Circuit board assembly and electronic equipment

By setting up electrical connection boards and recessed structures on the circuit board, adjusting the bent shape of the flexible circuit board, the problem of poor bending of the flexible circuit board is solved, extending the service life and reducing the risk of damage.

CN118765036BActive Publication Date: 2025-01-14HONOR DEVICE CO LTD
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Patent Information

Application Number
CN202411237220.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-09-05
Publication Date
2025-01-14
Estimated Expiration
2044-09-05

AI Technical Summary

Technical Problem

The service life of flexible circuit boards is shortened due to poor bending shape in electronic equipment, and it is difficult for the prior art to effectively adjust their bending shape to avoid friction and damage.

Method used

An electrical connection plate and a recessed structure are provided on the circuit board. By adjusting the coordination between the electrical connection plate and the recessed structure, the distance between the second connecting section of the flexible circuit board and the circuit board is adjusted to achieve a reasonable bending form of the flexible circuit board. Extend service life.

Benefits of technology

Through the coordination of the electrical connection plate and the recessed structure, the height difference of the flexible circuit board is adjusted to ensure that its bending shape is reasonable, the risk of damage is reduced, the service life is extended, and the needs of different scenarios are adapted to.

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Abstract

The present application relates to the technical field of electronic equipment, and in particular to a circuit board assembly and electronic equipment. The circuit board assembly includes a circuit board, an electrical connection board and a flexible circuit board. The electrical connection board is mounted on the circuit board along the thickness direction of the circuit board assembly and is electrically connected to the circuit board. At least part of the flexible circuit board is a flexible structure. The flexible circuit board includes a first connection section and a second connection section. The first connection section is used to connect to a device of the electronic device, and the second connection section is connected to the electrical connection board. The electrical connection board is used to adjust the distance between the second connection section and the circuit board along the thickness direction of the circuit board assembly, thereby adjusting the bending shape of the flexible circuit board without changing the distance between the device of the electronic device and the circuit board in the width direction of the electronic device.
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Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a circuit board assembly and an electronic equipment. Background Art

[0002] In modern life, work and communication, electronic devices such as smart watches, mobile phones, and laptops are becoming one of the necessities of modern people's lives. Taking a mobile phone as an example, an electronic device includes a battery, a motherboard, a screen assembly, and a housing. The battery, the motherboard, and the screen assembly are arranged in the housing. The motherboard includes a circuit board and electronic components arranged on the circuit board. The electronic components include, but are not limited to, a processor, an antenna module, etc.

[0003] As electronic devices realize more and more functions, more and more devices are arranged inside the electronic devices. Since flexible circuit boards can be bent, they can be used for electrical connection between devices and circuit boards. However, when the bending shape of the flexible circuit board is poor, the flexible circuit board bends too much or rubs against nearby components, which affects the service life. Summary of the invention

[0004] The embodiments of the present application provide a circuit board assembly and an electronic device, which are intended to satisfy the requirement that a flexible circuit board has a reasonable bending shape.

[0005] An embodiment of the present application provides a circuit board assembly for an electronic device, the circuit board assembly comprising:

[0006] Circuit boards;

[0007] An electrical connection plate, which is mounted on the circuit board along the thickness direction of the circuit board assembly and is electrically connected to the circuit board;

[0008] A flexible circuit board, at least part of which is a flexible structure, comprising a first connecting section and a second connecting section, wherein the first connecting section is used to connect to a device of an electronic device, and the second connecting section is connected to the electrical connection board, and the electrical connection board is used to adjust the distance between the second connecting section and the circuit board along the thickness direction of the circuit board assembly.

[0009] In the embodiment of the present application, an electrical connection plate is placed between the second connection section of the flexible circuit board and the circuit board along the thickness direction of the electronic device, which can assist in adjusting the distance between the second connection plate and the circuit board in the thickness direction of the electronic device, thereby being able to adjust the height difference between the two ends of the flexible circuit board without changing the distance between the components of the electronic device and the circuit board in the width direction of the electronic device, so that the flexible circuit board has a reasonable bending shape and extends its service life.

[0010] In a possible design, the circuit board is provided with a recessed structure recessed along a thickness direction of the circuit board assembly;

[0011] Part of the structure of the electrical connection plate is accommodated in the recessed structure, and the electrical connection plate and the recessed structure are used to adjust the distance between the second connection section and the circuit board along the thickness direction of the circuit board assembly.

[0012] In the embodiment of the present application, a recessed structure is provided on the circuit board, and the electrical connection plate cooperates with the recessed structure to increase the range in which the height difference between the two ends of the flexible circuit board can be adjusted.

[0013] In a possible design, the recessed structure includes at least one groove.

[0014] In an embodiment of the present application, a groove is set on the circuit board, and the depth of the groove can be adjusted according to the actual depth. Part of the structure of the electrical connection board is set in the groove. The depth of the groove can be adjusted according to the required height difference between the two ends of the flexible circuit board, so that the height difference between the two ends of the flexible circuit board is reasonable, thereby enabling the flexible circuit board to obtain a better shape.

[0015] In addition, the number of electrical connection boards can be appropriately increased to increase the range of adjusting the height difference between the two ends of the flexible circuit board.

[0016] In a possible design, the recessed structure includes a first groove and a second groove that are spaced apart, and the circuit board is further provided with a fabric area located between the first groove and the second groove;

[0017] The electrical connection plate comprises a first plate, a second plate and a third plate, a part of the structure of the first plate is accommodated in the first groove, a part of the structure of the second plate is accommodated in the second groove, the third plate is arranged on the first plate and the second plate and is electrically connected to the first plate and the second plate, and the third plate is also electrically connected to the second connection section;

[0018] A gap is provided between the third plate and the layout area along the thickness direction of the circuit board assembly.

[0019] In an embodiment of the present application, components need to be arranged in the layout area on the circuit board. In order to avoid the components arranged on the circuit board, groove structures are set on both sides of the layout area of ​​the circuit board to achieve component arrangement while meeting the matching of any height difference of the flexible circuit board.

[0020] In a possible design, when the depth of the first groove is greater than the thickness of the first plate and the depth of the second groove is greater than the thickness of the second plate, the third plate is provided with an avoidance groove for avoiding the fabric area.

[0021] In the embodiment of the present application, the avoidance groove is provided on the third plate to avoid interference between the third plate and the fabric area, so as to ensure that the third plate is electrically connected to the first plate and the second plate, and at the same time ensure that the cooperation between the electrical connection plate and the circuit board can meet the height difference required by the flexible circuit board.

[0022] In a possible design, the recessed structure is a through hole that penetrates the circuit board along the thickness direction of the circuit board.

[0023] In the embodiment of the present application, a through hole structure is provided on the circuit board, which can further increase the depth of the recessed structure on the circuit board, and part of the structure of the electrical connection board is provided in the through hole, thereby increasing the range of adjusting the height difference between the two ends of the flexible circuit board, thereby making the height difference between the two ends of the flexible circuit board reasonable, and thus making the flexible circuit board obtain a better shape.

[0024] In a possible design, the recessed structure includes a first hole, the electrical connection plate includes a first plate and a second plate, the first plate is connected to the circuit board and blocks the first hole from the bottom;

[0025] One end of the second plate is connected to the first plate, and the other end of the second plate extends out of the through hole and is electrically connected to the second connecting section.

[0026] In the embodiment of the present application, after the first hole is set on the circuit board, the first hole is blocked at the bottom by setting the first plate and supporting the second plate located in the first hole, thereby ensuring the stability of the circuit board assembly.

[0027] In a possible design, the recessed structure includes a first hole and a second hole, and the circuit board is further provided with a fabric area located between the first hole and the second hole;

[0028] The electrical connection board includes a first board, a second board, a third board and a fourth board, the first board and the fourth board are distributed along the thickness direction of the circuit board assembly, and the second board and the third board are located between the first board and the fourth board and connected to the two;

[0029] The first plate is connected to the circuit board and blocks the first hole and the second hole from the bottom, a portion of the structure of the second plate is located in the first hole, a portion of the structure of the third plate is located in the second hole, the fourth plate is electrically connected to the second connecting section, and a gap is provided between the fourth plate and the fabric area along the thickness direction of the circuit board assembly.

[0030] In an embodiment of the present application, components need to be arranged in the layout area on the circuit board. In order to avoid the components arranged on the circuit board, hole structures are set on both sides of the layout area of ​​the circuit board to achieve component arrangement while meeting the matching of any height difference of the flexible circuit board.

[0031] In a possible design, the electrical connection board is a PCB board, or;

[0032] The electrical connection plate includes a conductive portion and a covering portion, wherein the conductive portion is located inside the covering portion and both ends of the conductive portion along the thickness direction of the circuit board assembly are exposed from the covering portion, and the electrical connection plate is electrically connected to the circuit board and the second connection section through the conductive portion.

[0033] In an embodiment of the present application, the electrical connection board can be made of a conductor, that is, each position of the electrical connection board can conduct electricity. For example, the electrical connection board can be an existing printed circuit board in the electronic device. In addition to being used for height matching, the electrical connection board can also be used to arrange components of the electronic device.

[0034] The electrical connection plate may also be a fabricated structure, that is, a portion of the structure of the electrical connection plate is conductive and a portion of the structure is insulating.

[0035] In a possible design, the flexible circuit board includes a deformation section, and the deformation section is located between the first connecting section and the second connecting section and is connected to the two;

[0036] The first connecting section and the second connecting section are made of hard material.

[0037] In the embodiment of the present application, the deformation section is used to generate a bending shape, and the deformation section is a soft material. The first connecting section and the second connecting section are used to connect with other devices or circuit boards, and the first connecting section and the second connecting section are hard materials.

[0038] Alternatively, the flexible circuit board may be made of soft material.

[0039] In a possible design, after the deformation section is bent, the radius of the arc formed by one end of the deformation section close to the first connecting section is a first radius R1, and the radius of the arc formed by one end of the deformation section close to the second connecting section is a second radius R2;

[0040] When R1≤0.6mm, and / or R2≤0.6mm, the copper material in the flexible circuit board is HA copper.

[0041] In the embodiment of the present application, HA copper has excellent bending properties. When R1≤0.6mm and / or R2≤0.6mm, the copper in the deformation section 54f can be made of HA copper to avoid the bending angles at both ends of the deformation section 54f being too small, resulting in breakage at both ends of the deformation section 54f.

[0042] In a possible design, a minimum distance D1 between the first connecting section and the second connecting section is ≥2 mm.

[0043] In the embodiment of the present application, the minimum distance between the first connecting section and the second connecting section is limited to ensure that the deformation section has a reasonable bending shape.

[0044] In a possible design, the minimum distance D2 between the conductive hole on the first connecting segment and the deformation segment is greater than 0.5 mm;

[0045] The minimum distance D2 between the conductive hole on the second connecting section and the deformation section is greater than 0.5 mm.

[0046] In the embodiment of the present application, the minimum distance between the conductive holes on the first connecting segment and the second connecting segment and the deformation segment is limited to avoid electrical connection between the guide hole and the deformation segment, which may cause circuit abnormality.

