Integrated circuit test system inspection method, device, equipment and storage medium

Abstract

The present invention relates to the field of integrated circuit technology, and specifically to a spot inspection method, device, equipment and storage medium for an integrated circuit test system, wherein the spot inspection method in the test machine includes: obtaining historical test data, determining the material tube type of the material tube to which the current tested part belongs according to the historical test data; when the material tube type is a spot inspection material tube, entering the spot inspection mode, testing multiple tested parts in the spot inspection material tube in turn, and obtaining multiple test results of the multiple tested parts in the spot inspection material tube; obtaining the spot inspection result according to the test results of all the spot inspection material tubes. In other words, a spot inspection material tube equipped with spot inspection samples is added to the integrated circuit test system, and the integrated circuit system can automatically identify the spot inspection material tube according to the historical test data when processing the loading area, and test multiple tested parts in the spot inspection material tube in turn, and obtain the spot inspection result according to the test results of all the spot inspection material tubes, thereby realizing automatic spot inspection of the integrated circuit test system.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuits, and in particular to a spot inspection method, device, equipment and storage medium for an integrated circuit test system. Background Art

[0002] The rapid development of integrated circuit testing technology has made a great contribution to the widespread application of integrated circuits. In each stage of integrated circuit development, production, and application, repeated inspections and tests are required to ensure product quality and to produce products that meet system requirements. Integrated circuit testing is the process of testing integrated circuits or modules, comparing the output response of the tested integrated circuits with the expected output, and evaluating the functions and performance of integrated circuit components. It is an important means to verify design, monitor production, ensure quality, analyze failures, and guide applications.

[0003] Differences in peripheral hardware and environment will bring certain system errors to the test system, which will lead to deviations in test results and cause serious production quality accidents. Therefore, in order to ensure the accuracy of integrated circuit testing and improve the reliability of integrated circuit test results, technicians need to regularly inspect the integrated circuit test system to detect whether the test system is currently faulty or the test results are abnormal.

[0004] The spot inspection test of the existing technology mainly relies on the autonomous operation of the technicians. The technicians manually place the designated spot inspection samples on the test station of the sorting machine, and then control the test machine to test the integrated circuit. In order to ensure the accuracy of the spot inspection results, it is usually necessary to test multiple spot inspection samples, so the technicians need to repeat the above operations many times, and the entire spot inspection process is time-consuming, and only a small number of samples can be used for spot inspection. When the test value deviation is large during individual tests, it has a great impact on the accuracy of the test value. At the same time, since the accuracy of the integrated circuit installation position during manual loading cannot reach the precision of the robot operation, manual loading may cause the integrated circuit pins to accidentally scratch the contact surface of the test station, causing damage to the test device. In addition, before the spot inspection operation begins, the technicians are required to clear the operating table of the test system to avoid confusing the spot inspection samples with other integrated circuit products and making them indistinguishable during the spot inspection operation. Summary of the invention

[0005] In view of this, the present invention provides an inspection method, device, equipment and storage medium for an integrated circuit test system to solve many problems that exist when technicians manually inspect the integrated circuit test system.

[0006] In a first aspect, the present invention provides a spot inspection method for an integrated circuit test system, which is applied to a test machine. The spot inspection method for the integrated circuit test system includes: acquiring historical test data, and determining the material tube type of the material tube to which the current tested component belongs based on the historical test data; when the material tube type is a spot inspection material tube, entering a spot inspection mode, and testing multiple tested components in the spot inspection material tube in turn to obtain multiple test results for the multiple tested components in the spot inspection material tube; and obtaining a spot inspection result based on the test results of all spot inspection material tubes.

[0007] The present invention adds a spot inspection material tube equipped with spot inspection samples to the integrated circuit test system. During the integrated circuit test process, the spot inspection material tube is pre-placed in the loading area of ​​the sorting machine. When the integrated circuit system processes the loading area, it can automatically identify the spot inspection material tube according to historical test data, and test multiple test pieces in the spot inspection material tube in turn to obtain multiple test results of the multiple test pieces in the spot inspection material tube. The spot inspection result is obtained according to the test results of all the spot inspection material tubes, thereby realizing automatic spot inspection of the integrated circuit test system.

[0008] In an optional embodiment, historical test data is obtained, and the material pipe type of the material pipe to which the current tested part belongs is determined based on the historical test data, including: obtaining historical test data corresponding to the first number of tested parts that have recently completed testing; determining based on the historical test data whether the first number of tested parts that have recently completed testing are a continuous first number of marked samples; if they are a continuous first number of marked samples, then the material pipe type of the material pipe to which the current tested part belongs is a spot inspection pipe.

[0009] That is to say, by continuously setting a first number of marking samples in the spot inspection material tube, the integrated circuit system can accurately identify whether the material tube to which the current part under test belongs is the spot inspection material tube by determining whether the first number of parts under test that have recently completed testing are continuous first number of marking samples when processing the loading area.

[0010] In an optional embodiment, testing any test piece i in the point inspection tube includes: sending a test signal to the sorting machine in response to a loading completion signal of the test piece i sent by the sorting machine; receiving the test result of the test piece i sent by the sorting machine, and saving the test result of the test piece i.

[0011] This allows multiple test pieces in a spot-checking tube to be tested automatically.

[0012] In an optional embodiment, after receiving the test results sent by the sorting machine and saving the test results, it also includes: generating a first sorting signal and sending it to the sorting machine, so that the sorting machine places the test piece i in an empty material tube in the unloading area according to the first sorting signal.

[0013] This allows the test piece to be fed into a specific empty tube.

[0014] In an optional embodiment, after testing any one of the test pieces i in the spot inspection material tube, it also includes: determining the number of spot inspection samples based on multiple test results of multiple test pieces under the spot inspection mode, and judging whether the number reaches a preset threshold; if the number reaches the preset threshold, exiting the spot inspection mode; or, determining whether there is a second number of continuous marking samples based on multiple test results of multiple test pieces under the spot inspection mode; if there is a second number of continuous marking samples, exiting the spot inspection mode.

[0015] That is to say, after entering the spot inspection mode, the number of spot inspection samples can be counted, and the spot inspection mode can be automatically exited when the number of spot inspection samples reaches a preset threshold; or a second number of mark samples can be set in the spot inspection material tube, and whether the spot inspection material tube test is completed can be determined by judging whether there is a continuous second number of mark samples.

