A die bonder

Abstract

The present invention provides a die bonder, which includes a frame. A gantry driving device is arranged on the frame. Within the moving range of the gantry driving device, a material receiving and feeding mechanism, a solder paste cutting device, a die bonding table and a wafer mounting mechanism are further arranged on the frame. A switchable blue film ejector pin mechanism is arranged at the bottom of the wafer mounting mechanism. By setting the gantry driving device, the actuator has higher motion stability, improves the operation load capacity and enhances the operation precision. At the same time, the arranged material receiving and feeding mechanism, solder paste cutting device and switchable blue film ejector pin mechanism can realize full-automatic assembly and improve the packaging efficiency.

Description

[0001] This application is a divisional application of the application with the application number 2023118692345, the application date of December 29, 2023, and the invention name of "A Gantry Die Bonder". Technical Field

[0002] The present invention relates to the field of discrete device packaging, and particularly to a die bonder. Background Art

[0003] In the assembly operation of the discrete device group soldering link, usually, the execution components of the packaging operation are set according to different process contents, that is, crystal picking, die bonding, dispensing, assembling solder pads, etc. are all completed through the components corresponding to each process, such as manipulators, dispensing heads, vacuum suction nozzles, etc. However, in some discrete device packages, typically in IGBTs, usually one execution component is used to complete the full assembly process from front to back. This requires the execution component to have sufficient strength and stiffness to withstand the operation load in the full assembly process, and the action speed of the single execution component operation should be higher than that of the traditional multi-execution component form. Therefore, stronger stability is required to ensure the operation accuracy. Summary of the Invention

[0004] The technical problem to be solved by the present invention is that the conventional structure of the existing multi-execution components has problems such as low driving speed, low operation load, and low operation accuracy of the execution components. The present invention provides a die bonder to solve the above problems.

[0005] The technical solution adopted by the present invention to solve its technical problems is: a die bonder, including a machine frame, a gantry driving device is arranged on the machine frame, within the moving range of the gantry driving device, a material receiving and feeding mechanism, a solder pad cutting device, a die bonding table, and a wafer mounting mechanism are further arranged on the machine frame, and a switchable blue film thimble mechanism is arranged at the bottom of the wafer mounting mechanism;

[0006] The gantry driving device includes two longitudinally parallel and separately arranged longitudinal guide rails, a longitudinal linear motor parallel to the longitudinal guide rails, a longitudinal slider slidably mounted on the longitudinal guide rails, and a cross beam fixedly arranged on the longitudinal slider. The mover of the longitudinal linear motor is fixedly connected to the cross beam. A transverse guide rail is horizontally arranged on the cross beam, a transverse linear motor parallel to the transverse guide rail, and a transverse slider slidably mounted on the transverse guide rail and fixedly connected to the mover of the transverse linear motor. An execution mechanism is mounted on the transverse slider.

[0007] Further: The switchable blue film ejector pin mechanism includes a third mechanism body, a fixed seat fixedly arranged on the third mechanism body, and a switching housing movably installed on the fixed seat. A thimble cap is arranged at the top of the switching housing, and a suction port is arranged on the top end face of the thimble cap. It is characterized in that: a vacuum chamber and a vacuum pumping port communicating with the vacuum chamber are arranged in the fixed seat; at the top of the fixed seat, a positioning groove is arranged at the orifice of the vacuum chamber; the bottom of the switching housing is inserted into the positioning groove; a magnetic static ring is arranged at the bottom of the positioning groove; at the bottom of the positioning groove, a first sealing groove is arranged outside the magnetic static ring; the bottom of the switching housing is provided with a positioning step matching with the positioning groove, and a magnetic switching ring corresponding to the position of the magnetic static ring is arranged at the bottom of the positioning step. The magnetic static ring and the magnetic switching ring are attracted to each other, and a first sealing ring in sealing contact with the bottom of the positioning step is arranged in the first sealing groove.

[0008] Further: A thimble mechanism is arranged in the switching housing. The thimble mechanism successively includes a thimble, a thimble clamping part and a thimble rod from top to bottom. A thimble rod guide sleeve is fixedly arranged in the switching housing. The thimble rod passes through the thimble rod guide sleeve and slides axially along the thimble rod guide sleeve. A waist-shaped hole is arranged axially on the thimble rod, and a limit pin is arranged in the thimble rod guide sleeve. The limit pin extends into the waist-shaped hole.

[0009] A push rod is vertically arranged in the fixed seat. The push rod passes through the vacuum chamber and abuts against the bottom of the thimble rod. A thimble driving mechanism for pushing the push rod to move upward is arranged on the third mechanism body.

[0010] Further: The thimble driving mechanism includes a voice coil motor vertically installed, a driving seat fixedly arranged on the mover of the voice coil motor, and a thimble action block arranged above the driving seat. The thimble action block is fixedly arranged at the bottom of the push rod; a magnetic thimble fixing ring is arranged on the driving seat; on the thimble action block, a magnetic thimble action ring corresponding to the position of the magnetic thimble fixing ring is arranged; the magnetic thimble fixing ring and the magnetic thimble action ring repel each other; a universal ball capable of contacting the bottom end face of the thimble action block is arranged on the top end face of the driving seat.

[0011] Further: The solder tab cutting device is used to cut a roll of solder tape into solder tabs, and includes a second mechanism body. It is characterized in that: a tape releasing mechanism and a conveying rail are arranged on the second mechanism body. A tape roll is installed on the tape releasing mechanism, and the solder tape is led out from the tape roll and introduced into the conveying rail; on the second mechanism body,

[0012] a clamping mechanism for clamping the solder tape on the conveying rail is successively installed along the conveying rail.

[0013] A distance - setting mechanism for clamping the welding tape and making a lateral movement;

[0014] A cutting mechanism for cutting the welding tape fed by the clamping mechanism or the distance - setting mechanism.

[0015] Further: The conveying rail includes a flat rail and a side rail horizontally installed on the upper end surface of the flat rail; The clamping mechanism includes a clamping cylinder installed below the flat rail, a first clamping plate and a clamping guiding part arranged above the flat rail. The clamping guiding part includes a clamping guide rail vertically and fixedly arranged on the second mechanism body. A clamping slider is arranged on the clamping guide rail, and a clamping bracket is installed on the clamping slider. The clamping bracket is fixedly connected to the first clamping plate; The piston rod of the clamping cylinder is fixedly connected to the clamping bracket, and the welding tape is threaded between the first clamping plate and the flat rail.

