Display panel and display device

Abstract

The application relates to the technical field of display, and particularly provides a display panel and a display device, the display panel has a hole area; the display panel further comprises a substrate, isolation columns and an encapsulation layer, the isolation columns are located in the hole area, the isolation columns are arranged on one side surface of the substrate and at least one side of each isolation column in a circumferential direction of the isolation column is provided with a raised layer; the encapsulation layer comprises a first inorganic film layer which is stacked with the substrate along a first direction, the first direction is a thickness direction of the substrate, and the raised layer and the isolation columns are both located between the substrate and the first inorganic film layer. The raised layer arranged on at least one side in the circumferential direction of the isolation column can help to reduce the height difference between the isolation column and the adjacent area on the circumferential side of the isolation column in the first direction, the raised layer and the first inorganic film layer can overcome the defects caused by the problem of the excessively large side etching amount of the isolation column, play a planarization role, improve the film forming quality of the first inorganic film layer, reduce the possibility of abnormal defects such as the gap of the first inorganic film layer at the isolation column, and avoid panel failure.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of display, more particularly, relates to a display panel and a display device. BACKGROUND

[0002] An organic light emitting diode (OLED) display panel is a display device that uses the self-luminous principle of organic light emitting materials to realize display; it has the advantages of fast response speed, high brightness, full view angle, etc., and thus becomes a type of display panel with great competitiveness and good development prospects. In order to improve the screen ratio of the display panel, the display panel has a hole region, and the hole region is separated from a display region by an isolation region. However, the existing display panel is easy for water vapor to enter and affect the display effect of the panel. SUMMARY

[0003] The present application aims to at least solve one of the technical problems in the related art to some extent.

[0004] To this end, the present application provides a display panel and a display device to solve the technical problem that water vapor is easy to enter and affect the display effect in the prior art.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present application is to provide a display panel, the display panel has a hole region; the display panel further comprises a substrate, an isolation column and an encapsulation layer, the isolation column is located in the hole region, the isolation column is arranged on one side surface of the substrate, and at least one side of the isolation column in the circumferential direction is provided with a raised layer; the encapsulation layer comprises a first inorganic film layer stacked with the substrate along a first direction, the first direction is the thickness direction of the substrate, and the raised layer and the isolation column are both located between the substrate and the first inorganic film layer.

[0006] In the embodiments provided in the present application, the display panel can realize the sealing of the isolation column part through the first inorganic film layer in the encapsulation layer, so as to guarantee that the display panel can be effectively encapsulated in the hole region, avoid water vapor intrusion, and ensure that the panel can display normally; the raised layer located on one side of the isolation column in the circumferential direction can help to reduce the difference in height between the isolation column and the circumferential region in the first direction, and cooperate with the first inorganic film layer to overcome the defects caused by the large side etching amount of the isolation column and the like, so as to play a planarization role and make the surface of the hole region more flat. The raised layer helps the deposition and processing of the subsequent film layer, especially the first inorganic film layer, thereby effectively improving the film formation quality of the first inorganic film layer located thereon, reducing the possibility of abnormal defects such as gaps of the first inorganic film layer at the isolation column, and avoiding panel failure.

[0007] Optionally, in the first direction, the end face of the elevation layer towards one end of the first inorganic film layer is flush with the end face of the isolation column towards one end of the first inorganic film layer.

[0008] Optionally, the display panel further comprises a display layer, and the display layer is between the substrate and the encapsulation layer.

[0009] Optionally, the display panel further comprises a display area and an isolation area, the isolation area connects the hole area and the display area, the encapsulation layer further comprises a first organic film layer and a second inorganic film layer, the second inorganic film layer is between the substrate and the first inorganic film layer, and the first organic film layer is in the display area and on a side of the second inorganic film layer away from the substrate.

[0010] The isolation column is between the second inorganic film layer and the substrate, and the elevation layer is on a side of the second inorganic film layer away from the substrate.

[0011] Optionally, the display panel further comprises an encapsulation dam surrounding the hole area, the encapsulation dam is in the isolation area, and the second inorganic film layer covers the encapsulation dam.

