Wafer edge damaged layer etching device

Abstract

The invention relates to the technical field of etching devices, and discloses a wafer edge damaged layer etching device, comprising: a casing and a workbench, wherein the casing is provided with a workbench in the middle, the workbench is provided with an etching groove on the top, a turntable is provided in the center of the etching groove, a positioning groove is provided on the top of the turntable, a guide rod is provided inside the positioning groove, a wafer placement plate is provided on the top of the guide rod, and an adsorption component is provided on the wafer placement plate. In the invention, positive pressure air is conveyed through an air pipe and a branch pipe to inflate an elastic airbag with positive pressure, and under the guidance of the guide rod, the wafer placement plate rises to separate the wafer from the etching liquid, and during the entire process of separating the wafer from the etching liquid, the wafer is placed stably to avoid damaging the microstructure of the wafer surface, and at the same time avoid pollution or damage caused by improper operation of personnel.

Description

Technical Field

[0001] The invention relates to the technical field of etching devices, in particular to a wafer edge damaged layer etching device. Background Art

[0002] The wafer edge damage layer refers to the surface damage area on the edge of the wafer caused by mechanical friction and thermal stress during the semiconductor manufacturing process. This damage layer has an important impact on the integrity of the wafer and the reliability of the final product. During the integrated circuit manufacturing process, the wafer will undergo many physical and chemical processing steps, which may cause tiny damage on the surface and edge of the wafer. This damage usually includes tiny cracks, lattice deformation, and peeling of surface materials. These damages will not only affect the structural integrity of the wafer, but may also affect its electrical properties, causing device performance degradation or failure.

[0003] The wafer edge damaged layer etching device is a device used in microelectronics manufacturing. Its purpose is to remove the damaged layer at the edge of the wafer through an etching process to improve the manufacturing quality and reliability of the wafer.

[0004] When chemically etching the damaged layer at the edge of the wafer, one method of wet etching is to immerse the wafer in a chemical etching solution and use chemical reactions to remove the material on the surface of the wafer. After the etching time is over, it is an important step to safely remove the wafer from the etching solution. The existing method is to slightly tilt the etching tank to allow the etching solution to flow out slowly, but this is easy to damage the microstructure of the wafer surface and is prone to contamination or damage due to improper operation. Summary of the invention

[0005] The object of the present invention is to provide a wafer edge damaged layer etching device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: A wafer edge damaged layer etching device, comprising: a casing and a workbench, a workbench is provided in the middle of the casing, an etching groove is provided on the top of the workbench, a turntable is provided in the center of the etching groove, a positioning groove is opened on the top of the turntable, a guide rod is provided inside the positioning groove, a wafer placing plate is provided on the top of the guide rod, an adsorption assembly is provided on the wafer placing plate, an elastic airbag is provided on the bottom end of the adsorption assembly, a branch pipe is provided at the bottom end of the elastic airbag, a rotary joint is provided at the bottom end of the branch pipe, an air supply pipe is provided at the bottom end of the rotary joint, a vacuum pump is provided on one side of the inner wall of the bottom of the casing, and one end of the air supply pipe is connected to one end of the vacuum pump.

[0007] Preferably, a fixed tooth is provided at the bottom of the turntable, a bevel gear is provided on one side of the workbench, a drive motor is provided on one side of the bottom of the workbench, one end of the output shaft of the drive motor is fixedly connected to the bevel gear, the bevel gear is meshed with the fixed tooth, there are multiple fixed teeth, and the multiple fixed teeth are evenly arranged circumferentially at the bottom of the turntable.

[0008] Preferably, a through hole is opened inside the positioning groove, the guide rod is movably inserted in the through hole, a limit block is provided at the bottom end of the guide rod, there are a plurality of through holes, and the plurality of through holes are evenly arranged circumferentially inside the positioning groove.

[0009] Preferably, positioning blocks are provided on the top outer ring of the wafer placement plate, and the positioning blocks are evenly arranged circumferentially on the wafer placement plate.

[0010] Preferably, the adsorption assembly includes a suction cup piston and a piston cylinder, the middle part of the wafer placement plate has a slot, the piston cylinder is fixed on the slot, the piston cylinder is open, the opening of the piston cylinder is set upward and a guide hole is provided at the bottom of the piston cylinder, the suction cup piston includes a piston rod, the piston rod is adapted to the guide hole and the two ends of the piston rod are respectively connected to a first piston head and a second piston head, the first piston head is sealingly slidably arranged in the piston cylinder, the second piston head is located outside the piston cylinder, and the top of the elastic airbag is fixedly connected to the second piston head.

