A filament failure diagnostic system for a helium mass spectrometer leak detection apparatus

Abstract

The application relates to a filament fault diagnosis system for a helium mass spectrometry air tightness detection device, which comprises an ionization chamber arranged in a vacuum environment and a detector in communication with the ionization chamber, the ionization chamber comprises a filament and a permanent magnet, the filament generates electrons through electric current and is arranged in a magnetic field of the permanent magnet, the permanent magnet collides the electrons and combined molecules to form charged ions, the detector converts the charged ions into an electric signal, the system further comprises a gas analysis module and a signal analysis module, the gas analysis module is close to the filament and is used for detecting the metal vapor concentration released by the filament in real time, the signal analysis module is electrically connected with the detector and is used for monitoring the fluctuation of the electric signal in real time, when the metal vapor concentration released by the filament exceeds a preset first threshold value and the fluctuation of the electric signal exceeds a preset second threshold value, the system automatically diagnoses that the filament has a fault and reminds an operator, so that the fault source of the air tightness detection device, i.e. filament aging, can be found and diagnosed in time.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of air tightness detection equipment, and particularly relates to a filament fault diagnosis system for a helium mass spectrometry air tightness detection equipment. BACKGROUND

[0002] Air tightness detection is a key quality control process used to ensure the sealing performance of various industrial products, such as electronic components, medical devices and packaging materials, during the production process. Air tightness detection equipment can be mainly divided into: differential pressure method and helium mass spectrometry method equipment. Among them, the helium mass spectrometry method using a mass spectrometer is particularly outstanding in accurately detecting small leaks due to its high sensitivity and fast response characteristics, and is an important technology in current air tightness detection.

[0003] In the equipment that uses a mass spectrometer to achieve air tightness detection, namely the helium mass spectrometry method equipment, the entire operation process starts with using a vacuum system to pump out the air in the detection chamber to form a highly vacuum environment, eliminating any excess air or other gases in the detection chamber to avoid interference with the final detection results. The detection object is then placed in the vacuumized detection chamber for verification of its sealing performance, such as battery casings, medical equipment or packaging materials. Through a helium gas supply system, helium gas is injected into the inside of the detection object as a tracer gas, and the helium gas molecules are small enough to pass through small cracks. If the detection object has leaks, helium gas will escape from these leaks and then be pumped into the mass spectrometer through the vacuum system. The mass spectrometer generally includes four main components: a vacuum system, an ionization chamber inside the vacuum system, a mass analyzer and a detector. The vacuum system in the mass spectrometer is responsible for maintaining a low pressure environment inside the entire instrument. The ionization chamber is where helium gas molecules are converted into ions, and the vacuum environment greatly reduces the presence of air molecules. In a vacuum environment, ionization is performed to prevent collisions between air molecules and ions, and to prevent accidental reactions of ions with other gases or scattering and attenuation caused by air. Without a vacuum environment, such collisions would cause ions to scatter or disperse energy, affecting the detection and analysis of ions.

[0004] In the ionization chamber in the vacuum environment, helium gas molecules form charged ions through the ionization chamber, and these ions are sent to the mass analyzer (such as a quadrupole rod) for mass / charge ratio separation, i.e. separating ions of different masses. The detector includes a high-energy repeller and an electron multiplier, the high-energy repeller replaces the charged ions into electrons, and the electron multiplier amplifies the bombarded electrons into software-recognizable electrical signals, which can generate total ion current graphs and mass spectra to accurately detect and quantify leaked helium gas. This series of operations allows accurate identification of small leaks, ensuring that products meet the expected air tightness standards after production, thereby ensuring the overall quality and safety of the products.

[0005] Among them, the ionization chamber is the key component to ionize the gas sample such as helium. In the existing leak detection technology, the electron impact ionization (EI) source is widely used due to its stability and high efficiency of ion generation. EI technology can produce high-quality ion spectra, is easy to operate and easy to integrate with other technologies such as gas chromatography, and is the most suitable ionization chamber for such equipment. Electron impact ionization (EI) technology generates high-energy electrons through a heated filament. These electrons move up and down in a spiral in a magnetic field generated by a permanent magnet. Electrons will collide with compound molecules (helium). The compound molecules lose electrons under the bombardment of high-energy electrons to form charged ions. Charged ions can be effectively manipulated by the mass analyzer and detected by the detector, because only charged ions can be effectively separated by the mass analyzer according to the mass / charge ratio under the action of the electric field and the magnetic field.

[0006] The ion generation process is affected by many factors, and filament aging is one of the common factors that cause a decrease in ion yield. The decrease in ion quantity will result in a decrease in the detected signal intensity, making it difficult to detect low-concentration analytes, thereby affecting the detection limit of the mass spectrometer. The sensitivity of the analysis will be directly affected, which means that even components present in the sample may not be effectively detected and quantified. Insufficient ion yield will also result in unstable and poor reproducible results. Since these problems are usually gradual and not easily noticed, it is difficult to find and diagnose them in a timely manner, resulting in the fact that the leak detection equipment has already failed without knowing it. The total ion current graph and mass spectrum graph generated are not accurate, making it difficult to ensure the reliability of the data.

[0007] Although regular maintenance and inspection can effectively manage and solve problems in ion generation, these methods often fail to provide immediate diagnosis of the fault location, and when the leak detection equipment fails, the operator needs to disassemble the machine and rely on personal experience to diagnose the fault location and cause. Therefore, when the problem occurs, the data quality has already been affected, that is, before the equipment failure is discovered, the previous data may have been inaccurate or even incorrect. When the ionization chamber fails, such as filament aging or ionization chamber contamination, it will directly affect the generation and transmission efficiency of helium ions. This decrease in efficiency will result in insufficient detection of helium ions, which in turn will not accurately measure the small leaks of the test object, thereby affecting the accuracy and reliability of the entire leak detection. In some cases, if the problem is severe and not discovered in a timely manner, it may result in the leak detection equipment being unable to correctly evaluate the leak tightness of the test object, and the final result is that the product fails the test or is released incorrectly, which not only affects product quality, but also may cause safety risks and economic losses.

[0008] Therefore, aiming at the above problems, a filament fault diagnosis system for a helium mass spectrometry leak detection device is proposed, which can warn potential problems in advance, prompt fault location and cause, and automatically diagnose specific factors affecting ion generation in real time. SUMMARY

[0009] The purpose of the present application is to overcome the shortcomings in the prior art, and to propose a filament fault diagnosis system for a helium mass spectrometry leak detection device, which can warn potential problems in advance, prompt fault location and cause, such as filament failure, and automatically diagnose specific factors affecting ion generation in real time.

