A high performance wafer auto-sorting system

Abstract

The application relates to the technical field of wafer sorting, and discloses a high-efficiency wafer automatic sorting system which comprises a workbench and a supporting frame, the supporting frame is arranged on the top of the workbench and is fixedly connected with the top of the workbench, a detection mechanism is fixedly connected to the top of the supporting frame, the detection mechanism is used for detecting wafers, the system further comprises a conveying device which is arranged above the workbench and is used for conveying wafers which need to be detected and sorted, the conveying device is fixedly connected with the supporting frame, a turnover device which is arranged above the conveying device and is used for overturning the wafers conveyed on the conveying device, and the turnover device is fixedly connected with the supporting frame. The high-efficiency wafer automatic sorting system can conveniently convey wafers to different positions and store the wafers according to the detection structure of the detection mechanism, the classification effect is good, and manual operation is not needed, so that the system is convenient to use.

Description

Technical Field

[0001] This invention relates to the field of wafer sorting technology, specifically to a high-efficiency automated wafer sorting system. Background Technology

[0002] Quartz crystal is a type of silicon (SiO2) and is currently the most widely used crystal in the world. Electronic components made using the physical properties of quartz crystal have high frequency stability and are widely used in digital circuits, computers, communications, and other fields. Its function is to serve as a frequency source or frequency reference in electronic circuits. With the development of communication and electronic technologies, the demand for quartz crystal wafers has also increased significantly. Both natural and artificially manufactured quartz crystals are hexagonal pyramids, exhibiting anisotropic physical properties. The various wafers in crystal oscillators are cut into square, rectangular, and circular slices at different angles to each axis. Different cut wafers have different properties. The quartz crystal processing industry requires the selection, orientation, cutting, grinding, and polishing of large quantities of quartz crystal raw materials to prepare semi-finished quartz crystals. Then, the semi-finished products are strictly sorted according to their frequencies, electrodes are added for frequency adjustment, and finally, finished products of different specifications are packaged. The processes from raw materials through orientation, scribing, cutting, angle measurement, grinding, polishing, etching, and cleaning are all very rigorous. The sorting of semi-finished quartz wafers must also be very accurate. For example, waste crystals with poor activity and high noise levels must be sorted out separately. Therefore, quartz wafers need to be strictly sorted according to their electrical parameters before they can be put into further processing and production.

[0003] However, the sorting equipment currently in use is inconvenient for classifying and transporting wafers, requiring manual sorting, transfer and storage, which is inconvenient to use and has low processing efficiency. Summary of the Invention

[0004] To achieve the above objectives, the present invention provides the following technical solution: a high-efficiency automated wafer sorting system, comprising a worktable and a support frame, wherein the support frame is disposed on top of the worktable and fixedly connected to the top of the worktable, and a detection mechanism is fixedly connected to the top of the support frame, the detection mechanism being used to detect wafers, and further comprising:

[0005] A conveying device is installed above the workbench. The conveying device is used to transport wafers that need to be inspected and sorted. The conveying device is fixedly connected to the support frame.

[0006] A flipping device is disposed above the conveying device. The flipping device is used to flip the wafers conveyed on the conveying device. The flipping device is fixedly connected to the support frame.

[0007] The conveying device includes a main conveyor belt and a branch conveyor belt. A rotating frame is fixedly connected to one end of the main conveyor belt. A rotating disk is rotatably connected to the inner wall of the rotating frame through bearings. A small conveyor belt is fixedly connected to the top of the rotating disk. The rotating part of an electronic rotating table is fixedly connected to the bottom of the rotating disk.

[0008] Preferably, both the main conveyor belt and the branch conveyor belts are fixed on the support frame, and multiple sets of branch conveyor belts are provided, with one end of each branch conveyor belt extending to one side of the rotating disk.

[0009] Preferably, the fixed part of the electronic rotary table is fixedly connected to the rotating frame, and the top of the rotary disk located on both sides of the small conveyor belt is fixed with guide plates, which facilitates the transport of wafers to different positions and their classification and storage according to the detection structure of the detection mechanism. The classification effect is good, and no manual operation is required, making it convenient to use. The guide plates can prevent the small conveyor belt from throwing the wafers out during the rotation process, thus ensuring good reliability.

