Semiconductor material winding apparatus
By introducing an auxiliary clamping device into the semiconductor material winding equipment, the problem of material slack during the winding process was solved, achieving high-quality and efficient winding results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 汉斯半导体(江苏)有限公司
- Filing Date
- 2024-06-27
- Publication Date
- 2026-06-26
AI Technical Summary
During the winding process of flexible semiconductor materials, slack can easily occur, resulting in loose finished products that are not tightly wound, affecting quality and uniformity. Furthermore, the loss of power to the motor may cause material disorder.
An auxiliary clamping device is used, including components such as support rods, support arms, pressure rollers, ratchet mechanisms, and torsion springs. Through a drive device and a suction device, the material is always pressed tightly onto the take-up roller to prevent loosening.
This effectively avoids the loosening of semiconductor materials during the winding process, improves winding quality and efficiency, and ensures the compactness and stability of the finished product.
Smart Images
Figure CN118723715B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of semiconductor material production equipment, and more particularly to a semiconductor material winding device. Background Technology
[0002] In the semiconductor device manufacturing process, the winding process of flexible semiconductor materials is a crucial step, directly affecting the convenience of subsequent transportation and storage. Currently, the winding of flexible semiconductor materials mostly relies on an electric motor driving a winding roller to rotate, thereby tightly winding the flexible semiconductor material onto the roller shaft.
[0003] However, in practical applications, the high tensile properties of flexible semiconductor materials make them prone to loosening during winding, resulting in a less compact finished product and affecting its overall quality. Secondly, when the motor loses power or stops, the winding roller loses its driving force. Under the tension of the semiconductor material, the winding roller may reverse, causing the material already wound on the roller to loosen or even become disordered, significantly impacting the neatness and quality of the finished product. Summary of the Invention
[0004] This application aims to at least partially address one of the technical problems in the related art.
[0005] Therefore, one objective of this application is to provide a semiconductor material winding device that, by setting an auxiliary pressing device, can keep the winding semiconductor material pressed firmly on the winding roller, effectively preventing the semiconductor material from loosening during the winding process, thereby greatly improving the quality and efficiency of the winding process of flexible semiconductor materials, while also ensuring the tightness, neatness and quality stability of the finished winding product.
[0006] To achieve the above objectives, a semiconductor material winding device is provided in the first aspect of this application, comprising a base, a first upright plate, a second upright plate, a winding roller, an air suction device, multiple auxiliary pressing devices, a first driving device, and a second driving device. The first upright plate and the second upright plate are vertically and side-by-side fixedly mounted on the base, and the first upright plate is provided with a detachable gate. The winding roller is rotatably disposed between the second upright plate and the gate, with one end of the winding roller penetrating through the second upright plate and extending to the outside, and the other end of the winding roller engaging with the gate. A channel is provided inside the winding roller. The take-up roller has a row of through holes communicating with the channel; the suction device is mounted on the base and is rotatably connected to one end of the take-up roller via a pipe; a plurality of auxiliary pressing devices are distributed around the take-up roller between the first upright plate and the second upright plate, and the plurality of auxiliary pressing devices are respectively in contact with the take-up roller; the first driving device is mounted on the second upright plate and is respectively connected to the plurality of auxiliary pressing devices; the second driving device is mounted on the base and is connected to one end of the take-up roller.
[0007] The semiconductor material winding equipment of this application embodiment can keep the winding semiconductor material pressed firmly on the winding roller by setting an auxiliary pressing device, which effectively avoids the semiconductor material from loosening during the winding process, thereby greatly improving the quality and efficiency of the winding process of flexible semiconductor materials. At the same time, it also ensures the tightness, neatness and quality stability of the winding product.
