A device for metallizing the blind cavity sidewall of an LTCC substrate and a method for using the same

Abstract

The present invention discloses a device for realizing metallization of the side wall of the blind cavity of an LTCC substrate and a method for using the same, the device comprising: a fixed base, a fixed sliding rod and a material trough; the fixed sliding rod is fixedly arranged on the top side of the fixed base, and the material trough is sleeved on the fixed sliding rod; the fixed sliding rod is also sleeved on a spring, and the spring is arranged between the fixed base and the material trough; the material trough comprises a lower plate, an elastic membrane, an upper plate and a positioning pin, the elastic membrane is arranged between the lower plate and the upper plate, the lower plate body is provided with a second through cavity, the upper plate body is provided with a first through cavity, and the first through cavity stores a first conductor slurry; the fixed base is also provided with a placeholder block, the placeholder block is coaxially arranged with the first through cavity, and the placeholder block can pass through the second through cavity; by pressing down the material trough, the placeholder block pushes the first conductor slurry stored in the first through cavity, so that the first conductor slurry is coated on the cavity inner wall of the submodule containing the through cavity structure fixed on the top of the upper plate.

Description

Technical Field

[0001] The present invention belongs to the field of LTCC circuit substrate manufacturing, and in particular relates to a device for metallizing the sidewall of a blind cavity of an LTCC substrate and a method for using the device. Background Art

[0002] LTCC (low-temperature co-fired ceramics) is widely used in microwave / millimeter-wave communications. However, with the increasing development of miniaturization, high frequency, and compact integration in the communications field, circuit substrates are playing an increasingly important role in hermetic packaging and stacked interconnection.

[0003] The traditional microwave / millimeter wave LTCC component integration method is to assemble components on the surface of the LTCC substrate and then hermetically seal them by welding a metal frame. At the same time, metal ribs are arranged on the metal frame to provide electromagnetic isolation between different component areas. However, this integration method is highly dependent on the airtight welding of metal parts, and the signal cannot be transmitted upward along the Z direction of the package, making it unsuitable for stacked integration of packages.

[0004] The potential LTCC all-ceramic hermetic packaging substrate fully utilizes the molding advantages of the LTCC process in complex structure deep cavities, uses an integrated ceramic cavity for hermetic packaging, and gets rid of the dependence on metal parts. At the same time, the metallized vias can pass through the ceramic packaging area to realize the upward transmission of signals in the Z direction of the package, supporting the stacking integration of the package.

[0005] In response to new product forms and application requirements, it is urgent to develop a blind cavity inner wall sidewall metallization method to achieve good electromagnetic shielding inside the cavity of the LTCC ceramic substrate, so that the all-ceramic hermetic package substrate can be well applied in the microwave / millimeter wave frequency band.

[0006] There are relatively few published research results on the metallization of LTCC cavity sidewalls. The patent "A preparation method for LTCC substrate sidewall metallization and LTCC substrate" discloses a method for metallizing the outer edge sidewalls of a ceramic substrate. The method achieves adhesion of the slurry to the outer wall of the substrate by high-pressure adsorption and filling of through-microgrooves. This method requires the processing of additional through-type process microgrooves, which has high process costs. At the same time, since process microgrooves must be used in conjunction, it cannot be used for metallization of the sidewalls of large-sized cavities inside the substrate, nor can it be applied to the metallization of the sidewalls of blind cavities in the substrate.

[0007] In view of the urgent need for metallization of the inner sidewalls of the blind cavity of the LTCC substrate, it is urgent to develop a sidewall coating device and its use method to achieve uniform and efficient coating of the metallization slurry to the inner sidewalls of the cavity. Summary of the Invention

[0008] The purpose of the present invention is to overcome the problems of the prior art and disclose a device for metallizing the side walls of the blind cavities of LTCC substrates and a method for using the device and the method for using the device. The uniform and efficient metallization of the side walls of the blind cavities inside LTCC substrates is achieved through the device and the method for using the device.

