Chip mounter head mechanism and chip mounter

Abstract

The application discloses a patch machine welding head mechanism, and relates to the technical field of integrated circuit packaging, which comprises a base, a welding head assembly and a pressure adjusting assembly. The welding head assembly is slidably connected to the base and can move up and down linearly relative to the base. The suction device of the welding head assembly is used for sucking a chip and pasting the chip on a to-be-pasted part. The pressure adjusting assembly comprises an elastic assembly. One end of the elastic assembly abuts against the inside of the base, and the other end abuts against the welding head assembly. The application also provides a patch machine comprising the patch machine welding head mechanism. The position of the elastic assembly can change the compression amount of the elastic assembly, thereby adjusting the pressure of the pressure adjusting assembly on the welding head assembly. By replacing the elastic assembly, the elastic coefficient can be changed to provide greater pressure, so that the pressure adjusting range is larger when pasting, and the cost can be saved. Compared with a rigid assembly, the elastic assembly can also buffer the pasting, and can protect the chip from being damaged to a certain extent.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of integrated circuit packaging technology, in particular to a soldering head mechanism of a chip mounter and the chip mounter. BACKGROUND

[0002] The soldering head mechanism is a commonly used and very important mechanism on the chip mounter device, and is a key mechanism for executing the chip mounting process. During production, the soldering head mechanism picks up a chip or a CLIP piece, etc., and after angle compensation through visual information, the chip or the CLIP piece is mounted on a chip substrate. The existing soldering head mechanism can realize adjustable mounting pressure, but most of the existing soldering head mechanisms use a motor for pressure adjustment. Due to the reasons of space, device bearing capacity and operation convenience, the weight and volume of the motor cannot be too large, and the use of a smaller motor makes the range of adjusting the mounting pressure smaller, which cannot meet the demand of large pressure mounting. At the same time, the use of the motor has a high cost. Therefore, there is an urgent need for a soldering head mechanism of a chip mounter and the chip mounter, which can have a large range of pressure adjustment for mounting and can save costs. SUMMARY

[0003] The purpose of the present application is to provide a soldering head mechanism of a chip mounter and the chip mounter to solve the problems existing in the prior art, so that the range of pressure adjustment for mounting is larger when the chip mounter is used, and costs can be saved.

[0004] To achieve the above-mentioned purpose, the present application provides the following solutions.

[0005] The present application provides a soldering head mechanism of a chip mounter, comprising

[0006] a base;

[0007] a soldering head assembly, which is slidingly connected to the base and can move up and down linearly relative to the base, the soldering head assembly comprising a suction device for sucking a chip and mounting the chip on a to-be-mounted piece;

[0008] a pressure adjusting assembly, which comprises an elastic assembly, one end of the elastic assembly abutting against the inside of the base, and the other end abutting against the soldering head assembly, the elastic assembly being capable of being compressed when the soldering head assembly moves upward, the elastic assembly being capable of providing pressure to the soldering head assembly and adjusting the pressure.

[0009] Preferably, the device further comprises a driving device provided on the base for driving the soldering head assembly to rotate.

[0010] Preferably, the device further comprises a transmission mechanism, the driving device being connected to the soldering head assembly through the transmission mechanism and capable of driving the soldering head assembly to rotate.

[0011] Preferably, a central shaft is further included, the driving device is connected with the central shaft through the transmission mechanism, the central shaft is rotatably connected with the base through a bearing, and the pressure adjusting assembly is arranged inside the central shaft.

[0012] Preferably, the transmission mechanism comprises a first synchronous pulley, a second synchronous pulley and a synchronous belt, the first synchronous pulley is connected with the second synchronous pulley through the synchronous belt, the first synchronous pulley is fixedly connected with one end of the central shaft, and the second synchronous pulley is connected with the driving device.

[0013] Preferably, the elastic assembly comprises a compression nut and a spring, the compression nut is externally screwed into the central shaft, one end of the spring is abutted against the compression nut, and the other end of the spring is abutted against the welding head assembly, the compression amount of the spring can be adjusted by screwing the compression nut, so that the pressure of the pressure adjusting assembly on the welding head assembly is adjusted.

