Copper column installation device and automated copper column installation equipment

Abstract

A copper pillar installation device comprises: a main body, at least one side wall of which is provided with at least one air suction port; a plurality of feed ports, located on the upper surface of the main body, each of the feed ports comprising a plurality of feed holes, each of the feed holes comprising a first funnel-shaped perforated portion that is stepped and tapered and a second tubular perforated portion immediately below the first perforated portion, each of the first perforated portions being capable of accommodating a plurality of copper pillars, each of the second perforated portions being capable of accommodating only one copper pillar, and each of the second perforated portions having a lateral slot for communicating with the at least one air suction port of the main body; an exhaust device for connecting with the at least one air suction port; and a sieve plate having a first positioning position and a second positioning position, wherein when the sieve plate is located at the first positioning position, it allows the plurality of copper pillars to pass through the sieve plate and fall downward onto the plurality of connection pads of the substrate; and when the sieve plate is located at the second positioning position, it prevents any of the copper pillars from passing through the sieve plate.

Description

Technical Field

[0001] The present invention relates to a copper pillar installation solution for a substrate, and more particularly to a technical solution for quickly and accurately installing a plurality of copper pillars on a substrate in batches. Background Art

[0002] When manufacturing printed circuit boards (PCBs), typical electronics factories first apply solder paste to the connection pads of the PCB, then place multiple copper pillars on the corresponding connection pads. The PCB is then heated to melt the solder, completing the printed circuit.

[0003] When placing copper pillars on connection pads on a printed circuit board, an automated copper pillar placement device, such as a robotic arm or a needle implanting device, is generally used. However, the placement efficiency of existing copper pillar placement devices still has room for improvement.

[0004] Therefore, a novel copper pillar installation solution for a substrate is urgently needed in the art. Summary of the Invention

[0005] One purpose of the present invention is to disclose a copper column installation device, which can ensure that multiple copper columns to be placed each stay in a feed hole through an air pressure brake device and a sieve plate, so as to effectively prevent the copper columns from falling downward during the movement of the copper column installation device.

[0006] Another object of the present invention is to disclose a copper column installation device, which can suck out any copper column to be placed upward through an upward suction device when the copper column is stuck in the feed hole.

[0007] Another object of the present invention is to disclose a copper pillar installation device, which can deliver multiple copper pillars to multiple corresponding connection pads of a substrate in a batch feeding operation through multiple feed holes arranged in a predetermined pattern, thereby improving the copper pillar installation efficiency of the substrate.

[0008] Another object of the present invention is to disclose a copper pillar installation device, which can ensure that each funnel-shaped feed hole can smoothly guide and deliver a copper pillar through multiple funnel-shaped feed holes that taper in a stepped manner and a vibration device, thereby smoothly installing multiple copper pillars on multiple corresponding connection pads on a substrate in a batch manner.

[0009] Another object of the present invention is to disclose an automated copper pillar installation device, which can ensure that multiple copper pillars can be smoothly installed on multiple corresponding connection pads of a substrate in a batch manner through the above-mentioned copper pillar installation device, thereby improving the copper pillar installation efficiency of the substrate.

[0010] To achieve the above-mentioned purpose, a copper pillar installation device is proposed, which comprises: a main body, at least one side wall of which is provided with at least one air suction port; a plurality of feed ports, located on the upper surface of the main body, each of the feed ports comprises a plurality of feed holes, and the feed holes are arranged in a predetermined pattern, each of the feed holes comprises a first perforated portion in a stepped, funnel-shaped manner and a second perforated portion in a tubular shape immediately below the first perforated portion, each of the first perforated portions can accommodate a plurality of copper pillars, each of the second perforated portions can only accommodate one copper pillar, and each of the second perforated portions is connected to the release hole on the lower surface of the main body, wherein each of the second perforated portions has a lateral slot, and the At least one air suction port is connected to the lateral slot of each second perforated portion; an exhaust device is used to connect to the at least one air suction port; and a sieve plate is arranged on the lower surface of the main body in a horizontally movable manner, and has a plurality of discharge perforations, wherein the sieve plate has a first positioning position and a second positioning position, when the sieve plate is located at the first positioning position, the discharge perforations are correspondingly connected to the release holes to form a plurality of channels for the plurality of copper pillars to pass through the sieve plate and fall down to the plurality of connection pads of the substrate; and when the sieve plate is located at the second positioning position, the discharge perforations are not correspondingly connected to the release holes and can prevent any of the copper pillars from passing through the sieve plate.

[0011] In one embodiment, the screen plate is driven by a micro-driving device to move to the first positioning position or the second positioning position.