[0016] In an optional embodiment, after obtaining historical test data and determining the type of the material tube to which the current tested part belongs based on the historical test data, the method further includes: when the material tube type is not a spot inspection tube, in response to a loading completion signal sent by the sorting machine, sending a test signal to the sorting machine; receiving the test results sent by the sorting machine, and determining the type of the current tested part based on the test results; generating a second sorting signal based on the type of the tested part, and sending it to the sorting machine, so that the sorting machine sorts and unloads the tested part based on the second sorting signal.

[0017] In this way, the automatic test of the current test piece can be completed, and the current test piece can be unloaded according to the type, so that the test pieces of the same type can be unloaded into the same material tube.

[0018] In a second aspect, the present invention also provides an inspection method for an integrated circuit testing system, which is applied to a sorting machine. The inspection method for an integrated circuit testing system includes: in response to an inspection interactive instruction or the arrival of a preset time, placing an inspection material tube in a loading area or generating an interactive instruction indicating a loading operation; loading and testing the parts under test in the loading area in turn, generating test results and sending them to the testing machine, so that the testing machine generates a first sorting signal or a second sorting signal based on the test results; receiving the first sorting signal or the second sorting signal sent by the testing machine, placing the parts under test in an empty material tube in the unloading area according to the first sorting signal, or sorting and unloading the parts under test according to the second sorting signal.

[0019] The spot inspection method of the integrated circuit test system provided by the present invention places the spot inspection material tube in the loading area of ​​the sorting machine or generates an interactive instruction indicating the loading operation in response to the spot inspection interactive instruction or the arrival of the preset time. Therefore, the testing machine of the integrated circuit test system can automatically identify the spot inspection material tube when processing the loading area, and test multiple spot inspection samples in the spot inspection material tube in turn, obtain the spot inspection result according to the test results of the multiple spot inspection samples, and realize automatic spot inspection of the integrated circuit test system.

[0020] In an optional embodiment, the integrated circuits under test at the loading port are loaded and tested in sequence, and the test results are generated and sent to the test machine, so that the test machine generates a first sorting signal or a second sorting signal according to the test results, including: loading the tested parts in the loading area, and sending a loading completion signal to the test machine; receiving the test signal sent by the test machine, testing the integrated circuits under test according to the test signal, and obtaining the test results; sending the test results to the test machine, so that the test machine generates a first sorting signal or a second sorting signal according to the test results.

[0021] This can complete automatic testing or automatic spot inspection of the device under test.

[0022] In a third aspect, the present invention also provides a spot inspection method for an integrated circuit testing system, the spot inspection method comprising: a sorting machine places a spot inspection material tube in a loading area or generates an interactive instruction indicating a loading operation in response to a spot inspection interactive instruction or the arrival of a preset time, so as to realize the loading of the spot inspection material tube; a testing machine obtains historical test data, and determines the material tube type of the material tube to which the current tested part belongs based on the historical test data; when the material tube type is a spot inspection material tube, the testing machine enters a spot inspection mode, and tests multiple tested parts in the spot inspection material tube in turn, and obtains multiple test results of the multiple tested parts in the spot inspection material tube; the testing machine obtains the spot inspection result based on the test results of all spot inspection material tubes.

[0023] The present invention provides a spot inspection method for an integrated circuit test system. In response to a spot inspection interactive instruction or the arrival of a preset time, a sorting machine places a spot inspection material tube in a loading area of ​​the sorting machine or generates an interactive instruction indicating a loading operation. This enables the tester of the integrated circuit test system to automatically identify the spot inspection material tube according to historical test data when processing the loading area, and to test multiple test pieces in the spot inspection material tube in turn, thereby obtaining multiple test results of the multiple test pieces in the spot inspection material tube. The test results of all the spot inspection material tubes are used to obtain spot inspection results, thereby realizing automatic spot inspection of the integrated circuit test system.

[0024] In a fourth aspect, the present invention further provides a spot inspection device for an integrated circuit testing system, which is applied to a testing machine and includes a material tube identification module, a spot inspection test module and a result processing module; the material tube identification module is used to obtain historical test data, and determine the material tube type of the material tube to which the current tested part belongs based on the historical test data; the spot inspection test module is used to enter a spot inspection mode when the material tube type is a spot inspection material tube, and test multiple tested parts in the spot inspection material tube in turn to obtain multiple test results of the multiple tested parts in the spot inspection material tube; the result processing module is used to obtain a spot inspection result based on the test results of all spot inspection material tubes.

[0025] In the fifth aspect, the present invention also provides an inspection device of an integrated circuit testing system, which is applied to a sorting machine, and includes a loading module, a testing module and an unloading module; the loading module is used to place the inspection material tube in the loading area or generate an interactive instruction indicating a loading operation in response to an inspection interactive instruction or the arrival of a preset time; the testing module is used to load and test the test pieces in the loading area in turn, generate test results and send them to the testing machine, so that the testing machine generates a first sorting signal or a second sorting signal according to the test results; the unloading module is used to receive the first sorting signal or the second sorting signal sent by the testing machine, and place the test pieces in the empty material tube in the unloading area according to the first sorting signal, or sort and unload the test pieces according to the second sorting signal.

[0026] In the sixth aspect, the present invention also provides an integrated circuit testing system, the testing system comprising a testing machine and a sorting machine; the sorting machine is used to implement the inspection method of the integrated circuit testing system of the second aspect or any embodiment of the second aspect; the testing machine is used to implement the inspection method of the integrated circuit testing system of the first aspect or any embodiment of the first aspect.

[0027] In the seventh aspect, the present invention further provides a computer device, comprising a memory and a processor, the memory and the processor being communicatively connected to each other, the memory storing computer instructions, and the processor executing the computer instructions to thereby execute the inspection method for an integrated circuit test system of the first aspect or any embodiment of the first aspect, and / or execute the inspection method for an integrated circuit test system of the second aspect or any embodiment of the second aspect.

[0028] In an eighth aspect, the present invention further provides a computer-readable storage medium having computer instructions stored thereon, the computer instructions being used to enable a computer to execute the inspection method for an integrated circuit testing system of the first aspect or any embodiment of the first aspect, and / or to execute the inspection method for an integrated circuit testing system of the second aspect or any embodiment of the second aspect.

