Intracranial pressure detection device based on pressure sensor

Abstract

The present invention relates to the technical field of medical devices, and in particular to an intracranial pressure detection device based on a pressure sensor, comprising a probe and a circuit board, wherein a controller chip and a button battery are arranged on the circuit board, wherein the controller chip is electrically connected to the button battery, wherein the probe is electrically connected to the controller chip through a line, and further comprising a handheld host, wherein the handheld host comprises a housing, an NFC control chip arranged on the housing, an NFC receiving module, and a display screen, wherein the NFC control chip is respectively connected to the NFC receiving module and the display screen in communication; wherein an NFC transmitting module is also arranged on the circuit board, wherein the controller chip is connected in communication with the NFC transmitting module, and the NFC transmitting module is connected in communication with the NFC receiving module. The present invention transmits intracranial pressure data through an NFC transceiver module, thereby reducing the power consumption of the circuit board, thereby facilitating longer monitoring of the intracranial pressure of the patient.

Description

Technical Field

[0001] The present invention relates to the technical field of medical devices, and in particular to an intracranial pressure detection device based on a pressure sensor. Background Art

[0002] Intracranial pressure monitoring is the pressure of the cranial cavity contents on the cranial cavity wall. It is necessary to place the probe of the intracranial pressure detection detector inside the skull, and place the probe on the forehead and occipital region. The waveform of intracranial pressure is transmitted to the workstation through the sensor, so as to fully understand the changes in intracranial pressure. By analyzing the changes in the patient's intracranial pressure, it can help determine the patient's injury and brain edema, so as to know the treatment and estimate the prognosis.

[0003] The intracranial pressure detector usually includes a probe, a wire and a host. A pressure sensor is arranged in the probe. The probe and the host are connected by a wire. The probe is placed in the intracranial ventricle or brain tissue to monitor the intracranial pressure. The probe monitors the intracranial pressure data and transmits the pressure data to the host through the wire. The host displays the pressure data through a display screen. The above intracranial pressure monitoring adopts a wired connection method. When the wire is pulled, it is easy to break the wound on the patient's head and cause infection. It may also cause the line to fall off and contact poorly. Therefore, in order to improve the above problems, people have improved the above connection method. The specific method is to connect a circuit board to the end of the wire away from the probe. The circuit board is provided with a battery, a controller chip, and a WiFi communication module. The controller chip, the probe, and the WiFi communication module are powered by the battery. The probe and the controller chip are connected in communication, and the controller chip and the WiFi communication module are connected in communication. The WiFi communication module is connected to the host through wireless WiFi communication. The intracranial pressure data monitored by the probe is wirelessly transmitted to the host through the WiFi communication module in real time, eliminating the long wire in the middle and reducing the inconvenience caused by the wired connection.

[0004] The smaller the size of a circuit board is, the better. After all, the circuit board is usually still located outside the patient's head, which can easily cause discomfort and inconvenience to the patient. Some circuit boards are even directly implanted inside the scalp. A small circuit board can reduce the adverse effects it brings. The battery used in this type of circuit board is small in size, and button batteries are often used as a power supply.

[0005] In the related technology, since the intracranial pressure detector monitors the patient's intracranial pressure data in real time, the WiFi communication module on the circuit board is always connected to the host and transmits the intracranial pressure data to the host in real time, resulting in a large amount of power consumption by the circuit board. The button battery itself has a small amount of power, resulting in a short battery life of the above-mentioned intracranial pressure detector. For patients whose vital signs data are relatively stable but who need longer time to monitor intracranial pressure, the intracranial pressure detector that transmits data via WiFi cannot meet the needs of longer time monitoring of intracranial pressure due to its high power consumption. Summary of the invention

[0006] The present invention aims to provide an intracranial pressure detection device based on a pressure sensor, so as to improve the problem of high power consumption of an intracranial pressure detector that transmits data via WiFi.

[0007] The present invention is achieved through the following technical solutions:

[0008] An intracranial pressure detection device based on a pressure sensor comprises a probe and a circuit board, wherein a controller chip and a button battery are arranged on the circuit board, wherein the controller chip is electrically connected to the button battery, wherein the probe is electrically connected to the controller chip through a line, and further comprises a handheld host, wherein the handheld host comprises a housing, an NFC control chip arranged on the housing, an NFC receiving module and a display screen, wherein the NFC control chip is respectively connected to the NFC receiving module and the display screen for communication;

[0009] The circuit board is also provided with an NFC transmitting module, the controller chip is communicatively connected with the NFC transmitting module, and the NFC transmitting module is communicatively connected with the NFC receiving module.