[0012] Optionally, the first inorganic film layer is in the display area through the encapsulation dam and covers the first organic film layer.

[0013] Optionally, the encapsulation layer further comprises a third inorganic film layer, and the third inorganic film layer is stacked with the second inorganic film layer.

[0014] In the display area, the third inorganic film layer and the second inorganic film layer are respectively on two sides of the first organic film layer in the first direction.

[0015] In the hole area, the third inorganic film layer is on a side of the isolation column away from the substrate, and the elevation layer is on a side of the third inorganic film layer away from the substrate.

[0016] Optionally, the first inorganic film layer is connected with the third inorganic film layer covering the encapsulation dam.

[0017] Optionally, the display panel further comprises a planarization layer, and the planarization layer covers a side of the encapsulation layer away from the substrate.

[0018] The application further provides a display device, which comprises the display panel.

[0019] In the embodiments provided in the application, the display device has the display panel, and thus has at least the advantages of the display panel. For specific effects, refer to the foregoing description, which will not be repeated here.

[0020] The beneficial effects of the display panel and display device provided in this application are as follows: Compared with related technologies, the display panel provided in this application can reduce the height difference between the isolation pillar and its adjacent surrounding area in the first direction by setting a padding layer on at least one side of the isolation pillar in the circumferential direction. The padding layer and the first inorganic film layer can overcome the defects caused by the isolation pillar being too large on the side, making the isolation pillar and its adjacent surrounding area in the hole area relatively flat. The surface of the hole area with the padding layer is smoother, improving the film formation quality of the first inorganic film layer, reducing the possibility of gaps in the encapsulation layer, and avoiding panel failure. In addition, the above structure can also improve the durability of the encapsulation layer to a certain extent, giving the display panel a longer service life. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A plan view of the display panel provided in an embodiment of this application;

[0023] Figure 2 This is a schematic diagram of a first structure of a display panel provided in an embodiment of this application;

[0024] Figure 3 for Figure 2 Enlarged view of the structure of region I;

[0025] Figure 4 This is a schematic diagram of a second structure of the display panel provided in an embodiment of this application;

[0026] Figure 5 This is a schematic diagram of a third structure of the display panel provided in an embodiment of this application;

[0027] Figure 6 This is a schematic diagram of the structure of the display panel hole area provided in an embodiment of this application;

[0028] Figure 7 A simplified structural diagram of the display device provided in the embodiments of this application.

[0029] The following are the labeling elements in the figure:

[0030] A. Hole area; B. Display area; C. Isolation area; 10. Display panel;

[0031] 1, substrate; 2, isolation column; 3, groove; 4, pad layer; 5, encapsulation layer; 51, first inorganic film layer; 52, first organic film layer; 53, second inorganic film layer; 54, third inorganic film layer; 6, display layer; 7, encapsulation dam; 8, planarization layer. DETAILED DESCRIPTION

[0032] In order to make the technical problems to be solved, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not intended to limit the present application.

[0033] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0034] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0035] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0036] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected or in communication with each other; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication or interaction relationship of two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0037] In the present application, unless specifically stated and limited otherwise, a first feature is "on" or "under" a second feature can mean that the first and second features are in direct contact, or the first and second features are in indirect contact with an intervening medium. Also, a first feature "over", "above" and "on top of" a second feature can mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. A first feature "under", "below" and "underneath" a second feature can mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is horizontally lower than the second feature.

[0038] In the present application, the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" mean that a particular feature, structure, material, or characteristic is included in at least one embodiment or example of the present application. The illustrative appearances of the above-mentioned terms in the description are not necessarily the same. Also, the described specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples described in the specification and the features of different embodiments or examples without contradiction.