[0010] Preferably, the flipping device includes a fixed frame, with movable slides fixedly connected to both sides of the inner wall of the fixed frame. A fixed seat is slidably connected to the side of the movable slide via an electronic slider. A rotary motor is fixedly connected to the side of the fixed seat away from the movable slide. A telescopic push rod is fixedly connected to the drive shaft of the rotary motor. A clamp is fixedly connected to the end of the telescopic push rod away from the rotary motor. A fixed ring is sleeved on and rotatably connected to the telescopic push rod. A pull rod is fixedly connected to the side of the fixed ring. The end of the pull rod away from the fixed ring is fixedly connected to the fixed seat. The wafer is held by the clamp, and then the movable slide can drive the wafer to move upward. The rotary motor can then drive the wafer to flip, facilitating the inspection of the side and bottom surfaces of the wafer. The inspection effect is good, and it is also convenient to use.

[0011] Preferably, the side of the fixed frame is fixedly connected to the support frame, and the movable slide and the telescopic push rod are both electrically driven.

[0012] Preferably, the fixing ring is sleeved on the fixing part of the telescopic push rod, and the fixing ring is rotatably connected to the telescopic push rod through a rotating bearing.

[0013] Preferably, the chuck includes a chuck base, a rotating support fixedly connected to one side of the chuck base, rotating support rods rotatably connected to both sides of the rotating support, a pressing plate rotatably connected to the end of the rotating support rod away from the rotating support, an arc-shaped spring fixedly connected to one side of the rotating support rod, a positioning rod fixedly connected to the side of the chuck base near the rotating support, and a positioning hole provided on the side of the chuck base located on the side of the positioning rod. Regardless of whether the wafer side is curved or flat, the pressing plate can be tightly attached to the wafer side, resulting in good clamping stability. Through the cooperation of the positioning rod and the positioning hole, the two sets of chuck bases are connected together, so that the two sets of chuck bases can maintain relative stability and avoid the wafer from falling off due to shaking during rotation, resulting in good reliability.

[0014] Preferably, the side of the chuck seat away from the rotating support is fixedly connected to the telescopic push rod, and the end of the arc spring away from the rotating support rod is fixedly connected to the rotating support.

[0015] Preferably, the end of the positioning rod away from the chuck seat is tapered, and the positioning rods and positioning holes inside the two sets of chucks are staggered.

[0016] This invention provides a high-performance automated wafer sorting system. It offers the following advantages:

[0017] 1. This high-efficiency automatic wafer sorting system involves placing wafers onto a main conveyor belt, which then transports them to a detection mechanism. The mechanism inspects the wafers, and after inspection, the main conveyor belt continues to move the wafers onto a smaller conveyor belt. Based on the detection results, an electronic rotary table rotates a rotating disk, which in turn rotates the smaller conveyor belt. The smaller conveyor belt then rotates the wafers on it. When the output end of the smaller conveyor belt rotates to the corresponding branch conveyor belt, the wafers are transferred to that belt. This allows wafers to be transported to different locations via different branch conveyors, facilitating sorting and storage according to the detection mechanism's structure. The sorting effect is good, and manual operation is unnecessary, making it convenient to use. The guide plate prevents wafers from being thrown out during the rotation of the smaller conveyor belt, ensuring high reliability.

[0018] 2. This high-efficiency automatic wafer sorting system, when the main conveyor belt transports the wafers to the area below the inspection mechanism, the inspection mechanism inspects the wafers. After the upper surface of the wafer is inspected, the moving slide moves the fixed seat downwards, which in turn moves the rotating motor and the telescopic push rod downwards. The telescopic push rod moves the chuck downwards, positioning it to one side of the wafer. Then, the telescopic push rod extends, moving the chuck toward the wafer and clamping it. The moving slide then moves the wafer upwards, and the rotating motor flips the wafer, facilitating the inspection of the sides and lower surface of the wafer. The inspection effect is good, and it is easy to use.

[0019] 3. In this high-efficiency automatic wafer sorting system, when the chuck moves toward the wafer, the squeezing plate inside the chuck gradually approaches and squeezes the wafer. The reaction force of the wafer on the squeezing plate drives the rotating support rod to rotate around the rotating support. During the rotation of the rotating support rod, the arc spring is stretched. The tension generated by the deformation of the arc spring pulls the rotating support rod and drives the squeezing plate to press against the side of the wafer, thereby clamping the wafer. With the rotation of the squeezing plate at the end of the rotating support rod, it can adapt to different shapes of the wafer side. Whether the wafer side is curved or flat, the squeezing plate can be tightly attached to the wafer side, and the clamping stability is good.

