Piezoelectric vibration heat dissipating device

Abstract

The application discloses a piezoelectric vibration heat dissipation device, and relates to the technical field of heat dissipation devices. The piezoelectric vibration heat dissipation device comprises a mounting seat and a heat dissipation working mechanism. The mounting seat is provided with a mounting space, and the mounting seat is provided with a heat conduction wall for contacting a heat dissipation element. The mounting seat is also provided with a heat dissipation opening in communication with the mounting space. The heat dissipation working mechanism is installed in the mounting space, and the heat dissipation working mechanism and the heat conduction wall are opposite and spaced apart to form a heat dissipation space in communication with the heat dissipation opening. The heat dissipation working mechanism is provided with an air inlet and an air outlet. The air inlet is in communication with an external environment, and the air outlet is in communication with the heat dissipation space. The heat dissipation working mechanism is configured to drive gas to flow into the heat dissipation space through the air inlet and the air outlet in sequence, so that the gas in the heat dissipation space flows out of the heat dissipation space through the heat dissipation opening. Therefore, high-speed jet flow impact heat dissipation can be realized, the heat dissipation efficiency is high, the noise is low, the piezoelectric vibration heat dissipation device is simple and stable in structure, occupies a small space, and is portable and easy to install.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation device technology, and in particular to a piezoelectric vibration heat dissipation device. Background Technology

[0002] In related technologies, heat dissipation of electronic components is a crucial aspect of electronic device design. With the continuous development of electronic devices, their integration and power density are constantly increasing, leading to the generation of a large amount of heat inside the devices. If this heat cannot be effectively dissipated, it will cause the operating temperature of components to become too high, thereby affecting device performance and lifespan, and even causing malfunctions. Existing heat dissipation methods rely on forced convection through cooling fans to accelerate heat dissipation. Some high-performance devices also employ heat pipes, heat sinks, and other heat dissipation technologies to meet even higher heat dissipation demands. However, these heat dissipation methods all have limitations, such as insufficient efficiency, complex structures, or large space requirements. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide a piezoelectric vibration heat dissipation device that can achieve high-speed jet impact heat dissipation, with high heat dissipation efficiency, low noise, and a simple and stable structure, small footprint, portability, and easy installation.

[0004] According to an embodiment of the present invention, a piezoelectric vibration heat dissipation device includes: a mounting base having an installation space, the mounting base having a heat-conducting wall for contacting a heat-dissipating element, the mounting base also having a heat dissipation port communicating with the installation space; a heat dissipation working mechanism, at least a portion of which is mounted in the installation space, and the heat dissipation working mechanism and the heat-conducting wall being opposite to and spaced apart to form a heat dissipation space between the heat dissipation working mechanism and the heat-conducting wall, the heat dissipation port communicating with the heat dissipation space, the heat dissipation working mechanism having an air inlet and an air outlet, the air inlet communicating with the external environment, the air outlet communicating with the heat dissipation space, and the heat dissipation working mechanism being configured to drive gas to flow into the heat dissipation space sequentially through the air inlet and the air outlet, so that gas in the heat dissipation space flows out of the heat dissipation space from the heat dissipation port.

[0005] According to the piezoelectric vibration heat dissipation device of the present invention, the gas is driven by the heat dissipation working mechanism to flow into the heat dissipation space through the air inlet and the air outlet in sequence, so that the gas in the heat dissipation space flows out of the heat dissipation space from the heat dissipation outlet. It can realize high-speed jet impact heat dissipation, with high heat dissipation efficiency and low noise. Moreover, the piezoelectric vibration heat dissipation device has a simple and stable structure, occupies little space, and is portable and easy to install.

[0006] According to some embodiments of the present invention, the mounting base further has an assembly port communicating with the mounting space, the assembly port and the heat-conducting wall being opposite to and spaced apart, and the heat dissipation mechanism being mounted in the mounting space through the assembly port.

[0007] According to some embodiments of the present invention, a connecting channel is also formed in the mounting base, the connecting channel connecting the heat dissipation port and the heat dissipation space, and at least part of the connecting channel is constructed as a variable diameter section, the cross-sectional area of ​​the variable diameter section gradually decreasing along the gas flow direction in the connecting channel.

[0008] According to some embodiments of the present invention, the heat dissipation mechanism includes: a fixed frame and a working layer, the working layer being fixed to the fixed frame, the fixed frame being mounted on a mounting base, and the working layer being configured to drive gas to flow into the heat dissipation space.

[0009] According to some embodiments of the present invention, the working layer includes a vibration generator, which drives gas to flow into the heat dissipation space by vibration.

[0010] According to some embodiments of the present invention, the vibration generator includes: a generator body and a piezoelectric vibration element, the generator body defining a cavity, the cavity being connected to both an air inlet and an air outlet, and the piezoelectric vibration element being disposed at the air outlet.

[0011] According to some embodiments of the present invention, there are multiple piezoelectric vibration elements and multiple air outlets, and the multiple piezoelectric vibration elements and multiple air outlets are arranged in a one-to-one correspondence.