[0011] Preferably, the elastic airbag includes an airbag body, the top of the airbag body has a raised telescopic head, the bottom end of the airbag body is provided with an airbag inlet connected to one end of the branch pipe, the bottom of the wafer placement plate is provided with a fixed cover, the bottom end of the fixed cover is provided with a circular hole fixedly connected to the shoulder of the telescopic head, the telescopic head is located in the fixed cover and fixedly connected to the second piston head, the inner diameter of the airbag body is larger than the inner diameter of the telescopic head, and a return spring is also provided in the airbag body, and the stiffness of the return spring is greater than the friction between the first piston head and the inner wall of the piston cylinder.

[0012] Preferably, a buffer pad is provided on the top surface of the wafer placement plate.

[0013] Preferably, an etching liquid filter box is provided on one side of the inner wall at the bottom of the casing, a filter plate is provided on the inner wall in the middle of the etching liquid filter box, a liquid outlet pipe is provided on one side of the bottom of the etching tank, and one end of the liquid outlet pipe is located below the filter plate; a liquid inlet filter cylinder is provided on one side of the top of the filter plate, a circulation pipe is provided inside the liquid inlet filter cylinder, the top of the circulation pipe is located directly above the center of the turntable, a liquid outlet filter cylinder is provided on the top of the circulation pipe, and a circulation pump is provided on one side of the top of the etching liquid filter box, and the circulation pump is connected to the circulation pipe.

[0014] Preferably, a hollow rotating shaft is provided in the center of the bottom of the turntable, and one end of the branch pipe passes through the hollow rotating shaft and is connected to the rotating joint.

[0015] Preferably, the height travel of the elastic airbag during inflation and deflation is greater than the depth of the etched groove.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The present invention realizes that when the wafer edge damaged layer etching device is used, the wafer to be etched is placed on the wafer placing plate by means of the arranged casing, etching groove and wafer placing plate, and the wafer is positioned by means of the positioning block. When etching is required, negative pressure air is generated by means of the dual-purpose pump for suction and inflation, and the negative pressure air is transported through the air pipe and the branch pipe, and the elastic air bag is negatively suctioned and contracted by the negative pressure air. Under the guiding action of the guide rod, the wafer placing plate descends, so that the wafer is immersed in the etching liquid in the etching groove for etching. After the etching is completed, positive pressure air is generated by means of the dual-purpose pump for suction and inflation, and the elastic air bag is positively pumped and inflated by the positive pressure air through the air pipe and the branch pipe. Under the guiding action of the guide rod, the wafer placing plate rises, so that the wafer is separated from the etching liquid. During the entire process of separating the wafer from the etching liquid, the wafer is placed stably, so as to avoid damaging the microstructure of the wafer surface and simultaneously avoid pollution or damage caused by improper operation of personnel. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A three-dimensional diagram of a wafer edge damaged layer etching device according to the present invention;

[0019] Figure 2 A three-dimensional diagram of another viewing angle of a wafer edge damaged layer etching device according to the present invention;

[0020] Figure 3 This is a front view of a wafer edge damaged layer etching device according to the present invention;

[0021] Figure 4 This is a main cross-sectional view of a wafer edge damaged layer etching device according to the present invention;

[0022] Figure 5 For the present invention Figure 4 The enlarged structural diagram at A in the middle;

[0023] Figure 6 For the present invention Figure 4 The enlarged structural diagram at B in the middle;

[0024] Figure 7 It is a right sectional view of a wafer edge damaged layer etching device of the present invention;

[0025] Figure 8 This is a three-dimensional diagram of the internal structure of a wafer edge damaged layer etching device of the present invention;

[0026] Fig. 9A three-dimensional diagram of the internal structure of a wafer edge damaged layer etching device according to the present invention from another perspective;

[0027] Fig.10 A top view of the internal structure of a wafer edge damaged layer etching device according to the present invention;

[0028] Fig.11 This is a schematic diagram of the structure of Embodiment 2 of the present invention;

[0029] Fig.12 is a cross-sectional view of embodiment 2 of the present invention;

[0030] Fig.13 Schematic diagram of the structure of the elastic airbag in Example 2 of the present invention.