[0014] Preferably, the elastic assembly further comprises a lock nut, the lock nut is externally screwed into the central shaft and is located above the compression nut, and the lock nut is used for preventing the compression nut from slipping off.

[0015] Preferably, a height touch sensor and an angle origin sensor are further included, the angle origin sensor comprises a reference plate and a measuring head, the reference plate is fixedly arranged on the central shaft, the measuring head is fixedly arranged on the base, the angle origin sensor is used for detecting the rotation angle of the welding head assembly, the height touch sensor comprises a first touch sensor and a second touch sensor, the first touch sensor is arranged on the central shaft and is fixedly connected, the second touch sensor is arranged on the welding head assembly and is fixedly connected, and when the first touch sensor and the second touch sensor are separated, the pressure provided by the pressure adjusting assembly to the welding head assembly reaches a preset value.

[0016] Preferably, the welding head assembly further comprises a spline shaft, the spline shaft comprises an inner shaft and an outer shaft, the outer shaft is slidably sleeved on the inner shaft, the outer shaft is fixedly connected with the central shaft, one end of the inner shaft is fixedly connected with the second touch sensor through a screw, the spring is abutted against the second touch sensor, and the other end of the inner shaft is fixedly connected with the suction device.

[0017] The application further provides a chip mounter comprising the chip mounter welding head mechanism.

[0018] The application has the following technical effects relative to the prior art:

[0019] The welding head assembly of the present application is slidingly connected to the base and can move up and down linearly relative to the base. The welding head assembly comprises a suction device for sucking the chip and sticking the chip to the to-be-stuck part. The pressure adjusting assembly comprises an elastic assembly, one end of which abuts against the inside of the base and the other end of which abuts against the welding head assembly. When the welding head assembly moves upward, the elastic assembly can be compressed, and the elastic assembly can provide pressure to the welding head assembly and the pressure can be adjusted. Specifically, the compression amount of the elastic assembly can be changed by adjusting the position of the elastic assembly, thereby adjusting the pressure provided by the pressure adjusting assembly to the welding head assembly. Moreover, different elastic assemblies with different elastic coefficients can be replaced to provide greater pressure, so that the pressure adjusting range of the chip mounter is larger when sticking the chip, and the cost can be saved. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort.

[0021] Fig. 1 is a sectional view of the welding head mechanism of the chip mounter in the embodiment of the present application;

[0022] Fig. 2 is a sectional view of the welding head mechanism of the chip mounter in the embodiment of the present application;

[0023] Fig. 3 is a sectional view of the welding head mechanism of the chip mounter in the embodiment of the present application;

[0024] In the drawings: 100-welding head assembly; 200-pressure adjusting assembly; 300-transmission mechanism; 400-driving device; 1-base; 2-motor; 3-center shaft; 4-first synchronous pulley; 5-pressing cap; 6-bearing; 7-angle origin sensor; 71-measuring head; 72-reference plate; 8-lock nut; 9-pressing nut; 10-spring; 11-screw; 12-contact sensor seat; 13-fluted shaft; 131-outer shaft; 132-inner shaft; 14-suction device; 15-second synchronous pulley; 17-height contact sensor; 171-first contact sensor; 172-second contact sensor. DETAILED DESCRIPTION

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] The purpose of this invention is to provide a pick-and-place machine soldering head mechanism and a pick-and-place machine to solve the problems existing in the prior art, so that the pressure adjustment range during pick-and-place is larger and the cost can be saved.

