A method for manufacturing a plug-in soldering integrated circuit board for high-precision signal transmission

Abstract

The present invention discloses a method for manufacturing a plug-in soldering integrated circuit board for high-precision signal transmission, wherein a double-sided circuit pattern is manufactured on a double-sided copper-clad laminate, including plug-in finger patterns symmetrical on both sides, and conductive circuits connected to the plug-in finger patterns are distributed on different sides, a graphic covering layer is manufactured from a single-sided copper-clad laminate, and is respectively pressed onto both sides of the double-sided circuit pattern, plug-in pattern prefabricated holes on the plug-in finger pattern are drilled, and the outer shape is formed to form a plug-in soldering integrated circuit board; by manufacturing the double-sided circuit pattern, the conductive circuits are distributed to both sides, thereby reducing mutual interference between the circuits and improving the supporting force; by pressing the graphic covering layer, an auxiliary layer is formed, thereby improving the supporting force of the board during drilling and forming processing, and preventing the plug-in fingers from skewing or deviating during drilling and milling processing; the overall process forms an effective processing flow with front-to-back coordination, realizes a feasible processing process, and effectively improves the processing precision.

Description

Technical Field

[0001] The present invention relates to the field of circuit board manufacturing, and in particular to a method for manufacturing a plug-and-weld integrated circuit board for high-precision signal transmission. Background Art

[0002] For a type of high-precision circuit board products used in digital AI video or medical equipment, a design with dual connections of plug-in and soldering has emerged, which can improve the reliability of the connection and enhance the performance of high-precision signal transmission.

[0003] This type of circuit board product is usually designed as a single-sided circuit graphic product to meet the circuit conduction and signal transmission requirements. However, when the circuit graphic density distributed on the single-sided circuit surface is high, it is easy to cause signal interference between adjacent circuits. In addition, the single-sided circuit graphic has weak support for the entire board, and graphic problems are easy to occur during the processing process.

[0004] For dual connections using plug-in and welding, plug-in fingers are usually designed to achieve plug-in connection, and plug-in through holes are set on the plug-in fingers to achieve plug-in and welding connections. When the plug-in fingers have high precision and a large aspect ratio (long length and narrow width), if drilling is performed first, the plug-in fingers will easily become skewed or offset during the subsequent forming process. If forming is performed first, plug-in through holes will easily be generated during the subsequent drilling process, causing the plug-in fingers to break or the plug-in through holes to be offset. Moreover, if forming is performed using a single track, the plug-in fingers will further become skewed and offset.

[0005] Therefore, in view of the above background and problems, it is necessary to provide a method for manufacturing a plug-in integrated circuit board with high-precision signal transmission. Summary of the Invention

[0006] The present invention aims to address the problems of circuit boards with a design that uses plug-in fingers to achieve dual connections of plugging and soldering, where the density of single-sided circuit patterns is too high, which easily causes signal interference and insufficient supporting force. In addition, plug-in fingers with plug-in through-hole designs are prone to skew, displacement, and breakage during drilling and forming. A method for manufacturing a plug-in soldering integrated circuit board with high-precision signal transmission is proposed. The manufacturing method includes the following steps:

[0007] S10: Take a double-sided copper clad laminate, set up an effective processing area and an extension area, the effective processing area includes an auxiliary processing area, and the extension area is distributed around the effective processing area; make a double-sided circuit pattern for the double-sided copper clad laminate, the double-sided circuit pattern includes two-sided symmetrical plug-in finger patterns; the extension area and the auxiliary processing area expose the insulating dielectric layer of the double-sided copper clad laminate; the tail end of the plug-in finger pattern is connected to a conductive circuit, and the top end is a plug-in end; adjacent conductive circuits are distributed on different sides of the double-sided circuit pattern, and a plug-in prefabricated hole pattern is made on the plug-in finger pattern; the whole forms a graphic board.

[0008] S20: Take a single-sided copper clad laminate and make a graphic covering layer, wherein the covering layer pattern retains the copper layer of the single-sided copper clad laminate in a range corresponding to the effective processing area, and exposes the insulating dielectric layer of the single-sided copper clad laminate in the extension area and the auxiliary processing area; respectively press the graphic covering layer onto the upper and lower surfaces of the graphic board to form a graphic covering board.

