Intelligent adapter structure of high voltage and high power regulated power supply

Abstract

The present invention specifically relates to an intelligent adapter structure of a high-voltage and high-power regulated power supply, comprising an adapter housing, wherein a plurality of detachable component mounting mechanisms are installed inside the adapter housing, each of the component mounting mechanisms comprises a component carrier board, and replaceable electronic components are installed on the component carrier board. The electronic components inside the adapter that are prone to failure are integrated on the component carrier board, and the circuit working status, including key parameters such as current, voltage, and temperature, are monitored by a microcontroller chip. Whether the components are working properly is determined by algorithm analysis. A microcontroller MCU is used in combination with a high-precision sensor and a customized fault diagnosis algorithm to implement a health status assessment of each key component. When an electronic component on the component carrier board fails, a relay-based intelligent switching matrix immediately activates the spare component, switches seamlessly, and ensures stable power output.

Description

Technical Field

[0001] The invention belongs to the field of adapters, and in particular relates to an intelligent adapter structure of a high-voltage and high-power regulated power supply. Background Art

[0002] In the development of modern power electronics technology, high-voltage and high-power regulated power supplies play a pivotal role and are widely used in key areas such as industrial automation, data centers, rail transit, and new energy vehicle charging stations. These application environments place extremely high demands on the stability and reliability of power supply equipment. Any failure or instability may cause the entire system to be interrupted, causing economic losses and even safety issues. Traditional regulated power supply designs often focus on improving conversion efficiency and power density, but have obvious deficiencies in intelligent management, fault detection, and self-repair capabilities.

[0003] In the past, high-voltage and high-power power adapters mostly used a single point of failure design, that is, the electronic components were directly fixed on the motherboard. Once a key component such as a high-voltage filter capacitor, IGBTs, MOSFETs, etc. failed, the entire power system would often need to be shut down for complex fault diagnosis and component replacement, which not only prolonged the system interruption time, but also greatly increased the maintenance cost and difficulty. In addition, due to the lack of an integrated intelligent monitoring system, it is difficult to achieve real-time monitoring of the power supply status and fault prediction, which reduces the availability and safety of the system.

[0004] In recent years, with the rapid development of microelectronics technology, sensor technology and artificial intelligence algorithms, it has become possible to transform high-voltage and high-power regulated power supplies into intelligent ones. In particular, the popularization of microcontroller units (MCUs) and high-precision sensors, as well as the maturity of fault diagnosis algorithms based on big data and machine learning, have enabled power supply systems to monitor their own status in real time, accurately identify fault types, and even predict potential faults, so that measures can be taken in advance to reduce unexpected downtime.

[0005] Therefore, it is particularly urgent to develop a new type of high-voltage and high-power regulated power supply intelligent adapter structure. Summary of the invention

[0006] The object of the present invention is to provide an intelligent adapter structure of a high-voltage and high-power regulated power supply to solve the problems raised in the above-mentioned background technology.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0008] An intelligent adapter structure of a high-voltage and high-power regulated power supply comprises an adapter housing, a plurality of detachable component mounting mechanisms are installed inside the adapter housing, each of the component mounting mechanisms comprises a component carrier, a replaceable electronic component is installed on the component carrier, a top block is fixedly installed on the top of the component carrier, an inspection groove is provided at positions corresponding to the plurality of top blocks inside the adapter housing, a corresponding top plate is provided at the bottom of the inspection groove corresponding to each top block, the top plate is hinged to the bottom plate of the inspection groove, a sealing cover is hinged on the top of the inspection groove, and the inside of the inspection groove is provided with a sealing cover. The bottom of the component carrier is fixed on the base plate, a first fixing plate is fixedly provided in the adapter housing at the position where the base plate is installed, the base plate is embedded in the first fixing plate, a second fixing plate is fixedly provided in the adapter housing at the lower part of the first fixing plate, an ejector plate is respectively abutted against the bottom of each base plate on the second fixing plate, a spiral rod is fixedly provided at the bottom of the ejector plate, a matching thread is provided at the position where the second fixing plate contacts the spiral rod, a micro motor is fixedly connected to the bottom of the spiral rod, and a microcontroller chip is also installed inside the adapter housing.

[0009] Furthermore, the component carrier includes a main carrier and a spare carrier. The main carrier integrates the main electronic components, and the spare carrier integrates the spare electronic components. The main electronic components and the spare electronic components are respectively fixed on the corresponding component carriers through SMT. The circuits of the main electronic components and the spare electronic components are independent of each other through a relay matrix. Both ends of each relay in the relay matrix are respectively connected to the main electronic component circuit and the corresponding spare electronic component circuit. During normal operation, the relay is connected to the main circuit. Once the main component fails, the relay quickly switches to the spare circuit. The microcontroller chip is connected to the control circuit of the relay matrix through a digital signal output port.

[0010] Furthermore, the electronic components integrated on the component carrier include one or more of high-voltage filter capacitors, IGBTs, and MOSFETs.

[0011] Furthermore, each component carrier is provided with a quick-lock connector, which is connected to the circuit on the component carrier.

