A highly efficient and automated semiconductor drying equipment

Abstract

The present application discloses a highly efficient and automated semiconductor spin-drying device, and relates to the technical field of semiconductor manufacturing equipment. The present application optimizes and improves the structure of the automatic wafer spin-drying device in the prior art, uses a groove on the upper surface of a rotating disk to limit the wafer frame, applies pressure on the wafer frame in coordination with the centrifugal force exerted on the wafer frame to fix the wafer frame; uses a transfer cart to transfer the wafer frame; and achieves the technical effect that the highly efficient and automated semiconductor spin-drying device has a relatively simple structure, is easy to maintain, and has reliable operation.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor manufacturing equipment, and in particular to a high-efficiency automatic semiconductor drying device. Background Art

[0002] A wafer refers to the silicon chip used to make silicon semiconductor integrated circuits. It is called a wafer because of its round shape.

[0003] Silicon wafers can be processed into various circuit element structures to become electronic components with specific electrical functions. As the size of integrated circuits on semiconductor wafers develops toward the micron level, the cleaning requirements during the semiconductor wafer manufacturing process are becoming increasingly higher. In particular, if semiconductor wafers are contaminated by dust particles or metals during the manufacturing process, it is easy to damage the circuit functions within the wafer, resulting in short circuits or open circuits, which in turn leads to the failure of the integrated circuit and affects the formation of geometric features. Therefore, in addition to eliminating external pollution sources during the manufacturing process, cleaning work is also required to effectively use chemical solutions or gases to remove impurities such as dust, metal ions, and organic matter remaining on the wafer without destroying the surface characteristics and electrical characteristics of the wafer.

[0004] The wet cleaning process is a more commonly used cleaning process for wafers. After the cleaning process is completed, the wafer needs to be dried. The wafer dryer is used to dry the surface of the wet wafer by rotating and drying.

[0005] In the prior art, the placement process of wafers in the spin-drying process is mostly done manually, and the wafer frame is heavy, inconvenient to carry and labor-intensive. In response to the above problems, a Chinese invention patent with patent number CN115355680B discloses an automatic wafer spin-drying device, which uses related automation equipment to assist manual wafer loading and unloading operations, thereby reducing labor intensity and improving operating efficiency to a certain extent. However, its structure is relatively complex, maintenance is difficult, and the large number of linked components in the operation process results in a relatively high failure rate, which is not conducive to the conduct and promotion of on-site operations.

[0006] Therefore, there is a need for an efficient and automated semiconductor drying device with a relatively simple structure, convenient maintenance and reliable operation. Summary of the invention

[0007] The embodiments of the present application solve the technical problems of complex structure and difficult maintenance of automatic wafer drying devices in the prior art by providing an efficient and automated semiconductor drying device, thereby achieving the technical effect that the efficient and automated semiconductor drying device has a relatively simple structure, convenient maintenance and reliable operation.

[0008] The embodiment of the present application provides a highly efficient and automated semiconductor drying device, including a base, a rotating disk, a wafer frame, a downward pressure limit assembly, a clamping and shifting assembly, and a conveyor belt assembly;

[0009] The rotating disk is arranged horizontally, rotates around its own axis and is connected to the base, and three or more limit positioning grooves are arranged at equal intervals on the upper surface. The limit positioning grooves are long strips as a whole, arranged close to the edge of the rotating disk, and are equally spaced from each other. The length direction is perpendicular to the axis of the rotating disk and matches the bottom convex block.

[0010] The bottom of the limit positioning groove is a plane, and the opening faces upward;

[0011] The wafer frame is a rectangular block frame, and a rectangular block bottom convex block is fixed on the bottom surface;

[0012] The downward pressure limiting assembly is used to further limit the displacement of the wafer frame during the spin-drying process by applying pressure on the top of the wafer frame. The main body is a combination of a rod body and a plate body, which is fixed on the top of the rotating disk;

[0013] The clamping and shifting assembly is used to transfer the conveyor belt assembly and the wafer frame on the rotating disk back and forth, and the main body is a mobile trolley with a clamp;

[0014] The conveyor belt assembly is positioned on the ground and is used to convey the wafer frame. Insertion grooves for inserting bottom protrusions are arranged at equal intervals on the conveyor belt of the conveyor belt assembly.

[0015] Furthermore, the portion of the limit positioning groove closest to the center of the rotating disk is the insertion portion, the portion closest to the edge of the rotating disk is the stopping portion, and the middle portion is the guiding portion;

[0016] The inserting portion is used to insert the bottom protrusion located at the bottom of the wafer frame, and the bottom of the groove of this portion is semicircular;

[0017] The guide portion is used to guide the bottom protrusion to move horizontally and limit the moving direction of the bottom protrusion, and the groove bottom of this portion is an isosceles trapezoid;

[0018] The stopper is used to limit the movement of the bottom protrusion, and the shape of the bottom of this part of the groove is rectangular and has the same shape as the bottom surface of the bottom protrusion;

[0019] After the bottom protrusion slides to the stopper, it contacts and fits the inner wall of the groove of the stopper. At this time, if the bottom protrusion is subjected to a horizontal force, it can only move toward the guide part.

