A dynamic aging test method and system for all-in-one computers
By obtaining the operating environment temperature and the heating temperature of the body in the aging test of the computers, analyze the heating rate and thermal exchange rate, evaluate the temperature adjustment and data processing capacity, solve the problem that the existing test method cannot combine the actual use environment, improve The correlation and reliability of aging testing.
Patent Information
- Application Number
- CN202410916976.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-09
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2044-07-09
AI Technical Summary
The existing all-in-one computer aging testing methods cannot be effectively combined with the actual use environment, and cannot evaluate potential aging defects. There is room for optimization of the aging testing methods.
By obtaining the heating temperature and operating environmental temperature of the body during the operation of the computers, the body's heating rate and environmental thermal exchange analysis are performed, the evaluation temperature adjustment ability, and calculating the operating response delay to evaluate the data processing capacity, then associated and associated and associated Compared with aging test data.
It has improved the correlation between the aging test results of the computers and the actual use environment, enhanced the reliability of aging test results, and can more accurately evaluate the aging impact and data processing capabilities.
Smart Images

Figure CN118860756B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of aging testing, and in particular to a dynamic aging testing method and system for an all-in-one computer. Background Art
[0002] At present, with the rapid development of computers, all-in-one computers that integrate components are gradually replacing traditional desktop computers. As the integration of all-in-one computers becomes higher, the connection structure and manufacturing process between components become more and more complicated. The performance of all-in-one computers is not only related to the qualified status of components before leaving the factory, but also to the connection relationship between components. Therefore, it is necessary to test the aging performance of all-in-one computers to improve the performance of all-in-one computers.
[0003] The existing aging test method for all-in-one computers is usually to set up a special aging furnace, put the computer under test into the aging furnace, set the corresponding test temperature so that the computer under test runs at the test temperature, and observe the running status and running performance changes of the all-in-one computer within the set test time, so as to obtain the aging test results of the all-in-one computer under test. However, the aging test results before leaving the factory can often only be used to evaluate the factory acceptance of various components of the all-in-one computer and whether the connection relationship between the components can run normally under the current test environment. The existing testing method cannot evaluate potential aging defects in combination with the actual working environment after being put into actual use. There is room for further optimization of the aging test method of the all-in-one computer during actual use. Summary of the invention
[0004] In order to improve the correlation between the aging test results of the all-in-one computer and the actual usage environment, and to improve the reliability of the aging test results, the present application provides a dynamic aging test method and system for the all-in-one computer.
[0005] In the first aspect, the above-mentioned invention objective of the present application is achieved through the following technical solutions:
[0006] A dynamic aging test method for an all-in-one computer, comprising:
[0007] Acquire the heating temperature of the all-in-one computer and the operating environment temperature during operation, and analyze the self-heating rate of the all-in-one computer and the environmental heat exchange according to the heating temperature of the all-in-one computer and the operating environment temperature;
[0008] Based on the self-heating rate of the machine body and the ambient heat exchange rate, the temperature regulation capability of the all-in-one computer is comprehensively evaluated, and the temperature regulation evaluation results of the all-in-one computer in different ambient temperatures are obtained;
[0009] Obtaining the operation reaction rate of the all-in-one computer for data processing at different operation times, and calculating the operation reaction delay at different operation times, and evaluating the data processing capability of the all-in-one computer according to the operation reaction delay;
[0010] According to the temperature regulation evaluation results and the data processing capability evaluation results, the body self-heating rate and the ambient heat exchange rate under the same operating time are respectively associated with the corresponding operating reaction delay, and compared with the factory test data of the all-in-one computer to obtain aging test data.
[0011] By adopting the above technical scheme, in the actual use process of the all-in-one computer, the body self-heating rate and the environmental heat exchange rate of the all-in-one computer are analyzed respectively in combination with the body operating heating temperature and the operating environment temperature of the all-in-one computer, which helps to more accurately evaluate the aging effect of the all-in-one computer under different temperature conditions, and further combine the body self-heating rate and the environmental heat exchange rate to comprehensively evaluate the temperature regulation ability of the all-in-one computer, further evaluate the temperature regulation ability of the all-in-one computer, and calculate the operation response delay of the all-in-one computer through the data processing reaction rate at different operating times, and then evaluate the data processing ability of the all-in-one computer, which helps to more accurately analyze the impact of body temperature changes on the body data processing rate, take the operating time as the correlation point, and respectively associate the body self-heating rate and the environmental heat exchange rate with the operation response delay, so as to improve the correlation between the aging test results of the all-in-one computer and the actual use environment, and take the exit test data of the all-in-one computer as a reference indicator, and perform aging comparison analysis on the associated data under the current operating state, so as to obtain aging test data and improve the reliability of the aging test results.