[0016] Further: The distance - setting mechanism is installed in the flat rail. The distance - setting mechanism includes a distance - setting driving part, a distance - setting cylinder installed on the distance - setting driving part, a second clamping plate and a distance - setting movable frame arranged on the piston rod of the distance - setting cylinder; The distance - setting driving part includes a horizontally arranged distance - setting driving lead screw, a distance - setting driving block installed on the distance - setting driving lead screw and a distance - setting driving motor. The distance - setting driving motor rotates to drive the distance - setting driving block to move along the distance - setting driving lead screw. A distance - setting fixed frame is arranged on the distance - setting driving block. The distance - setting cylinder is fixedly installed on the distance - setting fixed frame. A distance - setting vertical guide rail is vertically installed on the distance - setting fixed frame. A distance - setting vertical slider is installed on the distance - setting vertical guide rail. The distance - setting vertical slider is fixedly connected to the distance - setting movable frame. The second clamping plate is arranged above the distance - setting movable frame and fixedly connected to the distance - setting fixed frame; The welding tape is threaded between the second clamping plate and the distance - setting movable frame.

[0017] Further: The cutting mechanism includes a cutting seat, a tool holder, a cutting tool and a cutting driving mechanism. The cutting seat has a vertical cutting surface. A linear material opening is horizontally opened on the cutting surface. The welding tape passes through from the material opening. The tool holder is arranged in contact with the cutting surface. A chute is vertically opened on the tool holder. The cutting tool is slidably installed in the chute and arranged in contact with the cutting surface. A spring piece for pushing the cutting tool towards the cutting surface is also arranged on the tool holder; The cutting driving mechanism drives the cutting tool to move up and down along the chute.

[0018] Further: The material receiving and feeding mechanism includes a linear first mechanism body. A material receiving position and a material feeding position are horizontally arranged at the left end of the first mechanism body. A transfer window is arranged at the right end of the first mechanism body. A carrier mechanism is arranged below the material receiving position and the material feeding position. The carrier mechanism loads the material pieces and transfers them between the material receiving position, the material feeding position and the transfer window.

[0019] Further: The vehicle mechanism includes a stage, a pulley, a stage guide rail, and a stage slider slidably mounted on the stage guide rail. The stage guide rail is horizontally and fixedly arranged on the first mechanism body, and the stage is fixedly connected to the stage slider; The number of pulleys is two, and the two pulleys are horizontally separated and rotatably mounted on the first mechanism body. A synchronous belt is wound around the outer periphery of the pulley, and the synchronous belt is fixedly connected to the stage; An activity plate is arranged above the stage. A guide sleeve is vertically arranged on the stage, and a guide post is vertically and fixedly arranged on the activity plate. The guide post is inserted and installed in the guide sleeve. A lifting drive device is installed on the stage, and the lifting drive device drives the activity plate to move up and down in the vertical direction; A suction cup is installed on the activity plate.

[0020] The beneficial effect of the present invention is that a die bonder of the present invention has higher motion stability of the execution mechanism by setting a gantry drive device, improves the operation load capacity, and improves the operation accuracy. At the same time, the set feeding and discharging mechanism, solder slice cutting device, and switchable blue film ejector pin mechanism can realize full-automatic assembly and improve the packaging efficiency. Brief Description of the Drawings

[0021] The present invention will be further described below in conjunction with the drawings and embodiments.

[0022] Figure 1 is a schematic structural diagram of a die bonder of the present invention;

[0023] Figure 2 is a schematic cross-sectional view of the structure of the switchable blue film ejector pin mechanism;

[0024] Figure 3 is an exploded schematic diagram of the switchable blue film ejector pin mechanism with the switching housing part disassembled;

[0025] Figure 4 is a schematic structural diagram of the ejector pin clamping part;

[0026] Figure 5 and Figure 6 are schematic structural diagrams of the switchable blue film ejector pin mechanism from different perspectives with the switching housing omitted;

[0027] Figure 7 and Figure 8 are schematic structural diagrams of the switchable blue film ejector pin mechanism from different perspectives with the switching housing and some shielding plates of the mechanism body omitted;

[0028] Figure 9 is a front view of the schematic structure of the solder slice cutting device;

[0029] Figure 10 is a perspective view of the schematic structure of the solder slice cutting device;

[0030] Figure 11 is Figure 10 A schematic perspective view of the structure after omitting the conveying rail;

[0031] Figure 12 A schematic structural view of the cutting mechanism;

[0032] Figure 13 A schematic structural view of the material receiving and feeding mechanism;

[0033] Figure 14 is Figure 13 A schematic view of the internal structure;

[0034] Figure 15 A schematic view of a partial installation structure of the carrier table and the movable plate;

[0035] Figure 16 and Figure 17 Schematic views of different perspectives of the structure of the material sheet mounted on the supporting block;

[0036] Figure 18 A schematic view of the structure of the supporting block.

[0037] In the figure, 1. Material receiving and feeding mechanism, 2. Solder sheet cutting device, 3. Switchable blue film ejector pin mechanism, 4. Wafer mounting mechanism, 5. Die bonding table, 6. Longitudinal guide rail, 7. Longitudinal slider, 8. Longitudinal linear motor, 9. Cross beam, 10. Transverse guide rail, 11. Transverse linear motor, 12. Transverse slider, 13. Actuator, 14. Frame.

[0038] Regarding the serial numbers of the relevant components of the material receiving and feeding mechanism as 101. First mechanism body, 102. Feeding position, 103. Material receiving position, 104. Transfer window, 105. Material sheet, 106. Carrier table, 107. Belt pulley, 108. Carrier table guide rail, 109. Carrier table slider, 110. Synchronous belt, 111. Movable plate, 112. Guide sleeve, 113. Guide post, 114. Lifting drive device, 115. Suction cup, 116. Feeding baffle, 117. Material clamping cylinder, 118. Material receiving baffle, 119. Supporting block, 120. Return spring, 121. Hinge shaft, 122. Supporting groove.

[0039] Regarding the relevant components of the solder tab cutting device, the serial numbers are shown in the figure: 201, solder strip; 202, second mechanism body; 203, coil; 204, conveying rail; 205, clamping mechanism; 206, distance - setting mechanism; 207, cutting mechanism; 208, flat rail; 209, side rail; 210, clamping cylinder; 211, first clamping plate; 212, clamping guide rail; 213, clamping slider; 214, clamping bracket; 215, distance - setting cylinder; 216, second clamping plate; 217, distance - setting driving lead screw; 218, distance - setting driving block; 219, distance - setting driving motor; 220, distance - setting fixed frame; 221, distance - setting vertical guide rail; 222, distance - setting vertical slider; 223, distance - setting movable frame; 224, distance - setting horizontal guide rail; 225, distance - setting horizontal slider; 226, cutting base; 227, tool holder; 228, cutting tool; 229, material inlet; 230, chute; 231, elastic piece.

