A multi-layer circuit board drilling process

Abstract

The present invention relates to the field of circuit board drilling, and in particular to a multi-layer circuit board drilling process. A multi-layer circuit board drilling process of the present invention is based on the use of drilling equipment, and the drilling equipment includes an upper drilling mechanism and a moving mechanism. The lower drill rod cooperates with a hollow drill bit to first drill out the lower structure of the microhole from the lower side of the multi-layer circuit board group, and at the same time, the electric upper drill rod drills out the upper structure of the microhole from the upper side of the multi-layer circuit board group. After that, the upper drilling mechanism uses the electric main drill rod to perform fine hole drilling from top to bottom on the basis of the microholes drilled by the multi-layer circuit board group. At the same time, the hollow drill bit sucks away the debris in time, and the spray liquid will be more sucked into the fine hole under the suction effect, thereby improving the cooling efficiency of the electric main drill rod and improving the drilling effect of the fine hole. The technical problem of poor spray liquid flow effect and debris clogging in the fine hole structure drilling work on the multi-layer circuit board group, which causes the drill rod to be drilled off and broken, is solved.

Description

Technical Field

[0001] The invention relates to the field of circuit board drilling, and in particular to a multi-layer circuit board drilling process. Background Art

[0002] In the multi-layer circuit board drilling process, after the multi-layer circuit boards are stacked together to form a multi-layer circuit board group, due to the large number of inner copper layers in the multi-layer circuit board group, the drill rod will generate a large amount of heat during the cutting process, and the thermal conductivity of the substrate is small and the thermal expansion coefficient is large, resulting in the heat not being able to be conducted out in time, causing the drill rod to heat up and the temperature to rise rapidly. This high temperature will cause the drill bit blade to wear or even burn, thereby causing drilling deviation and chipping. Especially when it is necessary to open a large number of fine hole structures less than 4mm on the multi-layer circuit board group, due to the small diameter of the drill rod, after the drill rod is drilled into the multi-layer circuit board group, if the spray liquid cannot effectively enter the drilled fine holes of the multi-layer circuit board group along the threaded discharge groove structure of the drill rod, the heat conduction efficiency in the middle of the multi-layer circuit board group is poor, and when the debris in the fine holes drilled by the multi-layer circuit board group cannot be discharged outward in time, it will cause the fine holes of the multi-layer circuit board group to be blocked, causing the subsequent drilling stroke of the drill rod to be blocked, and finally resulting in a large deformation of the lower end of the drill rod, the drilling direction of the drill rod deviates, and even causes the drill rod to heat up excessively and cause the risk of chipping. Summary of the invention

[0003] In order to overcome the shortcomings of poor spray liquid flow effect and debris clogging in drilling fine hole structures on a multi-layer circuit board group, which cause drill deviation and chipping of the drill rod, the present invention provides a multi-layer circuit board drilling process.

[0004] The technical solution is as follows: a multi-layer circuit board drilling process, which is based on the use of drilling equipment, and the drilling equipment includes a fixed frame, a positioning platform, a moving mechanism, a lifting slider, a suction cylinder, a hollow drill bit, a lower drill rod, a driving motor, a bottom spray pipe, a stopper, an upper drilling mechanism and a main spray pipe; the fixed frame is fixedly connected to the positioning platform; the fixed frame is connected to the moving mechanism; the moving mechanism is fixedly connected to the suction cylinder; a suction port structure is provided on the suction cylinder; a hollow drill bit is rotatably connected in the suction cylinder, and a vertical channel is provided in the hollow drill bit; the hollow drill bit is provided with a through-hole structure connected to the vertical channel; the through-hole structures of the hollow drill bit are all connected to the suction cylinder The suction port structure is as follows: a lifting slider is connected to the moving mechanism; a lower drill rod for drilling micro-holes on the multi-layer circuit board group is rotatably connected to the lifting slider; a driving motor is installed on the lifting slider; the output shaft of the driving motor is fixedly connected to the lower drill rod; the lower drill rod is inserted into the hollow drill bit through a spline structure; a bottom spray pipe for spraying spray liquid toward the lower drill rod is connected to the moving mechanism; a stopper adapted to the bottom of the hollow drill bit is connected to the moving mechanism; an upper drilling mechanism for drilling micro-holes and fine holes on the multi-layer circuit board group is connected to the fixed frame; and a main spray pipe is connected to the upper drilling mechanism;

