Computer case and cooling system

Abstract

The present invention provides a computer case and a cooling system, comprising a case body and a case back plate, wherein a control mainboard is arranged inside the case body, heat dissipation cooling mechanisms are installed on the side of the control mainboard and the side of the case body, an energy storage mechanism is connected to the surface of the heat dissipation cooling mechanism on the surface of the control mainboard, a partition cooling mechanism is arranged inside the case body, the partition cooling mechanism comprises a feed pipe and a cooling pipe, a plurality of cooling pipes are arranged, a multi-way control valve is connected between the ends of adjacent cooling pipes, the feed pipe is connected to the inside of the feed pipe through the multi-way control valve, a partition plate is arranged at a vertical position inside the cooling pipe, cooling air guide mechanisms are symmetrically distributed on both sides of the surface of the cooling pipe, after the temperature of a regional component position rises, the position is automatically adjusted to perform centralized cooling and temperature reduction treatment, so as to achieve targeted cooling and temperature reduction while achieving covering cooling inside the case body, thereby improving the targetedness, and thus quickly cooling the temperature inside the case body.

Description

Technical Field

[0001] The present invention relates to the field of computer devices, and specifically to a computer chassis and a cooling system. Background Art

[0002] The design of computer chassis and their cooling systems is constantly innovating. For example, by optimizing the air duct layout and fan configuration inside the chassis, the air circulation efficiency inside the chassis is improved, thereby reducing the hardware temperature, or by the high heat conductivity and fluidity of the liquid, efficient heat dissipation of core components such as the CPU and GPU is achieved.

[0003] According to a supercomputer cooling system with a gushing double cycle disclosed in Chinese Patent No. "CN110366359B", which includes a subcooler, a circulation pump, a blade chassis, a condenser, a secondary cooling system, as well as pipelines and valves. The evaporative cooling medium is stored in the subcooler, the blade chassis, and the connected pipelines. The cooling system is divided into two connected cycles: among them, the steam in the blade chassis rises to the condenser through the gas collecting pipe and the gas collecting valve and condenses into a liquid, and then flows back into the blade chassis through the liquid return pipe to realize the self-circulation of the steam; the high-temperature medium in the blade chassis enters the subcooler through the overflow pipe, and after cooling, it flows back into the blade chassis through the liquid inlet pipe to realize the controllable circulation of the evaporative cooling medium. The present invention exchanges heat through the phase change of the medium and forced convection, and preferably solves the problem of difficult heat dissipation of the equipment; and it is energy-saving, environmentally friendly, has no electromagnetic radiation, no dust pollution, and low noise to the outside; and it has low operating cost and high heat dissipation efficiency, can increase the equipment placement density, and improve the utilization rate of the computer room.

[0004] According to a computer dust-proof cooling system disclosed in Chinese Patent No. "CN114816007B", which relates to the field of computer technology. Aiming at the problem of poor working performance of existing computers, the following solution is proposed. It includes a water tank and a plurality of chassis fixed on the top of the water tank. A plurality of air guide holes are opened on both sides of the chassis, and an air guide component is arranged inside the air guide holes. A cooling component for cooling the chassis is arranged inside the water tank. The present invention can help the computer to perform fast and effective heat dissipation work, and can prevent external dust and sundries from adhering to the computer mainframe through the heat dissipation components, thereby effectively improving the dust-proof performance of the computer, and can intermittently clean the dust-proof components of the computer, so as to avoid the blockage of the dust-proof components and has a long battery life.

[0005] The above patent documents and the prior art have the following technical problems when in use:

[0006] Problem 1: The computer chassis cooling system usually adopts a unified heat dissipation method and cannot perform targeted cooling according to the temperature differences of components in different areas inside the chassis, resulting in ineffective cooling of some high-temperature areas and affecting the overall performance;

[0007] Problem 2: There is a lack of effective isolation measures between the internal components of the chassis, resulting in the heat generated by high-temperature components being easily transmitted to the surrounding components, causing the temperature inside the entire chassis to rise and increasing the difficulty of heat dissipation;

[0008] Problem 3: Traditional cooling fans adopt a fixed structure and cannot automatically adjust the cooling effect according to the temperature changes inside the chassis, resulting in unstable heat dissipation efficiency when the temperature fluctuates greatly and unable to meet the requirements of efficient heat dissipation;

[0009] Problem 4: The cooling systems between the main bodies of computer chassis are usually independent of each other and cannot share cooling resources. When cooling multiple chassis centrally, more cooling equipment and resources need to be invested, resulting in waste of resources;

[0010] Problem 5: The heat generated inside the chassis is usually regarded as waste heat to be removed and not effectively utilized, resulting in waste of energy. At the same time, in case of emergency, the lack of backup power supply may cause the equipment to malfunction. Summary of the Invention

[0011] Technical Problems to be Solved

[0012] In view of the deficiencies of the prior art, the present invention provides a computer chassis and a cooling system, which solve the following problems:

[0013] 1. The problem that the temperature distribution of the internal components of the chassis is uneven and there is a lack of targeted cooling means;

[0014] 2. The problem that the internal components of the chassis affect each other and it is difficult to achieve effective temperature isolation;

[0015] 3. The problem that the fixed structure of the cooling fan limits the heat dissipation efficiency;

[0016] 4. The problem that the cooling systems between the main bodies of the chassis are independent of each other and cannot be shared;

[0017] 5. The problem that the heat inside the chassis is not effectively utilized and there is waste of energy.

