A device and method for cleaning particles on silicon wafer surface by ultrasonic vibration

Abstract

The present application provides an ultrasonic vibration cleaning device and a cleaning method for particles on the surface of a silicon wafer, belonging to the technical field of silicon wafer cleaning, comprising a frame, an ultrasonic cleaning tank, a lifting drive member and a carrier; a plurality of slide frames are longitudinally slidably connected to the carrier; the slide frames are arranged in groups of two, and a plurality of differential gears corresponding to each group of slide frames are rotatably connected to the carrier, and the differential gear is located between two slide frames in the same group corresponding to itself, and the bottom of the relative inner sides of the two slide frames in the same group are both provided with driven racks that can mesh with the differential gears; a transmission member is arranged between the ultrasonic cleaning tank and the carrier; the present application can reduce the probability of poor cleaning effect of two adjacent silicon wafers due to a small gap between each other.

Description

Technical Field

[0001] The present application relates to the technical field of silicon wafer cleaning, and in particular to a device and method for ultrasonic vibration cleaning of particles on the surface of a silicon wafer. Background Art

[0002] Silicon wafer, also known as wafer, is a round thin sheet made of silicon material, mainly used in semiconductor manufacturing and the production of electronic devices. As the basic material of the semiconductor industry, silicon wafer is widely used in the manufacture of integrated circuits, optoelectronic devices, sensors, etc.

[0003] In the production and processing of silicon wafers, in order to ensure the quality and performance of subsequent processing steps, the silicon wafers are usually cleaned to remove pollutant particles on the surface of the silicon wafers. Common silicon wafer cleaning methods include deionized water cleaning, chemical cleaning and ultrasonic cleaning. Among them, ultrasonic cleaning uses the cavitation effect of ultrasound to generate a large number of bubbles and impact and peel off the dirt on the surface of the object to achieve the purpose of cleaning.

[0004] Referring to the Chinese patent document with the announcement number CN221282044U and the announcement date July 5, 2024, the name is a wafer ultrasonic cleaning device, which can allow the surface water of the cleaning liquid to continuously enter the filter basket so as to filter and store floating impurities inside the filter basket, thereby preventing the floating impurities from re-attaching to the surface of the wafer during the process of the wafer moving upward out of the cleaning box, thereby ensuring the cleaning effect of the wafer ultrasonic cleaning device.

[0005] Referring to the above technical solution, during the ultrasonic cleaning process of silicon wafers, in order to effectively utilize the internal space of the ultrasonic cleaning tank so that more silicon wafers can be cleaned at the same time, the silicon wafers are usually placed on a carrier in a vertical array, and then the silicon wafers are immersed in the ultrasonic cleaning tank together with the carrier. However, the gap between two adjacent silicon wafers will become increasingly narrow. In this case, the fluidity of the cleaning liquid between two adjacent silicon wafers is easily affected, resulting in poor cleaning effect. Summary of the invention

[0006] In view of this, the present application provides an ultrasonic vibration cleaning device and a cleaning method for particles on the surface of a silicon wafer, which are mainly used to solve the problem of poor cleaning effect caused by a small gap between two adjacent silicon wafers.

[0007] In order to solve the above technical problems, the present application provides an ultrasonic vibration cleaning device and a cleaning method for particles on the surface of a silicon wafer.

[0008] In the first aspect, the present application provides an ultrasonic vibration cleaning device for particles on the surface of a silicon wafer, comprising a frame, an ultrasonic cleaning tank and a lifting drive member arranged on the frame, and a carrier frame arranged at the execution end of the lifting drive member; a plurality of sliding frames for carrying a single silicon wafer are longitudinally slidably connected to the carrier frame, the sliding frames are arranged in a U shape, and the inner walls on three sides of the sliding frames are provided with placement grooves matching the silicon wafer; the sliding frames are arranged in groups of two, and a plurality of differential gears corresponding to each group of sliding frames are rotatably connected to the carrier frame, and the differential gears are located between the two sliding frames in the same group corresponding to themselves, and the bottoms of the relative inner sides of the two sliding frames in the same group are provided with driven racks that can mesh with the differential gears, which are used to make the two sliding frames in the same group slide and displace in opposite directions when the differential gears rotate; a transmission member is arranged between the ultrasonic cleaning tank and the carrier frame, which is used to make all the differential gears rotate synchronously in the process of the lifting drive member driving the carrier frame to rise and fall.

