Water-cooling liquid heat dissipation temperature compensation system for modular all-in-one machine and working method thereof

Abstract

The present invention belongs to the technical field of temperature measurement, and specifically relates to a water-cooling liquid heat dissipation temperature compensation system for a modular all-in-one machine and a working method thereof. The water-cooling liquid heat dissipation temperature compensation system for the modular all-in-one machine comprises: a CPU water cooling head and a GPU water cooling head arranged in parallel; a water cooling box, which is connected in series with the CPU water cooling head and the GPU water cooling head arranged in parallel to form a water cooling circulation channel, i.e., primary water cooling; a temperature monitoring unit, comprising: a CPU temperature sensor configured to monitor the CPU temperature and a GPU temperature sensor configured to monitor the GPU temperature; a control module, which is configured to perform heat conduction compensation for the flow rate or flow direction flowing through the CPU water cooling head and the GPU water cooling head according to temperature data acquired by the temperature monitoring unit, i.e., secondary water cooling. The water-cooling liquid heat dissipation temperature compensation system for the modular all-in-one machine can distribute cooling water according to actual use requirements by switching between parallel and series connection.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor technology, and specifically relates to a cooling device for heat conduction through flowing liquid, and more particularly to a modular all-in-one machine water-cooling liquid heat dissipation temperature compensation system and a working method thereof. Background Art

[0002] At present, the central processing unit CPU and independent graphics card GPU generate the most heat during the use of all-in-one terminals.

[0003] When an all-in-one computer is equipped with both a CPU and a GPU, the requirements for the CPU and the GPU are different in different application scenarios. Sometimes the demand for the CPU is very high, causing the CPU to heat up more seriously than the GPU, and sometimes the demand for the GPU is very high, causing the GPU to heat up more seriously than the CPU. For example, "A chip liquid cooling radiator" with a publication number of "CN220821549U" dissipates heat for the chip by being set in series.

[0004] However, if the inventive concept of the above patent is applied to the present scenario, and the CPU water cooling head, GPU water cooling head and water tank are connected in series to dissipate heat, the water flow either passes through the CPU water cooling head first or passes through the GPU water cooling head first, resulting in that one of the CPU water cooling head and the GPU water cooling head must use a water source that has already absorbed heat to dissipate heat.

[0005] Therefore, how to solve the technical problem that the existing all-in-one heat dissipation device cannot distribute water cooling flow according to the usage requirements of the CPU and GPU is an urgent problem that technical personnel need to solve.

[0006] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Summary of the invention

[0007] The disclosed embodiments at least provide a modular all-in-one machine water-cooling liquid heat dissipation temperature compensation system and a working method thereof.

[0008] In a first aspect, an embodiment of the present disclosure provides a modular all-in-one machine using a water-cooling liquid heat dissipation temperature compensation system, comprising: a CPU water-cooling head and a GPU water-cooling head arranged in parallel; a water cooling box, connected in series with the CPU water-cooling head and the GPU water-cooling head arranged in parallel, to form a water-cooling circulation channel, i.e., primary water cooling; a temperature monitoring unit, comprising: a CPU temperature sensor configured to monitor the CPU temperature and a GPU temperature sensor configured to monitor the GPU temperature; a control module, configured to perform heat conduction compensation for the flow rate or flow direction flowing through the CPU water-cooling head and the GPU water-cooling head according to the temperature data acquired by the temperature monitoring unit, i.e., secondary water cooling.

[0009] In an optional embodiment, the control module is configured to control the flow through the CPU water cooling head and the GPU water cooling head to perform heat conduction compensation according to the temperature data obtained by the temperature monitoring unit, that is,

[0010] Adjust the flow distribution by adjusting the flow valve opening of the CPU and / or GPU;

[0011] When T is greater than T0;

[0012] ;

[0013] Where θ is the flow valve opening of the CPU or GPU; k is the proportional coefficient; T is the current temperature of the CPU or GPU; T0 is the expected temperature of the CPU or GPU;

[0014] The control module is configured to control the heat conduction compensation of the flow through the CPU water cooling head and the GPU water cooling head according to the temperature data obtained by the temperature monitoring unit, that is,

[0015] When the flow valve opening data of the CPU or GPU exceeds the threshold, the flow direction of the cooling water is adjusted.

