A wafer test probe high-strength high-conductivity Cu-Ag alloy ultra-thin strip and a preparation method thereof

Abstract

The application discloses a kind of high-strength high-conductivity Cu-Ag alloy ultra-thin strip for wafer test probe and a preparation method thereof.The Cu-Ag alloy ultra-thin strip contains 6-20wt% of Ag, the rest is Cu and unavoidable impurities, and the content of impurities is less than 0.01wt%.The main components of the Cu-Ag alloy ultra-thin strip are Cu-based solid solution and Ag-based solid solution, and the Ag-rich phase is distributed in the Cu-based solid solution in the form of fiber organization.The average grain size of the Cu-Ag alloy ultra-thin strip is 470-600nm, and the texture is mainly {211}<111> copper texture.The thickness of the Cu-Ag alloy ultra-thin strip is 30-60μm.The preparation method includes the processes of melting and casting, homogenization treatment, rough rolling, aging treatment, intermediate rolling, intermediate annealing, finish rolling and strip tension leveling annealing.The preparation method of the Cu-Ag alloy ultra-thin strip does not need to add other strengthening elements, the preparation process is simple, and the high-strength high-conductivity Cu-Ag ultra-thin strip can be mass-produced.The tensile strength of the Cu-Ag ultra-thin strip is 1132-1180MPa, the yield strength is 1052-1101MPa, the electrical conductivity is about 70%IACS, and the hardness is 274-303HV 0.2 , which can be used as a material for medium-power wafer test probe.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of alloy materials, and particularly relates to a high-strength and high-conductivity Cu-Ag alloy ultra-thin strip for wafer test probes and a preparation method thereof. BACKGROUND

[0002] The semiconductor test probe is mainly used in the design verification, wafer test, finished product test and other links of a semiconductor, and is a core component and consumable throughout the whole semiconductor production process. The probe needs to have different current-carrying capacities according to the power of the wafer to be tested, and the current-carrying capacity is closely related to the conductivity of the probe material. The conductivity of the probe for testing medium power needs to reach more than 65%, and the tensile strength needs to reach more than 1000 MPa. In order to meet the minimum spacing of the probe card, the size of the probe is micron level. At present, the commonly used probe materials include tungsten alloy, beryllium copper, Cu-Ag alloy and the like. Tungsten has the advantages of high strength, high conductivity and high temperature resistance, but it also has the problems of large brittleness, easy breakage and easy scratching of the wafer surface, which are not conducive to use. Beryllium copper has high strength and corrosion resistance, but the conductivity of beryllium copper is low, and at the same time, toxic beryllium oxide is generated in the preparation process, which causes harm to the human body. The Cu-Ag alloy maintains high strength and also has high conductivity, which can meet the performance requirements of the probe for testing medium power wafers.

[0003] At present, the research on high-strength and high-conductivity Cu-Ag alloy mainly focuses on the preparation of wire materials, and the Cu-Ag alloy strip prepared by the existing technology cannot meet the performance requirements of the probe for testing wafers. The application aims to provide a high-efficiency and batch preparation method for a high-strength and high-conductivity Cu-Ag alloy ultra-thin strip for wafer test probes, which does not add additional strengthening elements, adopts medium-frequency induction melting, and realizes the high-efficiency and batch preparation of the Cu-Ag alloy ultra-thin strip by means of solid solution-rolling-ageing, large deformation cold rolling and intermediate heat treatment. SUMMARY

[0004] The first object of the application is to provide a high-strength and high-conductivity Cu-Ag alloy ultra-thin strip, and the second object of the application is to provide a preparation method of the Cu-Ag alloy ultra-thin strip.

[0005] The first object of the application is achieved by a high-strength and high-conductivity Cu-Ag alloy ultra-thin strip, which contains 6-20wt% of Ag and the rest of Cu and unavoidable impurities, and the content of the impurities is less than 0.01wt%;

[0006] The Cu-Ag alloy ultra-thin strip mainly consists of a Cu-based solid solution and an Ag-based solid solution, and the Ag-rich phase is distributed in the Cu-based solid solution in the form of fiber organization;

[0007] The average grain size of the Cu-Ag alloy ultra-thin strip is 470-600nm, and the texture is mainly {211} <111> copper texture.

[0008] The thickness of the Cu-Ag alloy ultra-thin strip is 30-60 μm;

[0009] The tensile strength of the Cu-Ag alloy ultra-thin strip is 1132-1180 MPa, the yield strength is 1052-1101 MPa, the electrical conductivity is 69-70.4 %IACS, and the hardness is 274-303 HV 0.2 .