[0039] The term "substrate" used herein refers to a material on which a subsequent layer of material is added to provide a bearing base for the layers above it. In some embodiments, the substrate can be flexible, stretchable, foldable, bendable or rollable, so that the display panel can be flexible, stretchable, foldable, bendable or rollable. The material of the substrate can be formed of any suitable insulating material with flexibility, such as polyimide (PI), polycarbonate (P), polyether sulfone (PES), and also polymeric materials such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyarylate (PR) or glass fiber reinforced plastic (FRP). The substrate can be transparent, translucent or opaque. In some other embodiments, the substrate can also be hard, made of hard insulating materials such as metal, ultra-thin glass, plastic or sapphire wafer, etc. The substrate itself can be patterned, the material added on top of the substrate can be patterned, or it can remain unpatterned.

[0040] As used herein, the term "layer" can refer to a portion of material that includes a region having a thickness. A layer can extend over an entire underlying or overlying structure, or can have a scope less than the scope of an underlying or overlying structure. Additionally, a layer can be a region of a continuous structure that is homogeneous or inhomogeneous and that has a thickness less than the thickness of the continuous structure. For example, a layer can be between or at any pair of lateral planes between a top surface and a bottom surface of the continuous structure. A layer can extend laterally, vertically, and / or along a tapered surface. A substrate can be a layer, can include one or more layers therein, and / or can have one or more layers thereon, thereabove, and / or therebelow. A layer can include a plurality of layers. For example, an interconnect layer can include one or more conductor and contact layers (within which contacts, interconnect lines, and / or vias are formed) and one or more dielectric layers.

[0041] With the OLED display panel as an example, with the continuous improvement of product performance, the reliability requirement of the hole area A is also continuously improved. In the related technology, the display layer 6 located in the area is blocked by setting the isolation column 2 in the hole area A, and the encapsulation layer 5 is covered outside the isolation column 2 to protect the hole area A and the display area B, avoid the intrusion of water vapor and oxygen, and affect the normal display of the display panel 10. In the process of implementing the present application, the inventors found that in the related technology, the side etching amount of the isolation column 2 in the hole area A is large, and the CVD film layer is thin, which causes the CVD layer (Chemical Vapor Deposition, a thin film structure processed by a chemical vapor deposition process) at the corresponding position to have a gap after film formation, and further causes encapsulation failure. In the reliability test, water vapor can penetrate from the above-mentioned gap, causing the display panel 10 to have black spots and display defects.

[0042] Based on this, the display panel 10 provided in the embodiments of the present application sets a pad layer 4 outside at least one side wall of the isolation column 2 in the circumferential direction, effectively reduces the height difference between the adjacent areas of the isolation column 2, makes the upper surface of the isolation column 2 and the circumferential side area in the hole area A relatively flat, achieves the purpose of effectively improving the film formation quality of the encapsulation layer 5 outside the isolation column 2 and the pad layer 4, reduces the possibility of the encapsulation layer 5 having a gap, ensures the encapsulation quality, and avoids the problem of display defects caused by the intrusion of water vapor from the gap in the circumferential side of the isolation column 2.

[0043] Referring to Figure 1 , Figure 2 and Figure 3 , the display panel 10 provided in the embodiments has a hole area A.

[0044] The display panel 10 further comprises the substrate 1, the isolation column 2 and the encapsulation layer 5, wherein the substrate 1 and the encapsulation layer 5 are stacked, and the isolation column 2 is located in the hole area A and between the substrate 1 and the encapsulation layer 5. The isolation column 2 is arranged on one side surface of the substrate 1, and at least one side wall of each isolation column 2 is provided with a raised layer 4 in the circumferential direction, and the raised layer 4 is used to fill the area adjacent to the isolation column 2, so as to reduce the height difference between the top of the isolation column 2 and the upper surface of the adjacent area to a certain extent, which helps to overcome the defects caused by the large side etching amount of the isolation column 2. The encapsulation layer 5 comprises a first inorganic film layer 51 stacked with the substrate 1 in a first direction, and the raised layer 4 and the isolation column 2 are located between the substrate 1 and the first inorganic film layer 51. The above-mentioned first direction refers to the thickness direction of the substrate 1.

