conversely, if the capacitance value is less than the standard value, it indicates that there is a short circuit on the PCB board, and short circuit information is generated. Then, the generated open circuit and short circuit information are transmitted to the detection information output unit.

[0046] Upon receiving a wiring error signal, the system first performs a detailed analysis to determine the error type and possible location. Then, it acquires a high-resolution image of the PCB board to provide accurate visual information for subsequent error localization. Using the schematic as a reference, the system employs image processing technology to precisely locate the faulty wiring within the PCB board image. This includes using image recognition algorithms to identify lines and connections that do not match the schematic.

[0047] By using flying probes, the system can obtain the capacitance values ​​at various points on the PCB board. These values ​​are then compared with preset standard values. Based on the comparison results, the system can determine the problems existing on the PCB board. If the capacitance value is greater than the standard value, it usually indicates an open circuit on the PCB board; conversely, if the capacitance value is less than the standard value, it usually indicates a short circuit.

[0048] Suppose that during the manufacturing of a switch motherboard, the system detects a lower-than-standard capacitance value near a network port during flying probe testing, leading the system to conclude that a short circuit exists in that area. Using image recognition technology, the system further pinpoints the short circuit to be between two adjacent signal lines. The system then generates short circuit information, indicating the specific location of the short circuit and its possible cause (e.g., insufficient conductor spacing).

[0049] The electrical test analysis unit analyzes the acquired correct wiring signals. By analyzing the transmitted signals from the PCB board, it determines changes in the transmitted signals and generates normal and abnormal signals. For abnormal signals, it further analyzes the PCB board impedance to identify influencing factors and generate impact information. This impact information is then transmitted to the detection information output unit. The specific method for generating the impact information is as follows:

[0050] The system acquires the transmission signal of the PCB board within a time period t, where the specific value of the time period t is set by the operator. It analyzes the changes in the transmission signal and generates a normal signal when the transmission signal changes stably, and generates an abnormal signal when the transmission signal changes unstable. The generated normal signal is then transmitted to the detection information output unit.

[0051] For the generated abnormal signals, the impedance of the corresponding PCB board is analyzed to obtain the impedance change fluctuation graph within the time period t1. The change fluctuation graph is analyzed. When the change fluctuation graph is stable, non-impedance cause information is generated. Conversely, when the change fluctuation graph is unstable, impedance cause information is generated.

[0052] Further analysis of the generated non-impedance cause information is performed, the PCB board testing environment is adjusted to obtain a normal testing environment, and the current testing environment is adjusted. Then, the changes in the PCB board transmission signal corresponding to the adjusted testing environment are analyzed. If the transmission signal changes stably, it indicates that the change in the testing environment has caused abnormal fluctuations in the transmission signal, and environmental influence cause information is generated. Conversely, if the transmission signal changes unstablely, it indicates that the PCB board itself has defects, and its own cause information is generated.

[0053] Suppose that during testing of a high-frequency PCB board, the system detects unstable transmitted signals within a time period t. By analyzing the impedance fluctuation graph, the system discovers abnormal impedance fluctuations at specific frequency points, thus generating impedance cause information. Furthermore, by adjusting the detection environment (e.g., reducing background electromagnetic interference), the system tests again and finds the transmitted signal becomes stable. Therefore, it is determined that environmental interference caused the initial abnormal signal fluctuations, generating corresponding environmental influence cause information.

[0054] The generated impedance cause information, environmental impact information, and internal cause information are transmitted to the detection information output unit.

[0055] The detection information output unit is used to display the acquired impedance cause information, environmental impact information, and self-cause information to the operator.

[0056] Example 3, as Example 3 of the present invention, focuses on combining the implementation processes of Example 1 and Example 2.

[0057] Example 4, please refer to Figure 2 A PCB with assembly positioning marks, specifically including an image information acquisition module 101, a PCB positioning module 102, a PCB detection and analysis module 103, and an information output module 104;

[0058] The image information acquisition module 101 includes an information acquisition unit, which is used to acquire images of the PCB board and the schematic diagram, and transmit the PCB board images and schematic diagram to the PCB positioning module 102.

[0059] PCB positioning module 102 includes a component positioning analysis unit, which is used to identify and position the components on the PCB board according to the acquired PCB board image and schematic diagram, and generate corresponding identification information, while transmitting the generated identification information to the information output module 104.

[0060] The PCB inspection and analysis module 103 includes an insertion inspection and analysis unit and an electrical test and analysis unit. It is used to judge the connection status corresponding to the PCB board image and generate connection correct signal and connection error signal. At the same time, it analyzes the connection correct signal and connection error signal respectively. The connection error signal is analyzed to generate analysis results, and the analysis results include open circuit information and short circuit information. The analysis results are transmitted to the information output module 104. The connection correct signal is analyzed by analyzing the changes in the transmitted signal and determining the cause of the influence of the transmitted signal according to the PCB board impedance to generate influence information. The influence information includes impedance cause information, environmental influence information and self-cause information. The generated influence information is transmitted to the information output module 104.