[0016] In an optional embodiment, the water cooling box is connected to a water pump; the CPU water cooling head and the GPU water cooling head are connected in parallel and then connected in series with the water cooling box and the water pump; the water pump is connected to the CPU water cooling head and the GPU water cooling head through a CPU flow valve and a GPU flow valve, respectively; when the CPU water cooling head and the GPU water cooling head are connected in parallel, the control module is configured to adjust the opening of the CPU flow valve and the GPU flow valve respectively according to data sent by the CPU temperature sensor and the GPU temperature sensor to distribute the flow; when the opening of the CPU flow valve reaches a threshold first, the control module is configured to control the opening and closing of the corresponding flow direction valves so that the CPU water cooling head, the GPU water cooling head, the water pump and the water cooling box are connected in series, and the cooling water of the water cooling box passes through the CPU water cooling head first; and when the opening of the GPU flow valve reaches a threshold first, the control module is configured to control the opening and closing of the corresponding flow direction valves so that the GPU water cooling head, the CPU water cooling head, the water pump and the water cooling box are connected in series, and the cooling water of the water cooling box passes through the GPU water cooling head first.

[0017] In an optional embodiment, the water pump is connected to the CPU water cooling head and the GPU water cooling head through a first shunt pipe and a second shunt pipe, respectively, and the water pump is connected to the first shunt pipe and the second shunt pipe through a CPU flow valve and a GPU flow valve, respectively; the first shunt pipe is also connected to the water cooling box through a first drainage pipe, and the second shunt pipe is also connected to the water cooling box through a second drainage pipe, and the parallel-connected CPU water cooling head and GPU water cooling head are connected in series with the water cooling box through a return pipe; wherein, a first flow direction valve is provided on the first drainage pipe, a second flow direction valve is provided on the second drainage pipe, and a third flow direction valve is provided on the return pipe; when the opening of the CPU flow valve reaches a threshold value first or the opening of the GPU flow valve reaches a threshold value first, the CPU water cooling head and the GPU water cooling head are connected in series by opening and closing the corresponding flow direction valve and flow valve.

[0018] In an optional embodiment, when the opening of the CPU flow valve reaches the threshold first, the control module is configured to control the opening and closing of the corresponding flow direction valves to connect the CPU water cooling head, the GPU water cooling head, the water pump and the water cooling box in series, and the cooling water of the water cooling box passes through the CPU water cooling head first, that is, the control module controls the GPU flow valve to close, the first flow direction valve to close, the third flow direction valve to close, and the second flow direction valve to open.

[0019] In an optional embodiment, when the opening of the GPU flow valve reaches the threshold first, the control module is configured to control the opening and closing of the corresponding flow direction valves to connect the GPU water cooling head, the CPU water cooling head, the water pump and the water cooling box in series, and the cooling water of the water cooling box passes through the GPU water cooling head first, that is, the control module controls the CPU flow valve to close, the first flow direction valve to open, the third flow direction valve to close, and the second flow direction valve to close.

[0020] In an optional embodiment, the CPU water cooling head and the GPU water cooling head are connected to the return pipe through a T-shaped three-way pipe; wherein the return pipe is connected to the vertical pipe of the T-shaped three-way pipe; a filter is arranged in the horizontal pipe of the T-shaped three-way pipe; the third flow direction valve is a butterfly valve and is arranged in the vertical pipe of the T-shaped three-way pipe.

[0021] In an optional embodiment, an adjustment component is provided on the outer sleeve of the horizontal tube of the T-shaped three-way pipe, and the adjustment component is located at the filter; the adjustment component includes: an upper ring connected to the upper end face of the horizontal tube, and a lower ring connected to the lower end face of the horizontal tube; both ends of the rotating shaft of the third flow direction valve extend out of vertical tubes, one end is connected to the servo motor, and the other end is coaxially provided with a gear; the upper ring and the lower ring are meshed with the gear through corresponding connecting rods, and the two connecting rods are located on both sides of the gear; when the opening of the CPU flow valve reaches the threshold first, the control module is configured to control the rotation of the third flow direction valve through the servo motor The shaft rotates forward to close the vertical pipe, and at the same time, the forward rotation of the shaft drives the upper ring and the lower ring to move in opposite directions to stretch the filter, so as to prevent impurities in the pipeline on the CPU side from passing through the filter to block the pipeline on the GPU side, and reversely flush the GPU water cooling head; and when the opening of the GPU flow valve reaches the threshold first, the control module is configured to control the shaft of the third flow direction valve to reverse through the servo motor to close the vertical pipe, and at the same time, the reverse rotation of the shaft drives the upper ring and the lower ring to move and squeeze the filter, so as to prevent impurities in the pipeline on the GPU side from passing through the filter to block the pipeline on the CPU side, and reversely flush the CPU water cooling head.

[0022] In an optional embodiment, a hanging ring is provided in the vertical pipe above the third flow direction valve; a linkage rod is provided in the horizontal pipe, one end of the linkage rod is connected to the inner wall of the horizontal pipe near the upper part of the filter screen, and the other end is connected to the hanging ring; when the upper ring and the lower ring stretch or squeeze the filter screen, the linkage rod rises and falls due to the deformation of the horizontal pipe, thereby driving the hanging ring to move back and forth to clean the inner wall of the vertical pipe.

