Heat dissipation control method and related device, equipment and medium

Abstract

The present application discloses a heat dissipation control method and related devices, equipment and media. The heat dissipation control method includes: obtaining the current detection result of the resource occupation of the target hardware in the electronic device at the current moment; obtaining the temperature impact value based on at least the influence coefficient of the resource occupation of the target hardware on the device temperature and the detection result; wherein the temperature impact value represents the change trend of the device temperature; adjusting the current heat dissipation intensity of the heat dissipation component based on the temperature impact value to obtain the target heat dissipation intensity of the heat dissipation component; and controlling the heat dissipation component to dissipate heat based on the target heat dissipation intensity. The above scheme can improve the precision of heat dissipation control and realize the advanced nature of heat dissipation control.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a heat dissipation control method and related devices, equipment and media. Background Art

[0002] Electronic devices usually contain hardware such as processors, which often generate heat when working. If the heat is not dissipated in time, the electronic device may not operate normally.

[0003] At present, existing heat dissipation technologies usually perform heat dissipation control based on monitored temperature data (such as the temperature value of the processor, etc.). For example, when a certain set threshold is detected, the heat dissipation intensity is adjusted accordingly. However, this heat dissipation control strategy is relatively rough and cannot achieve precise control. Secondly, since it only takes effect when the temperature has changed, it has a certain lag. In view of this, how to improve the precision of heat dissipation control and achieve the advanced nature of heat dissipation control has become an urgent problem to be solved. Summary of the invention

[0004] The main technical problem solved by the present application is to provide a heat dissipation control method and related devices, equipment and media, which can improve the precision of heat dissipation control and realize the advanced nature of heat dissipation control.

[0005] In order to solve the above problems, the first aspect of the present application provides a heat dissipation control method, including: obtaining the current detection result of the resource occupancy of the target hardware in the electronic device at the current moment; obtaining a temperature impact value based at least on the influence coefficient and detection result of the resource occupancy of the target hardware on the device temperature; wherein the temperature impact value represents the changing trend of the device temperature; adjusting the current heat dissipation intensity of the heat dissipation component based on the temperature impact value to obtain the target heat dissipation intensity of the heat dissipation component; and controlling the heat dissipation component to dissipate heat based on the target heat dissipation intensity.

[0006] In order to solve the above problems, the second aspect of the present application provides a heat dissipation control device, including: an occupancy detection module, an impact determination module, a strength adjustment module and a component control module, the occupancy detection module is used to obtain the current detection result of the resource occupancy of the target hardware in the electronic device at the current moment; the impact determination module is used to obtain a temperature impact value based on at least the impact coefficient and detection result of the resource occupancy of the target hardware on the device temperature; wherein the temperature impact value represents the changing trend of the device temperature; the strength adjustment module is used to adjust the current heat dissipation intensity of the heat dissipation component based on the temperature impact value to obtain the target heat dissipation intensity of the heat dissipation component; the component control module is used to control the heat dissipation component to dissipate heat based on the target heat dissipation intensity.

[0007] In order to solve the above problems, the third aspect of the present application provides an electronic device, which at least includes a heat dissipation component, a non-volatile memory and a processor. The heat dissipation component and the non-volatile memory are respectively coupled to the processor. At least the processor serves as the target hardware for detecting resource occupancy during the heat dissipation control process, and the non-volatile memory stores program instructions. The processor is used to execute the program instructions to implement the heat dissipation control method in the above first aspect.

[0008] In order to solve the above problem, the fourth aspect of the present application provides a computer-readable storage medium, which stores program instructions that can be executed by a processor, and the program instructions are used to implement the heat dissipation control method in the above first aspect.

[0009] The above scheme obtains the current detection result of the resource occupation of the target hardware in the electronic device at the current moment, and at least the influence coefficient and detection result of the resource occupation of the target hardware on the device temperature, obtains the temperature influence value, and the temperature influence value represents the change trend of the device temperature, and then adjusts the current heat dissipation intensity of the heat dissipation component based on the temperature influence value to obtain the target heat dissipation intensity of the heat dissipation component, thereby controlling the heat dissipation component to dissipate heat based on the target heat dissipation intensity, and then, on the one hand, compared with controlling the heat dissipation intensity at different gears, adjusting the heat dissipation intensity according to the dimension influence value can improve the precision of heat dissipation control, and on the other hand, by combining the influence coefficient of the resource occupation of the target hardware on the device temperature and the resource occupation of the target hardware at the current moment, the temperature influence value representing the change trend of the device temperature is obtained, and the heat dissipation intensity is adjusted accordingly, compared with heat dissipation control after the device temperature changes, it can be realized that heat dissipation control is carried out in advance before the temperature changes according to the real-time operating status, and the advanced nature of heat dissipation control can be realized. Therefore, the precision of heat dissipation control can be improved, and the advanced nature of heat dissipation control can be realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a flow chart of an embodiment of the heat dissipation control method of the present application;

[0011] Figure 2 It is a schematic diagram of the framework of an embodiment of the heat dissipation control device of the present application;

[0012] Figure 3 It is a schematic diagram of the framework of an embodiment of the electronic device of the present application;

[0013] Figure 4 It is a schematic diagram of a framework of an embodiment of a computer-readable storage medium of the present application. DETAILED DESCRIPTION

[0014] The scheme of the embodiment of the present application is described in detail below in conjunction with the drawings of the specification.

[0015] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0016] The terms "system" and "network" are often used interchangeably in this article. The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship. In addition, "many" in this article means two or more than two.

[0017] See also Figure 1 , Figure 1 1 is a flow chart of an embodiment of the heat dissipation control method of the present application. Specifically, the embodiment of the present disclosure may include the following steps:

[0018] Step S11: obtaining the current detection result of the resource occupancy of the target hardware in the electronic device at the current moment.

[0019] In one implementation scenario, the target hardware is a hardware unit in an electronic device that generates heat during the operation of the device. It should be noted that the target hardware can provide computing resources, storage resources, network resources, etc., which are not limited here. Exemplarily, taking the target hardware as a hardware unit that provides computing resources as an example, the target hardware may include but is not limited to: a central processing unit (CPU), a graphics processing unit (GPU), etc., which are not limited here; or, taking the target hardware as a hardware unit that provides storage resources as an example, the target hardware may include but is not limited to: volatile storage media such as random access memory (RAM), and non-volatile storage media such as solid-state hard disks and mechanical hard disks. Of course, the above examples are only several possible examples of target hardware, and the specific types of target hardware are not limited here. In actual application, it can be set according to the specific composition of the electronic device. For example, in the case where the electronic device has a networking function, considering that wireless network cards, wired network cards, etc., will also generate heat, the target hardware may also include but is not limited to wireless network cards, wired network cards, etc. Network cards. Other situations can be deduced by analogy, and no examples are given one by one here.