[0010] The present application is realized by the following technical solutions:

[0011] The present application proposes a filament fault diagnosis system for a helium mass spectrometry leak detection device, which includes an ionization chamber in a vacuum environment and a detector connected to the ionization chamber. The ionization chamber includes a filament and a permanent magnet. The filament generates electrons through current and is located in the magnetic field of the permanent magnet. The permanent magnet collides with electrons and chemical molecules to form charged ions. The detector converts the charged ions into an electrical signal. The system further includes:

[0012] A gas analysis module is provided near the filament to detect the concentration of metal vapor released by the filament in real time.

[0013] A signal analysis module is electrically connected to the detector to monitor the fluctuation of the electrical signal in real time.

[0014] When the concentration of metal vapor released by the filament exceeds a preset first threshold value, and the fluctuation of the electrical signal exceeds a preset second threshold value, the filament is diagnosed as having a fault.

[0015] In an embodiment of the present application, the system performs the following steps:

[0016] The gas analysis module detects the concentration of metal vapor released by the filament in real time.

[0017] When the concentration of metal vapor released by the filament exceeds a preset first threshold value, the signal analysis module monitors the fluctuation of the electrical signal in real time.

[0018] When the fluctuation of the electrical signal exceeds a preset second threshold value, the filament is diagnosed as having a fault.

[0019] In an embodiment of the present application, the detector comprises a high-energy repeller and an electron multiplier, the signal analysis module is electrically connected to the electron multiplier, the high-energy repeller replaces the charged ions into electrons, and the electron multiplier converts the bombarded electrons into an electric signal, so that the signal analysis module can monitor the fluctuation of the electric signal in real time.

[0020] In an embodiment of the present application, the electron multiplier is provided with an automatic gain control device for automatically adjusting the gain in the electron multiplication process, and the electron multiplier automatically adjusts the generated electric signal according to the number of electrons received from the high-energy repeller, so that the signal analysis module can monitor the fluctuation of the electric signal in real time.

[0021] In an embodiment of the present application, the signal analysis module determines the fluctuation of the signal by measuring the amplitude parameter of the electric signal and calculating the standard deviation thereof.

[0022] When the metal vapor concentration released by the filament exceeds a preset first threshold value, and the standard deviation of the electric signal exceeds a preset second threshold value, the system will automatically diagnose that the filament has a fault.

[0023] In an embodiment of the present application, the system further comprises a thermal imaging module facing the filament, and the thermal imaging module is used to monitor the temperature distribution of the filament in real time.

[0024] When the metal vapor concentration released by the filament exceeds a preset first threshold value, the thermal imaging module detects that the temperature distribution of the filament exceeds a preset third threshold value, and the fluctuation of the electric signal exceeds a preset second threshold value, the filament is diagnosed as having a fault.

[0025] In an embodiment of the present application, the thermal imaging module acquires the temperature distribution data of the filament by capturing the infrared radiation emitted by the filament during operation, and monitors whether the abnormal hot spot and / or uneven heating range of the filament exceeds a preset third threshold value according to the temperature distribution data.

[0026] In an embodiment of the present application, the thermal imaging module comprises a high-resolution infrared camera, and automatically identifies and records the hot spot and / or uneven change during the operation of the filament; the thermal imaging module predicts the aging trend of the filament by performing time series analysis on the continuously acquired temperature distribution data.

[0027] In an embodiment of the present application, the system performs the following steps:

[0028] The gas analysis module detects the metal vapor concentration released by the filament in real time, and the thermal imaging module monitors the temperature distribution of the filament in real time.

[0029] When the metal vapor concentration released by the filament exceeds a preset first threshold value, and the thermal imaging module detects that the temperature distribution data of the filament exceeds a preset third threshold value, the signal analysis module monitors the fluctuation of the electrical signal in real time;

[0030] When the fluctuation of the electrical signal exceeds a preset second threshold value, the filament is diagnosed as having a fault, and a protection measure is automatically triggered to send a diagnosis result.

[0031] In an embodiment of the present application, the system further comprises a mass analyzer for separating different ion masses, the mass analyzer being arranged between and in communication with the ionization chamber and the detector, the ionization chamber comprising a fixed shell, an ionization area and an ejection assembly, the fixed shell forming the ionization area, and the ejection assembly being arranged in the ionization area;

[0032] The fixed shell is provided with a first accommodating groove and a second accommodating groove on two sides thereof facing away from the first direction, the first accommodating groove and the second accommodating groove both being in communication with the ionization area, the filament comprising a first filament body and a second filament body, the first filament body being arranged in the first accommodating groove, and the second filament body being arranged in the second accommodating groove;

[0033] The gas analysis module has two, both of the gas analysis modules being arranged on a side of the fixed shell away from the ionization area, one of the gas analysis modules being close to the first filament body, and the other gas analysis module being close to the second filament body;

[0034] The fixed shell is provided with a communication hole in a second direction, so that the combined molecules enter the ionization area, the second direction being perpendicular to the first direction;

[0035] The infrared camera has two, one of the infrared cameras being arranged in the first accommodating groove and facing the first filament body, and the other infrared camera being arranged in the second accommodating groove and facing the second filament body, both of the infrared cameras being arranged in a third direction, the third direction being perpendicular to the second direction and the first direction, respectively.

[0036] Compared with the prior art, the present application has the following beneficial effects:

[0037] 1. The filament generates electrons through heating with an electric current. These electrons then collide with chemical molecules through a permanent magnet, forming charged ions. A gas analysis module is located near the filament to monitor the concentration of metal vapor that may be released in real time, allowing for timely assessment of whether the filament is aging or deteriorating. A detector converts the charged ions into an electrical signal. The signal analysis module is electrically connected to the detector and monitors the fluctuations in the electrical signal transmitted from the detector in real time. When the filament ages or begins to deteriorate, metal vapor may be generated on its surface, which is detected by the gas analysis module. Simultaneously, an aging filament is prone to unstable electron emission, making the ion generation process discontinuous and resulting in signal instability. This instability manifests as signal fluctuations, reducing the repeatability and reliability of the results. The signal analysis module detects these fluctuations. When the gas analysis module detects that the metal vapor concentration exceeds a set first threshold, and the signal analysis module detects that the electrical signal fluctuation exceeds a second threshold, the system automatically diagnoses a filament fault and alerts the operator. This allows for timely detection and diagnosis of filament aging as the cause of failure in airtightness testing equipment, preventing situations where the equipment is malfunctioning without the user's knowledge.