[0047] In a possible design, a minimum distance D3 between the line on the first connecting segment and the connecting position of the first connecting segment and the deformation segment is greater than 0.25 mm;

[0048] A minimum distance D4 between the line on the second connecting segment and a connecting position between the second connecting segment and the deformation segment is greater than 0.25 mm.

[0049] In the embodiment of the present application, by limiting a distance between the line on the first connecting section and the deformation section, the line on the first connecting section is prevented from being bent during the bending process of the deformation section. By limiting a distance between the line on the second connecting section and the deformation section, the line on the second connecting section is prevented from being bent during the bending process of the deformation section.

[0050] In a possible design, along the arrangement direction of the components of the electronic device and the electrical connection board, the climbing angle C of the flexible circuit board satisfies: 0°≤C≤80°.

[0051] In the embodiment of the present application, by limiting the height difference and the width distance between the two ends of the flexible circuit board, the climbing angle of the flexible circuit board can be limited to 0° to 80°, so as to ensure that the flexible circuit board forms a reasonable bending shape and reduce the risk of damage to the flexible circuit board.

[0052] An embodiment of the present application further provides an electronic device, which includes the circuit board assembly described above.

[0053] In one possible design, the electronic device includes a main board and a camera module, the camera module includes a lens, a lens mount and a sensor, the sensor is connected to the bottom of the lens mount, the main board is a circuit board of the circuit board assembly, the first connecting section of the flexible circuit board is electrically connected to the sensor, and the second connecting section of the flexible circuit board is electrically connected to the electrical connection board via a connector.

[0054] In an embodiment of the present application, the circuit board assembly is used in a camera scene, and the camera module and the main board are set at different heights. Through the cooperation of the electrical connection plate and the recessed structure, it is possible to assist in adjusting the distance between the second connection section of the flexible circuit board and the sensor in the thickness direction of the electronic device, thereby being able to adjust the bending shape of the flexible circuit board without changing the distance between the circuit board and the sensor in the width direction of the electronic device.

[0055] The flexible circuit board and the corresponding device or the electrical connection board may be connected by welding. Alternatively, the flexible circuit board and the corresponding device or the electrical connection board may be connected by a connector.

[0056] In one possible design, the electronic device includes a main board, a charging module and a sub-board, the charging module includes a battery, the main board and the sub-board are circuit boards of the circuit board assembly, the first connecting section of the flexible circuit board is connected to the battery, and the second connecting section of the flexible circuit board is connected to the electrical connection board via a connector.

[0057] In the embodiment of the present application, the circuit board assembly is applied in the charging scene, and the electronic device may be a straight-screen machine, a double-folding machine, a triple-folding machine, a quad-folding machine, etc. The charging scene may involve multiple flexible circuit boards, and the partial structure of each flexible circuit board connected to the corresponding device or the main board / sub-board may be bent. In order to improve the bending shape of each flexible circuit board and reduce the risk of its breakage, the height difference between the two ends of the flexible circuit board can be adjusted by cooperating with the electrical connection plate and the recessed structure, so that the flexible circuit board has a reasonable bending shape.

[0058] The flexible circuit board and the corresponding device or the electrical connection board may be connected by welding. Alternatively, the flexible circuit board and the corresponding device or the electrical connection board may be connected by a connector.

[0059] It should be understood that the foregoing general description and the following detailed description are exemplary only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] Figure 1 is a schematic diagram of the structure of an electronic device in an embodiment;

[0061] Figure 2 is an exploded schematic diagram of an electronic device;

[0062] Figure 3 is a schematic diagram of a system-on-chip;

[0063] Figure 4 It is a cross-sectional view of the electronic device at the camera module;

[0064] Figure 5 This is a schematic diagram of the installation board (main board);

[0065] Figure 6 It is a structural schematic diagram of a camera module;

[0066] Figure 7 for Figure 6 Schematic diagram of the decomposition of

[0067] Figure 8 A schematic diagram of data connection and transmission between the camera module and the system-level chip;

[0068] Fig. 9 is a schematic diagram of the connector;

[0069] Fig.10 It is a cross-sectional schematic diagram of an embodiment when the camera module is electrically connected to the mainboard;

[0070] Fig.11 for Fig.10 The middle part of the structure is enlarged schematic diagram;

[0071] Fig.12 It is a cross-sectional schematic diagram of another embodiment when the camera module is electrically connected to the mainboard;

[0072] Fig.13 A schematic diagram of a circuit board assembly provided in the present application in one embodiment;

[0073] Fig.14 A schematic diagram of a circuit board assembly provided by the present application in another embodiment;

[0074] Fig.15 A schematic diagram of a circuit board assembly provided by the present application in another embodiment;

[0075] Fig.16 A schematic diagram of a circuit board assembly provided by the present application in another embodiment;

[0076] Fig.17 A schematic diagram of a mainboard provided in the present application in one embodiment;

[0077] Fig.18 A schematic diagram of a circuit board assembly provided by the present application in another embodiment;

[0078] Fig.19 A schematic diagram of an electrical connection board provided in the present application in one embodiment;

[0079] Fig. 20 A schematic diagram of a circuit board assembly provided by the present application in another embodiment;

[0080] Fig.21 A schematic diagram of a circuit board assembly provided by the present application in another embodiment;

[0081] Fig. 22A schematic diagram of a circuit board assembly provided by the present application in another embodiment;

[0082] Fig.23 A schematic diagram of another embodiment of the mainboard provided by the present application;

[0083] Fig.24 A schematic diagram of a circuit board assembly provided by the present application in another embodiment;

[0084] Fig.25 A schematic diagram of an electrical connection board provided in the present application in one embodiment;

[0085] Fig.26 A schematic diagram of another embodiment of the electrical connection board provided by the present application;

[0086] Fig. 27 A schematic diagram of another embodiment of the electrical connection board provided by the present application;

[0087] Fig.28 for Fig. 27 Distribution diagram of pads on the CEC connection board;

[0088] Fig.29 A schematic diagram of a circuit board assembly provided by the present application in another embodiment;

[0089] Fig.30 A schematic diagram of two flexible circuit boards adapted to two camera modules when two camera modules are provided in an electronic device;

[0090] Fig.31 for Fig.30 The structural diagram of the two flexible circuit boards;

[0091] Fig.32 for Fig.14 A schematic diagram of the welding process of the illustrated embodiment;

[0092] Fig.33 A schematic diagram of a flexible circuit board provided in the present application in one embodiment;

[0093] Fig.34 for Fig.33 A cross-sectional schematic diagram of a flexible circuit board;

[0094] Fig.35 A schematic diagram of another embodiment of the flexible circuit board provided by the present application;

[0095] Fig.36 for Fig.34 A cross-sectional schematic diagram of a flexible circuit board;

[0096] Fig.37 A schematic diagram of a charging scenario for an electronic device in one embodiment;

[0097] Fig.38 A schematic diagram of a charging scenario of an electronic device in another embodiment;

[0098] Fig.39 A schematic diagram of a charging scenario of an electronic device in another embodiment;

[0099] Fig.40 A schematic diagram of a charging scenario of an electronic device in another embodiment;

[0100] Fig.41 A schematic diagram of a charging scenario of an electronic device in another embodiment.

[0101] Reference numerals:

[0102] 100-electronic device, 10a-housing, 10b-display screen, 10c-circuit board assembly, 1c-mainboard, 11c-groove, 12c-first groove, 13c-second groove, 14c-cloth area, 15c-through hole, 16c-first hole, 17c-second hole, 2c-electrical connection board, 21c-first board, 22c-second board, 23c-third board, 231c-avoidance groove, 24c-fourth board, 25c-first pad, 26c-conductive part, 27c-covering part, 10d-middle frame assembly, 10e-button module, 10f-camera module, 101f-first camera module, 102f-second camera module, 1f-lens, 2f-lens holder, 3f-filter, 4f-sensor, 5f - flexible circuit board, 51f-first flexible circuit board, 511f-first connection end, 512f-second connection end, 513f-first bending section, 52f-second flexible circuit board, 521f-third connection end, 522f-fourth connection end, 523f-second bending section, 53f-reinforcement plate, 54f-deformation section, 55f-first connection section, 551f-second solder pad, 552f-conductive hole, 56f-second connection section, 57f-third solder pad, 6f-connector, 61f-male end, 62f-female end, 10g-battery, 10h-wireless charging coil, 10i-microphone, 10j-fingerprint module, 10k-card tray, 10l-motor, 10m-system-level chip, 10n-mounting board;

[0103] 1-sub-board, 1a-charging port, 2-first battery, 3-first connector, 4-second connector, 5-third connector, 6-charging flexible circuit board, 7-first battery flexible circuit board, 8-first folding part, 9-second folding part, 10-first rotating shaft, 11-first through-shaft flexible circuit board, 12-fourth connector, 13-fifth connector, 15-first sub-main board, 16-sixth connector, 17-second battery, 18-second battery flexible circuit board, 19-third folding part, 20-second Rotating shaft, 21-second sub-mainboard, 22-second through-shaft flexible circuit board, 23-seventh connector, 24-eighth connector, 25-third battery, 26-third battery flexible circuit board, 27-ninth connector, 28-three-way flexible circuit board, 29-fourth folding part, 30-third rotating shaft, 31-third sub-mainboard, 32-third through-shaft flexible circuit board, 33-tenth connector, 34-eleventh connector, 35-fourth battery, 36-fourth battery flexible circuit board, 37-twelfth connector;

[0104] X-width direction, Y-length direction, Z-thickness direction.

[0105] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application. DETAILED DESCRIPTION

[0106] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0107] In a specific embodiment, the present application is further described in detail below through a specific embodiment and in conjunction with the accompanying drawings.

[0108] The circuit board assembly provided in the embodiment of the present application can be applied to electronic devices. The electronic devices may include but are not limited to mobile or fixed terminals such as mobile phones, tablet computers, and laptop computers. For ease of description, the embodiment of the present application is described by taking a mobile phone as an example.

[0109] like Figure 1 The structural diagram of the electronic device shown in the figure has an X direction, a Y direction and a Z direction. In the following description, the thickness direction of the electronic device 100 is defined as the Z direction, the width direction of the electronic device is defined as the X direction, and the length direction of the electronic device is defined as the Y direction.

[0110] Figure 2 The figure shows a schematic diagram of the decomposed structure of an electronic device 100 in a specific embodiment. The electronic device 100 may include a shell 10a, a display screen 10b and a middle frame assembly 10d, wherein the shell 10a and the display screen 10b together enclose a receiving space (not shown in the figure), and the middle frame assembly 10d is located between the shell 10a and the display screen 10b.

[0111] The electronic device 100 further includes a circuit board assembly 10c, a key module 10e, a camera module 10f, a battery 10g, a wireless charging coil 10h, a microphone 10i, a fingerprint module 10j, a card tray 10k, a motor 10l, etc. The circuit board assembly 10c, the key module 10e, the camera module 10f, the battery 10g, the wireless charging coil 10h, the microphone 10i, the fingerprint module 10j, the card tray 10k, the motor 10l, etc. are located in the receiving space and are mounted on the middle frame assembly 10d, which provides support and protection for the various components inside the electronic device 100.

