Monitoring module of control cabinet and fault diagnosis method, device, equipment and system

Abstract

The present invention discloses a monitoring module and fault diagnosis method, device, equipment and system for a control cabinet, which obtains the detection data of the first, second and third signal detection points set on the communication circuit of the monitoring module; compares whether the detection data of the first, second and third signal detection points are consistent with the data sent by the communication station host, so as to judge whether the communication circuit is normal; obtains the crystal oscillator output frequency in the control chip and the power supply voltage of the control chip; judges whether the drive circuit of the control chip is normal according to the crystal oscillator output frequency and the power supply voltage; and detects whether the monitoring module has a flash fault by bending the pins on the circuit board of the monitoring module and then inserting the pins one by one. Through the above series of diagnoses of communication circuits, drive circuits and flash faults, the fault diagnosis problem of the monitoring module of the control cabinet can be solved more reliably, thereby improving the monitoring reliability of the monitoring module.

Description

Technical Field

[0001] The present invention relates to the field of fault diagnosis and testing, and in particular to a monitoring module of a control cabinet and a fault diagnosis method, device, equipment and system. Background Art

[0002] At present, the monitoring module of the instrument control cabinet of a nuclear power plant is used to monitor the status inside the instrument cabinet of the nuclear power plant, and to process and alarm the monitoring signal. Once the monitoring module fails, it will not be able to detect and alarm the status of the instrument cabinet of the nuclear power plant, or a false alarm will be issued.

[0003] Therefore, how to perform fault diagnosis on the monitoring module of the instrument control cabinet of a nuclear power plant has become a problem that needs to be solved urgently. Summary of the invention

[0004] The embodiments of the present invention provide a monitoring module and a fault diagnosis method, device, equipment and system for a control cabinet to solve the fault diagnosis problem of the monitoring module of the control cabinet and improve the monitoring reliability of the monitoring module.

[0005] A method for diagnosing faults of a monitoring module of an instrument control cabinet, comprising:

[0006] Acquire detection data of a first signal detection point, detection data of a second signal detection point, and detection data of a third signal detection point set on a communication loop of the monitoring module; the first signal detection point is set at a communication port of the monitoring module, the second signal detection point is set between a communication transceiver chip and a digital isolator of the monitoring module, and the third signal detection point is set between the digital isolator and a control chip of the monitoring module;

[0007] Compare the detection data of the first signal detection point, the detection data of the second signal detection point and the detection data of the third signal detection point with the data sent by the communication station host to see whether they are consistent, so as to determine whether the communication loop is normal;

[0008] Obtaining the crystal oscillator output frequency in the control chip and the power supply voltage of the control chip; judging whether the drive circuit of the control chip is normal according to the crystal oscillator output frequency and the power supply voltage;

[0009] By bending the pins on the circuit board of the monitoring module and then inserting the pins one by one, it is detected whether the monitoring module has a flash fault.

[0010] A monitoring module of an instrument control cabinet, comprising:

[0011] A communication port, an electromagnetic protection circuit, a terminal resistance circuit, a communication transceiver chip, a digital isolator and a control chip connected in sequence; wherein the communication port, the electromagnetic protection circuit, and the terminal resistance circuit are configured in the data board of the monitoring module, and the communication transceiver chip, the digital isolator and the control chip are configured in the control board of the monitoring module;

[0012] The terminal resistance circuit includes a voltage divider branch and a dip switch, wherein a first port of the dip switch is connected to an output end of the electromagnetic protection circuit and an input end of the communication transceiver chip, and a second port of the dip switch is connected to a voltage divider control end of the voltage divider branch for controlling the voltage divider branch.

[0013] A monitoring module fault diagnosis device for an instrument control cabinet, comprising:

[0014] A data acquisition module, used to obtain detection data of a first signal detection point, a second signal detection point and a third signal detection point set on the communication loop of the monitoring module; the first signal detection point is set at the communication port of the monitoring module, the second signal detection point is set between the communication transceiver chip and the digital isolator of the monitoring module, and the third signal detection point is set between the digital isolator and the control chip of the monitoring module;

[0015] a communication loop diagnostic module, used to compare the detection data of the first signal detection point, the detection data of the second signal detection point and the detection data of the third signal detection point with the data sent by the communication station host to determine whether the communication loop is normal;

[0016] A drive circuit diagnostic module, used to obtain the crystal oscillator output frequency in the control chip and the power supply voltage of the control chip; and determine whether the drive circuit of the control chip is normal according to the crystal oscillator output frequency and the power supply voltage;

[0017] The flash fault diagnosis module is used to detect whether the monitoring module has a flash fault by bending the pins on the circuit board of the monitoring module and then inserting the pins one by one.