[0029] In the ninth aspect, the present invention also provides a computer program product, comprising computer instructions, the computer instructions being used to enable a computer to execute the inspection method for an integrated circuit testing system of the first aspect or any embodiment of the first aspect, and / or to execute the inspection method for an integrated circuit testing system of the second aspect or any embodiment of the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0031] Figure 1 is a schematic diagram of the structure of an integrated circuit testing system according to an embodiment of the present invention;

[0032] Figure 2 is a flow chart of a spot inspection method for an integrated circuit test system in a test machine according to an embodiment of the present invention;

[0033] Figure 3 is a flow chart of another integrated circuit test system spot inspection method in a test machine according to an embodiment of the present invention;

[0034] Figure 4 is a flow chart of another integrated circuit test system spot inspection method in a test machine according to an embodiment of the present invention;

[0035] Figure 5 is a flow chart of a spot inspection method of an integrated circuit test system in a sorting machine according to an embodiment of the present invention;

[0036] Figure 6 is a flow chart of another integrated circuit test system spot inspection method in a sorting machine according to an embodiment of the present invention;

[0037] Figure 7 is a flow chart of an integrated circuit test system spot inspection method according to an embodiment of the present invention;

[0038] Figure 8 is a structural block diagram of an integrated circuit test system spot inspection device in a test machine according to an embodiment of the present invention;

[0039] Fig. 9 is a structural block diagram of an integrated circuit test system spot inspection device in a sorting machine according to an embodiment of the present invention;

[0040] Fig.10 It is a schematic diagram of the hardware structure of a computer device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0042] Figure 1 is a schematic diagram of the structure of an integrated circuit test system according to an embodiment of the present invention. Figure 1 As shown, the integrated circuit test system includes a tester and a sorter, wherein the tester is used to send test signals, receive test results and analyze the performance of the integrated circuit under test according to the test results, generate and send sorting signals, etc.; the sorter is used to receive test signals and test the integrated circuit under test according to the test signals, send test results, receive sorting signals and perform corresponding sorting operations on the integrated circuit under test according to the sorting signals, etc.

[0043] The test machine is equipped with one or more test sites, and the sorting machine is equipped with one or more test stations and communication ports. Under normal circumstances, the number of test sites used for integrated circuit testing during the test process is equal to the number of test stations and communication ports. Each test site of the test machine is connected to the corresponding test station of the sorting machine through a test cable, and each test site is also connected to the communication port corresponding to the test station through a sorting signal line. Then, the test signal and test result are transmitted between the test machine and the sorting machine through the test cable, and the sorting signal is transmitted through the sorting signal line.

[0044] In addition, the sorting machine structure is usually provided with a control module, a robot group, a loading area and an unloading area; the control module is connected to the robot group, and is also connected to each test station and the communication port. The control module can control the robot group to load the test station after the test starts, and control the robot group to sort and unload the tested integrated circuits at the test station according to the sorting signals received by each communication port; the robot group is connected to the control module, and can place the integrated circuits to be tested at the loading port of the sorting machine at each test station according to the control of the control module, and after the test of the tested integrated circuits at the test station is completed, the tested integrated circuits at the test station are placed in the designated unloading port according to the control of the control module, and then coordinate with each test station to realize integrated circuit testing. In addition, the loading area is usually pre-installed with multiple loading tubes, each loading tube is pre-loaded with a certain number of integrated circuits to be tested. During the integrated circuit testing process, the integrated circuits to be tested are transported to the loading port in sequence according to the order of the pre-loaded loading tubes and the order of the integrated circuits to be tested in the tubes, and then the robot group loads them to the testing station; the unloading area is equipped with a variety of unloading methods according to the sorting results, and then the robot group sorts the integrated circuits to be tested into the corresponding unloading channels according to the sorting results, such as the integrated circuits to be tested with the sorting result of good products are placed in the finished product tube, and the integrated circuits to be tested with the sorting result of defective products are placed in the defective product tube, etc.

[0045] Optionally, the sorting machine structure is also provided with an interactive module, which is connected to the control module, capable of receiving interactive instructions input from the outside, transmitting them to the control module, and displaying prompt information and test results provided by the control module.

[0046] Specifically, an integrated circuit testing method of an integrated circuit testing system is as follows: after the test starts, the control module controls the manipulator group to place the integrated circuit to be tested on the designated test station of the sorting machine, and then controls the sorting machine to send a Ready signal to the tester through the corresponding communication port via the sorting signal line, prompting the tester to start the test; after the corresponding test station of the tester receives the Ready signal, it sends a test signal to the corresponding test station of the sorting machine through the test cable, so that the sorting machine test station tests the integrated circuit to be tested according to the test signal; after the test is completed, the sorting machine test station returns the test result to the corresponding test station of the tester through the test cable; the tester analyzes the integrated circuit performance according to the test result, and then generates a sorting operation signal according to the integrated circuit performance and sends it to the corresponding communication port of the sorting machine through the sorting signal line; after the sorting machine receives the sorting operation signal, the control module controls the manipulator group to perform corresponding sorting operations on the integrated circuit to be tested according to the sorting operation signal.

[0047] Based on this, according to an embodiment of the present invention, an embodiment of a spot inspection method for an integrated circuit testing system is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0048] In this embodiment, a spot inspection method for an integrated circuit test system is provided, which can be used in a test machine. Figure 2 FIG. 1 is a flow chart of a spot inspection method for an integrated circuit test system in a test machine according to an embodiment of the present invention. Figure 2 As shown, the process includes the following steps:

[0049] Step S201: Acquire historical test data, and determine the material tube type of the material tube to which the current tested component belongs according to the historical test data.

[0050] The loading area of ​​the integrated circuit test system includes one or more detection material tubes and one or more spot inspection material tubes, wherein the detection material tubes are pre-loaded with the integrated circuit to be tested, and the spot inspection material tubes are pre-loaded with spot inspection samples.

[0051] After placing the material tube to be tested in the loading area of ​​the sorting machine, the sorting machine loads each part to be tested in the material tube to be tested to the testing station one by one; after each part to be tested is loaded, that is, after the testing machine receives the loading completion signal sent by the sorting machine, it uses the test results of several parts to be tested within a certain number range before the current part to be tested as historical test data, and then determines the type of the material tube to which the current part to be tested belongs based on the historical test data.

[0052] Step S202: When the material tube type is a spot inspection material tube, enter the spot inspection mode, test the multiple test pieces in the spot inspection material tube in sequence, and obtain multiple test results of the multiple test pieces in the spot inspection material tube.

