Pedestal and semiconductor process chamber

Abstract

The application discloses a susceptor and a semiconductor process chamber, and belongs to the technical field of semiconductors. The susceptor comprises a susceptor body, a magnetic assembly and a plurality of bearing pieces on the susceptor body, the bearing pieces are used for bearing wafers, and the bearing pieces are rotatably arranged on the susceptor body around the axes of the bearing pieces; the magnetic assembly comprises an electromagnet arranged for each bearing piece and a plurality of first magnetic conductive pieces fixedly connected with the bearing pieces; the plurality of first magnetic conductive pieces are circumferentially and spacedly arranged around the axes of the bearing pieces; the electromagnet is spacedly arranged with the plurality of first magnetic conductive pieces, and the electromagnet is used for generating a force on the first magnetic conductive pieces in a powered state, so as to drive the first magnetic conductive pieces to drive the bearing pieces to rotate around the axes of the bearing pieces. The semiconductor process chamber comprises the above-mentioned susceptor and a chamber body, and the susceptor body, the bearing pieces and the first magnetic conductive pieces are all arranged in the chamber body. In this way, the machining difficulty and the machining cost of the susceptor can be reduced.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and specifically relates to a base and a semiconductor process chamber. Background Art

[0002] Chemical vapor deposition equipment is mainly used for growing semiconductor thin film materials. The chemical vapor deposition equipment includes a chamber body and a base body arranged in the chamber body. The wafer is placed on the base body of the chemical vapor deposition equipment, and the wafer can undergo a process on the base body.

[0003] Currently, a susceptor body is typically equipped with multiple wafer carriers. To maintain a uniform temperature field within the chamber and ensure effective vapor deposition, the susceptor body can rotate the carriers and wafers around its axis. Furthermore, to ensure uniform processing of the wafer's edge at all circumferential locations, the carriers must rotate the wafers around their own axes relative to the susceptor body. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a base and a semiconductor process chamber to ensure that a wafer can rotate relative to the base body around the axis of the carrier plate.

[0005] In a first aspect, an embodiment of the present application provides a base, comprising a base body, a magnetic assembly, and a plurality of bearing members located on the base body;

[0006] The carrier is used to carry the wafer, and the carrier is rotatably arranged on the base body around its own axis;

[0007] The magnetic assembly includes an electromagnetic member provided for each of the supporting members and a plurality of first magnetic conductive members fixedly connected to the supporting members;

[0008] A plurality of the first magnetic conductive members are circumferentially spaced around the axis of the carrier;

[0009] The electromagnetic component is spaced apart from the plurality of first magnetic conductive components. When the electromagnetic component is powered on, it generates a force on the first magnetic conductive components to drive the first magnetic conductive components to drive the supporting components to rotate around their own axes.

[0010] In a second aspect, an embodiment of the present application further provides a semiconductor process chamber, comprising the above-mentioned base and a chamber body; wherein the base body, the carrier and the first magnetic conductive member are all arranged inside the chamber body.

[0011] In the embodiment of the present application, the electromagnetic component generates a magnetic field when energized, and the magnetic field attracts the first magnetic conductive component, thereby driving the first magnetic conductive component to move. Since the carrier is rotatably arranged on the base body around its own axis, and the first magnetic conductive component is circumferentially spaced around the axis of the carrier, the electromagnetic component will generate a force on the first magnetic conductive component. This force is a tangential force along the carrier at the first magnetic conductive component, so that the first magnetic conductive component can only rotate around the axis of the carrier, thereby driving the carrier and the wafer thereon to rotate around the axis of the carrier, realizing the self-rotation process of the wafer, and ensuring that the edge of the wafer is uniformly processed at various positions in the circumferential direction. In addition, by replacing the gas drive method with the electromagnetic drive method, the self-rotation process of the wafer can be realized by simply controlling the power supply of the electromagnetic component, without the need to set a complex suspension air duct on the base body, which is conducive to reducing the processing difficulty and processing cost of the base body. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a cross-sectional view of a semiconductor process chamber disclosed in an embodiment of the present application;

[0013] Figure 2 is a cross-sectional view of a portion of the structure of a semiconductor process chamber disclosed in an embodiment of the present application;

[0014] Figure 3 It is an exploded view of a portion of the structure of a semiconductor process chamber disclosed in an embodiment of the present application;

[0015] Figure 4 It is a partial structural schematic diagram of the magnetic component disclosed in the embodiment of this application.

