A method and system for rapid detection of circuit board processing defects

Abstract

The present invention discloses a method and system for rapid detection of defects in circuit board processing, and relates to the technical field of circuit board processing defect detection. The system pre-processes and analyzes the collected defect data set and environmental impact data set through a data acquisition module and a data evaluation module, obtains a printing defect index #imgabs0#, a cutting defect index #imgabs1#, a perforation defect index #imgabs2#, a welding defect index #imgabs3# and an environmental impact coefficient #imgabs4#, and constructs a comprehensive defect evaluation index #imgabs5# to evaluate and obtain a first unqualified result, generate a first hierarchical evaluation strategy, and further compare it with the environmental impact coefficient #imgabs6# to generate an environmental adjustment strategy. Through a second hierarchical evaluation unit and a second environmental evaluation unit, the circuit board processing quality is comprehensively evaluated, defects are quickly identified, and corresponding warning information is generated in a timely manner, so as to effectively control the bad defect situation.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing defect detection, and in particular to a circuit board processing defect rapid detection method and system. Background Art

[0002] With the increasing popularity of electronic products and the continuous advancement of electronic technology, circuit boards play a vital role in various electronic devices. However, during the circuit board processing, due to complex factors such as processing equipment, process parameters, and material quality, various defects are often prone to occur, such as component position offset, misaligned printing, inaccurate cutting, etc. These defects seriously affect the functionality, reliability and stability of the circuit board, and may even cause quality problems for the entire electronic product. Therefore, it is very important to quickly and accurately detect defects in the circuit board processing process.

[0003] Traditional circuit board defect detection methods mainly rely on manual visual inspection and simple instrument measurement, which have problems such as slow detection speed, low accuracy, and susceptibility to subjective factors. Manual visual inspection often requires experienced operators, is time-consuming and labor-intensive, and cannot meet the needs of mass production; while instrument measurement can often only detect a single or a few defects and cannot fully cover all possible problems. Summary of the invention

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies in the prior art, the present invention provides a method and system for quickly detecting circuit board processing defects, so as to solve the problem in the background technology that circuit board processing defects cannot be quickly identified.

[0006] (II) Technical solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: a circuit board processing defect rapid detection system, including a data acquisition module, a data evaluation module and a strategy module;

[0008] The data acquisition module is used to divide the circuit board processing area into several areas and deploy several monitoring points in each area to collect defect data and environmental impact data during the processing and build defect data sets and environmental impact data sets;

[0009] The defect data set includes the following data: component position offset pyl, component spacing difference jjcz, component direction offset angle value pyjdz, printing alignment deviation value dqpc, printing thickness difference hdcz, printing layer peeling area ratio value blblz, cutting edge barb area dcmj, cutting depth qgsd, cutting position deviation value pcz, perforation position deviation value ckpcz, perforation radius difference kjcz, aperture edge barb area kjdc, solder point overflow area ycmj, solder point position deviation value hjpc, solder point damaged area ssmj and solder point missing solder quantity qssl;

[0010] The environmental impact data set includes the following data: processing tool temperature wd1, equipment vibration value sbzdz, environmental humidity sdz, electromagnetic interference value dcgr and regional air pressure value qyz;

[0011] The data evaluation module is used to calculate and analyze the defect data set and the environmental impact data set after pre-processing and dimensionless processing to obtain: printing defect index , Cutting defect index , Perforation Defect Index , welding defect index and environmental impact factor , and the printing defect index , Cutting defect index , Perforation Defect Index , welding defect index Correlation, construction of comprehensive defect assessment index ; When the comprehensive defect assessment index Exceeding the first defect threshold , it is determined as a first unqualified result, and a first grading evaluation strategy is generated through a strategy module;

[0012] When the strategy module identifies the first unqualified result, the environmental impact factor is again With the second environmental threshold A comparison is performed to obtain a second evaluation result, and an environment adjustment strategy is generated based on the second evaluation result.

[0013] Preferably, the data acquisition module includes a processing and printing monitoring unit;

[0014] The processing printing monitoring unit is used to install a first integrated sensor at a monitoring point in the printing area to collect circuit board printing data, obtain component position offset pyl, component spacing difference jjcz, component direction offset angle value pyjdz, printing alignment deviation value dqpc, printing thickness difference hdcz and printing layer peeling area ratio value blblz;

[0015] The first integrated sensor includes a visual sensor, an angle sensor and a thickness sensor, which collect the printed image of the circuit board, and use image processing technology to collect the component position, spacing and direction angle during the circuit board printing process through edge detection, feature extraction and pattern recognition; extract the component position contour, calculate the component position offset pyl, component spacing difference jjcz and component direction offset angle value pyjdz between components; extract the printing layer position and contour, calculate the printing alignment deviation value dqpc and the printing layer peeling area ratio value blblz; use the thickness sensor to measure the thickness of the printing area to obtain the printing thickness difference hdcz.

[0016] Preferably, the data acquisition module further comprises a cutting monitoring unit, which is used to install a second integrated sensor in the cutting area to collect circuit board cutting data, and obtain the cutting edge barb area dcmj, the cutting depth qgsd, and the cutting position deviation value pcz;

[0017] The second integrated sensor includes a visual sensor, a laser ranging sensor and an optical sensor. The visual sensor is used to collect the circuit board cutting image, and the barb area and barb position of the circuit board cutting edge are extracted to obtain the cutting edge barb area dcmj. The laser ranging sensor is installed on the cutting tool to measure the cutting depth qgsd into the circuit board. The optical sensor is used to measure the deviation value between the cutting position and the preset standard position to obtain the cutting position deviation value pcz.

[0018] Preferably, the data acquisition module further includes a perforation monitoring unit, which is used to install a third integrated sensor at a monitoring point in the perforation area to collect circuit board perforation data, and obtain a perforation position deviation value ckpcz, a perforation radius difference value kjcz, and an aperture edge barb area kjdc;

[0019] The third integrated sensor includes a visual sensor, a laser ranging sensor and an optical sensor. The visual sensor is used to collect the circuit board perforation image, and the barb area and barb position of the circuit board perforation aperture edge are extracted to obtain the aperture edge barb area kjdc; the optical sensor is used to measure the deviation value between the perforation position and the preset standard position to obtain the perforation position deviation value ckpcz and the perforation radius difference value kjcz.

[0020] Preferably, the data acquisition module further comprises a welding monitoring unit, which is used to install a fourth integrated sensor at a monitoring point in the welding area to collect circuit board welding data, and obtain the solder overflow area ycmj of the welding point, the position deviation value hjpc of the welding point, the damaged area ssmj of the welding point, and the number of missing welds qssl of the welding point;

[0021] The fourth integrated sensor includes a visual sensor, which captures the circuit board welding image through the visual sensor, and identifies the welding point position and appearance characteristics, including the shape and size characteristics of the protrusions or depressions, and extracts the welding point overflow area characteristics, damaged area characteristics and missing welding point quantity characteristics, and obtains the welding point overflow solder area ycmj, the welding point damaged area ssmj and the welding point missing welding quantity qssl; measures the deviation value between the welding position and the preset standard position through the optical sensor, and obtains the welding point position deviation value hjpc.

