NBF-based FCBGA substrate manufacturing method and FCBGA substrate

Abstract

The present application discloses a method for manufacturing an FCBGA substrate based on NBF and an FCBGA substrate. The method comprises: performing a baking preheating treatment on the copper surface of the substrate prepared with a circuit; placing an NBF film on the preheated copper surface, wherein the NBF film comprises a PET film and an NBF resin surface, the NBF resin surface contacts the copper surface, and the PET film does not contact the copper surface; performing vacuum lamination and metal hot pressing treatment to press the NBF resin surface and the copper surface; performing a segmented curing treatment on the NBF resin surface after removing the PET film, and performing laser drilling on the cured NBF resin surface to form a blind hole for connection between the NBF resin surface and the copper surface; removing the glue residue at the hole wall and the bottom of the blind hole; and making an outer layer circuit on the cured NBF resin surface to obtain a layer of circuit pattern. The FCBGA substrate can be made using the NBF film, so that the FCBGA substrate can be mass-produced.

Description

Technical Field

[0001] The present application relates to the technical field of packaging substrate manufacturing, and in particular to a method for manufacturing an FCBGA substrate based on NBF and an FCBGA substrate. Background Art

[0002] FCBGA (Flip Chip Ball Grid Array) is a type of packaging substrate, which is generally made using the SAP process. Compared with other packaging forms, this packaging not only provides excellent electrical performance, but also reduces the loss and inductance between component interconnections, reduces electromagnetic interference problems, and withstands higher frequencies, making it possible to break through the overclocking limit. With the continuous advancement of chip manufacturing technology, the chip industry is in urgent need of a new material with excellent insulation, heat resistance and ease of use. ABF substrates are suitable for high-performance computing chips such as CPU, GPU, FPGA, and ASIC due to their advantages such as small line width and line spacing and many pins. ABF (Ajinomoto Build-up Film) is ajinomoto build-up film, a thin film made of synthetic resin materials with good insulation. ABF build-up films are mainly used in personal computers, servers, 5G bases, AI chips, and other fields. ABF substrates are widely used in high-performance computing chips in satellites, 5G base stations, and self-driving cars.

[0003] However, at present, the production of ABF film is limited, which leads to the limitation of mass production of FCBGA package substrates, and cannot meet the demand for FCBGA package substrates in the domestic and foreign markets. Therefore, how to make FCBGA substrates without using ABF is an urgent problem to be solved. Summary of the invention

[0004] The following is an overview of the topics described in detail in this article.

[0005] The embodiments of the present application provide a method for manufacturing an FCBGA substrate based on NBF and an FCBGA substrate, which can manufacture the FCBGA substrate using an NBF film, thereby enabling the FCBGA substrate to be mass-produced.

[0006] In a first aspect, an embodiment of the present application provides a method for manufacturing a FCBGA substrate based on NBF, comprising:

[0007] Performing a baking preheating treatment on the copper surface of the substrate prepared with the circuit;

[0008] placing an NBF film on the preheated copper surface, wherein the NBF film comprises a PET film and an NBF resin surface, the NBF resin surface is in contact with the copper surface, and the PET film is not in contact with the copper surface;

[0009] The NBF film placed on the copper surface is subjected to vacuum lamination and metal hot pressing treatment to press the NBF resin surface onto the copper surface;

[0010] After removing the PET film, the NBF resin surface is subjected to a segmented curing treatment to cure the NBF resin surface;

[0011] Laser drilling is performed on the solidified NBF resin surface to form a blind hole for communication between the NBF resin surface and the copper surface;

[0012] After laser drilling, removing the glue residue on the hole wall and the hole bottom of the blind hole;

[0013] An outer layer circuit is made on the solidified NBF resin surface to obtain a layer of circuit pattern.

