A heat dissipation device and monitoring system for an infrared detector used in aerospace

Abstract

The present invention provides a heat dissipation device and a monitoring system for an infrared detector used in aerospace. The heat dissipation device includes: a translation mechanism, a primary flexible heat dissipation member, a driving assembly, and a secondary flexible heat dissipation member. An installation surface for placing the infrared detector is provided on the primary flexible heat dissipation member. The primary flexible heat dissipation member is arranged on the translation mechanism and is used for conducting the heat of the infrared detector to the translation mechanism. The driving assembly is arranged on the lower end surface of the translation mechanism and is used to drive the translation mechanism to move, thereby driving the infrared detector to move. The secondary flexible heat dissipation member is used to connect the translation mechanism and the driving assembly to conduct the heat collected by the translation mechanism to the driving assembly. In this way, while ensuring that the infrared detector moves normally for detection, heat dissipation of the infrared detector is also achieved, and the heat dissipation effect is good.

Description

[0001] The present invention relates to a heat dissipation device and a monitoring system for an infrared detector used in aerospace. This application claims priority. The application number of the prior application is: 202410856176.0, the title: A heat dissipation device and a monitoring system for an infrared detector used in aerospace, and the priority date: June 28, 2024. Technical Field

[0002] The present invention relates to the technical field of star sensors, and particularly to a heat dissipation device and a monitoring system for an infrared detector used in aerospace. Background Art

[0003] With the continuous development of aerospace technology, people's exploration of space is becoming more and more inclined to deep space, which requires obtaining accurate spatial positioning position information. Currently, mainly through astronomical navigation to measure celestial bodies for carrier orientation and positioning navigation, which has many advantages such as high measurement accuracy, no interference, no time drift, and high reliability.

[0004] Among them, the star measurement technology of the sensor in astronomical navigation is the key to achieving high-precision, all-weather navigation. The star measurement sensor (star sensor) generally uses an infrared detector. The fixed image noise generated by the imaging of this type of detector is caused by the uneven dark current of each pixel in the sensor. However, this type of infrared detector needs to work at high power for a long time during operation, resulting in too high a temperature of the infrared detector, which has an adverse effect on its imaging accuracy. In the prior art, the infrared detector is mostly installed on a heat dissipation bracket, but due to space limitations, the heat dissipation effect is not good, and the infrared detector cannot move relative to the heat dissipation bracket, which has an adverse effect on the detection effect of the infrared detector.

[0005] Therefore, the present invention is dedicated to providing a heat dissipation device and a monitoring system for an infrared detector used in aerospace to solve the above problems. Summary of the Invention

[0006] The object of the present invention is to provide a heat dissipation device and a monitoring system for an infrared detector used in aerospace. The heat dissipation device has a simple structure and ingenious design. While ensuring the movement of the infrared detector for detection work, it also realizes the heat dissipation of the infrared detector, improves the heat dissipation of the infrared detector during mobile work, and further improves the imaging effect of the infrared detector.

[0007] The technical solution provided by the present invention is as follows:

[0008] A heat dissipation device for an infrared detector used in aerospace, comprising:

[0009] A translation mechanism.

[0010] The first-level flexible heat dissipation component, on which there is a mounting surface for placing an infrared detector, is arranged on the translation mechanism and is used to conduct the heat of the infrared detector to the translation mechanism.

[0011] The driving component is arranged on the lower end surface of the translation mechanism and is used to drive the translation mechanism to move, thereby driving the infrared detector to move.

[0012] The second-level flexible heat dissipation component is used to connect the translation mechanism and the driving component to conduct the heat collected by the translation mechanism to the driving component;

[0013] The translation mechanism includes a first translation frame member and a second translation frame member spaced below the first translation frame member. The two ends in the length direction of the first-level flexible heat dissipation component are respectively connected to the two ends of the second translation frame member, and one side of the first translation frame member away from the second translation frame member is fixedly connected to the first-level flexible heat dissipation component, so that the first translation frame member can move along the length direction of the first-level flexible heat dissipation component;

[0014] The second-level flexible heat dissipation component is used to connect the second translation frame member and the driving component, and the second translation frame member is adapted to move along the width direction of the first-level flexible heat dissipation component.

[0015] In some embodiments, the first-level flexible heat dissipation component includes a mounting member and a first-level heat conduction belt. Connectors are arranged at the two ends in the length direction of the first-level heat conduction belt, and the connectors are used to connect to the ends of the second translation frame member.

[0016] The mounting member is arranged on the first-level heat conduction belt and is arranged relative to the first translation frame member.

[0017] In some embodiments, the mounting member includes a mounting frame arranged above the first-level heat conduction belt and a heat conduction pressing plate arranged below the first-level heat conduction belt.