[0018] Technical Solutions

[0019] To achieve the above object, the present invention is realized through the following technical solutions: A computer chassis, including a chassis main body and a chassis backplane, a control main board is provided inside the chassis main body, heat dissipation and cooling mechanisms are installed on the side of the control main board and the side of the chassis main body, an energy storage mechanism is connected to the surface of the heat dissipation and cooling mechanism on the surface of the control main board, a partition cooling mechanism is provided inside the chassis main body, the partition cooling mechanism includes a feed pipe and cooling pipes, there are multiple groups of cooling pipes, multi-way control valves are connected between the ends of adjacent cooling pipes, the feed pipe is connected to the inside of the feed pipe through the multi-way control valve, a partition plate is provided at the vertical position inside the cooling pipe, cooling air guiding mechanisms are symmetrically distributed on both sides of the surface of the cooling pipe, and a sealing cover is provided at the end of the cooling pipe.

[0020] Preferably, the heat dissipation and cooling mechanism includes a heat dissipation motor and heat dissipation blades, a guiding frustum is connected to the output shaft of the heat dissipation motor, a guiding spiral groove is circumferentially formed on the surface of the guiding frustum, a traction spring is provided inside the guiding spiral groove near the heat dissipation motor, a guiding sliding seat is connected to the end of the traction spring, and the top surface of the guiding sliding seat abuts against the bottom surface of the heat dissipation blades.

[0021] Preferably, blade diversion grooves are staggered on the back of the heat dissipation blades, a wind guiding platform is provided at the end of the guiding frustum, wind guiding strips are circumferentially distributed on the surface of the wind guiding platform, a fan base is provided outside the heat dissipation motor, and the heat dissipation motor is bolted to the inner wall of the fan base, and the fan base is screwed to the inner surface of the chassis main body.

[0022] Preferably, the energy storage mechanism includes a heat collection plate and an energy storage component, the heat collection plate is located on one side of the heat dissipation and cooling mechanism on the surface of the control main board, an energy heat pipe is connected to the surface of the heat collection plate, an energy storage component is provided on one side of the inner bottom surface of the chassis main body, the top surface of the energy storage component is connected to the bottom end of the energy heat pipe, and heat conduction holes are provided on the surface of the heat collection plate at the position where it coincides with the energy heat pipe.

[0023] Preferably, a chassis backplane is bolted to the front of the chassis main body, cooling connection grooves for engaging with the cooling pipes are formed on the surfaces of the main side of the chassis and the chassis backplane, temperature monitoring components are provided at multiple positions inside the chassis main body, and the temperature monitoring components are electrically connected to both the partition cooling mechanism and the heat dissipation and cooling mechanism.

[0024] Preferably, chassis air guiding main grooves are formed on the surfaces of the back and both sides inside the chassis main body, chassis air guiding arc grooves are symmetrically distributed on both sides of the chassis air guiding main grooves, and the chassis air guiding arc grooves are evenly arranged in an array along the vertical direction of the chassis main body. Both the chassis air guiding arc grooves and the chassis air guiding main grooves are blind grooves with the same groove depth.

[0025] Preferably, electrical components are connected to the surface of the control main board. A connection interface is provided on one side of the outer surface of the chassis main body. A fan-shaped ventilation slot is formed on one side surface of the chassis main body away from the heat dissipation and cooling mechanism, and the fan-shaped ventilation slot is located between adjacent chassis diversion arc slots.

[0026] Preferably, the bottom surface of the cooling pipe is flat and the top surface is arc-shaped. The pipe orifice areas of adjacent cooling pipes are the same. The connection position between the cooling pipe and the multi-way control valve is sealed. One end of the cooling pipe away from the multi-way control valve abuts against the inner wall of the chassis main body.

[0027] Preferably, the cooling air guiding mechanisms on both sides of the same cooling pipe surface are independently controlled, and the cooling air guiding mechanisms on the same side of the same cooling pipe surface are synchronously controlled.

[0028] On the other hand, a cooling system applicable to the above computer chassis is further provided, which includes:

[0029] A heat dissipation and cooling system, by controlling the heat dissipation and cooling mechanism, enables the heat dissipation motor to autonomously adjust the rotation speed according to the temperature monitoring situation of the temperature monitoring component, and while rotating, performs self-adjustment of the torsion angle through the heat dissipation blades to autonomously adjust and guide the air intake volume for adaptation;

[0030] A partition cooling system, partitions the chassis main body through the cooling pipes of the partition cooling mechanism, makes the installation position of the temperature monitoring component correspond to the partition position, and synchronizes the partition situation to the control system for feedback;

[0031] A cooling air guiding system, controls the partition cooling mechanism, analyzes the relationship between the area and the temperature by combining the internal computer algorithm, calculates the position of the cooling pipe and the control rate of the coolant flow in the specified area, controls the opening and closing conditions and the opening and closing rate of the cooling air guiding mechanisms on both sides of the cooling pipe in the specified area, and controls the equipment externally connected to the partition cooling mechanism;

[0032] A temperature monitoring system, monitors the temperature at the edge position of the area after the chassis main body is partitioned, and feeds it back to the partition air guiding system, the heat dissipation and cooling system, and the control system;

[0033] A control system, connects and integrates and controls each system, receives the data of the temperature monitoring system, sets the temperature monitoring threshold, automatically adjusts the states of the cooling air guiding system and the heat dissipation and cooling system, and maintains the stability of the temperature inside the chassis main body.

