Topological protection photonic circuit design method and related equipment

Abstract

The present invention relates to the field of micro-light diffraction substrate processing technology, specifically a topological protection photonic circuit design method and related equipment. The method includes the following steps: selecting materials with refractive index and mechanical strength, processing the materials at a micro-nano scale for making photonic crystals; designing a two-dimensional or three-dimensional photonic crystal structure with a periodic refractive index distribution on a micro-light diffraction substrate, and geometrically configuring the photonic crystal units of the photonic crystal structure to achieve topological protection; integrating a topological insulator into the photonic crystal structure, and the photonic crystal structure has topological protection characteristics during optical signal transmission, which is used to resist physical disturbances and processing defects. The topological protection photonic circuit design method of the present invention improves the anti-disturbance capability of the photonic circuit under environmental disturbances and manufacturing defects by introducing topological protection on the micro-light diffraction substrate.

Description

Technical Field

[0001] The invention relates to the technical field of micro-light diffraction substrate processing, and in particular to a topological protection photonic circuit design method and related equipment. Background Art

[0002] Micro-light diffraction substrates are widely used in modern optical communications and photonic devices due to their outstanding ability to control the propagation path of light and enhance optical performance. In micro-light diffraction substrates, traditional photonic circuits are prone to signal loss and transmission distortion when faced with various factors such as environmental disturbances and manufacturing defects. This is undoubtedly a huge technical defect for high-precision application scenarios. The current means to solve this technical defect are mostly external compensation or predictive adjustment, and the effect is average. Based on the above brief introduction to the defects of micro-light diffraction substrates, we hope to break through this technical bottleneck. The technical problem raised is: how to enhance the anti-interference ability of photonic circuits in micro-light diffraction substrates without external means. Summary of the invention

[0003] The present invention provides a topological protection photonic circuit design method and related equipment to solve the technical problem of how to enhance the anti-interference performance of the photonic circuit in a micro-light diffraction substrate.

[0004] The technical solution of the present invention to solve the above technical problems is as follows:

[0005] On the one hand, a method for designing a topologically protected photonic circuit is provided, which is applied to a micro-light diffraction substrate, and the method comprises the following steps:

[0006] Select materials with high refractive index and mechanical strength, and process them at micro-nano scale to make photonic crystals;

[0007] Designing a two-dimensional or three-dimensional photonic crystal structure with a periodic refractive index distribution on a micro-light diffraction substrate, and geometrically configuring the photonic crystal units of the photonic crystal structure to achieve topological protection;

[0008] Integrate topological insulators into photonic crystal structures, which have topological protection properties during optical signal transmission to resist physical disturbances and processing defects;

[0009] The band gap distribution and photon transmission path of the photonic crystal unit are calculated by the topological photon path optimization algorithm to ensure that the optical signal is not interfered with;

[0010] Etching the photonic crystal structure onto the micro-light diffraction substrate, wherein the etching method comprises at least one of electron beam lithography, deep ultraviolet lithography and reactive ion etching;

[0011] The optical performance of the topologically protected photonic circuit of the micro-light diffraction substrate is tested, and the anti-interference ability of the micro-light diffraction substrate in the application environment is verified by adjusting and optimizing the parameters of the geometric configuration.

[0012] On the other hand, a system for topological protection photonic circuit design is provided, which is applied to a micro-light diffraction substrate, and the system includes:

[0013] A selection module for selecting materials having refractive index and mechanical strength;

[0014] A design module, used to design a two-dimensional or three-dimensional photonic crystal structure and generate the geometric shape and refractive index distribution of the photonic crystal unit;

[0015] Integration modules for integrating topological insulators into photonic crystal structures;

[0016] A calculation module, used for calculating the band gap distribution and photon transmission path of the photonic crystal unit by using a topological photon path optimization algorithm;

[0017] a fabrication module for etching a photonic crystal structure onto a micro-light diffractive substrate;

[0018] Test module for testing the optical performance of topologically protected photonic circuits on micro-light diffractive substrates;

[0019] A feedback module is used to adjust and optimize the parameters of the topologically protected photonic circuit of the micro-light diffraction substrate.

[0020] On the other hand, a computer-readable storage medium is provided, on which a computer program is stored, and when the computer program is loaded by a computer, the above-mentioned topological protection photonic circuit design method is implemented.

[0021] In another aspect, a micro-light diffraction substrate is provided, the substrate comprising:

[0022] The substrate layer is made of a material with a refractive index and optical transmission performance required by the application environment;

[0023] A photonic crystal structure layer, embedded in the substrate layer, wherein the photonic crystal structure layer includes a periodic refractive index distribution or a random refractive index distribution of an integrated topological insulator;

[0024] Surface anti-reflection layer, used to reduce surface reflection of light transmission;

[0025] The temperature control system is integrated with the substrate and adjusts the operating temperature based on real-time temperature feedback to ensure the environmental stability of the photonic circuit.

[0026] On the other hand, a topological protection photonic circuit processing device is provided, which is used for processing a micro-light diffraction substrate. The processing device integrates a system designed for the topological protection photonic circuit as described above, and the processing device also includes:

[0027] Electron beam lithography equipment for realizing the pattern design of two-dimensional or three-dimensional photonic crystals;

[0028] Deep ultraviolet lithography equipment for the transfer of photonic crystal structures;

[0029] Reactive ion etching device for fine etching of depth and sidewall verticality;

[0030] Thermal annealing treatment device for improving the optical properties of photonic crystal structures;

[0031] Testing equipment, used to detect and verify the optical performance of photonic circuits in real time and provide feedback data;

[0032] The parameter adjustment device adjusts and optimizes the parameters of the topological protection photonic circuit of the micro-light diffraction substrate in real time based on the feedback data.

[0033] The beneficial effects of the present invention are:

[0034] The topological protection photonic circuit design method of the present invention improves the anti-disturbance ability of the photonic circuit under environmental disturbances and manufacturing defects by introducing topological protection on the micro-light diffraction substrate. Specifically, by integrating topological insulators, the optical signal is guided to propagate robustly in the photonic crystal, reducing the signal loss or distortion caused by external disturbances. Furthermore, the topological photon path optimization algorithm is applied to calculate and adjust the band gap distribution and transmission path of the photonic crystal unit to ensure the transmission efficiency and accuracy of the signal. In terms of manufacturing process, the designed photonic crystal structure can be accurately etched onto the substrate through electron beam lithography, deep ultraviolet lithography and reactive ion etching technology, thereby realizing the desired optical function.