[0045] In actual processing, due to the existence of the isolation column 2, a groove 3 is formed in the area of the hole area A which is outside the isolation column 2 and does not have the isolation column 2, and the groove 3 is recessed relative to the isolation column 2. Due to the large height difference between the groove 3 and the isolation column 2, it is difficult to continuously form the encapsulation structure formed on the hole area A. When the side etching amount of the isolation column 2 is large, it will directly affect the film forming effect of the encapsulation layer 5 formed on the hole area A, and even cause the CVD layer at the corresponding position to have a gap after film forming, resulting in encapsulation failure.

[0046] Therefore, in the embodiments provided in the present application, the display panel 10 can not only realize the sealing of the hole area A where the isolation column 2 and the groove 3 are located through the first inorganic film layer 51 in the encapsulation layer 5, so as to ensure that the display panel 10 can be encapsulated in the hole area A, avoid water vapor intrusion, and enable the panel to display normally; but also help to reduce the height difference (i.e. height difference) between the groove 3 and the isolation column 2 in the first direction by arranging the raised layer 4 on at least one side of the isolation column 2 in the circumferential direction, so that the surface of the area where the isolation column 2 and the groove 3 on the circumferential side of the hole area A is relatively flat, facilitating the deposition and processing of the subsequent film layer, thereby effectively improving the film forming quality of the first inorganic film layer 51 located thereon, reducing the possibility of abnormal defects such as gaps of the first inorganic film layer 51 at the isolation column 2, overcoming the defects caused by the large side etching amount of the isolation column 2, avoiding the problem of water vapor intrusion into the hole area A and display black spot caused by the gap or crack of the first inorganic film layer 51, and avoiding panel failure. In addition, the above structure can also improve the durability of the encapsulation layer 5 to a certain extent, so that the display panel 10 has a longer service life.

[0047] The raised layer 4 can be a film layer structure made of organic materials, inorganic materials or the like. Since the toughness of the organic material is better than that of the inorganic material, the organic material is generally selected to prepare the raised layer 4.

[0048] The display panel 10 also has a display area B and a separation area C, wherein the separation area C connects the aperture area A and the display area B. In the display panel 10, the display area B is used for image display, and the separation area C is used for separating the aperture area A and the display area B. Generally, the separation area C can be an annular structure arranged around the aperture area A. Of course, when the aperture area A is of a structure other than a circle (for example, a strip, a pill, etc.), the shape of the separation area C can change with the shape of the aperture area A. When the number of the separation columns 2 in the aperture area A is one, the above-mentioned groove 3 refers to the area in the aperture area A and not provided with the separation column 2; when the number of the separation columns 2 in the aperture area A is multiple, the above-mentioned groove 3 can refer to the area between two adjacent separation columns 2. When multiple separation columns 2 are arranged in the aperture area A, the multiple separation columns 2 are arranged in sequence and are spaced apart, as shown in FIG. 2. In actual processing, the number of the separation columns 2 and the spacing width between two adjacent separation columns 2 can be adjusted adaptively according to the processing needs. Figure 6

[0049] The first inorganic film layer 51 in the encapsulation layer 5 is a thin film structure formed outside the separation column 2 and the elevation layer 4, which can be processed by a chemical vapor deposition process. As a part of the encapsulation layer 5, the first inorganic film layer 51 can not only provide encapsulation protection for the substrate 1, the separation column 2 and the elevation layer 4, etc., prevent water vapor, oxygen and other pollutants from the outside into the device, so as to improve the stability and life of the display panel 10, but also can make the surface of the display panel 10 more flat, which is helpful to improve the light emitting uniformity and display effect of the display panel 10, and is also helpful to the subsequent packaging and processing of the panel, etc.

[0050] The above-mentioned separation column 2 is in a shape similar to a “sandwich” as a whole, as shown in FIGS. 2 and 3. Figure 2 Figure 3 The specific structure of the separation column 2 is a prior art, which is not described here.

[0051] In some embodiments, in the first direction, the end surface of the elevation layer 4 towards one end of the first inorganic film layer 51 is relatively flush or recessed with respect to the end surface of the separation column 2 towards one end of the first inorganic film layer 51.

