A semiconductor wafer surface cleaning mechanism

Abstract

The present invention discloses a semiconductor wafer surface cleaning mechanism, including a cleaning body, a closed cover plate, a wafer introduction cleaning component and a gas cleaning mechanism. The top of the cleaning body is provided with an installation port and the top is movably connected to the closed cover plate through a hinge. The closed cover plate includes a plate body and a closed disk built inside the plate body. The closed disk is used in conjunction with the installation port. The wafer introduction cleaning mechanism is installed in the installation port and includes a top plate, a cleaning box, a rotary drive, an elastic component, a container one and a container two. The top plate is installed at the bottom of the installation port and has a plurality of groups of wafer introduction ports evenly opened on the surface. The cleaning box is installed below the top plate, and the rotary drive is installed at the bottom of the cleaning box. The semiconductor wafer cleaning device designed by the present invention can realize synchronous and automatic cleaning of groups of wafers, and cleans the wafers by combining chemical immersion with gas cleaning, which greatly improves the effect and efficiency of wafer cleaning.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor wafers, in particular to a semiconductor wafer surface cleaning mechanism. Background Art

[0002] Semiconductor wafer refers to the basic material used to manufacture integrated circuits and other semiconductor devices. It is a round silicon wafer made of high-purity single-crystal silicon material. Wafers play a key role in the integrated circuit manufacturing process. As the substrate of the circuit, they provide a flat surface and the structure and materials used to manufacture electronic devices. Semiconductor wafers are one of the core materials in the semiconductor industry. They provide the basis for integrated circuit manufacturing. During the manufacturing process, multiple electronic devices such as transistors, capacitors, resistors, etc. will be formed on the wafer, and finally form tiny and complex integrated circuit chips. The cleaning of semiconductor wafers is particularly important during the production and processing of semiconductor wafers. Various pollutants such as dust, particles, grease, moisture, organic matter, etc. exist on the surface of the wafer. These pollutants may have a negative impact on subsequent process steps and device performance, and will cause problems such as poor circuit connection, leakage, and short circuit. The existing methods for cleaning semiconductor wafers are diverse, mainly including: chemical immersion cleaning, ultrasonic cleaning, gas cleaning, ultrapure water cleaning, and atmosphere cleaning.

[0003] However, the existing semiconductor wafer surface cleaning method has the following problems: during the cleaning process, the semiconductor wafer is mainly cleaned on the upper and lower surfaces of the wafer body, but often lacks the effect of cleaning the periphery of the wafer body, which easily leads to incomplete cleaning of the wafer body. In addition, in order to improve the cleaning effect of the semiconductor wafer, the semiconductor wafer is mainly cleaned one by one, which affects the cleaning efficiency. In addition, the automation level of semiconductor wafer cleaning is not high, and manual assistance is often required. Therefore, it is necessary to design corresponding technical solutions to solve the existing technical problems. Summary of the invention

[0004] The purpose of the present invention is to provide a semiconductor wafer surface cleaning mechanism, which solves the problem that during the cleaning process of the semiconductor wafer, the upper and lower surfaces of the wafer body are mainly cleaned, but the periphery of the wafer body is often not cleaned, which easily leads to incomplete cleaning of the wafer body. In addition, in order to improve the cleaning effect of the semiconductor wafer, the cleaning method for the semiconductor wafer is mainly a one-by-one cleaning method, which affects the cleaning efficiency. In addition, the degree of automation for cleaning the semiconductor wafer is not high, and human-assisted operation is often required. This technical problem.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor wafer surface cleaning mechanism, comprising a cleaning body, a closed cover, a wafer introduction cleaning component and a gas cleaning mechanism, wherein a mounting port is provided on the top of the cleaning body and the top is movably connected to the closed cover by a hinge, the closed cover comprises a plate body and a closed disk built into the inner side of the plate body, the closed disk is used in conjunction with the mounting port, the wafer introduction cleaning mechanism is installed in the mounting port and comprises a top plate, a cleaning box, a rotating drive, an elastic component, container one and container two, the top plate is installed at the bottom of the mounting port and a plurality of groups of wafer introduction ports are evenly provided on the surface, the cleaning box is installed below the top plate, the rotating drive is installed at the bottom of the cleaning box, the elastic component is installed at the bottom of the top plate, The force component is installed on one side of the cleaning box, and the container one and container two are symmetrically installed on the left and right sides of the cleaning body. Pump bodies are installed on the top of the container one and container two, and the pump bodies are connected to the cleaning box through pipelines. The gas cleaning mechanism includes an air storage box, an air suction pump, an air guide pipe, a hydraulic cylinder, a push plate and a guide cleaning plate. The air storage box is installed on the outside of the cleaning body and the upper end is connected to the air suction pump. The air outlet end of the air suction pump is connected to the push plate through the air guide pipe. The hydraulic cylinder is installed on the cleaning body and the power output end is connected to the push plate. The guide cleaning plates are divided into several groups and are evenly installed on the push plates. Several groups of sockets are evenly opened on the outside of the cleaning box, and several groups of the guide cleaning plates are respectively inserted into the several groups of sockets.

