Manufacturing method of thick yin-yang copper PCB board and thick yin-yang copper PCB board

Abstract

The present application relates to the field of PCB production and discloses a method for manufacturing a thick yin-yang copper PCB. The method comprises: simultaneously performing a first etching on a first surface and a second surface of a seventh PCB; after completing the first etching on the second surface, retaining the tin layer on the circuit pattern on the second surface to obtain an eighth PCB; producing a second outer layer pattern on the eighth PCB, without applying a dry film to the first surface, applying a dry film to the second surface, and not performing an exposure treatment on the dry film on the second surface, retaining the dry film on the second surface as a protective film; applying glue to the edges of the eighth PCB to obtain a ninth PCB; performing a second etching on the ninth PCB, after completing the second etching on the first surface, removing the dry film on the second surface, and then removing the tin layer on the second surface. The present application enables quality inspection of fine circuits on thick yin-yang copper PCBs, thereby improving the production quality of thick yin-yang copper PCBs.

Description

Technical Field

[0001] The present application relates to the technical field of PCB board production, and more specifically, to a manufacturing method of a yin-yang copper thick PCB board and a yin-yang copper thick PCB board. Background Art

[0002] High-power thick copper PCBs are increasingly being used, particularly in the new energy sector. For example, they've found applications in new energy vehicles, charging stations, photovoltaics, energy storage, and servers. Thick copper PCBs feature thicker circuit patterns, allowing them to carry larger electrical loads. To reduce PCB costs, circuit patterns with different copper thicknesses can be machined on each side of the PCB. PCBs with different copper thicknesses on both sides are known as yin-yang copper PCBs. Yin-yang thick copper multilayer PCBs offer high thermal stability and excellent insulation and withstand voltage, making them suitable for loads of varying sizes.

[0003] Patent CN104427776B (Application Number: 201310364780.3) provides a method for manufacturing a thick copper yin-yang printed circuit board. This method includes the following steps: providing a printed circuit board with different copper foil thicknesses; fabricating conductive circuits, with a first conductive circuit and a second conductive circuit being fabricated on the thick copper side and the thin copper side, respectively; and post-processing. The steps for fabricating the first conductive circuit on the thick copper side include: transferring the outer layer pattern, tinning the pattern, and alkaline etching; the steps for fabricating the second conductive circuit on the thin copper side include: transferring the outer layer pattern and acid etching. This method fabricates the first and second conductive patterns on the thick copper side and the thin copper side, respectively, to produce fine circuits on printed circuit boards with different copper foil thicknesses. However, the manufacturing method described in patent CN104427776B cannot perform quality inspection on the fine circuits on the thick copper yin-yang PCBs, and therefore cannot guarantee the production quality of thick copper yin-yang PCBs. Summary of the Invention

[0004] The purpose of the present application is to provide a method for manufacturing a yin-yang copper thick PCB board and a yin-yang copper thick PCB board, which solves the technical problem of being unable to perform quality inspection on fine circuits on the yin-yang copper thick PCB board and unable to ensure the production quality of the yin-yang copper thick PCB board. The present application achieves the technical effect of being able to perform quality inspection on fine circuits on the yin-yang copper thick PCB board and improving the production quality of the yin-yang copper thick PCB board.

[0005] The present application provides a method for manufacturing a yin-yang copper thickness PCB board and a yin-yang copper thickness PCB board, the method comprising: performing electroplating on a first surface of an original PCB board to increase a first copper thickness to obtain a second PCB board; wherein the first surface and the second surface of the original PCB board are both provided with an original copper layer of the same thickness; performing a first full-board electroplating on the second PCB board, thereby increasing the second copper thickness on the first surface and the second surface of the first PCB board, thereby obtaining a third PCB board; performing a first pattern electroplating on the third PCB board, thereby obtaining a fourth PCB board; performing a second full-board electroplating on the fourth PCB board, thereby increasing the third copper thickness on the first surface and the second surface of the first PCB board, thereby obtaining a fifth PCB board; producing a first outer layer pattern on the fifth PCB board, performing a second pattern electroplating on the fifth PCB board, and electroplating a tin layer on the circuit pattern on the second surface, thereby obtaining a A sixth PCB board is formed; the sixth PCB board is subjected to a second pattern electroplating to obtain a seventh PCB board; the first and second surfaces of the seventh PCB board are simultaneously etched for the first time, and after the first etching of the second surface is completed, the tin layer on the circuit pattern on the second surface is retained to obtain an eighth PCB board; a second outer layer pattern is formed on the eighth PCB board, wherein the dry film is not applied to the first surface and is applied to the second surface, and the dry film on the second surface is not exposed, and the dry film on the second surface is retained as a protective film; the edge of the eighth PCB board is coated with glue to obtain a ninth PCB board; the ninth PCB board is subjected to a second etching to obtain the second surface, and after the second etching of the first surface is completed, the dry film on the second surface is removed, and the tin layer on the second surface is removed, and then solder resist, characterization, surface treatment and molding are performed to obtain a finished yin-yang copper thick PCB board.