[0018] A computer device comprises a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor implements the above-mentioned monitoring module fault diagnosis method when executing the computer program.

[0019] A computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the monitoring module fault diagnosis method is implemented.

[0020] The above-mentioned monitoring module fault diagnosis method, device, equipment and system can determine whether the communication circuit is normal by installing multiple detection points for data detection, and then compare whether the detection data of multiple detection points are consistent with the data sent by the communication station host; by determining whether the drive circuit of the control chip is normal by controlling the output frequency of the crystal oscillator and the power supply voltage in the chip; by bending the pins on the circuit board and then inserting the pins one by one, it can be determined whether the monitoring module has a flash fault; through the above series of diagnoses of communication circuits, drive circuits and flash faults, the fault diagnosis problem of the monitoring module of the control cabinet can be solved more reliably, thereby improving the monitoring reliability of the monitoring module. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0022] Figure 1 is a schematic diagram of an application environment of a monitoring module fault diagnosis method according to an embodiment of the present invention;

[0023] Figure 2 is a flow chart of a monitoring module fault diagnosis method in one embodiment of the present invention;

[0024] Figure 3 is a schematic diagram of three signal detection points arranged on a communication loop in one embodiment of the present invention;

[0025] Figure 4 is a detection waveform and analysis data diagram of a first signal detection point in one embodiment of the present invention;

[0026] Figure 5 is a detection waveform and analysis data diagram of the second and third signal detection points in one embodiment of the present invention;

[0027] Figure 6 It is a waveform diagram of the crystal oscillator output pin of the control chip in the monitoring module in one embodiment of the present invention;

[0028] Figure 7 is a power supply voltage waveform diagram of a control chip in one embodiment of the present invention;

[0029] Figure 8 are six signal waveform diagrams tested by a logic analyzer in one embodiment of the present invention;

[0030] Fig. 9 is a first communication circuit diagram on a data board in one embodiment of the present invention;

[0031] Fig.10 is a schematic diagram of a monitoring module of an instrument control cabinet in one embodiment of the present invention;

[0032] Fig.11 is a schematic diagram of a monitoring module fault diagnosis device of an instrument control cabinet in one embodiment of the present invention;

[0033] Fig.12 is a schematic diagram of a computer device in one embodiment of the present invention. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] The monitoring module fault diagnosis method of the instrument control cabinet provided by the embodiment of the present invention can be applied as follows: Figure 1 Specifically, the monitoring module fault diagnosis method is applied in a monitoring module fault diagnosis system, and the fault diagnosis system includes: Figure 1 The client and server shown in the figure communicate with each other through the network to realize the fault diagnosis of the monitoring module. The client, also known as the user end, refers to the program corresponding to the server and providing local services to the client. The client can be installed on but not limited to various personal computers, laptops, smart phones, tablet computers and portable wearable devices. The server can be implemented as an independent server or a server cluster composed of multiple servers.

[0036] In one embodiment, if Figure 2 As shown, a monitoring module fault diagnosis method is provided, and the method is applied in Figure 1 The server in the example is used as an example to illustrate the process, including the following steps:

[0037] S201, acquiring detection data of a first signal detection point, detection data of a second signal detection point, and detection data of a third signal detection point set on the communication loop of the monitoring module; the first signal detection point is set at the communication port of the monitoring module, the second signal detection point is set between the communication transceiver chip and the digital isolator of the monitoring module, and the third signal detection point is set between the digital isolator and the control chip of the monitoring module;

[0038] The monitoring module includes a communication port, an electromagnetic protection circuit, a communication transceiver chip, a digital isolator and a control chip connected in sequence, the communication port is connected to the input end of the electromagnetic protection circuit, the output end of the electromagnetic protection circuit is connected to the input end of the communication transceiver chip, the output end of the communication transceiver chip is connected to the input end of the digital isolator, and the output end of the digital isolator is connected to the control chip to form a communication loop. The communication port of the monitoring module is used to communicate with the communication station host through the RS485 bus to obtain the request instruction sent by the communication station host, and the request instruction reaches the control chip through the electromagnetic protection circuit, the communication transceiver chip and the digital isolator.