[0012] In a preferred example, the present application can be further configured as follows: according to the temperature adjustment evaluation result and the data processing capacity evaluation result, the self-heating rate of the machine body and the environmental heat exchange rate under the same operating time are respectively associated with the corresponding operating reaction delay, and the data is compared with the factory test data of the all-in-one computer to obtain the aging test data, which specifically includes:
[0013] Obtaining the factory qualified status of the components of the all-in-one computer and the current component operation status, and analyzing the component aging degree according to the component status change between the factory qualified status of the components and the current component operation status;
[0014] Under the same operation time, the machine body self-heating rate and the environmental heat exchange rate related to each operation time are respectively associated with the corresponding operation reaction delay to obtain the machine body operation associated data;
[0015] According to the machine operation related data, analyzing the effect of the change of the operating temperature condition on the time delay of the machine operation response, and obtaining the temperature delay correlation relationship of the all-in-one computer;
[0016] The factory aging test data of the all-in-one computer is obtained, the temperature-time delay correlation relationship is combined with the component aging degree, and compared with the factory aging test data to obtain the aging test data under the current operating state.
[0017] In a preferred example, the present application can be further configured as follows: the factory aging test data of the all-in-one computer is obtained, the temperature delay correlation relationship and the component aging degree are combined, and compared with the factory aging test data to obtain the aging test data under the current operating state, specifically including:
[0018] The aging test data under the current operating state is expressed by formula (1), which is as follows:
[0019]
[0020] Among them, L 测 Indicates the aging test data under the current operating state. ΔW indicates the temperature difference between the machine body and the external environment during heat exchange. It is obtained by averaging the self-heating rate of the machine body and the heat exchange rate of the environment. ΔV 延 It represents the difference in data processing reaction rate between adjacent running times and is used to characterize the running reaction delay of the body. n0 , Y n represent the difference between the initial operating state and the current operating state of the nth element, including the data processing rate change and the temperature regulation change, γ n0 Indicates the factory qualified coefficient of the nth component, L 测0 Indicates the initial aging test value of the all-in-one computer.
[0021] By adopting the above technical scheme, combined with the factory qualified status of the components of the all-in-one computer and the current component operating status, the impact of the actual operating environment on the component status change is analyzed, which is helpful to evaluate the current component aging degree, and through the associated comprehensive operating temperature of the body and the operating response delay under the same operating time, data association is performed, which helps to jointly analyze the impact of the body operation aging degree on the current operating state, thereby obtaining the temperature-delay association relationship of the all-in-one computer, which helps to improve the correlation between the body operation data, and with the factory aging test data as a reference, the combined temperature-delay association relationship and the component aging degree are compared and analyzed, thereby obtaining aging test data that is suitable for the current operating conditions and the current aging degree of the body, which helps to analyze the reliability of the aging test results of the all-in-one computer from multiple dimensions.
[0022] In a preferred example, the present application can be further configured as follows: the body heating temperature and the operating environment temperature of the all-in-one computer during operation are obtained, and the body self-heating rate and environmental heat exchange analysis of the all-in-one computer are performed according to the body heating temperature and the operating environment temperature, specifically including:
[0023] Obtaining the body heating temperature and operating environment temperature corresponding to the running all-in-one computer in adjacent unit time, calculating the body heating temperature difference in adjacent unit time, and obtaining the body self-heating rate of the all-in-one computer;
[0024] The heat exchange temperature difference of the operating environment temperature under adjacent unit time is calculated to obtain the heat exchange rate of the all-in-one computer.
[0025] In a preferred example, the present application may be further configured as follows: the step of obtaining the operation reaction rate of the all-in-one computer for data processing at different operation times, calculating the operation reaction delay at different operation times, and evaluating the data processing capability of the all-in-one computer according to the operation reaction delay, further comprising:
[0026] Obtaining operation load data of the all-in-one computer under different operation response delays, and performing collaborative analysis on the operation response delay of the all-in-one computer according to the operation load data and the operation environment temperature data;
[0027] According to the collaborative analysis results, the operation response delays at different operation times are calculated, and the data processing capabilities of the all-in-one computer under different load conditions or different ambient temperature conditions are evaluated based on the operation response delays.
[0028] By adopting the above technical solution, the operating response delay of the all-in-one computer is analyzed based on multiple aging influencing factors such as operating load and operating environment temperature. Through multiple groups of aging test conditions such as operating load, operating environment temperature, and operating environment temperature combined with operating load, the operating response delay under different test conditions is analyzed, and then the data processing capacity under different aging test conditions is evaluated, further improving the correlation between the aging test evaluation results and the aging test conditions.