[0006] In one possible implementation, the first copper thickness is 60-70 μm, the second copper thickness is 8-12 μm, and the third copper thickness is 15-20 μm; the copper thickness of the first surface of the fifth PCB board is greater than or equal to 265 μm, and the copper thickness of the second surface of the fifth PCB board is greater than or equal to 125 μm; the copper thickness of the first surface of the seventh PCB board is greater than or equal to 280 μm, and the copper thickness of the second surface of the fifth PCB board is greater than or equal to 140 μm.

[0007] In another possible implementation, the method further includes: drilling holes on the second PCB board before performing the first whole-board electroplating on the second PCB board, and setting the diameter of the drill bit to be pre-enlarged by 0.3-0.35 mm according to the hole diameter tolerance of the copper-plated hole of ±0.076 mm during drilling.

[0008] In another possible implementation, when the first outer layer pattern is produced on the fifth PCB board, the line width and line spacing of the first board surface and the second board surface are dynamically compensated according to the copper thickness difference between the first board surface and the second board surface and the etching solution parameters.

[0009] In another possible implementation, the method further includes: when simultaneously performing a first etching on the first and second surfaces of the seventh PCB board, supporting and conveying the seventh PCB board from the first surface of the seventh PCB board via conveyor rollers, and inspecting etching quality of the second surface of the seventh PCB board using a quality inspection component; and when performing a second etching on the ninth PCB board, supporting and conveying the ninth PCB board from the second surface of the ninth PCB board via conveyor rollers, and inspecting etching quality of the first surface of the ninth PCB board using the quality inspection component.

[0010] In another possible implementation, when the first and second surfaces of the seventh PCB are simultaneously etched for the first time, the seventh PCB is supported and conveyed from the first surface of the seventh PCB by a conveyor roller, including: when the conveyor roller is supporting and conveying the seventh PCB from the first surface of the seventh PCB, controlling the etching liquid spray density and etching liquid spray volume on the side where the conveyor roller is located to be greater than the etching liquid spray density and etching liquid spray volume on the second surface of the seventh PCB; wherein the etching liquid spray density and etching liquid spray volume on the side where the conveyor roller is located relative to the etching liquid spray density on the second surface of the seventh PCB, and the etching liquid spray volume increase amount, are controlled based on a difference in copper thickness between the first and second surfaces and an area blocked by the conveyor roller.

[0011] In another possible implementation, the method further includes: when removing the dry film on the second board surface and then removing the tin layer on the second board surface, supporting and conveying the ninth PCB board from the first board surface of the ninth PCB board by a conveyor roller, and inspecting the quality of the tin layer removal on the second board surface of the ninth PCB board by a quality inspection component.

[0012] In another possible implementation, inspecting the etching quality of the second surface of the seventh PCB by a quality inspection component includes: acquiring a seventh PCB image of the seventh PCB from above the seventh PCB, and determining an etching residue amount after etching the second surface in the seventh PCB image; and when the etching residue amount is greater than a preset etching residue amount, performing a second etching on the ninth PCB, removing a dry film on the second surface, and then performing additional etching on the second surface of the ninth PCB.

[0013] In another possible implementation, determining the etching residue amount after etching the second board surface on the seventh PCB board image includes: determining the residual copper layer width around all circuit patterns on the seventh PCB board image, and using the residual copper layer width as the etching residue amount.

[0014] An embodiment of the present application further provides a yin-yang copper thick PCB board, which is manufactured using the above-mentioned yin-yang copper thick PCB board manufacturing method.

