A low temperature and high pressure test device based on vortex tube cooling and a test method thereof

Abstract

The present invention relates to the technical field of semiconductor testing devices, and in particular to a low-temperature and high-pressure testing device based on vortex tube cooling and a testing method thereof, comprising a lower end cover and an upper end cover detachably mounted on the lower end cover, a closed testing cavity for placing a test wafer is arranged between the lower end cover and the upper end cover, a probe for detecting the wafer is arranged in the testing cavity, and further comprising a compressor, a first air storage chamber, a first vortex tube refrigerator and a second vortex tube refrigerator arranged outside the upper end cover, a first valve connected to the testing cavity is arranged on the upper end cover, when in use, the gas is circulated multiple times through the first vortex tube refrigerator and the second vortex tube refrigerator, so as to realize the recycling of the gas and generate gas to the required temperature and pressure, and the cooling gas is transported to the testing cavity to meet the requirements of different chip testing, so as to make the testing more standardized and refined, improve the efficiency of cooling the gas, and further reduce the maintenance cost and waste.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor testing devices, and in particular to a low-temperature and high-voltage testing device based on vortex tube cooling and a testing method thereof. Background Art

[0002] In the semiconductor device manufacturing process, semiconductor device detection is the top priority of manufacturing work. With the increasing output of miniaturized high-power devices, the detection conditions of semiconductor chips have become more diversified, and the requirements for detection devices have become higher and higher. The research and development of new detection devices is imminent. However, traditional detection devices are difficult to achieve instantaneous cooling of the detection gas from room temperature to the required detection temperature, which can easily cause warping of the probe card and position drift of the probe, and even damage to the probe card, detection failure and other problems. At the same time, it is also easy to cause high detection costs and long detection time in the test field due to the high costs incurred during the chip detection process. Summary of the invention

[0003] The technical problem to be solved by the present invention is: in order to solve the problem that traditional detection devices cannot achieve instantaneous changes from room temperature to detection temperature, resulting in warping and deformation of the probe card and position drift of the probe, and even damage to the probe card and detection failure, a low-temperature and high-pressure testing device based on vortex tube cooling and a testing method thereof are now provided.

[0004] The technical solution adopted by the present invention to solve its technical problems is: a low-temperature and high-pressure testing device based on vortex tube cooling, comprising a lower end cover and an upper end cover detachably mounted on the lower end cover, a closed detection cavity for placing a detection wafer is arranged between the lower end cover and the upper end cover, a probe for detecting the wafer is arranged in the detection cavity, and also comprises a compressor, a first air storage chamber, a first vortex tube refrigerator and a second vortex tube refrigerator arranged outside the upper end cover, a first valve connected to the detection cavity is arranged on the upper end cover, the output end of the compressor is connected to the first air storage chamber, the first air storage chamber is connected to the vortex chamber of the first vortex tube refrigerator, the cold end of the first vortex tube refrigerator is connected to the detection cavity, the hot end of the first vortex tube refrigerator is connected to the vortex chamber of the second vortex tube refrigerator, a first cooling component is arranged on the hot end of the first vortex tube refrigerator, the hot end of the second vortex tube refrigerator is connected to the first air storage chamber, and the hot end of the second vortex tube refrigerator is arranged on the second cooling component. Compared with the existing technology, this solution circulates the gas multiple times through the first vortex tube refrigerator and the second vortex tube refrigerator, realizes the recycling of the gas and produces gas to the required temperature and pressure, and transports the cooled gas to the detection chamber to meet the needs of different chip detection, reduce the detection cost, make the detection more standardized and refined, and avoid the problem of test failure and damage to the probe caused by the long time required for processing the detection gas from room temperature to the required detection temperature.

[0005] In order to realize the first cooling component, some preferred embodiments include a first sleeve sleeved on the hot end of the first vortex tube cooler, a closed first heat exchange cavity is formed between the first sleeve and the hot end of the first vortex tube cooler, and a water inlet and a water outlet connected to the first heat exchange cavity are provided on the first sleeve. A closed first heat exchange cavity is formed by the first sleeve on the hot end of the first vortex tube cooler and between the first sleeve and the hot end of the first vortex tube cooler, and a water inlet and a water outlet connected to the first heat exchange cavity are provided on the first sleeve, cooling water is introduced into the first heat exchange cavity through the water inlet, and the cooling water exchanges heat with the hot end of the first vortex tube cooler to reduce the temperature of the gas at the hot end of the first vortex tube cooler. The first cooling component has a simple structure and is easy to manufacture.