[0014] According to some embodiments of the present application, the outer layer circuit is formed on the cured NBF resin surface to obtain a layer of circuit pattern, including:

[0015] By PHT horizontal copper deposition, a 0.8um conductive copper layer is formed in the blind hole and on the surface of the NBF resin surface;

[0016] Drying the conductive copper layer;

[0017] Performing lamination treatment on the dried conductive copper layer, and laminating a photosensitive film on the conductive copper layer;

[0018] After aligning the circuit positive film with the substrate covered with the photosensitive film, exposure, film stripping and development are performed to reveal the circuit pattern;

[0019] The circuit pattern is copper plated by a blind hole filling process to fill the hole copper and the surface copper to form an electroplated copper layer;

[0020] The conductive copper layer of 0.8 um not covered by the electroplated copper layer is removed by flash etching to obtain a layer of the circuit pattern; wherein the copper thickness etching amount of the flash etching is less than 2 um.

[0021] According to some embodiments of the present application, the drying the conductive copper layer includes: drying the conductive copper layer at 150 degrees Celsius for 30 minutes.

[0022] According to some embodiments of the present application, the conductive copper layer after drying is subjected to lamination treatment, comprising:

[0023] After the conductive copper layers on both sides are washed and laminated, vacuum lamination is performed within 1 hour after copper deposition at the PHT level.

[0024] According to some embodiments of the present application, the baking preheating treatment of the copper surface of the substrate prepared with the circuit includes: baking the copper surface at a temperature of 130 degrees Celsius for 30 minutes.

[0025] According to some embodiments of the present application, the step of curing the NBF resin surface in sections includes:

[0026] First, bake the substrate covered with the NBF resin surface at 100 degrees Celsius for 30 minutes;

[0027] The substrate covered with the NBF resin surface was then baked at 180 degrees Celsius for 30 minutes.

[0028] According to some embodiments of the present application, the method further includes:

[0029] After obtaining a layer of circuit patterns, the copper surface of the substrate prepared with the circuits is subjected to baking preheating treatment;

[0030] placing an NBF film on the preheated copper surface, wherein the NBF film comprises a PET film and an NBF resin surface, the NBF resin surface is in contact with the copper surface, and the PET film is not in contact with the copper surface;

[0031] The NBF film placed on the copper surface is subjected to vacuum lamination and metal hot pressing treatment to press the NBF resin surface onto the copper surface;

[0032] After removing the PET film, the NBF resin surface is subjected to a segmented curing treatment to cure the NBF resin surface;

[0033] Laser drilling is performed on the solidified NBF resin surface to form a blind hole for communication between the NBF resin surface and the copper surface;

[0034] After laser drilling, removing the glue residue on the hole wall and the hole bottom of the blind hole;

[0035] Making an outer layer circuit on the solidified NBF resin surface to obtain a new layer of circuit pattern;

[0036] The number of circuit layers is determined according to the substrate manufacturing requirements, and after repeating the number of circuit layers for multiple times, a multi-layer circuit packaging substrate is obtained.

[0037] According to some embodiments of the present application, after obtaining the multi-layer circuit packaging substrate, the method further includes:

[0038] The multi-layer circuit package substrate is subjected to an AOI optical inspection process to confirm that the circuits on the multi-layer circuit package substrate meet the circuit requirements.

[0039] According to some embodiments of the present application, after performing an AOI optical inspection process on the multi-layer circuit package substrate to confirm that the circuits on the multi-layer circuit package substrate meet the circuit requirements, the method further includes:

[0040] The multi-layer circuit packaging substrate is subjected to solder masking, wire capping, surface electroplating, molding, final inspection and packaging to obtain a finished multi-layer circuit packaging substrate; wherein the surface electroplating is performed by using OSP process on both surfaces of the multi-layer circuit packaging substrate.

[0041] In a second aspect, an embodiment of the present application provides an NBF-based FCBGA substrate, which is prepared by the NBF-based FCBGA substrate manufacturing method as described in any one of the embodiments of the first aspect.

[0042] The embodiment of the present application includes: first, preheating the copper surface of the substrate prepared with the circuit by baking; second, placing an NBF film on the preheated copper surface, wherein the NBF film includes a PET film and an NBF resin surface, the NBF resin surface contacts the copper surface, and the PET film does not contact the copper surface; then, vacuum laminating and metal hot pressing the NBF film placed on the copper surface to press the NBF resin surface with the copper surface; then, after removing the PET film, performing a segmented curing treatment on the NBF resin surface to solidify the NBF resin surface; then, laser drilling the solidified NBF resin surface to form a blind hole for connection between the NBF resin surface and the copper surface; then, after laser drilling, removing the glue residue at the hole wall and the bottom of the blind hole; finally, making an outer layer circuit on the solidified NBF resin surface to obtain a layer of circuit pattern, and completing the FCBGA substrate using the NBF film. That is to say, the embodiment of the present application can make an FCBGA substrate using the NBF film, so that the FCBGA substrate can be mass-produced.

