A method of encapsulating a waterproof electronic device

Abstract

This invention provides a method for encapsulating a breathable and waterproof electronic device, comprising the following steps: A. Establishing a first gas channel for a sensor chip: After covering the sensor chip with a first pipe, pour potting compound to the same height as the first pipe, and place it in an atmospheric environment to cure and dry naturally, thus establishing the first gas channel; B. Establishing a second gas channel containing a hydrophobic and breathable membrane: Take a hydrophobic and breathable membrane with a diameter larger than the aperture of the first pipe, place it flat on top of the first pipe, and place a second pipe on top of the hydrophobic and breathable membrane, connecting it to the top of the first pipe through the hydrophobic and breathable membrane; C. Encapsulating the two pipe sections and the hydrophobic and breathable membrane as a whole: Under pressure, pour potting compound to at least 1 cm above the hydrophobic and breathable membrane, completing the integrated encapsulation of the hydrophobic and breathable membrane and the second pipe sandwiched in the middle, thus establishing the second gas channel. This method is simpler to operate and ensures better performance.

Description

Technical Field

[0001] This invention relates to the field of electronic device packaging technology, and more specifically, to a method for packaging breathable and waterproof electronic devices. Background Technology

[0002] Gas sensors play a crucial role in environmental monitoring, industrial control, and safety detection, enabling real-time detection and monitoring of harmful gas concentrations to safeguard lives and property. However, in practical applications, gas sensors often face harsh environmental conditions such as underwater environments, high humidity, rain, dust, and chemical corrosion. These adverse factors can damage internal sensor components, degrade performance, or even cause failure, severely impacting their stability and lifespan. Therefore, developing effective waterproof and breathable encapsulation technology is essential to ensure the continuous and stable operation of gas sensors in various harsh environments. The core of waterproof and breathable encapsulation technology lies in preventing the intrusion of moisture and other liquids to avoid damage to internal circuits and sensing elements, while simultaneously allowing gas molecules to freely pass through the encapsulation material to ensure the sensor can sensitively detect the target gas. The key to achieving this goal lies in selecting appropriate encapsulation materials and structural design.

[0003] Existing waterproof and breathable encapsulation technologies for electronic devices such as gas sensors mainly utilize hydrophobic and breathable membranes to cover the pores of the outer shell, and then use silicone rings / gaskets to deform under pressure to prevent water molecule penetration. However, this method requires consideration of five major waterproofing factors: the shell itself, the shell joints, the joint between the rubber ring / gasket and the shell, the joint between the hydrophobic and breathable membrane and the shell, and the membrane itself. It requires a perfect fit between each component, resulting in numerous factors to consider, high processing difficulty, and high cost.

[0004] Therefore, designing a low-cost, simple-to-operate packaging method for breathable and waterproof electronic devices is a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0005] The purpose of this invention is to provide a packaging method for breathable and waterproof electronic devices, which effectively solves the problems of poor sealing performance, numerous factors affecting sealing performance, and high processing difficulty of existing gas sensors, reduces production costs, simplifies operation, and ensures performance.

[0006] The embodiments of the present invention are implemented as follows:

[0007] This invention provides a method for packaging breathable and waterproof electronic devices, comprising the following steps:

[0008] A. Establishment of the first gas channel for the sensor chip: After the first pipe is fitted over the sensor chip, potting compound is poured in to the same height as the first pipe, and then placed in an atmospheric environment to cure and dry naturally to establish the first gas channel.

[0009] B. Establish a second gas channel containing a hydrophobic and breathable membrane. Take a hydrophobic and breathable membrane with a diameter larger than that of the first pipe and place it flat on top of the first pipe. Take a second pipe to press down on the upper part of the hydrophobic and breathable membrane and connect it to the top of the first pipe through the hydrophobic and breathable membrane.

[0010] C. Integrate the two pipe sections with the hydrophobic and breathable membrane. While under pressure, pour in potting compound that covers at least 1 cm above the hydrophobic and breathable membrane to complete the integrated encapsulation of the hydrophobic and breathable membrane and the second pipe, thus establishing a second gas channel.