[0039] In this step, multiple signal detection points are set on the communication loop of the monitoring module. During the abnormal period of the monitoring module, the data received by each detection point is compared with the data sent by the communication station host to see if they are consistent. If they are completely consistent, the possibility of abnormality in the communication loop can be ruled out. If the data received by a detection point is changed, it means that the problem occurs at the signal detection point.

[0040] like Figure 3 As shown, signal detection points 1, 2 and 3 are set on the communication loop. In order to avoid crosstalk between signals, signal detection point 1 is measured by an oscilloscope, and signal detection points 2 and 3 are measured by a logic analyzer. Among them, the signal on the communication port is an RS485 signal, which is a differential signal. The transmission result is only related to the difference of the communication port (M+ and M- terminals). Therefore, the differential signal can be determined by measuring the difference of the communication port.

[0041] In other implementations, when there is no crosstalk between signals, a logic analyzer may be used to simultaneously measure signals at multiple signal detection points.

[0042] S202, comparing the detection data of the first signal detection point, the detection data of the second signal detection point, and the detection data of the third signal detection point with the data sent by the communication station host to determine whether the communication loop is normal;

[0043] Among them, the detection waveform and analysis data of the first signal detection point (i.e., signal detection point 1) are as follows: Figure 4 As shown, the data waveforms and analytical data of the second signal detection point (i.e., signal detection point 2) and the third signal detection point (i.e., signal detection point 3) are as follows: Figure 5As shown in the figure, during the abnormal period of the monitoring module, the data of each detection point was continuously measured and compared, and it was found that the data of each detection point was always consistent with the data sent by the communication station host. The data received by each detection point was 03, 02, 00, 00, 00, 08, 78, 2e, which proves that the request command signal of the communication station host has been correctly transmitted to the receiving port of the control chip in the monitoring module through the signal link, and the possibility of abnormality in the communication loop can be ruled out.

[0044] S203, obtaining the crystal oscillator output frequency in the control chip and the power supply voltage of the control chip; judging whether the driving circuit of the control chip is normal according to the crystal oscillator output frequency and the power supply voltage;

[0045] Among them, during the abnormal period of the monitoring module, an oscilloscope is used to measure the crystal oscillator of the control chip in the monitoring module. The waveform of the crystal oscillator output pin is as follows: Figure 6 As shown, the measured output frequency of the crystal oscillator is consistent with the nominal frequency of the crystal oscillator, both of which are 24MHz, confirming that the crystal oscillator can work continuously and stably.

[0046] Use an oscilloscope to measure the power supply voltage waveform of the control chip, such as Figure 7 As shown, during the abnormal period of the monitoring module, the power supply of the FPGA is stable at about 3.3V, without abnormal fluctuations. This can rule out the possibility that there are abnormalities in the crystal oscillator and power supply circuit that drive the control chip in the monitoring module, that is, the drive circuit of the control chip is normal.

[0047] S204, detecting whether the monitoring module has a flash fault by bending the pins on the circuit board of the monitoring module and then inserting the pins one by one.

[0048] Among them, several pins responsible for communication on a circuit board of the monitoring module are determined, all the pins are bent to separate the pins on the circuit board from the terminal row on another circuit board, and then the pins are inserted one by one into the corresponding positions in the terminal row on the other circuit board. Each time a pin is inserted, it is detected whether the monitoring module has a flash fault; if no flash fault occurs, continue to insert the next pin until a pin is inserted and the monitoring module at the detection point reproduces the flash fault, then it is confirmed that the pin is the cause of the flash fault.

[0049] The monitoring module fault diagnosis method of the present embodiment performs data detection by installing multiple detection points, and then compares whether the detection data of the multiple detection points are consistent with the data sent by the communication station host, so as to determine whether the communication circuit is normal; by determining the output frequency of the crystal oscillator and the power supply voltage in the control chip, it can be determined whether the drive circuit of the control chip is normal; by bending the pins on the circuit board and then inserting the pins one by one, it can be determined whether the monitoring module has a flash fault; through the above series of diagnoses of the communication circuit, drive circuit and flash fault, the fault diagnosis problem of the monitoring module of the control cabinet can be solved more reliably, thereby improving the monitoring reliability of the monitoring module.

[0050] In one embodiment, the monitoring module includes a communication port, an electromagnetic protection circuit, a communication transceiver chip, a digital isolator and a control chip connected in sequence; wherein the communication port and the electromagnetic protection circuit are configured in a data board of the monitoring module, and the communication transceiver chip, the digital isolator and the control chip are configured in a control board of the monitoring module;

[0051] In the above step S204, the monitoring module is detected to see if a flash fault occurs by bending the pins on the control board of the monitoring module and then inserting the pins one by one.