[0035] Furthermore, through performance testing, the design parameters are verified and optimized to ensure the anti-interference performance of the topology protection photonic circuit in the actual application environment. Figure 8 As shown, the X-axis and Y-axis represent specific features or areas on the micro-light diffraction substrate, respectively. The left figure (the anti-interference diagram before topological protection) shows the anti-interference characteristics of the substrate at different positions before the topological protection technology is used, where darker colors represent lower anti-interference; the right figure (the anti-interference diagram after topological protection) shows the improvement of the substrate anti-interference after the topological protection technology is adopted, where brighter colors indicate enhanced anti-interference. The topological protection photonic circuit design method of the present invention achieves a breakthrough in technical bottlenecks because it does not need to rely on external compensation measures, and provides a way to maintain high-quality optical signal transmission in complex environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A flowchart of a method for designing a topological protection photonic circuit in one embodiment of the present invention;

[0037] Figure 2 A schematic diagram of a topologically protected photonic crystal structure in one embodiment of the present invention;

[0038] Figure 3 A refractive index distribution diagram of a topologically protected photonic crystal structure in one embodiment of the present invention;

[0039] Figure 4 A schematic diagram of a topological photon space path in one embodiment of the present invention;

[0040] Figure 5 A visualization simulation diagram of the band gap and topological characteristics of a two-dimensional photonic crystal in one embodiment of the present invention;

[0041] Figure 6 A simulation diagram of the bandgap structure of a photonic crystal in one embodiment of the present invention;

[0042] Figure 7 This is a diagram showing the scattering suppression effect of a micro-light diffraction substrate in one embodiment of the present invention;

[0043] Figure 8 This is a test diagram of the anti-interference performance of a photonic circuit in one embodiment of the present invention;

[0044] Fig. 9 A comparative analysis diagram of the anti-interference performance of a photonic circuit in one embodiment of the present invention;

[0045] Fig.10 Schematic diagram of a topological protection photonic circuit design system in one embodiment of the present invention.

[0046] In the accompanying drawings: 100, selection module; 200, design module; 300, integration module; 400, calculation module; 500, manufacturing module; 600, testing module; 700, feedback module. DETAILED DESCRIPTION

[0047] The present invention provides the following preferred embodiments:

[0048] Embodiment 1: In order to solve the anti-interference problem of the photonic circuit in the micro-light diffraction substrate, this embodiment proposes a topological protection photonic circuit design method to ensure that the stability and anti-interference ability of the photonic circuit are improved without relying on external means.

[0049] like Figure 1 As shown, the method comprises the following steps:

[0050] S101. Select materials with refractive index and mechanical strength, and process the materials at micro-nano scale to make photonic crystals.

[0051] S102. Design a two-dimensional or three-dimensional photonic crystal structure with a periodic refractive index distribution on a micro-light diffraction substrate, and geometrically configure the photonic crystal units of the photonic crystal structure to achieve topological protection.

[0052] S103. Integrate topological insulators into photonic crystal structures. When optical signals are transmitted, the photonic crystal structures have topological protection properties to resist physical disturbances and processing defects.

[0053] S104, calculating the band gap distribution and photon transmission path of the photonic crystal unit by using a topological photon path optimization algorithm to ensure that the optical signal is not interfered with.

[0054] S105, etching the photonic crystal structure onto the micro-light diffraction substrate, wherein the etching steps include electron beam lithography, deep ultraviolet lithography and reactive ion etching.

[0055] S106. Test the optical performance of the topological protection photonic circuit of the micro-light diffraction substrate, and verify the anti-interference performance of the micro-light diffraction substrate in the application environment by adjusting and optimizing the parameters of the geometric configuration.

[0056] Specifically, photonic crystals are manufactured by selecting materials with specific refractive index and excellent mechanical strength, ensuring that the selection of materials can not only meet the high efficiency of optical transmission, but also maintain the integrity and stability of the structure in micro-nanoscale processing. When selecting materials for manufacturing photonic crystals, commonly used materials include silicon (Si), gallium arsenide (GaAs), gallium nitride (GaN) and silicon dioxide (SiO2). Silicon has become a common material for building photonic crystals due to its mature processing technology and high refractive index, and is particularly suitable for integrated photonics and silicon-based optoelectronic devices. Gallium arsenide is widely used in high-speed and optical sensor fields due to its excellent optoelectronic properties and direct bandgap properties, and has good transmittance in the infrared band. Gallium nitride has wide bandgap characteristics and high thermal conductivity, and is particularly suitable for high-temperature and high-power optoelectronic applications. Silicon dioxide, with its low loss and chemical stability, is widely used in applications such as optical fiber communications and low-loss photonic crystals that require high transparency. At the same time, the mechanical strength of these materials in micro-nano processing provides the basis for achieving high-precision and reliable structures. It is understandable that the materials selected here need to undergo property testing and optimization selection to achieve a uniform refractive index distribution at the micro-nano processing scale, thereby meeting the working requirements of the photonic crystal.

[0057] Furthermore, if Figure 2 and Figure 3As shown in the figure, when designing a two-dimensional or three-dimensional photonic crystal structure with a periodic refractive index distribution on a micro-light diffraction substrate, attention should be paid to the geometric configuration of the photonic crystal unit. The geometric configuration should fully consider the parameter settings that can effectively achieve topological protection, thereby forming a photonic crystal network that resists external physical disturbances and processing defects. In the design process, computational simulation tools are introduced to optimize and verify the rationality of the geometric arrangement, which helps to ensure the effective realization of topological protection characteristics at the theoretical level, and then provide guidance for process implementation in practice.

[0058] Furthermore, in the process of integrating topological insulators into photonic crystal structures, this embodiment focuses on the compatibility and stability between topological insulator materials and photonic crystal structures. It should be understood that the selection of topological insulators and their energy level stability have a great influence on the topological characteristics of the system. Therefore, the integration process needs to rely on fine simulation and experimental verification to ensure that the photonic crystal structure can effectively exert its topological protection characteristics in optical signal transmission. In-depth research on this integration method enables practical results in resisting physical disturbances and manufacturing defects. It should be noted that when selecting topological insulator materials, the following main candidate materials can be considered: bismuth antimonide (BiSb), bismuth telluride (Bi2Te3), indium antimonide (InSb) and mercury telluride (HgTe). Bismuth antimonide is an earlier discovered topological insulator with good topological surface states, which is suitable for basic research and exploration of low-temperature quantum materials. Bismuth telluride is widely used to study the transmission phenomenon of electronic surface states due to its stable topological insulation properties at room temperature, and is also used in the field of thermoelectric materials. Indium antimonide has shown its advantages in infrared detectors and infrared imaging systems, and exhibits excellent topological properties under low temperature conditions, making it an important candidate material in nanoelectronics and optoelectronics. Mercury telluride is suitable for studying topological quantum computing, especially in the study of quantum Hall effect, because of its topological insulator properties formed under high symmetry conditions. The different physical properties and topological properties of these materials provide a variety of ways to explore topological protection effects in the development of new quantum devices and basic physics research.

[0059] It can be understood that by applying the topological photon path optimization algorithm, the band gap distribution and photon transmission path of the photonic crystal unit are calculated and optimized to ensure the stable transmission of the optical signal, such as Figure 4 As shown. In this process, the electromagnetic properties of the photonic crystal structure are simulated, and feedback adjustments are made based on the actual preparation parameters to ensure the accuracy and consistency of the light propagation path. The optimization of the bandgap distribution ensures the transmission efficiency of the optical signal within the predetermined frequency range and greatly reduces the impact of external interference on the signal path.