[0020] 4. This high-efficiency automatic wafer sorting system is also equipped with positioning rods and positioning holes. As the chucks gradually approach the wafers, the two sets of chucks also move closer to each other. At this time, the chucks drive the positioning rods to gradually approach the positioning holes. When they are within a certain range, the positioning rods insert into the positioning holes. Through the cooperation between the positioning rods and the positioning holes, the two sets of chucks are connected together, so that the two sets of chucks can maintain relative stability and avoid the wafers from falling off due to shaking during rotation. This system has good reliability. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the high-performance wafer automatic sorting system of the present invention;

[0022] Figure 2 This is a schematic diagram of the top structure of the conveying device of the present invention;

[0023] Figure 3 This is a schematic diagram of the bottom structure of the conveying device of the present invention;

[0024] Figure 4 This is a schematic diagram of the flipping device of the present invention;

[0025] Figure 5 This is a schematic diagram of the fixing base connection structure of the present invention;

[0026] Figure 6 This is a schematic diagram of the chuck structure of the present invention;

[0027] Figure 7 This is a schematic diagram of the clamping structure of the present invention.

[0028] In the diagram: 1. Workbench; 2. Support frame; 3. Detection mechanism; 4. Conveying device; 41. Main conveyor belt; 42. Rotating frame; 43. Rotating disc; 44. Small conveyor belt; 45. Electronic rotary table; 46. Support conveyor belt; 47. Guide plate; 5. Tilting device; 51. Fixed frame; 52. Moving slide; 53. Fixed seat; 54. Rotating motor; 55. Telescopic push rod; 56. Chuck; 561. Chuck seat; 562. Rotating support; 563. Rotating support rod; 564. Extrusion plate; 565. Arc spring; 566. Positioning rod; 567. Positioning hole; 57. Fixing ring; 58. Pull rod. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Please see Figures 1-3 This invention provides a technical solution that solves the problem that currently used sorting devices are inconvenient for classification and transportation, requiring manual sorting, transfer, and storage, making them inconvenient to use: a high-efficiency automatic wafer sorting system, including a workbench 1 and a support frame 2, the support frame 2 being disposed on top of the workbench 1 and fixedly connected to the top of the workbench 1, the top of the support frame 2 being fixedly connected to a detection mechanism 3, the detection mechanism 3 being used to detect wafers, and further including:

[0031] Conveying device 4 is installed above workbench 1. Conveying device 4 is used to transport wafers that need to be inspected and sorted. Conveying device 4 is fixedly connected to support frame 2.

[0032] A flipping device 5 is disposed above the conveying device 4. The flipping device 5 is used to flip the wafers conveyed on the conveying device 4. The flipping device 5 is fixedly connected to the support frame 2.

[0033] The conveying device 4 includes a main conveyor belt 41 and a branch conveyor belt 46. One end of the main conveyor belt 41 is fixedly connected to a rotating frame 42. The inner wall of the rotating frame 42 is rotatably connected to a rotating disk 43 via bearings. A small conveyor belt 44 is fixedly connected to the top of the rotating disk 43. The rotating part of an electronic rotating table 45 is fixedly connected to the bottom of the rotating disk 43. Both the main conveyor belt 41 and the branch conveyor belt 46 are fixed on the support frame 2. Multiple sets of branch conveyor belts 46 are provided. One end of the branch conveyor belt 46 extends to one side of the rotating disk 43. The fixed part of the electronic rotating table 45 is fixedly connected to the rotating frame 42. Guide plates 47 are fixed to the top of the rotating disk 43 on both sides of the small conveyor belt 44.

