Design parameter method, device, computer equipment and storage medium

Abstract

The present disclosure relates to a design parameter determination method and device, computer equipment and storage medium. The method comprises: setting different groups of design parameters based on an initial layout and a process file of the initial layout, each group of design parameters comprising layout parameters and process parameters, the layout parameters comprising position parameters and size parameters of process layers in the initial layout, and the process parameters comprising at least one of thickness parameters and dielectric constant of the process layers in the process file; extracting a parasitic parameter corresponding to each group of design parameters based on the groups of design parameters, the parasitic parameter comprising a capacitance parameter and a resistance parameter; performing simulation based on the groups of parasitic parameters to obtain a simulation result corresponding to each group of parasitic parameters; and determining target design parameters from the groups of design parameters based on the simulation results. The method reduces the number of iterations, can obtain the target design parameters faster, and improves the efficiency of layout design and process design.

Description

Technical Field

[0001] This disclosure relates to the field of automated design of integrated circuits, and specifically to a method, apparatus, computer device, and storage medium for determining design parameters. Background Technology

[0002] In flat panel display layout design, parasitic parameters need to be extracted to determine the load on pixel voltages or touch signals. After extraction, subsequent simulation processes are used to determine the rationality of the layout and process parameters. If inappropriate settings are found, the layout and process parameters must be continuously adjusted, and parasitic parameter extraction and simulation are repeated until the final layout and process parameters are obtained. Obtaining the final layout and process parameters often involves a relatively long parameter extraction and subsequent simulation iteration cycle, resulting in low efficiency in layout and process design. Summary of the Invention

[0003] To overcome the problems existing in related technologies, this disclosure provides a method, apparatus, computer equipment, and storage medium for determining design parameters.

[0004] According to a first aspect of the present disclosure, a method for determining design parameters is provided, the method comprising:

[0005] Based on the initial layout and the process file of the initial layout, multiple sets of different design parameters are set. Each set of design parameters includes layout parameters and process parameters. The layout parameters include the position parameters and size parameters of the process layer in the initial layout. The process parameters include at least one of the thickness parameters and dielectric constant of the process layer in the process file.

[0006] Based on the multiple sets of design parameters, the parasitic parameters corresponding to each set of design parameters are extracted. The parasitic parameters include capacitance parameters and resistance parameters.

[0007] Simulations were performed based on multiple sets of parasitic parameters, and simulation results were obtained for each set of parasitic parameters.

[0008] Based on multiple simulation results, the target design parameters are determined from multiple sets of design parameters.

[0009] In some embodiments, the setting of multiple sets of design parameters based on the initial layout and the process document of the initial layout includes:

[0010] Based on the process layer in the initial layout, multiple sets of different layout parameters are set, and each set of layout parameters includes the layout parameters of at least one process layer in the initial layout.

[0011] Based on the process layer in the process file, set different sets of process parameters, each set of process parameters including layout parameters of at least one process layer in the process file.

[0012] Based on the multiple sets of layout parameters and the multiple sets of process parameters, the multiple sets of design parameters are determined.

[0013] In some embodiments, the process of setting the layout parameters of the process layer in the initial layout or the process parameters of the process layer in the process file includes:

[0014] Determine the parameter setting type of the target process layer. The parameter setting type includes a first type or a second type. The first type is used to indicate a parameter setting method that includes a start parameter, an end parameter, and a step size parameter. The second type is used to indicate a parameter setting method that includes multiple parameters, and the multiple parameters are separated by a separator.

[0015] When the parameter setting type is the first type, the parameters of the target process layer are set based on the parameter setting method indicated by the first type;

[0016] When the parameter setting type is the second type, the parameters of the target process layer are set based on the parameter setting method indicated by the second type;

[0017] Wherein, when the target process layer is any process layer in the initial layout, the parameters of the target process layer are layout parameters; when the target process layer is any process layer in the process file, the parameters of the target process layer are process parameters.

[0018] In some embodiments, the method further includes:

[0019] Determine the parameter mode of each process layer in the initial layout and the parameter mode of each process layer in the process file. The parameter mode includes a first mode, a second mode, a third mode, or a fourth mode. The first mode is used to indicate that the parameters set for the process layer can be combined with other parameters. The second mode is used to indicate that the parameters set for the process layer cannot be used to adjust the initial layout. The third mode is used to indicate that multiple parameters set for the process layer are combined with other parameters in sequence. The fourth mode is used to indicate that the parameters set for the process layer cannot be combined with other parameters.

[0020] The determination of the multiple sets of design parameters based on the multiple sets of layout parameters and the multiple sets of process parameters includes:

[0021] Based on the multiple sets of layout parameters, the multiple sets of process parameters, the parameter patterns of each process layer in the initial layout, and the parameter patterns of each process layer in the process file, the multiple sets of design parameters are determined.

[0022] In some embodiments, determining the multiple sets of design parameters based on the multiple sets of layout parameters, the multiple sets of process parameters, the parameter patterns of each process layer in the initial layout, and the parameter patterns of each process layer in the process file includes:

[0023] When the parameter mode of the first process layer in the initial layout is the fourth mode, the design parameters are determined based on the layout parameters of the first process layer, where the first process layer is any process layer in the initial layout.