[0023] In a second aspect, an embodiment of the present disclosure also provides a working method of the water-cooling liquid heat dissipation temperature compensation system for a modular all-in-one machine as described above, which includes: when a CPU water cooling head and a GPU water cooling head are connected in parallel, the control module is configured to adjust the opening of the CPU flow valve and the GPU flow valve respectively to distribute the flow according to data sent by the CPU temperature sensor and the GPU temperature sensor; when the opening of the CPU flow valve reaches a threshold first, the control module is configured to control the opening and closing of the corresponding flow direction valves so that the CPU water cooling head, the GPU water cooling head, the water pump and the water cooling box are connected in series, and the cooling water of the water cooling box passes through the CPU water cooling head first; and when the opening of the GPU flow valve reaches a threshold first, the control module is configured to control the opening and closing of the corresponding flow direction valves so that the GPU water cooling head, the CPU water cooling head, the water pump and the water cooling box are connected in series, and the cooling water of the water cooling box passes through the GPU water cooling head first.

[0024] The beneficial effect of the present invention is that the water-cooling liquid heat dissipation temperature compensation system of the modular all-in-one machine can distribute cooling water according to actual use requirements by switching between parallel and series connections to improve the heat dissipation requirements of the CPU and GPU.

[0025] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, this article specifically cites preferred embodiments and provides detailed descriptions as follows in conjunction with the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 A schematic diagram of a modular all-in-one machine water cooling temperature compensation system provided by an embodiment of the present disclosure;

[0029] Figure 2 A structural block diagram of a parallel connection provided by an embodiment of the present disclosure;

[0030] Figure 3 A structural block diagram of a series connection and a water cooling head first passing through the CPU provided in an embodiment of the present disclosure;

[0031] Figure 4 A structural block diagram of a water cooling head connected in series and first passing through a GPU provided by an embodiment of the present disclosure;

[0032] Figure 5 A schematic cross-sectional view of a T-shaped three-way pipe provided in an embodiment of the present disclosure;

[0033] Figure 6 A schematic diagram of the structure of a T-shaped three-way pipe provided in an embodiment of the present disclosure.

[0034] In the figure:

[0035] Water cooling box 1, return pipe 11, third flow direction valve 12, rotating shaft 121, gear 122, servo motor 123;

[0036] CPU water cooling head 2, CPU flow valve 21, first drainage pipe 22, first flow direction valve 23;

[0037] GPU water cooling head 3, GPU flow valve 31, second drainage pipe 32, second flow direction valve 33;

[0038] Water pump 4, first shunt pipe 41, second shunt pipe 42;

[0039] T-shaped three-way pipe 5, vertical pipe 51, horizontal pipe 52;

[0040] Adjustment assembly 6, upper ring 61, lower ring 62;

[0041] Filter 7;

[0042] Hanging ring 8;

[0043] Linkage rod 9. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0046] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0047] like Figures 1 to 4 As shown, at least one embodiment provides a modular all-in-one machine using water-cooling liquid heat dissipation temperature compensation system, which includes: a CPU water cooling head 2 and a GPU water cooling head 3 arranged in parallel; a water cooling box 1, which is connected in series with the CPU water cooling head 2 and the GPU water cooling head 3 arranged in parallel to form a water cooling circulation channel, that is, primary water cooling; a temperature monitoring unit, including: a CPU temperature sensor configured to monitor the CPU temperature and a GPU temperature sensor configured to monitor the GPU temperature; a control module, configured to perform heat conduction compensation for the flow rate or flow direction flowing through the CPU water cooling head 2 and the GPU water cooling head 3 according to the temperature data obtained by the temperature monitoring unit, that is, secondary water cooling.

[0048] Specifically, the control module calculates the received CPU temperature data and GPU temperature data separately to obtain the opening data of two groups of flow valves, and controls the corresponding flow valves respectively through the two groups of data to distribute the coolant entering the CPU water cooling head 2 and the GPU water cooling head 3; in the initial stage of the equipment operation, there is no need to lower the temperature of the CPU or GPU very low, so a parallel setting is adopted to distribute the proportion of coolant by adjusting the opening of the flow valve; when the opening data of any one of the flow valves exceeds the threshold first, the coolant entering the CPU water cooling head 2 and the GPU water cooling head 3 is changed to a series setting, that is, all the coolant first enters the CPU water cooling head 2 and the GPU water cooling head 3 that exceed the threshold, so that the cooling effect can be maximized; the modular all-in-one machine water cooling liquid heat dissipation temperature compensation system can distribute cooling water according to actual use needs by switching between parallel and series connections to improve the heat dissipation needs of the CPU and GPU.