[0012] In a possible embodiment, the micro-driving device has a micro-actuator, and the micro-actuator may be a piezoelectric driver, a stepping motor, an electronically controlled cylinder, or an electromagnet driver.

[0013] In one embodiment, the micro-driving device drives the screen plate to move according to the control voltage, and the control voltage is determined according to the sensing signal of the optical ruler.

[0014] In one embodiment, the copper column installation device further has an upward suction device for sucking any of the copper columns upward through the corresponding feed hole when the copper column is stuck.

[0015] In one embodiment, when the vacuum device performs the vacuum operation, it applies a lateral force to one of the copper pillars in each of the second perforated portions through each of the lateral slots to fix each of the copper pillars in each of the second perforated portions; and when the vacuum device stops the vacuum operation, it releases one of the copper pillars from each of the second perforated portions to allow multiple copper pillars to fall downward.

[0016] In one embodiment, the pattern formed by the connection pads of the substrate corresponds to the predetermined pattern.

[0017] In one embodiment, the copper pillar installation device further includes a vibration device, which is in contact with the body to guide one of the plurality of copper pillars in each first through-hole portion into a corresponding second through-hole portion by vibrating the body.

[0018] To achieve the above objectives, the present invention further proposes an automated copper pillar installation device, which comprises a feeding device and the copper pillar installation device as described above, wherein the feeding device is used to transfer a plurality of the copper pillars to the feed ports of the copper pillar installation device.

[0019] In order to enable the examiner to further understand the structure, features, objectives, and advantages of the present invention, the following are attached with drawings and detailed descriptions of preferred embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A top view of an embodiment of a copper pillar mounting device of the present invention;

[0021] Figure 2 for Figure 1 A sectional perspective view of a copper pillar mounting device;

[0022] Figure 3 for Figure 1 A partial cross-sectional view of a copper pillar mounting device; and

[0023] Figure 4 This is a schematic diagram of an embodiment of the automated copper column installation equipment of the present invention. DETAILED DESCRIPTION

[0024] Please also refer to Figures 1 to 3 ,in, Figure 1 A schematic top view of an embodiment of a copper pillar mounting device of the present invention; Figure 2 for Figure 1 A sectional perspective view of the copper pillar mounting device taken along section line AA; and Figure 3 for Figure 1 A partial cross-sectional view of the copper pillar mounting device along the section line AA.

[0025] like Figures 1 to 3 As shown, the copper column installation device 100 includes a body 110 , a plurality of feed ports 120 , at least one air suction port 130 , a vibration device 140 and a sieve plate 150 .

[0026] The feed ports 120 are located on the upper surface of the body 110. Each feed port 120 includes a plurality of feed holes 121. The feed holes 121 are arranged in a predetermined pattern (a square pattern in this embodiment). Each feed hole 121 includes a first, funnel-shaped, stepped, tapering portion 121a and a second, tubular, perforated portion 121b immediately below the first perforated portion 121a. Each first perforated portion 121a is capable of accommodating a plurality of copper pillars 10. Each second through-hole portion 121b can only accommodate one copper pillar 10. Each second through-hole portion 121b is connected to the release hole 111 on the lower surface of the body 110, and each second through-hole portion 121b has a lateral groove 121b1. At least one air inlet 130 of the body 110 is connected to the lateral groove 121b1 of each second through-hole portion 121b. The stepped sidewall of the first through-hole portion 121a with a stepped, gradually tapering funnel shape is shown in FIG. Figure 3 The enlarged view of the local area B, and the position of the lateral groove 121b1 please refer to Figure 2 An enlarged view of the local area C.

[0027] At least one air inlet 130 is provided on at least one side wall of the main body 110 to connect with an air extraction device (not shown in the figure) and is communicated with the lateral slots 121 b 1 of each second through-hole portion 121 b .

[0028] The vibration device 140 is in contact with the main body 110 to guide one of the copper pillars 10 in each first through-hole portion 121 a into a corresponding second through-hole portion 121 b by vibrating the main body 110 .

[0029] The sieve plate 150 is arranged on the lower surface of the main body 110 in a horizontally movable manner, and has a plurality of discharge through-holes 151, wherein the sieve plate 150 has a first positioning position and a second positioning position. When the sieve plate 150 is located at the first positioning position, the discharge through-holes 151 are correspondingly connected to the release holes 111 to form a plurality of channels for a plurality of copper pillars 10 to pass through the sieve plate 150 and fall downward to the plurality of connection pads of the substrate; and when the sieve plate 150 is located at the second positioning position, the discharge through-holes 151 are not correspondingly connected to the release holes 111 and can prevent any copper pillar 10 from passing through the sieve plate 150.