[0020] Further, the downward pressure limiting assembly includes a center rod, a downward pressure plate and a downward pressure rod;

[0021] The central rod is a telescopic rod that is telescopic under the control of the control unit, is arranged longitudinally, is coaxial with the rotating disk, and has a bottom fixed on the rotating disk;

[0022] The lower pressure plate is a hard plate body, which is horizontally arranged and fixed on the top of the center rod to play the role of guiding force;

[0023] The lower pressure rod is a hard rod body arranged longitudinally, and the top is fixed at a position close to the edge of the bottom of the lower pressure plate;

[0024] The pressing rod corresponds to the limiting positioning groove one by one and is located directly above the limiting positioning groove; before loading the wafer frame, the central rod is controlled to extend so that the pressing rod moves upward;

[0025] After all the bottom protrusions move to the stopper portion of the limit positioning groove, the central rod is controlled to contract, so that the pressing rod contacts and squeezes the wafer frame to fix it.

[0026] Further, the clamping and shifting assembly includes a guide rail fixed on the ground, a base that moves along the guide rail under the cooperation of the control unit and the power assembly, a rotating guide rail column, a bearing frame and a floating clamping plate;

[0027] The guide rail is located between the base and the conveyor belt assembly; the base plays the role of bearing and supporting the rotating guide rail column; the rotating guide rail column is a hard column, the bottom of which is positioned on the top of the base, and is connected to the base around its own axis under the control of the control unit, so as to support the bearing frame and guide the movement of the bearing frame; the bearing frame is a U-shaped hard frame, which is slidably positioned on the rotating guide rail column, and slides along the height direction of the rotating guide rail column under the coordinated cooperation of the control unit and the power assembly; the floating clamping plates exist in pairs, which are symmetrical and used in combination, fixed on two opposite surfaces of the bearing frame, cooperate with each other and form a clamp structure with the bearing frame for clamping and fixing the wafer frame.

[0028] Furthermore, a sliding groove is provided on the supporting frame, and a sliding block is positioned in the sliding groove; the floating clamping plate is positioned on the sliding block; the sliding groove is a transversely arranged straight groove, and is positioned on the opposite surface of the supporting frame; the sliding block is slidably positioned in the sliding groove, and compression springs are provided at both ends, one end of the compression spring abuts against the sliding block, and the other end abuts against the inner wall of the sliding groove at the end. During the sliding process of the sliding block, it is necessary to overcome the elastic force of the compression spring to slide.

[0029] Furthermore, three groups of sliding blocks are provided on the supporting frame of the clamping and shifting assembly; the sliding blocks are in a group of two; compression springs are provided between the sliding blocks and between the sliding blocks and the ends of the sliding grooves; during the sliding process of the sliding blocks, it is necessary to overcome the elastic force of the compression springs to slide; after the clamping and shifting assembly clamps three wafer frames on the conveyor belt assembly, it moves to the rotating disk for placement and fixation; when the clamping and shifting assembly clamps multiple wafer frames, the heights of the wafer frames on the supporting frame are different.

[0030] Preferably, it also includes a storage bucket;

[0031] The storage barrel is a round barrel with an open top, buried in the ground;

[0032] A lifting assembly is provided on the inner bottom of the storage barrel;

[0033] The bottom of the base is fixed to the top of the lifting assembly;

[0034] There are multiple rotating disks, all of which are horizontally arranged in a row with equal spacing between them, and the rotating disk at the bottom is positioned on the base;

[0035] The rotating disks are fixed together by connecting rods;

[0036] A through hole is provided on the rotating disk near the edge;

[0037] The downward pressure limiting assembly comprises a center rod, a downward pressure plate and a downward pressure rod;

[0038] The central rod is a telescopic rod structure, fixed on the top surface of the topmost rotating disk; the lower pressure plate is fixed on the top of the central rod;

[0039] The down-pressing rods are long hard rods arranged longitudinally, each of which penetrates all through holes in a row; a top block for limiting a floating compression spring is fixed on the top of the down-pressing rod; the floating compression spring is a compression spring, which corresponds to the down-pressing rod one by one and is sleeved on the down-pressing rod;

[0040] When the center rod contracts, all the downward pressure rods are pressed downward;

[0041] When the center rod is extended, the downward pressure rod moves upward due to the elastic force;

[0042] A resisting fixing plate is fixed on the lower pressure rod; the resisting fixing plate is a rubber plate, which is horizontally arranged, corresponds to the limit positioning grooves one by one, and is fixed on one or multiple lower pressure rods at the same time;

[0043] As the pressing rod moves downward, the fixing plate abuts against the wafer frame to fix the wafer frame.

[0044] Preferably, it also includes an annular sheet body and a pump air component;

[0045] When the lifting assembly is retracted to the limit, the lower pressure plate is located in the space surrounded by the storage barrel;

[0046] The annular sheet is an annular sheet made of elastic rubber material, there are multiple of them, the edges of which are fixed on the inner wall of the storage barrel and arranged in a row, the width of which is 5 to 10 cm less than the spacing between the rotating disks, and the spacing between each other is less than 10 cm;

[0047] After the annular sheet is fixed, it forms a plurality of annular spaces together with the inner wall of the storage barrel; the pump gas assembly controls the amount of gas in the space enclosed by each annular sheet under the control of the control unit, thereby controlling the expansion and contraction of the annular sheet.

[0048] Preferably, it also includes an outer covering sheet and a pump liquid component;

[0049] The outer covering sheet is an annular sheet made of elastic rubber material, corresponding to the annular sheet one by one, with the edge fixed on the edge of the annular sheet and arranged in a row;

[0050] The outer covering sheet is provided with one or more rows of injection holes, and the injection holes are through holes; the outer covering sheet and the annular sheet together form an annular space;

[0051] The pump liquid assembly is connected to the space enclosed by the outer sheet body and the annular sheet body; when the pump liquid assembly is in operation, cleaning liquid is injected into the space enclosed by the outer sheet body and the annular sheet body; the cleaning liquid is sprayed out from the spray hole to rinse and clean, and the water injection operation is completed at the same time.