[0053] Specifically, testing any test piece i in the spot inspection tube includes: sending a test signal to the sorting machine in response to a loading completion signal of the test piece i sent by the sorting machine; receiving the test result of the test piece i sent by the sorting machine, and saving the test result of the test piece i.

[0054] Step S203: Obtain the inspection results according to the test results of all the inspected material tubes.

[0055] In this embodiment, an inspection tube equipped with inspection samples is added to the integrated circuit testing system. During the integrated circuit testing process, the inspection tube is pre-placed in the loading area of ​​the sorting machine. When the integrated circuit system processes the loading area, it can automatically identify the inspection tube based on historical test data, and test multiple test pieces in the inspection tube in turn. The inspection results are obtained based on the test results of all the inspection tubes, thereby realizing automatic inspection of the integrated circuit testing system.

[0056] In this embodiment, a spot inspection method for an integrated circuit test system is provided, which can be used in a test machine. Figure 3 FIG. 1 is a flow chart of another integrated circuit test system spot inspection method in a test machine according to an embodiment of the present invention. Figure 3 As shown, the process includes the following steps:

[0057] Step S301: Acquire historical test data, and determine the material tube type of the material tube to which the current tested component belongs according to the historical test data.

[0058] In an optional embodiment, the spot inspection material tube is pre-loaded with spot inspection samples and mark samples.

[0059] Among them, the spot inspection samples are used as a reference to verify whether the integrated circuit test system is abnormal, that is, by statistically summarizing the test results of all the spot inspection samples in the spot inspection material tube, it can be determined whether the integrated circuit test system is abnormal. It should be noted that the number of spot inspection samples in the spot inspection material tube should be greater than or equal to the standard spot inspection quantity X, and the standard spot inspection quantity X is the minimum number of spot inspection samples that can ensure the accuracy of the spot inspection results.

[0060] The marking sample is used to mark the spot inspection tube. For example, the marking sample can be set at the top of the spot inspection tube, and then the integrated circuit test system automatically enters or exits the spot inspection mode by counting the number of marking samples.

[0061] Specifically, the marking sample is a special integrated circuit obtained by a specific marking method and can be identified by the test machine. Exemplarily, the marking method for the marking sample can be to pre-build a special code in the marking sample, which is only used to characterize the identity of the marking sample and can be automatically identified by the test machine; it can be to set a special on-off state for some pins of the marking sample during the packaging process of the marking sample, such as leaving some pins of the marking sample hanging, so that the on-off state of the pins of the marking sample can be automatically identified by the test machine; it can also be to remove some pins of the marking sample in advance, so that the test machine can automatically identify the marking sample according to the pin setting method.

[0062] Based on this, historical test data is obtained, and the type of the material tube of the current tested piece can be determined according to the historical test data by using the following steps S3011 to S3013.

[0063] Step S3011: Acquire historical test data corresponding to a first number of devices under test that have recently completed testing.

[0064] Step S3012: Determine, based on historical test data, whether the first number of tested pieces that have recently completed testing are a first number of consecutive marker samples.

[0065] Step S3013: If it is a first number of consecutive marked samples, the material tube type of the material tube to which the current tested piece belongs is a spot inspection material tube.

[0066] For example, the first number can be represented by N, that is, the critical value for the integrated circuit test system to enter the spot check mode is N. That is, when there are consecutive first number of marked samples, the next sample in the test station is the spot check sample, and the integrated circuit test system automatically enters the spot check mode.

[0067] Step S302: when the material tube type is a spot inspection material tube, entering the spot inspection mode, testing the multiple test pieces in the spot inspection material tube in turn, and obtaining multiple test results of the multiple test pieces in the spot inspection material tube.

[0068] In an optional embodiment, when the material tube type is a spot inspection material tube, multiple test pieces in the spot inspection material tube are tested in sequence to obtain multiple test results of the multiple test pieces in the spot inspection material tube, including steps S3021 to S3026.

[0069] Step S3021: When the material tube type is a spot inspection material tube, enter the spot inspection mode.

[0070] Step S3022: In response to the loading completion signal of the current tested part sent by the sorting machine, a test signal is sent to the sorting machine.

[0071] Step S3023: receiving the test result of the current device under test sent by the sorting machine, and saving the test result of the current device under test.

[0072] Step S3024: Generate a first sorting signal and send it to the sorting machine, so that the sorting machine places the current tested component in an empty material tube in the unloading area according to the first sorting signal.

[0073] Step S3025: Determine the number of spot inspection samples according to multiple test results of multiple test pieces in the spot inspection mode.

[0074] Specifically, as mentioned above, the testing machine can automatically identify whether the tested piece is a mark sample, because the spot inspection material tube only includes mark samples and spot inspection samples, so the number of spot inspection samples can be determined based on multiple test results of multiple tested pieces in the spot inspection mode.

[0075] Step S3026: Determine whether the number reaches a preset threshold; when the number reaches the preset threshold, proceed to step S3027; otherwise, take the next tested piece in the spot-checking material tube as the current tested piece and return to step S3022.

[0076] Step S3027: Exit the spot check mode.

[0077] That is, after entering the spot inspection mode, the number of spot inspection samples is counted, and when the number of spot inspection samples reaches a preset threshold, the spot inspection mode is automatically exited. The threshold can be determined according to the capacity of the spot inspection tube and the number of marked samples at the top of the spot inspection tube. For example, the threshold is equal to the capacity of the spot inspection tube minus the number of marked samples at the top of the spot inspection tube.

[0078] Step S303: Obtain the inspection results according to the test results of all the inspected material tubes.

[0079] In this embodiment, all the marking samples are set at the top of the spot inspection material tube, that is, after a certain number of marking samples are continuously set at the top of the spot inspection material tube, the rest are all set as spot inspection samples. In this case, the number of marking samples at the top of the spot inspection material tube should be greater than or equal to the critical value N for the test system to enter the spot inspection mode.

[0080] In summary, the present embodiment adds an inspection tube equipped with inspection samples and marking samples to the integrated circuit testing system, and then pre-places the inspection tube in the loading area of ​​the sorting machine during the integrated circuit testing process. When the integrated circuit system processes the loading area, it can automatically identify the inspection tube according to the marking sample and enter the inspection mode; further, it automatically exits the inspection mode according to the number of inspection samples, and summarizes the test results of all inspection tubes to determine whether there is any abnormality in the test system.