[0027] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0028] Example 1

[0029] like Figs. 1-3 As shown, the present invention provides a pick-and-place machine soldering head mechanism, including a base 1, a soldering head assembly 100, and a pressure regulating assembly 200. The soldering head assembly 100 is slidably connected to the base 1 and can move linearly up and down relative to the base 1. The soldering head assembly 100 includes a suction device 14, which is used to pick up a chip and place the chip onto the workpiece to be placed. The pressure regulating assembly 200 includes an elastic component, one end of which abuts against the interior of the base 1, and the other end of which abuts against the soldering head assembly 100. When the soldering head assembly 100 moves upward, it can compress the elastic component. The elastic component can provide pressure to the soldering head assembly 100 and can adjust the pressure. Adjusting the position of the elastic component can change the amount of compression of the elastic component, thereby adjusting the pressure of the pressure regulating assembly 200 on the soldering head assembly 100. Furthermore, by replacing the elastic component, changing the elastic coefficient of the elastic component can provide greater pressure, making the pressure adjustment range during pick-and-place machine placement larger and saving costs. Moreover, compared with rigid components, the elastic component can also buffer the placement, which can protect the chip from damage to a certain extent.

[0030] Taking the CLIP sheet bonding process as an example, during the process of the pick-up device 14 picking up the sheet, when the CLIP punching mechanism punches the CLIP sheet, the pick-up device 14 has already contacted or approached the CLIP sheet. At this time, the pressure regulating component 200 in the bonding head mechanism of the pick-and-place machine can effectively buffer the punching force of the CLIP punching mechanism, thereby protecting the product and its own structure.

[0031] In this embodiment, the pick-and-place machine welding head mechanism also includes a drive device 400, which is fixedly mounted on the base 1 and used to drive the welding head assembly 100 to rotate. The drive device 400 is fixedly connected to the base, which can be a bolt connection or welding, etc.

[0032] In the embodiment, the patch machine welding head mechanism further comprises a transmission mechanism 300, the driving device 400 is connected with the welding head assembly 100 through the transmission mechanism 300, and the welding head assembly 100 can be driven to rotate. The driving device 400 is preferably a motor 2, the output shaft of the motor 2 is connected with the transmission mechanism 300, the transmission mechanism 300 drives the welding head assembly 100 to rotate, the rotation of the welding head assembly 100 around the vertical axis thereof is realized, the patch angle is adjustable, and the patch is more accurate.

[0033] In the embodiment, the base 1 of the patch machine welding head mechanism further comprises a central shaft 3, the driving device 400 is connected with the central shaft 3 through the transmission mechanism 300, the central shaft 3 is rotationally connected with the base body of the base 1 through a bearing 6, the pressure adjusting assembly 200 is arranged in the central shaft 3, a gland 5 is arranged above the bearing 6, the gland 5 is used to limit the displacement of the bearing 6, the transmission mechanism 300 drives the central shaft 3 to rotate, the central shaft 3 rotates relative to the base 1 through the bearing 6, and the pressure adjusting assembly 200 arranged in the central shaft 3 is driven to rotate, and finally the welding head assembly 100 is driven to rotate, so that the patch angle is adjustable.

[0034] In the embodiment, the transmission mechanism 300 comprises a first synchronous pulley 4, a second synchronous pulley 15 and a synchronous belt, the first synchronous pulley 4 and the second synchronous pulley 15 are connected through the synchronous belt, the first synchronous pulley 4 is fixedly connected with one end of the central shaft 3 in the same axis, the second synchronous pulley 15 is fixedly connected with the output shaft of the motor 2 in the same axis, the first synchronous pulley 4 is driven to rotate through the synchronous belt, and then the central shaft 3 is driven to rotate by the first synchronous pulley 4.

[0035] In the embodiment, the elastic assembly comprises a compression nut 9 and a spring 10, the compression nut 9 is externally threadedly connected in the central shaft 3, one end of the spring 10 abuts against the compression nut 9, and the other end abuts against the welding head assembly 100. By screwing the compression nut 9, the compression amount of the spring 10 can be adjusted, and then the pressure of the pressure adjusting assembly 200 on the welding head assembly 100 is adjusted. When the compression nut 9 is screwed towards the welding head assembly 100, the compression amount of the spring 10 becomes larger, and a larger patch pressure can be provided. Conversely, when the compression nut 9 is screwed away from the welding head assembly 100, the spring 10 relaxes, the compression amount becomes smaller, and a smaller patch pressure is provided. By adjusting the position of the compression nut 9, the compression amount of the spring 10 is controlled, and then the adjustment of the patch pressure is realized.

