Chip module assembly mechanism

Abstract

The present invention provides a chip module assembly mechanism, in which a retaining ring assembly device and a cover plate pre-pressing device are integrated on a scheduling device, and a lifting drive assembly drives the mounting plate to move in a vertical direction to realize the assembly of the retaining ring and the pre-pressing of the cover plate; the integrated design improves the degree of automation of the assembly, making the chip module assembly mechanism more compact, the equipment small in size, and easy to put into use. The retaining ring assembly device adopts a combination design of a suction head and a protrusion, and the suction head adsorbs the retaining ring through the suction hole. By introducing a special motion trajectory of the first driving member and the protrusion, the automatic release of the retaining ring is realized. When the suction head inserts the retaining ring into the slot and moves upward, the downward force of the protrusion on the retaining ring causes the suction head to break away from the retaining ring. This design avoids the retaining ring being lifted up when the suction head moves upward, and ensures the stability of the chip module assembly mechanism in releasing the retaining ring.

Description

Technical Field

[0001] The present invention relates to the field of chip assembly equipment, and in particular to a chip module assembly mechanism. Background Art

[0002] In the electronics manufacturing industry, chip module assembly is a complex and highly precise process. Traditional chip module assembly methods often rely on manual labor, which is not only inefficient but also prone to assembly errors or damage due to human error. This difficulty and error rate increase significantly when precise alignment of tiny components such as retaining rings and pins is involved.

[0003] Although existing automated assembly equipment has improved assembly efficiency to a certain extent, it often has problems such as inaccurate release when handling small and easily detached components such as retaining rings. For example, when the suction head is raised after the retaining ring is lowered, it can lift up the retaining ring, resulting in chip module assembly failure or reduced product quality.

[0004] Therefore, it is necessary to provide a chip module assembly mechanism to solve the above technical problems. Summary of the Invention

[0005] The present invention provides a chip module assembly mechanism to solve the problem in the prior art of chip module assembly technology that when processing small and easily detached components such as retaining rings, there are often problems such as inaccurate release, which leads to assembly failure.

[0006] To solve the above technical problems, the technical solution of the present invention is as follows: a chip module assembly mechanism, wherein the chip module includes a base plate, a cover plate, and a retaining ring, wherein the base plate is provided with a retaining slot and pins, the base plate is provided with a pinhole for connecting the pins, the retaining ring is provided between the base plate and the cover plate, and the retaining ring is plugged into the retaining slot;

[0007] The chip module assembly mechanism includes:

[0008] A snap ring assembly device, used for adsorbing the snap ring and installing the snap ring onto the substrate;

[0009] A cover pre-pressing device for gripping the cover; and

[0010] A scheduling device, the scheduling device including a lifting drive assembly and a mounting plate, the lifting drive assembly being connected to the snap ring assembly device and the cover plate pre-pressing device via the mounting plate, the lifting drive assembly driving the mounting plate to move in a vertical direction, thereby causing the snap ring assembly device to assemble the snap ring onto the base plate, and the cover plate pre-pressing device to pre-press the cover plate against the pins on the base plate;

[0011] The snap ring assembly device comprises:

[0012] A suction head, the suction head is connected to the suction device, and a suction hole is provided at the bottom of the suction head, and the suction hole is used to adsorb the clamping ring;

[0013] a protrusion slidably connected to the bottom end of the nozzle, the protrusion being used to prevent the nozzle from lifting the retaining ring; and

[0014] A first driving member is connected to the mounting plate, and the first driving member is connected to the suction head. The first driving member drives the suction head to move relative to the base plate, so that the clamping ring is plugged into the clamping groove.

[0015] In the present invention, the clamping ring assembly device further comprises an elastic member, wherein the elastic member connects the top end of the protrusion and the suction head, and the elastic member elastically presses the protrusion downward.

[0016] In the present invention, the suction head is a hollow cylindrical structure, and the suction head includes:

[0017] A first connecting end is located at the top of the suction head, the top of the first connecting end is connected to the first driving member, and the side of the first connecting end is connected to the suction device;

[0018] An extension end, located in the middle of the suction head, extending vertically downward; and

[0019] A second connecting end is located at the bottom end of the suction head, a partition is provided at the top end of the second connecting end, the air suction hole is located in the side wall of the second connecting end, and the air suction hole is connected to the interior of the first connecting end;

[0020] The protrusion is slidably connected to the inner wall of the second connection end, the elastic member is arranged in the second connection end, the top end of the elastic member is connected to the bottom surface of the partition, and the bottom end of the elastic member is connected to the top end of the protrusion.

[0021] In the present invention, a first sliding block is provided on the outer side of the protrusion, and first slideways are provided on both side walls of the suction head relative to each other, and the first sliding block is slidably connected to the first slideway.

[0022] In the present invention, the cover plate pre-pressing device includes a clamping claw, which is used to grab the cover plate, and the clamping claw includes:

[0023] Two first clamping members are provided, and the two first clamping members are arranged opposite to each other in the front-to-back direction to form a first clamping opening, and the first clamping opening clamps both sides of the cover plate in the front-to-back direction;

[0024] Two second clamping members are provided, and the two second clamping members are arranged opposite to each other in the left and right directions to form a second clamping opening, and the second clamping opening clamps the left and right sides of the cover plate, and the second clamping members are used to clamp and pre-press the cover plate; and

[0025] The second driving member is arranged on the mounting plate, the driving member is connected to the first clamping member and the second clamping member, and the driving member drives the opening and closing of the first clamping opening and the second clamping opening.