[0011] Furthermore, the sensor chip is located on a circuit board, and both the circuit board and the sensor chip are located at the bottom inside the sensor housing.

[0012] Furthermore, the diameter of the first pipe is larger than the diameter of the sensor chip.

[0013] Furthermore, in step A, potting compound is first poured into the outside of the first pipe to seal the bottom of the first pipe. After curing, potting compound is continuously poured in until it reaches the same height as the first pipe.

[0014] Furthermore, the potting compound is made of circuit board-specific potting compound A and B, which are mixed uniformly in a weight ratio of 1:1.

[0015] Furthermore, the first and second pipes have the same diameter.

[0016] Furthermore, the first and second pipes are coaxially connected.

[0017] Furthermore, in step C, the pressing state is achieved by manually or with auxiliary means pressing down the second pipe to fix the hydrophobic and breathable membrane between the first and second pipes, and sealing the first and second pipes to prevent potting compound from entering the pipes.

[0018] Furthermore, in step C, after pouring in the potting compound, it is placed in an atmospheric environment to cure and dry naturally.

[0019] The beneficial effects of the packaging method for a breathable and waterproof electronic device provided by this invention are as follows:

[0020] This invention changes the traditional waterproof and breathable packaging method for electronic devices such as gas sensors. It replaces the structure that uses silicone rings / pads to deform under pressure to prevent water molecule penetration. It completely eliminates five major waterproof factors: the housing itself, the housing joints, the joint between the rubber ring / pad and the housing, the joint between the hydrophobic and breathable membrane and the housing, and the membrane itself. It directly uses potting compound to seal the circuit board and other components inside the sensor housing. At the same time, it constructs a first gas channel and a second gas channel, so that the chip at the bottom of the first channel can receive external gas, effectively prevent moisture intrusion, and prevent the accumulation of dust and other particles, further improving the stability and reliability of the sensor. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of step A of the method of the present invention;

[0023] Figure 2 This is a schematic diagram of step B of the method of the present invention;

[0024] Figure 3 This is a schematic diagram of step C of the method of the present invention;

[0025] Figure 4 This is a flowchart of the preparation experiment for the encapsulation of the present invention;

[0026] Figure 5 This is a diagram illustrating the waterproofing effect of the encapsulation process in this invention.

[0027] Figure 6 This is a schematic diagram of the comparative experimental materials packaged according to the present invention;

[0028] Figure 7 This is a comparative experiment showing the waterproofing effect of the encapsulation of this invention.

[0029] Figure 8 This is a comparative experiment showing the secondary waterproofing effect of the encapsulation of this invention;

[0030] In the diagram: 1. Sensor housing; 2. Circuit board; 3. Chip; 4. First channel; 5. Encapsulating adhesive; 6. Hydrophobic and breathable membrane; 7. Second channel. Detailed Implementation

[0031] To further understand the present invention, preferred embodiments of the present invention are described below in conjunction with examples. However, it should be understood that these descriptions are only for further illustrating the features and advantages of the present invention, and are not intended to limit the scope of the claims of the present invention.

[0032] This invention provides a method for packaging breathable and waterproof electronic devices, comprising the following steps:

[0033] A. Establishment of the first gas channel of sensor chip 3: After the first pipe 4 is fitted over the sensor chip 3, potting compound 5 is poured into the first pipe 4 at the same height, and then placed in the atmospheric environment to cure and dry naturally to establish the first gas channel.

[0034] B. Establish a second gas channel containing a hydrophobic and breathable membrane 6. Take a hydrophobic and breathable membrane 6 with a diameter larger than the aperture of the first pipe 4, place it flat on the top of the first pipe 4, and take a second pipe 7 to press down the upper part of the hydrophobic and breathable membrane 6, and connect it to the top of the first pipe 4 through the hydrophobic and breathable membrane 6.

[0035] C. Integrate the two pipe sections with the hydrophobic and breathable membrane 6. While under pressure, pour in the potting compound 5, ensuring it covers at least 1 cm above the hydrophobic and breathable membrane 6. This completes the integrated encapsulation of the hydrophobic and breathable membrane 6 and the second pipe 7, thus establishing a second gas channel.