[0016] Description of reference numerals:

[0017] 100-chamber body, 110-chamber upper cover, 120-chamber lower cover,

[0018] 200-base body, 210-support shaft,

[0019] 300- bearing parts,

[0020] 400-magnetic component, 410-electromagnetic component, 420-permanent magnet, 430-first magnetic conductive component,

[0021] 500-Mounting ring,

[0022] 600-second magnetic conductive member, 610-first magnetic conductive plate, 620-second magnetic conductive plate, 601-protrusion,

[0023] 700-wafer,

[0024] 800-Intake seat,

[0025] 900-Cover. DETAILED DESCRIPTION

[0026] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0027] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0028] In the prior art, to ensure uniform processing of the wafer 700's edge at all circumferential locations, the base body 200 is provided with a suspension air channel in the shape of an Archimedean line. During the process, a driving gas flows along the suspension air channel, thereby driving the carrier plate to rotate smoothly in a suspended manner. The carrier plate then drives the wafer 700 to rotate about its own axis relative to the base body 200. However, the shape of the suspension air channel has strict requirements, making the base body 200 difficult to manufacture and high in cost.

[0029] Based on this, the present application provides a susceptor and a semiconductor process chamber. The susceptor and the semiconductor process chamber provided in the embodiments of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and their application scenarios.

[0030] Please refer to Figures 1-4 The base disclosed in the embodiment of the present application includes a base body 200, a carrier 300 and a magnetic component 400, wherein the base body 200 serves as an installation base for the magnetic component 400 and multiple carriers 300.

[0031] The plurality of carriers 300 are located on the base body 200, the base body 200 provides support for the plurality of carriers 300, the carrier 300 is used to carry the wafer 700, and the carrier 300 is rotatably arranged on the base body 200 around its own axis. Optionally, the upper surface of the base body 200 is provided with a support shaft 210, the axis of the carrier 300 is provided with an opening, the support shaft 210 extends into the opening, and the support shaft 210 and the opening are rotationally matched, that is, the carrier 300 is rotatably arranged on the base body 200 through the support shaft 210. Wherein, the carrier 300 can be a carrier disc, the carrier disc has a circular groove for accommodating the wafer 700, which can limit the position of the wafer 700 and prevent the wafer 700 from separating from the carrier 300.

[0032] The magnetic assembly 400 includes an electromagnetic element 410 arranged for each carrier 300 and a plurality of first magnetic conductive elements 430 fixedly connected with the carrier 300, the electromagnetic element 410 corresponds to the carrier 300 one by one, the electromagnetic element 410 generates a magnetic field when energized, which is used to attract the plurality of first magnetic conductive elements 430 connected with the corresponding carrier 300, and the electromagnetic element 410 can be an electromagnetic coil. The plurality of first magnetic conductive elements 430 are circumferentially spaced around the axis of the carrier 300, that is, the first magnetic conductive element 430 deviates from the axis of the carrier 300, each first magnetic conductive element 430 is a magnetic conductive structure, which has a magnetic conductive effect and can be magnetically attracted by the electromagnetic element 410. The electromagnetic element 410 and the plurality of first magnetic conductive elements 430 are spaced apart, and the electromagnetic element 410 is used to generate a force on the first magnetic conductive element 430 when in an energized state, for example, the force is a tangential force along the carrier 300 at the first magnetic conductive element 430, to drive the first magnetic conductive element 430 to drive the carrier 300 to rotate around its own axis. Specifically, when the electromagnetic element 410 is energized, the electromagnetic element 410 generates an attractive force on the first magnetic conductive element 430, and the attractive force has a component in the tangential direction of the carrier 300, and the electromagnetic element 410 generates an attractive force on each first magnetic conductive element 430, respectively, and drives the first magnetic conductive element 430 to drive the carrier 300 to rotate by relying on the tangential force, thereby realizing the rotation of the wafer 700.

[0033] Moreover, during the rotation of the wafer 700, the plurality of first magnetic conductive elements 430 can be sequentially attracted by the electromagnetic element 410, thereby realizing the continuous rotation of the wafer 700.