[0015] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0016] The embodiment of the present application provides a method for manufacturing a PCB board with a positive and negative copper thickness, which includes: electroplating a first surface of an original PCB board to increase the first copper thickness to obtain a second PCB board; wherein the first surface and the second surface of the original PCB board are both provided with an original copper layer of the same thickness; performing a first full-board electroplating on the second PCB board, so that the first surface and the second surface of the first PCB board increase the second copper thickness to obtain a third PCB board; performing a first pattern electroplating on the third PCB board, so that the fourth PCB board increases the third copper thickness to obtain a fifth PCB board; making a first outer layer pattern on the fifth PCB board, performing a second pattern electroplating on the fifth PCB board, and electroplating a tin layer on the circuit pattern on the second surface to obtain a sixth PCB board B board; performing a second pattern electroplating on the sixth PCB board to obtain a seventh PCB board; performing a first etching on the first and second surfaces of the seventh PCB board simultaneously; after completing the first etching on the second surface, retaining the tin layer on the circuit pattern on the second surface to obtain an eighth PCB board; producing a second outer layer pattern on the eighth PCB board; during the second outer layer pattern, no dry film is applied to the first surface, but dry film is applied to the second surface, and the dry film on the second surface is not exposed, retaining the dry film on the second surface as a protective film; applying glue to the edge of the eighth PCB board to obtain a ninth PCB board; performing a second etching on the ninth PCB board; after completing the second etching on the first surface, removing the dry film on the second surface, removing the tin layer on the second surface, and then performing solder mask, lettering, surface treatment and molding to obtain a finished positive and negative copper thick PCB board. The embodiment of the present application can increase the thickness of the copper layer of the PCB board through multiple full-board electroplating, multiple pattern electroplating, and multiple outer layer patterning. In conjunction with dry film and tin plating on the PCB board, the production accuracy of the circuit patterns on both sides of the yin-yang copper thick PCB board is ensured, thereby improving the production efficiency of the yin-yang copper thick PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 A schematic flow chart of a method for manufacturing a thick yin-yang copper PCB provided in an embodiment of the present application;

[0019] Figure 2 A schematic diagram of a seventh PCB board image provided in an embodiment of the present application. DETAILED DESCRIPTION

[0020] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0021] It should be noted that when a component or structure is referred to as being “fixed to” or “disposed on” another component or structure, it may be directly on the other component or structure or indirectly on the other component or structure. When a component or structure is referred to as being “connected to” another component or structure, it may be directly connected to the other component or structure or indirectly connected to the other component or structure.

[0022] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or a component or structure referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0024] In the prior art manufacturing method of the thick copper yin and yang PCB board, it is impossible to perform quality inspection on the fine circuits on the thick copper yin and yang PCB board, and the production quality of the thick copper yin and yang PCB board cannot be guaranteed.

[0025] Based on the above reasons, an embodiment of the present application provides a method for manufacturing a PCB board with a positive and negative copper thickness, which includes: electroplating a first board surface of an original PCB board to increase the first copper thickness to obtain a second PCB board; wherein the first board surface and the second board surface of the original PCB board are both provided with an original copper layer of the same thickness; performing a first full-board electroplating on the second PCB board, so that the first board surface and the second board surface of the first PCB board increase the second copper thickness to obtain a third PCB board; performing a first pattern electroplating on the third PCB board, so that the fourth PCB board increases the third copper thickness to obtain a fifth PCB board; making a first outer layer pattern on the fifth PCB board, performing a second pattern electroplating on the fifth PCB board, and electroplating a tin layer on the circuit pattern on the second board surface to obtain A sixth PCB board is formed; the sixth PCB board is subjected to a second pattern electroplating to obtain a seventh PCB board; the first and second surfaces of the seventh PCB board are simultaneously etched for the first time, and after the first etching of the second surface is completed, the tin layer on the circuit pattern on the second surface is retained to obtain an eighth PCB board; a second outer layer pattern is formed on the eighth PCB board, wherein the dry film is not applied to the first surface and is applied to the second surface, and the dry film on the second surface is not exposed, and the dry film on the second surface is retained as a protective film; the edge of the eighth PCB board is coated with glue to obtain a ninth PCB board; the ninth PCB board is subjected to a second etching to obtain the second surface, and after the second etching of the first surface is completed, the dry film on the second surface is removed, and the tin layer on the second surface is removed, and then solder resist, characterization, surface treatment and molding are performed to obtain a finished yin-yang copper thick PCB board. The embodiment of the present application can increase the thickness of the copper layer of the PCB board through multiple full-board electroplating, multiple pattern electroplating, and multiple outer layer patterning. In conjunction with dry film and tin plating on the PCB board, the production accuracy of the circuit patterns on both sides of the yin-yang copper thick PCB board is ensured, thereby improving the production efficiency of the yin-yang copper thick PCB board.

[0026] In some scenarios, the manufacturing method of a thick yin-yang copper PCB board according to an embodiment of the present application can be applied to the production of thick yin-yang copper PCB boards, thereby improving the production efficiency of thick yin-yang copper PCB boards.

