A heat dissipation device

Abstract

The present application discloses a heat dissipation device, which relates to the technical field of heat dissipation devices. The heat dissipation device includes: a device body, a water inlet, a water outlet, a jet chamber and a heat dissipation chamber arranged inside the device body; the jet chamber is arranged at the projection position of the water inlet inside the device body; the water inlet is connected to the jet chamber; the jet chamber is between the water inlet and the heat dissipation chamber, and the inner wall of the jet chamber is provided with a plurality of jet holes in a circumferential array, and the jet chamber is used to introduce the heat dissipation medium entering from the water inlet into the heat dissipation chamber through the jet holes. In the present application, the process of the heat dissipation medium entering the jet chamber through the water inlet and then being introduced into the heat dissipation chamber realizes a heat dissipation medium transmission method first longitudinally and then transversely, which is conducive to the uniform distribution of the heat dissipation medium fluid, and can give full play to the advantage of the heat dissipation medium in taking away heat, thereby improving the overall temperature uniformity of the heat dissipation device and enhancing the convective heat exchange capacity.

Description

Technical Field

[0001] The present application belongs to the technical field of heat dissipation devices, and specifically relates to a heat dissipation device. Background Art

[0002] With the development of microelectronic devices, ultra-large-scale integrated circuits and electronic products, the heat generated by the heating devices on the circuit boards has also increased dramatically, and the requirements for cooling technology have become increasingly higher.

[0003] In the related art, a cold plate with a skived-tooth structure can be used to dissipate heat from heat-generating components on a circuit board.

[0004] In the process of realizing the present application, the inventors found that there are at least the following problems in the related art: the temperature uniformity of the heating surface of the skived cold plate is poor, and the heat dissipation efficiency of the core heating part is low. Summary of the invention

[0005] The present application aims to provide a heat dissipation device, which at least solves the problem in the related art that the temperature uniformity of the heating surface of the skived cold plate is poor and the heat dissipation efficiency of the core heating part is low.

[0006] In order to solve the above technical problems, this application is implemented as follows:

[0007] In a first aspect, an embodiment of the present application provides a heat dissipation device, comprising:

[0008] A device body, a water inlet, a water outlet, a jet chamber and a heat dissipation chamber arranged inside the device body;

[0009] The water inlet and the water outlet are arranged on the surface of the device body, and the jet chamber is arranged at the projection position of the water inlet inside the device body;

[0010] The water inlet is connected to the jet chamber; the jet chamber is located between the water inlet and the heat dissipation chamber, and the inner wall of the jet chamber is provided with a plurality of jet holes in a circumferential array. The jet chamber is used to introduce the heat dissipation medium entering from the water inlet into the heat dissipation chamber through the jet holes.

[0011] Optionally, a heat dissipation fin structure is provided in the heat dissipation chamber, and the heat dissipation fin structure comprises: a plurality of heat dissipation fins radially distributed along a first projection area, and the first projection area is an area formed by the projection of the water inlet in the heat dissipation chamber.

[0012] Optionally, the heat dissipation fin is a rectangular plate-shaped structure, and the extension direction of the long side of the heat dissipation fin is consistent with the radial radiation direction of the heat dissipation fin;

[0013] One long side of the heat dissipation fin is connected to an inner wall of the heat dissipation chamber close to the water inlet, and the other long side of the heat dissipation fin is connected to an inner wall of the heat dissipation chamber away from the water inlet.

[0014] Optionally, in the direction toward the bottom inner wall of the jet chamber, the jet chamber is a circular structure, and a plurality of circular arrangement lines with increasing diameters are arranged at intervals around the center of the bottom inner wall of the jet chamber;

[0015] A plurality of jet holes are evenly and spaced apart on each of the circular arrangement lines.

[0016] Optionally, the bottom inner wall of the jet chamber is a planar structure, and the jet hole penetrates the bottom inner wall of the jet chamber along the axial direction of the water inlet.

[0017] Optionally, along the direction from the jet chamber to the water inlet, the cross-sectional width of the jet chamber decreases successively.

[0018] Optionally, the cross-section of the jet chamber is a dome structure, or the cross-section of the jet chamber is a trapezoidal structure.

[0019] Optionally, in the direction toward the bottom inner wall of the heat dissipation chamber, the contour of the heat dissipation chamber includes two straight edges and two outer arc edges; the two straight edges are arranged opposite to each other, and the two outer arc edges are arranged opposite to each other.

[0020] Optionally, the heat dissipation fin structure includes: a circular fin area and a plurality of annular fin areas; the annular fin area and the circular fin area each include a plurality of heat dissipation fins distributed radially;

[0021] The circular fin area is arranged at the position of the first projection area, and a plurality of annular fin areas surround the circular fin area and are nested in sequence.

[0022] Optionally, in the direction toward the bottom inner wall of the heat dissipation chamber, among the multiple annular fin areas, an extension length of the heat dissipation fins included in the annular fin area close to the circular fin area is smaller than an extension length of the heat dissipation fins included in the annular fin area away from the circular fin area.

[0023] Optionally, the heat dissipation chamber is connected to the water outlet via a guide channel.

[0024] Optionally, the guide channel includes: two outer channels, and the two outer channels are respectively arranged on opposite sides of the heat dissipation chamber.

[0025] Optionally, the guide channel includes: a plurality of inner channels, and the plurality of inner channels are arranged at intervals between a side of the heat dissipation chamber close to the water outlet and the water outlet.

[0026] Optionally, the outer channel includes: a first horizontal section, a second horizontal section, a first bending section, a second bending section and a third bending section;

[0027] One end of the first bending section is connected to the heat dissipation chamber, and the other end of the first bending section is connected to one end of the first horizontal section; the first horizontal section is parallel to the long side of the device body;

[0028] The other end of the first horizontal segment is connected to one end of the second horizontal segment through a second bending segment, and the bending angle of the second bending segment is an obtuse angle, so that the angle between the first horizontal segment and the second horizontal segment is an obtuse angle;

[0029] The other end of the second horizontal section is connected to the water outlet through the third bending section.

[0030] Optionally, the plurality of inner channels include: three straight channels and two curved channels;

[0031] A first straight channel among the three straight channels is arranged on the shortest connecting line between the heat dissipation chamber and the water outlet; the other two second straight channels are symmetrically arranged on both sides of the first straight channel, one end of the second straight channel is connected to the heat dissipation chamber, and the other end of the second straight channel is connected to the water outlet through a curved channel.