[0112] Those skilled in the art will appreciate that the structures illustrated in the embodiments of the present application do not constitute specific limitations on the electronic device. In other possible implementations of the present application, the electronic device may include fewer components than shown, or more components, or combine certain components, or split certain components, or arrange the components differently.

[0113] like Figure 3 FIG. 1 is a schematic diagram of a system-level chip 10m, wherein the electronic device 100 is connected to various devices by the system-level chip 10m, and the system-level chip 10m is a chip integrating multiple circuits and is the core of the entire electronic device 100. The system-level chip 10m includes multiple interfaces, and the multiple interfaces are used to connect multiple functional modules such as CPU, communication module, WiFi, audio processing module, image processing module, camera module 10f, memory, Bluetooth, GPS, etc.

[0114] As the electronic device 100 needs to realize more and more functions, more and more devices are arranged inside the electronic device 100, and some devices are stacked along the thickness direction Z inside the electronic device 100.

[0115] like Figure 4 The figure shows a cross-sectional view of the electronic device 100 at the camera module 10f, including the camera module 10f and multiple devices arranged near the camera module 10f. The black squares in the figure represent devices (101-118), and the devices (101-118) are installed on the corresponding circuit boards. The devices (101-118) may be resistors, capacitors, inductors, radio frequency chips, sensors, Bluetooth, GPS, etc. It can be seen from the figure that in order to maximize the use of the limited space inside the electronic device 100, some devices (101-118) are stacked, and can be stacked in three layers, four layers, five layers or even six layers.

[0116] like Figure 5The figure shows a schematic diagram of a mounting board 10n (eg, a motherboard). Most chips (eg, n1-n10) in an electronic device are centrally mounted on the mounting board 10n (eg, a motherboard). Figure 4 and Figure 5 , that is, the above-mentioned devices need to be electrically connected to the mounting board 10n (such as the main board) to achieve electrical connection with the corresponding chip. Due to the limited internal space of the electronic device, some devices in the electronic device may be misaligned with the mounting board 10n (such as the main board), so a flexible circuit board with a certain bending shape is required to connect each device with the mounting board 10n (such as the main board). It should be noted that the mounting board 10n may also be other circuit boards, such as a sub-main board, etc.

[0117] The following description takes the electrical connection between the camera module and the mainboard as an example.

[0118] like Figure 6 FIG. 1 is a schematic diagram of the structure of a camera module 10f in a specific embodiment. Figure 6 As shown, the camera module 10f includes a lens 1f, a lens holder 2f, a sensor 4f, a flexible circuit board 5f and a connector 6f, wherein the lens 1f and the sensor 4f are installed in the lens holder 2f, one end of the flexible circuit board 5f is connected to the sensor 4f, and the other end of the flexible circuit board 5f is electrically connected to the connector 6f, and the connector 6f is used to be electrically connected to the mainboard.

[0119] Figure 7 Please refer to the exploded diagram of the camera module 10f. Figure 7 , and combined with Figure 6 The camera module 10f also includes a filter 3f. The lens 1f, the filter 3f and the sensor 4f are installed in the lens holder 2f. The filter 3f is located between the lens 1f and the sensor 4f to filter out ultraviolet light and infrared light that cannot be observed by the human eye. The scene is shot through the lens 1f, and the generated optical image is projected onto the sensor 4f. The optical image is converted into a digital signal, which is then sent to the system-level chip on the mainboard for processing and finally converted into an image that can be seen on the screen of the electronic device.

[0120] Figure 6 and Figure 7 In the illustrated embodiment, the camera module 10f is not installed. Since the sensor 4f and the connector 6f are located at the same height, the flexible circuit board 5f connecting the sensor 4f and the connector 6f is in the shape of a flat plate without any bends.

[0121] Specifically, Figure 8The figure shows the schematic diagram of data connection and transmission between the camera module and the system-level chip. The data transmission between the two requires the configuration of the Mobile Industry Processor Interface (MIPI) to support the transmission of large amounts of data and ensure image quality and transmission efficiency. The data transmitted between the camera module and the system-level chip includes the clock signal (Master clock for sensor logical chip, MCLK), camera ID (CAM ID), restart system signal (RESET), shutdown signal (SHDN) and control signal (1 2 C) etc.

[0122] The connector 6f may be a board-to-board connector, such as Fig. 9 As shown, the connector 6f has a male end 61f and a female end 62f. The male end 61f is used to be fixed on the mainboard, and the female end 62f is used to be connected to the flexible circuit board. The male end 61f and the female end 62f are plugged together to realize the electrical connection between the flexible circuit board and the mainboard, thereby realizing the electrical connection between the camera module and the system-on-chip SOC on the mainboard.

[0123] Please refer to Fig.10 , Fig.10 The figure shows a cross-sectional schematic diagram of the electrical connection between the camera module 10f and the main board 1c in a specific embodiment. The electronic device 100 includes the camera module 10f, the flexible circuit board 5f, the connector 6f and the main board 1c. The sensor 4f of the camera module 10f is electrically connected to one end of the flexible circuit board 5f, the other end of the flexible circuit board 5f is connected to the connector 6f, and the connector 6f is electrically connected to the main board 1c, so as to realize the electrical connection between the sensor 4f and the main board 1c. Among them, the two ends of the flexible circuit board 5f are respectively connected to the sensor 4f and the connector 6f. As the volume of the camera module 10f becomes larger and larger, a part of the structure of the camera module 10f is usually located below the main board 1c, so that a part of the structure of the camera module 10f is located below the connector 6f, and the sensor 4f is located at the bottom of the camera module 10f. Therefore, the sensor 4f will be located below the connector 6f in some cases, that is, the sensor 4f and the connector 6f have different heights in the thickness direction Z of the electronic device 100, so that a height difference is formed at both ends of the flexible circuit board 5f connecting the sensor 4f and the connector 6f, so that the flexible circuit board 5f has a certain bending shape after installation.

[0124] The length of the flexible circuit board 5f is generally designed to be a fixed length. The length of the flexible circuit board 5f affects its bending shape. Under normal circumstances, when the flexible circuit board 5f is bent into an S-shape or other smooth shape, its bending shape is better and not easy to break. When the distance between the connector 6f and the sensor 4f along the thickness direction Z of the electronic device 100 is constant, and the distance between the connector 6f and the sensor 4f along the width direction X or the length direction Y of the electronic device 100 is constant, if the length of the flexible circuit board 5f is too large, the bending degree of the flexible circuit board 5f is too large, and the flexible circuit board 5f is easily damaged. If the length of the flexible circuit board 5f is too small, the bending degree of the flexible circuit board 5f is too small, resulting in the position where the flexible circuit board 5f is connected to the connector 6f and the sensor 4f is prone to folding, resulting in the flexible circuit board 5f being easily damaged.

[0125] In some embodiments, the bending shape of the flexible circuit board 5f can be adjusted in the following two ways, so that the flexible circuit board 5f forms a reasonable S-shaped or other shaped bend, and the flexible circuit board 5f is prevented from being bent too much and breaking. One way is to adjust the distance between the connector 6f and the sensor along the thickness direction Z of the electronic device. Another way is to adjust the distance between the sensor 4f and the connector 6f in the width direction X of the electronic device 100 when the camera module 10f and the main board 1c are arranged along the length direction Y of the electronic device, and adjust the distance between the sensor 4f and the connector 6f in the length direction Y of the electronic device when the camera module 10f and the main board 1c are arranged along the length direction Y of the electronic device.

[0126] The following description is based on the arrangement of the mainboard and the camera module along the width direction of the electronic device. For example, when the length of the flexible circuit board is too large, the bending shape of the flexible circuit board can be adjusted by increasing the distance between the connector and the sensor along the thickness direction of the electronic device, or the bending shape of the flexible circuit board can be adjusted by increasing the distance between the connector and the sensor along the width direction of the electronic device. Of course, other methods can also be used to adjust the bending shape of the flexible circuit board, which will not be described in detail in this application.

[0127] The following first describes how to adjust the bending shape of the flexible circuit board by increasing the distance between the connector and the sensor along the width direction of the electronic device. Fig.11 , Fig.11 for Fig.10The enlarged schematic diagram of some structures shows that the flexible circuit board 5f forms a bent shape after connecting the sensor 4f and the connector 6f of the camera module. It is necessary to control the two parameters A and B of the flexible circuit board 5f in the figure to limit the climbing angle (C) of the flexible circuit board 5f so as to satisfy the flexible circuit board 5f to form a reasonable bending shape. Among them, the position where the sensor 4f is connected to the flexible circuit board 5f is the first connection position, and the position where the flexible circuit board 5f is connected to the connector 6f is the second connection position. The climbing angle of the flexible circuit board 5f is represented by: the angle formed by the line connecting the first connection position and the second connection position and the horizontal plane. For details, please refer to the following Table 1:

[0128] Table 1

[0129]

[0130] As can be seen from Table 1 above, in some embodiments, A and B can be limited to B ≤ 10 mm, A ≥ 20% × B. The above definition is only a possible embodiment and does not constitute an absolute limitation on the scope of protection of this application. By limiting the height difference (B) at both ends of the flexible circuit board 5f and the width distance (A) at both ends, the climbing angle of the flexible circuit board 5f can be limited to 0° to 80° to ensure that the flexible circuit board 5f forms a reasonable bending shape and reduce the risk of damage to the flexible circuit board 5f.

[0131] Under the high-density space requirement of the electronic device 100, if the distance between the sensor 4f and the connector 6f in the width direction X of the electronic device 100 is increased, the position of nearby devices will be occupied, the width of the electronic device 100 will be increased, and the overall volume of the electronic device 100 will be increased, which will increase the cost. Therefore, the movement of the sensor 4f and the connector 6f in the width direction X of the electronic device 100 is limited, that is, the distance between the sensor 4f and the connector 6f in the width direction X of the electronic device 100 cannot be further increased.

[0132] In addition, please continue to refer to Fig.10 When the distance between the sensor 4f and the connector 6f in the width direction X of the electronic device 100 remains unchanged and the length of the flexible circuit board 5f is a fixed value, if the distance between the sensor 4f and the connector 6f in the thickness direction Z of the electronic device 100 is too small, the height difference between the two ends of the flexible circuit board 5f is reduced, causing the flexible circuit board 5f to bend too much to both sides, which may easily cause the flexible circuit board 5f to contact with the components on both sides and cause wear.

[0133] The circuit board assembly provided in the embodiment of the present application can solve the above-mentioned technical problems.

[0134] Please refer to Fig.12 , Fig.12 FIG. 1 is a cross-sectional view of the electrical connection between the camera module 10f and the mainboard 1c in another specific embodiment. Fig.10 In the embodiment shown, the electronic device 100 in this embodiment further includes an electrical connection board 2c, which is disposed between the connector 6f and the main board 1c along the thickness direction Z of the electronic device 100 and electrically connects the connector 6f and the main board 1c. The electrical connection board 2c is an auxiliary device, which is located between the connector 6f and the main board 1c along the thickness direction of the electronic device.