[0010] Further, the probe includes a shell, a pressure sensor assembly and a temperature sensor, a detection window is opened on one side wall of the shell, a threading port and a temperature sensing port are opened on the other adjacent side wall, the threading port is connected to the detection window, the pressure sensor assembly is located inside the detection window, and the temperature sensor is located inside the temperature sensing port;

[0011] A first wire is electrically connected between the pressure sensor component and the controller chip, and the first wire passes through the threading port. A second wire is electrically connected between the temperature sensor and the controller chip. A silicone protective layer for protecting the pressure sensor component is encapsulated in the detection window.

[0012] Further, a positioning groove is provided on the inner bottom wall of the detection window, the pressure sensor assembly comprises a PCB board, a pressure sensor chip and a solder pad, the pressure sensor chip and the solder pad are both placed on the PCB board, the pressure sensor chip is electrically connected to the solder pad through a circuit on the PCB board, and the PCB board is located in the positioning groove;

[0013] A mounting column is vertically arranged on the PCB board, a connecting hole is vertically opened inside the mounting column, the solder pad is located inside the connecting hole, and the pressure sensor chip is located on one side of the mounting column; a sliding groove is horizontally opened on the inner side wall of the connecting hole close to the middle of the detection window, a sliding column is horizontally slidably arranged in the sliding groove, a first spring is arranged at one end of the sliding column close to the inner bottom wall of the sliding groove, and an end of the first spring away from the sliding column is used to abut against the inner bottom wall of the sliding groove;

[0014] A receiving groove is provided on the lower wall of the inner side wall of the sliding groove in the horizontal direction, and a second spring is provided at the lower part of one end of the sliding column away from the first spring, and the second spring extends into the receiving groove and is provided with a pressure block;

[0015] A conductive column is arranged in the connecting hole, the bottom of the conductive column is in contact with the pad, and the top is connected to the end of the first wire away from the controller chip. An extension groove is provided on the side of the conductive column close to the sliding groove. When one end of the first spring is in contact with the bottom wall of the sliding groove and the other end is in a free state, the end of the sliding column away from the first spring drives the second spring and the pressure block to move into the extension groove, and the second spring presses the lower wall of the inner side wall of the extension groove through the pressure block.

[0016] A pull rope is provided at one end of the sliding column close to the first spring, an extension hole is opened on the inner bottom wall of the sliding groove and passes through the side wall of the mounting column, and the end of the pull rope away from the sliding column passes through the extension hole and extends to one side of the mounting column and is provided with a pull ring.

[0017] Furthermore, a conductive paste layer is provided on the bottom end surface of the conductive column.

[0018] Furthermore, a mounting cavity is provided at the bottom of the pressing block, a notch is provided at the lower cavity wall of the mounting cavity, a ball is rolled in the mounting cavity, and the lower end of the ball extends to the outside of the mounting cavity through the notch.

[0019] Furthermore, the height of the extension groove is greater than the sum of the heights of the sliding groove and the storage groove, the upper wall inside the extension groove is higher than the upper wall of the sliding groove, and the lower wall inside the extension groove is lower than the inner bottom wall of the storage groove; a moving hole is provided inside the end of the sliding column away from the first spring, and a through passage hole is provided on the lower wall of the moving hole, a moving block is provided in the moving hole along the vertical sliding, a connecting column is provided below the moving block, the connecting column is located in the passage hole and the bottom is connected to the top of the second spring, when the pressing block is pressed against the lower wall inside the extension groove, the moving block is pressed against the upper wall inside the moving hole; an extrusion assembly is provided on the conductive column, and when the pressing block is pressed against the extension groove, the extrusion assembly is used to squeeze the moving block downward.

[0020] Furthermore, a downward pressing hole is formed through the top wall of the movable hole, and an adjusting hole is formed through the top wall of the extension groove in the vertical direction; the extrusion assembly includes an extrusion rod and a locking block, the extrusion rod is located in the adjusting hole, the sizes of the extrusion rod and the locking block are smaller than the size of the downward pressing hole, the downward pressing hole is rectangular, and the cross-section of the locking block in the horizontal plane has a longer side and a shorter side, and the longer side of the locking block is larger than the width of the downward pressing hole; after the locking block passes downward through the downward pressing hole, the extrusion rod and the locking block can be rotated to confine the locking block in the movable hole.

[0021] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0022] 1. In the present invention, when the intracranial pressure of the patient is relatively stable, but for the sake of safety, it is necessary to monitor the intracranial pressure of the patient for a long time, the probe is first placed in the corresponding position in the skull, and then the circuit board is left outside the skull or sealed inside the scalp layer. Since the circuit board and the handheld host use NFC near-field communication, the NFC communication distance is usually less than 10 cm. When the distance between the circuit board and the handheld host is greater than the communication distance, the circuit board disconnects the communication with the handheld host. At this time, the intracranial pressure data collected by the probe will not be transmitted to the handheld host through the NFC transmitting module. When the medical staff needs to obtain the intracranial pressure data of the patient, they move the handheld host close to the circuit board of the patient's head. When the handheld host After the connection between the device and the circuit board is completed, the NFC transmitting module on the circuit board transmits the intracranial pressure data currently collected by the probe to the NFC receiving module of the handheld host, and the NFC control chip on the handheld host converts the intracranial pressure data and outputs it through the display screen, so that medical staff can check the patient's current intracranial pressure situation; since this scheme can control the time when the intracranial pressure detection device transmits intracranial pressure data, it can control and reduce the time for the circuit board to transmit intracranial pressure data, that is, the NFC transmitting module does not transmit intracranial pressure data anytime and anywhere, but works only when needed, which is convenient to reduce the power consumption of the circuit board, and then conveniently prolong the time for the intracranial pressure detection device to monitor intracranial pressure;