[0024] When the parameter mode of the second process layer in the process file is the fourth mode, the design parameters are determined based on the process parameters of the second process layer, where the second process layer is any process layer in the process file;

[0025] When the parameter mode of the process layer in the initial layout is the first mode or the third mode, and the parameter mode of the process parameters in the process file is the first mode or the third mode, at least one set of design parameters is determined based on the layout parameters of the process layer in the initial layout and the process parameters of the process layer in the process file.

[0026] In some embodiments, the method further includes:

[0027] Set multiple sets of voltage parameters for the liquid crystal layer;

[0028] The determination of the multiple sets of design parameters based on the multiple sets of layout parameters and the multiple sets of process parameters includes:

[0029] Based on the multiple sets of layout parameters, the multiple sets of process parameters, and the multiple sets of voltage parameters, the multiple sets of design parameters are determined.

[0030] In some embodiments, the setting of multiple sets of design parameters based on the initial layout and the process document of the initial layout includes:

[0031] Determine the target area in the initial layout;

[0032] Based on the process layer in the target area, multiple sets of different layout parameters are set.

[0033] In some embodiments, after performing simulations based on multiple sets of parasitic parameters to obtain simulation results corresponding to each set of parasitic parameters, the method further includes:

[0034] The simulation results corresponding to each set of parasitic parameters are saved separately to obtain the simulation result file corresponding to each simulation result. The simulation result file is named based on the design parameters corresponding to the simulation results.

[0035] According to a second aspect of the present disclosure, a design parameter determining apparatus is provided, the apparatus comprising:

[0036] The parameter setting module is configured to set multiple sets of design parameters based on the initial layout and the process file of the initial layout. Each set of design parameters includes layout parameters and process parameters. The layout parameters include the position parameters and size parameters of the process layer in the initial layout. The process parameters include at least one of the thickness parameters and dielectric constant of the process layer in the process file.

[0037] The parasitic parameter extraction module is configured to extract parasitic parameters corresponding to each set of design parameters based on the multiple sets of design parameters, wherein the parasitic parameters include capacitance parameters and resistance parameters;

[0038] The simulation module is configured to perform simulations based on multiple sets of parasitic parameters, and obtain simulation results corresponding to each set of parasitic parameters;

[0039] The design parameter determination module is configured to determine the target design parameters from multiple sets of design parameters based on multiple simulation results.

[0040] In some embodiments, the parameter setting module is configured to:

[0041] Based on the process layer in the initial layout, multiple sets of different layout parameters are set, and each set of layout parameters includes the layout parameters of at least one process layer in the initial layout.

[0042] Based on the process layer in the process file, set different sets of process parameters, each set of process parameters including layout parameters of at least one process layer in the process file.

[0043] Based on the multiple sets of layout parameters and the multiple sets of process parameters, the multiple sets of design parameters are determined.

[0044] In some embodiments, the process of setting the layout parameters of the process layer in the initial layout or the process parameters of the process layer in the process file includes:

[0045] Determine the parameter setting type of the target process layer. The parameter setting type includes a first type or a second type. The first type is used to indicate a parameter setting method that includes a start parameter, an end parameter, and a step size parameter. The second type is used to indicate a parameter setting method that includes multiple parameters, and the multiple parameters are separated by a separator.

[0046] When the parameter setting type is the first type, the parameters of the target process layer are set based on the parameter setting method indicated by the first type;

[0047] When the parameter setting type is the second type, the parameters of the target process layer are set based on the parameter setting method indicated by the second type;

[0048] Wherein, when the target process layer is any process layer in the initial layout, the parameters of the target process layer are layout parameters; when the target process layer is any process layer in the process file, the parameters of the target process layer are process parameters.

[0049] In some embodiments, the apparatus further includes:

[0050] The parameter mode determination module is configured to determine the parameter mode of each process layer in the initial layout and the parameter mode of each process layer in the process file. The parameter mode includes a first mode, a second mode, a third mode, or a fourth mode. The first mode is used to indicate that the parameters set for the process layer can be combined with other parameters. The second mode is used to indicate that the parameters set for the process layer cannot be used to adjust the initial layout. The third mode is used to indicate that multiple parameters set for the process layer are combined with other parameters in sequence. The fourth mode is used to indicate that the parameters set for the process layer cannot be combined with other parameters.

[0051] The parameter setting module is configured to determine the multiple sets of design parameters based on the multiple sets of layout parameters, the multiple sets of process parameters, the parameter mode of each process layer in the initial layout, and the parameter mode of each process layer in the process file.

[0052] In some embodiments, the parameter setting module is configured to:

[0053] When the parameter mode of the first process layer in the initial layout is the fourth mode, the design parameters are determined based on the layout parameters of the first process layer, where the first process layer is any process layer in the initial layout.

[0054] When the parameter mode of the second process layer in the process file is the fourth mode, the design parameters are determined based on the process parameters of the second process layer, where the second process layer is any process layer in the process file;

[0055] When the parameter mode of the process layer in the initial layout is the first mode or the third mode, and the parameter mode of the process parameters in the process file is the first mode or the third mode, at least one set of design parameters is determined based on the layout parameters of the process layer in the initial layout and the process parameters of the process layer in the process file.

[0056] In some embodiments, the apparatus further includes:

[0057] The voltage parameter setting module is configured to set multiple sets of voltage parameters for the liquid crystal layer;

[0058] The parameter setting module is configured to determine the multiple sets of design parameters based on the multiple sets of layout parameters, the multiple sets of process parameters, and the multiple sets of voltage parameters.