[0038] 2. The signal analysis module monitors the fluctuations of the electrical signal in real time by measuring the amplitude parameter. The standard deviation, calculated by measuring the deviation between each signal amplitude data point and the average amplitude, reveals the signal's volatility at its average level. The standard deviation measures the degree of deviation of a set of electrical signal data points from their average value. A larger standard deviation indicates greater signal volatility and more significant differences between data points. The second threshold is a preset standard deviation limit used to determine whether the electrical signal fluctuation is abnormal. When the real-time calculated standard deviation exceeds the second threshold, indicating abnormal signal volatility, the system automatically diagnoses a filament fault and alerts the operator. This allows for timely detection and diagnosis of filament aging as the cause of the airtightness testing equipment malfunction.

[0039] 3. The thermal imaging module faces the filament. By capturing the infrared radiation emitted by the filament during operation, the module obtains temperature distribution data and monitors for abnormal hot spots and / or uneven heating based on this data. When the concentration of metal vapor released by the filament exceeds a preset first threshold, and the thermal imaging module detects that the filament's temperature distribution data exceeds a preset third threshold, the signal analysis module monitors the fluctuation of the electrical signal in real time. When the fluctuation of the electrical signal exceeds a preset second threshold, the system automatically diagnoses a filament fault and alerts the operator. This allows for timely detection and diagnosis of filament aging as the cause of the airtightness testing equipment malfunction.

[0040] 4、When the temperature of a small area of the filament is significantly higher than the average temperature of its surrounding area, the area is considered as an abnormal hot spot. When the third threshold is set as the abnormal hot spot limit of the filament, the abnormal hot spot limit is set as a percentage of the normal operating temperature, for example, 120%, if the temperature of any small area of the filament exceeds 120% of the normal temperature, it is considered as an abnormal hot spot. If the temperature distribution of the filament is significantly inconsistent along its length, i.e. some areas are much hotter than others, this phenomenon is called uneven heating. When the third threshold is set as the uneven heating limit of the filament, uneven heating is defined as the difference between the highest temperature and the lowest temperature in any continuous area along the length of the filament exceeds a certain multiple of the normal maximum temperature difference, for example, 150%, it is considered as uneven heating. The thermal imaging module can simultaneously monitor whether the abnormal hot spot and the uneven heating range of the filament exceed the preset third threshold.

[0041] 5、The first threshold is the preset metal vapor concentration limit; the third threshold is the preset abnormal hot spot or uneven heating of the filament, and the real-time identification of the abnormal temperature rise or uneven heating area; the second threshold is the preset standard deviation limit, which is used to determine whether the fluctuation of the electrical signal is abnormal. The gas analysis module detects the metal vapor concentration released by the filament in real time, and the thermal imaging module monitors the temperature distribution of the filament in real time; when the metal vapor concentration released by the filament exceeds the preset first threshold, and the thermal imaging module detects that the temperature distribution data of the filament exceeds the preset third threshold, the signal analysis module monitors the fluctuation of the electrical signal in real time; when the fluctuation of the electrical signal exceeds the preset second threshold, the control processing unit automatically diagnoses that the filament has a fault, and reminds the operator. Thus, the source of the fault of the airtightness detection equipment is found and diagnosed in time as the filament aging.

[0042] Other features and advantages of the present application will be set forth in the descriptions that follow, and in part will be apparent from the descriptions, or can be learned by practice of the present application. The purposes and other advantages of the present application will be realized and attained by the structures particularly pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF DRAWINGS

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without any creative effort.

[0044] Figure 1 A flow chart of a filament fault diagnosis system in a helium mass spectrometric airtightness detection device is provided for an embodiment of the present application;

[0045] Figure 2 A flow chart of a filament fault diagnosis system in a helium mass spectrometer leak detection apparatus is provided for an embodiment of the present application;

[0046] Figure 3 A flow chart of a filament fault diagnosis system in a helium mass spectrometer leak detection apparatus is provided for an embodiment of the present application;

[0047] Figure 4 A block diagram of a filament fault diagnosis system in a helium mass spectrometer leak detection apparatus is provided for an embodiment of the present application;

[0048] Figure 5 A block diagram of a filament fault diagnosis system in a helium mass spectrometer leak detection apparatus is provided for an embodiment of the present application;

[0049] Figure 6 A schematic diagram of a leak detection apparatus is provided for an embodiment of the present application;

[0050] Figure 7 A schematic diagram of an ionization chamber is provided for an embodiment of the present application.

[0051] BRIEF DESCRIPTION OF DRAWINGS

[0052] 10, mass spectrometer; 100, ionization chamber; 11, first filament; 12, second filament; 21, first magnet; 22, second magnet; 130, fixed shell; 31, ionization region; 32, first accommodating groove; 33, second accommodating groove; 34, communication hole; 41, push-pull electrode; 42, pull-out electrode; 43, ion focusing; 44, entrance lens; 150, infrared camera; 160, residual gas analyzer; 200, mass analyzer; 300, detector; 310, high-energy repeller; 320, electron multiplier; 1230, vacuum system; 40, gas analysis module; 50, signal analysis module; 60, thermal imaging module; 70, control processing unit; 71, processor; 72, computer program; 73, memory. DETAILED DESCRIPTION

[0053] In order to make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0054] In order to make the skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by the skilled in the art without creative work are within the scope of protection of the present application.

[0055] It should be noted that when an element is referred to as being "fixed" or "set" on another element, it can be directly on the other element or indirectly on the other element; when an element is referred to as being "connected" to another element, it can be directly connected to the other element or indirectly connected to the other element.

[0056] In addition, the terms "first", "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of", "several" is two or more, unless otherwise explicitly and specifically limited.

[0057] In the following description, specific details are set forth in order to provide a thorough understanding of the embodiments of the present application for the purpose of explanation and not for the purpose of limitation. It will be obvious to the skilled in the art that the present application can be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits and methods are omitted so as not to obscure the description of the present application with unnecessary details.

[0058] In order to illustrate the technical solutions described in the present application, the following will be illustrated by specific embodiments.