[0009] By adopting the above technical solution, when ultrasonic cleaning is carried out using the slide frame as the supporting component of the silicon wafer, the silicon wafer is moved back and forth up and down in the ultrasonic cleaning tank with the help of the lifting drive component. At the same time, through the step-by-step transmission of the transmission component, the differential gear and the driven rack, multiple silicon wafers can be moved back and forth longitudinally and staggered in the ultrasonic cleaning tank, thereby improving the fluidity of the cleaning liquid.

[0010] Optionally, the transmission member includes a rack plate vertically arranged on the inner wall of the ultrasonic cleaning tank, a transmission rod is rotatably connected inside the carrier, a driven gear capable of meshing with the rack plate is provided on the transmission rod, and each differential gear can be connected to the transmission rod in a bevel gear meshing manner.

[0011] By adopting the above technical solution, when the slide frame moves up and down in the ultrasonic cleaning tank, with the cooperation of the rack plate, the driven gear and the transmission rod, all the differential gears can rotate in a manner of one stage driving multiple stages.

[0012] Optionally, rollers for contacting the silicon wafer are rotatably connected in the placement grooves, and a linkage is provided between the carrier and the slide frame to enable the silicon wafer to rotate when the slide frame is slidably displaced.

[0013] By adopting the above technical solution, the roller and the silicon wafer are in rolling contact, and then the linkage is used to make the silicon wafer rotate while the silicon wafer follows the sliding frame to slide, thereby further improving the comprehensiveness of the silicon wafer cleaning.

[0014] Optionally, the linkage member includes a linkage rack arranged on the upper surface of the carrier frame, and a linkage gear capable of meshing with the linkage rack is arranged on the central axis of the roller located in the placement groove at the bottom end of the slide frame.

[0015] By adopting the above technical solution, with the cooperation of the linkage rack and the linkage gear, the roller located in the placement groove at the bottom of the slide frame can be rotated, and then the friction transmission between the roller and the silicon wafer is used to make the silicon wafer rotate.

[0016] Optionally, the top ends of the two vertical frames of the sliding frame are both hinged with clamping wheels via torsion springs, and the two clamping wheels on each sliding frame are symmetrically arranged.

[0017] By adopting the above technical solution, the two clamping wheels can clamp and position the silicon wafer carried inside the slide frame under the action of the torsion spring to prevent the silicon wafer from slipping out of the slide frame.

[0018] Optionally, the overflow port opened at the top of the ultrasonic cleaning tank is connected to an overflow pipe for discharging the cleaning liquid overflowing from the internal surface of the ultrasonic cleaning tank.

[0019] By adopting the above technical solution, when the cleaning liquid is continuously fed into the ultrasonic cleaning tank, the cleaning liquid containing pollutant particles on the surface inside the ultrasonic cleaning tank will be discharged through the overflow port and the overflow pipe in sequence, preventing the pollutant particles from re-attaching to the surface of the silicon wafer when the silicon wafer is discharged from the water.

[0020] Optionally, a dial plate is hinged on the top of the sliding frame, and the dial plate is located on a side close to the overflow port.

[0021] By adopting the above technical solution, during the longitudinal reciprocating movement of the slide frame, the paddle plate will swing back and forth due to the resistance of the cleaning liquid, thereby disturbing the cleaning liquid in the ultrasonic cleaning tank.