[0012] Furthermore, a sensor is installed on the component carrier board, and the sensor is connected to the data acquisition port of the microcontroller chip to monitor the key parameters of the circuit in real time.

[0013] Furthermore, the sensors include current sensors, voltage sensors, and RTDs. The microcontroller chip uses a Kalman filter to process noise data. For current and voltage, the microcontroller chip uses dynamic window detection to determine whether there are abnormal fluctuations by comparing the current reading with the average and standard deviation over a period of time. Temperature monitoring is based on the rated temperature rise curve of the component. When the temperature rise rate is abnormal or reaches the limit value, an early warning is issued immediately.

[0014] The method for quantifying the redundancy configuration of the main electronic components and the backup electronic components is: statistically analyzing the failure rate λ, the mean time to failure MTTF and the reliability target R required by the system for each component;

[0015] The failure rate λ of each component: refers to the probability of a component failing within a given time period;

[0016] Mean time to failure (MTTF) is a statistic that indicates the average expected time from the start of operation of a new component to the occurrence of the first failure under normal operating conditions. The reliability target R of the system requirement is a measure of the probability that the system can continue to work normally within a specific period of time, expressing the ability of the system to complete its functions under predetermined conditions and time.

[0017] Establish judgment formula:

[0018] R=(1-e -λ·MTTF ) N ×(1-(1-e -λ·MTTF ) M );

[0019] Among them, N is the number of main components in the system, and M is the number of spare components. The optimal number of spare components M is calculated according to the judgment formula to maximize the overall reliability of the system and optimize the cost-effectiveness ratio.

[0020] Beneficial Effects

[0021] The present application integrates the electronic components inside the adapter that are prone to failure on the component carrier. One or more electronic components can be integrated on each component carrier. The circuit working status, including key parameters such as current, voltage, and temperature, is monitored by a microcontroller chip. Whether the component is working properly is determined through algorithm analysis. A microcontroller MCU is used in combination with a high-precision sensor and a customized fault diagnosis algorithm to implement a health status assessment of each key component. When an electronic component on the component carrier fails, the relay-based intelligent switching matrix immediately activates the backup component and switches seamlessly to ensure stable power output. After fault detection, the component carrier of the faulty module sends a control signal through the microcontroller chip to start the corresponding micromotor. The motor shaft of the micromotor rotates to drive the spiral rod to rotate out the second fixed plate, so that the ejection plate pushes the bottom plate upward, and then the ejector block on the component carrier pushes open the top plate. The microcontroller chip also sends a fault indication to facilitate the staff to remove the faulty component carrier.

[0022] The high-voltage, high-power, regulated power supply intelligent adapter structure of the present application brings the following significant beneficial effects:

[0023] The present invention combines advanced intelligent technology with modular design concepts, fundamentally changing the operation and maintenance mode of high-voltage power adapters. Through a series of innovative designs, the intelligent adapter significantly enhances the stability and reliability of the system in harsh application environments, while optimizing the maintenance process and reducing maintenance costs.

[0024] The core highlight is its unique modular design of component carriers. Each carrier integrates quickly replaceable electronic components, including key components such as high-voltage filter capacitors, IGBTs, MOSFETs, and cleverly configures the main and backup components. Once a fault is detected, the microcontroller chip 111 immediately activates the intelligent switching mechanism and seamlessly switches to the backup components to ensure uninterrupted power supply. This design greatly reduces system downtime caused by single-point failures and improves the system's continuous operation capability.

[0025] As an intelligent center, microcontroller chip 111 integrates a precision sensor network and a machine learning-based fault prediction algorithm to achieve real-time monitoring and in-depth analysis of system status, accurately identify fault types and predict potential problems, effectively preventing the occurrence of faults. Through dynamic data processing and early warning systems, maintenance personnel can quickly locate problems, shorten troubleshooting time, and improve maintenance efficiency.

[0026] In addition, the present invention innovatively adopts an automated faulty component removal mechanism and uses a micro-motor-driven ejection structure to simplify the replacement process of faulty modules, reduce the burden of manual operation, and ensure the safety and convenience of the replacement process. At the same time, the standardized design and compatibility testing of component carriers ensure the interchangeability of products from different suppliers, further improving the flexibility of maintenance and the scalability of the system.

[0027] To strike a balance between cost and reliability, the present invention accurately quantifies the redundancy of the main and standby components, calculates the optimal number of standby components based on the system reliability target, and ensures that unnecessary cost waste is avoided while meeting high reliability. This refined management strategy, combined with a comprehensive cost-benefit analysis, makes the smart adapter an ideal solution that takes into account both economy and reliability in high-voltage and high-power applications.

[0028] In summary, the high-voltage, high-power, regulated power supply intelligent adapter structure of the present invention, with its excellent intelligent monitoring capability, efficient fault response and switching mechanism, convenient modular maintenance design, and sophisticated cost and reliability balance strategy, has brought unprecedented reliability improvement and operation and maintenance efficiency optimization to the field of power electronics technology, and has significant practical value and innovative significance in promoting industry progress. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a cross-sectional view of a component mounting mechanism in the intelligent adapter structure of the high-voltage and high-power regulated power supply of the present invention.