[0059] In some embodiments, the parameter setting module is configured to:

[0060] Determine the target area in the initial layout;

[0061] Based on the process layer in the target area, multiple sets of different layout parameters are set.

[0062] In some embodiments, the apparatus further includes:

[0063] The simulation result saving module is configured to save the simulation results corresponding to each set of parasitic parameters, obtain the simulation result file corresponding to each simulation result, and name the simulation result file based on the design parameters corresponding to the simulation result.

[0064] According to a third aspect of the present disclosure, a computer device is provided, including a memory and a processor, the memory storing a computer program, the processor executing the computer program to implement the steps of the method described in the first aspect.

[0065] According to a fourth aspect of the present disclosure, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements the steps of the method described in the first aspect.

[0066] The technical solutions provided by the embodiments of this disclosure can include the following beneficial effects: setting multiple sets of design parameters at one time, and extracting corresponding parasitic parameters based on each set of design parameters, thereby performing simulations based on multiple sets of parasitic parameters, obtaining multiple sets of simulation results at one time, reducing the number of iterations, obtaining target design parameters faster, and improving the efficiency of layout design and process design.

[0067] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0068] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0069] Figure 1 This is a flowchart illustrating a method for determining design parameters according to an exemplary embodiment;

[0070] Figure 2 This is a flowchart illustrating a method for determining design parameters according to an exemplary embodiment;

[0071] Figure 3 This is a schematic diagram of a target area in an initial layout according to an exemplary embodiment;

[0072] Figure 4 This is a schematic diagram of a process document according to an exemplary embodiment;

[0073] Figure 5 This is a schematic diagram illustrating a settings interface according to an exemplary embodiment;

[0074] Figure 6 This is a schematic diagram illustrating a simulation interface according to an exemplary embodiment;

[0075] Figure 7 This is a schematic diagram illustrating a simulation result file according to an exemplary embodiment;

[0076] Figure 8 This is a flowchart illustrating a method for determining design parameters according to an exemplary embodiment;

[0077] Figure 9 This is a block diagram illustrating a design parameter determining device according to an exemplary embodiment;

[0078] Figure 10 This is a block diagram of a computer device according to an exemplary embodiment. Detailed Implementation

[0079] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the invention as detailed in the appended claims.

[0080] In flat panel display layout design, parasitic parameters need to be extracted to determine the load on pixel voltages or touch signals. After extraction, subsequent simulation processes are used to determine the rationality of the layout and process parameters. If inappropriate settings are found, the layout and process parameters must be continuously adjusted, and parasitic parameter extraction and simulation are repeated until the final layout and process parameters are obtained. Obtaining the final layout and process parameters often involves a relatively long parameter extraction and subsequent simulation iteration cycle, resulting in low efficiency in layout and process design.

[0081] To address the aforementioned issues, this disclosure provides a method for determining design parameters. This method sets multiple sets of design parameters at once and extracts corresponding parasitic parameters based on each set. Simulations are then performed using these parasitic parameters, resulting in multiple sets of simulation results at once. This reduces the number of iterations, allows for faster acquisition of target design parameters, and improves the efficiency of layout and process design.

[0082] The method provided in this disclosure is executed by a computer device, which can be a device with circuit layout design capabilities, such as a mobile phone, tablet computer, laptop computer, desktop computer, wearable device, or smart terminal.

[0083] Figure 1 This is a flowchart illustrating a design parameter determination method according to an exemplary embodiment, executed by a computer device. See also... Figure 1 The method includes the following steps:

[0084] Step S101: Based on the initial layout and the process file of the initial layout, set different sets of design parameters. Each set of design parameters includes layout parameters and process parameters. The layout parameters include the position parameters and size parameters of the process layer in the initial layout. The process parameters include at least one of the thickness parameters and dielectric constant of the process layer in the process file.

[0085] The initial layout refers to any layout in the design process. The process file for the initial layout is used to store process parameters not shown in the initial layout. The process layers in the initial layout include at least one of metal layers, semiconductor layers, vias, and via layers, and each process layer can be one or more. For example, the initial layout includes two metal layers. The process layers in the process file include at least one of metal layers, semiconductor layers, vias, and dielectric layers, and each process layer can be one or more. For example, the process file includes two metal layers and five dielectric layers.

[0086] In this embodiment of the disclosure, when setting parameters, layout parameters are set for the process layers in the initial layout, and process parameters are set for the process layers in the process file. Furthermore, since there are one or more process layers in the initial layout, layout parameters can be set separately for each process layer in the initial layout, and one or more sets of layout parameters can be set for each process layer. Similarly, since there are one or more process layers in the process file, process parameters can be set separately for each process layer in the process file, and one or more sets of process parameters can be set for each process layer.

[0087] The layout parameters include position and size parameters of the process layer in the initial layout. Position parameters include at least one of the movement direction and movement distance parameters of the process layer in the initial layout. Size parameters include at least one of the scaling ratio, length, and width parameters of the process layer in the initial layout. For example, position parameters may include the distance moved in the X direction, the distance moved in the Y direction, the degree of forward rotation, or the degree of reverse rotation; size parameters may include the scaling ratio, the scaling ratio, the adjusted length, or the adjusted width. It should be noted that when setting the layout parameters of the process layer in the initial layout, position and / or size parameters can be set. Furthermore, at least one of the multiple parameters indicated by the position parameters and at least one of the multiple parameters indicated by the size parameters can be set.

[0088] The process parameters include at least one of the thickness parameters of the process layer and the dielectric constant in the process document.