[0052] ​​When the end surface of the elevation layer 4 is recessed relative to the end surface of the isolation column 2, the height difference between the recess 3 and the isolation column 2 can be reduced under the action of the elevation layer 4, thereby preliminarily planarizing the surface for attaching the first inorganic film layer 51, and helping to form a continuous first inorganic film layer 51 on the surface of the elevation layer 4 and the surface of the isolation column 2, so as to improve the film forming quality of the first inorganic film layer 51; when the end surface of the elevation layer 4 is flush with the end surface of the isolation column 2, the elevation layer 4 can fill the recess 3 formed around the isolation column 2 at this time, and the first inorganic film layer 51 can be attached on a relatively flat plane, which helps to form a continuous first inorganic film layer 51 on the surface of the elevation layer 4 and the surface of the isolation column 2, so as to achieve better film forming quality.

[0053] The above-mentioned elevation layer 4 is made of an organic material, which can be used to seal around the isolation column 2 to reduce or avoid the invasion of water vapor and the like into the isolation column 2, so as to ensure the normal display of the display panel 10 and avoid the failure of the display panel 10.

[0054] In the case where the elevation layer 4 and the isolation column 2 are directly in contact with the above-mentioned first inorganic film layer 51, the end surface height of the portion where the elevation layer 4 is in contact with the first inorganic film layer 51 does not exceed the end surface height of the portion where the isolation column 2 is in contact with the first inorganic film layer 51, so as to ensure that the elevation layers 4 located on the inner and outer sides of the isolation column 2 are not connected and conducted, and avoid that the elevation layers 4 formed by the organic material at different positions are connected and conducted through the isolation column 2, which leads to the introduction of electric charges during the reliability test and causes electrochemical action, so that the hole area A fails, and further causes the water vapor to enter the display panel 10 and cause display failure of the display panel 10.

[0055] In some embodiments, the packaging layer 5 further comprises a second inorganic film layer 53, which is stacked on the substrate 1 and extends from the display area B to the hole area A through the isolation area C, and is located between the substrate 1 and the first inorganic film layer 51. The isolation column 2 is located between the second inorganic film layer 53 and the substrate 1, so that the second inorganic film layer 53 can preliminarily package the isolation column 2. The elevation layer 4 is located on the side of the second inorganic film layer 53 away from the substrate 1. The above-mentioned second inorganic film layer 53 and the first inorganic film layer 51 can be made of inorganic packaging materials, and both can be thin film structures prepared by a chemical vapor deposition (CVD) technique.

[0056] Due to the presence of the second inorganic film layer 53, the isolation column 2 needs to be in contact with the first inorganic film layer 51 through the second inorganic film layer 53. At this time, the end surface height of the portion where the above-mentioned elevation layer 4 is in contact with the first inorganic film layer 51 should not exceed the end surface height of the second inorganic film layer 53 corresponding to the isolation column 2, so that the second inorganic film layer 53 cooperates with the isolation column 2 to separate the elevation layers 4 located on both sides of the isolation column 2.

[0057] That is, in order to ensure the normal function of the display panel 10, the two elevated layers 4 arranged at both sides of the isolation column 2 cannot be connected above the isolation column 2.

[0058] In some embodiments, the encapsulation layer 5 further comprises a third inorganic film layer 54, which is arranged in a stack with the second inorganic film layer 53. The third inorganic film layer 54 is arranged on the side of the second inorganic film layer 53 away from the substrate 1 and in the part of the hole region A. That is, the isolation column 2 is connected to the third inorganic film layer 54 through the second inorganic film layer 53 and is arranged on the side of the third inorganic film layer 54 facing the substrate 1, and the elevated layer 4 is arranged on the side of the third inorganic film layer 54 away from the substrate 1 and the second inorganic film layer 53.

[0059] At this time, the elevated layer 4 is arranged between the first inorganic film layer 51 and the third inorganic film layer 54 and is used to fill the gap between the two, so as to provide a relatively flat attachment surface for the preparation of the first inorganic film layer 51 as much as possible, which helps to form a continuous first inorganic film layer 51 on the surface of the elevated layer 4 and the surface of the third inorganic layer, improves the film forming quality of the first inorganic film layer 51, and enables the first inorganic film layer 51 to have a better encapsulation effect.