[0049] In some embodiments, the control module is configured to control the flow through the CPU water cooling head and the GPU water cooling head to perform heat conduction compensation according to the temperature data obtained by the temperature monitoring unit, that is,

[0050] Adjust the flow distribution by adjusting the flow valve opening of the CPU and / or GPU;

[0051] When T is greater than T0;

[0052] ;

[0053] Where θ is the flow valve opening of the CPU or GPU; k is the proportional coefficient; T is the current temperature of the CPU or GPU; T0 is the expected temperature of the CPU or GPU;

[0054] The control module is configured to control the heat conduction compensation of the flow through the CPU water cooling head and the GPU water cooling head according to the temperature data obtained by the temperature monitoring unit, that is,

[0055] When the flow valve opening data of the CPU or GPU exceeds the threshold, the flow direction of the cooling water is adjusted.

[0056] Specifically, since the CPU or GPU has its own expected working temperature, the lower the temperature, the better; when T is less than T0, the openings of the CPU flow valve 21 and the GPU flow valve 31 are the same to evenly distribute the flow; when the current temperature T of the CPU is greater than the expected temperature T0 of the CPU, the control module intervenes in the regulation, and according to the obtained CPU flow valve opening θ, the CPU flow valve 21 is regulated to increase the opening by a corresponding percentage; when the current temperature T of the GPU is greater than the expected temperature T0 of the GPU, the control module intervenes in the regulation, and according to the obtained GPU flow valve opening θ, the GPU flow valve 31 is regulated to increase the opening by a corresponding percentage.

[0057] In one application scenario, the expected temperature T0 of the CPU is 30 degrees, the expected temperature T0 of the GPU is 30 degrees, the initial opening of the CPU flow valve 21 is 0.1 (i.e. 10%), the initial opening of the GPU flow valve 31 is 0.1 (i.e. 10%), the opening threshold of the flow valve is 1 (i.e. 100%), and the proportional coefficient of k is 0.0004; as shown in Table 1 below:

[0058] Table 1

[0059] Example Current CPU temperature Current temperature of the GPU CPU flow valve opening GPU flow valve opening Example 1 20 25 0.1 0.1 Example 2 35 40 0.1+0.01 0.1+0.04 Example 3 60 60 0.1+0.36 0.1+0.36 Example 4 80 35 0.1+1 0.1+0.01 Example 5 40 80 0.1+0.04 0.1+1

[0060] Specifically, Figure 2 As shown, and referring to the embodiments 1-3 in the above Table 1; when the opening of the CPU or GPU flow valve is less than the threshold value, the flow direction of the cooling water is in parallel, and the proportion of cooling water is allocated only by adjusting the opening of each valve.

[0061] Specifically, Figure 3 As shown, and refer to Example 4 in Table 1 above; when the current temperature of the CPU is 80 degrees, the opening of the CPU flow valve is 1.1, which has exceeded the threshold value 1. At this time, the control module intervenes to control the opening and closing of each valve, so that the cooling water flows in series and passes through the CPU first.

[0062] Specifically, Figure 4 As shown, and referring to Example 5 in Table 1 above; when the opening of the GPU flow valve exceeds the threshold, the cooling water flows in series and passes through the GPU first.

[0063] like Figure 1 , Figure 2 As shown, in some embodiments, the temperature adjustment component also includes: a cold box 1, a water pump 4, a CPU water cooling head 2 and a GPU water cooling head 3; wherein the CPU water cooling head 2 and the GPU water cooling head 3 are connected in parallel and then in series with the water cooling box 1 and the water pump 4.

[0064] Specifically, the water pump 4 transports the cooling water in the water cooling box 1 to the CPU water cooling head 2 and the GPU water cooling head 3 respectively. Compared with the series design, this parallel design allows the CPU water cooling head 2 and the GPU water cooling head 3 to use cooling water that has not absorbed heat in one cycle.

[0065] In some embodiments, the water pump 4 is connected to the CPU water cooling head 2 and the GPU water cooling head 3 through the CPU flow valve 21 and the GPU flow valve 31 respectively.

[0066] Specifically, the control module is electrically connected to the CPU flow valve 21 and the GPU flow valve 31 , and realizes the flow distribution of cooling water by controlling the opening of the CPU flow valve 21 and the GPU flow valve 31 respectively.

[0067] like Figure 2 As shown, in some embodiments, when the CPU water cooling head 2 and the GPU water cooling head 3 are connected in parallel, the control module is configured to adjust the opening of the CPU flow valve 21 and the GPU flow valve 31 respectively according to the data sent by the CPU temperature sensor and the GPU temperature sensor to distribute the flow of cooling water; specifically, this indicates that the usage demand of the all-in-one machine is relatively balanced, and there is no large demand for using the CPU or GPU.