[0006] In order to realize the second cooling assembly, preferably some embodiments, the second cooling assembly includes a second sleeve sleeved on the hot end of the second vortex tube cooler, and a closed second heat exchange cavity is formed between the second sleeve and the hot end of the second vortex tube cooler, and the first heat exchange cavity is connected to the second heat exchange cavity. Like the first cooling assembly, the second cooling assembly has a similar structure to the first cooling assembly, and the second heat exchange cavity of the second cooling assembly is connected to the first heat exchange cavity. Cooling water enters the second heat exchange cavity through the first heat exchange cavity and is discharged through the water outlet of the second heat exchange cavity.

[0007] In order to better control the gas entering the detection chamber, in some preferred embodiments, a second valve is provided between the first gas storage chamber and the vortex chamber of the first vortex tube refrigerator, a third valve is provided between the cold end of the first vortex tube refrigerator and the detection chamber, a fourth valve is provided between the hot end of the first vortex tube refrigerator and the vortex chamber of the second vortex tube refrigerator, and a fifth valve is provided between the hot end of the second vortex tube refrigerator and the first gas storage chamber. The first valve, the second valve, the third valve, the fourth valve and the fifth valve are provided, and each valve is controlled to control the required temperature and pressure of the gas, and also to detect the patency of the pipeline of the detection device to ensure the reliability of the detection temperature.

[0008] In order to facilitate understanding of the temperature and pressure of the gas generated at the first vortex tube refrigerator, preferably in some embodiments, a temperature gauge and a pressure gauge are provided on the first vortex tube refrigerator. By providing a temperature gauge and a pressure gauge on the first vortex tube refrigerator, the condition of the gas at the cold end of the first vortex tube refrigerator can be directly known by observing the temperature gauge and the pressure gauge.

[0009] In order to facilitate the flexible use of production gas, in some preferred embodiments, the cold end of the first vortex tube refrigerator is connected to the detection chamber through a gas storage tank, the third valve is located between the gas storage tank and the cold end of the first vortex tube refrigerator, and a sixth valve is provided between the gas storage tank and the detection chamber. By providing a gas storage tank on one side of the test device, the gas storage tank stores gas, and when in use, the gas can be released into the detection chamber, which is convenient for use.

[0010] In some preferred embodiments, a second air storage chamber is provided between the lower end cover and the upper end cover, the second air storage chamber, the detection chamber and the sixth valve are interconnected, and the first valve is connected to the detection chamber through the second air storage chamber.

[0011] In order to facilitate the testing of the gas circuit of the test device, in some preferred embodiments, a seventh valve is provided between the second gas storage chamber and the detection chamber and the sixth valve. By cooperating with the second gas storage chamber and the seventh valve provided between the lower end cover and the upper end cover, the gas is controlled to directly enter the second gas storage chamber and be discharged through the first valve, which can facilitate the staff to understand the situation of the gas circuit of the detection device and ensure stable and reliable detection.

[0012] In order to facilitate the fixation of the wafer in the detection chamber, in some preferred embodiments, a PCB board and a transfer layer are provided on the upper end cover, a guide plate is provided in the detection chamber, the transfer layer is located between the PCB board and the guide plate, one end of the probe is connected to the PCB board, and the other end of the probe passes through the transfer layer and the guide plate in sequence, and a rubber pad for fixing the wafer to be tested is provided under the guide plate. The rubber pad on the guide plate is pressed against the top of the wafer to fix the wafer in the detection chamber, thereby ensuring stable and reliable wafer testing.