[0040] Regarding the relevant components of the switchable blue film ejector pin mechanism, the serial numbers are shown in the figure: 301, third mechanism body; 302, fixed seat; 303, switching housing; 304, ejector pin cap; 305, suction port; 306, vacuum chamber; 307, vacuum pumping port; 308, positioning groove; 309, magnetic static ring; 310, first sealing groove; 311, positioning step; 312, magnetic switching ring; 313, ejector pin; 314, ejector pin clamping part; 315, ejector rod; 316, ejector rod guide sleeve; 317, waist - shaped hole; 318, limit pin; 319, push rod; 320, ejector pin driving mechanism; 321, voice coil motor; 322, driving seat; 323, ejector pin action block; 324, magnetic ejector pin fixing ring; 325, magnetic ejector pin action ring; 326, universal ball; 327, ejector pin guide rod; 328, ejector pin guide sleeve; 329, guide rail; 330, slider; 331, ejector pin chuck; 332, locking sleeve; 333, cutting groove; 334, clamping flap; 335, clamping hole; 336, second sealing groove; 337, process hole; 338, plug. Detailed implementation manners

[0041] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation of the present invention. On the contrary, the embodiments of the present invention include all changes, modifications, and equivalents that fall within the spirit and scope of the appended claims.

[0042] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present invention.

[0043] In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "connected" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, in the description of the present invention, unless otherwise stated, the meaning of "a plurality" is two or more.

[0044] Any process or method description shown in the flowchart or described in other ways herein can be understood as representing a module, segment, or part of code including one or more executable instructions for implementing a specific logical function or process. The scope of the preferred embodiments of the present invention includes additional implementations, where the functions may be executed in a manner that is not shown or discussed in the order, including in a substantially simultaneous manner according to the functions involved or in the reverse order, which should be understood by those skilled in the art to which the embodiments of the present invention belong.

[0045] As Figure 1As shown in the figure, the present invention provides a die bonder, which includes a frame 14. A gantry driving device is provided on the frame 14. Within the moving range of the gantry driving device, a material receiving and feeding mechanism 1, a solder tape cutting device 2, a die bonding stage 5, and a wafer mounting mechanism 4 are further provided on the frame 14. A switchable blue film ejector pin mechanism 3 is provided at the bottom of the wafer mounting mechanism 4. The gantry driving device includes two longitudinally parallel and separately arranged longitudinal guide rails 6, a longitudinal linear motor 8 parallel to the longitudinal guide rails 6, a longitudinal slider 7 slidably mounted on the longitudinal guide rails 6, and a cross beam 9 fixedly provided on the longitudinal slider 7. The mover of the longitudinal linear motor 8 is fixedly connected to the cross beam 9. A transverse guide rail 10 is horizontally provided on the cross beam 9, a transverse linear motor 11 parallel to the transverse guide rail 10, and a transverse slider 12 slidably mounted on the transverse guide rail 10 and fixedly connected to the mover of the transverse linear motor 11. An actuator 13 is mounted on the transverse slider 12.

[0046] The actuator 13 obtains a wafer or a substrate in the material receiving and feeding mechanism 1, and places the obtained wafer or substrate on the die bonding stage 5. The solder tape cutting device 2 cuts the solder tape into solder pieces of a specified length, and places the cut solder pieces on the wafer or substrate on the die bonding stage 5. At the same time, a wafer blue film is installed in the wafer mounting mechanism 4, and the switchable blue film ejector pin mechanism 3 ejects the chip at a specified position. The actuator 13 places the chip on the wafer blue film on the solder piece on the wafer or substrate. Thus, the die bonding operation can be completed.

[0047] Both ends of the cross beam 9 of the gantry driving device are supported by the longitudinal guide rails 6. Therefore, the support is sufficient, the high-speed movement is stable and reliable, the structural strength and stiffness are relatively high, and it is not easy to shake during the rapid movement of the actuator 13, etc. The operation accuracy is high, which is suitable for the high-precision operation of the actuator 13.

[0048] Regarding the switchable blue film ejector pin mechanism 3, see Figures 2 to 8 :

[0049] It includes a third mechanism body 301, a fixed seat 302 fixedly arranged on the third mechanism body 301, and a switching housing 303 movably installed on the fixed seat 302. A thimble cap 304 is arranged at the top of the switching housing 303, and a suction port 305 is arranged on the top end face of the thimble cap 304. A vacuum chamber 306 and a vacuum pumping port 307 communicating with the vacuum chamber 306 are arranged in the fixed seat 302; at the top of the fixed seat 302, a positioning groove 308 is arranged at the orifice of the vacuum chamber 306; the bottom of the switching housing 303 is inserted into the positioning groove 308; a magnetic static ring 309 is arranged at the bottom of the positioning groove 308; at the bottom of the positioning groove 308, a first sealing groove 310 is arranged outside the magnetic static ring 309; the bottom of the switching housing 303 is provided with a positioning step 311 matching the positioning groove 308, and a magnetic switching ring 312 corresponding to the position of the magnetic static ring 309 is arranged at the bottom of the positioning step 311. The magnetic static ring 309 and the magnetic switching ring 312 are attracted to each other, and a first sealing ring in sealing contact with the bottom of the positioning step 311 is arranged in the first sealing groove 310.

[0050] The blue film thimble 313 device of the present application is mainly used in the blue film crystal picking process link of discrete device packaging. In this process, the blue film covered with chips is first installed in the die bonder for blue film die bonding operation, and then through the thimble mechanism, the chips processed at the corresponding positions are jacked up from bottom to top under the blue film and the blue film at the specified position is adsorbed. Then, the die picking mechanism sucks and transfers the chips at the specified positions on the surface of the blue film. Since the thimble mechanism adsorbs the blue film below the chips in advance, the chips can be separated from the blue film below when transferring the chips, and thus the entire crystal picking process is completed.

[0051] Since the chip specifications, shapes, sizes, etc. on the surfaces of blue films with different specifications, models, and types are all different, different chips require different thimble mechanisms to be adapted to complete the thimble 313 operation. Therefore, when the blue film wafer is changed in the packaging equipment, the thimble mechanism also needs to be correspondingly changed to adapt to the new blue film wafer.

[0052] What is disclosed in the present application is exactly the technical solution that can quickly switch the thimble mechanism under this operation requirement. The fixed seat 302 is a component arranged below the blue film. The vacuum pumping port 307 provided on the fixed seat 302 is connected to an external vacuum pump. The switching housing 303 is a movable component that can be quickly replaced according to different blue film types. The thimble cap 304 and the suction port 305 on the switching housing 303 are adapted to different types of blue films.