[0022] Preferably, the data acquisition module further includes a regional environment data acquisition unit, which is used to acquire the processing tool temperature wd1, the equipment vibration value sbzdz, the environmental humidity sdz, the electromagnetic interference value dcgr and the regional air pressure value qyz at the acquisition points in several areas; and construct an environmental impact data set;

[0023] The processing tool temperature wd1 is measured by installing a temperature sensor on the processing tool; the equipment vibration value sbzdz is measured by an acceleration sensor to obtain the vibration frequency and amplitude of the circuit board during the processing; the ambient humidity sdz is measured by a temperature sensor; the electromagnetic interference value dcgr is measured by an electromagnetic field sensor to obtain the electromagnetic field strength; the regional air pressure value qyz is measured by an air pressure sensor.

[0024] Preferably, the data evaluation module comprises a calculation unit, an association unit and a first evaluation unit;

[0025] The calculation unit is used to calculate and analyze the defect data set and the environmental impact data set after pre-processing and dimensionless processing to obtain: printing defect index , Cutting defect index , Perforation Defect Index , welding defect index and environmental impact factor ;

[0026] The printing defect index The method of obtaining is to extract the component position offset pyl, component spacing difference jjcz, component direction offset angle value pyjdz, printing alignment deviation value dqpc, printing thickness difference hdcz and printing layer peeling area ratio value blblz in the defect data set, and after dimensionless processing, generate the printing defect index through the following formula :

[0027]

[0028] Among them, S1 represents the preset offset threshold of the circuit board component position, S2 represents the preset circuit board component spacing difference threshold, S3 represents the preset circuit board component direction offset angle threshold, S4 represents the preset circuit board printing alignment deviation threshold, S5 represents the preset circuit board thickness difference threshold, S6 represents the preset circuit board printed layer peeling area ratio threshold, , , , , , ,and , , , , , and is the weight, and its specific value is set by the user is the first constant correction coefficient;

[0029] The cutting defect index The method of obtaining is to extract the cutting edge barb area dcmj, cutting depth qgsd and cutting position deviation value pcz in the defect data set, and after dimensionless processing, the cutting defect index is generated by the following formula :

[0030]

[0031] Among them, S7 represents the preset barb area threshold for the cutting edge of the circuit board, S8 represents the preset cutting depth threshold for the circuit board, and S9 represents the preset cutting position deviation threshold for the circuit board. , , ,and , , and is the weight, and its specific value is set by the user is the second constant correction coefficient;

[0032] The perforation defect index The method of obtaining is to extract the perforation position deviation value ckpcz, the perforation radius difference kjcz and the aperture edge barb area kjdc in the defect data set, and after dimensionless processing, generate the perforation defect index through the following formula: :

[0033]

[0034] Among them, S10 represents the preset deviation threshold of the circuit board perforation position, S11 represents the preset perforation radius difference threshold of the circuit board, and S12 represents the preset aperture edge barb area threshold of the circuit board. , , ,and , , and is the weight, and its specific value is set by the user is the third constant correction coefficient;

[0035] The welding defect index The acquisition method is to extract the solder overflow area ycmj, the solder position deviation value hjpc, the damaged area ssmj and the number of missing solder joints qssl in the defect data set, and after dimensionless processing, generate the welding defect index through the following formula :

[0036]

[0037] Among them, S13 represents the preset overflow solder area threshold for the circuit board soldering point, S14 represents the preset soldering point position deviation threshold for the circuit board, S15 represents the preset damaged area threshold for the circuit board, and S16 represents the preset soldering point quantity threshold for the circuit board. , , , ,and , , , and is the weight, and its specific value is set by the user is the fourth constant correction coefficient;

[0038] Environmental impact factor The acquisition method is to extract the processing tool temperature wd1, equipment vibration value sbzdz, environmental humidity sdz, electromagnetic interference value dcgr and regional air pressure value qyz from the environmental impact data set; after dimensionless processing, the environmental impact coefficient is generated by the following formula :

[0039]

[0040] Among them, bz1 represents the preset temperature threshold for regional processing tools, bz2 represents the preset vibration threshold for regional processing equipment, bz3 represents the preset threshold for regional environmental humidity, bz4 represents the preset threshold for electromagnetic interference of regional processing equipment, and bz5 represents the preset threshold for regional air pressure. , , , , ,and , , , , and is the weight, and its specific value is set by the user is the fifth constant correction coefficient;

[0041] The correlation unit is used to convert the printing defect index , Cutting defect index , Perforation Defect Index , welding defect index The comprehensive defect assessment index is generated by the following correlation formula :

[0042]

[0043] in, , , , and , , and is the weight, which is adjusted by the user;

[0044] The first evaluation unit is used to convert the comprehensive defect evaluation index With the first defect threshold Compare and obtain the first evaluation results, including:

[0045] When the comprehensive defect assessment index ≥First defect threshold When , it indicates that the processing quality of the circuit board is unqualified, and it is judged as the first unqualified result;

[0046] When the comprehensive defect assessment index <First defect threshold , indicating that the processing quality of the circuit board is qualified, and is judged as the first qualified result.

[0047] Preferably, the data policy module includes a second hierarchical assessment unit and a second environmental assessment unit;

[0048] When the result is determined to be a first unqualified result, the second grading evaluation unit is used to classify the comprehensive defect evaluation index of the first unqualified result as Printing Defect Index in , Cutting defect index , Perforation Defect Index , welding defect index Conduct a first-level assessment strategy, including:

[0049] When the printing defect index ≥First printing threshold , indicating that the circuit board printing process is unqualified; generating the first warning information;

[0050] When the printing defect index <First printing threshold , indicating that the circuit board printing process is qualified;

[0051] When cutting defect index ≥ Second cutting threshold , indicating that the circuit board cutting process is unqualified; generating a second warning message;

[0052] When cutting defect index <Second cutting threshold , indicating that the circuit board cutting process is qualified;

[0053] When the perforation defect index ≥Third perforation threshold , indicating that the circuit board perforation process is unqualified; generating the third warning information;

[0054] When the perforation defect index <Third perforation threshold , indicating that the circuit board perforation process is qualified;

[0055] When the welding defect index ≥ Fourth welding threshold , indicating that the circuit board welding process is unqualified; generating the fourth warning information;

[0056] When the welding defect index <Fourth welding threshold , indicating that the circuit board welding process is qualified;

[0057] The second environmental assessment unit is used to, when the first unqualified result is identified, again set the environmental impact coefficient With the second environmental threshold Compare and obtain the second evaluation result, including:

[0058] When the environmental impact factor ≥ Second environmental threshold When , it indicates that the circuit board processing area environment is unqualified, and a second unqualified result is generated;

[0059] When the environmental impact factor <Second environmental threshold When , it indicates that the circuit board processing area environment is qualified, and a second qualified result is generated.