[0052] The monitoring module is divided into a data board and a control board. The control board is located above the data board. The control board is plugged into the data board below through several pins. The control board is plugged into the data board through twenty pins, which is responsible for data communication and data control. When performing a flash fault test, the four pins (M_5V, M_GND, M+, M-) on the control board that are required to maintain Modbus communication are inserted into the terminal block of the data board, and the remaining 16 pins are separated from the data board. The pins of the control board are bent and inserted one by one. For example, after the DP2- pin is inserted, the monitoring module reproduces the flash fault phenomenon, and preliminarily determines the suspected problem pin.

[0053] In order to further determine whether only the DP2- pin affects the normal operation of the monitoring module, it is necessary to keep the DP2- pin separated from the data board and insert the remaining pins one by one to confirm that the monitoring module cannot reproduce the flash failure phenomenon. Finally, keep the DP2- pin separated and insert all the other 19 pins. The monitoring module can still work normally, so the suspected problem pin is determined to be a faulty pin.

[0054] The monitoring module fault diagnosis method of this embodiment detects flash faults by bending the pins on the upper control board and then inserting them one by one into the pins on the data board. After eliminating the faults in the communication circuit and the drive circuit, the flash fault of the monitoring module can be further diagnosed.

[0055] In one embodiment, when the monitoring module is detected to have a flash fault, the monitoring module fault diagnosis method further includes:

[0056] S205, acquiring a first communication signal on the data board that is communicated using a first communication protocol on a first communication circuit, and a second communication signal on the data board that is communicated using a second communication protocol on a second communication circuit;

[0057] S206, comparing the first communication signal and the second communication signal, and when it is detected that the high and low levels of the first communication signal affect the normal communication of the second communication signal, determining that the key communication circuit causing the flash fault is the first communication circuit.

[0058] Among them, the communication circuit on the data board that uses the DP communication protocol to communicate is the first communication circuit, which has four communication pins, namely DP1-pin, DP2-pin, DP3-pin, and DP4-pin, and the test signal is the first communication signal; on the other hand, the communication circuit on the data board that uses the Modbus communication protocol to communicate is the second communication circuit, which has M communication pins, and the test signal is the second communication signal.

[0059] The logic analyzer is connected to the four communication pins of the first communication circuit and the communication pins of the second communication circuit respectively for testing. According to the six signal waveforms tested, Figure 8 As shown in the figure, DP2_R is the DP communication receiving signal, DP2_D is the DP communication sending signal, DP2_RD is the DP communication receiving / sending switching signal, Mod-R is the Modbus communication receiving signal, Mod-D is the Modbus communication sending signal, and Mod-RD is the Modbus communication receiving / sending switching signal. It can be clearly seen from the waveform diagram that: when the first communication signal transmitted on the DP2-pin of the first communication circuit is at a low level, the second communication signal of the Modbus communication has no output, and the monitoring module communication is abnormal; when the first communication signal is at a high level, the output of the second communication signal is normal, and the monitoring module communication is normal. Therefore, it can be determined that the first communication circuit is the key communication circuit that produces the flash fault.

[0060] The monitoring module fault diagnosis method of this embodiment compares the communication signals of different communication protocols to find the correlation influence between the communication signals of different communication protocols, and then determines the key communication circuit that can affect the occurrence of the flash fault, thereby locating the flash fault.

[0061] In one embodiment, after determining that the key communication circuit causing the flash fault is the first communication circuit, the monitoring module fault diagnosis method further includes:

[0062] S207, removing some devices in the first communication circuit, and detecting the ground resistance of the pads of the devices to determine whether the first communication circuit has an insulation degradation fault;

[0063] S208: If it is determined that the first communication circuit has an insulation degradation fault, a terminal resistor is added to the output end of the first communication circuit to eliminate the flash fault.

[0064] After determining that the key communication circuit causing the flash fault is the first communication circuit where the DP2-pin is located, the circuit of the first communication circuit on the data board is as follows: Fig. 9 As shown, the DP2 communication signal is connected from the wiring terminals DP2+ and DP2-, passes through the transient suppression diode D1 / D2, the magnetic bead inductor L1 and the common mode inductor L2 to form an EMC (electromagnetic protection) circuit and then reaches the socket P1 with 20 pins. The socket is used to plug the DP2- pin in the previous embodiment. The circuit part of the first communication circuit of DP2 communication on the data board is relatively simple, and most of the functions are implemented on the control board.

