Substrate processing system

Abstract

This invention provides a substrate processing system comprising an atmospheric pressure transport chamber, a vacuum processing chamber, one or more loading interlock units, a vacuum transport chamber, multiple mounting sections, a first transport mechanism, a second transport mechanism, and a control unit. The multiple mounting sections are disposed in the atmospheric pressure transport chamber. Each of the multiple mounting sections can be detachably mounted on one of the multiple storage sections. The control unit, in parallel with the first and second transport mechanisms, performs the following transport operations: transporting consumable components from the storage sections via the atmospheric pressure transport chamber and one of the loading interlock units to the vacuum processing chamber; and transporting consumable components from the vacuum processing chamber via the vacuum transport chamber and another of the loading interlock units. According to this invention, the replacement time of consumable components in the vacuum processing chamber can be shortened, thereby improving the operating efficiency of the substrate processing system.

Description

[0001] This application is a divisional application of the patent application filed on November 28, 2019, with application number 201911193850.7 and entitled "Substrate Processing System, Transport Method, Transport Procedure and Holding Apparatus". Technical Field

[0002] This invention relates to a substrate processing system, a transport method, a transport procedure, and a holding device. Background Technology

[0003] A plasma processing apparatus is known that performs plasma processing by placing a substrate on a mounting platform located inside a processing chamber. Such a plasma processing apparatus contains consumable components that are gradually consumed due to repeated plasma processing.

[0004] Consumable components include, for example, the focusing ring located on the outer periphery of the substrate mounted on the stage. The focusing ring is exposed to the plasma and is worn down, requiring periodic replacement.

[0005] For example, Patent Document 1 proposes a focusing ring replacement method that introduces and removes the focusing ring without opening the processing chamber to the atmosphere. Additionally, it proposes a technique to shorten the downtime of vacuum processing caused by checking the condition of the substrate stage surface and replacing that surface (Patent Document 2). Furthermore, it proposes a container for replacing consumable parts (Patent Document 3).

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent document 1: Japanese Patent Application Publication No. 2018-10992.

[0009] Patent document 2: Japanese Patent Application Publication No. 2012-216614.

[0010] Patent document 3: Japanese Patent Application Publication No. 2017-98540. Summary of the Invention

[0011] The technical problem that the invention aims to solve

[0012] This invention provides a technique to improve the working efficiency of a substrate processing system by shortening the replacement time of consumable components in the vacuum processing chamber.

[0013] Technical solutions for solving the problem

[0014] One embodiment of the substrate processing system of the present invention includes an atmospheric pressure transport chamber, a vacuum processing chamber, one or more loading interlock units, a vacuum transport chamber, multiple mounting sections, a first transport mechanism, a second transport mechanism, and a control unit. The atmospheric pressure transport chamber is used to transport substrates and consumable components under atmospheric pressure. The vacuum processing chamber is used to perform vacuum processing on the substrates. One or more loading interlock units are disposed between the atmospheric pressure transport chamber and the vacuum processing chamber, allowing the transported substrates and consumable components to pass through. The vacuum transport chamber is disposed between the vacuum processing chamber and one or more loading interlock units, and is used to transport substrates and consumable components under reduced pressure. Multiple mounting sections are provided in the atmospheric pressure transport chamber and have ports allowing substrates or consumable components transported between each of multiple storage sections used for storing substrates or consumable components and the atmospheric pressure transport chamber. Each of the multiple mounting sections can be detachably mounted on one of the multiple storage sections. The first transport mechanism transports substrates and consumable components between one or more loading interlock units and the vacuum processing chamber via the vacuum transport chamber. The second conveying mechanism transports substrates and consumable components between multiple storage sections and one or more loading interlocking units via an atmospheric pressure conveying chamber. The control unit causes the first and second conveying mechanisms to perform the following conveying operations in parallel: conveying consumable components from the storage section via the atmospheric pressure conveying chamber and one of the one or more loading interlocking units to the vacuum processing chamber; and conveying consumable components from the vacuum processing chamber via the vacuum conveying chamber and another of the one or more loading interlocking units.

[0015] Invention Effects

[0016] According to the present invention, the replacement time of consumable components in the vacuum processing chamber can be shortened, thereby improving the working efficiency of the substrate processing system. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a substrate processing system according to one embodiment.

[0018] Figure 2 This is a schematic diagram of an example of the processing components of a substrate processing system according to one embodiment.

[0019] Figure 3 It is used for explanation Figure 2 A three-dimensional diagram showing the structure of the base.

[0020] Figure 4 This is a diagram illustrating the flow of the delivery process for consumable components in one embodiment.

[0021] Figure 5 This is a flowchart illustrating an example of a replacement timing notification process in a substrate processing system according to one embodiment.

[0022] Figure 6This is a flowchart illustrating an example of the process for setting up FR using FOUP in a substrate processing system according to one embodiment.

[0023] Figure 7 This is a flowchart illustrating an example of the process for extracting FR using FOUP in a substrate processing system according to one embodiment.

[0024] Figure 8A This is a flowchart illustrating an example of a replacement reservation process in a substrate processing system according to one embodiment.

[0025] Figure 8B This is a flowchart illustrating an example of a replacement appointment cancellation process in a substrate processing system according to one embodiment.

[0026] Figure 9 This is a flowchart illustrating an example of the replacement process in a substrate processing system according to one embodiment.

[0027] Figure 10 This is a flowchart illustrating an example of the process for ensuring processing by changing paths in a substrate processing system according to one embodiment.

[0028] Figure 11 This diagram illustrates the replacement execution process in a substrate processing system according to one embodiment.

[0029] Figure 12 This is a graph illustrating the reduction in downtime when the focus ring is replaced by a substrate processing system according to one embodiment.

[0030] Figure 13A This is a diagram illustrating the operation of the second lifting pin when the focusing ring is fed into a substrate processing system according to one embodiment.

[0031] Figure 13B This is a diagram illustrating the operation of the second lifting pin when the focus ring is delivered in a substrate processing system according to one embodiment.

[0032] Figure 14A This is a schematic top view illustrating an example of the configuration of a pickup in a substrate processing system according to one embodiment.

[0033] Figure 14B yes Figure 14A A schematic front view of the pickup shown.

[0034] Figure 15A It means in Figure 14A A schematic top view showing the state of the chip held on the pickup.

[0035] Figure 15B Viewed from a horizontal direction Figure 15AA schematic front view of the pickup and the chip shown.

[0036] Figure 16A It means in Figure 14A A schematic top view showing the pickup maintaining the focus ring.

[0037] Figure 16B Viewed from a horizontal direction Figure 16A A schematic front view of the pickup and focus ring shown.

[0038] Figure 17 This is a diagram illustrating the configuration position of the third sensor in a substrate processing system according to one embodiment.

[0039] Figure 18A This is a schematic perspective view of the baffle of a gate valve according to one embodiment.

[0040] Figure 18B This is a schematic perspective view of an enlarged portion of a gate valve according to one embodiment.

[0041] Figure 18C This is a schematic perspective view showing the state in which the opening of a gate valve is blocked according to one embodiment.

[0042] Figure 19A This is a diagram illustrating the positional relationship between consumable components and sensors during transport in one embodiment.

[0043] Figure 19B yes Figure 19A The figure shows an example of the detection signal in the example.

[0044] Figure 20A It is a diagram used to illustrate the positional deviation of consumable parts during transportation.

[0045] Figure 20B It means Figure 20A The figure shows an example of the detection signal in the example.

[0046] Figure 21 This is a diagram showing the positional relationship between consumable components and sensors when four sensors are configured.

[0047] Figure 22 This is a diagram used to illustrate the method for calculating the positional deviation of consumable components.

[0048] Explanation of reference numerals in the attached figures

[0049] 1. Substrate Processing System

[0050] 10 Vacuum Delivery Chambers

[0051] 15VTM arm (first conveyor mechanism)

[0052] 17a First Pickup

[0053] 17b Second Pickup

[0054] 20 Atmospheric Pressure Delivery Chamber

[0055] 25LM boom (second conveyor mechanism)

[0056] 27a First Pickup

[0057] 27b Second Pickup

[0058] 30 control devices

[0059] 31 Storage Department

[0060] 32 Processing Department

[0061] 33 Input / Output Interfaces

[0062] 34 Display Unit

[0063] 60 First Maintenance Section

[0064] 70 Second Maintenance Section

[0065] 220 baffle

[0066] 221 opening

[0067] 222 First protrusion

[0068] 223 Second protrusion

[0069] 230 movable cover

[0070] 240 mobile unit

[0071] LLM1 and LLM2 are equipped with interlocking units.

[0072] LP1~LP5 Loading ports (mounting section)

[0073] MS mapping sensor

[0074] PM1-PM8 processing units (vacuum processing chamber)

[0075] S1~S16 First sensor

[0076] S17~S18 Second Sensor

[0077] S20~S27 Third sensor

[0078] GV gate valve. Detailed Implementation

[0079] The disclosed embodiments will now be described in detail based on the accompanying drawings. Furthermore, these embodiments are not intended to be limiting. Additionally, the various embodiments can be appropriately combined without contradicting the processing content.

[0080] (Example of the configuration of the substrate processing system in the implementation method)

[0081] In one embodiment, the substrate processing system transports used consumable components from the vacuum processing chamber to the storage section, and unused consumable components from the storage section to the vacuum processing chamber. In one embodiment, the transport of used consumable components and the transport of unused consumable components are performed in parallel.

[0082] Here, consumable components refer, for example, to components that need to be replaced due to repeated plasma processing in a substrate processing system having multiple chambers (vacuum processing chambers) where plasma processing is performed under a reduced pressure atmosphere. A consumable component is, for example, a focusing ring disposed on a stage within the chamber. Besides the focusing ring, consumable components also include any components that can be fed into and removed from the chamber by means of a robotic arm or similar device. In the following description, a focusing ring will be used as an example of a consumable component to illustrate the implementation. Furthermore, in the following description, "vacuum" refers to a state where a space is filled with gas at a pressure lower than atmospheric pressure. That is, in the following description, "vacuum" includes a reduced pressure state or a negative pressure state. Additionally, in the following description, "atmospheric pressure" refers to a pressure approximately equal to atmospheric pressure.

[0083] Figure 1 This is a schematic diagram of a substrate processing system 1 according to one embodiment.

[0084] The substrate processing system 1 includes multiple processing components PM (PM1 to PM8), a vacuum transport chamber 10, multiple loading interlocking units LLM (LLM1, LLM2), an atmospheric pressure transport chamber 20, multiple loading ports LP (LP1 to LP5), and a control device 30.

[0085] In addition, Figure 1 In the example, this represents 8 processing units PM1 to PM8, 2 load interlock units LLM1 to LLM2, and 5 load ports LP1 to LP5. The number of processing units PM, load interlock units LLM, and load ports LP in the substrate processing system 1 is not limited to the numbers shown in the figure. Hereinafter, unless otherwise specified, the 8 processing units PM1 to PM8 will be collectively referred to as processing unit PM. Similarly, the 2 load interlock units LLM1 to LLM2 will be collectively referred to as load interlock units LLM. Likewise, the 5 load ports LP1 to LP5 will be collectively referred to as load ports LP. Furthermore, the substrate processing system 1 of this embodiment has at least 2 load interlock units LLM.

[0086] The processing component PM performs processing on a semiconductor substrate (hereinafter, wafer W) under a reduced pressure atmosphere. The processing component PM is an example of a vacuum processing chamber. The processing component PM performs processes such as etching and film deposition. The processing component PM has a stage supporting the wafer W and a focusing ring F arranged on the stage to surround the wafer W. Additionally, the processing component PM includes a liftable first lifting pin (described later) disposed in the area on the stage where the wafer W is placed. Figure 2 and Figure 3 172); and a second liftable pin (described later) in the region of the mounting focusing ring FR on the mounting stage. Figure 2 and Figure 3 (182). The first lifting pin rises to lift the wafer W from the stage. Additionally, the second lifting pin rises to lift the focusing ring FR from the stage. During the processing of the wafer W, a reduced pressure atmosphere is maintained within the processing unit PM.

[0087] The processing unit PM is connected to the vacuum delivery chamber 10 via an openable and closable gate valve GV. The gate valve GV is closed during the processing of the wafer W within the processing unit PM. The gate valve GV opens when the processed wafer W is discharged from the processing unit PM and when an unprocessed wafer W is fed into the processing unit PM. Additionally, the gate valve GV also opens when the focusing ring FR is fed into or out of the processing unit PM. The processing unit PM is equipped with a gas supply section for supplying a specified gas and an exhaust section capable of evacuating a vacuum. Further details of the processing unit PM will be described later.

[0088] The interior of the vacuum transport chamber 10 is maintained at a reduced pressure atmosphere. The wafer W is transported to various processing components via the vacuum transport chamber 10. Figure 1 In this example, the vacuum transport chamber 10 is approximately pentagonal in top view, with the processing unit PM arranged around its perimeter along its four sides. The wafer W processed in the processing unit PM is transported via the vacuum transport chamber 10 to the processing unit PM for further processing. After all processing is complete, the wafer W is transported via the vacuum transport chamber 10 to the loading interlock unit LLM. The vacuum transport chamber 10 has a gas supply section (not shown) and an exhaust section capable of evacuating a vacuum.

[0089] Additionally, a first transport mechanism for transporting the wafer W and the focusing ring FR (hereinafter also referred to as the transport material) is provided in the vacuum transport chamber 10. For example, Figure 1 The VTM (Vacuum Transfer Module) arm 15 shown is an example of the first conveying mechanism. This VTM arm 15 conveys the transported items between the processing units PM1 to PM8 and the loading interlocking units LLM1 and LLM2.

[0090] Figure 1 The VTM arm 15 shown has a first arm 15a and a second arm 15b. The first arm 15a and the second arm 15b are mounted on a base 15c. The base 15c is capable of sliding along the long side of the vacuum delivery chamber 10 on guide rails 16a and 16b. For example, the base 15c moves within the vacuum delivery chamber 10 by a motor-driven screw engaging with guide rails 16a and 16b. The first arm 15a and the second arm 15b are rotatably fixed to the base 15c. Furthermore, a generally U-shaped first pickup 17a and a second pickup 17b are rotatably connected to the front end of each of the first arm 15a and the second arm 15b.

[0091] In addition, the VTM arm 15 has an electric motor (not shown) for extending and retracting the first arm 15a and the second arm 15b, and an electric motor (not shown) for raising and lowering the first arm 15a and the second arm 15b.

[0092] Additionally, the vacuum transport chamber 10 has first sensors S1 to S16 configured corresponding to each processing component PM. Each set of first sensors S1 to S16 consists of two sensors, with each set corresponding to one processing component PM. Each of the first sensors S1 to S16 is used to detect the positional deviation of the wafer W and the focusing ring FR transported to the corresponding processing component PM. The transport position is corrected based on the detected position. The positional information of the wafer W and the focusing ring FR detected by the first sensors S1 to S1 is sent to the control device 30. Since each of the first sensors S1 to S16 has the same structure, the first sensors S1 and S2 configured in front of the processing component PM1 will be described as representative examples.

