Automatic plate cover opening equipment and automatic plate cover opening method

Abstract

The present invention discloses an automated plate uncovering device and an automated plate uncovering method. The device comprises at least: a plate conveying mechanism, a plate de-covering mechanism, and a plate detecting mechanism. The plate conveying mechanism is used to convey at least one circuit plate along a first direction. At least one de-covering punch of the plate de-covering mechanism can de-cover the circuit plate along a second direction different from the first direction. The plate detecting mechanism detects the circuit plate after the de-covering operation, thereby detecting whether the circuit plate has been successfully de-covered. In this way, a mechanized and automated de-covering operation can be realized, thereby solving the problems of uncontrollable quality and inability to mass produce in the manual de-covering operation of printed circuit boards in the prior art.

Description

Technical Field

[0001] The present invention relates to a cover opening device, in particular to an automatic plate cover opening device and an automatic plate cover opening method. Background Art

[0002] Conventional technology often relies on manual operation for de-capping of printed circuit boards (PCBs).

[0003] However, manual operation of removing the cover of a printed circuit board often results in a problem of uncontrollable quality.

[0004] For example, different operators often use different forces to open the cover of a printed circuit board. Alternatively, the same operator may use different forces to open the cover of a printed circuit board under different physical conditions.

[0005] Therefore, the prior art has problems with the uncapping operation of printed circuit boards, such as the uncapping operation quality being difficult to control or the yield being reduced (eg, the problem of uncapping residue).

[0006] Furthermore, the opening operation based on the existing technology mainly relies on manual operation, which is difficult to mass-produce and thus difficult to meet customer needs.

[0007] Therefore, the inventors felt that the above-mentioned defects could be improved, and through intensive research and application of scientific principles, they finally proposed the present invention which has a reasonable design and effectively improves the above-mentioned defects. Summary of the Invention

[0008] The embodiments of the present invention provide an automated plate cover opening device and an automated plate cover opening method, so as to effectively improve the deficiencies of the prior art.

[0009] The technical problem to be solved by the present invention is to provide an automated plate opening device in response to the deficiencies of the prior art, which includes: a plate loading mechanism, which is located at the front end of the automated plate opening device, the plate loading mechanism provides at least one circuit plate for placement thereon, and can be used to raise the position of the circuit plate; a plate conveying mechanism, which is connected to the rear side of the plate loading mechanism and is configured to convey the circuit plate along a first direction; a plate transferring mechanism, which is located above the plate conveying mechanism and is arranged adjacent to the plate loading mechanism, the plate transferring mechanism is used to transfer the circuit plate from the plate loading mechanism to the plate conveying mechanism, so that the plate conveying mechanism can convey the circuit plate; a plate a sheet removing mechanism, which is located above the sheet conveying mechanism and is arranged at the rear side of the sheet transferring mechanism along the first direction; wherein the sheet removing mechanism includes at least one removing punch; wherein, when the sheet conveying mechanism conveys the circuit sheet to the position of the sheet removing mechanism, the sheet removing mechanism is configured to perform a removing operation on the circuit sheet through the removing punch along a second direction different from the first direction; and a sheet detecting mechanism, which is arranged on the sheet conveying mechanism and is arranged at the rear side of the sheet removing mechanism along the first direction; wherein the sheet detecting mechanism is configured to perform an inspection operation on the circuit sheet that has undergone the removing operation, so as to detect whether the removing of the circuit sheet is successful.

[0010] Preferably, the automated plate cover opening equipment further includes: a plate material receiving mechanism, which is arranged at the rear side of the plate detection mechanism and is located at the tail end of the automated plate cover opening equipment; wherein, when the plate detection mechanism detects that the circuit plate cover is successfully removed, the plate material receiving mechanism performs a material receiving operation on the circuit plate from the plate conveying mechanism.

[0011] Preferably, the automated plate uncovering equipment further includes: a waste collection mechanism, which is located on the lower side of the plate conveying mechanism and corresponds to the lower side of the plate de-covering mechanism in a vertical position; wherein the waste collection mechanism is configured to collect plate waste generated by the circuit plate after the de-covering operation.

[0012] Preferably, the plate loading mechanism includes a loading guide component and a loading and placing plate carrier; the loading guide component has a guide rail, and a length direction of the loading guide component is set at an inclined angle relative to a vertical normal vector of the ground plane; the loading and placing plate carrier is movably set on the guide rail of the loading guide component, the loading and placing plate carrier provides the circuit plate for placement thereon, and the circuit plate placed on the loading and placing plate carrier is also inclined relative to the ground plane, and the loading guide component is used to drive the loading and placing plate carrier to move along the length direction of the loading guide component, so that the height of the circuit plate can be lifted to a position adjacent to the plate transfer mechanism.

[0013] Preferably, the plate transferring mechanism comprises: a transferring drive motor, a transferring wheel component, a transferring swing component, at least one transferring vacuum component, and at least one transferring suction cup component; wherein, one end of the transferring wheel component is connected to the transferring drive motor, and the other end of the transferring wheel component is connected to the transferring swing component, and the at least one transferring vacuum component and the at least one transferring suction cup component are indirectly connected to the transferring swing component; wherein, the transferring drive motor can drive the transferring wheel component to rotate, and the transferring wheel component can drive the transferring swing component to move approximately in a horizontal direction when rotating, and further drive the at least one transferring vacuum component and the at least one transferring suction cup component to move in the horizontal direction, so that the circuit plate is adsorbed by the plate loading mechanism and transferred to the plate conveying mechanism.

[0014] Preferably, the plate conveying mechanism includes: a conveying drive motor, at least one conveying cross-plate component, and at least one conveying belt component; wherein the at least one conveying cross-plate component is uprightly arranged along the first direction, and the at least one conveying belt component is arranged on one side of the at least one conveying cross-plate component to jointly define a conveying platform area, and the conveying platform area spans the plate transferring mechanism, the plate removing mechanism, and the plate detecting mechanism; wherein a conveying drive shaft of the conveying drive motor passes through the at least one conveying cross-plate component and is linked to the at least one conveying belt component; wherein the plate transferring mechanism is used to transfer the circuit plate to the conveying platform area, and is arranged on the at least one conveying belt component, so that the at least one conveying belt component can convey the circuit plate.

[0015] Preferably, the sheet conveying mechanism further comprises: at least one sheet support platform, which is located on the lower side of the at least one conveying belt component; wherein, when the at least one de-covering punch on the sheet de-covering mechanism performs the de-covering operation on the circuit sheet, the at least one sheet support platform is supported on the bottom surface of the circuit sheet.

[0016] Preferably, the sheet material de-capping mechanism comprises: a de-capping mold component, and the de-capping mold component comprises a mold body and the at least one de-capping punch; wherein the at least one de-capping punch is arranged on the bottom surface of the mold body, and the de-capping punch is configured to perform the de-capping operation on a portion of the circuit sheet to be de-capped, so that the circuit sheet forms a de-capping opening and generates a sheet material waste.