[0034] Beneficial effects

[0035] The present invention has the following beneficial effects:

[0036] 1. The present invention uses a partitioned cooling mechanism to partition the interior of the chassis main body, cooperates with a temperature monitoring component for temperature monitoring, and cooperates with a multi-way control valve to divert the coolant inside the cooling pipes at various regional positions. After the temperature of the components at a certain position rises, it automatically adjusts to perform centralized cooling and temperature reduction treatment for that position, and combines an internal algorithm to analyze the temperature and the flow rate of the coolant to give the precise parameter relationship between the coolant flow rate and the temperature, achieving targeted cooling and temperature reduction while covering the cooling of the interior of the chassis main body, improving the targeting, and thus quickly cooling the temperature inside the chassis main body.

[0037] 2. The present invention uses a partitioned cooling mechanism to divide the interior of the chassis main body by using cooling pipes, divides the high-heat-generation area and the low-heat-generation area inside the chassis main body, realizes regional space isolation, changes the traditional open design, enables the connection between each internal area to be unaffected, and at the same time can perform targeted cooling and temperature reduction through the cooling pipes, reduces the temperature difference, reduces heat radiation, realizes temperature control and isolation from the internal structure of the chassis main body, reduces the mutual influence of the temperatures between the components inside the chassis main body, thereby reducing the cooling difficulty and improving the cooling efficiency.

[0038] 3. The present invention changes the fixed structure of the traditional cooling fan inside the chassis main body, adopts a heat dissipation and cooling mechanism arranged inside the chassis main body for autonomous adjustment, enables the heat dissipation blades to adjust their own installation angles and torsion angles according to the rotation speed. Thus, when the rotation speed increases, by converting the angle of the heat dissipation blades, the air intake volume of the entire heat dissipation and cooling structure is adjusted, improving the heat dissipation efficiency. Therefore, without changing the volume and installation method of the heat dissipation blades, the air intake volume and the heat dissipation degree are controlled and adjusted to be adapted, with high adaptability, and it is convenient to perform centralized adaptive heat dissipation treatment on the high-heat-generation area inside the chassis main body.

[0039] 4. The present invention interconnects the chassis main bodies through cooling pipes, realizes the interconnection between the chassis main body with a cooling system and the ordinary chassis main body by reserving cooling connection slots on the chassis main body, realizes the sharing of the cooling system and the device, is convenient for cooling and temperature reduction treatment of multiple chassis main bodies centrally when the server is in use, realizes the assembly between the chassis main bodies and the sharing of the cooling systems, saves resources while improving the cooling efficiency of the chassis main body, and improves the direct scalability between the chassis main bodies.

[0040] 5. The present invention sets a separate area inside the chassis main body for energy storage, and adds an energy storage component at the air guiding position of the heat dissipation and cooling mechanism to collect thermal energy, converts the temperature difference into a potential difference through the Seebeck effect, generates electric energy and stores it through the energy storage component, stores it as the standby electric energy inside the chassis main body for emergency use, increases the energy utilization rate, is green and safe, realizes sustainable development, and provides a safety guarantee for the electric energy when the entire chassis main body is in use. Description of the Drawings

[0041] Figure 1 This is the unfolded structure diagram of the main body of the computer chassis of the present invention;

[0042] Figure 2 This is the structure diagram of the chassis main body of the present invention;

[0043] Figure 3 This is the structure diagram of the chassis main body of the present invention;

[0044] Figure 4 This is the internal structure diagram of the chassis main body of the present invention;

[0045] Figure 5 This is the structure diagram of the partition cooling mechanism of the present invention;

[0046] Figure 6 This is the structure diagram of the heat dissipation and cooling mechanism of the present invention;

[0047] Figure 7 This is the partial structure diagram of the heat dissipation and cooling mechanism of the present invention;

[0048] Figure 8 This is the rear structure diagram of the heat dissipation and cooling mechanism of the present invention;

[0049] Figure 9 This is the external connection plane flow guide diagram of the partition cooling mechanism of the present invention;

[0050] Figure 10 This is the internal partition plan view of the chassis main body of the present invention;

[0051] Figure 11 This is the internal partition schematic diagram of the chassis main body of the present invention.

[0052] Among them: 1. Chassis main body; 2. Chassis back panel; 3. Partition cooling mechanism; 301. Feed pipe; 302. Multi-way control valve; 303. Cooling pipe; 304. Partition plate; 305. Cooling air guiding mechanism; 306. Sealing cover; 4. Heat dissipation and cooling mechanism; 401. Fan base; 402. Heat dissipation motor; 403. Guide frustum; 404. Guide screw groove; 405. Traction spring; 406. Heat dissipation blades; 407. Guide sliding seat; 408. Air guiding platform; 409. Air guiding strip; 410. Blade flow guiding groove; 5. Energy storage mechanism; 501. Heat collection plate; 502. Energy heat pipe; 503. Energy storage component; 504. Heat conduction hole; 504. Thermoelectric conversion element; 6. Control main board; 7. Electrical components; 8. Chassis main flow guiding groove; 9. Chassis arc flow guiding groove; 10. Sector ventilation groove; 11. Cooling connection groove; 12. Temperature monitoring component; 13. Connection interface. Specific implementation manner

[0053] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention. Specific Embodiment 1:

[0055] As Figures 1-11 shown, a computer chassis includes a chassis main body 1 and a chassis backplane 2. The chassis backplane 2 is bolted to the front of the chassis main body 1. A control main board 6 is provided inside the chassis main body 1. Electrical components 7 are connected to the surface of the control main board 6. A connection interface 13 is provided on one side of the outer surface of the chassis main body 1. Heat dissipation and cooling mechanisms 4 are installed on both the side of the control main board 6 and the side of the chassis main body 1. An energy storage mechanism 5 is connected to the surface of the heat dissipation and cooling mechanism 4 on the surface of the control main board 6. A partition cooling mechanism 3 is provided inside the chassis main body 1. When the entire device is actually used, the edge of the chassis backplane 2 is fitted to the surface of the chassis main body 1 through screws or bolts to maintain the entire covering environment outside the chassis main body 1 and prevent internal components from being directly exposed to the external air environment. In addition to installing the control main board 6 and electrical components 7 inside the chassis main body 1, it is also necessary to install a partition cooling structure, a heat dissipation and cooling mechanism 4, an energy storage mechanism 5, and a temperature monitoring component 12. After installation, the partition cooling structure partitions the inside of the chassis and performs a covering and targeted cooling and temperature reduction treatment inside the chassis main body 1 in combination with the temperature monitoring component 12 according to the partition structure. The heat dissipation and cooling mechanism 4 performs auxiliary cooling and temperature reduction. The energy storage mechanism 5 conducts the heat energy at the position of the heat dissipation and cooling mechanism 4 in the high heat generation area of the entire chassis main body 1, converts the heat energy into electrical energy, and stores it inside the energy storage mechanism 5 for use as a backup power source.

[0056] When partitioning the internal area of the chassis main body 1 during use, it is generally selected to be divided according to the installation positions of devices such as the control main board 6 and electrical components 7 and the heat generation conditions during use. The inside of the chassis main body 1 is divided into a high heat generation area and a low heat generation area. One set is provided on each of the top and bottom surfaces of the chassis main body 1 with the cooling pipe 303 as the area edge for spatial division in the area. After division, the cooling pipe 303 with the corresponding length is assembled with the multi-way control valve 302 of the corresponding channel. If it is divided into four areas, the multi-way control valve 302 can select an eight-way valve or a four-way valve. After the area division, the temperature monitoring component 12 is installed according to the area division result. After installation, the partition situation and the installation situation of the temperature monitoring component 12 are synchronized to the control system to complete the area division and area monitoring inside the chassis main body 1. The number and position of the area division can be adjusted according to the actual use situation inside the chassis main body 1.

[0057] When installing the heat dissipation and cooling mechanism 4, the cooling pipe 303 and the chassis main body 1 can select corresponding installation methods according to actual usage requirements. For example, methods such as direct surface fitting, installation through a hoop, and installation by setting a clamping groove can be adopted. Any reasonable existing installation method can be used inside the chassis main body 1 to complete the end fixing of the cooling pipe 303 and the inner wall of the chassis main body 1, and maintain the stability of the cooling pipe 303.

[0058] During actual use, the temperature monitoring component 12 is generally composed of multiple temperature sensing patches. The control system connects and controls multiple temperature sensing patches through the MCU, and adjusts the numerical values of the temperature monitoring threshold and range of the temperature sensing patches through the control system. For the convenience of installation, the temperature sensing patches are installed and connected by a wireless bonding method. Each temperature sensing patch has a corresponding number. After bonding, the temperature sensing patches are positioned in the control system to form a spatial installation area, which is convenient for the control system to adaptively adjust and integrate the positions of the partitioned temperature sensing patches, and is convenient for adapting to the targeted cooling of the partitioned cooling system. Specific Embodiment Two:

[0060] As Figures 1-11 shown, when performing targeted cooling of the area, it is mainly realized through the partitioned cooling mechanism 3. The specific structure is that the partitioned cooling mechanism 3 includes a feed pipe 301 and cooling pipes 303. There are multiple groups of cooling pipes 303. A multi-way control valve 302 is connected between the ends of adjacent cooling pipes 303. The feed pipe 301 is internally connected to the feed pipe 301 through the multi-way control valve 302. A partition plate 304 is provided at the vertical position inside the cooling pipe 303. Cooling air guiding mechanisms 305 are symmetrically distributed on both sides of the surface of the cooling pipe 303. A sealing cover 306 is provided at the end of the cooling pipe 303. Coolant enters through the feed pipe 301, and the opening and closing of each cooling pipe 303 are adjusted and controlled through the multi-way control valve 302. The partition plate 304 divides the two regions inside the cooling pipe 303, so that the cooling pipe 303 can perform independent targeted cooling treatments on the two sides without interference. The end of the cooling pipe 303 is sealed by the sealing cover 306 to prevent coolant leakage. At the same time, the bottom surface of the cooling pipe 303 is flat, the top surface is arc-shaped, the pipe orifice areas of adjacent cooling pipes 303 are the same, and the connection position between the cooling pipe 303 and the multi-way control valve 302 is sealed. The end of the cooling pipe 303 away from the multi-way control valve 302 abuts against the inner wall of the chassis main body 1. When performing cooling and temperature reduction, in the attached drawing Figure 11Taking the partition of [partition name] as an example, the entire chassis main body 1 is divided into four regions A, B, C, and D by the cooling pipes 303. The four cooling pipes 303 are connected by an eight-way multi-way control valve 302. Since there are two channels inside each cooling pipe 303 separated by the partition plate 304, when assembling the four cooling pipes 303, in order to facilitate targeted control of each channel, an eight-way multi-way control valve 302 is selected for connection. As Figure 11 shown, when it is monitored that the temperature in area A is too high and exceeds the set threshold, the multi-way control valve 302 injects the coolant into the inner side channels of the AD pipe and the AB pipe in area A by opening the valve ports at the corresponding A1 and A2 positions. Through the operation of the cooling air guiding structure on the surface of the cooling pipe 303, the air inside the coolant is driven to exchange heat with the air inside area A, realizing centralized cooling. By controlling the inlet rate and inlet volume of the coolant, the cooling efficiency of area A is controlled, achieving centralized control when the temperature in area A is too high. By adopting this method, targeted cooling and temperature reduction treatment of the partitioned areas inside the chassis main body 1 can be realized. Using this cooling principle, the control method and positioning method for other partition conditions inside the chassis main body 1 are the same. The specific partition conditions and positioning positions can be selected according to the actual use scenario.