[0043] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or understood by practicing the present application. The purpose and other advantages of the present application can be realized and obtained through the structures particularly pointed out in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0045] Figure 1 It is a flow chart of a method for manufacturing a FCBGA substrate based on NBF provided by an embodiment of the present application;

[0046] Figure 2It is a schematic diagram of the attachment and bonding of the NBF resin surface and the copper surface after vacuum lamination and metal hot pressing treatment provided by one embodiment of the present application;

[0047] Figure 3 This is a schematic diagram of a specific process of performing segmented curing treatment on a NBF resin surface provided by an embodiment of the present application;

[0048] Figure 4 is a schematic diagram of a blind hole formed by laser drilling provided by an embodiment of the present application;

[0049] Figure 5 This is an embodiment of the present application. Figure 1 Specific flow chart of step S170 in FIG. DETAILED DESCRIPTION

[0050] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0051] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0052] In the description of this application, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0053] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0054] The present application provides a method for manufacturing an FCBGA substrate based on NBF and an FCBGA substrate, the method comprising: preheating the copper surface of the substrate prepared with circuits by baking; placing an NBF film on the preheated copper surface, wherein the NBF film comprises a PET film and an NBF resin surface, the NBF resin surface contacts the copper surface, and the PET film does not contact the copper surface; performing vacuum lamination and metal hot pressing to press the NBF resin surface and the copper surface; performing segmented curing treatment on the NBF resin surface after removing the PET film, performing laser drilling on the cured NBF resin surface, so that blind holes for connection are formed between the NBF resin surface and the copper surface; removing the glue residue at the hole wall and the bottom of the blind hole; and making an outer layer circuit on the cured NBF resin surface to obtain a layer of circuit pattern. The FCBGA substrate can be made using the NBF film, so that the FCBGA substrate can be mass-produced.

[0055] The embodiments of the present application are further described below in conjunction with the accompanying drawings.

[0056] First, as Figure 1 As shown, Figure 1 It is a flow chart of a method for manufacturing a FCBGA substrate based on NBF provided by an embodiment of the present application, and the method includes but is not limited to steps S110 to S170.

[0057] Step S110: performing a baking preheating treatment on the copper surface of the substrate on which the circuit is prepared.

[0058] Step S120: placing an NBF film on the preheated copper surface, wherein the NBF film comprises a PET film and an NBF resin surface, the NBF resin surface contacts the copper surface, and the PET film does not contact the copper surface.

[0059] Step S130: vacuum laminating and metal hot pressing the NBF film placed on the copper surface to press the NBF resin surface onto the copper surface.

[0060] Step S140: After removing the PET film, the NBF resin surface is subjected to segmented curing treatment to solidify the NBF resin surface.

[0061] Step S150: laser drilling is performed on the solidified NBF resin surface to form blind holes for connection between the NBF resin surface and the copper surface.

[0062] Step S160: After laser drilling, remove the glue residue on the hole wall and the hole bottom of the blind hole.

[0063] Step S170: making an outer layer circuit on the cured NBF resin surface to obtain a layer of circuit pattern.

[0064] Through step S110 to step S170, first, the copper surface of the substrate prepared with the circuit is baked and preheated; secondly, an NBF film is placed on the preheated copper surface, wherein the NBF film includes a PET film and an NBF resin surface, the NBF resin surface is in contact with the copper surface, and the PET film is not in contact with the copper surface; then, the NBF film placed on the copper surface is vacuum laminated and metal hot pressed to press the NBF resin surface with the copper surface; then, after removing the PET film, the NBF resin surface is subjected to segmented curing treatment to solidify the NBF resin surface; then, the solidified NBF resin surface is laser drilled to form a blind hole for connection between the NBF resin surface and the copper surface; then, after laser drilling, the glue residue at the hole wall and the bottom of the blind hole is removed; finally, an outer layer circuit is made on the solidified NBF resin surface to obtain a layer of circuit pattern, and the FCBGA substrate is made using the NBF film. That is to say, the embodiment of the present application can make the FCBGA substrate using the NBF film, so that the FCBGA substrate can be mass-produced.