[0023] 2. In general, the pads of the pressure sensor chip and its wires are welded by soldering. However, the silicone used in the silicone protective layer itself has a certain water permeability, and the probe shell itself also has other small gaps, which causes the body fluids outside the shell to slowly penetrate into the shell. The welded copper and tin will undergo an electrochemical reaction when exposed to water, which will cause the contact resistance at the pad to increase and change, which will affect the transmission of the signal data collected by the pressure sensor chip, and further affect the measurement accuracy of the intracranial pressure. In response to the above problems, in this solution, when electrically connecting the pad of the pressure sensor chip to the first wire, the method of using solder paste for welding is abandoned. When connecting, the PCB board is placed under microscopic magnification operation conditions, and a tool with a hook can be used to reach into the connecting hole to hook the pressure block upwards, so that The second spring is compressed upward, and then the pull ring is pulled to drive the sliding column, the second spring and the pressure block to move in the direction of the first spring through the pull rope. At this time, the first spring is compressed, and the second spring and the pressure block move into the sliding groove. Then the conductive column is inserted into the connecting hole, so that the bottom of the conductive column abuts against the welding pad below, so that the extension groove corresponds to the sliding groove, and then the pull ring is released. The sliding column will drive the second spring and the pressure block to move into the extension groove under the rebound action of the first spring, so that the second spring and the pressure block can move into the extension groove, and the second spring presses the pressure block against the lower wall inside the extension groove, thereby making the conductive column abut against the welding pad below. On the one hand, this solution abandons the use of solder, reduces the electrochemical corrosion between copper and tin when encountering water, and the operation of connecting the first wire and the welding pad is also relatively simple and quick;

[0024] 3. Pressing the moving block downward by the extrusion assembly can further increase the extrusion force of the conductive column on the pad, thereby improving the contact stability between the conductive column and the pad, and ensuring good contact between the conductive column and the pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, constitute a part of this application, and do not constitute a limitation of the embodiments of the present invention.

[0026] In the attached picture:

[0027] Figure 1 It is a structural schematic diagram of the present invention;

[0028] Figure 2 It is a partial cross-sectional view of the present invention, which is intended to show the internal structure of the probe;

[0029] Figure 3 For the present invention Figure 2 Enlarged view of part A in the middle.

[0030] Marks and corresponding parts names in the attached drawings:

[0031] 1. Probe; 2. Circuit board; 3. Controller chip; 4. Button battery; 5. Handheld host; 6. Shell; 7. NFC control chip; 8. NFC receiving module; 9. Display screen; 10. NFC transmitting module; 11. Shell; 12. Temperature sensor; 13. Detection window; 14. Threading port; 15. Temperature sensing port; 16. First wire; 17. Second wire; 18. Silicone protective layer; 19. Positioning slot; 20. PCB board; 21. Pressure sensor chip; 2 2. Solder pad; 23. Mounting column; 24. Connecting hole; 25. Sliding groove; 26. Sliding column; 27. First spring; 28. Storage groove; 29. ​​Second spring; 30. Pressing block; 31. Conductive column; 32. Extension groove; 33. Pull rope; 34. Extension hole; 35. Pull ring; 36. Conductive paste layer; 37. Ball bearing; 38. Moving hole; 39. Passing hole; 40. Moving block; 41. Connecting column; 42. Pressing hole; 43. Adjusting hole; 44. Extrusion rod; 45. Locking block. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical scheme and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the embodiments and drawings. The schematic implementation modes and descriptions of the present invention are only used to explain the present invention and are not intended to limit the present invention. It should be noted that the present invention is already in the actual development and use stage.

[0033] Example 1

[0034] An intracranial pressure detection device based on a pressure sensor, referring to Figure 1 , including a probe 1 and a circuit board 2, on which a controller chip 3 and a button battery 4 are arranged, the controller chip 3 is electrically connected to the button battery 4, the probe 1 is electrically connected to the controller chip 3 through a line, and also includes a handheld host 5, the handheld host 5 includes a shell 6, an NFC control chip 7 arranged on the shell 6, an NFC receiving module 8 and a display screen 9, the NFC control chip 7 is communicatively connected to the NFC receiving module 8 and the display screen 9 respectively; an NFC transmitting module 10 is also arranged on the circuit board 2, the controller chip 3 is communicatively connected to the NFC transmitting module 10, and the NFC transmitting module 10 is communicatively connected to the NFC receiving module 8.