[0029] In the second aspect, the above invention objective of the present application is achieved through the following technical solutions:
[0030] A dynamic aging test system for an all-in-one computer, comprising:
[0031] A data analysis module, used to obtain the heating temperature of the all-in-one computer and the operating environment temperature during operation, and to analyze the self-heating rate of the all-in-one computer and the environmental heat exchange according to the heating temperature of the computer and the operating environment temperature;
[0032] A data adjustment module is used to comprehensively evaluate the temperature adjustment capability of the all-in-one computer according to the self-heating rate of the body and the ambient heat exchange rate, and obtain the temperature adjustment evaluation results of the all-in-one computer in different ambient temperatures;
[0033] A data evaluation module, used to obtain the operation reaction rate of the all-in-one computer for data processing at different operation times, and calculate the operation reaction delay at different operation times, and evaluate the data processing capability of the all-in-one computer according to the operation reaction delay;
[0034] The data comparison module is used to associate the body self-heating rate and the environmental heat exchange rate under the same operating time with the corresponding operating response delay according to the temperature regulation evaluation results and the data processing capacity evaluation results, and compare the data with the factory test data of the all-in-one computer to obtain aging test data.
[0035] By adopting the above technical scheme, in the actual use process of the all-in-one computer, the body self-heating rate and the environmental heat exchange rate of the all-in-one computer are analyzed respectively in combination with the body operating heating temperature and the operating environment temperature of the all-in-one computer, which helps to more accurately evaluate the aging effect of the all-in-one computer under different temperature conditions, and further combine the body self-heating rate and the environmental heat exchange rate to comprehensively evaluate the temperature regulation ability of the all-in-one computer, further evaluate the temperature regulation ability of the all-in-one computer, and calculate the operation response delay of the all-in-one computer through the data processing reaction rate at different operating times, and then evaluate the data processing ability of the all-in-one computer, which helps to more accurately analyze the impact of body temperature changes on the body data processing rate, take the operating time as the correlation point, and respectively associate the body self-heating rate and the environmental heat exchange rate with the operation response delay, so as to improve the correlation between the aging test results of the all-in-one computer and the actual use environment, and take the exit test data of the all-in-one computer as a reference indicator, and perform aging comparison analysis on the associated data under the current operating state, so as to obtain aging test data and improve the reliability of the aging test results.
[0036] On the third aspect, the above-mentioned purpose of the present application is achieved through the following technical solutions:
[0037] A computer device comprises a memory, a processor and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the steps of the above-mentioned dynamic aging test method for an all-in-one computer are implemented.
[0038] Fourthly, the above-mentioned purpose of the present application is achieved through the following technical solutions:
[0039] A computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the above-mentioned dynamic aging test method for an all-in-one computer are implemented.
[0040] In summary, the present application includes at least one of the following beneficial technical effects:
[0041] 1. In the actual use process of the all-in-one computer, the self-heating rate and the ambient heat exchange rate of the all-in-one computer are analyzed respectively in combination with the operating heating temperature of the all-in-one computer and the operating environment temperature, which is helpful to more accurately evaluate the aging effect of the all-in-one computer under different temperature conditions, and further combine the self-heating rate of the body and the ambient heat exchange rate to comprehensively evaluate the temperature regulation ability of the all-in-one computer, further evaluate the temperature regulation ability of the all-in-one computer, and calculate the operation reaction delay of the all-in-one computer through the data processing reaction rate at different operating times, and then evaluate the data processing ability of the all-in-one computer, which is helpful to more accurately analyze the impact of body temperature changes on the body data processing rate, take the operating time as the correlation point, and respectively associate the body self-heating rate and the ambient heat exchange rate with the operation reaction delay, so as to improve the correlation between the aging test results of the all-in-one computer and the actual use environment, and take the exit test data of the all-in-one computer as a reference indicator, and perform aging comparison analysis on the associated data under the current operating state, so as to obtain aging test data and improve the reliability of the aging test results;
[0042] 2. Combine the factory qualified status of the components of the all-in-one computer and the current operating status of the components to analyze the impact of the actual operating environment on the component status change, which is helpful to evaluate the current component aging degree, and through the data association of the associated body comprehensive operating temperature and the operating response delay under the same operating time, it is helpful to conduct a joint analysis of the impact of the body operation aging degree on the current operating state, so as to obtain the temperature delay correlation relationship of the all-in-one computer, which is helpful to improve the correlation between the body operation data, and with the factory aging test data as a reference, the combined temperature delay correlation relationship and the component aging degree are compared and analyzed, so as to obtain the aging test data that is suitable for the current operating conditions and the current aging degree of the body, which is helpful to analyze the reliability of the aging test results of the all-in-one computer from multiple dimensions;
[0043] 3. Analyze the operating response delay of the all-in-one computer based on multiple aging influencing factors such as operating load and operating environment temperature. Analyze the operating response delay under different test conditions through multiple groups of aging test conditions such as operating load, operating environment temperature, and operating environment temperature combined with operating load. Then, evaluate the data processing capacity under different aging test conditions, and further improve the correlation between the aging test evaluation results and the aging test conditions. BRIEF DESCRIPTION OF THE DRAWINGS
[0044] Figure 1 This is a flow chart of an implementation of a dynamic aging test method for an all-in-one computer according to this embodiment.