[0018] The heat conduction pressing plate is adapted to be clamped and matched with the mounting frame to arrange the mounting member on the first-level heat conduction belt. The side of the mounting frame away from the heat conduction pressing plate is the mounting surface, and the heat conduction pressing plate is fixedly connected to the first translation frame member.

[0019] In some embodiments, the first-level heat conduction belt has two spaced bending parts in the length direction to form a protruding part between the two bending parts. The protruding part extends into the mounting frame and contacts the infrared detector located on the mounting surface.

[0020] In some embodiments, the mounting member further includes an elastic gasket, and the elastic gasket is disposed between the heat-conducting pressing plate and the first-level heat-conducting belt.

[0021] In some embodiments, the driving assembly includes a mounting base, a first driving member and a second driving member disposed on the mounting base. The mounting base is movably disposed below the second translation frame member. The first driving member is in transmission connection with the first translation frame member to drive the first translation frame member to move along the length direction of the first-level flexible heat dissipation member.

[0022] The second driving member is in transmission connection with the second translation frame member to drive the second translation frame member to move along the width direction of the first-level flexible heat dissipation member.

[0023] In some embodiments, the second-level flexible heat dissipation member includes two second-level heat-conducting belts, and the two second-level heat-conducting belts are disposed at both ends in the width direction of the first-level flexible heat dissipation member to connect the second translation frame member and the driving assembly.

[0024] In some embodiments, the driving assembly further includes a heat dissipation bottom plate disposed at one end of the mounting base away from the second translation frame member.

[0025] One end of the second-level heat-conducting belt is connected to the second translation frame member, and the other end of the second-level heat-conducting belt is connected to the heat dissipation bottom plate.

[0026] A monitoring system for a heat dissipation device of an aerospace infrared detector includes a control module, a first acquisition module, a second acquisition module, a third acquisition module, a first calculation module, a second calculation module and a processing module, and a heat dissipation device of an aerospace infrared detector according to any one of the above.

[0027] The heat dissipation device of the aerospace infrared detector includes a first-level flexible heat dissipation member, a second-level flexible heat dissipation member, a mounting base, a heat dissipation bottom plate, a first translation frame member and a second translation frame member. The first translation frame member, the second translation frame member, the mounting base and the heat dissipation bottom plate are arranged in sequence from top to bottom.

[0028] The control module is configured to preset the operating power consumption Q of the infrared detector and control the driving assembly to drive the infrared sensor to move.

[0029] The first acquisition module is configured to acquire the temperature of the infrared detector.

[0030] The second acquisition module is configured to acquire the temperature of the second translation frame member.

[0031] The third acquisition module is configured to acquire the temperature of the heat dissipation bottom plate.

[0032] The first calculation module is configured to calculate the heat conduction amount Q of the first-stage flexible heat dissipation member according to the temperature of the infrared detector and the temperature of the second translation frame member A .

[0033] The second calculation module is configured to calculate the heat conduction amount Q of the second-stage flexible heat dissipation member according to the temperature of the second translation frame member and the temperature of the heat dissipation bottom plate B .

[0034] The processing module is configured to use the heat conduction amount Q of the first-stage flexible heat dissipation member A , the heat conduction amount Q of the second-stage flexible heat dissipation member B Compare with the Q operating power consumption of the preset infrared detector to obtain the heat value absorbed by the heat dissipation device of the spaceborne infrared detector

[0035] Through a heat dissipation device and a monitoring system for a spaceborne infrared detector provided by the present invention, the following beneficial effects are achieved

[0036] 1. A heat dissipation device for a spaceborne infrared detector provided by the present invention. The heat dissipation device for the spaceborne infrared detector is configured such that the infrared detector is disposed on the upper end surface of the first-stage flexible heat dissipation member. Both ends of the first-stage flexible heat dissipation member in the length direction are connected to the translation mechanism. The second-stage flexible heat dissipation member is used to connect the translation mechanism and the driving component. Such that the heat generated by the infrared detector is transferred to the translation mechanism through the first-stage flexible heat dissipation member, and the heat transferred to the translation mechanism is further transferred to the driving component through the second-stage flexible heat dissipation member. The driving component can drive the infrared detector to move. While realizing the movement of the infrared detector, the heat generated during the operation of the infrared detector can also be discharged in time, ensuring the infrared detector and meeting the imaging requirements of the infrared detector

[0037] 2. A heat dissipation device for a spaceborne infrared detector provided by the present invention. The infrared detector can be directly disposed on the heat dissipation device. The structure is simple and no additional connecting device needs to be provided, reducing both the material cost and the satellite launch cost