[0032] Optionally, the water inlet and the water outlet are arranged on the same surface of the device body.

[0033] Optionally, along the axial direction of the water inlet, the water inlet includes a first segment and a second segment; the inner diameter of the first segment is greater than the inner diameter of the second segment;

[0034] The second segment is located between the first segment and the jet chamber.

[0035] Optionally, in the direction toward the bottom inner wall of the heat dissipation chamber, on the outer contour of the heat dissipation fin structure, the spacing between adjacent heat dissipation fins is 0.1 mm-0.3 mm.

[0036] Optionally, the heat dissipation device is a three-dimensional printed structure.

[0037] In a second aspect, an embodiment of the present application further provides a method for manufacturing a heat dissipation device, comprising:

[0038] Performing multiple three-dimensional printing operations to obtain the heat dissipation device;

[0039] Wherein, each three-dimensional printing operation includes:

[0040] Laying metal material powder;

[0041] According to the digital modeling corresponding to the heat dissipation device, the metal material powder is three-dimensionally printed by laser to obtain a printing layer corresponding to the three-dimensional printing operation.

[0042] Optionally, the laying of metal material powder includes:

[0043] When performing the first 3D printing operation, metal material powder is laid on a substrate;

[0044] When performing a non-first three-dimensional printing operation, metal material powder is laid on the printing layer obtained by the previous three-dimensional printing operation.

[0045] Optionally, after one 3D printing operation is completed and before the next 3D printing operation is performed, the method further includes:

[0046] Wait for a preset time to wait for the print layer obtained by the three-dimensional printing operation to cool and form.

[0047] Optionally, the height of each printing layer is 0.02-0.06 mm.

[0048] In an embodiment of the present application, the heat dissipation device includes: a device body, a water inlet, a water outlet, a jet chamber and a heat dissipation chamber arranged inside the device body; the jet chamber is arranged at the projection position of the water inlet inside the device body; the water inlet is connected to the jet chamber; the jet chamber is between the water inlet and the heat dissipation chamber, and the inner wall of the jet chamber is provided with a plurality of jet holes in a circumferential array, and the jet chamber is used to introduce the heat dissipation medium entering from the water inlet into the heat dissipation chamber through the jet holes. In the present application, the process of the heat dissipation medium entering the jet chamber through the water inlet and then being introduced into the heat dissipation chamber realizes a heat dissipation medium transmission method that is first longitudinal and then transverse, which is helpful for the uniform distribution of the heat dissipation medium fluid, and can give full play to the advantage of the heat dissipation medium in taking away heat, thereby improving the overall temperature uniformity of the heat dissipation device and enhancing the convective heat exchange capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 is a schematic diagram of the appearance structure of the heat dissipation device provided in an embodiment of the present application;

[0050] Figure 2 is a schematic diagram of a cross-sectional structure of a heat dissipation device provided in an embodiment of the present application;

[0051] Figure 3 is a schematic diagram of the cross-sectional structure of the heat dissipation device provided in an embodiment of the present application;

[0052] Figure 4 is a schematic diagram of temperature distribution of a heat dissipation device provided in an embodiment of the present application;

[0053] Figure 5 is a schematic diagram of a partial cross-sectional structure of a heat dissipation device provided in an embodiment of the present application;

[0054] Figure 6 is another cross-sectional partial structural schematic diagram of the heat dissipation device provided in an embodiment of the present application;

[0055] Figure 7 is another cross-sectional partial structural schematic diagram of the heat dissipation device provided in an embodiment of the present application;

[0056] Figure 8 It is a schematic flow chart of the steps of the method for manufacturing a heat dissipation device provided in an embodiment of the present application.

[0057] Reference numerals:

[0058] 10-device body; 11-jet chamber; 12-heat dissipation chamber; 111-jet hole; 112-circular arrangement line; 20-water inlet; 21-first section; 22-second section; 30-water outlet; 31-third field programmable gate array; 40-heat dissipation fin structure; 41-heat dissipation fin; 411-circular fin area; 412-annular fin area; 50-guiding channel; 51-outer channel; 52-inner channel. DETAILED DESCRIPTION

[0059] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0060] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0061] In practical applications, heat dissipation of electronic devices is a very important research topic. According to statistics, 55% of electronic equipment failures are caused by temperature, and thermal management has become a key issue to ensure the normal operation of high heat flux density electronic devices. In addition, the power consumption of high-performance electronic devices has gradually increased and has exceeded 1000W. There is a problem of local ultra-high heat flux density, and it is urgent to carry out large-scale, non-uniform high heat flux density heat dissipation technology research. The liquid cooling plate is an important component of the heat dissipation system. The liquid cooling plate is a form of indirectly transferring the heat of the heating device to the cooling liquid enclosed in the circulation pipeline through a cold plate (usually a closed cavity made of heat-conducting metals such as copper and aluminum), and taking away the heat through the cooling liquid.

[0062] Reference Figure 1 and Figure 2 The embodiment of the present application provides a heat dissipation device, comprising: a device body 10, a water inlet 20, a water outlet 30, a jet chamber 11 and a heat dissipation chamber 12 arranged inside the device body 10; the water inlet 20 and the water outlet 30 are arranged on the surface of the device body 10, and the jet chamber 11 is arranged at the projection position of the water inlet 20 inside the device body 10; the water inlet 20 is connected to the jet chamber 11; the jet chamber 11 is between the water inlet 20 and the heat dissipation chamber 12, and the inner wall of the jet chamber 11 is provided with a plurality of jet holes 111 in a circumferential array, and the jet chamber 11 is used to introduce the heat dissipation medium entering from the water inlet 20 into the heat dissipation chamber 12 through the jet holes 111.

[0063] In the embodiment of the present application, a heat dissipation device can be used to dissipate heat from high-heat electronic devices. The heat dissipation device can be specifically a liquid cooling plate. The heat dissipation device includes a device body 10 having a water inlet 20, a water outlet 30 and a chamber, and uses a liquid heat dissipation medium. A receiving groove matching the size of the electronic device is provided on one side of the device body 10. The device body 10 can cover the electronic device for arrangement, and the electronic device is placed in the receiving groove. The heat dissipation medium can enter the chamber of the device body 10 from the water inlet 20 of the device body 10. The flow process of the liquid heat dissipation medium in the chamber can take away the heat generated by the electronic device. The heat dissipation medium finally flows away from the water outlet 30 of the device body 10 to achieve heat dissipation of the electronic device.