[0026] In the present invention, the first clamping member includes:

[0027] a first rod component, a top end of which is connected to the driving component;

[0028] a second rod member connected to one end of the first rod member, wherein the line where the long side of the second rod member lies is perpendicular to the line where the long side of the first rod member lies; and

[0029] The third rod component is vertically arranged, the top end of the third rod component is connected to the second rod component, and a first support block is arranged on the inner side of the third rod component, and the first support block is used to support the cover plate.

[0030] In the present invention, the second clamping member includes:

[0031] a fourth rod component, a top end of which is connected to the driving component;

[0032] a fifth rod component, arranged vertically, wherein the top end of the fifth rod component is connected to the fourth rod component, and a second support block is provided on the inner side of the fifth rod component, and the second support block is used to support the cover plate; and

[0033] A pressing block is connected to the fourth rod component, the pressing block is located above the cover plate, and the pressing block is used to pre-press the cover plate.

[0034] In the present invention, the chip module assembly mechanism further includes a detection device, which is arranged on one side of the cover plate pre-pressing device, and includes:

[0035] A lens connecting seat is located on one side of the cover plate pre-pressing device;

[0036] a detection lens connected to the lens connection seat, the detection lens being used to photograph and identify the position of the cover plate; and

[0037] A light source assembly is connected to the lens connection seat, and the light source assembly is used to provide lighting.

[0038] In the present invention, the cover plate pre-pressing device further comprises a rotating driving member, which is arranged on the mounting plate and connected to the driving member. The rotating driving member drives the clamping jaw to rotate, thereby driving the cover plate to rotate.

[0039] In the present invention, the scheduling device further includes:

[0040] a first horizontal drive assembly connected to the lifting drive assembly, the first horizontal drive assembly driving the fixing seat to move along the X-axis direction, wherein the X-axis direction is perpendicular to the straight line in which the lifting drive assembly drives the mounting plate to move; and

[0041] The second horizontal drive component is connected to the first horizontal drive component, and the second horizontal drive component drives the second horizontal drive component to move along the Y-axis direction. The straight line where the long side of the second horizontal drive component is located is perpendicular to the straight line where the long side of the first horizontal drive component is located.

[0042] Compared with the prior art, the present invention has the following beneficial effects: the chip module assembly mechanism of the present invention is integrated on the scheduling device through the retaining ring assembly device and the cover plate pre-pressing device, and the mounting plate is driven to move in the vertical direction by the lifting drive assembly to realize the assembly of the retaining ring and the pre-pressing of the cover plate; the integrated design not only improves the degree of automation of the assembly, but also ensures the coordination and accuracy between the various steps, making the chip module assembly mechanism more compact, the equipment volume is small, and it is easy to put into use. The retaining ring assembly device adopts a combination design of a suction head and a protrusion. The suction head absorbs the retaining ring through the suction hole, and the automatic release of the retaining ring is realized by introducing the special movement trajectory of the first driving member and the protrusion. When the suction head inserts the retaining ring into the slot and moves upward, the downward force of the protrusion on the retaining ring causes the suction head to break away from the retaining ring. This design avoids the retaining ring being lifted up when the suction head moves up, and ensures the stability of the chip module assembly mechanism in releasing the retaining ring. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. The drawings described below are only drawings corresponding to some embodiments of the present invention.

[0044] Figure 1 This is a schematic diagram of the overall structure of the chip module assembly mechanism according to a preferred embodiment of the present invention.

[0045] Figure 2 It is a schematic diagram of the overall structure of the clamping ring assembly device according to a preferred embodiment of the present invention.

[0046] Figure 3 The cross section of the tip of the preferred embodiment of the present invention is Figure 1 .

[0047] Figure 4 Schematic diagram of the overall structure of the suction head according to a preferred embodiment of the present invention.

[0048] Figure 5 The cross section of the tip of the preferred embodiment of the present invention is Figure 2 .

[0049] Figure 6Schematic diagram of the structure of the cover plate pre-pressing device according to a preferred embodiment of the present invention.

[0050] Figure 7 This is a front view of the clamping claw connection structure of a preferred embodiment of the present invention.

[0051] Figure 8 The clamping claw of the preferred embodiment of the present invention is three-dimensional Figure 1 .

[0052] Figure 9 The clamping claw of the preferred embodiment of the present invention is three-dimensional Figure 2 .

[0053] Figure 10 for Figure 7 Schematic cross-section of .

[0054] Figure 11 It is a side view of the clamping jaw connection structure of the present invention.

[0055] Figure 12 for Figure 11 Schematic cross-section of .

[0056] Figure 13 This is a bottom view of the cover plate pre-pressing device of the present invention.