[0093] The first sensors S1 and S2 are, for example, transmissive photoelectric sensors, having a light-emitting section and a light-receiving section respectively disposed on the top and bottom plates of the vacuum transport chamber 10. The first sensors S1 and S2 are respectively disposed on the transport path when the wafer W and the focusing ring FR are transported from the vacuum transport chamber 10 to the processing assembly PM1. For example, the first sensors S1 and S2 are disposed at a position between the light-emitting section and the light-receiving section of the first sensors S1 and S2 through which at least a portion of the wafer W and the focusing ring FR pass. The VTM arm 15 holds the wafer W as it is transported to the processing assembly PM1, passing under the light-emitting section of the sensors S1 and S2. Light is emitted from the light-emitting section above the wafer W, and the light-receiving section below the wafer W receives the emitted light. Light reception by the light-receiving section stops while the wafer W is passing under the light-emitting section. Light reception by the light-receiving section resumes after the wafer W has passed under the light-emitting section. Therefore, based on the length of the light reception stop period in the first sensors S1 and S2, the positional deviation of the wafer W or the focusing ring FR can be detected. Based on the position information sent from the first sensors S1 and S2, the control device 30 corrects the position of the wafer W, i.e. the position of the VTM arm 15, and then delivers the wafer W or the focusing ring FR to the processing component PM1.

[0094] Additionally, the vacuum transport chamber 10 has second sensors S17 to S18 configured corresponding to each loading interlock unit LLM. The second sensors S17 to S18 are respectively configured on the transport paths of loading interlock units LLM1 and LLM2 with the vacuum transport chamber 10. Figure 1 In this example, a second sensor is configured before a loading interlock unit LLM. Before conveying the transport item to the loading interlock unit LLM, the VTM arm 15 remains in standby mode until the second sensor S17 or S18 detects the transport item. Alternatively, if the second sensor S17 (S18) does not detect the transport item, the VTM arm 15, according to an instruction from the control device 30, rotates the front end of the first pickup 17a (17b) in the horizontal plane to move the transport item to a position detectable by the second sensor S17 (S18). When the second sensor S17 (S18) detects the transport item, the VTM arm 15 resumes conveying the transport item to the predetermined destination loading interlock unit LLM.

[0095] The loading interlock unit LLM includes a stage for placing the transported material and support pins for raising and lowering the wafer W and the focusing ring FR. The structure of the support pins can be the same as that of the first and second lifting pins in the processing assembly PM, which will be described later. The loading interlock unit LLM includes an exhaust mechanism (not shown) such as a vacuum pump and a leak valve, which allows switching between atmospheric and depressurized atmospheres within the loading interlock unit LLM. The loading interlock unit LLM is arranged along one side of the vacuum transport chamber 10, where the processing assembly PM is not located. The loading interlock unit LLM and the vacuum transport chamber 10 are internally connected via a gate valve GV.

[0096] VTM arm 15 holds the conveyor belt lifted from the loading interlock unit LLM by the support pin and conveys it to the loading platform of the processing assembly PM. Additionally, VTM arm 15 holds the conveyor belt within the processing assembly PM by the first lifting pin (see 172). Figure 2 The wafer W, lifted by the rising of the VTM arm 15, is transported to the mounting stage within the loading interlock unit LLM. Additionally, the VTM arm 15 holds the processing assembly PM within the stage held by the second lifting pin (see 182). Figure 2 The focusing ring FR, lifted by the rising of the FR, is transported to the loading stage within the loading interlock unit LLM.

[0097] The loading interlock unit LLM is connected to the atmospheric pressure delivery chamber 20 on the opposite side of the side connected to the vacuum delivery chamber 10. The loading interlock unit LLM and the atmospheric pressure delivery chamber 20 are internally connected via a gate valve GV.

[0098] The atmospheric pressure delivery chamber 20 is maintained at atmospheric pressure. Figure 1 In this example, the atmospheric pressure conveying chamber 20 is roughly rectangular in shape when viewed from above. Multiple loading interlocking units (LLMs) are arranged side-by-side along one long side of the atmospheric pressure conveying chamber 20. Additionally, multiple loading ports (LPs) are arranged side-by-side along the other long side of the atmospheric pressure conveying chamber 20. A second conveying mechanism is configured within the atmospheric pressure conveying chamber 20 for conveying the conveyed material between the loading interlocking units (LLMs) and the loading ports (LPs). Figure 1 The LM (Loader Module) arm 25 shown is an example of the second conveying mechanism. The LM arm 25 has an arm 25a. The arm 25a is rotatably fixed to a base 25c. The base 25c is fixed near the loading port LP3. A generally U-shaped first pickup 27a and a second pickup 27b are rotatably connected to the front end of the arm 25a.

[0099] At least one of the first pickup 27a and the second pickup 27b has a mapping sensor MS (not shown) at its front end. For example, the mapping sensor MS is configured at both ends of the approximate U-shape of each of the first pickup 27a and the second pickup 27b. When the FOUP (Front Opening Unified Pod) is connected to the loading port LP (described later), the FOUP cover is open, and the mapping sensor MS performs mapping. That is, the mapping sensor MS detects the wafer W or the focus ring FR within the FOUP and sends the detection result to the control device 30. Furthermore, the wafer W and the focus ring FR have different configuration intervals and thicknesses when the FOUP is stored; therefore, the control device 30 switches the threshold of the mapping sensor MS according to the type of FOUP (detection object) (described later).

[0100] A third sensor, S20 to S27, is also installed inside the atmospheric pressure delivery chamber 20. The third sensors S20 to S27 detect the delivered wafer W and focusing ring FR. The third sensors S20 to S23 detect the material being transported between the loading interlock unit LLM and the atmospheric pressure delivery chamber 20. The third sensors S24 to S27 detect the material being transported between the atmospheric pressure delivery chamber 20 and the loading port LP. The third sensors S20 to S27 are positioned on the transport path of the LM arm 25 between the door of the loading port LP (described later) and the loading interlock unit LLM. The third sensors S20 to S27 are arranged in pairs before the loading interlock units LLM1 and LLM2, and the loading ports LP2 and LP4. The third sensors S20 to S27 can be the same transmissive photoelectric sensors as the first sensors S1 to S16. The third sensors S20 to S27 are capable of detecting both the wafer W and the focusing ring FR.

[0101] Furthermore, during the transport of the wafer W or the focusing ring FR, detection errors may occur in the first sensors S1-16, the second sensors S17 and 18, and the third sensors S20-S27. In this case, there is a possibility of malfunctions such as the transported item falling from the VTM arm 15 or the LM arm 25. Therefore, when a detection error occurs, the substrate processing system 1 interrupts the processing. Alternatively, in the event of a detection error, the substrate processing system 1 may not immediately interrupt the processing, but instead move the tip of the pickup of the VTM arm 15 or the LM arm 25, which is the target of the detection error, horizontally and perform a re-detection. If the re-detection result is another detection error, the substrate processing system 1 interrupts the processing. If the re-detection result is that the transported item is detected, the substrate processing system 1 continues processing.

[0102] exist Figure 1 In the example, the third sensor's ports corresponding to the configurations of loading ports LP1 to LP5 are only loading ports LP2 and LP4. Figure 1In this example, the third sensor is configured only at the position corresponding to the loading port LP that allows setting the focus ring FR using the FOUP. In other examples, the third sensor can also be configured to correspond to all loading ports LP.

[0103] The loading port LP is configured to accommodate a FOUP for housing a wafer W or a focus ring FR. The FOUP is a container for housing a wafer W or a focus ring FR. The FOUP has a cover that can be opened and closed. When the FOUP is installed at the loading port LP, the cover of the FOUP engages with the door of the loading port LP. Furthermore, the lock on the FOUP cover is unlocked, allowing the FOUP cover to be opened. In this state, the FOUP is opened by opening the door of the loading port LP, causing the FOUP cover to move along with the door, thus opening the FOUP. The interior of the FOUP and the atmospheric pressure delivery chamber 20 are connected via the loading port LP. One embodiment of the FOUP package includes a wafer FOUP capable of housing a wafer W and a focus ring (FR) FOUP capable of housing a focus ring FR. The wafer FOUP is an example of a first storage unit, and the FR FOUP is an example of a second storage unit.

[0104] The wafer FOUP has a shelf-shaped storage section corresponding to the number of wafers W to be stored. Furthermore, the FR FOUP is configured to store, for example, a number of focusing rings FR corresponding to the number of processing components PM in the substrate processing system 1. For example, when there are 8 processing components PM with focusing rings FR, the FR FOUP can store 8 unused focusing rings FR and 8 used focusing rings FR. The upper 8 layers of the storage section can store the unused focusing rings FR, and the lower 8 layers of the storage section can store the used focusing rings FR. Furthermore, storing the used focusing rings FR at the bottom is to prevent particles attached to the used focusing rings FR from adhering to the unused focusing rings FR. Moreover, the number of wafers W and focusing rings FR that can be stored in the FOUP is only one example; the FOUP can be configured to store any number of wafers W and focusing rings FR.

[0105] The loading ports LP include a first loading port for mounting FOUPs for wafers and a second loading port for mounting FOUPs for FRs. Figure 1 In the example, loading ports LP1, LP3, and LP5 are the first loading ports. Additionally, loading ports LP2 and LP4 are the second loading ports. The first loading port is an example of a first mounting section, and the second loading port is an example of a second mounting section. Furthermore, in one embodiment, the second loading port can mount either a wafer FOUP or a FR FOUP. Additionally, the FR FOUP can be installed only when the focusing ring FR is replaced, or it can be installed normally. Furthermore, in another example, the number of second loading ports may be odd.

[0106] Each loading port LP includes a reading unit (not shown) for reading the carrier ID (identifier) ​​of the FOUP. The carrier ID is an identifier used to identify the type of each FOUP. To distinguish between FR (Flat-Loading) and wafer FOUPs, the naming rules for the carrier IDs can be preset in the substrate processing system 1. For example, carrier IDs starting with a specified string of characters are identified as carrier IDs for FR FOUPs, and carrier IDs starting with another specified string of characters are identified as carrier IDs for wafer FOUPs. For example, carrier IDs starting with "FR_" are set as FR FOUPs, and carrier IDs starting with "W_" are set as wafer FOUPs in the substrate processing system 1. The naming rules for carrier IDs are set with default values, but the operator can set them. When a FOUP is loaded onto the loading port LP and blocked, the reading unit reads the carrier ID assigned to the FOUP. Based on the carrier ID, the substrate processing system 1 identifies whether each FOUP is a wafer FOUP or a FR FOUP. When the carrier ID is authenticated and the FOUP is connected to the loading port LP, the cover of the FOUP and the door of the loading port open together, and the wafer W or focusing ring FR stored in the FOUP is detected by the mapping sensor MS of the LM arm 25.

[0107] An alignment device AU is configured on one short side of the atmospheric pressure transport chamber 20. The alignment device AU includes a rotating stage for mounting the wafer W and an optical sensor for optically inspecting the outer periphery of the wafer W. The alignment device AU performs alignment of the wafer W by detecting, for example, the flatness and notches of the wafer W.

[0108] The processing components PM, vacuum delivery chamber 10, VTM arm 15, loading interlock unit LLM, atmospheric pressure delivery chamber 20, LM arm 25, loading port LP, and alignment device AU, as described above, are each connected to the control device 30 and controlled by the control device 30.

[0109] The control device 30 is an information processing device that controls the various parts of the substrate processing system 1. The specific structure and function of the control device 30 are not particularly limited. The control device 30 may include, for example, a storage unit 31, a processing unit 32, an input / output interface (IO I / F) 33, and a display unit 34. The storage unit 31 may be any storage device such as a hard disk, optical disk, or semiconductor storage element. The processing unit 32 may be a processor such as a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). The display unit 34 may be a functional unit for displaying information, such as a liquid crystal display or a touch panel.

[0110] The processing unit 32 reads and executes the programs and schemes stored in the storage unit 31, and controls each part of the substrate processing system 1 via the input / output interface 33. Furthermore, the processing unit 32 identifies the type of FOUP connected to each loading port LP based on the carrier ID read by the reading unit located in the loading port LP, and stores it in the storage unit 31. Additionally, the processing unit 32 receives information about the wafer W and focus ring FR within the FOUP detected by the mapping sensor MS, and stores it in the storage unit 31. Furthermore, the processing unit 32 receives the content and progress of the processing being performed by each processing component PM from sensors (not shown) and the like, and stores it in the storage unit 31. Additionally, the control device 30 receives notifications of detection errors from the second and third sensors and performs re-detection or processing abort processing. Furthermore, the control device 30 controls and executes the replacement time notification processing, FR FOUP setting processing, FR FOUP removal processing, replacement reservation processing, replacement reservation cancellation processing, and replacement processing, as described later.

[0111] (Example of the structure of the Processing Component PM)

[0112] Figure 2 This is a schematic diagram of an example of the processing component PM of a substrate processing system 1 according to one embodiment. Figure 2 The processing component PM shown is a parallel plate type plasma processing device.

[0113] The processing assembly PM includes, for example, a processing chamber 102 having a cylindrical processing container formed of alumina with an anodized (alumina-resistant) surface. The processing chamber 102 is grounded. A generally cylindrical mounting stage 110 for mounting the wafer W is provided at the bottom of the processing chamber 102. The mounting stage 110 includes a plate-shaped insulator 112 made of ceramic or the like and a base 114 forming a lower electrode disposed on the insulator 112.

[0114] The stage 110 includes a base temperature regulating unit 117 capable of adjusting the base 114 to a predetermined temperature. The base temperature regulating unit 117 is configured, for example, to circulate a temperature regulating medium in a temperature regulating medium chamber 118 disposed within the base 114.

[0115] The base 114 has a convex substrate mounting portion formed at its upper central part. The upper surface of this substrate mounting portion becomes the substrate mounting surface 115, and the upper surface of the lower portion around it becomes the focusing ring mounting surface 116 for mounting the focusing ring FR. Figure 2As shown, when an electrostatic chuck 120 is provided on the upper part of the substrate mounting portion, the upper surface of the electrostatic chuck 120 becomes the substrate mounting surface 115. The electrostatic chuck 120 is configured with electrodes 122 disposed between insulating materials. A DC voltage of, for example, 1.5 kV is applied to the electrostatic chuck 120 from a DC power supply (not shown) connected to the electrodes 122. As a result, the wafer W is electrostatically attracted to the electrostatic chuck 120. The substrate mounting portion is formed with a diameter smaller than that of the wafer W, and when the wafer W is mounted, the peripheral portion of the wafer W extends out from the substrate mounting portion.

[0116] A focusing ring FR is disposed on the upper periphery of the base 114 in such a way that it surrounds the wafer W placed on the substrate mounting surface 115 of the electrostatic chuck 120. The focusing ring FR is disposed on the focusing ring mounting surface 116 of the base 114.

[0117] Gas passages for supplying a heat-conducting medium (such as a back-side gas like He gas) to the back side of the wafer W placed on the substrate mounting surface 115 are formed in the insulator 112, the base 114, and the electrostatic chuck 120. Heat conduction between the base 114 and the wafer W is achieved through this heat-conducting medium, maintaining the wafer W at a specified temperature.

[0118] An upper electrode 130 is disposed above and opposite the base 114. The space formed between the upper electrode 130 and the base 114 becomes a plasma generation space. The upper electrode 130 is supported on the upper part of the processing chamber 102 via an insulating shielding member 131.

[0119] The upper electrode 130 mainly consists of an electrode plate 132 and an electrode support 134 that detachably supports it. The electrode plate 132 is formed of, for example, quartz, and the electrode support 134 is formed of, for example, a conductive material such as alumina with a surface treated with acid-resistant aluminum.

[0120] The electrode support 134 is provided with a processing gas supply section 140 for introducing processing gas from the processing gas supply source 142 into the processing chamber 102. The processing gas supply source 142 is connected to the gas inlet 143 of the electrode support 134 via a gas supply pipe 144.

[0121] Gas supply pipe 144, for example Figure 2 The mass flow controller (MFC) 146 and the on / off valve 148 are arranged sequentially from the upstream side. Alternatively, an FCS (Flow Control System) can be installed instead of the MFC. The processing gas supply source 142 supplies a fluorocarbon gas (C4F8) such as C4F8. x F y It is used as a processing gas for etching.