[0060] Preferably, the strategy module further includes a strategy generation unit, which is used to generate a corresponding strategy according to the first warning information, the second warning information, the third warning information, the fourth warning information and the second unqualified result, including:

[0061] Generate a first printing adjustment strategy according to the first warning information, adjust printing processing parameters, and replace equipment or materials;

[0062] Generate a second cutting adjustment strategy according to the second warning information, adjust cutting processing parameters, and replace equipment or materials;

[0063] Generate a third perforation adjustment strategy according to the third perforation information, adjust perforation processing parameters, and replace equipment or materials;

[0064] generating a fourth welding adjustment strategy according to the fourth warning information, adjusting welding processing parameters, and replacing equipment or materials;

[0065] And generate an environmental adjustment strategy based on the second unqualified result, including: adding ventilation equipment, purifying the air, adding anti-shake equipment, adjusting temperature control equipment and using electromagnetic shielding equipment.

[0066] A method for quickly detecting defects in circuit board processing comprises the following steps:

[0067] S1. Data collection: Divide the circuit board processing area into several areas and deploy monitoring points in each area to collect defect data and environmental impact data during the processing;

[0068] S2. Data processing and evaluation: Preprocess and dimensionless process the collected defect data set and environmental impact data set, and calculate and analyze the printing defect index , Cutting defect index , Perforation Defect Index , welding defect index and environmental impact factor , and the printing defect index , Cutting defect index , Perforation Defect Index , welding defect index Correlation, construction of comprehensive defect assessment index ;

[0069] S3. Determine whether the processing quality is qualified: the comprehensive defect assessment index With the first defect threshold set Make comparisons to determine whether the processing quality is qualified;

[0070] S4. If the comprehensive defect assessment index ≥First defect threshold , a first unqualified result is generated, and a first grading evaluation strategy is generated through the strategy module;

[0071] If the first unqualified result is identified, the environmental impact factor is again With the second environmental threshold Performing comparison, generating a second evaluation result, and generating a second strategy through a strategy module;

[0072] According to various defect indexes and environmental impact coefficients Generate corresponding adjustment strategies, including printing adjustment strategy, cutting adjustment strategy, perforation adjustment strategy, welding adjustment strategy and environment adjustment strategy.

[0073] (III) Beneficial effects

[0074] The present invention provides a method and system for rapid detection of circuit board processing defects. It has the following beneficial effects:

[0075] (1) The disadvantages of traditional methods such as manual visual inspection and simple instrument measurement are slow speed and low accuracy. However, this system can quickly and accurately detect various defects in the circuit board processing process through the data acquisition module and data evaluation module, greatly improving the detection efficiency.

[0076] (2) Traditional instrument measurements can often only detect a single or a few defects, but this system divides the circuit board processing area into several areas and deploys monitoring points in each area, achieving comprehensive coverage and being able to detect all problems that arise.

[0077] (3) The data evaluation module preprocesses and dimensionlessly processes the collected defect data set and environmental impact data set, and then obtains the printing defect index using a computational analysis method. , Cutting defect index , Perforation Defect Index , welding defect index and environmental impact factor , constructing a comprehensive defect assessment index by correlating , effectively improving the accuracy and reliability of detection.

[0078] (4) After identifying the first unqualified result, the system can evaluate the environmental impact coefficient according to the first grading evaluation strategy generated by the strategy module. By comparing the results, the second evaluation result is obtained and the environmental adjustment strategy is generated. Through the work of the second hierarchical evaluation unit and the second environmental evaluation unit, it is convenient to more comprehensively evaluate the quality of circuit board processing, quickly identify the defects of circuit boards in different processing areas, and generate corresponding early warning information in time, so as to effectively control the adverse conditions in the production process and ensure the quality and stability of the circuit board. This timely adjustment strategy helps to prevent the defects from further expanding and improve the efficiency and quality of circuit board production. BRIEF DESCRIPTION OF THE DRAWINGS

[0079] Figure 1 This is a schematic diagram of a flow chart of a circuit board processing defect rapid detection system of the present invention;

[0080] Figure 2 The present invention is a schematic diagram of the steps of a method for rapid detection of circuit board processing defects. DETAILED DESCRIPTION

[0081] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0082] Example 1

[0083] See also Figure 1 ,The present invention provides a circuit board processing defect rapid detection system, including a data acquisition module, a data evaluation module and a strategy module;

[0084] The data acquisition module is used to divide the circuit board processing area into several areas and deploy several monitoring points in each area to collect defect data and environmental impact data during the processing and build defect data sets and environmental impact data sets;

[0085] The defect data set includes the following data: component position offset pyl, component spacing difference jjcz, component direction offset angle value pyjdz, printing alignment deviation value dqpc, printing thickness difference hdcz, printing layer peeling area ratio value blblz, cutting edge barb area dcmj, cutting depth qgsd, cutting position deviation value pcz, perforation position deviation value ckpcz, perforation radius difference kjcz, aperture edge barb area kjdc, solder point overflow area ycmj, solder point position deviation value hjpc, solder point damaged area ssmj and solder point missing solder quantity qssl;

[0086] The environmental impact data set includes the following data: processing tool temperature wd1, equipment vibration value sbzdz, environmental humidity sdz, electromagnetic interference value dcgr and regional air pressure value qyz;

[0087] The data evaluation module is used to calculate and analyze the defect data set and the environmental impact data set after pre-processing and dimensionless processing to obtain: printing defect index , Cutting defect index , Perforation Defect Index , welding defect index and environmental impact factor , and the printing defect index , Cutting defect index , Perforation Defect Index , welding defect index Correlation, construction of comprehensive defect assessment index ; When the comprehensive defect assessment index Exceeding the first defect threshold , it is determined as a first unqualified result, and a first grading evaluation strategy is generated through a strategy module;

[0088] When the strategy module identifies the first unqualified result, the environmental impact factor is again With the second environmental threshold A comparison is performed to obtain a second evaluation result, and an environment adjustment strategy is generated based on the second evaluation result.