[0045] Figure 2 This is a flowchart for implementing step S10 of a dynamic aging test method for an all-in-one computer in this embodiment.
[0046] Figure 3 This is a flowchart for implementing step S30 of a dynamic aging test method for an all-in-one computer in this embodiment.
[0047] Figure 4 This is a flowchart for implementing step S40 of a dynamic aging test method for an all-in-one computer in this embodiment.
[0048] Figure 5 This is a structural block diagram of a dynamic aging test system for an all-in-one computer according to this embodiment.
[0049] Figure 6 The present invention is a schematic diagram of the internal structure of a computer device for implementing a dynamic aging test method for an all-in-one computer. DETAILED DESCRIPTION
[0050] The present application is further described in detail below in conjunction with the accompanying drawings.
[0051] In one embodiment, the aging test tool for the all-in-one computer in this embodiment is mainly used to test the hardware connection and software stability of the all-in-one computer. By simulating the long-term and high-load working conditions of the all-in-one computer, a series of testing tasks of the all-in-one computer are automatically executed, thereby checking the performance and reliability of the computer under various temperature conditions and load conditions, such as Figure 1 As shown, the present application discloses a dynamic aging test method for an all-in-one computer, which specifically includes the following steps:
[0052] S10: Obtaining the heating temperature of the all-in-one computer and the operating environment temperature during operation, and performing a self-heating rate analysis and an environmental heat exchange analysis on the all-in-one computer according to the heating temperature of the all-in-one computer and the operating environment temperature.
[0053] Specifically, Figure 2 As shown, step S10 includes:
[0054] S101: Obtain the body heating temperature and operating environment temperature of the running all-in-one computer corresponding to adjacent unit times, calculate the body heating temperature difference under adjacent unit times, and obtain the body self-heating rate of the all-in-one computer.
[0055] Specifically, the body heating temperature during operation is collected by a temperature sensor preset inside the chassis, and the operating environment temperature is collected by a temperature sensor preset outside the chassis. In adjacent unit times, the corresponding body heating temperature difference is calculated to obtain the body self-heating rate of the all-in-one computer. At this time, only the temperature change inside the chassis is calculated.
[0056] S102: Calculate the heat exchange temperature difference of the operating environment temperature under adjacent unit time to obtain the heat exchange rate of the all-in-one computer.
[0057] Specifically, the operating environment temperature under adjacent unit time is obtained, and the heat exchange rate of the all-in-one computer is calculated by formula (2). Formula (2) is as follows:
[0058]
[0059] Among them, V 换 Table is similar to the heat exchange rate of the all-in-one computer, T 内(n+1) , T 内n Respectively represent the internal temperature of the body in the n+1th time period and the nth time period, T 外n It represents the operating environment temperature value in the nth time period, and Δt represents the time interval between adjacent unit times.
[0060] S20: Comprehensively evaluate the temperature regulation capability of the all-in-one computer according to the self-heating rate of the computer body and the ambient heat exchange rate, and obtain the temperature regulation evaluation results of the all-in-one computer in different ambient temperatures.
[0061] Specifically, within the preset maximum operating temperature range of the all-in-one computer, when the self-heating rate of the body is greater than the ambient heat exchange rate, the all-in-one computer is quickly heat-exchanged through auxiliary heat dissipation equipment such as peripheral heat dissipation fans. When the body operating temperature exceeds the preset maximum operating temperature of the all-in-one computer, the operating power of the auxiliary heat dissipation equipment is adjusted to the maximum until the body operating temperature drops to the preset maximum operating temperature. The temperature adjustment time of the current all-in-one computer is counted. When the temperature adjustment time is within the preset temperature adjustment time, it indicates that the temperature adjustment ability of the current all-in-one computer is within the normal range; when the temperature adjustment time exceeds the preset temperature adjustment time, it indicates that the temperature adjustment ability of the current all-in-one computer has aging abnormalities, thereby obtaining the temperature adjustment evaluation result of the all-in-one computer, wherein the preset temperature adjustment time is determined by the factory setting of the all-in-one computer.