[0122] Processing gas supply source 142 supplies, for example, etching gas used for plasma etching. Furthermore, Figure 2 This only refers to a single processing gas supply system consisting of a gas supply pipe 144, an on / off valve 148, a mass flow controller 146, and a processing gas supply source 142. However, the processing component PM has multiple processing gas supply systems. For example, processing gases such as CF4, O2, N2, and CHF3 can be independently controlled in flow and supplied to the processing chamber 102.

[0123] A gas diffusion chamber 135, for example, generally cylindrical in shape, is provided in the electrode support 134 to allow the process gas introduced from the gas supply pipe 144 to diffuse uniformly. The bottom of the electrode support 134 and the electrode plate 132 are provided with a plurality of gas discharge holes 136 to discharge the process gas from the gas diffusion chamber 135 into the process chamber 102. The process gas diffused in the gas diffusion chamber 135 can be uniformly discharged into the plasma generation space through the plurality of gas discharge holes 136. At this time, the upper electrode 130 also functions as a spray head for supplying process gas.

[0124] The upper electrode 130 has an electrode support temperature regulating section 137 capable of adjusting the electrode support 134 to a predetermined temperature. The electrode support temperature regulating section 137 is configured, for example, to circulate a temperature regulating medium in a temperature regulating medium chamber 138 disposed within the electrode support 134.

[0125] The bottom of the processing chamber 102 is connected to an exhaust pipe 104, which in turn is connected to an exhaust section 105. The exhaust section 105 is equipped with a vacuum pump, such as a turbomolecular pump, capable of adjusting the processing chamber 102 to a predetermined reduced-pressure atmosphere. Furthermore, a wafer W inlet / outlet 106 is provided on the side wall of the processing chamber 102, and a gate valve 108 (equivalent to...) is provided at the inlet / outlet 106. Figure 1 (GV of the wafer). The gate valve 108 is opened when wafer W is being fed in or out. Then, wafer W is fed in or out through the feed inlet 106 via a feed arm (not shown).

[0126] The upper electrode 130 is connected to a first high-frequency power supply 150, and a first matching device 152 is provided on its power supply line. The first high-frequency power supply 150 is capable of outputting high-frequency power for plasma generation with a frequency range of 50 to 150 MHz. As described above, applying higher frequency power to the upper electrode 130 can form a well-dissociated and high-density plasma in the processing chamber 102, enabling plasma processing under lower pressure conditions. The output frequency of the first high-frequency power supply 150 is preferably 50 to 80 MHz, typically adjusted to 60 MHz or a frequency close to that shown in the figure.

[0127] The base 114, serving as the lower electrode, is connected to a second high-frequency power supply 160, and a second matching circuit 162 is provided on its power supply line. This second high-frequency power supply 160 is capable of outputting high-frequency bias power with a frequency range of several hundred kHz to tens of MHz. The frequency of the output power of the second high-frequency power supply 160 is typically adjusted to 2 MHz or 13.56 MHz, etc.

[0128] In addition, the base 114 is connected to a high-pass filter (HPF) 164 that filters the high-frequency current flowing into the base 114 from the first high-frequency power supply 150, and the upper electrode 130 is connected to a low-pass filter (LPF) 154 that filters the high-frequency current flowing into the upper electrode 130 from the second high-frequency power supply 160.

[0129] The processing component PM is connected to the control device 30 of the substrate processing system 1. The control device 30 controls various parts of the processing component PM. The input / output interface 33 of the control device 30 includes a keyboard for the operator to input commands for managing the processing component PM, and a display for visually displaying the operating status of the processing component PM.

[0130] In addition, the storage unit 31 stores various processing programs and processing conditions (schemes) required for execution by the processing component PM under the control of the control device 30. These processing conditions summarize multiple parameter values, such as control parameters and setting parameters, for each part of the processing component PM. Each processing condition includes, for example, parameter values ​​for the flow rate ratio of the processed gas, the pressure inside the processing chamber, and high-frequency power. Furthermore, the aforementioned programs and processing conditions can also be stored in a hard disk or semiconductor memory, or installed in a designated location in the storage unit 31 in a portable computer-readable storage medium such as a CD-ROM or DVD.

[0131] The control device 30 reads the desired program and processing conditions from the storage unit 31 based on instructions received via the input / output interface 33, and controls each unit to execute the desired processing of the processing component PM. Furthermore, the processing conditions can be edited via operations from the input / output interface 33. In addition, a separate control device is provided for each processing component PM, and each control device communicates with the host device to control the entire substrate processing system 1.

[0132] (An example of a lifting pin and drive mechanism)

[0133] Furthermore, the base 114 of the processing component PM, such as Figure 3 As shown, a first lifting pin 172 is provided movably from the substrate mounting surface 115, and a second lifting pin 182 is provided movably from the focusing ring mounting surface 116. Figure 3 It is used for explanation Figure 2A perspective view of the structure of the base 114 is shown. Specifically, as... Figure 2 As shown, the first lifting pin 172 is driven by the first driving mechanism 170 and is capable of lifting the wafer W from the substrate mounting surface 115. The second lifting pin 182 is driven by the second driving mechanism 180 and is capable of lifting the focusing ring FR from the focusing ring mounting surface 116.

[0134] The first drive mechanism 170 and the second drive mechanism 180 are electric motors such as DC motors, stepper motors, linear motors, piezoelectric actuators, and air drive mechanisms. The first drive mechanism 170 and the second drive mechanism 180 each have a drive accuracy suitable for the transport of the wafer W and the transport of the focusing ring FR.

[0135] The insulator 112 of the base 114 supporting the processing assembly PM is formed in a ring shape. A first lifting pin 172 is configured to extend vertically upward from below the base 114 surrounded by the insulator 112, and is movable from the substrate mounting surface 115, which serves as the upper surface of the electrostatic chuck 120. Each first lifting pin 172 is inserted into and passes through holes formed in the base 114 and the electrostatic chuck 120, and is controlled by a first drive mechanism 170. Figure 3 The device moves up and down from the substrate mounting surface 115. Furthermore, the first drive mechanism 170 can also be connected to an annular base on which the first lifting pins 172 are arranged at equal intervals, driving the first lifting pins 172 via the base. The number of first lifting pins 172 is not limited to three. Additionally, the position of the first lifting pins 172 should be such that they do not interfere with the VTM arm 15 during the feeding and unfeeding of the wafer W.

[0136] The second lifting pin 182 is configured to extend vertically upward from below the base 114 and is movable from the focusing ring mounting surface 116. Each of the second lifting pins 182 is inserted into a hole formed from below the base 114 through the focusing ring mounting surface 116, and is driven and controlled by the second drive mechanism 180, such as... Figure 3 The focus ring FR is shown to rise and fall from the mounting surface 116. Furthermore, the second drive mechanism 180 can also be connected to an annular base on which second lifting pins 182 are arranged at equal intervals, driving the second lifting pins 182 via the base. Alternatively, multiple second drive mechanisms 180 can be configured to each drive one second lifting pin 182. The number of second lifting pins 182 is not limited to three. The position of the second lifting pins 182 can be such that it does not interfere with the VTM arm 15 during the feeding and feeding of the focus ring FR. The base connected to such a second drive mechanism 180 is configured with a larger diameter than the base connected to the first drive mechanism 170, and is positioned further outward than the base connected to the first drive mechanism 170. Thus, the first drive mechanism 170 and the second drive mechanism 180 do not interfere with each other, and can independently raise and lower the first lifting pin 172 and the second lifting pin 182.

[0137] According to the first drive mechanism 170 configured as described above, the wafer W can be lifted from the electrostatic chuck 120 by raising each of the first lifting pins 172. Furthermore, according to the second drive mechanism 180, the focusing ring FR can be lifted from the focusing ring mounting surface 116 by raising each of the second lifting pins 182.

[0138] In addition, Figure 2 In the example, the focusing ring FR is formed as a single piece, but it can also be divided into two or more parts. For example, the easily worn inner diameter side and the outer diameter side can be separated and constituted as two separate parts. In this case, only the inner focusing ring can be lifted using the second lifting pin 182 for replacement.

[0139] (Mode settings)

[0140] The substrate processing system 1 of this embodiment, having the above-described configuration, can be set to the following modes: (1) access mode of the loading port LP, (2) maintenance mode of each part, and (3) processing mode of the processing component PM.

[0141] (1) Access mode of loading port LP

[0142] The access mode is used to determine whether to accept automatic configuration of the FOUP on the loading port LP. There are two access modes: manual mode and automatic mode. In manual mode, the substrate processing system 1 performs FOUP configuration and retrieval based on operator input. In automatic mode, the substrate processing system 1 performs FOUP configuration and retrieval without operator input.

[0143] For example, in manual mode, the substrate processing system 1 does not accept the setting and removal of FOUPs by the overhead hoist transfer (OHT). In manual mode, the substrate processing system 1 accepts the setting and removal of FOUPs by the automated guided vehicle (AGV) with operator input. On the other hand, in automatic mode, the substrate processing system 1 accepts the setting and removal of FOUPs by the OHT without operator input.

[0144] Manual mode is the mode selected when setting and removing FOUPs under operator supervision. In this embodiment, setting and removing FOUPs for FRs can be performed only when manual mode is selected.

[0145] (2) Maintenance mode of each department

[0146] The maintenance mode is set to perform maintenance when the normal processing (processing of product wafer W) of each part of the substrate processing system 1 is stopped. The maintenance mode can be set uniformly for a group of components that operate in tandem. For example, the atmospheric pressure delivery chamber 20 and the loading ports LP1 to LP5 can all be uniformly set to either the normal processing mode or the maintenance mode.

[0147] When set to normal processing mode, each part of the substrate processing system 1 operates automatically based on a pre-set processing flow. On the other hand, when set to maintenance mode, each part of the substrate processing system 1 operates according to the operator's input.

[0148] (3) Processing mode of PM component

[0149] The processing mode of the processing component PM specifies the mode in which processing, such as plasma processing, is performed on the product wafer W. Two processing modes can be set: a production mode and a non-production mode. In production mode, the substrate processing system 1 can perform plasma processing on the product wafer W in the processing component PM. On the other hand, in non-production mode, the substrate processing system 1 cannot perform plasma processing on the product wafer W in the processing component PM. In this embodiment, when a consumable component replacement process is executed, the substrate processing system 1 switches the processing component PM, on which the consumable component is located, to a non-production mode. After the consumable component is replaced, the processing component PM switches back to production mode and resumes plasma processing of the product wafer W.

[0150] (An example of the transport processing flow in the implementation method)

[0151] Figure 4 This is a diagram illustrating the flow chart of the delivery process for consumable components according to one embodiment. Figure 4 The left side displays the processing performed by the operator, while the right side displays the processing performed by the substrate processing system 1 (control device 30). Among these, in... Figure 4 In this process, the operations performed by the operator and displayed can be automatically executed by various parts of the substrate processing system 1 as appropriate.

[0152] First, the substrate processing system 1 executes the replacement time notification process for consumable components (step S21, refer to...). Figure 5 For example, the substrate processing system 1 determines whether it is time to replace the focus ring FR. Then, when the substrate processing system 1 determines that it is time to replace the focus ring FR, it sends a notification to the operator informing them of the replacement time (step S22). For example, the substrate processing system 1 displays information indicating the arrival of the replacement time on the display unit 34 of the control device 30.

[0153] The operator confirms whether a FR FOUP is set on the loading port LP of the substrate processing system 1. If no FR FOUP is set, the operator performs the process for setting the FR FOUP (step S23, see step S23). Figure 5 ).

[0154] The substrate processing system 1 detects that a FR (Front-End Frame) FOUP has been set using sensors and a reading unit, and stores the FR FOUP setting in the storage unit 31, thus completing the process (step S24, see reference). Figure 5 When setting up the FR (Focus Ring Optimizer) FOUP, the substrate processing system 1 notifies the operator that a replacement reservation for the FR can be made. For example, the substrate processing system 1 displays a screen on the display unit 34 indicating that the replacement reservation has been accepted.

[0155] The operator performs the prescribed input to the substrate processing system 1 to schedule a replacement of the focus ring FR (step S25). Based on the operator's input, the substrate processing system 1 stores the information indicating that the focus ring FR replacement schedule is complete in the storage unit 31 (step S26). Furthermore, the substrate processing system 1 notifies the operator that a replacement schedule for the focus ring FR is currently in progress (step S27). For example, the substrate processing system 1 displays the information indicating that a replacement schedule is in progress on the display unit 34.

[0156] Additionally, when executing a replacement reservation, the substrate processing system 1 resets the counter used for notifying the replacement time (step S28). The counter can be reset based on operator input (step S29), or it can be executed automatically by the substrate processing system 1 when executing a replacement reservation.

[0157] Furthermore, when the specified conditions are met, the substrate processing system 1 begins replacing the focus ring FR (step S30). When the substrate processing system 1 begins replacing the focus ring FR, it notifies the operator that the replacement is in progress (step S31). For example, the substrate processing system 1 displays the replacement information on the display unit 34.

[0158] Furthermore, when the replacement of the focus ring FR is completed (step S32), the substrate processing system 1 notifies the operator that the replacement is complete (step S33). For example, the substrate processing system 1 removes the information about the replacement process displayed on the display unit 34.

[0159] If the unused focusing ring FR stored in the FR FOUP is no longer available, the operator performs a process to remove the FR FOUP (step S34). The substrate processing system 1 detects that the removal process has been performed and ends the process (step S35). The above is the flow chart for the transport and processing of consumable components in the substrate processing system 1. Furthermore, Figure 4 The processing flow shown is an example, and can be followed by... Figure 4The steps can be executed in different orders, and additional processing can also be performed.

[0160] (An example of a displayed screen)

[0161] The display unit 34 of the substrate processing system 1 configured as described above displays the status of each processing component PM on the screen. The display unit 34 displays, for example, a graphical user interface (GUI). While viewing the GUI displayed by the display unit 34, the operator can perform input operations and set the processing of each component and the replacement time of consumable parts.

[0162] The display unit 34 displays the loading ports LP1, LP3, and LP5, which are capable of mounting FOUPs for chips, and the loading ports LP2 and LP4, which are capable of mounting any FOUP for chips and FRs, in a mutually recognizable manner.

[0163] Display unit 34 also displays the loading ports LP connected to the chip FOUP and the loading ports LP not connected to the chip FOUP in a recognizable manner. Display unit 34 also displays the loading ports LP connected to the FR FOUP and the loading ports LP not connected to the FR FOUP in a recognizable manner.

[0164] The display unit 34 also displays the number and location of the wafers W stored in the wafer FOUP connected to the loading port LP in a recognizable manner. The display unit 34 also displays the number of processed wafers W and the number of unprocessed wafers W stored in the wafer FOUP in a recognizable manner. The display unit 34 also displays the number of focus rings FR stored in the FR FOUP connected to the loading port LP in a recognizable manner. The display unit 34 also displays the number of unused focus rings FR and the number of used focus rings FR stored in the FR FOUP in a recognizable manner.

[0165] The display unit 34 also displays various processing conditions, such as modes and schemes, set for the processing components PM. The display unit 34 can switch the display screen according to the operator's input. The operator can switch between the individual screen of each processing component PM and the overall screen showing the status of the substrate processing system 1 as a whole, and display them on the display unit 34 according to the instructions.

[0166] (An example of the process for handling time change notifications)

[0167] Next, regarding Figure 4 The details of each process shown will be explained. First, the change time notification process (step S21) will be explained.

[0168] As described above, the substrate processing system 1 of the embodiment determines whether the replacement time of the focus ring FR has arrived. Then, if the substrate processing system 1 determines that the replacement time has arrived, it notifies the operator of the information that the replacement time has arrived.

