Chip package pre-processing apparatus

Abstract

This invention discloses a chip packaging pretreatment device, comprising: a cleaning assembly including a cleaning chamber, a cleaning component disposed within the cleaning chamber, and a swing component disposed within the cleaning chamber; and a cutting assembly including a cutting table connected to the cleaning chamber and cutting blades disposed on the cutting table. A conveyor belt is provided on the cutting table. During processing, the operator first controls the conveyor belt within the cleaning chamber to approach the inlet, receiving the chip from the previous processing step, then cleaning it, and then moving it to the outlet to deliver the chip onto the conveyor belt on the cutting table, where it is cut using the cutting blades. The cleaning chamber and the cutting table are interconnected, reducing the possibility of dust contamination during transportation.

Description

Technical Field

[0001] This invention relates to the technical field of Clip strip preprocessing, and more particularly to a chip packaging preprocessing device. Background Technology

[0002] Clip tape refers to a type of tape used in flip-chip bonding. Invented specifically for flip-chip bonding, this tape works by replacing recessed chip contacts with raised bumps. A special adhesive is used to secure the module to a special carrier tape. This process also requires wire bonding and subsequent epoxy encapsulation. The chip is flipped over and placed on the substrate, and electrical connections are established using tape bonding equipment and the raised bumps.

[0003] The chips used in the Clip process are significantly different from those used in the wire bonding process. Clip chips have their contacts facing downwards, while wire-bonded chips have their contacts facing upwards. Clip chips can only use Clip strips. Previously, Clip strips were only used in flip-chip bonding. Current strip bonding equipment often requires pre-processing of the chips before use, including cleaning and dicing. However, current pre-processing is divided into two areas. After cleaning, the chips undergo a long transport process to the dicing area for dicing, which easily leads to re-contamination by dust. Summary of the Invention

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0005] In view of the problems existing in the above-mentioned chip packaging preprocessing equipment, the present invention is proposed.

[0006] Therefore, the purpose of this invention is to provide a chip packaging preprocessing device.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a chip packaging pretreatment device, comprising: a cleaning component, including a cleaning chamber, a cleaning component disposed within the cleaning chamber, and a swing component disposed within the cleaning chamber; and a cutting component, including a cutting table connected to the cleaning chamber and a cutting blade disposed on the cutting table, wherein a conveyor belt is disposed on the cutting table.

[0008] In a preferred embodiment of the chip packaging pretreatment equipment of the present invention, the cleaning component includes an annular blower assembly disposed within the cleaning chamber and a drying unit disposed on the annular blower assembly. The drying units are spaced apart between the annular blower assemblies. The drying unit is also provided with an air regulating plate. The annular blower assembly has an air outlet at its upper end. The drying unit has an adjustment plate. The adjustment plate is connected to the air outlet after rotation. The adjustment plate is provided with several auxiliary drying modules.

[0009] In a preferred embodiment of the chip packaging preprocessing equipment of the present invention, the oscillating component includes an oscillating body disposed within a cleaning chamber, a first rotating rod disposed on the oscillating body, a second rotating rod connected to the first rotating rod, and a transfer component disposed between the first rotating rod and the second rotating rod.

[0010] The transfer component includes a plurality of first transfer rods connected to a first rotating rod and a second transfer rod connected to a second rotating rod. The plurality of first transfer rods and the second transfer rods are arranged to abut against each other in an alternating manner, and a receiving plate is provided at the upper end of the second rotating rod.

[0011] As a preferred embodiment of the chip packaging preprocessing equipment of the present invention, wherein: the outside of the swing body is covered with an expansion member, the expansion member includes a carrier disposed on the outside of the swing body and an expansion filler disposed in the carrier body, the expansion filler expands after being heated and deforms the carrier body, the carrier body includes a heating plate connected to the swing body and a deformation plate disposed on the heating plate.

[0012] In a preferred embodiment of the chip packaging preprocessing equipment of the present invention, the dicing blade includes a dicing plate disposed on a dicing table and a plurality of dicing units disposed below the dicing plate. Every six dicing units form a dicing blade group. Each dicing unit includes two outwardly extending dicing blades, with the included angle between the dicing blades forming a 90° angle. The dicing units are arranged in an array within each dicing blade group.