[0057] 1. Chip module; 11. Cover plate; 12. Base plate; 121. Pins; 13. Snap ring;

[0058] 2. Cover plate pre-pressing device; 21. Rotating drive member; 22. Clamping claw; 222. First clamping member; 2221. First rod member; 2222. Second rod member; 2223. Third rod member; 2224. First support block; 223. Second clamping member; 2231. Fourth rod member; 2232. Fifth rod member; 2233. Second support block; 2234. Pressing block; 224. Second driving member; 225. Connecting plate; 226. Third sensor; 23. First sensor; 24. Second sensor;

[0059] 3. Dispatching device; 31. Lifting drive assembly; 32. Mounting plate; 33. First horizontal drive assembly; 34. Second horizontal drive assembly; 35. Fixed seat;

[0060] 4. Snap ring assembly device; 41. Suction head; 411. First connecting end; 412. Extending end; 413. Second connecting end; 4131. Partition plate; 4132. First slideway; 4133. Air intake hole; 42. Protrusion; 421. First receiving groove; 43. First driving member; 44. Elastic member; 45. First slider; 46. Protective cover; 47. Connector;

[0061] 5. Detection device; 51. Lens connector; 52. Detection lens; 53. Light source assembly. DETAILED DESCRIPTION

[0062] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of the present invention.

[0063] In the figures, structurally similar elements are denoted by the same reference numerals.

[0064] The terms "first" and "second" in the present invention are used for descriptive purposes only and should not be understood as indicating or implying relative importance, and should not be used as a limitation on the order of precedence.

[0065] Please refer to Figure 1 、 Figure 2 and Figure 3 ,in Figure 1 FIG. 1 is a schematic diagram of the overall structure of a chip module assembly mechanism according to a preferred embodiment of the present invention. Figure 2 This is a schematic diagram of the overall structure of a snap ring assembly device according to a preferred embodiment of the present invention. Figure 3 The cross section of the tip of the preferred embodiment of the present invention is Figure 1 .

[0066] The following is a preferred embodiment of a chip module assembly mechanism provided by the present invention that can solve the above technical problems.

[0067] The preferred embodiment of the chip module assembly mechanism provided by the present invention is: a chip module assembly mechanism, wherein the chip module 1 includes a substrate 12, a cover plate 11 and a snap ring 13, the substrate 12 is provided with a slot and a pin 121, the substrate 12 is provided with a pinhole for connecting the pin 121, the snap ring 13 is arranged between the substrate 12 and the cover plate 11, and the snap ring 13 is plugged into the slot; the chip module assembly mechanism includes a snap ring assembly device 4, a cover plate pre-pressing device 2 and a scheduling device 3; the snap ring assembly device 4 is used to Adsorb the snap ring 13 and install the snap ring 13 on the substrate 12; the cover pre-pressing device 2 is used to grab the cover 11; the scheduling device 3 includes a lifting drive component 31 and a mounting plate 32, the lifting drive component 31 is connected to the snap ring assembly device 4 and the cover pre-pressing device 2 through the mounting plate 32, the lifting drive component 31 drives the mounting plate 32 to move in the vertical direction, so that the snap ring assembly device 4 assembles the snap ring 13 to the substrate 12, and the cover pre-pressing device 2 pre-presses the cover 11 and the pins 121 on the substrate 12.

[0068] In this embodiment, the snap ring assembly device 4 includes a suction head 41, a protrusion 42 and a first driving member 43; the top of the suction head 41 is connected to the suction device, and the bottom of the suction head 41 is provided with a suction hole 4133, and the suction hole 4133 is used to adsorb the snap ring 13; the protrusion 42 is connected to the bottom of the suction head 41 for sliding up and down, and the protrusion 42 is used to prevent the suction head 41 from lifting the snap ring 13; the first driving member 43 is connected to the mounting plate 32, and the first driving member 43 is connected to the suction head 41, and the first driving member 43 drives the suction head 41 to move relative to the base plate 12, so that the snap ring 13 is plugged into the card slot.

[0069] When installing the retaining ring 13, the suction head 41 attracts the retaining ring 13 and inserts the retaining ring 13 into the retaining groove on the base plate 12. The suction head 41 releases its suction force, and the first driving member 43 drives the suction head 41 upward. The protrusion 42 remains in contact with the retaining ring 13 due to gravity and the elastic member. The protrusion 42 remains stationary, pressing the retaining ring 13 into the retaining groove. During the upward movement of the suction head 41, the protrusion 42 separates from the retaining ring 13, thereby preventing the suction head 41 from lifting the retaining ring 13. When the protrusion 42 reaches the bottom of the suction head 41, the suction head 41 lifts the protrusion 42 again.

[0070] The movement trajectory of the suction head 41 includes an activated state and a released state. When the suction head is in the activated state, the suction head 41 adsorbs and fixes the snap ring 13; when the suction head is in the released state, the snap ring 13 is correctly inserted into the slot, and the suction head 41 releases its suction force and no longer adsorbs the snap ring 13; the suction head 41 starts to move upward under the drive of the first driving member, and the protrusion 42 maintains contact with the snap ring 13 under the action of gravity and does not move up with the suction head; the protrusion 42 presses the snap ring 13 in the slot to prevent it from being lifted up by the rising suction head 41.

[0071] The chip module assembly mechanism integrates the retaining ring assembly device 4, the cover plate pre-pressing device 2, and the scheduling device 3, achieving a fully automated process from the attachment and installation of the retaining ring 13 to the pre-pressing of the cover plate 11. This automated design significantly improves production efficiency and reduces manual operation errors and costs. The scheduling device 3, through the design of the lifting drive assembly 31 and the mounting plate 32, enables the retaining ring assembly device 4 and the cover plate pre-pressing device 2 to move vertically as needed, thereby adapting to the assembly requirements of the chip module 1.