[0169] Here, the substrate processing system 1 determines whether the replacement time of the focusing ring FR has arrived based on predetermined parameters. Then, when the predetermined parameters reach a threshold, the substrate processing system 1 determines that the replacement time has arrived.

[0170] For example, in the substrate processing system 1, parameters for judgment and threshold values ​​for these parameters are pre-stored in the storage unit 31 of the control device 30. Parameters include, for example, the number of plasma treatments performed by the processing component PM after replacing the focusing ring FR, the duration of the plasma treatment (discharge time), the number of wafers W processed, and the exposure time of the focusing ring FR in the plasma. For example, when the parameter is set to the number of plasma treatments performed after replacing the focusing ring FR, the threshold value can be set to 4000 times. Furthermore, different parameters and threshold values ​​can be set for various types of consumable components. In addition to the replacement of consumable components, parameters and threshold values ​​can also be set for other maintenance items such as cleaning and maintenance to prevent component aging. Furthermore, when multiple processing components PM have the same consumable components, different parameters and threshold values ​​can be set for each processing component PM. Parameters and threshold values ​​can be pre-set in the substrate processing system 1 or set by the operator. Additionally, the substrate processing system 1 can be configured to determine the execution time when no maintenance is performed within the substrate processing system 1, and instead display information corresponding to notifications received from external devices such as a host device.

[0171] Figure 5This is a flowchart illustrating an example of the process for notification of a replacement time in a substrate processing system 1 according to one embodiment. First, the operator inputs the parameters used in determining the replacement time and the threshold value of those parameters into the substrate processing system 1. The substrate processing system 1 sets the parameters and threshold value based on the input (step S51). Then, the substrate processing system 1 counts parameters such as the number of wafers W processed. The substrate processing system 1 determines whether the count value has reached the set threshold value (step S52). If it is determined that the threshold value has not been reached (step S52, No), the substrate processing system 1 repeats the determination in step S52. On the other hand, if it is determined that the threshold value has been reached (step S52, Yes), the substrate processing system 1 sends a notification that the replacement time has arrived (step S53). For example, the substrate processing system 1 displays the replacement time notification on the display unit 34. Then, the substrate processing system 1 determines whether there is an instruction to reset the count (step S54). If it is determined that there is no instruction to reset the count (step S54, No), the substrate processing system 1 repeats the determination in step S54. On the other hand, if it is determined that there is an indication to reset (step S54, yes), the substrate processing system 1 resets the count (step S55). Then, the substrate processing system 1 returns to step S52 to repeatedly perform the processing.

[0172] (An example of using FOUP to set up the processing flow in FR)

[0173] Next, the process for setting FR using FOUP will be explained. Figure 4 An example of the process in steps S23 and S24. Figure 6 This is a flowchart illustrating an example of the process for setting up FR using FOUP in a substrate processing system 1 according to one embodiment.

[0174] As described above, the substrate processing system 1 of the embodiment displays in a recognizable manner the loading ports LP2, LP4 for setting any FOUP for wafers and FR, and the loading ports LP1, LP3, LP5 for setting wafer FOUPs. The display unit 34, for example, displays the loading ports LP for setting FR FOUPs and LP for setting wafer FOUPs using different colors.

[0175] First, the operator specifies the object loading port (e.g., loading port LP4) for setting FR using FOUP on the screen displayed on the display unit 34 of the substrate processing system 1. Then, the operator sets the access mode of the object loading port LP4 to manual mode (step S701).

[0176] When the operator sets the loading port LP4 to manual mode, the substrate processing system 1 detects the set mode (step S702) and changes the access mode stored in the storage unit 31 corresponding to the loading port LP4 to manual mode.

[0177] Next, the operator, for example, operates an AGV to load the FR using FOUP into loading port LP4, which serves as the object loading port (step S703). Then, the operator inputs an instruction to the substrate processing system 1 to set the FR using FOUP (step S704). The substrate processing system 1 detects the instruction input (step S705).

[0178] When the substrate processing system 1 detects the input indication, it first stops the FR FOUP card at the loading port LP4 (step S706). When the FR FOUP card stops at the loading port LP4, the reading unit of the loading port LP4 reads the carrier ID of the FR FOUP. The carrier ID read by the reading unit is sent to the processing unit 32 of the control device 30. The processing unit 32 determines whether the carrier ID is the carrier ID of the FR FOUP and authenticates the carrier ID (step S707). Since the loading port LP4 is the loading port for the FR FOUP, if the carrier ID is the carrier ID of the wafer FOUP, the processing unit 32 notifies the operator that the content cannot be set. For example, the processing unit 32 causes the display unit 34 to display a notification that the content cannot be set. On the other hand, if the read carrier ID is the carrier ID of the FR FOUP, the processing unit 32 authenticates the carrier ID. The authenticated carrier ID is stored in the storage unit 31 corresponding to the loading port LP4. In addition, the processing unit 32 sets the threshold of the mapping sensor MS according to the authenticated carrier ID.

[0179] When the carrier ID is authenticated, the substrate processing system 1 then connects the mounted FR FOUP to the loading port LP4 (step S708). After the FR FOUP is connected, the substrate processing system 1 opens the cover of the FR FOUP and the door of the loading port LP4, connecting the FR FOUP to the atmospheric pressure delivery chamber 20 (step S709). When the cover of the FR FOUP is open, the mapping sensor MS performs mapping of the focus rings FR within the FR FOUP (step S710). The mapping sensor MS detects the position and number of focus rings FR within the FR FOUP. At this time, the mapping sensor MS performs detection based on a scale value (calibration reference value, threshold) suitable for the size of the focus rings FR. The mapping sensor MS notifies the control device 30 of the detected position and number of focus rings FR. The control device 30 stores the notified position and number of focus rings FR in the storage unit 31. Then, the control device 30 displays the position and number of focus rings FR on the display unit 34 to update the screen (step S711). Here, the FR FOUP setting process is completed.

[0180] When the FR FOUP is set, the display unit 34 updates the display screen according to each setting stage. The display unit 34 displays the loading port where the FR FOUP is not set (first state) and the loading port where the FR FOUP is connected but the mapping of the focus ring FR is not completed (second state) in different ways. In addition, the display unit 34 displays the loading ports in the first and second states and the loading port where the FR FOUP is connected and the mapping of the focus ring FR is completed (third state) in different ways.

[0181] (An example of the FR retrieval process using FOUP)

[0182] Next, the process of removing FR using FOUP will be explained. Figure 4 An example of steps S34 and S35. Figure 7 This is a flowchart illustrating an example of the process of retrieving and processing FR using FOUP in a substrate processing system 1 according to one embodiment.

[0183] The operator first specifies the object loading port (e.g., loading port LP4) on the display screen. Then, the operator enters an instruction to retrieve the FR using FOUP (step S901).

[0184] The substrate processing system 1 receives an instruction from the operator (step S902). Upon receiving the instruction, the substrate processing system 1 first closes the cover of the FR FOUP (step S903). Then, the substrate processing system 1 disconnects the FR FOUP from the loading port LP4 (step S904). Furthermore, the substrate processing system 1 releases the locking mechanism of the FR FOUP (step S905). When the locking mechanism is released, the substrate processing system 1 notifies the operator that the FR FOUP has been successfully removed (step S906). For example, the substrate processing system 1 displays the completion of the removal on the display unit 34. Upon receiving the notification from the substrate processing system 1, the operator operates the AGV to remove the FR FOUP from the loading port LP4 and transport it (step S907). After the transport is completed, the operator inputs a prescribed instruction to the substrate processing system 1 (step S908). When the substrate processing system 1 receives the operator's instruction input, it stores the completion of the FR FOUP removal in the storage unit 31 and updates the screen (step S909). Therefore, FR is completed by retrieving FOUP.

[0185] Furthermore, the display unit 34 displays the loading port LP during the FOUP's take-out process (state 4) in a manner different from that in states 1 to 3.

[0186] (Example 1 of FR processing using FOUP settings)

[0187] In the above description, the reading unit of the loading port LP reads the carrier ID of the FR FOUP, the processing unit 32 authenticates it, and stores it in the storage unit 31. However, there are also cases where each FOUP is not pre-assigned a carrier ID. Therefore, the substrate processing system 1 is configured so that the operator can input the carrier ID when setting the FOUP.

[0188] For example, the storage unit 31 pre-stores information about the carrier ID input screen that accepts input from the operator. Figure 6 After the processing begins, when the operator inputs the FOUP setting instruction into the substrate processing system 1 (step S704), the substrate processing system 1 executes steps S705 to S706. Then, in step S707, the substrate processing system 1 displays the carrier ID input screen instead of reading the carrier ID. The operator inputs information about the carrier ID of the specific object loading port LP and the FOUP in the setting process for that object loading port LP into the carrier ID input screen. When a carrier ID is input into the carrier ID input screen, the processing unit 32 identifies whether the carrier ID is the ID of the FR FOUP or the ID of the wafer FOUP. The identification result is stored in the storage unit 31. As described above, in Figure 6 In the processing, instead of step S707, the substrate processing system 1 performs the display of the carrier ID input screen, the acceptance of carrier ID input, and the authentication of the carrier ID. The processing of the carrier ID input and authentication is similar to... Figure 6 The processing (after step S708) is the same.

[0189] In addition, in step S707, if the substrate processing system 1 fails to read the carrier ID, the carrier ID input screen is displayed.

[0190] (Example 2 of FR using FOUP settings)

[0191] In the above description, the substrate processing system 1 identifies the FR FOUP and the wafer FOUP through the carrier ID. However, it is not limited to this and the substrate processing system 1 can also be configured to identify the FR FOUP and the wafer FOUP based on the operator's input.

[0192] For example, similar to the above-described variation 1, the storage unit 31 stores information about the input screen that receives input from the operator in advance. Figure 6After processing begins, when the operator inputs the FOUP setting instruction into the substrate processing system (step S704), the substrate processing system 1 executes steps S705-706. Then, in step S707, the substrate processing system 1 displays the carrier ID input screen instead of reading the carrier ID. The input screen in Modification 2 differs from that in Modification 1; the operator specifies the type of FOUP. The operator inputs whether the FOUP specified in the settings is a wafer FOUP or an FR FOUP into the loading port on the input screen. Figure 6 In the processing, instead of step S707, the substrate processing system 1 performs the display of the FOUP type and carrier ID input screen and the acceptance of input content. Subsequent processing and... Figure 6 The processing (after step S708) is the same.

[0193] The input screen of Modification 2 can be displayed if the substrate processing system 1 fails to read the carrier ID. Additionally, the input screen of Modification 2 can also be displayed if the information entered in the carrier ID input screen of Modification 1 is invalid.

[0194] By configuring it in the above manner, even if a FOUP without a carrier ID is set or if the operator makes an erroneous input, the substrate processing system 1 can still attract the operator's attention and ensure that the processing is not delayed.

[0195] (An example of changing the appointment processing procedure)

[0196] Next, the process for scheduling a replacement of the focusing ring FR will be explained. Figure 4 An example of steps S25 to S27.

[0197] Here, "replacement reservation" refers to instructing the substrate processing system 1 to perform the replacement of consumable components such as the focus ring FR when the replacement time arrives. In this embodiment, the replacement of consumable components is performed by the substrate processing system 1 when a replacement reservation is made by the operator. Alternatively, the substrate processing system 1 may be configured to automatically start the replacement process when the replacement time arrives. In this case, the replacement reservation process is omitted.

[0198] (Change the executable time for appointment processing)

[0199] In this embodiment, the replacement reservation process can be performed after the FR FOUP for the loading port LP is set. If the FR FOUP is not set on the loading port LP, the substrate processing system 1 cannot perform the replacement reservation process. Alternatively, the substrate processing system 1 will display an error message if the operator attempts to perform the replacement reservation process.

[0200] Figure 8AThis is a flowchart illustrating an example of the replacement reservation processing flow in a substrate processing system 1 according to one embodiment. The operator first inputs an instruction to the substrate processing system 1 to display a replacement reservation screen (step S1301). The substrate processing system 1 displays the replacement reservation screen according to the instruction input (step S1302). If no FR (Front-Up FOUP) is set, the substrate processing system 1 displays an error message and terminates the process. The replacement reservation screen displays, for example, a list of consumables whose replacement time is approaching, a list of processing components (PM) that configure these consumables, and a corresponding input button for the replacement reservation. When the replacement reservation screen is displayed, the operator performs replacement reservation input on the screen (step S1303). For example, the operator presses a designated button on the screen. When the substrate processing system 1 receives the operator's input, it displays a warning screen regarding the replacement reservation (display warning, step S1304). The warning screen indicates the time for performing the replacement processing, etc. When the operator performs a confirmation input on the warning screen (step S1305), the substrate processing system 1 performs the replacement reservation. That is, the substrate processing system 1 stores the replacement reservation in the storage unit 31 in correspondence with the processing component PM that is the replacement reservation target (step S1306). Then, the substrate processing system 1 displays the "replacement reservation in progress" information and the processing component PM that is the target in correspondence on the display unit 34 (step S1307). Thus, the replacement reservation processing is completed.

[0201] Figure 8B This is a flowchart illustrating an example of the replacement reservation cancellation process in a substrate processing system 1 according to one embodiment. After executing a replacement reservation, the substrate processing system 1 performs a cancellation process based on operator input.

[0202] The operator first inputs the display instruction for the replacement appointment cancellation screen into the substrate processing system 1 (step S1308). Based on the operator's input, the substrate processing system 1 displays the replacement appointment cancellation screen (step S1309). The replacement appointment cancellation screen displays the loading port LP in the replacement appointment. Additionally, the replacement appointment cancellation screen displays the input button for canceling the replacement appointment corresponding to the loading port LP. For example, the replacement appointment cancellation screen displays the processing component PM, the consumable item to be replaced, and the cancellation button corresponding to the replacement appointment. The operator performs the cancellation input for the replacement appointment in the appointment cancellation screen (step S1310). For example, the operator presses the cancellation button in the replacement appointment cancellation screen. Based on the operator's input, the substrate processing system 1 deletes the replacement appointment stored corresponding to the processing component PM and consumable item from the storage unit 31 (step S1311). Then, the substrate processing system 1 deletes the "Replacement in Progress" information from the display (step S1312). Thus, the replacement appointment cancellation process is completed.

[0203] (An example of changing the processing flow)

[0204] Next, the replacement procedure for consumable parts will be explained. Figure 4 An example of the process of steps S30 to S33. Figure 9 This is a flowchart illustrating an example of the replacement process in a substrate processing system 1 according to one embodiment.

[0205] When a replacement reservation is stored in storage unit 31, the substrate processing system 1 first detects the status of the processing component PM that is the target. While processing is being performed in the target processing component PM, the substrate processing system 1 puts the replacement processing into standby mode. When the processing of the target processing component PM ends and it becomes idle (step S1501), the substrate processing system 1 changes the mode of the target processing component PM to non-production mode (step S1502). Then, the substrate processing system 1 stores the mode change of the target processing component PM in storage unit 31 (step S1503). The substrate processing system 1 changes the display from "Replacement Reservation in Progress" to "Replacement in Progress" on display unit 34 (step S1504). The substrate processing system 1 executes processing to ensure a replacement path (step S1505). For details of the processing to ensure a replacement path, please refer to [link to relevant documentation]. Figure 10 The following will describe the process. Then, the substrate processing system 1 performs a replacement (step S1506). During the replacement in step S1506, the substrate processing system 1 simultaneously delivers the used focus ring FR from the processing component PM and the unused focus ring FR from the FR FOUP. After the replacement is completed, the substrate processing system 1 changes the mode of the object processing component PM to production mode (step S1507). Then, the substrate processing system 1 stores the mode change of the object processing component PM in the storage unit 31 (step S1508). The substrate processing system 1 deletes the "Replacing" display shown on the display unit 34 (step S1509). Thus, the replacement process ends.