[0020] In one implementation scenario, the heat dissipation conditions can be set in advance. When the heat dissipation conditions are met, the process steps in the embodiment of the present disclosure are executed, that is, the resource occupancy is detected at the current moment to obtain the current detection result, and heat dissipation control is performed in advance accordingly. It should be noted that the heat dissipation conditions can be set specifically according to the actual application needs. For example, the heat dissipation conditions can be set as follows: the current moment is a preset time (such as 1 second, 2 seconds, 3 seconds, etc.) from the last detection of resource occupancy, so that the heat dissipation control can be performed every preset time. When the actual application requirements are other situations, it can be deduced by analogy, and examples are not given one by one here.

[0021] In one implementation scenario, when the electronic device is turned on, the underlying system is still in the startup state, and the detection result of resource occupancy cannot be obtained temporarily. At this time, before obtaining the current detection result, the current heat dissipation intensity of the heat dissipation component can be determined based on the preset mapping relationship and the current temperature of the electronic device, and the preset mapping relationship includes the mapping relationship between the temperature interval and the heat dissipation intensity interval of the heat dissipation component. The current heat dissipation intensity is the lower limit value of the mapping intensity interval corresponding to the current temperature, and the mapping intensity interval is the heat dissipation intensity interval mapped to the temperature interval where the current temperature is located, so as to perform heat dissipation control based on the current heat dissipation intensity determined by the current temperature during device startup. Of course, during device startup, heat dissipation control can also be performed directly according to the preset heat dissipation intensity, and heat dissipation control during device startup is not limited here.

[0022] In a specific implementation scenario, as a possible example, taking the heat dissipation component including an air cooling component as an example, it should be noted that the heat dissipation intensity of the air cooling component can specifically represent the fan speed. In this case, please refer to Table 1, which is a schematic table of an embodiment of a preset mapping relationship when the heat dissipation component includes an air cooling component.

[0023] Table 1 Schematic table of an embodiment of a preset mapping relationship when the heat dissipation component includes an air cooling component

[0024]

[0025] As shown in Table 1, when the heat dissipation component includes an air cooling component, the preset mapping relationship may include five gears of the air cooling component. Among them, in gear 1, the temperature range is lower than 40 degrees, and the heat dissipation intensity range is [2000, 4000) rpm, in gear 2, the temperature range is [40, 45) degrees, and the heat dissipation intensity range is [4000, 6000) rpm, in gear 3, the temperature range is [45, 50) rpm, and the heat dissipation intensity range is [6000, 8000) rpm, in gear 4, the temperature range is [50, 55) rpm, and the heat dissipation intensity range is [8000, 10000) rpm, and in gear 5, the temperature range is not lower than 55 degrees, and the heat dissipation intensity range is not lower than 10000 rpm. It should be noted that in Table 1, "[" indicates that the endpoint value is included, and ")" indicates that the endpoint value is not included. In addition, PWM represents a PWM signal for controlling the rotation speed of the air cooling component, and the rotation speed of the air cooling component can be controlled by adjusting the duty cycle of the PWM signal to adjust the heat intensity. PWM (%) in Table 1 means the duty cycle of the PWM signal. For example, when the duty cycle of the PWM signal is small, the speed is slow. Conversely, when the duty cycle of the PWM signal is large, the speed is fast. For the specific process of controlling the fan speed through the PWM signal, please refer to the technical details of the PWM fan, which will not be repeated here. Of course, the heat dissipation component may not be limited to the air cooling component. For example, it may also include a water cooling component. The heat dissipation intensity of the water cooling component at least represents the speed of the water pump. For the specific implementation, please refer to the technical details of the water cooling component. It will not be repeated here; or, it may also include a semiconductor refrigeration component. The heat dissipation intensity of the semiconductor refrigeration component at least represents the current size. For the specific implementation, please refer to the technical details of the semiconductor refrigeration component. It will not be repeated here.

[0026] In a specific implementation scenario, please continue to refer to Table 1. Taking the current temperature of 38 degrees as an example, according to the preset mapping relationship, it can be determined that the temperature interval is below 40 degrees, and the heat dissipation intensity interval (i.e., the mapping intensity interval) mapped by the temperature interval is [2000, 4000) revolutions, so its lower limit value, i.e., 2000 revolutions, can be selected as the current heat dissipation intensity. On this basis, the air-cooling component can be controlled to work at 2000 revolutions to dissipate heat for the electronic device. Of course, the above example is only a possible example, and other situations can be inferred from this, and examples are not given one by one here. It should be noted that after controlling the air-cooling component to work at 2000 revolutions, when the heat dissipation conditions are met again, if the electronic device has not yet started up, the aforementioned steps of determining the current heat dissipation intensity of the heat dissipation component based on the preset mapping relationship and the current temperature of the electronic device and subsequent steps can be continued until the electronic device is started up, at which time the current detection result of the resource occupancy of the target hardware in the electronic device at the current moment can be obtained. For example, if the current dimension rises to 44 degrees, it can be determined that the temperature range is [40,45), and the heat dissipation intensity range (i.e., mapping intensity range) mapped by this temperature range is [4000,6000), so its lower limit value, i.e., 4000 rpm, can be selected as the current heat dissipation intensity. On this basis, the air cooling component can be controlled to work at 4000 rpm to dissipate heat for the electronic equipment.

[0027] In an implementation scenario, the current detection result may at least include the first occupancy rate of the target hardware at the current moment. Taking the case where the target hardware includes a central processing unit and a random access memory as an example, the current detection result may include the first occupancy rate of the above target hardware at the current moment. Exemplarily, the current detection result may specifically include: the first occupancy rate of the central processing unit at the current moment is 30%, and the first occupancy rate of the random access memory at the current moment is 50%. Of course, the above example is only a possible example in the actual application process, and does not limit the specific value of the first occupancy rate.

[0028] In another implementation scenario, different from the aforementioned situation, the current detection result may at least include the second occupancy rate of each business process on the target hardware at the current moment. It should be noted that the business process may also include but is not limited to: the first process of the operating system, the second process related to the function implemented by the electronic device, etc., and the specific type of the business process is not limited here. Taking the electronic device as a network video recorder running the Windows operating system as an example, the business process may include but is not limited to the first process related to the operating system such as system update, desktop window manager, and the second process related to the implementation of the function such as video encoding and decoding. Taking the target hardware including a central processing unit and a random access memory as an example, the current detection result may include the second occupancy rate of each business process on the central processing unit and the second occupancy rate of each random access memory. Other situations can be deduced by analogy, and the business process is not limited here.