[0038] 3. A heat dissipation device for a spaceborne infrared detector provided by the present invention. The first translation frame member is disposed at intervals on the upper end surface of the second translation frame member. Both ends of the first-stage heat conduction belt in the length direction are disposed at both ends of the second translation frame member. The first-stage heat conduction belt has good flexibility, such that the first translation frame member and the infrared detector can move along the length direction of the first-stage heat conduction belt. Moreover, the second translation frame member moves along the width direction of the first-stage heat conduction belt, which can drive the first translation frame member and the infrared detector to move along the width direction of the first-stage heat conduction belt, realizing the two-dimensional movement of the infrared detector, with higher flexibility and further meeting the detection requirements of the infrared detector

[0039] 4. The heat dissipation device for an aerospace infrared detector provided by the present invention has a protrusion formed between two bent portions of the first heat conduction belt, so that the protrusion is in full contact with the infrared detector, ensuring the heat dissipation effect of the first heat conduction belt and further improving the heat dissipation effect of the heat dissipation device.

[0040] 5. The monitoring system of the heat dissipation device for an aerospace infrared detector provided by the present invention can obtain the heat conduction amounts of the first flexible heat dissipation member and the second flexible heat dissipation member, and compare them with the preset working power consumption of the infrared detector, thereby realizing the monitoring of the heat dissipation effect of the heat dissipation device to reflect the working states of the infrared detector and the heat dissipation device, and providing a judgment basis for the staff. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The following will further illustrate the above-mentioned characteristics, technical features, advantages and their implementation manners of the solution in a clear and understandable manner in combination with the drawings of the preferred embodiments.

[0042] Figure 1 is a schematic structural diagram of the heat dissipation device for an aerospace infrared detector provided by the present invention;

[0043] Figure 2 is a schematic structural diagram of the first flexible heat dissipation member of the heat dissipation device for an aerospace infrared detector provided by the present invention;

[0044] Figure 3 is an exploded view of the first flexible heat dissipation member of the heat dissipation device for an aerospace infrared detector provided by the present invention;

[0045] Figure 4 is a front view of the heat dissipation device for an aerospace infrared detector provided by the present invention;

[0046] Figure 5 is a schematic module diagram of the monitoring system of the heat dissipation device for an aerospace infrared detector provided by the present invention.

[0047] Description of the reference numerals in the drawings:

[0048] Translation mechanism 1, first translation frame member 11, second translation frame member 12;

[0049] First flexible heat dissipation member 2, mounting member 21, mounting frame 211, heat conduction pressing plate 212, elastic gasket 213, first heat conduction belt 22, bent portion 221, protrusion 222, connecting member 223, first pressing plate 23;

[0050] Drive assembly 3, mounting seat 31, heat dissipation bottom plate 32;

[0051] Second flexible heat dissipation member 4, second heat conduction belt 41, second pressing plate 42;

[0052] Infrared detector 5;

[0053] Control module 61, first acquisition module 62, second acquisition module 63, third acquisition module 64, first calculation module 65, second calculation module 66, processing module 67. Detailed implementation

[0054] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the specific implementation manners of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts, and other implementation manners can also be obtained.

[0055] For the sake of simplicity of the drawings, only the parts related to the present invention are schematically shown in each figure, and they do not represent their actual structures as products. In addition, for the sake of simplicity and easy understanding of the drawings, in some figures, components with the same structure or function are only schematically shown for one of them, or only one of them is marked. In this article, "one" not only means "only this one", but also means "more than one" situation.

[0056] In this article, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0057] In addition, in the description of this application, the terms "first", "second", etc. are only used for distinguishing descriptions, and cannot be understood as indicating or implying relative importance.

[0058] In one embodiment, a heat dissipation device for an aerospace infrared detector is described. While realizing the movement of the infrared detector 5 to ensure the detection of the infrared detector 5, it can also timely discharge the heat generated when the infrared detector 5 works, reduce heat accumulation, and thus ensure the imaging requirements of the infrared detector 5.

[0059] Specifically, refer to the accompanying drawings of the specification Figures 1 to 4, A heat dissipation device for an aerospace infrared detector includes a translation mechanism 1, a primary flexible heat dissipation member 2, a secondary flexible heat dissipation member 4, and a drive assembly 3. Among them, the primary flexible heat dissipation member 2 is located on the translation mechanism 1, and an installation surface is provided on the primary flexible heat dissipation member 2 for installing the infrared detector 5, so as to install the infrared detector 5 on the primary flexible heat dissipation member 2. The heat generated when the infrared detector 5 operates can be transferred to the primary flexible heat dissipation member 2 and then transferred to the translation mechanism 1 through the primary flexible heat dissipation member 2.