[0017] Preferably, the sheet material removing mechanism further comprises: at least one retractable pressing plate, which is retractably arranged on the bottom surface of the mold body and located on one side of the removing punch; wherein when the removing punch performs a removing operation on the portion of the circuit sheet to be removed from the cover, the at least one retractable pressing plate is retractably pressed against a portion of the top surface of the circuit sheet that is not to be removed from the cover, and the at least one retractable pressing plate and the at least one sheet material supporting platform of the sheet material conveying mechanism can jointly clamp the circuit sheet.

[0018] In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide an automatic plate opening method, which includes: providing the automatic plate opening device as described above; implementing a plate loading operation, including: placing the at least one circuit plate on the plate loading mechanism, and lifting the circuit plate to a position adjacent to the plate transfer mechanism; implementing a plate transfer operation, including: transferring the at least one circuit plate from the plate loading mechanism to the plate conveying mechanism through the plate transfer mechanism; implementing a plate conveying operation, including: transferring the at least one circuit plate through the plate conveying mechanism along the first direction The sheet material is conveyed in a direction to be conveyed to the position of the sheet material removing mechanism; and a sheet material removing operation is performed, including: the at least one removing punch of the sheet material removing mechanism is used to remove the cover on the circuit sheet along the second direction, so that a removing opening is formed on the circuit sheet, and the uncovered portion of the circuit sheet is formed as a sheet material waste; and a sheet material detection operation is performed, including: the circuit sheet that has undergone the removing operation is conveyed to the position of the sheet material detection mechanism by the sheet material conveying mechanism, and the sheet material detection mechanism is used to perform the detection operation on the circuit sheet to detect whether the removing of the cover is successful.

[0019] The beneficial effect of the present invention is that the automated plate opening equipment and the automated plate opening method provided by the present invention can realize the mechanized and automated opening operation of the circuit board, thereby solving the problems of uncontrollable quality and inability to mass produce in the manual opening operation of the printed circuit board in the prior art.

[0020] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a three-dimensional schematic diagram of the automatic plate cover opening device according to an embodiment of the present invention.

[0022] Figure 2 It is a side view schematic diagram of the automated plate cover opening device according to an embodiment of the present invention.

[0023] Figure 3 Schematic diagram of the structure of the plate feeding mechanism according to an embodiment of the present invention.

[0024] Figure 4 Schematic diagram of the structure of the plate transfer mechanism according to an embodiment of the present invention.

[0025] Figure 5 Schematic diagram of the plate conveying mechanism from a rear perspective according to an embodiment of the present invention.

[0026] Figure 6 Schematic diagram of a plate conveying mechanism from a front perspective according to an embodiment of the present invention.

[0027] Figure 7 for Figure 5 Schematic diagram of a partial enlargement of the middle region VII.

[0028] Figure 8 Schematic diagram of the structure of the plate cover removal mechanism according to an embodiment of the present invention.

[0029] Figure 9 for Figure 8 Schematic diagram of a partial enlargement of region IX in the middle.

[0030] Figure 10 Schematic diagram of a first operating state of a plate cover removing mechanism according to an embodiment of the present invention.

[0031] Figure 11 Schematic diagram of a second operating state of the plate cover removing mechanism according to an embodiment of the present invention.

[0032] Figure 12 Schematic diagram of the structure of the plate detection mechanism according to an embodiment of the present invention.

[0033] Figure 13 Schematic diagram of the structure of the plate material receiving mechanism according to an embodiment of the present invention.

[0034] Figure 14 Schematic diagram of the structure of the waste collection mechanism according to an embodiment of the present invention.

[0035] Figure 15 This is a flow chart of the steps of the automatic cover opening method of the plate according to an embodiment of the present invention. DETAILED DESCRIPTION

[0036] The following describes the disclosed embodiments of the present invention through specific embodiments. Those skilled in the art will appreciate the advantages and effects of the present invention from the contents disclosed in this specification. The present invention may be implemented or applied through other different specific embodiments, and the details in this specification may be modified and altered based on different viewpoints and applications without departing from the spirit of the present invention.

[0037] In addition, the drawings of the present invention are only for simple illustration and are not depicted in actual size. Please note that the following embodiments will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

[0038] It should be understood that although terms such as "first," "second," and "third" may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. In addition, the term "or" as used herein may include any one or more combinations of the associated listed items, as appropriate.

[0039] [Automated plate opening equipment]

[0040] See also Figure 1 and Figure 2 As shown, an embodiment of the present invention provides automated PCB board de-capping equipment E. The automated PCB board de-capping equipment E can be used to perform a de-capping operation on at least one circuit board P. In one embodiment of the present invention, the circuit board P can be a printed circuit board, particularly a flexible printed circuit (FPC), but the present invention is not limited thereto.

[0041] The automated plate uncovering device E comprises a plate loading mechanism 1 , a plate transferring mechanism 2 , a plate conveying mechanism 3 , a plate uncovering mechanism 4 , a plate detecting mechanism 5 , a plate receiving mechanism 6 , and a waste collecting mechanism 7 .

[0042] The plate loading mechanism 1 is disposed at the front end of the automated plate opening device E. The plate loading mechanism 1 is configured to place the circuit plate P thereon and to lift the circuit plate P to a position adjacent to the plate transfer mechanism 2 .

[0043] The sheet conveying mechanism 3 is connected to the rear side of the sheet loading mechanism 1. The sheet transfer mechanism 2, the sheet cover removal mechanism 4, and the sheet detection mechanism 5 are sequentially arranged on or above the sheet conveying mechanism 3, from closer to the sheet loading mechanism 1 to farther away. The sheet material receiving mechanism 6 is arranged at the rear end of the automated sheet cover removal equipment E, that is, adjacent to the rear side of the sheet material detection mechanism 5. Furthermore, the waste collection mechanism 7 is located below the sheet conveying mechanism 3 and vertically corresponds to the lower side of the sheet cover removal mechanism 4, but the present invention is not limited to this.

[0044] The plate transfer mechanism 2 is arranged adjacent to the plate loading mechanism 1, and the plate transfer mechanism 2 is configured to transfer the circuit plate P from the plate loading mechanism 1 (e.g., by vacuum-lifting the circuit plate P) and transfer it to the plate conveying mechanism 3.

[0045] The plate conveying mechanism 3 is configured to convey the circuit plate P along a first direction D1 (e.g., conveying direction), and enables the circuit plate P to pass through the plate uncovering mechanism 4 and the plate detecting mechanism 5 in sequence. Then, the plate collecting mechanism 6 is configured to collect the circuit plate P.

[0046] The plate cover removal mechanism 4 includes at least one cover removal punch 44b ( Figure 2 Show two).

[0047] like Figure 10 and Figure 11 When the sheet conveying mechanism 3 conveys the circuit sheet P to the position of the sheet de-capping mechanism 4, the sheet de-capping mechanism 4 is configured to perform a de-capping operation on the circuit sheet P along a second direction D2 (e.g., de-capping direction) through its de-capping punch 44b, so that a de-capping opening P1 is formed in the circuit sheet P, and the de-capped portion of the circuit sheet P is formed as a sheet waste P'.