[0029] In another implementation scenario, different from the aforementioned situation, the electronic device includes first hardware and second hardware both as target hardware, the first hardware supports detecting the occupancy rate of the entire hardware, and the second hardware supports detecting the occupancy rate of each business process. Exemplarily, the target hardware may include: a central processing unit, a random access memory, and a network card, the last of which only supports detecting the occupancy rate of the entire hardware, while the first two support detecting the occupancy rate of each business process. In this case, the current detection result may specifically include the first occupancy rate of the first hardware at the current moment and the second occupancy rate of each business process on the second hardware at the current moment.

[0030] Step S12: obtaining a temperature impact value based at least on the impact coefficient of the resource occupancy of the target hardware on the device temperature and the detection result.

[0031] In the disclosed embodiment, the temperature impact value represents the changing trend of the device temperature. Exemplarily, the larger the temperature impact value, the larger the changing trend of the device temperature can be represented. Conversely, the smaller the temperature impact value, the smaller the changing trend of the device temperature can be represented. In addition, the impact coefficient of the target hardware represents the degree of influence of the resource occupancy of the target hardware on the device temperature. Exemplarily, the larger the impact coefficient of the target hardware, the larger the influence of the resource occupancy of the target hardware on the device temperature. Conversely, the smaller the impact coefficient of the target hardware, the smaller the influence of the resource occupancy of the target hardware on the device temperature.

[0032] In an implementation scenario, as described above, the current detection result may at least include the first occupancy rate of the target hardware at the current moment. In this case, the temperature impact value can be obtained by weighting based on the first occupancy rate and the influence coefficient of the same target hardware. For example, taking the target hardware including a central processing unit and a random access memory as an example, the current detection result may specifically include: the first occupancy rate of the central processing unit at the current moment is 30%, and the first occupancy rate of the random access memory at the current moment is 50%. Then, the first occupancy rate can be weighted based on the influence coefficient of the central processing unit of 60% and the influence coefficient of the random access memory of 40%, such as 60%*30%+40%*50%, and the temperature impact value can be obtained, that is, 0.38. Of course, the above example is only a possible example in the actual application process, and other situations can be deduced by analogy, and no examples are given one by one here. In the above manner, the current detection result at least includes the first occupancy rate of the target hardware at the current moment, and the temperature impact value is obtained by weighting based on the first occupancy rate and the influence coefficient of the same target hardware, which helps to reduce the calculation complexity of the temperature impact value.

[0033] In another implementation scenario, as described above, the current detection result may at least include the second occupancy rate of each business process on the target hardware at the current moment. In this case, for the same target hardware, the sub-influence value of the corresponding target hardware on the device temperature can be obtained based on the second occupancy rate of each business process on the target hardware and the influence factor causing the target hardware to heat up, and then the sub-influence value and influence coefficient of the same target hardware can be weighted to obtain the temperature influence value.

[0034] Table 2 Schematic table of an embodiment of the second occupancy rate of the target hardware by each business process at the current moment

[0035]

[0036] For example, the target hardware still includes a central processing unit and a random access memory. Please refer to Table 2, which is a schematic table of an embodiment of the second occupancy rate of the target hardware by each business process at the current moment. On this basis, the temperature impact value S can be calculated by the above method:

[0037] …… (1)

[0038] In the above formula (1), represents the second occupancy rate of the CPU by the i-th business process, represents the second occupancy rate of the random access memory by the jth business process, Characterizes the sub-value of the CPU's impact on device temperature. Characterizes the sub-value of random access memory's impact on device temperature. In addition, represents the influence coefficient of the CPU, Represents the influence coefficient of random access memory. Of course, the above example is only a possible example in the actual application process, and other situations can be deduced by analogy, so no one will be given here one by one. In the above method, the current detection result at least includes the second occupancy rate of each business process on the target hardware at the current moment. For the same target hardware, based on the second occupancy rate of each business process on the target hardware and the influence factor causing heat to the target hardware, the sub-influence value of the corresponding target hardware on the device temperature is obtained, and then based on the sub-influence value and influence coefficient of the same target hardware, the temperature impact value is obtained by weighting, which can evaluate the temperature impact value at a finer granularity, and help to maximize the accuracy of the temperature impact value.

[0039] In another implementation scenario, as mentioned above, the electronic device may include a first hardware and a second hardware, both of which are target hardware. The first hardware supports detecting the occupancy rate of the entire hardware, and the second hardware supports detecting the occupancy rate of each business process. The current detection result includes the first occupancy rate of the first hardware at the current moment and the second occupancy rate of each business process on the second hardware at the current moment. In this case, the first impact value of the first hardware can be obtained by weighting based on the first occupancy rate and influence coefficient of the same first hardware, and for the same second hardware, the second occupancy rate of the second hardware by each business process and the influence factor causing heating to the second hardware are weighted to obtain the sub-influence value of the corresponding second hardware on the device temperature, and the second impact value of the second hardware is weighted based on the sub-influence value and influence coefficient of the same second hardware, and then the temperature impact value is obtained based on the first impact value and the second impact value. For example, take the case where the target hardware includes a central processing unit, a random access memory and a network card. Among them, the network card is the first hardware, and the central processing unit and the random access memory are the second hardware. Please continue to refer to Table 2, and the temperature impact value S can be calculated in the above manner:

[0040] …… (2)

[0041] In the above formula (2), represents the second occupancy rate of the CPU by the i-th business process, represents the second occupancy rate of the random access memory by the jth business process, Characterizes the sub-value of the CPU's impact on device temperature. Indicates the sub-influence value of random access memory on device temperature, N represents the first occupancy rate of the network card, represents the influence coefficient of the CPU, represents the influence coefficient of the random access memory, and Z represents the influence coefficient of the network card. In other words, represents the first impact value, Represents the second impact value. Of course, the above example is only a possible example in the actual application process. Other situations can be deduced by analogy, and no examples are given here one by one. The above method is based on the first occupancy rate and influence coefficient of the same first hardware to obtain the first impact value of the first hardware, and for the same second hardware, based on the second occupancy rate of each business process on the second hardware and the influence factor causing heat to the second hardware, the sub-influence value of the corresponding second hardware on the device temperature is obtained, and based on the sub-influence value and influence coefficient of the same second hardware, the second impact value of the second hardware is obtained by weighting, and then based on the first impact value and the second impact value, the temperature impact value is obtained. It can take into account both the first hardware that supports the detection of the overall occupancy rate of the hardware and the second hardware that supports the detection of the occupancy rate of each business process, which can not only improve the scope of application of heat dissipation control, but also further improve the accuracy of the temperature impact value.

