A chip surface precision drilling process and system based on optical detection

Abstract

The present invention belongs to the technical field of chip processing supervision, and specifically is a chip surface precision punching process and system based on optical detection, wherein the system includes a processor, a chip design module, a chip punching module, an optical detection module, a comparison correction compensation module and a touch display warning module; the present invention analyzes the position accuracy of the chip to be punched and the adverse factors affecting the chip punching in the punching operation area before punching through a position accuracy verification module and a regional impact verification module, and punches holes on the chip surface one by one when generating a high-precision position signal and a low-impact regional signal; the comparison correction compensation module identifies pseudo through holes based on the punched chip image, and enables the laser punching equipment to perform compensatory punching on the chip surface, thereby improving the through hole rate of the chip, ensuring the accuracy and consistency of the chip surface punching, and significantly improving product quality and chip production efficiency, with a high level of intelligence and automation.

Description

Technical Field

[0001] The present invention relates to the field of chip processing supervision technology, and specifically to a chip surface precision drilling process and system based on optical detection. Background Art

[0002] With the rapid development of integrated circuit technology, chip packaging technology is also facing higher and higher requirements. Especially in large-board fan-out packaging technology, the chip surface needs to be punched with a large number of high-precision holes according to the designed circuit diagram to achieve interconnection between multiple chips and circuit conduction between different circuit layers inside the chip.

[0003] At present, the chip surface is mainly punched by laser drilling technology. However, before the chip is punched, it is impossible to reasonably analyze the position accuracy of the chip to be punched and the adverse factors affecting the chip drilling in the punching operation area and timely warn. In addition, when the chip surface is punched, it is easy to produce a situation where the aperture cannot be completely opened, the aperture conductivity is low, and it is difficult to ensure the accuracy and consistency of the chip surface drilling, which is not conducive to improving product quality and chip production efficiency.

[0004] In view of the above technical defects, a solution is now proposed. Summary of the invention

[0005] The purpose of the present invention is to provide a chip surface precision drilling process and system based on optical detection, which solves the problem that the prior art is unable to reasonably analyze and timely warn the position accuracy of the chip to be punched and the adverse factors affecting the chip drilling in the drilling operation area before chip drilling, and is prone to the situation where the aperture cannot be completely drilled when drilling the chip surface, which is not conducive to improving product quality and chip production efficiency.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A chip surface precision punching system based on optical detection, comprising a processor, a chip design module, a chip punching module, an optical detection module, a comparison correction compensation module and a touch display warning module;

[0008] The chip design module is used to design a circuit aperture diagram of the chip to be punched, and send the circuit aperture diagram of the chip to be punched to the processor for storage;

[0009] Before drilling, the operator places and fixes the chip to be drilled in the drilling operation area. The chip drilling module obtains the coordinate information of all the points to be drilled on the chip to be drilled based on the circuit aperture map, and drills holes one by one on the chip surface based on the coordinate information of the points to be drilled through the laser drilling equipment.

[0010] The optical inspection module uses a high-resolution linear array CCD camera to take pictures of the punched chips, and sends the captured chip images to the comparison, correction and compensation module through the processor;

[0011] The comparison, correction and compensation module identifies the pseudo-through holes on the chip based on the chip image and records the coordinate information of the identified pseudo-through holes. The chip punching module uses the coordinate information of the pseudo-through holes to enable the laser punching equipment to perform compensatory punching on the chip surface until all the pseudo-through holes on the chip are corrected to be completely through.

[0012] Further, the processor is communicatively connected to the position accuracy verification module, the position accuracy verification module obtains the punching operation area, establishes a three-dimensional coordinate system of the punching operation area, and analyzes the position accuracy of the chip to be punched before punching;

[0013] A high-precision position signal or a low-precision position signal is generated through analysis, and the high-precision position signal or the low-precision position signal is sent to the touch display warning module through the processor. The touch display warning module issues a corresponding warning when receiving the low-precision position signal.