[0048] The second direction D2 (e.g., the cover removal direction) is different from the first direction D1 (e.g., the conveying direction). The second direction D2 is substantially perpendicular to the first direction D1 (e.g., the angle between the second direction D2 and the first direction D1 is substantially 80-100 degrees), but the present invention is not limited thereto.

[0049] After the de-covering operation is completed, the plate conveying mechanism 3 is configured to convey the circuit plate P to the position of the plate detecting mechanism 5, and the plate detecting mechanism 5 is configured to perform an inspection operation on the circuit plate P that has undergone the de-covering operation to detect whether the circuit plate P has been successfully de-covered.

[0050] If the plate detecting mechanism 5 detects that the circuit plate P is successfully de-capped, the plate receiving mechanism 6 performs a receiving operation on the circuit plate P that has been successfully de-capped.

[0051] On the contrary, if the plate detection mechanism 5 detects that the circuit plate P has not been successfully uncovered, the plate receiving mechanism 6 stops receiving the circuit plate P, and a monitoring screen M of the automatic plate uncovering equipment E can issue a warning message of unsuccessful uncovering based on the detection result of the plate detection mechanism 5, but the present invention is not limited to this.

[0052] As described above, the sheet material receiving mechanism 6 is configured to transfer the uncovered circuit sheets P from the sheet material conveying mechanism 3 and perform a receiving operation. The sheet material receiving mechanism 6 is used to collect and stack a certain number of circuit sheets P to complete the uncovering operation of a batch of circuit sheets P.

[0053] In addition, the waste collection mechanism 7 is configured to collect the plate waste P' to prevent the plate waste P' from being randomly scattered on the ground around the equipment.

[0054] The above is a brief introduction to the position settings and operating functions of each mechanism in the automated plate opening equipment E.

[0055] Below, the above-mentioned mechanisms, such as: plate loading mechanism 1, plate transferring mechanism 2, plate conveying mechanism 3, plate removing mechanism 4, plate detecting mechanism 5, plate receiving mechanism 6, and waste collecting mechanism 7, will be described in more detail, and the connection relationship between the plates of each of the above-mentioned mechanisms will be explained when necessary.

[0056] See also Figure 3 As shown, Figure 3 Shown is a schematic diagram of the structure of the plate loading mechanism 1.

[0057] The plate loading mechanism 1 includes a loading guide member 11 , a loading plate placement platform 12 , at least one loading sensing unit 13 , and a loading fixing plate 14 .

[0058] The loading guide member 11 is an elongated electric cylinder with a guide rail. The loading guide member 11 is mounted on the loading stationary plate 14. The loading guide member 11 is positioned on the loading stationary plate 14 at an angle (e.g., 5 to 45 degrees) relative to a normal vector perpendicular to the ground plane.

[0059] The loading guide member 11 can be, for example, a servo cylinder, preferably a linear reciprocating servo cylinder. The loading fixing plate 14 can be, for example, a sheet of metal or plastic having a plurality of fixing holes, for allowing the guide member 11 to be mounted thereon through the fixing holes, but the present invention is not limited thereto.

[0060] The loading and placing platform 12 is movably (e.g., slidably) disposed on a rail guide groove (not numbered) of the loading guide member 11. The loading and placing platform 12 is capable of receiving at least one circuit board P. The loading guide member 11 is configured to drive the loading and placing platform 12 up and down along an inclined direction of the inclined angle, e.g., away from the ground, so that the circuit board P can be lifted and loaded to a position adjacent to the board transfer mechanism 2.

[0061] It is worth mentioning that because the loading guide member 11 is arranged along an inclined direction, the circuit board P placed on the loading board placement platform 12 is also arranged inclined relative to the ground plane. Therefore, if multiple circuit boards P are stacked on the board placement platform 12, the boards are less likely to stick to each other.

[0062] The at least one loading sensing unit 13 is disposed on the loading guiding member 11 and located on one side of the track guiding groove, and is configured to position the lifting height of the loading plate placing platform 12 .

[0063] In this embodiment, the number of the at least one loading sensing unit 13 is multiple (e.g., two), and the two loading sensing units 13 are respectively arranged at the upper end and the lower end of the loading guide member 11 to respectively define a loading height (e.g., when the loading sensing unit 13 is arranged at the lower end of the loading guide member 11) and a loading height (e.g., when the loading sensing unit 13 is arranged at the upper end of the loading guide member 11), but the present invention is not limited thereto.

[0064] See also Figure 4 As shown, Figure 4 It shows a schematic diagram of the structure of the plate transfer mechanism 2.

[0065] The plate transfer mechanism 2 includes a transfer drive motor 21 , a transfer wheel component 22 , a transfer swing component 22 a , at least one transfer vacuum component 23 , at least one transfer suction cup component 24 , and at least one transfer sensing unit 25 .

[0066] In this embodiment, the transfer drive motor 21 may be, for example, a servomotor, the transfer wheel member 22 may be, for example, a pulley transmission member, and the transfer swing member 22a may be, for example, a horizontally reciprocating swing member in the shape of a rectangular parallelepiped. Furthermore, the transfer vacuum member 23 may be, for example, a vacuum generator, the transfer suction cup member 24 may be, for example, a vacuum suction cup, and the transfer sensing unit 25 may be, for example, a photoelectric sensor, although the present invention is not limited thereto.

[0067] One end of the transfer wheel member 22 is connected (pivoted) to the transfer drive motor 21, and the other end of the transfer wheel member 22 is connected to the transfer swing member 22a. The transfer drive motor 21 is configured to drive the transfer wheel member 22 to rotate, and the transfer wheel member 22 is configured to further drive the transfer swing member 22a to move generally in a horizontal direction during the rotation.

[0068] Specifically, a long, strip-shaped, fixed transfer member 22b with a narrow fixing slot is disposed on one side of the transfer swing member 22a. The at least one transfer vacuum member 23 is mounted on a vacuum line (not numbered). One end of the vacuum line is secured to the narrow fixing slot (not numbered) of the traction fixing member 22b via a set screw, thereby connecting to the traction fixing member 22b. The at least one transfer vacuum member 23 is linked to the transfer swing member 22a via the traction fixing member 22b.

[0069] The other end of the vacuum pipeline connected to the at least one transfer vacuum component 23 (i.e., the end away from the transfer swing component 22a or the transfer fixed component 22b) is connected to the at least one transfer suction cup component 24, and the transfer suction cup component 24 is set downward (towards the ground).

[0070] The operation of the plate transfer mechanism 2 is described as follows.

[0071] When the plate loading mechanism 1 loads at least one circuit plate P to a position adjacent to the plate transferring mechanism 2, the plate transferring mechanism 2 is configured to drive the transferring wheel component 22 to rotate through the transferring drive motor 21, thereby driving the transferring swing component 22a to move toward the plate loading mechanism 1. The transferring swing component 22a drives the transferring vacuum component 23 and the transferring suction cup component 24 to move synchronously through the transferring fixed component 22b, and makes the at least one transferring suction cup component 24 located above the circuit plate P (at this time, the suction cup hardware of the transferring suction cup component 24 faces the surface of the circuit plate P).