[0022] In a second aspect, the present application provides a method for ultrasonic vibration cleaning of particles on the surface of a silicon wafer, which is applied to the ultrasonic vibration cleaning device for particles on the surface of a silicon wafer described in the first aspect, and the cleaning method comprises:

[0023] S1, firstly, the carrier is lifted to the top of the rack through the cooperation of the lifting drive, and then the personnel put the silicon wafers into each slide frame one by one;

[0024] S2, and then the support frame is lowered again through the cooperation of the lifting drive member and enters the ultrasonic cleaning tank, and the cleaning liquid is pumped into the ultrasonic cleaning tank by the infusion pump arranged inside the frame;

[0025] S3, using an ultrasonic generator disposed inside the frame to generate ultrasonic waves inside the ultrasonic cleaning tank, and using the cavitation effect of the ultrasonic waves in the cleaning liquid to clean the silicon wafer;

[0026] S4, after the cleaning is completed, the lifting drive member lifts the carrier frame to the top of the frame again so that personnel can take the cleaned silicon wafer out of the slide frame.

[0027] By adopting the above technical solution, when the silicon wafer is placed inside the slide frame, the clamping plate and the torsion spring cooperate to clamp the silicon wafer, and then the silicon wafer enters the ultrasonic cleaning tank with the help of the cylinder, and finally the ultrasonic cleaning of the silicon wafer can be carried out with the cooperation of the ultrasonic generator.

[0028] Optionally, in S3, the lifting drive can continuously drive the carrier to vertically displace by alternating ascending and descending actions, so that the carrier can be lifted and lowered reciprocatingly inside the ultrasonic cleaning tank. At the same time, under the step-by-step transmission action of the transmission member, the differential gear and the driven rack, each slide frame can move longitudinally reciprocatingly on the carrier, and the moving directions of two adjacent slide frames are always opposite, thereby causing the silicon wafers inside the two adjacent slide frames to be misaligned.

[0029] By adopting the above technical solution, during the ultrasonic cleaning process of silicon wafers, the flow range of the cleaning liquid can be increased by staggering two adjacent silicon wafers, thereby improving the effect of the ultrasonic cleaning work.

[0030] In summary, compared with the prior art, the present application includes at least one of the following beneficial technical effects:

[0031] 1. The method of dislocating two adjacent silicon wafers increases the flow space of the cleaning liquid in the gap between the silicon wafers, so that the cleaning liquid is evenly distributed in the ultrasonic cleaning tank in a flowing state, reducing the probability of poor cleaning efficiency due to the small gap between the two adjacent silicon wafers; and the two adjacent silicon wafers can also maintain a dislocated state during the disassembly process, which is conducive to the removal of the silicon wafers and reduces the possibility of damage to the silicon wafers due to the small gap between the two adjacent silicon wafers during disassembly.

[0032] 2. During the ultrasonic cleaning process of silicon wafers, the silicon wafers can be rotated by friction transmission to change the circumferential position of the silicon wafers in the slide frame, thereby making the cleaning of the silicon wafers more comprehensive and reducing the probability of cleaning dead corners due to the obstruction of the slide frame during the cleaning process of the silicon wafers.

[0033] 3. Removing pollutant particles floating on the surface of the cleaning liquid by overflow discharge can reduce the possibility of pollutant particles re-attaching to the surface of the silicon wafer when the silicon wafer is discharged from the water. In addition, the pollutant particles on the surface of the cleaning liquid can be moved toward the overflow port by using the cooperation of the paddle, which is conducive to the discharge of pollutant particles on the surface of the cleaning liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a schematic diagram of the structure of a device for ultrasonic vibration cleaning of particles on the surface of a silicon wafer according to the present application;

[0035] Figure 2A cross-sectional view of an ultrasonic cleaning tank for this application;

[0036] Figure 3 This is a schematic diagram of the structure of the carrier frame of this application;

[0037] Figure 4 This is a schematic diagram of the structure of the carrier frame and the sliding frame of this application;

[0038] Figure 5 A cross-sectional view of the slide frame of this application;

[0039] Figure 6 This is a schematic diagram of the structure of the transmission rod and differential gear of this application;

[0040] Figure 7 A cross-sectional view of the frame for this application.