[0014] Furthermore, the specific analysis process of the position accuracy verification module includes:

[0015] A number of detection points are set on the chip to be punched, and the chip point deviation value is obtained based on the position deviation distance between the actual coordinates of the corresponding detection point in the three-dimensional coordinate system and the corresponding standard coordinates. The chip point deviation value is numerically compared with the preset chip point deviation threshold. If the chip point deviation value exceeds the preset chip point deviation threshold, the corresponding detection point is marked as a chip abnormal point; if a chip abnormal point exists, a position low precision signal is generated.

[0016] Furthermore, if there is no chip abnormality point, the chip point deviation values ​​of all detection points are averaged to obtain the chip position detection value, and the chip position detection value is numerically compared with the preset chip position detection threshold. If the chip position detection value exceeds the preset chip position detection threshold, a low position precision signal is generated; if the chip position detection value does not exceed the preset chip position detection threshold, a high position precision signal is generated.

[0017] Further, the position accuracy verification module is communicatively connected to the regional impact verification module, the position accuracy verification module sends a high-precision position signal to the regional impact verification module, and the regional impact verification module analyzes the adverse factors affecting chip drilling in the drilling operation area upon receiving the high-precision position signal;

[0018] A regional low impact signal or a regional high impact signal is generated through analysis, and the regional low impact signal or the regional high impact signal is sent to the touch display warning module via the processor. The touch display warning module issues a corresponding warning when receiving the regional high impact signal.

[0019] Furthermore, the specific analysis process of the regional impact verification module is as follows:

[0020] The vibration amplitude and vibration frequency of the lower supporting part of the chip to be punched are obtained, and the vibration amplitude and vibration frequency are numerically compared with the preset vibration amplitude threshold and the preset vibration frequency threshold, respectively. If the vibration amplitude or the vibration frequency exceeds the corresponding preset threshold, a regional high impact signal is generated;

[0021] If the vibration amplitude and the vibration frequency do not exceed the corresponding preset threshold values, the deviation value of the ambient temperature in the punching operation area compared to the preset suitable temperature standard value is marked as the punching temperature anomaly value, and the deviation value of the ambient humidity in the punching operation area compared to the preset suitable humidity standard value is marked as the punching humidity anomaly value, and the dust concentration in the punching operation area is marked as the punching net anomaly value;

[0022] The regional impact assessment value is obtained by numerically calculating the vibration amplitude, vibration frequency, drilling temperature difference, drilling moisture difference and drilling net difference. The regional impact assessment value is numerically compared with the preset regional impact assessment threshold. If the regional impact assessment value exceeds the preset regional impact assessment threshold, a regional high impact signal is generated; if the regional impact assessment value does not exceed the preset regional impact assessment threshold, a regional low impact signal is generated.

[0023] Furthermore, the comparison, correction and compensation module is also used to identify cracks, misaligned holes and holes with abnormal shapes and sizes on the chip. If it is determined after identification that there are cracks, misaligned holes or holes with abnormal shapes and sizes on the chip, the corresponding chip will be marked as a non-essential chip for correction. After the corresponding chip is marked as a non-essential chip for correction, pseudo-through hole identification and compensatory drilling will no longer be performed on the chip.

[0024] Further, the processor is communicatively connected to the punching periodicity evaluation module, which is used to set the detection period, conduct a comprehensive evaluation and analysis on the punching performance of the chip within the detection period, generate a punching evaluation failure signal or a punching evaluation success signal through the analysis, and send the punching evaluation failure signal or the punching evaluation success signal to the touch display warning module via the processor, and the touch display warning module issues a corresponding warning when receiving the punching evaluation failure signal; the specific analysis process is as follows:

[0025] The number of chips that are punched during the detection period is marked as the chip punching number inspection value, and the number of chips that are marked as corrected non-essential chips after punching during the detection period is marked as the chip operation anomaly inspection value. The ratio of the chip operation anomaly inspection value to the chip punching number inspection value is marked as the chip punching anomaly analysis value, and the chip punching anomaly analysis value is numerically compared with the preset chip punching anomaly analysis threshold. If the chip punching anomaly analysis value exceeds the preset chip punching anomaly analysis threshold, a punching evaluation unqualified signal is generated.