[0059] Reference should be made to Figures 1 to 7The application provides a filament fault diagnosis system for a helium mass spectrometry air tightness detection device, which comprises an ionization chamber 100 arranged in a vacuum environment and a detector 300 in communication with the ionization chamber 100. The ionization chamber 100 comprises a filament (not marked in the figure) and a permanent magnet (not marked in the figure). The filament generates electrons through electric current and is arranged in the magnetic field of the permanent magnet. The permanent magnet causes the electrons and combined molecules (such as helium molecules) to collide to form charged ions. The detector 300 converts the charged ions into an electric signal. The system further comprises a gas analysis module 40 and a signal analysis module 50. The gas analysis module 40 is close to the filament and is used for real-time detection of the metal vapor concentration released by the filament. The signal analysis module 50 is electrically connected with the detector 300 and is used for real-time monitoring of the fluctuation of the electric signal. When the metal vapor concentration released by the filament exceeds a preset first threshold value and the fluctuation of the electric signal exceeds a preset second threshold value, the filament is diagnosed as having a fault.

[0060] Regarding the filament: tungsten, molybdenum, osmium, iridium, etc. can all be used as filament materials. In a vacuum environment, the filament is easy to form metal vapor at high temperature. This vapor is generated on the surface of the filament and gradually escapes. The generation of this metal vapor is an important sign of the gradual degradation of the filament and can be detected in real time by a residual gas analyzer 160 (RGA). This monitoring helps to diagnose the health status of the filament, predict potential faults and plan necessary maintenance measures to ensure the normal operation and high-precision performance of the air tightness detection device.

[0061] Regarding the gas analysis module 40: the gas analysis module 40 is preferably a residual gas analyzer 160 (RGA). The RGA can detect very low concentrations of gas, including metal vapor released from the filament aging source. Detection under vacuum conditions means that the influence of background gas is minimal, so the data provided by the RGA is more accurate and is not affected by common pollutants present in the ambient air. The RGA can provide detailed information about the type and concentration of gas, which is extremely useful for determining the specific cause and location of the fault. The first threshold value is a preset metal vapor concentration limit. When the real-time detected metal vapor concentration exceeds the first threshold value, it means that the concentration of metal vapor is abnormally excessive.

[0062] Regarding the signal analysis module 50: The signal analysis module 50 monitors the fluctuation of the electrical signals in real time, and analyzes the stability and fluctuation of these signals in real time. The signal analysis module 50 is performed by measuring the amplitude parameter of the electrical signals. In the signal analysis, the amplitude is the strength or size of the signal, and the standard deviation is calculated by measuring the deviation between each signal amplitude data point and the average amplitude, which can reveal the fluctuation and instability of the signal around its average level. The standard deviation is used to measure the degree of deviation of a group of electrical signal data points from their average value. The standard deviation is the average amount of deviation of each data point from the average value, reflecting the dispersion of the data. In the signal analysis, the larger the standard deviation, the greater the fluctuation of the signal, and the more significant the difference between the data points. The second threshold is a preset standard deviation limit used to determine whether the fluctuation of the electrical signal is abnormal. When the real-time calculated standard deviation exceeds this second threshold, i.e., the fluctuation of the electrical signal exceeds the preset second threshold, it represents that the fluctuation of the electrical signal is abnormal.

[0063] In the present system, when the concentration of metal vapor released by the filament exceeds the preset first threshold (the first threshold is a preset metal vapor concentration limit), and at the same time the standard deviation of the electrical signal exceeds the second threshold (the second threshold is a preset standard deviation limit), the system will diagnose that the filament has a fault.

[0064] In particular, please refer to Figure 5 and Figure 6, Mass spectrometer 10 is set in vacuum system 1230, so that ionization chamber 100 and detector 300 are located in a vacuum environment, including a filament heated by electric current and a permanent magnet inside ionization chamber 100. The role of the filament is to generate electrons, which move up and down in a spiral with a diameter of about 1 mm in the magnetic field generated by the permanent magnet. In the process of movement, these electrons will collide with compound molecules (helium gas). Under the bombardment of these high-energy electrons, compound molecules lose electrons to produce charged ions. Gas analysis module 40 is used to monitor the concentration of metal vapor that the filament may release in real time. By detecting the concentration of metal vapor, it can be known in time whether the filament is in an aging or degenerative state. Detector 300 converts the charged ions into an electrical signal, and signal analysis module 50 is electrically connected to detector 300 and is responsible for monitoring the fluctuations in the electrical signal transmitted from detector 300. Signal analysis module 50 can analyze the degree of fluctuation of the electrical signal, thereby indirectly reflecting the changes in ion yield and transmission efficiency. The filament generates high-energy electrons by heating. When the filament ages or begins to degenerate, metal vapor may be produced on its surface, which is detected by gas analysis module 40. At the same time, the aging filament is prone to unstable electron emission, making the ion generation process become incoherent, resulting in unstable signals. This instability is reflected in the fluctuation of the signal, which reduces the repeatability and reliability of the results. Signal analysis module 50 will monitor this fluctuation. Therefore, when the concentration of metal vapor exceeds a first threshold value (that is, the concentration of metal vapor released when the filament is in an aging or degenerative state), and the fluctuation of the electrical signal exceeds a second threshold value (that is, the filament aging causes unstable electron emission, making the ion generation process become incoherent, causing the fluctuation of the electrical signal to be abnormal), the system will consider that the filament has a fault, and will remind the operator.

[0065] It needs to be understood that in traditional leak detection equipment, although the helium mass spectrometry method has high sensitivity, these systems often face the problem of being unable to identify and diagnose the internal components of the equipment, especially the filament aging or damage in the ionization chamber 100, in a timely manner. This is because the aging or damage of the filament will affect the ionization efficiency, leading to a decrease in ion production, and ultimately affecting the detection accuracy. The monitoring of the internal components of the ionization chamber 100 relies mainly on periodic maintenance and post-fault analysis, which not only takes a long time, but also may have affected the accuracy of a large amount of detection data once a fault occurs. In addition, traditional systems often lack real-time fault warning capability and cannot intervene when a fault occurs, resulting in the equipment running in a non-optimal state for a long time, making the equipment maintenance reaction slow, increasing the maintenance cost and equipment downtime. In the present application, by combining gas analysis and electrical signal fluctuation dual monitoring, real-time and accurate diagnosis of filament aging or damage is achieved. This real-time monitoring and fault diagnosis mechanism greatly improves the reliability and safety of the equipment compared to traditional leak detection equipment, reduces the production downtime caused by equipment failure, and ensures production efficiency and product quality. In addition, this system can provide early warning of potential equipment failure, allowing operators to perform preventive maintenance, thereby reducing maintenance costs and potential safety risks.