[0068] like Figure 3 As shown, in some embodiments, when the opening of the CPU flow valve 21 reaches the threshold first, it indicates that the temperature of the CPU is very high at this time. At this time, the control module is configured to control the opening and closing of the corresponding flow valves to connect the CPU water cooling head 2, the GPU water cooling head 3, the water pump 4 and the water cooling box 1 in series, and the cooling water of the water cooling box 1 first passes through the CPU water cooling head 2; specifically, at this time it indicates that the use demand of the all-in-one machine focuses on the CPU.

[0069] like Figure 4 As shown, in some embodiments, when the opening of the GPU flow valve 31 reaches the threshold first, it indicates that the temperature of the GPU is very high at this time. At this time, the control module is configured to control the opening and closing of the corresponding flow valves to connect the GPU water cooling head 3, the CPU water cooling head 2, the water pump 4 and the water cooling box 1 in series, and the cooling water of the water cooling box 1 first passes through the GPU water cooling head 3; specifically, at this time it indicates that the use demand of the all-in-one machine focuses on the GPU.

[0070] In some embodiments, in order to achieve switching between parallel connection and series connection, the following structure is adopted:

[0071] First, the water pump 4 is connected in series with the water cooling box 1 to transport the cooling water in the water cooling box 1. The water pump 4 is connected to the CPU water cooling head 2 and the GPU water cooling head 3 through the first shunt pipe 41 and the second shunt pipe 42 respectively, and the outlet of the water pump 4 is connected to the first shunt pipe 41 and the second shunt pipe 42 through the CPU flow valve 21 and the GPU flow valve 31 respectively.

[0072] Secondly, the first shunt pipe 41 is also connected to the water cooling box 1 through the first drainage pipe 22, and the second shunt pipe 42 is also connected to the water cooling box 1 through the second drainage pipe 32. The parallel-connected CPU water cooling head 2 and GPU water cooling head 3 are connected in series with the water cooling box 1 through the reflux pipe 11.

[0073] Finally, a first flow direction valve 23 is provided on the first drainage pipe 22 , a second flow direction valve 33 is provided on the second drainage pipe 32 , and a third flow direction valve 12 is provided on the return pipe 11 .

[0074] In some embodiments, Figure 2 As shown, the control module controls the CPU flow valve 21 to open, the GPU flow valve 31 to open, the third flow direction valve 12 to open, the first flow direction valve 23 to close, and the second flow direction valve 33 to close.

[0075] In some embodiments, Figure 3 As shown, when the opening of the CPU flow valve 21 reaches the threshold first, the control module is configured to control the opening and closing of the corresponding flow direction valves so that the CPU water cooling head 2, the GPU water cooling head 3, the water pump 4 and the water cooling box 1 are connected in series, and the cooling water of the water cooling box 1 first passes through the CPU water cooling head 2, that is, the control module controls the GPU flow valve 31 to close, the first flow direction valve 23 to close, the third flow direction valve 12 to close, and the second flow direction valve 33 to open.

[0076] In some embodiments, Figure 4 As shown, when the opening of the GPU flow valve 31 reaches the threshold first, the control module is configured to control the opening and closing of the corresponding flow direction valves so that the GPU water cooling head 3, the CPU water cooling head 2, the water pump 4 and the water cooling box 1 are connected in series, and the cooling water of the water cooling box 1 first passes through the GPU water cooling head 3, that is, the control module controls the CPU flow valve 21 to close, the first flow direction valve 23 to open, the third flow direction valve 12 to close, and the second flow direction valve 33 to close.

[0077] like Figure 5 As shown, in some embodiments, the CPU water cooling head 2 and the GPU water cooling head 3 are connected to the return pipe 11 through a T-shaped three-way pipe 5; wherein the return pipe 11 is connected to the vertical pipe 51 of the T-shaped three-way pipe 5; a filter screen 7 is arranged in the horizontal pipe 52 of the T-shaped three-way pipe 5; the third flow direction valve 12 adopts a butterfly valve and is arranged in the vertical pipe 51 of the T-shaped three-way pipe 5.

[0078] Specifically, the vertical tube 51 of the T-shaped three-way pipe 5 has only one interface, and the horizontal tube 52 has two interfaces. The GPU water cooling head 3 and the CPU water cooling head 2 are respectively connected to the corresponding interfaces of the horizontal tube 52, and the return pipe 11 is connected to the interface of the vertical tube 51; the horizontal tube 52 is made of flexible metal material to facilitate stretching and extrusion, and the filter screen 7 will be stretched and extruded along with the horizontal tube 52, resulting in smaller mesh holes thereon. Since the water flow rate will be greater when connected in series than when connected in series, it is easy to carry away impurities on the inner wall of the pipeline.