[0030] In the figure, 100. adapter housing, 101. inspection slot, 102. top plate, 103. top block, 104. component carrier, 105. bottom plate, 106. first fixing plate, 107. second fixing plate, 108. ejector plate, 109. screw rod, 110. micro motor, 111. micro control chip. DETAILED DESCRIPTION

[0031] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] The intelligent adapter structure of the high-voltage and high-power regulated power supply provided by the present application is as follows: Figure 1As shown, it includes an adapter housing 100, and a plurality of detachable component mounting mechanisms are installed inside the adapter housing 100, each of the component mounting mechanisms includes a component carrier 104, and replaceable electronic components are installed on the component carrier 104. A top block 103 is fixedly installed on the top of the component carrier 104, and an inspection slot 101 is opened inside the adapter housing 100 at positions corresponding to the plurality of top blocks 103. A corresponding top plate 102 is provided at the bottom of the inspection slot 101 corresponding to each top block 103, and the top plate 102 is hinged to the bottom plate of the inspection slot 101. A sealing cover is hinged on the top of the inspection slot 101, and the interior of the inspection slot 101 is filled with a moisture-proof gasket. 04 is fixed on the bottom of the base plate 105, and a first fixing plate 106 is fixedly provided in the adapter housing 100 at the position where the base plate 105 is installed, and the base plate 105 is embedded in the first fixing plate 106. A second fixing plate 107 is also fixedly provided in the adapter housing 100 at the lower part of the first fixing plate 106, and an ejector plate 108 is respectively abutted against the bottom of each base plate 105 on the second fixing plate 107, and a screw rod 109 is fixedly provided at the bottom of the ejector plate 108, and a matching thread is provided at the position where the second fixing plate 107 contacts the screw rod 109, and a micro motor 110 is fixedly connected to the bottom of the screw rod 109, and a microcontroller chip 111 is also installed inside the adapter housing 100.

[0033] The electronic components inside the adapter that are prone to failure are integrated on the component carrier 104. Each component carrier 104 can integrate one or more electronic components. Among several component carriers 104, one or two groups of component carriers 104 integrate main electronic components, and other component carriers 104 integrate spare electronic components. The circuit working status, including key parameters such as current, voltage, and temperature, is monitored by the microcontroller chip 111. Whether the component is working properly is determined through algorithm analysis. The microcontroller MCU is used with high-precision sensors and customized fault diagnosis algorithms to achieve health status assessment of each key component. When an electronic component on the component carrier 104 fails, the intelligent switching matrix based on the relay immediately activates the spare component, seamlessly switches, and ensures power supply. The output is stable. The electronic components integrated on the component carrier 104 adopt a modular design. Specifically, the electronic components integrated on the component carrier 104 are encapsulated in a standardized module with a protective shell. The interface adopts a dedicated high-voltage and high-current connector. The built-in electrical isolation and short-circuit protection mechanism supports hot plugging under power. After fault detection, the component carrier 104 of the faulty module sends a control signal through the microcontroller chip 111 to start the corresponding micromotor 110. The motor shaft of the micromotor 110 rotates to drive the screw rod 109 to rotate out of the second fixed plate 107, so that the ejection plate 108 pushes the bottom plate 105 upward, and then the top block 103 on the component carrier 104 pushes open the top plate 102. The microcontroller chip 111 also sends a fault indication to facilitate the staff to take out the faulty component carrier 104.

[0034] The micro motor 110 uses closed-loop control, and the motor speed and position are monitored in real time by the Hall effect sensor to ensure accurate control of the extension and retraction of the screw rod 109. The motor start condition is set to the microcontroller chip 111 receiving the fault indication, and after confirmation by the safety verification program, the motor speed is accurately controlled by the PWM (pulse width modulation) signal to drive the screw rod in a smooth and safe manner. To prevent damage to the components during the removal process, the motor driver includes overload protection and speed limit functions.

[0035] All component carriers 104 follow a unified design specification to ensure standardized dimensions, interface types and fixing methods. The quick-lock connectors on each component carrier adopt industry-standard standards, such as IEC 60320 or similar standards, to ensure that component carriers from different suppliers are fully interchangeable. To ensure interchangeability, each batch of component carriers must pass strict compatibility testing before production to ensure correct electrical and mechanical docking with the adapter body and other carriers.

[0036] The component carrier 104 includes a main carrier and a spare carrier. The main carrier integrates the main electronic components, and the spare carrier integrates the spare electronic components. The main electronic components and the spare electronic components are respectively fixed on the corresponding component carrier 104 through SMT. The circuits of the main electronic components and the spare electronic components are independent of each other through a relay matrix. The two ends of each relay in the relay matrix are respectively connected to the main electronic component circuit and the corresponding spare electronic component circuit. During normal operation, the relay is connected to the main circuit. Once the main component fails, the relay quickly switches to the spare circuit. The microcontroller chip 111 is connected to the control circuit of the relay matrix through a digital signal output port.