[0066] It is important to note that the use of gas analysis alone for filament failure diagnosis in ionization chamber 100 presents accuracy issues. Gas analysis module 40 monitors the state of the filament by detecting the concentration of metal vapor released by the filament in real-time. While an increase in metal vapor often indicates that the filament is degrading, this analysis does not provide a complete picture of whether the filament has degraded enough to affect the performance of the entire device! The use of gas analysis module 40 alone can be affected by external chemicals in the working environment, which can lead to false positives in filament status. Metal vapor released by the filament can be produced by a variety of different physical or chemical processes, not necessarily just due to filament aging. For example, volatile organic compounds (VOCs) or other chemical vapors that can be present can confound the detection results with metal vapor released by the filament. There can also be a lack of specificity in gas analysis alone to distinguish the exact cause of changes in metal vapor concentration, as other chemical changes within the device can also produce metal vapor in addition to filament aging. The monitoring of electrical signal fluctuations adds a layer of specificity to help confirm whether these changes are directly related to a decline in filament function. Analysis of electrical signal fluctuations can reveal specific manifestations of filament damage, such as a decrease in ion production efficiency and instability in electron emission, which are direct consequences of changes in the physical state of the filament. The combined use of electrical signal fluctuation analysis can then provide an important cross-verification point. If electrical signal fluctuations are abnormal independent of an increase in metal vapor concentration, it can indicate that the filament failure determination is affected by other interfering factors, rather than true filament aging or damage.

[0067] It is important to note that the use of signal analysis alone for filament failure diagnosis in ionization chamber 100 also presents accuracy issues. Electrical signal fluctuation monitoring relies on the analysis of the stability of the electrical signal produced by the charged ions received by detector 300. While abnormal fluctuations in the electrical signal are an important indicator of a decline in filament performance, there can be other factors that can cause similar signal changes! Fluctuations in the electrical signal can be caused by a variety of electrical or mechanical problems within ionization chamber 100, not just filament problems. By simultaneously monitoring gas analysis data, it is possible to rule out the possibility that electrical signal fluctuations are due to non-filament-related electrical faults. For example, if there is no significant change in metal vapor concentration but electrical signal fluctuations increase, this can indicate that the problem is in other parts of the electronic device, such as electrical connections or power supply problems in ionization chamber 100. The combination of gas analysis and electrical signal fluctuation monitoring not only increases the specificity and sensitivity of fault detection, but also improves the reliability of the entire diagnostic process, allowing more accurate indication of whether the filament has truly failed, while excluding false positives due to problems in the environment or other parts of the device, ensuring the accuracy of the operation of the leak detection device and the timeliness of maintenance.

[0068] Therefore, by combining the use of gas analysis and electrical signal fluctuation monitoring, not only does it solve the limitations and misdiagnosis problems that a single method may bring, but it can better determine whether this is due to a problem with the filament itself or an external or accidental factor causing false positives. When gas analysis shows that the concentration of metal vapor released by the filament is higher than the first preset threshold, and the electrical signal also shows abnormal fluctuations, that is, when the concentration of metal vapor released by the filament exceeds the first preset threshold, and the fluctuation of the electrical signal exceeds the second preset threshold, it can be determined that the source of the fault is the filament itself.

[0069] Reference is made to Figure 1 In an embodiment, the system performs the following steps:

[0070] S1: The gas analysis module 40 detects the concentration of metal vapor released by the filament in real time;

[0071] S2: When the concentration of metal vapor released by the filament exceeds the first preset threshold, the signal analysis module 50 monitors the fluctuation of the electrical signal in real time;

[0072] S3: When the fluctuation of the electrical signal exceeds the second preset threshold, the filament is diagnosed as having a fault, and the protection measures are automatically triggered, and the diagnostic results are sent.

[0073] Specifically, the gas analysis module 40 is arranged in the area close to the filament in order to capture the metal vapor that may be released by the filament, and to monitor the concentration of metal vapor in the environment in real time. The first threshold for the concentration of metal vapor is preset based on the measured value of the concentration of metal vapor under normal operating conditions of the filament, and the measured value of the concentration of metal vapor when the filament begins to show performance degradation due to aging. When the concentration of metal vapor released by the filament exceeds the first preset threshold, the signal analysis module 50 monitors the fluctuation of the electrical signal in real time. The signal analysis module 50 monitors the fluctuation of the electrical signal in real time to determine the stability and trend of the signal. The second threshold for the fluctuation of the electrical signal is preset. The second threshold is based on the measured value of the fluctuation. When the gas analysis module 40 detects that the concentration of metal vapor exceeds the first preset threshold, and the signal analysis module 50 detects that the fluctuation of the electrical signal also exceeds the second threshold, the system automatically determines that the location of the fault is the filament, and automatically triggers the protection measures, such as stopping the work of the gas tightness detection device, and reminding the operator that the filament needs to be replaced due to aging.

[0074] Reference is made to Figure 6 In an embodiment, the detector 300 includes a high-energy repeller 310 and an electron multiplier 320, the signal analysis module 50 is electrically connected to the electron multiplier 320, the high-energy repeller 310 replaces the charged ions into electrons, and the electron multiplier 320 converts the bombarded electrons into an electrical signal, so that the signal analysis module 50 monitors the fluctuation of the electrical signal in real time.

[0075] Specifically, in the existing mass spectrometer 10, the detector 300 usually includes a high-energy dynode 310 and an electron multiplier 320, and the charged ions are first captured by the high-energy dynode 310. The function of the dynode is to convert the charge state of the ions into electrons, and the released electrons enter the electron multiplier 320, which is a device that amplifies the electronic signal by using the principle of secondary electron emission. The performance of the filament degrades, the ionization efficiency decreases, and the number of generated ions decreases, thereby reducing the strength of the ion signal. In addition, the decrease in ionization efficiency means that the ability of the helium molecules to convert into the ions required for detection is weakened. This leads to a decrease in detection sensitivity, affects the detection limit, and causes the analyte with low concentration to be unable to be effectively detected, and the signal analysis module 50 is also unable to monitor the fluctuation of the electric signal in real time. Therefore, when the primary electrons hit the inner surface of the multiplier, more electrons are released, and after multiple amplifications, a significantly enhanced electric signal is formed. The amplified electric signal is then transmitted to the signal analysis module 50, which monitors the fluctuation of the electric signal in real time, analyzes the amplitude parameters obtained by the fluctuation in real time, and the signal analysis module 50 can detect whether the fluctuation of the electric signal exceeds the preset second threshold value (the second threshold value is a preset standard deviation limit) in real time.