[0005] A multi-layer circuit board drilling process specifically includes the following steps:

[0006] Step 1: Use the lower drill rod and the hollow drill bit to pre-drill the micro-hole lower structure on the multi-layer circuit board assembly, and the upper drilling mechanism pre-drills the micro-hole upper structure on the multi-layer circuit board assembly;

[0007] Step 2: Based on step 1, the through-hole structure of the hollow drill bit is used to suck the debris drilled out of the lower drill rod;

[0008] Step 3: the upper drilling mechanism drills a fine hole structure based on the micro-hole structure of the multi-layer circuit board group;

[0009] Step 4: Based on step 3, the debris drilled out by the upper drilling mechanism is sucked out by using the through-hole structure of the micropores and the hollow drill bit, and more spray liquid is sucked into the fine holes.

[0010] Furthermore, a vertical groove structure connected to the threaded discharge groove structure is provided on the spline structure of the lower drill rod; and the vertical groove structure is connected to the through hole structure of the hollow drill bit.

[0011] Furthermore, the moving mechanism includes a lower plane moving component, a lower vertical slide rail, a lower electric slider, a rotating bracket, a rotating motor and a lifting electric push rod; the lower plane moving component is installed on the fixed frame; the lower vertical slide rail is installed on the moving part of the lower plane moving component; the lower electric slider is slidably connected to the lower vertical slide rail; the lower electric slider is fixedly connected to the bottom liquid spray pipe; the lower electric slider is rotatably connected to the rotating bracket; the lower electric slider is installed with a rotating motor; the output shaft of the rotating motor is fixedly connected to the rotating bracket; one side of the rotating bracket is slidably connected to the lifting slider; the lifting electric push rod is installed on the rotating bracket; the telescopic end of the lifting electric push rod is fixedly connected to the lifting slider; the other side of the rotating bracket is fixedly connected to the blocking plug.

[0012] Furthermore, the upper end of the hollow drill bit is configured as an upwardly contracted conical structure.

[0013] Furthermore, the upper drilling mechanism includes an upper plane moving assembly, an upper vertical slide rail, an upper electric slider, an electric turntable, an electric main drill rod and an electric upper drill rod; the upper plane moving assembly is installed on the fixed frame, and the upper vertical slide rail is installed on the moving part of the upper plane moving assembly; the upper electric slider is slidably connected to the upper vertical slide rail; the electric turntable is rotatably connected to the upper electric slider; the electric main drill rod is installed on one side of the electric turntable; and the electric upper drill rod is installed on the other side of the electric turntable.

[0014] Furthermore, an insert block is slidably connected inside the stopper; a micro electric push rod is installed on the rotating bracket; and the telescopic end of the micro electric push rod is fixedly connected to the insert block.

[0015] Furthermore, the upper end of the insert block is configured as a pointed structure.

[0016] Furthermore, in the multi-layer circuit board group, a heat sink is placed between every two adjacent circuit board layers.

[0017] Furthermore, the positioning platform of the fixing frame is fixedly connected with a heat sink.

[0018] Furthermore, a cooling tube is fixedly wound on the surface of the heat sink.

[0019] Beneficial effects of the present invention: A multi-layer circuit board drilling process of the present invention includes an upper drilling mechanism and a moving mechanism, wherein a hollow drill bit and a lower drill rod are provided on the moving mechanism, wherein the lower drill rod cooperates with the hollow drill bit to first drill out the lower structure of the micro-hole from the lower side of the multi-layer circuit board group, and at the same time, the upper drilling mechanism drills out the upper structure of the micro-hole from the upper side of the multi-layer circuit board group through the electric upper drill rod, and at the same time, the hollow drill bit timely sucks away the debris generated during the micro-hole drilling work, thereby improving the drilling effect of the micro-hole, and then the upper drilling mechanism performs fine hole drilling work from top to bottom on the basis of the micro-holes drilled by the multi-layer circuit board group through the electric main drill rod, and at the same time, the hollow drill bit is retained at the bottom of the multi-layer circuit board group to suck away the debris, and the spray liquid will be more sucked into the fine hole under the suction action, thereby improving the cooling efficiency of the electric main drill rod and improving the drilling effect of the fine hole;

[0020] The invention solves the technical problems of poor spray liquid flow and debris blockage in drilling fine-hole structures on multi-layer circuit boards, which causes drill deviation and chipping of the drill rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of the present invention;

