Electrode resistance and method of manufacturing the same

Abstract

The application discloses an electrode resistor and a manufacturing method thereof, and the manufacturing method comprises the following steps: a copper layer and a resistor alloy layer are pressed together under high pressure through a preset adhesive film to form a laminated structure; the preset adhesive film has a thermal conductivity greater than 3 W / m*K and a voltage resistance greater than 60 KV / mm, and the high pressure is a pressure greater than 10 KG; according to a resistance value pattern, the resistor alloy layer and the copper layer in the laminated structure are etched completely to expose the preset adhesive film, wherein a first etching groove is formed when the copper layer in the laminated structure is etched, and the ratio of the groove depth to the groove width of the first etching groove is A, and A is greater than or equal to 1 / 2; the first etching groove is filled with structural adhesive, so that the first etching groove is in a filled state, and the height of the filled structural adhesive does not exceed the outer edge of the first etching groove; and the laminated structure after the structural adhesive is filled is adjusted in resistance, silk-screen printed, glued, electroplated and classified.

Description

TECHNICAL FIELD

[0001] The present application relates to the mechanical technical field, especially to an electrode resistance and a manufacturing method thereof. BACKGROUND

[0002] The alloy resistance is mainly used for detecting current, and thus is also called current detection resistance, electrode resistance or sampling resistance by engineers. The material of the alloy resistance is mainly copper alloy, and different material ratios are used by each manufacturer during production and research. Common alloy resistance materials on the market include manganese-copper alloy, iron-chromium-aluminum alloy, constantan alloy, nickel-chromium alloy, Karma alloy, nickel-copper alloy and the like. The alloy resistance has low resistance, high stability and high power.

[0003] At present, most of the alloy resistances on the market adopt welding process, and the welding generally adopts electron beam welding, laser welding and resistance welding, and the main purpose is to splice and weld the resistance alloy material and the copper terminal. Since copper is a good heat sink and a good conductor, copper is very common as an electrode of resistance products in the field of alloy resistance.

[0004] However, the form of directly welding copper as an electrode at both ends of the resistance alloy material can only make good use of the conductivity of copper, and the heat dissipation performance of copper cannot be utilized because of the small contact area. After the heat of the resistance alloy material is partially conducted to the copper electrode, the copper electrode is cooled through air or the circuit board of the application end. The product of this process has a long heat conduction path and small conduction area, which causes the heat of the resistance alloy material to be not taken away in time, thereby reducing the performance of the product.

[0005] The above content is only used to assist in understanding the technical solutions of the present application, and does not represent the acknowledgement of the above content as prior art. SUMMARY

[0006] The main purpose of the present application is to provide an electrode resistance and a manufacturing method thereof, which aims to solve the above problems.

[0007] To achieve the above purpose, the present application provides a manufacturing method of an electrode resistance, which comprises the following steps:

[0008] The copper layer and the resistance alloy layer are pressed together under high pressure through a preset adhesive film to form a laminated structure, wherein the thermal conductivity of the preset adhesive film is greater than 3W / m·K, the voltage resistance is greater than 60KV / mm, and the high pressure is a pressure greater than 10KG of vacuum;

[0009] According to the resistance value pattern, the resistance alloy layer and the copper layer in the laminated structure are etched completely to expose the preset adhesive film, wherein a first etching groove is formed when etching the copper layer in the laminated structure, and the ratio of the groove depth to the groove width of the first etching groove is A, A is greater than or equal to 1 / 2;

[0010] The first etching groove is filled with structural adhesive, so that the first etching groove is in a filled state, and the height of the filled structural adhesive does not exceed the outer edge of the first etching groove;

[0011] The laminated structure after filling the structural adhesive is adjusted in resistance, silk-screen printed, glued, electroplated and granulated.