[0064] Specifically, according to research, the projected position of the water inlet 20 of the heat dissipation device generally corresponds to the core heating area of ​​the electronic device, and the core heating area has a prominent and high heat generation. Figure 3, which shows a schematic diagram of the cross-sectional structure of a heat dissipation device. In order to improve the heat dissipation efficiency of the core heating area of ​​the electronic device, the embodiment of the present application can set a jet chamber 11 at the projection position of the water inlet 20 inside the device body 10, and set a heat dissipation chamber 12 on the side of the jet chamber 11 away from the water inlet 20. The inner wall of the jet chamber 11 is provided with a plurality of jet holes 111 in a circumferential array. The jet chamber 11 is used to introduce the heat dissipation medium entering from the water inlet 20 into the heat dissipation chamber 12 through the jet holes 111. Of course, the jet holes 111 can also be arranged in other ways.

[0065] Based on such a design, when heat is emitted from the core heating area of ​​the electronic device, the liquid heat dissipation medium can enter the jet chamber 11 from the water inlet 20, and after being pressurized in the jet chamber 11 to increase the flow rate, it is introduced into the heat dissipation chamber 12 through the jet hole 111, so that the heat dissipation medium spreads radially along the circumference in the heat dissipation chamber 12 and flows at high speed, quickly taking away the heat emitted from the core heating area of ​​the electronic device.

[0066] In the embodiment of the present application, the heat dissipation medium enters the jet chamber 11 through the water inlet 20 and is then introduced into the heat dissipation chamber 12, realizing a heat dissipation medium transmission method first longitudinally and then transversely. This heat dissipation medium transmission method can be distinguished from the transverse transmission method only in the related art, which changes the disadvantage of poor temperature uniformity of the heating surface of the skived cold plate in the related art, helps to evenly distribute the fluid, gives full play to the advantage of the heat dissipation medium in taking away heat, and makes the fluid evenly distributed on the entire heat exchange surface, thereby improving the overall temperature uniformity of the heat dissipation device and enhancing the convective heat transfer capacity, which helps to increase the service life cycle of electronic devices.

[0067] In summary, in the embodiment of the present application, the heat dissipation device includes: a device body, a water inlet, a water outlet, a jet chamber and a heat dissipation chamber arranged inside the device body; the jet chamber is arranged at the projection position of the water inlet inside the device body; the water inlet is connected to the jet chamber; the jet chamber is between the water inlet and the heat dissipation chamber, and the inner wall of the jet chamber is provided with a plurality of jet holes in a circumferential array, and the jet chamber is used to introduce the heat dissipation medium entering from the water inlet into the heat dissipation chamber through the jet holes. In the present application, the process of the heat dissipation medium entering the jet chamber through the water inlet and then being introduced into the heat dissipation chamber realizes a heat dissipation medium transmission method first longitudinally and then transversely, which is helpful for the uniform distribution of the heat dissipation medium fluid, and can give full play to the advantage of the heat dissipation medium in taking away heat, thereby improving the overall temperature uniformity of the heat dissipation device and enhancing the convective heat exchange capacity.

[0068] Further, specifically in the design process of liquid-cooled plate heat sink, single-phase fluid cooling is an efficient heat dissipation technology, and the jet microchannel cooling technology combining microchannel and jet impact is a good solution to the heat dissipation problem of high-power electronic devices. However, many numerical and experimental studies have shown that microchannel cooling has obvious disadvantages, namely, the channel pressure drop and heating surface temperature rise along the flow direction are large, and due to the small channel scale, the processing difficulty is large, and the processing cost is high, which limits the application of microchannel and microchannel jet cooling technology to a certain extent. In contrast, the embodiment of the present application combines the jet impact in the jet chamber with the heat dissipation chamber The heat dissipation device solution of the fin structure can better solve the above problems, realize the cooling of local hot spots and ensure the uniformity of the heating surface. The heat dissipation medium is sprayed onto the surface to be cooled through the jet hole, so that the impacted wall has a velocity boundary layer that is much thinner than the general wall flow, thereby achieving the effect of reducing the thermal resistance of forced convection heat transfer, and has a very strong heat exchange capacity. When a strong cooling effect is required in a local area, it is suitable for jet cooling.

[0069] Optional, see Figure 2 In some embodiments, a heat dissipation fin structure 40 is provided in the heat dissipation chamber 12 , and the heat dissipation fin structure 40 includes: a plurality of heat dissipation fins 41 radially radiating along a first projection area, and the first projection area is an area formed by the projection of the water inlet 20 in the heat dissipation chamber 12 .

[0070] Optionally, the cooling fin 41 is a rectangular plate-like structure, and the extension direction of the long side of the cooling fin 41 is consistent with the radial radiation direction of the cooling fin 41; the long side of one side of the cooling fin 41 is connected to the inner wall of the cooling chamber 12 close to the water inlet 20, and the long side of the other side of the cooling fin 41 is connected to the inner wall of the cooling chamber 12 away from the water inlet 20.

[0071] In the embodiment of the present application, in order to further improve the heat dissipation efficiency of the heat dissipation device, the embodiment of the present application may also be provided with a heat dissipation fin structure 40 in the heat dissipation chamber 12, and the heat dissipation fin structure 40 includes a plurality of heat dissipation fins 41 in a radiating divergent shape. Specifically, the heat dissipation fins 41 may be a rectangular plate-shaped structure, and the long side extension direction of each heat dissipation fin 41 is consistent with the radial radiation direction of the heat dissipation fin 41. Preferably, the heat dissipation fins 41 are perpendicular to the bottom inner wall surface of the heat dissipation chamber 12.

[0072] After the liquid heat dissipation medium is pressurized in the jet chamber 11 to increase the flow rate, it is introduced into the heat dissipation chamber 12 through the jet hole 111, and can directly impact the surface of the heat dissipation fin 41 of the heat dissipation fin structure 40 to take away the heat, and then the heat dissipation medium further diffuses radially into the laminar heat exchange area to take away the heat from other areas. In the embodiment of the present application, the heat dissipation medium is sprayed onto the surface to be cooled of the heat dissipation fin 41 through the jet hole 111, so that the impacted wall has a velocity boundary layer that is much thinner than the general wall flow, thereby achieving the effect of reducing the thermal resistance of forced convection heat transfer, and having extremely strong heat exchange capacity. Therefore, when a strong cooling effect is required in a local area, jet cooling is suitable.