[0060] Correspondingly, the drive assembly 3 is arranged on the lower end surface of the translation mechanism 1 to drive the translation mechanism 1 to move, and then drive the infrared detector 5 to move, so as to adjust the positional relationship of the infrared detector 5 and realize the adjustment of the detection area of the infrared detector 5. In addition, the secondary flexible heat dissipation member 4 is used to connect the translation mechanism 1 and the drive assembly 3, so that the heat transferred from the infrared detector 5 to the translation mechanism 1 is further transferred to the drive assembly 3 through the secondary flexible heat dissipation member 4, thereby realizing the secondary heat dissipation of the infrared detector 5.

[0061] In the prior art, most aerospace infrared detectors are provided with special brackets and corresponding heat dissipation treatments for the brackets, so that the heat generated when the infrared detector 5 operates can be discharged through the brackets. However, the infrared detector 5 needs to move during operation to obtain a larger detection range, and the existing technology often does not take this into account, resulting in the infrared detector 5 being fixedly installed on the bracket and unable to move, greatly reducing the observation effect of the infrared detector 5. Even if some consider the movement requirements of the infrared detector 5, most are to set a drive assembly to drive the infrared detector 5 and the bracket to move together. The volume and weight of the bracket are large, resulting in an increase in the overall volume and weight of the drive assembly and the infrared detector, which is not conducive to the miniaturization of satellites.

[0062] In this embodiment, the infrared detector 5 is arranged on the primary flexible heat dissipation member 2 of the heat dissipation device. The drive assembly 3 drives the translation mechanism 1 to move and then drives the infrared detector 5 to move. There is no need to drive the infrared detector 5 and the heat dissipation device to move together, reducing the volume and weight of the heat dissipation device, realizing the mobile detection of the infrared detector 5, ensuring the detection effect of the infrared detector 5, and being conducive to the miniaturization of devices such as satellites. Moreover, the heat generated when the infrared detector 5 operates can be sequentially transferred to the drive assembly 3 through the primary flexible heat dissipation member 2 and the secondary flexible heat dissipation member 4, realizing secondary heat dissipation, improving the heat transfer and heat dissipation efficiency, enabling the infrared detector 5 to be in a stable temperature range, and meeting the temperature requirements for the best imaging of the infrared detector 5.

[0063] In one embodiment, refer to the accompanying drawings of the specification Figure 1, this embodiment further describes the translation mechanism 1. Among them, the translation mechanism 1 includes a first translation frame member 11 and a second translation frame member 12, and the first translation frame member 11 is spaced apart from the upper end surface of the second translation frame member 12, and there is no mutual contact between the two. Correspondingly, both ends of the first-stage flexible heat dissipation member 2 in the length direction are respectively oppositely arranged at both ends of the second translation frame member 12, and the side of the first translation frame member 11 away from the second translation frame member 12 is connected to the first-stage flexible heat dissipation member 2 (the middle part of the first-stage flexible heat dissipation member 2 is connected), so as to install and fix the part of the first-stage flexible heat dissipation member 2 facing the infrared detector 5 on the side of the first translation frame member 11 away from the second translation frame member 12. It can be understood that by arranging the first translation frame member 11 and the second translation frame member 12 at intervals, and the first-stage flexible heat dissipation member 2 has a certain flexibility, the first translation frame member 11 moves relative to the second translation frame member 12 along the length direction of the first-stage flexible heat dissipation member 2, thereby driving the infrared detector 5 to move along the length direction of the first-stage flexible heat dissipation member 2.

[0064] In addition, the second translation frame member 12 is movably arranged on the upper end surface of the driving component 3, and the second-stage flexible heat dissipation member 4 is used to connect the second translation frame member 12 and the driving component 3, so that the heat transferred from the infrared detector 5 to the second translation frame member 12 through the first-stage flexible heat dissipation member 4 is transferred to the driving component 3 through the second-stage flexible heat dissipation member 4.

[0065] Moreover, the second translation frame member 12 can move along the width direction of the first-stage flexible heat dissipation member 2. After the second translation frame member 12 moves a certain distance along the width direction of the first-stage flexible heat dissipation member 2, it drives the first translation frame member 11 and the infrared detector 5 to move along the width direction of the first-stage flexible heat dissipation member 2. Therefore, by arranging the infrared detector 5 on this heat dissipation device, the infrared detector 5 can be moved along the length direction and the width direction of the first-stage flexible heat dissipation member 2, which is convenient for the infrared detector 5 to adjust its position to adjust the detection range.