[0061] The information output module 104 is used to display the acquired analysis results and impact information to the corresponding testing personnel.

[0062] Some of the data in the above formulas are numerical calculations with dimensions removed, and the contents not described in detail in this specification are all prior art known to those skilled in the art.

[0063] The above embodiments are only used to illustrate the technical methods of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical methods of the present invention without departing from the spirit and scope of the technical methods of the present invention.

Claims

1. A PCB assembly inspection system with assembly positioning marks, characterized in that, include: The component positioning and analysis unit is used to identify components in the acquired PCB image, analyze the characteristics of the components, establish a corresponding coordinate system to locate the components and generate identification information, and transmit the identification information to the detection information output unit. The specific processing method is as follows: The components in the acquired PCB image are identified. A CCD camera and a ring red light source are used to image the electronic components on the PCB circuit board. The identified components are labeled as i, where i = 1, 2, ..., j, and j represents the quantity of the component. Then, the component features of component i are extracted, including the size, shape and color of the component. At the same time, the pixel coordinate system is converted to the physical world coordinate system, and component i is labeled and located in the physical world coordinate system to further generate identification information. The insertion detection and analysis unit analyzes the acquired PCB board image and determines the wiring status within the image, generating correct and incorrect wiring signals. The specific processing method is as follows: The PCB board image is acquired, and the corresponding schematic diagram is also acquired. Here, the schematic diagram is the wiring schematic diagram of the PCB board. The PCB board image and the schematic diagram are matched to determine whether there are wiring errors. If there are wiring errors, a wiring error signal is generated; otherwise, a wiring correct signal is generated. The correct wiring signal is transmitted to the electrical test and analysis unit. For the incorrect wiring signal, the impact of the wiring error is further analyzed, and corresponding analysis results are generated. The analysis results include open circuit information and short circuit information. The analysis results are then transmitted to the detection information output unit. The electrical test analysis unit analyzes the acquired correct connection signals. By analyzing the transmitted signals from the PCB board, it determines changes in the transmitted signals and generates normal and abnormal signals. For abnormal signals, it further analyzes the PCB board's impedance to identify influencing factors and generate impact information. This impact information is then transmitted to the detection information output unit. The specific processing method is as follows: The system acquires the transmission signal of the PCB board within a time period t, the specific value of which is set by the operator. It analyzes the changes in the transmission signal and generates a normal signal when the transmission signal changes stably, and an abnormal signal when the transmission signal changes unstablely. The generated normal signal is then transmitted to the detection information output unit.

2. The PCB insertion inspection system with assembly positioning marks according to claim 1, characterized in that, It also includes an information acquisition unit and a detection information output unit; The information acquisition unit is used to acquire images of the PCB board and transmit the acquired images to the component positioning analysis unit and the assembly detection analysis unit. The detection information output unit is used to display the acquired identification information, impedance cause information, environmental impact information, and self-cause information to the operator.

3. The PCB assembly and inspection system with assembly positioning marks according to claim 1, characterized in that, The specific method for analyzing the generated wiring error signal is as follows: The system acquires PCB board images and locates erroneous connections in the PCB board images using schematic diagrams. Simultaneously, it performs flying probe testing on the PCB board to obtain capacitance values, which are then compared with standard values. If the capacitance value is greater than the standard value, it indicates an open circuit in the PCB board, and open circuit information is generated. Conversely, if the capacitance value is less than the standard value, it indicates a short circuit in the PCB board, and short circuit information is generated.

4. The PCB assembly and inspection system with assembly positioning marks according to claim 1, characterized in that, The specific methods for analyzing abnormal signals are as follows: The impedance of the PCB board is analyzed to obtain the impedance fluctuation graph within the time period t1. The fluctuation graph is analyzed. When the fluctuation graph shows a stable change, non-impedance cause information is generated. Conversely, when the fluctuation graph shows an unstable change, impedance cause information is generated. Further analysis of the generated non-impedance cause information is performed, the PCB board testing environment is adjusted to obtain a normal testing environment, and the current testing environment is adjusted. Then, the changes in the PCB board transmission signal corresponding to the adjusted testing environment are analyzed. If the transmission signal changes stably, it indicates that the change in the testing environment has caused abnormal fluctuations in the transmission signal, and environmental influence cause information is generated. Conversely, if the transmission signal changes unstablely, it indicates that the PCB board itself has defects, and its own cause information is generated.

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