[0026] Furthermore, if the chip punching anomaly value does not exceed the preset chip punching anomaly threshold, all the punching good chips in the detection period are obtained and their number is marked as the punching good number inspection value, wherein the punching good chip means a chip that is not marked as a non-essential chip for correction, does not need to perform compensatory punching, and the actual punching operation time does not exceed the corresponding preset punching operation time threshold;

[0027] The ratio of the punching operation optimization value to the chip punching number detection value is marked as the chip punching optimization value, and the deviation value between the actual punching operation time of the corresponding punching optimization chip and the corresponding preset punching operation time threshold is marked as the punching advance time, and the punching advance time of all the punching optimization chips in the detection period is averaged to obtain the punching advance time value;

[0028] The punching periodicity evaluation coefficient is obtained by numerically calculating the chip punching anomaly analysis value, the chip punching optimization analysis value and the punching advance time value, and the punching periodicity evaluation coefficient is numerically compared with the preset punching periodicity evaluation coefficient threshold. If the punching periodicity evaluation coefficient exceeds the preset punching periodicity evaluation coefficient threshold, a punching evaluation qualified signal is generated; if the punching periodicity evaluation coefficient does not exceed the preset punching periodicity evaluation coefficient threshold, a punching evaluation unqualified signal is generated.

[0029] Furthermore, the present invention also proposes a chip surface precision drilling process based on optical detection, comprising the following steps:

[0030] Step 1: designing a circuit aperture diagram of the chip to be punched, and sending the circuit aperture diagram of the chip to be punched to a processor for storage;

[0031] Step 2: Place and fix the chip to be punched in the punching operation area, and analyze the position accuracy of the chip to be punched and the unfavorable factors affecting chip punching in the punching operation area;

[0032] Step 3: When generating the high-precision position signal and the low-impact regional signal, the chip punching module determines the coordinate information of all the points to be punched on the chip to be punched based on the circuit aperture map, and punches holes one by one on the chip surface through the laser punching equipment;

[0033] Step 4: The optical inspection module uses a high-resolution linear array CCD camera to take a picture of the punched chip, and sends the captured chip image to the comparison, correction and compensation module;

[0034] Step 5: The comparison, correction and compensation module identifies the pseudo through holes on the chip based on the chip image, and enables the laser drilling equipment to perform compensatory drilling on the chip surface based on the coordinate information of the pseudo through holes until all the pseudo through holes on the chip are corrected to be completely through.

[0035] Compared with the prior art, the present invention has the following beneficial effects:

[0036] 1. In the present invention, the position accuracy of the chip to be punched and the adverse factors affecting chip punching in the punching operation area are analyzed before punching through the position accuracy verification module and the area impact verification module. When the position high-precision signal and the area low-impact signal are generated, the chip surface is punched one by one. The comparison correction compensation module identifies the pseudo through-hole based on the punched chip image and performs compensatory punching, thereby improving the through-hole rate of the chip, ensuring the accuracy and consistency of the punching on the chip surface, significantly improving the product quality and chip production efficiency, and having a high level of intelligence and automation;

[0037] 2. In the present invention, the punching performance of the chip within the detection period is comprehensively evaluated and analyzed through the punching periodic evaluation module, and a punching evaluation failure signal or a punching evaluation success signal is generated through the analysis. When the punching evaluation failure signal is generated, the touch display warning module issues a warning, so as to conduct timely cause investigation and analysis, and inspect and repair the corresponding components or optimize the corresponding punching control program, so as to further ensure the subsequent punching effect and efficiency of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with the accompanying drawings;

[0039] Figure 1 This is a system block diagram of Embodiment 1 of the present invention;

[0040] Figure 2 This is a system block diagram of Embodiment 2 of the present invention;