[0031] In the figure: 1. casing; 2. workbench; 3. etching groove; 4. turntable; 5. positioning groove; 6. guide rod; 7. wafer placement plate; 8. positioning block; 9. vacuum pump; 10. etching liquid filter box; 11. circulation pipe; 12. liquid outlet filter cartridge; 13. circulation pump; 14. liquid outlet pipe; 15. gas pipe; 16. rotary joint; 17. branch pipe; 18. liquid inlet filter cartridge; 19. elastic airbag; 1901. telescopic head; 1902. airbag inlet; 1903. airbag body; 20. suction cup; 21. fixed tooth; 22. bevel gear; 23. drive motor, 24. filter plate; 25. fixed cover; 26. suction cup piston; 2601. first piston head; 2602. piston rod; 2603. second piston head; 27. piston cylinder; 28. reset spring; 29. ​​buffer gasket. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0033] Example 1

[0034] See also Figure 1-10 The present invention provides a technical solution: a wafer edge damaged layer etching device, comprising: a housing 1 and a workbench 2, the housing 1 is provided with a workbench 2 in the middle, an etching groove 3 is provided on the top of the workbench 2, a turntable 4 is provided in the center of the etching groove 3, a positioning groove 5 is provided on the top of the turntable 4, there are four positioning grooves 5, and the four positioning grooves 5 are evenly arranged in the circumferential direction on the turntable 4. It is capable of performing etching operations on multiple wafers at the same time, a guide rod 6 is provided inside the positioning groove 5, a wafer placement plate 7 is provided at the top of the guide rod 6, and a suction cup 20 is provided at the center of the bottom end of the wafer placement plate 7. The suction cup 20 of this embodiment can be an electrostatic suction cup or a vacuum suction cup.

[0035] Furthermore, an elastic airbag 19 is provided at the bottom of the suction cup 20, a branch pipe 17 is provided at the bottom of the elastic airbag 19, a rotary joint 16 is provided at the bottom of the branch pipe 17, an air supply pipe 15 is provided at the bottom of the rotary joint 16, and an air suction and inflation dual-purpose pump 9 is provided on one side of the bottom inner wall of the casing 1, and one end of the air supply pipe 15 is connected to one end of the air suction and inflation dual-purpose pump 9. Negative pressure air is generated by the dual-purpose pump 9 for suction and inflation, and is transported through the air pipe 15 and the branch pipe 17, so that the elastic airbag 19 is negatively inhaled and contracted by the negative pressure air. Under the guidance of the guide rod 6, the wafer placement plate 7 descends, so that the wafer is immersed in the etching liquid in the etching groove 3 for etching. After the etching is completed, positive pressure air is generated by the dual-purpose pump 9 for suction and inflation, and is transported through the air pipe 15 and the branch pipe 17, so that the elastic airbag 19 is positively inflated by the positive pressure air. Under the guidance of the guide rod 6, the wafer placement plate 7 rises, so that the wafer is separated from the etching liquid. During the entire process of separating the wafer from the etching liquid, the wafer is placed stably to avoid damaging the microstructure of the wafer surface, and at the same time avoid pollution or damage caused by improper operation of personnel.

[0036] Furthermore, a fixed tooth 21 is provided at the bottom of the turntable 4, a bevel gear 22 is provided at one side of the workbench 2, a driving motor 23 is provided at one side of the bottom of the workbench 2, one end of the output shaft of the driving motor 23 is fixedly connected to the bevel gear 22, the bevel gear 22 is meshed with the fixed tooth 21, there are multiple fixed teeth 21, and the multiple fixed teeth 21 are evenly arranged in the circumferential direction at the bottom of the turntable 4. During the etching process, the bevel gear 22 is driven to rotate by the driving motor 23, and the bevel gear 22 is meshed with the fixed teeth 21 to realize the rotation of the turntable 4, and the turntable 4 drives the wafer on the wafer placement plate 7 above it to rotate slowly, thereby ensuring uniform contact between the wafer and the etching liquid and improving the etching effect.

[0037] Furthermore, a through hole is opened inside the positioning groove 5, and the guide rod 6 is movably inserted in the through hole. A limit block is provided at the bottom end of the guide rod 6. There are several through holes, and the several through holes are evenly arranged circumferentially inside the positioning groove 5. The guide rod 6 is used to improve the stability of the wafer placement plate 7 during lifting and lowering, and the limit block is used to limit the rising height of the wafer placement plate 7.

[0038] A positioning block 8 is provided on the outer ring of the top of the wafer placement plate 7 , and the positioning blocks 8 are evenly arranged in the circumferential direction on the wafer placement plate 7 .