[0089] In this embodiment, the problems of slow detection speed and low accuracy in traditional methods of manual visual inspection and simple instrument measurement have been effectively solved. Through the data acquisition module and the data evaluation module, the system can quickly and accurately detect various defects in the circuit board processing process, including component position offset, printing misalignment, inaccurate cutting and other problems. Traditional instrument measurement can often only detect a single or a few types of defects, while the system can divide the circuit board processing area into several areas and deploy monitoring points in each area, thereby achieving comprehensive coverage and being able to detect all problems that arise. After the data evaluation module preprocesses and dimensionlessly processes the collected defect data set and environmental impact data set, it uses computational analysis methods to obtain the printing defect index. , Cutting defect index , Perforation Defect Index , welding defect index and environmental impact factor , constructing a comprehensive defect assessment index by correlating This intelligent analysis method effectively improves the accuracy and reliability of detection. After identifying unqualified results, the system can evaluate the environmental impact coefficient according to the first-level evaluation strategy generated by the strategy module. A comparison is made to obtain a second evaluation result and generate an environmental adjustment strategy. This timely adjustment strategy helps prevent defects from further expanding and improves the efficiency and quality of circuit board production.

[0090] Example 2: This example is an explanation of Example 1. Figure 1 ,Specifically, the data acquisition module includes a processing and printing monitoring unit;

[0091] The processing printing monitoring unit is used to install a first integrated sensor at a monitoring point in the printing area to collect circuit board printing data, obtain component position offset pyl, component spacing difference jjcz, component direction offset angle value pyjdz, printing alignment deviation value dqpc, printing thickness difference hdcz and printing layer peeling area ratio value blblz;

[0092] The first integrated sensor includes a visual sensor, an angle sensor and a thickness sensor, which collect the printed image of the circuit board, and use image processing technology to collect the component position, spacing and direction angle during the circuit board printing process through edge detection, feature extraction and pattern recognition; extract the component position contour, calculate the component position offset pyl, component spacing difference jjcz and component direction offset angle value pyjdz between components; extract the printing layer position and contour, calculate the printing alignment deviation value dqpc and the printing layer peeling area ratio value blblz; use the thickness sensor to measure the thickness of the printing area to obtain the printing thickness difference hdcz.

[0093] The increase of component position offset pyl and component spacing difference jjcz will lead to poor connection or short circuit between components, thus affecting the overall performance and reliability of the circuit board; the increase of component direction offset angle value pyjdz will lead to the decline of subsequent processing welding quality, affecting the strength and connectivity of the welding point, thus reducing the durability and stability of the circuit board;

[0094] The increase of printing alignment deviation value dqpc and printing thickness difference value hdcz will lead to poor printing quality, uneven printing, inconsistent printing layer thickness and other problems, affecting the appearance and function of the circuit board; the increase of printing layer peeling area ratio value blblz will lead to decreased adhesion between the printing layer and the substrate, increasing the risk of layer peeling, resulting in short circuit failure of the circuit board;

[0095] In this embodiment, the component position offset pyl, component spacing difference jjcz, component direction offset angle value pyjdz, printing alignment deviation value dqpc, printing thickness difference hdcz and printing layer peeling area ratio value blblz are obtained by measuring and collecting with the help of the first integrated sensor, which can realize fast, continuous and real-time monitoring of various parameters in the circuit board printing process, improve production efficiency and production line operation efficiency, so as to effectively evaluate printing quality and discover potential defects. Through the application of visual sensors and image processing technology, it is possible to realize automatic monitoring and data collection of the circuit board printing process, reduce the need for manual intervention, and reduce labor costs and production risks.

[0096] Example 3, this example is an explanation of Example 1, please refer to Figure 1 Specifically, the data acquisition module also includes a cutting monitoring unit, which is used to install a second integrated sensor in the cutting area to collect circuit board cutting data, and obtain the cutting edge barb area dcmj, cutting depth qgsd, and cutting position deviation value pcz;

[0097] The second integrated sensor includes a visual sensor, a laser ranging sensor and an optical sensor. The visual sensor is used to collect the circuit board cutting image, and the barb area and barb position of the circuit board cutting edge are extracted to obtain the cutting edge barb area dcmj. The laser ranging sensor is installed on the cutting tool to measure the cutting depth qgsd into the circuit board. The optical sensor is used to measure the deviation value between the cutting position and the preset standard position to obtain the cutting position deviation value pcz.

[0098] In this embodiment, the increase in the cutting edge barb area dcmj will cause the edge of the circuit board to be uneven and barbs to appear, which will damage other components or wires around the circuit board, or even pierce the protective layer of the circuit board, thereby affecting the reliability and safety of the circuit board. Inconsistent cutting depth qgsd leads to uneven force when welding components, affecting the welding quality. The cutting position deviation value pcz; leads to inaccurate circuit board size, which makes it difficult to align components when installing them, affecting the installation quality of the components and the overall performance of the circuit board. The data collected by the cutting monitoring unit can effectively improve the cutting quality of the circuit board, reduce production costs, and improve production efficiency.

[0099] Example 4: This example is an explanation of Example 1. Figure 1 Specifically, the data acquisition module also includes a perforation monitoring unit, which is used to install a third integrated sensor at a monitoring point in the perforation area to collect circuit board perforation data, and obtain a perforation position deviation value ckpcz, a perforation radius difference value kjcz, and an aperture edge barb area kjdc;

[0100] The third integrated sensor includes a visual sensor, a laser ranging sensor and an optical sensor. The visual sensor is used to collect the perforation image of the circuit board, and the barb area and barb position of the perforation aperture edge of the circuit board are extracted to obtain the barb area kjdc of the aperture edge; the optical sensor is used to measure the deviation between the perforation position and the preset standard position to obtain the perforation position deviation value ckpcz and the perforation radius difference value kjcz. In this embodiment, the perforation position deviation value ckpcz is too large, resulting in inaccurate alignment of the component, so that the pin of the component cannot pass through the hole correctly, which makes it difficult to install the component and affects the assembly efficiency and quality of the circuit board; the increase in the perforation radius difference value kjcz may lead to inconsistent aperture size, so that the solder cannot completely fill the hole during welding, or the welding is not firm, thereby reducing the connection reliability of the welding point and affecting the stability and reliability of the circuit board. The increase in the barb area kjdc of the aperture edge may cause the hole edge to be uneven, barbs or burrs to appear, and these sharp edges may damage the solder, wire or component pins, resulting in poor contact of the welding point, wire breakage or component shedding, thereby affecting the performance and reliability of the circuit board. The introduction of the perforation monitoring unit helps to timely discover and adjust possible problems in the perforation process, thereby ensuring that the quality and performance of the circuit board meet the requirements and quickly detecting circuit board defects in the perforation process.