[0012] Preferably, in the manufacturing method of the electrode resistance, the step of pressing the copper layer and the resistance alloy layer together through the preset adhesive film under high pressure to form a laminated structure comprises:

[0013] The copper layer, the preset adhesive film and the resistance alloy layer are pressed together to form a to-be-pressed structure; and the to-be-pressed structure is placed in an opening of an electrically driven press and vacuumized;

[0014] The press is pressurized to a first pressure, at this time, the temperature is raised from room temperature to a preset first temperature, at this time, the copper layer is electrified, the electrification of the copper layer generates heat to heat and soften the preset adhesive film, and the first preset time is maintained and filled between the copper layer and the resistance alloy layer;

[0015] The temperature is lowered to a preset second temperature, and the laminated structure after pressing is obtained after the preset adhesive film is solidified.

[0016] Preferably, in the manufacturing method of the electrode resistance, the first temperature is 180-190℃;

[0017] The second temperature is room temperature;

[0018] The temperature rising rate from room temperature to the first temperature is 15-18℃ / min;

[0019] The first preset time is 4-5min;

[0020] The temperature lowering rate from room temperature to the second temperature is 5-15℃ / min.

[0021] Preferably, in the manufacturing method of the electrode resistance, the second temperature is 31-40℃.

[0022] Preferably, in the manufacturing method of the electrode resistance, A is 1:1.

[0023] Preferably, in the manufacturing method of the electrode resistance, in the step of filling the structural glue into the first etching groove so that the first etching groove is filled and the height of the filled structural glue does not exceed the outer edge of the first etching groove, the filling of the structural glue into the first etching groove needs to be filled to a thickness consistent with the groove depth and the filling thickness is allowed to be negative tolerance relative to the groove depth by not more than 0.05 mm.

[0024] Preferably, in the manufacturing method of the electrode resistance, in the steps of adjusting the resistance, silk printing, glue making, plating and particle separation for the stacked structure after the structural glue is filled, the adjusting of the resistance includes:

[0025] According to the preset resistance value, the pattern of the resistance alloy layer of each product is corrected so that the pattern of the product corresponds to the preset resistance value.

[0026] Preferably, in the manufacturing method of the electrode resistance, the laser is used to adjust the resistance when the resistance is adjusted, wherein,

[0027] The laser power accounts for 60%-90% of the power of the laser;

[0028] The laser frequency is greater than 2000 Hz;

[0029] The corresponding relationship between the cutting length of the resistance alloy layer and the resistance value is as follows:

[0030] y=0.0264x 2 -0.0876x+5.0955;

[0031] Wherein, x is the length of the laser cutting, x≤2 mm;

[0032] y is the resistance value of the resistance of the resistance alloy layer.

[0033] Preferably, in the manufacturing method of the electrode resistance, in the steps of adjusting the resistance, silk printing, glue making, plating and particle separation for the stacked structure after the structural glue is filled, the plating includes:

[0034] Partial plating, between the glue making and particle separation steps, targeted partial area plating, so that the lower copper layer and the upper resistance alloy layer are connected up and down;

[0035] Integral plating, after the particle separation step, the resistance after the cutting single particle is subjected to integral roll plating to plate a tin layer which is more convenient for the later application end.

[0036] In order to achieve the above-mentioned purpose, the application also provides an electrode resistance manufactured by the manufacturing method of the electrode resistance.

[0037] The application has at least the following beneficial effects:

[0038] The electrode resistance manufacturing method provided by the present application uses a copper layer of copper material as a heat-dissipating electrode and a conductor to improve the heat-dissipating efficiency of the resistance alloy material and the performance of the product.

[0039] Further, the copper material is directly attached to the bottom of the resistance alloy layer, and the heat generated by the working load of the resistance alloy layer is quickly conducted away through the intermediate high-voltage high-thermal-conductivity preset adhesive layer to ensure the thermal stability of the resistance alloy layer and achieve the characteristics of high-power use.

[0040] Further, the etching controllability of the process can realize the demand for multiple resistance values in one material, cause the structure of a large electrode, and the heat dissipation condition does not change, so that different resistance values can still realize the load work under the same power.