[0072] The design of the suction head 41 and bump 42 in the snap ring assembly device 4, in conjunction with the first drive member 43, ensures that the snap ring 13 is accurately inserted into the retaining groove on the substrate 12. This high-precision assembly method helps improve the overall quality and reliability of the chip module 1. The bump 42 falls under the action of gravity, separating the snap ring 13 from the suction head 41 and ensuring that the snap ring 13 is released onto the substrate 12.

[0073] The snap ring assembly device 4 in this embodiment is described in detail as follows:

[0074] Combine Figure 3 The snap ring assembly device 4 in this embodiment also includes an elastic member 44, which connects the top of the protrusion 42 and the suction head 41. The elastic member 44 elastically squeezes the protrusion 42 downward. By introducing the elastic member 44 to connect the top of the protrusion 42 and the suction head 41. When the suction head 41 inserts the snap ring 13 into the slot and moves upward, the elastic member 44 elastically squeezes the protrusion 42 downward, increasing the downward force of the protrusion 42 on the snap ring, causing the suction head to break away from the contact with the snap ring 13. This design avoids the snap ring being lifted up when the suction head 41 moves upward, thereby improving the accuracy and efficiency of assembly. The use of the elastic member 44 makes the downward force of the protrusion 42 on the snap ring greater, which is conducive to the separation of the snap ring from the suction head.

[0075] Combine Figure 4 and Figure 5 The suction head 41 in this embodiment is a hollow cylindrical structure, and includes a first connecting end 411, an extension end 412, and a second connecting end 413; the first connecting end 411 is located at the top of the suction head 41, and the top of the first connecting end 411 is connected to the first driving member 43, and the side of the first connecting end 411 is connected to the suction device through the connector 47; the extension end 412 is located in the middle of the suction head 41, and the extension end 412 extends vertically downward. The vertical downward extension design of the extension end 412 increases the overall length of the suction head 41, which is conducive to better adapting to substrates 12 of different heights; The second connection end 413 is located at the bottom end of the suction head 41, and a partition 4131 is provided at the top end inside the second connection end 413. The suction hole 4133 is located in the side wall of the second connection end 413, and the suction hole 4133 is connected to the inside of the first connection end 411; the suction head 41 adopts a hollow cylindrical structure and is divided into a first connection end 411, an extension end 412 and a second connection end 413. This design optimizes the airflow channel, so that the suction force generated by the suction equipment can be more effectively transmitted to the suction hole 4133 at the bottom end of the suction head 41, thereby improving the stability and efficiency of the adsorption clamp 13.

[0076] Among them, the protrusion 42 is slidingly connected to the inner wall of the second connecting end 413, the elastic member 44 is arranged in the second connecting end 413, the top of the elastic member 44 is connected to the bottom surface of the partition 4131, and the bottom end of the elastic member 44 is connected to the top of the protrusion 42. This structural layout allows the various components of the clamping ring assembly device 4 to fit tightly together and occupy a small space.

[0077] Furthermore, a first slider 45 is provided on the outer side of the protrusion 42 , and first slideways 4132 are provided on both side walls of the suction head 41 . The first slider 45 is slidably connected to the first slideway 4132 , thereby improving the sliding stability of the protrusion 42 and the suction head 41 .

[0078] The first slider 45 in this embodiment passes through both sides of the protrusion 42 and extends. On the basis of allowing the protrusion 42 to slide stably in the vertical direction, the first slider 45 also facilitates the installation of the protrusion 42 in the suction head 41. The structural design is sophisticated and easy to install and use.

[0079] In this embodiment, a first receiving groove 421 is provided at the top of the protrusion 42, and the bottom end of the elastic member 44 is located in the first receiving groove 421, which improves the stability of the connection between the elastic member 44 and the protrusion 42 and prevents the elastic member 44 from falling off or deflecting.

[0080] In addition, in this embodiment, the suction holes 4133 are provided in a plurality of groups, and the plurality of groups of suction holes 4133 are evenly distributed around the bottom end of the suction head 41 , so as to facilitate the suction head 41 to stably adsorb the clamping ring 13 .

[0081] In this embodiment, the diameter of the outer cross section of the second connecting end 413 gradually decreases, so as to facilitate the guiding and adsorption of the snap ring 13 .

[0082] In this embodiment, the clamping ring assembly device 4 further includes a protective sleeve 46 , which is connected to the fixing seat 35 and is sleeved on the outside of the suction head 41 , with the bottom end of the protective sleeve 46 flush with the bottom surface of the suction head 41 .

[0083] The cover plate pre-pressing device 2 in this embodiment is described in detail as follows:

[0084] Combine Figure 1 、 Figure 6 and Figure 7 The cover plate pre-pressing device 2 is used to pre-press the cover plate 11. The cover plate 11 corresponds to the substrate 12. The cover plate 11 is provided with a pinhole corresponding to the pin 121 of the substrate 12. The cover plate pre-pressing device 2 includes a clamping jaw 22; the clamping jaw 22 is located on one side of the fixing seat 35, and the clamping jaw 22 is used to grab the cover plate 11. The cover plate 11 is located above the substrate 12, and the pinhole corresponds to the pin 121; the lifting drive assembly 31 The lifting drive assembly 31 is connected to the clamping jaw 22 through the mounting plate 32, and the lifting drive assembly 31 drives the clamping jaw 22 to move up and down (that is, it moves along the straight line where the Z axis marked in the figure is located), thereby pre-pressing the cover plate 11.