[0073] Among them, the heat dissipation fins can be a plate-like structure perpendicular to the inner wall of the bottom surface of the heat dissipation chamber. The heat dissipation fins can be made of metal materials with good thermal conductivity, thereby ensuring both the high thermal conductivity of the heat dissipation fins and the structural strength of the heat dissipation fins.

[0074] Specifically, the core heat dissipation principle of the embodiment of the present application is described. The core heat exchange of the embodiment of the present application is to spray the liquid heat dissipation medium entering from the water inlet through the jet hole to the heating surface of the heat dissipation fin. The high-speed fluid directly impacts the heating surface, and a very thin velocity boundary layer can be formed on the impacted surface. Therefore, a very strong convective heat transfer capacity can be generated locally. The local convective heat transfer coefficient is nearly 10 times higher than that of the shovel-tooth cold plate of the related technology, but the convective heat transfer coefficient gradually decreases as it moves away from the center of the jet. The liquid flow state in the jet area is turbulent, and the fluid flow state between the heat dissipation fins away from the jet area is laminar.

[0075] For turbulent scenes, you can refer to Formula 1, which is the calculation formula for the local convection heat transfer coefficient of turbulent scenes:

[0076] Formula 1: ;

[0077] in, is the Nusselt number, is the Reynolds number, is the Prandtl number, D is the diameter of the jet hole, is the jet distance, is the thermal conductivity, is the radius of the circle centered at the stagnation point, is the turbulent cold plate convection heat transfer coefficient.

[0078] For laminar flow scenarios, you can refer to Formula 2, which is the calculation formula for the local convection heat transfer coefficient of the laminar flow scenario:

[0079] Formula 2: ;

[0080] in, is the Nusselt number, is the Reynolds number, is the Prandtl number, is the distance between the heat sink fins, is the jet distance, is the thermal conductivity, is the convective heat transfer coefficient of the laminar cold plate.

[0081] Furthermore, the calculation formula for convective heat conduction is Formula 3:

[0082] Formula 3: ;

[0083] Among them, Q is the power consumption of the electronic device, S1 is the convection heat transfer area, ΔT is the temperature difference between the center temperature of the electronic device surface and the inlet water temperature, and h is the local convection heat transfer coefficient.

[0084] Under the condition of constant power consumption, convection heat transfer area and water inlet temperature, the local convection heat transfer coefficient can be increased, and the central temperature of the electronic device surface will be reduced, achieving a good heat dissipation effect. According to the test, the case temperature of the heat dissipation chamber is 78.81℃, and the temperature of the first projection area formed by the projection of the water inlet in the heat dissipation chamber is the lowest, and gradually increases along the radial direction, which can meet the early design expectations.

[0085] Optional, see Figure 2 , Figure 3 and Figure 4 In the direction toward the bottom inner wall C of the jet chamber 11 (i.e., when viewed from above), the jet chamber 11 is a circular structure, and a plurality of circular arrangement lines 112 with increasing diameters are arranged at intervals around the center B of the bottom inner wall C of the jet chamber 11; and a plurality of jet holes 111 are arranged at intervals and evenly on each circular arrangement line 112.

[0086] Optional, see Figure 4 The bottom inner wall C of the jet chamber 11 is a plane structure, referring to Figure 3 The jet hole 111 penetrates the bottom inner wall C of the jet chamber 11 along the axial direction Y of the water inlet.

[0087] In the embodiment of the present application, the liquid heat dissipation medium will be pressurized and the flow rate will be increased when entering the jet chamber 11. After the heat dissipation medium further enters the jet hole 111, the flow rate will be further increased. Therefore, the high-speed heat dissipation medium can directly impact the heating surface of the heat dissipation fins in the heat dissipation chamber 12 at high speed, thereby achieving the effect of rapid heat dissipation and cooling.

[0088] Specifically, the embodiment of the present application can design the structure of the jet chamber 11 to be circular in a top view. The circular jet chamber 11 can allow the liquid heat dissipation medium to spread out along the radial circumference and pressurize to achieve high-speed flow. The bottom inner wall C of the jet chamber 11 can be a planar structure, so that the jet hole 111 can penetrate the bottom inner wall C of the jet chamber 11 along the direction Y, thereby connecting the jet chamber 11 and the heat dissipation chamber 12. In addition, the embodiment of the present application arranges a plurality of circular arrangement lines 112 with increasing diameters at intervals around the center B of the bottom inner wall of the jet chamber 11, so that a plurality of jet holes 111 are arranged at intervals and evenly on each circular arrangement line 112, so that the jet holes 111 can be evenly distributed in a multi-layer ring shape on the bottom inner wall of the jet chamber 11, so that the heat dissipation medium is evenly injected into the heat dissipation chamber through the evenly distributed jet holes, and on the basis of realizing the cooling of the local hot spots, the temperature uniformity of the heating surface is further ensured.

[0089] in, Figure 4 Two circular arrangement lines 112 around the center B of the bottom inner wall are shown in the figure, but the number of circular arrangement lines is not specifically limited in the embodiment of the present application, and the number of circular arrangement lines can be increased or decreased according to actual needs. In addition, preferably, a jet hole can also be set at the position of the center B.

[0090] Optional, see Figure 5 , which shows a schematic diagram of a partial cross-sectional structure of a heat dissipation device, along the direction X from the jet chamber 11 to the water inlet 20, the cross-sectional width of the jet chamber 11 decreases successively.

[0091] In the embodiments of the present application, Figure 5 As shown, along the direction X, the cross-sectional width of the jet chamber 11 decreases successively. Such a design can create the structural characteristics of the jet chamber 11 being "narrow at the top and wide at the bottom", so that when the heat dissipation medium enters the jet chamber 11 through the water inlet 20, the space changes from narrow to wide, thereby achieving the effect of pressurizing and increasing the flow rate.

[0092] Optionally, the cross section of the jet chamber is a dome structure, or the cross section of the jet chamber is a trapezoidal structure.

[0093] Reference Figure 5 As shown, it shows that the cross section of the jet chamber is a dome structure, and the dome structure can form a structural form similar to a "dome" in the jet chamber, that is, a uniform structural form from narrow to wide, which can further enhance the effect of pressurizing the heat dissipation medium and increasing the flow rate. Of course, the embodiment of the present application does not specifically limit the form of the cross section of the jet chamber, and the cross section of the jet chamber can also be a trapezoidal structure, etc.

[0094] Optional, see Figure 6, which shows a schematic diagram of a heat dissipation fin structure from a top view. In the direction toward the bottom inner wall of the heat dissipation chamber 12 (i.e., from a top view), the outline of the heat dissipation chamber 12 includes two straight edges 402 and two outer arc edges 401; the two straight edges 402 are arranged opposite to each other, and the two outer arc edges 401 are arranged opposite to each other.