[0010] The second object of the application is achieved by the method for preparing the high-strength high-conductivity Cu-Ag alloy ultra-thin strip, which comprises the steps of melting and casting, homogenizing treatment, rough rolling, aging treatment, intermediate rolling, intermediate annealing, finish rolling, and strip tension leveling annealing.

[0011] In the aging treatment step, the aging temperature is 400-500 ℃, and the time is 5-15 h.

[0012] The intermediate rolling step adopts multi-pass rolling, and the single-pass deformation amount is not higher than 10 %, and the total deformation amount is 90-95 %.

[0013] In the intermediate annealing step, the annealing temperature is 250-350 ℃, and the holding time is 0.5-2 h.

[0014] The method for preparing the Cu-Ag alloy ultra-thin strip of the application adopts solid solution-rolling-aging treatment, which, on one hand, induces Ag phase to precipitate from the Cu matrix to improve the strength of the alloy, and the large deformation amount rolling makes the Ag precipitated phase form Ag fiber structure to produce a strengthening effect, combined with the work hardening of the Cu matrix, to realize high strength of the Cu-Ag alloy ultra-thin strip, and on the other hand, the solid solution followed by rolling with a certain deformation amount can increase the deformation energy storage and improve the recrystallization driving force of the Cu-Ag alloy, so that the Cu-Ag alloy is more likely to recrystallize after the aging treatment, to achieve the effects of refinement and homogenization, thereby improving the plasticity of the Cu-Ag alloy material and being beneficial to the subsequent large deformation amount rolling. In addition, the appropriate intermediate annealing process is added in the preparation process, to regulate the dislocation density and solute atom content of the Cu-Ag alloy and reduce the scattering effect in the alloy to realize high electrical conductivity.

[0015] The Cu-Ag alloy ultra-thin strip prepared by the method of the application has the tensile strength of 1132-1180 MPa, the yield strength of 1052-1101 MPa, the electrical conductivity of about 70 %IACS, and the hardness of 274-303 HV 0.2 , and can be used as a material for wafer detection probes of medium power. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 Figure (a), (b), (c) are cast state microstructure diagrams of Cu-Ag alloys of Examples 1-3, respectively, and Figure (d) is a cast state microstructure diagram of the alloy of Comparative Example 1;

[0017] Figure 2 Figure (a), (b), (c), (d) are solid solution state microstructure diagrams of Cu-Ag alloys of Examples 1-3 and Comparative Example 1, respectively, and Figure (e), (f), (g), (h) are aging state microstructure diagrams of Cu-Ag alloys of Examples 1-3 and Comparative Example 1, respectively. DETAILED DESCRIPTION

[0018] The application will be further described in detail below in conjunction with the accompanying drawings and examples, but the application is not limited in any way by the following description, and any transformation or improvement based on the teaching of the application falls within the protection scope of the application.

[0019] The Cu-Ag alloy ultra-thin strip for wafer test probes provided by the application has an Ag content of 6-20wt%, the rest being Cu and unavoidable impurities, and the impurity content is less than 0.01wt%;

[0020] The Cu-Ag alloy ultra-thin strip mainly consists of Cu-based solid solution and Ag-based solid solution, and the Ag-rich phase is distributed in the Cu-based solid solution in the form of fiber structure;

[0021] The Cu-Ag alloy ultra-thin strip has an average grain size of 470-600nm, and the texture is mainly {211}<111> copper texture;

[0022] The Cu-Ag alloy ultra-thin strip has a thickness of 30-60μm;

[0023] The Cu-Ag alloy ultra-thin strip has a tensile strength of 1132-1180MPa, a yield strength of 1052-1101MPa, an electrical conductivity of 69-70.4%IACS, and a hardness of 274-303HV 0.2 .