[0081] In this embodiment, a spot inspection method for an integrated circuit test system is provided, which can be used in a test machine. Figure 4 FIG. 1 is a flow chart of another integrated circuit test system spot inspection method in a test machine according to an embodiment of the present invention. Figure 4 As shown, the process includes the following steps:

[0082] Step S401: Obtain historical test data, and determine the type of the material tube to which the current tested part belongs based on the historical test data. Figure 3 The process is the same as step S301 and will not be described again here.

[0083] Step S402: when the material tube type is a spot inspection material tube, a plurality of test pieces in the spot inspection material tube are tested in sequence to obtain a plurality of test results of the plurality of test pieces in the spot inspection material tube.

[0084] In an optional implementation, when the material tube type is a spot inspection material tube, the spot inspection mode is entered to test multiple test pieces in the spot inspection material tube in sequence, including steps S4021 to S4026.

[0085] Step S4021: When the material tube type is a spot inspection material tube, enter the spot inspection mode.

[0086] Step S4022: In response to the loading completion signal of the current tested part sent by the sorting machine, a test signal is sent to the sorting machine.

[0087] Step S4023: receiving the test result of the current device under test sent by the sorting machine, and saving the test result of the current device under test.

[0088] Step S4024: Generate a first sorting signal and send it to the sorting machine, so that the sorting machine places the current tested component in an empty material tube in the unloading area according to the first sorting signal.

[0089] Step S4025: Determine whether there are a second number of consecutive marked samples based on multiple test results of multiple test pieces in the spot inspection mode; if there are a second number of consecutive marked samples, proceed to step S4026; otherwise, take the next test piece in the spot inspection tube as the current test piece and return to step S4022.

[0090] Specifically, as mentioned above, the testing machine can automatically identify whether the tested piece is a marking sample, because the spot inspection material tube only includes marking samples and spot inspection samples. Therefore, based on multiple test results of multiple tested pieces in the spot inspection mode, it is determined whether there is a continuous second number of marking samples.

[0091] Step S4026: Exit the spot check mode.

[0092] For example, the second number can be represented by M, that is, the critical value for the integrated circuit test system to exit the spot inspection mode is M. That is, when there are consecutive second number of marked samples, it means that the spot inspection samples in the spot inspection tube have been processed, and the integrated circuit test system automatically exits the spot inspection mode.

[0093] Step S403: Obtain the inspection results according to the test results of all the inspected material tubes.

[0094] In an embodiment, part of the marking samples are set at the top of the spot inspection material tube and part of them are set at the tail end of the spot inspection material tube, that is, after a certain number of marking samples are continuously set at the top and tail ends of the spot inspection material tube, the rest are all set as spot inspection samples. In this case, the number of marking samples at the top of the spot inspection material tube should be greater than or equal to the critical value N for the test system to enter the spot inspection mode, and the number of marking samples at the tail end of the spot inspection material tube should be greater than or equal to the critical value M for the test system to exit the spot inspection mode.

[0095] In this embodiment, an inspection tube equipped with inspection samples and marking samples is added to the integrated circuit testing system, and the inspection tube is pre-placed in the loading area of ​​the sorting machine during the integrated circuit testing process. When the integrated circuit system processes the loading area, it can automatically enter and exit the inspection mode according to the number of marking samples, and summarize the test results of all the inspection tubes to determine whether there is any abnormality in the test system.

[0096] In this embodiment, a spot inspection method of an integrated circuit test system is provided, which can be used for a sorting machine. Figure 5 FIG. 1 is a flow chart of a spot inspection method for an integrated circuit test system in a sorting machine according to an embodiment of the present invention. Figure 5 As shown, the process includes the following steps:

[0097] Step S501: In response to the spot inspection interactive instruction or the arrival of a preset time, the spot inspection material tube is placed in a loading area or an interactive instruction indicating a loading operation is generated.

[0098] In the integrated circuit test system, whether there is a need for inspection can be determined by inspection interaction instructions or whether the preset time has been reached. When there is a need for inspection, the inspection material tube needs to be placed in the loading area or an interactive instruction indicating the loading operation needs to be generated so that the integrated circuit test system can automatically perform inspection.

[0099] Step S502: loading and testing the test pieces in the loading area in sequence, generating test results and sending them to the testing machine, so that the testing machine generates a first sorting signal or a second sorting signal according to the test results.

[0100] Specifically, the integrated circuit to be tested in the detection material tube, the inspection sample and the marking sample in the inspection material tube are all the tested parts.

[0101] Step S503: receiving the first sorting signal or the second sorting signal sent by the testing machine, placing the tested piece in an empty material tube in the material discharge area according to the first sorting signal, or sorting and discharging the tested piece according to the second sorting signal.

[0102] Exemplarily, the inspection samples and the marking chips are used for unloading according to the first sorting signal, and the other pieces to be tested are unloaded according to the second sorting signal.

[0103] The spot inspection method for the integrated circuit test system provided in the present embodiment places the spot inspection material tube in the loading area of ​​the sorting machine or generates an interactive instruction indicating the loading operation in response to a spot inspection interactive instruction or the arrival of a preset time. This enables the tester of the integrated circuit test system to automatically identify the spot inspection material tube when processing the loading area, and to test multiple spot inspection samples in the spot inspection material tube in turn, and obtain the spot inspection result based on the test results of the multiple spot inspection samples, thereby realizing automatic spot inspection of the integrated circuit test system.

[0104] In this embodiment, a spot inspection method of an integrated circuit test system is provided, which can be used for a sorting machine. Figure 6 FIG. 1 is a flow chart of another integrated circuit test system inspection method in a sorting machine according to an embodiment of the present invention. Figure 6 As shown, the process includes the following steps:

[0105] Step S601: In response to the spot inspection interactive instruction or the arrival of a preset time, the spot inspection material tube is placed in a loading area or an interactive instruction indicating a loading operation is generated.

[0106] Step S602: loading and testing the test pieces in the loading area in sequence, generating test results and sending them to the testing machine, so that the testing machine generates a first sorting signal or a second sorting signal according to the test results.

[0107] In an optional embodiment, loading and testing the test pieces in the loading area in sequence, generating test results and sending them to the testing machine, so that the testing machine generates a first sorting signal or a second sorting signal according to the test results, includes the following steps:

[0108] Step S6021: Load the test piece in the loading area and send a loading completion signal to the testing machine.