[0009] S30: drilling holes at positions where the prefabricated hole patterns are inserted on the surface of the pattern covering plate to form a drilled pattern plate.

[0010] S40: forming the drilling pattern plate along the outer contour to form the plug-and-weld integrated circuit board.

[0011] Furthermore, the prefabricated plug-in hole pattern includes a positioning ring, which is a plurality of copper ring circuit patterns distributed in sequence from the edge to the center of the prefabricated plug-in hole pattern.

[0012] Optionally, the drilling process is: using an X-ray detection machine to scan the plug-in prefabricated hole pattern from the surface of the pattern covering layer to form a scanned pattern; transmitting the scanned pattern to a computer terminal, and generating drilling data for the plug-in prefabricated hole pattern therein; importing the drilling data into the host of the drilling machine to perform the drilling process.

[0013] Furthermore, the forming process includes performing split-knife milling on the plug-in finger pattern to form the plug-in fingers; the split-knife milling is to mill each of the plug-in finger patterns along the tail end to the top end.

[0014] Furthermore, the conductive circuits corresponding to the adjacent plug-in finger patterns are respectively distributed on both sides of the double-sided circuit pattern.

[0015] Furthermore, the conductive circuits distributed on both sides of the double-sided circuit pattern are connected through conductive holes.

[0016] Furthermore, the insulating dielectric layer of the double-sided copper clad laminate is made of the same material as the insulating dielectric layer of the single-sided copper clad laminate.

[0017] Furthermore, the surface of the plug-in finger pattern is made with an electroplated gold layer.

[0018] Furthermore, a solder resist layer is formed on the surface of the effective processing area where the conducting circuits are distributed.

[0019] Furthermore, the pressing process adopts a heating rate of 4°C to 6°C and a maximum pressure of 10 kg / cm 2 Up to 20kg / cm 2 , the maximum temperature is 120℃ to 150℃ for pressing.

[0020] The technical solution of the present invention changes the single-sided circuit pattern of the existing technology into a double-sided circuit pattern, provides a basis for the double-sided distribution of the conductive circuit, reduces the mutual interference of the circuits, and improves the overall supporting force of the circuit board, providing board surface strength for subsequent forming processing; for the processing of the plug-in fingers, an auxiliary layer is formed by pressing the graphic covering layer to improve the supporting force of the board during drilling and forming processing, and to resist the mechanical strength of drilling and milling processing, and prevent the plug-in fingers from skewing and deviating. Furthermore, for the drilling processing after being covered by the graphic covering layer, a positioning ring is set or an X-ray detection machine is used to realize the "reverse processing" drilling processing method, which effectively improves the processing accuracy of the drilling. Furthermore, the forming processing is carried out by using a split-knife milling method, which effectively avoids the problem of skew of the plug-in fingers caused by milling from a single forming collection in one direction; the overall process forms an effective processing flow with front and back coordination, realizes a feasible processing process, and effectively improves the processing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0022] Figure 1 This is a schematic diagram of the finished planar structure of a conventional soldered integrated circuit board;

[0023] Figure 2 for Figure 1 Schematic diagram of the XA-XA cross-sectional structure;

[0024] Figure 3 for Figure 1 Schematic diagram of the XB-XB cross-sectional structure;

[0025] Figure 4 This is a key process flow chart for an embodiment of the present invention;

[0026] Figure 5 A schematic diagram of the planar structure of a graphic board formed in accordance with an embodiment of the present invention;

[0027] Figure 6 Implementation of the present invention Figure 5 AA cross-sectional structural diagram;

[0028] Figure 7 Implementation of the present invention Figure 5 BB cross-sectional structure diagram;

[0029] Figure 8 A schematic diagram of the planar structure of a positioning ring pattern plate produced in accordance with an embodiment of the present invention;

[0030] Figure 9 This is a schematic diagram of the planar structure of a cover plate formed in accordance with an embodiment of the present invention;

[0031] Figure 10 Implementation of the present invention Figure 9 Schematic diagram of CC cross-section structure;