[0008] In addition, the semiconductor material winding device proposed in this application may also have the following additional technical features:
[0009] In one embodiment of this application, the auxiliary pressing device includes a support rod, two support arms, a pressure roller, a ratchet mechanism, and a torsion spring. The support rod is rotatably disposed between the first upright plate and the second upright plate, with both ends of the support rod passing through the first upright plate and the second upright plate, respectively. The two support arms are arranged side-by-side between the first upright plate and the second upright plate, with one end of each support arm sleeved and fixed to the support rod, and the other ends of each support arm rotatably connected to both ends of the pressure roller. The pressure roller is in contact with the take-up roller. The ratchet mechanism includes a turntable, a ratchet, and external teeth. The device comprises a ring, a pawl, and a spring plate, wherein the turntable is sleeved and fixed to one end of the support rod; the ratchet is sleeved on the turntable and rotatably connected to the second upright plate; the external gear ring is sleeved and fixed to the ratchet; one end of the pawl is eccentrically and rotatably mounted on the turntable, and the other end of the pawl abuts against the ratchet; one end of the spring plate is fixed to the turntable via a connecting rod, and the other end of the spring plate abuts against the pawl; the torsion spring is sleeved on the other end of the support rod, and one end of the torsion spring is fixedly connected to the support rod, and the other end of the torsion spring is fixedly connected to the first upright plate.
[0010] In one embodiment of this application, the first driving device includes an internal gear ring, a worm gear, a worm, and a first driving mechanism. The internal gear ring is rotatably mounted on the second vertical plate and meshes with the external gear ring. The worm gear is sleeved and fixed on the internal gear ring. The worm is rotatably mounted on the second vertical plate and meshes with the worm gear. The first driving mechanism is mounted on the second vertical plate, and its output end is fixedly connected to one end of the worm.
[0011] In one embodiment of this application, the second driving device includes a second driving mechanism and a belt drive mechanism, wherein the second driving mechanism is disposed on the base; the belt drive mechanism includes a driving pulley, a driven pulley and a belt, wherein the driving pulley is fixedly connected to the output end of the second driving mechanism; the driven pulley is fixedly connected to one end of the take-up roller; and the belt is sleeved on the driving pulley and the driven pulley.
[0012] In one embodiment of this application, the gate is provided with a door handle.
[0013] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description
[0014] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein:
[0015] Figure 1 A three-dimensional semiconductor material winding apparatus according to an embodiment of this application Figure 1 ;
[0016] Figure 2 A three-dimensional semiconductor material winding apparatus according to an embodiment of this application Figure 2 ;
[0017] Figure 3 A three-dimensional semiconductor material winding apparatus according to an embodiment of this application Figure 3 ;
[0018] Figure 4 This is a schematic cross-sectional view of a semiconductor material winding device according to an embodiment of this application;
[0019] Figure 5 This is a left view of a semiconductor material winding apparatus according to an embodiment of this application;
[0020] Figure 6 This is a partial structural schematic diagram of a semiconductor material winding apparatus according to an embodiment of this application.
[0021] As shown in the figure: 10, base; 20, first upright plate; 201, gate; 202, door handle; 30, second upright plate; 40, take-up roller; 401, channel; 402, through hole; 50, air suction device; 60, auxiliary pressing device; 61, support rod; 62, support arm; 63, pressure roller; 64, ratchet mechanism; 641, turntable; 642, ratchet; 643, external gear ring; 644, pawl; 645, spring plate; 65, torsion spring; 70, first drive device; 71, internal gear ring; 72, worm gear; 73, worm; 74, first drive mechanism; 80, second drive device; 81, second drive mechanism; 82, belt drive mechanism; 821, driving pulley; 822, driven pulley; 823, belt. Detailed Implementation
[0022] Embodiments of this application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application. Rather, embodiments of this application include all variations, modifications, and equivalents falling within the spirit and scope of the appended claims.
[0023] The semiconductor material winding apparatus of this application embodiment will now be described with reference to the accompanying drawings.
[0024] like Figures 1-6 As shown, the semiconductor material winding device of this application embodiment may include a base 10, a first upright plate 20, a second upright plate 30, a winding roller 40, an air suction device 50, a plurality of auxiliary pressing devices 60, a first driving device 70 and a second driving device 80.
[0025] The first upright plate 20 and the second upright plate 30 are fixedly mounted on the base 10 vertically and side by side, and the first upright plate 20 is provided with a detachable ground gate 201.