[0095] In the embodiment of the present application, in order to match the structural characteristics of the device body 10 having two relatively long sides. In the embodiment of the present application, the contour of the heat dissipation chamber 12 can be designed to be composed of two straight edges 402 and two outer arc edges 401 in a top view, so that the two straight edges 402 can be respectively parallel to the two relatively long sides of the device body 10, and the position between the straight edge 402 and the corresponding long side of the device body 10 can be used to arrange the guide channel 50, and the two outer arc edges 401 extend toward the long side direction of the device body 10, thereby increasing the length of the heat dissipation chamber 12 and improving the heat dissipation area of ​​the heat dissipation chamber.

[0096] Optional, see Figure 6 , which shows a schematic diagram of a top view of a heat dissipation fin structure, the heat dissipation fin structure 40 includes: a circular fin area 411 and a plurality of annular fin areas 412; the annular fin area 412 and the circular fin area 411 each include a plurality of heat dissipation fins 41 distributed radially to achieve the purpose of enhancing heat exchange; the circular fin area 411 is arranged at the position of the first projection area, the diameters of the plurality of annular fin areas 412 increase successively, and the plurality of annular fin areas 412 surround the circular fin area 411 and are nested successively.

[0097] In the embodiment of the present application, the outer contour of the heat dissipation fin structure 40 is circular when viewed from a top view, so that the heat dissipation medium can easily enter the heat dissipation chamber 12 and can spread out along the radial circumference and flow at high speed, thereby quickly taking away the heat generated by the core heating area of ​​the electronic device and improving the heat dissipation performance of the heat dissipation device.

[0098] Furthermore, the heat dissipation fin structure 40 may include: a circular fin region 411 and a plurality of annular fin regions 412 ( Figure 6 A heat dissipation fin structure 40 is shown including two annular fin areas 412); the annular fin area 412 and the circular fin area 411 each include a plurality of heat dissipation fins 41 distributed radially; the circular fin area 411 is arranged at the position of the first projection area, and a plurality of annular fin areas 412 surround the circular fin area 411 and are nested in sequence.

[0099] Among them, the circular fin area 411 is arranged at the first projection area position of the bottom inner wall of the water inlet 20 on the heat dissipation chamber 12, so that the circular fin area 411 can quickly dissipate heat to the core heating part of the electronic device through the multiple heat dissipation fins 41 distributed radially, and the diameters of the multiple annular fin areas 412 are increased successively, and the multiple annular fin areas 412 are nested in sequence around the circular fin area 411, so that the annular fin area 412 can dissipate heat to other parts outside the core heating part through the multiple heat dissipation fins 41 distributed radially, and the multiple surrounding circular fin areas 411 are nested in sequence, which can fully increase the heat exchange area.

[0100] Optional, see Figure 6 In the direction toward the bottom inner wall of the heat dissipation chamber 12 (i.e., when viewed from a top perspective), among the multiple annular fin areas 412, the extension length of the heat dissipation fins 41 included in the annular fin area 412 close to the circular fin area 411 is smaller than the extension length of the heat dissipation fins 41 included in the annular fin area 412 far from the circular fin area 411.

[0101] That is, in the direction of diverging outward from the circular fin area 411 as the center, the sizes of the heat dissipating fins 41 included in different areas increase successively, thereby further expanding the coverage area of ​​the heat dissipating fins and improving the heat dissipation area coverage size of the heat dissipation device.

[0102] Preferably, the number of the surrounding circular fin regions 411 is two.

[0103] The embodiment of the present application combines the excellent characteristics of jet cooling to improve the local convection heat transfer coefficient and the fin structure to enhance the heat exchange surface area through the combination of a circular array jet structure in the jet chamber and a nested structure in which an annular fin area surrounds a circular fin area in the heat dissipation chamber, thereby further improving the heat dissipation performance of the heat dissipation device.

[0104] Optional, see Figure 2 The heat dissipation chamber 12 and the water outlet 30 are connected through the guide channel 50.

[0105] In the embodiment of the present application, the liquid heat dissipation medium can quickly take away the heat generated by the electronic device while flowing in the heat dissipation chamber 12, and then the heat dissipation medium carrying the heat can be discharged from the water outlet 30 through the guide channel 50, thereby achieving the purpose of heat exchange.

[0106] Optional, see Figure 2 The guide channel 50 includes two outer channels 51 , and the two outer channels 51 are respectively arranged on opposite sides of the heat dissipation chamber 12 .

[0107] In an embodiment of the present application, the guide channel 50 may include: two outer channels 51 respectively arranged on opposite sides of the heat dissipation chamber 12, and the two outer channels 51 can realize the drainage of the heat dissipation medium close to the outside of the heat dissipation chamber 12. The symmetrical arrangement of the two outer channels 51 can improve the drainage efficiency of the heat dissipation medium close to the outside of the heat dissipation chamber 12.

[0108] Optional, see Figure 2 The guide channel 50 includes: a plurality of inner channels 52 , and the plurality of inner channels 52 are arranged at intervals between a side of the heat dissipation chamber 12 close to the water outlet 30 and the water outlet 30 .

[0109] In an embodiment of the present application, the guide channel 50 may include: a plurality of inner channels 52 respectively arranged between the heat dissipation chamber 12 and the water outlet 30, the plurality of inner channels 52 can realize the drainage of the heat dissipation medium close to the inner side of the heat dissipation chamber 12, and the plurality of inner channels 52 are evenly spaced and distributed, which can improve the drainage efficiency of the heat dissipation medium close to the inner side of the heat dissipation chamber 12.

[0110] Optional, see Figure 7 The outer channel 51 includes: a first horizontal section 512, a second horizontal section 514, a first bending section 511, a second bending section 513 and a third bending section 515; one end of the first bending section 511 is connected to the heat dissipation chamber 12, and the other end of the first bending section 511 is connected to one end of the first horizontal section 512; the first horizontal section 512 is parallel to the long side of the device body 10; the other end of the first horizontal section 512 is connected to one end of the second horizontal section 514 through the second bending section 513, and the bending angle of the second bending section 513 is an obtuse angle, so that the angle between the first horizontal section 512 and the second horizontal section 514 is an obtuse angle; the other end of the second horizontal section 514 is connected to the water outlet 30 through the third bending section 515.

