An interval rounding device for wafer preparation

Abstract

The invention relates to the technical field of wafer processing, and discloses an interval rounding device for wafer preparation, comprising a workbench, a feeding mechanism for carrying wafers to be ground, a lifting mechanism for driving the feeding mechanism to rise and fall, and a clamping mechanism for clamping a plurality of wafers, wherein the feeding mechanism is arranged on the lifting mechanism, and the clamping mechanism is installed at both ends of the lifting mechanism; a clamping assembly is placed in a first notch after being adsorbed and connected with a clamping block, and a plurality of wafers are placed between two adjacent clamping blocks in sequence, and then the feeding mechanism with the wafers is placed on a carrier plate, and the wafer is lifted to a position having the same height as two clamping members, and then the two clamping members are driven to approach and contact the two clamping blocks at the edges, so that the plurality of wafers can be positioned between the clamping blocks, and then the feeding assembly is removed for rounding treatment, and this wafer connection method prevents wax from sticking to the wafer surface, and eliminates the influence of wax on the product spectrum during later testing.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing, in particular to an interval rounding device used for wafer preparation. Background Art

[0002] There may be defects and rough surfaces on the surface of the wafer just after cutting, which will affect the quality and reliability of the circuit. These defects and rough surfaces can be removed by grinding to improve the smoothness of the wafer surface; a flat wafer surface helps to achieve high-precision pattern transfer during the photolithography process, ensuring the precision and performance of the circuit.

[0003] After searching, the patent with application number CN202110186702.3 discloses a wafer edge grinding method and device, which belongs to the field of wafer processing technology. The device includes an edge grinding mechanism and a fixing mechanism. The edge grinding mechanism includes a first base plate and a grinder located on the first base plate. The grinder is provided with a first grinding wheel near one end of the fixing mechanism. The fixing mechanism includes a second base plate and an adsorption device located on the second base plate. The adsorption device includes a hollow motor and a vacuum adsorption pump. The hollow motor is connected to a suction cup head for adsorbing the wafer near one end of the edge grinding mechanism. The suction cup head is connected to the vacuum adsorption pump through a pipeline. The first grinding wheel includes a first grinding ring and a second grinding ring. The invention can effectively reduce the grinding force and grinding heat during the wafer grinding process. The position adjustment of the grinder and the wafer is convenient and stable. The angle can also be fine-tuned when the wafer rotates to improve the quality of wafer edge grinding. Steps of different shapes can be formed at the edge of the wafer to reduce the probability of edge collapse and fragmentation during wafer grinding and thinning.

[0004] In the current rounding process of the wafer preparation process, multiple wafer raw materials are glued together at intervals by wax sticking, and then polished synchronously. Although the rounding efficiency of the wafer is improved, the traditional wax sticking method of polishing the wafer cannot completely remove the sticky wax after polishing. Therefore, the sticky wax will affect the spectrum of the product. Therefore, we need to propose an interval rounding device for wafer preparation. Summary of the invention

[0005] The object of the present invention is to provide an interval rounding device for wafer preparation. Through the design of the loading mechanism, the clamping assembly is adsorbed and connected to the clamping block and then placed in the interior of the first notch, and multiple wafers are placed between two adjacent clamping blocks in turn, and then the loading mechanism with wafers is placed on the carrier plate, and the wafer is lifted to a position at the same height as the two clamping members through the lifting mechanism, and then the two clamping members are driven to approach and contact the two outermost clamping blocks to complete the tightening of multiple clamping blocks. Multiple wafers can be positioned between the clamping blocks, and then the clamping assembly is removed for rounding processing. This wafer connection method prevents wax from sticking to the wafer surface and eliminates the influence of wax on the product spectrum during later testing, so as to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: an interval rounding device for wafer preparation, comprising a workbench, a loading mechanism for carrying wafers to be polished, a lifting mechanism for driving the loading mechanism to rise and fall, and a clamping mechanism for clamping a plurality of wafers, wherein the loading mechanism is arranged on the lifting mechanism, and the clamping mechanism is installed at both ends of the lifting mechanism;

[0007] The loading mechanism comprises a material tray, the material tray is provided with a fourth groove for placing the wafer, the upper ends of two non-adjacent inner walls of the fourth groove are provided with a first notch, a clamping block and a material clamping assembly detachably mounted at both ends of the clamping block are provided between two groups of the first notches, and the clamping block abuts against the center position of the wafer;

[0008] The clamping assembly comprises a U-shaped limiting frame embedded in the first notch, and a plurality of connecting plates movably installed in the limiting frame, and one end of the connecting plate is magnetically adsorbed on the side wall of the clamping block.