[0109] Step S6022: Receive the test signal sent by the test machine, test the integrated circuit under test according to the test signal, and obtain the test result.

[0110] Step S6023: Send the test result to the test machine, so that the test machine generates a first sorting signal or a second sorting signal according to the test result.

[0111] Step S603: receiving the first sorting signal or the second sorting signal sent by the testing machine, placing the tested piece in the empty material tube of the material discharge area according to the first sorting signal, or sorting and discharging the tested piece according to the second sorting signal.

[0112] In this embodiment, a spot inspection material tube equipped with spot inspection samples is added to the integrated circuit testing system, and then the spot inspection material tube is pre-placed in the loading area of ​​the sorting machine during the integrated circuit testing process. When the sorting machine receives the spot inspection signal sent by the testing machine, it indicates that the sample in the test station at this time is a spot inspection sample. Therefore, the sorting machine can perform spot inspection on the spot inspection samples in the test station; after the spot inspection is completed, all the spot inspection samples in the spot inspection material tube can be re-loaded into the empty spot inspection material tube in the unloading area, thereby realizing automatic spot inspection of the integrated circuit testing system.

[0113] In this embodiment, a spot inspection method for an integrated circuit test system is provided. Figure 7 is a flow chart of an integrated circuit test system inspection method according to an embodiment of the present invention. Figure 7As shown, the process includes the following steps:

[0114] Step S701: In response to the spot inspection interactive instruction or the arrival of the preset time, the sorting machine places the spot inspection material tube in the loading area or generates an interactive instruction indicating the loading operation to realize the loading of the spot inspection material tube.

[0115] Step S702: the testing machine obtains historical test data, and determines the material tube type of the material tube to which the current tested component belongs according to the historical test data.

[0116] Step S703: When the material tube type is a spot inspection material tube, the testing machine enters the spot inspection mode, and tests the multiple test pieces in the spot inspection material tube in sequence to obtain multiple test results of the multiple test pieces in the spot inspection material tube.

[0117] Step S704: The testing machine obtains the inspection results based on the test results of all the inspected material tubes.

[0118] The present invention provides an inspection method for an integrated circuit test system. In response to an inspection interactive instruction or the arrival of a preset time, a sorting machine places an inspection material tube in a loading area of ​​the sorting machine or generates an interactive instruction indicating a loading operation. This enables the tester of the integrated circuit test system to automatically identify the inspection material tube according to historical test data when processing the loading area, and to test multiple inspection samples in the inspection material tube in turn, and obtain inspection results based on the test results of the multiple inspection samples, thereby realizing automatic inspection of the integrated circuit test system.

[0119] The above embodiments of the present application are all illustrated in the form of a single point inspection tube. It should be understood that when multiple consecutive point inspection tubes are set for spot inspection, the specific workflow is similar to the above single point inspection tube case, the only difference is that the spot inspection results need to be analyzed based on the test results of all the point inspection tubes, and the specific workflow will not be repeated here.

[0120] In this embodiment, a spot inspection device for an integrated circuit test system is also provided, which is used to implement the above-mentioned embodiments and preferred implementation modes, and the descriptions that have been made will not be repeated. As used below, the term "module" can implement a combination of software and / or hardware for a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, the implementation of hardware, or a combination of software and hardware, is also possible and conceivable.

[0121] The embodiment of the present invention provides a spot inspection device for an integrated circuit test system, which is applied to a test machine, such as Figure 8 As shown, it includes a material pipe identification module 801, a spot inspection test module 802 and a result processing module 803.

[0122] The material tube identification module 801 is used to obtain historical test data and determine the material tube type of the material tube to which the current tested part belongs according to the historical test data.

[0123] The spot inspection test module 802 is used to enter the spot inspection mode when the material tube type is a spot inspection material tube, and test multiple test pieces in the spot inspection material tube in sequence to obtain multiple test results of the multiple test pieces in the spot inspection material tube.

[0124] The result processing module 803 is used to obtain the spot inspection result according to the test results of all the spot inspection material tubes.

[0125] In some optional embodiments, the material tube identification module 801 is specifically used to: obtain historical test data corresponding to the first number of tested parts that have recently completed the test; determine whether the first number of tested parts that have recently completed the test are a continuous first number of marked samples based on the historical test data; if they are a continuous first number of marked samples, then the material tube type of the material tube to which the current tested parts belong is a spot inspection material tube.

[0126] In some optional embodiments, the spot inspection test module 802 is specifically used to: send a test signal to the sorting machine in response to a loading completion signal of the test piece i sent by the sorting machine; receive the test result of the test piece i sent by the sorting machine, and save the test result of the test piece i.

[0127] In some optional embodiments, after receiving the test results sent by the sorting machine and saving the test results, the spot inspection test module 802 is also used to generate a first sorting signal and send it to the sorting machine, so that the sorting machine places the test piece i in an empty material tube in the unloading area according to the first sorting signal.

[0128] In some optional embodiments, when the material tube type is a spot inspection material tube, after testing multiple spot inspection samples in the spot inspection material tube in turn and saving the test results, the spot inspection test module 802 is also used to determine the number of spot inspection samples based on multiple test results of multiple test pieces under the spot inspection mode, and judge whether the number reaches a preset threshold; if the number reaches the preset threshold, exit the spot inspection mode; or, based on multiple test results of multiple test pieces under the spot inspection mode, determine whether there is a second number of continuous marking samples; if there is a second number of continuous marking samples, exit the spot inspection mode.

[0129] In some optional embodiments, when the material tube type is not a spot inspection material tube, the spot inspection test module 802 is also used to send a test signal to the sorting machine in response to a loading completion signal sent by the sorting machine; receive the test results sent by the sorting machine, and determine the type of the current part under test according to the test results; generate a second sorting signal according to the type of the part under test, and send it to the sorting machine, so that the sorting machine sorts and unloads the part under test according to the second sorting signal.

[0130] The embodiment of the present invention provides a spot inspection device for an integrated circuit test system, which is applied to a sorting machine, such as Fig. 9 As shown, it includes a loading module 901 , a testing module 902 and a unloading module 903 .

[0131] Among them, the loading module 901 is used to place the inspection material tube in the loading area or generate an interactive instruction indicating the loading operation in response to the inspection interactive instruction or the arrival of a preset time.