[0060] Correspondingly, due to the presence of the third inorganic film layer 54, the isolation column 2 needs to be connected to the first inorganic film layer 51 through the third inorganic film layer 54. At this time, the end surface height of the part of the elevated layer 4 connected to the first inorganic film layer 51 should not exceed the end surface height of the third inorganic film layer 54 corresponding to the isolation column 2. At this time, the third inorganic film layer 54 and the second inorganic film layer 53 jointly cooperate with the isolation column 2 to achieve the separation of the elevated layers 4 arranged on both sides of the isolation column 2.

[0061] In some embodiments, the third inorganic film layer 54 is prepared in a manner basically consistent with the preparation of the first inorganic film layer 51 and the second inorganic film layer 53, and can also be prepared by chemical vapor deposition technology.

[0062] Specifically, the first inorganic film layer 51, the second inorganic film layer 53 and the third inorganic film layer 54 can be inorganic thin films made of any one or more of silicon nitride, silicon oxynitride, silicon carbide and silicon oxide, etc. They have high water and oxygen barrier ability and can effectively prevent the damage of water and oxygen in the outside to the display panel 10, thereby protecting the performance and quality of the display panel 10.

[0063] Specifically, the structure and performance of the CVD layer can be adaptively increased or decreased according to the design adjustment of the display panel 10. In actual application, a multi-layer CVD structure is usually used to achieve better encapsulation effect and performance optimization.

[0064] In some embodiments, the display panel 10 further comprises a display layer 6, which is located between the substrate 1 and the encapsulation layer 5. As shown in Figure 3 The display layer 6 is arranged between the substrate 1 and the second inorganic film layer 53, and is blocked by the isolation column 2 to prevent water vapor and oxygen from penetrating the display layer 6 in the display area B through the display layer 6 in the hole area A.

[0065] The display layer 6 comprises a light-emitting layer and an electrode layer, wherein the light-emitting layer can be processed from organic small molecule light-emitting materials, complex light-emitting materials, and high molecular polymers, and the electrode layer can be prepared by evaporation and the like. The preparation and processing method of the display layer 6 is a prior art, which will not be described here.

[0066] The display layer 6 formed above the substrate 1 is blocked by the display layer 6 formed above the isolation column 2 through the isolation column 2, and the side portion of the isolation column 2 is provided with the second inorganic film layer 53 and the third inorganic film layer 54. The second inorganic film layer 53 and the third inorganic film layer 54 can encapsulate the side portion of the isolation column 2 to prevent the side portion of the isolation column 2 from being invaded by water vapor and causing display black spots and other defects.

[0067] Referring to Figure 4 The encapsulation layer 5 of the display panel 10 further comprises a first organic film layer 52, which is located in the display area B and stacked with the substrate 1, and the part of the second inorganic film layer 53 extending to the display area B is located between the first organic film layer 52 and the substrate 1, that is, the first organic film layer 52 is located on the side of the second inorganic film layer 53 away from the substrate 1. Correspondingly, the third inorganic film layer 54 is located on the side of the first organic film layer 52 away from the substrate 1. Referring to Figure 4 The second inorganic film layer 53 and the third inorganic film layer 54 are stacked in the display area B, and the first organic film layer 52 is located between the second inorganic film layer 53 and the third inorganic film layer 54 in the first direction.

[0068] In some embodiments, the first organic film layer 52 can be an organic layer prepared by IJP (Ink-Jet Printing) technology. The first organic film layer 52 is a transparent polymer film with high defect coverage and stress buffering performance, which can effectively prevent the penetration of oxygen and moisture, thereby providing better oxygen and water vapor protection function to protect the display panel 10.

[0069] Referring to Figure 4 The display panel 10 further comprises an encapsulation dam 7 arranged around the hole area A, which is located in the isolation area C, that is, the encapsulation dam 7 is located between the isolation column 2 and the display area B, and at this time the above-mentioned groove 3 is formed between the encapsulation dam 7 and the isolation column 2 adjacent thereto, and the groove 3 can also be filled with the pad layer 4.