[0206] (Used to ensure processing when changing paths)

[0207] Before starting the replacement of the focusing ring FR, the substrate processing system 1 ensures the replacement path within the vacuum delivery chamber 10, the loading interlock unit LLM, and the atmospheric pressure delivery chamber 20. Figure 9 Step S1505). Figure 10 This is a flowchart illustrating the process of ensuring the change path in a substrate processing system 1 according to one embodiment.

[0208] First, the substrate processing system 1 determines whether a wafer W is present on the transport path (step S1101). The transport path refers to the vacuum transport chamber 10, the loading interlock unit LLM, and the atmospheric pressure transport chamber 20. If the substrate processing system 1 determines that there is no wafer W or focus ring FR on the transport path (step S1101, No), it determines whether there is a wafer W being processed in the processing assembly PM (step S1102). If it determines that there is a wafer W being processed (step S1102, Yes), the substrate processing system 1 puts the start standby for the next step of processing on standby after the processing in the processing assembly PM is completed, and performs the processing segmentation (step S1103). For example, after the processing is completed until the replacement processing is completed, the substrate processing system 1 keeps the processed wafer W in standby in the processing assembly PM. Then, the substrate processing system 1 performs the replacement of the focus ring FR (step S1104). On the other hand, if it determines that there is no wafer W being processed (step S1102, No), the substrate processing system 1 performs the replacement of the focus ring FR (step S1104).

[0209] On the other hand, if it is determined that there is a wafer W on the transport path (step S1101, yes), the substrate processing system 1 determines whether the wafer W is the wafer before processing (step S1105). If it is determined to be the wafer before processing (step S1105, yes), the substrate processing system 1 transports the wafer W to the processing component PM that performs the processing (step S1106).

[0210] Returning to step S1105, if the wafer is determined to be processed (step S1105, No), the substrate processing system 1 determines whether the processing of the wafer W is completely finished (step S1107). If it is determined that the processing is completely finished (step S1107, Yes), the substrate processing system 1 returns the wafer W to the wafer FOUP that houses the wafer W (step S1108). On the other hand, if it is determined that the processing is not completely finished (step S1107, No), the substrate processing system 1 transports the wafer to the processing component PM for further processing (step S1109). Then, processing can be performed. After steps S1106, S1108, and S1109, processing proceeds to step S1104, where the substrate processing system 1 performs a change.

[0211] In addition, Figure 10In the example, once the wafer W before processing is sent out from the FOUP, it is not returned to the wafer FOUP but is transported to the processing component PM at the destination (see step S1106). However, if returning to the wafer FOUP is more efficient, the wafer W before processing can be returned to the wafer FOUP. Furthermore, after the wafer W before processing is sent into the processing component PM and the gate valve GV is closed, the processing of the wafer W is performed within the processing component PM during the replacement of the focus ring FR. Additionally, if it is ensured that the processing of the wafer W has already been performed within the processing component PM during the path change process, this processing can continue during the replacement of the focus ring FR. That is, the sending and receiving of the focus ring FR in the vacuum processing chamber (processing component PM) of the target device and the vacuum processing of the wafer W in a vacuum processing chamber other than the target device can be performed in parallel.

[0212] Alternatively, you can start Figure 10 Before step S1104, the system is set to standby mode until the temperature of the base 114 (lower electrode) reaches a predetermined temperature. During plasma processing of the wafer W, the processing assembly PM becomes very hot; therefore, even if the transport path can be ensured, the focusing ring FR within the processing assembly PM may become hot. When the focusing ring FR is hot, it may come into contact with the electrostatic chuck 120 due to thermal expansion when lifted from the base 114. Furthermore, when the focusing ring FR is hot, the VTM arm 15 and LM arm 25 are prone to slipping during holding and transport. Therefore, in Figure 10 Before step S1104, it is also possible to detect whether the temperature of the processing component PM is at the specified temperature (normal temperature, such as the temperature in the range of 20℃±15℃), and put the processing into standby mode until it reaches the specified temperature.

[0213] (Change execution process)

[0214] Figure 11 This is a diagram illustrating the replacement process in a substrate processing system 1 according to one embodiment. The substrate processing system 1 then performs the replacement after ensuring a path for replacing the focus ring FR. Figure 9 Step S1506). In this embodiment, during replacement, the substrate processing system 1 performs the transport of the used focus ring FR and the transport of the unused focus ring FR in parallel. Figure 11 In the example, the used focusing ring FR configured in the processing component PM1 is replaced with the unused focusing ring FR configured in the FOUP of the carrier port LP4.

[0215] In this case, substrate processing system 1 first executes... Figure 9Steps S1501 to S1505 ensure the replacement path. Upon confirming that the replacement path has been ensured, the substrate processing system 1 actuates the VTM arm 15 to hold the focus ring FR within the processing assembly PM. Simultaneously, the substrate processing system 1 activates the LM arm 25 to hold the focus ring FR within the FR FOUP. Then, the substrate processing system 1 performs the parallel transport of the used focus ring FR using the VTM arm 15. Figure 11 (1) and the unused focusing ring FR transported using LM arm 25 Figure 11 (2)). The used focusing ring FR is transported to the loading interlock unit LLM2 ( Figure 11 (3)). The substrate processing system 1 will have the loaded interlock unit LLM2, which carries the used focus ring FR, exposed to the atmosphere. On the other hand, the unused focus ring FR will be transported to the loaded interlock unit LLM1 ( Figure 11 (4)). The substrate processing system 1 performs vacuuming of the loading interlock unit LLM1, which has been used to transport unused focus rings FR. The substrate processing system 1 further causes the VTM arm 15 to hold the unused focus rings FR placed in the loading interlock unit LLM1. On the other hand, the substrate processing system 1 causes the LM arm 25 to hold the used focus rings FR placed in the loading interlock unit LLM2. Then, the substrate processing system 1 performs the transport of the used focus rings FR using the LM arm 25 in parallel. Figure 11 (5)) and the unused focusing ring FR transported using VTM arm 15 ( Figure 11 (6)). In this way, the unused focusing ring FR is transported to the processing unit PM1. In addition, the used focusing ring FR is transported to the FR FOUP. Furthermore, during replacement, the usual product wafer W is not transported.

[0216] Figure 12 This is a diagram illustrating the effect of reducing downtime when the focus ring FR is replaced using the substrate processing system 1 of one embodiment.

[0217] Figure 12This example illustrates the time required to transport both used and unused focus rings (FRs) separately. The time required for the LM arm 25 to grip the focus ring FR stored in the FR FOUP is approximately 25 seconds. Then, the time required for the LM arm to position the focus ring FR into the loading interlock unit LLM is approximately 25 seconds. Furthermore, the time required to close the gate valve of the loading interlock unit LLM for vacuuming is approximately 10 seconds. Next, the VTM arm 15 to grip the focus ring FR from the loading interlock unit LLM is approximately 25 seconds. Furthermore, the time required to position the focus ring FR gripped by the VTM arm 15 into the processing unit PM is approximately 25 seconds. Then, the time required to lower the second lifting pin 182 supporting the focus ring FR positioned in the processing unit PM and close the gate valve GV is approximately 10 seconds. Additionally, the standby time for continuous operation of the loading interlock unit LLM is approximately 20 seconds. Therefore, the time required to transport the focus ring FR from the FOUP to the processing unit PM is approximately 140 seconds.

[0218] On the other hand, the time required to transport the used focusing ring FR from the processing unit PM to the FOUP is as follows. First, it takes approximately 25 seconds for the VTM arm 15 to grasp the focusing ring FR within the processing unit PM. Then, it takes approximately 25 seconds for the VTM arm 15 to place the grasped focusing ring FR into the loading interlock unit LLM. Then, it takes approximately 10 seconds to restore the depressurized atmosphere of the loading interlock unit LLM with the focused ring FR in place to atmospheric atmosphere. After the loading interlock unit LLM becomes atmospheric atmosphere, the gate valve on the atmospheric pressure delivery chamber 20 side of the loading interlock unit LLM is opened. Then, it takes approximately 25 seconds for the LM arm 25 to grasp the focusing ring FR from the loading interlock unit LLM. The LM arm 25 transports the grasped focusing ring FR to the loading port LP and places it within the FOUP. This process takes approximately 25 seconds. In addition, the standby time for the loading interlock unit LLM to operate continuously takes approximately 20 seconds. Therefore, the recovery of the used focusing ring FR takes approximately 130 seconds.

[0219] If, after performing the recycling of the used focus ring FR in the above replacement process, the unused focus ring FR is then transported to the processing unit PM, the processing time would be approximately 140 seconds + approximately 130 seconds = approximately 270 seconds. However, as in this embodiment, by performing the recycling of the used focus ring FR and the transport of the unused focus ring FR in parallel, the replacement process can be completed in approximately 140 seconds. Therefore, the substrate processing system 1 of this embodiment can significantly reduce downtime caused by the replacement of consumable components.

[0220] Furthermore, the vacuum transport chamber 10 is maintained under reduced pressure during replacement, allowing processing to continue in a processing unit PM other than the one being replaced. For example, if the processing time required to perform one cycle of processing in a processing unit PM is 140 seconds or more, the replacement of consumable parts can be performed without stopping processing in the processing unit PM that is not being replaced. Conversely, if the processing time required to perform one cycle of processing in a processing unit PM is less than 140 seconds, the processed wafer W can be left in standby mode within the processing unit PM. Therefore, contamination caused by the simultaneous presence of the product wafer W and the focusing ring FR in the vacuum transport chamber 10 can be prevented.

[0221] (Parameter settings during transport in the process of changing)

[0222] In the embodiment of the substrate processing system 1, during the transport of the wafer W and the focusing ring FR, the control methods of the VTM arm 15, LM arm 25, first lifting pin 172, second lifting pin 182, support pin, etc., are changed according to their respective sizes and shapes. For example, the substrate processing system 1 changes the following parameters: (1) the driving speed of the VTM arm 15 and LM arm 25; (2) the driving speed of the second lifting pin 182 in the processing component PM.

[0223] (1) Drive speed of VTM arm 15 and LM arm 25

[0224] The VTM arm 15 and LM arm 25 of the substrate processing system 1 are adjusted to accommodate the transport of wafer W during normal product wafer W processing. During replacement, the VTM arm 15 and LM arm 25 are adjusted to accommodate the transport of the focus ring FR. Therefore, before starting the replacement, the substrate processing system 1 switches the drive speeds of the VTM arm 15 and LM arm 25.

[0225] For example, when the substrate processing system 1 starts replacing ( Figure 9 At the start of step S1506, the drive speeds of the VTM arm 15 and LM arm 25 are switched to speeds different from those used during the normal processing of the product wafer W. For example, the substrate processing system 1 can switch the drive speeds of the VTM arm 15 and LM arm to a lower speed than the drive speed used during wafer W transport. This is because the focusing ring FR has a smaller area that can be held in a ring shape, making it easier for positional shifts to occur on the VTM arm 15 and LM arm 25 compared to the wafer W. For example, the drive speeds of the VTM arm 15 and LM arm 25 can be preset in the storage unit 31 of the substrate processing system 1. Then, the substrate processing system 1 is configured to switch the drive speed during changeover processing and during normal product wafer W transport. Alternatively, the drive speed can also be manually set by the operator.

[0226] (2) Drive speed of the second lifting pin in the processing component PM

[0227] Additionally, the substrate processing system 1 sets the drive speed of the second lifting pin 182 within the processing component PM to be suitable for the focus ring FR. For example, the substrate processing system 1 learns and stores the drive speed of the second lifting pin 182 in advance through machine learning. Figure 13A This is a diagram illustrating the operation of the second lifting pin 182 when the focusing ring FR is fed into the substrate processing system 1 according to one embodiment. Figure 13B This is a diagram illustrating the operation of the second lifting pin 182 when the focus ring FR is delivered in a substrate processing system 1 according to one embodiment.

[0228] Before performing each process, the substrate processing system 1 performs mechanical learning on the first and second lifting pins 172 and 182 and the support pin. Then, the substrate processing system 1 sets, for example, the maximum speed, minimum speed and pin rise delay of the second lifting pin 182 in the processing component PM when receiving the focus ring FR, and stores them in the storage unit 31.

[0229] The operation of the second lifting pin 182 during the insertion of the focus ring FR will be explained. The second lifting pin 182 is housed within the base 114 and moves up and down during the insertion and removal of the focus ring FR. Here, the position of the upper surface of the base 114 is referred to as the first height H1, and the position when the focus ring FR is transported using the VTM arm 15 is referred to as the second height H2.

[0230] Additionally, the area near the base 114 within the distance from the first height H1 to the second height H2 is referred to as range R1, and the area near the conveying position is referred to as range R2 (see reference). Figure 13A Here, "nearby" refers to a range within a specified distance in the vertical direction, such as 0.5 mm. This specified distance is the distance used to adjust the impact when the focusing ring FR contacts the second lifting pin 182, or when the focusing ring FR contacts the VTM arm 15. For example, in... Figure 13A In the example, the range R1 refers to the range within a specified distance upwards from the upper surface of the base 114. Specifically, the range R1 can also be the range within a specified distance downwards vertically from the upper surface of the base 114. Furthermore, in... Figure 13A In the example, range R2 refers to the range within a specified distance vertically downwards from the conveying height H2 of the focusing ring FR. However, range R2 can also be the range within a specified distance vertically downwards from the second height H2. The range between the first height H1 and the second height H2, excluding ranges R1 and R2, is referred to as range R3.

[0231] When not being fed in or out, the second lifting pin 182 is retracted into the base 114, with its top positioned at or below the first height H1. During the feeding of the focusing ring FR, the second lifting pin 182 is driven by the second drive mechanism 180, protruding from the base 114 and rising to a third height H3 (see reference 180) that is lower than the second height H2. Figure 13A Next, VTM arm 15 places the focus ring FR on the pickup (17a or 17b) and delivers it into the processing unit PM while maintaining it at a second height H2. When the focus ring FR placed on VTM arm 15 reaches base 114, the second lifting pin 182 rises to the second height H2. At this time, the second lifting pin 182 waits for a predetermined time until VTM arm 15 stops moving and the swing of the focus ring FR converges before beginning to rise. This waiting time is referred to as the pin rise delay. Then, the second lifting pin 182 receives the focus ring FR at the second height H2. After receiving it, the second lifting pin 182 descends, and the focus ring FR is placed on base 114.

[0232] When the focus ring FR is fed into the substrate processing system 1, the driving speed of the second lifting pin 182 is switched from a speed in range R2 to a lower speed than ranges R1 and R3 during the upward movement, and from a speed in range R1 to a lower speed than ranges R2 and R3 during the downward movement. This is to reduce the impact when the second lifting pin 182 contacts the focus ring FR and to prevent damage to the focus ring FR. Figure 13A In this example, the range R1 is set above the upper surface of the base 114, but the range R1 can also be set in both the upper and lower directions of the upper surface of the base 114. In addition, the range R2 can also be set in both the upper and lower directions of the second height H2.

[0233] Next, refer to Figure 13B Explain the action of the second lifting pin 182 during the delivery of the focusing ring FR. Figure 13B In this context, a predetermined distance extending vertically downwards from the upper surface (H1) of the base 114 is defined as range R4, and a predetermined distance extending vertically upwards from the second height H2 is defined as range R6. Furthermore, the portion of the range between the second height H2 and the fourth height H4 that is not included in range R6 is referred to as range R5. Moreover, the values ​​of the predetermined distances and ranges are set as described above. Figure 13A The same applies to other examples.

