A pin welding device for electronic component production that is easy to position

By designing pin welding equipment for electronic components production that is easy to position, the problems of pin misalignment and substrate movement during the welding process are solved, and efficient welding of substrates of different sizes and thicknesses is achieved, and welding efficiency and quality are improved.

CN118989491BActive Publication Date: 2025-05-06SHENZHEN HAIYUDA ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202411479642.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-10-23
Publication Date
2025-05-06
Estimated Expiration
2044-10-23

AI Technical Summary

Technical Problem

During the welding process of electronic components, the prior art is difficult to effectively solve the problem of pin misalignment or dummy welding, and the substrate is light in quality, which is easy to move during the welding process, affecting the welding effect.

Method used

A pin welding equipment for the production of electronic components for easy positioning is designed, including base plate, support legs, welding mechanism, positioning assembly and transmission assembly. The welding mechanism has a rotating structure, and the fixing of the substrate and positioning of electronic components are achieved through the V-shaped groove and the limiting groove. The transmission assembly drives the circular plate to rotate and realizes continuous welding.

Benefits of technology

The device can effectively position and weld electronic components of different sizes, ensure pin alignment, reduce dummy welding phenomenon, and adapt to substrates of different thicknesses and sizes through elastic material support blocks and adjustable positioning components, improving welding efficiency and quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses a pin welding device for electronic component production that is easy to position, and the present invention relates to the technical field of circuit board welding. The present invention comprises a circular plate, the bottom of the circular plate is rotatably connected to the top of the bottom plate, the bottom of the bottom plate is rotatably connected to a transmission assembly, the output end of the transmission assembly passes through the bottom plate and is fixedly connected to the bottom center of the circular plate, the surface of the output end of the transmission assembly is rotatably connected to the inner side surface of the bottom plate, the positioning assembly is slidably limited to the side of the circular plate away from the bottom plate, and the positioning assembly is arranged just above the V-shaped groove, the welding assembly is fixedly connected to the outer side surface of the bottom plate, the V-shaped structure of the V-shaped groove can fix substrates of different sizes, and realize the welding of electronic components on substrates of various sizes, and the movable positioning assembly can adjust the welding position according to the size of the substrate, and position the electronic component to the center of the substrate for welding pins.
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Description

Technical Field

[0001] The invention relates to the technical field of circuit board welding, and in particular to a pin welding device for electronic component production which is easy to position. Background Art

[0002] Electronic components are basic units that have independent circuit functions and constitute circuits. With the development of electronic technology, the variety of components is increasing, the functions are becoming stronger, and the scope of involvement is also expanding. With the advancement of science, the size of electronic components is getting smaller and smaller, and the integration of electronic equipment is getting higher and higher. The difficulty of welding and processing electronic components such as chips is also increasing;

[0003] Currently, when workers are welding chips and other components, they need to weld the circuit board substrate to the pins of the electronic components. A slight shake during welding may cause problems such as misalignment of the component pins or cold soldering. At the same time, the substrate used for welding is light in weight and is easy to move during the welding process, affecting the welding effect. Therefore, we proposed a pin welding equipment for electronic component production that is easy to position. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a pin welding device for electronic component production that is easy to position, comprising:

[0005] A base plate, and support legs disposed at the bottom of the base plate;

[0006] A welding mechanism, the welding mechanism having a rotating structure and used for continuous welding of a plurality of electronic component pins;

[0007] The bottom of the bottom plate is fixedly connected to the bottom of the supporting leg, and the side of the bottom plate away from the supporting leg is rotatably connected to the welding mechanism;

[0008] Wherein, the welding mechanism comprises:

[0009] A circular plate, the surface of which is provided with a V-shaped groove, the V-shaped groove being used for limiting the position of the substrate;

[0010] A positioning assembly having a sliding structure for limiting the electronic component at the center of the substrate;

[0011] A soldering assembly having a placement structure for placing a soldering iron when the pins are not being soldered;

[0012] A transmission assembly, which is arranged at the bottom of the base plate and is used to drive the circular plate to rotate;

[0013] The bottom of the circular plate is rotatably connected to the top of the base plate, and the bottom of the base plate is rotatably connected to the transmission assembly. The output end of the transmission assembly passes through the base plate and is fixedly connected to the bottom center of the circular plate. The surface of the output end of the transmission assembly is rotatably connected to the inner side surface of the base plate. The positioning assembly is slidably limited to the side of the circular plate away from the base plate, and the positioning assembly is arranged directly above the V-shaped groove. The welding assembly is fixedly connected to the outer side surface of the base plate. The substrate of the circuit board is inserted into the V-shaped groove of the circular plate to fix the substrate, and then the electronic component is fixed to the center position of the substrate through the positioning assembly. Then, the welding assembly is used to weld the pins of the electronic component, and then the transmission assembly is started. The transmission assembly drives the circular plate to rotate, and the step is repeated to weld the next group of substrates and the pins of the electronic components, thereby realizing continuous processing. The V-groove with a V-shaped structure can fix substrates of different sizes and realize the welding of electronic components on substrates of various sizes. The movable positioning assembly can adjust the welding position according to the size of the substrate, and position the electronic component to the center of the substrate for welding the pins.