[0052] Preferably, it also includes a rotating table and a force application disk;

[0053] The bottom of the inserting part and the guide part of the limit positioning groove is provided with a loading hole, which is a through hole for installing the rotating table;

[0054] The rotating table is cylindrical, with a flat top surface, inserted into and installed in the loading hole, and a bearing is provided between the loading hole;

[0055] The top surface of the rotating table is coplanar with the bottom of the limiting positioning groove;

[0056] The top surface diameter of the rotating table is larger than the circumscribed circle diameter of the bottom surface of the bottom protrusion; the force applying disk is in the shape of a disk, arranged horizontally, fixed at the bottom of the rotating table and coaxial with the rotating table, and exposed from the edge of the rotating disk.

[0057] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0058] By optimizing and improving the structure of the automatic wafer drying device in the prior art, the wafer frame is limited by a groove on the upper surface of a rotating disk, and the wafer frame is fixed by applying pressure on the wafer frame in coordination with the centrifugal force exerted on the wafer frame; the wafer frame is transported by a transfer cart; the technical problems of the automatic wafer drying device in the prior art being complex in structure and difficult to maintain are effectively solved, thereby achieving the technical effect of a highly efficient automated semiconductor drying equipment with a relatively simple structure, convenient maintenance and reliable operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] Figure 1This is a schematic diagram of the overall structure of the efficient and automated semiconductor drying equipment;

[0060] Figure 2 is a schematic diagram of the structure of the rotating disk;

[0061] Figure 3 It is a structural schematic diagram of a round wafer frame;

[0062] Figure 4 is a structural schematic diagram of a bearing frame;

[0063] Figure 5 A schematic diagram of the positional relationship among the bearing frame, the sliding groove and the sliding block;

[0064] Figure 6 This is a schematic diagram of the clamping and shifting assembly clamping the wafer frame;

[0065] Figure 7 A schematic diagram of the positional relationship between the storage bucket and the efficient automated semiconductor drying equipment;

[0066] Figure 8 It is a schematic diagram of the positional relationship between the lifting assembly and the base;

[0067] Fig. 9 The figure is a schematic diagram of the layout relationship of the reinforcement frame;

[0068] Fig.10 This is a schematic diagram of the appearance of a storage bucket;

[0069] Fig.11 This is a simplified diagram of the internal structure of the storage bucket;

[0070] Fig.12 It is a schematic diagram of the positional relationship between the annular sheet body and the outer covering sheet body;

[0071] Fig.13 It is a schematic diagram of the positional relationship among the force-applying disk, the rotating platform and the rotating disk;

[0072] Fig.14 This is a schematic diagram of the internal structure of the rotating disk.

[0073] In the figure:

[0074] Ground 001, base 100, rotating disk 200, limiting positioning groove 210, placing portion 211, guiding portion 212, stopping portion 213, connecting rod 220, through hole 230, loading hole 240, rotating table 250, force plate 260, wafer frame 300, bottom protrusion 310, center rod 410, lower pressure plate 420, lower pressure rod 430, top block 431, floating compression spring 432, abutting fixing plate 433, conveyor belt assembly 5 00, insertion slot 510, guide rail 610, base 620, rotating guide rail column 630, bearing frame 640, sliding slot 641, sliding block 642, floating clamping plate 650, storage bucket 700, lifting and lifting assembly 710, reinforcement frame 720, top cross bar 721, cross bar lifting body 722, top connecting rod 723, annular sheet body 730, outer covering sheet body 740, injection hole 741, pump air assembly 750, pump liquid assembly 760. DETAILED DESCRIPTION

[0075] To facilitate the understanding of the present invention, the present application will be described more comprehensively below with reference to the relevant drawings; the drawings show preferred embodiments of the present invention, but the present invention can be implemented in many different forms and is not limited to the embodiments described herein; on the contrary, the purpose of providing these embodiments is to enable a more thorough and comprehensive understanding of the disclosed content of the present invention.

[0076] It should be noted that the terms “vertical”, “horizontal”, “up”, “down”, “left”, “right” and similar expressions used in this document are only for illustrative purposes and do not represent the only implementation method.

[0077] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which the present invention belongs; the terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention; the term "and / or" used herein includes any and all combinations of one or more related listed items.

[0078] Embodiment 1

[0079] like Figure 1 As shown, the high-efficiency automated semiconductor spin-drying equipment of the present application includes a base 100, a rotating disk 200, a wafer frame 300, a downward pressure limit assembly, a clamping and shifting assembly, a conveyor belt assembly 500, a power assembly and a control unit.

[0080] The base 100 has a built-in motor, which serves to carry and position the rotating disk 200 and drive it to rotate.

[0081] The rotating disk 200 is a hard circular plate with a flat top surface, which is horizontally arranged, rotates around its own axis and is connected to the base 100, and is located on the top of the base 100;

[0082] like Figure 2 As shown, the upper surface of the rotating disk 200 is provided with three or more limiting positioning grooves 210 at equal intervals. The limiting positioning grooves 210 are in the shape of long strips as a whole, are provided near the edge of the rotating disk 200, are equally spaced from each other, and the length direction is perpendicular to the axis of the rotating disk 200; the center of gravity of the rotating disk 200 is located on its own axis;