[0026] It should be noted that the first upright plate 20 is provided with a discharge port (not specifically marked in the figure), and the gate 201 is detachably installed inside the discharge port. It is understood that the gate 201 is detachably installed on the first upright plate 20 to facilitate its opening and closing. For example, one side of the gate 201 can be pivotally connected to the first upright plate 20 via a hinge or pin, and the other side of the gate 201 can be connected to the first upright plate 20 via a snap-fit connection.
[0027] In this embodiment, the gate 201 is provided with a door handle 202. The door handle 202 facilitates the opening of the gate 201 by the operator to remove the semiconductor material wound on the take-up roller 40. It should be noted that the maximum diameter (thickness) of the semiconductor material wound on the take-up roller 40 is smaller than the diameter (aperture) of the discharge port.
[0028] The take-up roller 40 is rotatably disposed between the second vertical plate 30 and the gate 201, with one end of the take-up roller 40 passing through the second vertical plate 30 and extending to the outside, and the other end of the take-up roller 40 being engaged with the gate 201. The take-up roller 40 is provided with a channel 401, and a row of through holes 402 communicating with the channel 401 are provided on the take-up roller 40.
[0029] The suction device 50 is mounted on the base 10 and is rotatably connected to one end of the take-up roller 40 via a pipe. Multiple auxiliary pressing devices 60 are distributed around the take-up roller 40 between the first vertical plate 20 and the second vertical plate 30, and the multiple auxiliary pressing devices 60 are respectively in contact with the take-up roller 40. For example, there may be 2, 3, 4, 5, or 6 auxiliary pressing devices 60, etc. The specific number used can be selected according to the actual situation and is not limited here.
[0030] It should be noted that the suction device 50 described in this embodiment may be a suction pump.
[0031] The first drive device 70 is mounted on the second upright plate 30 and is connected to multiple auxiliary pressing devices 60. The second drive device 80 is mounted on the base 10 and is connected to one end of the take-up roller 40.
[0032] Specifically, when it is necessary to wind up semiconductor materials, the relevant personnel first need to set up the semiconductor material winding equipment at the location where the semiconductor material to be wound is to be wound (this location can be inside the factory where semiconductor materials are processed). Then, the personnel place one end of the semiconductor material to be wound at the through hole 402 on the winding roller 40 and control the suction device 50 to suck up air. At this time, one end of the semiconductor material is adsorbed onto the winding roller 40.
[0033] At this time, the operator controls the second drive device 80 to drive the winding roller 40 to rotate and wind up the semiconductor material to obtain a rolled semiconductor material. During the winding process, multiple auxiliary pressing devices 60 continuously apply pressure to the semiconductor material during the winding process to prevent the semiconductor material from loosening, thereby greatly improving the quality and efficiency of the winding process of flexible semiconductor materials. At the same time, it also ensures the tightness, neatness and quality stability of the finished product.
[0034] Once the semiconductor material is wound to a preset thickness (which is smaller than the diameter of the outlet), the operator can first open the gate 201, and then control the first drive device 70 to drive multiple auxiliary pressing devices 60 to rotate, so that the multiple auxiliary pressing devices 60 move away from the wound semiconductor material, thereby relieving the pressure on the wound semiconductor material (that is, the pressure of pressing the semiconductor material on the winding roller 40), and at the same time controlling the suction device 50 to stop working.
[0035] Finally, the workers can remove (extract) the rolled semiconductor material that has been wound on the take-up roller 40 through the discharge port.
[0036] In one embodiment of this application, such as Figures 1-3 , Figure 5 and Figure 6 As shown, the auxiliary clamping device 60 may include a support rod 61, two support arms 62, a pressure roller 63, a ratchet mechanism 64, and a torsion spring 65.
[0037] The support rod 61 is rotatably disposed between the first upright plate 20 and the second upright plate 30, and both ends of the support rod 61 pass through the first upright plate 20 and the second upright plate 30 respectively.
[0038] Two support arms 62 are arranged side by side between the first vertical plate 20 and the second vertical plate 30, and one end of each support arm 62 is respectively sleeved and fixed on the support rod 61. The other end of each support arm 62 is rotatably connected to both ends of the pressure roller 63, wherein the pressure roller 63 is in contact with the winding roller 40.