[0070] The second inorganic film layer 53 covers the encapsulation dam 7.

[0071] The encapsulation dam 7 is arranged between the substrate 1 and the display layer 6 in the first direction, and the encapsulation layer 5 covers the side of the encapsulation dam 7 away from the substrate 1 through the display layer 6.

[0072] Under the action of the encapsulation dam 7, the parts of the display layer 6 on both sides of the encapsulation dam 7 extend to the display area B and the hole area A respectively. The first organic film layer 52 arranged in the display area B is located on the side of the encapsulation dam 7 close to the display area B, the second inorganic film layer 53 extends to the display area B through the encapsulation dam 7 and is arranged between the first organic film layer 52 and the display layer 6, and the third inorganic film layer 54 extends to the display area B through the encapsulation dam 7 and covers the first organic film layer 52.

[0073] In this way, the encapsulation dam 7 can separate the first organic film layer 52 in the encapsulation layer 5, further avoiding the invasion of water vapor from the first organic film layer 52 of the encapsulation layer 5.

[0074] It should be noted that since the third inorganic film layer 54 extends to the display area B through the encapsulation dam 7, at this time, the part of the third inorganic film layer 54 located on the surface of the encapsulation dam 7 protrudes relative to the side of the first inorganic film layer 51 away from the substrate 1, and the first inorganic film layer 51 is connected with the third inorganic film layer 54 covering the encapsulation dam 7. At this time, the first inorganic film layer 51 and the third inorganic film layer 54 can cooperate and jointly block the invasion of water vapor, further improving the encapsulation effect of the encapsulation layer 5.

[0075] Specifically, the side surface of the first organic film layer 52 away from the substrate 1 is flush or substantially flush with the side surface of the second inorganic film layer 53 on the encapsulation dam 7 away from the substrate 1, so as to facilitate further processing of the surfaces of the first organic film layer 52 and the second inorganic film layer 53, and form a continuous third inorganic film layer 54.

[0076] In some embodiments, the display panel 10 further comprises a planarization layer 8 covering the side of the encapsulation layer 5 away from the substrate 1.

[0077] The planarization layer 8 covering the side of the encapsulation layer 5 away from the substrate 1 not only can protect the display layer 6 and the encapsulation layer 5 from the influence of the external environment, but also can play a role in planarization and insulation of the surface of the display panel 10, help to reduce the roughness of the surface of the display panel 10, and improve the display effect.

[0078] Specifically, the planarization layer 8 can be prepared or processed by selecting an organic material with the same or similar material as the cushion layer 4. The material of the planarization layer 8 and the cushion layer 4 is a prior art, which will not be described here.

[0079] It is understood that the display panel 10 provided in this embodiment can reduce the height difference between the isolation pillar 2 and its surrounding area in the first direction by filling the area around the isolation pillar 2 with the padding layer 4, making the area around the isolation pillar 2 covered by the encapsulation layer 5 in the hole area A relatively flat. The surface of the hole area A with the padding layer 4 is smoother, which can effectively improve the film formation quality of the first inorganic film layer 51 located thereon, reduce the possibility of gaps in the encapsulation layer 5, and overcome the defects caused by the isolation pillar 2 due to excessive side markings, thus avoiding panel failure. In addition, the above structure can also improve the durability of the encapsulation layer 5 to a certain extent, giving the display panel 10 a longer service life.

[0080] Based on the above embodiments, in another possible embodiment of this application, a novel display panel 10 is also provided. This display panel 10 eliminates the third inorganic film layer 54, while the first inorganic film layer 51 located on the side of the planarization layer 8 facing the substrate 1 can extend from the hole area A through the isolation area C to the display area B via the encapsulation dam 7 to cover the first organic film layer 52. (Refer to...) Figure 5 .

[0081] The first inorganic film layer 51 covers the side of the encapsulation dam 7 facing away from the substrate 1 and extends directly from the encapsulation dam 7 to above the first organic film layer 52. The portion of the first inorganic film layer 51 formed on the encapsulation dam 7 and the first organic film layer 52 is a continuous film structure.