[0035] In this solution, when the patient's intracranial pressure is relatively stable, but for the sake of safety, it is necessary to monitor the patient's intracranial pressure for a longer time, the probe 1 is first placed in the corresponding position in the skull, and then the circuit board 2 is left outside the skull or sealed inside the scalp layer. Since the circuit board 2 and the handheld host 5 use NFC near-field communication, the NFC communication distance is usually less than 10 cm. When the distance between the circuit board 2 and the handheld host 5 is greater than its communication distance, the circuit board 2 disconnects the communication with the handheld host 5. At this time, the intracranial pressure data collected by the probe 1 will not be transmitted to the handheld host 5 through the NFC transmitting module 10. When the medical staff needs to obtain the patient's intracranial pressure data, they move the handheld host 5 close to the circuit board 2 on the patient's head. When the handheld host After the connection between the probe 5 and the circuit board 2 is completed, the NFC transmitting module 10 on the circuit board 2 transmits the intracranial pressure data currently collected by the probe 1 to the NFC receiving module 8 of the handheld host 5, and the NFC control chip 7 on the handheld host 5 converts the intracranial pressure data and outputs it through the display screen 9, so that the medical staff can check the patient's current intracranial pressure situation; since the present scheme can control the time when the intracranial pressure detection device transmits the intracranial pressure data, it can control and reduce the time for the circuit board 2 to transmit the intracranial pressure data, that is, the NFC transmitting module 10 does not transmit the intracranial pressure data anytime and anywhere, but works only when needed, which is convenient for reducing the power consumption of the circuit board 2, and then conveniently extending the time for the intracranial pressure detection device to monitor the intracranial pressure.

[0036] Example 2

[0037] Based on Example 1, in this example, reference Figure 2 , Figure 3 The probe 1 includes a shell 11, a pressure sensor assembly and a temperature sensor 12. A detection window 13 is provided on one side wall of the shell 11, and a threading port 14 and a temperature sensing port 15 are provided on the other adjacent side wall. The threading port 14 is connected to the detection window 13, the pressure sensor assembly is located inside the detection window 13, and the temperature sensor 12 is located inside the temperature sensing port 15; a first wire 16 is electrically connected between the pressure sensor assembly and the controller chip 3, and the first wire 16 passes through the threading port 14, and a second wire 17 is electrically connected between the temperature sensor 12 and the controller chip 3; a silicone protective layer 18 for protecting the pressure sensor assembly is encapsulated in the detection window 13.

[0038] A temperature sensor 12 is installed in the probe 1. When the handheld host 5 is used to receive intracranial pressure data, the intracranial temperature data collected by the temperature sensor 12 can also be received at the same time. By simultaneously analyzing the patient's intracranial pressure and temperature data, it is convenient to predict and judge the development trend of the patient's intracranial pressure, because an increase in intracranial temperature is often accompanied by an increase in intracranial pressure.

[0039] Example 3

[0040] Based on Example 2, in this example, refer to Figure 2 , Figure 3 The inner bottom wall of the detection window 13 is provided with a positioning groove 19. The pressure sensor assembly includes a PCB board 20, a pressure sensor chip 21 and a pad 22. The pressure sensor chip 21 and the pad 22 are both placed on the PCB board 20. The pressure sensor chip 21 and the pad 22 are electrically connected through the circuit on the PCB board 20. The PCB board 20 is located in the positioning groove 19. The positioning groove 19 is used to preliminarily locate the position of the PCB board 20 inside the detection window 13.

[0041] A mounting column 23 is vertically arranged on the PCB board 20, a connecting hole 24 is vertically opened inside the mounting column 23, the pad 22 is located inside the connecting hole 24, and the pressure sensor chip 21 is located on one side of the mounting column 23; a sliding groove 25 is horizontally opened on the inner side wall of the connecting hole 24 near the middle of the detection window 13, a sliding column 26 is horizontally slidably arranged in the sliding groove 25, a first spring 27 is arranged at one end of the sliding column 26 near the inner bottom wall of the sliding groove 25, and one end of the first spring 27 away from the sliding column 26 is used to abut against the inner bottom wall of the sliding groove 25;

[0042] A receiving groove 28 is formed on the lower wall of the inner side wall of the sliding groove 25 in the horizontal direction. A second spring 29 is provided at the lower part of one end of the sliding column 26 away from the first spring 27. The second spring 29 extends into the receiving groove 28 and is provided with a pressure block 30.