[0030] During operation, the copper pillar installation device 100 can drive the sieve plate 150 to move to the second positioning position through a micro-drive device (not shown in the figure) and perform a vacuum operation through the vacuum device to ensure that the copper pillars 10 located in the main body 110 do not fall downward during the movement of the copper pillar installation device 100, wherein when the vacuum device performs the vacuum operation, it applies a lateral force to a copper pillar 10 in each second perforated portion 121b through each lateral slot 121b1 to fix each copper pillar 10 in each second perforated portion 121b. In addition, when the copper pillar installation device 100 moves to a position above the substrate, the vacuum operation can be stopped by the vacuum device and the sieve plate 150 can be driven to move to the first positioning position by the micro-drive device, so that each second perforated portion 121b releases a copper pillar 10 to a plurality of corresponding connection pads (not shown in the figure) of the substrate. Furthermore, the micro-drive device can drive the sieve plate 150 to move according to a control voltage, and the control voltage can be determined based on a sensing signal from an optical scale (not shown). Specifically, the micro-drive device can include a micro-actuator, which can be a piezoelectric actuator, a stepper motor, an electronically controlled cylinder, or an electromagnet actuator. Since the optical scale and these micro-actuators are conventional technologies, their principles will not be described in detail here.

[0031] In addition, the copper pillar mounting device 100 can be realized by 3D printing technology, engraving machine technology or milling machine processing technology; or it can be composed of multiple layers, and these layers can be realized by 3D printing technology, engraving machine technology or milling machine processing technology.

[0032] In addition, the pattern formed by the connection pads of the substrate corresponds to the predetermined pattern.

[0033] In addition, the copper column installation device 100 may further include an upward suction device (not shown in the figure) for sucking any copper column 10 upward through the corresponding feed hole 121 when it is stuck.

[0034] According to the above description, the present invention further proposes an automated copper column installation device. Figure 4 , which is a schematic diagram of an embodiment of the automated copper column installation equipment of the present invention. Figure 4 As shown, the automated copper column installation device 200 has a control circuit 210, a feeding device 220, a copper column installation device 230, a conveyor belt 240, an exhaust device 250, a micro-drive device 260 and an upward exhaust device 270, wherein the conveyor belt 240 is used to carry the substrate 20, and the copper column installation device 230 is realized by the copper column installation device 100.

[0035] During operation, the control circuit 210 drives the feeding device 220 to transfer multiple copper pillars 10 to the copper pillar installation device 230. It then drives the exhaust device 250 and the micro-drive device 260 to enable the copper pillar installation device 230 to batch-feed the multiple copper pillars 10 onto the corresponding connection pads (not shown) on the substrate 20 in the manner described above. Thereafter, the control circuit 210 drives the conveyor belt 240 to transfer the substrate 20 to the heating zone so that each of the copper pillars 10 can be soldered to the corresponding connection pads. Furthermore, if any copper pillar 10 is stuck in the feed hole, the upward exhaust device 270 can be driven to suck air into the feed hole and suck the copper pillar 10 upward out.

[0036] In addition, the heating device of the heating zone can be a reflow oven, an infrared heating lamp or a hot air gun.

[0037] Through the above disclosed design, the present invention has the following advantages:

[0038] 1. The copper column installation device of the present invention can ensure that multiple copper columns to be placed each stay in a feed hole through an air pressure brake device and a sieve plate, so as to effectively prevent the copper columns from falling downward during the movement of the copper column installation device.

[0039] 2. The copper column installation device of the present invention can suck out any copper column to be placed upward through the upward exhaust device when the copper column is stuck in the feed hole.

[0040] 3. The copper pillar installation device of the present invention can place multiple copper pillars onto multiple corresponding connection pads of a substrate in a batch feeding operation through multiple feeding holes arranged in a predetermined pattern, thereby improving the copper pillar installation efficiency of the substrate.

[0041] 4. The copper pillar installation device of the present invention can ensure that each funnel-shaped feed hole can smoothly guide and deliver a copper pillar through multiple stepped and gradually tapered funnel-shaped feed holes and a vibration device, thereby smoothly installing multiple copper pillars on multiple corresponding connection pads of the substrate in a batch manner.

[0042] 5. The automated copper pillar installation equipment of the present invention can ensure that multiple copper pillars can be smoothly installed on multiple corresponding connection pads of a substrate in a batch manner through the above-mentioned copper pillar installation device, thereby improving the copper pillar installation efficiency of the substrate.