[0024] The application also provides a preparation method of the Cu-Ag alloy ultra-thin strip for wafer test probes, which is realized according to the following steps:

[0025] 1) Melting and casting: Cu and Ag raw materials are heated to 1200℃ in a vacuum using a vacuum medium frequency furnace for alloying smelting, and a Cu-Ag ingot is obtained by casting;

[0026] 2) Homogenization treatment: the Cu-Ag ingot obtained in step 1) is placed in a muffle furnace, and the surface of the ingot is polished to a bright finish after quenching;

[0027] 3) Rough rolling: the Cu-Ag ingot after the homogenization treatment of step 2) is rolled;

[0028] 4) Aging treatment: the Cu-Ag block after the rough rolling of step 3) is subjected to aging treatment, and the surface of the block is polished to be bright after air cooling;

[0029] 5) Intermediate rolling: the Cu-Ag block after the aging treatment of step 4) is subjected to multi-pass cold rolling to obtain a Cu-Ag plate;

[0030] 6) Intermediate annealing: the plate after the intermediate rolling of step 5) is subjected to intermediate annealing, and the surface of the plate is polished to be bright after air cooling;

[0031] 7) Finish rolling: the plate after the annealing of step 6) is subjected to finish rolling to obtain a Cu-Ag alloy 30-60 μm ultra-thin strip;

[0032] 8) Strip tension leveling annealing: the ultra-thin strip after the finish rolling of step 7) is subjected to strip tension leveling annealing.

[0033] In step 2), the homogenization treatment temperature is 750-800℃, and the holding time is 4-6h.

[0034] In step 3), the total deformation amount of rough rolling is controlled to be 40-60%.

[0035] In step 4), the aging temperature is 400-500℃, and the holding time is 5-15h.

[0036] In step 5), the single-pass deformation amount of multi-pass cold rolling is controlled to be not higher than 10%, and the total deformation amount is controlled to be 90-95%.

[0037] In step 6), the intermediate annealing temperature is 250-350℃, and the holding time is 0.5h-2h.

[0038] In step 7), the single-pass deformation amount of finish rolling is controlled to be not higher than 5%, and the total deformation amount is controlled to be 99.8-99.95%.

[0039] In step 8), the strip tension leveling annealing temperature is 200-300℃, the holding time is 0.5h-1h, the vacuum degree of leveling annealing is not lower than 5×10 -3 Pa, and the tension is not lower than 400MPa.

[0040] Example 1

[0041] 1) Melting and casting: Cu and Ag with purity ≥99.99% are selected as raw materials, wherein the Ag content is 6wt%, the rest is Cu, and the Cu and Ag raw materials are heated to 1200℃ in vacuum using a vacuum medium frequency furnace for alloying smelting, and a Cu-6Ag ingot is cast; the alloy organization diagram obtained in this step is as followsFigure 1 As shown in (a).

[0042] 2) Homogenization treatment: The Cu-6Ag ingot obtained in step (1) is placed in a muffle furnace, heated to 780℃ and held for 4 hours, then quenched and polished until the surface of the ingot is bright; the alloy microstructure obtained in this step is shown in the figure. Figure 2 As shown in (a).

[0043] 3) Rough rolling: The homogenized Cu-6Ag ingot obtained in step (2) is rolled using a two-roll reversible rolling mill, with the total deformation controlled at 40%, to obtain Cu-6Ag blocks;

[0044] 4) Aging Treatment: The Cu-6Ag block after rough rolling in step 3) is subjected to aging treatment at 500℃ for 5 hours. After air cooling, the surface of the block is polished until bright. The alloy microstructure obtained in this step is shown in the figure below. Figure 2 As shown in (e).

[0045] 5) Intermediate rolling: The Cu-6Ag block after aging treatment in step 4) is subjected to multiple cold rolling passes using a two-roll reversible rolling mill. The deformation amount per pass is controlled at 10%, and the total deformation amount is controlled at 92% to obtain Cu-6Ag plate.

[0046] 6) Intermediate annealing: The sheet material after intermediate rolling in step 5) is subjected to intermediate annealing at a temperature of 350℃ and a holding time of 1 hour. After air cooling, the surface of the sheet material is polished until it is bright.

[0047] 7) Finish rolling: The plate after intermediate annealing in step 6) is finished rolled using a precision four-roll mill. The deformation per pass of the finish rolling is controlled at 5%, and the total deformation is controlled at 99.9%, to obtain a 40μm ultrathin strip of Cu-6Ag alloy.

[0048] 8) Tension leveling annealing: The ultra-thin strip after precision rolling in step 7) is subjected to tension leveling annealing in a vacuum annealing furnace. The vacuum tension leveling annealing temperature is 200℃, and the holding time is 1 hour. The vacuum degree of the leveling annealing is 5×10⁻⁶. -3 Pa, tension is 400 MPa.