[0037] One or more key electronic components, such as high-voltage filter capacitors, IGBTs, MOSFETs, precision voltage reference sources, and complex multi-layer PCB boards, are carefully laid out and integrated on each component carrier 104. These components are strategically allocated according to their functions and importance. In the combination of several component carriers 104, one or two groups of carriers are specially designed as carriers of the main electronic components. These main components are the core of system power conversion and voltage regulation, and undertake the main voltage conversion and current regulation tasks to ensure the high efficiency and stability of power supply.

[0038] At the same time, in order to ensure the uninterrupted operation and high reliability of the system, the remaining component carriers 104 are specially used to integrate backup electronic components. These backup components are identical or compatible with the main components. When the microcontroller chip 111 detects a failure of the main component, the microcontroller chip sends instructions to the relay matrix through a pre-set intelligent logic control mechanism to achieve seamless switching to the backup components. This process does not require interruption of power output, thereby ensuring the continuity and stability of power supply.

[0039] Furthermore, the selection and arrangement of electronic components on each component carrier 104 follows the modular design concept, which is not only convenient for production assembly and later maintenance, but also each module is encapsulated in a protective housing that meets industry standards to ensure that the components are protected from physical damage and environmental factors. In addition, each module is equipped with a connector designed for high-voltage and high-current applications, supports electrical isolation and short-circuit protection, and can be safely hot-swapped during system operation, greatly improving the maintainability and flexibility of the system.

[0040] In a specific embodiment, the strategic allocation of component carriers 104 is as follows: Assuming that there are four component carriers 104 configured inside the adapter, two of which are marked as A1 and A2 and are designated as main electronic component carriers, responsible for carrying core components in the high-voltage and high-current paths, such as large-capacity high-voltage filter capacitors and high-performance IGBT modules. These components are directly involved in the conversion and regulation of high-voltage DC voltages and are the key to ensuring the stability of power output. The main electronic component carriers A1 and A2 ensure that they can maintain high conversion efficiency and long life operation when working under high loads through optimized layout and advanced heat dissipation design.

[0041] The other two component carriers are marked as B1 and B2, which are used as carriers of backup electronic components. The B1 carrier integrates the same electronic components as the A1 carrier as a direct backup, and the B2 carrier also corresponds to the components of the backup A2 carrier. The backup components are not only consistent with the main components in model specifications, but also compared with the real-time data of the main components through the micro-control chip 111, so that they are always ready to intervene in the work at the first time of the main component failure to achieve seamless switching. For example, if the IGBT on the A1 carrier is detected to be faulty by the micro-control chip 111 due to abnormal overheating, the micro-control chip will immediately instruct the relay matrix to switch to the backup IGBT on the B1 carrier to ensure that the power output is not interrupted.

[0042] Each component carrier 104 is carefully designed to ensure that the component layout on it meets the electrical performance requirements and is convenient for heat dissipation management and fault isolation. For example, the high-voltage filter capacitor on the A1 carrier is installed close to the heat sink, while the IGBT module is kept at an appropriate distance from it and is equipped with a dedicated heat pipe to ensure that heat is quickly discharged. In addition, all component carriers 104 are connected to the high-voltage and high-current busbar inside the adapter through standardized interfaces. Electrical isolation and short-circuit protection devices are set at the interface to support live plug-in and unplug, which makes component replacement or system upgrade convenient and quick, fully reflecting the modularity and maintenance-friendly nature of the design.

[0043] The electronic components integrated on the component carrier 104 of the adapter include one or more of high-voltage filter capacitors, IGBTs, and MOSFETs.

[0044] The electronic components inside the adapter that are prone to failure, such as high-voltage filter capacitors, power semiconductor devices such as IGBTs or MOSFETs, precision voltage reference sources, and complex multi-layer circuit boards, are carefully integrated on the component carrier 104. These key components are firmly mounted on the carrier through advanced surface mounting technology SMT and selected high-temperature solder to enhance their durability under continuous high voltage and high current conditions. The scientific spacing layout between components, combined with efficient heat dissipation materials and heat pipe technology, ensures that good thermal management performance can be maintained even under full load operation, thereby significantly extending component life and reducing failure rates.

[0045] Each component carrier 104 is provided with a quick lock connector, which is connected to the circuit on the component carrier 104 .

[0046] The design of each component carrier 104 takes into account the requirements of easy maintenance and quick replacement. Not only do all electronic components adopt standard packaging forms to facilitate market purchase and replacement, but the edges of the carrier are also equipped with sturdy and reliable quick-lock connectors to ensure that the electrical connection can be quickly disconnected during the replacement process without causing damage to other components. In addition, the back of the component carrier 104 is provided with a thermal pad and a reinforcing rib structure, which can not only improve the mechanical strength of the carrier itself, but also promote the transfer of heat to the adapter housing 100, making full use of the housing as a heat dissipation medium, and further improving the overall thermal efficiency and stability of the system.