[0042] In one implementation scenario, the influence coefficient can be continuously updated during the operation of the electronic device. In other words, the continuous update of the influence coefficient and the heat dissipation control of the electronic device do not affect each other. When it is necessary to combine the influence coefficient for heat dissipation control, it is only necessary to load the latest updated influence coefficient. The influence coefficient can be specifically updated based on the operation monitoring data sampled by the electronic device at each historical moment, and the operation monitoring data includes: the historical detection results of the resource occupancy of the target hardware at the historical moment and the historical device temperature of the electronic device at the historical moment. In other words, during the operation of the electronic device, the operation monitoring data can be continuously collected and the influence coefficient can be updated accordingly. Exemplarily, as long as the amount of newly accumulated operation monitoring data meets certain requirements, it can trigger the update of the influence coefficient, so that the influence coefficient can be continuously updated during the operation of the electronic device, and in the heat dissipation control process, it is only necessary to load the latest influence coefficient.

[0043] In a specific implementation scenario, taking the heat dissipation component including the air cooling component as an example, the operation monitoring data can be represented as shown in Table 3.

[0044] Table 3 Schematic table of operation monitoring data of an embodiment

[0045]

[0046] As shown in Table 3, the target hardware may specifically include a central processing unit, a random access memory, and a network card, etc. At the historical moment of sampling point 1, the historical device temperature is T1, the historical detection results of the central processing unit include a historical occupancy rate of 30%, the historical detection results of the random access memory include a historical occupancy rate of 20%, and the historical detection results of the network card include a historical occupancy rate of 40%. At this time, the historical heat dissipation intensity of the air cooling component is 2000 revolutions (the duty cycle of the PWM signal is 20%). In addition, at the historical moments of other sampling points, this can be deduced by analogy, and no examples are given here one by one.

[0047] In a specific implementation scenario, as a possible example, the operation monitoring data of each group of adjacent sampling points can be compared. For example, for sampling point 1 and sampling point 2, the temperature T1 and temperature T2 can be compared to obtain the temperature difference of the group of adjacent sampling points, and the temperature change rate is calculated based on this, the occupancy difference of the central processing unit is compared, and the occupancy change rate of the central processing unit is calculated based on this, the occupancy difference of the random access memory is compared, and the occupancy change rate of the random access memory is calculated based on this, and the occupancy difference of the network card is compared, and the occupancy change rate of the network card is calculated based on this, and the same can be said for sampling point 2 and sampling point 3, sampling point 3 and sampling point 4, ..., sampling point n-1 and sampling point n, and no examples are given here one by one. On this basis, for each group of adjacent sampling points, an equation with the influence coefficient of each target hardware as an unknown quantity can be constructed. For example, for each group of adjacent sampling points, an equation can be constructed: rate_temp=X*rate_CPU+Y*rate_RAM+Z*rate_NET+B, where X represents the influence coefficient of the central processing unit, Y represents the influence coefficient of the random access memory, Z represents the influence coefficient of the network card, B represents a constant, rate_temp represents the temperature change rate, rate_CPU represents the occupancy change rate of the central processing unit, rate_RAM represents the occupancy change rate of the random access memory, and rate_NET represents the occupancy change rate of the network card. On this basis, by combining the equations formed by each group of adjacent sampling points to form an equation group, each influence coefficient can be solved. Of course, the above example is only a possible example in the actual application process, and the method of obtaining the influence coefficient is not limited to this, and no examples are given one by one here.

[0048] In an implementation scenario, as mentioned above, the temperature impact value can also be obtained based on the impact factors of each business process causing heating to the target hardware. For details, please refer to the above-mentioned related description, which will not be repeated here. Similar to the impact coefficient, the impact factor is continuously updated during the operation of the electronic device. In other words, the continuous update of the impact factor does not affect the heat dissipation control of the electronic device. When it is necessary to combine the impact factor for heat dissipation control, it is only necessary to load the latest updated impact factor. The impact factor can be specifically updated based on the operation monitoring data sampled by the electronic device at each historical moment, and the operation monitoring data includes: the historical detection results of the resource occupancy of the target hardware at the historical moment and the historical device temperature of the electronic device at the historical moment. In other words, during the operation of the electronic device, the operation monitoring data can be continuously collected and the impact coefficient can be updated accordingly. Exemplarily, as long as the amount of the newly accumulated operation monitoring data meets certain requirements, the update of the impact coefficient can be triggered, so that the impact coefficient can be continuously updated during the operation of the electronic device, and in the heat dissipation control process, it is only necessary to load the latest impact coefficient.

[0049] In a specific implementation scenario, still taking the heat dissipation component including the air cooling component as an example, the operation monitoring data can be represented as shown in Table 4.

[0050] Table 4 Schematic table of another embodiment of operation monitoring data

[0051]

[0052] As shown in Table 4, the target hardware may specifically include a central processing unit, a random access memory, and a network card, etc. At the historical moment of sampling point 1, the historical device temperature is T1, the historical detection results of the central processing unit include a historical occupancy rate of 30%, including a historical occupancy rate of 15% for business process A, a historical occupancy rate of 10% for business process B, etc., the historical detection results of the random access memory include a historical occupancy rate of 20%, including a historical occupancy rate of 10% for business process A, a historical occupancy rate of 10% for business process B, etc., the historical detection results of the network card include a historical occupancy rate of 40%, at which time the historical heat dissipation intensity of the air cooling component is 2000 revolutions (the duty cycle of the PWM signal is 20%). In addition, at the historical moments of other sampling points, this can be deduced by analogy, and no examples are given here one by one.

[0053] In a specific implementation scenario, as a possible example, the operation monitoring data of each group of adjacent sampling points can be compared. For example, for sampling point 1 and sampling point 2, the temperature T1 and temperature T2 can be compared to obtain the temperature difference of the group of adjacent sampling points, and the temperature change rate is calculated accordingly, and the occupancy difference of the same business process with respect to the central processor is compared, and the occupancy change rate of the corresponding business process with respect to the central processor is calculated accordingly, and the occupancy difference of the same business process with respect to the random access memory is compared, and the occupancy change rate of the corresponding business process with respect to the random access memory is calculated accordingly. For sampling point 2 and sampling point 3, sampling point 3 and sampling point 4, ..., sampling point n-1 and sampling point n, the same can be applied, and examples are not given one by one here. On this basis, for each group of adjacent sampling points, an equation with the impact factor of the business process on the target hardware as the unknown quantity can be constructed. For example, for each group of adjacent sampling points, the equation can be constructed: rate_temp=X*(w_CPU_1*rate_CPU_1+w_CPU_2*rate_CPU_2+…+w_CPU_n*rate_CPU_n)+Y*(w_RAM_1*rate_RAM_1+w_RAM_2*rate_RAM_2+…+w_RAM_n*rate_RAM_n)+Z*rate_NET+B, where , X represents the influence coefficient of the central processing unit, Y represents the influence coefficient of the random access memory, Z represents the influence coefficient of the network card, B represents a constant, rate_temp represents the temperature change rate, rate_CPU_i represents the occupancy change rate of the i-th business process on the central processing unit, w_CPU_i represents the influence factor of the i-th business process on the central processing unit, rate_RAM_i represents the occupancy change rate of the i-th business process on the random access memory, w_RAM_i represents the influence factor of the i-th business process on the random access memory, and rate_NET represents the occupancy change rate of the network card. On this basis, by combining the equations formed by each group of adjacent sampling points to form an equation system, each influence coefficient and influence factor can be solved. Of course, the above example is only a possible example in the actual application process, and the method of obtaining the influence coefficient is not limited to this, and no examples are given one by one here.