[0066] Furthermore, this embodiment further describes the driving component 3. Refer to the accompanying drawings of the specification Figure 4 , the driving component 3 includes a mounting seat 31, a first driving member and a second driving member, and the first driving member and the second driving member are arranged on the mounting seat 31. Among them, the mounting seat 31 is movably arranged on the lower end surface of the second translation frame member 12, the first driving member is in transmission connection with the first translation frame member 11, and drives the first translation frame member 11 to move along the length direction of the first-stage flexible heat dissipation member 2, and the second driving member is in transmission connection with the second translation frame member 12, and is used to drive the second translation frame member 12 to move along the width direction of the first-stage flexible heat dissipation member 2.

[0067] Specifically, two oppositely arranged sliding tracks are provided on the lower end surface of the second translation frame member 12. The two sliding tracks are located at both ends of the first-stage flexible heat dissipation member 2 in the length direction. Each sliding track extends along the width direction of the first-stage flexible heat dissipation member 2. One end of the mounting seat 31 close to the second translation frame member 12 is provided with a slider that cooperates with the sliding track. The slider is arranged in the sliding track so that the second translation frame member 12 moves along the width direction of the first-stage flexible heat dissipation member 2.

[0068] Furthermore, referring to the accompanying drawings of the specification Figure 4 , the driving assembly 3 further includes a heat dissipation bottom plate 32. The heat dissipation bottom plate 32 is arranged at one end of the mounting seat 31 away from the second translation frame member 12. One end of the second-stage flexible heat dissipation member 4 is connected to the second translation frame member 12, and the other end of the second-stage flexible heat dissipation member 4 is connected to the heat dissipation bottom plate 32. So that the heat generated by the infrared detector 5 is transferred to the heat dissipation bottom plate 32 after the action of the first-stage flexible heat dissipation member 2 and the second-stage flexible heat dissipation member 4. The arrangement of the heat dissipation bottom plate 32 can timely disperse the heat transferred to the second-stage flexible heat dissipation member 4 and timely cool the first-stage flexible heat dissipation member 2 and the second-stage flexible heat dissipation member 4, thereby ensuring the heat dissipation effect of the first-stage flexible heat dissipation member 2 and the second-stage flexible heat dissipation member 4.

[0069] In one embodiment, referring to the accompanying drawings of the specification Figures 2 to 4 , this embodiment further describes the first-stage flexible heat dissipation member 2. Among them, the first-stage flexible heat dissipation member 2 includes a mounting member 21 and a first-stage heat conduction belt 22. Both ends of the first-stage heat conduction belt 22 in the length direction are connecting members 223, and the connecting members 223 are used to connect to the opposite ends of the second translation frame member 12. Correspondingly, the mounting member 21 is arranged on the first-stage heat conduction belt 22 and is arranged opposite to the first translation frame member 11. The infrared detector 5 is arranged on the side of the mounting member 21 away from the first translation frame member 11, and the mounting member 21 is adapted to be snap-fitted with the first translation frame member 11, so that the middle part of the first-stage flexible heat dissipation member 2 is mounted on the first translation frame member 11, and the connecting members 223 on the first-stage flexible heat dissipation member 2 are fixed on the second translation frame member 12. Thus, when the first translation frame member 11 moves, it drives the infrared detector 5 to move.

[0070] The infrared detector 5 and the mounting member 21 can be fixedly connected by screws, and the mounting member 21 and the first translation frame member 11 can also be fixedly connected by screws. Of course, in actual production applications, other structures can also be used to achieve the purpose of connecting and fixing the infrared detector 5, the mounting member 21, and the first translation frame member 11, which will not be elaborated here one by one and are all within the protection scope of the present invention.

[0071] It should be noted that the connecting members 223 at both ends of the first-level heat conduction belt 22 in the length direction are set as the first pressing plates 23. The first pressing plates 23 have a certain rigidity and can serve as force-bearing support points. By providing through holes on the second translation frame member 12, the first pressing plates 23, and the first-level heat conduction belt 22, the connection and fixation of the three are realized through bolts.

[0072] Furthermore, the mounting member 21 includes a mounting frame 211 and a heat conduction pressing plate 212. The mounting frame 211 is arranged above the first-level heat conduction belt 22, and the heat conduction pressing plate 212 is arranged below the first-level heat conduction belt 22. The heat conduction pressing plate 212 is adapted to be snap-fitted with the mounting frame 211. Thus, the middle part of the first-level heat conduction belt 22 is arranged between the mounting frame 211 and the heat conduction pressing plate 212 to realize the connection and fixation of the mounting member 21 and the first-level heat conduction belt 22. In addition, one side of the mounting frame 211 away from the heat conduction pressing plate 212 is set as a mounting surface to mount the infrared detector 5 on the mounting surface of the mounting frame 211. The heat conduction pressing plate 212 is fixedly connected to the first translation frame member 11, thereby realizing the installation of the mounting member 21 and the first translation frame member 11.