[0041] Further, the original welding process in the prior art resistance processing process is difficult to shorten the heat conduction path and increase the conduction area, and the present application provides an electrode resistance product capable of shortening the heat conduction path and increasing the conduction area. BRIEF DESCRIPTION OF DRAWINGS

[0042] Figure 1 is a process diagram of the electrode resistance manufacturing method of the present application;

[0043] Figure 2 is a schematic diagram of an embodiment of the electrode resistance manufacturing method of the present application;

[0044] Figure 3 is Figure 2 a schematic diagram of the middle laminated structure;

[0045] Figure 4 is Figure 3 an enlarged schematic diagram of the X position.

[0046] 1-laminated structure, 11-copper layer, 12-preset adhesive film, 13-resistance alloy layer. DETAILED DESCRIPTION

[0047] The technical solutions of the present application will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, not all. In the following, the present application will be described in detail with reference to the accompanying drawings and embodiments. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0048] The term ''and / or'' in the embodiments of the present application describes the association relationship of the associated objects, and indicates that there can be three relationships, for example, A and / or B can represent the following three cases: A exists alone, A and B exist together, and B exists alone. The character '' / '' generally represents an ''or'' relationship between the associated objects before and after it.

[0049] It should be noted that the terms ''first'', ''second'', and the like in the specification and claims of the present application and the above-described drawings are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence.

[0050] The term ''a plurality of'' in the embodiments of the present application refers to two or more, and other quantifiers are similar.

[0051] In the present application, unless otherwise stated, the orientation words such as ''upper'', ''lower'', ''top'', and ''bottom'' are generally directed to the directions shown in the drawings, or are directed to the vertical, perpendicular, or gravity directions of the components themselves; similarly, for the convenience of understanding and description, ''inner'' and ''outer'' refer to the inner and outer relative to the contour of each component itself, but the above orientation words are not used to limit the present application.

[0052] To make the purposes, technical solutions, and advantages of the embodiments of the present application clearer, the embodiments of the present application will be described in detail below with reference to the drawings. However, those skilled in the art can understand that in the embodiments of the present application, many technical details are proposed in order to make the readers better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed by the present application can be implemented. The following division of each embodiment is for the convenience of description, and should not constitute any limitation on the specific implementation mode of the present application, and each embodiment can be combined and referred to each other without contradiction.

[0053] The present application provides a manufacturing method of an electrode resistor, Figure 1 and Figure 2 A process of the manufacturing method of the electrode resistor is schematically shown.

[0054] At step 101, pressing. Please refer to Figure 3 and Figure 4 The copper layer 11 and the resistance alloy layer 13 are pressed together under high pressure through the preset adhesive film 12 to form a laminated structure 1; wherein the thermal conductivity of the preset adhesive film 12 is greater than 3 W / m·K, and the withstand voltage is greater than 60 KV / mm. The laminated structure 1 is similar to a sandwich structure, the bottom layer of the sandwich structure is the copper layer 11, the middle layer is the preset adhesive film 12, and the uppermost layer is the resistance alloy layer 13.

[0055] Compared with the traditional technology, which uses alumina ceramic as the base material, the heat dissipation is poor, and the thermal conductivity is 15W / (m·K) to 30W / (m·K), the present invention uses a copper layer 11 as the base material. The copper material itself is an excellent conductive and thermal conductive material with a thermal conductivity coefficient of about 401 (W / m·K); at the same time, through the adhesive film combined in the middle, the thermal conductivity can reach 3 (W / m·K), and the voltage resistance can reach 60KV / mm, which can make the product have better thermal conductivity and long-term reliability as a whole. In addition, with the help of a vacuum pressure of 10KG, the copper layer 11, the preset adhesive film 12, and the resistance alloy layer 13 are pressed into a laminated structure 1. After the copper layer 11 (usually copper) is etched into a large electrode through the back-end processing, the heat generated by the load of the resistance product can be well conducted away by the copper layer 11 through the preset adhesive film 12, so that the product has a lower surface temperature rise than the traditional ceramic substrate resistor.