[0014] Furthermore, a plurality of V-shaped grooves are provided, and the plurality of V-shaped grooves are evenly distributed along the circumference of the circular plate. A plurality of positioning assemblies are provided, and the plurality of positioning assemblies are evenly distributed along the circumference of the circular plate. A plurality of V-shaped grooves are provided, and a plurality of substrates can be fixed at one time. When welding a substrate, the welded substrate can be unloaded and installed again. The corresponding positioning assemblies arranged directly above the V-shaped grooves can fix the electronic components. As the circular plate rotates, continuous welding of the substrate and the electronic components can be achieved.

[0015] Furthermore, limiting grooves are symmetrically provided on both sides of the V-shaped groove, and a spring plate is fixedly connected to the inner wall of the limiting groove, and the limiting groove is arranged in a parabolic shape. When a thinner substrate is processed, the substrate is inserted into the V-shaped groove to squeeze the spring plate, and the spring plate enters the limiting groove. As the substrate continues to penetrate into the V-shaped groove and is squeezed by the parabolic limiting groove, the two sides of the spring plate gradually come closer, and the thinner substrate is gradually clamped and fixed by the spring plate, thereby being able to fix substrates of different thicknesses.

[0016] Furthermore, a support block is provided at the interval between the spring plate and the limiting groove, and the surface of the support block is fixedly connected to the side of the spring plate and the limiting groove close to each other. The support block is made of elastic material. The support block made of elastic material can assist the spring plate to deform and provide elastic force when the spring plate is reset, thereby avoiding fatigue damage of the spring plate and improving the service life of the spring plate.

[0017] Furthermore, the positioning assembly includes a telescopic rod, which is symmetrically arranged on both sides of the V-shaped groove, and the telescopic rod is fixedly connected to the side of the circular plate away from the bottom plate, and a bent plate is arranged on the side of the telescopic rod away from the circular plate, and the bent plate is elastic, and the side of the bent plate close to the circular plate is fixedly connected to one end of the two telescopic rods away from the circular plate, and the bent plate is arranged directly above the V-shaped groove, and a suction cup is fixedly connected to the side of the bent plate close to the V-shaped groove, and the electronic component is adsorbed on the suction cup, and the telescopic rod is started, and the telescopic rod drives the bent plate to rise and fall, thereby driving the suction cup close to the substrate, pressing the electronic component to the center of the substrate, thereby realizing the positioning of the electronic component.

[0018] Furthermore, a positioning groove is provided on one side of the two telescopic rods away from the bent plate, and a positioning block is slidably connected to the inner walls of the two positioning grooves. The two positioning blocks are fixedly connected to one end of the two telescopic rods away from the bent plate away from the bottom plate. The bent plate is moved, and the bent plate drives the telescopic rod and the positioning block to move. The positioning block slides inside the positioning groove to adjust the position of the electronic component, so that after substrates of different sizes are inserted into the V-shaped groove at different depths, the suction cup can still press the electronic component in the center of the substrate, and uniform deformation occurs on both sides of the bent plate. Under the action of elastic force, the telescopic rod is driven to move to both sides of the bent plate, thereby driving the positioning block to abut against the inner side of the positioning groove to reach a balanced state, so that the bent plate will not move at will after deformation, thereby ensuring the positioning effect.

[0019] Furthermore, a protrusion is fixedly connected to one side of the circular plate close to the base plate, and an annular groove is provided on one side of the base plate close to the circular plate, and the inner side surface of the annular groove is slidably adapted to the surface of the protrusion. The circular plate rotates, driving the protrusion to rotate, and the protrusion slides inside the annular groove, thereby realizing the limited rotation of the circular plate, avoiding vibration when the circular plate rotates, avoiding vibration causing vibration of the substrate, and avoiding affecting the positioning effect of the substrate and the pins of the electronic components.