[0135] The electrical connection plate 2c can provide an adaptive height for the connector 6f, thereby adjusting the height difference of the flexible circuit board 5f in the thickness direction Z of the electronic device 100, so that the flexible circuit board 5f has a reasonable bending shape.

[0136] Please refer to Fig.13 , Fig.13 for Fig.12 The schematic diagram of the circuit board assembly in one embodiment, the circuit board assembly 10c includes a main board 1c, an electrical connection board 2c, a connector 6f and a flexible circuit board 5f. Along the thickness direction Z of the electronic device, the electrical connection board 2c is mounted on the main board 1c, and the connector 6f is mounted on the electrical connection board 2c. The connector 6f includes a male end 61f and a female end 62f, the male end 61f of the connector 6f is mounted on the electrical connection board 2c, and the female end 62f of the connector 6f is mounted on the flexible circuit board 5f. The flexible circuit board 5f is connected to the connector 6f by plugging and fitting the female end 62f of the connector 6f with the male end 61f. In this embodiment, by setting the electrical connection board 2c, the height of the connector 6f is adjusted, thereby adjusting the height difference between the two ends of the flexible circuit board 5f, so that the flexible circuit board 5f obtains a better shape and improves the life of the flexible circuit board 5f. Fig.13 The electrical connection board 2c in the illustrated embodiment can increase the height of both ends of the flexible wiring board 5f.

[0137] Therefore, in order to achieve a reasonable shape of the flexible circuit board 5f, it is necessary to control the height difference between the two ends of the flexible circuit board 5f. The height difference is limited by the actual height difference between the sensor 4f and the connector 6f. When the height of the sensor 4f is constant, the flexible circuit board 5f has a reasonable bending shape which is related to the height of the connector 6f.

[0138] Therefore, the embodiment of the present application adds an auxiliary device in the electronic device, and the auxiliary device is located between the connector 6f and the sensor 4f along the thickness direction of the electronic device, and can assist in adjusting the distance between the connector 6f and the sensor 4f in the thickness direction Z of the electronic device, thereby being able to adjust the bending shape of the flexible circuit board 5f without changing the distance between the connector 6f and the sensor 4f in the width direction X of the electronic device.

[0139] The height L0 (hereinafter referred to as the matching height) of the connector 6f is defined as the distance between the connector 6f and the upper surface of the mainboard when the flexible circuit board 5f has a reasonable bending shape ( Fig.13 It should be noted that the distance between the sensor 4f and the mainboard 1c along the thickness direction of the electronic device is a constant value, so in this embodiment, the upper surface of the mainboard 1c is taken as the base surface, and the distance between the base surface and the highest end surface of the connector 6f is the above-mentioned height L0.

[0140] For example, when a standard connector 6f and an electrical connection board 2c with the smallest board thickness are selected, Fig.13 The specific configuration height of the flexible circuit board 5f that can be satisfied by the embodiment shown can be seen in Table 2 below:

[0141] Table 2

[0142]

[0143] It should be noted that since the connector 6f is a standard part, the height of the connector 6f is generally fixed (for example, 0.5mm, 0.6mm) and cannot be changed at will as needed. The electrical connection board 2c has a minimum thickness limit, because the processing process and rigidity have an impact. The minimum thickness of the electrical connection board 2c without plastic packaging is generally 0.3mm.

[0144] From Table 2 above, it can be seen that when the height of the connector 6f is 0.6mm and the thickness of the electrical connection plate 2c is 0.3mm, the height L0 can be 0.9mm. When the height of the connector 6f is 0.5mm and the thickness of the electrical connection plate 2c is 0.3mm, the height L0 can be 0.8mm.

[0145] Obviously, the standard connector and the minimum thickness electrical connection plate cannot meet the height requirement of less than 0.8mm. When the required height L0 is less than 0.8mm, a customized connector 6f is required. The customized connector 6f has a complex process and a long process cycle, and requires a lot of experiments and tests, which affects the product preparation cycle.

[0146] In this regard, in some embodiments, a recessed structure may be provided on the main board, and the range of height that can be achieved may be increased through the cooperation between the electrical connection plate and the recessed structure.

[0147] Specifically, please refer to Fig.14 , Fig.141 is a schematic diagram of a circuit board assembly 10c in another embodiment, wherein the circuit board assembly 10c includes a main board 1c, an electrical connection board 2c, a connector 6f, and a flexible circuit board 5f. Along the thickness direction Z of the electronic device, the main board 1c is provided with a groove 11c, and the groove 11c is the above-mentioned recessed structure. Part of the structure of the electrical connection board 2c is arranged in the groove 11c, the male end 61f of the connector 6f is mounted on the electrical connection board 2c, and the female end 62f of the connector 6f is mounted on the flexible circuit board 5f. The female end 62f of the connector 6f is plugged into and matched with the male end 61f, so as to realize the connection between the flexible circuit board 5f and the connector 6f.

[0148] In this embodiment, a groove 11c is provided on the main board 1c, and the depth of the groove 11c can be adjusted according to actual needs. Part of the structure of the electrical connection board 2c is provided in the groove 11c, and the depth of the groove 11c can be adjusted according to the required height, thereby adjusting the height of the connector 6f, so that when the circuit board assembly 10c uses a standard connector 6f and an electrical connection board 2c with the minimum thickness, the height L0 can still be achieved below 0.8 mm, thereby making the height difference between the two ends of the flexible circuit board 5f reasonable, thereby enabling the flexible circuit board 5f to obtain a better shape.

[0149] To ensure that the mainboard 1c has sufficient support strength for the electrical connection board 2c, the depth of the groove 11c is less than 70% of the thickness of the mainboard 1c. For example, when the thickness of the mainboard 1c is 0.6mm, the depth of the groove 11c can be 0-0.4mm.

[0150] For example, when a standard connector 6f and an electrical connection board 2c with the smallest board thickness are selected, Fig.14 The specific configuration height of the flexible circuit board 5f that can be satisfied by the illustrated embodiment can be found in Table 3 below:

[0151] Table 3

[0152]

[0153] It should be noted that since the connector 6f is a standard part, the height of the connector 6f is generally fixed (for example, 0.5mm, 0.6mm) and cannot be changed at will as needed. The electrical connection board 2c has a minimum thickness limit, because the processing process and rigidity have an impact. The minimum thickness of the electrical connection board 2c without plastic packaging is generally 0.3mm.

[0154] It can be seen from Table 3 above that when the height of the connector 6f is 0.6mm, the thickness of the electrical connection plate 2c is 0.3mm, and the depth of the groove 11c is 0, the height L0 can be 0.9mm. When the height of the connector 6f is 0.6mm, the thickness of the electrical connection plate 2c is 0.3mm, and the depth of the groove 11c is 0.1mm, the height L0 can be 0.8mm. When the height of the connector 6f is 0.6mm, the thickness of the electrical connection plate 2c is 0.3mm, and the depth of the groove 11c is 0.2mm, the height L0 can be 0.7mm. When the height of the connector 6f is 0.6mm, the thickness of the electrical connection plate 2c is 0.3mm, and the depth of the groove 11c is 0.3mm, the height L0 can be 0.6mm. When the height of the connector 6f is 0.6mm, the thickness of the electrical connection plate 2c is 0.3mm, and the depth of the groove 11c is 0.4mm, the height L0 can be 0.5mm.

[0155] When the height of the connector 6f is 0.5mm, the thickness of the electrical connection plate 2c is 0.3, and the depth of the groove 11c is 0, the height L0 can be 0.8mm. When the height of the connector 6f is 0.5mm, the thickness of the electrical connection plate 2c is 0.3mm, and the depth of the groove 11c is 0.1mm, the height L0 can be 0.7mm. When the height of the connector 6f is 0.5mm, the thickness of the electrical connection plate 2c is 0.3mm, and the depth of the groove 11c is 0.2mm, the height L0 can be 0.6mm. When the height of the connector 6f is 0.5mm, the thickness of the electrical connection plate 2c is 0.3mm, and the depth of the groove 11c is 0.3mm, the height L0 can be 0.5mm. When the height of the connector 6f is 0.5mm, the thickness of the electrical connection plate 2c is 0.3mm, and the depth of the groove 11c is 0.4mm, the height L0 can be 0.4mm.

[0156] Therefore, in this embodiment, a 0.6mm connector 6f and an electrical connection plate 2c with the minimum thickness can be used to achieve a height of 0.5mm-0.9mm. A 0.5mm connector 6f and an electrical connection plate 2c with the minimum thickness can be used to achieve a height of 0.4mm-0.8mm. Without replacing the connector 6f, a wider adjustable range of the height can be achieved. While improving the bending shape of the flexible circuit board 5f, there is no need to customize the connector 6f, thereby saving the preparation cost of the connector 6f.

[0157] In some embodiments, the number of electrical connection boards can be appropriately increased to increase the range of height configuration. Fig.15The schematic diagram of the circuit board assembly 10c in another embodiment is shown, and the circuit board assembly 10c includes a main board 1c, an electrical connection board 2c, a connector 6f and a flexible circuit board 5f. Along the thickness direction Z of the electronic device 100, the main board 1c is provided with a groove 11c, and the groove 11c is the above-mentioned recessed structure. The electrical connection board 2c includes a first board 21c and a second board 22c, a part of the structure of the first board 21c is arranged in the groove 11c, the second board 22c is arranged on the first board 21c, and the first board 21c is electrically connected to the second board 22c. The male end 61f of the connector 6f is installed on the second board 22c, and the female end 62f of the connector 6f is installed on the flexible circuit board 5f. The female end 62f of the connector 6f and the male end 61f are plugged together to realize the connection between the flexible circuit board 5f and the connector 6f.

[0158] In this embodiment, a 0.6mm connector 6f can be used to achieve a height L0 of 0.8mm-1.2mm, and a 0.5mm connector 6f can be used to achieve a height L0 of 0.7mm-1.1mm.

[0159] Another example: Fig.16 The schematic diagram of the circuit board assembly 10c in another embodiment is shown, and the circuit board assembly 10c includes a main board 1c, an electrical connection board 2c, a connector 6f and a flexible circuit board 5f. Along the thickness direction Z of the electronic device 100, the main board 1c is provided with a groove 11c, and the groove 11c is the above-mentioned concave structure. The electrical connection board 2c includes a first board 21c, a second board 22c, a third board 23c and a fourth board 24c, a part of the structure of the first board 21c is arranged in the groove 11c, the second board 22c is arranged on the first board 21c, the third board 23c is arranged on the second board 22c, and the fourth board 24c is arranged on the third board 23c, and the first board 21c, the second board 22c, the third board 23c and the fourth board 24c are electrically connected. The male end 61f of the connector 6f is installed on the fourth board 24c, and the female end 62f of the connector 6f is installed on the flexible circuit board 5f. The flexible circuit board 5f is connected to the connector 6f by plugging and fitting the female end 62f of the connector 6f with the male end 61f.

[0160] Of course, the number of electrical connection plates 2c can be stacked in three or five layers, etc., which can be determined according to actual conditions and is not limited in this embodiment.

[0161] In this embodiment, the range of height matching is further refined by increasing the number of electrical connection plates 2c and the matching of the electrical connection plates 2c with the grooves 11c on the main board 1c.