[0027] The following describes in detail a method for manufacturing a thick yin-yang copper PCB provided in an embodiment of the present application with reference to specific examples.

[0028] Figure 1 A schematic diagram of a process for manufacturing a thick copper PCB board of a male and female copper provided in an embodiment of the present application is shown as follows: Figure 1 As shown, the method includes S110 to S190, and S110 to S190 are described in detail below.

[0029] S110: Electroplating the first surface of the original PCB to increase the thickness of the first copper layer to obtain a second PCB, wherein both the first surface and the second surface of the original PCB are provided with original copper layers of the same thickness.

[0030] When producing a yin-yang copper thick PCB board, the first board surface of the original PCB board can be electroplated to increase the first copper thickness, thereby making the copper thickness of the first board surface and the copper thickness of the second board surface of the original PCB board different, thereby obtaining a second PCB board, which is convenient for subsequent production of a yin-yang copper thick PCB board based on the second PCB board.

[0031] When manufacturing the second PCB board, a plating resist (such as a photosensitive dry film or other plating resist material) can be first coated on the second board surface of the original PCB board to protect the second board surface from being electroplated. Then, the first copper thickness is thickened by electroplating on the first board surface to obtain the original PCB board.

[0032] S120 , performing a first whole-board electroplating on the second PCB board, so that a second copper thickness is increased on the first board surface and the second board surface of the first PCB board, thereby obtaining a third PCB board.

[0033] After obtaining the second PCB board, the second PCB board can be subjected to a first whole-board electroplating, so that the second copper thickness is increased on the first board surface and the second board surface of the first PCB board, so that the overall copper layer thickness of the first board surface and the second board surface is increased for the first time, thereby obtaining a third PCB board.

[0034] S130 , performing a first pattern electroplating on the third PCB board to obtain a fourth PCB board.

[0035] After obtaining the third PCB board, the third PCB board can be subjected to a first pattern electroplating to obtain a fourth PCB board. The first pattern electroplating can increase the copper thickness of the circuit pattern, thereby increasing the copper layer thickness of the circuit pattern of the third PCB board.

[0036] S140 , performing a second whole-board electroplating on the fourth PCB board, so that the third copper thickness is increased on the first board surface and the second board surface of the first PCB board, thereby obtaining a fifth PCB board.

[0037] After obtaining the fourth PCB board, the fourth PCB board can be further subjected to a second whole-board electroplating, so that the third copper thickness is increased again on the first board surface and the second board surface of the first PCB board, so that the overall copper layer thickness of the first board surface and the second board surface is increased for a second time, thereby obtaining a fifth PCB board.

[0038] S150 , forming a first outer layer pattern on the fifth PCB board, performing a second pattern electroplating on the fifth PCB board, and electroplating a tin layer on the circuit pattern on the second board surface to obtain a sixth PCB board.

[0039] After obtaining the fifth PCB board, a first outer layer pattern can be produced on the fifth PCB board. The first outer layer pattern can retain the copper layer related to the circuit pattern thickened during the electroplating to thicken the first copper thickness on the first board surface, the first whole board electroplating, the first pattern electroplating, and the second whole board electroplating in the above-mentioned S110 to S140, and can remove the copper layer unrelated to the circuit pattern thickened during the electroplating to thicken the first copper thickness on the first board surface, the first whole board electroplating, the first pattern electroplating, and the second whole board electroplating in the above-mentioned S110 to S140, thereby realizing the production of the circuit pattern with a thickened copper layer.

[0040] The first outer layer patterning may include pattern transfer, outer layer electroplating, etching, and dry film removal processes. The first outer layer patterning can further increase the copper layer thickness on the first board surface and the second board surface.

[0041] After the first outer layer pattern is formed, the fifth PCB board may be subjected to a second pattern electroplating. The second pattern electroplating can further increase the copper layer thickness of the PCB board.

[0042] After the second pattern electroplating, a tin layer can be electroplated on the circuit pattern on the second board surface to obtain a sixth PCB board. The tin layer can prevent the circuit pattern on the second board surface from being affected.

[0043] S160 , performing a second pattern electroplating on the sixth PCB board to obtain a seventh PCB board.

[0044] After the sixth PCB board is obtained, the sixth PCB board can be subjected to a second pattern electroplating, which can further increase the thickness of the copper layer on the sixth PCB board to obtain a seventh PCB board.

[0045] For example, the second pattern electroplating of the sixth PCB board may be performed only on the first board surface, thereby increasing the thickness of the copper layer of the circuit pattern on the first board surface.