[0072] The transfer vacuum member 23 is then configured to generate a vacuum, causing the transfer suction cup member 24 to generate a vacuum suction force through the connected vacuum line, thereby adsorbing the circuit board P onto the transfer suction cup member 24. The plate transfer mechanism 2 is then configured to drive the transfer wheel member 22 via the transfer drive motor 21, thereby driving the transfer swing member 22a toward the plate conveyor mechanism 3, thereby transferring the adsorbed circuit board P onto the plate conveyor mechanism 3. After completing the above operation, the transfer vacuum member 23 is released from the vacuum, placing the circuit board P onto the plate conveyor mechanism 3.

[0073] According to the above configuration, the plate transfer mechanism 2 can accurately and quickly transfer the circuit plate P from the plate loading mechanism 1 to the plate conveying mechanism 3 .

[0074] It is worth mentioning that in this embodiment, the number of the at least one transferring vacuum component 23 is preferably four, and the number of the at least one transferring suction cup component 24 corresponds to the number of the transferring vacuum components 23 and is also four, and the position configuration of the suction cups of the four transferring suction cup components 24 can adsorb four points of the circuit board P, so that the four transferring suction cup components 24 can stably adsorb the circuit board P.

[0075] Furthermore, the transfer sensing unit 25 is disposed on one side of the transfer wheel component 22 to detect the operating status of the transfer wheel component 22 . The specific configuration thereof can be adjusted according to needs.

[0076] See also Figures 5 to 7 As shown, it shows a schematic diagram of the structure of the plate conveying mechanism 3.

[0077] The plate conveying mechanism 3 includes: a feed vertical plate component 31, at least one feed guide rail component 31a, at least one feed sensing unit 32, a conveying drive motor 33, a first conveying sensing unit 34 (located at a feed position), a second conveying sensing unit 35 (located at a cover removal position), at least one conveying horizontal plate component 36, at least one conveying belt component 37, a size measuring component 38, at least one hand wheel fixing component 39, at least one pressure wheel fixing component 310, at least one plate support platform 311, and a third conveying sensing unit 312 (located at a discharge position).

[0078] The feed riser 31 is plate-shaped and positioned adjacent to the sheet material loading mechanism 1, abutting against the loading stationary plate 14. The feed riser 31 is positioned at an angle (e.g., 5 to 45 degrees) relative to a normal vector perpendicular to the ground plane of the loading guide member 11. In other words, the inclination of the feed riser 31 coincides with that of the loading guide member 11, and the two members have the same inclination angle, but the present invention is not limited thereto.

[0079] The at least one feed guide rail member 31a is a long strip-shaped guide rail. In this embodiment, there are two of the at least one feed guide rail members 31a, and the length direction of the two feed guide rail members 31a is arranged along the above-mentioned inclined direction and spaced apart on a side surface of the feed riser member 31 (e.g., the side surface of the feed riser member 31 facing the loading guide member 11).

[0080] The two feeding guide rail components 31a are configured to provide the loading plate carrier 12 to be movably set thereon, so that when the loading guide component 11 drives the loading plate carrier 12 to move upward along the inclined direction, the feeding vertical plate component 31 and the two feeding guide rail components 31a can stabilize the moving state of the loading plate carrier 12, thereby preventing the loading plate carrier 12 from shaking during movement.

[0081] The at least one feed sensing unit 32 can be a contrast sensor. There are two of the at least one feed sensing unit 32, each disposed on the side surface of the feed riser 31, outside the two feed guide rails 31a, and adjacent to the top edge of the feed riser 31 to determine whether the circuit board P has been placed in the feed position.

[0082] Specifically, there are two at least one conveying cross-plate member 36 and two at least one conveying belt member 37. The two conveying cross-plate members 36 are spaced apart and arranged vertically along the first direction D1 (i.e., the conveying direction), and the two conveying belt members 37 are disposed inside the two conveying cross-plate members 36 to collectively define a conveying platform area R. In this embodiment, the two conveying belt members 37 are spaced apart to form a gap, which allows the sheet waste P' formed by the decapping operation to fall into the waste collection mechanism 7.

[0083] The conveyor drive motor 33, for example, can be a servo motor and is positioned adjacent to the sheet material loading mechanism 1. A conveyor drive shaft 33a of the conveyor drive motor 33 extends through two conveyor cross-plate members 36 and is respectively connected to two conveyor belt members 37. The sheet material transfer mechanism 2 is capable of transferring the circuit sheet P to the conveyor platform area R via the transfer suction cup member 24 and is positioned on the two conveyor belt members 37. Consequently, the two conveyor belt members 37 are capable of transporting the circuit sheet P.

[0084] When the conveying drive motor 33 drives the conveying drive shaft 33a to rotate, the two conveying belt components 37 can drive the circuit board P to be conveyed along the first direction D1 (conveying direction) and sequentially pass through a feeding position, a uncovering position, and a discharging position in the conveying platform area R.

[0085] In addition, the plate conveying mechanism 3 can calculate the moving distance of the circuit plate P through the number of revolutions of the conveying driving motor 33 through a calculator unit, but the present invention is not limited thereto.

[0086] The first conveying sensing unit 34 can be a reflective sensor. The first conveying sensing unit 34 is disposed at the feeding position of the conveying platform area R and is located inside the two conveying belt members 37 to determine whether the circuit board P is moving on the two conveying belt members 37 and is at the feeding position.

[0087] The second conveying sensing unit 35 can be a contrast sensor. It is located at the decapping position of the conveying platform area R and outside of at least one of the conveying cross-plate members 36. The second conveying sensing unit 35 is configured to determine whether the circuit board P has been conveyed to the decapping position and to position the circuit board P to facilitate subsequent decapping operations.

[0088] The dimension measuring member 38 can be, for example, a scale. It can be positioned across the bottom of the two conveying cross-plate members 36 and be longer than the width of the conveying platform area R defined by the two conveying cross-plate members 36. The width of the conveying platform area R defined by the two conveying cross-plate members 36 can be adjusted based on the width of the circuit board P, and the dimension measuring member 38 can be used as a guide for adjustment.

[0089] The handwheel fixing members 39 can be provided in at least two numbers, and can be disposed on the outside of the two conveyor cross-plate members 36. When the width of the conveyor platform area R defined by the two conveyor cross-plate members 36 has been appropriately adjusted according to the width of the circuit board P, the two handwheel fixing members 39 can be used to fix the positions of the two conveyor cross-plate members 36, thereby fixing the width of the conveyor platform area R.

[0090] There can be two pressure roller fixing members 310, each located at the decapping position. The two pressure roller fixing members 310 can be respectively disposed on the two conveying cross-plate members 36 and configured to protrude inwardly toward the conveying platform area R. Furthermore, the ends of the two pressure roller fixing members 310 protruding toward the conveying platform area R are respectively located above the two conveying belt members 37 and spaced a distance from the two conveying belt members 37. Accordingly, when the sheet conveying mechanism 3 conveys the circuit sheet P to the decapping position where the sheet decapping mechanism 4 is located, the two pressure roller fixing members 310 are configured to rest on (or press against) the top surface of the circuit sheet P, thereby preventing the circuit sheet P from being displaced when the sheet decapping mechanism 4 performs the decapping operation.