[0060] Furthermore, in the etching process of the photonic crystal structure, micro-nano processing technology, including electron beam lithography, deep ultraviolet lithography and reactive ion etching, is used to achieve high-precision and high-resolution structural etching. These modern etching technologies are used in this embodiment to depict and transfer the designed photonic crystal structure to the actual micro-light diffraction substrate, which can achieve a combination of fine geometric morphology and material properties. During the etching process, by adjusting the etching parameters and process conditions, it is ensured that each detail of the photonic crystal structure meets the design requirements, while minimizing the defects that may be introduced during the etching process.

[0061] Through the steps of this embodiment, the optical performance of the topologically protected photonic circuit of the micro-light diffraction substrate can be effectively tested and verified. Through experimental testing and parameter optimization, the geometric configuration is further adjusted to ensure that the anti-interference performance of the photonic circuit meets the established requirements in the actual application environment. Through this embodiment, the micro-light diffraction substrate can be made to work stably and efficiently in a changing environment, thereby improving the overall anti-interference performance of the photonic circuit without relying on external compensation measures, such as Figure 8 and Fig. 9 shown.

[0062] Embodiment 2: In order to solve the problem of unstable optical performance caused by improper lattice selection and parameter setting when designing photonic circuits on micro-light diffraction substrates, this embodiment further optimizes the design steps of two-dimensional or three-dimensional photonic crystal structures to ensure that photonic circuits with periodic refractive index distribution can play an effective role in the predetermined application environment.

[0063] Specifically, first select the appropriate lattice type according to the application requirements. Usually, a square lattice or a honeycomb lattice or a combination thereof can be selected. The purpose of this step is to establish the basic structure of the photonic crystal through the geometric characteristics of different lattice types, thereby affecting the overall refractive index distribution and light transmission path. The square lattice is convenient for parameter setting and adjustment in the preliminary design stage due to its symmetry and simple geometric characteristics; while the honeycomb lattice, due to its special point distribution, helps to form natural topological defects and boundary states, and is suitable for applications with adaptive topological protection characteristics.

[0064] Furthermore, this embodiment improves the lattice constant and geometry of the photonic crystal unit by refining the lattice parameters. It should be understood that the lattice constant determines the periodic length within the photonic crystal, and the setting of this parameter needs to take into account both the optical band gap and the light propagation efficiency. The geometric array arrangement directly affects the opening and closing of the photonic band gap and the formation of the topological interface state. Reasonable geometric selection can achieve refractive index modulation in a large range, thereby optimizing the photon transmission path.

[0065] It is understandable that when arranging the refractive index center points, the use of a honeycomb point arrangement algorithm can effectively optimize the relative positions of the refractive index distribution center points. The calculation method of the refractive index distribution function n(x) is as follows:

[0066]

[0067] Furthermore, through multiple simulations and experimental verifications, the parameters in the refractive index distribution function n(x), such as the base refractive index n0, the refractive index change Δn, and the period length Λ, are adjusted to ensure the expected optical performance. The honeycomb point distribution algorithm not only provides flexibility for the change of the refractive index distribution morphology, but also ensures the coordinated distribution of the refractive index in the lattice structure, thereby achieving the optimal application state of the photonic crystal.

[0068] Furthermore, the bandgap structure and optical properties of the photonic crystal are simulated by numerical simulation tools, such as the finite-difference time-domain method (FDTD). Figure 6 The simulation results will be directly fed back into the adjustment of the refractive index distribution and lattice parameters, and through multiple iterations of optimization, the expected light transmission performance can be accurately fitted. It should be emphasized that the consideration of factors such as material stability, environmental impact and process feasibility during the simulation process can effectively guide the realization of the final design solution.

[0069] The method of this embodiment effectively solves the problem of unstable optical performance caused by improper lattice selection and parameter configuration, making the application of the designed photonic circuit on the micro-light diffraction substrate more stable and reliable.

[0070] Example 3: In order to solve the problem of unstable topological protection state that may occur when integrating topological insulators in photonic circuits, this example further refines the method of integrating indium antimonide (InSb) into the photonic crystal structure. Specifically, during the design process, it is necessary to deeply understand and calculate the energy level stability of indium antimonide as a topological insulator, which is a key link to ensure that the topological protection effect is effectively maintained. To achieve this goal, the energy level stability of InSb is first calculated. The calculation method is based on the principle of energy minimization. The calculation formula for energy level stability is:

[0071]

[0072] Among them, E topo is the topological state energy, m is the particle mass, v i is the particle velocity, U(x i ) is the potential energy function, e is the elementary charge, r ij is the distance between particles.

[0073] Furthermore, in the implementation of this process, it is necessary not only to pay attention to the intrinsic material properties of InSb, but also to consider its interaction with the surrounding photonic crystal structure. The energy level of InSb needs to be adjusted so that it exhibits a specific topological surface state in the channel. This adjustment process is usually achieved by changing its orientation and strength in the applied electric and magnetic fields. In addition, the interparticle distance r is calculated. ij When constructing a topological insulator interface, its local position in the photonic crystal structure and the electromagnetic wave phase coupling relationship should be considered to ensure the overall minimization of the topological state energy. This energy minimization strategy provides a theoretical basis for constructing an effective topological insulator interface.

[0074] It is understandable that the adjustment of specific technical and material parameters involved in this combination process is not just a matter of formula verification, but also requires comprehensive optimization in terms of design rationality and robustness. With the help of high-precision simulation software and experimental modeling methods, the above theoretical calculations can be verified and corrected. This picometer-level adjustment not only improves the overall performance of photonic circuits in integrated circuits, but also enhances the durability of topological insulators in practical applications.

[0075] Through this embodiment, the integration of indium antimonide and photonic crystal not only realizes an effective topological protection state energy minimization strategy, but also expands new implementation paths for future quantum communication and photonics applications. It enhances the adaptability of the device in complex electromagnetic environments and provides strong technical support and theoretical guidance for the development and utilization of topological insulating materials in the future.

[0076] Embodiment 4: In order to solve the problem of accurate optimization when designing the photon transmission path in the photonic crystal structure, this embodiment further refines the steps of calculating the photonic crystal unit band gap distribution and the photon transmission path through the topological photon path optimization algorithm. First, in the photonic crystal design, it is necessary to determine the geometric shape and the dielectric constant distribution of the material for the accurate definition of the lattice parameters. The parameters are set according to the crystal periodicity principle to ensure the reasonable distribution of the photonic band gap, such as Figure 5 By adopting the plane wave expansion method or tight binding model, we established the wave equation of the photonic crystal unit, which is in the form of:

[0077]

[0078] It should be understood that this wave equation calculates the eigenvalues ​​of different wave vectors k in the Brillouin zone to obtain the complete band structure. Such a calculation process provides theoretical support for identifying the band gap between energy bands and determining the frequency range that can be used for photon transmission, such as Figure 5 shown.