[0073] It can be understood that the heat generated by the infrared detector 5 is transferred to the mounting frame 211 and then to the first-level heat conduction belt 22.

[0074] Preferably, the first-level heat conduction belt 22 has two oppositely arranged bending parts 221 in the length direction of the first-level heat conduction belt 22 to form a protruding part 222 between the two bending parts 221 of the first-level heat conduction belt 22. When the first-level heat conduction belt 22 is arranged between the mounting frame 211 and the heat conduction pressing plate 212, the protruding part 222 can extend into the interior of the mounting frame 211, so that the protruding part 222 is in contact with the infrared detector 5 located on the mounting surface.

[0075] It should be noted that when the mounting member 21 is arranged on the first-level heat conduction belt 22, the protruding part 222 of the first-level heat conduction belt 22 can be directly in contact with the infrared detector 5, so that in addition to the heat of the infrared detector 5 being transferred to the first-level heat conduction belt 22 through the mounting frame 211, it can also be directly transferred to the protruding part 222 and then transferred to the second translation frame member 12 through the end of the first-level heat conduction belt 22.

[0076] In addition, referring to the accompanying drawings of the specification Figure 3 , this embodiment further describes the mounting member 21. The mounting member 21 further includes an elastic gasket 213, and the elastic gasket 213 is arranged between the heat conduction pressing plate 212 and the first-level heat conduction belt 22. The arrangement of the elastic gasket 213 can protect the first-level heat conduction belt 22.

[0077] Preferably, the elastic gasket 213 can be made of silicone material. The silicone material has good thermal conductivity and certain elasticity, and can play a role in buffering and shock absorption. In actual production applications, other materials can also be used, which will not be elaborated one by one here, and all are within the protection scope of the present invention.

[0078] In one embodiment, referring to the accompanying drawings of the specification Figures 1 to 3 , this embodiment further describes the secondary flexible heat dissipation member 4. Among them, the secondary flexible heat dissipation member 4 includes two secondary heat conduction belts 41, and the two secondary heat conduction belts 41 are arranged at both ends in the width direction of the primary flexible heat dissipation member 2. Among them, one end of each secondary heat conduction belt 41 is fixedly connected to the second translation frame member 12, and the other end of each secondary heat conduction belt 41 is fixedly connected to the heat dissipation bottom plate 32.

[0079] In addition, second pressing plates 42 are also arranged at both ends in the length direction of each secondary heat conduction belt 41. The second pressing plates 42 also have a certain rigidity to provide force-bearing support points. The second pressing plates 42 can be fixedly connected to the second translation frame member 12 and the heat dissipation bottom plate 32 through bolts.

[0080] Preferably, a thermal grease is arranged at one end of the protruding portion 222 away from the first translation frame member 11, and a thermal grease is also arranged at the connection between the primary heat conduction belt 22 and the second translation frame member 12. The thermal grease has a high thermal conductivity and can quickly transfer the heat generated by the infrared detector 5 to the heat dissipation bottom plate 32.

[0081] In one embodiment, referring to Figure 5 , this embodiment provides a monitoring system for a heat dissipation device of an aerospace infrared detector, including a control module 61, a first acquisition module 62, a second acquisition module 63, a third acquisition module 64, a first calculation module 65, a second calculation module 66 and a processing module 67, and a heat dissipation device of an aerospace infrared detector described in any of the above embodiments.

[0082] The heat dissipation device of the aerospace infrared detector includes a primary flexible heat dissipation member 2, a secondary flexible heat dissipation member 4, a mounting seat 31, a heat dissipation bottom plate 32, a first translation frame member 11 and a second translation frame member 12. The first translation frame member 11, the second translation frame member 12, the mounting seat 31 and the heat dissipation bottom plate 32 are arranged in sequence from top to bottom.

[0083] The control module 61 is used to preset the working power consumption Q of the infrared detector and control the driving assembly to drive the infrared sensor to move;

[0084] The first acquisition module 62 is used to acquire the temperature of the infrared detector 5;

[0085] The second acquisition module 63 is used to acquire the temperature of the second translation frame member 12;

[0086] The third acquisition module 64 is configured to acquire the temperature of the heat dissipation base plate 32;

[0087] The first calculation module 65 is configured to calculate the heat conduction quantity Q of the first-stage flexible heat dissipation member 2 according to the temperature of the infrared detector 5 and the temperature of the second translation frame member 12 A ;

[0088] The second calculation module 66 is configured to calculate the heat conduction quantity Q of the second-stage flexible heat dissipation member 4 according to the temperature of the second translation frame member 12 and the temperature of the heat dissipation base plate 32 B ;

[0089] The processing module 67 is configured to compare the heat conduction quantity Q of the first-stage flexible heat dissipation member 2 A , the heat conduction quantity Q of the second-stage flexible heat dissipation member 4 B with the preset Q operating power consumption of the infrared detector 5 to obtain the heat value absorbed by the heat dissipation device of the spaceborne infrared detector, and this heat value is used for the staff to judge the working state of the infrared detector and the heat dissipation effect of the heat dissipation device of the spaceborne infrared detector.