[0036] In the embodiment, the elastic assembly further comprises a lock nut 8 which is externally threaded on the central shaft 3 and is located above the compression nut 9, the lock nut 8 is used to prevent the compression nut 9 from slipping off, the bottom end of the lock nut 8 is in abutment with the top end of the compression nut 9, when the compression nut 9 fails to be threadedly connected with the central shaft, the lock nut 8 plays a role in resisting the compression nut 9, preventing the compression nut 9 from slipping off in the direction away from the welding head assembly 100, the arrangement of the lock nut 8 and the compression nut 9 provides double protection for the patch pressure, and at the same time, the lock nut 8 can prevent the compression nut 9 from loosening under vibration conditions, and the lock nut 8 is used to abut against the compression nut 9, thereby forming a double-nut anti-loosening structure.

[0037] In the embodiment, the patch machine welding head mechanism further comprises a height touch sensor 17 and an angle origin sensor 7, the angle origin sensor 7 comprises a reference plate 72 and a measuring head 71, the reference plate 72 is fixedly arranged on the central shaft 3, the measuring head 71 is fixedly arranged on the base 1, and the angle origin sensor 7 is used to detect the rotation angle of the welding head assembly 100; the height touch sensor 17 comprises a first touch sensor 171 and a second touch sensor 172, the first touch sensor 171 is arranged on the central shaft 3 and is fixedly connected, the second touch sensor 172 is arranged on the welding head assembly 100 and is fixedly connected, preferably, the second touch sensor 172 is fixedly arranged on the welding head assembly 100 through the touch sensor seat 12, the first touch sensor 171 and the second touch sensor 172 cooperate with each other and are used to monitor the pressure provided by the pressure adjusting assembly 200 to the welding head assembly 100. Specifically, in the embodiment, the reference plate 72 moves in the space mapped by the measuring head 71, the measuring head 71 can accurately measure the rotation angle of the welding head assembly 100 through the movement of the reference plate 72 in the mapped space, and then accurate patching is realized; in the initial state, the first touch sensor 171 and the second touch sensor 172 are in contact, when patching, the spring 10 is compressed, the welding head assembly 100 moves upward relative to the central shaft 3, and when the first touch sensor 171 and the second touch sensor 172 are separated, it indicates that the pressure has reached the pre-set value, thereby ensuring firm patching.

[0038] In the embodiment, the welding head assembly 100 further comprises a spline shaft 13, the spline shaft 13 comprises an inner shaft 132 and an outer shaft 131, the outer shaft 131 is slidably sleeved on the inner shaft 132, and the outer shaft 131 is fixedly connected with the central shaft 3 through splines, which can be welding or bolt connection, preferably bolt connection for easy disassembly, one end of the inner shaft 132 is fixedly connected with the second touch sensor 172 through a screw 11, and the spring 10 abuts against the second touch sensor 172, and the other end of the inner shaft 132 is fixedly connected with the suction device 14.

[0039] The working process of the patch machine welding head mechanism is as follows:

[0040] When the rotation angle is adjusted: the suction device 14 first sucks up the chip, the vision system has identified the angle deviation of the chip carrier required to be pasted in advance, the motor 2 drives the second synchronous pulley 15 to rotate, the second synchronous pulley 15 drives the first synchronous pulley 4 and the central shaft 3 to rotate through the synchronous belt, so as to rotate the suction device 14, adjust the angle of the chip on the suction device 14 to be consistent with the angle of the carrier, and play a role of compensating the angle deviation of the pasted chip.