[0085] Among them, the clamping jaw 22 includes a second driving member 224, a first clamping member 222 and a second clamping member 223, and the mounting plate 32 is connected to the lifting driving assembly 31; there are two first clamping members 222, and the two first clamping members 222 are arranged opposite to each other in the front-to-back direction to form a first clamping gap, and the first clamping gap clamps the front-to-back sides of the cover plate 11; there are two second clamping members 223, and the two second clamping members 223 are arranged opposite to each other in the left-to-right direction to form a second clamping gap, and the second clamping gap clamps the left-to-right sides of the cover plate 11, and the second clamping member 223 is used to clamp and pre-press the cover plate 11; the second driving member 224 is arranged on the mounting plate 32, and the second driving member 224 is connected to the first clamping member 222 and the second clamping member 223, and the second driving member 224 drives the opening and closing of the first clamping gap and the second clamping gap.

[0086] In the cover pre-pressing device 2 of the present invention, the clamping jaw 22 includes a first clamping member 222 in the front-to-back direction and a second clamping member 223 in the left-to-right direction, which can clamp the cover 11 stably in all directions. The second driving member 224 drives the opening and closing of the first clamping member 222 and the second clamping member 223 to realize the rapid grasping and release of the cover 11. The lifting driving assembly 31 is arranged on the fixed seat 35 and is directly connected to the clamping jaw 22. By precisely controlling the up and down movement of the clamping jaw 22, the pre-pressing operation of the cover 11 on the substrate 12 is realized, ensuring that the pinhole on the cover 11 and the pin 121 on the substrate 12 are accurately aligned during the pre-pressing process, avoiding poor connection or damage problems caused by misalignment, and realizing automatic alignment of the cover 11 and the substrate 12. The entire pre-pressing process is fully automated without the need for manual intervention.

[0087] The structure of the clamping jaw 22 in this embodiment is described in detail as follows:

[0088] Combine Figure 7 、 Figure 8 and Figure 9 In this embodiment, the first clamping member 222 includes a first rod member 2221, a second rod member 2222, and a third rod member 2223. The top end of the first rod member 2221 is connected to the second driving member 224, and the bottom surface of the first rod member 2221 is used to pre-press the top surface of the cover plate 11. The second rod member 2222 is connected to one end of the first rod member 2221, and the line along which the long side of the second rod member 2222 is perpendicular to the line along which the long side of the first rod member 2221 is located. The third rod member 2223 is arranged vertically, and the top end of the third rod member 2223 is connected to the second rod member 2222. A first support block 2224 is provided on the inner side of the third rod member 2223. The first support block 2224 is used to support the cover plate 11, and the inner side of the third rod member 2223 defines the lateral direction of the cover plate 11. The third rod member 2223 and the first support block 2224 thereon define the front-to-back direction of the cover plate 11, thereby improving the stability and accuracy of the clamping.

[0089] Furthermore, the third rod members 2223 are provided in a plurality of groups, and the plurality of third rod members 2223 are arranged along the straight line where the long side of the second rod member 2222 is located. A plurality of first support blocks 2224 are provided to support the cover plate 11 to improve the stability of the clamping jaws 22 supporting the cover plate 11.

[0090] Combine Figure 8 、 Figure 9 and Figure 10 In this embodiment, the second clamping member 223 includes a fourth rod member 2231, a fifth rod member 2232, and a pressure block 2234. One end of the fourth rod member 2231 is connected to the second driving member 224. The fifth rod member 2232 is vertically arranged, with its top end connected to the fourth rod member 2231. A second support block 2233 is provided on the inner side of the fifth rod member 2232. The second support block 2233 is used to support the cover plate 11. The inner sides of the two sets of fifth rod members 2232 respectively define the left and right directions of the cover plate 11. The second support blocks 2233 on the fifth rod member 2232 further support and ensure the stability of the cover plate 11 during the clamping process. The design of the inner side of the fifth rod member 2232 defines the left and right directions of the cover plate 11, facilitating precise alignment and placement.

[0091] The pressing block 2234 is slidably connected to the fourth rod component 2231 , and the pressing block 2234 slides up and down relative to the fourth rod component 2231 . The pressing block 2234 is located above the cover plate 11 , and the top of the pressing block 2234 is movably connected to the mounting plate 221 , thereby pre-pressing the cover plate 11 .

[0092] Furthermore, the pressure block 2234 is arranged on the fourth rod component 2231 along the vertical sliding direction, and the pressure block 2234 is connected to the fourth rod component 2231 for sliding up and down. The clamping jaw 22 in this embodiment also includes a connecting plate 225 and a third sensor 226. The connecting plate 225 is located above the pressure block 2234, and the connecting plate 225 is movably connected to the top of the pressure block 2234. The connecting plate 225 is used to press the pressure block downward; the third sensor 226 is arranged between the connecting plate 225 and the mounting plate 221, and the third sensor 226 is used to detect the pre-pressure applied by the mounting plate 221.