[0065] It should be noted that NBF (Nanoscale Build-up Film) material is a new type of high-end build-up film with high heat resistance, low thermal expansion coefficient, low elastic modulus, excellent fluidity and good processability. It is mainly used for the research and development of multi-layer FCBGA packaging substrates or BGA packaging substrate products.

[0066] NBF laminated film uses high-purity nanomaterials and evenly disperses them. After pre-curing, the NBF laminated film can form a dense and uniform concave-convex microstructure through chemical treatment, that is, a slight and uniform surface roughness. Therefore, NBF laminated film is conducive to improving the adhesion after copper plating and is suitable for SAP fine line processing. In addition, NBF laminated film does not contain glass fiber in the film, so it is an insulating resin material for thick copper lines.

[0067] NBF film includes NBF resin surface and PET film; among them, PET (Polyester Film) film has excellent mechanical properties and heat resistance. Its toughness is the best among all thermoplastics. Its tensile strength and impact strength are much higher than those of ordinary films. It can protect the NBF resin surface during subsequent vacuum lamination and metal hot pressing treatment. The NBF resin surface has good electrical insulation properties.

[0068] According to some embodiments of the present application, step S110: performing a baking preheating treatment on the copper surface of the substrate prepared with the circuit, including: baking the copper surface at a temperature of 130 degrees Celsius for 30 minutes.

[0069] It is understandable that to prepare the inner circuit substrate, the first step is to pre-bake the copper surface of the circuit substrate at a temperature of 130 degrees Celsius for 30 minutes. In this way, by preheating the substrate with circuits, moisture on the board surface can be removed; preheating the copper surface is conducive to better bonding between the copper surface and the NBF resin surface, and in the subsequent hot pressing of the NBF film metal, it is conducive to increasing the temperature step and improving the quality of the film.

[0070] Specifically, in step S120, after preheating the copper surface, the NBF film obtained by automatic cutting is placed on the preheated copper surface, wherein the PET film is on the outside and does not contact the copper surface; the NBF resin surface is on the inside and contacts the copper surface. It should be noted that the shape of the cut NBF film matches the shape of the substrate to be laminated.

[0071] Specifically, in step S130, a vacuum lamination metal hot press is used to perform vacuum lamination and metal hot pressing on the NBF film placed on the copper surface. The vacuum lamination is used to make the surface of the NBF film smoother, and the metal hot press is used to apply pressure to the copper surface to achieve plastic deformation, so that the NBF resin surface and the copper surface can be better attached and bonded (such as Figure 2 Specifically, when a vacuum lamination metal hot press is used, the flattening parameter pressure is vacuum pressure, and the hot pressing temperature is 80 degrees Celsius.

[0072] It should be noted that NBF film replaces prepreg and copper foil. Therefore, in the process of NBF film lamination, there will be no bubble and void problems that exist in PP prepreg, and NBF film has good filling effect. The uniformity of NBF film is the flatness after vacuum flattening. When the thickness of NBF material is selected as 20um, the uniformity of NBF film is 20±2um after vacuum flattening.

[0073] It can be understood that the vacuum flattening method can ensure that there are no bubbles, no voids, and good glue filling, which ensures good lamination quality and enables a reliable connection between the NBF film and the substrate, laying a hardware foundation for subsequent processes and layer addition.

[0074] It is understandable that after completing the vacuum lamination and hot pressing treatment, the PET film needs to be removed first so that the NBF resin surface can be directly cured in sections to improve the efficiency of curing the NBF resin surface.

[0075] Combination Figure 3 According to some embodiments of the present application, step S140 is further described, and in step S140, "performing segmented curing treatment on the substrate covered with the NBF resin surface" includes steps S141 to S142.

[0076] Step S141: first bake the substrate covered with the NBF resin surface at 100 degrees Celsius for 30 minutes.

[0077] Step S142: bake the substrate covered with the NBF resin surface at 180 degrees Celsius for 30 minutes.