[0043] A conductive column 31 is provided in the connecting hole 24. The bottom of the conductive column 31 abuts against the pad 22, and the top is connected to the end of the first wire 16 away from the controller chip 3. The conductive column 31 and the first wire 16 are both made of copper. An extension groove 32 is provided on the side of the conductive column 31 close to the sliding groove 25. When one end of the first spring 27 abuts against the inner bottom wall of the sliding groove 25 and the other end is in a free state, the end of the sliding column 26 away from the first spring 27 drives the second spring 29 and the pressing block 30 to move into the extension groove 32, and the second spring 29 presses the lower wall of the inner side wall of the extension groove 32 through the pressing block 30.

[0044] A pull rope 33 is provided at one end of the sliding column 26 close to the first spring 27, and an extension hole 34 is opened on the inner bottom wall of the sliding groove 25 to pass through the side wall of the mounting column 23. The end of the pull rope 33 away from the sliding column 26 passes through the extension hole 34 and extends to one side of the mounting column 23 and is provided with a pull ring 35.

[0045] In this solution, under normal circumstances, the pad 22 of the pressure sensor chip 21 and its wire are welded by soldering tin. However, the silicone used in the silicone protective layer 18 itself also has a certain water permeability, and the shell 11 of the probe 1 itself also has other small gaps, which causes the body fluid outside the shell 11 to slowly penetrate into the shell 11. The welded copper and tin will undergo an electrochemical reaction when exposed to water, which will cause the contact resistance at the pad 22 to increase and change, which will affect the transmission of the signal data collected by the pressure sensor chip 21, and thus affect the measurement accuracy of the intracranial pressure. In response to the above problems, in this solution, when electrically connecting the pad 22 of the pressure sensor chip 21 and the first wire 16, the method of using solder paste for welding is abandoned. When connecting specifically, the PCB board 20 is placed under microscopic magnification operation conditions, and a tool with a hook can be used to extend into the connecting hole 24 to hook the pressure block 30 upward, so that the second spring 29 is compressed upward, and then the pull is pulled. The pull ring 35 drives the sliding column 26, the second spring 29 and the pressing block 30 to move toward the direction of the first spring 27 through the pull rope 33. At this time, the first spring 27 is compressed, and the second spring 29 and the pressing block 30 move into the sliding groove 25. Then, the conductive column 31 is inserted into the connecting hole 24, so that the bottom of the conductive column 31 abuts against the pad 22 below, so that the extension groove 32 corresponds to the sliding groove 25, and then the pull ring 35 is released. The sliding column 26 is resilient under the rebound effect of the first spring 27. The second spring 29 and the pressure block 30 will be driven to move into the extension groove 32, so that the second spring 29 and the pressure block 30 can move into the extension groove 32, and the second spring 29 presses the pressure block 30 against the lower wall inside the extension groove 32, thereby making the conductive column 31 tightly pressed against the pad 22 below. On the one hand, this solution abandons the use of solder, reducing the electrochemical corrosion between copper and tin when encountering water, and the operation of connecting the first wire 16 and the pad 22 is also relatively simple and quick.

[0046] Example 4

[0047] Based on Example 3, in this example, refer to Figure 2 , Figure 3 A conductive paste layer 36 is coated on the bottom end surface of the conductive column 31. After the conductive column 31 is placed in the connecting hole 24, the conductive column 31 and the pad 22 are electrically connected through the conductive paste layer 36. The conductive paste layer 36 can reduce the contact resistance between the conductive column 31 and the pad 22, thereby reducing the temperature rise, saving energy loss, and further reducing the electrochemical corrosion between the conductive column 31 and the pad 22.

[0048] Example 5

[0049] Based on Example 4, in this example, reference Figure 2 , Figure 3The bottom of the pressing block 30 is provided with an installation cavity, the lower wall of the installation cavity is provided with a notch, a ball 37 is provided in the installation cavity for rolling, and the lower end of the ball 37 extends to the outside of the installation cavity through the notch. By providing the ball 37 at the bottom of the pressing block 30, rolling friction is generated between the pressing block 30 and the bottom wall of the receiving groove 28 and between the pressing block 30 and the lower wall of the extension groove 32, so that the sliding column 26 can more smoothly push the second spring 29 and the pressing block 30 to the designated position inside the extension groove 32, and then the second spring 29 can nearly vertically drive the pressing block 30 downward to press against the lower wall of the extension groove 32.

[0050] Example 6

[0051] Based on Example 5, in this example, refer to Figure 2 , Figure 3 The height of the extension groove 32 is greater than the sum of the heights of the sliding groove 25 and the receiving groove 28, and the lower wall inside the extension groove 32 is lower than the inner bottom wall of the receiving groove 28, and the upper wall height inside the extension groove 32 is higher than the upper wall inside the sliding groove 25; the upper wall height inside the extension groove 32 is designed to be higher, so that the corresponding end of the sliding column 26 can smoothly extend into the extension groove 32; due to the accuracy factor of the opening position of the extension groove 32 and the thickness of the conductive paste layer 36 at the bottom of the conductive column 31, in order to prevent the second spring 29 and the pressure block 30 from being unable to move to the specified position of the extension groove 32 with the sliding column 26, the lower wall height inside the extension groove 32 is reduced, so that the pressure block 30 can move into the extension groove 32 more smoothly.