[0041] Explanation of the reference numerals in the accompanying drawings: 1. Frame; 11. Ultrasonic cleaning tank; 12. Lifting drive member; 13. Carrying frame; 14. Ultrasonic generator; 15. Infusion pump; 16. Drain pipe; 17. Solenoid valve; 2. Slide frame; 21. Placement slot; 22. Clamping wheel; 23. Torsion spring; 3. Differential gear; 4. Driven rack; 5. Transmission member; 51. Rack plate; 52. Transmission rod; 53. Driven gear; 6. Roller; 7. Linkage member; 71. Linkage rack; 72. Linkage gear; 8. Overflow port; 81. Overflow pipe; 9. Dial plate. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the following will be combined with the embodiments of the present application. Figure 1-Figure 7 , the technical scheme of the embodiment of the present application is clearly and completely described. Obviously, the described embodiment is a part of the embodiment of the present application, not all of the embodiments. Based on the described embodiment of the present application, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of this application.

[0043] In a first aspect, the present application provides an ultrasonic vibration cleaning device for particles on the surface of a silicon wafer, which adopts the following technical solution:

[0044] Reference Figure 1 and Figure 2The present embodiment provides an ultrasonic vibration cleaning device for particles on the surface of a silicon wafer, comprising a frame 1, an ultrasonic cleaning tank 11, a lifting drive 12, a bearing mechanism and a transmission mechanism. The ultrasonic cleaning tank 11 and the lifting drive 12 are both arranged on the frame 1, and the bearing mechanism is arranged at the execution end of the lifting drive 12 and is used to carry the silicon wafer. The lifting drive 12 can use a cylinder, and the extension and contraction actions of the cylinder are used to drive the bearing mechanism to move vertically inside the ultrasonic cleaning tank 11. The transmission mechanism is arranged between the ultrasonic cleaning tank 11 and the bearing mechanism, and is used to displace the silicon wafers carried by the bearing mechanism in pairs.

[0045] Reference Figure 2 , Figure 3 , Figure 4 and Figure 5 The bearing mechanism includes a bearing frame 13, a slide frame 2 and a placement groove 21. The bearing frame 13 is fixedly connected to the execution end of the lifting drive member 12, and the slide frames 2 are arranged on the bearing frame 13 in a group of two, and the slide frames 2 can slide longitudinally on the bearing frame 13. The slide frames 2 carry silicon wafers in a one-to-one manner, and the inner walls of the three sides of each slide frame 2 are provided with placement grooves 21 matching the silicon wafers.

[0046] Reference Figure 2 , Figure 4 and Figure 6 , the transmission mechanism includes a differential gear 3, a driven rack 4, a rack plate 51, a transmission rod 52 and a driven gear 53. Multiple differential gears 3 are provided and correspond to multiple groups of slide frames 2 one by one. Each differential gear 3 is rotatably connected to the carrier 13. The driven rack 4 is arranged at the bottom of the opposite inner side surfaces of each group of two slide frames 2, that is, each differential gear 3 is located between two corresponding slide frames 2 and two driven racks 4 in the same group. The two driven racks 4 in the same group of slide frames 2 are meshed with one differential gear 3 between each other at the same time, and each two driven racks 4 are arranged 180° rotationally symmetrically based on the differential gear 3 they are meshed with. When the differential gear 3 rotates, the two driven racks 4 adjacent to and meshed with it will drive the slide frame 2 where they are located to move longitudinally, and due to the difference in the meshing point, the displacement directions of the two adjacent slide frames 2 are always opposite.