[0056] Specifically, during lamination, the copper layer 11, the preset adhesive film 12, and the resistance alloy layer 13 can be pre-pressed together to form a structure to be pressed. The structure to be pressed is then placed in the opening of an electrically driven press and evacuated. The press is then pressurized to a first pressure, while the temperature is raised from room temperature to a preset first temperature. At this point, the copper layer 11 is energized, and the heat generated by the copper layer 11 heats and softens the preset adhesive film 12, which is maintained for a first preset time and filled between the copper layer 11 and the resistance alloy layer 13. The temperature is then lowered to a preset second temperature, and after the preset adhesive film 12 solidifies, the laminated structure 1 is obtained after lamination.

[0057] The first pressure vacuum is greater than 10 kg. The first temperature is 180°C to 190°C. The second temperature may be room temperature. The heating rate from room temperature to the first temperature is 15°C / min to 18°C / min. The first preset time is 4 minutes to 5 minutes. The cooling rate from the preset second temperature is 5°C / min to 15°C / min. The second temperature is 31°C to 40°C.

[0058] Furthermore, the use of an electrically driven press can make the temperature of each layer uniform. By raising the temperature to 180℃-190℃ and maintaining it at the first temperature for 4min-5min, rapid lamination is performed in a short time, and the first preset adhesive film 12 is quickly filled, which can greatly shorten the lamination time and improve the lamination efficiency.

[0059] Furthermore, when the electric press is pressed, the copper layer 11 is energized and heated to soften the preset adhesive film 12, and then the temperature is cooled to 31°C-40°C at a rate of 5°C / min-15°C / min after a short period of time. There is no need to eliminate stress by baking. In this way, the curing process does not need to be completed in the press, and conventional baking equipment (such as an oven) can be used to complete it, saving the use time of the press.

[0060] It is worth noting that the electric press has a large difference in heating mode compared with the traditional press, and the temperature difference of each layer of the traditional press is very large, while the electric press used in the present application can make the temperature of each layer closer.

[0061] The traditional press is pressed for a long time (at least 3-5 hours each time) and stress is eliminated by baking, which is low in efficiency, has a large temperature difference between the inner and outer layers, and needs to prolong the pressing time to meet the pressing demand; while the present application can be pressed in a short time by using the above pressing parameters and the electric press, and the preset adhesive film 12 can be filled in the press, and the baking is only used to assist the curing and does not need to be specially used to eliminate stress.

[0062] At step 102, etching. According to the resistance pattern, the resistance alloy layer 13 and the copper layer 11 in the laminated structure 1 are etched completely to expose the preset adhesive film 12, wherein a first etching groove is formed when etching the copper layer 11 in the laminated structure 1, and the ratio of the groove depth to the groove width of the first etching groove is A, A is greater than or equal to 1 / 2.

[0063] Chemical etching is performed on the structure and size of the product for the copper layer 11 and the resistance alloy layer 13, the resistance alloy layer 13 is etched according to the designed pattern, and the copper layer 11 is etched according to the design requirements to make the large electrode of the product in the early stage. Because the etching process is used, different patterns can be designed on the surface of the resistance alloy material according to the resistance value requirement to meet the requirement of realizing different resistance values with the same material. In addition, the etching position on the copper material etching surface is in the middle of the resistance pattern on the surface of the resistance alloy material.

[0064] The etching process is mainly for the resistance alloy layer 13, and etching is performed according to the resistance pattern, and the etching position needs to be etched completely, that is, the middle preset adhesive film 12 layer needs to be exposed to prevent incomplete etching from causing short circuit or product resistance value not meeting the standard.

[0065] Similarly, the copper layer 11 etching is mainly to etch out the large electrode, and the etching needs to be complete, and the etching position needs to expose the middle preset adhesive film 12 layer to avoid incomplete etching of the product electrode part directly conducting and the product directly failing.

[0066] It is worth noting that the first etching groove formed by etching the copper layer 11 has a groove depth and groove width ratio, and the ratio of the groove depth to the groove width is greater than or equal to 1 / 2. In this embodiment, the groove width of the first etching groove is as consistent as possible with the groove depth under the premise of ensuring complete etching, such as the ratio of the groove depth to the groove width being 1:1, so as to obtain a larger electrode size to a greater extent, prevent the groove width from being too wide, and cause the electrode size to be small, and also reduce the structural strength of the product.