[0053] When the switching housing 303 is installed on the fixed base 302, the switching housing 303 is inserted into the positioning groove 308, that is, the positioning step 311 is embedded in the positioning groove 308, completing the positioning of the installation position of the switching housing 303. The magnetic switching ring 312 below the switching housing 303 and the magnetic static ring 309 on the fixed base 302 are attracted to each other, so that the fixed connection between the switching housing 303 and the fixed base 302 can be completed. Since the switching housing 303 is not subject to other external forces except the axial direction, the switching housing 303 can ensure the stability of the connection with the fixed base 302 under the action of gravity and magnetic force. At the same time, the positioning step 311 is pressed on the first sealing ring, so that the sealing contact between the switching housing 303 and the fixed base 302 can be completed.

[0054] The inside of the switching housing 303 and the vacuum chamber 306 form a sealed space. When the external vacuum pump works, a negative pressure state is formed inside the switching housing 303, and the suction port 305 on the thimble cap 304 can complete the adsorption of the blue film.

[0055] When it is necessary to replace different thimble mechanisms, only need to vertically pull out the switching housing 303 upward. Since the magnetic static ring 309 and the magnetic switching ring 312 are only magnetically connected and there is no rigid connection relationship, the positioning step 311 can be pulled out into the positioning groove 308. In this way, the whole switching housing 303 is separated from the fixed base 302. According to the method described above, the new adapted switching housing 303 can be reinstalled into the fixed base 302 to complete the replacement operation of the thimble mechanism.

[0056] A thimble mechanism is arranged inside the switching housing 303. The thimble mechanism sequentially includes a thimble 313, a thimble clamping part 314 and a thimble rod 315 from top to bottom. A thimble rod guide sleeve 316 is fixedly arranged inside the switching housing 303. The thimble rod 315 passes through the thimble rod guide sleeve 316 and axially slides along the thimble rod guide sleeve 316. A waist-shaped hole 317 is axially arranged on the thimble rod 315. A limit pin 318 is arranged in the thimble rod guide sleeve 316, and the limit pin 318 extends into the waist-shaped hole 317.

[0057] A push rod 319 is vertically arranged in the fixed base 302. The push rod 319 passes through the vacuum chamber 306 and abuts against the bottom of the thimble rod 315. A thimble driving mechanism 320 for pushing the push rod 319 to move upward is arranged on the third mechanism body 301.

[0058] During the actual process of taking the blue film crystal, since the film body is closely attached to the plane of the chip wafer without any air bubbles or gaps between them, when the chip is adsorbed and detached from the film body, there is a large bonding force between the film body and the chip surface, making it difficult to separate the two. Even, the film body may be torn and damaged, affecting the abnormal phenomenon of taking crystals from other wafers. In view of the above problems, the thimble mechanism provided in the switching housing 303 of the present application is mainly used to break the vacuum state between the film body and the chip surface, reduce the bonding force between the film body and the chip, and facilitate the separation operation of the chip and the film body.

[0059] Specifically, at the crystal-taking position, the thimble driving mechanism 320 drives the push rod 319 to push the thimble 315 upward. The thimble 315 moves upward, thereby driving the thimble 313 to move upward until it extends out of the switching housing 303. The thimble 313 pierces the blue film body at the position where the crystal is to be taken. In this way, the vacuum between the film body and the chip surface is broken. With the adsorption effect of the suction port 305 of the thimble cap 304, the chip and the film body can be easily separated from each other, avoiding tearing and damage.

[0060] The thimble mechanism is arranged in the switching housing 303, and the thimble mechanism is movably connected to the push rod 319, that is, the connection between the thimble 315 and the push rod 319 is movable. The thimble mechanism is installed in the switching housing 303 and can be disengaged and switched from the fixed seat 302 together with the switching housing 303. The push rod 319 pushes the thimble 315 from bottom to top. When the switching housing 303 is pulled out upward, the push rod 319 naturally separates from the thimble 315. When the switching housing 303 is installed on the fixed seat 302, the thimble 315 is naturally placed on the push rod 319 so that the push rod 319 can push it upward.

[0061] When the switching housing 303 is disengaged from the fixed seat 302, that is, when the thimble 315 moves out of the push rod 319, the thimble mechanism slides downward under the action of gravity. The limit pin 318 is inserted into the waist-shaped hole 317, which can effectively limit the sliding distance of the thimble mechanism in the switching housing 303, that is, the thimble mechanism can only slide up and down within the length range of the waist-shaped hole 317. This can prevent the thimble mechanism from slipping out of the switching housing 303 and improve the reliability of the switching operation of the switching housing 303.

[0062] The thimble driving mechanism 320 includes a vertically installed voice coil motor 321, a driving seat 322 fixedly arranged on the mover of the voice coil motor 321, and a thimble action block 323 arranged above the driving seat 322. The thimble action block 323 is fixedly arranged at the bottom of the push rod 319. A magnetic thimble fixing ring 324 is arranged on the driving seat 322. On the thimble action block 323, a magnetic thimble action ring 325 is arranged at a position corresponding to the magnetic thimble fixing ring 324. The magnetic thimble fixing ring 324 and the magnetic thimble action ring 325 repel each other. The top end surface of the driving seat 322 is provided with a universal ball 326 that can contact the bottom end surface of the thimble action block 323.

[0063] The blue film body is attached to the chip surface. The thimble mechanism pierces the blue film body under the drive of the thimble driving mechanism 320, facilitating the separation of the film body from the chip. During this process, the thimble 313 completes the action of piercing the film body under the drive of the thimble driving mechanism 320. Since the film thickness of the film body is relatively thin and the film body material is a high-molecular soft material, it is necessary to precisely control the driving force on the thimble 313 during the piercing process to prevent the thimble 313 from scratching the fragile chip surface after piercing the film body.

[0064] However, the thimble 313 necessarily contacts the chip surface when piercing the blue film. Therefore, how to control the driving force of the thimble 313 is the key problem to be solved in the prior art. In this application, the thimble driving mechanism 320 adopts a non-direct contact driving form, which avoids the phenomenon that in a hard connection, after the thimble 313 pierces, the driving mechanism continues to move towards the chip and applies an excessive point contact force to the chip surface, ultimately resulting in the chip surface being easily scratched.

[0065] Specifically, the thimble action block 323 and the driving seat 322 are two separated components. The thimble action block 323 is arranged at the bottom of the push rod 319. The magnetic thimble action ring 325 arranged on the thimble action block 323 and the magnetic thimble fixing ring 324 arranged on the driving seat 322 repel each other, that is, the magnetic thimble fixing ring 324 pushes the magnetic thimble action ring 325 upward. The driving seat 322 is installed on the mover of the voice coil motor 321. Therefore, the mover of the voice coil motor 321 can drive the driving seat 322 to move up and down. Due to the existence of the interaction force between the driving seat 322 and the thimble action block 323, when the driving seat 322 moves up and down, the thimble action block 323 also moves up and down accordingly.