[0020] Furthermore, the transmission assembly includes a motor, a side of the motor close to the base plate is fixedly connected with a rotating shaft, the rotating shaft is fixedly connected to an output end of the motor, an end of the rotating shaft away from the motor passes through the base plate and is fixedly connected to the side of the circular plate close to the base plate, the surface of the rotating shaft is rotatably connected to the inner side surface of the base plate, and the motor is started, the output end of the motor drives the rotating shaft to rotate, and the rotation of the rotating shaft drives the circular plate to rotate, and drives the parts on the top of the circular plate to rotate, thereby realizing continuous welding. A first fixed frame is fixedly connected to the surface of the motor, and a side of the first fixed frame away from the motor is respectively fixedly connected to a side of several supporting legs close to the center of the base plate, and a second fixed frame is fixedly connected to a side of the base plate close to the supporting legs, and the inner side surface of the second fixed frame is rotatably connected to the surface of the rotating shaft. The first fixed frame and the second fixed frame can fix and limit the motor and the rotating shaft, reduce vibration generated when the motor is in use, and improve the stability of the rotation of the circular plate.

[0021] Furthermore, the welding assembly includes a ring body, the inner side surface of the ring body is fixedly connected to the surface of the base plate, the side of the ring body away from the circular plate is fixedly connected to a fixed block, the side of the fixed block away from the circular plate is fixedly connected to a wire, the end of the wire away from the fixed block is fixedly connected to a soldering iron, and the end of the soldering iron away from the wire is set to an inclined shape, the soldering iron is started, the soldering iron works, generates heat, and the pins of the electronic components are soldered to the top of the substrate, the inclined end of the soldering iron, its tip can be used to solder a single pin, and its inclined side can be used to solder multiple pins, and by changing the pressing angle, the welding of electronic components with different numbers of pins can be achieved, and the contact area with the pins can be changed, thereby avoiding contact between the soldering iron and the substrate, and avoiding damage to the substrate during welding.

[0022] Furthermore, the outer side surface of the ring body is fixedly connected to a fixing seat, the inner wall of the fixing seat is fixedly connected to an elastic ring, the inner side surface of the elastic ring is slidably connected to the outer surface of the electric wire, a placement tube is provided on the outside of the electric soldering iron, the placement tube is fixedly connected to the side of the ring body away from the supporting leg, and the inner wall of the placement tube is slidably connected to the surface of the electric soldering iron, a sleeve is provided at one end of the electric wire close to the electric soldering iron, the inner side surface of the sleeve is fixedly connected to the surface of the electric wire, and the sleeve is arranged in a curved shape for easy holding, the worker holds the sleeve to drive the electric wire and the electric soldering iron to move, the electric soldering iron leaves the placement tube, and after welding is completed, the electric soldering iron is placed. When the soldering iron is put back, the fixing seat and the elastic ring can limit the wire to prevent the wire from being entangled, and the elasticity of the elastic ring can clamp the wire to prevent the wire from being pulled at will. A sleeve is provided to facilitate hand-held holding, and at the same time, the connection between the wire and the electric soldering iron is protected to prevent leakage. The placement tube can be placed inside the placement tube when the electric soldering iron is idle to prevent the electric soldering iron from falling and scalding the worker, and at the same time, it can free the worker's hands to complete other operations. At the same time, when heating the electric soldering iron, the electric soldering iron can be placed inside the placement tube for heating. In a small space, the electric soldering iron can quickly reach a predetermined temperature, thereby reducing the startup time and improving the welding efficiency.

[0023] The present invention has the beneficial effects:

[0024] The present invention is capable of fixing substrates of different sizes by setting a welding mechanism and a V-groove of a V-shaped structure, thereby realizing welding of electronic components on substrates of various sizes. The movable positioning component can adjust the welding position according to the size of the substrate, and position the electronic component at the center of the substrate for welding pins. A plurality of V-grooves are set, so that a plurality of substrates can be fixed at one time. When welding a substrate, the welded substrate can be unloaded and the substrate can be installed again. The corresponding positioning component arranged directly above the V-groove can fix the electronic component accordingly. As the circular plate rotates, continuous welding of the substrate and the electronic component can be realized.

[0025] The present invention provides a limiting groove. When processing a thinner substrate, the substrate is inserted into the V-shaped groove to squeeze the spring plate, and the spring plate enters the limiting groove. As the substrate continues to penetrate into the V-shaped groove and is squeezed by the parabolic limiting groove, the two sides of the spring plate gradually move closer, and the thinner substrate is gradually clamped and fixed by the spring plate, so that substrates of different thicknesses can be fixed. The support block of elastic material can assist the spring plate in deforming and provide elastic force when the spring plate is reset, so as to avoid fatigue damage of the spring plate, thereby improving the service life of the spring plate.