[0093] When the clamping jaws 22 are pressed downward as a whole, the top surface of the cover plate 11 abuts against the pressure block 2234, causing the pressure block 2234 to move upward; the pressure block 2234 abuts against the connecting plate 225, and a third sensor 226 is set between the connecting plate 225 and the mounting plate 221. The third sensor 226 detects pressure, that is, pre-pressure is applied to the cover plate 11 through the mounting plate 221 and the pressure block 2234 to avoid damage to the clamping jaws.

[0094] Furthermore, the fifth rod component 2232 is detachably connected to the fourth rod component 2231 , so as to facilitate adjustment of the clamping range of the clamping jaw 22 according to cover plates 11 of different sizes.

[0095] Combine Figure 7 and Figure 13 In this embodiment, the cover plate pre-pressing device 2 further includes a first sensor 23 and a second sensor 24 . The first sensor 23 is connected to the mounting plate 32 . The first sensor 23 is used to detect whether the clamping claw 22 grabs the cover plate 11 .

[0096] Combine Figure 11 、 12 and Figure 13 The second sensor 24 is connected to the mounting plate 32 and is located above the movement trajectory of the cover 11. The second sensor 24 is used to detect whether the cover 11 has flipped into place. The use of the first sensor 23 and the second sensor 24 can monitor the status of the clamping jaw 22 and the position of the cover 11 in real time, ensuring the accuracy and safety of the operation process.

[0097] Combine Figure 6 and Figure 7 The cover plate pre-pressing device 2 in this embodiment also includes a rotating driving member 21, which is arranged on the mounting plate 32 and is connected to the second driving member 224. The rotating driving member 21 drives the clamping jaw 22 to rotate, thereby driving the cover plate 11 to rotate, thereby improving the practicality of the cover plate pre-pressing device 2.

[0098] The scheduling device 3 in this embodiment is described in detail as follows:

[0099] Combine Figure 1 The scheduling device 3 also includes a first horizontal drive assembly 33, a second horizontal drive assembly 34 and a fixed seat 35. The lifting drive assembly 31 is set on the fixed seat 35. The first horizontal drive assembly 33 is connected to the lifting drive assembly 31 through the fixed seat 35. The first horizontal drive assembly 33 drives the fixed seat 35 to move along the x-axis direction; the second horizontal drive assembly 34 is connected to the first horizontal drive assembly 33. The second horizontal drive assembly 34 drives the second horizontal drive assembly 34 to move along the y-axis direction. The straight line where the long side of the second horizontal drive assembly 34 is located is perpendicular to the straight line where the long side of the first horizontal drive assembly 33 is located. The position of the clamp 22 can be adjusted in the horizontal direction, so that the clamp can achieve precise movement in the X-axis and Y-axis directions, ensuring the smoothness and accuracy of the entire pre-pressing process. The x, y, and z axes shown in the figure are perpendicular to each other. Through the precise control of the dual horizontal drive assemblies, it is ensured that the clamp 22 can be accurately moved to the specified position, improving the smoothness and accuracy of the pre-pressing process.

[0100] The other structures of the chip module assembly mechanism in this embodiment are described in detail as follows:

[0101] Combine Figure 1 and Figure 2The chip module assembly mechanism in this embodiment further includes a detection device 5. The detection device 5 is used to detect whether the arrangement direction of the cover plate 11 with the gripper corresponds to the arrangement direction of the substrate 12; if the arrangement direction of the cover plate 11 does not correspond to the position of the substrate 12, it is necessary to rotate the driving member 21 to cause the clamping claw 22 to grip the cover plate 11 and then rotate until the positions of the cover plate 11 and the substrate 12 correspond. The detection device 5 can automatically detect whether the arrangement directions of the cover plate 11 and the substrate 12 correspond, thereby improving production efficiency and reducing manual intervention. The rotating driving member 21 can automatically adjust the direction of the cover plate 11 to ensure that it corresponds to the position of the substrate 12, thereby reducing assembly errors.

[0102] Combine Figure 1 The detection device 5 in this embodiment includes a lens mount 31, a detection lens 52, and a light source assembly 53. The lens mount 31 is connected to the fixing base 35. The detection lens 52 is connected to the lens mount 31 and is used to capture and identify the position of the cover plate 11. The light source assembly 53 is connected to the lens mount 31 and is used to provide illumination. The detection lens 52 and the light source assembly 53 provide a clear image, which helps to accurately identify the position of the cover plate 11.

[0103] Working principle of the present invention:

[0104] 1. The substrate 12 is located at a designated position. A plurality of pins 121 are provided on the substrate 12 , and the pins 121 are not arranged symmetrically.

[0105] 2. The detection device 5 takes a photo of the cover plate 11 to be grasped for detection. The detection device 5 is used to identify whether the cover plate 11 to be grasped corresponds to the base plate 12.

[0106] In this embodiment, there are pinholes on the cover plate 11, which correspond to the pins 121 on the substrate 12; the pinholes are not arranged symmetrically, and the detection device 5 is used to identify whether the cover plate 11 to be grasped corresponds to the substrate 12 based on the pins 121 on the substrate 12.

[0107] 3. Grab the cover plate 11.