[0009] On the one hand, the purpose of the present invention is achieved through the following technical solutions:

[0010] A device for metallizing the sidewall of a blind cavity of an LTCC substrate, the device comprising: a fixed base, a fixed slide bar, and a material trough;

[0011] The fixed slide bar is fixedly arranged on the top side of the fixed base, and the material trough is sleeved on the fixed slide bar and can slide relative to the fixed slide bar;

[0012] The fixed slide rod is also sleeved with a spring, which is arranged between the fixed base and the material trough and is used for rebounding and resetting the material trough;

[0013] The material trough includes a lower plate, an elastic membrane, an upper plate and positioning pins, the elastic membrane is arranged between the lower plate and the upper plate, the lower plate body is provided with a second through cavity, the upper plate body is provided with a first through cavity, and the first through cavity stores a first conductive slurry;

[0014] The first through cavity and the second through cavity are coaxially arranged, and the sizes of the first through cavity and the second through cavity are the same as the size of the cavity on the submodule containing the through cavity structure in the LTCC substrate to be processed;

[0015] The positioning pins are arranged on the top side of the trough to complete the positioning or fixing of the submodule containing the through-cavity structure in the LTCC substrate to be processed;

[0016] A placeholder block is further provided on the fixed base, and the placeholder block is coaxially arranged with the first through cavity, and the placeholder block can pass through the second through cavity, and there is a gap between the placeholder block and the wall surface of the second through cavity;

[0017] The material groove is pressed down so that the placeholder block pushes the first conductive paste stored in the first through cavity, so that the first conductive paste is coated on the inner wall of the cavity of the submodule containing the through cavity structure fixed on the top of the upper plate.

[0018] According to a preferred embodiment, the fixed base is made of stainless steel or other equivalent hard and CNC-machinable materials, with a thickness of 5mm~15mm, a plane structure of square, round or other irregular shapes, and a plane size that can stably support the material trough, usually greater than or equal to 260mm.

[0019] According to a preferred embodiment, the fixed base is provided with a blind hole on the upper surface into which the fixed slide rod can be inserted. The diameter of the blind hole is matched with the diameter of the slide rod, usually 2mm~6mm, the depth of the blind hole is 3mm~8mm, the number of blind holes is ≥4, and they are evenly distributed around the processing area.

[0020] According to a preferred embodiment, the fixed base is provided with a raised placeholder on the upper surface, the planar size of the placeholder is 0.5mm~2mm smaller than the planar size of the sub-module cavity containing the through-cavity structure, the number of the placeholder is equal to the number of cavity structures contained in the sub-module, the position corresponds to the cavity structure contained in the sub-module, and the height should be no less than the total depth of the material trough.

[0021] According to a preferred embodiment, the fixed slide rod is made of stainless steel or other hard materials, has a diameter of 1.97mm~5.97mm, and can be firmly assembled in the blind hole of the fixed base. The height of the fixed slide rod can support the material trough to slide up and down, usually 10mm~20mm. The number of fixed slide rods is ≥4, and they are evenly distributed around the processing area after installation.

[0022] According to a preferred embodiment, the spring can be inserted into the fixed slide rod and can be freely extended and retracted on the fixed slide rod, and its elastic force can support the overall rebound and reset of the trough.

[0023] According to a preferred embodiment, the lower plate is made of stainless steel or other equivalent hard, CNC-machinable materials, has a thickness of 2mm to 5mm, a square planar structure, and preferably a planar size of 200mm to 260mm.

[0024] According to a preferred embodiment, the lower plate is provided with a second through cavity, the size of the second through cavity is the same as the cavity size on the submodule containing the through cavity structure, and the position of the through cavity is the same as the cavity position on the submodule containing the through cavity structure.

[0025] According to a preferred embodiment, the lower plate is provided with a through hole for the fixed slide rod to pass through, the position of the through hole corresponds to the position of the blind hole for installing the slide rod on the mounting base, the diameter of the through hole is 0.1mm~0.5mm larger than the diameter of the fixed slide rod, and is more than 1mm smaller than the diameter of the spring.

[0026] According to a preferred embodiment, the lower plate has a blind hole on its upper surface for installing a positioning pin, the diameter of which is 1.0mm~3.0mm, usually 0.02mm~0.05mm larger than the diameter of the positioning pin, and the depth of the blind hole is 1.0mm~3.0mm, so that the positioning pin can be fixedly installed.

[0027] According to a preferred embodiment, the elastic membrane is made of elastic silicone rubber or other equivalent elastic membrane, has a thickness of 0.1mm~0.2mm, and is provided with a through hole that allows the fixed slide rod and positioning pin to pass smoothly. The diameter of the through hole is preferably 0.5mm~1mm larger than the diameter of the fixed slide rod and positioning pin.

[0028] According to a preferred embodiment, the upper plate is made of stainless steel or other equivalent hard, CNC-machinable material, with a thickness of 2mm~5mm, a square planar structure, and the same planar size as the upper plate, preferably 200mm~260mm.