[0009] Preferably, limiting columns are connected between the two side walls of the limiting frame, and the other ends of the plurality of connecting plates are provided with aligned limiting holes, and the limiting columns are plugged into the inside of the limiting holes.

[0010] Preferably, the other end of the connecting plate is connected to a connecting column, and a through hole for the connecting column to pass through is provided on the side of the limit frame, and the side and end of the connecting column are connected to a limit block, and a ball is rollingly installed on the limit block, and a slide groove is provided on the inner and outer sides of the limit frame, and the ball is rollingly installed inside the slide groove.

[0011] Preferably, an iron sheet and a plug post are installed at one end of the connecting plate, and an installation groove and a slot are respectively opened on the outer wall of the clamping block, and a magnet adsorbed by the iron sheet is installed inside the installation groove.

[0012] Preferably, the clamping mechanism comprises two parallel supporting seats fixed on the workbench, two brackets moving towards each other are installed between the two supporting seats, and the brackets are connected with a mounting plate.

[0013] Preferably, a first rotating rod is rotatably mounted on one of the mounting plates, a first connecting seat is mounted on the end of the first rotating rod, and a first clamping member is mounted on the first connecting seat;

[0014] A second motor is installed on the other mounting plate, one end of the output shaft of the second motor is connected to a second rotating rod, a second connecting seat is installed at the end of the second rotating rod, and a second clamping member is installed on the second connecting seat.

[0015] Preferably, the first clamping member and the second clamping member are both truncated cone-shaped silicone rubber clamping members, and second notches are provided at both non-adjacent ends of the material tray. The first clamping member, the second clamping member, and the second notch are coaxially arranged, and the diameters of the first clamping member and the second clamping member are smaller than the diameter of the second notch.

[0016] Preferably, the support seat is provided with a third groove, wherein a first screw rod is rotatably mounted inside one of the third grooves, a polished rod is fixed inside another third groove, and a first motor driving the first screw rod to rotate is mounted at the end of one of the support seats;

[0017] Two first sliding seats that move toward each other are threadedly mounted on the outer wall of the first screw rod, two second sliding seats that move toward each other are slidably mounted on the polished rod, and the bracket is on the first sliding seat and the second sliding seat.

[0018] Preferably, a first groove is provided on the surface of the workbench, and the lifting mechanism includes a liftable base plate, a second screw rod rotatably installed inside the first groove, two screw rod seats moving toward each other are threadedly connected on the outer wall of the second screw rod, a diagonal support rod is rotatably installed between the screw rod seat and the bottom of the base plate, a bearing plate is installed on the base plate, and a slot for placing the feeding mechanism and a water storage tank located around the slot are respectively provided on the bearing plate.

[0019] Preferably, the workbench is also provided with a second groove and a through hole passing through the first groove and the second groove, a second gear is rotatably installed inside the second groove, a third motor is installed on the workbench, one end of the output shaft of the third motor is sleeved with a first gear, the first gear is meshed with the second gear, and one end of the second screw rod is inserted into the inner ring of the second gear through the through hole.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. The present invention adopts the design of a feeding mechanism, wherein the material clamping assembly is adsorbed and connected with the clamping block and then placed inside the first notch, and multiple wafers are placed between two adjacent clamping blocks in sequence, and then the material clamping assembly with the wafers is placed on the carrier plate, and the wafers are lifted to the same height as the two clamping members by the lifting mechanism, and then the two clamping members are driven to approach and contact the two clamping blocks at the edge, and the multiple clamping blocks are tightened, so that multiple wafers can be positioned between the clamping blocks, and then the material clamping assembly is removed, and a rounding process can be performed. This wafer connection method prevents wax from sticking to the wafer surface, and eliminates the influence of wax on the product spectrum during later testing;

[0022] 2. The design of the lifting mechanism of the present invention is that after the wafer is loaded, it is only necessary to place the loading mechanism carrying the wafer on the loading plate, and the wafer is automatically lifted to a position coaxial with the clamping member by mechanical drive, thereby avoiding the cumbersome process of manually installing the wafer, thereby improving the rounding efficiency of the wafer;