[0079] like Figure 6 As shown, in some embodiments, an adjustment component 6 is provided on the outer periphery of the horizontal tube 52 of the T-shaped three-way pipe 5, and the adjustment component 6 is located at the filter screen 7, and the filter screen 7 is pulled to deform by the adjustment component 6.

[0080] Specifically, the adjustment component 6 includes: an upper ring 61 connected to the upper end surface of the horizontal tube 52, and a lower ring 62 connected to the lower end surface of the horizontal tube 52. The upper ring 61 and the lower ring 62 are moved away from or towards each other to stretch and squeeze the horizontal tube 52.

[0081] In some embodiments, vertical tubes 51 extend from both ends of the rotating shaft 121 of the third flow direction valve 12, one end is connected to the servo motor, and the other end is coaxially provided with a gear 122; the upper ring 61 and the lower ring 62 are meshed with the gear 122 through corresponding connecting rods 63, and the two connecting rods 63 are located on both sides of the gear 122.

[0082] Specifically, the movement of the upper ring 61 and the lower ring 62 is achieved by opening and closing the third flow direction valve 12. When in parallel, the third flow direction valve 12 is opened, and the upper ring 61 and the lower ring 62 are in the middle position, and the horizontal tube 52 is neither squeezed nor stretched.

[0083] Specifically, when the opening of the CPU flow valve 21 reaches the threshold first, the control module is configured to control the shaft 121 of the third flow direction valve 12 to rotate forward through the servo motor 123 to close the vertical pipe 51. At the same time, the forward rotation of the shaft 121 drives the upper ring 61 and the lower ring 62 to move in opposite directions to stretch the filter 7, so as to prevent impurities in the pipeline on the CPU side from passing through the filter 7 to block the pipeline on the GPU side, and reversely flush the pipeline on the GPU water cooling head 3 side to take away the impurities on this side.

[0084] Specifically, when the opening of the GPU flow valve 31 reaches the threshold first, the control module is configured to control the reversal of the shaft 121 of the third flow direction valve 12 through the servo motor 123 to close the vertical pipe 51. At the same time, the reversal of the shaft 121 drives the upper ring 61 and the lower ring 62 to move the extrusion filter 7 to prevent impurities in the pipeline on the GPU side from passing through the filter 7 to block the pipeline on the CPU side, and reversely flush the pipeline on the CPU water cooling head 2 side to take away the impurities on this side.

[0085] like Figure 5 As shown, in some embodiments, the vertical tube 51 is located above the third flow direction valve 12 and is provided with a hanging ring 8; a linkage rod 9 is provided in the horizontal tube 52, one end of the linkage rod 9 is connected to the inner wall of the horizontal tube 52 near the upper part of the filter screen 7, and the other end is connected to the hanging ring 8; when the upper ring 61 and the lower ring 62 stretch or squeeze the filter screen 7, the horizontal tube 52 will also undergo tensile deformation or extrusion deformation, causing the connection between the linkage rod 9 and the horizontal tube 52 to rise and fall due to deformation, that is, the linkage rod 9 rises and falls due to the deformation of the horizontal tube 52, thereby driving the hanging ring 8 to move back and forth to clean the inner wall of the vertical tube 51.

[0086] At least one embodiment also provides a working method of the above modular all-in-one machine using water cooling liquid heat dissipation temperature compensation system, which includes: when the CPU water cooling head 2 and the GPU water cooling head 3 are connected in parallel, the control module is configured to adjust the opening of the CPU flow valve 21 and the GPU flow valve 31 respectively according to the data sent by the CPU temperature sensor and the GPU temperature sensor to distribute the flow; when the opening of the CPU flow valve 21 reaches the threshold first, the control module is configured to control the opening and closing of the corresponding flow direction valves so that the CPU water cooling head 2, the GPU water cooling head 3, the water pump 4 and the water cooling box 1 are connected in series, and the cooling water of the water cooling box 1 passes through the CPU water cooling head 2 first; and when the opening of the GPU flow valve 31 reaches the threshold first, the control module is configured to control the opening and closing of the corresponding flow direction valves so that the GPU water cooling head 3, the CPU water cooling head 2, the water pump 4 and the water cooling box 1 are connected in series, and the cooling water of the water cooling box 1 passes through the GPU water cooling head 3 first.

[0087] In summary, the water-cooled liquid heat dissipation temperature compensation system of this modular all-in-one machine can distribute cooling water according to actual usage needs by switching between parallel and series, so as to improve the heat dissipation requirements of the CPU and GPU; at the same time, during the series-parallel switching process, the pipeline is reversely cleaned by changing the flow rate.