[0047] In order to maximize system reliability and maintainability, each component carrier 104 also integrates a small status indicator LED light bar, which monitors and displays the working status of each component on the carrier in real time through the microcontroller chip 111. The green light is always on to indicate that everything is normal, the yellow light flashes to indicate the warning alarm state, and the red light is on to directly indicate that there is a fault. This intuitive visual feedback mechanism allows maintenance personnel to quickly locate the problem without complex detection, greatly shortening the troubleshooting and repair time. The fault indication system uses a three-color LED indicator (green, yellow, and red), which is integrated in a conspicuous position of the adapter housing 100 and is controlled in real time by the microcontroller chip 111. The green LED is always on to indicate that the system is operating normally; the yellow LED flashes to indicate a warning alarm, such as the temperature is close to the upper limit or the current and voltage have slight abnormal fluctuations; the red LED is on to indicate an emergency fault that needs to be handled immediately. At the same time, the adapter is equipped with a small LCD display to display the fault code and a brief fault description to help quickly locate the problem.

[0048] In a specific embodiment, the relay-based intelligent switching matrix is ​​designed as follows: each row in the relay matrix corresponds to a main component, and each column corresponds to a backup component, forming a cross control structure. The control logic adopts a dual-channel design, one channel is used for main circuit control, and the other channel is reserved for the backup circuit. The matrix is ​​integrated into the control system of the adapter and is directly controlled by the microcontroller chip 111. The matrix includes a plurality of high-reliability relays, each of which corresponds to the switching of a pair of main and backup electronic components. These relays are fast-response type, ensuring that the state switching is completed in a very short time after the microcontroller chip 111 detects the main component fault signal, seamlessly connecting the power supply and avoiding output interruption.

[0049] In the embodiment, taking the IGBT failure on the main electronic component carrier A1 as an example, after the microcontroller chip 111 identifies the failure through real-time data analysis, it immediately transmits the instruction to the specific relay in the intelligent switching matrix through the digital signal line. The relay then acts to disconnect the circuit connection of the faulty IGBT on the A1 carrier, and simultaneously closes the circuit of the corresponding spare IGBT on the spare carrier B1. This series of operations is completed in milliseconds, ensuring the continuity of the current path, thereby maintaining the stability of the power output.

[0050] The specific steps are as follows:

[0051] 1. Fault detection and identification: The microcontroller chip 111 detects an abnormality in the IGBT on the A1 carrier board, which may be due to overheating or other fault conditions.

[0052] 2. Instruction generation and transmission: The microcontroller chip 111 generates specific control instructions based on the preset fault handling logic and sends them to the intelligent switching matrix via a high-speed bus.

[0053] 3. Relay response: After receiving the command, the intelligent switching matrix immediately activates the relay with the corresponding number. This relay was previously connected to the main IGBT circuit and is now quickly disconnected.

[0054] 4. Backup element activation: The other end of the same relay is connected to the backup IGBT on the backup carrier board B1. As the main circuit is disconnected, the backup circuit is immediately closed and the backup IGBT starts to work.

[0055] 5. Status confirmation and feedback: The microcontroller chip 111 confirms the power output status again to ensure successful switching, and gives the operator intuitive feedback through the LED indicator light or display screen.

[0056] In this embodiment, the intelligent switching matrix design of the relay not only ensures the high efficiency of fault handling, but also reflects the flexibility and fault tolerance mechanism of the system design. It is one of the key technologies to achieve high reliability and uninterrupted operation of the high-voltage and high-power regulated power supply intelligent adapter.

[0057] Sensors are also installed on the component carrier 104, and the sensors are connected to the data acquisition port of the microcontroller chip 111 to monitor the key parameters of the circuit in real time. The sensors include current sensors, voltage sensors, and RTDs. The microcontroller chip 111 uses a Kalman filter to process noise data. For current and voltage, the microcontroller chip 111 uses dynamic window detection to determine whether there is abnormal fluctuation by comparing the current reading with the average and standard deviation over a period of time. For temperature monitoring, it is based on the rated temperature rise curve of the component. When the temperature rise rate is abnormal or reaches the limit value, an early warning is immediately issued.

[0058] In a specific embodiment, the microcontroller chip 111 monitors the key parameters of the circuit in real time, including but not limited to current, voltage and temperature, through an integrated precision sensor network. These sensors include but are not limited to Hall effect current sensors to measure current, precision voltage sensors to monitor voltage levels, and thermocouples or RTD resistance temperature detectors to track temperature changes of components and key areas.

[0059] The microcontroller chip 111 is embedded with a highly optimized algorithm based on machine learning models, which uses historical data and real-time input to continuously evaluate the health of components. The algorithm first sets a series of thresholds and allowable deviation ranges, such as the allowable fluctuation range of current, the stable window of voltage, and the safe operating temperature range of components. Once the monitoring data exceeds the preset range, the algorithm will immediately identify and classify the potential fault type.

[0060] In a specific embodiment, the microcontroller chip 111 collects thousands of data points per second, and uses a Kalman filter to process noise data through algorithm analysis. The Kalman filter parameters used by the microcontroller chip 111, such as the observed noise covariance matrix Q and the system noise covariance matrix R, will be fine-tuned according to the specific application scenario and sensor characteristics. For current and voltage, the algorithm uses a dynamic window detection method to determine whether there are abnormal fluctuations by comparing the current reading with the average and standard deviation over a period of time. In the dynamic window detection algorithm, the set standard deviation threshold and time window length will be determined based on historical data analysis and system simulation results to optimize the accuracy and false alarm rate of fault detection. Ensure the accuracy and stability of monitoring. Temperature monitoring is combined with the rated temperature rise curve of the component. Once the temperature rise rate is abnormal or reaches the limit value, an early warning will be issued immediately.