[0234] During the delivery of the focus ring FR, the second lifting pin 182 first rises to a first height H1. Then, as the top of the second lifting pin 182 abuts against the focus ring FR, it supports the focus ring FR and rises to a fourth height H4. The fourth height H4 is vertically higher than the second height H2 at which the focus ring FR was delivered. With the second lifting pin 182 holding the focus ring FR at the fourth height H4, the pickup (17a or 17b) of the VTM arm 15 enters the processing assembly PM and stops below the focus ring FR. At this time, the height of the pickup of the VTM arm 15 is the second height H2. Similarly, after a specified waiting time until the swing convergence of the VTM arm 15, the second lifting pin 182 descends, and the VTM arm 15 receives the focus ring FR supported on the second lifting pin 182. While maintaining the focusing ring FR, the VTM arm 15 moves from the processing assembly PM into the vacuum delivery chamber 10, delivering the focusing ring FR.

[0235] When the focus ring FR is ejected, the substrate processing system 1 switches the speed of the second lifting pin 182 in range R4 to a lower speed than ranges R5 and R6 during the upward movement, and switches the speed in range R6 to a lower speed than ranges R4 and R5 during the downward movement. For example, the substrate processing system 1 sets the driving speed of the second lifting pin to a first speed in range R4 during the upward movement, and a second speed higher than the first speed in ranges R5, R6, and other ranges. Furthermore, during the downward movement, it sets the speed to a first speed in range R6, and a second speed higher than the first speed in ranges R4, R5, and other ranges.

[0236] Specifically, the substrate processing system 1 switches the drive speed of the second lifting pin 182 to a low first speed during the period from when the second lifting pin 182 is about to contact the focusing ring FR until contact is made. Additionally, the substrate processing system 1 switches to the low first speed during the period from when the focusing ring FR, supported by the second lifting pin 182, is about to contact the base 114 and VTM arm 15 until placement is complete. Within the range where the focusing ring FR is not in contact with other components, the substrate processing system 1 drives the second lifting pin 182 at a high second speed.

[0237] Therefore, the substrate processing system 1 pre-sets and stores the first speed, second speed, and standby time (pin rise delay) of the second lifting pin 182 through machine learning. For example, the substrate processing system 1 sets the first speed and second speed in the range of 1 to 15 mm / s. In addition, for example, the substrate processing system 1 sets the standby time of the second lifting pin 182 in the range of 0.0 to 60.0 seconds.

[0238] The substrate processing system 1 can also set the drive speed of the support pin within the loading interlock unit LLM in the same way as the second lifting pin 182. For example, the drive speed of the support pin can be set in the range of 1 to 1700 mm / s.

[0239] (Specification of delivery path)

[0240] In this embodiment, as described above, the transport of used focus rings (FRs) and unused focus rings (FRs) are performed in parallel. Therefore, the substrate processing system 1 includes at least two loading interlock units (LLMs). The substrate processing system 1 then uses one loading interlock unit (e.g., LLM1) for transporting used focus rings (FRs) and the other loading interlock unit (e.g., LLM2) for transporting unused focus rings (FRs).

[0241] Furthermore, to improve transport accuracy, the pickups of VTM arm 15 and LM arm 25 can be specified as the transport path for unused focus rings FR. Transport accuracy refers to the precision and stability of the position of the focus ring FR during transport. When transport accuracy is high, the deviation between the designed transport path and the actual transported focus ring FR position is small; when transport accuracy is low, the deviation is large. Additionally, when transport accuracy is high, the position variation of the focus ring FR is small during each transport; when transport accuracy is low, the position variation is large. For example, as the transport path for unused focus rings FR, substrate processing system 1 specifies the first pickup 17a of VTM arm 15 and the first pickup 27a of LM arm 25. Furthermore, as the transport path for unused focus rings FR, substrate processing system 1 specifies the loading interlock unit LLM1.

[0242] Furthermore, as the transport path for the used focus ring FR, the substrate processing system 1 specifies the second pickup 17b of the VTM arm 15 and the second pickup 27b of the LM arm 25. Additionally, as the transport path for the used focus ring FR, the substrate processing system 1 specifies the loading interlock unit LLM2. The substrate processing system 1 stores the specified transport path in the storage unit 31.

[0243] For example, the storage unit 31 stores information for determining the first pickup 17a of the VTM arm 15, the first pickup 27a of the LM arm 25, and the loading interlock unit LLM1, as the default value for the transport path of the unused focus ring FR. Additionally, the storage unit 31 stores information for determining the second pickup 17b of the VTM arm 15, the second pickup 27b of the LM arm, and the loading interlock unit LLM2, as the default value for the transport path of the used focus ring FR. Then, during replacement processing, the substrate processing system 1 determines the transport path based on the information stored in the storage unit 31.

[0244] By specifying the transport path as described above, the substrate processing system 1 can use a different path for each transport, thereby suppressing minor deviations in the transport accuracy of the focus ring FR. For example, even if the first pickup 17a and the second pickup 17b of the VTM arm 15 each have positional deviations, the unused focus ring FR can be transported along the same path to suppress the reduction in transport accuracy. Furthermore, for used focus ring FRs, the necessity for precise control of transport accuracy is reduced; therefore, when specifying the pickups used in transport, unused focus ring FRs are prioritized. However, a transport path can also be specified for used focus ring FRs.

[0245] (Switching of processing modes)

[0246] exist Figure 9 In the example, the substrate processing system 1 switches the object processing component PM to non-production mode to perform the replacement process, and then switches back to production mode after the replacement process is complete. However, it is not limited to this; the substrate processing system 1 may not automatically switch to production mode after the replacement process, but may switch to production mode based on the operator's input.

[0247] For example, the default value of the operation mode after the replacement process is completed is set to "non-production mode" and stored in the storage unit 31, so that the setting will not be changed automatically. By setting it in this way, when conservative operations such as coating processes of the processing component PM need to be performed after the focus ring FR is replaced, it is possible to prevent the wafer W from being automatically sent into the processing component PM before the conservative operation.

[0248] (The replacement process has been suspended)

[0249] After the substrate processing system 1 starts the replacement process, there may be situations where the focus ring FR falls off the VTM arm 15 or the LM arm 25, making it impossible for the replacement process to continue. Therefore, the substrate processing system 1 of this embodiment can detect this state and stop the replacement process.

[0250] After the changeover process begins, if either the first sensor S1 or the second sensor S2 of the substrate processing system 1 fails to detect the focus ring FR, the processing unit 32 is notified of this situation. Upon receiving the notification, the processing unit 32 stops the operation of the drive system (VTM arm 15, LM arm 25, etc.). The processing unit 32 then notifies the operator of the operation stop. For example, the processing unit 32 displays the operation stop notification on the display unit 34.

[0251] Upon receiving a stop notification, the operator switches the processing unit PM, vacuum transport chamber 10, loading interlock unit LLM, and atmospheric pressure transport chamber 20 to maintenance mode. Then, the operator stops the substrate processing system 1's replacement process by executing an instruction input from the display unit 34. At this time, the substrate processing system 1 maintains the operating mode of the target processing unit PM in non-production mode (i.e., a processing mode where product wafer W cannot be processed). Furthermore, the focus ring FR, which is being replaced, does not move automatically and remains in the state at the time of the stop. This is because the state of the focus ring FR is unclear and requires visual confirmation by the operator before it can be restored. After confirming the status, the operator opens the chamber of the processing unit PM to set the focus ring FR, etc. After restoration, the operator switches each processing unit from maintenance mode to normal processing mode.

[0252] Furthermore, the termination of the replacement process can be arbitrarily executed not only when an anomaly is detected by the substrate processing system 1, but also at the operator's side. For example, the display unit 34 can display a screen indicating the termination of the replacement process. Then, the substrate processing system 1 is configured to stop the VTM arm 15 and the LM arm 25 according to the operator's instruction input. After the operation of the VTM arm 15 and the LM arm 25 stops, the operator performs the same processing as when receiving the notification of the operation stopping.

[0253] Furthermore, if, during a replacement appointment or replacement process, the operator switches the substrate processing system 1 to maintenance mode and removes the FR FOUP, or removes the focus ring FR within the FR FOUP, recovery can be performed using the same steps as described above. Additionally, by default, the removal of the FR FOUP is set in the substrate processing system 1 to be unavailable during replacement processing.

[0254] (Maintenance of lifting pins)

[0255] The lifting pins (second lifting pin 182, support pin) for raising and lowering the focusing ring FR in each part of the substrate processing system 1 are normally not activated until replacement is performed. Therefore, due to aging, the second lifting pin 182 and support pin may become fixed to surrounding structures. Therefore, the substrate processing system 1 of this embodiment can be configured to automatically perform maintenance periodically.

[0256] For example, similar to the counter used to notify the replacement time, a counter is set to determine the execution time of maintenance. For example, the execution time of maintenance for the second lifting pin 182 is set corresponding to each processing component PM. The execution time of maintenance for the second lifting pin 182 can be, for example, a parameter of the number of times the wafer W has been processed. For example, maintenance of the second lifting pin 182 is performed when the wafer W has been processed 1000 times.

[0257] Furthermore, the timing of maintenance can be arbitrarily set or selected by the operator based on preset parameters. For example, the timing can be determined by either the number of processing cycles (number of wafers processed) or the RF discharge time. The timing of maintenance for the support pins of the LLM interlock unit can also be set in the same way.

[0258] The maintenance execution time is, for example, set to the end time of the most recent batch of processing after reaching a threshold of preset parameters (e.g., after performing 1000 processing cycles). In the case of maintenance on the second lifting pin 182 or the support pin, the substrate processing system 1 causes the second lifting pin 182 or the support pin to perform a lifting action. Furthermore, if the timing of this maintenance action overlaps with the timing of other processing, the other actions are given priority, and this maintenance action is performed after the other actions are completed.

[0259] (Communication relationship with the host)

[0260] Furthermore, the processing described in the above embodiments, which is performed independently of the substrate processing system 1, can also be executed in other devices. For example, the control device 30 of the substrate processing system 1 can be configured as a separate device from other parts. In addition, the substrate processing system 1 can be remotely controlled from another device.

[0261] For example, a host (server) is configured in addition to the substrate processing system 1. Then, the plasma processing in each processing component PM can be controlled on the host side. In this case, the control of the processing component PM on the host side is interrupted due to a change in processing on the substrate processing system 1 side. Therefore, the substrate processing system 1 notifies the host each time a mode change is performed to perform a change in processing component. During production mode, the control of the processing component PM is managed by the host side; during non-production mode, the host side controls the process to stop processing of that processing component PM. In this case, the substrate processing system 1 is configured to... Figure 9 The mode change notification host in steps S1503 and S1507.

[0262] (Example of the shape of the pickup in the conveying mechanism)

[0263] In the above embodiment, the first pickup 17a and the second pickup 17b of the VTM arm 15 and the first pickup 27a and the second pickup 27b of the LM arm 25 can be configured as follows. Hereinafter, the first pickup 17a and the second pickup 17b of the VTM arm 15 and the first pickup 27a and the second pickup 27b of the LM arm 25 will be collectively referred to as pickup 50. Pickup 50 is an example of a holding device for holding the wafer W and the consumable component, which is provided at the front end of the arm of the transport mechanism for transporting the wafer W and the consumable component.

[0264] In the above embodiment, the VTM arm 15 and the LM arm 25 are configured to transport both the wafer W and the consumable component. Hereinafter, the configuration of the pickup 50 in the case of transporting the focus ring FR, which is a consumable component, will be described as an example.

[0265] Figure 14A This is a schematic top view showing an example of the configuration of the pickup 50 in a substrate processing system 1 according to one embodiment. Figure 14B yes Figure 14A The diagram shows a schematic front view of the pickup 50. The pickup 50 includes a base 51 and first branches 52 and second branches 53 extending in different directions from two ends of the base 51. The base 51, first branch 52, and second branch 53 are formed such that, when a triangle tangent to the outer diameter of the wafer W is drawn with the center of the wafer W as the center, the three vertices of the triangle are located on the base 51, first branch 52, and second branch 53, respectively. Furthermore, the shape of the pickup 50 is not limited to... Figure 14A The pickup 50 is shown in a two-strand shape. The pickup 50 may also have three or more branches. However, the shape of the pickup 50 is such that, when the focus ring FR is positioned on the pickup 50, a gap is formed between the inner diameter of the focus ring FR and the pickup 50 when viewed from above.

[0266] The pickup 50 has a first surface 55 on the side holding the wafer W and the focusing ring FR. A plurality of first holding portions 60a to 60f for holding the wafer W are formed on the first surface 55. Hereinafter, when it is not necessary to distinguish each of the plurality of first holding portions 60a to 60f individually, they are collectively referred to as the first holding portion 60. At least one first holding portion 60 is formed on each of the base 51, the first branch 52, and the second branch 53. Furthermore, Figure 14A This indicates six first holding parts 60; however, the number of first holding parts 60 is not limited to six, and may be less than or more than six. Furthermore, the plurality of first holding parts 60 are arranged on a first circle C1 with a diameter smaller than the inner diameter of the focusing ring FR.

[0267] The plurality of first retaining portions 60 have an upper surface at a height h1 from the first surface 55. The shape of the upper surface of the plurality of first retaining portions 60 is not particularly limited. The upper surface of the plurality of first retaining portions 60 may be substantially parallel to the first surface 55, or it may be a hemispherical surface with a chamfered outer periphery.

[0268] On the first surface 55, a plurality of second holding portions 70a to 70d for holding the focusing ring FR are also formed. Hereinafter, when it is not necessary to distinguish each of the plurality of second holding portions 70a to 70d individually, they will be collectively referred to as the second holding portion 70. Like the first holding portion 60, at least one second holding portion 70 is formed on each of the base 51, the first branch 52, and the second branch 53. Furthermore, Figure 14A This indicates that there are four second holding portions 70, but the number of second holding portions 70 is not limited to four; it can be less than four or more than four. One end of the second holding portion 70 is disposed on a second circle C2 with a diameter larger than the outer diameter of the focusing ring FR and approximately concentric with the first circle C1. The other end of the second holding portion 70 is disposed on a third circle C3 with a diameter larger than the inner diameter of the focusing ring FR and smaller than its outer diameter. Alternatively, the other end of the second holding portion 70 can also be disposed on a fourth circle C4 with a diameter smaller than the inner diameter of the focusing ring FR.

[0269] The other end of the second retaining part 70 is positioned closer to the center of the first circle C1 to the fourth circle C4 than one end of the second retaining part 70. One end of the second retaining part 70 has an upper surface at a height h2 from the first surface 55. The other end of the second retaining part 70 has an upper surface at a height h3 from the first surface 55. Heights h1, h2, and h3 are at least in the relationship h1 > h2 > h3. Figure 14B As shown, the upper surface of the second retaining part 70 is an inclined surface that gradually decreases in height from one end to the other, that is, from the circumferential side of the first circle C1 to the fourth circle C4 towards the center. The upper surface of the second retaining part 70 is always located at a lower position than the upper surface of the first retaining part 60.

[0270] Figure 15A It means in Figure 14A A schematic top view of the pickup 50 with the chip W held on it. Figure 15B Viewed from a horizontal direction Figure 15A A schematic front view of the pickup 50 and the chip W is shown. Figure 15A As shown, the pickup 50 supports the wafer W via a plurality of first holding portions 60, holding the wafer W in a state where the first surface 55 does not contact the wafer W. Additionally, as... Figure 15B As shown, when the chip W is held on the pickup 50, the upper surface of the second holding part 70, which is lower than the upper surface of the first holding part 60, does not contact the chip W.