[0091] There can be two sheet support platforms 311, each located in a decapping position. The two sheet support platforms 311 can be located on the inner sidewalls of the two conveyor cross-plate members 36 and below the two conveyor belt members 37. The two sheet support platforms 311 are spaced apart and correspond in position to the two pressure roller fixing members 310. When the decapping punch 44b of the sheet decapping mechanism 4 decaps the circuit sheet P, the two sheet support platforms 311 support the bottom surface of the circuit sheet P to prevent the circuit sheet P from bending or deforming.

[0092] The third conveying sensing unit 312 can be, for example, a reflective sensor disposed at the rear of the discharge position of the conveying platform area R. When the sheet conveying mechanism 3 conveys the circuit sheet P to the discharge position behind the sheet removing mechanism 4, the third conveying sensing unit 312 can sense whether the circuit sheet P has been delivered to the discharge position.

[0093] See also Figure 8 and Figure 9 As shown, it shows a schematic diagram of the structure of the plate removing cover mechanism 4. The plate removing cover mechanism 4 is located at the removing cover position of the conveying platform area R.

[0094] More specifically, the plate removing mechanism 4 includes a transverse guiding member 41 , a longitudinal guiding member 42 , a connecting and fixing member 43 , and a removing mold member 44 .

[0095] The transverse guide member 41 may be a linear slider. The top surface of the transverse guide member 41 may be provided with a guide scale 41a, and the transverse guide member 41 may be provided across the two conveying transverse plate members 36 and the two conveying belt members 37 via two support columns 41b located on the outside of the two conveying transverse plate members 36 (see also FIG. Figure 1 and Figure 2).

[0096] The longitudinal guide member 42 may be a slide cylinder, the connecting and fixing member 43 may be a fixing clamp, and the longitudinal guide member 42 may be movably (eg, slidably) disposed on the transverse guide member 41 via the connecting and fixing member 43 .

[0097] Accordingly, the longitudinal guiding member 42 can move back and forth along the length direction of the transverse guiding member 41 (ie, the width direction of the conveying platform area R).

[0098] When the longitudinal guide member 42 moves along the length direction of the transverse guide member 41, the position of the longitudinal guide member 42 can be confirmed by the guide ruler 41a, so as to confirm whether the longitudinal guide member 42 is located above the part of the circuit board P to be uncovered, but the present invention is not limited to this.

[0099] The decapping mold member 44 is used to decap the portion of the circuit board P to be decapped. The decapping mold member 44 comprises a mold body 44a, at least one decapping punch 44b, and at least one retractable pressure plate 44c. In this embodiment, the decapping mold member 44 further comprises a mold ruler 44d and at least one fixing screw 44e, but the present invention is not limited thereto.

[0100] In this embodiment, the mold body 44a has a generally hexahedral shape (e.g., a rectangular parallelepiped or a cube), but the present invention is not limited thereto. The mold body 44a is movably (e.g., slidably) mounted on the longitudinal guide member 42 via a fixed plate (not numbered), allowing it to move up and down along the second direction (the decapping direction). When the plate conveying mechanism 3 conveys the circuit sheet P to the decapping position, the decapping mold member 44 is driven by the longitudinal guide member 42 to move toward the portion of the circuit sheet P to be decapped.

[0101] The at least one decapping punch 44b is disposed on the bottom surface of the mold body 44a, and the decapping punch 44b is configured to perform a decapping operation on the portion of the circuit board P to be decapped (e.g., Figure 10 ), so that the circuit board P is formed with a cover opening P1, and another board waste P' (such as Figure 11 ).

[0102] In this embodiment, the number of the at least one decapping punch 44b is two ( Figure 9Only one is shown, while the other is symmetrically arranged but obscured due to viewing angles. The two decapping punches 44b are spaced apart on the bottom surface of the mold body 44a, and a virtual extension line connecting the ends of the two decapping punches 44b is approximately perpendicular to the virtual extension plane connecting the transverse guide member 41 and the two support columns 41b. Thus, the decapping mold member 44 is able to stably decap the portion of the circuit board P to be decapped through the arrangement of the two decapping punches 44b. Alternatively, the virtual extension line connecting the ends of the two decapping punches 44b aligns with the first direction (the conveying direction).

[0103] Specifically, the at least one retractable pressing plate 44c is substantially in the shape of a rectangular plate and is retractably disposed on the bottom surface of the mold body 44a and located on one side of the decapping punch 44b.

[0104] When the decapping punch 44b is decapping the portion of the circuit board P to be decapped, the at least one retractable pressing plate 44c is retractably secured to the top surface of the circuit board P and is secured to the portion of the top surface of the circuit board P not to be decapped (such as Figure 10 and Figure 11 shown).

[0105] In this embodiment, the number of the at least one retractable pressure plate 44c is two, and the two retractable pressure plates 44c are arranged at intervals on the bottom surface of the mold body 44a and located on both sides of the virtual extension line connected by the two decapping punches 44b, so as to roughly form a rectangular area around the two decapping punches 44b.

[0106] Furthermore, if Figure 11 When the decapping punch 44b removes the cover from the circuit sheet P, the two retractable pressure plates 44c are positioned above the two sheet support platforms 311 of the sheet conveying mechanism 3. At this point, the two retractable pressure plates 44c are pressed against the top surface of the circuit sheet P, while the two sheet support platforms 311 are supported on the bottom surface of the circuit sheet P, thereby clamping the circuit sheet P. This allows the decapping punch 44b to stably remove the cover from the circuit sheet P, preventing the circuit sheet P from bending, deforming, or shifting.

[0107] The operation of the plate cover removing mechanism 4 is described in more detail below.

[0108] See also Figure 8 , and please also refer to Figure 10As shown, after the transverse guide member 41, through the connection fixing member 43, drives the longitudinal guide member 42 to move horizontally above the circuit sheet P, the longitudinal guide member 42, via the mold body 44a, drives the decapping mold member 44 to move in the second direction D2 (decapping direction) toward the circuit sheet P, and positions the two decapping punches 44b above the portion of the circuit sheet P to be decapped. At this point, the two retractable pressing plates 44c are pressed against the portion of the top surface of the circuit sheet P that is not to be decapped, and the two plate support platforms 311 are supported on the bottom surface of the circuit sheet P, thereby respectively clamping the circuit sheet P together with the two retractable pressing plates 44c.

[0109] Next, please refer to Figure 11 As shown, the longitudinal guiding member 42 drives the mold body 44a to continuously move downward along the second direction D2 (de-covering direction) toward the circuit board P, and the part of the circuit board P to be de-covered is punched open and removed by two de-covering punches 44b, thereby forming a de-covering opening P1 at the part to be de-covered on the circuit board P, and the part to be de-covered is formed as a waste plate P', which can fall through the gap between the two plate support platforms 311.