[0034] In the embodiment of the present application, the electromagnetic component 410 is energized to generate a magnetic field, and the magnetic field attracts the first magnetic conductive component 430, thereby driving the first magnetic conductive component 430 to move. Since the carrier 300 is rotatably arranged on the base body 200 around its own axis, and the first magnetic conductive component 430 is circumferentially spaced around the axis of the carrier 300, the electromagnetic component 410 will generate a tangential force on the first magnetic conductive component 430 along the carrier 300 at the first magnetic conductive component 430, so that the first magnetic conductive component 430 can only rotate around the axis of the carrier 300, thereby driving the carrier 300 and the wafer 700 thereon to rotate around the axis of the carrier 300, realizing the self-rotation process of the wafer 700, and ensuring that the edge of the wafer 700 is evenly processed at various positions in the circumferential direction. In addition, by replacing the gas drive mode with the electromagnetic drive mode, the wafer 700 can be rotated by simply controlling the electromagnetic component 410 to be energized. There is no need to set a complex suspension air duct on the base body 200, which is beneficial to reducing the processing difficulty and processing cost of the base body 200.

[0035] In one optional embodiment, multiple first magnetic conductive members 430 are directly disposed on the outer periphery of each carrier 300, that is, the carrier 300 is directly connected to the first magnetic conductive members 430. In another embodiment, the base further includes a mounting ring 500 provided for each carrier 300. The mounting ring 500 is fixedly connected to the carrier 300, and the axis of the mounting ring 500 is collinear with the axis of the carrier 300. The multiple first magnetic conductive members 430 are spaced apart on the mounting ring 500. In this embodiment, the mounting ring 500 serves as a transition component connecting the carrier 300 and the multiple first magnetic conductive members 430, avoiding the situation where the carrier 300 is inconvenient to directly connect to each first magnetic conductive member 430. Furthermore, by arranging the axis of the mounting ring 500 collinear with the axis of the carrier 300, the first magnetic conductive members 430 are accurately spaced circumferentially around the axis of the carrier 300, which facilitates the electromagnetic member 410 to generate a force on each first magnetic conductive member 430 that facilitates the rotation of the carrier 300.

[0036] In an optional embodiment, the mounting ring 500 can be directly fixed on the upper end surface of the carrier 300. In another embodiment, the mounting ring 500 is sleeved on the periphery of the carrier 300. Optionally, the carrier 300 is a carrier plate, and the mounting ring 500 is sleeved on the periphery of the carrier plate. In this way, the installation process of the mounting ring 500 can be completed by adopting a sleeve structure, and the mounting ring 500 and the carrier 300 are kept fixed. The installation process is simple and convenient, and the mounting ring 500 basically does not occupy additional height space, which is beneficial to the layout of components in the height direction of the semiconductor process chamber. It should be noted that when adopting this sleeve method, the contact surface of the mounting ring 500 and the carrier 300 does not need to be welded or other operations, as long as the fixing requirements can be met. Of course, the contact surface of the mounting ring 500 and the carrier 300 can also be welded or other operations to improve the fixing reliability.

[0037] In an optional embodiment, a plurality of first magnetic conductive members 430 are spaced apart and arranged on the inner side wall or upper end surface of the mounting ring 500. In another embodiment, referring to Figure 2 and Figure 3 As shown, multiple first magnetic conductive members 430 are spaced apart on the outer wall of the mounting ring 500. This allows the electromagnetic member 410 to face the first magnetic conductive members 430, which facilitates the generation of an attractive force on the first magnetic conductive members 430. Furthermore, since the first magnetic conductive members 430 are farther from the axis of the carrier 300, the rotational force arm corresponding to the attractive force is longer, making it easier to drive the carrier 300 to rotate.

[0038] In an optional embodiment, the mounting ring 500 and the plurality of first magnetic conductive members 430 are integrally formed, i.e., both the mounting ring 500 and the plurality of first magnetic conductive members 430 are magnetically conductive structures and are made of magnetically conductive materials. This means that when the electromagnetic member 410 is energized, the electromagnetic member 410 not only exerts an attraction force on the plurality of first magnetic conductive members 430, but also on the mounting ring 500. Since the mounting ring 500 is offset from the axis of the carrier 300, the attraction force exerted by the electromagnetic member 410 on the mounting ring 500 also exerts a tangential force, further assisting in driving the carrier 300 to rotate. In this manner, the connection between the mounting ring 500 and the plurality of first magnetic conductive members 430 is integrated, eliminating any gaps between the mounting ring 500 and the plurality of first magnetic conductive members 430, thereby improving the connection strength between the plurality of first magnetic conductive members 430. Of course, in other embodiments, the mounting ring 500 and the plurality of first magnetic conductive members 430 may be separate structures.