[0079] Furthermore, by calculating the Berry connection , we can analyze the vector state of each wave vector k, which is expressed by the eigenstate u of the electron wave function. k and the partial derivative ∇ with respect to the wave vector k k It is understood that the calculation of the Berry connection can provide a deeper understanding of the nature of the band gap and provide a basis for the subsequent Berry curvature The Berry curvature Ω(k) describes the change in the relationship between different wave vectors, and its distribution in momentum space reflects the topological characteristics of the photon path.

[0080] By further calculating the product of the Berry curvature in the entire Brillouin zone , which measures the total effect of the Berry curvature Ω(k), where ∫ BZ is the integral across the energy band, and d 2 k is the area element in momentum space. This integration method not only verifies the overall topological properties of the photonic crystal, but also provides designers with quantitative indicators for evaluating the stability and transmission efficiency of the structure.

[0081] Through the detailed algorithm analysis and optimization of this embodiment, the band gap distribution of the photonic crystal and the photon transmission path can be accurately calculated and optimized, which improves the design efficiency. This method not only improves the transmission stability of the photonic circuit in complex media, but also provides a solid theoretical foundation and implementation path in the application and research of topological photonics.

[0082] Embodiment 5: In order to solve the problem of reduced light transmission efficiency caused by processing defects in photonic circuits, this embodiment further optimizes the light transmission characteristics of such processing defect locations. In the implementation process, the light transmission characteristics are first accurately measured, especially the accuracy of the total length L of the transmission line used for light transmission, so as to provide reliable basic data for subsequent analysis. Select a suitable waveform function f(x), which is used to reflect the expected light transmission state at a specific defect location, and obtain the potential distribution V(x) by calculation or experiment, which will help understand the potential changes along the transmission line and make corresponding adjustments.

[0083] Furthermore, by taking the second-order derivative of the potential distribution V(x) Calculations can reveal potential potential gradient changes in the transmission line. This detailed analysis helps identify optical perturbation features introduced by processing defects. It is important to understand that such potential analysis involves not only theoretical calculations but also experimental verification to ensure reliability. Next, by evaluating the optical transmission results Q def , which provides guidance for optimization in the optical transmission process. Its calculation basis is:

[0084]

[0085] It is understandable that this result not only quantifies the loss of transmission quality, but also provides a clear direction for the corresponding optimization. When adjusting the parameters of the waveform function f(x), it is necessary to consider the specific impact of each defect position on the optical transmission path. By optimizing the parameters of f(x), the optical transmission result Q def This process usually requires combining multiple simulation calculations with actual experimental feedback, and through dynamic adjustments, the impact of processing defects on light transmission is within a controllable range, thereby improving the overall propagation efficiency of photons.

[0086] Through this embodiment, it is possible to better identify and compensate for optical transmission problems caused by processing defects, and significantly improve the transmission stability of photonic circuits. This optimization method provides a solid guarantee for the application of topological protection photonic circuits and lays the foundation for subsequent design and function realization. Effective optical transmission optimization not only makes the performance of photonic systems more stable in complex application environments, but also provides perfect theoretical and engineering support for the processing of future optical components, especially under high precision and fine design requirements.

[0087] Embodiment 6: In order to solve the problem of photon transmission loss caused by surface reflection in the photonic crystal structure, this embodiment further optimizes the method of coating an anti-reflection layer on the surface of the photonic crystal structure. The coating of the anti-reflection layer helps to improve the transmission efficiency of photons in the line, and its selection and optimization directly affect the overall performance of the photonic crystal. The selection of a suitable anti-reflection material needs to consider its optical matching with the photonic crystal material to ensure that it minimizes reflection within the operating wavelength range.

[0088] Furthermore, the thickness and refractive index distribution of the anti-reflection layer usually adopt a multilayer film structure to achieve low reflectivity in a wider spectral range. It should be understood that the stacking combination of different materials and the precise control of film thickness can achieve the desired anti-reflection effect through optimized design. The use of advanced deposition techniques, such as electron beam evaporation or magnetron sputtering, can ensure the uniformity and adhesion of the film layer, thereby achieving low reflection while maintaining excellent mechanical properties.

[0089] It is understandable that the coating of the anti-reflection layer not only improves the efficiency of light transmission, but also protects the stability of the photonic crystal in different environments. Through this embodiment, the photonic circuit has achieved remarkable results in reducing surface reflection losses, which provides a guarantee for the efficient and stable photon transmission. At the same time, the application of this anti-reflection layer is not limited to enhancing the light transmission performance, but can also play a role in optimizing other functions of the device, such as improving fatigue resistance and durability, and expanding the performance potential of photonic crystals in complex applications.

[0090] Example 7: In order to solve the challenges of topological protection of photonic circuits and reducing optical transmission loss in a wide frequency band, this example further optimizes the method of integrating topological insulators into photonic crystal structures. In the integration process, different types of topological insulators are combined to enhance the adaptability of the system to different frequency bands through diversity. Topological insulators have unique edge state properties that can suppress backscattering, thereby improving the stability and reliability of optical transmission. Figure 7 shown.

[0091] Furthermore, when selecting and combining different topological insulators, it is necessary to consider their material properties, including refractive index, band gap width, and topological protection effect of edge states. These properties directly affect the waveguide performance and overall light transmission efficiency of photonic crystals. It is understandable that in this combination optimization, it is necessary to precisely control the preparation and integration process of the materials to achieve the functional complementarity and synergistic effect of each topological insulator in the structure. Through advanced material processes, such as molecular beam epitaxy or chemical vapor deposition, the effective integration of various topological insulators in photonic crystals is ensured, and a continuous and uniform topological structure is formed on a macro scale.

[0092] This combination of multiple topological insulators not only enhances the topological protection of photonic circuits under broadband conditions, but also effectively reduces the loss caused by scattering and defects during light transmission. Through this embodiment, photonic circuits show more excellent transmission performance in a wider range of applications, improving the operability and service life of the overall system. This design strategy provides technical support and guidance for the future development of high-bandwidth, low-loss photonic networks and devices.

[0093] Embodiment 8: In order to solve the problem of optimizing the refractive index distribution in the topological protection photonic circuit to reduce the optical transmission loss, this embodiment further refines the refractive index distribution design and optimizes the residual loss rate P of the photon in the transmission through precise calculation. res During this process, an optimization formula based on the energy and frequency of the transmitted photons was used to ensure that the refractive index distribution can effectively reduce the loss of light transmission along the way.

[0094] Furthermore, the optimization process relies on the following calculation formula:

[0095]

[0096] Among them, E i represents the photon energy of the i-th transmission state, while h and v i are Planck's constant and the frequency of the photon, respectively. This formula provides a way to accurately optimize the refractive index distribution by quantifying the energy loss of each photon state. The change in photon energy directly affects the dynamic adjustment of the refractive index, thereby better controlling and reducing losses in actual photonic circuits.