[0032] Figure 11 Implementation of the present invention Figure 9 DD cross-sectional structure diagram;

[0033] Figure 12 This is a schematic diagram of the planar structure of a plug-in through-hole plate manufactured in accordance with an embodiment of the present invention;

[0034] Figure 13 A schematic diagram of the planar structure of a pattern plate formed and processed according to an embodiment of the present invention;

[0035] Figure 14 This is a schematic diagram of the planar structure of a plug-and-weld integrated circuit board manufactured in accordance with an embodiment of the present invention;

[0036] Figure 15 This is a physical board diagram of a plug-and-weld integrated circuit board manufactured according to an embodiment of the present invention.

[0037] Description of Figure Numbers:

[0038] Label name Label name 50X Prior art soldering integrated circuit board 1350 vias 130X Prior art circuit copper layer 140 solder mask 140X Prior art solder mask 20 Positioning ring graphic board 410X Prior art plug-through hole 1331 locating ring 510X Prior art plug-in fingers 30 Graphic Overlay 1310X Existing insulating dielectric layer 310 Graphics Overlay 10JX Existing insulating dielectric layer 3110 First graphic overlay 10 Graphics tablet 3120 Second graphic overlay 10J Insulating dielectric layer of double-sided copper clad laminate 320 Copper layer of single-sided copper clad laminate 110 Effective processing area 330 Insulating dielectric layer of single-sided copper clad laminate 1110 Auxiliary processing area 340 Adhesive area 120 Expansion Area 40 Drilling graphics board 130 Double-sided line graphics 410 Plug-through hole 1310 Inserting finger graphic 420 Forming milling trajectory 1320 Conductive lines 430 Outline 1330 Electroplating gold layer 50 Plug-in integrated circuit board 1340 Prefabricated jack graphics 510 Inserting fingers

[0039] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0041] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, inside, outside, etc.) are only used to explain the relative position relationship and movement status of the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0042] In addition, the terms "first," "second," and so on, used in this disclosure are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referenced. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this disclosure, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0043] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0044] See also Figure 1 、 Figure 2 and Figure 3 , Figure 1 This is a schematic diagram of the finished planar structure of a conventional soldered integrated circuit board; Figure 2 for Figure 1 Schematic diagram of the XA-XA cross-sectional structure; Figure 3 for Figure 1 Schematic diagram of the XB-XB cross-sectional structure.

[0045] The prior art integrated soldering circuit board 50X is a single-sided graphic board, that is, it is composed of a stack of a prior art insulating dielectric layer 10JX and a prior art circuit pattern 130X. The prior art circuit pattern 130X is distributed on the same surface, and is provided with a prior art plug-in finger 510X. The surface is made with a prior art plug-in finger pattern 1310X, and has a prior art plug-in through hole 410X. The tail end of the prior art plug-in finger pattern 1310X is connected to a prior art conductive line 1320X, the surface is covered with a prior art solder mask layer 140X, and the surface of the prior art plug-in finger pattern 1310X is made with a prior art electroplating layer 1330X.

[0046] See also Figure 4 , Figure 4 This is a key process flow chart for an embodiment of the present invention;

[0047] The method for manufacturing a high-precision signal transmission integrated plug-in soldering circuit board according to the embodiment of the present invention includes: Figure 4 The key production process is described in detail step by step below.

[0048] See also Figure 5 、 Figure 6 、 Figure 7 and Figure 8 ; Figure 5 A schematic diagram of the planar structure of a graphic board formed in accordance with an embodiment of the present invention; Figure 6 Implementation of the present invention Figure 5 AA cross-sectional structural diagram; Figure 7 Implementation of the present invention Figure 5 BB cross-sectional structure diagram; Figure 8 This is a schematic diagram of the planar structure of a positioning ring graphic plate produced according to an embodiment of the present invention.

[0049] Step S10:

[0050] A double-sided copper clad laminate, including an insulating dielectric layer 10J of the double-sided copper clad laminate, is provided with an effective processing area 110 and an extension area 120 . The effective processing area 110 includes an auxiliary processing area 1110 , and the extension area 120 is distributed around the effective processing area 110 .