[0083] The bottom of the limiting positioning groove 210 is a plane with an opening facing upward. The portion close to the center of the rotating disk 200 is larger, and the portion away from the center of the rotating disk 200 is smaller. For the convenience of description, the portion of the limiting positioning groove 210 closest to the center of the rotating disk 200 is defined as the insertion portion 211, the portion closest to the edge of the rotating disk 200 is defined as the stopper portion 213, and the middle portion is defined as the guide portion 212. The insertion portion 211 is used to insert the bottom protrusion 310 located at the bottom of the wafer frame 300. The groove of this portion The bottom is semicircular; the guiding portion 212 is used to guide the horizontal movement of the bottom protrusion 310 and limit the moving direction of the bottom protrusion 310, and the bottom of this part of the groove is an isosceles trapezoid; the stopping portion 213 is used to limit the movement of the bottom protrusion 310, and the shape of this part of the groove bottom is rectangular and has the same shape as the bottom surface of the bottom protrusion 310; after the bottom protrusion 310 slides to the stopping portion 213, it contacts and fits the inner wall of the groove of the stopping portion 213. At this time, if the bottom protrusion 310 is subjected to horizontal force, it can only move toward the guiding portion 212.

[0084] like Figure 3 As shown, the wafer frame 300 is a rectangular block frame, which is densely covered with through holes and / or through grooves for water outlet, used for storing wafers, with an opening facing one side and a flat bottom surface. It is a prior art and will not be described here in detail; a rectangular block-shaped bottom protrusion 310 is fixed to the bottom surface of the wafer frame 300; the bottom protrusion 310 is used to cooperate with the limiting positioning groove 210 to limit the movement of the wafer frame 300 on the rotating disk 200; after the wafer frame 300 is positioned on the rotating disk 200, the opening faces the axis of the rotating disk 200.

[0085] The downward limiter assembly is used to further limit the displacement of the wafer frame 300 during the spin-drying process by applying pressure on the top of the wafer frame 300 . The main body is a combination of a rod body and a plate body, which is fixed on the top of the rotating disk 200 .

[0086] Furthermore, the downward pressure limit assembly includes a center rod 410, a lower pressure plate 420 and a lower pressure rod 430; the center rod 410 is a telescopic rod (cylinder, oil cylinder or electric telescopic rod) that is telescopic under the control of the control unit, which is longitudinally arranged, coaxial with the rotating disk 200, and the bottom is fixed on the rotating disk 200; the lower pressure plate 420 is a hard disk body, horizontally arranged, fixed on the top of the center rod 410, and plays a role in guiding force; the lower pressure rod 430 is a longitudinally arranged hard rod body, the top of which is fixed on the center rod 410. The lower pressure rod 430 is fixed at a position near the edge of the bottom of the lower pressure plate 420, and a soft cushion is provided at the bottom for buffering effect; the lower pressure rod 430 corresponds one-to-one with the limiting positioning groove 210 and is located directly above the limiting positioning groove 210; before the wafer frame 300 is loaded, the central rod 410 is controlled to extend so that the lower pressure rod 430 moves upward; after all the bottom protrusions 310 move to the stopper 213 of the limiting positioning groove 210, the central rod 410 is controlled to contract so that the lower pressure rod 430 contacts and squeezes the wafer frame 300 to fix it.

[0087] The clamping and shifting assembly is used to transfer the conveyor belt assembly 500 and the wafer frame 300 on the rotating disk 200 back and forth, and the main body is a moving trolley with a clamp.

[0088] Further, such as Figure 1 As shown, the clamping and shifting assembly includes a guide rail 610 fixed on the ground 001, a base 620 that moves along the guide rail 610 under the cooperation of the control unit and the power assembly, a rotating guide rail column 630, a bearing frame 640 and a floating clamping plate 650; the guide rail 610 is located between the base 100 and the conveyor belt assembly 500; the base 620 plays the role of bearing and supporting the rotating guide rail column 630; the rotating guide rail column 630 is a hard column, the bottom of which is positioned on the top of the base 620, and is connected to the rotating guide rail column 630 around its own axis under the control of the control unit. The base 620 supports the support frame 640 and guides the movement of the support frame 640. The support frame 640 is a U-shaped hard frame, which is slidably positioned on the rotating guide column 630, and slides along the height direction of the rotating guide column 630 under the coordinated cooperation of the control unit and the power assembly. The floating clamping plates 650 exist in pairs, which are symmetrical and used in combination, fixed on two opposite surfaces of the support frame 640, cooperate with each other and form a clamp structure together with the support frame 640, which is used to clamp and fix the wafer frame 300.

[0089] Furthermore, the floating clamping plate 650 is a combination of a telescopic rod that is extended and retracted under the control of a control unit and a plate body fixed to the end of the telescopic rod; the other end of the telescopic rod is fixed to the supporting frame 640, and when the telescopic rod is extended, the plates thereon approach each other to clamp the wafer frame 300 located between the two plates.

[0090] The conveyor belt assembly 500 is positioned on the ground and is used to convey the wafer frame 300. Insertion grooves 510 are arranged at equal intervals on the conveyor belt of the conveyor belt assembly 500. The insertion grooves 510 are through grooves for inserting the bottom protrusions 310. During transportation, the bottom surface of the wafer frame 300 contacts the conveyor belt, and the bottom protrusions 310 are inserted into the insertion grooves 510.

[0091] The power assembly is used to provide power for the operation of the various components of the efficient automated semiconductor spin-drying equipment of this application, and the control unit plays a role in controlling the coordinated operation of the various components of the efficient automated semiconductor spin-drying equipment. Both are prior arts and will not be elaborated here.

[0092] Preferably, the control unit is a combination of a programmable logic controller and control buttons.