[0078] Through step S141 to step S142, the NBF resin surface is gradually and stably completely cured by staged heating, with good curing effect. In addition, completely curing the NBF resin surface provides a reliable hardware foundation for subsequent processes and layer addition.

[0079] It is understood that after the NBF resin surface is cured, the step S150 is continued to perform laser drilling on the cured NBF resin surface to form a blind hole (such as a hole) for connection between the NBF resin surface and the copper surface. Figure 4 as shown).

[0080] It should be noted that the embodiment of the present application uses NBF film instead of prepreg and copper foil, so when laser blind vias are drilled, blind vias are formed by directly laser drilling from NBF film to copper. Since laser drilling of the inner layer of the copper-clad substrate is a technology well known to those skilled in the art, the specific laser principle and laser drilling method are not limited here.

[0081] Next, continue to execute step S160: after laser drilling, remove the glue residue on the hole wall and the bottom of the blind hole; make the blind hole clean, prepare for the subsequent blind hole filling; help to ensure that the blind hole has good interlayer electrical conduction performance after metallization.

[0082] According to some embodiments of the present application, Figure 5 , Figure 5 This is an embodiment of the present application. Figure 1 Specific flow diagram of step S170; further explanation of step S170, step S170: making an outer layer circuit on the cured NBF resin surface to obtain a layer of circuit pattern, including but not limited to steps S171 to step S176.

[0083] Step S171: forming a 0.8 um conductive copper layer in the blind hole and on the surface of the NBF resin surface by PHT horizontal copper deposition.

[0084] Step S172: drying the conductive copper layer.

[0085] Step S173: performing lamination processing on the dried conductive copper layer, and laminating the photosensitive film on the conductive copper layer.

[0086] Step S174: After aligning the circuit positive film with the substrate covered with the photosensitive film, exposure, film stripping and development are performed to reveal the circuit pattern.

[0087] Step S175: copper is plated on the circuit pattern through a blind hole filling process to fill the hole copper and the surface copper to form an electroplated copper layer.

[0088] Step S176: removing the 0.8 um conductive copper layer not covered by the electroplated copper layer by flash etching to obtain a layer of circuit pattern; wherein the copper thickness etching amount by the flash etching is less than 2 um.

[0089] Through steps S171 to S176, circuit preparation is completed.

[0090] It can be understood that in step S171, the hole metallization (PTH) horizontal copper deposition process is an electrochemical deposition process for depositing copper on a flat substrate. The horizontal copper deposition process is that copper ions are reduced from the electrolyte and deposited on the surface of the substrate to form a uniform, dense, and well-adhered copper film. Through step S171, a thin layer of chemical copper is deposited on the hole wall after drilling to provide conductivity for subsequent electroplating copper.

[0091] According to some embodiments of the present application, step S172: drying the conductive copper layer includes: drying the conductive copper layer at 150 degrees Celsius for 30 minutes, which can remove moisture from the board surface and prepare for subsequent processing.

[0092] According to some embodiments of the present application, the step S173 of "laminating the dried conductive copper layer" includes: washing and laminating the conductive copper layers on both sides, and then transferring to vacuum lamination within 1 hour after PTH horizontal copper deposition. Specifically, the outer layer adopts the SAP process, first washing and laminating, and then directly transferring to vacuum lamination within 1 hour after PTH horizontal copper deposition, which effectively avoids board surface oxidation.

[0093] It should be noted that after the circuit positive film is aligned with the substrate covered with the photosensitive film through step S174, first, exposure is performed using an etched spacing film to expose and harden the photosensitive film on the area to be etched away later, while the photosensitive film on the remaining circuits is not exposed and hardened; then, a developer is used to remove the photosensitive film on the circuit to develop the circuit pattern.

[0094] Next, step S175 is performed: copper is plated on the circuit pattern through a blind hole filling process to fill the hole copper and the surface copper to form an electroplated copper layer. It can be understood that the corresponding hole filling program can be selected according to specific product requirements. Therefore, this application does not make specific restrictions on the hole filling program used.

[0095] It should be noted that when performing step S176, the 0.8um copper thickness of the PTH horizontal copper deposition is removed by flash etching (micro-etching). Compared with the conventional flash etching of 2um in the mSAP process, the copper thickness etching amount of the flash etching treatment used in this application is smaller, which effectively improves the NBF material circuit process capability and meets the 15 / 15um ultra-fine circuit FCBGA packaging substrate manufacturing capability.