[0049] Example 2

[0050] 1) Melting and Casting: Cu and Ag with a purity ≥99.99% are selected as raw materials, with Ag content of 10wt% and the remainder being Cu. The Cu and Ag raw materials are heated to 1200℃ in a vacuum medium-frequency furnace for alloying and melting, and then cast to obtain Cu-10Ag ingots. The alloy microstructure obtained in this step is shown in the figure below. Figure 1 As shown in (b).

[0051] 2) homogenization treatment: the Cu-10Ag ingot obtained in step (1) is placed in a muffle furnace, heated to 800°C for 6h, and then quenched and polished to a bright finish; the microstructure of the alloy obtained in this step is shown in Figure 2 (b).

[0052] 3) rough rolling: the Cu-10Ag ingot obtained in step (2) is rolled using a two-roller reversing mill, with a total deformation of 40%, to obtain a Cu-10Ag bulk;

[0053] 4) aging treatment: the Cu-10Ag bulk obtained in step 3) is subjected to aging treatment at a temperature of 450°C for 10h, and then air-cooled and polished to a bright finish; the microstructure of the alloy obtained in this step is shown in Figure 2 (f).

[0054] 5) intermediate rolling: the Cu-10Ag bulk obtained in step 4) is subjected to multi-pass cold rolling using a two-roller reversing mill, with a single-pass deformation of 8% and a total deformation of 95%, to obtain a Cu-10Ag sheet;

[0055] 6) intermediate annealing: the Cu-10Ag sheet obtained in step 5) is subjected to intermediate annealing at a temperature of 350°C for 2h, and then air-cooled and polished to a bright finish;

[0056] 7) finish rolling: the Cu-10Ag sheet obtained in step 6) is subjected to finish rolling using a precision four-roller mill, with a single-pass deformation of 5% and a total deformation of 99.85%, to obtain a Cu-10Ag alloy 55μm ultra-thin strip.

[0057] 8) strip tension leveling annealing: the ultra-thin strip obtained in step 7) is subjected to strip tension leveling annealing in a vacuum annealing furnace, at a temperature of 220°C for 1h, with a vacuum degree of 5x10 -3 Pa and a tension of 400MPa.

[0058] Example 3

[0059] 1) melting and casting: Cu and Ag with a purity of ≥99.99% are used as raw materials, with an Ag content of 20wt%, and the rest being Cu. The Cu and Ag raw materials are heated to 1200°C in a vacuum using a vacuum medium-frequency furnace for alloying smelting, and a Cu-20Ag ingot is obtained by casting; the microstructure of the alloy obtained in this step is shown in Figure 1 (c).

[0060] 2) homogenization treatment: the Cu-20Ag ingot obtained in step 1) is placed in a muffle furnace, heated to 780℃ for 4h, and then quenched and polished to a bright finish; the microstructure of the alloy obtained in this step is shown in Figure 2 (c).

[0061] 3) rough rolling: the Cu-20Ag ingot obtained in step 2) is rolled using a two-roll reversing mill, with a total deformation of 60%, to obtain a Cu-20Ag bulk;

[0062] 4) aging treatment: the Cu-20Ag bulk obtained in step 3) is subjected to aging treatment at a temperature of 450℃ for 15h, and then air-cooled and polished to a bright finish; the microstructure of the alloy obtained in this step is shown in Figure 2 (g).

[0063] 5) intermediate rolling: the Cu-20Ag bulk obtained in step 4) is subjected to multi-pass cold rolling using a two-roll reversing mill, with a single-pass deformation of 10% and a total deformation of 90%, to obtain a Cu-20Ag sheet;

[0064] 6) intermediate annealing: the Cu-20Ag sheet obtained in step 5) is subjected to intermediate annealing at a temperature of 300℃ for 2h, and then air-cooled and polished to a bright finish;

[0065] 7) finish rolling: the sheet obtained in step 6) is subjected to finish rolling using a precision four-roll mill, with a single-pass deformation of 5% and a total deformation of 99.8%, to obtain a Cu-20Ag alloy 60μm ultra-thin strip.

[0066] 8) strip tension leveling annealing: the ultra-thin strip obtained in step 7) is subjected to strip tension leveling annealing in a vacuum annealing furnace, at a temperature of 240℃ for 1h, with a vacuum degree of 5×10 -3 Pa and a tension of 400MPa.