[0111] In the embodiment of the present application, two outer channels 51 are respectively arranged on opposite sides of the heat dissipation chamber 12, which can realize the drainage of the heat dissipation medium near the outside of the heat dissipation chamber 12. The symmetrical arrangement of the two outer channels 51 can improve the drainage efficiency of the heat dissipation medium near the outside of the heat dissipation chamber 12. Specifically, each outer channel 51 is composed of a horizontal section and a curved section. The horizontal section ensures the extension of the outer channel 51 in the length direction of the device body 10, and the curved section realizes the direction change of the outer channel 51 and the connection with other parts, such as the first bending section 511 realizes the connection between the outer channel 51 and the heat dissipation chamber 12, the second bending section 513 realizes the direction change of the outer channel 51 at the corner, and the third bending section 515 realizes the connection between the outer channel 51 and the water outlet. The embodiment of the present application can make the transmission efficiency of the outer channel higher and the outer channel more compatible with other structures in the device body by reasonably designing the structure of the outer channel.

[0112] Optional, see Figure 7 The multiple inner channels 52 include: three straight channels 521 and two curved channels 522; from a top view, a first straight channel among the three straight channels 521 is arranged on the shortest connecting line between the heat dissipation chamber 12 and the water outlet 30; the other two second straight channels are symmetrically arranged on both sides of the first straight channel, one end of the second straight channel is connected to the heat dissipation chamber 12, and the other end of the second straight channel is connected to the water outlet 30 through the curved channel 522.

[0113] In the embodiment of the present application, the plurality of inner channels 52 can realize the drainage of the heat dissipation medium near the inner side of the heat dissipation chamber 12. The plurality of inner channels 52 are evenly spaced and distributed, which can improve the drainage efficiency of the heat dissipation medium near the inner side of the heat dissipation chamber 12. Specifically, the circular array of the three straight channels 521 between the heat dissipation chamber 12 and the water outlet 30 can quickly transmit the heat dissipation medium along the length direction of the device body 10, while the curved channel 522 realizes the connection between the inner channel 52 and the water outlet 30, so as to achieve the purpose of finally converging the plurality of inner channels 52 to the water outlet 30.

[0114] Optional, see Figure 1 The water inlet 20 and the water outlet 30 are arranged on the same surface of the device body 10.

[0115] In the embodiment of the present application, the water inlet 20 and the water outlet 30 are arranged on the same surface of the device body 10, so that the other surface of the device body 10 can be arranged with a receiving groove matching the size of the electronic device, and the device body 10 can cover the electronic device for arrangement, and the electronic device is placed in the receiving groove. Therefore, arranging the water inlet and the water outlet on the same surface of the device body can make it more convenient to assemble the heat dissipation device with the electronic device.

[0116] Preferably, the line connecting the water inlet 20 and the water outlet 30 is parallel to the long side of the circumscribed rectangle of the device body 10 .

[0117] It should be noted that the embodiment of the present application does not specifically limit the location of the water inlet and the water outlet, and the water inlet and the water outlet may also be set on the side of the device body or other positions.

[0118] Optional, see Figure 5 , along the axial direction Y of the water inlet 20 , the water inlet 20 includes a first segment 21 and a second segment 22 ; the inner diameter of the first segment 21 is greater than the inner diameter of the second segment 22 ; the second segment 22 is located between the first segment 21 and the jet chamber 11 .

[0119] In the embodiment of the present application, the water inlet 20 includes a first segment 21 with a wider inner diameter and a second segment 22 with a narrower inner diameter. The first segment 21 with a wider inner diameter is located on the outside, so that the liquid heat dissipation medium can be more conveniently introduced into the water inlet 20, and the second segment 22 with a narrower inner diameter is located on the inside, so that the liquid heat dissipation medium can experience the effect of pressurization and increased flow rate in the process of entering the narrower second segment 22 from the wider first segment 21. The heat dissipation medium with pressurized and increased flow rate can achieve better heat exchange effect inside the heat dissipation device.

[0120] Optional, see Figure 6 In the direction toward the bottom inner wall of the heat dissipation chamber 12 (ie, in a top view), the outer contour of the heat dissipation fin structure 40 is circular, and on the outer contour, the spacing between adjacent heat dissipation fins 41 is 0.1 mm-0.3 mm.

[0121] In the embodiment of the present application, the spacing between adjacent heat dissipation fins 41 on the outer contour of the heat dissipation fin structure 40 is set to 0.1mm-0.3mm, which can ensure that each heat dissipation fin can be arranged in a relatively dense manner on the basis of being able to pass the heat dissipation medium. The densely distributed heat dissipation fins can further increase the heat exchange area of ​​the heat dissipation device and improve the heat exchange efficiency of the heat dissipation device. Preferably, the spacing between adjacent heat dissipation fins 41 is 0.2mm.

[0122] Optionally, the heat dissipation device is a three-dimensional printed structure.

[0123] In summary, in the embodiment of the present application, the heat dissipation device includes: a device body, a water inlet, a water outlet, a jet chamber and a heat dissipation chamber arranged inside the device body; the jet chamber is arranged at the projection position of the water inlet inside the device body; the water inlet is connected to the jet chamber; the jet chamber is between the water inlet and the heat dissipation chamber, and the inner wall of the jet chamber is provided with a plurality of jet holes in a circumferential array, and the jet chamber is used to introduce the heat dissipation medium entering from the water inlet into the heat dissipation chamber through the jet holes. In the present application, the process of the heat dissipation medium entering the jet chamber through the water inlet and then being introduced into the heat dissipation chamber realizes a heat dissipation medium transmission method first longitudinally and then transversely, which is helpful for the uniform distribution of the heat dissipation medium fluid, and can give full play to the advantage of the heat dissipation medium in taking away heat, thereby improving the overall temperature uniformity of the heat dissipation device and enhancing the convective heat exchange capacity.

[0124] Reference Figure 8 , which shows a flowchart of steps of a method for manufacturing a heat sink, the method comprising performing multiple three-dimensional printing operations to obtain the heat sink;

[0125] Each 3D printing operation includes:

[0126] Step 101: Lay metal material powder.

[0127] Step 102: According to the digital modeling corresponding to the heat dissipation device, three-dimensional printing is performed on the metal material powder by laser to obtain a printing layer corresponding to the three-dimensional printing operation.