[0108] (1) The scheduling device 5 achieves precise movement of the cover plate 11 in the X-axis and Y-axis directions through precise control of the first horizontal driving assembly 33 and the second horizontal driving assembly 34 until the clamping jaws 22 are located above the cover plate 11.

[0109] (2) The second drive member 224 is activated, causing the first clamping member 222 and the second clamping member 223 to open to their maximum simultaneously. The lifting drive assembly 31 drives the clamping jaws 22 to move above the cover 11. The second drive member 224 then drives the clamping jaws 22 to close, accurately gripping the cover 11. The first sensor 23 detects that the clamping jaws 22 have grasped the cover 11 and proceeds to the next step. The detection device 5 automatically captures and identifies the position of the cover 11. The light source assembly 53 provides sufficient lighting to ensure that the operation process is clearly visible.

[0110] The first clamping member 222 and the second clamping member 223 are driven to open and close by the second driving member 224 to clamp the front and back and left and right sides of the cover plate 11 to achieve stable fixation.

[0111] 4. Pre-pressed cover plate 11.

[0112] (1) The first horizontal driving assembly 33 and the second horizontal driving assembly 34 control the clamping jaw 22 to be positioned above the substrate 12 .

[0113] (2) Based on the recognition result of the detection device 5, the rotation drive member 21 adjusts the direction of the cover plate 11, and the rotation drive member 21 drives the clamping jaws 22 and the cover plate 11 to rotate to the required angle to achieve the complex docking requirements. Until the second sensor 24 detects that the cover plate 11 is flipped into place, the cover plate 11 corresponds to the base plate 12, ensuring that the pinhole and the pin 121 are accurately aligned.

[0114] (3) The lifting drive assembly 31 controls the downward movement of the clamping jaw 22. The clamping jaw 22 is pressed downward as a whole. The top surface of the cover plate 11 abuts against the pressure block 2234, causing the pressure block 2234 to move upward. The pressure block 2234 abuts against the connecting plate 225. The third sensor 226 detects the preload applied by the mounting plate 221 to avoid damaging the clamping jaw, thereby achieving a stable preload of the cover plate 11.

[0115] 5. Assemble the snap ring 13.

[0116] (1) The snap ring 13 is adsorbed.

[0117] The scheduling device 5 realizes the precise movement of the snap ring assembly device 4 in the X, Y, and Z axis directions through the control of the lifting drive component 31, the first horizontal drive component 33, and the second horizontal drive component 34 until the suction head 41 is located above the snap ring 13.

[0118] The snap ring assembly device 4 uses a suction head 41 to attract the snap ring 13. A suction device at the top of the suction head 41 is connected to the suction hole 4133, generating negative pressure to attract the snap ring 13. The bump does not hinder the suction head 41 from attracting the snap ring 13; gravity and the elastic member maintain the bump in contact with the snap ring.

[0119] (2) Insert the snap ring 13.

[0120] The first driving member 43 drives the suction head 41 (carrying the clamping ring 13 ) to move toward the base plate 12 until the clamping ring 13 is aligned with the clamping groove on the base plate 12 .

[0121] (3) Release the snap ring 13.

[0122] After the suction head 41 inserts the retaining ring 13 into the retaining groove on the base plate 12, the suction head 41 releases the retaining ring 13. Then, driven upward by the first driving member, the suction head 41 begins to move upward. Due to gravity and the elastic member 44, the protrusion 42 remains in contact with the retaining ring 13 and does not move upward with the suction head 41. The protrusion 42 presses the retaining ring 13 into the retaining groove, preventing it from being lifted by the rising suction head 41. When the protrusion 42 reaches the bottom of the suction head 41, the suction head 41 lifts the protrusion 42 again, completing the insertion of the retaining ring 13.

[0123] Sixth, complete the process of assembling the snap ring 13 and pre-pressing the cover plate 11.

[0124] This completes the working process of the chip module assembly mechanism of this preferred embodiment.

[0125] The innovation of this application lies in the unique design of the suction head and the protrusion in the retaining ring assembly device, and the multi-step integrated assembly process achieved by the scheduling device, which is the key to solving the problems of unstable retaining ring adsorption and inaccurate release in the existing technology. The driving component in this application can adopt a variety of existing mature technologies, including but not limited to screw drive, cylinder drive or electric motor drive, etc., to achieve the precise movement and operation of the retaining ring assembly device and the cover plate pre-pressing device. Regardless of the driving method adopted, its essence is to provide power support for the precise installation of the retaining ring and the accurate pre-pressing of the cover plate, rather than the core invention of this application. Therefore, the specific selection and implementation details of the driving method will not be elaborated here.

[0126] The first and second sensors are essential components of automated control systems. Because these sensor technologies are already quite mature and widespread, their operating principles, types (such as photoelectric sensors, proximity sensors, and pressure sensors), and widespread application in modern industry all fall within the scope of common prior art. This application does not elaborate on the specific technical details of the first and second sensors.

[0127] In summary, although the present invention has been disclosed above with reference to preferred embodiments, the above preferred embodiments are not intended to limit the present invention. A person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined in the claims.