[0006] As a preferred embodiment of the present invention, the bottom of the cleaning box is an arc-shaped structure and is filled with a chemical cleaning liquid, wherein the depth of the chemical cleaning liquid is equal to the radius of the semiconductor wafer.

[0007] As a preferred embodiment of the present invention, the rotary driver includes a side panel and a motor mounted on the side panel, a rotating wheel is mounted on the power output end of the motor, the rotating wheel is made of rubber material and has a plurality of groups of shifting bumps formed on the edge, and the shifting bumps are in contact with the bottom of the semiconductor wafer.

[0008] As a preferred embodiment of the present invention, the elastic component includes a bent plate and an electric push rod arranged at the outer end of the bent plate, the middle part of the bent plate is rotatably connected to the side wall of the cleaning box, the lower end of the bent plate is located at the bottom of the semiconductor wafer and the upper end is in contact with the power output end of the electric push rod.

[0009] As a preferred embodiment of the present invention, the bent plate has an S-shaped structure and the width of the lower end is smaller than the width of the upper end.

[0010] As a preferred embodiment of the present invention, the gas storage box is filled with an inert gas, and the inert gas is nitrogen.

[0011] As a preferred embodiment of the present invention, two adjacent groups of the guide cleaning plates are respectively located on both sides of the semiconductor wafer, the length of the guide cleaning plates is greater than the radius of the semiconductor wafer and is located above the chemical cleaning liquid.

[0012] As a preferred embodiment of the present invention, the outer end of the guide cleaning plate is connected to the air guide pipe, an air guide cavity is formed inside the guide cleaning plate and a strip exhaust port is opened on the outside, and the strip exhaust port faces the surface of the semiconductor wafer.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. The present invention designs a device for efficiently cleaning the surface of a semiconductor wafer. The semiconductor wafer cleaning device includes a cleaning body, a closed cover, a wafer introduction cleaning component and a gas cleaning mechanism. When the semiconductor wafer needs to be cleaned, the staff can insert an array of semiconductor wafers into the wafer introduction cleaning component in sequence, and then close the closed cover. The wafer introduction cleaning mechanism drives the internal wafer to undergo a rotational cleaning process. During the rotational cleaning process, nitrogen is introduced to the cleaned wafer through the gas cleaning mechanism. Gas cleaning can remove particles and organic matter on the wafer surface, while avoiding moisture and residues that may be brought by liquid cleaning. After cleaning, the wafer is ejected through the ejection mechanism.

[0015] 2. The semiconductor wafer cleaning equipment designed in the present invention can realize the synchronous and automated cleaning processing of an array of wafers, and clean the wafers by combining chemical immersion with gas cleaning, which greatly improves the effect and efficiency of wafer cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is the overall structure diagram of the present invention;

[0017] Figure 2 This is a structural diagram of the wafer introduction and cleaning assembly of the present invention;

[0018] Figure 3 This is a diagram showing the internal structure of the cleaning box of the present invention;

[0019] Figure 4 This is a structural diagram of the gas cleaning mechanism of the present invention;

[0020] Figure 5 This is a structural diagram of the guide cleaning plate described in the present invention.