[0039] Example 2

[0040] On the basis of Example 1, the suction cup 20 used in this embodiment is a vacuum suction cup.

[0041] The specific difference is that the structure of the vacuum suction cup in this embodiment includes a suction cup piston 26 and a piston cylinder 27. There is a notch in the middle of the wafer placement plate 7, and the piston cylinder 27 is fixed on the notch. The piston cylinder 27 is open, and the opening of the piston cylinder 27 is set upward and a guide hole is provided at the bottom of the piston cylinder 27. The suction cup piston 26 includes a piston rod 2602, and the piston rod 2602 is adapted to the guide hole and the two ends of the piston rod 2602 are respectively connected to a first piston head 2601 and a second piston head 2603, the first piston head 2601 is sealingly slidably arranged in the piston cylinder 27, and the second piston head 2603 is located outside the piston cylinder 27, and the top of the elastic airbag 19 is fixedly connected to the second piston head 2603.

[0042] Since the elastic airbag 19 is connected to the branch pipe 17, when the vacuum pump 9 starts to evacuate air, the contraction of the elastic airbag 19 will drive the suction cup piston 26 to move downward as a whole, thereby forming a vacuum on the groove of the wafer placement plate 7 to fix the wafer.

[0043] In this embodiment, the elastic airbag 19 includes an airbag body, the top of the airbag body has a raised telescopic head 1901, the bottom end of the airbag body is provided with an airbag inlet 1902 connected to one end of the branch pipe 17, and the bottom of the wafer placement plate 7 is provided with a fixed cover 25. The bottom end of the fixed cover 25 is provided with a circular hole fixedly connected to the shoulder of the telescopic head 1901. The telescopic head 1901 is located in the fixed cover 25 and is fixedly connected to the second piston head 2603. The inner diameter of the airbag body is larger than the inner diameter of the telescopic head 1901. A reset spring 28 is also provided in the airbag body. The stiffness of the reset spring 28 is greater than the friction between the first piston head 2601 and the inner wall of the piston cylinder 27.

[0044] A fixed cover 25 is provided to ensure the effect of the elastic airbag 19 on the suction cup piston 26. When air is pumped, due to the presence of the reset spring 28, the telescopic head 1901 on the top of the elastic airbag 19 begins to shrink first, and then can stably drive the suction cup piston 26 to move downward as a whole. When the suction cup piston 26 moves down to a suitable position as a whole, that is, after the wafer is fixed, the airbag body of the elastic airbag 19 begins to shrink. At this time, the wafer placement plate 7 begins to move downward, ensuring that the wafer is effectively fixed above the liquid surface, reducing the risk of leakage. At the same time, the cooperation of the first piston head 2601 and the piston cylinder 27 also effectively blocks the possibility of the etching liquid continuing to leak downward, thereby improving the use effect.

[0045] When the vacuum pump 9 is inflating, the airbag body is first expanded and restored by the elastic force of the return spring 28. When the airbag body is restored to the height where the wafer placement plate 7 is above the liquid surface, the vacuum pump 9 continues to inflate, so that the telescopic head 1901 pushes the second piston head 2603 upward, thereby causing the suction cup piston 26 to move upward as a whole, eliminating the vacuum suction applied to the bottom of the wafer, thereby effectively removing the wafer.

[0046] In addition, a buffer pad 29 is provided on the top surface of the wafer placement plate 7 to ensure the quality of the wafer. Due to the buffer pad 29, there is a sealing effect between the buffer pad 29 and the wafer, so the adsorption effect of the wafer can be improved.

[0047] An etching liquid filter box 10 is provided on one side of the inner wall at the bottom of the housing 1, a filter plate 24 is provided on the inner wall of the middle part of the etching liquid filter box 10, a liquid outlet pipe 14 is provided on one side of the bottom of the etching tank 3, and one end of the liquid outlet pipe 14 is located below the filter plate 24. A liquid inlet filter cartridge 18 is provided on one side of the top of the filter plate 24, a circulation pipe 11 is provided inside the liquid inlet filter cartridge 18, the top of the circulation pipe 11 is located just above the center of the turntable 4, a liquid outlet filter cartridge 12 is provided on the top of the circulation pipe 11, and a circulation pump 13 is provided on one side of the top of the etching liquid filter box 10, and the circulation pump 13 is connected to the circulation pipe 11. The etching liquid enters below the filter plate 24 through the liquid outlet pipe 14, and after multi-stage filtration using the filter plate 24, the liquid inlet filter cartridge 18, and the liquid outlet filter cartridge 12, it re-enters the etching tank 3 through the circulation pump 13 and the circulation pipe 11 to ensure the cleanliness of the etching liquid, thereby improving the quality of the etching process.