[0029] According to a preferred embodiment, the upper plate is provided with a through hole for the sliding rod to pass through, the position of the through hole corresponds to the position of the blind hole for installing the sliding rod on the mounting base, and the diameter of the through hole is 0.1mm~0.5mm larger than the diameter of the sliding rod, so that it can move freely on the fixed sliding rod.

[0030] According to a preferred embodiment, the upper plate is provided with a through hole allowing the positioning pin to pass through, and the through hole diameter is 1.0mm~3.0mm, which is usually 0.02mm~0.05mm larger than the diameter of the positioning pin, so that the positioning pin can be fixedly installed.

[0031] According to a preferred embodiment, the positioning pin is made of stainless steel, has a diameter of 0.98mm to 2.98mm, and a height of 5mm to 10mm, preferably extending 1.0mm to 3.0mm above the upper surface of the upper plate after installation.

[0032] According to a preferred embodiment, the stoppers are made of stainless steel or other equivalent hard metal, preferably square or circular in planar configuration, with a planar dimension of 5 mm to 20 mm. Their height is such that, when supported on the lower surface of the lower plate, the slurry can submerge the inner wall of the cavity of the submodule containing the through-cavity structure. The specific height can be flexibly adjusted based on the thickness of the workpiece. The number of stoppers should be ≥ 4, evenly distributed around the work area when in use.

[0033] On the other hand, the present invention also discloses:

[0034] A method for using the aforementioned device, comprising:

[0035] S1: Align the submodule containing the through-cavity structure and place it on the upper surface of the material tank of the device, aligning the through-cavity of the submodule containing the through-cavity structure with the first through-cavity of the material tank, and pre-filling the first through-cavity of the material tank with the first conductive paste used for metallizing the sidewall;

[0036] S2: Press the material tank downward, and use the placeholder block to squeeze the first conductor slurry in the material tank, so that the first conductor slurry spreads to the inner wall of the through-cavity structure and adheres to the inner wall, completing the coating of the slurry on the inner wall of the cavity.

[0037] According to a preferred embodiment, the method for using the device further comprises:

[0038] S3: After the inner wall of the through-cavity structure is coated, the downward pressure on the material tank is removed. The material tank is reset due to the elastic force of the spring, and the submodule containing the through-cavity structure with the cavity side wall coated with the conductive paste is removed from the device;

[0039] S4: The sub-module with a through-cavity structure with slurry adhered to the inner wall of the cavity is stacked and laminated with the sub-module without a cavity structure for a second time, and co-fired as an integrated whole to finally form an LTCC substrate with a blind cavity structure, and the inner wall of the blind cavity is uniformly metallized.

[0040] According to a preferred embodiment, the through-cavity structure of the submodule containing the through-cavity structure is manufactured by CNC milling.

[0041] According to a preferred embodiment, an LTCC substrate containing a blind cavity is divided into sub-modules containing a through-cavity structure and sub-modules without a cavity structure, based on the cavity depth. Each sub-module is fabricated into a corresponding green ceramic block using conventional LTCC processes for punching, filling, printing, laminating, and stacking. The green ceramic blocks of the sub-modules containing a through-cavity structure are then CNC-milled to produce the through-cavity structure, typically with a planar dimension of ≥5 mm and a depth of ≥1 mm.

[0042] The aforementioned main solution of the present invention and its various further alternatives may be freely combined to form multiple solutions, all of which are solutions that can be adopted and protected by the present invention. After understanding the solutions of the present invention, those skilled in the art will understand, based on existing technology and common knowledge, that there are many possible combinations, all of which are technical solutions to be protected by the present invention, and these are not exhaustive here.

[0043] Beneficial effects of the present invention:

[0044] The device of the present invention and the use method thereof are compatible with conventional LTCC substrate process technology and can achieve uniform and efficient sidewall metallization of the inner wall of the blind cavity of the LTCC substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 This is a schematic structural diagram of the LTCC substrate to be processed according to the present invention;

[0046] Figure 2 It is a structural schematic diagram of the device of the present invention;

[0047] Figure 3This is a schematic diagram of the slurry coating preparation of the device of the present invention;

[0048] Figure 4 Schematic diagram of the slurry coating process of the device of the present invention;

[0049] Figure 5 This is a schematic diagram of the slurry coating state of the device of the present invention;

[0050] Figure 6 It is a schematic diagram of the overall structure of the LTCC substrate;

[0051] Among them, 1-fixed base, 2-fixed sliding rod, 3-spring, 4-lower plate, 5-elastic membrane, 6-upper plate, 7-positioning pin, 8-placeholder, 9-limiting block, 10-first conductor paste, 11-second conductor paste, 12-metallized film layer on the inner and side walls of the cavity, C1-first through cavity, C2-second through cavity, P-material trough, A-submodule with through cavity structure, B-submodule without cavity structure, C-through cavity structure, L-LTCC substrate wiring, V-metallized through hole. DETAILED DESCRIPTION

[0052] The following describes the embodiments of the present invention through specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments. The details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other unless they conflict.