[0132] The testing module 902 is used to load and test the test pieces in the loading area in sequence, generate test results and send them to the testing machine, so that the testing machine generates a first sorting signal or a second sorting signal according to the test results.

[0133] In an optional implementation, the test module 902 specifically includes: a control module, a manipulator group test station and a communication port.

[0134] The unloading module 903 is used to receive the first sorting signal or the second sorting signal sent by the test machine, and place the tested piece in the empty material tube of the unloading area according to the first sorting signal, or sort and unload the tested piece according to the second sorting signal.

[0135] In an optional embodiment, the test module 902 is specifically used to: load the test piece in the loading area and send a loading completion signal to the test machine; receive a test signal sent by the test machine, test the integrated circuit under test according to the test signal, and obtain a test result; send the test result to the test machine, so that the test machine generates a first sorting signal or a second sorting signal according to the test result.

[0136] The further functional description of each of the above modules and units is the same as that of the above corresponding embodiments and will not be repeated here.

[0137] The inspection device of the integrated circuit test system in this embodiment is presented in the form of a functional unit, where the unit refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and memory that executes one or more software or fixed programs, and / or other devices that can provide the above functions.

[0138] The embodiment of the present invention also provides a computer device having the above Figure 8 and / or Fig. 9 The inspection device of the integrated circuit test system shown.

[0139] The embodiment of the present invention also provides an integrated circuit testing system, including a testing machine and a sorting machine, wherein the testing machine includes Figure 8 The inspection device of the integrated circuit test system shown in the figure, the sorting machine includes Fig. 9 The inspection device of the integrated circuit test system shown in FIG.

[0140] See also Fig.10 , Fig.10 is a schematic diagram of the structure of a computer device provided by an optional embodiment of the present invention, such as Fig.10 As shown, the computer device includes: one or more processors 10, a memory 20, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. Various components are connected to each other using different buses for communication, and can be installed on a common mainboard or installed in other ways as needed. The processor can process the instructions executed in the computer device, including instructions stored in or on the memory to display the graphical information of the GUI on an external input / output device (such as, a display device coupled to the interface). In some optional embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple computer devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Fig.10 A processor 10 is taken as an example.

[0141] The processor 10 may be a central processing unit, a network processor or a combination thereof. The processor 10 may further include a hardware chip. The hardware chip may be a dedicated integrated circuit, a programmable logic device or a combination thereof. The programmable logic device may be a complex programmable logic device, a field programmable gate array, a general purpose array logic or any combination thereof.

[0142] The memory 20 stores instructions executable by at least one processor 10, so that at least one processor 10 executes the method shown in the above embodiment.

[0143] The memory 20 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the computer device, etc. In addition, the memory 20 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some optional embodiments, the memory 20 may optionally include a memory remotely arranged relative to the processor 10, and these remote memories may be connected to the computer device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0144] The memory 20 may include a volatile memory, such as a random access memory; the memory may also include a non-volatile memory, such as a flash memory, a hard disk or a solid state drive; the memory 20 may also include a combination of the above types of memory.

[0145] The computer device also includes an input device 30 and an output device 40. The processor 10, the memory 20, the input device 30 and the output device 40 may be connected via a bus or other means. Fig.10 The example of connecting through bus is taken in the following.

[0146] The input device 30 can receive input digital or character information, and generate key signal input related to the user settings and function control of the computer device, such as a touch screen, a keypad, a mouse, a track pad, a touch pad, an indicator bar, one or more mouse buttons, a trackball, a joystick, etc. The output device 40 may include a display device, an auxiliary lighting device (e.g., an LED) and a tactile feedback device (e.g., a vibration motor), etc. The above-mentioned display device includes but is not limited to a liquid crystal display, a light emitting diode, a display and a plasma display. In some optional embodiments, the display device may be a touch screen.

[0147] The embodiment of the present invention also provides a computer-readable storage medium. The method according to the embodiment of the present invention can be implemented in hardware, firmware, or can be implemented as a computer code that can be recorded in a storage medium, or can be implemented as a computer code that is originally stored in a remote storage medium or a non-temporary machine-readable storage medium and will be stored in a local storage medium through a network download, so that the method described herein can be stored in such software processing on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. Among them, the storage medium can be a magnetic disk, an optical disk, a read-only storage memory, a random access memory, a flash memory, a hard disk or a solid-state hard disk, etc.; further, the storage medium can also include a combination of the above types of memories. It can be understood that a computer, a processor, a microprocessor controller, or programmable hardware includes a storage component that can store or receive software or computer code. When the software or computer code is accessed and executed by a computer, a processor, or hardware, the method shown in the above embodiment is implemented.

[0148] A part of the present invention may be applied as a computer program product, such as a computer program instruction, which, when executed by a computer, can call or provide the method and / or technical solution according to the present invention through the operation of the computer. Those skilled in the art should understand that the existence of the computer program instruction in a computer-readable medium includes, but is not limited to, a source file, an executable file, an installation package file, etc., and accordingly, the way in which the computer program instruction is executed by the computer includes, but is not limited to: the computer directly executes the instruction, or the computer compiles the instruction and then executes the corresponding compiled program, or the computer reads and executes the instruction, or the computer reads and installs the instruction and then executes the corresponding installed program. Here, the computer-readable medium may be any available computer-readable storage medium or communication medium accessible to the computer.

[0149] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A spot inspection method for an integrated circuit test system, characterized in that: Applied to a testing machine, the method comprises: Acquire historical test data, and determine the type of the material tube to which the current tested part belongs according to the historical test data; When the material tube type is a spot inspection material tube, enter the spot inspection mode, test the multiple test pieces in the spot inspection material tube in turn, and obtain multiple test results of the multiple test pieces in the spot inspection material tube, wherein the loading area of ​​the integrated circuit test system includes one or more detection material tubes and one or more spot inspection material tubes, wherein the detection material tube is pre-loaded with the integrated circuit to be tested, and the spot inspection material tube is pre-loaded with the spot inspection sample and the mark sample, and the mark sample is set at the top of the spot inspection material tube; According to the test results of all the inspection material tubes, the inspection results are obtained; The acquiring of historical test data and determining the type of the material tube to which the current tested part belongs according to the historical test data includes: Acquire historical test data corresponding to a first number of the tested devices that have recently completed testing; Determine, based on the historical test data, whether the first number of the tested pieces that have been tested most recently are a first number of consecutive marker samples; If it is a first number of consecutive marked samples, the material tube type of the material tube to which the current tested piece belongs is a spot inspection material tube.