[0046] S170 , performing a first etching on the first and second surfaces of the seventh PCB board simultaneously. After completing the first etching on the second surface, retaining the tin layer on the circuit pattern on the second surface, thereby obtaining an eighth PCB board.

[0047] After the seventh PCB is obtained, the first and second surfaces of the seventh PCB can be etched simultaneously to form circuit patterns on the first and second surfaces.

[0048] After the first etching is completed on the second board surface, the copper layer other than the tin layer on the second board surface can be removed, and the tin layer on the circuit pattern on the second board surface is retained, so that the thickness of the copper layer on the second board surface is not too thick, and the thickness requirement of the circuit pattern on the second board surface is met, and the eighth PCB board can be obtained.

[0049] S180: A second outer layer pattern is formed on the eighth PCB. For the second outer layer pattern, dry film is not applied to the first surface, but is applied to the second surface. The dry film on the second surface is not exposed, but retained as a protective film. The edges of the eighth PCB are then encapsulated with adhesive to obtain a ninth PCB.

[0050] After the eighth PCB board is obtained, a second outer layer pattern can be produced on the eighth PCB board. The second outer layer pattern can further increase the copper layer thickness of the eighth PCB board.

[0051] The second outer layer patterning may include pattern transfer, outer layer electroplating, etching, and dry film removal processes. The second outer layer patterning can further increase the copper layer thickness on the first board surface and the second board surface.

[0052] During the second outer layer patterning, dry film may not be applied to the first board surface, but may be applied to the second board surface. The dry film on the second board surface may not be exposed, and the dry film on the second board surface may be retained as a protective film, thereby avoiding increasing the copper layer thickness on the second board surface and thus avoiding affecting the copper layer thickness on the second board surface.

[0053] The ninth PCB is obtained by coating the edge of the eighth PCB with glue. The coating can avoid affecting the copper layer at the edge of the eighth PCB.

[0054] S190, perform a second etching on the ninth PCB board, after completing the second etching on the first board surface, remove the dry film on the second board surface, remove the tin layer on the second board surface, and then perform solder mask, characterization, surface treatment and molding to obtain a finished yin and yang copper thick PCB board.

[0055] After the ninth PCB is obtained, the ninth PCB is etched a second time. The second etching can supplementally etch the copper layer on the first board surface, ensuring that the remaining copper layer on the first board surface is completely etched and the copper layer thickness of the circuit pattern on the first board surface is guaranteed. Thus, the production of the circuit pattern on the first board surface that meets the thickness requirement is completed.

[0056] After the circuit pattern on the first board surface is completed, the dry film on the second board surface can be removed first, and then the tin layer on the second board surface can be removed to achieve the production of the circuit pattern on the second board surface that meets the thickness requirement.

[0057] After the copper layers of the first and second board surfaces are completed, solder mask, characterization, surface treatment and molding can be performed to obtain the finished Yin-Yang copper thick PCB board.

[0058] The beneficial effect brought about by the above implementation method is that the thickness of the copper layer of the PCB board is increased by multiple full-board electroplating, multiple pattern electroplating, and multiple outer layer patterns. In conjunction with the dry film and tin plating on the PCB board, the production effect of the circuit pattern of the PCB board can be guaranteed by the second etching, thereby ensuring the production accuracy of the circuit patterns on both sides of the yin and yang copper thick PCB board and improving the production efficiency of the yin and yang copper thick PCB board.

[0059] In some implementations, the first copper thickness is 60-70um, the second copper thickness is 8-12um, and the third copper thickness is 15-20um. The copper thickness can be gradually increased to meet the thickness requirements of the yin and yang copper thickness PCB board.

[0060] In some implementations, the copper thickness of the first surface of the fifth PCB board is greater than or equal to 265 μm, and the copper thickness of the second surface of the fifth PCB board is greater than or equal to 125 μm, which can meet the thickness requirement of the middle copper thickness of the yin and yang copper thickness PCB board.

[0061] In some implementations, the copper thickness of the first surface of the seventh PCB board is greater than or equal to 280 μm, and the copper thickness of the second surface of the fifth PCB board is greater than or equal to 140 μm, which can meet the final copper thickness requirements of the yin-yang copper thickness PCB board.

[0062] The beneficial effect brought by the above implementation is that by controlling the copper layer thickness requirement in the manufacturing process of the yin and yang copper thick PCB board, the manufacturing accuracy of the yin and yang copper thick PCB board can be guaranteed.