[0023] 3. The present invention adopts the design of the clamping assembly. Since the multiple connecting plates are movably arranged, the connecting plates and the clamping blocks are detachably connected, that is, the spacing between the multiple clamping blocks is adjustable, and can be applied to the rounding operation of wafers of different thicknesses, thereby improving the application range of the present device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the present invention;

[0025] Figure 2 It is a structural schematic diagram of the clamping mechanism of the present invention;

[0026] Figure 3 It is a structural schematic diagram of the jacking mechanism of the present invention;

[0027] Figure 4 For the present invention Figure 3 Enlarged view of part A in the middle;

[0028] Figure 5 It is a structural schematic diagram of the feeding mechanism of the present invention;

[0029] Figure 6 It is a structural schematic diagram of the material clamping assembly of the present invention;

[0030] Figure 7 For the present invention Figure 6 Enlarged view of part B in the middle.

[0031] In the figure: 1, workbench; 11, first groove; 12, through hole; 13, second groove; 2, clamping mechanism; 21, support seat; 22, third groove; 23, first motor; 24, first screw rod; 25, first sliding seat; 26, light rod; 27, second sliding seat; 28, bracket; 29, mounting plate; 210, first rotating rod; 211, first connecting seat; 212, first clamping member; 213, second motor; 214, second rotating rod; 215, second connecting seat; 216, second clamping member; 3, lifting mechanism; 31, second screw rod; 32, screw rod seat; 33, diagonal support rod; 34, Bottom plate; 35, bearing plate; 36, card slot; 37, water storage tank; 38, third motor; 39, first gear; 310, second gear; 4, feeding mechanism; 41, material tray; 42, fourth groove; 43, first missing slot; 44, second missing slot; 45, material clamping assembly; 451, limit frame; 452, through hole; 453, slide groove; 454, limit column; 455, connecting plate; 456, limit hole; 457, connecting column; 458, limit block; 459, ball bearing; 4510, iron sheet; 4511, plug column; 46, clamping block; 461, mounting groove; 462, slot; 463, magnet. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] See also Figure 1-7 The present invention provides a technical solution: an interval rounding device for wafer preparation, comprising a workbench 1, a loading mechanism 4 for carrying wafers to be polished, a lifting mechanism 3 for driving the loading mechanism 4 to rise and fall, and a clamping mechanism 2 for clamping a plurality of wafers, wherein the loading mechanism 4 is arranged on the lifting mechanism 3, and the clamping mechanism 2 is installed at both ends of the lifting mechanism 3;

[0034] The loading mechanism 4 can load multiple wafers at a time, and the multiple wafers are fixed by mechanical compression to prevent wax from sticking to the wafers, so as to avoid the influence of wax on the spectrum of the product during the later detection. The lifting mechanism 3 is used to raise the height of the wafer to facilitate the later wafer clamping operation.

[0035] like Figure 5-7As shown, the loading mechanism 4 includes a material tray 41, and a fourth groove 42 for placing wafers is provided on the material tray 41. The fourth groove 42 is set as a semicircular groove. When the wafer is placed, the center of the wafer is coaxial with the center of the fourth groove 42. The upper ends of two non-adjacent inner walls of the fourth groove 42 are provided with first notches 43. A plurality of clamping blocks 46 and a material clamping assembly 45 detachably mounted at both ends of the clamping blocks 46 are provided between the two groups of first notches 43. The clamping blocks 46 are in contact with the center position of the wafer. The positioning of multiple wafers is achieved by the clamping blocks 46, and the positions of the clamping assemblies 45 and the clamping blocks 46 can be adjusted laterally to achieve the positioning of wafers of different thicknesses.

[0036] The clamping assembly 45 includes a U-shaped limit frame 451 embedded in the first notch 43, and a plurality of connecting plates 455 movably installed in the limit frame 451. One end of the connecting plate 455 is magnetically adsorbed on the side wall of the clamping block 46. The clamping block 46 and the connecting plate 455 can be disassembled by magnetic attraction. After the wafer positioning clamp is fixed in place, the clamping assembly 45 can be easily removed without affecting the polishing process of the wafer.

[0037] The limiting columns 454 are connected between the two side walls of the limiting frame 451 , and the other ends of the multiple connecting plates 455 are each provided with aligned limiting holes 456 , and the limiting columns 454 are plugged into the inside of the limiting holes 456 , that is, the multiple connecting plates 455 can slide on the limiting columns 454 .