[0013] The cutting blades of the four cutting units are directly opposite each other, and the remaining two cutting units are located at the center of the rectangular frame formed by the four cutting units, with the two cutting units facing away from each other.

[0014] As a preferred embodiment of the chip packaging preprocessing equipment of the present invention, wherein: a telescopic component is provided inside the cutting unit, the telescopic component includes a sliding groove formed on the side wall of each cutting blade, a connecting piece slidably connected in the sliding groove, and an interconnecting hook piece provided at the front end of the connecting piece, the length of the connecting piece is the same as the length of the cutting blade, and a pull-out component is provided on the two cutting units located at the center.

[0015] As a preferred embodiment of the chip packaging preprocessing equipment of the present invention, the pull-out component includes pull strips disposed on the two cutting units and a rotating shaft disposed at the rear end of the pull strips. The rotating shaft is detachably connected to the cutting unit. A flat groove is reserved on the cutting unit. The flat groove abuts against the end of the rotating shaft and does not obstruct the rotation of the rotating shaft. The pull strip is connected to the recess.

[0016] In a preferred embodiment of the chip packaging pretreatment equipment of the present invention, the rotating shaft is connected to the bottom surface of the cutting plate, the bottom surface of the cutting plate is provided with a slot, a spiral limiting strip is provided in the slot, and a plurality of threaded grooves are provided on the surface of the rotating shaft.

[0017] In a preferred embodiment of the chip packaging pretreatment equipment of the present invention, the rear end of the pull bar is provided with a hook that cooperates with the rotating shaft.

[0018] As a preferred embodiment of the chip packaging preprocessing equipment of the present invention, wherein: a circular retaining post is provided at one end of the cutting unit near the cutting plate, and a mating waist-shaped groove is provided on the side wall of the cutting plate to cooperate with the circular retaining post.

[0019] The beneficial effects of this invention are as follows: During processing, the operator first controls the conveyor belt inside the cleaning box to be close to the inlet, receiving the chip from the previous processing step, cleaning it, and then moving it to the outlet to send the chip onto the conveyor belt on the cutting table. The chip is then cut using the cutting blade. The cleaning box and the cutting table are interconnected, reducing the possibility of dust contamination during transportation.

[0020] During cutting, the cutting plate presses down, and the cutting unit cuts and presses the chip, separating the originally integrated chip assembly into individual units. As the plate presses down, the threaded groove on the outer surface of the rotating shaft moves relative to the spiral limiting strip, causing the rotating shaft to rotate. The rotation of the rotating shaft pulls the pull bar back, thereby pulling back the originally protruding connecting piece, which in turn pulls back the outer cutting unit. During the pull-back process, the cut chip is pulled together slightly, making it easier for the operator to handle later. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0022] Figure 1This is a schematic diagram of the overall structure of the chip packaging preprocessing equipment of the present invention.

[0023] Figure 2 This is a schematic diagram of the internal structure of the cleaning chamber in the chip packaging preprocessing equipment of the present invention.

[0024] Figure 3 This is a schematic diagram of the cutting stage in the chip packaging preprocessing equipment of the present invention.

[0025] Figure 4 This is a schematic diagram of the cleaning component in the chip packaging preprocessing equipment of the present invention.

[0026] Figure 5 This is an enlarged schematic diagram of the swinging component in the chip packaging preprocessing equipment of the present invention.

[0027] Figure 6 This is a schematic diagram of the cutting blade structure of the chip packaging preprocessing equipment of the present invention.

[0028] Figure 7 This is an exploded view of the cutting blade structure of the chip packaging pretreatment equipment of the present invention.

[0029] Figure 8 This is a schematic diagram of the telescopic component described in the chip packaging preprocessing equipment of the present invention.

[0030] Figure 9 This is a schematic diagram of the diced unit described in the chip packaging preprocessing equipment of the present invention.

[0031] Figure 10 This is a schematic diagram of the dicing blade assembly in the chip packaging preprocessing equipment of the present invention.