[0062] S30: Obtaining the operation reaction rate of the all-in-one computer for data processing at different operation times, calculating the operation reaction delay at different operation times, and evaluating the data processing capability of the all-in-one computer according to the operation reaction delay.
[0063] Specifically, Figure 3As shown, step S30 includes:
[0064] S301: Obtaining operation load data of the all-in-one computer under different operation response delays, and performing collaborative analysis on the operation response delay of the all-in-one computer according to the operation load data and the operation environment temperature data.
[0065] Specifically, the operating load data of the all-in-one computer under different operating response delays is obtained. For example, in the current operating state, the processing time of the all-in-one computer for the same data instruction changes, then the operating load data before and after the response delay change is obtained, such as the load of the software or process in the running state in the all-in-one computer, so as to combine the operating load data and the operating environment temperature data to perform a collaborative analysis of the operating response delay of the all-in-one computer, such as obtaining the corresponding computer operating response delay based on three sets of test conditions: operating load change, operating environment temperature change, and simultaneous change of operating load and operating environment temperature, so as to analyze the collaborative reaction delay of the simultaneous change of operating load and operating environment temperature with a single test condition as a reference.
[0066] S302: Calculate the operation response delay under different operation times according to the collaborative analysis result, and evaluate the data processing capability of the all-in-one computer under different load conditions or different ambient temperature conditions according to the operation response delay.
[0067] Specifically, the operation response delays under different operation times are calculated according to the collaborative analysis results. When the difference between the operation response delays exceeds the preset response threshold, it means that the current all-in-one computer may have reduced performance under the current test conditions, which may easily cause body aging. When the difference between the operation response times is within the preset response threshold, it means that the current all-in-one computer has better data processing capabilities under the current test conditions. The current test conditions include multiple test conditions such as single load change, single environment change, and coordinated change of load and environment, so as to obtain the data processing capability evaluation results of the all-in-one computer under different load conditions or different ambient temperature conditions.
[0068] S40: According to the temperature regulation evaluation results and the data processing capability evaluation results, the body self-heating rate and the environmental heat exchange rate under the same operating time are respectively associated with the corresponding operating response delay, and compared with the factory test data of the all-in-one computer to obtain aging test data.
[0069] Specifically, Figure 4 As shown, step S40 includes:
[0070] S401: Obtain the factory qualified status of the components of the all-in-one computer and the current component operation status, and analyze the component aging degree according to the component status change between the factory qualified status and the current component operation status.
[0071] Specifically, the factory qualified status of the components of the all-in-one computer and the current component operating status are obtained, such as whether the pin arrangement meets the specifications, whether there is any damage, and other appearance qualifications, as well as the working frequency, response time, output power and other functional parameters of the factory operation test. The qualified status parameters of the components before they are put into use are obtained, and after a period of use, the current component operating status is obtained, such as the current response time, current operating frequency, appearance damage, etc. The comparison values between the corresponding parameters are used as component status changes. When one of the parameters exceeds the preset factory minimum, it means that the current component has an aging trend.
[0072] The automatic testing tool in this embodiment can automatically perform testing tasks such as CPU load testing, memory stress testing, disk read and write testing, etc., so as to obtain the operating data of components such as CPU, memory and disk, and then judge the current operating status of components. It also combines multiple operating data such as temperature, operating voltage, cooling fan speed, etc. to judge the overheating status of the computer, and then judge the aging trend of components from multiple dimensions.
[0073] S402: Under the same operation time, the machine body self-heating rate and the environment heat exchange rate related to each operation time are respectively associated with the corresponding operation reaction delay to obtain machine body operation associated data.
[0074] Specifically, taking the operation time as the association point, at the same operation time, the relevant body self-heating rate and environmental heat exchange rate in each operation time are respectively associated with the corresponding operation reaction delay, so as to obtain the body operation association data of the operation time, body self-heating rate, environmental heat exchange rate and operation reaction delay.
[0075] S403: Analyze the time delay effect of the change in operating temperature conditions on the operating response of the machine body according to the machine body operation correlation data, and obtain the temperature delay correlation relationship of the all-in-one computer.
[0076] Specifically, based on the machine operation related data, the impact of changes in operating temperature conditions on the delay of the machine operation response is analyzed. For example, when the operating temperature changes, while other conditions remain unchanged, such as load, the corresponding data processing delay is obtained, and the data is sequentially associated in order of operating temperature to obtain the temperature-delay association relationship of the all-in-one computer.