[0052] A moving hole 38 is provided inside the end of the sliding column 26 away from the first spring 27, and a through hole 39 is provided on the lower wall of the moving hole 38. A moving block 40 is vertically slidably arranged in the moving hole 38, and a connecting column 41 is provided below the moving block 40. The connecting column 41 is located in the through hole 39 and the bottom is connected to the top of the second spring 29. When the pressing block 30 is pressed against the lower wall inside the extension groove 32, the moving block 40 is pressed against the upper wall inside the moving hole 38; an extrusion assembly is provided on the conductive column 31, and when the pressing block 30 is pressed against the inside of the extension groove 32, the extrusion assembly is used to squeeze the moving block 40 downward.

[0053] Furthermore, a pressing hole 42 is provided through the top wall of the moving hole 38, and an adjusting hole 43 is provided through the top wall of the extension groove 32 in the vertical direction; the extrusion assembly includes an extrusion rod 44 and a locking block 45, the extrusion rod 44 is located in the adjusting hole 43, the sizes of the extrusion rod 44 and the locking block 45 are both smaller than the size of the pressing hole 42, the pressing hole 42 is rectangular, and the cross section of the locking block 45 on the horizontal plane has a longer side and a shorter side, and the longer side of the locking block 45 is larger than the width of the pressing hole 42; after the locking block 45 passes through the pressing hole 42 downward, the extrusion rod 44 and the locking block 45 can be rotated to confine the locking block 45 in the moving hole 38. The locking block 45 can be a rectangular parallelepiped or columnar structure, and the outer diameter of the locking block 45 is smaller than the size of the moving hole 38, so that the locking block 45 can be rotated in the moving hole 38. The locking block 45 and the extrusion rod can be taken out from the adjusting hole 43, which is convenient for processing and subsequent assembly of various components.

[0054] In the present solution, since the lower wall inside the extension groove 32 is lower than the bottom wall of the storage groove 28, the second spring 29 will stretch a short distance after moving to the extension groove 32, resulting in the weakening of the squeezing force of the second spring 29 on the conductive column 31 through the pressing block 30. In order to compensate for the above-mentioned weakened squeezing force, the squeezing rod 44 can be pressed down, and the locking block 45 at the lower end of the squeezing rod 44 passes through the pressing hole 42 and presses down the moving block 40 inside the moving hole 38 until the locking block 45 is completely entered into the moving hole 38, and then the squeezing rod 44 is rotated 90 degrees so that the longer side of the locking block 45 is parallel to the wide side of the moving hole 38, so as to facilitate the locking limitation of the locking block 45 inside the moving hole 38.

[0055] On the one hand, the moving block 40 is squeezed downward by the squeezing rod 44 and the locking block 45, so that the moving block 40 moves downward, increasing the pressure of the pressing block 30 below on the conductive column 31, thereby increasing the squeezing force of the conductive column 31 on the pad 22, and improving the contact stability between the conductive column 31 and the pad 22.

[0056] On the other hand, the sliding column 26 cooperates with the second spring 29 to limit the position of the locking block 45, and then limits the extrusion rod 44, so as to maintain the extrusion effect of the extrusion rod 44 and the locking block 45 on the moving block 40, and then maintain the moving block 40 to further squeeze the conductive column 31.

[0057] On the other hand, the present solution does not overly pursue the matching accuracy between two adjacent components, and its main purpose is to press the conductive column 31 against the pad 22, for example: 1) the sliding column 26 can only slide in the sliding groove 25, and there is no requirement that the sliding column 26 and the sliding groove 25 must be slidingly matched, but only requires that under the elastic force of the first spring 27, the corresponding end of the sliding column 26 can slide along the sliding groove 25 into the extension groove 32; 2) the end of the first spring 27 away from the sliding column 26 is not directly connected to the inner bottom wall of the sliding groove 25, and it is only necessary for the first spring 27 to be able to abut against the inner bottom wall of the sliding groove 25, thereby eliminating the step of connecting the first spring 27 to the inner bottom wall of the sliding groove 25, thereby simplifying the production process. Manufacturing process; 3) There is no requirement for the precision of sliding fit between the conductive column 31 and the connecting hole 24 inside the mounting column 23. The main purpose is that the conductive column 31 can be placed in the bottom of the connecting hole 24. Therefore, it is only necessary to set the outer diameter of the conductive column 31 to be smaller than the aperture of the connecting hole 24; 4) The upper wall inside the extension groove 32 is higher than the upper wall inside the sliding groove 25. The two are not required to be flush here. Because the size of the parts is small, it is difficult to achieve the precision requirement of flushing, and it is time-consuming and laborious. Therefore, the upper wall inside the extension groove 32 is designed to be higher than the upper wall inside the sliding groove 25 by a certain distance, so as to ensure that the corresponding end of the sliding column 26 can be smoothly moved into the extension groove 32, and it is also convenient to reduce the difficulty of production and manufacturing;