[0032] Figure 11 The chip packaging preprocessing equipment of the present invention Figure 10 Enlarged diagram of part A in the middle.

[0033] Figure 12 This is a schematic diagram of the rotary shaft connection of the chip packaging preprocessing equipment of the present invention. Detailed Implementation

[0034] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0035] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0036] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0037] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth. Example

[0038] Reference Figure 1-5 The present invention discloses a chip packaging preprocessing device, including a cleaning component 100. The cleaning component 100 includes a cleaning housing 101, which is used for processing steps before connecting the chip, and then for transporting the chip, and seals the overall internal environment to ensure that there is no additional dust, and performs complete cleaning of the chip.

[0039] Furthermore, the cleaning component 100 also includes a cleaning component 102 disposed within the cleaning chamber 101 and a swing component 103 disposed within the cleaning chamber. The cleaning component 102 is used to clean the chips that pass through the cleaning chamber 101. In this embodiment, the cleaning component 102 includes a fan disposed within the cleaning chamber 101. The fan can blow air to clean the inside of the cleaning chamber 101, and a filter screen is provided at the air inlet of the fan. The filter screen includes three layers and is used to filter dust in the air, thereby ensuring that the amount of dust inside the air blown onto the chip meets the requirements.

[0040] The swing component 103 serves to deflect and vibrate, primarily accommodating chips transported from the front end. A conveyor belt is installed inside the cleaning chamber 101, with a reciprocating motion. Several receiving plates 104c are mounted on the upper surface of the conveyor belt, which is positioned on the swing component 103. The operator controls the reciprocating motion of the conveyor belt to move it closer to the two sides of the cleaning chamber 101. When it approaches the inlet, it can receive chips from the previous processing step for cleaning, and then move it closer to the outlet to deliver the chips.

[0041] Furthermore, the present invention also includes a cutting assembly 200, which includes a cutting table 201 connected to the cleaning box 101 and a cutting blade disposed on the cutting table 201. After the chip is transported out of the cleaning box 101, it is transported to the cutting table 201. The cutting blade is disposed above the cutting table 201. The cutting blade presses down to cut the chip into individual chip units. A cutting component is disposed on the cutting table 201, which controls the cutting blade 202c.

[0042] Furthermore, the present invention also includes an adhesive component disposed at the end of the cutting table 201, which is mainly used for applying adhesive to the chip.

[0043] Operation process: During processing, the operator first controls the conveyor belt inside the cleaning box 101 to receive the chip from the previous processing step when it is near the inlet, then cleans it, and then moves it to the outlet to send the chip out onto the conveyor belt on the cutting table 201, and then cuts it using the cutting blade. Example

[0044] Reference Figure 6-12 This embodiment differs from the previous embodiment in that the cleaning component 102 includes an annular blower assembly 102a disposed within the cleaning housing 101 and a drying unit 102b disposed on the annular blower assembly 102a. The drying unit 102b is spaced between the annular blower assemblies 102a, and the drying unit 102b is provided with a heating resistance wire, which can heat the blower to heat the outer film of the chip, and then initially separate the chip from the adhesive layer attached to the bottom of the chip, thus separating the two.

[0045] Furthermore, an air regulating plate 102c is also provided on the annular blower assembly 102a. The air regulating plate 102c is located at the opening of the annular blower assembly 102a and can rotate, thereby changing the airflow direction of the annular blower assembly 102a. Additionally, an air outlet 102d is provided at the upper end of the drying unit 102b, extending forward and closer to the lower chip. An adjustment plate 102e is provided on the drying unit 102b, and the adjustment plate 102e can rotate. It is then connected to the air outlet 102d. Several auxiliary drying modules are provided on the adjustment plate 102e. The size of the adjustment plate 102e matches the air outlet 102d of the dryer unit 102b. A hinge rod is provided on the outside of the adjustment plate 102e, so as to control the connection between the adjustment plate 102e and the air outlet 102d. The port size of the end of the adjustment plate 102e away from the air outlet 102d is smaller and the whole is flat, so that it can get closer to the chip and the bonding layer of the chip bottom layer, making it easier to detach.