[0051] An expansion area 120 is set on the original processed board surface size to provide a pressing space for the subsequent pressing of the graphic covering layer 310. It is worth noting that the expansion area 120 can be pre-enlarged to a certain extent based on the range of the effective processing area to prevent the graphic covering layer 310 from pressing onto the non-auxiliary processing area within the effective processing area, causing the problem of adhesion and difficulty in peeling off after molding.

[0052] A double-sided circuit pattern 130 is manufactured on the double-sided copper clad laminate, and the double-sided circuit pattern 130 includes two-sided symmetrical plug-in finger patterns 1310; in this embodiment.

[0053] This embodiment replaces the original single-sided graphic board with a method of using a double-sided copper-clad laminate to produce a double-sided circuit pattern 130, so that the existing circuit pattern is changed to a double-sided circuit pattern 130. On the one hand, it provides a double-sided copper layer foundation for the subsequent production of double-sided conductive circuits 1320. On the other hand, the double-sided circuit pattern 130 has stronger supporting force than the existing circuit pattern, preventing the problem of insufficient board strength during subsequent molding processing causing the plug-in fingers 510 to be skewed.

[0054] The expansion area 120 and the auxiliary processing area expose the insulating dielectric layer 10J10J of the double-sided copper clad laminate; the tail end of the plug-in finger pattern 1310 is connected to a conductive line 1320, and the top end is a plug-in end; adjacent conductive lines 1320 are distributed on different surfaces of the double-sided line pattern 130, and a plug-in prefabricated hole pattern 1340 is made on the plug-in finger pattern 1310.

[0055] An electroplating gold layer 1330 is formed on the surface of the plug finger pattern 1310 , and a solder resist layer 140 is formed on the surface of the effective processing area where the conducting circuit 1320 is distributed.

[0056] In this embodiment, the conductive circuits 1320 corresponding to the adjacent plug finger patterns 1310 are respectively distributed on both sides of the double-sided circuit pattern 130 .

[0057] Since the single-sided graphic board is replaced with a double-sided circuit graphic 130 board, and the plug-in fingers 510 are used in a dual-conductivity manner of plugging and welding, based on this premise, the conductive lines 1320 are distributed on both sides, which can effectively reduce the problem of signal interference caused by the close distance between the lines when distributed on the same side.

[0058] The electroplating gold layer 1330 and the solder mask layer 140 are produced, that is, after all layers and patterns are produced, the method of overlaying the graphic covering layer 310 of this embodiment is used to produce the subsequent plug-in holes 410 and molding processing. Of course, since the processing of the electroplating gold layer 1330 is carried out by electroplating gold, the production of the electroplating gold layer 1330 can also be placed after the molding processing.

[0059] In this embodiment, the conductive circuits 1320 distributed on both sides of the double-sided circuit pattern 130 are connected through the conductive holes 1350 .

[0060] Furthermore, the vias 1350 can be used to connect the conductive circuit 1320 to the tail ends of the double-sided plug-in finger graphics 1310, thereby further improving the stability during plugging and welding, and preventing poor conduction problems caused by cold soldering; the method for making the vias 1350 is to drill holes before electroplating the entire board, and after electroplating the entire board and making the double-sided circuit graphics 130, the vias 1350 are formed.

[0061] In one embodiment, the plug prefabricated hole pattern 1340 includes a positioning ring 1331, and the positioning ring 1331 is a plurality of copper ring circuit patterns (such as Figure 8 As shown), the entire plate body forms a positioning ring graphic plate 20.

[0062] Since the graphic board 10 is covered into the inner layer after the graphic covering layer 310 is subsequently attached, and since the pressing may have a certain impact on the expansion and contraction of the product, the drilling machine cannot accurately position the graphics of the inner layer when drilling. For drilling of circuit boards with higher precision requirements, a positioning ring 1331 is made in the plug-in prefabricated hole graphic 1340 when making the double-sided circuit graphic 130, so that a "trial drilling" process can be performed first, that is, drilling is performed through positioning, and some holes (which are more affected by expansion and contraction) can be drilled first. The positioning ring 1331 (under the observation of an X-ray detector) can be used to observe whether the drilling is deviated, so that the drilling data and parameters can be adjusted in time, and then batch drilling processing can be formed, which can effectively improve the drilling accuracy.