[0077] S404: Obtain factory aging test data of the all-in-one computer, combine the temperature-time delay correlation with the component aging degree, and compare with the factory aging test data to obtain aging test data under the current operating state.
[0078] Specifically, the aging test data under the current operating state is expressed by formula (1), and formula (1) is as follows:
[0079]
[0080] Among them, L 测 Indicates the aging test data under the current operating state. ΔW indicates the temperature difference between the machine body and the external environment during heat exchange. It is obtained by averaging the self-heating rate of the machine body and the heat exchange rate of the environment. ΔV 延 It represents the difference in data processing reaction rate between adjacent running times and is used to characterize the running reaction delay of the body. n0 , Y n represent the difference between the initial operating state and the current operating state of the nth element, including the data processing rate change and the temperature regulation change, γ n0 Indicates the factory qualified coefficient of the nth component, L 测0 Indicates the initial aging test value of the all-in-one computer.
[0081] The all-in-one computer aging test tool in this embodiment can also be used to test the software compatibility of the all-in-one computer to ensure that the software and applications can run normally under different test conditions. The tool will also automatically record all information during the test and generate a detailed test report to facilitate users to analyze the test results. If an abnormality or failure is detected during the test, a warning can be issued in time to remind personnel to pay attention and deal with it. Through a variety of test conditions, the all-in-one computer is tested in multiple dimensions to analyze the potential problems of the all-in-one computer, improve the quality reliability and operation stability of the all-in-one computer, and reduce user losses.
[0082] The aging test method in this embodiment simplifies the test process, reduces the difficulty and complexity of test operations, and only needs to set test parameters and test conditions to automatically execute test tasks and generate test result reports, reducing the tediousness and repetitiveness of tests. It can be applied to a variety of test scenarios and improve the applicability of test tools.
[0083] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.
[0084] In one embodiment, a dynamic aging test system for an all-in-one computer is provided, and the dynamic aging test system for an all-in-one computer corresponds one-to-one to the dynamic aging test method for an all-in-one computer in the above embodiment. Figure 5 As shown, the dynamic aging test system for all-in-one computers includes a data analysis module, a data adjustment module, a data evaluation module and a data comparison module. The detailed description of each functional module is as follows:
[0085] The data analysis module is used to obtain the heating temperature of the body and the operating environment temperature of the all-in-one computer during operation, and analyze the self-heating rate of the body and the environmental heat exchange of the all-in-one computer according to the heating temperature of the body and the operating environment temperature;
[0086] A data adjustment module is used to comprehensively evaluate the temperature adjustment capability of the all-in-one computer according to the self-heating rate of the body and the ambient heat exchange rate, and obtain the temperature adjustment evaluation results of the all-in-one computer in different ambient temperatures;
[0087] A data evaluation module is used to obtain the operation reaction rate of the all-in-one computer for data processing at different operation times, calculate the operation reaction delay at different operation times, and evaluate the data processing capability of the all-in-one computer according to the operation reaction delay;
[0088] The data comparison module is used to associate the body self-heating rate and the environmental heat exchange rate under the same operating time with the corresponding operating response delay according to the temperature regulation evaluation results and the data processing capacity evaluation results, and compare the data with the factory test data of the all-in-one computer to obtain aging test data.
[0089] Preferably, the data comparison module includes:
[0090] The component analysis submodule is used to obtain the factory qualified status and current component operation status of the all-in-one computer components, and analyze the component aging degree according to the component status change between the factory qualified status and the current component operation status;
[0091] The data association submodule is used to associate the body self-heating rate and the environmental heat exchange rate related to each running time with the corresponding running reaction delay at the same running time to obtain the body running associated data;
[0092] The correlation analysis submodule is used to analyze the time delay effect of the change of operating temperature conditions on the operating reaction of the machine body according to the machine body operation correlation data, and obtain the temperature delay correlation relationship of the all-in-one computer;
[0093] The data comparison submodule is used to obtain the factory aging test data of the all-in-one computer, combine the temperature delay correlation with the component aging degree, and compare it with the factory aging test data to obtain the aging test data under the current operating state.
[0094] Preferably, the data comparison submodule specifically includes:
[0095] The aging test data under the current operating state is expressed by formula (1), which is as follows:
[0096]
[0097] Among them, L 测 Indicates the aging test data under the current operating state. ΔW indicates the temperature difference between the machine body and the external environment during heat exchange. It is obtained by averaging the self-heating rate of the machine body and the heat exchange rate of the environment. ΔV 延 It represents the difference in data processing reaction rate between adjacent running times and is used to characterize the running reaction delay of the body. n0 , Y n represent the difference between the initial operating state and the current operating state of the nth element, including the data processing rate change and the temperature regulation change, γ n0 Indicates the factory qualified coefficient of the nth component, L 测0 Indicates the initial aging test value of the all-in-one computer.