[0046] Furthermore, in this embodiment, the swing component 103 includes a swing body 103a disposed within the cleaning box 101. The swing body 103a is connected to the receiving plate 104c via a motor. After the motor is started, it drives the swing body 103a to rotate. The swing body 103a is also provided with a first rotating rod 103b, a second rotating rod 103c connected to the first rotating rod 103b, and a transfer component 104 disposed between the first rotating rod 103b and the second rotating rod 103c.

[0047] In this embodiment, the transfer member 104 includes a plurality of first transfer rods 104a connected to the first rotating rod 103b and a second transfer rod 104b connected to the second rotating rod 103c. A hemispherical block is provided at the end of the first rotating rod 103b and the second rotating rod 103c. The first transfer rods 104a are arranged along the spherical surface, and the second transfer rods 104b are also arranged along the spherical surface. The plurality of first transfer rods 104a and second transfer rods 104b are arranged to abut against each other in an alternating manner.

[0048] Furthermore, several first transfer rods 104a and second transfer rods 104b are staggered and abutted together, and a receiving plate 104c is provided at the upper end of the second rotating rod 103c, which can support the chip.

[0049] Furthermore, an expansion member 105 is wrapped around the outside of the swing body 103a. The expansion member 105 includes a carrier disposed on the outside of the swing body 103a and an expansion filler disposed in the carrier. The expansion filler expands when heated and deforms the carrier. The carrier includes a heating plate 105a connected to the swing body 103a and a deformation plate 105b disposed on the heating plate 105a.

[0050] Furthermore, the expansion filler includes a heat-expandable solid filler disposed within the carrier and silver nanoparticles uniformly distributed within the solid filler. The excellent thermal conductivity of the silver nanoparticles causes the low-boiling-point acetone solvent to rapidly reach its boiling point, and the liquid boils and transforms into gas, which is used to deform the carrier.

[0051] Several phase change droplets are distributed within the solid packing material. Acetone is used as the solvent for these droplets, and in the specific design of the droplets, a low-boiling-point organic solvent is employed. Acetone can be used as the low-boiling-point organic solvent, allowing the support to deform at a low temperature of 40 degrees Celsius.

[0052] Furthermore, in this embodiment, the cutting tool includes a cutting plate 202a disposed on the cutting table 201 and a plurality of cutting units 202b disposed below the cutting plate 202a. The cutting plate 202a is disposed in a horizontal direction, and the planar dimensions of the cutting plate 202a are the same as the dimensions of the receiving plate 104c. The cutting units 202b are detachably mounted on the lower surface of the cutting plate 202a according to certain arrangement requirements.

[0053] Preferably, six cutting units 202b form a cutting blade group. Each cutting unit 202b includes two outwardly extending cutting blades 202c, with an included angle of 90° between the two cutting blades 202c. The cutting units 202b are arranged in an array within each cutting blade group. When viewed from the bottom surface of the cutting plate 202a, the ends of the cutting blades 202c of the four cutting units 202b are positioned opposite each other, forming a rectangular frame around the four cutting units 202b. The four cutting units 202b are the four corners of the rectangular frame, and the extended cutting blades 202c are the same length as two adjacent sides of the rectangular frame. A certain gap is left between each pair of adjacent cutting blades 202c. The remaining two cutting units 202b are positioned at the center of the rectangular frame structure formed by the four cutting units 202b, and the two cutting units 202b are positioned opposite each other, with the two centrally located cutting units 202b being symmetrical.

[0054] Furthermore, within each cutting unit 202b forming a cutting blade assembly, four arrayed rectangular spaces are created. A cutting blade is provided on the lower end face of each cutting unit 202b. The four matrix spaces correspond to the four chip positions respectively. After several cutting blade assemblies are arrayed and arranged on the cutting plate 202a, they form the entire cutting blade assembly. Each cutting unit 202b and the cutting plate 202a are detachably connected. Thus, the operator can select different installation methods for the cutting units 202b according to the size of the chip being cut or the cutting requirements, thereby performing different cutting methods.