[0012] According to some embodiments of the present invention, the fixing frame includes: a first fixing frame and a second fixing frame, a working layer is disposed between the first fixing frame and the second fixing frame, and the first fixing frame is located on the side of the working layer facing the heat-conducting wall, the second fixing frame is located on the side of the working layer away from the heat-conducting wall, the first fixing frame and the second fixing frame are fixedly connected so that the working layer is fixed between the first fixing frame and the second fixing frame, the second fixing frame has a first vent, the first vent corresponds to the air inlet, and the first fixing frame has a second vent, the second vent corresponds to the air outlet.

[0013] According to some embodiments of the present invention, the piezoelectric vibration heat dissipation device further includes: an encapsulation jacket, which is fitted onto the mounting base and the heat dissipation working mechanism, and the heat-conducting wall is exposed outside the encapsulation jacket, and the encapsulation jacket forms a third vent corresponding to the air inlet.

[0014] In some embodiments of the present invention, the third vent is provided with a filter.

[0015] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0017] Figure 1This is a schematic diagram of the heat dissipation mechanism according to an embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of the mounting base according to an embodiment of the present invention;

[0019] Figure 3 This is a schematic diagram of the structure of the second layer of the fixing frame according to an embodiment of the present invention;

[0020] Figure 4 This is a schematic diagram of the structure of the first layer of the fixing frame according to an embodiment of the present invention;

[0021] Figure 5 This is a schematic diagram of the first-layer fixing frame from another angle according to an embodiment of the present invention;

[0022] Figure 6 This is a schematic diagram of the structure of the vibration generator according to an embodiment of the present invention;

[0023] Figure 7 This is a schematic diagram of the vibration generator from another angle according to an embodiment of the present invention;

[0024] Figure 8 This is a schematic diagram of the structure of the piezoelectric vibration element according to an embodiment of the present invention;

[0025] Figure 9 This is a schematic diagram of a piezoelectric vibration heat dissipation device according to an embodiment of the present invention;

[0026] Figure 10 This is a schematic diagram of the heat dissipation mechanism of an embodiment of the present invention from another angle.

[0027] Figure label:

[0028] Piezoelectric vibration heat dissipation device 100;

[0029] Mounting base 10; mounting space 11; heat-conducting wall 12; heat dissipation port 13; heat dissipation space 14; assembly port 15; connecting flow channel 16; mounting slot 17;

[0030] Heat dissipation mechanism 20; air inlet 21; air outlet 22;

[0031] Mounting part 23; First connecting bracket 231; Second connecting bracket 232;

[0032] Fixed strip 24;

[0033] Fixture 30;

[0034] First layer of fixing frame 31;

[0035] Second vent 311; Second sub-vent 3110;

[0036] Second rectangular metal plate 312; inner support plate 313; support frame 314; outer support plate 315; connecting plate 316; groove 317;

[0037] Second layer fixing frame 32; First vent 321; First rectangular metal plate 322;

[0038] Working layer 40; Vibration generator 41; Generator body 42;

[0039] Piezoelectric vibration element 43; base 431; piezoelectric drive plate 432; elastic vibration diaphragm 433;

[0040] Encapsulation jacket 50; third vent 51; marking area 52. Detailed Implementation

[0041] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0042] The following is for reference. Figures 1-10 A piezoelectric vibration heat dissipation device 100 according to an embodiment of the present invention includes: a mounting base 10 having a mounting space 11, the mounting base 10 having a heat-conducting wall 12 for contacting a heat-dissipating element, the mounting base 10 also having a heat dissipation port 13 communicating with the mounting space 11; a heat dissipation working mechanism 20, at least a portion of which is mounted in the mounting space 11, and the heat dissipation working mechanism 20 and the heat-conducting wall 12 are opposite to and spaced apart to form a heat dissipation space 14 between the heat dissipation working mechanism 20 and the heat-conducting wall 12, the heat dissipation port 13 communicating with the heat dissipation space 14, the heat dissipation working mechanism 20 having an air inlet 21 and an air outlet 22, the air inlet 21 communicating with the external environment, the air outlet 22 communicating with the heat dissipation space 14, and the heat dissipation working mechanism 20 being configured to drive gas to flow into the heat dissipation space 14 sequentially through the air inlet 21 and the air outlet 22, so that the gas in the heat dissipation space 14 flows out of the heat dissipation space 14 through the heat dissipation port 13.

[0043] The piezoelectric vibration heat dissipation device 100 includes a mounting base 10 and a heat dissipation working mechanism 20. The mounting base 10 forms an installation space 11. At least a portion of the heat dissipation working mechanism 20 is installed in the installation space 11. For example, half of the heat dissipation working mechanism 20 may be installed in the installation space 11, or one-third of the heat dissipation working mechanism 20 may be installed in the installation space 11. However, the present invention is not limited to this. The heat dissipation working mechanism 20 may also be installed in other proportions in the installation space 11, as long as at least a portion of the heat dissipation working mechanism 20 is installed in the installation space 11.