[0039] In an optional embodiment, multiple carriers 300 are circumferentially distributed around the axis of the base body 200, and multiple electromagnetic members 410 are circumferentially distributed around the axis of the base body 200, with each carrier 300 corresponding to each electromagnetic member 410. Thus, when the electromagnetic member 410 is energized, the electromagnetic member 410 generates a magnetic field that directly attracts the first magnetic conductive member 430 to which the corresponding carrier 300 is connected.

[0040] In another embodiment, the magnetic assembly further includes a second magnetic conductive member 600 in an annular shape. The axis of the second magnetic conductive member 600 is colinear with the axis of the base body 200. The second magnetic conductive member 600 is disposed around the plurality of supporting members 300, i.e., the second magnetic conductive member 600 can be located at the periphery of the base body 200. Alternatively, the plurality of supporting members 300 are disposed around the second magnetic conductive member 600, i.e., the second magnetic conductive member 600 can be located at the center of the base body 200. The plurality of electromagnetic members 410 are circumferentially spaced around the axis of the second magnetic conductive member 600, i.e., the plurality of electromagnetic members 410 can be located at the periphery or at the center of the base body 200. The second magnetic conductive member 600 is a magnetic conductive structure that does not itself possess magnetism. It is primarily used to transmit the magnetic field generated by the electromagnetic member 410, thereby making it easier for the electromagnetic member 410 to attract the first magnetic conductive member 430. In this way, when the electromagnetic member 410 is in a powered state, the electromagnetic member 410 attracts the first magnetic conductive member 430 through the second magnetic conductive member 600 .

[0041] In this embodiment, the second magnetic conductive member 600 can be used to transmit the magnetic field generated by the electromagnetic member 410 when it is energized to the appropriate location, thereby facilitating the generation of an attractive force between the second magnetic conductive member 600 and the first magnetic conductive member 430. Furthermore, the second magnetic conductive member 600 serves as a mounting base for multiple electromagnetic members 410, facilitating the installation of multiple electromagnetic members 410. Optionally, when the electromagnetic member 410 is energized, the electromagnetic member 410 can be attracted to the first magnetic conductive member 430 and the mounting ring 500 via the second magnetic conductive member 600.

[0042] In an alternative embodiment, the second magnetic conductor 600 can only include the first magnetic conductor plate 610, and the plurality of electromagnets 410 are arranged at intervals on the first magnetic conductor plate 610. In another embodiment, the second magnetic conductor 600 further includes a second magnetic conductor plate 620, and the first magnetic conductor plate 610 and the second magnetic conductor plate 620 are arranged oppositely, both the first magnetic conductor plate 610 and the second magnetic conductor plate 620 are annular, and the plurality of electromagnets 410 are arranged between the first magnetic conductor plate 610 and the second magnetic conductor plate 620. In this way, the first magnetic conductor plate 610 and the second magnetic conductor plate 620 in combination provide a reliable installation basis for the plurality of electromagnets 410, and by increasing the second magnetic conductor plate 620, the magnetic field generated by the electromagnets 410 is transmitted to the edges of the first magnetic conductor plate 610 and the second magnetic conductor plate 620 through the first magnetic conductor plate 610 and the second magnetic conductor plate 620 respectively, the magnetic conducting effect is improved, which is beneficial to increase the adsorption force between the second magnetic conductor 600 and the first magnetic conductor 430, so that the electromagnets 410 are more easily to drive the carrier 300 and the wafer 700 to realize self-rotation.