[0066] When the ejector pin 313 is not working, the drive seat 322 is in the lower position, and the ejector pin 313 is hidden in the ejector pin cap 304; when the ejector pin 313 is to pierce the film body upward, the mover of the voice coil motor 321 drives the drive seat 322 to move upward. Under the action of the magnetic ejector pin fixing ring 324 pushing the magnetic ejector pin action ring 325 upward, the ejector pin action block 323 also moves upward, and there is a gap between the drive seat 322 and the ejector pin action block 323 during the movement process, that is, they are all non-direct contact and non-rigid connection. Such a driving process continues until the ejector pin 313 pierces the film body and the head of the ejector pin 313 touches the surface of the chip. The ejector pin action block 323 is continuously pushed upward by non-direct contact magnetic force. During the process of the ejector pin 313 piercing the film body until it touches the surface of the chip, the ejector pin action block 323 drives the ejector pin 313 to move upward. And when the ejector pin action block 323 encounters abnormal resistance, due to the non-contact pushing method, the ejector pin action block 323 has sufficient buffer space and will not hard push the ejector pin action block 323. The direct contact driving method of the mover of the voice coil motor 321 driving the drive seat 322 will not directly act on the ejector pin action block 323, which plays the role of softening and buffering the driving force of the ejector pin 313 and avoids the hidden danger of scratching the surface of the chip in the direct driving mode.

[0067] The universal balls 326 on the surface of the drive seat 322 play a role in assisting in supporting the ejector pin action block 323. During normal operation, the universal balls 326 do not contact the ejector pin action block 323. When the resistance of the film body is extremely large or the ejector pin mechanism slides and jams, under the continuous upward pushing action of the mover of the voice coil motor 321, the universal balls 326 contact the surface of the ejector pin action block 323, providing temporary contact for the ejector pin action block 323. After the ejector pin 313 breaks through the position with abnormal resistance, the universal balls 326 and the ejector pin action block 323 return to the separated state and then rely on magnetic repulsion for non-contact pushing. Of course, when the ejector pin 313 breaks through the film body and touches the surface of the chip, the device can monitor that the work of the ejector pin 313 is completed, and will not let the universal balls 326 contact the ejector pin action block 323 to avoid applying abnormal force to the ejector pin 313 and scratching the surface of the chip.

[0068] The ejector pin guide rod 327 is vertically arranged on the ejector pin action block 323, the ejector pin guide sleeve 328 is vertically arranged on the fixed seat 302, and the ejector pin guide rod 327 is inserted into the ejector pin guide sleeve 328; the guide rail 329 is vertically arranged on the third mechanism body 301, the slider 330 is slidably installed on the guide rail 329, and the slider 330 is fixedly connected to the drive seat 322.

[0069] The cooperation between the thimble guide sleeve 328 and the thimble guide rod 327 can be correctly guided during the up-and-down sliding of the thimble action block 323, restricting the up-and-down sliding of the thimble action block 323 in the vertical direction. The cooperation between the guide rail 329 and the slider 330 also restricts the straight up-and-down movement of the driving seat 322 in the vertical direction. This guiding method and the cooperation mode of the guide rail 329 and the slider 330 are to ensure the movement of the corresponding components in the vertical direction, increase the stability of the moving components, and improve the reliability of the entire device.

[0070] The thimble clamping part 314 includes a thimble chuck 331 and a locking sleeve 332. The shape of the thimble chuck 331 is externally conical. The thimble chuck 331 has intersecting slotted grooves 333. The slotted grooves 333 divide the thimble chuck 331 to form a number of clamping petals 334. A clamping hole 335 is formed by the combination of the several clamping petals 334. The thimble 313 is inserted into the clamping hole 335. The inner hole of the locking sleeve 332 is internally conical. The locking sleeve 332 is installed on the thimble chuck 331, and the inner conical hole of the locking sleeve 332 cooperates with the outer cone of the thimble chuck 331.

[0071] In the normal installation state, the thimble 313 is installed in the clamping hole 335, and the locking sleeve 332 is screwed onto the thimble chuck 331. As the locking sleeve 332 is tightened, due to the conical surface cooperation between the locking sleeve 332 and the thimble chuck 331, the clamping petals 334 of the thimble chuck 331 will be pressed, and the clamping petals 334 will be pressed against each other. In this way, the diameter of the clamping hole 335 will become smaller, which can play a role in fixing the thimble 313 in the clamping hole 335. When the thimble 313 needs to be replaced and the thimble 313 is pulled out from the thimble chuck 331, only the locking sleeve 332 on the thimble chuck 331 needs to be loosened. The locking sleeve 332 no longer exerts a pressing force on the clamping petals 334, the clamping petals 334 recover from deformation, and the diameter of the clamping hole 335 becomes larger, so that the thimble 313 can be easily pulled out.

[0072] A second sealing groove 336 is provided on the outer wall of the thimble cap 304, and a second sealing ring that is in sealing contact with the inner hole wall of the switching housing 303 is arranged in the second sealing groove 336. Through the second sealing ring, the sealing effect between the thimble cap 304 and the switching housing 303 can be ensured, and the reliability of the internal sealing of the switching housing 303 can be improved.

[0073] An air guide groove extending axially is provided on the outer wall of the ejector guide sleeve 316 and the outer wall of the ejector 315. Since the ejector guide sleeve 316 divides the interior of the switching housing 303 into upper and lower regions, and the lower region is directly connected to the vacuum chamber 306, in order to ensure the negative pressure effect in the upper region during vacuum pumping, the air guide groove can optimize the internal air flow efficiency, improve the negative pressure state in the upper region inside the switching housing 303 during vacuum pumping, and enhance the adsorption effect of the suction port 305 on the thimble cap 304 on the film body.

[0074] A limiting installation hole is provided in the ejector guide sleeve 316 along the radial direction; on the switching housing 303, a process hole 337 is provided corresponding to the limiting installation hole, and a plug 338 is installed in the process hole 337. During installation, the process hole 337 can be aligned with the limiting installation hole first, the limiting pin 318 is inserted into the limiting installation hole through the process hole 337 from the outside, and then the plug 338 is used to block the process hole 337, and the installation of the limiting pin 318 can be completed. This installation method can simplify the installation of the limiting pin 318 inside the switching housing 303 and has good assembly processability.