[0065] In order to narrow the scope of the fault point, the first communication circuit on the data board was tested in sections, the common mode inductor was removed, the communication circuit was divided into two sections, and the resistance values ​​of the four pads of the common mode inductor to the ground were measured respectively. The measurement results are as follows: the resistance values ​​of measuring points 1, 2 and 3 to the ground are all over the range, and the possibility of abnormality can be ruled out. The resistance value of measuring point 4 to the ground is certain, and the resistance value is not a stable value, and it is always in a fluctuating state. Since this abnormal circuit has no electronic components and is only a PCB circuit, it is confirmed through inspection that the low insulation of the DP2 communication loop makes the DP2 communication easily introduce interference, that is, the first communication circuit has an insulation reduction fault.

[0066] In one embodiment, a monitoring module for an instrument control cabinet is provided, such as Fig.10 As shown, the monitoring module includes: a communication port 101, an electromagnetic protection circuit 102, a terminal resistance circuit 103, a communication transceiver chip 104, a digital isolator 105 and a control chip 106 connected in sequence; wherein the communication port 101, the electromagnetic protection circuit 102, and the terminal resistance circuit 103 are configured in the data board of the monitoring module, and the communication transceiver chip 104, the digital isolator 105 and the control chip 106 are configured in the control board of the monitoring module;

[0067] The terminal resistance circuit 103 includes a voltage divider branch and a dip switch, wherein the first port of the dip switch is connected to the output end of the electromagnetic protection circuit 102 and the input end of the communication transceiver chip 104, and the second port of the dip switch is connected to the voltage divider control end of the voltage divider branch for controlling the voltage divider branch.

[0068] Among them, the communication port using the DP communication protocol is connected to a group of electromagnetic protection circuits, terminal resistance circuits, communication transceiver chips, digital isolators and control boards to form a first communication circuit; the communication port using Modbus communication is connected to a group of electromagnetic protection circuits, terminal resistance circuits, communication transceiver chips, digital isolators and control boards to form a second communication circuit.

[0069] The monitoring module of this embodiment sets a terminal resistance circuit between the electromagnetic protection circuit and the communication transceiver chip. Whether the terminal resistance is used can be set by a dip switch to prevent the reflected wave generated on the bus from affecting the communication signal.

[0070] In one embodiment, if Fig.10 As shown, the voltage dividing branch includes:

[0071] A first terminal resistor, a second terminal resistor and a third terminal resistor, wherein the input end of the first terminal resistor is connected to the positive pole of the power supply, the output end of the first terminal resistor is respectively connected to the second port of the dip switch and the input end of the second terminal resistor, the output end of the second terminal resistor is respectively connected to the second port of the dip switch and the input end of the third terminal resistor, and the output end of the third terminal resistor is grounded.

[0072] Among them, the resistance of the first terminal resistor and the third terminal resistor is preferably 390 ohms, and the resistance of the second terminal resistor is preferably 220 ohms. After the terminal resistor of the voltage-dividing branch is put into the first communication circuit using the DP communication protocol, the potential difference between the positive and negative electrodes of the communication port using the DP communication protocol will be fixed at 1.1V. At this time, the MΩ-level fluctuation of the resistance of the DP2- pin to the ground can basically be ignored for the potential difference between the positive and negative electrodes DP2+ and DP2- of the communication port. Therefore, it can be determined that after the terminal resistance setting dial switch on the control board is put into use, the abnormal communication monitoring module can immediately resume normal communication.

[0073] In one embodiment, if Fig.10 As shown, the electromagnetic protection circuit includes: a transient suppression diode, a magnetic bead inductor and a common mode inductor, the input end of the transient suppression diode and the input end of the magnetic bead inductor are respectively connected to the communication ports DP2+ and DP2-, the output end of the transient suppression diode is grounded, the output end of the magnetic bead inductor is connected to the input end of the common mode inductor (i.e., port 1 and port 2), and the output end of the common mode inductor (i.e., port 3 and port 4) is connected to the first port of the dip switch;

[0074] The digital isolator includes a first digital isolation chip and a second digital isolation chip; the input end of the first digital isolation chip is connected to the transmitting end of the communication transceiver chip, and the output end of the first digital isolation chip is connected to the control chip; the input end of the second digital isolation chip is connected to the receiving end of the communication transceiver chip, and the output end of the second digital isolation chip is connected to the control chip.