[0093] When the high-efficiency automated semiconductor spin-drying equipment of the embodiment of the present application is used: the clamping and shifting assembly is used to clamp the wafer frame 300 from the conveyor belt assembly 500 and move it above the rotating disk 200; the bottom protrusion 310 is moved to insert it into the limiting positioning groove 210 and drive the wafer frame 300 to move until the bottom protrusion 310 moves to the limit position of the limiting positioning groove 210 close to the edge of the rotating disk 200; after all the limiting positioning grooves 210 are loaded into the bottom protrusion 310, the center rod 410 is controlled to contract so that the lower pressure rod 430 moves down to squeeze and position the wafer frame 300; thereafter, the spin-drying operation is performed; after the spin-drying operation is completed, the center rod 410 is controlled to extend, and then the wafer frames 300 on the rotating disk 200 are taken out one by one.

[0094] Preferably, in order to reduce the impact and wear on the limiting positioning groove 210 during the placement and placement of the wafer frame 300, and to ensure that the bottom protrusion 310 moves into place, and to reduce the running damage of the clamping and shifting assembly; Figure 4 As shown, a sliding groove 641 is provided on the supporting frame 640, and a sliding block 642 is positioned in the sliding groove 641; the floating clamping plate 650 is positioned on the sliding block 642; the sliding groove 641 is a transversely arranged straight groove, which is positioned on the opposite surfaces of the supporting frame 640 (that is, on two parallel rods on the supporting frame 640); the sliding block 642 is slidably positioned in the sliding groove 641, and compression springs are provided at both ends, one end of the compression spring abuts against the sliding block 642, and the other end abuts against the inner wall of the sliding groove 641 at the end. During the sliding process of the sliding block 642, it is necessary to overcome the elastic force of the compression spring to slide.

[0095] Preferably, in order to improve the transport efficiency and reduce the equipment use cost, Figure 5 and Figure 6As shown, three groups of sliding blocks 642 are provided on the supporting frame 640 of the clamping and shifting assembly; the sliding blocks 642 are arranged in groups of two; compression springs are provided between the sliding blocks 642 and between the sliding blocks 642 and the ends of the sliding grooves 641; during the sliding process of the sliding blocks 642, it is necessary to overcome the elastic force of the compression springs to slide; the clamping and shifting assembly clamps three wafer frames 300 on the conveyor belt assembly 500 and then moves to the rotating disk 200 for placement and fixation; when the clamping and shifting assembly clamps multiple wafer frames 300, the heights of the wafer frames 300 on the supporting frame 640 are different, the highest is close to the rotating guide rail column 630, and the others are lower in sequence.

[0096] The technical solutions in the above embodiments of the present application have at least the following technical effects or advantages:

[0097] The invention solves the technical problems of complex structure and difficult maintenance of automatic wafer drying devices in the prior art, and achieves the technical effects of relatively simple structure, convenient maintenance and reliable operation of efficient automated semiconductor drying equipment.

[0098] Embodiment 2

[0099] In order to further improve the processing efficiency of the round wafers, the embodiment of the present application optimizes and improves the structure of the downward limiter assembly and the rotating disk 200 on the basis of the above embodiment, and adds a storage bucket 700, and uses multiple rotating disks 200 to stack together to process more wafers at a time, specifically:

[0100] like Figure 7 and Figure 8 As shown, the storage barrel 700 is a round barrel with an open top, buried in the ground, and used to store the placement base 100, the rotating disk 200 and the downward pressure limit assembly, and the barrel mouth is coplanar with the ground 001;

[0101] The inner bottom of the storage bucket 700 is provided with a lifting assembly 710, which is used to lift the base 100 so that it can be lifted or lowered as needed; the lifting assembly 710 is a telescopic rod structure, a scissor-type lifting structure or other lifting structures;

[0102] The bottom of the base 100 is fixed to the top of the lifting assembly 710;

[0103] There are multiple rotating disks 200, all of which are horizontally arranged in a row with equal spacing between each other. The rotating disk 200 at the bottom is positioned on the base 100; the rotating disks 200 are fixed together by connecting rods 220; the connecting rods 220 are hard cylinders, arranged longitudinally, and are multiple in number. They are located between two rotating disks 200, coaxial with the rotating disks 200 and fix the two adjacent rotating disks 200 together; the rotating disk 200 at the top is not provided with a limiting positioning groove 210;

[0104] The rotating disk 200 is provided with a through hole 230 near the edge. The through hole 230 is a longitudinal through hole for the pressing rod 430 to pass through and to guide the movement of the pressing rod 430. The number of the through holes 230 on the rotating disk 200 is an integer multiple of the number of the limiting positioning grooves 210. One limiting positioning groove 210 corresponds to one or more through holes 230. The number of columns of the through holes 230 of the entire device is the same as the number of the through holes 230 on a single rotating disk 200.

[0105] The downward pressure limiting assembly includes a center rod 410, a lower pressure plate 420 and a lower pressure rod 430; the center rod 410 is a telescopic rod structure, fixed on the top surface of the topmost rotating disk 200 and coaxial with the rotating disk 200; the lower pressure plate 420 is a hard disk body, horizontally arranged, fixed on the top of the center rod 410, and plays a role in guiding force; the lower pressure rod 430 is a longitudinally arranged hard long rod, each of which penetrates all the through holes 230 in a row; a top block 431 for limiting a floating compression spring 432 is fixed on the top of the lower pressure rod 430; the floating compression spring 432 is a compression spring corresponding to the lower pressure rod 430 one by one, sleeved on the lower pressure rod 430, and the top abuts against the top block 43 1, and the bottom abuts against the topmost rotating disk 200; when the center rod 410 contracts, all the downward pressing rods 430 are pressed downward; when the center rod 410 extends, the downward pressing rods 430 are moved upward under the influence of elastic force; a resisting fixing plate 433 is fixed on the downward pressing rod 430; the resisting fixing plate 433 is a rubber plate, which is horizontally arranged, one-to-one corresponding to the limiting positioning groove 210, fixed on one or multiple downward pressing rods 430 at the same time, and each resisting fixing plate 433 is always located directly above the limiting positioning groove 210, and moves up and down with the movement of the downward pressing rod 430; as the downward pressing rod 430 moves downward, the resisting fixing plate 433 abuts against the wafer frame 300 to fix the wafer frame 300.