Claims

1. A chip module assembly mechanism, characterized in that: The chip module includes a base plate, a cover plate, and a snap ring. The base plate is provided with a snap slot and pins, the base plate is provided with pinholes for connecting the pins, the snap ring is provided between the base plate and the cover plate, and the snap ring is plugged into the snap slot. The chip module assembly mechanism includes: A snap ring assembly device, used for adsorbing the snap ring and installing the snap ring onto the substrate; A cover pre-pressing device for gripping the cover; and A scheduling device, the scheduling device including a lifting drive assembly and a mounting plate, the lifting drive assembly being connected to the snap ring assembly device and the cover plate pre-pressing device via the mounting plate, the lifting drive assembly driving the mounting plate to move in a vertical direction, thereby causing the snap ring assembly device to assemble the snap ring onto the base plate, and the cover plate pre-pressing device to pre-press the cover plate against the pins on the base plate; The snap ring assembly device comprises: A suction head, the suction head is connected to the suction device, and a suction hole is provided at the bottom of the suction head, and the suction hole is used to adsorb the clamping ring; a protrusion slidably connected to the bottom end of the nozzle, the protrusion being used to prevent the nozzle from lifting the retaining ring; and a first driving member connected to the mounting plate, the first driving member being connected to the suction head, and the first driving member driving the suction head to move relative to the base plate, thereby causing the retaining ring to be plugged into the retaining groove; Wherein, the clamp ring assembly device further comprises an elastic member, the elastic member is connected to the top of the protrusion and the suction head, and the elastic member elastically presses the protrusion downward; The suction head is a hollow cylindrical structure, and the suction head comprises: A first connecting end is located at the top of the suction head, the top of the first connecting end is connected to the first driving member, and the side of the first connecting end is connected to the suction device; An extension end, located in the middle of the suction head, extending vertically downward; and A second connecting end is located at the bottom end of the suction head, a partition is provided at the top end of the second connecting end, the air suction hole is located in the side wall of the second connecting end, and the air suction hole is connected to the interior of the first connecting end; The protrusion is slidably connected to the inner wall of the second connection end, the elastic member is arranged in the second connection end, the top end of the elastic member is connected to the bottom surface of the partition, and the bottom end of the elastic member is connected to the top end of the protrusion.

2. The chip module assembly mechanism according to claim 1, wherein: A first sliding block is provided on the outer side of the protrusion, and first slideways are provided on both side walls of the suction head opposite to each other, and the first sliding block is slidably connected to the first slideway.

3. The chip module assembly mechanism according to claim 1, wherein: The cover plate pre-pressing device includes a clamping claw, which is used to grab the cover plate, and the clamping claw includes: Two first clamping members are provided, and the two first clamping members are arranged opposite to each other in the front-to-back direction to form a first clamping opening, and the first clamping opening clamps both sides of the cover plate in the front-to-back direction; Two second clamping members are provided, and the two second clamping members are arranged opposite to each other in the left and right directions to form a second clamping opening, and the second clamping opening clamps the left and right sides of the cover plate, and the second clamping members are used to clamp and pre-press the cover plate; and The second driving member is arranged on the mounting plate, the driving member is connected to the first clamping member and the second clamping member, and the driving member drives the opening and closing of the first clamping opening and the second clamping opening.

4. The chip module assembly mechanism according to claim 3, wherein: The first clamping member comprises: a first rod component, a top end of which is connected to the driving component; a second rod member connected to one end of the first rod member, wherein the line where the long side of the second rod member lies is perpendicular to the line where the long side of the first rod member lies; and The third rod component is vertically arranged, the top end of the third rod component is connected to the second rod component, and a first support block is arranged on the inner side of the third rod component, and the first support block is used to support the cover plate.

5. The chip module assembly mechanism according to claim 3, characterized in that: The second clamping member comprises: a fourth rod component, a top end of which is connected to the driving component; a fifth rod component, arranged vertically, wherein the top end of the fifth rod component is connected to the fourth rod component, and a second support block is provided on the inner side of the fifth rod component, and the second support block is used to support the cover plate; and A pressing block is connected to the fourth rod component, the pressing block is located above the cover plate, and the pressing block is used to pre-press the cover plate.

6. The chip module assembly mechanism according to claim 4, characterized in that: The chip module assembly mechanism further includes a detection device, which is arranged on one side of the cover plate pre-pressing device, and includes: A lens connecting seat is located on one side of the cover plate pre-pressing device; a detection lens connected to the lens connection seat, the detection lens being used to photograph and identify the position of the cover plate; and A light source assembly is connected to the lens connection seat, and the light source assembly is used to provide lighting.

7. The chip module assembly mechanism according to claim 6, characterized in that: The cover plate pre-pressing device further includes a rotation driving member, which is disposed on the mounting plate and connected to the driving member. The rotation driving member drives the clamping jaw to rotate, thereby driving the cover plate to rotate.

8. The chip module assembly mechanism according to claim 1, wherein: The lifting drive assembly is arranged on a fixed seat, and the scheduling device further comprises: a first horizontal drive assembly connected to the lifting drive assembly, the first horizontal drive assembly driving the fixing seat to move along the X-axis direction, wherein the X-axis direction is perpendicular to the straight line in which the lifting drive assembly drives the mounting plate to move; and The second horizontal drive component is connected to the first horizontal drive component, and the second horizontal drive component drives the second horizontal drive component to move along the Y-axis direction. The straight line where the long side of the second horizontal drive component is located is perpendicular to the straight line where the long side of the first horizontal drive component is located.

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