[0162] The following Tables 4 and 5 show the selection of standard connector 6f and minimum thickness electrical connection board 2c. Fig.16The illustrated embodiment shows a comparison of the height L0 that can be satisfied when the groove 11 c is provided and the height L0 that can be satisfied when the groove 11 c is not provided.

[0163] Table 4

[0164]

[0165] Table 5

[0166]

[0167] It should be noted that since the connector 6f is a standard part, the height of the connector 6f is generally fixed (for example, 0.5mm, 0.6mm) and cannot be changed at will as needed. The electrical connection board 2c has a minimum thickness limit, because the processing process and rigidity have an impact. The minimum thickness of the electrical connection board 2c without plastic packaging is generally 0.3mm.

[0168] It can be seen from Table 4 above that when the height of the connector 6f is 0.6mm, the total thickness of the electrical connection plate 2c is 1.2mm (0.3×4), and the depth of the groove 11c is 0, the height L0 can be 1.8mm. When the height of the connector 6f is 0.6mm, the total thickness of the electrical connection plate 2c is 1.2mm, and the depth of the groove 11c is 0.1mm, the height L0 can be 1.7mm. When the height of the connector 6f is 0.6mm, the total thickness of the electrical connection plate 2c is 1.2mm, and the depth of the groove 11c is 0.2mm, the height L0 can be 1.6mm. When the height of the connector 6f is 0.6mm, the total thickness of the electrical connection plate 2c is 1.2mm, and the depth of the groove 11c is 0.3mm, the height L0 can be 1.5mm. When the height of the connector 6f is 0.6mm, the total thickness of the electrical connection plate 2c is 0.9mm, and the depth of the groove 11c is 0.0.4mm, the height L0 can be 1.1mm.

[0169] When the height of the connector 6f is 0.5mm, the total thickness of the electrical connection plate 2c is 1.2mm, and the depth of the groove 11c is 0, the height L0 can be 1.7mm. When the height of the connector 6f is 0.5mm, the total thickness of the electrical connection plate 2c is 1.2mm, and the depth of the groove 11c is 0.1mm, the height L0 can be 1.6mm. When the height of the connector 6f is 0.5mm, the total thickness of the electrical connection plate 2c is 1.2mm, and the depth of the groove 11c is 0.2mm, the height L0 can be 1.5mm. When the height of the connector 6f is 0.5mm, the total thickness of the electrical connection plate 2c is 1.2mm, and the depth of the groove 11c is 0.3mm, the height L0 can be 1.4mm. When the height of the connector 6f is 0.5mm, the total thickness of the electrical connection plate 2c is 1.2mm, and the depth of the groove 11c is 0.4mm, the height L0 can be 1.3mm. When the height of the connector 6f is 0.5mm, the total thickness of the electrical connection plate 2c is 0.9mm, and the depth of the groove 11c is 0.0.2mm, the height L0 can be 1.2mm.

[0170] It can be seen from Table 5 above that when the height of the connector 6f is 0.6mm, the total thickness of the electrical connection plate 2c is 1.2mm, and the depth of the groove 11c is 0, the height L0 can be 1.8mm. When the height of the connector 6f is 0.5mm, the total thickness of the electrical connection plate 2c is 1.2mm, and the depth of the groove 11c is 0, the height L0 can be 1.7mm.

[0171] Therefore, by comparing the data in Table 4 (this embodiment) with those in Table 5 (comparative example), the embodiment can achieve a height L0 of 1.1 mm to 1.8 mm with an interval of 0.1 mm after the groove 11c is set, while the comparative example can only achieve a height of 1.7 mm and 1.8 mm without the groove 11c. The embodiment can achieve a wider adjustable range of height by matching the electrical connection plate 2c with the groove 11c.

[0172] In the above embodiments, the mainboard is provided with a groove for accommodating the electrical connection board. In other embodiments, the mainboard may be provided with more than one groove for accommodating the electrical connection board.

[0173] Specifically, in some embodiments, Fig.17 The figure shows a top view of the main board 1c. The main board 1c is provided with a first groove 12c, a second groove 13c and a cloth area 14c (indicated by a dotted box in the figure). The cloth area 14c is located between the first groove 12c and the second groove 13c. Elements are arranged in the cloth area 14c. The first groove 12c and the second groove 13c are the above-mentioned recessed structures.

[0174] Fig.18 Shown is the use of Fig.17A schematic diagram of a circuit board assembly 10c of the main board 1c in another embodiment, please refer to Fig.17 and Fig.18 , the circuit board assembly 10c includes a main board 1c, an electrical connection board 2c, a connector 6f and a flexible circuit board 5f. The electrical connection board 2c includes a first board 21c, a second board 22c and a third board 23c, a part of the structure of the first board 21c is arranged in the first groove 12c, a part of the structure of the second board 22c is arranged in the second groove 13c, the third board 23c is arranged on the first board 21c and the second board 22c, and the third board 23c is electrically connected to both the first board 21c and the second board 22c. The third board 23c is connected to the male end 61f of the connector 6f. The female end 62f of the connector 6f is installed on the flexible circuit board 5f, and the connection between the flexible circuit board 5f and the connector 6f is realized by plugging and matching the female end 62f of the connector 6f with the male end 61f.

[0175] In this embodiment, components need to be arranged in the layout area 14c on the main board 1c. In order to avoid the components arranged on the main board 1c, grooves are opened on both sides of the layout area 14c of the main board 1c to achieve component arrangement while meeting the arbitrary height matching of the flexible circuit board 5f.

[0176] In some embodiments, Fig.19 FIG. 2 is a schematic diagram of an electrical connection board 2c in another embodiment. Fig. 20 Shown is the use of Fig.19 China Electric Connection Board 2c and Fig.17 Schematic diagram of the circuit board assembly 10c of the main board 1c in another embodiment. Fig.17 , Fig.19 and Fig. 20 The electrical connection plate 2c includes a first plate 21c, a second plate 22c and a third plate 23c, and the third plate 23c is provided with an avoidance groove 231c.

[0177] The first board 21c is arranged in the first groove 12c, the second board 22c is arranged in the second groove 13c, and the third board 23c is arranged on the first board 21c and the second board 22c and connected to the male end 61f of the connector 6f. The female end 62f of the connector 6f is installed on the flexible circuit board 5f, and the flexible circuit board 5f is connected to the connector 6f by plugging and matching the female end 62f of the connector 6f with the male end 61f.

[0178] Among them, the depth of the first groove 12c is greater than the thickness of the first plate 21c, the depth of the second groove 13c is greater than the thickness of the second plate 22c, and the third plate 23c is provided with an avoidance groove 231c to avoid interference between the third plate 23c and the fabric area 14c, so as to ensure that the third plate 23c is electrically connected to the first plate 21c and the second plate 22c, and at the same time ensure that the cooperation between the electrical connection plate 2c and the main board 1c can meet the required height.

[0179] Please refer to Fig.21 , Fig.21 The schematic diagram of the circuit board assembly 10c in another embodiment is shown, and the circuit board assembly 10c includes a main board 1c, an electrical connection board 2c, a connector 6f and a flexible circuit board 5f. Along the thickness direction Z of the electronic device, the main board 1c has a through hole 15c arranged therethrough, and the through hole 15c is the above-mentioned recessed structure. The electrical connection board 2c includes a first board 21c and a second board 22c, the first board 21c is connected to the main board 1c, and blocks the bottom of the through hole 15c, and a part of the structure of the second board 22c is located in the through hole 15c and is arranged on the first board 21c. The first board 21c is electrically connected to the second board 22c. The male end 61f of the connector 6f is mounted on the second board 22c, and the female end 62f of the connector 6f is mounted on the flexible circuit board 5f. The flexible circuit board 5f is connected to the connector 6f by plugging and fitting the female end 62f of the connector 6f with the male end 61f.

[0180] Alternatively, in some embodiments, please refer to Fig. 22 , Fig. 22 FIG. 1 is a schematic diagram of a circuit board assembly 10c in another embodiment. Fig.21 On the basis of the embodiment shown, the electrical connection board 2c may further include a third board 23c, which is disposed on the second board 22c and is used to electrically connect the second board 22c and the connector 6f. Alternatively, the electrical connection board 2c may further include a fourth board, a fifth board, etc. stacked on the third board 23c according to the required configuration.

[0181] In the above embodiments, the main board is provided with a through hole for accommodating the electrical connection board. In other embodiments, the main board may be provided with more than one through hole for accommodating the electrical connection board.

[0182] Specifically, Fig.23 FIG. 1 is a schematic top view of the main board 1c. Fig.24 Shown is the use of Fig.23 Schematic diagram of the circuit board assembly 10c of the main board 1c in another embodiment. Fig.23 and Fig.24 The main board 1c is provided with a first hole 16c, a second hole 17c and a fabric area 14c (indicated by a dotted box in the figure). The first hole 16c and the second hole 17c penetrate the main board 1c along the thickness direction Z of the electronic device. The fabric area 14c is located between the first hole 16c and the second hole 17c. Components are arranged in the fabric area 14c. The first hole 16c and the second hole 17c are the above-mentioned recessed structures.

[0183] The circuit board assembly 10c includes a main board 1c, an electrical connection board 2c, a connector 6f and a flexible circuit board 5f. The electrical connection board 2c includes a first board 21c, a second board 22c, a third board 23c and a fourth board 24c. The first board 21c is connected to the main board 1c and blocks the bottom of the first hole 16c and the second hole 17c. A part of the structure of the second board 22c is located in the first hole 16c, and a part of the structure of the third board 23c is located in the second hole 17c. The fourth board 24c is arranged on the first board 21c and the second board 22c. The first board 21c, the second board 22c / the third board 23c and the fourth board 24c are electrically connected. The fourth board 24c is connected to the male end 61f of the connector 6f. The female end 62f of the connector 6f is installed on the flexible circuit board 5f. The female end 62f of the connector 6f is plugged into and matched with the male end 61f to realize the connection between the flexible circuit board 5f and the connector 6f.

[0184] In summary, the electrical connection board is used to achieve the height matching of the connector, thereby adjusting the height difference between the two ends of the flexible circuit board. At the same time, the electrical connection board also needs to achieve electrical connection of the components connected to the two ends of the electrical connection board. Therefore, at least part of the structure of the electrical connection board can conduct electricity. Two specific embodiments of the electrical connection board are described in detail below.

[0185] In a specific embodiment, please continue to refer to Fig.25 and Fig.26 ,like Fig.25 FIG. 2 is a schematic diagram showing the structure of the electrical connection board 2c in a specific embodiment. Fig.26 for Fig.25 Schematic diagram from another perspective, the electrical connection board 2c is made of a conductor, that is, each position of the electrical connection board 2c can conduct electricity, for example, the electrical connection board can be a printed circuit board (PCB). In addition to being used for height matching, the electrical connection board 2c of this embodiment can also be used to arrange components of electronic equipment.

[0186] like Fig.25 and Fig.26 As shown, the electrical connection board 2c is provided with a first soldering pad 25c for soldering the connector. Due to the high density requirement of the internal space of the electronic device 100, the electrical connection board 2c can connect two or more connectors, and two or more first soldering pads 25c are provided accordingly.