[0096] According to some embodiments of the present application, the method further includes: after obtaining a layer of circuit pattern, baking and preheating the copper surface of the substrate prepared with the circuit; placing an NBF film on the preheated copper surface, wherein the NBF film includes a PET film and an NBF resin surface, the NBF resin surface is in contact with the copper surface, and the PET film is not in contact with the copper surface; vacuum laminating and metal hot pressing the NBF film placed on the copper surface to press the NBF resin surface with the copper surface; after removing the PET film, performing a segmented curing treatment on the surface covered with the NBF resin to cure the NBF resin surface; laser drilling the cured NBF resin surface to form a blind hole for connection between the NBF resin surface and the copper surface; after laser drilling, removing the glue residue at the hole wall and the bottom of the blind hole; making an outer layer of circuit on the cured NBF resin surface to obtain a new layer of circuit pattern; determining the number of circuit layers according to the substrate manufacturing requirements, and repeating multiple times according to the number of circuit layers to obtain a multi-layer circuit packaging substrate.

[0097] According to some embodiments of the present application, after obtaining the multi-layer circuit packaging substrate, it also includes: performing AOI optical inspection processing on the multi-layer circuit packaging substrate to confirm that the circuits on the multi-layer circuit packaging substrate meet the circuit requirements.

[0098] According to some embodiments of the present application, after performing AOI optical inspection on the multi-layer circuit package substrate to confirm that the circuits on the multi-layer circuit package substrate meet the circuit requirements, the method further includes:

[0099] The multi-layer circuit packaging substrate is subjected to solder mask, wire capping, surface electroplating, molding, final inspection and packaging to obtain a finished multi-layer circuit packaging substrate; wherein, the surface electroplating is performed using the OSP process on both surfaces of the multi-layer circuit packaging substrate.

[0100] It should be noted that after the multi-layer circuit packaging substrate is prepared, the post-process process is produced according to the conventional process, such as AOI optical inspection, solder mask, wire capping, surface electroplating, molding, final inspection, etc.

[0101] In a second aspect, an embodiment of the present application provides an NBF-based FCBGA substrate, which is prepared by the NBF-based FCBGA substrate manufacturing method as described in any one of the embodiments of the first aspect.

[0102] It should be noted that the present application develops a process flow for producing a multi-layer FCBGA package substrate based on NBF materials to prepare a FCBGA substrate. The obtained multi-layer FCBGA package substrate meets the 15 / 15um line width spacing design requirements, and the warpage is reduced from 1% to ≤0.75%. And the relevant reliability test items are qualified.

[0103] In summary, this application designs a process flow for producing BGA type packaging substrates based on NBF film, and uses vacuum flattening technology to achieve layer addition between the film and the carrier, and the outer layer combined with SAP process to achieve ultra-dense and fine line process capabilities. The batch production of FCBGA products with a line width of 15 / 15um and more than four layers is achieved, which is conducive to improving the quality yield of FCBGA products and meeting the reliability quality requirements of multi-layer FCBGA packaging substrates. It has broad application prospects, good economic and social benefits.

[0104] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the embodiments disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary technical means in the art that are not disclosed in the present application.

[0105] The above is a specific description of the preferred implementation of the present application, but the present application is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions without violating the spirit of the present application. These equivalent deformations or substitutions are all included in the scope defined by the present application.

Claims

1. A method for manufacturing a FCBGA substrate based on NBF, characterized in that: include: Performing a baking preheating treatment on the copper surface of the substrate prepared with the circuit; placing an NBF film on the preheated copper surface, wherein the NBF film comprises a PET film and an NBF resin surface, the NBF resin surface is in contact with the copper surface, and the PET film is not in contact with the copper surface; The NBF film placed on the copper surface is subjected to vacuum lamination and metal hot pressing treatment to press the NBF resin surface onto the copper surface; After removing the PET film, the NBF resin surface is subjected to a segmented curing treatment to cure the NBF resin surface; Laser drilling is performed on the solidified NBF resin surface to form a blind hole for communication between the NBF resin surface and the copper surface; After laser drilling, removing the glue residue on the hole wall and the hole bottom of the blind hole; Making an outer layer circuit on the solidified NBF resin surface to obtain a layer of circuit pattern; The step of preheating the copper surface of the substrate with the circuits includes: baking the copper surface at a temperature of 130 degrees Celsius for 30 minutes; The stepwise curing of the NBF resin surface includes: firstly baking the substrate covered with the NBF resin surface at 100 degrees Celsius for 30 minutes; and then baking the substrate covered with the NBF resin surface at 180 degrees Celsius for 30 minutes.