[0013] A test method using a vortex tube cooling low temperature and high pressure test device as described above, the specific operation steps are as follows:

[0014] S1. Place the wafer to be tested in the testing chamber, set the upper end cover on the lower end cover, and make the wafer to be tested contact with the probe and fix it in the testing chamber;

[0015] S2, turn on the compressor and set the pressure of the compressor output gas;

[0016] S3, opening the first valve, the second valve, the third valve, the fourth valve, the fifth valve, the sixth valve and the seventh valve, and allowing the gas to be discharged to the outside through the first valve;

[0017] S4, wait for a while, close the first valve, the second valve, the third valve, the fourth valve, the fifth valve, the sixth valve and the seventh valve, so that the entire test device is airtight;

[0018] S5, opening the second valve, starting the first cooling assembly and cooling the hot end of the first vortex tube refrigerator;

[0019] S6. Observe the values ​​of the temperature gauge and the pressure gauge. After the cold end temperature of the first vortex tube refrigerator stabilizes and reaches the temperature required for the test, open the third valve to deliver the gas reaching the temperature and pressure required for the test to the gas storage tank;

[0020] S7, opening the sixth valve to introduce the gas in the gas storage tank into the detection chamber and directly act on the wafer to be tested;

[0021] S8, adjust the seventh valve, control the detection chamber to reach the required pressure and temperature, and start the detection;

[0022] S9, after the detection is completed, close the sixth valve, open the first valve, and release the pressure in the detection chamber;

[0023] S10, after waiting for a period of time, the upper end cover and the lower end cover are disassembled, the wafer to be tested is taken out, the test work is completed, and the entire test device is restored to the initial state.

[0024] The beneficial effects of the present invention are as follows: when the present invention is a low-temperature and high-pressure testing device based on vortex tube cooling and its testing method are in use, the gas is circulated multiple times through the first vortex tube refrigerator and the second vortex tube refrigerator to realize the recycling of the gas and generate gas to the required temperature and pressure, and the cooling gas is transported to the detection chamber, which effectively avoids a series of problems such as test failure and damage to the probe caused by the long cooling time of the gas from room temperature to the required detection temperature, so as to meet the requirements of different chip detection, make the detection more standardized and refined, improve the efficiency of gas cooling, further reduce maintenance costs and waste, thereby reducing site production costs, and avoid the problem that traditional detection devices cannot achieve instantaneous changes from room temperature to the detection temperature, resulting in warping and deformation of the probe card and position drift of the probe, and even damage to the probe card, resulting in detection failure. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0026] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0027] Figure 2 It is a front view of the present invention;

[0028] Figure 3 It is a left side view of the present invention;

[0029] Figure 4 is a top view of the present invention;

[0030] Figure 5The internal structure of the present invention is shown in FIG. Figure 1 ;

[0031] Figure 6 The internal structure of the present invention is shown in FIG. Figure 2 ;

[0032] Figure 7 It is a three-dimensional structural schematic diagram of the compressor, the first air storage chamber, the first vortex tube refrigerator, and the second vortex tube refrigerator in the present invention;

[0033] Figure 8 It is a front view of the compressor, the first air storage chamber, the first vortex tube refrigerator, and the second vortex tube refrigerator in the present invention;

[0034] Fig. 9 It is a left view of the compressor, the first air storage chamber, the first vortex tube refrigerator, and the second vortex tube refrigerator in the present invention;

[0035] Fig.10 It is a schematic diagram of the internal structure of the compressor, the first air storage chamber, the first vortex tube refrigerator, and the second vortex tube refrigerator in the present invention.

[0036] In the figure: 1, lower end cover, 2, upper end cover, 3, detection chamber, 4, probe, 5, compressor, 6, first air storage chamber, 7, first vortex tube refrigerator, 8, second vortex tube refrigerator, 9, first valve, 10, first cooling assembly, 11, second cooling assembly, 12, first sleeve, 13, first heat exchange chamber, 14, water inlet, 15, water outlet, 16, second sleeve, 17, second heat exchange chamber, 18, second valve, 19, third valve, 20, fourth valve, 21, fifth valve, 22, temperature gauge, 23, pressure gauge, 24, air storage tank, 25, sixth valve, 26, second air storage chamber, 27, PCB board, 28, transfer layer, 29, guide plate, 30, rubber pad, 31, seventh valve. DETAILED DESCRIPTION

[0037] The present invention is further described in detail below in conjunction with embodiments:

[0038] The present invention is not limited to the following specific embodiments. A person skilled in the art can implement the present invention in various other specific embodiments according to the contents disclosed in the present invention, or any simple changes or modifications made to the design structure and ideas of the present invention fall within the protection scope of the present invention. It should be noted that the embodiments and features in the embodiments of the present invention can be combined with each other without conflict.