[0021] In the figure: 1. cleaning body; 2. mounting port; 3. plate body; 4. closing plate; 5. top plate; 6. cleaning box; 7. rotating drive; 8. elastic component; 9. container one; 10. container two; 11. wafer introduction port; 12. pump body; 13. air storage box; 14. vacuum pump; 15. air guide tube; 16. hydraulic cylinder; 17. push plate; 18. guide cleaning plate; 19. socket; 20. chemical cleaning liquid; 21. side plate; 22. motor; 23. rotating wheel; 24. toggle bump; 25. bending plate; 26. electric push rod; 27. inert gas; 28. air guide cavity; 29. ​​strip exhaust port. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] See also Figure 1-5 The present invention provides a technical solution: a semiconductor wafer surface cleaning mechanism, comprising a cleaning body 1, a closed cover, a wafer introduction cleaning component and a gas cleaning mechanism, a mounting port 2 is provided on the top of the cleaning body 1 and the top is movably connected to the closed cover by a hinge, the closed cover comprises a plate body 3 and a closed disk 4 with an inner side of the plate body 3 built therein, the closed disk 4 is used in conjunction with the mounting port 2, the wafer introduction cleaning mechanism is installed in the mounting port 2 and comprises a top plate 5, a cleaning box 6, a rotating driver 7, an elastic component 8, a container 1 9 and a container 2 10, the top plate 5 is installed at the bottom of the mounting port 2 and a plurality of groups of wafer introduction ports 11 are evenly provided on the surface, the cleaning box 6 is installed below the top plate 5, the rotating driver 7 is installed at the bottom of the cleaning box 6, the elastic component 8 is installed on one side of the cleaning box 6, and the container Container 1 9 and container 2 10 are symmetrically installed on the left and right sides of the cleaning body 1. Pump bodies 12 are installed on the tops of containers 1 9 and 10. The pump bodies 12 are connected to the cleaning box 6 through a pipeline. The gas cleaning mechanism includes an air storage box 13, an air pump 14, an air guide pipe 15, a hydraulic cylinder 16, a push plate 17 and a guide cleaning plate 18. The air storage box 13 is installed on the outside of the cleaning body 1 and the upper end is connected to the air pump 14. The air outlet end of the air pump 14 is connected to the push plate 17 through the air guide pipe 15. The hydraulic cylinder 16 is installed on the cleaning body 1 and the power output end is connected to the push plate 17. The guide cleaning plates 18 are divided into several groups and are evenly installed on the push plates 17. Several groups of sockets 19 are evenly opened on the outside of the cleaning box 6, and several groups of guide cleaning plates 18 are respectively inserted into the several groups of sockets 19.

[0024] Further improvement, such as Figure 3As shown: the bottom of the cleaning box 6 is an arc-shaped structure and is filled with a chemical cleaning liquid 20. The depth of the chemical cleaning liquid 20 is equal to the radius of the semiconductor wafer. Chemical immersion cleaning can effectively remove organic and inorganic pollutants on the surface.

[0025] Further improvement, such as Figure 3 As shown: the rotary driver 7 includes a side plate 21 and a motor 22 installed on the side plate 21, a rotating wheel 23 is installed at the power output end of the motor 22, the rotating wheel 23 is made of rubber material and has a plurality of groups of shifting protrusions 24 formed on the edge, the shifting protrusions 24 are in contact with the bottom of the semiconductor wafer, and the rotating wheel 23 is driven to rotate by the motor 22, and the rotating wheel 23 rotates the semiconductor wafer through the shifting protrusions 24 during the rotation process, so as to perform a rotary cleaning process.

[0026] Further improvement, such as Figure 3 As shown: the elastic component 8 includes a bent plate 25 and an electric push rod 26 arranged at the outer end of the bent plate 25. The middle part of the bent plate 25 is rotatably connected to the side wall of the cleaning box 6. The lower end of the bent plate 25 is located at the bottom of the semiconductor wafer and the upper end is in contact with the power output end of the electric push rod 26. When the semiconductor wafer is cleaned, the outer end of the bent plate 25 is pressed down by the electric push rod 26, and the bent plate 25 rotates and is pushed out from the semiconductor wafer from the wafer introduction port 11.

[0027] Further improvement, such as Figure 3 As shown, the bent plate 25 is in an S-shaped structure and the width of the lower end is smaller than the width of the upper end. This design makes it easy to push the cleaned semiconductor wafer out from the wafer introduction port 11.

[0028] Further improvement, such as Figure 1 As shown: the gas storage box 13 is filled with an inert gas 27, which is nitrogen. Nitrogen cleaning can remove particles and organic matter on the surface of the wafer, while avoiding moisture and residues that may be caused by liquid cleaning.

[0029] Further improvement, such as Figure 4 and 5 As shown: two adjacent groups of guide cleaning plates 18 are respectively located on both sides of the semiconductor wafer. The length of the guide cleaning plates 18 is greater than the radius of the semiconductor wafer and is located above the chemical cleaning liquid 20. This design can clean both sides of the semiconductor wafer.

[0030] Specifically, the outer end of the guide cleaning plate 18 is connected to the air guide pipe 15, and an air guide cavity 28 is formed inside the guide cleaning plate 18 and a strip exhaust port 29 is opened on the outside. The strip exhaust port 29 faces the surface of the semiconductor wafer. The air guide cavity 28 can be used to guide the airflow and discharge nitrogen from the strip exhaust port 29. Particles and organic matter on the wafer surface can be removed by nitrogen cleaning, while avoiding moisture and residues that may be caused by liquid cleaning.