[0187] In some embodiments, the electrical connection board 2c may be an existing circuit board in the electronic device, such as a sub-board. Specifically, the electronic device may include multiple PCBs, which are respectively used to arrange electronic components to realize the functions of each electronic component so that the electronic device can be used normally. Among them, at least part of the PCB of the electronic device can also be used for height matching, that is, at least part of the PCB can be used as an electrical connection board.

[0188] As shown in Table 6 below, the electronic device may include five PCBs, namely PCB1, PCB2, PCB3, PCB4, and PCB5. PCB2, PCB3, PCB4, and PCB5 are arranged on PCB1. PCB2, PCB3, PCB4, and PCB5 may be a proximity light board, an NFC spring plate, a wide-angle CAM plate, and an ambient light board, respectively. At least some of the five PCBs may be used as an electrical connection board 2c, such as a proximity light board, an NFC spring plate, a wide-angle CAM plate, and an ambient light board.

[0189] Table 6

[0190]

[0191] As shown in the table above, the fourth column indicates the hierarchy of each PCB, where "layer" refers to the number of conductive layers of the PCB. The conductive layer is the copper-covered part of the PCB that can transmit current and signals. The more "layers" a PCB has, the thicker it is. Therefore, PCB1 has more conductive layers, and a recessed structure can be made on PCB1.

[0192] "Order" refers to the number of layers of laser drilling on the PCB to achieve high-density circuit connection. According to the number of layers of laser drilling, PCB can be divided into first-order board, second-order board, third-order board, etc. Among them, the first-order board refers to a circuit board with only one layer of laser drilling, that is, a circuit board with only one layer of non-metallic holes. The second-order board refers to a circuit board with two layers of laser drilling, that is, a circuit board with two layers of non-metallic holes, and different layers of conductive layers can be connected through the two layers of non-metallic holes. The third-order board refers to a circuit board with three layers of laser drilling, that is, a circuit board with three layers of non-metallic holes, and different conductive layers can be connected through the three layers of non-metallic holes.

[0193] And, as shown in the above table, in some embodiments, in the assembly of the electronic device, when the proximity light board, NFC spring plate, wide-angle CAM plate and ambient light board are electrically connected to the flexible circuit board, part of the structure of the proximity light board, NFC spring plate, wide-angle CAM plate and ambient light board can be used as an electrical connection board to achieve a reasonable bending shape of the flexible circuit board. Correspondingly, the PCB that is secondary welded to the main board / sub-main board in the sixth column indicates that the PCB can be used as an electrical connection board and welded to the recessed structure on the main board / sub-main board. It should be noted that the above limitation is only a possible embodiment and does not constitute an absolute limitation on the scope of protection of the present application.

[0194] In other embodiments, a portion of the electrical connection plate is conductive and a portion of the electrical connection plate is insulated. Fig. 27The figure shows a cross-sectional schematic diagram of another embodiment of the electrical connection plate 2c, wherein the electrical connection plate 2c includes a conductive portion 26c (represented by a black column in the figure) and a covering portion 27c covering the conductive portion 26c. The covering portion 27c may be an injection molded part, and the conductive portion 26c is a conductive metal (such as a copper column) embedded in the covering portion 27c, and the conductive portion 26c is arranged to penetrate the covering portion 27c.

[0195] like Fig.28 Shown Fig. 27 The conductive part of the middle electrical connection board 2c has first pads 25c on two surfaces distributed along the thickness direction Z of the electronic device. The electrical connection board 2c is respectively fixed to the connector and the mainboard by welding through the first pads 25c on two surfaces.

[0196] like Fig.29 To adopt Fig. 27 A schematic diagram of a circuit board assembly 10c of an electrical connection board 2c in another embodiment, wherein the circuit board assembly 10c includes a main board 1c, an electrical connection board 2c, a connector 6f and a flexible circuit board 5f. Along the thickness direction Z of the electronic device 100, the main board 1c is provided with a groove 11c, and the groove 11c is the above-mentioned recessed structure. Part of the structure of the electrical connection board 2c is arranged in the groove 11c, wherein one end of the conductive portion 26c is electrically connected to the main board 1c, and the other end of the conductive portion 26c is electrically connected to the male end 61f of the connector 6f. The female end 62f of the connector 6f is mounted on the flexible circuit board 5f, and the connection between the flexible circuit board 5f and the connector 6f is achieved by plugging and fitting the female end 62f of the connector 6f with the male end 61f.

[0197] In this embodiment, the electrical connection plate 2c can be formed by injection molding, and during the injection molding process, the conductive metal is embedded in the injection molded part to form a structure including a conductive portion and a coating portion. The minimum thickness of the electrical connection plate 2c can be 0.1 mm, and the thickness of the electrical connection plate 2c can also be made according to actual needs. For example, the thickness of the electrical connection plate 2c can be made into a standard part of 0.1 mm-0.3 mm, and the electrical connection plate 2c can be stacked according to the required height, shortening the production time and reducing the production cost.

[0198] It should be noted that the electronic device may include one camera module or multiple camera modules. The following description assumes that the electronic device includes two camera modules.

[0199] like Fig.30The figure shows a schematic diagram of two camera modules of an electronic device connected to a mainboard. The electronic device includes two flexible circuit boards, the two flexible circuit boards are a first flexible circuit board 51f and a second flexible circuit board 52f, and the two camera modules are a first camera module 101f and a second camera module 102f. The first flexible circuit board 51f connects the mainboard 1c and the first camera module 101f, and the second flexible circuit board 52f connects the mainboard 1c and the second camera module 102f. Fig.30 It can be seen that along the width direction X of the electronic device, since the distance between the first camera module 101f and the main board 1c is smaller than the distance between the second camera module 102f and the main board 1c, the bending shapes of the first flexible circuit board 51f and the second flexible circuit board 52f are different.

[0200] Please refer to the configuration of the first flexible circuit board 51f and the second flexible circuit board 52f. Fig.31 The first flexible circuit board 51f includes a first connection end 511f, a second connection end 512f and a first bending section 513f connected therebetween, and the second flexible circuit board 52f includes a third connection end 521f, a fourth connection end 522f and a second bending section 523f connected therebetween. Fig.30 and Fig.31 The first connection end 511f of the first flexible circuit board 51f is used to connect to the first camera module 101f, the second connection end 512f is used to connect to the main board 1c, the third connection end 521f of the second flexible circuit board 52f is used to connect to the second camera module 102f, and the fourth connection end 522f is used to connect to the main board 1c.

[0201] Since the distance between the first camera module 101f and the main board 1c is smaller than the distance between the second camera module 102f and the main board 1c along the width direction X of the electronic device, the distance between the first connection end 511f and the second connection end 512f of the first flexible circuit board 51f is smaller than the distance between the third connection end 521f and the fourth connection end 522f of the second flexible circuit board 52f. Fig.30 In the embodiment shown, after the first flexible circuit board 51f and the second flexible circuit board 52f are bent, the first bending section 513f of the first flexible circuit board 51f is closer to the main board 1c, and the first bending section 513f of the first flexible circuit board 51f interferes with the main board 1c. The main board 1c (the outline of the main board is as shown in FIG. Fig.30 As shown by the thick solid line in the figure, part of the structure needs to be hollowed out (indicated by the dotted line in the figure) to avoid the first flexible circuit board 51f, but components cannot be arranged in the hollowed-out part of the main board 1c, which affects the utilization rate of the main board 1c.

[0202] The above technical problem can be solved by changing the bending shape of the first flexible circuit board 51f, so that the first bending section 513f of the first flexible circuit board 51f does not interfere with the main board 1c, thereby eliminating the need to hollow out the main board 1c. Specifically, the method of adjusting the bending shape of the flexible circuit board described in the above embodiments can be adopted, that is, an electrical connection board can be added between the main board 1c and the second connection end 512f of the first flexible circuit board 51f, and a recessed structure can be provided on the main board 1c. The position of the second connection end 512f along the thickness direction of the electronic device can be adjusted by combining the electrical connection board and the recessed structure, thereby adjusting the distance between the first connection end 511f and the second connection end 512f along the thickness direction of the electronic device, thereby changing the bending shape of the first flexible circuit board 51f, so that the first bending section 513f of the first flexible circuit board 51f does not interfere with the main board 1c.

[0203] It should be noted that the connection method of the flexible circuit board, the connector, the electrical connection board and the main board in the above embodiments can all be welded. Fig.14 The illustrated embodiment is used as an example to illustrate the welding process, and other embodiments are similar.

[0204] Please refer to Fig.32 , Fig.32 for Fig.14 The schematic diagram of the welding process of the embodiment shown in the figure, the welding process of the circuit board assembly 10c may specifically include:

[0205] S1: Weld the male end 61f of the connector 6f to the first pad 25c on the upper end surface of the electrical connection board 2c;

[0206] S2: making a groove 11c on the main board 1c, and spraying solder on the inner wall of the groove 11c;

[0207] S3: placing the electrical connection board 2c in the groove 11c of the main board 1c, and welding the first solder pad 25c on the outer periphery of the electrical connection board 2c to the solder on the inner wall of the groove 11c to form a concave solder joint structure to improve the structural strength;

[0208] S4: Solder the female end 62f of the connector 6f to the flexible circuit board 5f, and plug the female end 62f of the connector 6f into the male end 61f to achieve the snap-fit ​​of the connector 6f and complete the welding of the circuit board assembly 10c.

[0209] Among them, in step S3, when assembling the electrical connection board 2c and the main board 1c, the gap between the electrical connection board 2c and the inner wall of the groove 11c is HH, and HH can be 0.1mm≤HH≤1mm, so as to ensure that part of the structure of the electrical connection board 2c can be installed in the groove 11c. When the electrical connection board 2c and the groove 11c are welded, the solder can fill the gap between the two to ensure the connection strength. After step S4, the circuit board assembly 10c can be installed in the electronic device 100.

[0210] Specifically, a reinforcing plate 53f can also be provided on the side of the flexible circuit board 5f away from the female end 62f to improve the flexibility of the flexible circuit board 5f, improve the strength of the plug-in part of the flexible circuit board 5f, and facilitate the flexible circuit board 5f to plug the female end 62f of the connector 6f onto the male end 61f of the connector 6f.

[0211] Alternatively, in some embodiments, a hard board connector may be used to replace the connector described above to connect the flexible circuit board and the electrical connection board. The specific connection process may be: one end of the flexible circuit board is inserted into the hard board connector and snap-fitted with the hard board connector, and the hard board connector is welded and fixed to the electrical connection board.

[0212] It can be understood that the hard board connector is an existing hard board connector structure, and the specific structure of this embodiment will not be repeated here.

[0213] It should be noted that the flexible circuit board described in the above embodiments can be made of a flexible material as a whole, or can be made of a partially flexible material and a partially rigid material. The following will describe possible structures and materials of the flexible circuit board in conjunction with the accompanying drawings.