[0101] Example 5. This example is an explanation of Example 1. Please refer to Figure 1 Specifically, the data acquisition module also includes a welding monitoring unit, which is used to install a fourth integrated sensor at a monitoring point in the welding area to collect circuit board welding data, and obtain the solder overflow area ycmj of the welding point, the position deviation value hjpc of the welding point, the damaged area ssmj of the welding point, and the number of missing welding points qssl;

[0102] The fourth integrated sensor includes a visual sensor, which captures the circuit board welding image through the visual sensor, and identifies the welding point position and appearance characteristics, including the shape and size characteristics of the protrusions or depressions, and extracts the welding point overflow area characteristics, damaged area characteristics and missing welding point quantity characteristics, and obtains the welding point overflow solder area ycmj, the welding point damaged area ssmj and the welding point missing welding quantity qssl; measures the deviation value between the welding position and the preset standard position through the optical sensor, and obtains the welding point position deviation value hjpc.

[0103] In this embodiment, the increase of the solder overflow area ycmj of the welding point may cause the solder to short-circuit with the adjacent components or wires or the gap between the solder and the circuit board is insufficient, thereby affecting the conduction performance and stability of the circuit board. Excessive solder overflow may also cause a short circuit between the welding points, and even cause a short circuit fault of the circuit board. The welding point position deviation value hjpc may cause the solder to not match the welding point position, which may cause the welding to be loose or the welding point position to be inaccurate, thereby affecting the connection stability and electrical performance of the circuit board. A large damaged area ssmj of the welding point may cause the mechanical strength of the welding point to be insufficient, thereby affecting the reliability and durability of the welding point. A large damaged area of ​​the welding point may also cause the electrical performance of the welding point to decrease, and even cause a short circuit or open circuit of the circuit board. The number of welding points missing qssl may cause the connection points on the circuit board to be incomplete, which may affect the overall electrical connection performance of the circuit board, and then affect the working stability and reliability of the circuit board. Too many missing welding points may also cause the circuit board to lose its function or performance. Monitoring and controlling these parameters during the welding process is very important, which can effectively improve the quality and reliability of the circuit board.

[0104] Example 6. This example is an explanation of Example 1. Please refer to Figure 1 Specifically, the data acquisition module also includes a regional environmental data acquisition unit, which is used to collect and obtain the processing tool temperature wd1, equipment vibration value sbzdz, environmental humidity sdz, electromagnetic interference value dcgr and regional air pressure value qyz at the collection points in several areas; construct an environmental impact data set;

[0105] The processing tool temperature wd1 is measured by installing a temperature sensor on the processing tool; the equipment vibration value sbzdz is measured by an acceleration sensor to obtain the vibration frequency and amplitude of the circuit board during the processing; the ambient humidity sdz is measured by a temperature sensor; the electromagnetic interference value dcgr is measured by an electromagnetic field sensor to obtain the electromagnetic field strength; the regional air pressure value qyz is measured by an air pressure sensor.

[0106] In this embodiment, the change of the processing tool temperature wd1 will affect the temperature control during welding and printing. Too high a temperature may cause excessive melting of the welding point or deformation of the printing material, while too low a temperature may cause the welding to be loose or the printing quality to decrease. The equipment vibration value sbzdz reflects the vibration of the processing equipment during operation. Excessive vibration will lead to reduced processing accuracy, affect the accuracy of cutting and perforation, and thus affect the quality and stability of the circuit board. The change of the environmental humidity sdz will affect the humidity of the printing material and the moisture level of the circuit board surface, which may cause unstable printing quality or corrosion of metal parts, affecting the reliability of the circuit board. Too high an electromagnetic interference value dcgr may affect the normal operation of the processing equipment, cause errors in the circuit board processing process, and affect the quality of the circuit board; the change of the regional air pressure value qyz will affect the air pressure control during welding and printing, which may cause changes in the fluidity of the welding gas or printing material, affecting the welding and printing quality. The environmental impact data set will have an impact on the processing process of the circuit board, which may cause the quality of the circuit board to decrease, the stability to decrease, or a failure to occur. Therefore, real-time monitoring and control of these environmental parameters can effectively improve the quality and stability of circuit board processing and ensure the reliability and performance of the circuit board.

[0107] Example 7. This example is an explanation of Example 1. Please refer to Figure 1 ,Specifically, the data evaluation module includes a calculation unit, an association unit and a first evaluation unit;

[0108] The calculation unit is used to calculate and analyze the defect data set and the environmental impact data set after pre-processing and dimensionless processing to obtain: printing defect index , Cutting defect index , Perforation Defect Index , welding defect index and environmental impact factor ;

[0109] The printing defect index The method of obtaining is to extract the component position offset pyl, component spacing difference jjcz, component direction offset angle value pyjdz, printing alignment deviation value dqpc, printing thickness difference hdcz and printing layer peeling area ratio value blblz in the defect data set, and after dimensionless processing, generate the printing defect index through the following formula :

[0110]

[0111] Among them, S1 represents the preset offset threshold of the circuit board component position, S2 represents the preset circuit board component spacing difference threshold, S3 represents the preset circuit board component direction offset angle threshold, S4 represents the preset circuit board printing alignment deviation threshold, S5 represents the preset circuit board thickness difference threshold, S6 represents the preset circuit board printed layer peeling area ratio threshold, , , , , , ,and , , , , , and is the weight, and its specific value is set by the user is the first constant correction coefficient;

[0112] The cutting defect index The method of obtaining is to extract the cutting edge barb area dcmj, cutting depth qgsd and cutting position deviation value pcz in the defect data set, and after dimensionless processing, the cutting defect index is generated by the following formula :

[0113]

[0114] Among them, S7 represents the preset barb area threshold for the cutting edge of the circuit board, S8 represents the preset cutting depth threshold for the circuit board, and S9 represents the preset cutting position deviation threshold for the circuit board. , , ,and , , and is the weight, and its specific value is set by the user is the second constant correction coefficient;

[0115] The perforation defect index The method of obtaining is to extract the perforation position deviation value ckpcz, the perforation radius difference kjcz and the aperture edge barb area kjdc in the defect data set, and after dimensionless processing, generate the perforation defect index through the following formula: :

[0116]

[0117] Among them, S10 represents the preset deviation threshold of the circuit board perforation position, S11 represents the preset perforation radius difference threshold of the circuit board, and S12 represents the preset aperture edge barb area threshold of the circuit board. , , ,and , , and is the weight, and its specific value is set by the user is the third constant correction coefficient;

[0118] The welding defect index The acquisition method is to extract the solder overflow area ycmj, the solder position deviation value hjpc, the damaged area ssmj and the number of missing solder joints qssl in the defect data set, and after dimensionless processing, generate the welding defect index through the following formula :

[0119]

[0120] Among them, S13 represents the preset overflow solder area threshold for the circuit board soldering point, S14 represents the preset soldering point position deviation threshold for the circuit board, S15 represents the preset damaged area threshold for the circuit board, and S16 represents the preset soldering point quantity threshold for the circuit board. , , , ,and , , , and is the weight, and its specific value is set by the user is the fourth constant correction coefficient;