[0271] Figure 16AIt means in Figure 14A A schematic top view of the pickup 50 with the focus ring FR in place. Figure 16B It means viewing from a horizontal direction. Figure 16A A schematic front view of the pickup 50 and focus ring FR is shown. Figure 16A As shown, the pickup 50 supports the focus ring FR via a plurality of second holding portions 70, holding the focus ring FR in a state where the first surface 55 does not contact the focus ring FR. Additionally, as... Figure 16B As shown, the outer periphery of the focusing ring FR abuts against and is supported by the second holding portion 70 at the middle portion of the inclined surface of the second holding portion 70. Since the focusing ring FR is annular, when the focusing ring FR is held on the pickup 50, the first holding portion 60 is located in the hollow portion at the center of the focusing ring FR. Therefore, when the focusing ring FR is held on the pickup 50, the focusing ring FR does not contact the first holding portion 60.

[0272] Therefore, by providing a first holding part 60 for holding the wafer W and a second holding part 70 for holding the focus ring FR on the pickup 50, one pickup 50 can be used for transporting either the wafer W or the focus ring FR.

[0273] Furthermore, by positioning the upper surface of the first holding portion 60 higher than the upper surface of the second holding portion 70, contamination or damage to the wafer W can be prevented from occurring due to contact with the pickup 50 during wafer W transport. Additionally, by making the upper surface of the second holding portion 70 an inclined surface that slopes downwards from the outside to the inside, the contact area between the focusing ring FR and the pickup 50 can be reduced. Therefore, it is possible to prevent the focusing ring FR from sticking to the pickup 50 during transport. Furthermore, by preventing sticking, positional shift of the focusing ring FR during transport and bounce during placement can be prevented.

[0274] In addition, the moving speed of the pickup 50 is set to be slower when delivering the focus ring FR than when delivering the wafer W.

[0275] Furthermore, the materials of the first retaining part 60 and the second retaining part 70 are not particularly limited. The first retaining part 60 and the second retaining part 70 can be formed from any material such as rubber or ceramic. However, from the viewpoint of preventing them from sticking together as described above, the second retaining part 70 is preferably made of a material with a low coefficient of friction with the focusing ring FR.

[0276] Furthermore, at least a portion of the second retaining part 70 may be disposed between the inner and outer diameters of the focusing ring FR, and the specific shape is not limited to this. Figures 14A to 16B As shown. For example, if the lower surface of the focusing ring FR is not flat, the positions of one end and the other end of the second holding part 70 can be adjusted to match the shape of the focusing ring FR.

[0277] Furthermore, the second holding portion 70 can be integrally formed with the base 51, the first branch 52, and the second branch 53 of the pickup 50. Additionally, the second holding portion 70 can be formed of the same material as the base 51, the first branch 52, and the second branch 53 of the pickup 50. Besides ceramic, titanium, silicon nitride, etc., can also be used.

[0278] also, Figure 16A and Figure 16B The focusing ring FR shown is Figure 3 Unlike other devices, it has no cutouts on the upper surface of the inner diameter side. However, the shape of the focusing ring FR delivered by the pickup 50 is not particularly limited. Figure 3 The focusing ring FR of the shape shown can also be conveyed by the pickup 50.

[0279] (Position deviation detection during transport)

[0280] As described above, the substrate processing system 1 of the above embodiment has first sensors S1 to S16 for detecting positional deviations of the wafer W and the focusing ring FR transported to the processing component PM. Furthermore, the first sensors are arranged in pairs along the transport path near the gate valve of each processing component PM. Additionally, third sensors S20 to S27 within the atmospheric pressure transport chamber 20 also detect positional deviations. Next, a positional deviation detection method that can be used in conjunction with the first sensors S1 to S16 and the third sensors S20 to S27 will be described. In the following description, third sensors S20 and S21 installed before the loading interlock unit LLM1 and third sensors S24 and S25 installed before the loading port LP2 will be described as examples.

[0281] Figure 17 This is a diagram illustrating the configuration position of the third sensor in a substrate processing system according to one embodiment. Figure 17 Viewing from right to left on the paper Figure 1 A cross-sectional view of the atmospheric pressure delivery chamber 20 of the substrate processing system 1 shown.

[0282] exist Figure 17 In the middle, on the left is the loading platform 201 of the loading port LP2 for placing the FOUP. To the right of the loading platform 201 is a door 202 for communicating between the atmospheric pressure delivery chamber 20 and the interior of the FOUP. Moving the door 202 downwards moves the FOUP cover, thereby communicating between the interior of the FOUP and the interior of the atmospheric pressure delivery chamber 20. On the side of the atmospheric pressure delivery chamber 20 opposite to the loading port LP2, a gate valve GV (see reference) connected to the loading interlock unit LLM1 is located. Figures 18A to 18C The gate valve GV is positioned between the loading interlock unit LLM and the atmospheric pressure delivery chamber 20. The gate valve GV includes a baffle 220, a movable cover 230, and a moving mechanism 240.

[0283] Figure 18A This is a schematic perspective view of the baffle 220 of a gate valve GV according to one embodiment. Figure 18B This is a schematic perspective view of an enlarged portion of a gate valve GV according to one embodiment. Figure 18C This is a schematic perspective view showing the state in which the opening 221 of the gate valve GV in one embodiment is blocked.

[0284] The baffle 220 is a plate-shaped component that is fixed in front of the loading interlock unit LLM1. Figure 18A When the baffle 220 is positioned before the interlocking unit LLM1 is loaded, it appears as a roughly rectangular shape with a top, right, bottom, and left side when viewed from the side of the atmospheric pressure delivery chamber 20. However, the shape of the baffle 220 is not particularly limited. The baffle 220 is formed by an opening 221, a pair of first protrusions 222 (top and bottom), and a pair of second protrusions 223 (top and bottom).

[0285] Opening 221 divides the space between the loading interlock unit LLM1 and the atmospheric pressure delivery chamber 20, through which the wafer W and focusing ring FR are fed in and out. Figure 18A In this example, the opening 221 is formed at a position slightly above the center of the baffle 220. The opening 221 is a roughly rectangular shape with a width larger than the outer diameter of the focusing ring FR. The size and shape of the opening 221 are not particularly limited as long as they can be placed on the pickup 50 and fed in and out horizontally.

[0286] The first protrusion 222 protrudes from the baffle 220 toward the atmospheric pressure conveying chamber 20. The first protrusion 222 has an upper protrusion 222a and a lower protrusion 222b. The upper protrusion 222a is a plate-shaped part that protrudes horizontally along the upper edge of the baffle 220. The upper protrusion 222a is provided with the light-emitting part 20p of the third sensor S20. The lower protrusion 222b is a plate-shaped part that protrudes horizontally along the lower edge of the baffle 220. The lower protrusion 222b is provided with the light-receiving part 20r of the third sensor S20. Alternatively, the light-emitting part 20p may be provided in the lower protrusion 222b, and the light-receiving part 20r may be provided in the upper protrusion 222a.

[0287] The light-projecting part 20p of the upper protrusion 222a emits light downwards in a vertical direction. The light-receiving part 20r of the lower protrusion 222b is positioned on the optical path OP1 of the light emitted from the light-projecting part 20p. Figure 18A In the example, the line connecting the projection part 20p and the light receiving part 20r extends in the vertical direction and passes before the space defined by the opening 221.

[0288] The second protrusion 223 has the same shape as the first protrusion 222. The second protrusion 223 protrudes from the baffle 220 toward the atmospheric pressure conveying chamber 20. The second protrusion 223 has an upper protrusion 223a and a lower protrusion 223b. The upper protrusion 223a is a plate-shaped component protruding horizontally along the upper edge of the baffle 220. The light-emitting portion 21p of the third sensor S21 is disposed on the upper protrusion 223a. The lower protrusion 223b is a plate-shaped component protruding horizontally along the lower edge of the baffle 220. The light-receiving portion 21r of the third sensor S21 is disposed on the lower protrusion 223b.

[0289] The light-projecting part 21p of the upper protrusion 223a emits light downwards in a vertical direction. The light-receiving part 21r of the lower protrusion 223b is positioned on the optical path OP2 of the emitted light. Figure 18A In the example, the line connecting the projection part 21p and the light receiving part 21r extends in a vertical direction and passes before the space defined by the opening 221.

[0290] In addition, the gate valve GV has a connection portion 250 for connecting each sensor to the control device 30 (see reference). Figure 18C The connecting part 250 is, for example, a cable for transmitting signals detected by the light-receiving parts of each sensor to the control device 30.

[0291] A movable cover 230 is provided on the side of the atmospheric pressure conveying chamber 20 of the baffle 220 (see reference). Figure 18C The movable cover 230 is connected to the moving mechanism 240 and moves up and down between the upper protrusions 222a, 223a and the lower protrusions 222b, 223b of the first protrusion 222 and the second protrusion 223, corresponding to the power transmitted from the moving mechanism 240. When the movable cover 230 is at its uppermost position within its movable range (see reference...), Figure 18C The movable cover 230 covers the opening 221, sealing the space between the loading interlock unit LLM1 and the atmospheric pressure delivery chamber 20. When at its lowest point within the movable range, the movable cover 230 opens the opening 221, allowing communication between the loading interlock unit LLM1 and the atmospheric pressure delivery chamber 20. The thickness of the movable cover 230 is such that it does not interfere with the optical paths OP1 and OP2 between the upper protrusions 222a and 223a and the lower protrusions 222b and 223b (refer to...). Figure 17 ).

[0292] return Figure 17 This describes the third sensors S24 and S25 configured on the loading port LP2 side. Each of the third sensors S24 and S25 includes a light-emitting section 24p, 25p and a light-receiving section 24r, 25r. For example... Figure 17As shown, the light-projecting parts 24p and 25p of the third sensors S24 and S25 are disposed on the top side of the atmospheric pressure delivery chamber 20. Additionally, the light-receiving parts 24r and 25r of the third sensors S24 and S25 are disposed on the bottom side of the atmospheric pressure delivery chamber 20. The wafer W and the focusing ring FR, transported by the LM arm 25, pass through the optical path of the light emitted from the light-projecting parts 24p and 25p and received by the light-receiving parts 24r and 25r. The placement of the third sensors S24 and S25 is not particularly limited as long as the wafer W and the focusing ring FR can pass through the optical path.

[0293] Next, the detection of position deviation using the third sensor will be explained. Figure 19A This is a diagram illustrating the positional relationship between consumable components and sensors during transport in one embodiment. Figure 19A This indicates that the focusing ring FR is being transported to the loading interlock unit LLM1 along the direction of arrow X. Figure 19A In the diagram, the loading port LP2 is located below the paper, and the loading interlock unit LLM1 is located above the paper. When the focusing ring FR is conveyed along the transport path, its center is designed to move along line L3. The third sensor S20 is configured to position the optical path OP1 on line L2. Additionally, the third sensor S21 is configured to position the optical path OP2 on line L4. Furthermore, the third sensors S20 and S21 are positioned on lines orthogonal to the travel direction of the focusing ring FR. Moreover, lines L2 and L4 are each parallel to line L3, which is positioned equidistant from line L3.

[0294] At this time, when the focusing ring FR is delivered to the correct position, the detection signal detected in the third sensor S20 and the detection signal detected in the third sensor S21 are the same waveform. Figure 19B It means Figure 19A The diagram illustrates an example of the detection signal. When the focusing ring FR passes between the light-projecting sections 20p and 21p and the light-receiving sections 20r and 21r of the third sensors S20 and S21, the light emitted from the light-projecting sections 20p and 21p is blocked by the focusing ring FR. The light-receiving sections 20r and 21r output a high-level detection signal when there is no light, and a low-level detection signal when there is light. Figure 19A In this case, each part of the focusing ring FR simultaneously passes through the third sensor S20 and S21. Therefore, as... Figure 19B As shown, the detection signals output from the third sensor S20 and S21 simultaneously become high level or simultaneously become low level.

[0295] On the other hand, when the focusing ring FR produces a positional deviation, the detection signals output from the third sensors S20 and S21 are different waveforms. Figure 20A This is a diagram used to illustrate the positional deviation of consumable components during transport. Figure 20A In the example, the center of the focusing ring FR deviates from the correct position (on line L3) towards the side of line L2. Figure 20A When the focusing ring FR is conveyed in the direction of arrow X in its current position, compared to the third sensor S21, the outer periphery of the focusing ring FR first blocks the light emitted from the projection section 20p at the third sensor S20. Afterwards, during period P1 (refer to...) Figure 20B Afterwards, the focusing ring FR blocks the light emitted from the projection section 21p at the third sensor S21. Furthermore, as the focusing ring FR moves in the X direction, it blocks the light again in the third sensor S21, and subsequently, the light is also blocked in the third sensor S20. Therefore, the waveform of the detection signal obtained when the center of the focusing ring FR is deviated from the correct position is, for example, as shown below. Figure 20B The waveform shown is illustrated. The control device 30 detects the positional deviation of the focusing ring FR based on the deviation of the waveform of the detection signal output from the third sensors S20 and S21. Therefore, the control device 30 is able to correct the positional deviation of the focusing ring FR.

[0296] In the example above, two sensors are configured above and below the opening 221 of the gate valve GV before the interlock unit LLM1 is installed. However, this is not a limitation; more than three sensors can also be configured. For example, Figure 21 This is a diagram showing the location relationship between consumable components and sensors in a configuration with four sensors. Figure 21 In the example, in addition to the third sensors S20 and S21, sensors S20A and S21A are also configured. Furthermore, when more than three sensors are configured, each sensor has a light-emitting part and a light-receiving part configured above and below the opening 221.

[0297] Furthermore, in correcting positional deviations, either the outer diameter or the inner diameter of the focusing ring FR detected by each sensor can be used, or both can be used. However, from the viewpoint of accurately correcting the positional relationship between the wafer W and the focusing ring FR, it is preferable to use the inner diameter for correction.

[0298] In addition, the correction of positional deviation, for example, Figure 22 The position of the center of the focusing ring FR is calculated by moving the focusing ring FR by the difference from the correct center position. Figure 22 This is a diagram illustrating the method for calculating the positional deviation of consumable components. For example... Figure 22As shown, based on the detection signal, the center line of the line segment connecting the inner diameter position of the focusing ring FR on line segment L2 is drawn. Additionally, the center lines of the line segments connecting one intersection point of line segment L2 and the inner diameter position, and one intersection point of line segment L4 and the inner diameter position, are drawn. The intersection of the two center lines is the center of the focusing ring FR. Based on the distance between the center of the focusing ring FR and line segment L3 calculated in this way, the position of the focusing ring FR is corrected.

[0299] Furthermore, when two sensors are positioned in front of opening 221, the spacing between the two sensors is wider than the width of the pickup and shorter than the inner diameter of the focusing ring FR. Additionally, for example, when four sensors are positioned in front of opening 221, the spacing between the two outermost sensors is wider than the width of the pickup and shorter than the inner diameter of the focusing ring FR. Moreover, since each of the first, second, and third sensors can perform positional deviation correction not only for the focusing ring FR but also for the wafer W, the spacing between the two outermost sensors is also shorter than the outer diameter of the wafer.

[0300] Furthermore, the first, second, and third sensors are used not only for detecting and correcting the positional deviation of the wafer W and the focus ring FR, but also for detecting whether the pickup holds the wafer W or the focus ring FR. For example, if the pickup's front end is moved left or right before reaching the loading interlock unit LLM, and the third sensor detects an object, it can be determined that the wafer W or the focus ring FR is positioned on the pickup. Additionally, the presence or absence of the wafer W or the focus ring FR can be determined using the same action before the pickup reaches the loading port LP.

[0301] Furthermore, the third sensor, positioned before the loading port LP, is arranged in a position that does not interfere with the opening and closing of the door 202 of the loading port LP. Additionally, no structures other than the wafer W and the focusing ring FR are arranged in the optical path connecting the light-emitting and light-receiving parts of the third sensor. The same applies to the third sensor positioned before the loading interlock unit LLM.