[0054] Step S13: adjusting the current heat dissipation intensity of the heat dissipation component based on the temperature influence value to obtain the target heat dissipation intensity of the heat dissipation component.

[0055] In one implementation scenario, the current heat dissipation intensity can be adjusted according to the change trend represented by the temperature impact value. For example, the greater the change trend, the greater the adjustment of the current heat dissipation intensity to obtain the target heat dissipation intensity, and conversely, the smaller the change trend, the smaller the adjustment of the current heat dissipation intensity to obtain the target heat dissipation intensity.

[0056] In an implementation scenario, as mentioned above, the current heat dissipation intensity can be determined based on a preset mapping relationship and the current temperature of the electronic device. For details, please refer to the above-mentioned related descriptions, which will not be repeated here. On this basis, the current heat dissipation intensity can be adjusted based on the product of the temperature impact value and the current adjustment step length to obtain the target heat dissipation intensity of the heat dissipation component, and the current adjustment step length can specifically be the difference between the upper limit value and the lower limit value of the mapping intensity interval. The above method adjusts the current heat dissipation intensity according to the product of the temperature impact value and the current adjustment step length, which can prevent the temperature of the electronic device from rising too fast as much as possible through the temperature impact value, and at the same time can further refine the adjustment granularity of the heat dissipation intensity to achieve refined adjustment.

[0057] In a specific implementation scenario, still taking the heat dissipation component including the air cooling component as an example, when the current temperature is lower than 40 degrees, the lower limit value of the heat dissipation interval intensity [2000,4000) can be determined, that is, 2000 revolutions as the current heat dissipation intensity. At this time, the current adjustment step is the difference between the upper limit value and the lower limit value, that is, 2000 revolutions. When the current temperature is other values, it can be deduced by analogy, and examples are not given one by one here. For the sake of ease of description, the lower limit value of the intensity interval mapped to the current temperature can be recorded as n1, and the upper limit value can be recorded as n2, then the current adjustment step can be recorded as In this case, the target heat dissipation intensity can be expressed as: For example, still taking the current temperature below 40 degrees as an example, the current adjustment step is 2000 revolutions, if the temperature impact value is calculated to be 0.2, then the target heat dissipation intensity is: Of course, the above example is only a possible example in the actual application process, and other situations can be deduced by analogy, and no more examples are given here.

[0058] In a specific implementation scenario, as another possible example, after obtaining the temperature impact value, it is also possible to first determine whether the temperature impact value is lower than a preset impact value (such as 0.1, etc.). If so, the current heat dissipation intensity can be maintained as the target heat dissipation intensity. Otherwise, the aforementioned step of adjusting the current heat dissipation intensity based on the product of the temperature impact value and the current adjustment step to obtain the target heat dissipation intensity of the heat dissipation component can be performed. In this way, when the change trend represented by the temperature impact value is small, the current heat dissipation intensity can be maintained, thereby being able to meet the heat dissipation requirements while reducing the trigger frequency of adjusting the heat dissipation intensity as much as possible.

[0059] Step S14: Based on the target heat dissipation intensity, control the heat dissipation component to dissipate heat.

[0060] In one implementation scenario, after the target heat dissipation intensity is obtained, the heat dissipation component can be controlled to dissipate heat based on the target heat dissipation intensity. For example, still taking the heat dissipation component including the air cooling component as an example, when the current temperature is lower than 40 degrees, if the temperature influence coefficient S is calculated to be 0.2 (i.e., there is a slight upward trend), the target heat dissipation intensity can be calculated to be 2400 rpm, and at this time, the air cooling component can be controlled to dissipate heat for the electronic device at a fan speed of 2400 rpm.

[0061] In one implementation scenario, after controlling the heat dissipation component to dissipate heat based on the target heat dissipation intensity, in response to meeting the heat dissipation condition, the step of obtaining the current detection result of the resource occupancy of the target hardware in the electronic device at the current moment can be returned to start a new round of heat dissipation control, and based on the preset mapping relationship, the matching result of the heat dissipation intensity interval where the target heat dissipation intensity is located and the new current temperature of the electronic device is obtained, so as to determine whether to perform heat dissipation control on the heat dissipation component based on the preset mapping relationship based on the matching result. It should be noted that the specific setting of the heat dissipation condition can refer to the aforementioned related description, which will not be repeated here. On this basis, in the above manner, after heat dissipation control is performed based on the target heat dissipation intensity, it is further determined whether to dissipate the heat dissipation component based on the preset mapping relationship according to the matching result between the heat dissipation intensity interval where the target heat dissipation intensity is located and the new current dimension when the heat dissipation condition is met, and the step of obtaining the current detection result can be returned, which can reflect the effect feedback of the target heat dissipation intensity on the electronic device to dissipate heat in advance according to the matching result, which helps to ensure that the electronic device is in a temperature controllable state as much as possible.

[0062] In a specific implementation scenario, when the heat dissipation intensity interval that should be mapped to the temperature interval where the new current temperature is located is consistent with the heat dissipation intensity interval where the target heat dissipation intensity is located, it can be determined that the matching result includes a match. Conversely, when the heat dissipation intensity interval corresponding to the temperature interval where the new current temperature is located is inconsistent with the heat dissipation intensity interval where the target heat dissipation intensity is located, it can be determined that the matching result includes a mismatch.

[0063] In a specific implementation scenario, still taking the heat dissipation component including the air cooling component as an example, after the electronic device is cooled in advance based on the target heat dissipation intensity of 2400 rpm, when the heat dissipation conditions are met, the new current temperature of the electronic device can be obtained, such as 39 degrees. At this time, the new current temperature still matches the heat dissipation intensity interval where the target heat dissipation intensity (i.e., 2400 rpm) is located, so it can be determined that there is no need to control the heat dissipation of the heat dissipation component based on the preset mapping relationship; on the contrary, if the new current temperature of the electronic device is 41 degrees, then the new current temperature does not match the heat dissipation intensity interval where the target heat dissipation intensity (i.e., 2400 rpm) is located, so it can be determined that it is necessary to control the heat dissipation of the heat dissipation component based on the preset mapping relationship. Specifically, the new current heat dissipation intensity can be determined based on the new current temperature and the preset mapping relationship, that is, the lower limit value of the heat dissipation intensity interval mapped to the temperature interval where the new current temperature is located, i.e., 4000 rpm, as the new current heat dissipation intensity. It should be noted that the above example is only a possible example in the actual application process, and other situations can be deduced by analogy, and no examples are given one by one here.