[0061] Furthermore, when the cooling pipe 303 of the partition cooling mechanism 3 is cooling and reducing the temperature, in addition to the coolant provided inside, in order to improve the cooling effect, a cooling air guiding structure is arranged on the side of the cooling pipe 303 for heat exchange. The specific structure is that the cooling air guiding mechanisms 305 on both sides of the surface of the same cooling pipe 303 are independently controlled, and the cooling air guiding mechanisms 305 on the same side of the surface of the same cooling pipe 303 are synchronously controlled. The cooling air guiding mechanism 305 is mainly used to blow out the cold air of the coolant inside the cooling pipe 303 through air cooling and exchange heat with the air inside the area, thereby realizing temperature reduction. Therefore, according to the use scenario and method of the cooling air guiding structure, the specific structure of the cooling air guiding mechanism 305 in actual use can be the existing fan structure inside the chassis main body 1. To improve the cooling efficiency of the cooling air guiding structure, the cooling air guiding mechanism 305 can adopt the same structure as the heat dissipation cooling mechanism 4. By using this structure, in actual use, the rotation speed of the cooling air guiding mechanism 305 can be directly controlled, and at the same time, the torsion angle can be automatically adjusted through the heat dissipation blades 406 during rotation to adjust the air intake volume. The specific structure type of the cooling air guiding structure is selected according to the actual use requirements and construction difficulty. Generally, an electric control structure is selected for easy one-key opening and closing. Specific Embodiment Three:

[0063] To increase the scalability during the use of the entire chassis main body 1 and the sharing of the cooling system, cooling connection grooves 11 for engaging with the cooling pipes 303 are provided on the main side surface of the chassis and the surface of the chassis backplane 2. Temperature monitoring components 12 are provided at multiple positions inside the chassis main body 1, and the temperature monitoring components 12 are electrically connected to both the partition cooling mechanism 3 and the heat dissipation cooling mechanism 4. After removing the sealing cap 306 at the end of the cooling pipe 303, a new cooling pipe 303 or other pipes are inserted between adjacent cooling connection grooves 11 to connect two chassis main bodies 1, so that the cooling pipes 303 inside one chassis main body 1 can be interconnected with the internal space of another chassis main body 1. After connection, the end is kept sealed. The inside of the other chassis main body 1 can be cooled by the cooling air guiding mechanism 305 on the surface of the newly connected cooling pipe 303. The cooling connection grooves 11 can be used for direct plugging and sealing between adjacent chassis main bodies 1 through the cooling pipes 303. Adjacent chassis main bodies 1 are interconnected through the cooling pipes 303. By reserving the cooling connection grooves 11 on the chassis main body 1, the interconnection between the chassis main body 1 with a cooling system and the ordinary chassis main body 1 is realized, the sharing of the cooling system and device is achieved, which is convenient for centrally cooling multiple chassis main bodies 1 during the use of the server, realizes the assembly between the chassis main bodies 1 and the sharing between the cooling systems, saves resources while improving the cooling efficiency of the chassis main body 1, and improves the scalability between the chassis main bodies 1.

[0064] Meanwhile, for local heat dissipation inside the chassis main body 1, auxiliary heat dissipation and temperature reduction are carried out through the heat dissipation and cooling mechanism 4. The specific structure is that the heat dissipation and cooling mechanism 4 includes a heat dissipation motor 402 and heat dissipation blades 406. A guiding frustum 403 is connected to the output shaft of the heat dissipation motor 402. Guiding spiral grooves 404 are circumferentially formed on the surface of the guiding frustum 403 to guide the movement of the heat dissipation blades 406, optimize the air duct, and enhance the guiding effect of the wind force. A traction spring 405 is arranged inside one end of the guiding spiral groove 404 close to the heat dissipation motor 402. The end of the traction spring 405 is connected to a guiding sliding seat 407. The top surface of the guiding sliding seat 407 abuts against the bottom surface of the heat dissipation blade 406. The heat dissipation motor 402 serves as the driving force for driving the heat dissipation blades 406. In actual use, it can be replaced with any motor of a suitable model. The heat dissipation motor 402 drives the heat dissipation blades 406 on its surface to rotate through the guiding frustum 403, realizes the diversion of the wind, and realizes the exchange of air. The guiding frustum 403 adopts a trapezoidal frustum structure, and the cross-section of the guiding frustum 403 at one end close to the heat dissipation motor 402 is smaller than that at the other end. In actual use, when the heat dissipation motor 402 rotates, it drives the guiding frustum 403 to rotate, and the heat dissipation blades 406 rotate synchronously. Under the action of the traction force, the guiding sliding seat 407 drives the heat dissipation blades 406 to slide inside the guiding spiral groove 404 towards one end of the air guiding platform 408. The traction spring 405 maintains the traction on the guiding sliding seat 407. As the rotational speed increases, the traction force on the edge of the heat dissipation blades 406 increases, driving the heat dissipation blades 406 to move. The heat dissipation blades 406 follow the shape of the guiding spiral groove 404, and the torsion angle of their own changes. As the angle deflects, the air intake volume of the entire heat dissipation blade 406 changes. When the rotational speed of the heat dissipation motor 402 decreases, the traction force becomes smaller, and under the action of the traction spring 405 again, the heat dissipation blades 406 gradually return to the initial position, thereby realizing the adjustment of the torsion angle of the heat dissipation blades 406, realizing the adjustment of the air intake volume, improving the heat dissipation efficiency, and thus controlling and adjusting the air intake volume and heat dissipation degree to be adapted without changing the volume and installation method of the heat dissipation blades 406, with high adaptability and being convenient for centralized adaptive heat dissipation treatment of the high-heat generation area inside the chassis main body 1.