[0075] Regarding the solder tab cutting device 2, see Figures 9 to 12 :

[0076] It is used to cut a roll of solder tape 201 into solder tabs, including a second mechanism body 202, a tape releasing mechanism and a conveying rail 204 are provided on the second mechanism body 202, a tape roll 203 is installed on the tape releasing mechanism, and the solder tape 201 is led out from the tape roll 203 and introduced into the conveying rail 204; on the second mechanism body 202, a clamping mechanism 205 is successively installed along the conveying rail 204 for clamping the solder tape 201 on the conveying rail 204; a fixed-distance mechanism 206 for clamping the solder tape 201 and making a lateral movement; a cutting mechanism 207 for cutting the solder tape 201 fed by the clamping mechanism 205 or the fixed-distance mechanism 206.

[0077] The solder tape 201 cutting device designed in this patent can cut a roll of solder tape 201 into solder tabs with a specified length, and the length of the solder tabs can be adjusted to any length as needed. When solder tabs with different widths are required, only the solder tape 201 needs to be replaced with the corresponding size specification and then re-cut.

[0078] The specific operation method is as follows. During the preparation work, a roll of solder tape 201 is installed on the tape releasing mechanism. The tape releasing mechanism is a conventional structure commonly used in conventional coil processing, mainly composed of a guide wheel, a buffer wheel, etc. After the solder tape 201 is released from the tape roll 203, it is introduced into the conveying rail 204 in a flattened state. After the clamping mechanism 205 and the fixed-distance mechanism 206 operate successively to feed the solder tape 201 to a certain length, the cutting mechanism 207 performs a cutting operation.

[0079] When the clamping mechanism 205 and the cutting mechanism 207 are working, they operate in a mode where one clamps while the other releases. This stepping method feeds the welding tape 201 forward by a set length. The detailed operation process is as follows: When starting to cut, the clamping mechanism 205 is in a released state, the distance - setting mechanism 206 clamps the welding tape 201 and laterally moves it to the cutting mechanism 207. The cutting mechanism 207 operates to cut the welding tape 201, which serves as the starting end of the welding tape 201. Then, the clamping mechanism 205 clamps the welding tape 201, the distance - setting mechanism 206 releases the welding tape 201 and returns to its original position. After completion, the clamping mechanism 205 releases the welding tape 201 again, the distance - setting mechanism 206 clamps the welding tape 201 again and moves it forward by a specified distance, and then the cutting mechanism 207 cuts the welding tape 201. In this way, the welding tape 201 of the specified length is obtained, and this process repeats continuously.

[0080] The conveying rail 204 includes a flat rail 208 and a side rail 209 parallelly installed on the upper end surface of the flat rail 208; the clamping mechanism 205 includes a clamping cylinder 210 installed below the flat rail 208, a first clamping plate 211 arranged above the flat rail 208, and a clamping guiding part. The clamping guiding part includes a clamping guide rail 212 vertically and fixedly arranged on the second mechanism body 202. A clamping slider 213 is arranged on the clamping guide rail 212, a clamping bracket 214 is installed on the clamping slider 213, and the clamping bracket 214 is fixedly connected to the first clamping plate 211; the piston rod of the clamping cylinder 210 is fixedly connected to the clamping bracket 214, and the welding tape 201 is threaded between the first clamping plate 211 and the flat rail 208.

[0081] The welding tape 201 is mainly flattened and installed on the flat rail 208. The side gauges hold both sides of the welding tape 201, and the welding tape 201 is laid flat on the conveying rail 204 and fed forward. When the clamping cylinder 210 operates, it can drive the first clamping plate 211 to move up and down above the flat rail 208, thus enabling the clamping mechanism 205 to have the functions of clamping and releasing. When clamping is required, the piston rod of the clamping cylinder 210 retracts, and the first clamping plate 211 presses the welding tape 201 against the flat rail 208. When releasing is required, the piston rod of the clamping cylinder 210 extends, and the first clamping plate 211 releases the welding tape.

[0082] The clamping guide rail 212 and the clamping slider 213 mainly play a role in stabilizing the clamping bracket 214, ensuring that the clamping bracket 214 can move stably in the vertical direction under the drive of the clamping cylinder 210, and improving the stability and reliability of the operation of the clamping mechanism 205.

[0083] The distance - setting mechanism 206 is installed in the flat rail 208. The distance - setting mechanism 206 includes a distance - setting driving part, a distance - setting cylinder 215 installed on the distance - setting driving part, a second clamping plate 216, and a distance - setting movable frame 223 arranged on the piston rod of the distance - setting cylinder 215. The distance - setting driving part includes a horizontally arranged distance - setting driving lead screw 217, a distance - setting driving block 218 installed on the distance - setting driving lead screw 217, and a distance - setting driving motor 219. The distance - setting driving motor 219 rotates to drive the distance - setting driving block 218 to move along the distance - setting driving lead screw 217. A distance - setting fixed frame 220 is provided on the distance - setting driving block 218. The distance - setting cylinder 215 is fixedly installed on the distance - setting fixed frame 220. A distance - setting vertical guide rail 221 is vertically installed on the distance - setting fixed frame 220. A distance - setting vertical sliding block 222 is installed on the distance - setting vertical guide rail 221. The distance - setting vertical sliding block 222 is fixedly connected to the distance - setting movable frame 223. The second clamping plate 216 is arranged above the distance - setting movable frame 223 and is fixedly connected to the distance - setting fixed frame 220. The welding tape 201 is threaded between the second clamping plate 216 and the distance - setting movable frame 223.

[0084] The distance - setting driving part further includes a distance - setting transverse guide rail 224 horizontally installed on the second mechanism body 202. A distance - setting transverse sliding block 225 is slidably installed on the distance - setting transverse guide rail 224. The distance - setting transverse sliding block 225 is fixedly connected to the distance - setting fixed frame 220.

[0085] The working principle of the distance - setting mechanism 206 is different from that of the clamping mechanism 205. The distance - setting driving motor 219 rotates to drive the distance - setting driving block 218 to move. The distance - setting driving block 218 drives the entire distance - setting fixed frame 220 to move horizontally, thus having a distance - setting function. The piston rod of the distance - setting cylinder 215 on the distance - setting fixed frame 220 moves up and down to drive the distance - setting movable frame 223 to move up and down. The second clamping plate 216 is installed on the distance - setting fixed frame 220. In this way, the up - and - down movement of the distance - setting movable frame 223 and the second clamping plate 216 are combined to form an operation of clamping and releasing the welding tape 201 threaded therebetween. The combination of the distance - setting vertical guide rail 221 and the distance - setting vertical sliding block 222, as well as the distance - setting transverse guide rail 224 and the distance - setting transverse sliding block 225, are all for improving the reliability of the moving parts during horizontal and vertical movements, and improving the operation precision and stability of the device.