[0044] like Figure 2 As shown, the mounting base 10 has a heat-conducting wall 12 for contacting the heat-dissipating element. By contacting the heat-dissipating element through the heat-conducting wall 12, the heat of the heat-dissipating element can be conducted to the heat-conducting wall 12. The mounting base 10 can be made of metal materials with good thermal conductivity such as copper, aluminum, or alloys, so that the heat of the heat-dissipating element can be quickly and effectively conducted to the heat-conducting wall 12 and dissipated.

[0045] The mounting base 10 also has a heat dissipation vent 13, which can be located on the side wall of the mounting base 10. The heat dissipation vent 13 communicates with the mounting space 11. The heat dissipation working mechanism 20 and the heat-conducting wall 12 are opposite to and spaced apart. The mounting base 10, as shown... Figure 2 When placed in the indicated position, the heat dissipation mechanism 20 is installed above the mounting base 10 and above the heat-conducting wall 12, with the heat dissipation mechanism 20 and the heat-conducting wall 12 facing each other and spaced apart, so as to form a heat dissipation space 14 between the heat dissipation mechanism 20 and the heat-conducting wall 12. The heat dissipation port 13 is connected to the heat dissipation space 14, and the heat of the heat dissipated element can be quickly and effectively conducted to the heat-conducting wall 12 and dissipated to the external environment from the heat dissipation space 14 and the heat dissipation port 13.

[0046] like Figure 1 and Figure 10 As shown, the heat dissipation working mechanism 20 has an air inlet 21 and an air outlet 22. The air inlet 21 is connected to the external environment, allowing low-temperature gas from the external environment to enter the heat dissipation working mechanism 20. The air outlet 22 is connected to the heat dissipation space 14, allowing the low-temperature gas to be vertically shot through the air outlet 22 to the heat-conducting wall 12 and then exchange heat with the heat-conducting wall 12 in the heat dissipation space 14, absorbing and carrying away the heat on the heat-conducting wall 12. The heat dissipation mechanism 20 is configured to drive gas to flow into the heat dissipation space 14 through the air inlet 21 and the air outlet 22 in sequence. The heat dissipation mechanism 20 may include a piezoelectric vibration element 43. The vibration of the piezoelectric vibration element 43 can accelerate the flow of gas, realize high-speed jet impact heat dissipation, increase the gas exchange speed in the heat dissipation space 14, so that the gas in the heat dissipation space 14 can quickly flow out of the heat dissipation space 14 from the heat dissipation outlet 13, thereby effectively reducing the temperature in the heat dissipation space 14 and the heat-conducting wall 12, improving the heat dissipation efficiency of the piezoelectric vibration heat dissipation device 100, so that the heat-dissipated component is within a suitable working range, thereby effectively extending the service life of the heat-dissipated component.

[0047] Furthermore, compared to fan cooling, heat dissipation via piezoelectric vibration element 43 results in lower noise. The small size and light weight of piezoelectric vibration element 43 facilitate the compact design of piezoelectric vibration heat dissipation device 100. Since there are no mechanically worn parts, the service life of piezoelectric vibration element 43 is relatively long. As a result, piezoelectric vibration heat dissipation device 100 has advantages such as simple structure, strong stability, small space occupation, portability and easy installation.

[0048] According to the embodiment of the present invention, the piezoelectric vibration heat dissipation device 100 drives gas to flow into the heat dissipation space 14 through the air inlet 21 and the air outlet 22 in sequence via the heat dissipation working mechanism 20, so that the gas in the heat dissipation space 14 flows out of the heat dissipation space 14 from the heat dissipation outlet 13. This can achieve high-speed jet impact heat dissipation, with high heat dissipation efficiency and low noise. Furthermore, the piezoelectric vibration heat dissipation device 100 has a simple and stable structure, occupies little space, and is portable and easy to install.

[0049] According to some embodiments of the present invention, such as Figure 2 As shown, the mounting base 10 may also have an assembly port 15 communicating with the mounting space 11. The assembly port 15 and the heat-conducting wall 12 are opposite to and spaced apart. The heat dissipation working mechanism 20 is installed in the mounting space 11 through the assembly port 15.

[0050] The mounting base 10 may also have an assembly port 15 communicating with the installation space 11. The assembly port 15 may be adapted to the shape and size of the heat dissipation working mechanism 20 so that the heat dissipation working mechanism 20 can be smoothly installed in the installation space 11 through the assembly port 15. Specifically, the mounting base 10 may have multiple mounting slots 17, and the heat dissipation working mechanism 20 may have multiple mounting parts 23. As an example of this application, the mounting base 10 may have four mounting slots 17, which are respectively formed at the middle position of the four side walls of the mounting base 10. The heat dissipation working mechanism 20 may have four mounting parts 23, which are respectively located at the middle position of the four side walls of the heat dissipation working mechanism 20. The shape and size of the mounting slots 17 are adapted to the shape and size of the mounting parts 23. The four mounting slots 17 and the four mounting parts 23 are arranged in a one-to-one correspondence, and each mounting part 23 is engaged with the corresponding mounting slot 17 so that the heat dissipation working mechanism 20 can be smoothly and securely installed in the installation space 11 through the assembly port 15.