[0061] In actual operation, assuming that the IGBT module on the component carrier 104 is running at high load, the microcontroller chip 111 detects that its operating temperature exceeds the preset safety threshold, and at the same time finds that atypical harmonics appear in the current waveform, indicating that there may be overheating risks and current imbalance. At this time, the algorithm immediately calculates the probability of failure and issues a warning signal. On the one hand, the LED status indicator shows a flashing yellow light, and on the other hand, a control command is sent to the relay matrix to prepare to activate the backup component. At the same time, the microcontroller chip 111 records a detailed fault log, including timestamps, fault types, affected components and other information, to provide data support for subsequent maintenance.

[0062] This embodiment not only demonstrates the powerful functions of the microcontroller chip 111 in real-time monitoring and fault prediction, but also demonstrates the role of algorithm analysis in improving system adaptability and maintenance efficiency, ensuring the long-term stable operation and efficient maintenance of the high-voltage and high-power regulated power supply intelligent adapter.

[0063] The specific circuit connection relationship of this application is as follows:

[0064] 1. Main / backup electronic components and component carriers 104: The main electronic components such as IGBTs, MOSFETs, high-voltage filter capacitors, etc. mounted on each component carrier 104 are fixed by SMT technology and connected to the circuit on the carrier through a quick lock connector. The backup electronic components are also fixed on the corresponding backup component carriers, and their circuits are independent of the main component circuits through the relay matrix, but are designed as a backup path that can be seamlessly switched.

[0065] 2. Sensors and microcontroller chip 111: Current sensors, voltage sensors, RTD and other sensors are directly connected to the data acquisition port of the microcontroller chip 111 to monitor various key parameters in real time and transmit the data to the microcontroller chip for analysis and processing.

[0066] 3. Microcontroller chip 111 and relay matrix: As the core control unit, microcontroller chip 111 is connected to the control circuit of the relay matrix through the digital signal output port. When the microcontroller chip determines that a main electronic component fails according to the algorithm analysis, it will immediately send a control signal to the corresponding relay to activate the circuit path of the backup component.

[0067] 4. Relays and main / backup electronic component circuits: Each relay in the relay matrix is ​​connected to the main electronic component circuit and the corresponding backup electronic component circuit at both ends. During normal operation, the relay is connected to the main circuit. Once the main component fails, the relay quickly switches to the backup circuit to achieve seamless power supply.

[0068] Circuit connection example

[0069] Main electronics and relays: Assuming the main IGBT module is located on the component carrier A1, its positive and negative terminals are connected to the main circuit through quick-lock connectors, which is directly connected to the load side. This circuit is connected to the positive and negative poles of the power supply through one end of the relay K1. The other end of K1 is connected to the corresponding terminals of the carrier B1 where the backup IGBT is located.

[0070] Spare electronic components and relays: The spare IGBT module is located on the carrier board B1, and its circuit is connected to the other end of the K1 relay, which is usually in a disconnected state. When the microcontroller chip 111 detects an IGBT failure on A1, it switches K1 through a control signal, thereby closing the circuit of the spare IGBT and disconnecting the circuit of the main IGBT.

[0071] Sensor network: The current sensor is connected in series in the loop of the main / backup IGBT, the voltage sensor is connected in parallel between the power supply and the IGBT, and the RTD is directly attached to the surface of the IGBT. All three are directly connected to the input interface of the microcontroller chip 111 through signal lines.

[0072] Control logic of microcontroller chip 111: The microcontroller chip receives real-time data from the sensor and uses an algorithm to analyze it. When the current or voltage is abnormal or the temperature measured by the RTD exceeds the preset threshold, the corresponding fault handling process is immediately triggered, including but not limited to sending a signal to the relay matrix, starting the fault indication system, and recording the fault log.

[0073] Integrated Circuit Logic

[0074] 1. Normal operation logic: In the absence of faults, the microcontroller chip continues to monitor, the main circuit components work normally, the relay remains in place, and the power supply path of the main components is maintained.

[0075] 2. Fault detection logic: When the sensor detects an abnormality, the microcontroller chip performs data analysis, confirms the fault, and sends a control signal.

[0076] 3. Fault response logic: The control signal activates the relay matrix, disconnecting the faulty component circuit and connecting the backup component circuit to ensure uninterrupted power supply.

[0077] 4. Maintenance and recovery logic: The faulty component carrier is removed by the microcontroller chip 111 controlling the micro motor 110 and the screw rod 109 mechanism for easy replacement. After replacement, the system can be automatically or manually reset, re-monitored and confirmed to resume normal operation.

[0078] In further implementation, the present application accurately quantifies the redundancy of main electronic components and backup electronic components to ensure that at a given time, the system has sufficient backup resources to deal with failures while avoiding increased costs caused by excessive redundancy.