[0022] Figure 2 It is a schematic diagram of the structure of the rotating bracket of the present invention;

[0023] Figure 3 It is a schematic diagram of the stopper structure of the present invention;

[0024] Figure 4 A cross-sectional view of the suction tube and the hollow drill bit of the present invention from a first viewing angle;

[0025] Figure 5 A cross-sectional view of the suction tube and the hollow drill bit of the present invention from a second viewing angle;

[0026] Figure 6 It is a schematic diagram of the structure of the electric turntable of the present invention;

[0027] Figure 7 It is a schematic diagram of the plug structure of the present invention;

[0028] Figure 8 It is a schematic diagram of the working state of the plug block of the present invention;

[0029] Fig. 9 It is a schematic diagram of the heat sink and cooling tube structure of the present invention;

[0030] Fig.10 A schematic diagram of a micro-hole structure of a first multi-layer circuit board assembly of the present invention;

[0031] Fig.11 A schematic diagram of fine holes of a first multi-layer circuit board assembly of the present invention;

[0032] Fig.12 It is a schematic diagram of the three-dimensional structure of the second multi-layer circuit board assembly of the present invention.

[0033] Description of reference numerals: 1-fixed frame, 101-positioning table, 2-lower plane moving assembly, 21-lower vertical slide rail, 22-lower electric slide block, 31-rotating bracket, 32-rotating motor, 33-lifting slide block, 34-lifting electric push rod, 41-suction cylinder, 410-suction port, 42-hollow drill bit, 420-through hole, 43-lower drill rod, 430-vertical slot, 44-driving motor, 5-bottom Liquid spray pipe, 6-block, 61-insert block, 62-micro electric push rod, 7-upper plane moving component, 71-upper vertical slide rail, 72-upper electric slider, 73-electric turntable, 74-electric main drill rod, 75-electric upper drill rod, 8-main liquid spray pipe, 9-heat sink, 10-cooling pipe, 11-multi-layer circuit board group, 1101-micropore, 1102-conical hole, 1103-fine hole, 12-heat sink. DETAILED DESCRIPTION

[0034] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0035] Example 1

[0036] A multi-layer circuit board drilling process, which is based on the use of drilling equipment, such as Figure 1-Figure 6As shown, the drilling equipment includes a fixed frame 1, a positioning platform 101, a moving mechanism, a lifting slider 33, a suction cylinder 41, a hollow drill bit 42, a lower drill rod 43, a driving motor 44, a bottom spray pipe 5, a stopper 6, an upper drilling mechanism and a main spray pipe 8; the fixed frame 1 is fixedly connected to the positioning platform 101; the lower side of the fixed frame 1 is connected to the moving mechanism; the suction cylinder 41 is fixedly connected to the moving mechanism; a suction port 410 structure is provided on the suction cylinder 41; a hollow drill bit 42 is rotatably connected in the suction cylinder 41, and a vertical channel is provided in the hollow drill bit 42; the upper end of the hollow drill bit 42 is set as a tapered structure that contracts upward; a through hole 420 structure connected to the vertical channel is respectively provided on the left and right sides of the hollow drill bit 42; the two through holes 420 structures of the hollow drill bit 42 are both connected to the suction port 41 of the suction cylinder 41 10 structure; a lifting slider 33 is connected to the moving mechanism; a lower drill rod 43 is rotatably connected to the lifting slider 33; a driving motor 44 is installed on the lifting slider 33; the output shaft of the driving motor 44 is fixedly connected to the lower drill rod 43; the lower drill rod 43 is provided with an upper threaded discharge groove structure and a lower spline structure; the lower drill rod 43 is initially inserted into the hollow drill bit 42 through the spline structure; two vertical grooves 430 structures connected to the threaded discharge groove structure are provided on the spline structure of the lower drill rod 43; the two vertical grooves 430 structures are respectively connected to a through hole 420 structure adjacent to the hollow drill bit 42; a bottom spray pipe 5 is connected to the moving mechanism; a stopper 6 adapted to the bottom of the hollow drill bit 42 is connected to the moving mechanism; an upper drilling mechanism is connected to the fixed frame 1; and a main spray pipe 8 is connected to the upper drilling mechanism.