[0039] The ratchet mechanism 64 may include a turntable 641, a ratchet 642, an external gear ring 643, a pawl 644, and a spring plate 645, wherein the turntable 641 is sleeved and fixed on one end of the support rod 61.
[0040] Ratchet 642 is mounted on turntable 641 and is rotatably connected to the second vertical plate 30. External gear ring 643 is mounted and fixed on ratchet 642.
[0041] One end of the pawl 644 is eccentrically and rotatably mounted on the turntable 641, while the other end of the pawl 644 abuts against the ratchet 642. One end of the spring plate 645 is fixedly mounted on the turntable 641 via a connecting rod, and the other end of the spring plate 645 abuts against the pawl 644. The torsion spring 65 is sleeved on the other end of the support rod 61, with one end of the torsion spring 65 fixedly connected to the support rod 61 and the other end of the torsion spring 65 fixedly connected to the first vertical plate 20.
[0042] Understandably, when the take-up roller 40 is winding up the semiconductor material, as the thickness of the semiconductor material on the take-up roller 40 increases, the pressure roller 63 gradually moves away from the take-up roller 40 and drives the support rod 61 to rotate through the two support arms 62. The rotating support rod 61 generates torque on the torsion spring 65. At the same time, the rotating support rod drives the turntable 641 to rotate. The rotating turntable 641 simultaneously drives the pawl 644 and the spring plate 645 to rotate unidirectionally within the ratchet 642.
[0043] Similarly, the torsion spring 65 will also exert a reverse force on the support rod 61, and apply time pressure (resistance) to the semiconductor material wound on the winding roller 40 through the pressure roller 63, thereby effectively preventing the semiconductor material from loosening during the winding process, greatly improving the quality and efficiency of the winding process of the flexible semiconductor material, and at the same time ensuring the tightness, neatness and quality stability of the wound product.
[0044] In one embodiment of this application, such as Figures 1-3 As shown, the first drive device 70 may include an internal gear ring 71, a worm gear 72, a worm 73 and a first drive mechanism 74, wherein the internal gear ring 71 is rotatably mounted on the second vertical plate 30 and meshes with the external gear ring 643.
[0045] The worm gear 72 is sleeved and fixed on the internal gear ring 71. The worm 73 is rotatably mounted on the second vertical plate 30 and meshes with the worm gear 72. The first drive mechanism 74 is mounted on the second vertical plate 30 and the output end of the first drive mechanism 74 is fixedly connected to one end of the worm 73.
[0046] It should be noted that the first drive mechanism 74 described in this embodiment may be a drive motor.
[0047] Understandably, once the semiconductor material wound on the take-up roller 40 reaches a preset thickness, in order to facilitate the removal of the rolled semiconductor material from the take-up roller 40, the operator first needs to open the gate 201. Then, the first drive mechanism 74 is controlled to drive the worm gear 73 to rotate. The rotating worm gear 73 drives the internal gear ring 71 to rotate through the worm wheel 72. The rotating internal gear ring 71 drives the external gear ring 643 to rotate. The rotating external gear ring 643 drives the ratchet 642 to rotate. The rotating ratchet 642 drives the turntable 641 to rotate through the pawl 644, thereby driving the support rod 61 to rotate. The rotating support rod 61 drives the pressure roller 63 to rotate and move away from the wound semiconductor material through the two support arms 62, thereby releasing the pressure roller 63 from the rolled semiconductor material on the take-up roller 40, so that the operator can remove the rolled semiconductor material from the take-up roller 40.
[0048] In one embodiment of this application, such as Figure 1 As shown, the second drive device 80 may include a second drive mechanism 81 and a belt drive mechanism 82, wherein the second drive mechanism 81 is disposed on the base 10.
[0049] The belt drive mechanism 82 includes a driving pulley 821, a driven pulley 822, and a belt 823. The driving pulley 821 is fixedly connected to the output end of the second drive mechanism 81, and the driven pulley 822 is fixedly connected to one end of the take-up roller 40. The belt 823 is sleeved on the driving pulley 821 and the driven pulley 822.
[0050] It should be noted that the second drive mechanism 81 described in this embodiment may be a servo motor.