[0041] When the pressure is adjusted: the central shaft 3 is provided as a hollow internal thread structure, the spring 10 is placed in the center of the central shaft 3, the compression nut 9 is provided as an external thread structure, the lower end of the spring 10 is pressed against the inner shaft 132 of the spline shaft 13 through the contact sensor base 12, the suction device 14 is fixedly connected to the inner shaft 132, and then the suction device 14 presses the device required to be pasted together with the sucked chip, realizes the compression of the pasted chip, the upper end of the spring 10 is compressed by the compression nut 9, by adjusting the position of the compression nut 9, the compression amount of the spring 10 can be adjusted, and then the spring force of the spring 10, that is, the pressure applied to the spline shaft 13, can be adjusted. At the same time, by replacing the spring 10 with different elastic coefficients, the purpose of adjusting other set pressure values can be achieved.

[0042] Example two

[0043] The application further provides a chip pasting machine comprising the chip pasting machine welding head mechanism.

[0044] The principles and implementation manners of the application are described by using specific examples in the application, and the above examples are only used to help understand the method and core idea of the application; meanwhile, for those skilled in the art, according to the idea of the application, the specific implementation manners and application ranges will be changed. In conclusion, the content of the specification should not be understood as a limitation of the application.

Claims

1. A patching machine head mechanism, characterized by: The base; The welding head assembly is slidably connected to the base and can move up and down linearly relative to the base. The welding head assembly comprises a suction device for sucking a chip and sticking the chip to a to-be-stuck member; The pressure adjusting assembly comprises a resilient assembly. One end of the resilient assembly abuts against the inside of the base, and the other end abuts against the welding head assembly. When the welding head assembly moves upward, the resilient assembly can be compressed. The resilient assembly can provide pressure to the welding head assembly and the pressure can be adjusted; The driving device is arranged on the base and is used for driving the welding head assembly to rotate; The driving device is connected with the welding head assembly through the transmission mechanism and can drive the welding head assembly to rotate; The driving device is connected with the center shaft through the transmission mechanism. The center shaft is rotatably connected with the base through a bearing. The pressure adjusting assembly is arranged in the inside of the center shaft. The transmission mechanism comprises a first synchronous pulley, a second synchronous pulley and a synchronous belt. The first synchronous pulley and the second synchronous pulley are connected through the synchronous belt. The first synchronous pulley is fixedly connected with one end of the center shaft. The second synchronous pulley is connected with the driving device.

2. The patch bonder head mechanism of claim 1, wherein: The resilient assembly comprises a compression nut and a spring. The compression nut is externally screwed in the center shaft. One end of the spring abuts against the compression nut, and the other end abuts against the welding head assembly. By screwing the compression nut, the compression amount of the spring can be adjusted, and then the pressure provided by the pressure adjusting assembly to the welding head assembly can be adjusted.

3. The patch bonder head mechanism of claim 1, wherein: The resilient assembly further comprises a lock nut. The lock nut is externally screwed in the center shaft and is located above the compression nut. The lock nut is used for preventing the compression nut from slipping off.

4. The patch bonder head mechanism of claim 3, wherein: Further comprising a height touch sensor and an angle origin sensor. The angle origin sensor comprises a reference plate and a measuring head. The reference plate is fixedly arranged on the center shaft. The measuring head is fixedly arranged on the base. The angle origin sensor is used for detecting the rotation angle of the welding head assembly. The height touch sensor comprises a first touch sensor and a second touch sensor. The first touch sensor is arranged on the center shaft and is fixedly connected. The second touch sensor is arranged on the welding head assembly and is fixedly connected. When the first touch sensor and the second touch sensor are separated, the pressure provided by the pressure adjusting assembly to the welding head assembly reaches a preset value.

5. The patch bonder head mechanism of claim 3, wherein: The welding head assembly further comprises a spline shaft. The spline shaft comprises an inner shaft and an outer shaft. The outer shaft is slidably sleeved on the inner shaft. The outer shaft is fixedly connected with the center shaft. One end of the inner shaft is fixedly connected with the second touch sensor through a screw. The spring abuts against the second touch sensor. The other end of the inner shaft is fixedly connected with the suction device.

6. The patch bonder head mechanism of claim 5, wherein: The patching machine welding head mechanism comprises any one of claims 1-6.

7. A pick-and-place machine characterized by: ​

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