[0063] In some implementations, the method further includes: drilling holes on the second PCB board before performing the first full-board electroplating on the second PCB board, and setting the diameter of the drill bit to be pre-enlarged by 0.3-0.35 mm according to the hole diameter tolerance of the copper-plated hole of ±0.076 mm during drilling.

[0064] The beneficial effect brought about by the above implementation method is that the diameter compensation of the drilled hole during drilling can improve the manufacturing accuracy of the via holes in the male and female copper thick PCB board.

[0065] In some implementations, when the first outer layer pattern is produced on the fifth PCB board, the line width and line spacing of the first board surface and the second board surface are dynamically compensated according to the copper thickness difference between the first board surface and the second board surface and the etching solution parameters.

[0066] The beneficial effect brought about by the above implementation method is that the line width and line spacing of the first board surface and the second board surface can be dynamically compensated according to the difference in copper thickness between the first board surface and the second board surface, thereby improving the accuracy of the first outer layer pattern production and ensuring the production accuracy of subsequent circuit patterns.

[0067] In some implementations, the above method further includes S210 to S220, and S201 and S202 are described in detail below.

[0068] S201: When performing a first etching on the first and second surfaces of a seventh PCB simultaneously, the seventh PCB is supported and conveyed from the first surface of the seventh PCB by conveyor rollers, and etching quality of the second surface of the seventh PCB is inspected by a quality inspection component.

[0069] After obtaining the seventh PCB board, when the first etching is performed simultaneously on the first and second surfaces of the seventh PCB board, the seventh PCB board can be supported and conveyed from the first surface of the seventh PCB board by conveyor rollers, so that the conveyor rollers abut against the first surface of the seventh PCB board and the second surface is arranged upward. Then, the etching quality of the second surface of the seventh PCB board can be inspected by the quality inspection component, thereby ensuring the etching quality of the second surface.

[0070] For example, when the etching quality of the second surface of the seventh PCB board is unqualified, the production process of the seventh PCB board with the unqualified second surface can be stopped to ensure the subsequent production quality of the PCB boards.

[0071] S202: When performing a second etching on the ninth PCB board, the ninth PCB board is supported and conveyed from the second board surface of the ninth PCB board by conveyor rollers, and the etching quality of the first board surface of the ninth PCB board is inspected by a quality inspection component.

[0072] During production, when the ninth PCB board is etched for the second time, the ninth PCB board can be supported and conveyed from the second board surface of the ninth PCB board by a conveyor roller, so that the conveyor roller and the second board surface of the ninth PCB board are in contact with each other, and the first board surface is set upward. Then, the etching quality of the first board surface of the ninth PCB board can be inspected by the quality inspection component.

[0073] The beneficial effect brought about by the above implementation method is that, since the second board surface is the PCB board surface on which the circuit pattern processing is completed first, the etching quality of the PCB board can be timely inspected by performing etching quality inspection on the second board surface.

[0074] The beneficial effect brought about by the above implementation is that the seventh PCB board with unqualified etching quality on the second board surface can be promptly rejected, thereby avoiding the subsequent production of PCB boards with unqualified etching quality on the second board surface and avoiding waste.

[0075] The beneficial effect brought about by the above implementation method is that the production quality of the second board surface of the seventh PCB board has been tested during the production process of the seventh PCB board. By subsequently testing the quality of the first board surface of the ninth PCB board, the overall etching quality of the PCB boards can be tested, thereby ensuring the production quality of the PCB boards.

[0076] The beneficial effect brought about by the above implementation method is that the quality inspection sequence of the first board surface and the second board surface is arranged scientifically and reasonably, thereby ensuring the efficiency of the quality inspection of the PCB boards and avoiding waste in the production of PCB boards.

[0077] In some implementations, when the first surface and the second surface of the seventh PCB are simultaneously etched for the first time, the seventh PCB is supported and conveyed from the first surface of the seventh PCB by a conveyor roller, including: when the conveyor roller is supporting and conveying the seventh PCB from the first surface of the seventh PCB, controlling the etching liquid spray density and etching liquid spray volume on the side where the conveyor roller is located to be greater than the etching liquid spray density and etching liquid spray volume on the second surface of the seventh PCB; wherein the etching liquid spray density and etching liquid spray volume on the side where the conveyor roller is located relative to the etching liquid spray density on the second surface of the seventh PCB, and the etching liquid spray volume increase amount are controlled based on a difference in copper thickness between the first surface and the second surface and an area blocked by the conveyor roller.