[0075] The first digital isolation chip and the second digital isolation chip are of model ADUM1200, and the communication transceiver chip is of model HVD06. The first digital isolation chip is used to isolate the data on the transmitting end of the communication transceiver chip, and the second digital isolation chip is used to isolate the data on the receiving end of the communication transceiver chip.

[0076] It should be understood that the order of execution of the steps in the above embodiment does not necessarily mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present invention.

[0077] In one embodiment, a monitoring module fault diagnosis device for an instrument control cabinet is provided, and the fault diagnosis device corresponds one-to-one to the monitoring module fault diagnosis method in the above embodiment. Fig.11 As shown, the fault diagnosis device includes a data acquisition module 110, a communication circuit diagnosis module 111, a drive circuit diagnosis module 112 and a flash fault diagnosis module 113. The functional modules are described in detail as follows:

[0078] The data acquisition module 110 is used to obtain detection data of a first signal detection point, a second signal detection point and a third signal detection point set on the communication loop of the monitoring module; the first signal detection point is set at the communication port of the monitoring module, the second signal detection point is set between the communication transceiver chip and the digital isolator of the monitoring module, and the third signal detection point is set between the digital isolator and the control chip of the monitoring module;

[0079] The communication loop diagnostic module 111 is used to compare the detection data of the first signal detection point, the detection data of the second signal detection point and the detection data of the third signal detection point with the data sent by the communication station host to determine whether the communication loop is normal;

[0080] The drive circuit diagnosis module 112 is used to obtain the crystal oscillator output frequency in the control chip and the power supply voltage of the control chip; and determine whether the drive circuit of the control chip is normal according to the crystal oscillator output frequency and the power supply voltage;

[0081] The flash fault diagnosis module 113 is used to detect whether the monitoring module has a flash fault by bending the pins on the circuit board of the monitoring module and then inserting the pins one by one.

[0082] Optionally, the monitoring module includes a communication port, an electromagnetic protection circuit, a communication transceiver chip, a digital isolator and a control chip connected in sequence; wherein the communication port and the electromagnetic protection circuit are configured in a data board of the monitoring module, and the communication transceiver chip, the digital isolator and the control chip are configured in a control board of the monitoring module;

[0083] The above-mentioned flash fault diagnosis module 113 is used to detect whether the monitoring module has a flash fault by bending the pins on the control board of the monitoring module and then inserting the pins one by one.

[0084] Optionally, the fault diagnosis device further includes:

[0085] A signal acquisition module, used to acquire a first communication signal on the data board that is communicated using a first communication protocol on a first communication circuit, and a second communication signal on the data board that is communicated using a second communication protocol on a second communication circuit;

[0086] A signal comparison module is used to compare the first communication signal and the second communication signal, and when it is detected that the high and low levels of the first communication signal affect the normal communication of the second communication signal, determine that the key communication circuit that causes the flash fault is the first communication circuit.

[0087] Optionally, the fault diagnosis device further includes:

[0088] An insulation fault determination module, used to remove some devices in the first communication circuit and detect the ground resistance value of the pad of the device to determine whether the first communication circuit has an insulation reduction fault;

[0089] The flash fault elimination module is used to add a terminal resistor at the output end of the first communication circuit to eliminate the flash fault if it is determined that the first communication circuit has an insulation reduction fault.

[0090] For the specific definition of the monitoring module fault diagnosis device, please refer to the definition of the monitoring module fault diagnosis method above, which will not be repeated here. Each module in the above-mentioned monitoring module fault diagnosis device can be implemented in whole or in part by software, hardware and a combination thereof. The above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory in the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above modules.

[0091] In one embodiment, Fig.12 A schematic diagram of the structure of a computer device provided by an embodiment of the present invention. Fig.12 As shown, the computer device of this embodiment includes: at least one processor ( Fig.12 Only one is shown in the figure), a memory, and a computer program stored in the memory and executable on at least one processor, wherein when the processor executes the computer program, the steps in any of the above-mentioned health prediction method embodiments are implemented.

[0092] The computer device may include, but is not limited to, a processor and a memory. Those skilled in the art will appreciate that Fig.12 This is merely an example of a computer device and does not constitute a limitation on the computer device. The computer device may include more or fewer components than those shown in the figure, or a combination of certain components, or different components. For example, it may also include a network interface, a display screen, and an input device.