[0086] The cutting mechanism 207 includes a cutting base 226, a tool holder 227, a cutting tool 228 and a cutting drive mechanism. The cutting base 226 has a vertical cutting surface, on which a linear material opening 229 is horizontally formed. The solder tape 201 passes through the material opening 229. The tool holder 227 is arranged in contact with the cutting surface. A chute 230 is vertically formed on the tool holder 227. The cutting tool 228 is slidably installed in the chute 230 and is arranged in contact with the cutting surface. A spring piece 231 for pushing the cutting tool 228 towards the cutting surface is further arranged on the tool holder 227. The cutting drive mechanism drives the cutting tool 228 to move up and down along the chute 230.

[0087] The cutting tool 228 slides up and down in the chute 230 in contact with the cutting surface, and can easily cut the solder tape 201 at the material opening 229. This cutting method has a neat cut-off, and the solder tape 201 cut from the material opening 229 can accurately control the cutting operation accuracy. The cutting tool 228 is in a free state in the chute 230 and is pushed by the spring piece 231 to be in contact with the cutting surface. This method has self-compensation ability and can avoid the problem of reduced processing accuracy caused by the wear of the cutting edge of the cutting tool 228.

[0088] Regarding the material receiving and feeding mechanism 1, see Figures 13 to 18 :

[0089] It includes a linear first mechanism body 101. At the left end of the first mechanism body 101, a material receiving position 103 and a material feeding position 102 are arranged horizontally. A transfer window 104 is arranged at the right end of the first mechanism body 101. A carrier mechanism is arranged below the material receiving position 103 and the material feeding position 102. The carrier mechanism loads the material sheet 105 and transfers it between the material receiving position 103, the material feeding position 102 and the transfer window 104.

[0090] This linear material feeding mechanism can be arranged at the starting section of the production line. The linear arrangement is simple and occupies less space. The material receiving position 103 and the material feeding position 102 are arranged together, which is convenient for taking and placing the material sheet 105. The carrier mechanism is responsible for transporting the material sheet 105 at the material feeding position 102 to the transfer window 104, or transporting the recycled material sheet 105 retrieved from the transfer window 104 back to the material receiving position 103.

[0091] The vehicle mechanism includes a carrier table 106, a pulley 107, a carrier table guide rail 108, and a carrier table slider 109 slidably mounted on the carrier table guide rail 108. The carrier table guide rail 108 is horizontally and fixedly arranged on the first mechanism body 101, and the carrier table 106 is fixedly connected to the carrier table slider 109. There are two pulleys 107, which are horizontally separated and rotatably mounted on the first mechanism body 101. A synchronous belt 110 is wound around the outer circumference of the pulley 107, and the synchronous belt 110 is fixedly connected to the carrier table 106. An activity plate 111 is arranged above the carrier table 106. A guide sleeve 112 is vertically arranged on the carrier table 106, and a guide post 113 is vertically and fixedly arranged on the activity plate 111. The guide post 113 is inserted and installed in the guide sleeve 112. A lifting drive device 114 is installed on the carrier table 106, and the lifting drive device 114 drives the activity plate 111 to move up and down in the vertical direction. A suction cup 115 is installed on the activity plate 111.

[0092] The synchronous belt 110 is tensioned by the pulley 107 to be in a horizontal state. The rotation of the pulley 107 will drive the synchronous belt 110 to rotate. The carrier table 106 is fixed on the upper or lower side of the synchronous belt 110. As the synchronous belt 110 rotates, it will drive the carrier table 106 to slide in the direction of the carrier table guide rail 108 in the horizontal direction. In this way, the carrier table 106 moves horizontally at the material receiving position 103, the material sending position 102, and the transfer window 104. This driving method is simpler than the driving method of the lead screw module, and the transmission speed is increased, and the structure is simplified, reducing the occupied space.

[0093] The activity plate 111 is installed on the carrier table 106 and can move up and down in the vertical direction under the drive of the lifting drive device 114. There are many structures of the lifting drive device 114, such as electric push rods, lead screw nut pairs, etc., which can all achieve the above functions. Therefore, the specific structure type will not be described in detail. As long as it can have the function of extending and driving. The lifted activity plate drives the suction cup 115 installed on the activity plate 111 to move up and down. In this way, the suction cup 115 can pick up or send materials to the transfer window 104, or send the material sheet 105 to the material receiving position 103 or pick up the material sheet 105 from the material sending position 102.

[0094] A material sending baffle 116 and a material clamping cylinder 117 are arranged at the material sending position 102. Several layers of material sheets 105 to be distributed are stacked in the material sending baffle 116. The piston rod of the material clamping cylinder 117 extends to clamp the lowermost material sheet 105 in the material sending baffle 116.

[0095] During normal operation, the piston rod of the blank clamping cylinder 117 extends to clamp the lowermost blank 105 in the stack of blanks 105, so that the entire stack of blanks 105 can be lifted. When feeding is required, the suction cup 115 first moves under the drive of the movable plate 111 to the position below the feeding position 102. At the same time, the suction cup 115 lifts to reach the lowermost blank 105 of the stack of blanks 105 at the feeding position 102. Then, the piston rod of the blank clamping cylinder 117 retracts, and the lowermost blank will be supported by the suction cup 115. At the same time, after the suction cup 115 moves downward by a distance equal to the thickness of a blank 105, the piston rod of the blank clamping cylinder 117 extends again to clamp the second-lowermost blank 105. Finally, the suction cup 115 supporting the just-taken-out blank 105 descends again, and transfers it to the transfer window 104, thus completing the feeding operation.

[0096] A blank receiving baffle 118, a return spring 120 and a supporting block 119 are arranged at the receiving position 103. The number of the supporting blocks 119 is four, and they are respectively arranged around the receiving position 103. The recycled blanks 105 are supported on the supporting blocks 119. A right-angled supporting groove 122 is arranged on the supporting block 119, and a hinge shaft 121 is arranged below the supporting groove 122. On the supporting block 119, an arc-shaped transition is arranged between the supporting groove 122 and the hinge shaft 121. The supporting groove 122 supports the blank 105, and the return spring 120 is arranged on the back of the supporting groove 122 and pushes the supporting block 119.

[0097] During normal operation, the blanks 105 are placed on the four supporting blocks 119. The supporting grooves 122 on the supporting blocks 119 engage with the four sides of the blank 105. Although the supporting block 119 can rotate along the hinge shaft 121, due to the shape of the supporting groove 122 being right-angled and engaging with the four sides of the blank 105, and a return spring 120 is arranged on the back of the supporting groove 122 to push the supporting block 119 to rotate towards the opening direction of the supporting groove 122, the blank 105 can be reliably placed on the supporting groove 122.