[0063] After the above manufacturing process, the graphic board 10 is formed as a whole.

[0064] See also Figure 9 、 Figure 10 and Figure 11 ; Figure 9 This is a schematic diagram of the planar structure of a cover plate formed in accordance with an embodiment of the present invention; Figure 10 Implementation of the present invention Figure 9 Schematic diagram of CC cross-section structure; Figure 11 Implementation of the present invention Figure 9 Schematic diagram of the DD cross-section structure.

[0065] Step S20:

[0066] A single-sided copper clad laminate is taken to make a patterned covering layer 310. The pattern of the covering layer retains the copper layer 320 of the single-sided copper clad laminate in the range corresponding to the effective processing area, and exposes the insulating dielectric layer 330 of the single-sided copper clad laminate in the corresponding range corresponding to the expansion area 120 and the auxiliary processing area.

[0067] The graphic covering layer 310 is pressed onto both the upper and lower surfaces of the graphic board 10, such as Figure 10 and Figure 11 As shown, the first graphic covering layer 3110 and the second graphic covering layer 3120 are laminated respectively to form the graphic covering plate 30.

[0068] During lamination, the expansion area 120 and the auxiliary processing form the bonding area 340320.

[0069] In this embodiment, a method similar to the "rigid-flex board cover removal process" is used to produce the drilling and forming process; that is, the first graphic covering layer 3110 and the second graphic covering layer 3120 are first pressed on the graphic board 10, and then the drilling and forming processes are performed, which provides effective support for the processing of the plug-in fingers 510 and effectively avoids the problem of skewness of the plug-in fingers 510 caused by the drilling and forming processes.

[0070] Since the first graphic covering layer 3110 and the second graphic covering layer 3120 are auxiliary layers, that is, layers that need to be removed later (similar to the uncovering process of the rigid-flexible board), if the semi-cured sheet or the insulating dielectric layer is directly pressed, the material will adhere to the double-sided circuit pattern 130 under high temperature and high pressure conditions, resulting in subsequent difficulty in removal and cleaning. Therefore, a single-sided copper clad laminate is made to form the graphic covering layer 310, and the copper layer 320 of the single-sided copper clad laminate is retained in the range of the effective processing area, and the insulating dielectric of the single-sided copper clad laminate is exposed in the expansion area 120 and the auxiliary processing area. Layer 330, when pressed, the effective processing area corresponds to the copper layer 320 of the single-sided copper clad laminate, while the expansion area 120 and the auxiliary processing area expose the insulating dielectric layer 10J of the double-sided copper clad laminate, and the performance difference between the copper layer 320 of the single-sided copper clad laminate and the insulating dielectric layer of the single-sided copper clad laminate is utilized (the copper layer 320 of the single-sided copper clad laminate does not adhere to the copper layer of the graphic board, the copper layer 320 of the single-sided copper clad laminate is not easy to adhere to the insulating dielectric layer area of ​​the graphic board, and the insulating dielectric layer and the insulating dielectric layer of the graphic board are easy to adhere), to achieve the difference in interlayer adhesion during pressing, thereby providing the conditions for "uncovering" during subsequent molding processing.

[0071] In this embodiment, the insulating dielectric layer 10J of the double-sided copper clad laminate is made of the same material as the insulating dielectric layer 330 of the single-sided copper clad laminate. The same material can improve the effective bonding force between the layers during lamination.

[0072] In this embodiment, the pressing adopts a heating rate of 4°C to 8°C and a maximum pressure of 10kg / cm 2 Up to 20kg / cm 2 , the maximum temperature is 120℃ to 150℃ for pressing.

[0073] Since the first graphic covering layer 3110 and the second graphic covering layer 3120 serve as auxiliary layers, and as mentioned above, the difference in material properties is utilized to achieve interlayer adhesion during lamination, a micro-pressing lamination method with a faster heating rate, lower pressure, and lower maximum temperature is adopted to achieve micro-pressing of the first graphic covering layer 3110 and the second graphic covering layer 3120 to the surface of the graphic board, while preventing the problem of failure of the material properties (and interlayer adhesion) caused by excessive lamination parameters.