[0064] In a specific implementation scenario, no matter what the matching result is, it does not affect the step of returning to the above step of obtaining the current detection result of the resource occupancy of the target hardware in the electronic device at the current moment when the heat dissipation condition is met, so as to start the next round of heat dissipation control. It should be noted that in the actual application process, since the matching result is obtained faster, the heat dissipation control according to the preset mapping relationship and the new current temperature is completed one step earlier, so that the electronic device can be controlled by the heat dissipation component as soon as possible when the device temperature suddenly changes.

[0065] The above scheme obtains the current detection result of the resource occupation of the target hardware in the electronic device at the current moment, and at least the influence coefficient and detection result of the resource occupation of the target hardware on the device temperature, obtains the temperature influence value, and the temperature influence value represents the change trend of the device temperature, and then adjusts the current heat dissipation intensity of the heat dissipation component based on the temperature influence value to obtain the target heat dissipation intensity of the heat dissipation component, thereby controlling the heat dissipation component to dissipate heat based on the target heat dissipation intensity, and then, on the one hand, compared with controlling the heat dissipation intensity at different gears, adjusting the heat dissipation intensity according to the dimension influence value can improve the precision of heat dissipation control, and on the other hand, by combining the influence coefficient of the resource occupation of the target hardware on the device temperature and the resource occupation of the target hardware at the current moment, the temperature influence value representing the change trend of the device temperature is obtained, and the heat dissipation intensity is adjusted accordingly, compared with heat dissipation control after the device temperature changes, it can be realized that heat dissipation control is carried out in advance before the temperature changes according to the real-time operating status, and the advanced nature of heat dissipation control can be realized. Therefore, the precision of heat dissipation control can be improved, and the advanced nature of heat dissipation control can be realized.

[0066] See also Figure 2 , Figure 2 It is a schematic diagram of the framework of an embodiment of the heat dissipation control device 20 of the present application. The heat dissipation control device 20 includes: an occupancy detection module 21, an impact determination module 22, an intensity adjustment module 23 and a component control module 24. The occupancy detection module 21 is used to obtain the current detection result of the resource occupancy of the target hardware in the electronic device at the current moment; the impact determination module 22 is used to obtain the temperature impact value based on at least the impact coefficient and detection result of the resource occupancy of the target hardware on the device temperature; wherein the temperature impact value represents the change trend of the device temperature; the intensity adjustment module 23 is used to adjust the current heat dissipation intensity of the heat dissipation component based on the temperature impact value to obtain the target heat dissipation intensity of the heat dissipation component; the component control module 24 is used to control the heat dissipation component to dissipate heat based on the target heat dissipation intensity.

[0067] In the above scheme, the heat dissipation control device 20 obtains the current detection result of the resource occupation of the target hardware in the electronic device at the current moment, and at least the influence coefficient and detection result of the resource occupation of the target hardware on the device temperature, obtains the temperature influence value, and the temperature influence value represents the change trend of the device temperature, and then adjusts the current heat dissipation intensity of the heat dissipation component based on the temperature influence value to obtain the target heat dissipation intensity of the heat dissipation component, thereby controlling the heat dissipation component to dissipate heat based on the target heat dissipation intensity, and then, on the one hand, compared with controlling the heat dissipation intensity at different gears, adjusting the heat dissipation intensity according to the dimension influence value can improve the precision of heat dissipation control, and on the other hand, by combining the influence coefficient of the resource occupation of the target hardware on the device temperature and the resource occupation of the target hardware at the current moment, the temperature influence value representing the change trend of the device temperature is obtained, so as to adjust the heat dissipation intensity accordingly, compared with performing heat dissipation control after the device temperature changes, it can be realized that heat dissipation control is performed in advance before the temperature changes according to the real-time operating status, and the advanced nature of heat dissipation control can be achieved. Therefore, the precision of heat dissipation control can be improved, and the advanced nature of heat dissipation control can be achieved.

[0068] In some disclosed embodiments, the current detection result includes at least the first occupancy rate of the target hardware at the current moment, and the impact determination module 22 includes a first determination submodule for weighting the first occupancy rate and the impact coefficient of the same target hardware to obtain a temperature impact value.

[0069] In some public embodiments, the current detection result includes at least the second occupancy rate of the target hardware by each business process at the current moment, and the impact determination module 22 includes a second determination sub-module for weighting, for the same target hardware, the second occupancy rate of the target hardware by each business process and the impact factor causing heat generation on the target hardware to obtain a sub-impact value of the device temperature of the corresponding target hardware; and weighting based on the sub-impact value and impact coefficient of the same target hardware to obtain a temperature impact value.

[0070] In some disclosed embodiments, an electronic device includes first hardware and second hardware, both of which serve as target hardware, the first hardware supports detecting the occupancy rate of the entire hardware, and the second hardware supports detecting the occupancy rate of each business process, and a current detection result includes a first occupancy rate of the first hardware at a current moment and a second occupancy rate of each business process on the second hardware at a current moment, respectively. The impact determination module 22 includes a third determination submodule, which is used to perform weighting based on the first occupancy rate and the impact coefficient of the same first hardware to obtain a first impact value of the first hardware; and, for the same second hardware, perform weighting based on the second occupancy rate of the second hardware by each business process and the impact factor causing heat generation on the second hardware to obtain a sub-impact value of the corresponding second hardware on the device temperature, and perform weighting based on the sub-impact value and the impact coefficient of the same second hardware to obtain a second impact value of the second hardware; and obtain a temperature impact value based on the first impact value and the second impact value.

[0071] In some disclosed embodiments, the impact coefficient is continuously updated during the operation of the electronic device. The impact coefficient is updated based on operation monitoring data sampled by the electronic device at each historical moment, and the operation monitoring data includes: historical detection results of resource occupancy of the target hardware at historical moments and historical device temperature of the electronic device at historical moments.

[0072] In some public embodiments, the temperature impact value is also obtained based on the impact factors of each business process causing heat to the target hardware. The impact factors are continuously updated during the operation of the electronic device. The impact factors are updated based on the operation monitoring data sampled by the electronic device at each historical moment, and the operation monitoring data includes: historical detection results of resource occupancy of the target hardware at historical moments and historical device temperatures of the electronic device at historical moments.