[0110] It is worth mentioning that in this embodiment, the depth of the punching of the two cover removal punches 44b from the top surface of the circuit board P during the cover removal operation is equal to the depth of the two retractable pressing plates 44c retracted toward the inside of the mold body 44a (as shown in FIG. Figure 11 ), but the present invention is not limited thereto.

[0111] It should be noted that Figure 10 and Figure 11 Only one of the decapping punches 44b can be shown, and the other decapping punch 44b is blocked by the previous decapping punch 44b in terms of viewing angle ( Figure 2 Show two).

[0112] Please continue reading Figure 8 and Figure 9 As shown, the die ruler 44d is provided on the top surface of the die body 44a, and the length direction of the die ruler 44d is substantially consistent with the direction of the virtual extension line connecting the ends of the two decapping punches 44b.

[0113] It is worth noting that in this embodiment, the two decapping punches 44b can be moved toward or away from each other along the imaginary extension line to adjust the distance between the two decapping punches 44b. More specifically, the distance between the two decapping punches 44b can be adjusted based on the width of the portion of the circuit board P to be decapped and the indicator of the die ruler 44d, but the present invention is not limited to this.

[0114] For example, in an embodiment not shown in the drawings of the present invention, the number of the decapping punch 44b may be, for example, only one. In this case, the die ruler 44d is not necessary.

[0115] Specifically, the at least one fixing screw 44e is disposed on the top surface of the mold body 44a and located on one side of the mold ruler 44d.

[0116] In this embodiment, there are two fixing screws 44e , which are spaced apart and disposed on the top surface of the mold body 44a , and are used to respectively lock the two decapping punches 44b .

[0117] In one embodiment, when the distance between the two decapping punches 44b needs to be adjusted, the two fixing screws 44e can be loosened first to allow the two decapping punches 44b to move away from or toward each other, thereby adjusting the distance between the two decapping punches 44b. Thereafter, the two fixing screws 44e can be tightened again to fix the positions of the two decapping punches 44b.

[0118] See also Figure 12 Also see Figure 1 and Figure 2 As shown, Figure 12 A schematic diagram showing the structure of the plate detection mechanism 5 is shown. The plate detection mechanism 5 is installed on the plate conveying mechanism 3 and is located behind the plate de-covering mechanism 4. It detects the circuit plate P after it has been de-covered by the plate de-covering mechanism 4 to confirm whether the circuit plate P has been successfully de-covered.

[0119] The plate detection mechanism 5 includes at least one cover removal sensing unit 51 and a sensing unit base 52 on which the cover removal sensing unit 51 is mounted.

[0120] The sensing unit base 52 is larger than a flat rectangular shape and is vertically disposed between the two conveying belt members 37 , and its height does not exceed that of the conveying belt members 37 .

[0121] The cover removal sensing unit 51 can be, for example, a reflective sensor. In this embodiment, the at least one cover removal sensing unit 51 is provided in multiple units (e.g., three). The three cover removal sensing units 51 can be spaced apart on the sensing unit base 52 along the first direction D1 (e.g., the conveying direction), and the sensing portions of the three cover removal sensing units 51 are all arranged upward.

[0122] In terms of operation, after the sheet removing mechanism 4 completes the uncovering operation on the circuit sheet P, the sheet conveying mechanism 3 continues to convey the uncovered circuit sheet P to the sheet detection mechanism 5 located behind the sheet removing mechanism 4. The uncovering sensing unit 51 is configured to detect the circuit sheet P, thereby detecting whether the cover of the circuit sheet P has been successfully removed (e.g., whether there is a uncovering opening P1). In this embodiment, the three uncovering sensing units 51 can detect three circuit sheets P respectively, but the present invention is not limited to this.

[0123] If the decapping sensor unit 51 detects that the circuit board P is indeed located within the decapping opening P1 (e.g., the detection signal from the decapping sensor unit 51 can pass through the decapping opening P1 without being reflected), the decapping sensor unit 51 will transmit a decapping success signal to a calculator unit of the automated sheet material decapping apparatus E. Conversely, if the decapping sensor unit 51 detects that the circuit board P is not located within the decapping opening P1 (e.g., the detection signal from the decapping sensor unit 51 cannot pass through the decapping opening P1 and is reflected), the decapping sensor unit 51 will transmit a decapping failure signal to the calculator unit of the automated sheet material decapping apparatus E. In this case, the automated sheet material decapping apparatus E will stop the circuit board P that failed decapping from entering the sheet material receiving mechanism 6, but the present invention is not limited to this.

[0124] It is worth noting that in this embodiment, the sheet detection mechanism 5 is positioned before the third conveying sensing unit 312 (discharging position) of the sheet conveying mechanism 3. This ensures that the sheet detection mechanism 5 detects a successful decapping signal from the circuit sheet P before the conveying mechanism 3 can continue to convey the successfully decapped circuit sheet P to the third conveying sensing unit 312. Subsequently, the sheet receiving mechanism 6 receives the circuit sheet P only after the third conveying sensing unit 312 detects the circuit sheet P.

[0125] See also Figure 13 Please also refer to Figure 1 and Figure 2 , Figure 13 The schematic diagram of the structure of the plate receiving mechanism 6 is shown. The plate receiving mechanism 6 is located at the rear side of the plate conveying mechanism 3 and the plate detecting mechanism 5, that is, at the rear section of the automatic plate opening device E.

[0126] The plate receiving mechanism 6 includes a first guiding member 61 , a second guiding member 62 , a receiving and placing platform 63 , at least one receiving vacuum member 64 , at least one receiving suction cup member 65 , and a receiving sensing unit 66 .

[0127] The first guide member 61 can be, for example, a linear servo cylinder arranged laterally. The first guide member 61 is configured to provide a lateral guiding function. Figure 13 Also see Figure 1 As shown, the first guiding member 61 is transversely arranged at the tail section of the automated plate opening device E along the first direction D1 (conveying direction), and is partially located above the plate detection mechanism 5 , while the other part extends above the plate detection mechanism 5 .

[0128] Furthermore, the second guide member 62 can be, for example, another longitudinally disposed linear servo cylinder. The second guide member 62 is configured to provide longitudinal guidance. The second guide member 62 is disposed on the rear side of the plate detection mechanism 5 and can be positioned at an angle of approximately 90 degrees (e.g., 80 to 100 degrees, preferably 90 degrees) relative to the first guide member 61.

[0129] The receiving and placing platform 63 is generally rectangular. The length of the second guide member 62 is generally perpendicular to the top surface of the receiving and placing platform 63. The top surface of the receiving and placing platform 63 is capable of placing the at least one circuit board P (particularly a circuit board P that has been successfully removed).

[0130] Furthermore, one side of the material receiving and placing platform 63 is movably (e.g., slidably) disposed on the second guide member 62 so that the material receiving and placing platform 63 can move back and forth up and down along the length direction of the second guide member 62.