[0074] See also Figure 12 ; Figure 12 This is a schematic diagram of the planar structure of a plug-in through-hole plate manufactured according to an embodiment of the present invention.

[0075] Step S30:

[0076] The surface of the pattern covering plate 30 is drilled at the position of the plug-in prefabricated hole pattern 1340 to form a plug-in through hole 410, thereby forming a drilled pattern plate 40 as a whole.

[0077] Under the protection and support of the graphic cover plate 30, the drilling process can be carried out effectively.

[0078] In one embodiment, the drilling process is as follows: using an X-ray detection machine to scan the plug-in prefabricated hole pattern 1340 from the surface of the pattern covering layer 310 to form a scan pattern; transmitting the scan pattern to a computer terminal, and generating drilling data for the plug-in prefabricated hole pattern 1340 therein; importing the drilling data into the host of the drilling machine to perform the drilling process.

[0079] In one embodiment described above, a positioning ring 1331 is made for the prefabricated plug hole pattern 1340, and then a "forward processing" drilling process is used to form the plug through hole 410. For high-precision circuit board products, higher hole processing accuracy is required. When the above-mentioned "forward processing" drilling process still cannot meet the high-precision drilling processing requirements, a "reverse processing" drilling method can be used, that is, an X-ray detector is first used for a transmission scan. The X-ray passes through the pattern cover plate to scan the prefabricated plug hole pattern 1340. The scanned pattern is processed by the computer and reversely formed into drilling data. After screening, inspection, and confirmation, the drilling data is imported into the mainframe of the drilling machine for drilling processing. In this way, by first determining the position of the prefabricated plug hole pattern 1340, then reversely forming the drilling data, and then drilling, it is equivalent to first determining the position of the overall plug through hole 410 and then performing "blind" drilling, that is, a high-precision plug through hole 410 can be obtained.

[0080] See also Figure 13 , Figure 13 A schematic diagram of the planar structure of a pattern plate formed and processed according to an embodiment of the present invention; Figure 14 The diagram is a planar structural diagram of a plug-and-weld integrated circuit board manufactured according to an embodiment of the present invention.

[0081] Step S40: Drill the pattern board according to Figure 13 The forming milling track 420 shown in FIG. 1 is used to perform milling processing on the plug-in finger pattern 1310 to form the plug-in finger 510, and is formed along the outline 430 to form the plug-in integrated circuit board 50 (eg Figure 14 shown).

[0082] In this embodiment, the forming process includes performing split-knife milling on the plug-in finger pattern 1310 to form the plug-in finger 510 ; the split-knife milling is to mill each of the plug-in finger patterns 1310 along the tail end to the top end.

[0083] Since the length and width of the connecting fingers 510 are relatively large (longer in length and narrower in width), using a conventional single forming milling trajectory to perform a one-time milling process in one direction can easily lead to problems such as skew and displacement of the connecting fingers 510. However, in this embodiment, under the support and protection of the first graphic covering layer 3110 and the second graphic covering layer 3120, a split-knife milling method is further adopted to mill each connecting finger 510 from the tail end to the top end, further avoiding the skew problem caused by milling in one direction.

[0084] See also Figure 15 , Figure 15 This is a physical board diagram of a plug-and-weld integrated circuit board manufactured according to an embodiment of the present invention.

[0085] According to the manufacturing method of this embodiment, the following Figure 15 Plug-in integrated circuit board.

[0086] It is worth noting that due to the actual design and processing of circuit boards, which are relatively precise, the actual structural diagrams and the thickness of each layer, line width and other dimensions are all at the micron level. For example, the thickness of each layer is generally between 5μm and 50μm. If the drawings in the specification are made according to the actual proportions, there will be a problem of unclear drawings. Therefore, in order to more clearly show the implementation process of the manufacturing method, the drawings of this embodiment are all schematic diagrams that enlarge the technical features, and do not represent the size of the actual structural diagram, nor do they represent enlarged drawings of the actual structural diagram in proportion.