2. The spot inspection method of the integrated circuit test system according to claim 1, characterized in that: Testing any test piece i in the point inspection tube includes: In response to a loading completion signal of the test piece i sent by the sorting machine, sending a test signal to the sorting machine; Receive the test result of the device under test i sent by the sorting machine, and save the test result of the device under test i.

3. The spot inspection method of the integrated circuit test system according to claim 2, characterized in that: After receiving the test result of the device under test i sent by the sorting machine and saving the test result of the device under test i, the method further includes: A first sorting signal is generated and sent to a sorting machine, so that the sorting machine places the tested component i in an empty material tube in a material unloading area according to the first sorting signal.

4. The spot inspection method of the integrated circuit test system according to claim 2, characterized in that: After testing any one of the test pieces i in the spot inspection tube, the method further includes: Determine the number of spot inspection samples according to the multiple test results of the multiple test pieces in the spot inspection mode, and judge whether the number reaches a preset threshold; If the number reaches the preset threshold, exit the spot check mode; or, Determine whether there are a second number of consecutive marked samples according to a plurality of test results of a plurality of the test pieces in the spot inspection mode; If there are a second number of consecutive marker samples, the spot check mode is exited.

5. The spot inspection method of the integrated circuit test system according to claim 1, characterized in that: Also includes: When the material tube type is not a spot inspection material tube, in response to a material loading completion signal sent by the sorting machine, a test signal is sent to the sorting machine; Receiving the test result sent by the sorting machine, and determining the type of the current tested component according to the test result; A second sorting signal is generated according to the type of the tested parts and sent to a sorting machine, so that the sorting machine sorts and discharges the tested parts according to the second sorting signal.

6. A spot inspection method for an integrated circuit test system, characterized in that: The inspection method comprises: The sorting machine, in response to the spot inspection interactive instruction or the arrival of the preset time, places the spot inspection material tube in the loading area or generates an interactive instruction indicating the loading operation, so as to realize the loading of the spot inspection material tube, wherein the loading area of ​​the integrated circuit test system includes one or more detection material tubes and one or more spot inspection material tubes, wherein the detection material tube is pre-loaded with the integrated circuit to be tested, and the spot inspection material tube is pre-loaded with the spot inspection sample and the mark sample, and the mark sample is arranged at the top of the spot inspection material tube; The testing machine obtains historical test data, and determines the material tube type of the material tube to which the current tested part belongs according to the historical test data; When the material tube type is a spot inspection material tube, the testing machine enters a spot inspection mode, and sequentially tests a plurality of test pieces in the spot inspection material tube to obtain a plurality of test results of the plurality of test pieces in the spot inspection material tube; The testing machine obtains the inspection results according to the test results of all the inspection material tubes; The acquiring of historical test data and determining the type of the material tube to which the current tested part belongs according to the historical test data includes: Acquire historical test data corresponding to a first number of the tested devices that have recently completed testing; Determine, based on the historical test data, whether the first number of the tested pieces that have been tested most recently are a first number of consecutive marker samples; If it is a first number of consecutive marked samples, the material tube type of the material tube to which the current tested piece belongs is a spot inspection material tube.

7. A spot inspection device for an integrated circuit test system, characterized in that: Applicable to test machines, including: A material tube identification module, used to obtain historical test data and determine the material tube type of the material tube to which the current tested part belongs according to the historical test data; A spot inspection test module, for entering a spot inspection mode when the material tube type is a spot inspection material tube, testing a plurality of test pieces in the spot inspection material tube in sequence, and obtaining a plurality of test results of the plurality of test pieces in the spot inspection material tube, wherein the loading area of ​​the integrated circuit test system comprises one or more detection material tubes and one or more spot inspection material tubes, wherein the detection material tube is pre-loaded with an integrated circuit to be tested, and the spot inspection material tube is pre-loaded with a spot inspection sample and a marking sample, and the marking sample is arranged at the top of the spot inspection material tube; The result processing module is used to obtain the inspection results according to the test results of all the inspection material tubes; The material pipe identification module is specifically used to: obtain historical test data corresponding to the first number of the tested parts that have been tested most recently; determine whether the first number of the tested parts that have been tested most recently are a continuous first number of marked samples based on the historical test data; if they are a continuous first number of marked samples, the material pipe type of the material pipe to which the current tested parts belong is a spot inspection material pipe.

8. An integrated circuit testing system, characterized in that: The testing system comprises a testing machine and a sorting machine; A sorting machine, for placing a spot inspection tube in a loading area or generating an interactive instruction indicating a loading operation in response to a spot inspection interactive instruction or the arrival of a preset time, wherein the loading area of ​​the integrated circuit test system includes one or more detection tubes and one or more spot inspection tubes, wherein the detection tube is pre-installed with an integrated circuit to be tested, and the spot inspection tube is pre-installed with a spot inspection sample and a mark sample, and the mark sample is arranged at the top of the spot inspection tube; sequentially loading and testing the tested pieces in the loading area, generating test results and sending them to the test machine, so that the test machine generates a first sorting signal or a second sorting signal according to the test results; receiving the first sorting signal or the second sorting signal sent by the test machine, placing the tested pieces in an empty tube in a unloading area according to the first sorting signal, or sorting and unloading the tested pieces according to the second sorting signal; A test machine, used to implement the inspection method of an integrated circuit test system according to any one of claims 1 to 5.

9. The integrated circuit testing system according to claim 8, characterized in that: The sorting machine is specifically used for: loading the tested parts in the loading area and sending a loading completion signal to the tester; receiving the test signal sent by the tester, testing the tested integrated circuit according to the test signal, and obtaining the test result; sending the test result to the tester, so that the tester generates a first sorting signal or a second sorting signal according to the test result.

10. A computer device, characterized in that: include: A memory and a processor, wherein the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor executes the inspection method of the integrated circuit test system according to any one of claims 1 to 6 by executing the computer instructions.

11. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a computer to execute the inspection method of the integrated circuit test system according to any one of claims 1 to 6.

12. A computer program product, characterized in that The method comprises computer instructions, wherein the computer instructions are used to cause a computer to execute the inspection method of an integrated circuit test system according to any one of claims 1 to 6.

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