[0065] To improve the heat dissipation effect and regulate the air volume guided by the entire heat dissipation and cooling mechanism 4, blade diversion grooves 410 are staggeredly distributed on the back of the heat dissipation fins 406, which helps to more effectively disperse and guide the air flow, improve the heat dissipation efficiency. A wind guiding platform 408 is provided at the end of the guiding frustum 403, and wind guiding strips 409 are circumferentially distributed on the surface of the wind guiding platform 408. An external fan base 401 is provided for the heat dissipation motor 402, and the heat dissipation motor 402 is bolted to the inner wall of the fan base 401. The fan base 401 is screwed to the inner surface of the main chassis body 1. The wind speed during rotation is guided through the diversion grooves on the back of the heat dissipation fins 406, facilitating the rapid diffusion of the air volume. The air volume brought out by the heat dissipation fins 406 is gathered by the wind guiding platform 408, and the air volume on the surface of the heat dissipation fins 406 is gathered through the cooperation of the wind guiding strips 409 and the wind guiding platform 408, facilitating the collection of heat energy for the energy storage mechanism 5. Specific Embodiment Four:

[0067] To improve the energy utilization rate of the entire device, an energy storage mechanism 5 is provided to convert the released heat energy. Specifically, the energy storage mechanism 5 includes a heat collection plate 501 and an energy storage component 503. The heat collection plate 501 is located on one side of the heat dissipation and cooling mechanism 4 on the surface of the control main board 6. An energy heat pipe 502 is connected to the surface of the heat collection plate 501. An energy storage component 503 is provided on one side of the inner bottom surface of the main chassis body 1. The top surface of the energy storage component 503 is connected to the bottom end of the energy heat pipe 502. A heat conduction hole 504 is provided on the surface of the heat collection plate 501 at the position where it coincides with the energy heat pipe 502. A thermoelectric conversion element is provided at the connection position between the energy storage component 503 and the energy heat pipe 502 for converting heat energy. The heat collection plate 501 conducts and collects the hot air emitted by the heat dissipation and cooling mechanism 4 in the high-heat generation area. A separate area is set inside the main chassis body 1 for energy storage, and an energy storage mechanism 5 is added at the air guiding position of the heat dissipation and cooling mechanism 4 to collect heat energy. The temperature difference is converted into an electric potential difference through the Seebeck effect to generate electric energy, which is stored through the energy storage component 503, stored as backup electric energy inside the main chassis body 1 for emergency use, increasing the energy utilization rate, being green and safe, and achieving sustainable development, providing a safety guarantee for the electric energy used by the entire main chassis body 1.

[0068] Further, to improve the air guiding effect and cooling efficiency during the internal use of the entire chassis main body 1, chassis guiding main grooves 8 are provided on the surfaces of the back and both sides inside the chassis main body 1. Chassis guiding arc grooves 9 are symmetrically distributed on both sides of the chassis guiding main grooves 8, and the chassis guiding arc grooves 9 are evenly arranged in an array along the vertical direction of the chassis main body 1. Both the chassis guiding arc grooves 9 and the chassis guiding main grooves 8 are blind grooves with the same groove depth. By setting the chassis guiding main grooves 8 and the chassis guiding arc grooves 9 to guide the air passing through the inner wall of the chassis main body 1, the control of the flow rate is achieved, and the contact area between the air volume and the inner wall of the chassis main body 1 is increased, thereby improving the cooling effect. At the same time, a fan-shaped ventilation groove 10 is provided on the surface of the side of the chassis main body 1 away from the heat dissipation and cooling mechanism 4, and the fan-shaped ventilation groove 10 is located between adjacent chassis guiding arc grooves 9. By setting the fan-shaped ventilation groove 10 for direct ventilation and heat dissipation in the physical structure, and setting the fan-shaped ventilation groove to correspond and match the shape of the surface chassis guiding arc grooves 9, the rapid flow of gas is facilitated, thereby improving the cooling effect. Specific Embodiment Five:

[0070] This embodiment provides a cooling system applicable to the computer chassis described in any one of Embodiments One to Four, which includes the following:

[0071] A heat dissipation and cooling system, by controlling the heat dissipation and cooling mechanism 4, enables the heat dissipation motor 402 to autonomously adjust the rotation speed according to the temperature monitoring situation of the temperature monitoring component 12, and while rotating, perform self-adjustment of the torsion angle through the heat dissipation blades 406 to autonomously adjust and guide the air intake volume for adaptation;

[0072] A partition cooling system, through the cooling pipes 303 of the partition cooling mechanism 3, partitions the chassis main body 1, and makes the installation position of the temperature monitoring component 12 correspond to the partition position, and synchronizes the partition situation to the control system for feedback;

[0073] A cooling air guiding system, controls the partition cooling mechanism 3, analyzes the relationship between the area and the temperature by combining the internal computer algorithm, calculates the position of the cooling pipes 303 in the specified area and the control rate of the coolant flow rate, controls the opening and closing situation and the opening and closing rate of the cooling air guiding mechanisms 305 on both sides of the cooling pipes 303 in the specified area, and controls the equipment externally connected to the partition cooling mechanism 3;

[0074] A temperature monitoring system, monitors the temperature at the edge positions of the areas after the chassis main body 1 is partitioned, and feeds it back to the partition air guiding system, the heat dissipation and cooling system, and the control system;

[0075] A control system, connects, integrates, and controls each system, receives the data of the temperature monitoring system, sets the temperature monitoring threshold, automatically adjusts the states of the cooling air guiding system and the heat dissipation and cooling system, and maintains the stability of the temperature inside the chassis main body 1.