[0082] It is understood that the display panel 10 provided in this embodiment reduces the third inorganic film layer 54 by reducing the process of the third inorganic film layer 54 without affecting the encapsulation effect of the pad layer 4 and the isolation pillar 2 area for the hole area A. This can help reduce processing costs and improve the processing efficiency of the display panel 10.

[0083] In another embodiment, a display device is also provided, which includes the display panel 10 described in any of the preceding embodiments. Please refer to... Figure 7 .

[0084] The display device has the aforementioned display panel 10, and therefore has at least the advantages of the aforementioned display panel 10. For specific effects, please refer to the detailed description in the foregoing embodiments, which will not be repeated here.

[0085] The display device provided by the embodiment can be a mobile phone, a notebook, a tablet computer, a smart watch, a smart bracelet, a navigator, a display, a personal digital assistant (PDA) or the like, and has a display function. Since the display panel 10 in the display device has the above-mentioned pad layer 4, and the pad layer 4 can achieve the purpose of reducing the height difference between the isolation column 2 and the surrounding area in the first direction by being filled on at least one side of the isolation column 2 in the circumferential direction, the isolation column 2 and the circumferential side area thereof covered with the packaging layer 5 in the hole area A are relatively flat, the film forming quality of the first inorganic film layer 51 located thereon is effectively improved, the possibility of the packaging layer 5 having a gap is reduced, the defects caused by the problem of the side etching amount of the isolation column 2 being too large and the like are overcome, and then the problems of water vapor intrusion and display black spots are reduced, so that the display device can display normally, and the display panel 10 is prevented from being invalid. In addition, the above-mentioned structure can also improve the durability of the packaging layer 5 to a certain extent, so that the display panel 10 has a longer service life.

[0086] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel, characterized by, The display panel has a hole region; the display panel further comprises: a substrate; an isolation column located in the hole region, the isolation column is arranged on one side of the substrate, and at least one side of the isolation column in the circumferential direction is provided with a raised layer; an encapsulation layer comprising a first inorganic film layer stacked with the substrate in a first direction, the first direction being the thickness direction of the substrate, and the raised layer and the isolation column are both located between the substrate and the first inorganic film layer; an encapsulation dam arranged around the hole region.

2. The display panel of claim 1, wherein, In the first direction, the end face of the raised layer towards one end of the first inorganic film layer is flush with the end face of the isolation column towards one end of the first inorganic film layer.

3. The display panel of claim 1, wherein, The display panel further comprises a display region and an isolation region, the isolation region connecting the hole region and the display region, the encapsulation layer further comprising a first organic film layer and a second inorganic film layer, the second inorganic film layer being located between the substrate and the first inorganic film layer, and the first organic film layer being located in the display region and on the side of the second inorganic film layer away from the substrate; The isolation column is located between the second inorganic film layer and the substrate, and the raised layer is located on the side of the second inorganic film layer away from the substrate.

4. The display panel of claim 3, wherein, The encapsulation dam is located in the isolation region, and the second inorganic film layer covers the encapsulation dam.

5. The display panel of claim 4, wherein, The first inorganic film layer is arranged in the display region through the encapsulation dam and covers the first organic film layer.

6. The display panel of claim 4, wherein, The encapsulation layer further comprises a third inorganic film layer, and the third inorganic film layer is stacked with the second inorganic film layer; In the display region, the third inorganic film layer and the second inorganic film layer are respectively located on both sides of the first organic film layer in the first direction; In the hole region, the third inorganic film layer is located on the side of the isolation column away from the substrate, and the raised layer is located on the side of the third inorganic film layer away from the substrate.

7. The display panel of claim 6, wherein, The first inorganic film layer is connected with the third inorganic film layer covering the encapsulation dam.

8. The display panel of claim 1, wherein, The display panel further comprises a display layer, and the display layer is located between the substrate and the encapsulation layer.

9. The display panel of any one of claims 1-8, wherein, The display panel further comprises a planarization layer, and the planarization layer covers the side of the encapsulation layer away from the substrate.

10. A display device, characterized by comprising: The display panel comprises any one of claims 1-9.

Images