[0121] Environmental impact factor The acquisition method is to extract the processing tool temperature wd1, equipment vibration value sbzdz, environmental humidity sdz, electromagnetic interference value dcgr and regional air pressure value qyz from the environmental impact data set; after dimensionless processing, the environmental impact coefficient is generated by the following formula :

[0122]

[0123] Among them, bz1 represents the preset temperature threshold for regional processing tools, bz2 represents the preset vibration threshold for regional processing equipment, bz3 represents the preset threshold for regional environmental humidity, bz4 represents the preset threshold for electromagnetic interference of regional processing equipment, and bz5 represents the preset threshold for regional air pressure. , , , , ,and , , , , and is the weight, and its specific value is set by the user is the fifth constant correction coefficient;

[0124] The correlation unit is used to convert the printing defect index , Cutting defect index , Perforation Defect Index , welding defect index The comprehensive defect assessment index is generated by the following correlation formula :

[0125]

[0126] in, , , , and , , and is the weight, which is adjusted by the user;

[0127] The first evaluation unit is used to calculate the comprehensive defect evaluation index With the first defect threshold Compare and obtain the first evaluation results, including:

[0128] When the comprehensive defect assessment index ≥First defect threshold When , it indicates that the processing quality of the circuit board is unqualified, and it is judged as the first unqualified result;

[0129] When the comprehensive defect assessment index <First defect threshold , indicating that the processing quality of the circuit board is qualified, and is judged as the first qualified result.

[0130] In this embodiment, the printing defect index , Cutting defect index , Perforation Defect Index , welding defect index and environmental impact factor Through the above process, the defects in the circuit board processing can be quickly and accurately evaluated, unqualified products can be found in time, and corresponding measures can be taken to make adjustments to ensure the quality and stability of the circuit board.

[0131] Example 8. This example is an explanation of Example 7. Please refer to Figure 1,Specifically, the data strategy module includes a second hierarchical evaluation unit and a second environmental evaluation unit;

[0132] When the result is determined to be a first unqualified result, the second grading evaluation unit is used to classify the comprehensive defect evaluation index of the first unqualified result as Printing Defect Index in , Cutting defect index , Perforation Defect Index , welding defect index Conduct a first-level assessment strategy, including:

[0133] When the printing defect index ≥First printing threshold , indicating that the circuit board printing process is unqualified; generating the first warning information;

[0134] When the printing defect index <First printing threshold , indicating that the circuit board printing process is qualified;

[0135] When cutting defect index ≥ Second cutting threshold , indicating that the circuit board cutting process is unqualified; generating a second warning message;

[0136] When cutting defect index <Second cutting threshold , indicating that the circuit board cutting process is qualified;

[0137] When the perforation defect index ≥Third perforation threshold , indicating that the circuit board perforation process is unqualified; generating the third warning information;

[0138] When the perforation defect index <Third perforation threshold , indicating that the circuit board perforation process is qualified;

[0139] When the welding defect index ≥ Fourth welding threshold , indicating that the circuit board welding process is unqualified; generating the fourth warning information;

[0140] When the welding defect index <Fourth welding threshold , indicating that the circuit board welding process is qualified;

[0141] The second environmental assessment unit is used to, when the first unqualified result is identified, again set the environmental impact coefficient With the second environmental threshold Compare and obtain the second evaluation result, including:

[0142] When the environmental impact factor ≥ Second environmental threshold When , it indicates that the circuit board processing area environment is unqualified, and a second unqualified result is generated;

[0143] When the environmental impact factor <Second environmental threshold When , it indicates that the circuit board processing area environment is qualified, and a second qualified result is generated.

[0144] In this embodiment, through the work of the second grading assessment unit and the second environmental assessment unit, it is convenient to more comprehensively assess the circuit board processing quality, quickly identify circuit board defects in different processing areas, and generate corresponding early warning information in a timely manner, thereby effectively controlling adverse conditions in the production process and ensuring the quality and stability of the circuit boards.

[0145] Example 9. This example is an explanation of Example 8. Please refer to Figure 1 Specifically, the strategy module further includes a strategy generation unit, which is used to generate a corresponding strategy according to the first warning information, the second warning information, the third warning information, the fourth warning information and the second unqualified result, including:

[0146] Generate a first printing adjustment strategy according to the first warning information, and adjust printing processing parameters, including pressure, speed, temperature, and replacement of equipment or materials;

[0147] Generate a second cutting adjustment strategy based on the second warning information to adjust cutting parameters, including tool edge, speed, depth, and replacement of equipment or materials;

[0148] Generate a third perforation adjustment strategy according to the third perforation information, and adjust perforation processing parameters, including speed, perforation position, pressure, and replacement of equipment or material;

[0149] generating a fourth welding adjustment strategy according to the fourth warning information, adjusting welding process parameters, including temperature, time, pressure, and replacing equipment or materials;

[0150] And generate an environmental adjustment strategy based on the second unqualified result, including: adding ventilation equipment, purifying the air, adding anti-shake equipment, adjusting temperature control equipment and using electromagnetic shielding equipment.

[0151] In this embodiment, by implementing the above strategies, problems arising in the processing process can be promptly dealt with, and the circuit board defect detection situation can be adjusted in a timely manner, thereby ensuring the quality and stability of the circuit board and improving production efficiency and product reliability.

[0152] Example 10, please refer to Figure 2 , a method for rapid detection of circuit board processing defects, comprising the following steps,

[0153] S1. Data collection: Divide the circuit board processing area into several areas and deploy monitoring points in each area to collect defect data and environmental impact data during the processing;

[0154] S2. Data processing and evaluation: Preprocess and dimensionless process the collected defect data set and environmental impact data set, and calculate and analyze the printing defect index , Cutting defect index , Perforation Defect Index , welding defect index and environmental impact factor , and the printing defect index , Cutting defect index , Perforation Defect Index , welding defect index Correlation, construction of comprehensive defect assessment index ;

[0155] S3. Determine whether the processing quality is qualified: the comprehensive defect assessment index With the first defect threshold set Make comparisons to determine whether the processing quality is qualified;

[0156] S4. If the comprehensive defect assessment index ≥First defect threshold , a first unqualified result is generated, and a first grading evaluation strategy is generated through the strategy module;

[0157] If the first unqualified result is identified, the environmental impact factor is again With the second environmental threshold Performing comparison, generating a second evaluation result, and generating a second strategy through a strategy module;

[0158] According to various defect indexes and environmental impact coefficients Generate corresponding adjustment strategies, including printing adjustment strategy, cutting adjustment strategy, perforation adjustment strategy, welding adjustment strategy and environment adjustment strategy.

[0159] In this embodiment, the method is convenient for quickly and accurately detecting defects in the circuit board processing process, and generating corresponding adjustment strategies according to the detection results, which helps to improve product quality, production efficiency and equipment stability.