[0128] In the embodiment of the present application, the related technology uses a cold plate with a skived structure to achieve heat dissipation. The skived cold plate is a device obtained by brazing multiple parts into one. This method may have problems such as poor cold plate processing and easy leakage. However, the embodiment of the present application can prepare the heat dissipation device through three-dimensional printing. Three-dimensional printing can effectively eliminate this hidden danger. In addition, the three-dimensional printing process can meet the engineering implementation of complex structures. This makes the heat dissipation device easy to operate and maintain, and the feasibility of the production plan of the heat dissipation device is high.

[0129] The design process of 3D printing is: firstly, software modeling for the heat sink is performed on the computer, and then the built 3D model is "partitioned" into layer-by-layer cross-sections, i.e., slices, to guide the subsequent layer-by-layer printing of the printer. Among them, the standard file format for collaboration between the design software and the printer can be the Standard Template Library (STL) file format. An STL file can use triangular faces to approximate the surface of an object. The smaller the triangular face, the higher the surface resolution generated.

[0130] Slicing is to slice the 3D model of the heat sink according to the set layer thickness (such as 0.04mm) using slicing software, dividing the 3D model into a series of horizontal layers. Each layer can be converted into a 2D image, which describes the area that needs to be filled or built during printing. In the slicing software, the position and angle of the model on the printing platform can be adjusted to optimize the printing effect and save materials.

[0131] After that, printing can be carried out layer by layer. The printer reads the cross-sectional information in the slice file, prints these sections layer by layer with powdered metal material, and then bonds the printed layers together in various ways to create a heat dissipation device.

[0132] Specifically, the manufacturing method of the heat dissipation device includes performing multiple three-dimensional printing operations to obtain the heat dissipation device, that is, each three-dimensional printing operation is based on the previous printing result, and a new layer of structure is further printed until the last three-dimensional printing operation is completed, and the heat dissipation device can be obtained. The whole process can be implemented unsupervised, reducing dependence on human resources.

[0133] Furthermore, each 3D printing operation requires further laying of metal material powder on the previous printing result, and then the metal material powder can be 3D printed by laser according to the digital modeling corresponding to the heat sink to obtain the printing layer corresponding to the 3D printing operation. The digital modeling can be a 3D modeling file of the heat sink, which represents the full range of structural details of the heat sink in the 3D virtual environment. By performing 3D printing according to the digital modeling, a heat sink with accurate structure can be obtained.

[0134] In summary, in an embodiment of the present application, a method for manufacturing a heat sink includes performing multiple three-dimensional printing operations to obtain a heat sink; each three-dimensional printing operation includes laying metal material powder. According to the digital modeling corresponding to the heat sink, the metal material powder is three-dimensionally printed by laser to obtain a printing layer corresponding to the three-dimensional printing operation. The embodiment of the present application realizes the production of the heat sink through three-dimensional printing, which can eliminate the problems of high defective rate and easy leakage caused by the processing technology of brazing multiple parts into one to produce a shovel-tooth structure cold plate in the related technology, and the three-dimensional printing technology can meet the engineering realization of complex structures, so that the heat sink is convenient for operation and maintenance, and the production plan of the heat sink has a high feasibility.

[0135] In addition, based on the 3D printing process, more complex heat dissipation device structural designs can be realized in the future, thereby meeting the design requirements of high-efficiency heat exchange and coping with the challenges of gradually increasing heat flux density of electronic devices in the future.

[0136] Optionally, step 101 may specifically include:

[0137] Sub-step 1011: When performing the first three-dimensional printing operation, metal material powder is laid on the substrate.

[0138] In an embodiment of the present application, when performing the first three-dimensional printing operation, metal material powder can be laid on the substrate, so that when the first three-dimensional printing operation is completed, a first printing layer can be formed on the substrate.

[0139] Sub-step 1012: When performing a non-first three-dimensional printing operation, laying metal material powder on the printing layer obtained by the previous three-dimensional printing operation.

[0140] In the embodiment of the present application, when performing a non-first 3D printing operation, metal material powder can be laid on the printing layer obtained by the last 3D printing operation, so that after the non-first 3D printing operation is completed, a new printing layer can be further superimposed on the printing layer formed by the last 3D printing operation. After the last 3D printing operation is completed, a heat dissipation device is obtained.

[0141] Optionally, after one 3D printing operation is completed and before the next 3D printing operation is performed, the method further includes:

[0142] Step 103: Wait for a preset time to wait for the print layer obtained by the three-dimensional printing operation to cool and form.

[0143] In the embodiment of the present application, since 3D printing is a process of melting metal material powder and reshaping the structure through laser, after one 3D printing operation is completed and before the next 3D printing operation is performed, it is possible to wait for a preset time before performing the next 3D printing operation. The purpose of waiting for the preset time is to ensure that the printed layer obtained by this 3D printing operation can be cooled and formed.

[0144] Optionally, the height of each printing layer is 0.02-0.06 mm.

[0145] In a specific example, the manufacturing method of the heat dissipation device includes: first, using a powder spreading device to evenly spread copper powder (or other metal materials) on a substrate, and then a scanning device emits a laser to the copper powder to melt the copper powder according to the information provided by the digital modeling corresponding to the heat dissipation device, and then the copper powder is quickly condensed and formed. After that, the device continues to perform the powder spreading action to print and form the next layer, and prints the heat dissipation device by stacking and melting layer by layer, wherein, preferably, the height of each printed layer is about 0.04mm. The three-dimensional printing technology uses small and medium power lasers to quickly and completely melt the selected metal powder and the rapid cooling and solidification technology to obtain a non-equilibrium supersaturated solid solution and a uniform and fine metallographic structure with a density of nearly 100%. The powder material can be a single metal powder, a composite powder, or a high melting point refractory alloy powder, which is not specifically limited in the embodiments of the present application.

[0146] In summary, the embodiment of the present application is a heat dissipation device that integrates a jet chamber with a circumferential array jet hole structure and an enhanced heat exchange structure composed of heat dissipation fins. It is processed by a three-dimensional printing process, and the integrated structure can achieve a low leakage effect. In addition, the circumferential array jet hole structure in the jet chamber indirectly dissipates heat to the main core area of ​​the electronic device. The circumferential array jet hole structure and the array jet cooling structure composed of the heat dissipation fins are combined with each other, so that the heat dissipation device can combine the excellent characteristics of the local convection heat transfer coefficient and the shovel tooth structure to enhance the heat exchange surface area. In addition, the enhanced jet heat exchange in the water inlet area of ​​the heat dissipation device can take away the heat from the core area of ​​the electronic device, subverting the lateral flow direction of the liquid of the shovel tooth cold plate in the related technology, changing the disadvantage of the poor temperature uniformity of the heating surface of the traditional shovel tooth cold plate, and proposing a microchannel shovel tooth structure arranged radially along the inlet area, which is conducive to the uniform distribution of the fluid, giving full play to the advantage of the refrigerant taking away heat, so that the fluid is evenly distributed on the entire heat exchange surface. The heat dissipation capacity of the heat dissipation device based on the embodiment of the present application is improved by more than 20% compared with the traditional shovel tooth cold plate.