[0067] At step 103, filling glue. The first etching groove is filled with structural glue, so that the first etching groove is filled and the height of the filled structural glue does not exceed the outer edge of the first etching groove. By filling the first etching groove with structural glue, the large electrode can be blocked, and the product structure strength can be increased. When filling the first etching groove with structural glue, the thickness of the filling should be consistent with the groove depth. The filling thickness is allowed to be negative tolerance relative to the groove depth, which is not more than about 0.05 mm, but the filling cannot be more than the groove depth, which can cause overflow and result in unqualified product electrode surface flatness. For example, if the groove depth of the first etching groove is 1 mm, the thickness of the filled structural glue is D, 0.95 mm≤D≤1 mm. By filling the first etching groove with structural glue, the copper layer 11 etched into two large electrodes can be glued together to enhance the structural strength.

[0068] At step 104, adjusting resistance. After etching and filling glue, the substrate is further fine-tuned for each product on the surface of the resistance alloy layer 13 to the target resistance value accuracy. For the products processed in the previous process, in order to meet the resistance value accuracy requirements of customers, such as ±1% and ±0.5%, the laser thinning resistance adjustment method is commonly used to fine-tune the required accuracy range.

[0069] Specifically, the pattern of the resistance alloy layer 13 of each product is corrected according to the preset resistance value, so that the pattern of the product corresponds to the preset resistance value. The pattern correction of the resistance alloy layer 13 can be but not limited to laser.

[0070] Taking laser adjustment of resistance as an example, the parameters of laser usually include power, frequency, correction rate, etc. If the laser power is too high, it will cause large thermal damage to the surface of the resistance alloy layer 13; if only the peak value of the laser is high, it will cause insufficient heating time and cannot cut and adjust the resistance alloy layer 13; the part of the laser pulse peak value exceeding the damage threshold of the resistance alloy layer 13 will directly damage the surface of the resistance alloy layer 13, and the part below the damage threshold of the resistance alloy layer 13 will continuously heat the resistance alloy layer 13, and when the cumulative energy is high, it will cause thermal damage.

[0071] The effects of each parameter on adjusting resistance will be described below.

[0072] Generally, the laser power accounts for 60%-90% of the laser power. Too low or too high laser power will result in more slag when cutting the resistance alloy layer 13. With the increase of laser power, the temperature of the front edge during laser cutting can be increased, and the viscosity friction of the melted resistance alloy layer 13 can be reduced, which helps the gas to blow away the melted metal in the cutting seam; however, if the power is too high, the amount of melted resistance alloy layer 13 will increase, which will cause the excess melted resistance alloy layer 13 to be partially extruded to the back of the cutting seam, resulting in residual slag. In the embodiment, when the laser power accounts for 80% of the laser power, the residual slag is the least.

[0073] Too low or too high laser frequency will affect the quality of the laser cutting seam surface. For example, when the laser frequency is less than 1500Hz, the lower the laser frequency, the larger the wrinkles (also known as ripples) left by the laser cutting in the resistance alloy layer 13; when the laser frequency is greater than 2000Hz, the wrinkles left by the laser cutting in the resistance alloy layer 13 are very small and almost invisible. Therefore, in the embodiment, the laser frequency is greater than 2000Hz, at which time the wrinkles are very small, and the residual slag is the least under the same laser power.

[0074] The speed generally includes acceleration, uniform speed, variable speed, and deceleration, etc. Too low laser correction speed will result in too large energy density of the laser, which will cause the material around the cutting seam of the resistance alloy layer 13 to be melted, increasing the amount of slag, and even causing the cutting surface to be rough. Therefore, theoretically, the larger the laser correction speed, the better; however, too large laser cutting speed will cause the airflow speed to not have enough time to switch from the outside to the inside of the resistance alloy layer 13 before the laser starts cutting, which will cause the airflow speed to decrease, resulting in a decrease in cooling effect and overall effect. In the embodiment, the cutting speed is 79mm / s-80mm / s, at which time the effect is the best.