[0048] Further, in the above-mentioned embodiments 1 and 2, the role of the circulating pump 13 is to promote the etching liquid to circulate in the entire system, ensuring that the liquid can flow from the etching tank 3 to the filter box 10 and return to the etching tank 3 again. The design of the circulation pipe 11 and the liquid outlet filter cartridge 12 may be used to ensure that the etching liquid can be evenly distributed on the workpiece on the turntable 4, thereby achieving a uniform etching effect. By recycling the etching liquid, the waste of materials can be reduced and the etching efficiency can be improved. Automated liquid circulation and filtration reduce the manual intervention required in the etching process, reducing the labor intensity and the possibility of operating errors.

[0049] In addition, during the etching process, new etching solution may be injected into the etching solution filter box 10 to ensure the concentration of the etching solution in the etching tank 3 .

[0050] A hollow shaft is provided at the center of the bottom of the turntable 4, and the turntable 4 is rotatably connected to the etching groove 3 through the hollow shaft. One end of the branch pipe 17 passes through the hollow shaft and is connected to the rotary joint 16. When the turntable 4 rotates, the branch pipe 17 and the hollow shaft rotate together with the turntable 4. The connection of the rotary joint 16 ensures that the branch pipe 17 is not affected by the rotation.

[0051] The height stroke of the elastic airbag 19 when inflating and deflating is greater than the depth of the etching groove 3, so that the height of the elastic airbag 19 after inflation can be ensured, and the wafer on the wafer placement plate 7 can be completely separated from the etching liquid, which is convenient for removing the wafer.

[0052] When the wafer edge damage layer etching device is in use, the wafer to be etched is placed on the wafer placement plate 7, and the wafer is positioned by the positioning block 8. When etching is required, negative pressure air is generated by the dual-purpose pump 9 for air extraction and air pumping. Through the delivery of the air pipe 15 and the branch pipe 17, the negative pressure air performs negative pressure suction and contraction on the elastic air bag 19. Under the guidance of the guide rod 6, the wafer placement plate 7 descends, so that the wafer is immersed in the etching liquid in the etching groove 3 for etching. After the etching is completed, positive pressure air is generated by the dual-purpose pump 9 for air extraction and air pumping. Through the delivery of the air pipe 15 and the branch pipe 17, the positive pressure air performs positive pressure inflating and inflating on the elastic air bag 19. Under the guidance of the guide rod 6, the wafer placement plate 7 rises, so that the wafer is separated from the etching liquid. During the entire process of separating the wafer from the etching liquid, the wafer is placed stably to avoid damaging the microstructure of the wafer surface, and at the same time avoid pollution or damage caused by improper operation of personnel.

[0053] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work shall fall within the scope of protection of the present invention.