2. The method for manufacturing a FCBGA substrate based on NBF according to claim 1, characterized in that: The method of making an outer layer circuit on the cured NBF resin surface to obtain a layer of circuit pattern comprises: By PHT horizontal copper deposition, a 0.8um conductive copper layer is formed in the blind hole and on the surface of the NBF resin surface; Drying the conductive copper layer; Performing lamination treatment on the dried conductive copper layer, and laminating a photosensitive film on the conductive copper layer; After aligning the circuit positive film with the substrate covered with the photosensitive film, exposure, film stripping and development are performed to reveal the circuit pattern; The circuit pattern is copper plated by a blind hole filling process to fill the hole copper and the surface copper to form an electroplated copper layer; The conductive copper layer of 0.8 um not covered by the electroplated copper layer is removed by flash etching to obtain a layer of the circuit pattern; wherein the copper thickness etching amount of the flash etching is less than 2 um.

3. The method for manufacturing a FCBGA substrate based on NBF according to claim 2, characterized in that: The drying treatment of the conductive copper layer includes: drying the conductive copper layer at 150 degrees Celsius for 30 minutes.

4. The method for manufacturing a FCBGA substrate based on NBF according to claim 2, characterized in that: The conductive copper layer after drying is subjected to lamination treatment, comprising: After the conductive copper layers on both sides are washed and laminated, vacuum lamination is performed within 1 hour after copper deposition at the PHT level.

5. The method for manufacturing a FCBGA substrate based on NBF according to any one of claims 1 to 4, characterized in that: The method further comprises: After obtaining a layer of circuit patterns, the copper surface of the substrate prepared with the circuits is subjected to baking preheating treatment; placing an NBF film on the preheated copper surface, wherein the NBF film comprises a PET film and an NBF resin surface, the NBF resin surface is in contact with the copper surface, and the PET film is not in contact with the copper surface; The NBF film placed on the copper surface is subjected to vacuum lamination and metal hot pressing treatment to press the NBF resin surface onto the copper surface; After removing the PET film, the NBF resin surface is subjected to a segmented curing treatment to cure the NBF resin surface; Laser drilling is performed on the solidified NBF resin surface to form a blind hole for communication between the NBF resin surface and the copper surface; After laser drilling, removing the glue residue on the hole wall and the hole bottom of the blind hole; Making an outer layer circuit on the solidified NBF resin surface to obtain a new layer of circuit pattern; The number of circuit layers is determined according to the substrate manufacturing requirements, and after repeating the number of circuit layers for multiple times, a multi-layer circuit packaging substrate is obtained.

6. The method for manufacturing a FCBGA substrate based on NBF according to claim 5, characterized in that: After obtaining the multi-layer circuit packaging substrate, the method further includes: The multi-layer circuit package substrate is subjected to an AOI optical inspection process to confirm that the circuits on the multi-layer circuit package substrate meet the circuit requirements.

7. The method for manufacturing a FCBGA substrate based on NBF according to claim 6, characterized in that: After performing AOI optical inspection on the multi-layer circuit package substrate to confirm that the circuits on the multi-layer circuit package substrate meet the circuit requirements, the method further includes: The multi-layer circuit packaging substrate is subjected to solder masking, wire capping, surface electroplating, molding, final inspection and packaging to obtain a finished multi-layer circuit packaging substrate; wherein the surface electroplating is performed by using OSP process on both surfaces of the multi-layer circuit packaging substrate.

8. A NBF-based FCBGA substrate, characterized in that: The FCBGA substrate is prepared by the NBF-based FCBGA substrate manufacturing method as described in any one of claims 1 to 7.

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