[0097] It is important to understand that in order to achieve this refractive index distribution optimization, numerical simulation algorithms are used to iteratively adjust the refractive index parameters of each region. These algorithms can efficiently calculate the energy density distribution in different regions, thereby guiding the dynamic change of the refractive index. In addition, the geometric parameters and material properties of the topological structure must be considered to ensure the robustness and functionality of the overall structure. In this way, an uneven distribution of the refractive index can be achieved within the effective range, allowing photons to propagate with low loss along a predetermined path.

[0098] It is understandable that the adjustment of the refractive index of various material and geometric shape combinations not only affects the propagation path of the light wave, but also affects the stray and propagation speed of the mode. Therefore, in the specific implementation, it is necessary to adjust according to the target transmission speed and bandwidth requirements. Optical software tools are used to simulate the photon distribution and propagation effects in actual operation. Through multiple simulation optimizations, it is ensured that the loss in the real environment is as close to the theoretical optimal value as possible.

[0099] Through this embodiment, the loss in the topological photonic circuit is effectively reduced and the efficiency of photon transmission is improved. This enables the topological structure to show more superior performance in practical applications, especially in communication networks and integrated optical systems that require high transmission consistency and low loss.

[0100] Embodiment 9: In order to solve the problem of light transmission performance loss of micro-light diffraction substrates caused by accidental processing errors in photonic circuit design, this embodiment proposes a random refractive index distribution strategy in a photonic crystal structure. This strategy design is used to dynamically compensate for potential errors, thereby enhancing the stability of light transmission.

[0101] Furthermore, the implementation of this strategy involves introducing a random refractive index distribution in the photonic crystal structure, which statistically accounts for the nonlinear effects of processing errors. It should be understood that the random refractive index distribution helps to disperse the phase mismatch introduced by processing errors, thereby reducing the diffraction loss caused by the errors. Specifically, by using a high-precision randomization process during the manufacturing process, the change in refractive index can present a smooth random gradient in space, thereby reducing the impact of local errors on the overall transmission performance.

[0102] It is understandable that although the random refractive index seems to be disordered, its design needs to follow certain statistical laws to ensure the controllability of the overall transmission path. In this process, the parameters of the random distribution need to be optimized through simulation calculations to achieve the desired compensation effect. This includes considering the material properties used for manufacturing, operating temperature changes, and the geometric characteristics of the photonic crystal to ensure reliable error compensation capabilities under different working conditions.

[0103] Through this embodiment, the photonic crystal structure shows stronger adaptability and resilience in the face of production and processing errors. The random refractive index distribution strategy not only reduces the performance fluctuations caused by processing errors, but also provides more flexible design options for photonic circuits, thereby achieving stable and efficient light transmission in a variety of application scenarios. By applying this strategy to the actual production process, the manufacturing process of optical devices can better cope with various environmental challenges.

[0104] Embodiment 10: In order to solve the problem of insufficient anisotropic transmission characteristics of photonic crystal structures in topologically protected photonic circuits, this embodiment further refines the multi-layer spiral composite topological arrangement strategy. This strategy enhances the anisotropic transmission characteristics of the array by optimizing the photonic crystal structure, making it adaptable to complex optical transmission environments. This strategy utilizes a combination of multi-level and spiral features to achieve dynamic control and phase adjustment of the photon transmission path. This provides a flexible solution for accurately designing optical transmission behavior.

[0105] Specifically, the multi-layer spiral composite topological arrangement strategy adopted is based on the following calculation formula:

[0106]

[0107] Among them, H(x,y,z) is the phase offset of the photon, λ is the wavelength variable, f is the modulation frequency, and ϕ is the phase starting angle; these parameters all play a role in the optimization of the transmission path.

[0108] Furthermore, by adjusting f and ϕ, the adaptation between different light transmission modes can be optimized, and the physical spacing and arrangement between different layers can be changed. It should be understood that the appropriate parameter selection can effectively adjust the coupling strength between different material layers, thereby improving the propagation characteristics of photons in materials with anisotropic characteristics. This adjustment not only involves spatial parameters, but also needs to be optimized in the time domain to achieve the best light transmission effect in practical applications.

[0109] It is understandable that such a multi-layer spiral structure design provides a flexible means of optical control, so that optical devices can maintain stable performance under different conditions. At the same time, by adjusting the physical spacing and arrangement, the multi-channel and multi-mode transmission of photons can be precisely controlled, effectively promoting the utilization and optimization of anisotropic characteristics in photonic circuits.

[0110] Through this embodiment, the anisotropic transmission characteristics of the photonic crystal structure are enhanced, meeting the requirements for flexibility and reliability in high-performance optical communication systems. The optimized design of this embodiment not only improves the adaptability of photonic devices in different application scenarios, but also provides a practical foundation and solution for the innovation of future photonic technology.

[0111] Example 11: In order to solve the problem of achieving high-precision photonic crystal structure etching in topologically protected photonic circuits, this example further optimizes the manufacturing process of photonic crystals, covering multiple process steps from pattern design to final structure formation, thereby ensuring processing and manufacturing on a micro-light diffraction substrate.

[0112] First, high-resolution pattern design is performed on the micro-diffraction substrate using electron beam lithography, laying the foundation for subsequent structure transfer. Electron beam lithography has excellent pattern resolution and can achieve fine design at the submicron level. It should be understood that in this process, electron beam lithography requires the use of well-adapted resists to ensure high contrast in the exposure and development steps, facilitating the smooth progress of subsequent processes.

[0113] Furthermore, the pattern is accurately transferred to the designed position by applying deep ultraviolet lithography technology to ensure the integrity and position accuracy of the pattern. This technology is particularly suitable for the production of high-density and complex-structured photonic crystals. It is understandable that in order to achieve the best pattern transfer, the exposure and development process parameters of lithography need to be optimized in terms of material selection, photoresist thickness, exposure energy, and development time.

[0114] Furthermore, reactive ion etching technology is used to finely etch the depth and sidewall verticality of the micro-light diffraction substrate to achieve the required geometric accuracy and structural characteristics. It should be understood that this step not only places high demands on the depth accuracy of etching, but also requires the sidewalls to have good verticality to avoid unnecessary optical losses in the photonic crystal structure. Reactive ion etching parameters need to be strictly controlled, such as the type of etching gas, flow rate, etching time, and RF power, which must all match the chemical and physical properties of the material to achieve the ideal etching morphology.

[0115] Furthermore, the micro-light diffraction substrate is subjected to thermal annealing to improve the optical properties and structural stability of the material. Thermal annealing can make the stress distribution inside the material more uniform, repair the microstructural damage during the etching process, and improve the optical performance of the material. It is understandable that the temperature and time parameters of thermal annealing need to comprehensively consider the characteristics of the substrate material to ensure that its optical properties are improved without introducing additional defects.