[0075] The cutting length of the resistance alloy layer 13 has a certain correspondence with the resistance value, which can be adjusted according to the resistance to determine the length to be cut. The calculation formula is as follows:

[0076] y=0.0264x 2 -0.0876x+5.0955;

[0077] Wherein, x is the length of laser cutting, x≤2mm;

[0078] y is the resistance value of the resistance alloy layer 13.

[0079] At step 105, silk printing. The whole resistance alloy layer 13 of the product treated in step 104 is silk printed in full coverage form, to prepare for the subsequent electroplating process, to avoid the whole resistance alloy layer 13 being plated, and to simultaneously play a role of protecting the surface of the resistance product. The silk printing can adopt a conventional silk printing mode, which is not specifically limited here.

[0080] At step 106, gluing. The silk printed product is glued in a local area with respect to the silk printed resistance alloy layer 13. The silk printing layer and the intermediate preset glue film 12 layer are knocked off, and the local area exposes the lower copper layer 11.

[0081] The application glues the silk printed product in a local area with respect to the silk printed resistance alloy material surface, knocks off the silk printing layer and the intermediate preset glue film 12 layer, and exposes the lower copper layer 11 in the local area, so that the problem of poor electroplating effect, inability to conduct electricity and inability to plate can be effectively avoided when there is residual glue.

[0082] At step 107, local electroplating. The product after gluing is electroplated in a targeted local area, so that the lower copper layer 11 and the upper resistance alloy layer 13 are connected in an up-down manner.

[0083] At step 108, particle separation. The product after electroplating is cut into particles to obtain each alloy resistance.

[0084] At step 109, overall electroplating. The resistance after cutting into single particles is overall barrel plated to plate a tin layer which is more convenient for the application end to use in the later period.

[0085] At step 110, package testing. The single particle resistance after electroplating is tested for resistance value accuracy range and is packaged, to complete the product processing of the whole electrode resistance process.

[0086] The etching process at step 102 of the application is first shaped, the copper layer 11 is divided into two sides according to the electrode demand, and the product before step 107 is still in a non-conductive state. In this state, the resistance is invalid, because the resistance electrode has not been designed to be conductive, and after step 107 is completed, the upper and lower layers are connected, that is, it has become a product with a large electrode and a conductive product. After particle separation, a complete alloy resistance semi-finished product with a heat dissipation electrode and a copper material and a resistance alloy material is obtained.

[0087] The electrode resistance manufacturing method provided by the application uses a copper layer 11 of copper material as a heat dissipation electrode and a conductor to improve the heat dissipation efficiency of the resistance alloy material and improve the performance of the product.

[0088] Further, since the copper material is directly attached to the bottom of the resistance alloy layer 13, the heat generated by the working load of the resistance alloy layer 13 is rapidly conducted away through the intermediate high-voltage high-thermal-conductivity preset glue layer, so as to ensure the thermal stability of the resistance alloy layer 13 and achieve the characteristics of high-power use.

[0089] Further, since the etching controllability of the process can realize the demand of multiple resistance values under the premise of one material, the structure of the large electrode is caused, the heat dissipation condition is not changed, and therefore the load working under the same power can be realized under different resistance values.

[0090] The application also provides an electrode resistor manufactured by the manufacturing method. The embodiments of the electrode resistor include the embodiments of the manufacturing method, and the advantages of the manufacturing method can also be applied to the electrode resistor.

[0091] Obviously, the above-described embodiments are only some of the embodiments of the application, but not all the embodiments. Based on the embodiments of the application, other different forms of changes or modifications can be made by those skilled in the art without creative labor, and all should belong to the protection scope of the application.