[0106] During use, the lifting assembly 710 operates to control the lifting and lowering of the rotating disk 200, so that the clamping and shifting assembly can fill all the rotating disks 200 on the ground; after the loading of the wafer frame 300 is completed, the pressing and limiting assembly operates to simultaneously press and fix all the wafer frames 300.

[0107] In order to further improve the practicality of the present application and reduce the shaking of the rotating disk 200 during the rotation process, preferably, as Fig. 9As shown, it also includes a reinforcement frame 720; the reinforcement frame 720 is fixed on the ground, including a top cross bar 721, a cross bar lifting body 722 and a top connecting rod 723; the top cross bar 721 is a hard rod body arranged horizontally, one end of which is fixed to the top of the cross bar lifting body 722; the cross bar lifting body 722 is a telescopic rod structure or a scissors-type lifting structure, fixed to the ground; the top connecting rod 723 is a hard rod body, arranged longitudinally, coaxial with the rotating disk 200, the bottom is rotatably connected to the top of the lower pressure plate 420, and the top is fixed to the end of the top cross bar 721 away from the cross bar lifting body 722; during the operation of the lifting assembly 710 and the center rod 410, the cross bar lifting body 722 runs synchronously to keep the top cross bar 721 in a horizontal state.

[0108] Embodiment 3

[0109] In order to save water while ensuring adequate cleaning during the maintenance of the equipment of the present application, the embodiment of the present application adds an annular sheet 730 and a pump air assembly 750 on the basis of the above embodiment; the annular sheet 730 occupies the space in the storage barrel 700 after expansion to save water used during the soaking and washing process; specifically:

[0110] When the lifting assembly 710 is retracted to the limit, the lower pressure plate 420 is located in the space surrounded by the storage barrel 700;

[0111] like Fig.10 and Fig.11 As shown, the annular sheet 730 is an annular sheet made of elastic rubber material, there are multiple of them, the edges of which are fixed on the inner wall of the storage barrel 700 and arranged in a row, the width of which is 5 to 10 cm less than the spacing between the rotating disks 200, and the spacing between each other is less than 10 cm; after the annular sheet 730 is fixed, it forms multiple annular spaces together with the inner wall of the storage barrel 700; the pump air assembly 750 is a combination of an air pump, an air valve and an air delivery pipe, and under the control of the control unit, controls the amount of gas in the space enclosed by each annular sheet 730 and thus controls the annular sheet 730 to expand and contract;

[0112] When performing immersion cleaning, first lower the lower pressure plate 420 and the rotating plate 200 to the lowest position, and then control the annular sheet 730 to expand and extend into the space between the rotating plates 200, the space between the rotating plate 200 and the lower pressure plate 420, and the space around the lifting assembly 710; finally, water is injected and the rotating plate 200 is controlled to rotate for cleaning.

[0113] Embodiment 4

[0114] In order to further improve the cleaning effect and reduce the cleaning dead angle, the embodiment of the present application adds an outer covering sheet 740 and a pump liquid assembly 760 on the basis of the above embodiment; the rinsing and cleaning is performed by spraying water through multiple holes and controlling the base 100, the rotating disk 200 and other components to move up and down and rotate; specifically:

[0115] like Fig.12 As shown, the outer covering sheet 740 is an annular sheet made of elastic rubber material, corresponding to the annular sheet 730 one by one, and the edge is fixed on the edge of the annular sheet 730 and arranged in a row; the outer covering sheet 740 is provided with one or more rows of injection holes 741, and the injection holes 741 are through holes; the outer covering sheet 740 and the annular sheet 730 together form an annular space;

[0116] The pump liquid assembly 760 is a combination of a liquid pump, a liquid valve and a liquid infusion tube, and is connected to the space enclosed by the outer sheet 740 and the annular sheet 730. When the pump liquid assembly 760 is in operation, cleaning liquid is injected into the space enclosed by the outer sheet 740 and the annular sheet 730. The cleaning liquid is sprayed out from the spray hole 741 for flushing and cleaning, and the water injection operation is completed at the same time. During the water spraying process, the rotating disk 200 and other components move up and down and rotate to ensure sufficient flushing. During the water spraying process, the pump air assembly 750 can also be controlled to operate, change the shape of the annular sheet 730 and thus change the direction of the liquid spraying.

[0117] Furthermore, during the cleaning process, the wafer frame 300 may be loaded on the rotating disk 200 for cleaning.

[0118] Embodiment 5

[0119] In order to further enhance the cleaning effect of the wafer frame 300, the embodiment of the present application optimizes and improves the structure of the limiting positioning groove 210 on the basis of the above embodiment, and adds a rotating table 250 and a force application plate 260, specifically:

[0120] like Fig.13 and Fig.14 As shown, a loading hole 240 is provided at the bottom of the placing portion 211 and the guiding portion 212 of the limiting positioning groove 210, and the loading hole 240 is a through hole for installing a rotating table 250; the rotating table 250 is cylindrical, with a flat top surface, inserted and installed in the loading hole 240, and a bearing is provided between the loading hole 240; the top surface of the rotating table 250 is coplanar with the bottom of the limiting positioning groove 210; the top surface diameter of the rotating table 250 is larger than the circumscribed circle diameter of the bottom surface of the bottom protrusion 310; the force disk 260 is disk-shaped, horizontally arranged, fixed to the bottom of the rotating table 250 and coaxial with the rotating table 250, and exposed from the edge of the rotating disk 200.