[0037] like Figure 1 As shown, the moving mechanism includes a lower plane moving component 2, a lower vertical slide rail 21, a lower electric slider 22, a rotating bracket 31, a rotating motor 32 and a lifting electric push rod 34; the lower plane moving component 2 is installed on the fixed frame 1, and the lower plane moving component 2 is composed of a longitudinal electric slider and a transverse electric slider; the lower vertical slide rail 21 is installed on the moving part of the lower plane moving component 2; the lower vertical slide rail 21 is slidably connected with the lower electric slider 22; the lower electric slider 22 is fixedly connected to the bottom liquid spray pipe 5; the rotating bracket 31 is rotatably connected to the lower electric slider 22; the rotating motor 32 is installed on the lower electric slider 22; the output shaft of the rotating motor 32 is fixedly connected to the rotating bracket 31; one side of the rotating bracket 31 is slidably connected to the lifting slider 33; the lifting electric push rod 34 is installed on the rotating bracket 31; the telescopic end of the lifting electric push rod 34 is fixedly connected to the lifting slider 33; the other side of the rotating bracket 31 is fixedly connected to the blocking plug 6.

[0038] like Figure 1 and Figure 6As shown, the upper drilling mechanism includes an upper plane moving component 7, an upper vertical slide rail 71, an upper electric slider 72, an electric turntable 73, an electric main drill rod 74 and an electric upper drill rod 75; the upper plane moving component 7 is installed on the fixed frame 1; the upper plane moving component 7 is composed of a longitudinal electric slider and a transverse electric slider; the upper vertical slide rail 71 is installed on the moving part of the upper plane moving component 7; the upper electric slider 72 is slidably connected to the upper vertical slide rail 71; the electric turntable 73 is rotatably connected to the upper electric slider 72; the electric main drill rod 74 is installed on one side of the electric turntable 73; the electric upper drill rod 75 is installed on the other side of the electric turntable 73.

[0039] The present invention discloses a multi-layer circuit board drilling process, which is based on the use of drilling equipment. The working steps of the drilling equipment are as follows.

[0040] First, the micro-holes 1101 of the multi-layer circuit board assembly 11 are drilled.

[0041] The operator first connects the bottom spray pipe 5 and the main spray pipe 8 to the spray liquid delivery device, and connects the suction cylinder 41 to the suction device through the suction port 410, and then fixes the multi-layer circuit board group 11 on the positioning table 101 of the fixed frame 1, and then the lower plane moving component 2 drives the lower vertical slide rail 21 and the lower electric slide 22 to move through the longitudinal electric slide and the transverse electric slide, and aligns the hollow drill bit 42 on the lower electric slide 22 with the lower drill rod 43 to the multi-layer circuit board group 11 to be drilled into a fine hole 1 103 is the lower side of the drilling area, and at the same time, the electric turntable 73 drives the electric main drill rod 74 and the electric upper drill rod 75 to rotate one hundred and eighty degrees, so that the electric upper drill rod 75 is rotated from the initial upward state to the downward state, and at the same time, the upper plane moving component 7 drives the upper vertical slide rail 71 and the upper electric slider 72 to move through the longitudinal electric slider and the transverse electric slider, and aligns the electric upper drill rod 75 on the upper electric slider 72 with the upper side of the multi-layer circuit board group 11 where the fine hole 1103 drilling area is to be performed.

[0042] Subsequently, the lower electric slider 22 drives the hollow drill bit 42 and the lower drill rod 43 to move upward along the lower vertical slide rail 21, and at the same time, the driving motor 44 drives the lower drill rod 43 to rotate. The lower drill rod 43 drives the hollow drill bit 42 to rotate synchronously through the spline structure, and the lower drill rod 43 and the hollow drill bit 42 first perform the lower structure drilling work of the microhole 1101 on the lower side of the multi-layer circuit board group 11 from bottom to top. At the same time, the external suction equipment performs suction work on the suction port 410 of the suction cylinder 41, so that the debris generated by the lower drill rod 43 during the drilling work is first The threaded discharge groove structure of the rear lower drill rod 43, the vertical groove 430 structure of the lower drill rod 43, the through hole 420 structure of the hollow drill bit 42 and the suction port 410 of the suction cylinder 41 are sucked away by an external suction device, and at the same time, the upper electric slider 72 drives the electric upper drill rod 75 to move downward along the upper vertical slide rail 71, and the electric upper drill rod 75 first drills the upper structure of the microhole 1101 on the upper side of the multi-layer circuit board group 11 from top to bottom, wherein the diameter of the drilled microhole 1101 can be smaller than the diameter of the fine hole 1103 to be drilled.