[0039] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and the like may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0040] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0041] like Figure 1-10 As shown, a low-temperature and high-pressure test device based on vortex tube cooling includes a lower end cover 1, an upper end cover 2, a compressor 5, a first air storage chamber 6, a first vortex tube refrigerator 7 and a second vortex tube refrigerator 8. In this embodiment, the upper end cover 2 is threadedly connected to the lower end cover 1, so that the lower end cover 1 and the upper end cover 2 are detachable. Of course, in addition to the threaded connection, the lower end cover 1 and the upper end cover 2 can also be clamped together, or the lower end cover 1 and the upper end cover 2 are connected by screws. A closed detection chamber 3 is provided between the lower end cover 1 and the upper end cover 2. The detection chamber 3 is used to place a detection wafer. A probe 4 is provided in the detection chamber 3. The probe 4 For detecting wafers, a first valve 9 is arranged on the upper end cover 2, the first valve 9 is connected with the detection cavity 3 and can be connected with the outside of the detection device, the output end of the compressor 5 is connected with the first air storage chamber 6, the first air storage chamber 6 is connected with the vortex chamber of the first vortex tube refrigerator 7, the cold end of the first vortex tube refrigerator 7 is connected with the detection cavity 3, the hot end of the first vortex tube refrigerator 7 is connected with the vortex chamber of the second vortex tube refrigerator 8, a first cooling component 10 is arranged on the hot end of the first vortex tube refrigerator 7, the hot end of the second vortex tube refrigerator 8 is connected with the first air storage chamber 6, and a second cooling component 11 is arranged on the hot end of the second vortex tube refrigerator 8.

[0042] The first cooling component 10 includes a first sleeve 12, which is sleeved on the hot end of the first vortex tube refrigerator 7, and a closed first heat exchange chamber 13 is formed between the first sleeve 12 and the hot end of the first vortex tube refrigerator 7. The first sleeve 12 is provided with a water inlet 14 and a water outlet 15, and the water inlet 14 and the water outlet 15 are connected to the first heat exchange chamber 13. The second cooling component 11 includes a second sleeve 16, which is sleeved on the hot end of the second vortex tube refrigerator 8, and a closed second heat exchange chamber 17 is formed between the second sleeve 16 and the hot end of the second vortex tube refrigerator 8. The first heat exchange chamber 13 and the second heat exchange chamber 17 are connected to each other through a pipeline, and the second sleeve 16 also has a water outlet, and the water outlet on the second sleeve 16 can discharge the water after heat exchange in the second heat exchange chamber 17.

[0043] A second valve 18 is arranged between the first air storage chamber 6 and the vortex chamber of the first vortex tube refrigerator 7, a third valve 19 is arranged between the cold end of the first vortex tube refrigerator 7 and the detection chamber 3, a fourth valve 20 is arranged between the hot end of the first vortex tube refrigerator 7 and the vortex chamber of the second vortex tube refrigerator 8, and a fifth valve 21 is arranged between the hot end of the second vortex tube refrigerator 8 and the first air storage chamber 6.

[0044] The first vortex tube refrigerator 7 is provided with a temperature gauge 22 and a pressure gauge 23 .

[0045] The cold end of the first vortex tube refrigerator 7 is connected to the detection chamber 3 through the gas storage tank 24, the third valve 19 is located between the gas storage tank 24 and the cold end of the first vortex tube refrigerator 7, a sixth valve 25 is arranged between the gas storage tank 24 and the detection chamber 3, a second gas storage chamber 26 is arranged between the lower end cover 1 and the upper end cover 2, the second gas storage chamber 26, the detection chamber 3 and the sixth valve 25 are interconnected, the first valve 9 is connected to the detection chamber 3 through the second gas storage chamber 26, a seventh valve 31 is arranged between the second gas storage chamber 26 and the detection chamber 3 and the sixth valve 25, a valve is also arranged at the cold end of the second vortex tube refrigerator 8, and the gas discharge from the cold end of the second vortex tube refrigerator 8 can be controlled.

[0046] A PCB board 27 and a transfer layer 28 are provided on the upper end cover 2, a guide plate 29 is provided in the detection cavity 3, the transfer layer 28 is located between the PCB board 27 and the guide plate 29, one end of the probe 4 is connected to the PCB board 27, and the other end of the probe 4 passes through the transfer layer 28 and the guide plate 29 in sequence, and a rubber pad 30 for fixing the wafer to be tested is provided under the guide plate 29.