[0051] According to some embodiments of the present invention, such as Figure 2 As shown, a connecting channel 16 is also formed inside the mounting base 10. The connecting channel 16 connects the heat dissipation port 13 and the heat dissipation space 14. At least part of the connecting channel 16 is constructed as a variable diameter section. Along the gas flow direction inside the connecting channel 16, the cross-sectional area of ​​the variable diameter section gradually decreases.

[0052] The mounting base 10 may also form a connecting channel 16, which connects the heat dissipation port 13 and the heat dissipation space 14. This allows high-temperature gas in the heat dissipation space 14 to flow out of the heat dissipation port 13 through the connecting channel 16. At least a portion of the connecting channel 16 is constructed as a variable-diameter section. For example, half, one-third, and one-quarter of the connecting channel 16 may be constructed as variable-diameter sections in equal proportions. However, the invention is not limited to this; the connecting channel 16 may also have other proportions of variable-diameter sections, as long as at least a portion of the connecting channel 16 is constructed as a variable-diameter section. Along the gas flow direction within the connecting channel 16, the cross-sectional area of ​​the variable-diameter section gradually decreases, increasing the gas velocity. The high-speed airflow effectively carries away heat, helping to improve the heat dissipation efficiency of the piezoelectric vibration heat dissipation device 100. Furthermore, the variable-diameter section guides the airflow through a smoother transition, reducing airflow instability and thus lowering the noise generated when the airflow passes through.

[0053] Furthermore, a filter screen can be installed at the heat dissipation port 13, which can effectively reduce the risk of impurities in the external environment clogging the heat dissipation port 13 or entering the heat dissipation space 14 from the heat dissipation port 13, thereby avoiding affecting the heat dissipation efficiency and thus helping to improve the safety, reliability and heat dissipation efficiency of the piezoelectric vibration heat dissipation device 100.

[0054] According to some embodiments of the present invention, such as Figure 1 As shown, the heat dissipation working mechanism 20 may include: a fixed frame 30 and a working layer 40. The working layer 40 is fixed to the fixed frame 30, the fixed frame 30 is mounted on the mounting base 10, and the working layer 40 is configured to drive gas to flow into the heat dissipation space 14.

[0055] The working layer 40 is fixed to the fixing frame 30. For example, the working layer 40 and the fixing frame 30 can be fixedly connected by a snap-fit ​​or by bolts. However, the invention is not limited to these methods; the working layer 40 and the fixing frame 30 can also be fixedly connected in other ways, as long as the working layer 40 is fixed to the fixing frame 30. The working layer 40 is fixed to the fixing frame 30 so that the fixing frame 30 can provide stable support for the working layer 40, thereby providing a stable and reliable working environment for the working layer 40. The fixing frame 30 is mounted on the mounting base 10. For example, the mounting base 10 and the fixing frame 30 can be fixedly connected by a snap-fit ​​or by bolts. However, the invention is not limited to these methods; the mounting base 10 and the fixing frame 30 can also be fixedly connected in other ways, as long as the fixing frame 30 is fixed to the mounting base 10. The fixing frame 30 is mounted on the mounting base 10 to improve the stability of the entire heat dissipation mechanism 20 during operation.

[0056] The working layer 40 is configured to drive gas into the heat dissipation space 14. Specifically, the working layer 40 may include a piezoelectric vibration element 43. The vibration of the piezoelectric vibration element 43 can drive gas into the heat dissipation space 14 and accelerate the flow of gas to achieve high-speed jet impact heat dissipation. This increases the gas exchange speed in the heat dissipation space 14, so that the gas in the heat dissipation space 14 can quickly flow out of the heat dissipation space 14 from the heat dissipation port 13. This effectively reduces the temperature in the heat dissipation space 14 and the heat-conducting wall 12, improves the heat dissipation efficiency of the piezoelectric vibration heat dissipation device 100, and keeps the heat-dissipated component within a suitable working range, thereby effectively extending the service life of the heat-dissipated component.

[0057] Furthermore, by using the fixed frame 30, the working layer 40, and the mounting base 10 together, the structural stability of the piezoelectric vibration heat dissipation device 100 can be improved, as can its heat dissipation efficiency.

[0058] According to some embodiments of the present invention, such as Figure 6 As shown, the working layer 40 may include a vibration generator 41, which drives gas to flow into the heat dissipation space 14 through vibration.

[0059] Among them, the vibration generator 41 can generate high-frequency or low-frequency vibrations by using mechanical vibration, acoustic vibration and other principles. The vibration generator 41 drives the gas to generate high-speed flow, so that the high-speed gas flows into the heat dissipation space 14 to achieve the effect of efficient heat dissipation.

[0060] According to some embodiments of the present invention, such as Figures 6-8 As shown, the vibration generator 41 includes: a generator body 42 and a piezoelectric vibration element 43. The generator body 42 defines a cavity, which is connected to both the air inlet 21 and the air outlet 22. The piezoelectric vibration element 43 is located at the air outlet 22.