[0089] Combining multiple sets of layout parameters and multiple sets of process parameters can yield different sets of design parameters. Each set of design parameters must have at least one different parameter. For example, design parameters 1, 2, and 3 can be obtained if only the position parameter of metal layer 1 differs; or, design parameters 1, 2, and 3 can be obtained if only the position parameter of metal layer 1, the size parameter of metal layer 2, and the dielectric constant of the dielectric layer differ.

[0090] Step S102: Based on multiple sets of design parameters, extract the parasitic parameters corresponding to each set of design parameters. The parasitic parameters include capacitance parameters and resistance parameters.

[0091] For each set of design parameters, a target layout corresponding to each set of design parameters can be determined based on the initial layout. Then, the corresponding parasitic parameters can be extracted from each target layout. Since multiple sets of design parameters are obtained at once, multiple sets of parasitic parameters can be extracted simultaneously.

[0092] It should be noted that the embodiments disclosed herein do not limit the specific implementation methods for extracting parasitic parameters.

[0093] Step S103: Perform simulation based on multiple sets of parasitic parameters to obtain the simulation results corresponding to each set of parasitic parameters.

[0094] During the simulation process, simulations were performed separately for each set of parasitic parameters, yielding simulation results for each set of parameters, resulting in multiple sets of simulation results at once. These simulation results are used to characterize whether the corresponding design parameters are reasonable.

[0095] It should be noted that the specific implementation methods of the simulation are not limited in the embodiments disclosed herein.

[0096] Step S104: Based on multiple simulation results, determine the target design parameters from multiple sets of design parameters.

[0097] The design parameters corresponding to the simulation result that best represents the design parameters among multiple simulation results are determined as the target design parameters.

[0098] Of course, in some embodiments, if multiple simulation results are not the desired results, the implementation of steps S101-S104 above can be continued until the target design parameters are obtained.

[0099] The method provided in this disclosure sets multiple sets of design parameters at once and extracts corresponding parasitic parameters based on each set of design parameters. Simulation is then performed based on multiple sets of parasitic parameters, resulting in multiple sets of simulation results at once. This reduces the number of iterations, allows for faster acquisition of target design parameters, and improves the efficiency of layout design and process design.

[0100] Figure 2 This is a flowchart illustrating a design parameter determination method according to an exemplary embodiment, executed by a computer device. See also... Figure 2 The method includes the following steps:

[0101] Step S201: Based on the process layer in the initial layout, set different sets of layout parameters, each set of layout parameters including the layout parameters of at least one process layer in the initial layout.

[0102] The initial layout contains many process layers. Setting parameters for all process layers in the entire initial layout would result in a large computational load, which is detrimental to subsequent simulations. Therefore, in some embodiments, a target region in the initial layout is determined; based on the process layers within the target region, multiple sets of different layout parameters are set. See one example. Figure 3 The diagram shown is a schematic of the target area in the initial layout. The target area includes metal conductor A, metal conductor B and metal conductor C, and metal conductor A and metal conductor C belong to metal layer 1 (ITO1), and metal conductor B belongs to metal layer 2 (ITO2).

[0103] In some embodiments, a settings interface is provided, in which users can input layout parameters of the process layer in the initial layout.

[0104] Step S202: Based on the process layer in the process file, set different sets of process parameters, each set of process parameters including layout parameters of at least one process layer in the process file.

[0105] In some embodiments, similar to the implementation in step S201, when setting layout parameters for the process layer in the target region, different sets of process parameters are set based on the process layer located in the target region in the process file. In one example, see... Figure 4 The schematic diagram of the process document shown is from... Figure 4 It can be seen that the process parameters in rows 4, 5, 7, 9, 10, and 11 are the process parameters of the dielectric layers adjacent to ITO1 and ITO2.

[0106] In some embodiments, a settings interface is provided, in which users can input process parameters from the process layer in the process file.

[0107] It should be noted that the embodiments disclosed herein are only illustrated by taking the example of executing step S201 first and then step S202. In another embodiment, step S202 can be executed first and then step S201 can be executed. The embodiments disclosed herein do not restrict the order of execution of steps S201 and S202.

[0108] When setting design parameters, different parameter setting methods can be used. In some embodiments, the parameter setting type of the target process layer is determined. The parameter setting type includes a first type or a second type. The first type indicates a parameter setting method that includes start parameters, end parameters, and step size parameters. The second type indicates a parameter setting method that includes multiple parameters separated by a separator, such as a comma or underscore. When the parameter setting type is the first type, the parameters of the target process layer are set based on the parameter setting method indicated by the first type. When the parameter setting type is the second type, the parameters of the target process layer are set based on the parameter setting method indicated by the second type.

[0109] Specifically, when the target process layer is any process layer in the initial layout, the parameters of the target process layer are layout parameters; when the target process layer is any process layer in the process file, the parameters of the target process layer are process parameters. That is, for both the setting of layout parameters of the process layer in the initial layout and the setting of process parameters of the process layer in the process file, the parameter setting type can be determined first, and then the corresponding parameter setting method can be used to set them according to the determined parameter setting type.

[0110] See one example. Figure 5 The diagram shows the settings interface, where the Layout Setting window is used to set layout parameters, and the Tech Setting window is used to set process parameters.