[0131] The at least one material receiving vacuum component 64 can be, for example, a vacuum generator, and can be, for example, movably arranged on the first guide component 61 through a fixed back plate (not numbered in the figure), and can move back and forth left and right along the length direction of the first guide component 61 (i.e., the first direction D1).

[0132] The at least one material receiving suction cup component 65 can be, for example, a hardware with a suction cup. The at least one material receiving suction cup component 65 can be, for example, arranged on the above-mentioned fixed back plate through a vacuum pipeline and a transfer and fixing component (not numbered in the figure) with a narrow and long fixing groove, and connected to the at least one material receiving vacuum component 64. The at least one material receiving suction cup component 65 can move back and forth left and right along the length direction of the first guide component 61 along with the connected material receiving vacuum component 64. The suction cup of the at least one material receiving suction cup component 65 is arranged in the direction of the ground plane. In this embodiment, the number of the at least one material receiving vacuum component 64 and the at least one material receiving suction cup component 65 are both four, but the present invention is not limited to this.

[0133] The receiving sensing unit 66 can be, for example, a reflective sensor. It can be positioned on one side of the second guide member 62, adjacent to the first guide member 61. In other words, the receiving sensing unit 66 is positioned substantially on one side of the top of the second guide member 62, but the present invention is not limited thereto. The receiving sensing unit 66 is used to sense whether the stack of circuit boards P on the receiving and placing platform 63 is full.

[0134] Furthermore, the operation of the plate receiving mechanism 6 is described as follows.

[0135] After the plate detection mechanism 5 detects that the circuit plate P is successfully uncovered and sends a uncovering success signal, the first guiding member 61 can drive the material receiving vacuum member 64 and the material receiving suction cup member 65 connected thereto to move above the circuit plate P.

[0136] The receiving vacuum member 64 then creates a vacuum, causing the receiving suction cup member 65 to pick up the circuit board P. The first guide member 61 then drives the receiving vacuum member 64 and its connected receiving suction cup member 65 to move the sucked circuit board P to the top of the receiving and placing board platform 63. The receiving and placing board platform 63 then moves along the length of the second guide member 62, toward the circuit board P. The receiving vacuum member 64 then breaks the vacuum, allowing the receiving suction cup member 65 to place the circuit board P on the receiving and placing board platform 63. As the number of circuit boards P stacked on the receiving and placing board platform 63 increases, the receiving and placing board platform 63 moves downward. When the receiving sensing unit 66 senses that the stack of circuit boards P is full, the board receiving mechanism 6 stops operating.

[0137] See also Figure 14 As shown, Figure 14A schematic diagram of the structure of the waste collection mechanism 7 is shown. The waste collection mechanism 7 is located below the sheet conveying mechanism 3 and vertically corresponds to the position below the sheet de-covering mechanism 4, but the present invention is not limited to this. The waste collection mechanism 7 includes a waste discharge member 71 and a waste collection member 72. The waste discharge member 71 can be a waste discharge pipe. In this embodiment, the waste discharge member 71 can be a square tube with a length of 60 to 90 mm and a width of 60 to 90 mm, but the present invention is not limited to this. The waste discharge member 71 can remove the sheet waste P' generated by the de-covering operation of the circuit sheet P. It is worth noting that the sheet waste P' can, for example, fall into the waste discharge member 71 through the gap between the two opposing conveying belt members 37 and the gap between the two sheet support platforms 311, but the present invention is not limited to this. In addition, the waste collecting component 72 can be, for example, a collecting basket or a collecting bucket, which is disposed below the discharge port of the waste discharging component 71 and is used to collect the plate waste P′ discharged by the waste discharging component 71 .

[0138] According to the above configuration, the automated plate uncovering device E provided by the embodiment of the present invention can automatically remove the cover of the circuit plate P and properly collect the plate waste P'.

[0139] It is worth noting that in some embodiments of the present invention, the length of the automated sheet decapping device E may be, for example, between 2,000 and 2,500 mm, the width may be, for example, between 800 and 1,200 mm, and the height may be, for example, between 1,500 and 1,900 mm. Furthermore, the length of the circuit board P may be, for example, between 100 and 400 mm, and the width may be, for example, between 80 and 300 mm, but the present invention is not limited thereto.

[0140] [Automatic opening method of sheet metal]

[0141] The above is the relevant description of the mechanism design of the automatic plate cover opening device E according to the embodiment of the present invention. The following will continue to introduce the automatic plate cover opening method according to the embodiment of the present invention. Figure 15 As shown, an embodiment of the present invention also provides an automated plate opening method, which includes: step S110, step S120, step S130, step S140, step S150, step S160, and step S170. However, the order of the above steps can be adjusted or additional steps can be inserted as needed, and the present invention is not limited thereto.

[0142] like Figure 15 Also see Figure 2As shown, step S110 is to perform a plate loading operation, including: placing a circuit plate P on a plate loading mechanism 1 , and lifting the circuit plate P to a position adjacent to a plate transfer mechanism 2 .

[0143] The step S120 is to perform a plate transfer operation, which includes: transferring the circuit plate P from the plate loading mechanism 1 to a plate conveying mechanism 3 via the plate transfer mechanism 2 .

[0144] The step S130 is to perform a plate conveying operation, including conveying the circuit plate P along a first direction D1 (e.g., conveying direction) through the plate conveying mechanism 3 , and allowing the circuit plate P to pass through a plate uncovering mechanism 4 and a plate detecting mechanism 5 in sequence.

[0145] The step S140 is to perform a plate decapping operation, which includes: conveying the circuit plate P through the plate conveying mechanism 3 along the first direction D1 to the plate decapping mechanism 4, and performing a decapping operation on the circuit plate P along a second direction D2 (e.g., a decapping direction) perpendicular to the first direction D1 (e.g., a conveying direction) by at least one decapping punch 44b of the plate decapping mechanism 4, so that a decapping opening P1 is formed in the circuit plate P, and the decapped portion of the circuit plate P is formed into a plate waste P' (e.g., Figure 2 、 Figure 10 、 Figure 11 ).

[0146] Step S150 involves performing a plate inspection operation, which includes conveying the uncovered circuit plate P via the plate conveying mechanism 3 to the position of the plate inspection mechanism 5. The plate inspection mechanism 5 then inspects the circuit plate P to determine whether the uncovering of the circuit plate P is successful. If the plate inspection mechanism 5 determines that the circuit plate P is successfully uncovered, the subsequent material collection operation proceeds. Otherwise, the subsequent material collection operation is stopped.

[0147] The step S160 includes: performing a plate material collecting operation, including: passing the successfully uncovered circuit plate P through a plate material collecting mechanism 6 to collect the plate material from the plate conveying mechanism 3.

[0148] The step S170 includes: collecting the plate waste P' generated by the decapping operation by a waste collection mechanism 7 to prevent the plate waste P' from being randomly scattered on the ground around the equipment.

[0149] [Beneficial Effects of Embodiments]

[0150] The beneficial effect of the present invention is that the automated plate opening equipment and the automated plate opening method provided by the present invention can realize mechanized and automated opening operations for circuit boards, thereby solving the problems of uncontrollable quality and inability to mass produce in manual opening operations in the prior art.