Claims

1. A wafer edge damaged layer etching device, comprising: A casing (1) and a workbench (2), characterized in that: a workbench (2) is provided in the middle of the casing (1), an etching groove (3) is provided on the top of the workbench (2), a turntable (4) is provided in the center of the etching groove (3), a positioning groove (5) is provided on the top of the turntable (4), a guide rod (6) is provided inside the positioning groove (5), a wafer placement plate (7) is provided on the top of the guide rod (6), an adsorption component is provided on the wafer placement plate (7), an elastic air bag (19) is provided at the bottom end of the adsorption component, a branch pipe (17) is provided at the bottom end of the elastic air bag (19), a rotary joint (16) is provided at the bottom end of the branch pipe (17), an air supply pipe (15) is provided at the bottom end of the rotary joint (16), a vacuum pump (9) is provided on one side of the inner wall of the bottom of the casing (1), and one end of the air supply pipe (15) is connected to one end of the vacuum pump (9); The adsorption assembly comprises a suction cup piston (26) and a piston cylinder (27), the middle part of the wafer placement plate (7) has a notch, the piston cylinder (27) is fixed on the notch, the piston cylinder (27) is open, the opening of the piston cylinder (27) is arranged upward and a guide hole is arranged at the bottom of the piston cylinder (27), the suction cup piston (26) comprises a piston rod (2602), the piston rod (2602) is adapted to the guide hole and the two ends of the piston rod (2602) are respectively connected to a first piston head (2601) and a second piston head (2603), the first piston head (2601) is sealingly slidably arranged in the piston cylinder (27), the second piston head (2603) is located outside the piston cylinder (27), and the top end of the elastic airbag (19) is fixedly connected to the second piston head (2603); The elastic airbag (19) comprises an airbag body, the top of the airbag body has a protruding telescopic head (1901), the bottom end of the airbag body is provided with an airbag inlet (1902) connected to one end of the branch pipe (17), the bottom of the wafer placement plate (7) is provided with a fixed cover (25), the bottom end of the fixed cover (25) is provided with a circular hole fixedly connected to the shoulder of the telescopic head (1901), the telescopic head (1901) is located in the fixed cover (25) and is fixedly connected to the second piston head (2603), the inner diameter of the airbag body is larger than the inner diameter of the telescopic head (1901), and a return spring (28) is also provided in the airbag body, and the stiffness of the return spring (28) is greater than the friction between the first piston head (2601) and the inner wall of the piston cylinder (27); When the air is evacuated, due to the presence of the return spring (28), the telescopic head (1901) on the top of the elastic airbag (19) begins to shrink first, thereby being able to stably drive the suction cup piston (26) to move downward as a whole. When the suction cup piston (26) moves downward to a suitable position as a whole, that is, after the wafer is fixed, the airbag body of the elastic airbag (19) begins to shrink. At this time, the wafer placement plate (7) begins to move downward, so that the wafer is immersed in the etching liquid in the etching tank (3), and ensures that the wafer is effectively fixed above the liquid surface. When inflating, the airbag body is first expanded and restored by the elastic force of the return spring (28). When the airbag body is restored to the height where the wafer placement plate (7) is above the liquid surface, the vacuum pump (9) continues to inflate, causing the telescopic head (1901) to push the second piston head (2603) upward, thereby causing the suction cup piston (26) to move upward as a whole, eliminating the vacuum suction applied to the bottom of the wafer, thereby effectively removing the wafer.

2. The wafer edge damaged layer etching device according to claim 1, characterized in that: A fixed tooth (21) is provided at the bottom of the turntable (4), a bevel gear (22) is provided on one side of the workbench (2), a drive motor (23) is provided on one side of the bottom of the workbench (2), one end of an output shaft of the drive motor (23) is fixedly connected to the bevel gear (22), the bevel gear (22) is meshed with the fixed tooth (21), there are a plurality of fixed teeth (21), and the plurality of fixed teeth (21) are evenly arranged in a circumferential direction at the bottom of the turntable (4).

3. The wafer edge damaged layer etching device according to claim 1, characterized in that: A through hole is provided inside the positioning groove (5), the guide rod (6) is movably inserted into the through hole, a limit block is provided at the bottom end of the guide rod (6), there are a plurality of through holes, and the plurality of through holes are evenly arranged in the circumferential direction inside the positioning groove (5).

4. The wafer edge damaged layer etching device according to claim 1, characterized in that: Positioning blocks (8) are provided on the outer ring of the top of the wafer placement plate (7), and the positioning blocks (8) are evenly arranged in the circumferential direction on the wafer placement plate (7).

5. The wafer edge damaged layer etching device according to claim 1, characterized in that: A buffer pad (29) is provided on the top end surface of the wafer placement plate (7).

6. The wafer edge damaged layer etching device according to claim 1, characterized in that: An etching liquid filter box (10) is provided on one side of the inner wall at the bottom of the housing (1), a filter plate (24) is provided on the inner wall at the middle of the etching liquid filter box (10), a liquid outlet pipe (14) is provided on one side of the bottom of the etching tank (3), one end of the liquid outlet pipe (14) is located below the filter plate (24); a liquid inlet filter cartridge (18) is provided on one side of the top of the filter plate (24), a circulation pipe (11) is provided inside the liquid inlet filter cartridge (18), the top end of the circulation pipe (11) is located directly above the center of the turntable (4), a liquid outlet filter cartridge (12) is provided on the top of the circulation pipe (11), and a circulation pump (13) is provided on one side of the top of the etching liquid filter box (10), the circulation pump (13) is connected to the circulation pipe (11).

7. The wafer edge damaged layer etching device according to claim 1, characterized in that: A hollow rotating shaft is provided at the center of the bottom of the rotating disk (4), and one end of the branch pipe (17) passes through the hollow rotating shaft and is connected to the rotating joint (16).

8. The wafer edge damaged layer etching device according to claim 1, characterized in that: The height travel of the elastic airbag (19) when inflating and deflating air is greater than the depth of the etched groove (3).

Images