[0078] For example, the copper thickness difference between the first board surface and the second board surface can be calculated first, and the blocking area of ​​the conveyor roller can be determined. Then, according to the copper thickness difference between the first board surface and the second board surface and the blocking area of ​​the conveyor roller, the etching liquid spray density and the etching liquid spray amount on the side where the conveyor roller is located can be adjusted according to a direct proportional function. Then, the etching liquid spray density and the etching liquid spray amount on the side where the conveyor roller is located can be reasonably controlled relative to the etching liquid spray density and the etching liquid spray amount on the second board surface of the seventh PCB board, thereby improving the etching quality of the PCB board.

[0079] The beneficial effect brought about by the above-mentioned implementation method is that the etching liquid spraying amount on the side where the conveyor roller is located can be compensated, thereby avoiding the etching liquid spraying amount on the side where the conveyor roller is located being affected by the conveyor roller, and compensatory etching can be performed according to the copper thickness, thereby improving the etching quality of the PCB board.

[0080] In some implementations, the method further includes: when removing the tin layer on the second board surface after removing the dry film on the second board surface, supporting and conveying the ninth PCB board from the first board surface of the ninth PCB board by a conveyor roller, and inspecting the quality of the tin layer removal on the second board surface of the ninth PCB board by a quality inspection component.

[0081] The beneficial effect brought about by the above implementation is that the quality of the tin layer removal on the second board surface of the ninth PCB board can be tested, thereby ensuring the production quality of the second board surface of the ninth PCB board.

[0082] In some implementations, the above-mentioned inspection of the etching quality of the second surface of the seventh PCB board by the quality inspection component includes S310 to S320, and S310 to S320 are described in detail below.

[0083] S310: Acquire a seventh PCB image of the seventh PCB from above the seventh PCB, and determine an etching residue after etching the second surface in the seventh PCB image.

[0084] During operation, when the seventh PCB board is supported and conveyed from the first board surface of the seventh PCB board by the conveyor rollers, since the second board surface faces upward, the conveyor rollers will not block the second board surface. At this time, an image of the seventh PCB board can be obtained from above the seventh PCB board. The etching residue amount of the second board surface after etching in the image of the seventh PCB board can be determined based on the seventh PCB board image, thereby achieving accurate detection of the etching residue amount after etching of the second board surface.

[0085] S320: When the etching residue is greater than the preset etching residue, performing a second etching on the ninth PCB, removing the dry film on the second board surface, and then performing additional etching on the second board surface of the ninth PCB.

[0086] During use, when the etching residue is greater than the preset etching residue, when the ninth PCB board is etched for the second time, the dry film on the second board surface can be removed, and then the second board surface of the ninth PCB board can be supplementally etched to ensure the etching quality of the second board surface of the ninth PCB board.

[0087] The beneficial effect brought about by the above implementation method is that it is convenient to detect the etching residue after etching the second board surface on the seventh PCB board image, and the etching residue after etching the second board surface can be accurately detected. After removing the dry film on the second board surface, the second board surface is supplementally etched, thereby ensuring the production quality of the PCB board.

[0088] In some implementations, determining the etching residue amount after etching the second board surface on the seventh PCB board image includes: determining the residual copper layer width around all circuit patterns on the fifth PCB board image, and using the residual copper layer width as the etching residue amount.

[0089] Figure 2 A schematic diagram of a seventh PCB board image provided in an embodiment of the present application is shown as follows: Figure 2As shown, when using, when determining the etching residue amount after etching the second board surface on the seventh PCB board image, the residual copper layer width around all circuit patterns on the seventh PCB board image can be determined, and the residual copper layer width is used as the etching residue amount, thereby achieving accurate detection of the etching residue amount.

[0090] An embodiment of the present application further provides a yin-yang copper thick PCB board, which is manufactured using the above-mentioned yin-yang copper thick PCB board manufacturing method.

[0091] The copper thickness quality of the yin-yang copper thick PCB board meets the copper thickness requirements, and the production quality of the circuit pattern of the PCB board is high.