[0090] It can be understood that the power consumption of the infrared detector 5 mainly includes the power consumption of the infrared detector 5 itself and the TEC power consumption inside the detector body. The control module 61 sets the power consumption of the infrared detector 5, sets the operating power consumption of the infrared detector 5 during operation to be Q, and then controls the driving assembly 3 to drive the infrared detector 5 to move. The first acquisition module 62 is configured to acquire the temperature of the infrared detector 5, the second acquisition module 63 is configured to acquire the temperature of the second translation frame member 12, and the third acquisition module 64 is configured to acquire the temperature of the heat dissipation base plate 32. Then, the first calculation module 65 calculates the heat conduction quantity Q of the first-stage flexible heat dissipation member 2 according to the temperature of the infrared detector 5 and the temperature of the second translation frame member 12 A , and then calculates the heat conduction quantity QB of the second-stage flexible heat dissipation member 4 according to the temperature of the second translation frame member 12 and the temperature of the heat dissipation base plate 32.

[0091] It should be noted that the temperature of the infrared detector 5, the temperature of the second translation frame member 12, and the temperature of the heat dissipation base plate 32 can be the temperatures during the movement of the infrared detector 5. The Q obtained by the first calculation module 65 A is the heat conduction quantity of the first-stage flexible heat dissipation member 2 during a certain working period, and the Q obtained by the second calculation module 66 BThe heat conduction quantity of the secondary flexible heat dissipation component 4 during a certain working period can be calculated through multiple measurements, accurately reflecting the heat dissipation effects of the primary flexible heat dissipation component 2 and the secondary flexible heat dissipation component 4 during the operation of the infrared detector 5, and realizing the monitoring of the heat dissipation device. In addition, the temperature of the infrared detector 5, the temperature of the second translation frame member 12, and the temperature of the heat dissipation bottom plate 32 can also be the temperatures after the infrared detector 5 stops working, and the overall heat dissipation effect after the infrared detector 5 stops working is reflected through the first calculation module 65 and the second calculation module 66.

[0092] Moreover, at Q A and Q B After the calculation is completed, the heat conduction quantity Q A of the primary flexible heat dissipation component, the heat conduction quantity Q B of the secondary flexible heat dissipation component 4 is compared with the preset Q working power consumption of the infrared detector, which can reflect the heat absorbed by the heat dissipation device under the action of the heat dissipation device on the infrared detector 5, so that the staff can judge the working state of the infrared detector 5 and the heat dissipation effect of the heat dissipation device.

[0093] Furthermore, set the temperature of the infrared detector 5 as T 1 , the temperature of the second translation frame member 12 as T 2 and the temperature of the heat dissipation bottom plate as T 3 . The contact area between the infrared detector 5 and the primary flexible heat dissipation component 2 is Aa, the contact heat transfer coefficient is Ka, the distance between the infrared detector 5 and the second translation frame member 12 is La, the contact area between the second translation frame member 12 and the driving component 3 is Ab, the contact heat transfer coefficient is Kb, and the distance between the second translation frame member 12 and the heat dissipation bottom plate 32 is Lb. Thus, the calculation formula for the heat conduction quantity Q A of the primary flexible heat dissipation component 2 is:

[0094] Q A =[Aa*Ka*(T 1 -T 2 )] / La.

[0095] Furthermore, the calculation formula for the heat conduction quantity Q B of the secondary flexible heat dissipation component 4 is:

[0096] Q B =[Ab*Kb*(T 2 -T 3 )] / Lb.