[0026] The present invention sets a positioning assembly, and the positioning block slides inside the positioning groove to adjust the position of the electronic component, so that after substrates of different sizes are inserted into the V-shaped groove at different depths, the suction cup can still press the electronic component in the center of the substrate, and both sides of the bent plate are uniformly deformed. Under the action of elastic force, the telescopic rod is driven to move to both sides of the bent plate, thereby driving the positioning block to abut against the inner side of the positioning groove to achieve a balanced state, so that the bent plate will not move at will after deformation, thereby ensuring the positioning effect.

[0027] The present invention provides an electric soldering iron with an inclined end portion, wherein the tip portion can be used to solder a single pin, and the inclined side portion can be used to solder multiple pins. By changing the pressing angle, the soldering of electronic components with different numbers of pins can be achieved, and the contact area with the pins can be changed, thereby preventing the electric soldering iron from contacting the substrate, and preventing damage to the substrate during welding.

[0028] The present invention sets a welding assembly, and the fixing seat and the elastic ring can limit the electric wire to avoid the electric wire from being entangled. The elasticity of the elastic ring can clamp the electric wire to prevent the electric wire from being pulled at will. The sleeve is set to facilitate handholding and protect the connection between the electric wire and the electric soldering iron to avoid leakage. The placement tube can be placed inside the placement tube when the electric soldering iron is idle to prevent the electric soldering iron from falling and scalding the worker, and at the same time, the worker's hands can be freed to complete other operations. At the same time, when the electric soldering iron is heated, the electric soldering iron can be placed inside the placement tube for heating. In a small space, the electric soldering iron can quickly reach a predetermined temperature, thereby reducing the start-up time and improving the welding efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic diagram of a pin welding device for electronic component production that facilitates positioning according to the present invention;

[0030] Figure 2 This is a schematic diagram of the structure of the welding assembly of the present invention;

[0031] Figure 3 This is a schematic diagram of the bottom structure of the welding assembly of the present invention;

[0032] Figure 4 It is a schematic diagram of the cross-sectional structure of a circular plate of the present invention;

[0033] Figure 5 This is a schematic diagram of the circular plate assembly structure of the present invention;

[0034] Figure 6 It is a schematic diagram of the structure of the transmission assembly of the present invention;

[0035] Figure 7 This is a schematic diagram of the structure of the welding assembly of the present invention;

[0036] Figure 8 It is a schematic diagram of the structure of the electric soldering iron of the present invention.

[0037] In the figure: 1, bottom plate; 2, supporting leg; 3, welding mechanism; 31, circular plate; 32, V-shaped groove; 33, positioning assembly; 331, positioning groove; 332, positioning block; 333, telescopic rod; 334, bending plate; 335, suction cup; 34, welding assembly; 341, ring body; 342, fixing block; 343, electric wire; 344, fixing seat; 345, elastic ring; 346, sleeve; 347, electric soldering iron; 348, placing tube; 35, transmission assembly; 351, motor; 352, rotating shaft; 353, first fixing frame; 354, second fixing frame; 36, spring plate; 37, supporting block; 38, limiting groove; 39, protrusion; 310, ring groove. DETAILED DESCRIPTION

[0038] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

[0039] Example 1, please refer to Figure 1-Figure 6 The present invention is a pin welding device for electronic component production that is easy to position, comprising:

[0040] A base plate 1, and a supporting leg 2 arranged at the bottom of the base plate 1;

[0041] A welding mechanism 3, which has a rotating structure and is used for continuous welding of multiple electronic component pins;

[0042] The bottom of the bottom plate 1 is fixedly connected to the bottom of the support leg 2, and the side of the bottom plate 1 away from the support leg 2 is rotatably connected to the welding mechanism 3;

[0043] Among them, the welding mechanism 3 includes:

[0044] A circular plate 31, a V-shaped groove 32 is formed on the surface of the circular plate 31, and the V-shaped groove 32 is used for limiting the position of the substrate;

[0045] A positioning assembly 33, the positioning assembly 33 having a sliding structure, used to limit the electronic component at the center of the substrate;

[0046] A soldering assembly 34, the soldering assembly 34 having a placement structure for placing a soldering iron when the pins are not soldered;

[0047] A transmission assembly 35, which is disposed at the bottom of the base plate 1 and is used to drive the circular plate 31 to rotate;