[0038] The other end of the connecting plate 455 is connected to a connecting column 457. A through hole 452 is provided on the side of the limit frame 451 for the connecting column 457 to pass through. The height of the through hole 452 is equal to the thickness of the connecting column 457. The side and end of the connecting column 457 are connected to a limiting block 458. A ball 459 is rollingly installed on the limiting block 458. Two slide grooves 453 are provided on the inner and outer sides of the limit frame 451. The two slide grooves 453 are symmetrically arranged about the through hole. The ball 459 is rollingly installed inside the slide groove 453 to ensure the stability of the connecting plate 455 during the movement process.

[0039] An iron sheet 4510 and two plug posts 4511 are installed at one end of the connecting plate 455, and an installation groove 461 and two slots 462 are respectively opened on the outer wall of the clamping block 46. The two plug posts 4511 are located at both ends of the iron sheet 4510, and a magnet 463 adsorbed by the iron sheet 4510 is installed inside the installation groove 461. Through the adsorption effect of the magnet 463 and the iron sheet 4510, the clamping block 46 and the connecting plate 455 can be connected together.

[0040] like Figure 2As shown, the clamping mechanism 2 includes two parallel support seats 21 fixed on the workbench 1, two brackets 28 that move toward each other are installed between the two support seats 21, and a mounting plate 29 is connected to the bracket 28. The mounting plate 29 is vertically arranged with the bracket 28, and the two mounting plates 29 are arranged in parallel.

[0041] A first rotating rod 210 is rotatably mounted on one of the mounting plates 29 , a first connecting seat 211 is mounted on the end of the first rotating rod 210 , and a first clamping member 212 is mounted on the first connecting seat 211 ;

[0042] A second motor 213 is mounted on another mounting plate 29 . One end of the output shaft of the second motor 213 is connected to a second rotating rod 214 . A second connecting seat 215 is mounted on the end of the second rotating rod 214 . A second clamping member 216 is mounted on the second connecting seat 215 .

[0043] The first clamping member 212 and the second clamping member 216 are both configured as truncated cone-shaped silicone rubber clamping members, which can avoid damage to the wafer surface when clamping the wafer. Second notches 44 are provided at both non-adjacent ends of the material tray 41. The first clamping member 212, the second clamping member 216, and the second notch 44 are coaxially arranged, and the diameters of the first clamping member 212 and the second clamping member 216 are smaller than the diameter of the second notch 44.

[0044] The first motor 23 drives the first screw rod 24 to rotate, so that the two first sliding seats 25 approach each other, which can drive the two mounting plates 29 to approach each other, that is, the first clamping member 212 and the second clamping member 216 approach each other and pass through the second notch 44 to abut against the two outermost clamping blocks 46, and the tightening of multiple clamping blocks 46 is completed, so that multiple wafers can be positioned between the clamping blocks 46.

[0045] The support seat 21 is provided with a third groove 22, wherein a first screw rod 24 is rotatably mounted inside one of the third grooves 22, and a polished rod 26 is fixed inside another third groove 22, and a first motor 23 driving the first screw rod 24 to rotate is mounted at the end of one of the support seats 21;

[0046] Two first sliding seats 25 moving toward each other are threadedly mounted on the outer wall of the first screw rod 24 , two second sliding seats 27 moving toward each other are slidably mounted on the smooth rod 26 , and the bracket 28 is on the first sliding seat 25 and the second sliding seat 27 .

[0047] like Figure 3-4As shown, a first groove 11 is provided on the surface of the workbench 1, and the lifting mechanism 3 includes a liftable base plate 34, a second screw rod 31 rotatably installed inside the first groove 11, two screw rod seats 32 moving toward each other are threadedly connected on the outer wall of the second screw rod 31, and a diagonal support rod 33 is rotatably installed between the screw rod seat 32 and the bottom of the base plate 34, and a supporting plate 35 is installed on the base plate 34. The supporting plate 35 is respectively provided with a slot 36 for placing the feeding mechanism 4 and a water storage tank 37 located around the slot 36, and the water storage tank 37 is used to collect water used for dust reduction during wafer grinding.

[0048] The bottom plate 34 and the supporting plate 35 are detachable to facilitate cleaning of the water in the water storage tank 37 .

[0049] The first screw rod 24 and the second screw rod 31 are both configured as positive and negative thread screw rods.