[0076] For the cooling control system of the chassis main body 1, the specific algorithm content is as follows:

[0077] Cooling air guiding system: Controls the partition cooling mechanism 3. According to the internal computer algorithm to analyze the relationship between the area and the temperature, calculates the position of the cooling pipe 303 and the flow control rate, and controls the opening and closing situation and the opening and closing rate of the cooling air guiding mechanism 305.

[0078] Temperature monitoring system: Monitors the temperature at the edge positions of the areas after partitioning the chassis main body 1, and feeds back the data to the heat dissipation cooling system and the control system;

[0079] Control system: Centralizes and integrates the functions of all the above systems, receives the temperature monitoring data, sets the temperature monitoring threshold, and automatically adjusts the states of other systems to ensure the stability of the temperature inside the chassis.

[0080] Heat dissipation adjustment algorithm: According to the data of the temperature monitoring component 12, dynamically adjusts the rotation speed of the heat dissipation motor 402 and the torsion angle of the heat dissipation fins 406 to adapt to the real-time cooling requirements inside the chassis main body 1.

[0081] The automatic adjustment of the torsion angle and rotation speed of the heat dissipation fins 406 enables the air intake volume to be optimized according to the change of the internal temperature, achieving more efficient heat dissipation.

[0082] This algorithm aims to automatically adjust the rotation speed and angle of the heat dissipation fins 406 according to the feedback of the temperature sensor.

[0083] Rotation speed adjustment formula:

[0084]

[0085] Where:

[0086] R is the rotation speed of the heat dissipation motor 402;

[0087] R min and R max are the minimum and maximum rotation speeds of the heat dissipation motor 402;

[0088] T current is the current temperature;

[0089] T min and T max are the set minimum and maximum temperature thresholds.

[0090] Heat dissipation fin 406 angle adjustment formula:

[0091]

[0092] Where:

[0093] θ is the twist angle of the heat dissipation fin 406;

[0094] θ min and θ max are the minimum and maximum angles of the heat dissipation fin 406.

[0095] The rotation speed of the fan and the angle of the heat dissipation fin 406 are adjusted according to the current temperature relative to the preset temperature threshold by the linear interpolation method. When the temperature rises, the rotation speed and the angle increase, thereby improving the cooling efficiency.

[0096] Partition control algorithm: The partition cooling system automatically adjusts the multi-way control valve 302 of the cooling pipe 303 in each area according to the temperature monitoring data of each area, and precisely controls the amount and rate of the coolant entering each area to ensure precise regional cooling.

[0097] Cooling air guide control algorithm: According to the needs of the regional temperature and the coolant flow rate, the opening and closing of the cooling air guide mechanism 305 are controlled to optimize the cooling effect and reduce energy consumption.

[0098] Coolant flow control algorithm: This algorithm is used to control the multi-way control valve 302 to optimize the distribution of the coolant and ensure the efficiency of regional cooling.

[0099] Flow adjustment formula:

[0100] F = F base ×(1 + k×(T target - T current ))

[0101] Where:

[0102] F is the coolant flow rate entering a specific area;

[0103] F base is the basic flow rate setting;

[0104] T target is the target temperature setting;

[0105] T current is the current temperature,

[0106] k is the flow adjustment coefficient, which is used to enhance or weaken the response.

[0107] This formula adjusts the flow rate according to the difference between the target temperature and the current temperature to achieve a balance between rapid response and efficiency. If the current temperature is higher than the target temperature, the flow rate will increase to enhance the cooling effect.

[0108] The combination of these systems and algorithms not only improves the cooling efficiency but also increases the adaptive ability of the system, enabling it to automatically adjust the cooling strategy according to changes in internal conditions and achieve a better energy efficiency ratio. Specific Embodiment Six:

[0110] As Figure 9 shown, when the partition cooling mechanism 3 is actually used, the end of the feed pipe 301 is connected to an external coolant storage tank, and power is provided by an external water pump. The discharged coolant is cooled by a condenser or a heat sink and then flows back into the coolant storage tank for recycling.

[0111] During actual use, the cooling air guiding mechanism 305 on the surface of the cooling pipe 303 isolates the water flow, and a film is provided to prevent the water flow from overflowing. It conducts air but not liquid, facilitating air flow exchange.

[0112] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising a reference structure" does not exclude the existence of additional identical elements in the process, method, article or device comprising the element.