[0043] In an alternative embodiment, referring to Figure 4 As shown in the figure, the first magnetic conductor plate 610 and the second magnetic conductor plate 620 are both provided with a plurality of protruding portions 601, and the plurality of protruding portions 601 are arranged at intervals along the axis of the second magnetic conductor 600 in a circumferential direction, and the protruding portion 601 protrudes from the circumferential surface of the first magnetic conductor plate 610 or the circumferential surface of the second magnetic conductor plate 620. Here, the "circumferential surface" refers to the surface of the first magnetic conductor plate 610 or the second magnetic conductor plate 620 facing the carrier 300. Alternatively, when the first magnetic conductor plate 610 and the second magnetic conductor plate 620 both surround the plurality of carriers 300, the "circumferential surface" refers to the inner side wall of the first magnetic conductor plate 610 or the second magnetic conductor plate 620. When the plurality of carriers 300 surround the first magnetic conductor plate 610 and the second magnetic conductor plate 620, the "circumferential surface" refers to the outer side wall of the first magnetic conductor plate 610 or the second magnetic conductor plate 620. Moreover, the protruding portion 601 faces the first magnetic conductor 430, wherein the protruding portion 601 is a magnetic conducting structure and has a magnetic concentrating effect. When the electromagnets 410 are in an energized state, the first magnetic conductor plate 610 and the second magnetic conductor plate 620 respectively adsorb the first magnetic conductor 430 through the protruding portion 601.

[0044] By adopting this embodiment, the magnetic force transmitted by the second magnetic conductor 600 is concentrated on the protruding portion 601, and the magnetic property of the protruding portion 601 is stronger, so that the first magnetic conductor 430 is adsorbed through the protruding portion 601, which is beneficial to strengthen the magnetic concentrating effect and increase the adsorption force, so that the electromagnets 410 are more easily to drive the carrier 300 and the wafer 700 to realize self-rotation.

[0045] Furthermore, the large number of protrusions 601 allows the magnetic field transmitted by the first magnetic conductive plate 610 and the second magnetic conductive plate 620 to be distributed across different protrusions 601. Each protrusion 601 has a strong magnetic property, so the multiple protrusions 601 each generate an attractive force with the first magnetic conductive member 430, further enhancing the magnetic concentration effect and the total attractive force, making it easier for the electromagnetic member 410 to drive the carrier 300 and wafer 700 to rotate. Furthermore, the multiple protrusions 601 can sequentially attract the first magnetic conductive member 430, thereby achieving continuous rotation of the wafer 700.

[0046] Optionally, the plurality of protrusions 601 provided on the first magnetic conductive plate 610 and the first magnetic conductive plate 610 are an integrated structure, and the plurality of protrusions 601 provided on the second magnetic conductive plate 620 and the second magnetic conductive plate 620 are an integrated structure.

[0047] Of course, in other embodiments, the first magnetic conductive plate 610 and the second magnetic conductive plate 620 may not be provided with the protrusion 601 , and the first magnetic conductive plate 610 and the second magnetic conductive plate 620 may directly adsorb the first magnetic conductive member 430 .

[0048] In an optional embodiment, the number of carriers 300, mounting rings 500, and electromagnetic members 410 is at least two, and each carrier 300 and mounting ring 500 is spaced apart in the circumferential direction of the base body 200, with the mounting rings 500, carriers 300, and electromagnetic members 410 corresponding to each other. In this way, the number of carriers 300, mounting rings 500, and electromagnetic members 410 is large, and the base body 200 can carry multiple wafers 700 through multiple carriers 300. When the multiple electromagnetic members 410 are energized, the electromagnetic members 410 attract the multiple first magnetic conductive members 430 connected to the corresponding carriers 300, thereby driving the corresponding carriers 300 and the corresponding wafers 700 to rotate through the multiple first magnetic conductive members 430, thereby achieving simultaneous rotation of multiple wafers 700.

[0049] Optionally, a sinusoidal excitation current may be supplied to the electromagnetic component 410. The rotational speeds of the carrier 300 and the wafer 700 are related to the frequency of the sinusoidal excitation current. Therefore, by controlling the frequency of the sinusoidal excitation current supplied by the electromagnetic component 410, the rotational speed of the corresponding carrier 300 can be monitored and controlled. Therefore, by controlling the frequency of the sinusoidal excitation current supplied to each electromagnetic component 410 to be the same, the rotational speeds of each carrier 300 and each wafer 700 can be controlled to be consistent. In addition, by controlling the driver of the drive motor to change the rotational speed of the base body 200, and by controlling the frequency of the sinusoidal excitation current supplied to each electromagnetic component 410 to change the rotational speed of the wafer 700, the rotational speed ratio of the base body 200 to the wafer 700 can be changed to adapt to different process requirements.

[0050] In an optional embodiment, the electromagnetic component 410 may include only one electromagnetic coil, and the electromagnetic coil is energized to drive the first magnetic conductive component 430 to drive the supporting component 300 to rotate a certain angle.