[0050] The workbench 1 is also provided with a second groove 13 and a through hole 12 passing through the first groove 11 and the second groove 13. A second gear 310 is rotatably installed inside the second groove 13. A third motor 38 is installed on the workbench 1. One end of the output shaft of the third motor 38 is sleeved with a first gear 39. The first gear 39 is meshed with the second gear 310. One end of the second screw rod 31 passes through the through hole 12 and is inserted into the inner ring of the second gear 310.

[0051] The third motor 38 drives the second screw 31 to rotate through the first gear 39 and the second gear 310. The second screw 31 drives the two screw seats 32 to approach each other, so that the diagonal support rod 33 can be deflected at an angle, and the bottom plate 34 and the supporting plate 35 are lifted, thereby realizing the height lifting of the wafer on the loading mechanism 4.

[0052] Specifically, Figure 5 As shown, the workbench 1 is also equipped with a grinding mechanism for grinding wafers (the grinding mechanism is a common means in the prior art, and this application will not go into details, only the grinding head is shown in the figure). The grinding mechanism includes a movable support frame, on which a grinding head is rotatably arranged, and a motor for driving the grinding head to rotate, and the position of the grinding head is set corresponding to the position of the wafer after lifting.

[0053] Optional, such as Figure 1 As shown, a dust reduction mechanism is also installed on the workbench 1 (the dust reduction mechanism is a common means in the prior art, and this application will not go into details, only the water pipe and the nozzle are shown in the figure). Specifically, the dust reduction mechanism also includes a water tank, a circulation pipeline, and a water pump for pumping water in the water tank into the circulation pipeline and the water pipe. The nozzle is arranged at an angle and corresponds to the position of the wafer after lifting. The water sprayed from the nozzle falls on the wafer to prevent debris from floating in the air during grinding. The water after dust reduction falls into the water storage tank 37.

[0054] When in use, the clamping assembly 45 is adsorbed and connected to the clamping block 46 and then placed into the interior of the first notch 43, and multiple wafers are placed between two adjacent clamping blocks 46 in turn, and then the loading mechanism 4 loaded with wafers is placed on the supporting plate 35, and the wafers are lifted to a position at the same height (i.e. coaxial) as the first clamping member 212 and the second clamping member 216 through the lifting mechanism 3. Specifically, the third motor 38 drives the second screw rod 31 to rotate through the first gear 39 and the second gear 310, and the second screw rod 31 drives the two screw rod seats 32 to approach each other, so that the diagonal support rod 33 can be deflected at an angle, and the base plate 34 and the supporting plate 35 can be lifted, thereby realizing the height lifting of the wafers on the loading mechanism 4.

[0055] Then, the first motor 23 is operated, and the first motor 23 drives the first screw rod 24 to rotate, so that the two first sliding seats 25 are close to each other, and the two mounting plates 29 are driven to be close to each other, that is, the first clamping member 212 and the second clamping member 216 are close to each other and pass through the second notch 44 to contact the two clamping blocks 46 on the edge, and the tightening of the multiple clamping blocks 46 is completed, so that the multiple wafers can be positioned between the clamping blocks 46, and then the lifting mechanism 3 drives the carrier plate 35 to descend, and the material tray 41 also descends, and then the limit frame 451 is pulled outward to separate the iron sheet 4510 from the magnet 463, and the clamping assembly 45 is removed to complete the wafer loading;

[0056] Then the rounding process can be carried out. The grinding disc is driven close to the wafer and rotated, and the wafer is driven to rotate slowly through the second motor 213 to remove the excess part of the wafer edge until the wafer is ground into a circle. During the rounding process, water needs to be pumped into the water pipe, and then sprayed from the nozzle on the water pipe to the polished wafer to reduce dust.

[0057] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An interval rounding device for wafer preparation, characterized in that: It comprises a workbench (1), a loading mechanism (4) for carrying wafers to be polished, a lifting mechanism (3) for driving the loading mechanism (4) to rise and fall, and a clamping mechanism (2) for clamping a plurality of wafers, wherein the loading mechanism (4) is arranged on the lifting mechanism (3), and the clamping mechanism (2) is installed at both ends of the lifting mechanism (3); The loading mechanism (4) comprises a material tray (41), the material tray (41) is provided with a fourth groove (42) for placing wafers, the upper ends of two non-adjacent inner walls of the fourth groove (42) are provided with first notches (43), a clamping block (46) and a material clamping assembly (45) detachably mounted on both ends of the clamping block (46) are provided between two groups of the first notches (43), and the clamping block (46) is in contact with the center position of the wafer; The clamping assembly (45) comprises a U-shaped limiting frame (451) embedded in the first notch (43), and a plurality of connecting plates (455) movably mounted inside the limiting frame (451), one end of the connecting plate (455) being magnetically attached to the side wall of the clamping block (46); An iron sheet (4510) and a plug post (4511) are installed at one end of the connecting plate (455), and an installation groove (461) and a slot (462) are respectively provided on the outer wall of the clamping block (46), and a magnet (463) adsorbed by the iron sheet (4510) is installed inside the installation groove (461).