[0041] Figure 3 This is a flow chart of the method of Embodiment 3 of the present invention. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] Embodiment 1: Figure 1 As shown, the present invention proposes a chip surface precision punching system based on optical detection, including a processor, a chip design module, a position accuracy verification module, a regional impact verification module, a chip punching module, an optical detection module, a comparison correction compensation module and a touch display warning module;

[0044] The chip design module is used to design the circuit aperture diagram of the chip to be punched (the circuit aperture diagram of the chip to be punched refers to the design drawing used to guide the precise punching operation on the chip surface. It details the key information such as the location of the holes to be punched on the chip, the size of the holes, and the shape of the holes), and sends the circuit aperture diagram of the chip to be punched to the processor for storage.

[0045] Before punching, the operator places and fixes the chip to be punched in the punching operation area, the position accuracy verification module obtains the punching operation area, and establishes a three-dimensional coordinate system of the punching operation area, and analyzes the position accuracy of the chip to be punched before punching; a high-precision position signal or a low-precision position signal is generated through the analysis, and the high-precision position signal or the low-precision position signal is sent to the touch display warning module through the processor;

[0046] When the touch display warning module receives the low position accuracy signal, it issues a corresponding warning so that the operator can check and adjust the position of the chip to be punched in time, which is conducive to ensuring the stability of the punching operation and improving the accuracy of the chip surface punching. Among them, the specific analysis process of the position accuracy verification module is as follows:

[0047] A number of detection points are set on the chip to be punched, and a chip point deviation value is obtained based on the position deviation distance between the actual coordinates of the corresponding detection point in the three-dimensional coordinate system and the corresponding standard coordinates. The chip point deviation value is numerically compared with a preset chip point deviation threshold. If the chip point deviation value exceeds the preset chip point deviation threshold, the corresponding detection point is marked as a chip abnormal point; if there is a chip abnormal point, it indicates that the position condition of the chip to be punched is relatively abnormal, and a position low precision signal is generated;

[0048] If there is no chip abnormality point, the chip point deviation values ​​of all detection points are averaged to obtain the chip position detection value, and the chip position detection value is numerically compared with the preset chip position detection threshold. If the chip position detection value exceeds the preset chip position detection threshold, it indicates that the position condition of the chip to be punched is relatively abnormal, and a low position precision signal is generated; if the chip position detection value does not exceed the preset chip position detection threshold, it indicates that the position condition of the chip to be punched is relatively normal, and a high position precision signal is generated.

[0049] In addition, the position accuracy verification module sends the high-precision position signal to the regional impact verification module. When receiving the high-precision position signal, the regional impact verification module analyzes the adverse factors affecting chip punching in the punching operation area; generates a regional low-impact signal or a regional high-impact signal through the analysis, and sends the regional low-impact signal or the regional high-impact signal to the touch display warning module via the processor;

[0050] When the touch display warning module receives a high-impact signal from the area, it issues a corresponding warning so that the operator can promptly investigate the cause and make reasonable control measures to further reduce the adverse effects on the drilling accuracy. The specific analysis process of the regional impact verification module is as follows:

[0051] The vibration amplitude and vibration frequency of the bearing part below the chip to be punched are obtained, and the vibration amplitude and vibration frequency are numerically compared with the preset vibration amplitude threshold and the preset vibration frequency threshold respectively. If the vibration amplitude or vibration frequency exceeds the corresponding preset threshold, it indicates that the vibration condition of the position of the chip to be punched is abnormal, which is not conducive to ensuring the accuracy of punching, and a regional high-impact signal is generated;

[0052] If the vibration amplitude and the vibration frequency do not exceed the corresponding preset threshold values, the deviation value of the ambient temperature in the punching operation area compared to the preset suitable temperature standard value is marked as the punching temperature anomaly value, and the deviation value of the ambient humidity in the punching operation area compared to the preset suitable humidity standard value is marked as the punching humidity anomaly value, and the dust concentration in the punching operation area is marked as the punching net anomaly value;