[0061] The generator body 42 defines a cavity that is connected to both the air inlet 21 and the air outlet 22, allowing gas to flow into the cavity from the air inlet 21 and into the heat dissipation space 14 from the air outlet 22. The piezoelectric vibration element 43 is located at the air outlet 22. The high-frequency vibration of the piezoelectric vibration element 43 drives the gas to flow at high speed from the air outlet 22 to the heat dissipation space 14, achieving high-speed jet impact heat dissipation. This increases the gas exchange speed within the heat dissipation space 14, allowing the gas to flow out of the heat dissipation space 14 quickly from the heat dissipation port 13. This effectively reduces the temperature within the heat dissipation space 14 and the heat-conducting wall 12, improving the heat dissipation efficiency of the piezoelectric vibration heat dissipation device 100. This keeps the heat-dissipated component within a suitable operating range, thereby effectively extending the service life of the heat-dissipated component.

[0062] Furthermore, such as Figure 8As shown, the piezoelectric vibration element 43 may include a base 431, a piezoelectric drive plate 432, and an elastic vibration diaphragm 433. The shape and size of the base 431 can be adapted to the shape and size of the air outlet 22. The base 431 can be bonded to the generator body 42 so that the base 431 covers the air outlet 22. The base 431 may have a circular hole. Both the piezoelectric drive plate 432 and the elastic vibration diaphragm 433 can be constructed as circular thin sheets. The piezoelectric drive plate 432 can be constructed as a circular piezoelectric ceramic thin sheet, and the elastic vibration diaphragm 433 can be constructed as a circular brass thin sheet. The area of ​​the elastic vibration diaphragm 433 is larger than the area of ​​the piezoelectric drive plate 432. The elastic vibration diaphragm 433 can be bonded to the base 431 so that the elastic vibration diaphragm 433 covers the base 431. On 31, the piezoelectric drive plate 432 can be bonded to the elastic vibration membrane 433 so that the piezoelectric drive plate 432 covers the elastic vibration membrane 433. Both the piezoelectric drive plate 432 and the elastic vibration membrane 433 can have small holes for gas to flow through. During the process of gas flowing sequentially from the piezoelectric drive plate 432, the elastic vibration membrane 433 and the outlet 22, the high-frequency vibration generated by the piezoelectric drive plate 432 drives the elastic vibration membrane 433 to vibrate more efficiently, so that the gas flows at high speed from the outlet 22 to the heat dissipation space 14, realizing high-speed jet impact heat dissipation. Furthermore, by changing the working frequency or amplitude of the piezoelectric drive plate 432, the mechanical energy and vibration effect generated by the elastic vibration membrane 433 can be precisely controlled, thereby achieving fine adjustment of the heat dissipation effect.

[0063] According to some embodiments of the present invention, such as Figure 7 As shown, there are multiple piezoelectric vibration elements 43 and multiple air outlets 22, and the multiple piezoelectric vibration elements 43 and multiple air outlets 22 are arranged in a one-to-one correspondence.

[0064] The piezoelectric vibrating element 43 and the air outlet 22 can be multiple, for example, eight, ten, twelve, etc. However, the present invention is not limited to this, and other numbers of piezoelectric vibrating elements 43 and air outlets 22 can also be used, as long as there are multiple piezoelectric vibrating elements 43 and air outlets 22. Multiple piezoelectric vibrating elements 43 and multiple air outlets 22 are arranged in a one-to-one correspondence. The high-frequency vibration of multiple piezoelectric vibrating elements 43 can further drive the gas to flow at high speed from the corresponding air outlet 22 to the heat dissipation space 14, realizing high-speed jet impact heat dissipation, further increasing the gas exchange speed in the heat dissipation space 14, so that the gas in the heat dissipation space 14 flows out of the heat dissipation space 14 quickly from the heat dissipation port 13, thereby effectively reducing the temperature in the heat dissipation space 14 and the heat-conducting wall 12, further improving the heat dissipation efficiency of the piezoelectric vibration heat dissipation device 100, so that the heat-dissipated element is within a suitable working range, and thus further effectively extending the service life of the heat-dissipated element.

[0065] According to some embodiments of the present invention, such as Figure 1and Figure 10 As shown, the fixing frame 30 includes: a first fixing frame 31 and a second fixing frame 32. The working layer 40 is disposed between the first fixing frame 31 and the second fixing frame 32. The first fixing frame 31 is located on the side of the working layer 40 facing the heat-conducting wall 12, and the second fixing frame 32 is located on the side of the working layer 40 away from the heat-conducting wall 12. The first fixing frame 31 and the second fixing frame 32 are fixedly connected so that the working layer 40 is fixed between the first fixing frame 31 and the second fixing frame 32. The second fixing frame 32 has a first vent 321, which corresponds to the air inlet 21. The first fixing frame 31 has a second vent 311, which corresponds to the air outlet 22.