[0043] What is disclosed in the present invention is a preferred embodiment. Any local changes or modifications that are derived from the technical concept of the present invention and are easily inferred by those skilled in the art do not depart from the scope of the patent rights of the present invention.

Claims

1. A copper column mounting device, comprising: a main body, at least one side wall of which is provided with at least one air intake port; A plurality of feed ports are located on the upper surface of the body, each of the feed ports includes a plurality of feed holes, the feed holes are arranged in a predetermined pattern, each of the feed holes includes a first perforated portion in a stepped, funnel-shaped manner and a second perforated portion in a tubular shape immediately below the first perforated portion, each of the first perforated portions can accommodate multiple copper pillars, each of the second perforated portions can only accommodate one copper pillar, and each of the second perforated portions is connected to the release hole on the lower surface of the body, wherein, Each of the second perforated portions has a lateral slot, and the at least one air intake of the body is connected to the lateral slot of each of the second perforated portions; an air extraction device, configured to be connected to the at least one air inlet; as well as The sieve plate is arranged on the lower surface of the main body in a horizontally movable manner and has a plurality of discharge through-holes, wherein the sieve plate has a first positioning position and a second positioning position. When the sieve plate is located at the first positioning position, the discharge through-holes are correspondingly connected with the release holes to form a plurality of channels for the plurality of copper pillars to pass through the sieve plate and fall downward onto the plurality of connection pads of the substrate; and when the sieve plate is located at the second positioning position, the discharge through-holes are not correspondingly connected with the release holes and can prevent any of the copper pillars from passing through the sieve plate.

2. The copper column mounting device according to claim 1, wherein: The sieve plate is driven by a micro driving device to move to the first positioning position or the second positioning position.

3. The copper column mounting device according to claim 2, wherein: The micro driving device has a micro actuator, and the micro actuator is an actuator selected from the group consisting of a piezoelectric actuator, a stepping motor, an electric control cylinder and an electromagnet actuator.

4. The copper column mounting device according to claim 2, wherein: The micro driving device drives the screen plate to move according to the control voltage, and the control voltage is determined according to the sensing signal of the optical ruler.

5. The copper column installation device according to claim 1 further comprises an upward suction device for sucking out any of the copper columns upward through the corresponding feed hole when the copper column is stuck.

6. The copper column mounting device according to claim 1, wherein: When the vacuum device performs the vacuum operation, it applies lateral force to the copper pillars in each of the second perforated portions through each of the lateral slots to fix each of the copper pillars in each of the second perforated portions; and when the vacuum device stops the vacuum operation, it causes each of the second perforated portions to release the copper pillars, so that multiple of the copper pillars fall downward.

7. The copper column mounting device according to claim 1, wherein: The pattern formed by the connection pads of the substrate corresponds to the predetermined pattern.

8. The copper pillar installation device according to claim 1, further comprising a vibration device, wherein the vibration device is in contact with the body to guide one of the plurality of copper pillars in each first through-hole portion into a corresponding second through-hole portion by vibrating the body.

9. An automated copper pillar installation device, comprising a feeding device and the copper pillar installation device according to claim 1, wherein the feeding device is used to transfer a plurality of copper pillars to the feed ports of the copper pillar installation device. 10 . The automated copper column installation equipment according to claim 9 , further comprising a micro drive device to drive the screen plate to move to the first positioning position or the second positioning position.

11. The automated copper column installation equipment according to claim 10, wherein: The micro driving device has a micro actuator, and the micro actuator is an actuator selected from the group consisting of a piezoelectric actuator, a stepping motor, an electric control cylinder and an electromagnet actuator.

12. The automated copper column installation equipment according to claim 10, wherein: The micro driving device drives the screen plate to move according to the control voltage, and the control voltage is determined according to the sensing signal of the optical ruler.

13. The automated copper column installation equipment according to claim 9, further comprising an upward suction device for sucking any copper column upward through the corresponding feed hole when the copper column is stuck.

14. The automated copper column installation equipment according to claim 9, wherein: When the vacuum device performs the vacuum operation, it applies lateral force to the copper pillars in each of the second perforated portions through each of the lateral slots to fix each of the copper pillars in each of the second perforated portions; and when the vacuum device stops the vacuum operation, it causes each of the second perforated portions to release the copper pillars, so that multiple of the copper pillars fall downward.

15. The automated copper column installation equipment according to claim 9, wherein: The pattern formed by the connection pads of the substrate corresponds to the predetermined pattern.

16. The automated copper pillar installation device according to claim 9, further comprising a vibration device, wherein the vibration device is in contact with the body to guide one of the plurality of copper pillars in each first through-hole portion into a corresponding second through-hole portion by vibrating the body.

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