[0116] Through this embodiment, a high-precision manufacturing process of a photonic crystal structure on a micro-light diffraction substrate can be realized. This manufacturing process provides a feasible technical path for the mass production of high-performance photonic devices, and shows a wide range of application potential in optical communications, optical computing and other fields that require high-precision optical components. The use of this optimized process can effectively reduce manufacturing errors and defective rates, while improving the performance stability of the device.

[0117] Embodiment 12: In order to solve the problem of realizing efficient topological protection photonic circuits on micro-light diffraction substrates, this embodiment proposes a system for designing topological protection photonic circuits, which can accurately perform the complete steps from material selection to photonic circuit optimization and is applied to the processing of micro-light diffraction substrates. Fig.10 As shown, the system consists of multiple modules, and each module is organically linked to each other to achieve its functional role.

[0118] In this embodiment, the selection module 100 is responsible for the selection of materials, especially focusing on the refractive index and mechanical strength of the materials. By selecting suitable optical materials, a solid foundation can be provided for subsequent designs. It should be understood that the selection of refractive index not only affects the band gap and transmission characteristics of the photonic crystal, but also determines the overall stability of the photonic crystal.

[0119] Furthermore, the design module 200 is responsible for the geometric design of the photonic crystal structure, including the planning of the two-dimensional or three-dimensional structure and the detailed distribution of the refractive index. It is understood that the subtle geometry and refractive index design provide conditions for the manifestation of topological properties, making the light transmission path not only stable but also efficient.

[0120] Furthermore, the integrated module 300 effectively integrates the topological insulator into the photonic crystal structure. By adding the topological insulator, the asymmetry and echo immunity characteristics of the photon flow can be enhanced. This step means innovation in structural design, and by rationally formulating the synergy between the crystal and the insulator, the photon propagation optimization in a specific band can be achieved.

[0121] Furthermore, the calculation module 400 uses a topological photon path optimization algorithm to calculate and analyze the band gap distribution and effective transmission path of the photonic crystal unit, and obtains the parameters of the transmission characteristics through calculation, thereby providing a scientific basis for parameter tuning.

[0122] Further, the manufacturing module 500 etches the photonic crystal onto the micro-light diffraction substrate according to the design result. It is understandable that the etching accuracy in this step affects the effectiveness of the final product of the micro-light diffraction substrate, so it is necessary to carefully adjust the process parameters in combination with the aforementioned material properties and pattern requirements to ensure high-precision molding.

[0123] Furthermore, after manufacturing is completed, the optical performance of the photonic circuit is verified by the test module 600, and indicators such as transmission efficiency and bandgap characteristics are evaluated through a series of optical tests to ensure that the actual functions of the design scheme are realized.

[0124] Furthermore, the feedback module 700, as the self-optimizing part of the system, adjusts and optimizes the parameters of the entire photonic circuit by analyzing the test results. This process improves the system's ability to adapt to errors and changing requirements under real conditions.

[0125] Through the design of this embodiment, the realization of photonic circuits on micro-light diffraction substrates is not only more efficient, but also improved in anisotropy protection and topological quantum properties. This systematic process provides a reliable technical platform for the development of the next generation of optical communications and photonic computing, and promotes the industrialization and technological development of photonic circuits.

[0126] Embodiment 13: In order to solve the problem of complex calculation and parameter optimization in the existing topology protection photonic circuit design process, this embodiment proposes a computer-readable storage medium storing a computer program. The program is intended to implement a topology protection photonic circuit design method and has computing power and parameter adjustment functions.

[0127] It is understood that the program can be loaded into a computer system to implement a variety of complex calculation steps, including the geometric design of photonic crystal structures, the integration of topological insulators, and the algorithmic optimization of band gaps and photon transmission paths. Through a highly integrated program architecture, digital management of the entire process from material selection to process optimization is achieved. It should be understood that this functional design enables users to quickly adjust design parameters and obtain relatively optimal design solutions under different design requirements and application scenarios.

[0128] Furthermore, the computer program provides a variety of algorithms and optimization strategies through a modular algorithm interface, making the parameter adjustment of each design link more targeted. It can be understood that this adjustable algorithm framework not only improves the applicability of the program, but also provides intelligent decision support through long-term data accumulation.

[0129] Through this embodiment, the programmed design on the computer-readable storage medium provides an efficient and reliable tool for the design and optimization of topological protection photonic circuits, making the originally complex design process simpler and more intuitive.

[0130] Embodiment 14: In order to solve the problem of achieving efficient photon transmission and environmental stability in a micro-light diffraction substrate, this embodiment proposes a micro-light diffraction substrate with a multi-layer structure design to meet the needs of complex optical applications.

[0131] In this embodiment, the design of the micro-light diffraction substrate is based on the substrate layer, and uses a material with an optimized refractive index and stable optical transmission performance. It is understandable that the selection of materials needs to comprehensively consider the temperature and humidity conditions and mechanical stress of the application environment to ensure that stable optical properties can be maintained even in harsh environments. The ideal material should have low-loss optical properties and sufficient mechanical strength to support the superposition of structural layers and functional layers.

[0132] Furthermore, the photonic crystal structure layer embedded in the substrate layer can be a periodic refractive index distribution or a random refractive index distribution, and the photonic crystal structure layer includes an integrated topological insulator. It should be understood that the introduction of topological insulators is not only to ensure that the photonic crystal has the desired band gap characteristics and a transmission path that is not affected by defects, but also to enhance the stability to external disturbances. In the design process, selecting a suitable periodic geometric structure and fully considering the impact of topological effects on the photon transmission path will help to achieve high-precision and high-efficiency photon flow in practical applications.

[0133] Furthermore, the surface anti-reflection layer is covered on the top layer of the substrate to reduce surface reflection and improve light transmission efficiency. Selecting an anti-reflection material with an optical thickness and refractive index that matches the substrate layer can effectively reduce the reflection loss of the incident light. It is understandable that the anti-reflection layer not only needs to optimize optical matching, but also needs to have the characteristics of anti-scratch and resistance to environmental changes to extend the service life of the component.

[0134] Furthermore, the micro-light diffraction substrate also integrates a temperature control system, which adjusts and stabilizes the operating temperature through real-time temperature feedback, thereby ensuring the environmental stability of the photonic circuit. It should be noted that the integration of the temperature control system on the micro-light diffraction substrate is a complex process, which requires comprehensive consideration of factors such as material compatibility, manufacturing process and system functionality. The following is an implementation of how the temperature control system is integrated on the substrate:

[0135] First of all, the temperature control system is mainly composed of temperature sensors, temperature regulation modules and control circuits. The precise cooperation of these components ensures the system's agile response and precise control of temperature.

[0136] Furthermore, micro temperature sensors are integrated on the substrate, which are distributed in specific areas to monitor the temperature distribution of the substrate in real time. The selection of sensors must meet the requirements of high sensitivity and low latency so that data on temperature changes can be obtained in a timely manner. Commonly used materials include platinum resistance temperature detectors (RTDs) and thermocouples because they provide accurate and stable temperature measurements.