[0111] Referring to the Layout Setting window, it can be seen that settings are required for ITO1 and ITO2. For ITO1, ETCH and MOVE_Y settings can be applied separately. The parameter setting type for ETCH is the second type (Data), and is set to 0.1, meaning one parameter is set. The parameter setting type for MOVE_Y is the first type (Sweep), and is set to Start parameter 0.1, End parameter 0.5, and Step parameter 0.1, resulting in five parameters: 0.1, 0.2, 0.3, 0.4, and 0.5. Similarly, settings are also applied to ITO2, which will not be detailed here.

[0112] Referring to the Tech Setting window, you can see settings for ITO2 and Cathode (medium layer). For ITO2, a THICHNESS setting is applied, with the parameter type set to Type II. In this case, it's set to 1_2_3, meaning parameters 1, 2, and 3 are configured. Similarly, Type I settings are applied to Cathode, which will not be elaborated upon here.

[0113] In some embodiments, see the above. Figure 5 The diagram shows that during the setup process, you can also select the parameter type to be set. For example, parameter types include ETCH, MOVE_Y, MOVE_X, THICHNESS, PERM, etc. When a parameter type is selected, you can set specific parameters for that parameter type.

[0114] Step S203: Based on multiple sets of layout parameters and multiple sets of process parameters, determine multiple sets of design parameters.

[0115] After setting multiple sets of layout parameters and multiple sets of process parameters, these multiple sets of layout parameters and multiple sets of process parameters can be combined to obtain multiple sets of design parameters.

[0116] In some embodiments, to enable more flexible combination of multiple sets of layout parameters and multiple sets of process parameters, parameter modes can be set, with different parameter modes indicating different parameter combination methods. That is, the parameter mode for each process layer in the initial layout and the parameter mode for each process layer in the process file are determined. The parameter modes include a first mode, a second mode, a third mode, or a fourth mode. The first mode indicates that the parameters set for the process layer can be combined with other parameters; for example, the first mode could be called Enable. The second mode indicates that the parameters set for the process layer cannot be used to adjust the initial layout; for example, the second mode could be called Disable. The third mode indicates that multiple parameters set for the process layer are combined with other parameters in sequence; for example, the third mode could be called Order. The fourth mode indicates that the parameters set for the process layer cannot be combined with other parameters; for example, the fourth mode could be called Single.

[0117] When parameter modes are set, multiple sets of design parameters are determined based on multiple sets of layout parameters and multiple sets of process parameters, including: determining multiple sets of design parameters based on multiple sets of layout parameters, multiple sets of process parameters, the parameter modes of each process layer in the initial layout, and the parameter modes of each process layer in the process file.

[0118] Optionally, multiple sets of design parameters are determined based on multiple sets of layout parameters, multiple sets of process parameters, the parameter mode of each process layer in the initial layout, and the parameter mode of each process layer in the process file. This includes: when the parameter mode of the first process layer in the initial layout is the fourth mode, design parameters are determined based on the layout parameters of the first process layer, where the first process layer is any process layer in the initial layout; when the parameter mode of the second process layer in the process file is the fourth mode, design parameters are determined based on the process parameters of the second process layer, where the second process layer is any process layer in the process file; when the parameter mode of a process layer in the initial layout is the first mode or the third mode, and the parameter mode of the process parameters in the process file is the first mode or the third mode, at least one set of design parameters is determined based on the layout parameters of the process layer in the initial layout and the process parameters of the process layer in the process file.

[0119] In other words, if the layout parameter or process parameter is in the first mode, it can be combined with other layout parameters or process parameters; if it is in the second mode, it cannot be used to adjust the initial layout, meaning it cannot be used for subsequent processes; if it is in the third mode, it can be combined with other layout parameters or process parameters, and if there are multiple layout parameters or process parameters, they are combined with other parameters sequentially according to the setting order; if it is in the fourth mode, it cannot be combined with other parameters, but it can be used alone for subsequent processes.

[0120] See one example. Figure 5 The diagram of the settings interface shows that, under Mode, for each setting of ITO1, ITO2, and Cathode, you can select the corresponding parameter mode from four parameter modes: Enable, Disable, Order, and Single.

[0121] In addition, in some embodiments, multiple sets of voltage parameters can be set for the liquid crystal layer. In this case, multiple sets of design parameters are determined based on multiple sets of layout parameters and multiple sets of process parameters, including: determining multiple sets of design parameters based on multiple sets of layout parameters, multiple sets of process parameters, and multiple sets of voltage parameters.

[0122] See one example. Figure 5 The diagram shown illustrates the settings interface, where the Gui Setting window is used to set voltage parameters.

[0123] It should be noted that the voltage parameters are set similarly to the layout and process parameters mentioned above. Parameter modes and parameter setting types can also be set, but the specific setting methods will not be elaborated here.

[0124] Another point to note is that the voltage parameter setting is optional.

[0125] Step S204: Based on multiple sets of design parameters, extract the parasitic parameters corresponding to each set of design parameters.

[0126] Step S205: Perform simulation based on multiple sets of parasitic parameters to obtain the simulation results corresponding to each set of parasitic parameters.

[0127] In some embodiments, when simulating multiple sets of parasitic parameters, the simulation can be performed sequentially based on the multiple sets of parasitic parameters. That is, after the simulation of one set of parasitic parameters is completed, the simulation of the next set of parasitic parameters is performed until the simulation of the last set of parasitic parameters is completed. Alternatively, a preset number of parasitic parameters from multiple sets of parasitic parameters can be simulated simultaneously. Whenever the simulation of one set of parasitic parameters is completed, the simulation of the subsequent parasitic parameters can be performed, as long as the number of parasitic parameters simulated simultaneously does not exceed the preset number.