[0073] In some disclosed embodiments, the heat dissipation control device 20 includes a temperature mapping module for determining a current heat dissipation intensity of a heat dissipation component based on a preset mapping relationship and a current temperature of the electronic device; wherein the preset mapping relationship includes a mapping relationship between a temperature interval and a heat dissipation intensity interval of the heat dissipation component, and the current heat dissipation intensity is a lower limit value of the mapping intensity interval corresponding to the current temperature, and the mapping intensity interval is a heat dissipation intensity interval mapped to the temperature interval in which the current temperature is located; the intensity adjustment module 23 is specifically used to adjust the current heat dissipation intensity based on the product of the temperature influence value and the current adjustment step length to obtain a target heat dissipation intensity of the heat dissipation component; wherein the current adjustment step length is the difference between the upper limit value and the lower limit value of the mapping intensity interval.

[0074] In some disclosed embodiments, the heat dissipation control device 20 includes a re-control module for returning to the step of obtaining a current detection result of resource occupancy of the target hardware in the electronic device at the current moment in response to meeting the heat dissipation condition, and obtaining a matching result between the heat dissipation intensity interval where the target heat dissipation intensity is located and the new current temperature of the electronic device based on a preset mapping relationship, so as to determine, based on the matching result, whether to perform heat dissipation control on the heat dissipation component based on the preset mapping relationship.

[0075] In some disclosed embodiments, the heat dissipation component includes an air cooling component, and the heat dissipation intensity of the air cooling component represents the fan speed; and / or, the heat dissipation component includes a water cooling component, and the heat dissipation intensity of the water cooling component at least represents the water pump speed; and / or, the heat dissipation component includes a semiconductor refrigeration component, and the heat dissipation intensity of the semiconductor refrigeration component at least represents the current size.

[0076] See also Figure 3 , Figure 3 3 is a schematic diagram of a framework of an embodiment of an electronic device 30 of the present application. The electronic device 30 at least includes a heat dissipation component 31, a non-volatile memory 32 and a processor 33. The heat dissipation component 31 and the non-volatile memory 32 are respectively coupled to the processor 33. At least the processor 33 serves as the target hardware for detecting resource occupancy during the heat dissipation control process, and the non-volatile memory 32 stores program instructions, and the processor is used to execute the program instructions to implement the steps in the above heat dissipation control method embodiment. It should be noted that the electronic device 30 may include but is not limited to: a server, a laptop computer, a desktop computer, a network video recorder, etc., and the specific type of the electronic device 30 is not limited here. The non-volatile memory 32 may include but is not limited to a solid state drive, a mechanical hard disk, etc. In addition, the electronic device 30 may also include a volatile memory (not shown), and the volatile memory may include but is not limited to a random access memory, etc., as the target hardware. In addition, the electronic device 30 may also include a network card as the target hardware. The above examples are only several possible examples of the hardware contained in the electronic device 30, and they are not given one by one here.

[0077] Specifically, the processor 33 may also be referred to as a CPU (Central Processing Unit). The processor 33 may be an integrated circuit chip having the ability to process signals. The processor 33 may also be a general-purpose processor, a digital signal processor, an application-specific integrated circuit, a field programmable gate array or other programmable logic device, a discrete gate or transistor logic device, a discrete hardware component. A general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc. In addition, the processor 33 may be implemented by a plurality of integrated circuit chips.

[0078] In the above scheme, the electronic device 30 obtains the current detection result of the resource occupation of the target hardware in the electronic device at the current moment, and at least the influence coefficient and detection result of the resource occupation of the target hardware on the device temperature, obtains the temperature influence value, and the temperature influence value represents the change trend of the device temperature, and then adjusts the current heat dissipation intensity of the heat dissipation component based on the temperature influence value to obtain the target heat dissipation intensity of the heat dissipation component, thereby controlling the heat dissipation component to dissipate heat based on the target heat dissipation intensity, and then, on the one hand, compared with controlling the heat dissipation intensity at different gears, adjusting the heat dissipation intensity according to the dimension influence value can improve the precision of heat dissipation control, and on the other hand, by combining the influence coefficient of the resource occupation of the target hardware on the device temperature and the resource occupation of the target hardware at the current moment, the temperature influence value representing the change trend of the device temperature is obtained, and the heat dissipation intensity is adjusted accordingly, compared with performing heat dissipation control after the device temperature changes, it can be realized that heat dissipation control is performed in advance before the temperature changes according to the real-time operating status, and the advanced nature of heat dissipation control can be achieved. Therefore, the precision of heat dissipation control can be improved, and the advanced nature of heat dissipation control can be achieved.

[0079] See also Figure 4 , Figure 4 4 is a schematic diagram of a framework of an embodiment of a computer-readable storage medium 40 of the present application. The computer-readable storage medium 40 stores program instructions 41 executable by a processor, and the program instructions 41 can be executed to implement the steps in any of the above-mentioned heat dissipation control method embodiments.

[0080] In the above scheme, the computer-readable storage medium 40 implements the steps in any of the above heat dissipation control method embodiments. On the one hand, compared with controlling the heat dissipation intensity at different gears, adjusting the heat dissipation intensity according to the dimension influence value can improve the precision of heat dissipation control. On the other hand, by combining the influence coefficient of the resource occupancy of the target hardware on the device temperature and the resource occupancy of the target hardware at the current moment, a temperature influence value representing the temperature change trend of the device is obtained to adjust the heat dissipation intensity accordingly. Compared with performing heat dissipation control after the device temperature changes, heat dissipation control can be performed in advance before the temperature changes according to the real-time operating status, and the preemptive nature of heat dissipation control can be achieved. Therefore, the precision of heat dissipation control can be improved and the preemptive nature of heat dissipation control can be achieved.

[0081] In the several embodiments provided in the present application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device implementation described above is only schematic. For example, the division of modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or units can be electrical, mechanical or other forms.

[0082] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0083] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0084] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions to enable a computer device (which can be a personal computer, server, or network device, etc.) or a processor to execute all or part of the steps of each implementation method of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program code.

[0085] If the technical solution of this application involves personal information, the product using the technical solution of this application has clearly informed the personal information processing rules and obtained the individual's voluntary consent before processing the personal information. If the technical solution of this application involves sensitive personal information, the product using the technical solution of this application has obtained the individual's separate consent before processing the sensitive personal information, and at the same time meets the "explicit consent" requirement. For example, on personal information collection devices such as cameras, clear and prominent signs are set to inform that the personal information collection scope has been entered and personal information will be collected. If the individual voluntarily enters the collection scope, it is deemed that he or she agrees to the collection of his or her personal information; or on the device that processes personal information, the personal information processing rules are notified by obvious signs / information, and the individual's authorization is obtained through pop-up information or by asking the individual to upload his or her personal information; among them, the personal information processing rules may include information such as the personal information processor, the purpose of personal information processing, the processing method, and the type of personal information processed.