[0137] Furthermore, the temperature of the substrate can be directly influenced by integrating micro-cooling or heating elements (such as thermoelectric coolers). These elements raise or lower the local temperature as required, corresponding to the information provided by the temperature sensor. Such modules are usually made of semiconductor materials and can provide a fast and controllable thermal response.

[0138] Furthermore, the control circuit is used to process the signal received from the temperature sensor and drive the cooling or heating module according to the preset temperature threshold. The circuit integrates components such as amplifiers, filters, analog-to-digital / digital-to-analog converters, and microcontrollers to achieve precise signal processing and control algorithms. The control circuit is usually directly implanted or deposited on the substrate through silicon-based or other compatible circuit technologies, and the circuit is connected to other parts of the substrate through microelectronic processes, thereby achieving miniaturization and integration.

[0139] Furthermore, to ensure the stable operation of the system, it is necessary to ensure that the small power management module of the temperature control system provides stable power to each component. The power management module should be designed with low energy consumption to extend the service life and reduce heat generation.

[0140] During the integration process, it is necessary to ensure that all components are mechanically and thermodynamically compatible to avoid stress caused by thermal expansion and contraction that damages the micro-diffraction substrate material. In addition, the manufacturing process should ensure that the materials of each part can seamlessly cooperate in optical and electronic performance. Specific methods involve micromachining technologies such as physical vapor deposition (PVD), chemical vapor deposition (CVD) or photolithography, which are used to accurately integrate these electronic and thermal control components into the substrate. Through such integration, the substrate can achieve smooth and precise temperature control, ensuring its stable operation under various environmental conditions, thereby protecting the performance of the photonic circuit and extending its effective working life.

[0141] Through this embodiment, the micro-light diffraction substrate still exhibits excellent light transmission performance and stable environmental adaptability even in complex optical environments. From material selection to structural integration to environmental control, a complete set of efficient optical system solutions is built, which improves the transmission efficiency and stability of photonic circuits and provides practical technical support for the research and development of a new generation of photonic devices.

[0142] Example 15: In order to solve the complex process challenges in the manufacturing process of topologically protected photonic circuits in micro-light diffraction substrates, this example proposes a system integration and functional design for micro-light diffraction substrate processing equipment to achieve full-process automated control from pattern design to performance verification.

[0143] Specifically, the processing equipment integrates an electron beam lithography device, which is used to implement high-resolution two-dimensional or three-dimensional photonic crystal pattern design on micro-diffractive substrates. It is understandable that the electron beam lithography system needs to have extremely high stability to accurately control the exposure at the nanoscale to achieve the desired design goals for complex photonic crystal structures. The accurate alignment and fast lithography capabilities of the equipment are achieved through high-precision servo control and advanced electron optical systems.

[0144] Furthermore, in order to successfully transfer the processed patterns into the photonic crystal structure, deep ultraviolet lithography equipment is used to enhance the development of photoresists and the accurate transfer of etching patterns. Deep ultraviolet lithography provides higher resolution and can cover a larger processing area. Its operation utilizes a combination of resist selectivity and high-energy ultraviolet light to reliably transfer microscopic patterns.

[0145] Further, the subsequent processing involves a reactive ion etching device, which uses plasma etching technology to precisely process the photonic crystal structure. It should be understood that reactive ion etching can control the etching depth and sidewall verticality to ensure the optical performance and structural integrity of the photonic crystal. By adjusting the chemical composition of the etching gas and process parameters, the device provides a flexible process for achieving profile uniformity and minimal sidewall roughness.

[0146] Furthermore, after the structural processing is completed, the photonic crystal is annealed with the help of a thermal annealing device to improve the optical properties of the material. The thermal treatment process can release the internal stress of the material and optimize its crystal structure by slowly increasing and decreasing the temperature, thereby improving the light transmission characteristics. Through a predetermined temperature curve and a precise temperature control system, the annealing process ensures the improvement of material performance and physical stability.

[0147] In addition, to ensure the quality of finished products and process accuracy, the processing equipment is integrated with a test device for real-time detection and verification of the optical performance of the photonic circuit. The device has a measurement unit for reflection, transmission and scattered light, which can provide real-time feedback to evaluate any deviations in the production process. Through automated data collection and analysis processes, the test device provides continuous improvement guidance for the process control of the equipment.

[0148] Furthermore, based on the feedback information provided by the test device, the parameter adjustment device can adjust the process parameters in real time to optimize the design and manufacturing quality of the topological protection photonic circuit. This closed-loop control strategy realizes dynamic adjustment during the manufacturing process and improves the consistency of product quality.

[0149] Through this embodiment, the comprehensive solution of automation and control of processing equipment not only improves production efficiency, but also improves the functional performance of topological protection photonic circuits. The integration and optimized design of equipment form a manufacturing system that meets modern needs and serves the innovative development of photonic devices.

Claims

1. A topological protection photonic circuit design method, applied to a micro-light diffraction substrate, characterized in that: The method comprises the following steps: Selecting a material with a refractive index and mechanical strength, and processing the material at a micro-nano scale to make a photonic crystal; Designing a two-dimensional or three-dimensional photonic crystal structure with a periodic refractive index distribution on the micro-light diffraction substrate, and geometrically configuring the photonic crystal units of the photonic crystal structure to achieve topological protection; Integrating a topological insulator into the photonic crystal structure, the photonic crystal structure has topological protection characteristics during optical signal transmission, and is used to resist physical disturbances and processing defects; Calculating the band gap distribution and photon transmission path of the photonic crystal unit by a topological photon path optimization algorithm to ensure that the optical signal is not interfered with; Etching the photonic crystal structure onto the micro-light diffraction substrate, wherein the etching steps include electron beam lithography, deep ultraviolet lithography and reactive ion etching; Testing the optical performance of the topologically protected photonic circuit of the micro-light diffraction substrate, and verifying the anti-interference performance of the micro-light diffraction substrate in the application environment by adjusting and optimizing the parameters of the geometric configuration; The step of designing a two-dimensional or three-dimensional photonic crystal structure with a periodic refractive index distribution on the micro-light diffraction substrate comprises: Selecting a lattice type suitable for the application environment, wherein the lattice type includes at least one of a square lattice or a honeycomb lattice; Refining lattice parameters, wherein the lattice parameters include lattice constants of the photonic crystal unit and geometric shapes of the photonic crystal unit, and an array arrangement of the geometric shapes constitutes the lattice type; Using a honeycomb point distribution algorithm, the center points of the refractive index distribution are arranged on the lattice type to form an optimal arrangement of the relative positions of the center points of the refractive index distribution. The calculation formula of the refractive index distribution is: , where n(x) is the refractive index distribution function, n0 is the reference refractive index, Δn is the refractive index change, and Λ is the period length; Using a numerical simulation tool to simulate the band gap structure and optical properties of the photonic crystal to obtain simulation results, and adjusting the refractive index distribution and the lattice parameters according to the simulation results; The step of calculating the band gap distribution and photon transmission path of the photonic crystal unit by using a topological photon path optimization algorithm comprises: Determining the geometry and dielectric constant distribution of the material, defining the lattice parameters based on crystal periodicity; The wave equation of the photonic crystal unit is established by using the plane wave expansion method or the tight binding model: , and perform eigenvalue calculations for different wave vectors k in the Brillouin zone to obtain the band structure; Analyzing and calculating the energy band structure, identifying the band gap between any two energy bands, and determining the frequency range that can be used for photon transmission; pass Calculate the Berry connection A(k), where A(k) is a vector of wave vectors k, u k is the eigenstate of the electron wave function, ∇ k is the partial derivative with respect to k; pass Calculate the Berry curvature Ω(k); pass The integral C of the Berry curvature over the entire Brillouin zone is calculated to measure the total effect of the Berry curvature Ω(k), where ∫ BZ is the integral across the energy band, d 2 k is the area element in momentum space.