[0079] The method for accurately quantifying the redundancy configuration of main electronic components and backup electronic components is to count the failure rate (λ), mean time to failure (MTTF) and reliability target (R) required by the system for each component.

[0080] Failure rate of each component (λ): refers to the probability of a component failing within a given time period. It is a function of time and is used to describe the rate at which a component fails over time. The unit of failure rate is usually the number of failures per hour, year, etc., such as "times / hour" or "times / year".

[0081] Mean Time To Failure (MTTF): Mean Time To Failure (MTTF) is a statistic that represents the average expected time from the start of operation of a new component to the first failure under normal operating conditions. Simply put, MTTF is the average time from the start of use to the first failure of all similar components. The unit of MTTF is related to time, such as hours, days, years, etc. There is an inverse relationship between MTTF and failure rate λ, so the longer the MTTF of a component, the longer it is expected to operate without failure.

[0082] Reliability target (R) of system requirements: System reliability (R) is a measure of the probability that the system can continue to work normally within a specific period of time, and expresses the ability of the system to complete its functions under predetermined conditions and time. The reliability target (R) is a desired reliability level set in advance during system design, usually expressed as a percentage, such as "the system must maintain trouble-free operation 99.9% of the time within a year." This goal reflects the important considerations of the system in terms of performance and safety, as well as the user's expectations for system stability.

[0083] Statistical component failure rate (λ), data collection and analysis: First, collect component failure data from historical data provided by suppliers, industry standards or field operation records. These data should cover a long time span to ensure statistical accuracy. Analyze these data and calculate the average failure rate (λ) of each key electronic component, such as high-voltage filter capacitors, IGBTs, MOSFETs, etc.

[0084] Environmental and load factors: Considering the diversity of actual application environments (such as temperature, humidity, vibration, etc.) and the impact of different workloads on component failure rates, the calculation of λ should be adjusted by introducing environmental factors and load factors to reflect the failure probability under actual operating conditions.

[0085] Determine mean time to failure (MTTF) based on manufacturer data: Consult the MTTF data provided by the component manufacturer as a preliminary basis. These data are usually based on test results under laboratory conditions.

[0086] Adjustment for actual operation: Use field operation data to correct the manufacturer's MTTF. If there is no direct data, estimate the MTTF based on industry standards or similar application cases and adjust it based on the actual operating conditions of the component.

[0087] Set the system reliability target (R) and analyze application requirements: According to the application scenarios of high-voltage and high-power regulated power supplies (such as industrial automation, data centers, etc.), analyze the potential impact and loss of system interruptions on the business, and set the system reliability target R based on this. For example, a data center may require a 99.99% annual trouble-free operation time, that is, R = 0.9999.

[0088] The judgment formula is established through the failure rate model, and the optimal number of spare components M is calculated according to the judgment formula, so that the overall reliability of the system is maximized and the cost-effectiveness ratio is optimized. The judgment formula can be expressed as:

[0089] R=(1-e -λ·MTTF ) N ×(1-(1-e -λ·MTTF ) M )

[0090] Where N is the number of main components in the system and M is the number of spare components;

[0091] Actual calculation steps:

[0092] Determine the failure rate (λ) and mean time to failure MTTF of a single component, the number of main components N in the system,

[0093] Assuming a certain number of spare components M, calculate the reliability of a single component within the expected system operation period T: Use the above formula to calculate the system reliability (R);

[0094] Reverse calculation of the number of spare components M: Based on the system reliability target R, find the minimum integer M that meets the conditions.

[0095] Cost-benefit analysis: After determining the theoretical value of M, it is necessary to combine cost analysis to consider the balance between the cost increase caused by adding spare components and the improvement of system reliability, and determine the number of spare components M.

[0096] The high-voltage, high-power, regulated power supply intelligent adapter structure of the present application brings the following significant beneficial effects: the present invention combines advanced intelligent technology with modular design concepts, fundamentally changing the operation and maintenance mode of the high-voltage power supply adapter. Through a series of innovative designs, the intelligent adapter significantly enhances the stability and reliability of the system in harsh application environments, while optimizing the maintenance process and reducing maintenance costs.

[0097] The core highlight is its unique modular design of component carriers. Each carrier integrates quickly replaceable electronic components, including key components such as high-voltage filter capacitors, IGBTs, MOSFETs, and cleverly configures the main and backup components. Once a fault is detected, the microcontroller chip 111 immediately activates the intelligent switching mechanism and seamlessly switches to the backup components to ensure uninterrupted power supply. This design greatly reduces system downtime caused by single-point failures and improves the system's continuous operation capability.

[0098] As an intelligent center, microcontroller chip 111 integrates a precision sensor network and a machine learning-based fault prediction algorithm to achieve real-time monitoring and in-depth analysis of system status, accurately identify fault types and predict potential problems, effectively preventing the occurrence of faults. Through dynamic data processing and early warning systems, maintenance personnel can quickly locate problems, shorten troubleshooting time, and improve maintenance efficiency.