[0036] The sensor chip 3 is located on the circuit board 2, and both the circuit board 2 and the sensor chip 3 are located at the bottom inside the sensor housing 1. Placing the circuit board 2 and chip 3 inside the sensor housing 1, i.e., sealing the circuit board 2 and other components inside the sensor housing 1 with potting compound 5, provides a first layer of sealing. The sensor housing 1 has a first layer of sealing, while the potting compound 5 provides a second layer of sealing performance, greatly improving the sealing effect. Furthermore, the potting compound 5 is directly poured into the sensor housing 1, eliminating the need for additional molds or other auxiliary equipment, making operation simpler and more convenient.

[0037] The diameter of the first pipe 4 is larger than the diameter of the sensor chip 3. The diameter and height of the pipe are determined according to the size of the chip or other components, with the diameter ranging from 1 mm to 30 mm and the height exceeding 2 mm.

[0038] In step A, potting compound 5 is first poured onto the outside of the first pipe 4 to seal the bottom of the first pipe 4. After curing, potting compound 5 is continuously poured until it reaches the same height as the first pipe 4. This initially fixes the bottom of the first pipe 4 to prevent excessive potting compound 5 from seeping into the inside of the first pipe 4 and affecting the performance of the chip 3. When pouring the potting compound 5, the top of the first pipe 4 needs to be pressed to ensure that the bottom of the first pipe 4 is in close contact with the surface of the circuit board 2.

[0039] The potting compound 5 uses circuit board 2-specific potting compounds 5A and B, which are uniformly mixed in a weight ratio of 1:1. The potting compound 5 can be Kraft K-9741, Kraft K-9761, or other epoxy resin potting compounds.

[0040] The first pipe 4 and the second pipe 7 have the same diameter. The first pipe 4 and the second pipe 7 are coaxially connected. That is, the first gas channel and the second gas channel established by the first pipe 4 and the second pipe 7 have the same inner diameter and are coaxially arranged.

[0041] In step C, the compression process involves manually or with assistance pressing down the second pipe 7 to fix the hydrophobic and breathable membrane 6 between the first pipe 4 and the second pipe 7, ensuring a seal between them and preventing the potting compound 5 from entering the pipes. This guarantees the airtightness between the first pipe 4 and the second pipe 7.

[0042] In step C, after pouring in the potting compound 5, it is left to cure and dry naturally in the atmosphere. Natural curing and air drying prevents the potting compound 5 from deforming and causing poor sealing.

[0043] Specifically, such as Figure 4 As shown, following the design steps, a metal pipe is used as the first pipe 4 and placed inside the white outer shell. Then, potting compounds A and B 5 are mixed evenly in a 1:1 mass ratio and poured into the white outer shell to seal the bottom of the first pipe 4, preventing the liquid potting compound 5 from seeping into the first pipe 4 before curing. After drying, more potting compound 5 is poured until it is flush with the opening of the first pipe 4, facilitating the placement of the hydrophobic and breathable membrane 6. After drying, blue water-absorbing and color-changing silicone is added to the first pipe 4, and the surface of the first pipe 4 is sealed with the hydrophobic and breathable membrane 6. Then, the second pipe 7 is aligned with the first pipe 4, and the hydrophobic and breathable membrane 6 is pressed firmly, followed by the pouring of potting compound 5. After curing, an integrated encapsulation structure with only one air passage, isolated by the hydrophobic and breathable membrane 6, is obtained.

[0044] like Figure 5 As shown, the entire encapsulation structure was submerged in water with the opening facing downwards for 3 days. After removing the first channel 4, the hydrophobic membrane surface was exposed. After breaking the hydrophobic and breathable membrane 6 with tweezers, it was found that the color-changing silicone inside did not change significantly compared to the initial color. The experiment proved that the encapsulation structure was effective and effectively prevented the penetration of water molecules.

[0045] like Figure 6 As shown, for comparison, experiments were also conducted using eight commonly used non-porous waterproof shells. The results show that, as... Figure 7 As shown, after placing color-changing silica gel inside and soaking it in water for one day, all samples showed discoloration of the silica gel and even water accumulation. Only beverage bottles and finely processed white plastic boxes showed better results.