[0128] See one example. Figure 6 The schematic diagram of the simulation interface shown indicates that the first two sets of parasitic parameters have been simulated, and the simulation of the third set of parasitic parameters is underway.

[0129] In some embodiments, after the simulation is completed, the simulation results corresponding to each set of parasitic parameters are saved to obtain a simulation result file for each simulation result. The simulation result file is then named based on the design parameters corresponding to the simulation results. This naming method allows users to clearly see the design parameters from the file name of the simulation result file, making it convenient for users to view the simulation results corresponding to each set of design parameters.

[0130] See one example. Figure 7 The diagram shows a simulation result file. Taking the first simulation result file as an example, the file name is "Enable.ITO1_ETCH_0.1_ITO1_MOVEX_0.2_ITO2_MOVEY_0.2_Enable.ITO2_THICHNESS_10_INS_PERM_10_.csv". It can be seen that the design parameters corresponding to this simulation result file are "ITO1_ETCH_0.1", "ITO1_MOVEX_0.2", "ITO2_MOVEY_0.2", "ITO2_THICHNESS_10", and "INS_PERM_10".

[0131] Step S206: Based on multiple simulation results, determine the target design parameters from multiple sets of design parameters.

[0132] The method provided in this disclosure sets multiple sets of design parameters at once and extracts corresponding parasitic parameters based on each set of design parameters. Simulation is then performed based on multiple sets of parasitic parameters, resulting in multiple sets of simulation results at once. This reduces the number of iterations, allows for faster acquisition of target design parameters, and improves the efficiency of layout design and process design.

[0133] In one example, the flowchart of the design parameter determination method provided in this disclosure embodiment may also be as follows: Figure 8 As shown, see Figure 8 The method includes the following steps:

[0134] Step S1: Customize the settings in the settings interface for the initial layout and process documents.

[0135] The implementation method of step S1 is the same as that of steps S201 and S202 described above, and will not be repeated here.

[0136] Step S2: Based on the customized settings for the initial layout and process documents, determine multiple sets of design parameters.

[0137] The implementation method of step S2 is the same as that of step S203 above, and will not be repeated here.

[0138] Step S3: Use the determined sets of design parameters as inputs to extract parasitic parameters.

[0139] Step S4: Pass the input to the extraction engine and extract the corresponding parasitic parameters for each set of design parameters to obtain multiple sets of parasitic parameters.

[0140] Step S5: Perform simulation based on multiple sets of parasitic parameters to obtain the simulation results corresponding to each set of parasitic parameters, and determine the target design parameters from multiple sets of design parameters based on multiple simulation results.

[0141] Figure 9 This is a block diagram illustrating a design parameter determination device according to an exemplary embodiment, configured in a computer device. See also... Figure 9 The device includes:

[0142] The parameter setting module 901 is configured to set multiple sets of design parameters based on the initial layout and the process file of the initial layout. Each set of design parameters includes layout parameters and process parameters. The layout parameters include the position parameters and size parameters of the process layer in the initial layout. The process parameters include at least one of the thickness parameters and dielectric constant of the process layer in the process file.

[0143] The parasitic parameter extraction module 902 is configured to extract parasitic parameters corresponding to each set of design parameters based on multiple sets of design parameters. The parasitic parameters include capacitance parameters and resistance parameters.

[0144] Simulation module 903 is configured to perform simulations based on multiple sets of parasitic parameters to obtain simulation results corresponding to each set of parasitic parameters;

[0145] The design parameter determination module 904 is configured to determine the target design parameters from multiple sets of design parameters based on multiple simulation results.

[0146] In some embodiments, the parameter setting module 901 is configured to:

[0147] Based on the process layer in the initial layout, set different sets of layout parameters, each set of layout parameters including the layout parameters of at least one process layer in the initial layout.

[0148] Based on the process layer in the process file, set different sets of process parameters. Each set of process parameters includes layout parameters of at least one process layer in the process file.

[0149] Based on multiple sets of layout parameters and multiple sets of process parameters, multiple sets of design parameters are determined.

[0150] In some embodiments, the process of setting the layout parameters of the process layer in the initial layout or the process parameters of the process layer in the process file includes:

[0151] Determine the parameter setting type of the target process layer. The parameter setting type includes a first type or a second type. The first type is used to indicate the parameter setting method that includes start parameters, end parameters and step size parameters. The second type is used to indicate the parameter setting method that includes multiple parameters and the multiple parameters are separated by a separator.

[0152] When the parameter setting type is the first type, the parameters of the target process layer are set based on the parameter setting method indicated by the first type;

[0153] When the parameter setting type is the second type, the parameters of the target process layer are set based on the parameter setting method indicated by the second type;

[0154] Specifically, when the target process layer is any process layer in the initial layout, the parameters of the target process layer are layout parameters; when the target process layer is any process layer in the process file, the parameters of the target process layer are process parameters.

[0155] In some embodiments, the apparatus further includes:

[0156] The parameter mode determination module is configured to determine the parameter mode of each process layer in the initial layout and the parameter mode of each process layer in the process file. The parameter mode includes a first mode, a second mode, a third mode, or a fourth mode. The first mode is used to indicate that the parameters set for the process layer can be combined with other parameters. The second mode is used to indicate that the parameters set for the process layer cannot be used to adjust the initial layout. The third mode is used to indicate that multiple parameters set for the process layer are combined with other parameters in sequence. The fourth mode is used to indicate that the parameters set for the process layer cannot be combined with other parameters.