[0093] The processor may be a CPU, or other general-purpose processors, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0094] The memory includes a readable storage medium, an internal memory, etc., wherein the internal memory may be the memory of a computer device, and the internal memory provides an environment for the operation of the operating system and computer-readable instructions in the readable storage medium. The readable storage medium may be a hard disk of a computer device, and in other embodiments, it may also be an external storage device of the computer device, for example, a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped on the computer device. Further, the memory may also include both an internal storage unit of the computer device and an external storage device. The memory is used to store an operating system, an application program, a boot loader (BootLoader), data, and other programs, such as the program code of a computer program, etc. The memory may also be used to temporarily store data that has been output or is to be output.

[0095] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated into a processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of the present invention. The specific working process of the units and modules in the above-mentioned device can refer to the corresponding process in the above-mentioned method embodiment, which will not be repeated here. If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on such understanding, the present invention implements all or part of the processes in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a computer-readable storage medium. When the computer program is executed by the processor, the steps of the above-mentioned method embodiment can be implemented. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may at least include: any entity or device capable of carrying computer program code, recording medium, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal and software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk or an optical disk. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electric carrier signals and telecommunication signals.

[0096] The present invention implements all or part of the processes in the above-mentioned embodiment method, and can also be completed by a computer program product. When the computer program product runs on a computer device, the computer device can implement the steps in the above-mentioned method embodiment when executing.

[0097] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0098] In one embodiment, a monitoring module fault diagnosis system for an instrument control cabinet is provided, comprising: the monitoring module in the previous embodiment, and the computer device in the previous embodiment.

[0099] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the monitoring module fault diagnosis method in the above embodiment is implemented, for example Figure 2 S201-S204 shown are not described here in detail to avoid repetition. Alternatively, when the computer program is executed by the processor, the functions of each module / unit in the above-mentioned monitoring module fault diagnosis device are realized, for example Fig.11 The fault diagnosis functions shown are not described here in detail to avoid repetition.

[0100] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0101] The present invention implements all or part of the processes in the above-mentioned embodiment method, and can also be completed by a computer program product. When the computer program product runs on a computer device, the computer device can implement the steps in the above-mentioned method embodiment when executing.

[0102] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0103] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0104] In the embodiments provided by the present invention, it should be understood that the disclosed devices / computer equipment and methods can be implemented in other ways. For example, the device / computer equipment embodiments described above are only schematic, for example, the division of modules or units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0105] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0106] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A fault diagnosis method for a monitoring module of an instrument control cabinet, characterized in that: The following steps are involved: Acquire detection data of a first signal detection point, detection data of a second signal detection point, and detection data of a third signal detection point set on a communication loop of the monitoring module; the first signal detection point is set at a communication port of the monitoring module, the second signal detection point is set between a communication transceiver chip and a digital isolator of the monitoring module, and the third signal detection point is set between the digital isolator and a control chip of the monitoring module; Compare the detection data of the first signal detection point, the detection data of the second signal detection point and the detection data of the third signal detection point with the data sent by the communication station host to see whether they are consistent, so as to determine whether the communication loop is normal; Obtaining the crystal oscillator output frequency in the control chip and the power supply voltage of the control chip; judging whether the drive circuit of the control chip is normal according to the crystal oscillator output frequency and the power supply voltage; Detecting whether the monitoring module has a flash fault by bending the pins on the circuit board of the monitoring module and then inserting the pins one by one; When it is detected that the monitoring module has a flash fault, the monitoring module fault diagnosis method further includes: Acquire a first communication signal on a first communication circuit on a data board of the monitoring module that uses a first communication protocol for communication, and a second communication signal on a second communication circuit that uses a second communication protocol for communication; comparing the first communication signal and the second communication signal, and determining that the key communication circuit causing the flash fault is the first communication circuit when it is detected that the high and low levels of the first communication signal affect the normal communication of the second communication signal; After determining that the key communication circuit causing the flash fault is the first communication circuit, the monitoring module fault diagnosis method further includes: Removing some devices in the first communication circuit and detecting the ground resistance of the pads of the devices to determine whether the first communication circuit has an insulation degradation fault; If it is determined that the first communication circuit has an insulation reduction fault, a terminal resistor is added to the output end of the first communication circuit to eliminate the flash fault.