[0055] Furthermore, a telescopic member 300 is provided within the cutting unit 202b. The telescopic member 300 includes a sliding groove 301 formed on the side wall of each cutting blade 202c, a connecting piece 302 slidably connected within the sliding groove 301, and an interconnecting hook piece provided at the front end of the connecting piece 302. Two telescopic members 300 are provided on the side wall of each cutting unit 202b, so that each cutting unit 202b can be used as two cutting units 202b at the center of a cutting blade group (because the two ends of each cutting unit 202b located at the center of the cutting blade group are interconnected to the two cutting units 202b at the near edge).

[0056] The connecting piece 302 is composed of several individual connecting pieces 302 that are hinged together end to end. When they are in the sliding groove 301, the individual connecting pieces 302 are stacked together. A first magnet 303 is provided on the interconnecting hook at the front end of the connecting piece 302. A second magnet 305 that cooperates with the first magnet 303 is provided at the opening of each sliding groove 301. The attraction of the first magnet 303 and the second magnet 305 realizes the connection between the two cutting units 202b.

[0057] Furthermore, a pull-out member 400 is provided on the two cutting units 202b located at the center. In this embodiment, the pull-out member 400 includes a pull bar 401 provided on the two cutting units 202b and a rotating shaft 402 provided at the rear end of the pull bar 401.

[0058] The rotating shaft 402 is detachably connected to the cutting unit 202b. A flat groove is reserved on the cutting unit 202b, and the flat groove abuts against the end of the rotating shaft 402 without hindering the rotation of the rotating shaft 402. In order to cooperate with the pulling of the pull bar 401, a concave block is provided inside the sliding groove 301. The concave block is used to receive the connecting piece 302, and the pull bar 401 is directly connected to the concave block, thereby controlling the movement of the concave block. The pull bar 401 is connected to the concave block, so the pull bar 401 can drive the concave block to move.

[0059] Furthermore, the rotating shaft 402 is connected to the bottom surface of the cutting plate 202a. A slot 403 is provided on the bottom surface of the cutting plate 202a, and a spiral limiting strip 404 is provided in the slot 403. Several threaded grooves 405 are provided on the surface of the rotating shaft 402. When cutting, the cutting plate 202a presses down, and the cutting unit 202b cuts and presses the chip, cutting the originally integrated chip assembly into a unit. As it presses down, the threaded grooves 405 on the outer surface of the rotating shaft 402 and the spiral limiting strip 404 move relative to each other, thereby causing the rotating shaft 402 to rotate. The rotation of the rotating shaft 402 is pulled by the pull bar 401, which pulls the pull bar 401 back, thereby pulling back the originally extended connecting piece 302, and thus pulling back the outer cutting unit 202b.

[0060] Furthermore, during the pull-back process, the cut chips will be pulled together slightly, making it easier for subsequent operators to handle.

[0061] Preferably, a hook that engages with the rotating shaft 402 is provided at the rear end of the pull bar 401.

[0062] A circular locking post 406 is provided at one end of the cutting unit 202b near the cutting plate 202a, and a matching waist-shaped groove 407 is provided on the side wall of the cutting plate 202a to cooperate with the circular locking post 406.

[0063] Operation process: When cutting, the cutting plate 202a presses down, and the cutting unit 202b cuts and presses the chip, cutting the originally integrated chip assembly into individual units. As it presses down, the threaded groove 405 on the outer surface of the rotating shaft 402 moves relative to the spiral limiting strip 404, causing the rotating shaft 402 to rotate. The rotation of the rotating shaft 402 is pulled by the pull bar 401, which pulls the pull bar 401 back, thereby pulling back the originally protruding connecting piece 302, thus pulling back the outer cutting unit 202b. During the pull-back process, the cut chip is pulled, causing the chip to slightly assemble, which facilitates subsequent operation by the operator.

[0064] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of the invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structurally equivalent but also equivalent in structure. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of the invention. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0065] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the currently considered best mode for carrying out the invention, or those features that are not relevant to implementing the invention) may be omitted.