[0099] In addition, the present invention innovatively adopts an automated faulty component removal mechanism and uses a micro-motor-driven ejection structure to simplify the replacement process of faulty modules, reduce the burden of manual operation, and ensure the safety and convenience of the replacement process. At the same time, the standardized design and compatibility testing of component carriers ensure the interchangeability of products from different suppliers, further improving the flexibility of maintenance and the scalability of the system.

[0100] To strike a balance between cost and reliability, the present invention accurately quantifies the redundancy of the main and standby components, calculates the optimal number of standby components based on the system reliability target, and ensures that unnecessary cost waste is avoided while meeting high reliability. This refined management strategy, combined with a comprehensive cost-benefit analysis, makes the smart adapter an ideal solution that takes into account both economy and reliability in high-voltage and high-power applications.

[0101] In summary, the high-voltage, high-power, regulated power supply intelligent adapter structure of the present invention, with its excellent intelligent monitoring capability, efficient fault response and switching mechanism, convenient modular maintenance design, and sophisticated cost and reliability balance strategy, has brought unprecedented reliability improvement and operation and maintenance efficiency optimization to the field of power electronics technology, and has significant practical value and innovative significance in promoting industry progress.

Claims

1. The intelligent adapter structure of high-voltage and high-power regulated power supply is characterized in that: The adapter housing (100) comprises a plurality of detachable component mounting mechanisms installed inside the adapter housing (100), each of the component mounting mechanisms comprising a component carrier (104), a replaceable electronic component installed on the component carrier (104), a top block (103) fixedly installed on the top of the component carrier (104), an inspection slot (101) is provided inside the adapter housing (100) at positions corresponding to the plurality of top blocks (103), and a corresponding bottom of the inspection slot (101) is provided corresponding to each top block (103). A top plate (102) is hingedly connected to the bottom plate of the inspection slot (101); a sealing cover is hingedly provided at the top of the inspection slot (101); a moisture-proof gasket is filled inside the inspection slot (101); the bottom of the component carrier (104) is fixed to the bottom plate (105); a first fixing plate (106) is fixedly provided in the adapter housing (100) at a position where the bottom plate (105) is installed; the bottom plate (105) is embedded in the first fixing plate (106); and a fixing plate (106) is fixedly provided in the adapter housing (100) at the lower part of the first fixing plate (106). A second fixing plate (107), wherein the bottom of each base plate (105) is respectively abutted against an ejector plate (108) on the second fixing plate (107), a screw rod (109) is fixedly provided at the bottom of the ejector plate (108), a matching thread is provided at a position where the second fixing plate (107) contacts the screw rod (109), a micro motor (110) is fixedly connected to the bottom of the screw rod (109), and a micro control chip (111) is also installed inside the adapter housing (100); the component carrier (104) comprises a main carrier and a spare carrier, the main carrier The main electronic component is integrated on the board, and the spare electronic component is integrated on the spare carrier board. The main electronic component and the spare electronic component are respectively fixed on the corresponding component carrier board (104) through SMT. The circuits of the main electronic component and the spare electronic component are independent of each other through a relay matrix. The two ends of each relay in the relay matrix are respectively connected to the main electronic component circuit and the corresponding spare electronic component circuit. When working normally, the relay is connected to the main circuit. Once the main component fails, the relay quickly switches to the spare circuit. The microcontroller chip (111) is connected to the control circuit of the relay matrix through a digital signal output port. The electronic components integrated in the component carrier (104) include one or more of high-voltage filter capacitors, IGBTs, and MOSFETs; Each component carrier (104) is provided with a quick-lock connector, and the quick-lock connector is connected to the circuit on the component carrier (104); Quantify the configuration method of the redundancy of the main electronic components and the backup electronic components, and calculate the failure rate λ, mean time to failure MTTF and reliability target R required by the system for each component; The failure rate λ of each component refers to the probability of a component failing in a given time period; Mean time to failure (MTTF) is a statistic that represents the average expected time from the start of operation of a new component to the first failure under normal operating conditions. The reliability target R of the system requirement is a measure of the probability that the system can continue to work normally within a specific period of time, and expresses the ability of the system to complete its functions within the predetermined conditions and time; Establish judgment formula: ； Where N is the number of main components in the system and M is the number of spare components; The optimal number M of spare components is calculated according to the judgment formula to maximize the overall reliability of the system and optimize the cost-effectiveness ratio.

2. The intelligent adapter structure of the high-voltage and high-power regulated power supply according to claim 1 is characterized in that: A sensor is also installed on the component carrier (104), and the sensor is connected to the data acquisition port of the microcontroller chip (111) to monitor key parameters of the circuit in real time.

3. The intelligent adapter structure of the high-voltage and high-power regulated power supply according to claim 2 is characterized in that: The sensors include a current sensor, a voltage sensor, and an RTD. The microcontroller chip (111) uses a Kalman filter to process noise data. For current and voltage, the microcontroller chip (111) uses dynamic window detection to determine whether there is abnormal fluctuation by comparing the current reading with the average value and standard deviation in the past period of time. Temperature monitoring is based on the rated temperature rise curve of the component. When the temperature rise rate is abnormal or reaches the limit value, an early warning is immediately issued.

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