[0053] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0054] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" and the like indicate positions or locations based on the positions shown in the accompanying drawings, or the positions or locations in which the inventive product is typically placed when in use. These terms are intended solely to facilitate the description of the present invention and to simplify the description, and are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0055] Furthermore, terms such as "horizontal," "vertical," and "overhanging" do not necessarily imply that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0056] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0057] In addition, the present invention would like to point out that, in the present invention, unless the specific structure, connection relationship, positional relationship, power source relationship, etc. are specifically written out, the structure, connection relationship, positional relationship, power source relationship, etc. involved in the present invention are all known to those skilled in the art based on the existing technology without creative work.

[0058] Example 1

[0059] In this embodiment, Figure 1 and Figure 6 The figure shows the submodule division of the LTCC substrate, where A is a submodule with a through-cavity structure, and B is a submodule without a cavity structure. Both have 10 layers of raw porcelain, and the thickness of a single layer is 125 μm. Submodule A with a through-cavity structure and submodule B without a cavity structure are respectively made into raw porcelain blocks using conventional LTCC punching, filling, printing, lamination, and lamination. After lamination, the raw porcelain block thickness of submodule A with a through-cavity structure is 1.2 mm, and the raw porcelain block thickness of submodule B without a cavity structure is 1.2 mm. The through-cavity structure C of submodule A is combined with submodule B to form the blind cavity structure of the LTCC substrate. L represents the conventional wiring of the LTCC substrate, with a minimum line width of 0.15 mm and a through-hole diameter of 0.2 mm. V represents the conventional metallized through-hole of the LTCC substrate. The device of the present invention is mainly used for coating the metallization slurry 11 on the inner wall of the through-cavity structure C in submodule A with a through-cavity structure. Then, through secondary stacking and lamination of module A and submodule B, and integrated co-firing, an LTCC substrate with a blind cavity structure is finally formed, and the metallized film layer 12 is prepared on the sidewall of the blind cavity.

[0060] Furthermore, submodule A with a through-cavity structure and submodule B without a cavity structure are provided with alignment pin holes with a diameter of 2.52 mm, and the positions of the pin holes correspond to those of positioning pins 7. This set of pin holes is used for both alignment of the green porcelain block of submodule A with a through-cavity structure with the device of the present invention, and alignment of submodule A with a through-cavity structure and submodule B without a cavity structure during secondary lamination.

[0061] In this embodiment, a square through-cavity structure C is manufactured on the green porcelain block of the submodule A containing the through-cavity structure by means of CNC milling, and the plane size of the structure is 10 mm×10 mm.

[0062] refer to Figures 2 to 5 As shown, this embodiment discloses a device for metallizing the sidewall of a blind cavity of an LTCC substrate. The device includes: a fixed base 1, a fixed slide bar 2 and a material trough.

[0063] The fixed slide bar 2 is fixedly arranged on the top side of the fixed base 1, and the material trough is sleeved on the fixed slide bar 2 and can slide relative to the fixed slide bar 2; the fixed slide bar 2 is also sleeved with a spring 3, and the spring 3 is arranged between the fixed base 1 and the material trough for rebound reset of the material trough; the material trough includes a lower plate 4, an elastic membrane 5, an upper plate 6 and a positioning pin 7, and the elastic membrane 5 is arranged between the lower plate 4 and the upper plate 6, and the lower plate 4 is provided with a second through cavity C2, and the upper plate 6 is provided with a first through cavity C1, and the first through cavity C1 stores a first conductive paste 10; the first through cavity C1 and the second through cavity C2 are coaxially arranged, and the first through cavity C1 and the second through cavity C2 are coaxially arranged. The size is the same as the cavity size of the through-cavity structure C on the sub-module A containing the through-cavity structure in the LTCC substrate to be processed; the positioning pin 7 is arranged on the top side of the material trough, and is used to complete the limitation or fixation of the sub-module A containing the through-cavity structure in the LTCC substrate to be processed; the fixed base 1 is also provided with a placeholder 8, which is coaxially arranged with the first through-cavity C1, and the placeholder 8 can pass through the second through-cavity C2, and there is a gap between the placeholder 8 and the wall surface of the second through-cavity C2; by pressing down the material trough, the placeholder 8 pushes the first conductive paste 10 stored in the first through-cavity C1, so that the first conductive paste 10 is coated on the inner wall of the cavity of the sub-module A containing the through-cavity structure fixed on the top of the upper plate 6.