[0058] Since the probe 1 and all the parts it includes are very small in size, it is usually necessary to operate under microscopic magnification conditions when packaging the probe 1. For example, when squeezing the moving block 40 downward through the squeezing rod 44, the squeezing rod 44 itself is small in size, and the downward movement distance of the moving block 40 is also relatively small. In addition, the observation angle under microscopic magnification conditions is usually from top to bottom. During the manual squeezing process, it is difficult to accurately observe and feel whether the squeezing rod 44 has produced a downward movement of a sufficient distance. In other words, due to the influence of the factors of low size or matching accuracy in the above-mentioned points 3) and 4), the locking block 45 below the squeezing rod 44 may not pass through the downward pressing hole 42, but only stay in the space between the moving block 40 and the upper wall inside the extension groove 32. At this time, when the squeezing rod 44 is rotated, the locking block 45 may only be confined between the moving block 40 and the upper wall inside the extension groove 32, resulting in the squeezing rod 4 4 and the locking block 45 do not have an squeezing effect on the moving block 40; unless the size and relative position accuracy of all the components inside the shell 11 are high, such as the adjustment hole 43 is directly aligned with the lower pressure hole 42 below, but this usually requires the conductive column 31 and the connecting hole 24 to cooperate without gap, so as to facilitate the positioning of the conductive column 31, and the processing difficulty is relatively high, but it can ensure that the locking block 45 can smoothly pass through the lower pressure hole 42 and directly enter the moving hole 38; but in fact, as mentioned above, the overall size of the probe 1 is relatively small, and the production of each small component also requires the accuracy of each component, which is difficult and easy to spend more time, and at the same time increase the production cost. Therefore, although the locking block 45 can quickly and smoothly enter the moving hole 38 in an ideal state, considering the actual situation, the locking block 45 cannot enter the moving hole 38, and it is not convenient to quickly judge whether the locking block 45 has entered the moving hole 38;

[0059] In the present embodiment, after the locking block 45 successfully enters the moving hole 38, the squeezing rod 44 also limits the sliding column 26, that is, at this time, pulling the pull ring 35 will not be able to pull the sliding column 26 to move in the direction of the first spring 27, so it can be determined that the locking block 45 is located inside the moving hole 38 at this time; on the contrary, if the pull ring 35 can move, since the pull ring 35 moves horizontally under the condition of microscopic magnification, it is more convenient to detect its movement, so it can be determined that the moving block 40 has not entered the moving hole 38; that is, the structure of the locking block 45 and the squeezing rod 44 in the present embodiment can not only press the moving block 40 downward, but also The sliding column 26 is locked and matched, and by linking the pull rope 33 and the pull ring 35 at one end of the sliding column 26, it can also be determined whether the locking block 45 has played the function of squeezing the moving block 40. This mechanism can compensate and cover the low matching accuracy of the parts manufactured in this scheme to a certain extent, and it is convenient to determine whether the extrusion assembly has played the corresponding extrusion function. If the current locking block 45 has not entered the moving hole 38, it is convenient for the operator to continue to adjust the position of the conductive column 31 in the connecting hole 24 and the posture angle of the locking block 45 until the locking block 45 enters the moving hole 38 of the sliding column 26 to play the purpose of squeezing and locking.