2. The topological protection photonic circuit design method according to claim 1, characterized in that: The topological insulator is selected from indium antimonide (InSb), and the step of integrating the topological insulator into the photonic crystal structure includes calculating the energy level stability of the topological insulator to ensure that the energy of the topological protection state is minimized. The calculation formula of the energy level stability is: , where E topo is the topological state energy, m is the particle mass, v i is the particle velocity, U(x i ) is the potential energy function, e is the elementary charge, r ij is the distance between particles.

3. The topological protection photonic circuit design method according to claim 1, characterized in that: The method further includes optimizing light transmission at the location of the processing defect, wherein the step of optimizing light transmission includes: Determine the optical transmission characteristics of the location of the processing defect, and measure the total length L of the transmission line used for optical transmission; Selecting a waveform function f(x) to reflect the desired light transmission characteristics at the locations of the different processing defects, and calculating or experimentally obtaining a potential distribution V(x) to describe the potential variation along the transmission line; According to the distribution of the potential V(x), the second-order derivative of the potential is calculated ; By evaluating the optical transmission results Q def For optical transmission optimization, the optical transmission result Q def The calculation formula is: ； Adjust the parameters of the waveform function f(x) to optimize the optical transmission result Q def , used to improve the light transmission quality at the location of the processing defect.

4. The method for designing a topological protection photonic circuit according to claim 1, wherein: The method further comprises coating an anti-reflection layer on the surface of the photonic crystal structure to reduce reflection loss of photons during line transmission.

5. The method for designing a topological protection photonic circuit according to claim 1, characterized in that: In the process of integrating the topological insulator into the photonic crystal structure, a combination of different types of topological insulators is used to improve the topological protection of the photonic circuit within a wide frequency band and reduce the loss of light transmission.

6. The method for designing a topological protection photonic circuit according to claim 1, characterized in that: The refractive index profile is optimized by the following calculation formula: , where P res is the residual loss rate, E is the energy of the transmitted photon, h is Planck's constant, and ν is the frequency of the photon.

7. The method for designing a topological protection photonic circuit according to claim 1, characterized in that: The photonic crystal structure adopts a random refractive index distribution strategy to compensate for the light transmission performance loss of the micro-light diffraction substrate caused by accidental processing errors in the photonic circuit design process.

8. The method for designing a topological protection photonic circuit according to claim 1, characterized in that: The method further comprises the step of optimizing the photonic crystal structure by using a multi-layer spiral composite topological arrangement strategy to enhance the anisotropic transmission characteristics of the array; the calculation formula of the multi-layer spiral composite topological arrangement strategy base is: , where H(x,y,z) is the phase shift of the photon, λ is the wavelength variable, f is the modulation frequency, and ϕ is the phase starting angle; By changing f and ϕ, different light transmission modes can be optimized and the physical spacing and arrangement between different layers can be adjusted to improve the propagation characteristics of light in materials with anisotropic characteristics.

9. The method for designing a topological protection photonic circuit according to claim 1, characterized in that: The step of etching the photonic crystal structure onto the micro-light diffraction substrate comprises: Using electron beam lithography technology to perform high-resolution pattern design on the micro-diffraction substrate; Applying deep ultraviolet lithography technology to transfer the photonic crystal structure to the position of the pattern design; Reactive ion etching technology is used to perform fine etching of depth and sidewall verticality; The micro-light diffraction substrate is subjected to thermal annealing to improve the optical properties and structural stability of the material.

10. A system for topologically protected photonic circuit design, applied to micro-light diffraction substrate, characterized in that: The system is used to implement the topological protection photonic circuit design method according to claim 1, and the system includes: A selection module for selecting materials having refractive index and mechanical strength; A design module, used to design a two-dimensional or three-dimensional photonic crystal structure and generate the geometric shape and refractive index distribution of the photonic crystal unit; An integration module, used to integrate a topological insulator into the photonic crystal structure; A calculation module, used for calculating the band gap distribution and photon transmission path of the photonic crystal unit by a topological photon path optimization algorithm; A manufacturing module, used for etching the photonic crystal structure onto the micro-light diffraction substrate; A test module, used to test the optical performance of the topological protection photonic circuit of the micro-light diffraction substrate; A feedback module is used to adjust and optimize the parameters of the topological protection photonic circuit of the micro-light diffraction substrate.

11. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is loaded into a computer, the method for designing a topological protection photonic circuit as claimed in any one of claims 1 to 9 is implemented.

12. A micro-light diffraction substrate, made by the topological protection photonic circuit design method according to claim 1, characterized in that: The substrate comprises: The substrate layer is made of a material with the required refractive index and optical transmission performance required by the application environment; A photonic crystal structure layer, embedded in the substrate layer, wherein the photonic crystal structure layer includes a periodic refractive index distribution or a random refractive index distribution of an integrated topological insulator; Surface anti-reflection layer, used to reduce surface reflection of light transmission; The temperature control system is integrated with the substrate and adjusts the operating temperature based on real-time temperature feedback to ensure the environmental stability of the photonic circuit.

13. A topologically protected photonic circuit processing device for processing a micro-light diffraction substrate, characterized in that: The processing equipment is integrated with the system for designing a topological protection photonic circuit according to claim 10, and the processing equipment further comprises: Electron beam lithography equipment for realizing the pattern design of two-dimensional or three-dimensional photonic crystals; Deep ultraviolet lithography equipment for the transfer of photonic crystal structures; Reactive ion etching device for fine etching of depth and sidewall verticality; Thermal annealing treatment device for improving the optical properties of photonic crystal structures; Testing equipment, used to detect and verify the optical performance of photonic circuits in real time and provide feedback data; The parameter adjustment device adjusts and optimizes the parameters of the topological protection photonic circuit of the micro-light diffraction substrate in real time based on the feedback data.

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