[0076] Please refer to Figure 7 In an embodiment, the system further comprises a thermal imaging module 60, which is used to monitor the temperature distribution of the filament in real time. When the concentration of metal vapor released by the filament exceeds the preset first threshold value, the thermal imaging module 60 detects that the temperature distribution of the filament exceeds the preset third threshold value, and the fluctuation of the electric signal exceeds the preset second threshold value, the filament is diagnosed as having a fault.

[0077] Specifically, the thermal imaging module 60 captures the infrared radiation emitted by the filament during operation to obtain temperature distribution data of the filament (the temperature distribution data can be a temperature distribution map to display any temperature abnormality or uneven heating area in real time), and monitors abnormal hot spots or uneven heating of the filament according to the temperature distribution data. When the concentration of metal vapor released by the filament exceeds the preset first threshold value, the thermal imaging module 60 detects that the temperature distribution of the filament exceeds the preset third threshold value, and the fluctuation of the electric signal exceeds the preset second threshold value, the filament is diagnosed as having a fault.

[0078] Regarding the thermal imaging module 60, when the filament is in operation, the thermal imaging module 60 monitors its temperature distribution in real time and identifies any abnormal temperature rise or uneven area. The real-time monitored temperature data is compared with the preset third threshold value, and if the temperature exceeds the third threshold value, it indicates that the filament may have overheating or local overheating problems.

[0079] Abnormal hot spot: When a small area of the filament has a temperature significantly higher than the average temperature of its surrounding area, this area is considered an abnormal hot spot. Abnormal hot spots are usually caused by local material degradation, or an impending filament breakage. When the third threshold is set as the abnormal hot spot limit for the filament, the normal temperature distribution of the filament under stable and ideal working conditions in a vacuum environment needs to be determined first. This data can be obtained by running the device for a long time and collecting thermal imaging data. The limit of the abnormal hot spot is set to a certain percentage of the normal working temperature, for example, 120%. This means that if the temperature of any small area of the filament exceeds 120% of the normal temperature, it is considered an abnormal hot spot. The specific percentage can be adjusted according to the temperature resistance of the filament material and historical failure data.

[0080] Uneven heating: If the temperature distribution of the filament is significantly inconsistent along its length, i.e. some areas are much hotter than others, this phenomenon is called uneven heating. Uneven heating can be caused by unevenness of the filament material, filament assembly problems, or uneven current supply. When the third threshold is set as the uneven heating limit for the filament, the filament needs to be monitored regularly first to record the uniformity of its temperature. Uniformity can be defined by analyzing the temperature gradient of the filament along its length. Uneven heating is defined as the difference between the highest temperature and the lowest temperature in any continuous area along the length of the filament exceeding a certain multiple of the normal maximum temperature difference, such as 150%. Then it is considered an uneven heating.

[0081] The thermal imaging module 60 can also monitor whether the abnormal hot spot and uneven heating range of the filament exceed the preset third threshold at the same time. When the metal vapor concentration released by the filament exceeds the preset first threshold, the thermal imaging module 60 detects that the abnormal hot spot and uneven heating range of the filament exceed the preset third threshold, and the fluctuation of the electric signal exceeds the preset second threshold, the filament is diagnosed as having a fault.

[0082] Please refer to Figure 7 In an embodiment, the thermal imaging module 60 includes a high-resolution infrared camera 150 and automatically identifies and records the hot spots or uneven changes that occur during the operation of the filament; the system predicts the aging trend of the filament by performing time series analysis on the continuously acquired temperature distribution data, and when it detects that the abnormal hot spot or temperature change trend reaches the preset fault indicator, the filament is diagnosed as having a fault and automatically triggers the protection measures, and sends the diagnosis result.

[0083] Specifically, the time series analysis technique is used to process the continuous temperature data to identify the patterns and trends of temperature changes. The filament's temperature change history is analyzed to establish its normal aging curve, and potential failures are predicted by behaviors deviating from this curve. The system automatically compares the real-time data with preset failure indicators, and once an abnormal hot spot or temperature change trend exceeds the third threshold, the metal vapor concentration released by the filament exceeds the preset first threshold, and the fluctuation of the electrical signal exceeds the preset second threshold, it immediately diagnoses that there is a failure and automatically sends a failure report and an alarm to the operator or maintenance team. Through real-time and continuous temperature monitoring combined with time series analysis, potential filament failures can be quickly responded to.

[0084] Please refer to Figure 2 In an embodiment, the system performs the following steps:

[0085] S11, the gas analysis module 40 detects the metal vapor concentration released by the filament in real time, and the thermal imaging module 60 monitors the temperature distribution of the filament in real time;

[0086] S22, when the metal vapor concentration released by the filament exceeds the preset first threshold, and the thermal imaging module 60 detects that the temperature distribution data of the filament exceeds the preset third threshold, the signal analysis module 50 monitors the fluctuation of the electrical signal in real time;

[0087] S3, when the fluctuation of the electrical signal exceeds the preset second threshold, the filament is diagnosed as having a failure, and protection measures are automatically triggered to send the diagnosis result.

[0088] Specifically, the gas analysis module 40 is located near the filament area to capture the metal vapor that may be released by the filament, and to monitor the concentration of metal vapor in the environment in real time. The first threshold for the metal vapor concentration is preset through experiments and previous equipment operation data. The first threshold is based on the measured value of the metal vapor concentration under normal operating conditions of the filament, and the measured value of the metal vapor concentration when the filament begins to show performance decline due to aging. When the metal vapor concentration released by the filament exceeds the preset first threshold, the signal analysis module 50 monitors the fluctuation of the electrical signal in real time. The signal analysis module 50 monitors the fluctuation of the electrical signal in real time to determine the stability and change trend of the signal. The third threshold is preset for abnormal hot spots or uneven heating. The temperature distribution of the filament is monitored synchronously, and the module can capture the small changes in temperature and identify abnormal temperature rise or uneven heating areas in real time using high-resolution infrared camera technology. The second threshold is preset for the fluctuation of the electrical signal. The second threshold is based on the measured value of the fluctuation. When the gas analysis module 40 detects that the metal vapor concentration exceeds the preset first threshold, and the signal analysis module 50 detects that the fluctuation of the electrical signal also exceeds the second threshold, the system automatically determines that the failure location is the filament, and automatically triggers protection measures, such as stopping the work of the airtightness detection device, and reminding the operator that the filament needs to be replaced due to aging.