[0087] The above are only preferred embodiments of the present invention and are not intended to limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention's description and drawings, or direct / indirect applications in other related technical fields, within the scope of the present invention are included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a plug-in soldering integrated circuit board for high-precision signal transmission, characterized in that: The production method comprises the following steps: S10: Take a double-sided copper clad laminate, set an effective processing area and an expansion area, wherein the effective processing area includes an auxiliary processing area, and the expansion area is distributed around the effective processing area; Making a double-sided circuit pattern on the double-sided copper clad laminate, wherein the double-sided circuit pattern includes two-sided symmetrical plug-in finger patterns; The extension area and the auxiliary processing area expose the insulating dielectric layer of the double-sided copper clad laminate; The tail end of the plug-in finger pattern is connected to a conducting circuit, and the top end is a plug-in end; The adjacent conductive lines are distributed on different sides of the double-sided line pattern, and the plug-in finger pattern is made with a plug-in prefabricated hole pattern; The whole forms a graphic board; S20: Taking a single-sided copper clad laminate, and making a patterned covering layer, wherein the pattern of the covering layer is such that the copper layer of the single-sided copper clad laminate is retained in a range corresponding to the effective processing area, and the insulating dielectric layer of the single-sided copper clad laminate is exposed in the extended area and the auxiliary processing area; Pressing the graphic covering layer onto the upper and lower surfaces of the graphic plate respectively; forming a graphic cover plate; S30: drilling holes at positions where the prefabricated hole patterns are inserted on the surface of the pattern covering plate to form a drilled pattern plate; S40: forming the drilling pattern plate along the outer contour to form the plug-and-weld integrated circuit board.

2. The method for manufacturing a high-precision signal transmission integrated plug-and-weld circuit board according to claim 1, characterized in that: The prefabricated plug-in hole pattern includes a positioning ring, which is a plurality of copper ring circuit patterns distributed in sequence from the edge to the center of the prefabricated plug-in hole pattern.

3. The method for manufacturing a high-precision signal transmission integrated plug-and-weld circuit board according to claim 1, characterized in that: The drilling process is as follows: Scanning the prefabricated plug-in hole pattern from the surface of the pattern covering layer using an X-ray detector to form a scan pattern; The scanned graphics are transmitted to a computer, and drilling data is generated for the prefabricated hole graphics therein; The drilling data is imported into the main machine of the drilling machine to perform the drilling process.

4. The method for manufacturing a high-precision signal transmission integrated plug-and-weld circuit board according to claim 1, wherein: The forming process includes performing split-knife milling and shaping on the plug-in finger pattern to form the plug-in fingers; The split-knife milling is to mill each of the plug-in finger patterns along the tail end toward the top end.

5. The method for manufacturing a high-precision signal transmission integrated plug-and-weld circuit board according to claim 1, wherein: The conductive circuits corresponding to the adjacent plug-in finger patterns are respectively distributed on both sides of the double-sided circuit pattern.

6. The method for manufacturing a high-precision signal transmission integrated plug-and-weld circuit board according to claim 5, characterized in that: The conductive circuits distributed on both sides of the double-sided circuit pattern are connected through conductive holes.

7. The method for manufacturing a high-precision signal transmission integrated plug-and-weld circuit board according to claim 1, wherein: The insulating dielectric layer of the double-sided copper clad laminate is made of the same material as the insulating dielectric layer of the single-sided copper clad laminate.

8. The method for manufacturing a high-precision signal transmission integrated plug-and-weld circuit board according to claim 1, wherein: The surface of the plug-in finger pattern is made with an electroplated gold layer.

9. The method for manufacturing a high-precision signal transmission integrated plug-and-weld circuit board according to claim 1, wherein: A solder resist layer is formed on the surface of the effective processing area where the conducting circuits are distributed.

10. The method for manufacturing a high-precision signal transmission integrated plug-and-weld circuit board according to claim 1, wherein: The pressing method adopts a heating rate of 4°C to 6°C and a maximum pressure of 10kg / cm 2 Up to 20kg / cm 2 , the maximum temperature is 120℃ to 150℃ for pressing.

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