[0097] It should be noted that the above embodiments can be freely combined as needed. The above are only the preferred embodiments of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A heat dissipation device for an aerospace infrared detector, characterized in that: include: Translation mechanism; A primary flexible heat sink, wherein the primary flexible heat sink is provided with a mounting surface for placing the infrared detector, and the primary flexible heat sink is provided on the translation mechanism to conduct the heat of the infrared detector to the translation mechanism; A driving assembly, the driving assembly being arranged on the lower end surface of the translation mechanism, and being used for driving the translation mechanism to move, thereby driving the infrared detector to move; A secondary flexible heat sink, which is used to connect the translation mechanism and the drive assembly to transfer the heat collected by the translation mechanism to the drive assembly; The translation mechanism includes a first translation frame and a second translation frame arranged below the first translation frame, two ends of the first-level flexible heat sink in the length direction are respectively connected to two ends of the second translation frame, and a side of the first translation frame away from the second translation frame is connected and fixed to the first-level flexible heat sink, so that the first translation frame can move along the length direction of the first-level flexible heat sink; The secondary flexible heat sink is used to connect the second translation frame and the driving assembly, and the second translation frame is suitable for moving along the width direction of the primary flexible heat sink.

2. The heat dissipation device for an aerospace infrared detector according to claim 1, characterized in that: The primary flexible heat sink comprises a mounting member and a primary heat conducting belt, and connecting members are provided at both ends of the primary heat conducting belt in the length direction, and the connecting members are used to connect with the end of the second translation frame member; The mounting member is arranged on the primary thermal conductive belt and is arranged relative to the first translation frame member.

3. The heat dissipation device of an infrared detector for aerospace use according to claim 2, characterized in that: The mounting member comprises a mounting frame arranged above the primary heat-conducting belt and a heat-conducting pressing plate arranged below the primary heat-conducting belt; The heat-conducting pressure plate is suitable for engaging with the installation frame to set the installation component on the primary heat-conducting belt. The side of the installation frame away from the heat-conducting pressure plate is the installation surface. The heat-conducting pressure plate is connected and fixed to the first translation frame.

4. The heat dissipation device for aerospace infrared detector according to claim 3, characterized in that: The primary heat conducting belt has two spaced-apart bending portions in the length direction to form a protrusion between the two bending portions. The protrusion extends into the installation frame and contacts the infrared detector located on the installation surface.

5. The heat dissipation device for aerospace infrared detector according to claim 4, characterized in that: The mounting member further comprises an elastic gasket, and the elastic gasket is arranged between the heat-conducting pressure plate and the primary heat-conducting belt.

6. A heat dissipation device for an aerospace infrared detector according to any one of claims 1 to 5, characterized in that: The driving assembly includes a mounting seat, and a first driving member and a second driving member arranged on the mounting seat, the mounting seat is movably arranged below the second translation frame member, and the first driving member is drivingly connected to the first translation frame member to drive the first translation frame member to move along the length direction of the primary flexible heat sink; The second driving member is drivingly connected to the second translation frame member to drive the second translation frame member to move along the width direction of the first-level flexible heat dissipation member.

7. The heat dissipation device for aerospace infrared detector according to claim 6, characterized in that: The secondary flexible heat sink includes two secondary heat-conducting belts, which are arranged at both ends of the primary flexible heat sink in the width direction to connect the second translation frame and the driving assembly.

8. The heat dissipation device for aerospace infrared detector according to claim 7, characterized in that: The driving assembly further comprises a heat dissipation base plate arranged at an end of the mounting seat away from the second translation frame member; One end of the secondary thermal conductive belt is connected to the second translation frame, and the other end of the secondary thermal conductive belt is connected to the heat dissipation base plate.

9. A monitoring system for a heat dissipation device of an aerospace infrared detector, characterized in that: The heat dissipation device comprises a control module, a first acquisition module, a second acquisition module, a third acquisition module, a first calculation module, a second calculation module and a processing module, and a heat dissipation device for an aerospace infrared detector as described in any one of claims 1 to 8; The heat dissipation device of the aerospace infrared detector comprises a primary flexible heat dissipation member, a secondary flexible heat dissipation member, a mounting seat, a heat dissipation base plate, a first translation frame member and a second translation frame member, wherein the first translation frame member, the second translation frame member, the mounting seat and the heat dissipation base plate are arranged in sequence from top to bottom; A control module is used to preset the working power consumption Q of the infrared detector and control the driving component to drive the infrared sensor to move; The first acquisition module is used to acquire the temperature of the infrared detector; The second acquisition module is used to acquire the temperature of the second translation frame; The third acquisition module is used to acquire the temperature of the heat dissipation base plate; The first calculation module is used to calculate the heat conduction Q of the first-level flexible heat sink according to the temperature of the infrared detector and the temperature of the second translation frame. A ; The second calculation module is used to calculate the heat conduction Q of the secondary flexible heat sink according to the temperature of the second translation frame and the temperature of the heat sink bottom plate. B ; The processing module is used to convert the heat conduction Q of the first-level flexible heat sink into A , the heat conduction Q of the secondary flexible heat sink B The heat value absorbed by the heat dissipation device of the aerospace infrared detector is obtained by comparing it with the preset working power consumption Q of the infrared detector.

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