[0089] Reference is made to Figure 6 In an embodiment, the system further comprises a mass analyzer 200 for separating different ion masses, the mass analyzer 200 is arranged between and in communication with the ionization chamber 100 and the detector 300, the ionization chamber 100 comprises a fixed shell 130, an ionization area 31 and an ejection assembly (not labeled in the figure), the fixed shell 130 is formed with an ionization area 31, and the ejection assembly is arranged in the ionization area 31; the fixed shell 130 is provided with a first accommodating groove 32 and a second accommodating groove 33 on two sides facing away from each other in a first direction, the first accommodating groove 32 and the second accommodating groove 33 are in communication with the ionization area 31; the filament comprises a first filament body 11 and a second filament body 12, the first filament body 11 is arranged in the first accommodating groove 32, and the second filament body 12 is arranged in the second accommodating groove 33; the permanent magnet comprises a first magnet 21 and a second magnet 22, the first magnet 21 and the second magnet 22 attract each other, and the first filament body 11 and the second filament body 12 are arranged between the first magnet 21 and the second magnet 22; the gas analysis module 40 has two, one is arranged between the first filament body 11 and the first magnet 21, and the other is arranged between the second filament body 12 and the second magnet 22; the fixed shell 130 is provided with a communication hole 34 in a second direction, so that the compound molecules enter the ionization area 31, and the second direction is perpendicular to the first direction; the ejection assembly comprises a repelling electrode 41, a pulling electrode 42, an ion focusing 43 and an entrance lens 44, the repelling electrode 41 and the pulling electrode 42 are oppositely arranged and both arranged in the second direction, the ion focusing 43 is arranged at one end of the pulling electrode 42 away from the repelling electrode 41, and the entrance lens 44 is arranged at one end of the ion focusing 43 away from the pulling electrode 42; the repelling electrode 41 has a positive voltage, and a voltage difference is formed between the pulling electrode 42 and the repelling electrode 41, the repelling electrode 41 pushes the ions forward by the positive voltage, the ions are pushed forward by the voltage difference between the repelling electrode 41 and the pulling electrode 42, and pass through the pulling electrode 42, the ion focusing 43 causes the ions to be bundled and continue to be pushed to the entrance lens 44, so as to drive these ions to be sent into the mass analyzer 200 (such as a quadrupole rod) for mass / charge ratio separation, i.e. separation of ions of different masses, the high-energy pulling electrode 310 of the detector 300 replaces the charged ions into electrons, the electron multiplier 320 amplifies the bombarded electrons into an electric signal that can be recognized by software, so as to generate a total ion current graph and a mass spectrum graph, so as to accurately detect and quantify the leaked helium.

[0090] Reference is made to Figure 7In one embodiment, there are two infrared cameras 150. One infrared camera 150 is located in the first receiving groove 32 and faces the first filament 11. The other infrared camera 150 is located in the second receiving groove 33 and faces the second filament 12, so as to monitor the temperature distribution of the first filament 11 and the second filament 12 in real time. The infrared cameras 150 are located in a third direction, which is perpendicular to the second direction and the first direction, respectively.

[0091] Please refer to Figure 3 The control processing unit 70 is responsible for operating the entire system, controlling the helium flow, and adjusting the vacuum level. The control processing unit 70 is electrically or signal-connected to the gas analysis module 40, signal analysis module 50, and thermal imaging module 60 to collect and process data. The gas analysis module 40 detects the concentration of metal vapor released by the filament in real time, while the thermal imaging module 60 monitors the temperature distribution of the filament in real time. When the concentration of metal vapor released by the filament exceeds a preset first threshold, and the thermal imaging module 60 detects that the filament temperature distribution exceeds a preset third threshold, the signal analysis module 50 monitors the fluctuation of the electrical signal in real time. When the fluctuation of the electrical signal exceeds a preset second threshold, the control processing unit 70 diagnoses a filament fault, automatically triggers protective measures, and sends the diagnostic results to remind the operator to handle the fault.

[0092] Please refer to Figure 4 The control processing unit 70 includes a memory 73, a processor 71, and a computer program 72 stored in the memory 73 and executable on the processor 71. During the operation of the airtightness testing device, when the processor 71 executes the computer program 72, it enables the airtightness testing device to deliver helium gas into the mass spectrometer 10, detect leaks in the test material within the detection chamber, and especially monitor in real time whether the filament is malfunctioning. Alternatively, when the processor 71 executes the computer program 72, it implements the functions of each module / unit in the above-described device embodiments.

[0093] The computer program 72 can be divided into one or more modules / units. One or more modules / units are stored in the memory 73 and executed by the processor 71 to complete this application. The one or more modules / units can be a series of computer program 72 instruction segments capable of performing a specific function. These instruction segments are used to describe the execution process of the computer program 72 in the system.

[0094] The memory 73 is an internal storage unit of the residual gas analyzer 160, the electron multiplier 320, the infrared camera 150, and the memory 73 can also include both an internal storage unit and an external storage device of the mass spectrometer 10. The memory 73 is used to store the computer program 72 and other programs and data required by the air tightness detection device. The memory 73 can also be used to temporarily store data that has been output or will be output. The processor 71 is used to process the data stored in the memory 73.

[0095] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the division of the above functional units and modules is exemplified, and in actual application, the above functions can be completed by different functional units and modules according to needs, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the functions described above. Each functional unit and module in the embodiment can be integrated in one processing unit, or each unit can exist physically, or two or more units can be integrated in one unit, and the integrated unit can be realized in the form of hardware or in the form of software functional unit. In addition, the specific names of each functional unit and module are only for easy distinction, and do not limit the protection scope of the present application. The specific working process of the units and modules in the above system can refer to the corresponding process in the foregoing method embodiments, which will not be described here.

[0096] In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described or recorded in detail in a certain embodiment can refer to the relevant description of other embodiments.

[0097] Those of ordinary skill in the art can realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be realized in electronic hardware or a combination of computer software and electronic hardware. Whether the functions are executed in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0098] In the embodiments of the present application, it should be understood that the disclosed apparatus / terminal device and method can be implemented in other manners. For example, the embodiments of the apparatus / terminal device described above are merely schematic, and the division of the modules or units is merely logical function division, and there can be another division manner in actual implementation. For example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed mutual couplings or direct couplings or communication connections between different units can be indirect couplings or communication connections through some interfaces, devices or units, and can be electrical, mechanical or in other forms.