[0051] Understandably, when it is necessary to drive the take-up roller 40 to take up the semiconductor material, the operator can control the second drive mechanism 81 to drive the drive pulley 821 to rotate. The rotating drive pulley 821 drives the driven pulley 822 to rotate through the belt 823. The rotating driven pulley 822 drives the take-up roller 40 to rotate in order to take up the semiconductor material.
[0052] In summary, the semiconductor material winding equipment of this application embodiment, by setting an auxiliary pressing device, can keep the winding semiconductor material pressed firmly on the winding roller, effectively avoiding the loosening of the semiconductor material during the winding process, thereby greatly improving the quality and efficiency of the winding process of flexible semiconductor materials. At the same time, it also ensures the tightness, neatness and quality stability of the winding product.
[0053] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0054] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0055] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.
Claims
1. A semiconductor material winding device, characterized in that, It includes a base, a first upright plate, a second upright plate, a take-up roller, an air suction device, multiple auxiliary pressing devices, a first drive device, and a second drive device, wherein, The first upright plate and the second upright plate are fixedly mounted on the base perpendicularly and side by side, and the first upright plate is provided with a detachable ground gate; The take-up roller is rotatably disposed between the second vertical plate and the gate, and one end of the take-up roller passes through the second vertical plate and extends to the outside, while the other end of the take-up roller is engaged with the gate. The take-up roller has a channel inside and a row of through holes communicating with the channel on the take-up roller. The suction device is mounted on the base and is rotatably connected to one end of the take-up roller via a pipe. Multiple auxiliary clamping devices are distributed around the take-up roller between the first vertical plate and the second vertical plate, and each of the multiple auxiliary clamping devices is in contact with and connected to the take-up roller. The first driving device is mounted on the second upright plate, and the first driving device is connected to the plurality of auxiliary pressing devices respectively; The second drive device is mounted on the base and is connected to one end of the take-up roller; The auxiliary clamping device includes a support rod, two support arms, a pressure roller, a ratchet mechanism, and a torsion spring, wherein... The support rod is rotatably disposed between the first upright plate and the second upright plate, and both ends of the support rod pass through the first upright plate and the second upright plate respectively; Two support arms are arranged side by side between the first vertical plate and the second vertical plate, and one end of each support arm is respectively sleeved and fixed on the support rod, and the other end of each support arm is rotatably connected to both ends of the pressure roller, wherein the pressure roller is in contact with the winding roller. The ratchet mechanism includes a turntable, a ratchet, an external gear ring, a pawl, and a spring plate, wherein, The turntable is sleeved and fixed to one end of the support rod; The ratchet is sleeved on the turntable, and the ratchet is rotatably connected to the second vertical plate; The external gear ring is sleeved and fixed on the ratchet; One end of the pawl is eccentrically mounted on the turntable, and the other end of the pawl abuts against the ratchet. One end of the spring sheet is fixedly mounted on the turntable by a connecting rod, and the other end of the spring sheet abuts against the pawl; The torsion spring is sleeved on the other end of the support rod, and one end of the torsion spring is fixedly connected to the support rod, while the other end of the torsion spring is fixedly connected to the first upright plate.
2. The semiconductor material winding device according to claim 1, characterized in that, The first driving device includes an internal gear ring, a worm gear, a worm, and a first driving mechanism, wherein, The internal gear ring is rotatably mounted on the second vertical plate, and the internal gear ring meshes with the external gear ring; The worm gear is sleeved and fixed on the internal gear ring; The worm gear is rotatably mounted on the second vertical plate, and the worm gear meshes with the worm wheel; The first drive mechanism is mounted on the second upright plate, and the output end of the first drive mechanism is fixedly connected to one end of the worm gear.
3. The semiconductor material winding device according to claim 1, characterized in that, The second drive device includes a second drive mechanism and a belt drive mechanism, wherein, The second drive mechanism is mounted on the base; The belt drive mechanism includes a driving pulley, a driven pulley, and a belt, wherein... The active pulley is fixedly connected to the output end of the second drive mechanism; The driven pulley is fixedly connected to one end of the take-up roller; The belt is fitted onto the driving pulley and the driven pulley.
4. The semiconductor material winding device according to claim 1, characterized in that, The gate is equipped with a door handle.