[0113] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A computer case, comprising a case body (1) and a case back plate (2), characterized in that: A control main board (6) is provided inside the chassis body (1), and heat dissipation cooling mechanisms (4) are installed on the sides of the control main board (6) and the chassis body (1). The heat dissipation cooling mechanism (4) on the surface of the control main board (6) is connected to an energy storage mechanism (5). A partition cooling mechanism (3) is provided inside the chassis body (1), and the partition cooling mechanism (3) comprises a feed pipe (301) and a cooling pipe (303). The cooling pipe (303) is provided with a plurality of groups, and a multi-way control valve (302) is connected between the ends of adjacent cooling pipes (303). The feed pipe (301) is connected to the inside of the feed pipe (301) through the multi-way control valve (302). A partition plate (304) is provided at a vertical position inside the cooling pipe (303). Cooling air guide mechanisms (305) are symmetrically distributed on both sides of the surface of the cooling pipe (303), and a sealing cover (306) is provided at the end of the cooling pipe (303); The energy storage mechanism (5) comprises a heat collecting plate (501) and an energy storage component (503); the heat collecting plate (501) is located on one side of the heat dissipation and cooling mechanism (4) on the surface of the control main board (6); and the surface of the heat collecting plate (501) is connected to an energy heat pipe (502); an energy storage component (503) is provided on one side of the bottom surface of the interior of the chassis body (1); the top surface of the energy storage component (503) is connected to the bottom end of the energy heat pipe (502); a heat conduction hole (504) is provided on the surface of the heat collecting plate (501) at a position where the surface and the energy heat pipe (502) overlap; a thermoelectric conversion element is provided at a position where the energy storage component (503) and the energy heat pipe (502) are connected, for converting thermal energy; the heat collecting plate (501) conducts and collects hot air emitted by the heat dissipation and cooling mechanism (4) in a high-heating zone; the thermoelectric conversion element converts a temperature difference into an electric potential difference through the Seebeck effect, and stores the electric potential difference through the energy storage component (503); The chassis body (1) is bolted to a chassis back plate (2) on the front, and the main side surface of the chassis and the surface of the chassis back plate (2) are provided with cooling connection grooves (11) that engage with the cooling pipe (303). Temperature monitoring components (12) are provided at multiple positions inside the chassis body (1), and the temperature monitoring components (12) are electrically connected to the partition cooling mechanism (3) and the heat dissipation cooling mechanism (4).

2. The computer case according to claim 1, characterized in that: The heat dissipation cooling mechanism (4) comprises a heat dissipation motor (402) and heat dissipation blades (406); the output shaft of the heat dissipation motor (402) is connected to a guide truncated platform (403); a guide screw groove (404) is provided on the circumference of the surface of the guide truncated platform (403); a traction spring (405) is provided inside the end of the guide screw groove (404) close to the heat dissipation motor (402); a guide slide seat (407) is connected to the end of the traction spring (405); and the top surface of the guide slide seat (407) is against the bottom surface of the heat dissipation blade (406).

3. The computer case according to claim 2, wherein: The back of the heat dissipation blade (406) is provided with blade guide grooves (410) in a staggered manner, the end of the guide truncated platform (403) is provided with an air guide platform (408), the surface of the air guide platform (408) is provided with air guide strips (409) distributed around the circumference, the outside of the heat dissipation motor (402) is provided with a fan base (401), the heat dissipation motor (402) is bolted to the inner wall of the fan base (401), and the fan base (401) is screwed to the inner surface of the chassis body (1).

4. The computer case according to claim 1, wherein: The chassis main body (1) is provided with a chassis flow guide main groove (8) on the inner back and both side surfaces, and chassis flow guide arc grooves (9) are symmetrically distributed on both sides of the chassis flow guide main groove (8), and the chassis flow guide arc grooves (9) are evenly distributed in an array along the vertical direction of the chassis main body (1), and the chassis flow guide arc grooves (9) and the chassis flow guide main groove (8) are both blind grooves with the same groove depth.

5. The computer case according to claim 4, characterized in that: The control mainboard (6) is connected to an electrical component (7) on its surface, a connection interface (13) is provided on one side of the outer surface of the chassis body (1), and a fan-shaped ventilation groove (10) is provided on the side of the chassis body (1) away from the heat dissipation cooling mechanism (4), and the fan-shaped ventilation groove (10) is located between adjacent chassis guide arc grooves (9).

6. The computer case according to claim 1, wherein: The bottom surface of the cooling pipe (303) is a plane, and the top surface is an arc surface. The areas of the pipe openings of adjacent cooling pipes (303) are the same. The connection position between the cooling pipe (303) and the multi-way control valve (302) is sealed. The end of the cooling pipe (303) away from the multi-way control valve (302) abuts against the inner wall of the chassis body (1).

7. The computer case according to claim 1, wherein: The cooling air guide mechanisms (305) on both sides of the surface of the same cooling tube (303) are independently controlled, and the cooling air guide mechanisms (305) on the same side of the surface of the same cooling tube (303) are synchronously controlled.

8. A cooling system suitable for a computer case according to any one of claims 1 to 7, characterized in that: include: The heat dissipation cooling system controls the heat dissipation cooling mechanism (4) so ​​that the heat dissipation motor (402) autonomously adjusts the rotation speed according to the temperature monitoring condition of the temperature monitoring component (12), and autonomously adjusts the torsion angle through the heat dissipation blades (406) while rotating, thereby autonomously adjusting and guiding the air intake volume; A partition cooling system is used to partition the chassis body (1) through cooling pipes (303) of a partition cooling mechanism (3), and the installation position of the temperature monitoring component (12) corresponds to the partition position, and the partition situation is synchronously fed back to the control system; The cooling air guide system controls the partition cooling mechanism (3), analyzes the relationship between the zone and the temperature in combination with an internal computer algorithm, calculates the position of the cooling pipe (303) and the coolant flow control rate of the specified zone, controls the opening and closing conditions and opening and closing rates of the cooling air guide mechanism (305) on both sides of the cooling pipe (303) of the specified zone, and regulates the equipment connected to the outside of the partition cooling mechanism (3); A temperature monitoring system monitors the temperature of the edge of the partitioned area of ​​the chassis body (1) and feeds back the temperature to the partitioned air guide system, the heat dissipation cooling system and the control system; The control system connects, integrates and regulates various systems, receives data from the temperature monitoring system, sets temperature monitoring thresholds, and automatically adjusts the status of the cooling air guide system and the heat dissipation cooling system to maintain the internal temperature of the chassis body (1) stable.

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