[0053] The vibration amplitude QN, the vibration frequency QS, the drilling temperature difference QF, the drilling moisture difference QS and the drilling net difference QY are numerically calculated by the formula QX=(c1*QN+c2*QS+c3*QF+c4*QS+c5*QY) / 5 to obtain the regional impact assessment value QX; wherein c1, c2, c3, c4, c5 are preset proportional coefficients with values ​​greater than zero, and the larger the value of the regional impact assessment value QX, the greater the degree of influence of the adverse factors affecting chip drilling in the drilling operation area;

[0054] The regional impact assessment value QX is numerically compared with the preset regional impact assessment threshold. If the regional impact assessment value QX exceeds the preset regional impact assessment threshold, it indicates that the adverse factors affecting chip punching in the punching operation area have a large impact, and a regional high impact signal is generated; if the regional impact assessment value QX does not exceed the preset regional impact assessment threshold, it indicates that the adverse factors affecting chip punching in the punching operation area have a small impact, and a regional low impact signal is generated.

[0055] The chip punching module obtains the coordinate information of all the points to be punched on the chip to be punched based on the circuit aperture diagram, and punches holes one by one on the chip surface based on the coordinate information of the points to be punched through a laser punching device; the optical detection module uses a high-resolution linear array CCD camera to take pictures of the punched chip, and sends the captured chip image to the comparison, correction and compensation module through the processor.

[0056] The comparison, correction and compensation module identifies the pseudo-through holes on the chip based on the chip image and records the coordinate information of the identified pseudo-through holes. The chip punching module uses the coordinate information of the pseudo-through holes to enable the laser punching equipment to perform compensatory punching on the chip surface until all the pseudo-through holes on the chip are corrected to be completely through, which solves the problems of the existing punching technology such as the inability to completely open the aperture and the low aperture conductivity. Through optical detection and automatic correction technology, it can ensure that each aperture is completely opened, improve the chip's through-hole rate, reduce chip failure and repair costs caused by pseudo-through holes, ensure the accuracy and consistency of chip surface punching, and improve product quality and chip production efficiency.

[0057] It should be noted that the comparison, correction and compensation module is also used to identify cracks, misaligned holes and holes with abnormal shapes and sizes on the chip. If it is determined after identification that there are cracks, misaligned holes or holes with abnormal shapes and sizes on the chip (indicating that the corresponding chip has obvious abnormal defects and is likely to be scrapped), the corresponding chip will be marked as a non-essential chip for correction. After the corresponding chip is marked as a non-essential chip for correction, pseudo-through hole identification and compensatory punching will no longer be performed on the chip, thereby reducing unnecessary operations.

[0058] Embodiment 2: Figure 2 As shown, the difference between this embodiment and the first embodiment is that the processor is communicatively connected to the punching periodicity evaluation module, and the punching periodicity evaluation module is used to set the detection period, preferably, the detection period is three days; a comprehensive evaluation and analysis is performed on the punching performance of the chip within the detection period, and a punching evaluation failure signal or a punching evaluation qualified signal is generated through the analysis, and the punching evaluation failure signal or the punching evaluation qualified signal is sent to the touch display warning module via the processor;

[0059] When the touch display warning module receives a signal indicating that the punching evaluation is unqualified, it issues a corresponding warning so that the cause can be investigated and analyzed in time, and the corresponding components can be inspected and repaired or the corresponding punching control program can be optimized to further ensure the subsequent punching effect and efficiency of the chip, with a high degree of intelligence. The specific analysis process is as follows:

[0060] The number of chips that are punched during the detection cycle is marked as the chip punching number inspection value, and the number of chips that are marked as corrected non-essential chips after punching during the detection cycle is marked as the chip operation anomaly inspection value, the ratio of the chip operation anomaly inspection value to the chip punching number inspection value is marked as the chip punching anomaly analysis value, and the chip punching anomaly analysis value is numerically compared with the preset chip punching anomaly analysis threshold. If the chip punching anomaly analysis value exceeds the preset chip punching anomaly analysis threshold, it indicates that the punching effect of the chip during the detection cycle is not good, and a punching evaluation failure signal is generated.