[0034] In use, the wafer is placed on the main conveyor belt 41, which transports it to the area below the detection mechanism 3. The detection mechanism 3 then inspects the wafer. After inspection, the main conveyor belt 41 continues to move the wafer onto the small conveyor belt 44. Based on the inspection results from the detection mechanism 3, the electronic rotary table 45 drives the rotating disk 43 to rotate, which in turn drives the small conveyor belt 44 to rotate. The small conveyor belt 44 then rotates the wafer on it. When the output end of the small conveyor belt 44 rotates to the corresponding branch conveyor belt 46, the wafer can be transported to the corresponding branch conveyor belt 46. Thus, the wafer can be transported to different positions via different branch conveyor belts 46. This facilitates the transport of wafers to different positions and their classification and storage according to the inspection structure of the detection mechanism 3. The classification effect is good, and no manual operation is required, making it convenient to use. The guide plate 47 prevents the small conveyor belt 44 from throwing the wafer out during rotation, ensuring good reliability.

[0035] Please see Figures 1-7 This invention provides a technical solution that solves the problem that the currently used sorting mechanism is inconvenient to inspect both sides of the wafer and is not convenient to adapt to wafers of different shapes: The flipping device 5 includes a fixed frame 51, and movable slides 52 are fixedly connected to both sides of the inner wall of the fixed frame 51. A fixed seat 53 is slidably connected to the side of the movable slide 52 via an electronic slider. A rotating motor 54 is fixedly connected to the side of the fixed seat 53 away from the movable slide 52. A telescopic push rod 55 is fixedly connected to the drive shaft of the rotating motor 54. A clamp 56 is fixedly connected to the end of the telescopic push rod 55 away from the rotating motor 54. A fixed ring 57 is sleeved on the telescopic push rod 55 and rotatably connected to it. A pull rod 58 is fixedly connected to the side of the fixed ring 57. The end of the pull rod 58 away from the fixed ring 57 is fixedly connected to the fixed seat 53. The side of the fixed frame 51 is fixedly connected to the support frame 2. The movable slide 52 and the telescopic push rod 55 are both electrically driven. The fixed ring 57 is sleeved on the fixed part of the telescopic push rod 55 and is rotatably connected to the telescopic push rod 55 via a rotating bearing.

[0036] When the main conveyor belt 41 transports the wafer to the area below the inspection mechanism 3, the inspection mechanism 3 inspects the wafer. After the inspection of the upper surface of the wafer is completed, the fixed seat 53 is moved downward by the moving slide 52. The fixed seat 53 drives the rotary motor 54 and the telescopic push rod 55 to move downward. The telescopic push rod 55 drives the chuck 56 to move downward, moving the chuck 56 to one side of the wafer. Then, the telescopic push rod 55 extends, driving the chuck 56 to move towards the wafer. The chuck 56 holds the wafer, and then the moving slide 52 drives the wafer to move upward. The rotary motor 54 drives the wafer to flip, which facilitates the inspection of the side and lower surface of the wafer. The inspection effect is good and it is also convenient to use.

[0037] The chuck 56 includes a chuck seat 561. A rotating support 562 is fixedly connected to one side of the chuck seat 561. Rotating support rods 563 are rotatably connected to both sides of the rotating support 562. A pressing plate 564 is rotatably connected to the end of the rotating support rod 563 away from the rotating support 562. An arc spring 565 is fixedly connected to one side of the rotating support rod 563. A positioning rod 566 is fixedly connected to the side of the chuck seat 561 near the rotating support 562. A positioning hole 567 is opened on the side of the chuck seat 561 located on the side of the positioning rod 566. A telescopic push rod 55 is fixedly connected to the side of the chuck seat 561 away from the rotating support 562. The end of the arc spring 565 away from the rotating support rod 563 is fixedly connected to the rotating support 562. The end of the positioning rod 566 away from the chuck seat 561 is tapered. The positioning rods 566 and positioning holes 567 inside the two sets of chucks 56 are staggered.