[0051] In another embodiment, the electromagnetic component 410 includes a plurality of electromagnetic coils. Optionally, the electromagnetic coils are coil windings made of copper. The electromagnetic coils are spaced apart in the circumferential direction of the base body 200. When the electromagnetic coils are energized in sequence, the electromagnetic coils are used to sequentially attract the first magnetic conductive member 430, thereby driving the first magnetic conductive member 430 to continuously rotate the supporting member 300. Optionally, each electromagnetic component 410 includes six electromagnetic coils, which are evenly distributed in the circumferential direction of the base body 200. The six electromagnetic coils are energized in sequence. When each electromagnetic coil is energized, it can drive the first magnetic conductive member 430 to rotate the corresponding supporting member 300 by 60 degrees. After all six electromagnetic coils are energized once, the first magnetic conductive member 430 and the corresponding supporting member 300 rotate one circle. Then, the six electromagnetic coils are energized again in sequence, and this cycle is repeated to achieve continuous rotation of the first magnetic conductive member 430 and the corresponding supporting member 300. In this way, by energizing multiple electromagnetic coils in sequence, the first magnetic conductive member 430 and the corresponding carrier 300 can be continuously rotated, and the wafer 700 can be continuously rotated, ensuring that the edge of the wafer 700 can be evenly processed at all positions in the circumferential direction.

[0052] In an optional embodiment, the magnetic component 400 only includes an electromagnetic component 410, a first magnetic conductive component 430 and a second magnetic conductive component 600. When the electromagnetic component 410 is powered off, the adsorption force on the first magnetic conductive component 430 disappears, and the first magnetic conductive component 430 drives the carrier 300 to gradually reduce the rotation speed until it stops.

[0053] In another embodiment, Figures 1-2 as well as Figure 4As shown, the magnetic assembly 400 further includes permanent magnets 420, which are distributed along the circumference of the second magnetic conductive member 600. Optionally, the permanent magnets 420 can be provided separately from the second magnetic conductive member 600; alternatively, the permanent magnets 420 can be connected to the second magnetic conductive member 600. Further, optionally, the permanent magnets 420 can be fixedly connected to the second magnetic conductive member 600, either directly or indirectly through other components. When the second magnetic conductive member 600 includes a first magnetic conductive plate 610 and a second magnetic conductive plate 620, the permanent magnets 420 are disposed between the first magnetic conductive plate 610 and the second magnetic conductive plate 620. The permanent magnets 420 can stably attract the first magnetic conductive member 430. When the electromagnetic member 410 is in the de-energized state, the permanent magnets 420 attract the first magnetic conductive member 430, thereby keeping the carrier 300 stationary relative to the base body 200. By adopting this embodiment, the permanent magnet 420 can accurately control the first magnetic conductive part 430 and the carrier 300 to stop in time when the electromagnetic part 410 is powered off, thereby driving the wafer 700 to stop in time, avoiding the first magnetic conductive part 430 and the carrier 300 reducing their rotation speed after the electromagnetic part 410 is powered off, thereby avoiding the rotation speed of the wafer 700 changing due to the reduction in rotation speed, thereby avoiding affecting the process effect of the wafer 700.

[0054] Alternatively, a plurality of permanent magnets 420 may be provided, the plurality of permanent magnets 420 being arranged at intervals along the circumference of the second magnetic conductive member 600, the permanent magnets 420 corresponding one to the carrier 300, and each permanent magnet 420 being used to stably adsorb the first magnetic conductive member 430 connected to the corresponding carrier 300; the permanent magnet 420 may also be a strip-shaped structure, the permanent magnet 420 extending along the circumference of the second magnetic conductive member 600, and the permanent magnet 420 being located on the periphery of the electromagnetic member 410, and the permanent magnet 420 being used to adsorb the first magnetic conductive member 430 connected to each carrier 300; further, the permanent magnet 420 may be a ring-shaped structure, and the permanent magnet 420 is arranged around the base body 200. In this way, when the electromagnetic member 410 is in a power-off state, the permanent magnet 420 can adsorb the first magnetic conductive member 430 connected to each carrier 300, so that each carrier 300 and each wafer 700 are in a stationary state relative to the base body 200.

[0055] Optionally, the second magnetic conductive part 600 is provided with a protrusion 601, and the magnetic field of the permanent magnet 420 is transmitted to the protrusion 601 through the second magnetic conductive part 600. The permanent magnet 420 absorbs the first magnetic conductive part 430 through the protrusion 601, which is beneficial to enhance the magnetic concentration effect and is beneficial to the rapid stationary state of the first magnetic conductive part 430 and the supporting part 300.