[0098] Preferably, the data analysis module specifically includes:
[0099] The self-heating analysis submodule is used to obtain the body heating temperature and operating environment temperature of the running all-in-one computer corresponding to adjacent unit time, calculate the body heating temperature difference under adjacent unit time, and obtain the body self-heating rate of the all-in-one computer;
[0100] The heat exchange analysis submodule is used to calculate the heat exchange temperature difference of the operating environment temperature under adjacent unit time to obtain the heat exchange rate of the all-in-one computer.
[0101] Preferably, the data evaluation module further includes:
[0102] A collaborative analysis submodule is used to obtain the operation load data of the all-in-one computer under different operation response delays, and to perform collaborative analysis on the operation response delay of the all-in-one computer according to the operation load data and the operation environment temperature data;
[0103] The capability evaluation submodule is used to calculate the operation response delay under different operation times according to the collaborative analysis results, and to evaluate the data processing capability of the all-in-one computer under different load conditions or different ambient temperature conditions according to the operation response delay.
[0104] For the specific definition of the dynamic aging test system for all-in-one computers, please refer to the definition of the dynamic aging test method for all-in-one computers mentioned above, which will not be repeated here. Each module in the above-mentioned dynamic aging test system for all-in-one computers can be implemented in whole or in part by software, hardware and a combination thereof. The above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above modules.
[0105] In one embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as follows: Figure 6 As shown. The computer device includes a processor, a memory, a network interface and a database connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store dynamic aging test data of the all-in-one computer. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a dynamic aging test method for an all-in-one computer is implemented.
[0106] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps of a dynamic aging test method for an all-in-one computer are implemented.
[0107] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).
[0108] Those skilled in the art will clearly understand that for the sake of convenience and brevity of description, only the division of the above-mentioned functional units and modules is used as an example. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the system can be divided into different functional units or modules to complete all or part of the functions described above.
[0109] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.
Claims
1. A dynamic aging test method for an all-in-one computer, characterized in that: include: Acquire the heating temperature of the all-in-one computer and the operating environment temperature during operation, and analyze the self-heating rate of the all-in-one computer and the environmental heat exchange according to the heating temperature of the all-in-one computer and the operating environment temperature; Based on the self-heating rate of the machine body and the ambient heat exchange rate, the temperature regulation capability of the all-in-one computer is comprehensively evaluated, and the temperature regulation evaluation results of the all-in-one computer in different ambient temperatures are obtained; Obtaining the operation reaction rate of the all-in-one computer for data processing at different operation times, and calculating the operation reaction delay at different operation times, and evaluating the data processing capability of the all-in-one computer according to the operation reaction delay; According to the temperature regulation evaluation results and the data processing capacity evaluation results, the self-heating rate of the machine body and the environmental heat exchange rate under the same operating time are respectively associated with the corresponding operating reaction delay, and compared with the factory test data of the all-in-one computer to obtain aging test data; According to the temperature regulation evaluation result and the data processing capability evaluation result, the self-heating rate of the machine body and the environmental heat exchange rate under the same operation time are respectively associated with the corresponding operation reaction delay, and compared with the factory test data of the all-in-one computer to obtain the aging test data, which specifically includes: Obtaining the factory qualified status of the components of the all-in-one computer and the current component operation status, and analyzing the component aging degree according to the component status change between the factory qualified status of the components and the current component operation status; Under the same operation time, the machine body self-heating rate and the environmental heat exchange rate related to each operation time are respectively associated with the corresponding operation reaction delay to obtain the machine body operation associated data; According to the machine operation related data, analyzing the effect of the change of the operating temperature condition on the time delay of the machine operation reaction, and obtaining the temperature delay correlation relationship of the all-in-one computer; Obtaining factory aging test data of the all-in-one computer, combining the temperature-time delay correlation with the component aging degree, and comparing the data with the factory aging test data to obtain aging test data under the current operating state; The step of obtaining the factory aging test data of the all-in-one computer, combining the temperature-time delay correlation with the component aging degree, and comparing the data with the factory aging test data to obtain the aging test data under the current operating state specifically includes: The aging test data under the current operating state is expressed by formula (1), which is as follows: (1); in, Indicates the aging test data under the current operating state. It indicates the temperature difference of heat exchange between the machine and the external environment when the machine is running, which is obtained by averaging the self-heating rate of the machine and the heat exchange rate of the environment. It indicates the difference in data processing reaction rate between adjacent running times and is used to characterize the running reaction delay of the organism. , Respectively represent The difference between the initial operating state and the current operating state of each component, including changes in data processing rate and temperature regulation, Indicates The factory qualification coefficient of each component, Indicates the initial aging test value of the all-in-one computer.