[0061] Furthermore, if the chip punching anomaly value does not exceed the preset chip punching anomaly threshold, all the punching good chips in the detection period are obtained and their number is marked as the punching good number inspection value; wherein, the punching good chip means a chip that is not marked as a non-essential chip for correction, does not need to perform compensatory punching, and the actual punching operation time does not exceed the corresponding preset punching operation time threshold, and the three conditions must be met at the same time;

[0062] The ratio of the punching operation optimization value to the chip punching number detection value is marked as the chip punching optimization value, and the deviation value between the actual punching operation time of the corresponding punching optimization chip and the corresponding preset punching operation time threshold is marked as the punching advance time, and the punching advance time of all the punching optimization chips in the detection period is averaged to obtain the punching advance time value;

[0063] By formula The chip punching abnormal analysis value YM, the chip punching optimal analysis value YF and the punching time value YS are numerically calculated to obtain the punching periodicity evaluation coefficient YP; wherein, ehu1, ehu2, and ehu3 are preset proportional coefficients with values ​​greater than zero, and the larger the value of the punching periodicity evaluation coefficient YP is, the better the overall performance of the chip punching during the detection period is;

[0064] The punching periodicity evaluation coefficient YP is numerically compared with the preset punching periodicity evaluation coefficient threshold. If the punching periodicity evaluation coefficient YP exceeds the preset punching periodicity evaluation coefficient threshold, it indicates that the punching performance of the chip during the detection period is generally good, and a punching evaluation qualified signal is generated; if the punching periodicity evaluation coefficient YP does not exceed the preset punching periodicity evaluation coefficient threshold, it indicates that the punching performance of the chip during the detection period is generally poor, and a punching evaluation unqualified signal is generated.

[0065] Embodiment 3: Figure 3 As shown, the difference between this embodiment and the first and second embodiments is that the present invention proposes a chip surface precision drilling process based on optical detection, which includes the following steps:

[0066] Step 1: designing a circuit aperture diagram of the chip to be punched, and sending the circuit aperture diagram of the chip to be punched to a processor for storage;

[0067] Step 2: Place and fix the chip to be punched in the punching operation area, and analyze the position accuracy of the chip to be punched and the unfavorable factors affecting chip punching in the punching operation area;

[0068] Step 3: When generating the high-precision position signal and the low-impact regional signal, the chip punching module determines the coordinate information of all the points to be punched on the chip to be punched based on the circuit aperture map, and punches holes one by one on the chip surface through the laser punching equipment;

[0069] Step 4: The optical inspection module uses a high-resolution linear array CCD camera to take a picture of the punched chip, and sends the captured chip image to the comparison, correction and compensation module;

[0070] Step 5: The comparison, correction and compensation module identifies the pseudo through holes on the chip based on the chip image, and enables the laser drilling equipment to perform compensatory drilling on the chip surface based on the coordinate information of the pseudo through holes until all the pseudo through holes on the chip are corrected to be completely through.

[0071] The working principle of the present invention is as follows: when in use, the position accuracy status of the chip to be punched is analyzed before punching through the position accuracy verification module, and the adverse factors affecting chip punching in the punching operation area are analyzed through the regional impact verification module when generating a high position accuracy signal, and when generating a low position accuracy signal or a regional high impact signal, the operator is reminded to make corresponding improvement and adjustment measures in time, which is conducive to ensuring the stable progress of the punching operation and improving the accuracy of chip surface punching. When generating a high position accuracy signal and a regional low impact signal, the chip punching module punches holes one by one on the chip surface based on the circuit aperture diagram, the optical detection module takes a picture of the punched chip, and the comparison and correction compensation module identifies the pseudo through-holes on the chip based on the chip image, and enables the laser punching equipment to perform compensatory punching on the chip surface, which can ensure that each aperture is completely opened, improve the through-hole rate of the chip, reduce chip failure and repair costs caused by pseudo through-holes, ensure the accuracy and consistency of chip surface punching, significantly improve product quality and chip production efficiency, and have a high level of intelligence and automation.