[0056] It should be noted that the magnetism generated by the electromagnetic member 410 when energized is greater than the magnetism of the permanent magnet 420, so when the electromagnetic member 410 is energized, the adsorption force of the electromagnetic member 410 on the first magnetic conductive member 430 is greater than the adsorption force of the permanent magnet 420 on the first magnetic conductive member 430, so as to overcome the adsorption force of the permanent magnet 420 on the first magnetic conductive member 430, and the permanent magnet 420 generates an adsorption force on the first magnetic conductive member 430 during the energization of the electromagnetic member 410. The electromagnetic member 410 can also drive the first magnetic conductive member 430 to rotate the carrier 300 and the wafer 700.

[0057] Optionally, the electromagnetic member 410 and the second magnetic conductive member 600, and the permanent magnet 420 and the second magnetic conductive member 600 can be fixedly connected by screws or other threaded fasteners.

[0058] Based on the disclosed susceptor, the embodiment of the present application further discloses a semiconductor process chamber, which comprises the susceptor in the above-mentioned embodiments and a chamber body 100, wherein the susceptor body 200, the carrier 300 and the first magnetic conductive member 430 are all arranged in the chamber body 100, and the susceptor body 200 is rotatably arranged in the chamber body 100 about its own axis. Optionally, the semiconductor process chamber further comprises a driving mechanism arranged outside the chamber body 100. The driving mechanism can be a driving motor, the output shaft of the driving motor penetrates the chamber body 100 and is connected with the susceptor body 200 to drive the susceptor body 200 to rotate relative to the chamber body 100. The driver of the driving motor can record the rotation speed of the susceptor body 200 in real time and control the rotation speed.

[0059] By controlling the energization of the electromagnetic member 410, the wafer 700 can be rotated by using the semiconductor process chamber in the embodiment, without the need to provide a complex suspension air duct on the chamber body 100, which is conducive to reducing the processing difficulty and processing cost of the chamber body 100.

[0060] Optionally, as shown in Figure 1 The chamber body 100 comprises a chamber upper cover 110 and a chamber lower cover 120, and the chamber upper cover 110 and the chamber lower cover 120 jointly form a process space for accommodating the susceptor body 200 and the carrier 300.

[0061] In an optional embodiment, the magnetic assembly 400 further comprises a second magnetic conductive member 600 in the form of a ring, the second magnetic conductive member 600 is connected with the chamber body 100, and the second magnetic conductive member 600 serves as a mounting base for the plurality of electromagnetic members 410. The plurality of electromagnetic members 410 are arranged in the chamber body 100 through the second magnetic conductive member 600, avoiding the inconvenience of directly mounting the magnetic assembly 400 in the chamber body 100.

[0062] In an optional embodiment, the electromagnetic element 410 is disposed within the chamber body 100 and connected to the inner wall of the chamber body 100; alternatively, the electromagnetic element 410 is disposed outside the chamber body 100 and connected to the outer wall of the chamber body 100. In the latter embodiment, the electromagnetic element 410 can be directly connected to an external power source, avoiding the need to provide an opening in the chamber body 100 for the passage of power wires to the electromagnetic element 410 when the electromagnetic element 410 is located inside the chamber body 100. This further prevents the chamber body 100 from being connected to the external atmosphere and affecting the vacuum environment and cleanliness of the chamber body 100. Optionally, the electromagnetic element 410, the permanent magnet 420, and the second magnetic conductive element 600 are all disposed outside the chamber body 100.

[0063] In an optional embodiment, if Figure 1 As shown, the semiconductor process chamber further includes an inlet seat 800 , which is connected to the chamber body 100 . Process gas can be introduced into the interior of the chamber body 100 through the inlet seat 800 to process the wafer 700 placed on the carrier 300 .

[0064] In an optional embodiment, if Figure 2 and Figure 3 As shown, the semiconductor process chamber further includes a cover plate 900, which is disposed on the upper surface of the base body 200. The cover plate 900 is provided with through holes for accommodating the carrier 300, the first magnetic conductive member 430, and the wafer 700, with the through holes corresponding one to one with the carrier 300. In this way, the cover plate 900 protects the upper surface of the base body 200, preventing the process gas from affecting the upper surface of the base body 200 during the process. Further optionally, to reduce processing costs, the cover plate 900 may include an inner cover plate and an outer cover plate, with the outer cover plate disposed on the outer periphery of the inner cover plate, and the inner cover plate and the outer cover plate cooperate to cover and protect the upper surface of the base body 200.