[0043] During the drilling of micro-hole 1101, the external spray liquid delivery device sprays the spray liquid to the drilling area of ​​the lower drill rod 43 and the electric upper drill rod 75 on the multi-layer circuit board group 11 through the bottom spray pipe 5 and the main spray pipe 8, respectively, to cool the lower drill rod 43 and the electric upper drill rod 75, and flush out the debris generated by the drilling of the lower drill rod 43 and the electric upper drill rod 75. Since the lower drill rod 43 and the electric upper drill rod 75 are close to each other, they only drill half the height of the micro-hole 1101 structure in the multi-layer circuit board group 11, The drilling depth of the lower drill rod 43 and the electric upper drill rod 75 is not high, and it is not easy to have drilling deviation and chipping. When the lower drill rod 43 and the electric upper drill rod 75 are close to each other and are about to touch each other, the lifting electric push rod 34 pulls the lifting slider 33 to drive the lower drill rod 43 to withdraw downward and leave the hollow drill bit 42, and the hollow drill bit 42 remains on the lower side of the multi-layer circuit board. At the same time, the upper electric slider 72 drives the electric upper drill rod 75 to continue to move downward along the upper vertical slide rail 71, and the electric upper drill rod 75 penetrates the upper structure and the lower structure of the microhole 1101 structure from top to bottom. Fig.10 As shown, a completely connected micro-hole 1101 structure is formed, and a downwardly expanding tapered hole 1102 structure is drilled at the lower end of the micro-hole 1101 structure by a hollow drill bit 42 .

[0044] Afterwards, the upper electric slider 72 drives the electric upper drill rod 75 to reset upward along the upper vertical slide rail 71, and then the electric turntable 73 drives the electric main drill rod 74 and the electric upper drill rod 75 to rotate 180 degrees again, so that the electric main drill rod 74 rotates to a downward state, and at the same time, the rotating motor 32 drives the rotating bracket 31 to rotate 180 degrees, so that the stopper 6 is close to the bottom of the hollow drill bit 42. At this time, the bottom of the hollow drill bit 42 is blocked by the stopper 6, and then the upper electric slider 72 drives the electric main drill rod 74 along the upper vertical slide rail 71 on the basis of the micro-hole 1101 structure of the multi-layer circuit board, as shown in FIG. Fig.11 As shown, the fine hole 1103 is drilled on the multi-layer circuit board from top to bottom, and at the same time, the external suction equipment performs suction on the suction port 410 of the suction cylinder 41 to form a suction force, so that the debris generated by the electric main drill rod 74 during the fine hole 1103 drilling work can be sucked away by the external suction equipment through the micropore 1101 structure, the through hole 420 structure of the hollow drill bit 42 and the suction port 410 of the suction cylinder 41 under the suction force, and the spray liquid sprayed onto the electric main drill rod 74 through the upper spray can enter the fine hole 1103 more under the action of the suction force, allowing more spray liquid to flow through the electric main drill rod 74, thereby improving the cooling efficiency of the electric main drill rod 74, and finally improving the drilling effect of the fine hole 1103.

[0045] In addition, since the lower end of the electric main drill rod 74 will squeeze the bottom structure of the hole 1103 of the multi-layer circuit board group 11 downward during the drilling work of the electric main drill rod 74, the diameter of the lower side of the tapered hole 1102 structure drilled by the hollow drill bit 42 at the bottom of the multi-layer circuit board group 11 is the same as the diameter of the hole 1103. Therefore, after the bottom of the hole 1103 of the multi-layer circuit board group 11 has been drilled upward by the hollow drill bit 42, when the electric main drill rod 74 passes through the bottom of the hole 1103 of the multi-layer circuit board group 11 during the drilling work of the hole 1103, the electric main drill rod 74 will not squeeze and deform the bottom structure of the hole 1103 downward during the drilling work of the bottom of the hole 1103, thereby ensuring that the top and bottom of the hole 1103 of the multi-layer circuit board group 11 are both flat structures.

[0046] Example 2

[0047] On the basis of Example 1, Figure 1-Figure 7 As shown, in this embodiment, a plug 61 is slidably connected inside the stopper 6; a micro electric push rod 62 is installed on the rotating bracket 31; the telescopic end of the micro electric push rod 62 is fixedly connected to the plug 61; the upper end of the plug 61 is set as a pointed structure that splits to the left and right sides.