[0072] The above formulas are all dimensionless and numerical calculations. The formula is a formula obtained by collecting a large amount of data and performing software simulation to obtain the most recent real situation. The preset parameters in the formula are set by technicians in this field according to actual conditions. The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the contents of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that technicians in the relevant technical field can understand and use the present invention well. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A chip surface precision drilling system based on optical detection, characterized in that: It includes a processor, a chip design module, a chip punching module, an optical detection module, a comparison correction compensation module and a touch display warning module; The chip design module is used to design a circuit aperture diagram of the chip to be punched, and send the circuit aperture diagram of the chip to be punched to the processor for storage; Before drilling, the operator places and fixes the chip to be drilled in the drilling operation area. The chip drilling module obtains the coordinate information of all the points to be drilled on the chip to be drilled based on the circuit aperture map, and drills holes one by one on the chip surface based on the coordinate information of the points to be drilled through the laser drilling equipment. The optical inspection module uses a high-resolution linear array CCD camera to take pictures of the punched chips, and sends the captured chip images to the comparison, correction and compensation module through the processor; The comparison, correction and compensation module identifies the pseudo through holes on the chip based on the chip image and records the coordinate information of the identified pseudo through holes. The chip punching module enables the laser punching device to perform compensatory punching on the chip surface based on the coordinate information of the pseudo through holes until all the pseudo through holes on the chip are corrected to be completely through. The processor is communicatively connected to the punching periodicity evaluation module, which is used to set the detection period, conduct a comprehensive evaluation and analysis on the punching performance of the chip within the detection period, generate a punching evaluation failure signal or a punching evaluation success signal through the analysis, and send the punching evaluation failure signal or the punching evaluation success signal to the touch display early warning module through the processor, and the touch display early warning module issues a corresponding early warning when receiving the punching evaluation failure signal; the specific analysis process is as follows: The number of chips that are punched during the detection period is marked as a chip punching number inspection value, and the number of chips that are marked as correction unnecessary chips after being punched during the detection period is marked as a chip operation anomaly inspection value, and the ratio of the chip operation anomaly inspection value to the chip punching number inspection value is marked as a chip punching anomaly analysis value, and the chip punching anomaly analysis value is numerically compared with a preset chip punching anomaly analysis threshold value, and if the chip punching anomaly analysis value exceeds the preset chip punching anomaly analysis threshold value, a punching evaluation unqualified signal is generated; If the chip punching anomaly value does not exceed the preset chip punching anomaly threshold, all the punching good chips in the detection period are obtained and their number is marked as the punching good number inspection value, where the punching good chip means the chip that is not marked as a non-essential chip for correction, does not need to perform compensatory punching, and the actual punching operation time does not exceed the corresponding preset punching operation time threshold; The ratio of the punching operation optimization value to the chip punching number detection value is marked as the chip punching optimization value, and the deviation value between the actual punching operation time of the corresponding punching optimization chip and the corresponding preset punching operation time threshold is marked as the punching advance time, and the punching advance time of all the punching optimization chips in the detection period is averaged to obtain the punching advance time value; The punching periodicity evaluation coefficient is obtained by numerically calculating the chip punching anomaly analysis value, the chip punching optimization analysis value and the punching advance time value, and the punching periodicity evaluation coefficient is numerically compared with the preset punching periodicity evaluation coefficient threshold. If the punching periodicity evaluation coefficient exceeds the preset punching periodicity evaluation coefficient threshold, a punching evaluation qualified signal is generated; if the punching periodicity evaluation coefficient does not exceed the preset punching periodicity evaluation coefficient threshold, a punching evaluation unqualified signal is generated.