[0065] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A base, characterized in that: It comprises a base body (200), a magnetic assembly (400), and a plurality of bearing members (300) located on the base body (200); The carrier (300) is used to carry the wafer (700), and the carrier (300) is rotatably arranged on the base body (200) around its own axis; The magnetic assembly (400) includes an electromagnetic component (410) provided for each of the carriers (300) and a plurality of first magnetic conductive components (430) fixedly connected to the carriers (300); A plurality of the first magnetic conductive parts (430) are circumferentially spaced around the axis of the carrier (300); The electromagnetic component (410) is spaced apart from the plurality of first magnetic conductive components (430). When the electromagnetic component (410) is in an energized state, it is used to generate a force on the first magnetic conductive components (430) to drive the first magnetic conductive components (430) to drive the supporting component (300) to rotate around its own axis.

2. The base according to claim 1, wherein: The base further includes a mounting ring (500) provided for each of the supporting members (300), wherein the mounting ring (500) is fixedly connected to the supporting member (300), and the axis of the mounting ring (500) is collinear with the axis of the supporting member (300), and a plurality of the first magnetic conductive members (430) are spaced apart and arranged on the mounting ring (500).

3. The base according to claim 2, characterized in that The mounting ring (500) is sleeved on the periphery of the bearing component (300).

4. The base according to claim 2, characterized in that A plurality of the first magnetic conductive parts (430) are arranged at intervals on the outer side wall of the mounting ring (500).

5. The base according to claim 2, characterized in that The mounting ring (500) and the plurality of first magnetic conductive parts (430) are an integrated structure.

6. The base according to claim 1, characterized in that The plurality of bearing members (300) are circumferentially distributed around the axis of the base body (200); The magnetic assembly (400) further includes a second magnetic conductive member (600) in an annular shape, wherein the axis of the second magnetic conductive member (600) is colinear with the axis of the base body (200), and the second magnetic conductive member (600) is arranged around the plurality of the supporting members (300), or the plurality of the supporting members (300) are arranged around the second magnetic conductive member (600); A plurality of electromagnetic components (410) are arranged on the second magnetic conductive component (600) at intervals in the circumferential direction around the axis of the second magnetic conductive component (600).

7. The base according to claim 6, characterized in that The second magnetic conductive component (600) comprises a first magnetic conductive plate (610) and a second magnetic conductive plate (620) which are arranged opposite to each other, wherein the first magnetic conductive plate (610) and the second magnetic conductive plate (620) are both ring-shaped, and the plurality of electromagnetic components (410) are arranged between the first magnetic conductive plate (610) and the second magnetic conductive plate (620).

8. The base according to claim 7, characterized in that The first magnetic conductive plate (610) and the second magnetic conductive plate (620) are both provided with a plurality of protrusions (601), and the plurality of protrusions (601) are arranged at intervals along the circumferential axis of the second magnetic conductive member (600). The protrusions (601) protrude from the circumferential surface of the first magnetic conductive plate (610) or the circumferential surface of the second magnetic conductive plate (620), and the protrusions (601) face the first magnetic conductive member (430). The protrusions (601) are magnetic conductive structures.

9. The base according to claim 6, characterized in that The magnetic assembly (400) further includes permanent magnets (420) distributed along the circumference of the second magnetic conductive member (600).

10. The base according to claim 1, wherein: The electromagnetic component (410) includes a plurality of electromagnetic coils, each of which is spaced apart in the circumferential direction of the base body (200). When each of the electromagnetic coils is energized in sequence, each of the electromagnetic coils is used to sequentially adsorb the first magnetic conductive component (430) to drive the first magnetic conductive component (430) to drive the supporting component (300) to rotate continuously.

11. A semiconductor process chamber, characterized in that: It comprises the base and chamber body (100) according to any one of claims 1 to 10; wherein the base body (200), the supporting member (300) and the first magnetic conductive member (430) are all arranged inside the chamber body (100).

12. The semiconductor process chamber according to claim 11, wherein: The electromagnetic component (410) is arranged outside the chamber body (100).

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