[0160] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board processing defect rapid detection system, characterized by: It includes data collection module, data evaluation module and strategy module; The data acquisition module is used to divide the circuit board processing area into several areas and deploy several monitoring points in each area to collect defect data and environmental impact data during the processing and build defect data sets and environmental impact data sets; The defect data set includes the following data: component position offset pyl, component spacing difference jjcz, component direction offset angle value pyjdz, printing alignment deviation value dqpc, printing thickness difference hdcz, printing layer peeling area ratio value blblz, cutting edge barb area dcmj, cutting depth qgsd, cutting position deviation value pcz, perforation position deviation value ckpcz, perforation radius difference kjcz, aperture edge barb area kjdc, solder point overflow area ycmj, solder point position deviation value hjpc, solder point damaged area ssmj and solder point missing solder quantity qssl; The environmental impact data set includes the following data: processing tool temperature wd1, equipment vibration value sbzdz, environmental humidity sdz, electromagnetic interference value dcgr and regional air pressure value qyz; The data evaluation module is used to calculate and analyze the defect data set and the environmental impact data set after pre-processing and dimensionless processing to obtain: printing defect index , Cutting defect index , Perforation Defect Index , welding defect index and environmental impact factor , and the printing defect index , Cutting defect index , Perforation Defect Index , welding defect index Correlation, construction of comprehensive defect assessment index ; The data evaluation module includes a calculation unit, an association unit and a first evaluation unit; The calculation unit is used to calculate and analyze the defect data set and the environmental impact data set after pre-processing and dimensionless processing to obtain: printing defect index , Cutting defect index , Perforation Defect Index , welding defect index and environmental impact factor ; The printing defect index The method of obtaining is to extract the component position offset pyl, component spacing difference jjcz, component direction offset angle value pyjdz, printing alignment deviation value dqpc, printing thickness difference hdcz and printing layer peeling area ratio value blblz in the defect data set, and after dimensionless processing, generate the printing defect index through the following formula : Among them, S1 represents the preset offset threshold of the circuit board component position, S2 represents the preset circuit board component spacing difference threshold, S3 represents the preset circuit board component direction offset angle threshold, S4 represents the preset circuit board printing alignment deviation threshold, S5 represents the preset circuit board thickness difference threshold, S6 represents the preset circuit board printed layer peeling area ratio threshold, , , , , , ,and , , , , , and is the weight, and its specific value is set by the user is the first constant correction coefficient; The cutting defect index The method of obtaining is to extract the cutting edge barb area dcmj, cutting depth qgsd and cutting position deviation value pcz in the defect data set, and after dimensionless processing, the cutting defect index is generated by the following formula : Among them, S7 represents the preset barb area threshold for the cutting edge of the circuit board, S8 represents the preset cutting depth threshold for the circuit board, and S9 represents the preset cutting position deviation threshold for the circuit board. , , ,and , , and is the weight, and its specific value is set by the user is the second constant correction coefficient; The perforation defect index The method of obtaining is to extract the perforation position deviation value ckpcz, the perforation radius difference kjcz and the aperture edge barb area kjdc in the defect data set, and after dimensionless processing, generate the perforation defect index through the following formula: : Among them, S10 represents the preset deviation threshold of the circuit board perforation position, S11 represents the preset perforation radius difference threshold of the circuit board, and S12 represents the preset aperture edge barb area threshold of the circuit board. , , ,and , , and is the weight, and its specific value is set by the user is the third constant correction coefficient; The welding defect index The acquisition method is to extract the solder overflow area ycmj, the solder position deviation value hjpc, the damaged area ssmj and the number of missing solder joints qssl in the defect data set, and after dimensionless processing, generate the welding defect index through the following formula : Among them, S13 represents the preset overflow solder area threshold for the circuit board soldering point, S14 represents the preset soldering point position deviation threshold for the circuit board, S15 represents the preset damaged area threshold for the circuit board, and S16 represents the preset soldering point quantity threshold for the circuit board. , , , ,and , , , and is the weight, and its specific value is set by the user is the fourth constant correction coefficient; Environmental impact factor The acquisition method is to extract the processing tool temperature wd1, equipment vibration value sbzdz, environmental humidity sdz, electromagnetic interference value dcgr and regional air pressure value qyz from the environmental impact data set; after dimensionless processing, the environmental impact coefficient is generated by the following formula : Among them, bz1 represents the preset temperature threshold for regional processing tools, bz2 represents the preset vibration threshold for regional processing equipment, bz3 represents the preset threshold for regional environmental humidity, bz4 represents the preset threshold for electromagnetic interference of regional processing equipment, and bz5 represents the preset threshold for regional air pressure. , , , , ,and , , , , and is the weight, and its specific value is set by the user is the fifth constant correction coefficient; The correlation unit is used to convert the printing defect index , Cutting defect index , Perforation Defect Index , welding defect index The comprehensive defect assessment index is generated by the following correlation formula : in, , , , and , , and is the weight, which is adjusted by the user; When the comprehensive defect assessment index Exceeding the first defect threshold , it is determined as a first unqualified result, and a first grading evaluation strategy is generated through a strategy module; When the strategy module identifies the first unqualified result, the environmental impact factor is again With the second environmental threshold Performing comparison to obtain a second evaluation result, and generating an environment adjustment strategy based on the second evaluation result; The first evaluation unit is used to convert the comprehensive defect evaluation index With the first defect threshold Compare and obtain the first evaluation results, including: When the comprehensive defect assessment index ≥First defect threshold When , it indicates that the processing quality of the circuit board is unqualified, and it is judged as the first unqualified result; When the comprehensive defect assessment index <First defect threshold , indicating that the processing quality of the circuit board is qualified, and it is judged as the first qualified result; The data policy module includes a second hierarchical assessment unit and a second environmental assessment unit; When the result is determined to be a first unqualified result, the second grading evaluation unit is used to classify the comprehensive defect evaluation index of the first unqualified result as Printing Defect Index in , Cutting defect index , Perforation Defect Index , welding defect index Conduct a first-level assessment strategy, including: When the printing defect index ≥First printing threshold , indicating that the circuit board printing process is unqualified; generating the first warning information; When the printing defect index <First printing threshold , indicating that the circuit board printing process is qualified; When cutting defect index ≥ Second cutting threshold , indicating that the circuit board cutting process is unqualified; generating a second warning message; When cutting defect index <Second cutting threshold , indicating that the circuit board cutting process is qualified; When the perforation defect index ≥Third perforation threshold , indicating that the circuit board perforation process is unqualified; generating the third warning information; When the perforation defect index <Third perforation threshold , indicating that the circuit board perforation process is qualified; When the welding defect index ≥ Fourth welding threshold , indicating that the circuit board welding process is unqualified; generating the fourth warning information; When the welding defect index <Fourth welding threshold , indicating that the circuit board welding process is qualified; The second environmental assessment unit is used to, when the first unqualified result is identified, again set the environmental impact coefficient With the second environmental threshold Compare and obtain the second evaluation result, including: When the environmental impact factor ≥ Second environmental threshold When , it indicates that the circuit board processing area environment is unqualified, and a second unqualified result is generated; When the environmental impact factor <Second environmental threshold When , it indicates that the circuit board processing area environment is qualified, and the second qualified result is generated; The strategy module further includes a strategy generation unit, which is used to generate a corresponding strategy according to the first warning information, the second warning information, the third warning information, the fourth warning information and the second unqualified result, including: Generate a first printing adjustment strategy according to the first warning information, adjust printing processing parameters, and replace equipment or materials; Generate a second cutting adjustment strategy according to the second warning information, adjust cutting processing parameters, and replace equipment or materials; Generate a third perforation adjustment strategy according to the third perforation information, adjust perforation processing parameters, and replace equipment or materials; generating a fourth welding adjustment strategy according to the fourth warning information, adjusting welding processing parameters, and replacing equipment or materials; And generate an environmental adjustment strategy based on the second unqualified result, including: adding ventilation equipment, purifying the air, adding anti-shake equipment, adjusting temperature control equipment and using electromagnetic shielding equipment.