[0047] Reference Figure 2 , Figure 3 and Figure 6 The rack plate 51 is vertically arranged inside the ultrasonic cleaning tank 11, the transmission rod 52 is rotatably connected inside the carrier 13, the driven gear 53 is arranged on the transmission rod 52 and can be engaged with the rack plate 51, and the driven bevel gears arranged on the central axis of the differential gear 3 can be engaged with the corresponding active bevel gears arranged on the transmission rod 52, thereby realizing the change of rotation direction.

[0048] Reference Figure 1 , Figure 2 and Figure 7 An ultrasonic generator 14 and an infusion pump 15 are arranged inside the frame 1. The ultrasonic generator 14 is used to generate ultrasonic waves inside the ultrasonic cleaning tank 11. The infusion pump 15 is connected to the ultrasonic cleaning tank 11. When the ultrasonic cleaning work is carried out, the infusion pump 15 can pump the cleaning liquid into the ultrasonic cleaning tank 11. The bottom of the ultrasonic cleaning tank 11 is connected to a drain pipe 16, and the drain pipe 16 is connected in series with a solenoid valve 17. After the cleaning is completed and the solenoid valve 17 is opened, the cleaning liquid inside the ultrasonic cleaning tank 11 can be discharged through the drain pipe 16.

[0049] When the ultrasonic cleaning of silicon wafers is carried out, the lifting drive 12 drives the carrier 13 to be lifted above the frame 1, and then the personnel put the silicon wafers into each slide frame 2 one by one, and the placement grooves 21 are used to fit and limit the silicon wafers.

[0050] Then, the lifting drive 12 drives the carrier 13 to descend into the ultrasonic cleaning tank 11. At the same time, the infusion pump 15 operates to pump the cleaning liquid into the ultrasonic cleaning tank 11. Then, the ultrasonic generator 14 operates and generates ultrasonic waves inside the ultrasonic cleaning tank 11, and the cavitation effect of the ultrasonic waves in the cleaning liquid is used to clean the silicon wafer.

[0051] During the ultrasonic cleaning process of the silicon wafer, the cylinder used by the lifting drive 12 can continuously operate by alternating extension and contraction movements, so that the carrier 13, the slide frame 2 and the silicon wafer can be reciprocated and lifted inside the ultrasonic cleaning tank 11, thereby continuously changing the vertical position of the silicon wafer.

[0052] At the same time, due to the meshing connection between the rack plate 51 and the driven gear 53, the transmission rod 52 will alternately reverse in the reciprocating lifting and lowering process of the carrier 13. Due to the transmission relationship between the transmission rod 52 and the differential gear 3 and the meshing relationship between the differential gear 3 and the driven rack 4, each slide frame 2 can drive the silicon wafers inside it to move longitudinally reciprocatingly on the carrier 13. Since the moving directions of the two adjacent slide frames 2 are always opposite, the silicon wafers inside the two adjacent slide frames 2 will be alternately misaligned, increasing the flow space of the cleaning liquid and promoting the uniform distribution of the cleaning liquid, thereby reducing the probability that the two adjacent silicon wafers are difficult to be effectively cleaned due to the small gap between them.

[0053] In addition, during the disassembly and assembly process of the silicon wafer, the two adjacent slide frames 2 are also in a dislocated state, which is conducive to the removal of the silicon wafer and reduces the possibility of silicon wafer wear caused by the small gap between the two adjacent silicon wafers during disassembly and assembly.

[0054] Reference Figure 4 and Figure 5, the placement grooves 21 are rotatably connected with rollers 6 for contacting the silicon wafer, and a linkage member 7 is provided between the carrier 13 and the slide frame 2 for causing the silicon wafer to rotate when the slide frame 2 is slidingly displaced. The linkage member 7 includes a linkage rack 71 and a linkage gear 72, and a plurality of linkage racks 71 are provided and are located on the upper surface of the carrier 13, and the linkage gear 72 is respectively provided on the central axis of each roller 6 located in the placement groove 21 at the bottom end of the slide frame 2, and each linkage rack 71 is meshed with a vertically corresponding linkage gear 72.