[0147] In addition, in an embodiment of the present application, a method for manufacturing a heat sink includes performing multiple three-dimensional printing operations to obtain a heat sink; each three-dimensional printing operation includes laying metal material powder. According to the digital modeling corresponding to the heat sink, the metal material powder is three-dimensionally printed by laser to obtain a printing layer corresponding to the three-dimensional printing operation. The embodiment of the present application realizes the production of the heat sink through three-dimensional printing, which can eliminate the problems of high defective rate and easy leakage caused by the processing technology of brazing multiple parts into one to produce a shovel-tooth structure cold plate in the related technology, and the three-dimensional printing technology can meet the engineering realization of complex structures, so that the heat sink is convenient for operation and maintenance, and the production plan of the heat sink has a high feasibility.

[0148] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A heat dissipation device, characterized in that: The heat dissipation device comprises: A device body, a water inlet, a water outlet, a jet chamber and a heat dissipation chamber arranged inside the device body; The water inlet and the water outlet are arranged on the surface of the device body, and the jet chamber is arranged at the projection position of the water inlet inside the device body; The water inlet is in communication with the jet chamber; the jet chamber is located between the water inlet and the heat dissipation chamber, and the inner wall of the jet chamber is provided with a plurality of jet holes in a circumferential array, and the jet chamber is used to introduce the heat dissipation medium entering from the water inlet into the heat dissipation chamber through the jet holes; A heat dissipation fin structure is provided in the heat dissipation chamber, and the heat dissipation fin structure comprises: a plurality of heat dissipation fins radially distributed along a first projection area, and the first projection area is an area formed by the projection of the water inlet in the heat dissipation chamber; The heat dissipation chamber is connected to the water outlet through a guide channel; the guide channel includes: two outer channels and multiple inner channels, the two outer channels are respectively arranged on opposite sides of the heat dissipation chamber, and the multiple inner channels are spaced apart and arranged between one side of the heat dissipation chamber close to the water outlet and the water outlet.

2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation fin is a rectangular plate-shaped structure, and the extension direction of the long side of the heat dissipation fin is consistent with the radial radiation direction of the heat dissipation fin; One long side of the heat dissipation fin is connected to an inner wall of the heat dissipation chamber close to the water inlet, and the other long side of the heat dissipation fin is connected to an inner wall of the heat dissipation chamber away from the water inlet.

3. The heat dissipation device according to claim 1, characterized in that: In the direction toward the bottom inner wall of the jet chamber, the jet chamber is a circular structure, and a plurality of circular arrangement lines with increasing diameters are arranged at intervals around the center of the bottom inner wall of the jet chamber; A plurality of jet holes are evenly and spaced apart on each of the circular arrangement lines.

4. The heat dissipation device according to claim 1, characterized in that: The bottom inner wall of the jet chamber is a planar structure, and the jet hole penetrates the bottom inner wall of the jet chamber along the axial direction of the water inlet.

5. The heat dissipation device according to claim 1, characterized in that: Along the direction from the jet chamber to the water inlet, the cross-sectional width of the jet chamber decreases successively.

6. The heat dissipation device according to claim 5, characterized in that: The cross section of the jet chamber is a dome structure.

7. The heat dissipation device according to claim 5, characterized in that: The cross section of the jet chamber is a trapezoidal structure.

8. The heat dissipation device according to claim 1, characterized in that: In the direction toward the bottom inner wall of the heat dissipation chamber, the contour of the heat dissipation chamber includes two straight edges and two outer arc edges; the two straight edges are arranged opposite to each other, and the two outer arc edges are arranged opposite to each other.

9. The heat dissipation device according to claim 1, characterized in that: The heat dissipation fin structure comprises: a circular fin area and a plurality of annular fin areas; the annular fin area and the circular fin area each comprise a plurality of heat dissipation fins distributed radially; The circular fin area is arranged at the position of the first projection area, and a plurality of annular fin areas surround the circular fin area and are nested in sequence.

10. The heat dissipation device according to claim 9, characterized in that: In the direction toward the bottom inner wall of the heat dissipation chamber, among the multiple annular fin areas, the extension length of the heat dissipation fins included in the annular fin area close to the circular fin area is smaller than the extension length of the heat dissipation fins included in the annular fin area far from the circular fin area.

11. The heat dissipation device according to claim 1, characterized in that: The outer channel includes: a first horizontal section, a second horizontal section, a first bending section, a second bending section and a third bending section; One end of the first bending section is connected to the heat dissipation chamber, and the other end of the first bending section is connected to one end of the first horizontal section; the first horizontal section is parallel to the long side of the device body; The other end of the first horizontal segment is connected to one end of the second horizontal segment through a second bending segment, and the bending angle of the second bending segment is an obtuse angle, so that the angle between the first horizontal segment and the second horizontal segment is an obtuse angle; The other end of the second horizontal section is connected to the water outlet through the third bending section.

12. The heat dissipation device according to claim 1, characterized in that: The plurality of inner channels include: three straight channels and two curved channels; A first straight channel among the three straight channels is arranged on the shortest connecting line between the heat dissipation chamber and the water outlet; the other two second straight channels are symmetrically arranged on both sides of the first straight channel, one end of the second straight channel is connected to the heat dissipation chamber, and the other end of the second straight channel is connected to the water outlet through a curved channel.

13. The heat dissipation device according to claim 1, characterized in that: The water inlet and the water outlet are arranged on the same surface of the device body.

14. The heat dissipation device according to claim 1, characterized in that: Along the axial direction of the water inlet, the water inlet includes a first segment and a second segment; the inner diameter of the first segment is greater than the inner diameter of the second segment; The second segment is located between the first segment and the jet chamber.

15. The heat dissipation device according to claim 1, characterized in that: In the direction toward the bottom inner wall of the heat dissipation chamber, on the outer contour of the heat dissipation fin structure, the spacing between adjacent heat dissipation fins is 0.1 mm-0.3 mm.

16. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device is a three-dimensional printed structure.

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