[0151] The contents disclosed above are only preferred feasible embodiments of the present invention and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the description and drawings of the present invention should be included in the scope of the patent application of the present invention.

Claims

1. An automated plate opening device, characterized in that: The automated plate opening device includes: a plate loading mechanism located at the front end of the automated plate opening device, the plate loading mechanism providing at least one circuit plate for placement on the plate loading mechanism and performing a loading operation on the circuit plate; a plate conveying mechanism connected to the rear side of the plate loading mechanism and capable of conveying the circuit plate along a first direction; a plate transfer mechanism located above the plate conveying mechanism and adjacent to the plate loading mechanism, the plate transfer mechanism being used to transfer the circuit plate from the plate loading mechanism to the plate conveying mechanism so that the plate conveying mechanism can convey the circuit plate; a sheet material decapping mechanism, located above the sheet material conveying mechanism and disposed behind the sheet material transfer mechanism along the first direction; wherein the sheet material decapping mechanism includes at least one decapping punch; wherein, when the sheet material conveying mechanism conveys the circuit sheet to the position of the sheet material decapping mechanism, the sheet material decapping mechanism is configured to perform a decapping operation on the circuit sheet material along a second direction different from the first direction via the decapping punch; and A plate detection mechanism is arranged on the plate conveying mechanism and is arranged on the rear side of the plate de-covering mechanism along the first direction; wherein the plate detection mechanism is configured to perform an inspection operation on the circuit plate that has undergone the de-covering operation, thereby detecting whether the circuit plate has been successfully de-covered.

2. The automated plate opening equipment according to claim 1, characterized in that: The automated plate opening equipment further comprises: A plate receiving mechanism is arranged at the rear side of the plate detection mechanism and is located at the tail end of the automatic plate uncovering device; wherein, when the plate detection mechanism detects that the circuit plate has been successfully uncovered, the plate receiving mechanism receives the circuit plate from the plate conveying mechanism.

3. The automated plate opening equipment according to claim 1, characterized in that: The automated plate opening equipment further comprises: A waste collection mechanism is located at the lower side of the plate conveying mechanism and corresponds to the lower side of the plate removing mechanism in a vertical position; wherein the waste collection mechanism is configured to collect plate waste generated by the circuit plate after the removing operation.

4. The automated plate opening equipment according to claim 1, characterized in that: The plate loading mechanism includes a loading guide component and a loading and placing plate carrier; the loading guide component has a guide rail, and a length direction of the loading guide component is set at an inclined angle relative to a vertical normal vector of the ground plane; the loading and placing plate carrier is movably set on the guide rail of the loading guide component, the loading and placing plate carrier provides the circuit plate for placement thereon, and the circuit plate placed on the loading and placing plate carrier is also inclined relative to the ground plane, and the loading guide component is used to drive the loading and placing plate carrier to move along the length direction of the loading guide component so that the height of the circuit plate can be lifted to a position adjacent to the plate transfer mechanism.

5. The automated plate opening equipment according to claim 1, characterized in that: The plate transferring mechanism includes: a transferring drive motor, a transferring wheel component, a transferring swing component, at least one transferring vacuum component, and at least one transferring suction cup component; wherein, one end of the transferring wheel component is connected to the transferring drive motor, and the other end of the transferring wheel component is connected to the transferring swing component, and the at least one transferring vacuum component and the at least one transferring suction cup component are indirectly connected to the transferring swing component; wherein, the transferring drive motor can drive the transferring wheel component to rotate, and the transferring wheel component can drive the transferring swing component to move approximately in a horizontal direction when rotating, and further drive the at least one transferring vacuum component and the at least one transferring suction cup component to move in the horizontal direction, so that the circuit plate is adsorbed by the plate loading mechanism and transferred to the plate conveying mechanism.

6. The automated plate opening equipment according to claim 1, characterized in that: The plate conveying mechanism includes: a conveying drive motor, at least one conveying cross-plate component, and at least one conveying belt component; wherein the at least one conveying cross-plate component is arranged upright along the first direction, and the at least one conveying belt component is arranged on one side of the at least one conveying cross-plate component to jointly define a conveying platform area, and the conveying platform area spans the plate transferring mechanism, the plate removing mechanism, and the plate detecting mechanism; wherein a conveying drive shaft of the conveying drive motor passes through the at least one conveying cross-plate component and is linked to the at least one conveying belt component; wherein the plate transferring mechanism is used to transfer the circuit plate to the conveying platform area, and is arranged on the at least one conveying belt component, so that the at least one conveying belt component can convey the circuit plate.

7. The automated plate opening device according to claim 6, characterized in that: The plate conveying mechanism further includes: at least one plate supporting platform, which is located on the lower side of the at least one conveying belt component; wherein, when the at least one de-covering punch on the plate de-covering mechanism performs the de-covering operation on the circuit plate, the at least one plate supporting platform is supported on the bottom surface of the circuit plate.

8. The automated plate opening equipment according to claim 1, characterized in that: The plate decapping mechanism includes: a decapping mold component, and the decapping mold component includes a mold body and the at least one decapping punch; wherein the at least one decapping punch is arranged on the bottom surface of the mold body, and the decapping punch is configured to perform the decapping operation on a portion of the circuit plate to be decapped, so that a decapping opening is formed on the circuit plate, and a plate waste is generated.

9. The automated plate opening device according to claim 8, characterized in that: The sheet material removing mechanism further includes: at least one retractable pressing plate, which is retractably arranged on the bottom surface of the mold body and located on one side of the removing punch; wherein when the removing punch performs a removing operation on the portion of the circuit sheet to be removed, the at least one retractable pressing plate is retractably pressed against a portion of the top surface of the circuit sheet that is not to be removed, and the at least one retractable pressing plate and the at least one sheet material supporting platform of the sheet material conveying mechanism can jointly clamp the circuit sheet.

10. An automatic opening method for a plate, characterized in that: The automated cover opening method of the plate comprises: Provide an automated plate opening device according to any one of claims 1 to 9; Performing a plate loading operation includes: placing the at least one circuit plate on the plate loading mechanism, and moving the circuit plate to a position adjacent to the plate transfer mechanism; Implementing a plate transfer operation, including: transferring the at least one circuit plate from the plate loading mechanism to the plate conveying mechanism through the plate transfer mechanism; Implementing a plate conveying operation, comprising: conveying the at least one circuit plate along the first direction via the plate conveying mechanism to a position of the plate uncovering mechanism; and Performing a plate decapping operation includes: performing the decapping operation on the circuit plate along the second direction by the at least one decapping punch of the plate decapping mechanism, so that a decapping opening is formed in the circuit plate, and the decapped portion of the circuit plate is formed as a plate waste; and Implementing a plate inspection operation includes: transporting the circuit plate that has undergone the cover removal operation to the position of the plate inspection mechanism through the plate transport mechanism, and performing the inspection operation on the circuit plate through the plate inspection mechanism to detect whether the circuit plate has been successfully removed from the cover.

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