[0066] The working layer 40 is located between the first layer of fixing frame 31 and the second layer of fixing frame 32. The first layer of fixing frame 31 is located on the side of the working layer 40 facing the heat-conducting wall 12, and the second layer of fixing frame 32 is located on the side of the working layer 40 away from the heat-conducting wall 12. The first layer of fixing frame 31 and the second layer of fixing frame 32 can be welded and fixedly connected by fixing strips 24 so that the working layer 40 is fixed between the first layer of fixing frame 31 and the second layer of fixing frame 32. There can be multiple fixing strips 24, which are evenly distributed on the side wall of the fixing frame 30. For example, each side wall of the fixing frame 30 can be provided with four fixing strips 24. The four fixing strips 24 on the same side wall are paired to form a "V" shape structure. This arrangement can firmly fix the first layer of fixing frame 31 and the second layer of fixing frame 32, enhance the structural strength of the fixing frame 30, ensure that the load is evenly distributed on the entire fixing frame 30, avoid local overload, and thus provide more stable support for the working layer 40. Furthermore, the "V" shaped structure can further effectively disperse and resist forces from all directions, improving the stability of the fixed frame 30 structure.

[0067] The working layer 40 may include four independent vibration generators 41, which are evenly arranged between the first layer of fixing frame 31 and the second layer of fixing frame 32. Each vibration generator 41 may have two air inlets 21 and multiple air outlets 22, such as... Figure 6 As shown, taking the vibration generator 41 as an example with its vertical orientation, the two air inlets 21 can be located in the middle of the upper surface of the vibration generator 41, and the multiple air outlets 22 can be located on the lower surface of the vibration generator 41. The multiple air outlets 22 can form multiple rows, for example, the multiple air outlets 22 can form four rows. The specific number of air outlets 22 can be reasonably set according to the actual situation, and no specific limitation is made here.

[0068] like Figure 3As shown, the second-layer fixing frame 32 can be formed by fixing multiple first rectangular metal plates 322 with first vents 321 together. The multiple first rectangular metal plates 322 can be fixedly connected by multiple first connecting brackets 231. The first connecting brackets 231 can be "Z" shaped or similar "Z" shaped structures. Specifically, there can be four first rectangular metal plates 322 and four first connecting brackets 231. The four first connecting brackets 231 are respectively located in the middle of the four side walls of the second layer fixing frame 32, so that the four first connecting brackets 231 correspond one-to-one with the mounting slots 17 on the mounting base 10. The four first connecting brackets 231 can fix the four first rectangular metal plates 322 together to form the second layer fixing frame 32. Any two adjacent first rectangular metal plates 322 are spaced apart, so that the middle of the second layer fixing frame 32 can be constructed as a cross-shaped hollow structure. This can reduce the weight of the second layer fixing frame 32 while ensuring the structural strength of the second layer fixing frame 32, which is beneficial to improving the portability of the piezoelectric vibration heat dissipation device 100.

[0069] Furthermore, there can be multiple first vents 321, and each first rectangular metal plate 322 can have one first vent 321. The first vent 321 also corresponds to the air inlet 21. Specifically, each first vent 321 can correspond to two air inlets 21 on the corresponding vibration generator 41, and the area of ​​the first vent 321 is larger than the area of ​​the air inlet 21, so that the gas can quickly enter the cavity of the generator body 42 from the air inlet 21 after converging at the first vent 321.

[0070] like Figure 4As shown, the first layer of the fixing frame 31 can be formed by fixing multiple second rectangular metal plates 312 with second vents 311 together. The multiple second rectangular metal plates 312 can be fixedly connected by multiple second connecting brackets 232. The second connecting brackets 232 can be "Z" shaped or similar "Z" shaped structures. Specifically, there can be four second rectangular metal plates 312 and four second connecting brackets 232. The four second connecting brackets 232 are respectively located at the middle positions of the four side walls of the first layer fixing frame 31, so that the four second connecting brackets 232 correspond one-to-one with the mounting slots 17 on the mounting base 10. The four second connecting brackets 232 can fix the four second rectangular metal plates 312 together to form the first layer fixing frame 31. Any two adjacent second rectangular metal plates 312 are spaced apart, so that the middle of the first layer fixing frame 31 can be constructed as a cross-shaped hollow structure. This can reduce the weight of the first layer fixing frame 31 while ensuring the structural strength of the first layer fixing frame 31, which is beneficial to improving the portability of the piezoelectric vibration heat dissipation device 100. It should be noted that the second connecting brackets 232 and the first connecting brackets 231 correspond one-to-one. One first connecting bracket 231 and one corresponding second connecting bracket 232 form a mounting part 23.

[0071] There can be multiple second vents 311. Each second rectangular metal plate 312 can have one second vent 311. The second vent 311 corresponds to the air outlet 22. Specifically, each second vent 311 can correspond to the air outlet 22 on the corresponding vibration generator 41, and the area of ​​the second vent 311 is larger than the area of ​​the air outlet 22 so that the air outlet 22 can be connected to the heat dissipation space 14.

[0072] Furthermore, such as Figure 4 As shown, the second vent 311 may have an inner support plate 313 and multiple support frames 314 (the support frames 314 are in...) Figure 10 (Not shown in the drawing), the inner support plate 313 and multiple support frames 314 are all fixedly connected to the second rectangular metal plate 312. The inner support plate 313 and support frames 314 are connected in a cross shape in the second vent 311. The inner support plate 313 and multiple support frames 314 divide the second vent 311 into four second sub-vents 3110. Each second sub-vent 3110 is correspondingly set with the air outlet 22. The area of ​​the second vent 311 is larger than the area of ​​the air outlet 22 of the corresponding vibration generator 41, so that the air outlet 22 can communicate with the heat dissipation space 14.