2. The monitoring module fault diagnosis method according to claim 1, characterized in that: The monitoring module includes a communication port, an electromagnetic protection circuit, a communication transceiver chip, a digital isolator and a control chip connected in sequence; wherein the communication port and the electromagnetic protection circuit are configured in the data board of the monitoring module, and the communication transceiver chip, the digital isolator and the control chip are configured in the control board of the monitoring module; By bending the pins on the control board of the monitoring module and then inserting the pins one by one, it is detected whether the monitoring module has a flash fault.

3. The monitoring module fault diagnosis device of the instrument control cabinet is characterized in that: The monitoring module fault diagnosis device comprises: A data acquisition module, used to obtain detection data of a first signal detection point, a second signal detection point and a third signal detection point set on the communication loop of the monitoring module; the first signal detection point is set at the communication port of the monitoring module, the second signal detection point is set between the communication transceiver chip and the digital isolator of the monitoring module, and the third signal detection point is set between the digital isolator and the control chip of the monitoring module; a communication loop diagnostic module, used to compare the detection data of the first signal detection point, the detection data of the second signal detection point and the detection data of the third signal detection point with the data sent by the communication station host to determine whether the communication loop is normal; A drive circuit diagnostic module, used to obtain the crystal oscillator output frequency in the control chip and the power supply voltage of the control chip; and determine whether the drive circuit of the control chip is normal according to the crystal oscillator output frequency and the power supply voltage; A flash fault diagnosis module, used to detect whether the monitoring module has a flash fault by bending the pins on the circuit board of the monitoring module and then inserting the pins one by one; A signal acquisition module, used to acquire a first communication signal on a first communication circuit on a data board of the monitoring module that uses a first communication protocol for communication, and a second communication signal on a second communication circuit that uses a second communication protocol for communication; a signal comparison module, configured to compare the first communication signal and the second communication signal, and determine that the key communication circuit causing the flash fault is the first communication circuit when it is detected that the high and low levels of the first communication signal affect the normal communication of the second communication signal; An insulation fault determination module, used to remove some devices in the first communication circuit and detect the ground resistance value of the pad of the device to determine whether the first communication circuit has an insulation reduction fault; The flash fault elimination module is used to add a terminal resistor at the output end of the first communication circuit to eliminate the flash fault if it is determined that the first communication circuit has an insulation reduction fault.

4. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the monitoring module fault diagnosis method according to any one of claims 1 to 2 is implemented.

5. The monitoring module fault diagnosis system of the instrument control cabinet is characterized by: include: A monitoring module, and a computer device as claimed in claim 4; The monitoring module comprises: A communication port, an electromagnetic protection circuit, a terminal resistance circuit, a communication transceiver chip, a digital isolator and a control chip connected in sequence; wherein the communication port, the electromagnetic protection circuit, and the terminal resistance circuit are configured in the data board of the monitoring module, and the communication transceiver chip, the digital isolator and the control chip are configured in the control board of the monitoring module; The terminal resistance circuit includes a voltage divider branch and a dip switch, wherein a first port of the dip switch is connected to an output end of the electromagnetic protection circuit and an input end of the communication transceiver chip, and a second port of the dip switch is connected to a voltage divider control end of the voltage divider branch for controlling the voltage divider branch.

6. The monitoring module fault diagnosis system of the instrument control cabinet according to claim 5, characterized in that: The voltage dividing branch comprises: A first terminal resistor, a second terminal resistor and a third terminal resistor, wherein the input end of the first terminal resistor is connected to the positive pole of the power supply, the output end of the first terminal resistor is respectively connected to the second port of the dip switch and the input end of the second terminal resistor, the output end of the second terminal resistor is respectively connected to the second port of the dip switch and the input end of the third terminal resistor, and the output end of the third terminal resistor is grounded.

7. The monitoring module fault diagnosis system of the instrument control cabinet according to claim 6 is characterized in that: The electromagnetic protection circuit comprises: a suppression diode, a magnetic bead inductor and a common mode inductor, the input end of the suppression diode and the input end of the magnetic bead inductor are respectively connected to the communication port, the output end of the suppression diode is grounded, the output end of the magnetic bead inductor is connected to the input end of the common mode inductor, and the output end of the common mode inductor is connected to the first port of the dip switch; The digital isolator includes a first digital isolation chip and a second digital isolation chip; the input end of the first digital isolation chip is connected to the transmitting end of the communication transceiver chip, and the output end of the first digital isolation chip is connected to the control chip; the input end of the second digital isolation chip is connected to the receiving end of the communication transceiver chip, and the output end of the second digital isolation chip is connected to the control chip.

Images