[0157] The parameter setting module 901 is configured to determine multiple sets of design parameters based on multiple sets of layout parameters, multiple sets of process parameters, the parameter mode of each process layer in the initial layout, and the parameter mode of each process layer in the process file.

[0158] In some embodiments, the parameter setting module 901 is configured to:

[0159] When the parameter mode of the first process layer in the initial layout is the fourth mode, the design parameters are determined based on the layout parameters of the first process layer. The first process layer can be any process layer in the initial layout.

[0160] When the parameter mode of the second process layer in the process document is the fourth mode, the design parameters are determined based on the process parameters of the second process layer. The second process layer can be any process layer in the process document.

[0161] When the parameter mode of the process layer in the initial layout is the first mode or the third mode, and the parameter mode of the process parameters in the process file is the first mode or the third mode, at least one set of design parameters is determined based on the layout parameters of the process layer in the initial layout and the process parameters of the process layer in the process file.

[0162] In some embodiments, the apparatus further includes:

[0163] The voltage parameter setting module 901 is configured to set multiple sets of voltage parameters for the liquid crystal layer.

[0164] The parameter setting module 901 is configured to determine multiple sets of design parameters based on multiple sets of layout parameters, multiple sets of process parameters, and multiple sets of voltage parameters.

[0165] In some embodiments, the parameter setting module 901 is configured to:

[0166] Determine the target area in the initial map;

[0167] Based on the process layer in the target area, set different sets of layout parameters.

[0168] In some embodiments, the apparatus further includes:

[0169] The simulation result saving module is configured to save the simulation results corresponding to each set of parasitic parameters, obtain the simulation result file corresponding to each simulation result, and name the simulation result file based on the design parameters corresponding to the simulation result.

[0170] The modules in the above-mentioned design parameter determination device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device, or stored in the memory of a computer device as software, so that the processor can call and execute the operations corresponding to each module.

[0171] In one exemplary embodiment, a computer device is provided, including a processor and a memory, the memory storing a computer program, and the processor executing the computer program implementing the steps of any of the above-described design parameter determination methods.

[0172] In one exemplary embodiment, a computer-readable storage medium is provided, on which a computer program is stored, which, when executed by a processor, implements the steps of any of the design parameter determination methods described above. The computer-readable storage medium may be a ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, or optical data storage device, etc.

[0173] In one exemplary embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps of any of the above-described design parameter determination methods.

[0174] refer to Figure 10 The following description serves as a structural block diagram of the computer device disclosed herein. The computer device includes a computing unit 1001, which can perform various appropriate actions and processes based on a computer program stored in a read-only memory (ROM) 1002 or a computer program loaded from a storage unit 1008 into a random access memory (RAM) 1003. The RAM 1003 may also store various programs and data required for the operation of the computer device 1000. The computing unit 1001, ROM 1002, and RAM 1003 are interconnected via a bus 1004. An input / output (I / O) interface 1005 is also connected to the bus 1004.

[0175] Multiple components in computer device 1000 are connected to I / O interface 1005, including: input unit 1006, output unit 1007, storage unit 1008, and communication unit 1009. Input unit 1006 can be any type of device capable of inputting information to computer device 1000. Input unit 1006 can receive input numerical or character information and generate key signal inputs related to user settings and / or function control of computer device 1000, and may include, but is not limited to, a mouse, keyboard, touchscreen, trackpad, trackball, joystick, microphone, and / or remote control. Output unit 1007 can be any type of device capable of presenting information, and may include, but is not limited to, a monitor, speaker, video / audio output terminal, vibrator, and / or printer. Storage unit 1008 may include, but is not limited to, a hard disk and an optical disk. The communication unit 1009 allows the computer device 1000 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks, and may include, but is not limited to, modems, network cards, infrared communication devices, wireless communication transceivers and / or chipsets, such as Bluetooth™ devices, WiFi devices, WiMax devices, cellular communication devices and / or the like.

[0176] The computing unit 1001 can be various general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the computing unit 1001 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The computing unit 1001 performs the various methods and processes described above, such as the design parameter determination method. For example, in some embodiments, the design parameter determination method may be implemented as a computer software program tangibly contained in a machine-readable medium, such as storage unit 1008. In some embodiments, part or all of the computer program may be loaded and / or installed on the computer device 1000 via ROM 1002 and / or communication unit 1009. When the computer program is loaded into RAM 1003 and executed by the computing unit 1001, one or more steps of the design parameter determination method described above may be performed. Alternatively, in other embodiments, the computing unit 1001 may be configured to perform a design parameter determination method by any other suitable means (e.g., by means of firmware).

[0177] The computer device 1000 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the above-described design parameter determination method.

[0178] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the following claims.