[0048] During the drilling of the fine hole 1103 of the multilayer circuit board assembly 11, the micro electric push rod 62 first pulls the insert block 61 downward to leave the stopper 6, and after the rotating motor 32 controls the rotating bracket 31 to drive the stopper 6 to move to the lower surface of the hollow drill bit 42, the micro electric push rod 62 pushes the insert block 61 upward to be inserted into the hollow drill bit 42. Figure 8 As shown, at this time, the tip structure at the upper end of the plug block 61 is aligned with the through holes 420 structures on both sides of the hollow drill. After that, when the external suction equipment performs suction work through the suction cylinder 41, the spray liquid and debris entering the vertical channel of the hollow drill bit 42 from top to bottom will directly enter the through holes 420 structures on both sides of the hollow drill along the tip structure at the upper end of the plug block 61, thereby preventing a large amount of debris entering the vertical channel of the hollow drill bit 42 from top to bottom from rushing into the area below the through hole 420 structure of the vertical channel, forcing the debris entering the vertical channel of the hollow drill bit 42 to flow out from the through hole 420 structure of the hollow drill along the tip structure at the upper end of the plug block 61 with the spray liquid, so that there will be no debris residue in the vertical channel of the hollow drill bit 42, so that the vertical channel of the hollow drill bit 42 can be kept clean.

[0049] Example 3

[0050] On the basis of Example 1, Figure 1-Figure 6 and Fig.12 As shown, in the multi-layer circuit board group 11 of the present embodiment, a heat sink 12 is placed between each two adjacent circuit board layers; a heat sink 9 is fixedly connected to the left and right sides of the positioning platform 101 of the fixing frame 1; a cooling pipe 10 is fixedly coiled on the surface of the heat sink 9; and the cooling pipe 10 is externally connected to a coolant circulation device.

[0051] During the drilling of the microholes 1101 of the multi-layer circuit board group 11, after the multi-layer circuit board group 11 is placed on the positioning platform 101 of the fixing frame 1, the two heat sinks 9 are respectively attached to the left and right sides of the heat sinks 12 of each layer in the multi-layer circuit board group 11, and the external coolant circulation equipment continuously delivers coolant to the cooling tube 10, so that the heat sinks 12 between the circuit board layers in the multi-layer circuit board group 11 can transfer the heat generated by the adjacent circuit board layers during the drilling work to the adjacent heat sinks 9 in time, and the coolant continuously flowing in the cooling tube 10 absorbs the heat transferred to the heat sink 9, thereby further improving the heat dissipation treatment effect of the multi-layer circuit board group 11.

[0052] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A multi-layer circuit board drilling process, characterized in that: The process is based on the use of drilling equipment; The drilling equipment comprises a fixed frame (1), a positioning platform (101), a moving mechanism, a lifting slide block (33), a suction cylinder (41), a hollow drill bit (42), a lower drill rod (43), a driving motor (44), a bottom liquid spraying pipe (5), a stopper (6), an upper drilling mechanism and a main liquid spraying pipe (8); A positioning platform (101) is fixedly connected to the fixed frame (1); the fixed frame (1) is connected to a moving mechanism; a suction cylinder (41) is fixedly connected to the moving mechanism; a suction port (410) structure is provided on the suction cylinder (41); a hollow drill bit (42) is rotatably connected inside the suction cylinder (41), and a vertical channel is provided inside the hollow drill bit (42); a through hole (420) structure connected to the vertical channel is provided in the hollow drill bit (42); the through holes (420) structures of the hollow drill bit (42) are all connected to the suction port (410) structure of the suction cylinder (41); a lifting slider (33) is connected to the moving mechanism; a micro-hole (1101) structure for drilling micro-holes on a multi-layer circuit board group (11) is rotatably connected to the lifting slider (33); ) a lower drill rod (43) for lower drilling work; a driving motor (44) is installed on the lifting slider (33); the output shaft of the driving motor (44) is fixedly connected to the lower drill rod (43); the lower drill rod (43) is inserted into the hollow drill bit (42) through a spline structure; the moving mechanism is connected to a bottom spray pipe (5) for spraying spray liquid toward the lower drill rod (43); the moving mechanism is connected to a stopper (6) adapted to the bottom of the hollow drill bit (42); the fixed frame (1) is connected to an upper drilling mechanism for respectively performing upper drilling work of microholes (1101) and fine holes (1103) on the multilayer circuit board group (11); the upper drilling mechanism is connected to a main spray pipe (8); The multi-layer circuit board drilling process specifically includes the following steps: Step 1, using a lower drill rod (43) and a hollow drill bit (42) to pre-drill a micro-hole (1101) lower structure on the multi-layer circuit board assembly (11), while an upper drilling mechanism pre-drills a micro-hole (1101) upper structure on the multi-layer circuit board assembly (11); Step 2: Based on step 1, the through hole (420) of the hollow drill bit (42) is used to suck the debris drilled out by the lower drill rod (43); Step 3, the upper drilling mechanism drills a fine hole (1103) structure based on the microhole (1101) structure of the multilayer circuit board assembly (11); Step 4: Based on step 3, the micropores (1101) and the through hole (420) structure of the hollow drill bit (42) are used to suck the debris drilled out by the upper drilling mechanism, and more spray liquid is sucked into the fine holes (1103).