Claims

1. A method for manufacturing an electrode resistor, characterized in that: The manufacturing method comprises: The copper layer and the resistance alloy layer are pressed together under high pressure through a preset adhesive film to form a laminated structure; wherein the preset adhesive film has a thermal conductivity greater than 3W / m·K and a withstand voltage greater than 60KV / mm, and the high pressure is a vacuum pressure greater than 10KG; According to the resistance value pattern, the resistor alloy layer and the copper layer in the laminated structure are completely etched to expose the preset adhesive film, wherein a first etched groove is formed when etching the copper layer in the laminated structure, and the ratio of the groove depth to the groove width of the first etched groove is A, A is greater than or equal to 1 / 2; Filling the first etching groove with structural adhesive so that the first etching groove is filled and leveled, and the height of the filled structural adhesive does not exceed the outer edge of the first etching groove; Adjust the resistance, screen print, glue, electroplating and granulation of the laminated structure after filling with structural glue; The glue application includes: applying glue to a local area of ​​the resistor alloy layer after silk screen printing, removing the silk screen layer and the preset glue film layer in the middle, and exposing the copper layer underneath in the local area; In the steps of adjusting the resistance, silk-screening, gluing, electroplating and granulation of the laminated structure after filling the structural glue, the electroplating includes: Local electroplating: between the steps of glue application and particle separation, targeted local area electroplating is performed to connect the lower copper layer with the upper resistance alloy layer; In the overall electroplating, after the grain separation step, the resistors after being cut into single grains are subjected to the form of overall roller plating, and a layer of tin is plated on them, which is more convenient for use in later applications.

2. The method for manufacturing an electrode resistor according to claim 1, wherein: The method of laminating the copper layer and the resistance alloy layer together under high pressure via a preset adhesive film to form a laminated structure includes: The copper layer, the preset adhesive film, and the resistance alloy layer are pre-pressed together to form a structure to be pressed; the structure to be pressed is then placed in the opening of an electrically driven press and vacuumed; The press is pressurized to a first pressure, and the temperature is raised from room temperature to a preset first temperature. At this time, the copper layer is energized, and the copper layer is heated and softened by heating. The preset adhesive film is heated and softened for a first preset time, and is filled between the copper layer and the resistance alloy layer. The temperature is lowered to a preset second temperature, and the laminated structure is obtained after the preset adhesive film is solidified.

3. The method for manufacturing an electrode resistor according to claim 2, wherein: The first temperature is 180°C-190°C; The second temperature is room temperature; The heating rate from room temperature to the first temperature is 15°C / min-18°C / min; The first preset duration is 4min-5min; The cooling rate to the preset second temperature is 5°C / min-15°C / min.

4. The method for manufacturing an electrode resistor according to claim 2, wherein: The second temperature is 31°C-40°C.

5. The method for manufacturing an electrode resistor according to claim 1, wherein: A is 1:

1.

6. The method for manufacturing an electrode resistor according to claim 1, wherein: In the step of filling the first etching groove with structural adhesive so that the first etching groove is filled and leveled, and the height of the filled structural adhesive does not exceed the outer edge of the first etching groove, when filling the first etching groove with structural adhesive and leveling the groove with a thickness consistent with the groove depth, the negative tolerance of the filling thickness relative to the groove depth is allowed to not exceed 0.05 mm.

7. The method for manufacturing an electrode resistor according to claim 1, wherein: For the laminated structure after filling with structural glue, adjusting the resistance, silk screen printing, glue application, electroplating and grain separation, adjusting the resistance includes: The pattern of the resistance alloy layer of each product is modified according to the preset resistance value so that the pattern of the product corresponds to the preset resistance value.

8. The method for manufacturing an electrode resistor according to claim 7, wherein: The resistance is adjusted by laser, where Laser power accounts for 60%-90% of the laser power; Laser frequency is greater than 2000Hz; The corresponding relationship between the cutting length of the resistance alloy layer and the resistance value is as follows: ； Wherein, x is the length of laser cutting, x≤2mm; y is the resistance value of the resistance alloy layer.

9. An electrode resistor, characterized in that: The electrode resistor is manufactured using the method for manufacturing an electrode resistor according to any one of claims 1 to 8.

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