[0047] A test method using a vortex tube cooling low temperature and high pressure test device as described above, the specific operation steps are as follows:

[0048] S1, placing the wafer to be tested into the detection chamber 3, setting the upper end cover 2 on the lower end cover 1, and making the wafer to be tested contact with the probe 4 and fixed in the detection chamber 3;

[0049] S2, turn on the compressor 5 and set the pressure of the gas output by the compressor 5 to 10 MPa;

[0050] S3, open the first valve 9, the second valve 18, the third valve 19, the fourth valve 20, the fifth valve 21, the sixth valve 25 and the seventh valve 31, check whether the entire gas path of the test device is unobstructed, and discharge it to the outside through the first valve 9;

[0051] S4, after waiting for one minute, close the first valve 9, the second valve 18, the third valve 19, the fourth valve 20, the fifth valve 21, the sixth valve 25 and the seventh valve 31 to make the entire test device airtight;

[0052] S5, open the second valve 18, start the first cooling assembly 10 and cool the hot end of the first vortex tube refrigerator 7, or in this step, the second valve 18, the fourth valve 20, the fifth valve 21 can be opened as needed, and the cold end of the second vortex tube refrigerator 8 is also provided with a valve, the gas is internally circulated between the first vortex tube refrigerator 7 and the second vortex tube refrigerator 8 and cooled multiple times, and at the same time, the first cooling assembly 10 cools the hot end of the first vortex tube refrigerator 7, and the second cooling assembly 11 cools the hot end of the second vortex tube refrigerator 8;

[0053] S6, observe the values ​​of the temperature gauge 22 and the pressure gauge 23, and after the cold end temperature of the first vortex tube refrigerator 7 stabilizes and reaches the temperature required for the test, open the third valve 19 to deliver the gas reaching the temperature and pressure required for the test to the gas storage tank 24;

[0054] S7, opening the sixth valve 25, introducing the gas in the gas storage tank 24 into the detection chamber 3 and directly acting on the wafer under test;

[0055] S8, adjusting the seventh valve 31, and controlling the detection chamber 3 to reach the required pressure and temperature, and starting the detection;

[0056] S9, after the detection is completed, close the sixth valve 25, open the first valve 9, and release the pressure in the detection chamber 3;

[0057] S10, after waiting for a period of time, the upper end cover 2 and the lower end cover 1 are disassembled, the wafer to be tested is taken out, the test work is completed, and the entire test device is restored to the initial state.