[0055] During the longitudinal reciprocating movement of the slide frame 2, the roller 6 located inside the placement groove 21 at the bottom end of the slide frame 2 will also rotate due to the meshing connection relationship between the linkage gear 72 and the linkage rack 71. At this time, the silicon wafer will rotate inside the slide frame 2 under the friction transmission of the roller 6, causing the circumferential position of the silicon wafer inside the slide frame 2 to change, further improving the comprehensiveness of the cleaning work.

[0056] Reference Figure 5 Each slide frame 2 is provided with a clamping mechanism, which includes a torsion spring 23 and two clamping wheels 22. The two clamping wheels 22 are symmetrically arranged and hinged to the top of the two vertical frames of the slide frame 2 through the torsion spring 23.

[0057] When loading the silicon wafer into the slide frame 2, the silicon wafer first abuts against the two clamping wheels 22. As the personnel manually applies pressure, the two clamping wheels 22 will flip outward based on their own hinge points to allow the silicon wafer to enter the slide frame 2. Subsequently, the two clamping wheels 22 are reset under the action of the torsion springs 23 to fix the silicon wafer inside the slide frame 2.

[0058] Reference Figure 2 and Figure 7 The overflow port 8 opened at the top of the ultrasonic cleaning tank 11 is connected to an overflow pipe 81 for discharging the cleaning liquid overflowing from the surface of the ultrasonic cleaning tank 11 .

[0059] During the ultrasonic cleaning process of the silicon wafer, since the light contaminant particles that have been removed from the silicon wafer will float on the surface of the cleaning liquid, the cleaning liquid is continuously pumped into the ultrasonic cleaning tank 11 through the infusion pump 15, so that the cleaning liquid containing the contaminant particles on the surface of the ultrasonic cleaning tank 11 is discharged through the overflow port 8 and the overflow pipe 81 in sequence, so as to prevent the contaminant particles from re-attaching to the surface of the silicon wafer when the silicon wafer is discharged from the water.

[0060] Reference Figure 2 and Figure 4 A dial plate 9 is hinged on the top of the sliding frame 2, and the dial plate 9 is located on a side close to the overflow port 8.

[0061] During the longitudinal reciprocating movement of the slide frame 2, the paddle plate 9 will always swing in the direction opposite to the moving direction of the slide frame 2 due to the resistance of the cleaning liquid. Therefore, as the slide frame 2 continues to reciprocate, the paddle plate 9 will also swing back and forth, thereby disturbing the cleaning liquid in the ultrasonic cleaning tank 11; in addition, since the paddle plate 9 is located on the side close to the overflow port 8, when the swinging angle of the paddle plate 9 is limited to a maximum of forty-five degrees in both directions, the swinging of the paddle plate 9 can also push the pollutant particles on the surface of the cleaning liquid toward the direction close to the overflow port 8, which is beneficial to the discharge of the pollutant particles on the surface of the cleaning liquid.

[0062] The implementation principle of the ultrasonic vibration cleaning device for silicon wafer surface particles in the embodiment of the present application is as follows:

[0063] When the ultrasonic cleaning of silicon wafers is carried out, the lifting drive 12 drives the carrier 13 to be lifted above the frame 1, and then the personnel put the silicon wafers into each slide frame 2 one by one, and the placement grooves 21 are used to fit and limit the silicon wafers.

[0064] Then, the lifting drive 12 drives the carrier 13 to descend into the ultrasonic cleaning tank 11. At the same time, the infusion pump 15 operates to pump the cleaning liquid into the ultrasonic cleaning tank 11. Then, the ultrasonic generator 14 operates and generates ultrasonic waves inside the ultrasonic cleaning tank 11, and the cavitation effect of the ultrasonic waves in the cleaning liquid is used to clean the silicon wafer.