2. A circuit board processing defect rapid detection system according to claim 1, characterized in that: The data acquisition module includes a processing and printing monitoring unit; The processing printing monitoring unit is used to install a first integrated sensor at a monitoring point in the printing area to collect circuit board printing data, obtain component position offset pyl, component spacing difference jjcz, component direction offset angle value pyjdz, printing alignment deviation value dqpc, printing thickness difference hdcz and printing layer peeling area ratio value blblz; The first integrated sensor includes a visual sensor, an angle sensor and a thickness sensor, which collect the printed image of the circuit board, and use image processing technology to collect the component position, spacing and direction angle during the circuit board printing process through edge detection, feature extraction and pattern recognition; extract the component position contour, calculate the component position offset pyl, component spacing difference jjcz and component direction offset angle value pyjdz between components; extract the printing layer position and contour, calculate the printing alignment deviation value dqpc and the printing layer peeling area ratio value blblz; use the thickness sensor to measure the thickness of the printing area to obtain the printing thickness difference hdcz.

3. A circuit board processing defect rapid detection system according to claim 1, characterized in that: The data acquisition module also includes a cutting monitoring unit, which is used to install a second integrated sensor in the cutting area to collect circuit board cutting data, obtain the cutting edge barb area dcmj, the cutting depth qgsd, and the cutting position deviation value pcz; The second integrated sensor includes a visual sensor, a laser ranging sensor and an optical sensor. The visual sensor is used to collect the circuit board cutting image, and the barb area and barb position of the circuit board cutting edge are extracted to obtain the cutting edge barb area dcmj. The laser ranging sensor is installed on the cutting tool to measure the cutting depth qgsd into the circuit board. The optical sensor is used to measure the deviation value between the cutting position and the preset standard position to obtain the cutting position deviation value pcz.

4. A circuit board processing defect rapid detection system according to claim 1, characterized in that: The data acquisition module also includes a perforation monitoring unit, which is used to install a third integrated sensor at a monitoring point in the perforation area to collect circuit board perforation data, and obtain a perforation position deviation value ckpcz, a perforation radius difference value kjcz, and an aperture edge barb area kjdc; The third integrated sensor includes a visual sensor, a laser ranging sensor and an optical sensor. The visual sensor is used to collect the circuit board perforation image, and the barb area and barb position of the circuit board perforation aperture edge are extracted to obtain the aperture edge barb area kjdc; the optical sensor is used to measure the deviation value between the perforation position and the preset standard position to obtain the perforation position deviation value ckpcz and the perforation radius difference value kjcz.

5. A circuit board processing defect rapid detection system according to claim 1, characterized in that: The data acquisition module also includes a welding monitoring unit, which is used to install a fourth integrated sensor at a monitoring point in the welding area to collect circuit board welding data, obtain the solder overflow area ycmj of the welding point, the position deviation value hjpc of the welding point, the damaged area ssmj of the welding point, and the number of missing welding points qssl; The fourth integrated sensor includes a visual sensor, which captures the circuit board welding image through the visual sensor, and identifies the welding point position and appearance characteristics, including the shape and size characteristics of the protrusions or depressions, and extracts the welding point overflow area characteristics, damaged area characteristics and missing welding point quantity characteristics, and obtains the welding point overflow solder area ycmj, the welding point damaged area ssmj and the welding point missing welding quantity qssl; measures the deviation value between the welding position and the preset standard position through the optical sensor, and obtains the welding point position deviation value hjpc.

6. A circuit board processing defect rapid detection system according to claim 1, characterized in that: The data acquisition module also includes a regional environmental data acquisition unit, which is used to acquire the processing tool temperature wd1, the equipment vibration value sbzdz, the environmental humidity sdz, the electromagnetic interference value dcgr and the regional air pressure value qyz at the acquisition points in several areas; and construct an environmental impact data set; The processing tool temperature wd1 is measured by installing a temperature sensor on the processing tool; the equipment vibration value sbzdz is measured by an acceleration sensor to obtain the vibration frequency and amplitude of the circuit board during the processing; the ambient humidity sdz is measured by a temperature sensor; the electromagnetic interference value dcgr is measured by an electromagnetic field sensor to obtain the electromagnetic field strength; the regional air pressure value qyz is measured by an air pressure sensor.

7. A method for rapid detection of circuit board processing defects, comprising a system for rapid detection of circuit board processing defects according to any one of claims 1 to 6, characterized in that: The following steps are included: S1. Data collection: Divide the circuit board processing area into several areas and deploy monitoring points in each area to collect defect data and environmental impact data during the processing; S2. Data processing and evaluation: Preprocess and dimensionless process the collected defect data set and environmental impact data set, and calculate and analyze the printing defect index , Cutting defect index , Perforation Defect Index , welding defect index and environmental impact factor , and the printing defect index , Cutting defect index , Perforation Defect Index , welding defect index Correlation, construction of comprehensive defect assessment index ; S3. Determine whether the processing quality is qualified: the comprehensive defect assessment index With the first defect threshold set Make comparisons to determine whether the processing quality is qualified; S4. If the comprehensive defect assessment index ≥First defect threshold , a first unqualified result is generated, and a first grading evaluation strategy is generated through the strategy module; If the first unqualified result is identified, the environmental impact factor is again With the second environmental threshold Performing comparison, generating a second evaluation result, and generating a second strategy through a strategy module; According to various defect indexes and environmental impact coefficients Generate corresponding adjustment strategies, including printing adjustment strategy, cutting adjustment strategy, perforation adjustment strategy, welding adjustment strategy and environment adjustment strategy.

Images