[0067] Comparative Example 1

[0068] 1) melting and casting: Cu and Ag with a purity of ≥99.99% are used as raw materials, with an Ag content of 6wt%, the rest being Cu, and a vacuum medium frequency furnace is used to heat the Cu and Ag raw materials to 1200℃ for alloying smelting, and a Cu-6Ag ingot is obtained by casting; the microstructure of the alloy obtained in this step is shown in Figure 1 (d), which is basically the same as Figure 1 (a).

[0069] 2) homogenization treatment: the Cu-6Ag ingot obtained in step 1) is placed in a muffle furnace, heated to 780℃ for 4h, and then quenched, and the surface of the ingot is polished to a bright finish; the microstructure of the alloy obtained in this step is shown in Fig. Figure 2 (d).

[0070] 3) aging treatment: the Cu-6Ag block after solid solution in step 2) is subjected to aging treatment, the aging temperature is 450℃, the holding time is 24h, and the surface of the block is polished to a bright finish after air cooling; the microstructure of the alloy obtained in this step is shown in Fig. Figure 2 (h).

[0071] 4) multi-pass cold rolling: the Cu-6Ag ingot after aging treatment in step 3) is subjected to multi-pass cold rolling by using a two-roll reversible rolling mill, and the total deformation amount is controlled to be 90%, thereby obtaining a Cu-6Ag plate;

[0072] 5) intermediate annealing: the Cu-6Ag plate after cold rolling in step 4) is subjected to intermediate annealing, the annealing temperature is 450℃, the holding time is 2h, and the surface of the plate is polished to a bright finish after air cooling;

[0073] 6) multi-pass cold rolling: the Cu-6Ag block after aging in step 4) is subjected to cold rolling by using a two-roll reversible rolling mill, and the total deformation amount is controlled to be 99%, thereby obtaining a Cu-6Ag sheet;

[0074] 7) intermediate annealing: the Cu-6Ag plate after cold rolling in step 6) is subjected to intermediate annealing, the annealing temperature is 350℃, the holding time is 2h, and the surface of the plate is polished to a bright finish after air cooling;

[0075] 8) finish rolling: the plate after annealing in step 6) is subjected to finish rolling by using a precision four-roll rolling mill, the single-pass deformation amount of the finish rolling is controlled to be 5%, and the total deformation amount is controlled to be 99.9%, thereby obtaining a Cu-6Ag alloy 40μm ultra-thin strip.

[0076] 9) strip tension annealing flattening: the ultra-thin strip after finish rolling in step 8) is subjected to strip tension annealing flattening by using a vacuum annealing furnace, the vacuum strip tension annealing flattening temperature is 260℃, the holding time is 1h, and the vacuum degree of the annealing flattening is 5×10 -3 Pa, and the tension is 400MPa.

[0077] From Figure 2It can be seen that after homogenization treatment, part of Ag in the as-cast microstructure of the alloys of Examples 1-3 and Comparative Example 1 is dissolved into the Cu matrix microstructure, and after rolling and aging treatment, the Ag dissolved in the Cu matrix will be precipitated in the form of small size precipitates, and after subsequent rolling, Ag fibers are formed to improve the strength. The alloy of Example 1 has the same composition as the alloy of Comparative Example 1, but the alloy of Example 1 is subjected to plastic deformation before aging, and compared with the alloy of Comparative Example 1 aged at 450°C for 24h, the aging time of the alloy of Example 1 can be shortened to 5h, and the similar precipitate microstructure can be achieved.

[0078] Performance test of the strip prepared in Experimental Example 1-3

[0079] 1. Strength test

[0080] The Cu-Ag ultra-thin strip prepared in Examples 1-3 and Comparative Example 1 was respectively subjected to tensile strength and yield strength test on a universal mechanical property testing machine, and the test results are shown in Table 1.

[0081] 2. Electrical conductivity test

[0082] The Cu-Ag ultra-thin strip prepared in Examples 1-3 and Comparative Example 1 was respectively subjected to electrical conductivity test by using eddy current conductivity meter, and the test results are shown in Table 1.

[0083] 3. Microhardness test

[0084] The Cu-Ag ultra-thin strip prepared in Examples 1-3 and Comparative Example 1 was respectively subjected to hardness test by using microhardness tester, load 0.2kg, load holding time 10s, and the test results are shown in Table 1.