2. The interval rounding device for wafer preparation according to claim 1, characterized in that: The limiting columns (454) are connected between the two side walls of the limiting frame (451), and the other ends of the plurality of connecting plates (455) are provided with aligned limiting holes (456), and the limiting columns (454) are plugged into the inside of the limiting holes (456).

3. The interval rounding device for wafer preparation according to claim 1, characterized in that: The other end of the connecting plate (455) is connected to a connecting column (457), and a through hole (452) for the connecting column (457) to pass through is provided on the side of the limiting frame (451), and the side and end of the connecting column (457) are connected to a limiting block (458), and a ball (459) is rollingly installed on the limiting block (458), and a sliding groove (453) is provided on the inner and outer sides of the limiting frame (451), and the ball (459) is rollingly installed inside the sliding groove (453).

4. The interval rounding device for wafer preparation according to claim 1, characterized in that: The clamping mechanism (2) comprises two support seats (21) arranged in parallel and fixed on the workbench (1), two brackets (28) moving towards each other are installed between the two support seats (21), and a mounting plate (29) is connected to the brackets (28).

5. The interval rounding device for wafer preparation according to claim 4, characterized in that: A first rotating rod (210) is rotatably mounted on one of the mounting plates (29); a first connecting seat (211) is mounted on the end of the first rotating rod (210); and a first clamping member (212) is mounted on the first connecting seat (211); A second motor (213) is mounted on the other mounting plate (29); one end of the output shaft of the second motor (213) is connected to a second rotating rod (214); a second connecting seat (215) is mounted on the end of the second rotating rod (214); and a second clamping member (216) is mounted on the second connecting seat (215).

6. The interval rounding device for wafer preparation according to claim 5, characterized in that: The first clamping member (212) and the second clamping member (216) are both truncated cone-shaped silicone rubber clamping members, and the two non-adjacent ends of the material tray (41) are both provided with a second notch (44). The first clamping member (212), the second clamping member (216), and the second notch (44) are coaxially arranged, and the diameters of the first clamping member (212) and the second clamping member (216) are smaller than the diameter of the second notch (44).

7. The interval rounding device for wafer preparation according to claim 6, characterized in that: The support seat (21) is provided with a third groove (22), a first screw rod (24) is rotatably mounted inside one of the third grooves (22), a polished rod (26) is fixed inside another of the third grooves (22), and a first motor (23) for driving the first screw rod (24) to rotate is mounted at the end of one of the support seats (21); Two first sliding seats (25) that move toward each other are threadedly mounted on the outer wall of the first screw rod (24), two second sliding seats (27) that move toward each other are slidably mounted on the light rod (26), and the bracket (28) is on the first sliding seat (25) and the second sliding seat (27).

8. The interval rounding device for wafer preparation according to claim 5, characterized in that: The surface of the workbench (1) is provided with a first groove (11), and the lifting mechanism (3) comprises a liftable bottom plate (34), a second screw rod (31) rotatably mounted inside the first groove (11), two screw rod seats (32) movable towards each other are threadedly connected on the outer wall of the second screw rod (31), a diagonal support rod (33) is rotatably mounted between the screw rod seat (32) and the bottom of the bottom plate (34), a bearing plate (35) is mounted on the bottom plate (34), and a slot (36) for placing a feeding mechanism (4) and a water storage tank (37) located around the slot (36) are respectively provided on the bearing plate (35).

9. The interval rounding device for wafer preparation according to claim 8, characterized in that: The workbench (1) is also provided with a second groove (13) and a through hole (12) passing through the first groove (11) and the second groove (13); a second gear (310) is rotatably mounted inside the second groove (13); a third motor (38) is mounted on the workbench (1); one end of the output shaft of the third motor (38) is sleeved with a first gear (39); the first gear (39) is meshed with the second gear (310); one end of the second screw rod (31) passes through the through hole (12) and is inserted into the inner ring of the second gear (310).

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