2. The chip surface precision drilling system based on optical detection according to claim 1, characterized in that: The processor is communicatively connected to the position accuracy verification module, the position accuracy verification module obtains the punching operation area, establishes a three-dimensional coordinate system of the punching operation area, and analyzes the position accuracy of the chip to be punched before punching; A high-precision position signal or a low-precision position signal is generated through analysis, and the high-precision position signal or the low-precision position signal is sent to the touch display warning module through the processor. The touch display warning module issues a corresponding warning when receiving the low-precision position signal.

3. The chip surface precision drilling system based on optical detection according to claim 2, characterized in that: The specific analysis process of the position accuracy verification module includes: A number of detection points are set on the chip to be punched, and the chip point deviation value is obtained based on the position deviation distance between the actual coordinates of the corresponding detection point in the three-dimensional coordinate system and the corresponding standard coordinates. The chip point deviation value is numerically compared with the preset chip point deviation threshold. If the chip point deviation value exceeds the preset chip point deviation threshold, the corresponding detection point is marked as a chip abnormal point; if a chip abnormal point exists, a position low precision signal is generated.

4. The chip surface precision drilling system based on optical detection according to claim 1, characterized in that: If there is no chip abnormality point, the chip point deviation values ​​of all detection points are averaged to obtain the chip position detection value, and the chip position detection value is numerically compared with the preset chip position detection threshold. If the chip position detection value exceeds the preset chip position detection threshold, a low position precision signal is generated; if the chip position detection value does not exceed the preset chip position detection threshold, a high position precision signal is generated.

5. The chip surface precision drilling system based on optical detection according to claim 2, characterized in that: The position accuracy verification module is connected to the regional impact verification module in communication. The position accuracy verification module sends a high-precision position signal to the regional impact verification module. When the regional impact verification module receives the high-precision position signal, it analyzes the unfavorable factors affecting chip drilling in the drilling operation area. A regional low impact signal or a regional high impact signal is generated through analysis, and the regional low impact signal or the regional high impact signal is sent to the touch display warning module via the processor. The touch display warning module issues a corresponding warning when receiving the regional high impact signal.

6. The chip surface precision drilling system based on optical detection according to claim 5, characterized in that: The specific analysis process of the regional impact verification module is as follows: The vibration amplitude and vibration frequency of the lower supporting part of the chip to be punched are obtained, and the vibration amplitude and vibration frequency are numerically compared with the preset vibration amplitude threshold and the preset vibration frequency threshold, respectively. If the vibration amplitude or the vibration frequency exceeds the corresponding preset threshold, a regional high impact signal is generated; If the vibration amplitude and the vibration frequency do not exceed the corresponding preset threshold values, the deviation value of the ambient temperature in the punching operation area compared to the preset suitable temperature standard value is marked as the punching temperature anomaly value, and the deviation value of the ambient humidity in the punching operation area compared to the preset suitable humidity standard value is marked as the punching humidity anomaly value, and the dust concentration in the punching operation area is marked as the punching net anomaly value; The regional impact assessment value is obtained by numerically calculating the vibration amplitude, vibration frequency, drilling temperature abnormal value, drilling moisture abnormal value and drilling net abnormal value, and the regional impact assessment value is numerically compared with the preset regional impact assessment threshold. If the regional impact assessment value exceeds the preset regional impact assessment threshold, a regional high impact signal is generated; If the regional impact assessment value does not exceed the preset regional impact assessment threshold, a regional low impact signal is generated.

7. The chip surface precision drilling system based on optical detection according to claim 1, characterized in that: The comparison, correction and compensation module is also used to identify cracks, misaligned holes and holes with abnormal shapes and sizes on the chip. If it is determined after identification that there are cracks, misaligned holes or holes with abnormal shapes and sizes on the chip, the corresponding chip will be marked as a non-essential chip for correction. After the corresponding chip is marked as a non-essential chip for correction, pseudo-through hole identification and compensatory drilling will no longer be performed on the chip.

8. A chip surface precision drilling process based on optical detection, characterized in that: The process is implemented by using a chip surface precision punching system based on optical detection as described in any one of claims 1 to 7.

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