[0064] Preferably, the fixed base 1 is further provided with a stopper 9, located between the fixed base 1 and the lower plate 4, for limiting the trough's descending distance. When the lower surface of the lower plate 4 contacts the stopper 9, the first conductive paste 10 stored in the first through-cavity C1 submerges the inner wall of the cavity of the submodule A containing the through-cavity structure. Furthermore, the device is provided with four stoppers 9, each 3.8 mm in height.

[0065] Specifically, the fixed base 1 is made of stainless steel, has a square planar structure, a planar size of 250mm×250mm, and a thickness of 10mm. Fixed blind holes for the slide rod 2 are set at the four corners, with a blind hole diameter of 5mm and a center distance of 210mm. A placeholder block 8 is set on the surface with a height of 10mm and a planar size of 8mm×8mm.

[0066] Four fixed slide bars 2 with a diameter of 4.97 are installed in the four blind holes of the fixed base 1. The slide bars 2 are 20 mm long, and four springs 3 are installed on the slide bars 2. The diameter of the springs 3 is 7 mm.

[0067] The lower plate 4 is made of stainless steel, with a plane size of 230mm×230mm and a thickness of 5mm. The diameter of the through hole through which the fixed slide rod 2 passes is 5.2mm, and the diameter of the blind hole for installing the positioning pin 7 is 2.52mm and the depth is 3mm. A second through cavity C2 corresponding to the cavity of the sub-module A containing the through cavity structure is provided, and the plane size of the second through cavity C2 is 10mm×10mm.

[0068] The elastic film 5 is a silicone rubber elastic film with a thickness of 0.1 mm.

[0069] The upper plate 6 is made of stainless steel, with a plane size of 230mm×230mm and a thickness of 3mm. The diameter of the through hole through which the fixed slide rod 2 passes is 5.2mm, the diameter of the blind hole for installing the positioning pin 7 is 2.52mm, and a first through cavity C1 corresponding to the cavity of the sub-module A containing the through cavity structure is provided. The plane size of the first through cavity C1 is 10mm×10mm.

[0070] The positioning pin 7 is made of stainless steel, has a diameter of 2.49 mm and a length of 8 mm.

[0071] Example 2

[0072] This embodiment discloses a method for using the device described in Example 1, and the method for using the device includes the following steps.

[0073] Step S1: Align the submodule A containing the through-cavity structure and place it on the upper surface of the material tank of the device. Align the through-cavity structure C of the submodule A containing the through-cavity structure with the first through-cavity C1 of the material tank. The first through-cavity C1 of the material tank is pre-filled with the first conductive paste 10 used for metallizing the sidewall. Figure 3 shown.

[0074] Step S2: Press down the trough, and squeeze the first conductive paste 10 in the trough by the placeholder block 8, so that the first conductive paste 10 spreads to the inner wall of the through-cavity structure C and adheres to the inner wall, completing the coating of the paste on the inner wall of the cavity. Figure 4 shown.

[0075] Step S3: After the inner wall of the through-cavity structure C is coated, the downward pressure on the material tank is removed, and the material tank is reset based on the elastic force of the spring 3, and the submodule A containing the through-cavity structure with the conductive paste coated on the side wall of the cavity is removed from the device. Figure 5 shown.

[0076] Step S4: The submodule A with the slurry adhered to the inner wall of the cavity is laminated and laminated with the submodule B without the cavity structure for a second time, and then co-fired to form an LTCC substrate with a blind cavity structure, and the inner wall of the blind cavity is uniformly metallized, thereby completing the processing of the metallized film layer 12. Figure 6 shown.