[0060] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An intracranial pressure detection device based on a pressure sensor, comprising a probe (1) and a circuit board (2), wherein a controller chip (3) and a button battery (4) are arranged on the circuit board (2), wherein the controller chip (3) is electrically connected to the button battery (4), and the probe (1) is electrically connected to the controller chip (3) via a circuit, wherein: The device also comprises a handheld host (5), the handheld host (5) comprising a housing (6), an NFC control chip (7) arranged on the housing (6), an NFC receiving module (8) and a display screen (9), the NFC control chip (7) being communicatively connected to the NFC receiving module (8) and the display screen (9) respectively; The circuit board (2) is also provided with an NFC transmitting module (10), the controller chip (3) is communicatively connected to the NFC transmitting module (10), and the NFC transmitting module (10) is communicatively connected to the NFC receiving module (8); The probe (1) comprises a housing (11), a pressure sensor assembly and a temperature sensor (12); a detection window (13) is provided on one side wall of the housing (11); a threading port (14) and a temperature sensing port (15) are provided on the other adjacent side wall; the threading port (14) is communicated with the detection window (13); the pressure sensor assembly is located inside the detection window (13); and the temperature sensor (12) is located inside the temperature sensing port (15); A first wire (16) is electrically connected between the pressure sensor component and the controller chip (3), and the first wire (16) passes through the threading port (14); a second wire (17) is electrically connected between the temperature sensor (12) and the controller chip (3); a silicone protective layer (18) for protecting the pressure sensor component is encapsulated in the detection window (13); The inner bottom wall of the detection window (13) is provided with a positioning groove (19); the pressure sensor assembly comprises a PCB board (20), a pressure sensor chip (21) and a soldering pad (22); the pressure sensor chip (21) and the soldering pad (22) are both placed on the PCB board (20); the pressure sensor chip (21) and the soldering pad (22) are electrically connected via a circuit on the PCB board (20); and the PCB board (20) is located in the positioning groove (19); A mounting column (23) is vertically arranged on the PCB board (20), a connecting hole (24) is vertically opened inside the mounting column (23), the solder pad (22) is located inside the connecting hole (24), and the pressure sensor chip (21) is located on one side of the mounting column (23); a sliding groove (25) is horizontally opened on the inner side wall of one side of the connecting hole (24) close to the middle of the detection window (13), a sliding column (26) is horizontally slidably arranged inside the sliding groove (25), a first spring (27) is arranged at one end of the sliding column (26) close to the inner bottom wall of the sliding groove (25), and one end of the first spring (27) away from the sliding column (26) is used to abut against the inner bottom wall of the sliding groove (25); A receiving groove (28) is provided on the lower wall of the inner side wall of the sliding groove (25) in the horizontal direction, and a second spring (29) is provided at the lower part of one end of the sliding column (26) away from the first spring (27), and the second spring (29) extends into the receiving groove (28) and is provided with a pressure block (30); A conductive column (31) is arranged in the connecting hole (24), the bottom of the conductive column (31) is in contact with the pad (22), and the top is connected to the end of the first wire (16) away from the controller chip (3), and an extension groove (32) is provided on the side of the conductive column (31) close to the sliding groove (25). When one end of the first spring (27) is in contact with the bottom wall of the sliding groove (25) and the other end is in a free state, the end of the sliding column (26) away from the first spring (27) drives the second spring (29) and the pressure block (30) to move into the extension groove (32), and the second spring (29) presses the lower wall of the inner side wall of the extension groove (32) through the pressure block (30); A pull rope (33) is provided at one end of the sliding column (26) close to the first spring (27); an extension hole (34) penetrating the side wall of the mounting column (23) is provided on the inner bottom wall of the sliding groove (25); an end of the pull rope (33) away from the sliding column (26) passes through the extension hole (34) and then extends to one side of the mounting column (23) and is provided with a pull ring (35).

2. The intracranial pressure detection device based on a pressure sensor according to claim 1, characterized in that: A conductive paste layer (36) is provided on the bottom end surface of the conductive column (31).

3. The intracranial pressure detection device based on the pressure sensor according to claim 2, characterized in that: The bottom of the pressing block (30) is provided with an installation cavity, the lower cavity wall of the installation cavity is provided with a notch, a ball (37) is arranged to roll in the installation cavity, and the lower end of the ball (37) extends to the outside of the installation cavity through the notch.

4. The intracranial pressure detection device based on the pressure sensor according to claim 3 is characterized in that: The height of the extension groove (32) is greater than the sum of the heights of the sliding groove (25) and the receiving groove (28); the upper wall inside the extension groove (32) is higher than the upper wall of the sliding groove (25), and the lower wall inside the extension groove (32) is lower than the inner bottom wall of the receiving groove (28); a moving hole (38) is provided inside the end of the sliding column (26) away from the first spring (27); a through-going hole (39) is provided on the lower wall of the moving hole (38); a moving block (44) is provided in the moving hole (38) for vertical sliding movement 0), a connecting column (41) is arranged below the moving block (40), the connecting column (41) is located in the passage hole (39) and the bottom of the connecting column (41) is connected to the top of the second spring (29), when the pressing block (30) is pressed against the lower wall inside the extension groove (32), the moving block (40) is pressed against the upper wall inside the moving hole (38); an extrusion component is arranged on the conductive column (31), when the pressing block (30) is pressed against the inside of the extension groove (32), the extrusion component is used to press the moving block (40) downward.

5. The intracranial pressure detection device based on the pressure sensor according to claim 4 is characterized in that: The top wall of the movable hole (38) is provided with a downward pressing hole (42), and the top wall of the extension groove (32) is provided with an adjustment hole (43) extending vertically; the extrusion assembly comprises an extrusion rod (44) and a locking block (45), the extrusion rod (44) is located in the adjustment hole (43), the sizes of the extrusion rod (44) and the locking block (45) are both smaller than the size of the downward pressing hole (42), the downward pressing hole (42) is rectangular, and the cross section of the locking block (45) on the horizontal plane has a longer side and a shorter side, and the longer side of the locking block (45) is larger than the width of the downward pressing hole (42); after the locking block (45) passes downward through the downward pressing hole (42), the extrusion rod (44) and the locking block (45) can be rotated to confine the locking block (45) in the movable hole (38).

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