[0214] like Fig.33 The figure shows a schematic diagram of the structure of a flexible circuit board 5f in an embodiment, and the flexible circuit board 5f can be a soft-hard combination board. Specifically, the flexible circuit board 5f includes a deformation section 54f and a first connecting section 55f and a second connecting section 56f connected at both ends of the deformation section 54f, and the deformation section 54f is electrically connected to the first connecting section 55f and the second connecting section 56f. The deformation section 54f is a soft material, and the first connecting section 55f and the second connecting section 56f are hard materials.

[0215] The first connecting section 55f and the second connecting section 56f are respectively used to connect with electronic components. For example, when the flexible circuit board is used to connect the main board and the camera module, the first connecting section 55f is used to electrically connect with the connector on the main board, and the second connecting section 56f is used to electrically connect with the sensor of the camera module.

[0216] like Fig.34 Shown Fig.33 A cross-sectional diagram of Fig.34The serial numbers on the far right are used to mark the layers of the flexible circuit board. As can be seen from the figure, the flexible circuit board 5f includes multiple coatings, and the flexible circuit board 5f is a symmetrical structure with the serial number layer X as the base layer. Fig.34 The area indicated by the thick dotted line in the middle) is the first connecting section 55f, and the area B (such as Fig.34 The area indicated by the thick dashed line is the deformation section 54f, and the C area (as shown in FIG. Fig.34 The area indicated by the thick double-dotted dashed line in the middle is the second connecting section 56f. Since the deformation section 54f needs to have a certain bending shape, the deformation section 54f is not made of the same material as the first connecting section 55f and the second connecting section 56f, so that the hardness of the deformation section 54f is less than that of the first connecting section 55f and the second connecting section 56f. For example, this can be achieved by reducing the coating that improves the structural hardness in the deformation section 54f.

[0217] It can be understood that the first connecting section 55f and the second connecting section 56f are both provided with a second pad 551f for welding, and the second pad 551f penetrates multiple coatings (from the upper IV layer to the lower IV layer).

[0218] In some embodiments, Fig.34 The material and thickness of each coating of the flexible circuit board 5f can be specifically referred to in Table 7 below:

[0219] Table 7

[0220]

[0221] It should be noted that the materials and thicknesses of the various layers of the flexible circuit board in Table 7 above are merely a possible embodiment and do not constitute an absolute limitation on the protection scope of the present application.

[0222] Please continue to refer to Fig.33 The first connecting section 55f is located above the second connecting section 56f along the thickness direction Z of the electronic device 100. The deformation section 54f is in a bent shape, and the inner and outer corners formed by the bend are both smooth arc shapes.

[0223] After the deformation section 54f is bent, the radius of the arc formed at one end close to the first connecting section 55f is the first radius R1, and the radius of the arc formed at one end of the deformation section 54f close to the second connecting section 56f is the second radius R2.

[0224] In some embodiments, when the flexible circuit board 5f is used in a dynamic scene, when R1≤0.6mm, and / or, when R2≤0.6mm, the IX layer in the deformation section 54f can be made of HA copper, which has excellent bending properties to avoid the bending angles at both ends of the deformation section 54f being too small, resulting in the breakage of the two ends of the deformation section 54f. In other embodiments, when the flexible circuit board 5f is used in a static scene, when R1≤0.5, and / or, when R2≤0.6, the IX layer in the deformation section 54f can be made of HA copper.

[0225] Preferably, R1>1 mm, R2>1 mm.

[0226] In some embodiments, the copper coatings (such as layer IV, layer V, and layer IX) in the flexible circuit board 5f can all be made of 12μm HA copper foil. Among them, the cover film of layer VII is preferably a 12.5μm polyimide cover film, and the cover film of layer II is preferably a 15μm adhesive. It should be noted that the use of HA copper must use selective electroplating (hole copper electroplating) to increase the thickness of the copper layer in the hole and ensure reliable connection between the layers of the flexible circuit board.

[0227] Please continue to refer to Fig.33 In some embodiments, the minimum distance D1 between the first connecting segment 55f and the second connecting segment 56f is ≥ 2 mm to ensure that the deformation segment 54f has a reasonable bending shape.

[0228] The first connecting section 55f and the second connecting section 56f are both provided with a conductive hole 552f for conducting electricity, and the conductive hole 552f can electrically connect the conductive layer of the first connecting section 55f and the conductive layer of the second connecting section 56f. The minimum distance D2 between the conductive hole 552f and the deformable section 54f is greater than 0.5 mm, so as to avoid the conductive hole 552f and the deformable section 54f being electrically connected, which may cause circuit abnormality.

[0229] The minimum distance D3 between the line on the first connecting section 55f and the connection position between the first connecting section 55f and the deformation section 54f is greater than 0.25 mm, that is, there is a distance between the line on the first connecting section 55f and the deformation section 54f, so as to prevent the line on the first connecting section 55f from being bent during the bending process of the deformation section 54f. Similarly, the minimum distance D4 between the line on the second connecting section 56f and the connection position between the second connecting section 56f and the deformation section 54f is greater than 0.25 mm (D4 is the same as D3, and D3 in the figure can be referred to), that is, there is a distance between the line on the second connecting section 56f and the deformation section 54f, so as to prevent the line on the second connecting section 56f from being bent during the bending process of the deformation section 54f.

[0230] Fig.35The figure shows a schematic diagram of a flexible circuit board 5f in another embodiment. The flexible circuit board 5f can be made entirely of flexible materials, and the two ends of the flexible circuit board 5f are used to connect with electronic components. For example, when the flexible circuit board 5f is used to connect the main board and the camera module, the two ends of the flexible circuit board 5f are electrically connected to the connector on the main board and the sensor of the camera module respectively.

[0231] Fig.36 for Fig.35 A cross-sectional diagram of Fig.36 The serial numbers on the far right are used to mark the layers of the flexible circuit board. As can be seen from the figure, the flexible circuit board 5f includes multiple coatings, and the flexible circuit board 5f is a symmetrical structure with the serial number VI layer as the base layer. When the flexible circuit board 5f is in a bent state, the inner and outer corners formed by the bend are both smooth arcs.

[0232] It can be understood that the flexible circuit board 5f in the figure is provided with a third pad 57f for welding, and the third pad 57f runs through multiple coatings (from the upper IV layer to the lower IV layer). The III layer in the figure is provided with gold / nickel, and its main purpose is to block copper metal and air to prevent oxidation.

[0233] In some embodiments, Fig.36 The materials and thicknesses of the coatings of the flexible circuit board 5f can be specifically referred to in Table 8 below:

[0234] Table 8

[0235]

[0236] As can be seen from Table 8 above, it can be understood that the flexible circuit board 5f may not be provided with a layer IV of electroplated copper (button type). Alternatively, the flexible circuit board 5f may be provided with a layer IV of electroplated copper (button type), and the thickness of the electroplated copper (button type) is 3μm-150μm.

[0237] It should be noted that the materials and thicknesses of the various layers of the flexible circuit board in Table 8 above are merely a possible embodiment and do not constitute an absolute limitation on the protection scope of the present application.

[0238] The above is an embodiment of the circuit board assembly used in the camera module scenario. In other embodiments, the circuit board assembly can also be used in other scenarios of electronic devices. The following specifically describes the application of the circuit board assembly in the charging scenario of the electronic device.

[0239] like Fig.37The figure shows a schematic diagram of a charging scenario of an electronic device 100 (bar phone) in an embodiment, wherein the electronic device includes a main board 1c, a sub-board 1, a first battery 2, a first connector 3, a second connector 4, a third connector 5, a charging flexible circuit board 6, and a first battery flexible circuit board 7. The sub-main board 1c is provided with a charging port 1a. One end of the charging flexible circuit board 6 is electrically connected to the sub-board 1 through the first connector 3, and the other end of the charging flexible circuit board 6 is electrically connected to the main board 1c through the second connector 4. One end of the first battery flexible circuit board 7 is electrically connected to the main board 1c through the third connector 5, and the other end of the first battery flexible circuit board 7 is electrically connected to the first battery 2. That is, the charging current of the external charging line enters the sub-main board 1c through the charging port 1a, then enters the battery management chip of the main board 1c through the charging flexible circuit board 6, and finally enters the first battery 2 through the first battery flexible circuit board 7 to realize the charging function.

[0240] Among them, in some embodiments, the height of the secondary board 1 and the first battery 2 along the thickness direction Z of the electronic device may be different, so that the part of the structure of the charging flexible circuit board 6 connected to the first connector 3 is bent (the rest may be straight). In order to improve the bending shape of the charging flexible circuit board 6 and reduce the risk of its breakage, the height can be adjusted by the mutual cooperation of the electrical connection board and the recessed structure to meet the charging flexible circuit board 6 with a reasonable bending shape and extend the service life of the charging flexible circuit board 6.

[0241] Similarly, the main board 1c and the first battery 2 have different heights along the thickness direction Z of the electronic device, so that part of the structure of the charging flexible circuit board 6 connected to the second connector 4 is bent. In order to improve the bending shape of the charging flexible circuit board and reduce the risk of its breakage, the height can be adjusted by the cooperation between the electrical connection plate and the recessed mechanism to ensure that the charging flexible circuit board 6 has a reasonable bending shape and prolong the service life of the charging flexible circuit board 6.

[0242] Similarly, the main board 1c and the first battery 2 have different heights along the thickness direction Z of the electronic device, so that part of the structure of the first battery flexible circuit board 7 connected to the third connector 5 is bent. In order to improve the bending shape of the first battery flexible circuit board 7 and reduce the risk of its breakage, the height can be adjusted by the cooperation between the electrical connection plate and the recessed mechanism to ensure that the battery flexible circuit board has a reasonable bending shape and extend the service life of the first battery flexible circuit board 7.

[0243] like Fig.38 FIG. 1 is a schematic diagram of another embodiment of a charging scenario of an electronic device 100 (double folding device), and FIG. Fig.37 The difference from the illustrated embodiment is that the electronic device 100 comprises a first folding portion 8 , a second folding portion 9 and a first rotating shaft 10 , and the first folding portion 8 and the second folding portion 9 are rotatably connected via the first rotating shaft 10 .

[0244] The structure of the first folding portion 8 can be referred to Fig.37 The second folding portion 9 is provided with a first through-axis flexible circuit board 11, a fourth connector 12, a fifth connector 13, a first sub-main board 15, a sixth connector 16, a second battery 17 and a second battery flexible circuit board 18. One end of the first through-axis flexible circuit board 11 passes through the first rotating shaft 10 and is electrically connected to the main board 1c through the fourth connector 12, and the other end is connected to the first sub-main board 15 through the fifth connector 13. One end of the second charging flexible circuit board 6 is electrically connected to the sub-main board 1c through the sixth connector 16, and the other end is welded to the second battery 17.

[0245] In this embodiment, the partial structure of each flexible circuit board connected to the corresponding connector may be bent. In order to improve the bending shape of each flexible circuit board and reduce the risk of breakage, the height can be adjusted by cooperating with the electrical connection plate and the recessed structure so that the flexible circuit board has a reasonable bending shape. The specific content can be referred to above and will not be repeated in this embodiment.

[0246] like Fig.39 The figure shows a schematic diagram of another embodiment of a charging scene of an electronic device (a three-folding device). Fig.38 What is different from the illustrated embodiment is that the electronic device further comprises a third folding portion 19 and a second rotating shaft 20 , and the third folding portion 19 is rotatably connected to the first folding portion 8 via the second rotating shaft 20 .