2. A multi-layer circuit board drilling process according to claim 1, characterized in that: A vertical groove (430) structure connected to the threaded discharge groove structure is provided on the spline structure of the lower drill rod (43); the vertical groove (430) structure is connected to the through hole (420) structure of the hollow drill bit (42).

3. A multi-layer circuit board drilling process according to claim 1, characterized in that: The moving mechanism comprises a lower plane moving assembly (2), a lower vertical slide rail (21), a lower electric slide block (22), a rotating bracket (31), a rotating motor (32) and a lifting electric push rod (34); the lower plane moving assembly (2) is mounted on the fixed frame (1); the lower vertical slide rail (21) is mounted on the moving part of the lower plane moving assembly (2); the lower electric slide block (22) is slidably connected to the lower vertical slide rail (21); the lower electric slide block (22) is fixedly connected to the bottom liquid spray pipe (5); a rotating bracket (31) is rotatably connected to the lower electric slider (22); a rotating motor (32) is mounted on the lower electric slider (22); an output shaft of the rotating motor (32) is fixedly connected to the rotating bracket (31); one side of the rotating bracket (31) is slidably connected to the lifting slider (33); a lifting electric push rod (34) is mounted on the rotating bracket (31); a telescopic end of the lifting electric push rod (34) is fixedly connected to the lifting slider (33); and a stopper (6) is fixedly connected to the other side of the rotating bracket (31).

4. A multi-layer circuit board drilling process according to claim 1, characterized in that: The upper end of the hollow drill bit (42) is configured as a tapered structure that contracts upward.

5. A multi-layer circuit board drilling process according to claim 1, characterized in that: The upper drilling mechanism comprises an upper plane moving assembly (7), an upper vertical slide rail (71), an upper electric slider (72), an electric turntable (73), an electric main drill rod (74) and an electric upper drill rod (75); the upper plane moving assembly (7) is mounted on the fixed frame (1); the upper vertical slide rail (71) is mounted on the moving part of the upper plane moving assembly (7); the upper electric slider (72) is slidably connected to the upper vertical slide rail (71); the upper electric slider (72) is rotatably connected to the electric turntable (73); the electric main drill rod (74) is mounted on one side of the electric turntable (73); and the electric upper drill rod (75) is mounted on the other side of the electric turntable (73).

6. A multi-layer circuit board drilling process according to claim 1, characterized in that: An insert block (61) is slidably connected inside the stopper (6); a micro electric push rod (62) is mounted on the rotating bracket (31); and the telescopic end of the micro electric push rod (62) is fixedly connected to the insert block (61).

7. A multi-layer circuit board drilling process according to claim 6, characterized in that: The upper end of the insert block (61) is configured as a pointed structure.

8. A multi-layer circuit board drilling process according to any one of claims 1 to 7, characterized in that: In the multi-layer circuit board group (11), a heat sink (12) is placed between each two adjacent circuit board layers.

9. A multi-layer circuit board drilling process according to claim 8, characterized in that: A heat sink (9) is fixedly connected to the positioning platform (101) of the fixing frame (1).

10. A multi-layer circuit board drilling process according to claim 9, characterized in that: A cooling pipe (10) is fixedly coiled on the surface of the heat dissipation plate (9).

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