[0085] Table 1 Performance data comparison of Examples 1-3 and Comparative Example 1

[0086]

[0087] From Table 1, it can be obviously seen that the tensile strength, yield strength and microhardness of the alloy strips prepared in Examples 1-3 of the present application are greatly improved compared with those of Comparative Example 1, the strength is increased by more than 200 MPa, and the electrical conductivity is about 70%. Compared with the homogenization-aging treatment-rolling method used in Comparative Example 1, the homogenization-rolling-aging treatment used in the present application can induce Ag phase to precipitate from the Cu matrix to improve the strength of the alloy, and the Ag precipitated phase forms Ag fiber structure to produce a strengthening effect after large deformation rolling, combined with the work hardening of the Cu matrix, the high strength of the Cu-Ag alloy ultra-thin strip is realized. On the other hand, the large deformation rolling after solid solution can increase the deformation energy storage and improve the recrystallization driving force of the Cu-Ag alloy, and the Cu-Ag alloy is more likely to recrystallize after aging treatment, so that the refinement and homogenization effect is achieved, thereby improving the plasticity of the Cu-Ag alloy material, which is beneficial to subsequent large deformation rolling. In addition, the appropriate intermediate annealing process is added in the preparation process, and the synergistic effect realizes the high strength and high electrical conductivity of the Cu-Ag alloy ultra-thin strip. The Cu-Ag alloy ultra-thin strip obtained by the present application has a grain size of 470-600 nm, a texture mainly of {211} <111> copper texture, a tensile strength of 1132-1180 MPa, a yield strength of 1052-1101 MPa, an electrical conductivity of 70% IACS, and a hardness of 274-303 HV 0.2 The material can be used for wafer detection probe of medium power.

[0088] The above description is only the preferred embodiment of the present application, and is not intended to limit the other forms of the present application. Any skilled person in the art can modify or change the above disclosed technical content to equivalent embodiments. However, any simple modification, equivalent change and modification of the above embodiments without departing from the technical solution of the present application, and according to the technical essence of the present application, still belong to the protection scope of the present application.

Claims

1. A high-strength, high-conductivity Cu-Ag alloy ultrathin strip, characterized by, The Cu-Ag alloy ultra-thin strip has an Ag content of 6-20wt%, the rest being Cu and inevitable impurities, and the impurity content is less than 0.01wt%; The Cu-Ag alloy ultra-thin strip is mainly composed of Cu-based solid solution and Ag-based solid solution, and the Ag-rich phase is distributed in the Cu-based solid solution in the form of fiber organization; The Cu-Ag alloy ultra-thin strip has an average grain size of 470-600nm, and the texture is mainly {211}<111> copper texture; The Cu-Ag alloy ultra-thin strip has a thickness of 30-60μm; The Cu-Ag alloy ultra-thin strip has tensile strength of 1132-1180 MPa, yield strength of 1052-1101 MPa, electrical conductivity of 69-70.4% IACS, and hardness of 274-303 HV 0.2 .

2. The method of producing a high-strength high-conductivity Cu-Ag alloy ultra-thin strip as claimed in claim 1, characterized in that, The process comprises melting, homogenization, rough rolling, aging treatment, intermediate rolling, intermediate annealing, finish rolling, and strip tension leveling annealing; In the aging treatment process, the aging temperature is 400-500℃, and the time is 5-15h; The intermediate rolling process adopts multi-pass rolling, and the single-pass deformation is not higher than 10%, and the total deformation is 90-95%; In the intermediate annealing process, the annealing temperature is 250-350℃, and the holding time is 0.5h-2h.

3. The method for preparing the high-strength, high-conductivity Cu-Ag alloy ultrathin strip according to claim 2, characterized in that, In the homogenization process, the homogenization temperature is 750-800℃, and the holding time is 4-6h.

4. The method for preparing the high-strength, high-conductivity Cu-Ag alloy ultrathin strip according to claim 2, characterized in that, In the rough rolling process, the total deformation is 40-60%.

5. The method for preparing the high-strength, high-conductivity Cu-Ag alloy ultrathin strip according to claim 2, characterized in that, In the finish rolling process, the single-pass deformation is controlled to be not higher than 5%, and the total deformation is controlled to be 99.8-99.95%.

6. The method for preparing high-strength, high-conductivity Cu-Ag alloy ultrathin strip according to claim 2, characterized in that, The annealing temperature in the strip tension leveling annealing process is 200-300 DEG C, the holding time is 0.5-1 h, the vacuum degree is not less than 5*10 -3 Pa, and the tension is not less than 400 MPa.

7. Application of the high-strength high-conductivity Cu-Ag alloy ultra-thin strip of claim 1 in preparing wafer test probes.

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