[0088] In this article, when it is mentioned that the first component is located on the second component, this may mean that the first component may be directly formed on the second component, or the third component may be interposed between the first component and the second component. In addition, in the drawings, in order to effectively describe the technical content, the thickness of the components may be exaggerated or reduced.

[0089] In this article, when an element or layer is referred to as being "located on," "engaged to," "connected to," "attached to," or "coupled to" another element or layer, it may be directly located on, engaged, connected, attached to, or coupled to another element or layer, or there may be intermediate elements or layers. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," "directly attached to," or "directly coupled to" another element or layer, there may be no intermediate elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0090] Herein, example embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of..." modify the entire list of elements when following a list of elements, rather than modifying individual elements in the list. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0091] The terms used herein are only used to describe specific exemplary configurations and are not intended to be limited. As used herein, the singular articles "one", "an" and "the" may also be intended to include plural forms, unless it is clearly indicated above that this is not the case. The terms "comprise", "include" and "have" are inclusive, and therefore specify the presence of features, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components and / or combinations thereof. The method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the specific order discussed or shown, unless specifically identified as an execution order. Additional or alternative steps may be adopted.

[0092] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Therefore, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, so that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. On the contrary, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0093] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0094] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply an order or sequence when used in this document unless explicitly indicated above. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.

[0095] Spatially relative terms, such as "inside", "outside", "below", "below", "down", "above", "on", etc., may be used herein to facilitate description of the relationship of one element or feature to another element or feature as illustrated in the figure. In addition to the orientation depicted in the figure, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is turned over, the elements described as "below" or "below" other elements or features will be oriented to be "above" other elements or features. Therefore, the example term "below" can cover the orientation above and below. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0096] In the above discussion, unless otherwise stated, the terms "about," "approximately," "substantially," etc., when used to describe a numerical value, mean a variation of + / - 10% of the value.