[0092] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A method for manufacturing a thick yin and yang copper PCB board, characterized in that: The method comprises: Electroplating the first surface of the original PCB to increase the thickness of the first copper layer to obtain a second PCB; wherein both the first surface and the second surface of the original PCB are provided with an original copper layer of the same thickness; Performing a first full-board electroplating on the second PCB board, so that the second copper thickness is increased on the first board surface and the second board surface of the first PCB board, thereby obtaining a third PCB board; Performing a first pattern electroplating on the third PCB board to obtain a fourth PCB board; Performing a second full-board electroplating on the fourth PCB board, so that the third copper thickness is increased on the first board surface and the second board surface of the first PCB board, thereby obtaining a fifth PCB board; A first outer layer pattern is formed on the fifth PCB board, and a second pattern electroplating is performed on the fifth PCB board, and a tin layer is electroplated on the circuit pattern on the second board surface to obtain a sixth PCB board; Performing a second pattern electroplating on the sixth PCB board to obtain a seventh PCB board; performing a first etching on the first and second surfaces of the seventh PCB simultaneously, retaining the tin layer on the circuit pattern on the second surface after completing the first etching on the second surface, thereby obtaining an eighth PCB; A second outer layer pattern is produced on the eighth PCB. For the second outer layer pattern, no dry film is applied to the first surface, but dry film is applied to the second surface. The dry film on the second surface is not exposed, but retained as a protective film. The eighth PCB is then edge-coated with adhesive to obtain a ninth PCB. The ninth PCB board is etched for the second time. After the second etching of the first board surface is completed, the dry film on the second board surface is removed, and the tin layer on the second board surface is removed. Then, solder mask, characterization, surface treatment and molding are performed to obtain the finished Yin-Yang copper thick PCB board. When the first and second surfaces of the seventh PCB are simultaneously etched for the first time, the seventh PCB is supported and conveyed from the first surface of the seventh PCB by conveyor rollers, and the etching quality of the second surface of the seventh PCB is inspected by the quality inspection component. When the ninth PCB is etched for the second time, the ninth PCB is supported and transported from the second surface of the ninth PCB by the conveying rollers, and the etching quality of the first surface of the ninth PCB is inspected by the quality inspection component.

2. The method according to claim 1, wherein The first copper thickness is 60-70um, the second copper thickness is 8-12um, and the third copper thickness is 15-20um; The copper thickness of the first surface of the fifth PCB is greater than or equal to 265 μm, and the copper thickness of the second surface of the fifth PCB is greater than or equal to 125 μm. The copper thickness of the first board surface of the seventh PCB board is greater than or equal to 280 um, and the copper thickness of the second board surface of the fifth PCB board is greater than or equal to 140 um.

3. The method according to claim 2, wherein The method further comprises: Before the first full-board electroplating of the second PCB board, holes are drilled on the second PCB board. When drilling, the diameter of the drill bit is set to be pre-enlarged by 0.3-0.35mm according to the hole diameter tolerance of the copper-plated hole of ±0.076mm.

4. The method according to claim 3, wherein When the first outer layer pattern is produced on the fifth PCB board, the line width and line spacing of the first and second board surfaces are dynamically compensated according to the copper thickness difference between the first and second board surfaces and the etching solution parameters.

5. The method according to claim 4, wherein When the first and second surfaces of the seventh PCB are simultaneously subjected to the first etching, the seventh PCB is supported and conveyed from the first surface of the seventh PCB by conveyor rollers, including: When the conveyor roller supports and conveys the seventh PCB from the first board surface of the seventh PCB, the etching liquid spray density and the etching liquid spray amount on the side where the conveyor roller is located are controlled to be greater than the etching liquid spray density and the etching liquid spray amount on the second board surface of the seventh PCB. The etching liquid spray density and the etching liquid spray amount on the side where the conveyor roller is located are controlled to be increased by an amount relative to the etching liquid spray density and the etching liquid spray amount on the second board surface of the seventh PCB based on a difference in copper thickness between the first board surface and the second board surface and an area blocked by the conveyor roller.

6. The method according to claim 5, wherein The method further comprises: When the dry film on the second board surface is removed and the tin layer on the second board surface is removed, the ninth PCB board is supported and conveyed from the first board surface of the ninth PCB board by the conveyor roller, and the quality of the tin layer removal on the second board surface of the ninth PCB board is inspected by the quality inspection component.

7. The method according to claim 6, wherein The etching quality of the second surface of the seventh PCB is tested using the quality inspection component, including: Acquire a seventh PCB image of the seventh PCB from above the seventh PCB, and determine an etching residue amount after etching the second board surface in the seventh PCB image; When the etching residue is greater than the preset etching residue, when the ninth PCB is etched for the second time, the dry film on the second board surface is removed, and then the second board surface of the ninth PCB is supplementally etched.

8. The method according to claim 7, wherein Determine the etching residue after etching the second board surface on the seventh PCB board image, including: Determine the residual copper layer width around all circuit patterns on the seventh PCB board image, and use the residual copper layer width as the etching residue amount.

9. A thick male and female copper PCB board, characterized in that: The PCB is manufactured using the manufacturing method of any one of claims 1 to 8.

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