[0077] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A device for metallizing the sidewall of a blind cavity of an LTCC substrate, characterized in that: The device comprises: a fixed base (1), a fixed slide rod (2) and a trough (P); The fixed slide bar (2) is fixedly arranged on the top side of the fixed base (1), and the material trough (P) is sleeved on the fixed slide bar (2) and can slide relative to the fixed slide bar (2); The fixed slide bar (2) is also sleeved with a spring (3), which is arranged between the fixed base (1) and the material trough (P) and is used for rebounding and resetting the material trough; The material trough comprises a lower plate (4), an elastic membrane (5), an upper plate (6) and a positioning pin (7); the elastic membrane (5) is arranged between the lower plate (4) and the upper plate (6); a second through cavity (C2) is provided on the plate body of the lower plate (4); a first through cavity (C1) is provided on the plate body of the upper plate (6); a first conductive slurry (10) is stored in the first through cavity (C1); The first through cavity (C1) and the second through cavity (C2) are coaxially arranged, and the sizes of the first through cavity (C1) and the second through cavity (C2) are the same as the cavity size of the through cavity structure (C) on the submodule (A) containing the through cavity structure in the LTCC substrate to be processed; The positioning pin (7) is arranged on the top side of the material trough and is used to complete the positioning or fixing of the submodule (A) containing the through-cavity structure in the LTCC substrate to be processed; A placeholder block (8) is further provided on the fixed base (1), and the placeholder block (8) is coaxially arranged with the first through cavity (C1), and the placeholder block (8) can pass through the second through cavity (C2) and has a gap with the wall surface of the second through cavity (C2); By pressing the material groove downward, the placeholder block (8) pushes the first conductive paste (10) stored in the first through cavity (C1), so that the first conductive paste (10) is coated on the inner wall of the cavity of the submodule (A) containing the through cavity structure fixed on the top of the upper plate (6); The fixed base (1) is further provided with a limit block (9), which is located between the fixed base (1) and the lower plate (4) and is used to complete the lowering distance limit of the material trough. When the lower surface of the lower plate (4) contacts the limit block (9), the first conductive paste (10) stored in the first through cavity (C1) immerses the inner wall of the cavity of the submodule (A) containing the through cavity structure.

2. The device for metallizing the sidewall of a blind cavity of an LTCC substrate according to claim 1, wherein: The limiting blocks (9) are evenly distributed on the sides of the space-occupying blocks (8), and the number of the limiting blocks (9) is ≥4.

3. The device for metallizing the sidewall of a blind cavity of an LTCC substrate according to claim 1, wherein: The limiting block (9) is made of stainless steel or other equivalent hard metal, has a square or circular planar structure, and has a planar size of 5 mm to 20 mm.

4. The device for metallizing the sidewall of a blind cavity of an LTCC substrate according to claim 1, wherein: The gap between the spacer block (8) and the wall of the second through cavity (C2) is 0.5 mm to 2 mm.

5. The device for metallizing the sidewall of a blind cavity of an LTCC substrate according to claim 1, wherein: The number of the fixed slide bars (2) is ≥4 and is evenly distributed around the processing area.

6. The device for metallizing the sidewall of a blind cavity of an LTCC substrate according to claim 5, wherein: The fixed slide rod (2) is made of stainless steel or other hard materials, and has a diameter of 1.97 mm to 5.97 mm.

7. A method for using the device according to any one of claims 1 to 6, characterized in that: The method of using the device includes: S1: Aligning and placing the submodule (A) containing the through-cavity structure on the upper surface of the material tank of the device, aligning the through-cavity structure (C) of the submodule (A) containing the through-cavity structure with the first through-cavity (C1) of the material tank, and pre-loading the first conductive paste (10) used for metallizing the sidewall into the cavity of the first through-cavity (C1) of the material tank; S2: Pressing the material tank downward, and using the spacer block (8) to squeeze the first conductor paste (10) in the material tank, so that the first conductor paste (10) spreads to the inner wall of the through-cavity structure (C) and adheres to the inner wall, completing the coating of the paste on the inner wall of the cavity; S3: After the inner wall of the through-cavity structure (C) is coated, the downward pressure on the material tank is removed, and the material tank is reset based on the elastic force of the spring (3), and the submodule (A) containing the through-cavity structure with the conductive paste coated on the side wall of the cavity is removed from the device; S4: The sub-module (A) with a through-cavity structure with slurry adhered to the inner wall of the cavity and the sub-module (B) without a cavity structure are stacked and laminated for a second time, and co-fired as an integrated whole to finally form an LTCC substrate with a blind cavity structure, and the inner wall of the blind cavity is uniformly metallized.

8. The method of use according to claim 7, wherein: The through-cavity structure (C) of the submodule (A) containing the through-cavity structure is manufactured by CNC milling.

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