2. The dynamic aging test method for an all-in-one computer according to claim 1, characterized in that: The step of obtaining the heating temperature of the all-in-one computer and the operating environment temperature during operation, and performing a self-heating rate analysis of the all-in-one computer and the environmental heat exchange analysis according to the heating temperature of the computer and the operating environment temperature, specifically includes: Obtaining the body heating temperature and operating environment temperature corresponding to the running all-in-one computer in adjacent unit time, calculating the body heating temperature difference in adjacent unit time, and obtaining the body self-heating rate of the all-in-one computer; The heat exchange temperature difference of the operating environment temperature under adjacent unit time is calculated to obtain the heat exchange rate of the all-in-one computer.
3. The dynamic aging test method for an all-in-one computer according to claim 1, characterized in that: The step of obtaining the operation reaction rate of the all-in-one computer for data processing at different operation times, calculating the operation reaction delay at different operation times, and evaluating the data processing capability of the all-in-one computer according to the operation reaction delay, further includes: Obtaining operation load data of the all-in-one computer under different operation response delays, and performing collaborative analysis on the operation response delay of the all-in-one computer according to the operation load data and the operation environment temperature data; According to the collaborative analysis results, the operation response delays at different operation times are calculated, and the data processing capabilities of the all-in-one computer under different load conditions or different ambient temperature conditions are evaluated based on the operation response delays.
4. A dynamic aging test system for an all-in-one computer, characterized in that: include: A data analysis module, used to obtain the heating temperature of the all-in-one computer and the operating environment temperature during operation, and to analyze the self-heating rate of the all-in-one computer and the environmental heat exchange according to the heating temperature of the computer and the operating environment temperature; A data adjustment module is used to comprehensively evaluate the temperature adjustment capability of the all-in-one computer according to the self-heating rate of the body and the ambient heat exchange rate, and obtain the temperature adjustment evaluation results of the all-in-one computer in different ambient temperatures; A data evaluation module, used to obtain the operation reaction rate of the all-in-one computer for data processing at different operation times, and calculate the operation reaction delay at different operation times, and evaluate the data processing capability of the all-in-one computer according to the operation reaction delay; A data comparison module is used to associate the self-heating rate of the machine body and the environmental heat exchange rate under the same operating time with the corresponding operating reaction delay according to the temperature adjustment evaluation result and the data processing capacity evaluation result, and compare the data with the factory test data of the all-in-one computer to obtain aging test data; Wherein, the data comparison module specifically includes: The component analysis submodule is used to obtain the factory qualified status of the components of the all-in-one computer and the current component operation status, and analyze the aging degree of the components according to the component status change between the factory qualified status of the components and the current component operation status; The data association submodule is used to associate the body self-heating rate and the environmental heat exchange rate related to each running time with the corresponding running reaction delay at the same running time to obtain the body running associated data; The correlation analysis submodule is used to analyze the delay effect of the change of the operating temperature condition on the operating reaction of the machine body according to the machine body operation correlation data, and obtain the temperature delay correlation relationship of the all-in-one computer; A data comparison submodule is used to obtain the factory aging test data of the all-in-one computer, combine the temperature-time delay correlation with the component aging degree, and compare it with the factory aging test data to obtain the aging test data under the current operating state; The data comparison submodule specifically includes: The aging test data under the current operating state is expressed by formula (1), which is as follows: (1); in, Indicates the aging test data under the current operating state. It indicates the temperature difference of heat exchange between the machine and the external environment when the machine is running, which is obtained by averaging the self-heating rate of the machine and the heat exchange rate of the environment. It indicates the difference in data processing reaction rate between adjacent running times and is used to characterize the running reaction delay of the organism. , Respectively represent The difference between the initial operating state and the current operating state of each component, including changes in data processing rate and temperature regulation, Indicates The factory qualification coefficient of each component, Indicates the initial aging test value of the all-in-one computer.
5. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the steps of the dynamic aging test method for an all-in-one computer as described in any one of claims 1 to 3 are implemented.
6. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the steps of the dynamic aging test method for an all-in-one computer as claimed in any one of claims 1 to 3 are implemented.
Citation Information
Patent Citations
Semiconductor aging test method and system
CN116994641A
Automatic testing method and system for solid state disk aging test
CN118173151A