[0066] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0067] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A chip packaging preprocessing device, characterized in that: include, The cleaning assembly (100) includes a cleaning chamber (101), a cleaning component (102) disposed within the cleaning chamber (101), and a swing component (103) disposed within the cleaning chamber; and, The cutting assembly (200) includes a cutting table (201) connected to a cleaning housing (101) and cutting blades disposed on the cutting table (201). A drive belt is provided on the cutting table (201). The cutting blades include a cutting plate (202a) disposed on the cutting table (201) and several cutting units (202b) detachably connected to the cutting plate (202a). Every six cutting units (202b) form a cutting blade group. Each cutting unit (202b) includes two outwardly extending cutting blades (202c) with an included angle of 90° between them. The cutting units (202b) are arranged in an array within each cutting blade group. In this design, the cutting blades (202c) of four cutting units (202b) abut against each other. The remaining two cutting units (202b) are positioned at the center of the rectangular frame formed by the four cutting units (202b) surrounding each other, and the two cutting units (202b) are positioned opposite each other. Each cutting unit (202b) is provided with a telescopic member (300), and the telescopic member (300) includes a sliding groove formed on the side wall of each cutting blade (202c). 301), a connecting piece (302) slidably connected within the sliding groove (301) and a first magnet (303) disposed at the front end of the connecting piece (302), a recess is provided within the sliding groove (301), and a second magnet (305) is provided at the opening of the sliding groove (301) to cooperate with the first magnet (303), and a pull-out component (400) is provided on the two cutting units (202b) located at the center, the pull-out component (400) including components disposed on the two cutting units (202b) The pull bar (401) on 02b) and the rotating shaft (402) located at the rear end of the pull bar (401), the rotating shaft (402) being detachably connected to the cutting unit (202b), the cutting unit (202b) having a pre-reserved flat groove, the flat groove abutting against the end of the rotating shaft (402) without obstructing the rotation of the rotating shaft (402), the pull bar (401) being connected to the concave block, the rotating shaft (402) being connected to the bottom surface of the cutting plate (202a), the bottom surface of the cutting plate (202a) being... A slot (403) is provided, and a spiral limiting strip (404) is provided in the slot (403). Several threaded grooves (405) are provided on the surface of the rotating shaft (402). A hook that cooperates with the rotating shaft (402) is provided at the rear end of the pull bar (401). A circular locking post (406) is provided at one end of the cutting unit (202b) near the cutting plate (202a). A waist-shaped groove (407) that cooperates with the circular locking post (406) is provided on the side wall of the cutting plate (202a).

2. The chip packaging preprocessing equipment as described in claim 1, characterized in that: The cleaning component (102) includes an annular blower assembly (102a) disposed inside the cleaning box (101) and a dryer assembly (102b) disposed beside the annular blower assembly (102a). The dryer assembly (102b) is disposed beside the annular blower assembly (102a) and is also provided with an air regulating plate (102c). The annular blower assembly (102a) has an air outlet (102d) at its upper end, and the dryer assembly (102b) has an adjusting plate (102e). The adjusting plate (102e) is connected to the air outlet (102d) after rotation. The adjusting plate (102e) is provided with several auxiliary drying modules. The swing component (103) includes a swing body (103a) disposed in the cleaning box (101), a first rotating rod (103b) disposed on the swing body (103a), a second rotating rod (103c) connected to the first rotating rod (103b), and a transfer component (104) disposed between the first rotating rod (103b) and the second rotating rod (103c).

3. The chip packaging preprocessing equipment as described in claim 2, characterized in that: The transfer component (104) includes a plurality of first transfer rods (104a) connected to the first rotating rod (103b) and a second transfer rod (104b) connected to the second rotating rod (103c). The plurality of first transfer rods (104a) and the second transfer rods (104b) are staggered and abut against each other. A receiving plate (104c) is provided at the upper end of the second rotating rod (103c).

4. The chip packaging preprocessing equipment according to claim 3, characterized in that: The outside of the swing body (103a) is covered with an expansion member (105). The expansion member (105) includes a carrier disposed on the outside of the swing body (103a) and an expansion filler disposed in the carrier. The expansion filler expands when heated and deforms the carrier. The carrier includes a heating plate (105a) connected to the swing body (103a) and a deformation plate (105b) disposed on the heating plate (105a).

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