[0065] During the ultrasonic cleaning process of the silicon wafer, the cylinder used by the lifting drive 12 can continuously operate by alternating extension and contraction movements, so that the carrier 13, the slide frame 2 and the silicon wafer can be reciprocated and lifted inside the ultrasonic cleaning tank 11, thereby continuously changing the vertical position of the silicon wafer.

[0066] At the same time, due to the meshing connection between the rack plate 51 and the driven gear 53, the transmission rod 52 will alternately rotate forward and reverse during the reciprocating lifting and lowering process of the carrier 13. Due to the transmission relationship between the transmission rod 52 and the differential gear 3 and the meshing relationship between the differential gear 3 and the driven rack 4, each slide frame 2 can drive the silicon wafers inside it to move longitudinally reciprocatingly on the carrier 13. Since the moving directions of the two adjacent slide frames 2 are always opposite, the silicon wafers inside the two adjacent slide frames 2 will be alternately staggered, thereby increasing the flow space of the cleaning liquid.

[0067] In a second aspect, the present application provides a method for ultrasonic vibration cleaning of particles on a silicon wafer surface, which is applied to an ultrasonic vibration cleaning device for particles on a silicon wafer surface in the first aspect, and the cleaning method comprises:

[0068] S1, firstly, the carrier 13 is lifted to the top of the rack 1 by the cooperation of the lifting drive 12, and then the personnel put the silicon wafers into each slide frame 2 one by one;

[0069] S2, and then the support frame 13 is lowered again through the cooperation of the lifting drive member 12 and enters the ultrasonic cleaning tank 11, and at the same time, the cleaning liquid is pumped into the ultrasonic cleaning tank 11 by the infusion pump 15 arranged inside the frame 1;

[0070] S3, using the ultrasonic generator 14 provided inside the frame 1 to generate ultrasonic waves inside the ultrasonic cleaning tank 11, and using the cavitation effect of the ultrasonic waves in the cleaning liquid to clean the silicon wafer;

[0071] S4, after the cleaning is completed, the lifting drive 12 lifts the carrier 13 again to above the frame 1, so that personnel can take the cleaned silicon wafer out from the inside of the slide frame 2.

[0072] In S3, the lifting drive 12 can continuously drive the carrier 13 to perform vertical displacement by alternating ascending and descending actions, so that the carrier 13 can be lifted and lowered reciprocatingly inside the ultrasonic cleaning tank 11. At the same time, under the step-by-step transmission action of the transmission member 5, the differential gear 3 and the driven rack 4, each slide frame 2 can perform longitudinal reciprocating movement on the carrier 13, and the movement directions of two adjacent slide frames 2 are always opposite, so that the silicon wafers inside the two adjacent slide frames 2 are misaligned, reducing the probability of poor cleaning effect of two adjacent silicon wafers due to the small gap between each other.

[0073] In addition, it should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0074] The above is a preferred embodiment of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles described in the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. An ultrasonic vibration cleaning device for particles on the surface of a silicon wafer, comprising a frame, an ultrasonic cleaning tank and a lifting drive member arranged on the frame, and a carrier frame arranged at the execution end of the lifting drive member, characterized in that: The carrier frame is longitudinally slidably connected with a plurality of slide frames for carrying a single silicon wafer, the slide frames are arranged in a U shape, and the inner walls of the three sides of the slide frames are provided with placement grooves matching the silicon wafer; The slide frames are arranged in groups of two, and a plurality of differential gears corresponding to each group of slide frames are rotatably connected on the carrier frame, and the differential gear is located between the two slide frames in the same group corresponding to itself, and the bottoms of the opposite inner sides of the two slide frames in the same group are provided with driven racks that can mesh with the differential gears, so as to make the two slide frames in the same group slide and displace in opposite directions when the differential gears rotate; A transmission member is provided between the ultrasonic cleaning tank and the carrier frame, and is used to make all differential gears rotate synchronously when the lifting drive member drives the carrier frame to lift. The transmission parts include differential gears, driven racks, rack plates, transmission rods and driven gears. There are multiple differential gears corresponding to multiple groups of sliding frames one by one. Each differential gear is rotatably connected to the carrier frame. The driven rack is arranged at the bottom of the opposite inner side surfaces of each group of two sliding frames, that is, each differential gear is located between two corresponding sliding frames in the same group and two driven racks. The two driven racks in the same group of sliding frames are meshed with a differential gear between each other at the same time, and each two driven racks are arranged in 180° rotational symmetry based on the differential gear they are meshed with.