[0179] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A method for determining design parameters, characterized in that, The method includes: Based on the initial layout and the process file of the initial layout, multiple sets of different design parameters are set. Each set of design parameters includes layout parameters and process parameters. The layout parameters include the position parameters and size parameters of the process layer in the initial layout. The process parameters include at least one of the thickness parameters and dielectric constant of the process layer in the process file. Based on the multiple sets of design parameters, the parasitic parameters corresponding to each set of design parameters are extracted. The parasitic parameters include capacitance parameters and resistance parameters. Simulations were performed based on multiple sets of parasitic parameters, and simulation results were obtained for each set of parasitic parameters. Based on multiple simulation results, the target design parameters are determined from multiple sets of design parameters; The process of setting the layout parameters of the process layer in the initial layout or the process parameters of the process layer in the process file includes: Determine the parameter setting type of the target process layer. The parameter setting type includes a first type or a second type. The first type is used to indicate a parameter setting method that includes a start parameter, an end parameter, and a step size parameter. The second type is used to indicate a parameter setting method that includes multiple parameters, and the multiple parameters are separated by a separator. When the parameter setting type is the first type, the parameters of the target process layer are set based on the parameter setting method indicated by the first type; When the parameter setting type is the second type, the parameters of the target process layer are set based on the parameter setting method indicated by the second type; Wherein, when the target process layer is any process layer in the initial layout, the parameters of the target process layer are layout parameters; when the target process layer is any process layer in the process file, the parameters of the target process layer are process parameters.

2. The method according to claim 1, characterized in that, The process document based on the initial layout is used to set multiple sets of different design parameters, including: Based on the process layer in the initial layout, multiple sets of different layout parameters are set, and each set of layout parameters includes the layout parameters of at least one process layer in the initial layout. Based on the process layer in the process file, set different sets of process parameters, each set of process parameters including layout parameters of at least one process layer in the process file. Based on the multiple sets of layout parameters and the multiple sets of process parameters, the multiple sets of design parameters are determined.

3. The method according to claim 1 or 2, characterized in that, The method further includes: Determine the parameter mode of each process layer in the initial layout and the parameter mode of each process layer in the process file. The parameter mode includes a first mode, a second mode, a third mode, or a fourth mode. The first mode is used to indicate that the parameters set for the process layer can be combined with other parameters. The second mode is used to indicate that the parameters set for the process layer cannot be used to adjust the initial layout. The third mode is used to indicate that multiple parameters set for the process layer are combined with other parameters in sequence. The fourth mode is used to indicate that the parameters set for the process layer cannot be combined with other parameters. The determination of the multiple sets of design parameters based on the multiple sets of layout parameters and the multiple sets of process parameters includes: Based on the multiple sets of layout parameters, the multiple sets of process parameters, the parameter patterns of each process layer in the initial layout, and the parameter patterns of each process layer in the process file, the multiple sets of design parameters are determined.

4. The method according to claim 3, characterized in that, The determination of the multiple sets of design parameters based on the multiple sets of layout parameters, the multiple sets of process parameters, the parameter patterns of each process layer in the initial layout, and the parameter patterns of each process layer in the process file includes: When the parameter mode of the first process layer in the initial layout is the fourth mode, the design parameters are determined based on the layout parameters of the first process layer, where the first process layer is any process layer in the initial layout. When the parameter mode of the second process layer in the process file is the fourth mode, the design parameters are determined based on the process parameters of the second process layer, where the second process layer is any process layer in the process file; When the parameter mode of the process layer in the initial layout is the first mode or the third mode, and the parameter mode of the process parameters in the process file is the first mode or the third mode, at least one set of design parameters is determined based on the layout parameters of the process layer in the initial layout and the process parameters of the process layer in the process file.

5. The method according to claim 2, characterized in that, The method further includes: Set multiple sets of voltage parameters for the liquid crystal layer; The determination of the multiple sets of design parameters based on the multiple sets of layout parameters and the multiple sets of process parameters includes: Based on the multiple sets of layout parameters, the multiple sets of process parameters, and the multiple sets of voltage parameters, the multiple sets of design parameters are determined.

6. The method according to claim 2, characterized in that, Based on the process layer in the initial layout, different sets of layout parameters are set, including: Determine the target area in the initial layout; Based on the process layer in the target area, multiple sets of different layout parameters are set.

7. A device for determining design parameters, characterized in that, The design parameter determination device includes: The parameter setting module is configured to set multiple sets of design parameters based on the initial layout and the process file of the initial layout. Each set of design parameters includes layout parameters and process parameters. The layout parameters include the position parameters and size parameters of the process layer in the initial layout. The process parameters include at least one of the thickness parameters and dielectric constant of the process layer in the process file. The parasitic parameter extraction module is configured to extract parasitic parameters corresponding to each set of design parameters based on the multiple sets of design parameters, wherein the parasitic parameters include capacitance parameters and resistance parameters; The simulation module is configured to perform simulations based on multiple sets of parasitic parameters, and obtain simulation results corresponding to each set of parasitic parameters; The design parameter determination module is configured to determine the target design parameters from multiple sets of design parameters based on multiple simulation results; The process of setting the layout parameters of the process layer in the initial layout or the process parameters of the process layer in the process file includes: Determine the parameter setting type of the target process layer. The parameter setting type includes a first type or a second type. The first type is used to indicate a parameter setting method that includes a start parameter, an end parameter, and a step size parameter. The second type is used to indicate a parameter setting method that includes multiple parameters, and the multiple parameters are separated by a separator. When the parameter setting type is the first type, the parameters of the target process layer are set based on the parameter setting method indicated by the first type; When the parameter setting type is the second type, the parameters of the target process layer are set based on the parameter setting method indicated by the second type; Wherein, when the target process layer is any process layer in the initial layout, the parameters of the target process layer are layout parameters; when the target process layer is any process layer in the process file, the parameters of the target process layer are process parameters.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 6.

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