[0038] As the chuck 56 moves toward the wafer, the pressing plate 564 inside the chuck 56 gradually approaches and presses against the wafer. The reaction force of the wafer on the pressing plate 564 drives the rotating support rod 563 to rotate around the rotating support 562. During the rotation of the rotating support rod 563, the arc spring 565 is stretched. The tension generated by the deformation of the arc spring 565 pulls the rotating support rod 563, causing the pressing plate 564 to press firmly against the side of the wafer, thus clamping the wafer. The rotation of the pressing plate 564 at the end of the rotating support rod 563 allows it to adapt to different shapes of the wafer side, whether it is curved or flat. It can fit snugly against the side of the wafer, providing good clamping stability. It is also equipped with a positioning rod 566 and a positioning hole 567. As the chuck 561 gradually approaches the wafer, the two sets of chucks 561 also move closer to each other. At this time, the chuck 561 drives the positioning rod 566 to gradually approach the positioning hole 567. When it gets close enough, the positioning rod 566 inserts into the positioning hole 567. Through the cooperation of the positioning rod 566 and the positioning hole 567, the two sets of chucks 561 are connected together, so that the two sets of chucks 561 can maintain relative stability and avoid the wafer from falling off due to shaking during rotation. It has good reliability.

[0039] Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in the present invention, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. A high-efficiency automatic wafer sorting system, comprising a worktable (1) and a support frame (2), wherein the support frame (2) is disposed on top of the worktable (1) and fixedly connected to the top of the worktable (1), and a detection mechanism (3) is fixedly connected to the top of the support frame (2), the detection mechanism (3) being used to detect wafers, characterized in that, Also includes: A conveying device (4) is set above the workbench (1). The conveying device (4) is used to convey wafers that need to be inspected and sorted. The conveying device (4) is fixedly connected to the support frame (2). A flipping device (5) is disposed above the conveying device (4). The flipping device (5) is used to flip the wafers conveyed on the conveying device (4). The flipping device (5) is fixedly connected to the support frame (2). The conveying device (4) includes a main conveyor belt (41) and a branch conveyor belt (46). One end of the main conveyor belt (41) is fixedly connected to a rotating frame (42). The inner wall of the rotating frame (42) is rotatably connected to a rotating disk (43) through a bearing. A small conveyor belt (44) is fixedly connected to the top of the rotating disk (43). The bottom of the rotating disk (43) is fixedly connected to the rotating part of an electronic rotating table (45). The main conveyor belt (41) and the branch conveyor belt (46) are both fixed on the support frame (2). There are multiple sets of branch conveyor belts (46), and one end of the branch conveyor belt (46) extends to one side of the rotating disk (43). The fixed part of the electronic rotary table (45) is fixedly connected to the rotating frame (42), and the top of the rotating disk (43) located on both sides of the small conveyor belt (44) is fixed with guide plates (47). The flipping device (5) includes a fixed frame (51), and movable slides (52) are fixedly connected to both sides of the inner wall of the fixed frame (51). A fixed seat (53) is slidably connected to the side of the movable slide (52) via an electronic slider. A rotating motor (54) is fixedly connected to the side of the fixed seat (53) away from the movable slide (52). A telescopic push rod (55) is fixedly connected to the drive shaft of the rotating motor (54). A clamp (56) is fixedly connected to the end of the telescopic push rod (55) away from the rotating motor (54). A fixed ring (57) is sleeved on the telescopic push rod (55) and rotatably connected. A pull rod (58) is fixedly connected to the side of the fixed ring (57). The end of the pull rod (58) away from the fixed ring (57) is fixedly connected to the fixed seat (53). The fixed frame (51) is fixedly connected to the support frame (2) on the side, and the movable slide (52) and the telescopic push rod (55) are both electrically driven; The fixing ring (57) is sleeved on the fixing part of the telescopic push rod (55), and the fixing ring (57) is rotatably connected to the telescopic push rod (55) through a rotating bearing; The chuck (56) includes a chuck seat (561), a rotating support (562) is fixedly connected to one side of the chuck seat (561), rotating support rods (563) are rotatably connected to both sides of the rotating support (562), a pressing plate (564) is rotatably connected to one end of the rotating support rod (563) away from the rotating support (562), an arc spring (565) is fixedly connected to one side of the rotating support rod (563), a positioning rod (566) is fixedly connected to the side of the chuck seat (561) near the rotating support (562), and a positioning hole (567) is opened on the side of the chuck seat (561) located on the side of the positioning rod (566). The side of the chuck seat (561) away from the rotating support (562) is fixedly connected to the telescopic push rod (55), and the end of the arc spring (565) away from the rotating support rod (563) is fixedly connected to the rotating support (562). The end of the positioning rod (566) away from the chuck seat (561) is set to be tapered, and the positioning rods (566) and positioning holes (567) inside the two sets of chucks (56) are staggered.

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