2. The device for ultrasonically vibrating and cleaning particles on the surface of a silicon wafer according to claim 1, characterized in that: The transmission member includes a rack plate vertically arranged on the inner wall of the ultrasonic cleaning tank, a transmission rod is rotatably connected inside the carrier, a driven gear that can mesh with the rack plate is arranged on the transmission rod, and each differential gear can be connected to the transmission rod in a bevel gear meshing manner.

3. The device for ultrasonic vibration cleaning of silicon wafer surface particles according to claim 1, characterized in that: The placing grooves are all rotatably connected with rollers for contacting the silicon wafers, and a linkage member is arranged between the carrier and the sliding frame for causing the silicon wafers to rotate when the sliding frame is slidingly displaced.

4. The device for ultrasonically vibrating and cleaning particles on the surface of a silicon wafer according to claim 3, characterized in that: The linkage member comprises a linkage rack arranged on the upper surface of the carrier frame, and a linkage gear capable of meshing with the linkage rack is arranged on the central axis of the roller located in the placement groove at the bottom end of the slide frame.

5. The device for ultrasonic vibration cleaning of silicon wafer surface particles according to claim 1, characterized in that: The top ends of the two vertical frames of the sliding frame are both hinged with clamping wheels through torsion springs, and the two clamping wheels on each sliding frame are symmetrically arranged.

6. The device for ultrasonic vibration cleaning of silicon wafer surface particles according to claim 1, characterized in that: The overflow port opened at the top of the ultrasonic cleaning tank is connected to an overflow pipe for discharging the cleaning liquid overflowing from the surface of the inner layer of the ultrasonic cleaning tank.

7. The device for ultrasonic vibration cleaning of silicon wafer surface particles according to claim 1, characterized in that: The top of the sliding frame is hinged with a dial plate, and the dial plate is located on a side close to the overflow port.

8. A method for cleaning particles on the surface of a silicon wafer by ultrasonic vibration, applied to the device for cleaning particles on the surface of a silicon wafer by ultrasonic vibration according to claim 1, the cleaning method comprising: S1, firstly, the carrier is lifted to the top of the rack through the cooperation of the lifting drive, and then the personnel put the silicon wafers into each slide frame one by one; S2, and then the support frame is lowered again through the cooperation of the lifting drive member and enters the ultrasonic cleaning tank, and the cleaning liquid is pumped into the ultrasonic cleaning tank by the infusion pump arranged inside the frame; S3, using an ultrasonic generator disposed inside the frame to generate ultrasonic waves inside the ultrasonic cleaning tank, and using the cavitation effect of the ultrasonic waves in the cleaning liquid to clean the silicon wafer; S4, after the cleaning is completed, the lifting drive member lifts the carrier frame to the top of the frame again so that personnel can take the cleaned silicon wafer out of the slide frame.

9. A method for cleaning particles on the surface of a silicon wafer by ultrasonic vibration according to claim 8, characterized in that: In S3, the lifting drive can continuously drive the carrier to vertically displace by alternating ascending and descending actions, so that the carrier can be lifted and lowered reciprocatingly inside the ultrasonic cleaning tank. At the same time, under the step-by-step transmission action of the transmission member, the differential gear and the driven rack, each slide frame can be longitudinally reciprocated on the carrier, and the movement directions of two adjacent slide frames are always opposite, so that the silicon wafers inside the two adjacent slide frames are misaligned, reducing the probability of poor cleaning effect due to the small gap between the two adjacent silicon wafers.

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