[0073] And, as Figure 4As shown, the inner support plate 313, support frame 314, and second rectangular metal plate 312 can jointly define multiple grooves 317. The shape and size of the grooves 317 are adapted to the shape and size of the vibration generator 41 so that the vibration generator 41 can be embedded in the grooves 317. Specifically, each groove 317 is equipped with one vibration generator 41. The inner support plate 313 and support frame 314 can support the vibration generator 41. The thickness of the vibration generator 41 is slightly greater than the depth of the groove 317 so that the vibration generator 41 can abut against the second layer of fixing frame 32, thereby firmly fixing the vibration generator 41 between the second layer of fixing frame 32 and the first layer of fixing frame 31, preventing the vibration generator 41 from moving around in the grooves 317, and thus reducing the risk of damage or failure of the vibration generator 41.

[0074] At least two adjacent second rectangular metal plates 312 are connected by a connecting plate 316, and the width of the connecting plate 316 can be greater than the width of the inner support plate 313. For example... Figure 5 As shown, the first-layer fixing frame 31 can also be provided with multiple outer support plates 315 on the surface of the heat-conducting wall 12. Along the thickness direction of the first-layer fixing frame 31, the outer support plates 315 are connected to the inner support plates 313 and are arranged opposite to them. The width of the outer support plates 315 and the width of the corresponding inner support plates 313 can be the same, and the length of the outer support plates 315 can be greater than the length of the corresponding inner support plates 313. This arrangement can increase the structural strength and stability of the first-layer fixing frame 31, thereby providing a stable and reliable working environment for the vibration generator 41, and thus effectively improving the safety and reliability of the piezoelectric vibration heat dissipation device 100.

[0075] It can be explained that, for example Figure 1 As shown, the first-layer fixing frame 31 and the second-layer fixing frame 32 can have the same shape and size. The second connecting bracket 232 and the first connecting bracket 231 also have the same shape and size. Thus, after the four vibration generators 41 are installed in the corresponding slots 317, the second-layer fixing frame 32 and the first-layer fixing frame 31 are aligned and placed. After the four vibration generators 41 are pressed between the second-layer fixing frame 32 and the first-layer fixing frame 31, the second-layer fixing frame 32 and the first-layer fixing frame 31 are connected by the fixing strip 24. This can firmly fix the four vibration generators 41 between the second-layer fixing frame 32 and the first-layer fixing frame 31, providing a stable and reliable working environment for the vibration generators 41. Furthermore, the second connecting bracket 232 and the first connecting bracket 231 are aligned to form the mounting part 23. The thickness of the mounting part 23 is adapted to the depth of the mounting slot 17 so that the mounting part 23 can be smoothly installed in the corresponding mounting slot 17, thereby enabling the heat dissipation working mechanism 20 to be installed on the mounting base 10.

[0076] According to some embodiments of the present invention, such as Figure 9 As shown, the piezoelectric vibration heat dissipation device 100 may further include: an encapsulation jacket 50, which is fitted onto the mounting base 10 and the heat dissipation working mechanism 20, with the heat-conducting wall 12 exposed above the encapsulation jacket 50, and the encapsulation jacket 50 forming a third vent 51 corresponding to the air inlet 21.

[0077] The encapsulation jacket 50 can be a soft plastic film. The encapsulation jacket 50 is fitted onto the mounting base 10 and the heat dissipation mechanism 20, which can protect the mounting base 10 and the heat dissipation mechanism 20, thereby reducing the direct impact of the external environment on the mounting base 10 and the heat dissipation mechanism 20, such as dust, moisture, chemical corrosion, etc. In addition, the plastic film also has a certain insulating property, which helps to prevent electrical short circuits or leakage and other safety problems. Furthermore, the plastic film can better adapt to mounting bases 10 and heat dissipation mechanisms of different shapes and sizes, providing a tighter encapsulation effect.

[0078] The heat-conducting wall 12 is exposed outside the encapsulation jacket 50 so that the heat-conducting wall 12 can directly contact the heat-dissipating component, thereby achieving efficient heat dissipation. The encapsulation jacket 50 is formed with a third vent 51 corresponding to the air inlet 21 so that gas can flow into the air inlet 21 from the third vent 51, ensuring that the heat dissipation working mechanism 20 can work normally to dissipate heat from the heat-dissipating component.

[0079] According to some embodiments of the present invention, such as Figure 9 As shown, the third vent 51 can be equipped with a filter element, which can be a filter screen. The filter element can be set in the air inlet 21, thereby effectively reducing the risk of impurities in the external environment clogging the third vent 51 or entering the heat dissipation working mechanism 20 from the third vent 51, thus avoiding affecting the heat dissipation efficiency, and thus helping to improve the safety, reliability and heat dissipation efficiency of the piezoelectric vibration heat dissipation device 100.

[0080] As an example of this application, the encapsulation jacket 50 may be provided with a marking area 52 for imprinting product model features, thereby facilitating users to refer to and select a suitable piezoelectric vibration heat dissipation device 100 for heat dissipating the heat-dissipating component.