[0099] The units described as separated components can or can not be physically separated, and the components displayed as units can or can not be physical units, i.e., can be located in one place or can be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purposes of the embodiments.

[0100] In addition, each functional unit in the embodiments of the present application can be integrated in a processing unit, or each unit can exist physically as a separate unit, or two or more units can be integrated in one unit. The integrated unit can be implemented in the form of hardware, or in the form of a software functional unit.

[0101] If the integrated module / unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer readable storage medium. Based on such an understanding, all or part of the flow of the method in the above embodiments can be completed by a computer program instruction related hardware, and the computer program can be stored in a computer readable storage medium. When the processor executes the computer program, the steps of each method embodiment described above can be implemented. The computer program includes computer program code, and the computer program code can be in the form of source code, object code, executable file or some intermediate form. The computer readable medium can include any entity or device capable of carrying the computer program code, recording medium, U disk, mobile hard disk, magnetic disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signal, telecommunication signal and software distribution medium, etc. It should be noted that the computer readable medium can include or exclude some contents according to the requirements of legislation and patent practice in the jurisdiction, for example, in some jurisdictions, according to the legislation and patent practice, the computer readable medium does not include electrical carrier signals and telecommunication signals.

[0102] The above examples are only used to illustrate the technical solutions of the present application, but not limit the same; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions recorded in the foregoing examples can be modified, or some technical features can be replaced by equivalent ones; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A filament failure diagnostic system for use in a helium mass spectrometer leak detection apparatus, comprising an ionization chamber disposed in a vacuum environment and a detector in communication with the ionization chamber, the ionization chamber comprising a filament and a permanent magnet, the filament generating electrons through an electrical current and disposed in a magnetic field of the permanent magnet, the permanent magnet colliding the electrons and molecular compounds to form charged ions, the detector converting the charged ions into an electrical signal, characterized in that, The system further comprises: a gas analysis module, close to the filament, which can form metal vapor at high temperature in a vacuum environment, for detecting the concentration of metal vapor released by the filament in real time; a thermal imaging module, which is directed towards the filament, for monitoring the temperature distribution of the filament in real time; a signal analysis module, electrically connected to the detector, for monitoring the fluctuation of the electrical signal in real time; when the concentration of metal vapor released by the filament exceeds a preset first threshold value, the thermal imaging module detects that the temperature distribution of the filament exceeds a preset third threshold value, and the fluctuation of the electrical signal exceeds a preset second threshold value, the filament is diagnosed as having a fault; The system performs the following steps: The gas analysis module detects the concentration of metal vapor released by the filament in real time, while the thermal imaging module monitors the temperature distribution of the filament in real time; When the concentration of metal vapor released by the filament exceeds a preset first threshold value, while the thermal imaging module detects that the temperature distribution data of the filament exceeds a preset third threshold value, the signal analysis module monitors the fluctuation of the electrical signal in real time; When the fluctuation of the electrical signal exceeds a preset second threshold value, the filament is diagnosed as having a fault, and protection measures are automatically triggered, and the diagnostic results are sent.

2. The filament failure diagnostic system for use in a helium mass spectrometer gas tightness detection apparatus according to claim 1, characterized by, The detector includes a high-energy repeller and an electron multiplier, the signal analysis module is electrically connected to the electron multiplier, the high-energy repeller replaces charged ions into electrons, and the electron multiplier converts bombarded electrons into an electrical signal, so that the signal analysis module monitors the fluctuation of the electrical signal in real time.

3. The filament failure diagnostic system for use in a helium mass spectrometer gas tightness detection apparatus according to claim 2, characterized by, The electron multiplier is provided with an automatic gain control device for automatically adjusting the gain in the electron multiplication process, and the electron multiplier automatically adjusts the generated electrical signal according to the number of electrons received from the high-energy repeller, so that the signal analysis module monitors the fluctuation of the electrical signal in real time.

4. The filament failure diagnostic system for use in a helium mass spectrometer gas tightness detection apparatus according to claim 2, characterized by, The signal analysis module determines the volatility of the signal by measuring the amplitude parameter of the electrical signal and calculating its standard deviation; When the concentration of metal vapor released by the filament exceeds a preset first threshold value, and the standard deviation of the electrical signal exceeds a preset second threshold value, the system will automatically diagnose the filament as having a fault.

5. The filament failure diagnostic system for use in a helium mass spectrometer gas tightness detection apparatus according to claim 1, wherein The thermal imaging module acquires temperature distribution data of the filament by capturing infrared radiation emitted by the filament during operation, and monitors whether the abnormal hot spots and / or uneven heating range of the filament exceed a preset third threshold value according to the temperature distribution data.

6. The filament failure diagnostic system for use in a helium mass spectrometer gas tightness detection apparatus according to claim 5, wherein The thermal imaging module includes a high-resolution infrared camera and automatically identifies and records hot spots and / or uneven changes that occur during operation of the filament; the thermal imaging module predicts the aging trend of the filament by performing time series analysis on the continuously acquired temperature distribution data.

7. The filament failure diagnostic system for use in a helium mass spectrometer gas tightness detection apparatus according to claim 6, wherein The system further comprises a mass analyzer for separating different ion masses, which is arranged between and in communication with the ionization chamber and the detector, the ionization chamber comprising a fixed shell, an ionization area and an ejection assembly, the fixed shell being formed with the ionization area, and the ejection assembly being arranged in the ionization area; The fixed shell is provided with a first accommodating groove and a second accommodating groove on two sides thereof in a first direction, the first accommodating groove and the second accommodating groove are both in communication with the ionization area, the filament comprises a first filament body and a second filament body, the first filament body is arranged in the first accommodating groove, and the second filament body is arranged in the second accommodating groove; The gas analysis module has two, and the two gas analysis modules are both arranged on a side of the fixed shell away from the ionization area, one of the gas analysis modules is close to the first filament body, and the other gas analysis module is close to the second filament body; The fixed shell is provided with a communication hole in a second direction, so that the chemical molecules enter the ionization area, and the second direction is perpendicular to the first direction; The infrared camera has two, one of the infrared cameras is arranged in the first accommodating groove and faces the first filament body, and the other infrared camera is arranged in the second accommodating groove and faces the second filament body, and the two infrared cameras are arranged in a third direction, and the third direction is perpendicular to the second direction and the first direction, respectively.

Images