[0098] When receiving materials is required, the suction cup 115 transports the blank 105 to the position below the receiving position 103 and lifts it from the bottom upwards. The blank 105 on the suction cup 115 pushes the lowermost blank 105 of the stack of blanks 105 upwards, and the edge of the blank 105 simultaneously pushes the transition of the supporting block 119. In this way, all the supporting blocks 119 will turn upwards until the blank 105 reaches above the supporting blocks 119 from below. At the same time, the just-pushed-up blank 105 becomes the new lowermost blank 105. The suction cup 115 descends in height and places the stack of blanks 105 on the supporting blocks 119 again, thus completing the receiving work.

[0099] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0100] Taking the above-mentioned ideal embodiments of the present invention as an inspiration, through the above description, relevant staff can completely make various changes and modifications without departing from the technical idea of this invention. The technical scope of this invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A die bonder, comprising a frame (14), characterized in that: a gantry drive device is provided on the frame (14), within the moving range of the gantry drive device, a material receiving and feeding mechanism (1), a solder tape cutting device (2), a die bonding table (5) and a wafer mounting mechanism (4) are further provided on the frame (14), and a switchable blue film ejector pin mechanism (3) is provided at the bottom of the wafer mounting mechanism (4); the gantry drive device includes two longitudinally parallel and separated longitudinal guide rails (6), a longitudinal linear motor (8) parallel to the longitudinal guide rails (6), a longitudinal slider (7) slidably mounted on the longitudinal guide rails (6), and a cross beam (9) fixedly provided on the longitudinal slider (7), the mover of the longitudinal linear motor (8) is fixedly connected to the cross beam (9), a transverse guide rail (10) is horizontally provided on the cross beam (9), a transverse linear motor (11) parallel to the transverse guide rail (10), and a transverse slider (12) slidably mounted on the transverse guide rail (10) and fixedly connected to the mover of the transverse linear motor (11), and an actuator (13) is mounted on the transverse slider (12); the solder tape cutting device is used to cut a roll of solder tape (201) into solder pieces, including a second mechanism body (202), characterized in that: a tape unwinding mechanism and a conveying rail (204) are provided on the second mechanism body (202), a tape roll (203) is mounted on the tape unwinding mechanism, and the solder tape (201) is led out from the tape roll (203) and introduced into the conveying rail (204); on the second mechanism body (202), along the conveying rail (204), are successively mounted a clamping mechanism (205) for clamping the solder tape (201) on the conveying rail (204); a pitch setting mechanism (206) for clamping the solder tape (201) and making a lateral movement; a cutting mechanism (207) for cutting the solder tape (201) fed by the clamping mechanism (205) or the pitch setting mechanism (206); the conveying rail (204) includes a flat rail (208) and a side rail (209) parallelly mounted on the upper end surface of the flat rail (208); the clamping mechanism (205) includes a clamping cylinder (210) mounted below the flat rail (208), a first clamping plate (211) provided above the flat rail (208), and a clamping guiding part, the clamping guiding part includes a clamping guide rail (212) vertically and fixedly provided on the second mechanism body (202), a clamping slider (213) is provided on the clamping guide rail (212), a clamping bracket (214) is mounted on the clamping slider (213), the clamping bracket (214) is fixedly connected to the first clamping plate (211); the piston rod of the clamping cylinder (210) is fixedly connected to the clamping bracket (214), and the solder tape (201) is threaded between the first clamping plate (211) and the flat rail (208).

2. A die bonder according to claim 1, characterized in that: The fixed-distance mechanism (206) is installed in the flat rail (208). The fixed-distance mechanism (206) includes a fixed-distance driving part, a fixed-distance air cylinder (215) installed on the fixed-distance driving part, a second clamping plate (216), and a fixed-distance movable frame (223) arranged on the piston rod of the fixed-distance air cylinder (215); the fixed-distance driving part includes a horizontally arranged fixed-distance driving lead screw (217), a fixed-distance driving block (218) installed on the fixed-distance driving lead screw (217), and a fixed-distance driving motor (219). The fixed-distance driving motor (219) rotates to drive the fixed-distance driving block (218) to move along the fixed-distance driving lead screw (217). A fixed-distance fixing frame (220) is arranged on the fixed-distance driving block (218). The fixed-distance air cylinder (215) is fixedly installed on the fixed-distance fixing frame (220). A fixed-distance vertical guide rail (221) is vertically installed on the fixed-distance fixing frame (220). A fixed-distance vertical sliding block (222) is installed on the fixed-distance vertical guide rail (221). The fixed-distance vertical sliding block (222) is fixedly connected with the fixed-distance movable frame (223). The second clamping plate (216) is arranged above the fixed-distance movable frame (223) and is fixedly connected with the fixed-distance fixing frame (220); the welding tape (201) is threaded between the second clamping plate (216) and the fixed-distance movable frame (223). The cutting mechanism (207) includes a cutting seat (226), a tool holder (227), a cutting tool (228), and a cutting driving mechanism. The cutting seat (226) has a vertical cutting surface. A linear material opening (229) is horizontally opened on the cutting surface. The welding tape (201) passes out from the material opening (229). The tool holder (227) is arranged in contact with the cutting surface. A chute (230) is vertically opened on the tool holder (227). The cutting tool (228) is slidably installed in the chute (230) and is arranged in contact with the cutting surface. A spring piece (231) for pushing the cutting tool (228) towards the cutting surface is further arranged on the tool holder (227); the cutting driving mechanism drives the cutting tool (228) to move up and down along the chute (230).

3. A die bonder according to claim 2, characterized in that: The material receiving and feeding mechanism includes a linear first mechanism body (101). A material receiving position (103) and a material feeding position (102) are arranged horizontally at the left end of the first mechanism body (101). A transfer window (104) is arranged at the right end of the first mechanism body (101). A carrier mechanism is arranged below the material receiving position (103) and the material feeding position (102). The carrier mechanism loads the wafers (105) and transfers them between the material receiving position (103), the material feeding position (102), and the transfer window (104).

4. A die bonder according to claim 3, characterized in that: The vehicle mechanism includes a stage (106), a pulley (107), a stage guide rail (108), and a stage slider (109) slidably mounted on the stage guide rail (108). The stage guide rail (108) is horizontally and fixedly arranged on the first mechanism body (101), and the stage (106) is fixedly connected to the stage slider (109). There are two pulleys (107), and the two pulleys (107) are horizontally separated and rotatably mounted on the first mechanism body (101). A synchronous belt (110) is wound around the outer periphery of the pulley (107), and the synchronous belt (110) is fixedly connected to the stage (106). An activity plate (111) is arranged above the stage (106). A guide sleeve (112) is vertically arranged on the stage (106), and a guide post (113) is vertically and fixedly arranged on the activity plate (111). The guide post (113) is inserted and installed in the guide sleeve (112). A lifting drive device (114) is installed on the stage (106), and the lifting drive device (114) drives the activity plate (111) to move up and down in the vertical direction. A suction cup (115) is installed on the activity plate (111).

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