[0081] Furthermore, the power and size of the piezoelectric vibration heat dissipation device 100 can be adjusted according to the structure of the heat dissipation working mechanism 20. The piezoelectric vibration heat dissipation device 100 described in this application is a combination of four vibration generators 41, but the number of vibration generators 41 can be reasonably set according to the actual situation. For example, it can also be adjusted to a combination of two or six vibration generators 41. When the number of vibration generators 41 changes, the fixing frame 30, the mounting base 10 and the encapsulation jacket 50 are also adjusted synchronously with the vibration generators 41.

[0082] The heat dissipation steps of the piezoelectric vibration heat dissipation device 100 are as follows: First, select a suitable piezoelectric vibration heat dissipation device 100 by means of the product model printed on the marking area 52 of the packaging jacket 50. Place the piezoelectric vibration heat dissipation device 100 above the heat dissipation element so that the heat-conducting wall 12 contacts and adheres to the heat dissipation element. Then, the heat generated by the heat dissipation element can be conducted to the heat dissipation space 14 by the heat-conducting wall 12. By starting the piezoelectric vibration element 43 and selecting a suitable electrical frequency, due to the inverse piezoelectric effect, the piezoelectric drive plate 432 generates high-frequency vibration and continuously stretches and compresses to drive the elastic vibration diaphragm 433 to vibrate. Due to the pressure difference between the inside and outside, the airflow impact is caused. After the gas enters the cavity of the generator body 42 through the air inlet 21, it passes through the piezoelectric drive plate 432 and the elastic vibration diaphragm 433 at high speed and is vertically shot to the heat-conducting wall 12 of the mounting base 10 through the air outlet 22. Heat exchange occurs in the heat dissipation space 14. Then, the gas flows out of the heat dissipation outlet 13 again through the connecting flow channel 16, completing the heat dissipation process.

[0083] It can be noted that the piezoelectric vibration heat dissipation device 100 can be installed in various electronic components that need to be cooled, depending on the actual situation.

[0084] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0085] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A piezoelectric vibration heat dissipation device, characterized in that, include: The mounting base has an installation space, a heat-conducting wall for contacting the heat-dissipating element, and a heat dissipation vent that communicates with the installation space. A heat dissipation mechanism is provided, at least a portion of which is installed in the installation space. The heat dissipation mechanism and the heat-conducting wall are opposite to and spaced apart to form a heat dissipation space between the heat dissipation mechanism and the heat-conducting wall. The heat dissipation port is connected to the heat dissipation space. The heat dissipation mechanism has an air inlet and an air outlet. The air inlet is connected to the external environment, and the air outlet is connected to the heat dissipation space. The heat dissipation mechanism is configured to drive gas to flow into the heat dissipation space sequentially through the air inlet and the air outlet, so that the gas in the heat dissipation space flows out of the heat dissipation space from the heat dissipation port. The heat dissipation mechanism includes a fixed frame and a working layer. The working layer is fixed to the fixed frame, and the fixed frame is mounted on the mounting base. The working layer is configured to drive gas to flow into the heat dissipation space. The working layer includes a vibration generator, which drives gas to flow into the heat dissipation space through vibration. The vibration generator includes: a generator body and a piezoelectric vibration element. The generator body defines a cavity, which is connected to both the air inlet and the air outlet. The piezoelectric vibration element is located at the air outlet. There are multiple piezoelectric vibration elements and multiple air outlets, and each piezoelectric vibration element and multiple air outlets are arranged in a one-to-one correspondence.

2. The piezoelectric vibration heat dissipation device according to claim 1, characterized in that, The mounting base also has an assembly port communicating with the mounting space. The assembly port and the heat-conducting wall are opposite to and spaced apart. The heat dissipation mechanism is installed in the mounting space through the assembly port.

3. The piezoelectric vibration heat dissipation device according to claim 1, characterized in that, The mounting base also forms a connecting channel that connects the heat dissipation port and the heat dissipation space. At least a portion of the connecting channel is constructed as a variable diameter section, and the cross-sectional area of ​​the variable diameter section gradually decreases along the gas flow direction within the connecting channel.

4. The piezoelectric vibration heat dissipation device according to claim 1, characterized in that, The fixing frame includes a first fixing frame and a second fixing frame. The working layer is disposed between the first fixing frame and the second fixing frame. The first fixing frame is located on the side of the working layer facing the heat-conducting wall, and the second fixing frame is located on the side of the working layer away from the heat-conducting wall. The first fixing frame and the second fixing frame are fixedly connected so that the working layer is fixed between the first fixing frame and the second fixing frame. The second fixing frame has a first vent, which corresponds to the air inlet. The first fixing frame has a second vent, which corresponds to the air outlet.

5. The piezoelectric vibration heat dissipation device according to any one of claims 1-4, characterized in that, Also includes: An encapsulation jacket is fitted onto the mounting base and the heat dissipation mechanism, with the heat-conducting wall exposed above the encapsulation jacket. The encapsulation jacket has a third vent corresponding to the air inlet.

6. The piezoelectric vibration heat dissipation device according to claim 5, characterized in that, The third vent is equipped with a filter.

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