[0302] (Another variation)

[0303] Furthermore, in this embodiment, the execution of FR setting and retrieval using FOUP requires operator input. However, the substrate processing system 1 can also be configured to omit operator input.

[0304] Furthermore, in this embodiment, the type of FOUP that can be set for each loading port LP is fixed, but it is also possible to configure it so that FR FOUP and wafer FOUP can be set for all loading ports LP. In this case, a third sensor can be set in front of all loading ports LP. In addition, the types of mapping sensor MS and the first to third sensors are not particularly limited, and transmissive photoelectric sensors, etc., can be used.

[0305] In addition, in this embodiment, the control device 30 has a display unit 34. However, the screen generated by the control device 30 can also be sent to other devices via the input / output interface 33 and displayed on other devices.

[0306] <Effects of the Implementation Method>

[0307] The substrate processing system of the above embodiment includes an atmospheric pressure transport chamber, a vacuum processing chamber, one or more loading interlock units, a vacuum transport chamber, multiple mounting units, a first transport mechanism, a second transport mechanism, and a control unit. The atmospheric pressure transport chamber is used to transport substrates and consumable components under atmospheric pressure. The vacuum processing chamber is used to perform vacuum processing on the substrates. One or more loading interlock units are disposed between the atmospheric pressure transport chamber and the vacuum processing chamber, allowing the transported substrates and consumable components to pass through. The vacuum transport chamber is disposed between the vacuum processing chamber and one or more loading interlock units, and is used to transport substrates and consumable components under reduced pressure. Multiple mounting units are provided in the atmospheric pressure transport chamber and have ports that allow substrates or consumable components transported between each of the multiple storage units used for storing substrates or consumable components and the atmospheric pressure transport chamber to pass through. Each of the multiple storage units can be detachably mounted on the multiple mounting units. The first transport mechanism transports substrates and consumable components between one or more loading interlock units and the vacuum processing chamber via the vacuum transport chamber. The second transport mechanism transports substrates and consumable components between multiple storage sections and one or more loading interlock units via an atmospheric pressure transport chamber. The control unit causes the first and second transport mechanisms to perform the following transport in parallel: transporting consumable components from the storage section via the atmospheric pressure transport chamber and one of the one or more loading interlock units to the vacuum processing chamber; and transporting consumable components from the vacuum processing chamber via the vacuum transport chamber and another of the one or more loading interlock units. Therefore, the substrate processing system of this embodiment can shorten the replacement time of consumable components in the vacuum processing chamber. Therefore, according to this embodiment, the operating efficiency of the substrate processing system can be improved. When transporting wafers via one loading interlock unit, the transport process must be idle during the atmospheric opening and vacuuming of the loading interlock unit. The substrate processing system of the above embodiment transports consumable components via two loading interlock units. Furthermore, the substrate processing system of this embodiment performs a replacement process when there are no wafers on the first and second transport mechanisms or in the loading interlock units. Therefore, according to this embodiment, the two loading interlock units can be used for feeding out and feeding in respectively, which can shorten the replacement time of consumable parts.

[0308] Furthermore, in the substrate processing system of the above embodiment, the plurality of mounting sections include: a first mounting section capable of mounting a first storage section for storing substrates; and a second mounting section capable of mounting a second storage section for storing consumable components. Therefore, the substrate processing system of the embodiment can perform the replacement of consumable components by mounting both the substrate storage section and the consumable component storage section in the same atmospheric pressure transport chamber.

[0309] Furthermore, in the substrate processing system of the above embodiment, the control unit causes the display unit to display the installation status of the multiple storage units on the multiple mounting units. Therefore, in the substrate processing system of the embodiment, the operator can easily confirm the installation status of the storage units.

[0310] Furthermore, in the substrate processing system of the above embodiment, the control unit causes the display unit to display the first mounting portion and the second mounting portion among a plurality of mounting portions in a manner that allows identification of the first mounting portion and the second mounting portion. Therefore, according to the substrate processing system of the embodiment, the operator can easily determine the location where the second storage portion for storing consumable components should be installed.

[0311] Furthermore, in the substrate processing system of the above embodiment, the control unit receives a replacement reservation for consumable components disposed in the vacuum processing chamber. Then, when it is determined that there is no substrate and consumable component being transported in the vacuum transport chamber, one or more loading interlock units, and the atmospheric pressure transport chamber, the first transport mechanism and the second transport mechanism are instructed to perform the replacement of the consumable component. Therefore, the substrate processing system of this embodiment can perform the replacement of consumable components without hindering substrate processing. In addition, the substrate processing system can perform the replacement of consumable components without concern about substrate contamination or damage.

[0312] Furthermore, in the substrate processing system of the above embodiment, the control unit accepts replacement requests when the second storage unit is installed on the second mounting unit, and does not accept replacement requests when the second storage unit is not installed on the second mounting unit. Therefore, the substrate processing system of this embodiment can prevent the acceptance of replacement requests when there is no intention to replace the consumable parts used.

[0313] Furthermore, in the substrate processing system of the above embodiment, the control unit accepts the installation of the second storage unit on the second mounting unit only when a specified instruction input is received. Therefore, the substrate processing system of this embodiment can prevent the second storage unit for storing consumable components from being installed without the operator's knowledge.

[0314] Furthermore, the substrate processing system of the above embodiment also includes a sensor capable of detecting the substrate disposed in the first storage section and the consumable component disposed in the second storage section. Then, the control unit changes the sensor parameters upon receiving a predetermined instruction input. Therefore, the substrate processing system can perform detection according to parameters corresponding to the substrate and the consumable component respectively.

[0315] Furthermore, in the substrate processing system of the above embodiment, a holding device for holding the substrate and the consumable component is disposed at the front end of the arm of the conveying mechanism (first conveying mechanism and second conveying mechanism) for conveying the substrate and the consumable component. The holding device includes a first surface, a plurality of first holding portions, and a plurality of second holding portions. The first surface faces the surfaces of the substrate and the consumable component during conveying. A plurality of first holding portions are formed on the first surface for holding the substrate. A plurality of second holding portions are formed on the first surface and disposed on the outer side of a first circle connecting the plurality of first holding portions for holding the consumable component. The second holding portions have an inclined surface that extends radially inward toward the first surface from one end of the second holding portion disposed on a second circle having a diameter larger than the outer diameter of the consumable component. Therefore, the second holding portions can suppress the contact area with the consumable component, preventing the consumable component from adhering and bouncing. Furthermore, the second retaining part is positioned further outward than the first retaining part, so the annular consumable part can be held in a manner that prevents it from contacting the first retaining part.

[0316] Furthermore, in the aforementioned retaining device, the height of the first retaining portion from the first surface is greater than the height of one end of the second retaining portion from the first surface. Therefore, the first retaining portion can retain the substrate without contacting the second retaining portion. Thus, the retaining device of this embodiment can suppress the adhesion of substances adhering to the substrate to the retaining device.

[0317] Furthermore, in the aforementioned holding device, the other end of the second holding portion can be disposed on a third circle located between the inner and outer diameters of the consumable component. Additionally, the other end of the second holding portion can also be disposed on a fourth circle with a diameter smaller than the inner diameter of the consumable component. Therefore, the second holding portion can be configured to correspond to the shape of the consumable component being transported.

[0318] The embodiments disclosed in this specification are illustrative in all respects and are not intended to be limiting. The above-described embodiments can be omitted, substituted, or modified in various ways without departing from the scope and spirit of the accompanying technical solutions.

Claims

1. A substrate processing system, comprising: An atmospheric pressure transport chamber for transporting substrates and consumable components under normal atmospheric pressure. Multiple vacuum processing chambers for processing the substrate; A vacuum transport chamber that transports the substrate and the consumable components, including used or unused consumable components, under a reduced pressure atmosphere; One or more loading interlocking units are configured between the atmospheric pressure delivery chamber and the vacuum delivery chamber for the transport of the substrate and the consumable components; Multiple mounting sections are provided in the atmospheric pressure conveying chamber, each having a port through which the substrate or consumable component being conveyed between the multiple storage sections and the atmospheric pressure conveying chamber can pass, wherein... The plurality of storage compartments house the substrate or the consumable component, and the plurality of mounting compartments can be detachably mounted on each of the plurality of storage compartments; A first conveying mechanism conveys the substrate and the consumable component between the one or more loading interlocking units and the vacuum processing chamber via the vacuum conveying chamber; The second conveying mechanism conveys the substrate and the consumable components between the plurality of storage sections and the one or more loading interlocking units via the atmospheric pressure conveying chamber; and Control device, At least one of the plurality of mounting portions is capable of mounting: a first storage portion for the substrate, which stores the substrate but does not store the consumable component; and a second storage portion for the consumable component, which stores the consumable component but does not store the substrate.

2. The substrate processing system as described in claim 1, wherein, The second storage section has a storage section for storing the consumable parts. The consumable parts to be used before use are stored in the storage compartment at a position above the position where the used consumable parts are stored.

3. The substrate processing system as described in claim 1 or 2, wherein, The second storage section is configured to hold the same number of the consumable parts before use and the consumable parts after use.

4. The substrate processing system as described in claim 1 or 2, wherein, The second storage section is configured to accommodate a number of the pre-use consumable parts and the used consumable parts, corresponding to the number of the vacuum processing chambers.

5. The substrate processing system as described in claim 1 or 2, wherein, Each of the mounting parts is configured to be capable of mounting either the first storage part or the second storage part.

6. The substrate processing system as described in claim 1 or 2, wherein, The second storage unit is installed in the mounting unit when the consumable part is replaced.

7. The substrate processing system as described in claim 1 or 2, wherein, In the atmospheric pressure conveying chamber, a sensor for detecting the position of the substrate or the consumable component is arranged on the conveying path of the second conveying mechanism between the mounting part and the loading interlock unit.

8. The substrate processing system as described in claim 1 or 2, wherein, It also has a display section.

9. The substrate processing system as described in claim 8, wherein, The control device causes the display unit to show information indicating the time of replacement of the consumable component.

10. The substrate processing system as claimed in claim 8, wherein, When the second storage unit is installed on the mounting unit, the control device causes the display unit to display a screen for accepting the replacement appointment of the consumable parts.

11. The substrate processing system as claimed in claim 8, wherein, The display unit shows the location of the consumable component stored in the second storage unit in a recognizable manner.

12. The substrate processing system as claimed in claim 8, wherein, The display unit shows, in a recognizable manner, the consumable parts before use and the consumable parts after use, which are stored in the second storage unit.

13. The substrate processing system as claimed in claim 8, wherein, The display unit shows, in a recognizable manner, the mounting unit capable of mounting the first storage unit and the mounting unit capable of mounting the second storage unit.

14. The substrate processing system as claimed in claim 8, wherein, The display unit displays in a recognizable manner the mounting unit capable of mounting the first storage unit and the mounting unit capable of mounting both the first storage unit and the second storage unit.

15. The substrate processing system as claimed in claim 8, wherein, If the first storage unit is installed on a mounting unit that does not correspond to the installation of the first storage unit, the display unit will display a notification that it cannot be set.

16. The substrate processing system of claim 8, wherein, The display unit shows, in a recognizable manner, the mounting unit on which the second storage unit is installed and the mounting unit on which the second storage unit is not installed.

17. The substrate processing system of claim 10, wherein, When the control device accepts a replacement reservation via a screen displayed on the display unit for accepting the replacement reservation of the consumable component, the display unit causes the display unit to display information indicating that a replacement reservation is in progress.

18. The substrate processing system of claim 8, wherein, When the consumable component is being replaced, the control device causes the display unit to show information indicating that the consumable component is being replaced; when the replacement of the consumable component is completed, the information indicating that the consumable component is being replaced is deleted from the display unit.

19. The substrate processing system as claimed in claim 8, wherein, The control device displays the number of consumable parts stored in the second storage section installed on the mounting section on the display section.

20. The substrate processing system of claim 8, wherein, The control device, in the second storage section installed on the mounting section, causes the display section to display in a distinguishable manner the number of consumable components before use and the number of consumable components after use.

21. The substrate processing system as claimed in claim 8, wherein, The control device displays a carrier ID input screen on the display unit, which is used to input the carrier ID of the storage unit installed in the mounting unit. The control device receives the carrier ID installed in the storage unit of the mounting unit via input to the carrier ID input screen.

22. The substrate processing system as claimed in claim 8, wherein, The second storage section, which is installed in the mounting section, also includes a mapping sensor that detects the position of the consumable component by performing a mapping of the consumable component. In the plurality of mounting sections, the control device causes the display section to display in different ways: a first mounting section where the second storage section is not installed; and a second mounting section where the second storage section is installed but the mapping of the consumable component within the second storage section is incomplete, as performed by the mapping sensor.

23. The substrate processing system of claim 22, wherein, In the plurality of mounting sections, the control device causes the display section to display, in different ways, the first mounting section, the second mounting section, and the third mounting section where the consumable component is mounted and installed in the second storage section, and where the mapping performed by the mapping sensor has been completed.

24. The substrate processing system of claim 23, wherein, In the plurality of mounting sections, the control device causes the display section to display the first mounting section, the second mounting section, the third mounting section, and the fourth mounting section being processed for removal from the second storage section in different ways.

25. The substrate processing system as described in claim 1 or 2, wherein, Three of the plurality of mounting sections are capable of mounting the first storage section.

26. The substrate processing system as claimed in claim 1 or 2, wherein, Two of the plurality of mounting sections are capable of mounting the second storage section.

27. The substrate processing system as claimed in claim 1 or 2, wherein, The mounting section capable of mounting the first storage section and the mounting section capable of mounting the second storage section are alternately configured among the plurality of mounting sections.

28. The substrate processing system as claimed in claim 1 or 2, wherein, The consumable parts to be used before use are stored in the upper part of the second storage section. The used consumable parts are stored in the lower part of the second storage section.

29. The substrate processing system as described in claim 1 or 2, wherein, The plurality of mounting units have a reading unit for reading the carrier ID of the mounting storage unit. When the storage unit is installed on the mounting unit, the reading unit reads the carrier ID from the storage unit.

30. The substrate processing system of claim 29, wherein, The reading unit sends the read carrier ID to the control device. The control device determines whether the carrier ID sent from the reading unit is the carrier ID of the first storage unit or the carrier ID of the second storage unit.

31. The substrate processing system as described in claim 30, wherein, It has a mapping sensor that detects the consumable parts installed in the second storage section of the mounting section. When the carrier ID sent from the reading unit is the carrier ID of the second storage unit, the control device authenticates the carrier ID and sets the threshold of the mapping sensor based on the authenticated carrier ID.

32. The substrate processing system as described in claim 31, wherein, The mapping sensor detects at least the position of the consumable component within the second storage section.

33. The substrate processing system as described in claim 31, wherein, The mapping sensor also detects the substrate within the first storage section. The control device switches the threshold set for the mapping sensor based on whether the detected component is the substrate in the first storage section or the consumable component in the second storage section.

34. The substrate processing system as described in claim 33, wherein, The mapping sensor sends to the control device the result of detecting the substrate in the first storage section and the result of detecting the consumable component in the second storage section.

35. The substrate processing system of claim 31, wherein, The second conveying mechanism has: A pickup, roughly U-shaped, is used to hold the substrate and the consumable component; and An arm, the front end of which is rotatably connected to the pickup. The mapping sensors are positioned at both ends of the roughly U-shaped pickup.

36. The substrate processing system as described in claim 31, wherein, The mapping sensor is a transmissive photoelectric sensor.

37. The substrate processing system of claim 30, wherein, It also has a storage section. The control device stores the carrier ID that is identified as the carrier ID of the second storage unit in the storage unit, corresponding to the mounting unit on which the second storage unit is installed.

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