[0121] Furthermore, the edge of the rotating disk 200 is provided with patterns or teeth for increasing friction.

[0122] When the equipment is being immersed and cleaned, during the process, the restraint of the downward limit assembly on the wafer frame 300 is cancelled, and the rotating disk 200 is controlled to rise and fall so that there is an annular sheet 730 between every two rotating disks 200; the annular sheet 730 is controlled to expand and push the bottom protrusion 310 to the placement portion 211; then the annular sheet 730 is controlled to shrink, and the rotating disk 200 is controlled to rise and fall so that each rotating disk 200 is side by side with an annular sheet 730; at this time, the annular sheet 730 is controlled to expand and resist the force disk 260; the rotating disk 200 is controlled to rotate and thereby drive the wafer frame 300 to rotate (the rotation can be 90 degrees, 180 degrees or other custom angles, the key point is that before the cleaning is completed, the wafer frame 300 needs to be rotated to a state where it can be clamped by the clamping and shifting assembly); the downward limit assembly is controlled to fix the wafer frame 300 and continue cleaning.

[0123] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A highly efficient and automated semiconductor drying device, characterized in that: It comprises a base (100), a rotating disk (200), a round wafer frame (300), a downward pressure limiting component, a clamping and shifting component, and a conveyor belt component (500); The rotating disk (200) is arranged horizontally, rotated around its own axis and connected to the base (100), and three or more limiting positioning grooves (210) are arranged at equal intervals on the upper surface. The limiting positioning grooves (210) are in the shape of long strips as a whole, and are arranged close to the edge of the rotating disk (200). The spacing between each other is equal, and the length direction is perpendicular to the axis of the rotating disk (200), and matches the bottom protrusion (310); The bottom of the limiting positioning groove (210) is a plane, and the opening faces upward; The round wafer frame (300) is a rectangular block frame body, and a rectangular block bottom protrusion (310) is fixed on the bottom surface; The downward pressure limiting assembly is used to further limit the displacement of the wafer frame (300) during the spin-drying process by applying pressure on the top of the wafer frame (300), and the main body is a combination of a rod body and a plate body, which is fixed on the top of the rotating disk (200); The clamping and shifting assembly is used to shift the conveyor belt assembly (500) and the wafer frame (300) on the rotating disk (200) back and forth, and the main body is a moving trolley with a clamp; The conveyor belt assembly (500) is positioned on the ground and is used to convey the wafer frame (300). Insertion grooves (510) for inserting the bottom protrusions (310) are provided at equal intervals on the conveyor belt of the conveyor belt assembly (500); Also included is a storage bucket (700); The storage barrel (700) is a round barrel with an open top, buried in the ground; A lifting assembly (710) is provided on the inner bottom of the storage bucket (700); The bottom of the base (100) is fixed to the top of the lifting assembly (710); There are a plurality of rotating disks (200), all of which are horizontally arranged in a row with equal spacing between them, and the rotating disk (200) at the bottom is positioned on the base (100); The rotating disks (200) are fixed together via a connecting rod (220); A through hole (230) is provided on the rotating disk (200) near the edge;” It also includes an annular sheet body (730) and a pump air assembly (750); The annular sheet (730) is an annular sheet made of elastic rubber material, there are a plurality of them, the edges of which are fixed on the inner wall of the storage barrel (700) and arranged in a row; The pump gas component (750) controls the amount of gas in the space enclosed by each annular sheet (730) and thereby controls the annular sheet (730) to expand and contract; It also includes a rotating platform (250) and a force application disk (260); A loading hole (240) is provided at the bottom of the receiving portion (211) and the guiding portion (212) of the position limiting and positioning groove (210); the loading hole (240) is a through hole and is used for installing the rotating platform (250); The rotating table (250) is cylindrical, has a flat top surface, is inserted into and installed in the insertion hole (240), and is provided with a bearing between the insertion hole (240); The top surface of the rotating platform (250) is coplanar with the bottom of the limiting positioning groove (210); The top surface diameter of the rotating table (250) is greater than the circumscribed circle diameter of the bottom surface of the bottom bump (310); the force - applying disc (260) is disc - shaped, horizontally arranged, fixed to the bottom of the rotating table (250) and coaxial with the rotating table (250), and protrudes from the edge of the rotating disc (200). When performing the immersion cleaning of the equipment, the annular sheet body (730) is expanded to push the bottom bump (310) into the placing part (211), and the rotation of the wafer frame (300) on the rotating disc (200) is realized by the expansion and contraction of the annular sheet body (730) in cooperation with the lifting of the rotating disc (200).

2. The high-efficiency automated semiconductor drying equipment according to claim 1, characterized in that: The part of the limit - positioning groove (210) closest to the center of the rotating disc (200) is the placing part (211), the part closest to the edge of the rotating disc (200) is the stopping part (213), and the middle part is the guiding part (212). The placing part (211) is used for inserting the bottom bump (310) located at the bottom of the wafer frame (300), and the bottom of this part of the groove is semi - circular. The guiding part (212) is used for guiding the horizontal movement of the bottom bump (310) and restricting the moving direction of the bottom bump (310), and the bottom of this part of the groove is isosceles trapezoidal. The stopping part (213) is used for restricting the movement of the bottom bump (310), and the shape of the bottom of this part of the groove is rectangular and the same as the shape of the bottom surface of the bottom bump (310). After the bottom bump (310) slides to the stopping part (213), it touches and fits the inner wall of the groove of the stopping part (213). At this time, if the bottom bump (310) is subjected to a horizontal force, it can only move towards the guiding part (212).