[0247] The third folding portion 19 is provided with a second sub-main board 21, a second through-axis flexible circuit board 22, a seventh connector 23, an eighth connector 24, a third battery 25, a third battery flexible circuit board 26 and a ninth connector 27. The sub-board 1 is located below the second sub-main board 21. One end of the charging flexible circuit board 6 is electrically connected to the sub-board 1 through the first connector 3, and the other end is connected to the second sub-main board 21 through the second connector 4. One end of the third through-axis flexible circuit board 32 is electrically connected to the second sub-main board 21 through the seventh connector 23, and the other end passes through the second rotating shaft 20 and is electrically connected to the main board 1c through the eighth connector 24. One end of the flexible circuit of the third battery 25 is electrically connected to the second sub-main board 21 through the ninth connector 27, and the other end is welded to the third battery 25. The rest of the structure can be referred to. Fig.38 The contents of the illustrated embodiment will not be repeated in this embodiment.

[0248] In this embodiment, the partial structure of each flexible circuit board connected to the corresponding connector may be bent. In order to improve the bending shape of each flexible circuit board and reduce the risk of breakage, the height can be adjusted by cooperating with the electrical connection plate and the recessed mechanism so that the flexible circuit board has a reasonable bending shape. The specific content can be referred to above and will not be repeated in this embodiment.

[0249] Fig.40 The figure shows a schematic diagram of another embodiment of a charging scene of an electronic device (a three-folding device). Fig.39 The difference of the embodiment shown is that the sub-board 1 is located below the main board 1c, the first through-axis flexible circuit board 11 and the second through-axis flexible circuit board 22 are cancelled, and a three-way flexible circuit board 28 is used to electrically connect the main board 1c, the first sub-board 15 and the second sub-board 21. The rest of the structure can be referred to Fig.39 The contents of the illustrated embodiment will not be repeated in this embodiment.

[0250] In this embodiment, the partial structure of each flexible circuit board connected to the corresponding connector may be bent. In order to improve the bending shape of each flexible circuit board and reduce the risk of breakage, the height can be adjusted by cooperating with the electrical connection plate and the recessed mechanism so that the flexible circuit board has a reasonable bending shape. The specific content can be referred to above and will not be repeated in this embodiment.

[0251] Fig.41 The figure shows a schematic diagram of another embodiment of a charging scene of an electronic device (a four-folding device). Fig.38 What is different from the illustrated embodiment is that the electronic device further comprises a fourth folding portion 29 and a third rotating shaft 30 , and the fourth folding portion 29 is rotatably connected to the third folding portion 19 via the third rotating shaft 30 .

[0252] The fourth folding portion 29 is provided with a third sub-mainboard 31, a third through-axis flexible circuit board 32, a tenth connector 33, an eleventh connector 34, a fourth battery 35, a fourth battery flexible circuit board 36 and a twelfth connector 37. One end of the third through-axis flexible circuit board 32 passes through the third rotating shaft 30 and is electrically connected to the first sub-mainboard 15 through the tenth connector 33, and the other end is electrically connected to the third sub-mainboard 31 through the eleventh connector 34. One end of the fourth battery flexible circuit board 36 is electrically connected to the third sub-mainboard 31 through the twelfth connector 37, and the other end is welded to the fourth battery 35.

[0253] In this embodiment, the partial structure of each flexible circuit board connected to the corresponding connector may be bent. In order to improve the bending shape of each flexible circuit board and reduce the risk of breakage, the height can be adjusted by cooperating with the electrical connection plate and the recessed mechanism so that the flexible circuit board has a reasonable bending shape. The specific content can be referred to above and will not be repeated in this embodiment.

[0254] In practical applications, in addition to the above-mentioned scenarios, the circuit board assembly can also be used in other scenarios where the height needs to be adjusted so that the flexible circuit board in the circuit board assembly has a reasonable bending shape.

[0255] In addition, it should be noted that the above description uses the example of a flexible circuit board and a circuit board (such as a main board) being connected via a connector. In other embodiments, the second connection section of the flexible circuit board and the circuit board may also be connected via other methods, including but not limited to welding, connection via conductive tape, crimping, and magnetic connection. It is understandable that when the second connection section of the flexible circuit board and the circuit board are connected by a method other than a connector, the above-described method of adding an electrical connection board or adding an electrical connection board and a recessed structure to the circuit board assembly may also be used to adjust the distance between the second connection section of the flexible circuit board and the circuit board, thereby adjusting the bending shape of the flexible circuit board.

[0256] The above description is based on the example of the flexible circuit board and the electrical connection board being connected by a connector. In other embodiments, the flexible circuit board and the electrical connection board may also be connected by welding. Alternatively, the flexible circuit board and the electrical connection board may also be connected by bonding. The same or similar parts between the various embodiments in this specification may be referred to each other. In particular, for the device embodiment and the terminal embodiment, since they are basically similar to the method embodiment, the description is relatively simple.

[0257] The above is only a specific implementation of the embodiment of the present application, but the protection scope of the embodiment of the present application is not limited thereto, and any changes or replacements within the technical scope disclosed in the embodiment of the present application should be included in the protection scope of the embodiment of the present application. Therefore, the protection scope of the embodiment of the present application should be based on the protection scope of the claims.

Claims

1. A circuit board assembly, characterized in that: The circuit board assembly comprises: Circuit boards; An electrical connection plate, which is mounted on the circuit board along the thickness direction of the circuit board assembly and is electrically connected to the circuit board; A flexible circuit board, at least part of which is a flexible structure, comprising a first connecting section and a second connecting section, wherein the first connecting section is used to connect to a device of an electronic device, and the second connecting section is connected to the electrical connection board, and the electrical connection board is used to adjust the distance between the second connecting section and the circuit board along the thickness direction of the circuit board assembly; The circuit board is provided with a recessed structure recessed along the thickness direction of the circuit board assembly; Part of the structure of the electrical connection plate is accommodated in the recessed structure, and the electrical connection plate and the recessed structure are used to adjust the distance between the second connection section and the circuit board along the thickness direction of the circuit board assembly.

2. The circuit board assembly according to claim 1, characterized in that: The recessed structure includes at least one groove.

3. The circuit board assembly according to claim 1, characterized in that: The recessed structure comprises a first groove and a second groove which are spaced apart from each other, and the circuit board is further provided with a fabric area located between the first groove and the second groove; The electrical connection plate includes a first plate, a second plate and a third plate, a part of the structure of the first plate is accommodated in the first groove, a part of the structure of the second plate is accommodated in the second groove, the third plate is arranged on the first plate and the second plate and is electrically connected to the first plate and the second plate, and the third plate is also electrically connected to the second connection section; A gap is provided between the third plate and the layout area along the thickness direction of the circuit board assembly.

4. The circuit board assembly according to claim 3, characterized in that: When the depth of the first groove is greater than the thickness of the first plate and the depth of the second groove is greater than the thickness of the second plate, the third plate is provided with an avoidance groove for avoiding the fabric area.

5. The circuit board assembly according to claim 1, characterized in that: The recessed structure is a through hole penetrating the circuit board along the thickness direction of the circuit board.

6. The circuit board assembly according to claim 5, characterized in that: The recessed structure includes a first hole, the electrical connection plate includes a first plate and a second plate, the first plate is connected to the circuit board and blocks the first hole from the bottom; One end of the second plate is connected to the first plate, and the other end of the second plate extends out of the through hole and is electrically connected to the second connecting section.

7. The circuit board assembly according to claim 5, characterized in that: The recessed structure includes a first hole and a second hole, and the circuit board is further provided with a fabric area located between the first hole and the second hole; The electrical connection board includes a first board, a second board, a third board and a fourth board, the first board and the fourth board are distributed along the thickness direction of the circuit board assembly, and the second board and the third board are located between the first board and the fourth board and connected to the two; The first plate is connected to the circuit board and blocks the first hole and the second hole from the bottom, a portion of the structure of the second plate is located in the first hole, a portion of the structure of the third plate is located in the second hole, the fourth plate is electrically connected to the second connecting section, and a gap is provided between the fourth plate and the fabric area along the thickness direction of the circuit board assembly.

8. The circuit board assembly according to any one of claims 1 to 7, characterized in that: The electrical connection board is a PCB board; or, The electrical connection plate includes a conductive portion and a covering portion, wherein the conductive portion is located inside the covering portion and both ends of the conductive portion along the thickness direction of the circuit board assembly are exposed from the covering portion, and the electrical connection plate is electrically connected to the circuit board and the second connection section through the conductive portion.

9. The circuit board assembly according to any one of claims 1 to 7, characterized in that: The flexible circuit board includes a deformation section, and the deformation section is located between the first connecting section and the second connecting section and is connected to the two; The first connecting section and the second connecting section are made of hard material.

10. The circuit board assembly according to claim 9, characterized in that: After the deformation section is bent, the radius of the arc formed by one end of the deformation section close to the first connecting section is a first radius R1, and the radius of the arc formed by one end of the deformation section close to the second connecting section is a second radius R2; When R1≤0.6mm, and / or R2≤0.6mm, the copper material in the flexible circuit board is HA copper.

11. The circuit board assembly according to claim 9, characterized in that: A minimum distance D1 between the first connecting section and the second connecting section is ≥2 mm.

12. The circuit board assembly according to claim 9, characterized in that: The minimum distance D2 between the conductive hole on the first connecting section and the deformable section is greater than 0.5 mm; The minimum distance D2 between the conductive hole on the second connecting section and the deformation section is greater than 0.5 mm.

13. The circuit board assembly according to claim 9, characterized in that: The minimum distance D3 between the line on the first connecting section and the connecting position of the first connecting section and the deformation section is greater than 0.25 mm; A minimum distance D4 between the line on the second connecting segment and a connecting position between the second connecting segment and the deformation segment is greater than 0.25 mm.

14. The circuit board assembly according to claim 9, characterized in that: Along the arrangement direction of the components of the electronic device and the electrical connection board, the climbing angle C of the flexible circuit board satisfies: 0°≤C≤80°.

15. An electronic device, characterized in that: The electronic device comprises the circuit board assembly according to any one of claims 1 to 14.

16. The electronic device according to claim 15, characterized in that: The electronic device includes a main board and a camera module, the camera module includes a lens, a lens mount and a sensor, the sensor is connected to the bottom of the lens mount, the main board is a circuit board of the circuit board assembly, the first connecting section of the flexible circuit board is electrically connected to the sensor, and the second connecting section of the flexible circuit board is electrically connected to the electrical connection board via a connector.

17. The electronic device according to claim 15, characterized in that: The electronic device includes a main board, a charging module and a sub-board, the charging module includes a battery, the main board and the sub-board are circuit boards of the circuit board assembly, the first connecting section of the flexible circuit board is connected to the battery, and the second connecting section of the flexible circuit board is connected to the electrical connection board through a connector.

Citation Information

Patent Citations

  • Electronic equipment and circuit board

    CN115003019A

  • Electronic device including interposer

    US20190082536A1