[0058] The above-mentioned ideal embodiments of the present invention are for inspiration. Through the above-mentioned description, relevant staff can make various changes and modifications without departing from the technical idea of ​​the present invention. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A test method using a low temperature and high pressure test device based on vortex tube cooling, characterized in that: The low-temperature and high-pressure testing device based on vortex tube cooling comprises a lower end cover (1) and an upper end cover (2) detachably mounted on the lower end cover (1); a sealed testing cavity (3) for placing a testing wafer is arranged between the lower end cover (1) and the upper end cover (2); a probe (4) for testing the wafer is arranged in the testing cavity (3); and the device is characterized in that it also comprises a compressor (5) arranged outside the upper end cover (2), a first air storage chamber (6), a first vortex tube refrigerator (7) and a second vortex tube refrigerator (8); a first valve (9) communicating with the testing cavity (3) is arranged on the upper end cover (2); and the The output end of the compressor (5) is in communication with the first air storage chamber (6), the first air storage chamber (6) is in communication with the vortex chamber of the first vortex tube refrigerator (7), the cold end of the first vortex tube refrigerator (7) is in communication with the detection chamber (3), the hot end of the first vortex tube refrigerator (7) is in communication with the vortex chamber of the second vortex tube refrigerator (8), a first cooling component (10) is provided on the hot end of the first vortex tube refrigerator (7), the hot end of the second vortex tube refrigerator (8) is in communication with the first air storage chamber (6), and a second cooling component (11) is provided on the hot end of the second vortex tube refrigerator (8); A second valve (18) is provided between the first air storage chamber (6) and the vortex chamber of the first vortex tube refrigerator (7), a third valve (19) is provided between the cold end of the first vortex tube refrigerator (7) and the detection chamber (3), a fourth valve (20) is provided between the hot end of the first vortex tube refrigerator (7) and the vortex chamber of the second vortex tube refrigerator (8), and a fifth valve (21) is provided between the hot end of the second vortex tube refrigerator (8) and the first air storage chamber (6); The first vortex tube refrigerator (7) is provided with a temperature gauge (22) and a pressure gauge (23); The cold end of the first vortex tube refrigerator (7) is connected to the detection chamber (3) via an air storage tank (24), the third valve (19) is located between the air storage tank (24) and the cold end of the first vortex tube refrigerator (7), and a sixth valve (25) is provided between the air storage tank (24) and the detection chamber (3); When in use, the gas is circulated multiple times through the first vortex tube refrigerator (7) and the second vortex tube refrigerator (8), so that the gas is recycled and the gas with the required temperature and pressure is transported to the gas storage tank (24), and the cooling gas is transported to the detection cavity by the gas storage tank (24), so that the detection cavity (3) reaches the required pressure and temperature; The first cooling assembly (10) comprises a first sleeve (12) sleeved on the hot end of the first vortex tube refrigerator (7), a sealed first heat exchange chamber (13) being formed between the first sleeve (12) and the hot end of the first vortex tube refrigerator (7), and a water inlet (14) and a water outlet (15) being provided on the first sleeve (12) and communicating with the first heat exchange chamber (13); The second cooling assembly (11) comprises a second sleeve (16) sleeved on the hot end of the second vortex tube refrigerator (8), a sealed second heat exchange cavity (17) is formed between the second sleeve (16) and the hot end of the second vortex tube refrigerator (8), and the first heat exchange cavity (13) is in communication with the second heat exchange cavity (17); A second air storage chamber (26) is provided between the lower end cover (1) and the upper end cover (2); the second air storage chamber (26), the detection chamber (3) and the sixth valve (25) are connected to each other; and the first valve (9) is connected to the detection chamber (3) via the second air storage chamber (26); A seventh valve (31) is provided between the second gas storage chamber (26), the detection chamber (3) and the sixth valve (25); A PCB board (27) and a transfer layer (28) are arranged on the upper end cover (2); a guide plate (29) is arranged in the detection chamber (3); the transfer layer (28) is located between the PCB board (27) and the guide plate (29); one end of the probe (4) is connected to the PCB board (27); the other end of the probe (4) passes through the transfer layer (28) and the guide plate (29) in sequence; a rubber pad (30) for fixing the wafer to be tested is arranged below the guide plate (29); the test method comprises the following steps: S1, placing a wafer to be tested in a testing chamber (3), placing an upper end cover (2) on a lower end cover (1), and making the wafer to be tested contact with a probe (4) and fixed in the testing chamber (3); S2, turning on the compressor (5) and setting the pressure of the gas output by the compressor (5); S3, opening the first valve (9), the second valve (18), the third valve (19), the fourth valve (20), the fifth valve (21), the sixth valve (25), and the seventh valve (31), and allowing the gas to be discharged to the outside through the first valve (9); S4, wait for a period of time, and close the first valve (9), the second valve (18), the third valve (19), the fourth valve (20), the fifth valve (21), the sixth valve (25), and the seventh valve (31), so that the entire test device is airtight; S5, opening the second valve (18), starting the first cooling assembly (10) and cooling the hot end of the first vortex tube refrigerator (7); S6, observing the values ​​of the temperature gauge (22) and the pressure gauge (23), and after the cold end temperature of the first vortex tube refrigerator (7) is stabilized and reaches the temperature required for the test, opening the third valve (19) to transport the gas reaching the temperature and pressure required for the test to the gas storage tank (24); S7, opening the sixth valve (25), introducing the gas in the gas storage tank (24) into the detection chamber (3) and directly acting on the wafer to be detected; S8, adjusting the seventh valve (31), and controlling the detection chamber (3) to reach the required pressure and temperature, and starting the detection; S9, after the detection is completed, the sixth valve (25) is closed, the first valve (9) is opened, and the pressure in the detection chamber (3) is released; S10, after waiting for a period of time, the upper end cover (2) and the lower end cover (1) are disassembled, the wafer to be tested is taken out, the test work is completed, and the entire test device is restored to an initial state.

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