3. The high-efficiency automated semiconductor drying equipment according to claim 1, characterized in that: The clamping and shifting assembly includes a guide rail (610) fixed on the ground (001), a base (620) moving along the guide rail (610) under the coordinated cooperation of the control unit and the power assembly, a rotating guide post (630), a carrying frame (640) and a floating clamping plate (650). The guide rail (610) is located between the base table (100) and the conveyor belt assembly (500); the base (620) serves to support and carry the rotating guide post (630); the rotating guide post (630) is a rigid column, the bottom of which is positioned at the top of the base (620) and is rotatably connected to the base (620) around its own axis under the control of the control unit, serving to support the carrying frame (640) and guide the movement of the carrying frame (640); the carrying frame (640) is a U - shaped rigid frame body, slidably positioned on the rotating guide post (630) and sliding along the height direction of the rotating guide post (630) under the coordinated cooperation of the control unit and the power assembly; the floating clamping plates (650) exist in pairs, are symmetric with each other and are used in cooperation, fixed on two opposite surfaces of the carrying frame (640), cooperating with each other and together with the carrying frame (640) to form a clip structure for clamping and fixing the wafer frame (300).

4. The high-efficiency automated semiconductor drying equipment according to claim 3, characterized in that: The supporting frame (640) is provided with a sliding groove (641), and a sliding block (642) is positioned in the sliding groove (641); the floating clamping plate (650) is positioned on the sliding block (642); the sliding groove (641) is a transversely arranged straight groove, and is positioned on the opposite surface of the supporting frame (640); the sliding block (642) is slidably positioned in the sliding groove (641), and compression springs are provided at both ends, one end of the compression spring abuts against the sliding block (642), and the other end abuts against the inner wall of the sliding groove (641) at the end. During the sliding process of the sliding block (642), it is necessary to overcome the elastic force of the compression spring to slide.

5. The high-efficiency automated semiconductor drying equipment according to claim 4, characterized in that: The supporting frame (640) of the clamping and shifting assembly is provided with three groups of sliding blocks (642); the sliding blocks (642) are arranged in groups of two; compression springs are arranged between the sliding blocks (642) and between the sliding blocks (642) and the ends of the sliding grooves (641); during the sliding process of the sliding blocks (642), it is necessary to overcome the elastic force of the compression springs to slide; the clamping and shifting assembly clamps three wafer frames (300) on the conveyor belt assembly (500) and then moves to the rotating disk (200) for placement and fixation; when the clamping and shifting assembly clamps multiple wafer frames (300), the heights of the wafer frames (300) on the supporting frame (640) are different.

6. The high-efficiency automated semiconductor drying equipment according to claim 1, characterized in that: The downward pressure limiting assembly comprises a central rod (410), a downward pressure plate (420) and a downward pressure rod (430); The central rod (410) is a telescopic rod structure, fixed on the top surface of the topmost rotating disk (200); the lower pressure disk (420) is fixed on the top of the central rod (410); The lower pressure rod (430) is a longitudinally arranged hard long rod, each of which penetrates all the through holes (230) in a row; a top block (431) for limiting a floating pressure spring (432) is fixed on the top of the lower pressure rod (430); the floating pressure spring (432) is a pressure spring, which corresponds to the lower pressure rod (430) one by one and is sleeved on the lower pressure rod (430); When the central rod (410) contracts, all the downward pressing rods (430) are pressed and move downward; When the central rod (410) is extended, the downward pressing rod (430) moves upward under the influence of elastic force; A resisting fixing plate (433) is fixed on the lower pressing rod (430); the resisting fixing plate (433) is a rubber plate, arranged horizontally, corresponding one-to-one with the limiting positioning grooves (210), and fixed on one or multiple lower pressing rods (430) at the same time; As the pressing rod (430) moves downward, the abutting fixing plate (433) abuts against the wafer frame (300) to fix the wafer frame (300).

7. The high-efficiency automated semiconductor drying equipment according to claim 6, characterized in that: When the lifting and jacking assembly (710) is retracted to the limit, the lower pressure plate (420) is located in the space surrounded by the storage barrel (700); The width of the annular sheet (730) is 5 to 10 centimeters smaller than the spacing between the rotating disks (200), and the spacing between each other is less than 10 centimeters; After the annular sheet (730) is fixed, it forms a plurality of annular spaces together with the inner wall of the storage barrel (700).

8. The high-efficiency automated semiconductor drying equipment according to claim 7, characterized in that: It also includes an outer covering sheet (740) and a pumping liquid component (760); The outer covering sheet (740) is an annular sheet made of elastic rubber material, corresponding to the annular sheet (730) one by one, with its edge fixed on the edge of the annular sheet (730) and arranged in a row; The outer covering sheet (740) is provided with one or more rows of injection holes (741), and the injection holes (741) are through holes; the outer covering sheet (740) and the annular sheet (730) together form an annular space; The pump liquid assembly (760) is in communication with the space enclosed by the outer sheet (740) and the annular sheet (730); when the pump liquid assembly (760) is in operation, cleaning liquid is injected into the space enclosed by the outer sheet (740) and the annular sheet (730); the cleaning liquid is sprayed out from the spray hole (741) to perform flushing and cleaning while completing the water injection operation.

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