[0097] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A modular all-in-one machine using water cooling liquid heat dissipation temperature compensation system, characterized in that: include: The CPU water cooling head and GPU water cooling head are set in parallel; The water cooling box is connected in series with the CPU water cooling head and the GPU water cooling head arranged in parallel to form a water cooling circulation channel, i.e., first-level water cooling; A temperature monitoring unit, comprising: a CPU temperature sensor configured to monitor the temperature of the CPU and a GPU temperature sensor configured to monitor the temperature of the GPU; The control module is configured to perform heat conduction compensation for the flow rate or flow direction of the CPU water cooling head and the GPU water cooling head according to the temperature data obtained by the temperature monitoring unit, that is, two-stage water cooling; The control module is configured to control the flow through the CPU water cooling head and the GPU water cooling head to perform heat conduction compensation according to the temperature data obtained by the temperature monitoring unit, that is, Adjust the flow distribution by adjusting the flow valve opening of the CPU and / or GPU; When T is greater than T0; ； Where θ is the flow valve opening of the CPU or GPU; k is the proportional coefficient; T is the current temperature of the CPU or GPU; T0 is the expected temperature of the CPU or GPU; The control module is configured to control the heat conduction compensation of the flow through the CPU water cooling head and the GPU water cooling head according to the temperature data obtained by the temperature monitoring unit, that is, When the CPU or GPU flow valve opening data exceeds the threshold, adjust the flow direction of cooling water; The water cooling box is connected to the water pump; The CPU water cooling head and the GPU water cooling head are connected in parallel and then connected in series with the water cooling box and the water pump; The water pump is connected to the CPU water cooling head and the GPU water cooling head through the CPU flow valve and the GPU flow valve respectively; When the CPU water cooling head and the GPU water cooling head are connected in parallel, the control module is configured to adjust the opening of the CPU flow valve and the GPU flow valve respectively to distribute the flow according to the data sent by the CPU temperature sensor and the GPU temperature sensor; When the opening of the CPU flow valve reaches the threshold first, the control module is configured to control the opening and closing of the corresponding flow direction valves so that the CPU water cooling head, the GPU water cooling head, the water pump and the water cooling box are connected in series, and the cooling water of the water cooling box passes through the CPU water cooling head first; and When the opening of the GPU flow valve reaches the threshold first, the control module is configured to control the opening and closing of the corresponding flow direction valve so that the GPU water cooling head, the CPU water cooling head, the water pump and the water cooling box are connected in series, and the cooling water of the water cooling box first passes through the GPU water cooling head; The water pump is connected to the CPU water cooling head and the GPU water cooling head through a first shunt pipe and a second shunt pipe respectively, and the water pump is connected to the first shunt pipe and the second shunt pipe through a CPU flow valve and a GPU flow valve respectively; The first shunt pipe is also connected to the water cooling box through a first drainage pipe, the second shunt pipe is also connected to the water cooling box through a second drainage pipe, and the CPU water cooling head and the GPU water cooling head connected in parallel are connected in series to the water cooling box through a return pipe; Wherein, the first drainage pipe is provided with a first flow direction valve, the second drainage pipe is provided with a second flow direction valve, and the return pipe is provided with a third flow direction valve; When the opening of the CPU flow valve reaches the threshold first or the opening of the GPU flow valve reaches the threshold first, the CPU water cooling head and the GPU water cooling head are connected in series by opening and closing the corresponding flow direction valve and flow valve; When the opening of the CPU flow valve reaches the threshold first, the control module is configured to control the opening and closing of the corresponding flow direction valves so that the CPU water cooling head, the GPU water cooling head, the water pump and the water cooling box are connected in series, and the cooling water of the water cooling box first passes through the CPU water cooling head, that is, The control module controls the GPU flow valve to be closed, the first flow direction valve to be closed, the third flow direction valve to be closed, and the second flow direction valve to be opened; When the opening of the GPU flow valve reaches the threshold first, the control module is configured to control the opening and closing of the corresponding flow direction valve so that the GPU water cooling head, the CPU water cooling head, the water pump and the water cooling box are connected in series, and the cooling water of the water cooling box first passes through the GPU water cooling head, that is, The control module controls the CPU flow valve to close, the first flow direction valve to open, the third flow direction valve to close, and the second flow direction valve to close; The CPU water cooling head and the GPU water cooling head are connected to the return pipe through a T-shaped three-way pipe; The reflux pipe is connected to the vertical pipe of the T-shaped three-way pipe; A filter screen is arranged inside the horizontal pipe of the T-shaped three-way pipe; The third flow direction valve is a butterfly valve and is arranged in the vertical pipe of the T-shaped three-way pipe; The outer peripheral sleeve of the horizontal pipe of the T-shaped three-way pipe is provided with an adjustment component, and the adjustment component is located at the filter screen; The adjustment assembly includes: an upper ring connected to the upper end surface of the horizontal tube, and a lower ring connected to the lower end surface of the horizontal tube; Vertical tubes extend from both ends of the rotating shaft of the third flow direction valve, one end of which is connected to the servo motor and the other end of which is coaxially provided with a gear; The upper ring and the lower ring are meshed with the gear through corresponding connecting rods, and the two connecting rods are located on both sides of the gear; When the opening of the CPU flow valve reaches the threshold first, the control module is configured to control the shaft of the third flow direction valve to rotate forward through the servo motor to close the vertical pipe. At the same time, the forward rotation of the shaft drives the upper ring and the lower ring to move in opposite directions to stretch the filter, so as to prevent impurities in the pipeline on the CPU side from passing through the filter to block the pipeline on the GPU side, and reversely flush the GPU water cooling head; and When the opening of the GPU flow valve reaches the threshold first, the control module is configured to control the reversal of the shaft of the third flow direction valve through a servo motor to close the vertical pipe. At the same time, the reversal of the shaft drives the upper ring and the lower ring to move the extrusion filter to prevent impurities in the pipeline on the GPU side from passing through the filter and blocking the pipeline on the CPU side, and reverse flushing the CPU water cooling head.

2. The modular integrated machine water cooling temperature compensation system according to claim 1, characterized in that: The vertical pipe is provided with a hanging ring above the third flow direction valve; A linkage rod is arranged in the horizontal tube, one end of which is connected to the inner wall of the horizontal tube close to the upper part of the filter screen, and the other end of which is connected to the hanging ring; When the upper ring and the lower ring stretch or squeeze the filter screen, the linkage rod rises and falls due to the deformation of the horizontal tube, thereby driving the hanging ring to move back and forth to clean the inner wall of the vertical tube.

3. A method for operating a water-cooled heat dissipation temperature compensation system for a modular all-in-one machine as claimed in any one of claims 1 to 2, characterized in that: include: When the CPU water cooling head and the GPU water cooling head are connected in parallel, the control module is configured to adjust the opening of the CPU flow valve and the GPU flow valve respectively to distribute the flow according to the data sent by the CPU temperature sensor and the GPU temperature sensor; When the opening of the CPU flow valve reaches the threshold first, the control module is configured to control the opening and closing of the corresponding flow direction valves so that the CPU water cooling head, the GPU water cooling head, the water pump and the water cooling box are connected in series, and the cooling water of the water cooling box passes through the CPU water cooling head first; and When the opening of the GPU flow valve reaches the threshold first, the control module is configured to control the opening and closing of the corresponding flow valves so that the GPU water cooling head, the CPU water cooling head, the water pump and the water cooling box are connected in series, and the cooling water of the water cooling box passes through the GPU water cooling head first.

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