Claims

1. A heat dissipation control method, characterized in that: include: Obtaining a current detection result of resource occupancy of target hardware in the electronic device at the current moment; wherein the current detection result at least includes the occupancy rate of the target hardware by each business process at the current moment; At least based on the influence coefficient of the resource occupation of the target hardware on the device temperature and the detection result, a temperature influence value is obtained; wherein the temperature influence value represents the change trend of the device temperature, the influence coefficient is a numerical value, and is continuously updated based on the operation monitoring data sampled by the electronic device at each historical moment during the operation of the electronic device, and the latest updated influence coefficient is loaded when performing heat dissipation control; Adjusting a current heat dissipation intensity of a heat dissipation component based on the temperature influence value to obtain a target heat dissipation intensity of the heat dissipation component; Based on the target heat dissipation intensity, controlling the heat dissipation component to dissipate heat; The obtaining of the temperature impact value based at least on the influence coefficient of the resource occupation of the target hardware on the device temperature and the detection result includes: For the same target hardware, weighting is performed based on the occupancy rate of each business process on the target hardware and the influence factor causing the heat generation of the target hardware, so as to obtain the sub-influence value of the target hardware on the device temperature; wherein the influence factor is a numerical value, and is continuously updated during the operation of the electronic device based on the operation monitoring data sampled by the electronic device at each historical moment, and the latest updated influence factor is loaded when performing heat dissipation control, the operation monitoring data includes: the historical detection results of the resource occupancy of the target hardware at the historical moment and the historical device temperature of the electronic device at the historical moment, and the historical detection results include the historical occupancy rate of the target hardware by the business process; The temperature impact value is obtained by weighting the sub-influence values ​​and the influence coefficients of the same target hardware.

2. The method according to claim 1, characterized in that The electronic device includes first hardware and second hardware both serving as the target hardware, the first hardware supports detecting the occupancy rate of the entire hardware, and the second hardware supports detecting the occupancy rate of each business process, the current detection result also includes a first occupancy rate of the first hardware at the current moment and a second occupancy rate of each business process on the second hardware at the current moment, and obtaining a temperature impact value based at least on an influence coefficient of resource occupancy of the target hardware on device temperature and the detection result includes: Performing weighting based on the first occupancy rate and the influence coefficient of the same first hardware to obtain a first influence value of the first hardware; and For the same second hardware, weighting is performed based on the second occupancy rate of the second hardware by each business process and the influence factor causing heat generation of the second hardware to obtain a sub-influence value of the corresponding second hardware on the device temperature, and weighting is performed based on the sub-influence value and the influence coefficient of the same second hardware to obtain a second influence value of the second hardware; The temperature influence value is obtained based on the first influence value and the second influence value.

3. The method according to claim 1, characterized in that Before obtaining the current detection result of resource occupancy of the target hardware in the electronic device at the current moment, the method further includes: Based on a preset mapping relationship and the current temperature of the electronic device, determine the current heat dissipation intensity of the heat dissipation component; wherein the preset mapping relationship includes a mapping relationship between a temperature interval and a heat dissipation intensity interval of the heat dissipation component, and the current heat dissipation intensity is a lower limit value of the mapping intensity interval corresponding to the current temperature, and the mapping intensity interval is a heat dissipation intensity interval mapped to the temperature interval where the current temperature is located; The step of adjusting the current heat dissipation intensity of the heat dissipation component based on the temperature influence value to obtain the target heat dissipation intensity of the heat dissipation component includes: The current heat dissipation intensity is adjusted based on the product of the temperature impact value and the current adjustment step to obtain the target heat dissipation intensity of the heat dissipation component; wherein the current adjustment step is the difference between the upper limit value and the lower limit value of the mapping intensity interval.

4. The method according to claim 3, characterized in that After controlling the heat dissipation component to dissipate heat based on the target heat dissipation intensity, the method further includes: In response to satisfying the heat dissipation condition, obtaining, based on the preset mapping relationship, a matching result between the heat dissipation intensity interval where the target heat dissipation intensity is located and the new current temperature of the electronic device; Based on the matching result, it is determined whether to perform heat dissipation control on the heat dissipation component based on the preset mapping relationship, and the step of obtaining the current detection result of the resource occupancy of the target hardware in the electronic device at the current moment is returned.

5. The method according to any one of claims 1 to 4, characterized in that: The heat dissipation component includes an air cooling component, and the heat dissipation intensity of the air cooling component represents the fan speed; And / or, the heat dissipation component includes a water cooling component, and the heat dissipation intensity of the water cooling component at least represents the rotation speed of the water pump; And / or, the heat dissipation component includes a semiconductor refrigeration component, and the heat dissipation intensity of the semiconductor refrigeration component at least represents the current size.

6. A heat dissipation control device, characterized in that: include: An occupancy detection module is used to obtain a current detection result of resource occupancy of target hardware in the electronic device at the current moment; wherein the current detection result at least includes the occupancy rate of each service process on the target hardware at the current moment; An impact determination module, configured to obtain a temperature impact value based at least on an impact coefficient of the resource occupancy of the target hardware on the device temperature and the detection result; wherein the temperature impact value represents a change trend of the device temperature, the impact coefficient is a numerical value, and is continuously updated during the operation of the electronic device based on operation monitoring data sampled by the electronic device at various historical moments, and the latest updated impact coefficient is loaded when performing heat dissipation control; A strength adjustment module, used to adjust the current heat dissipation strength of the heat dissipation component based on the temperature influence value to obtain a target heat dissipation strength of the heat dissipation component; A component control module, used to control the heat dissipation component to dissipate heat based on the target heat dissipation intensity; The obtaining of the temperature impact value based at least on the influence coefficient of the resource occupation of the target hardware on the device temperature and the detection result includes: For the same target hardware, weighting is performed based on the occupancy rate of each business process on the target hardware and the influence factor causing the heat generation of the target hardware, so as to obtain the sub-influence value of the target hardware on the device temperature; wherein the influence factor is a numerical value, and is continuously updated during the operation of the electronic device based on the operation monitoring data sampled by the electronic device at each historical moment, and the latest updated influence factor is loaded when performing heat dissipation control, the operation monitoring data includes: the historical detection results of the resource occupancy of the target hardware at the historical moment and the historical device temperature of the electronic device at the historical moment, and the historical detection results include the historical occupancy rate of the target hardware by the business process; The temperature impact value is obtained by weighting the sub-influence values ​​and the influence coefficients of the same target hardware.

7. An electronic device, characterized in that: The method comprises at least a heat dissipation component, a non-volatile memory and a processor, wherein the heat dissipation component and the non-volatile memory are respectively coupled to the processor, at least the processor serves as target hardware for detecting resource occupancy during heat dissipation control, and the non-volatile memory stores program instructions, and the processor is used to execute the program instructions to implement the heat dissipation control method according to any one of claims 1 to 5.

8. A computer-readable storage medium, characterized in that: Program instructions that can be executed by a processor are stored, and the program instructions are used to implement the heat dissipation control method according to any one of claims 1 to 5.

Images