[0031] During use: When the semiconductor wafer needs to be cleaned, the staff can import several groups of semiconductor wafers to be cleaned from the wafer introduction port 11 in sequence. After the import is completed, the plate body 3 is closed so that the closing disk 4 seals the installation port 2, and then the motor 22 drives the rotating wheel 23 to rotate. During the rotation, the rotating wheel 23 drives the semiconductor wafer to rotate by moving the protrusion 24 to perform a rotary cleaning treatment. At the same time, the vacuum pump 14 extracts the nitrogen in the air storage box 13 and imports it to the guide cleaning plate 18. The guide cleaning plate 18 is used to clean both sides of the wafer. The particles and organic matter on the surface of the wafer can be removed by nitrogen cleaning, and the moisture and residue that may be brought by liquid cleaning can be avoided. After cleaning, the outer end of the bent plate 25 is pressed down by the electric push rod 26, and the bent plate 25 rotates and is pushed out from the semiconductor wafer from the wafer introduction port 11 to complete the purpose of cleaning the semiconductor wafer.

[0032] In the description of the present invention, it is necessary to understand that the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inside", "front", "center", "both ends" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0033] In addition, the terms "first", "second", "third" and "fourth" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first", "second", "third" and "fourth" may explicitly or implicitly include at least one of such features.

[0034] In the present invention, unless otherwise clearly stipulated and limited, the terms such as "installation", "setting", "connection", "fixation" and "screw-on" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the present invention according to the specific circumstances.

[0035] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor wafer surface cleaning mechanism, characterized in that: The invention comprises a cleaning machine body (1), a closed cover plate, a wafer introduction cleaning component and a gas cleaning mechanism. The top of the cleaning machine body (1) is provided with a mounting opening (2) and the top is movably connected to the closed cover plate via a hinge. The closed cover plate comprises a plate body (3) and a closed disk (4) built into the inner side of the plate body (3). The closed disk (4) is used in conjunction with the mounting opening (2). The wafer introduction cleaning mechanism is installed in the mounting opening (2) and comprises a top plate (5), a cleaning box (6), a rotating drive (7), an elastic component (8), a first container (9) and a second container (10). The top plate (5) is installed at the bottom of the mounting opening (2) and has a plurality of groups of wafer introduction openings (11) uniformly opened on its surface. The cleaning box (6) is installed on the top plate ( 5), the rotary drive (7) is installed at the bottom of the cleaning box (6), the elastic component (8) is installed at one side of the cleaning box (6), the container one (9) and the container two (10) are symmetrically installed on the left and right sides of the cleaning body (1), the top of the container one (9) and the container two (10) are both installed with a pump body (12), the pump body (12) is connected to the cleaning box (6) through a pipeline, the gas cleaning mechanism comprises an air storage box (13), an air pump (14), an air guide pipe (15), a hydraulic cylinder (16), a push plate (17) and a guide cleaning plate (18), the air storage box (13) is installed on the outside of the cleaning body (1) and the upper end is connected to the air pump (14), the air outlet of the air pump (14) The end of the cleaning box (6) is connected to the push plate (17) through an air guide pipe (15), the hydraulic cylinder (16) is installed on the cleaning body (1) and the power output end is connected to the push plate (17), the guide cleaning plates (18) are divided into a plurality of groups and are evenly installed on the push plate (17), the outer side of the cleaning box (6) is evenly provided with a plurality of groups of sockets (19), and the plurality of groups of guide cleaning plates (18) are respectively inserted into the plurality of groups of sockets (19), the bottom of the cleaning box (6) is an arc-shaped structure and is filled with a chemical cleaning liquid (20), the depth of the chemical cleaning liquid (20) is equal to the radius of the semiconductor wafer, and the rotary drive (7) includes a side plate (21) and a motor (22) installed on the side plate (21), and the motor (22) ) is provided with a rotating wheel (23) at the power output end thereof, the rotating wheel (23) being made of rubber material and having a plurality of groups of moving protrusions (24) formed on the edge thereof, the moving protrusions (24) being in contact with the bottom of the semiconductor wafer, the elastic component (8) comprising a bent plate (25) and an electric push rod (26) arranged at the outer end of the bent plate (25), the middle part of the bent plate (25) being rotatably connected to the side wall of the cleaning box (6), the lower end of the bent plate (25) being located at the bottom of the semiconductor wafer and the upper end being in contact with the power output end of the electric push rod (26), the bent plate (25) being in an S-shaped structure and the width of the lower end being smaller than the width of the upper end, the interior of the gas storage box (13) being filled with an inert gas (27), the inert gas (27) being nitrogen,Two adjacent groups of the guide cleaning plates (18) are respectively located on both sides of the semiconductor wafer, the length of the guide cleaning plates (18) is greater than the radius of the semiconductor wafer and is located above the chemical cleaning liquid (20), the outer end of the guide cleaning plates (18) is connected to the air guide pipe (15), the guide cleaning plates (18) are formed with an air guide cavity (28) inside and a strip exhaust port (29) is opened on the outside, and the strip exhaust port (29) faces the surface of the semiconductor wafer.

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