[0046] Then, the finely finished white plastic box and the beverage bottle were separately subjected to a two-day water immersion test. Figure 8 As shown, after soaking in water for two days, the color-changing gel inside both changed from dark blue to purple, indicating that water molecules still permeated during the experiment.

[0047] Therefore, it can be seen that the encapsulation method of the breathable and waterproof electronic device of this application results in an electronic device with a waterproof effect that is significantly better than the conventional waterproof shells currently on the market.

[0048] This invention changes the traditional waterproof and breathable packaging method for electronic devices such as gas sensors. It replaces the structure that uses silicone rings / pads to deform under pressure to prevent water molecule penetration. It completely eliminates five major waterproof factors: the shell itself, the shell joints, the joint between the rubber ring / pad and the shell, the joint between the hydrophobic and breathable membrane 6 and the shell, and the membrane itself. It directly uses potting compound 5 to seal components such as the circuit board 2 inside the sensor shell 1. At the same time, it constructs a first gas channel and a second gas channel, so that the chip 3 at the bottom of the first channel 4 can receive external gas, effectively prevent moisture intrusion, and prevent the accumulation of dust and other particles, further improving the stability and reliability of the sensor.

[0049] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method of packaging a waterproof electronic device with ventilation, characterized by, Including the following steps: A. Establishment of the first gas channel in sensor chip (3), After the first pipe (4) is fitted over the sensor chip (3), potting compound (5) is poured in to the same height as the first pipe (4), and then placed in the atmospheric environment to cure and dry naturally to establish the first gas channel. B. Establish a second gas channel containing a hydrophobic and breathable membrane (6). Take a hydrophobic and breathable membrane (6) with a diameter larger than the aperture of the first pipe (4), place it flat on the top of the first pipe (4), take a second pipe (7) to press down the upper part of the hydrophobic and breathable membrane (6), and connect it to the top of the first pipe (4) through the hydrophobic and breathable membrane (6); C. Seal the two pipe sections together with the hydrophobic and breathable membrane (6) as a whole. Under the pressure, pour in potting compound (5) and cover at least 1 cm above the hydrophobic and breathable membrane (6) to complete the integrated encapsulation of the hydrophobic and breathable membrane (6) and the second channel (7) sandwiched in the middle, and establish the second gas channel. The sensor chip (3) is located on the circuit board (2), and both the circuit board (2) and the sensor chip (3) are located at the bottom inside the sensor housing (1).

2. The packaging method for breathable and waterproof electronic devices according to claim 1, characterized in that: The diameter of the first pipe (4) is greater than the diameter of the sensor chip (3).

3. The packaging method for breathable and waterproof electronic devices according to claim 1, characterized in that: In step A, potting compound (5) is poured into the outside of the first pipe (4) to seal the bottom of the first pipe (4). After curing, potting compound (5) is poured in until it reaches the same height as the first pipe (4).

4. The packaging method for breathable and waterproof electronic devices according to claim 1, characterized in that: The potting compound (5) is made of circuit board special potting compound A and B, which are mixed evenly in a weight ratio of 1:

1.

5. The packaging method for breathable and waterproof electronic devices according to claim 1, characterized in that: The first pipe (4) and the second pipe (7) have the same diameter.

6. The packaging method for a breathable and waterproof electronic device according to claim 1, characterized in that: The first pipe (4) and the second pipe (7) are coaxially connected.

7. The packaging method for a breathable and waterproof electronic device according to claim 1, characterized in that: In step C, the pressing state is achieved by manually or with the assistance of pressing down the second pipe (7) so that the hydrophobic and breathable membrane (6) is fixed between the first pipe (4) and the second pipe (7), and the first pipe (4) and the second pipe (7) are sealed to prevent the potting compound (5) from entering the pipe.

8. The packaging method for a breathable and waterproof electronic device according to claim 1, characterized in that: In step C, after pouring in the potting compound (5), place it in an atmospheric environment to cure and dry naturally.

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