[0048] The bottom of the circular plate 31 is rotatably connected to the top of the bottom plate 1, the bottom of the bottom plate 1 is rotatably connected to the transmission assembly 35, the output end of the transmission assembly 35 passes through the bottom plate 1 and is fixedly connected to the bottom center of the circular plate 31, the surface of the output end of the transmission assembly 35 is rotatably connected to the inner side of the bottom plate 1, the positioning assembly 33 is slidably limited to the side of the circular plate 31 away from the bottom plate 1, and the positioning assembly 33 is arranged just above the V-shaped groove 32, the welding assembly 34 is fixedly connected to the outer side of the bottom plate 1, the substrate of the circuit board is inserted into the V-shaped groove 32 of the circular plate 31, the substrate is fixed, and then the electronic components are The positioning component 33 is used to fix the center position of the substrate, and then the welding component 34 is used to weld the pins of the electronic components. Then the transmission component 35 is started, and the transmission component 35 drives the circular plate 31 to rotate, and the steps are repeated to weld the next group of substrates and the pins of the electronic components, thereby realizing continuous processing. The V-shaped groove 32 with a V-shaped structure can fix substrates of different sizes and realize the welding of electronic components on substrates of various sizes. The movable positioning component 33 can adjust the welding position according to the size of the substrate and position the electronic component at the center of the substrate for welding the pins.

[0049] A plurality of V-grooves 32 are provided, and the plurality of V-grooves 32 are evenly distributed along the circumference of the circular plate 31. A plurality of positioning components 33 are provided, and the plurality of positioning components 33 are evenly distributed along the circumference of the circular plate 31. A plurality of V-grooves 32 are provided, and a plurality of positioning components 33 are evenly distributed along the circumference of the circular plate 31. A plurality of V-grooves 32 are provided, and a plurality of substrates can be fixed at one time. When welding a substrate, the welded substrate can be unloaded and installed again. The corresponding positioning components 33 provided directly above the V-grooves 32 can fix the electronic components accordingly. As the circular plate 31 rotates, continuous welding of the substrate and the electronic components can be achieved.

[0050] Limiting grooves 38 are symmetrically provided on both sides of the V-shaped groove 32, and an elastic plate 36 is fixedly connected to the inner wall of the limiting groove 38, and the limiting groove 38 is set to be parabolic. When processing a thinner substrate, the substrate is inserted into the V-shaped groove 32 to squeeze the elastic plate 36, and the elastic plate 36 enters the limiting groove 38. As the substrate continues to penetrate into the V-shaped groove 32 and is squeezed by the parabolic limiting groove 38, the two sides of the elastic plate 36 gradually move closer, and the thinner substrate is gradually clamped and fixed by the elastic plate 36, so that substrates of different thicknesses can be fixed.

[0051] A support block 37 is provided at the interval between the spring plate 36 and the limiting groove 38. The surfaces of the support block 37 are fixedly connected to the sides of the spring plate 36 and the limiting groove 38 that are close to each other. The support block 37 is made of elastic material. The support block 37 made of elastic material can assist the spring plate 36 in deforming and provide elastic force when the spring plate 36 is reset, thereby avoiding fatigue damage of the spring plate 36 and improving the service life of the spring plate 36.

[0052] The positioning assembly 33 includes telescopic rods 333, which are symmetrically arranged on both sides of the V-shaped groove 32, and the telescopic rods 333 are fixedly connected to the side of the circular plate 31 away from the bottom plate 1. A bent plate 334 is arranged on the side of the telescopic rod 333 away from the circular plate 31, and the bent plate 334 is elastic. The side of the bent plate 334 close to the circular plate 31 is fixedly connected to one end of the two telescopic rods 333 away from the circular plate 31, and the bent plate 334 is arranged directly above the V-shaped groove 32. A suction cup 335 is fixedly connected to the side of the bent plate 334 close to the V-shaped groove 32, and the electronic component is adsorbed on the suction cup 335. The telescopic rod 333 is started, and the telescopic rod 333 drives the bent plate 334 to rise and fall, thereby driving the suction cup 335 to approach the substrate, pressing the electronic component to the center of the substrate, thereby realizing the positioning of the electronic component.

[0053] The two telescopic rods 333 are provided with a positioning groove 331 on one side away from the bent plate 334. The inner walls of the two positioning grooves 331 are slidably connected with positioning blocks 332. The two positioning blocks 332 are fixedly connected to one end of the two telescopic rods 333 away from the bent plate 334 at the ends away from the bottom plate 1. The bent plate 334 is moved, and the bent plate 334 drives the telescopic rod 333 and the positioning block 332 to move. The positioning block 332 slides inside the positioning groove 331 to adjust the position of the electronic component. After substrates of different sizes are inserted into the V-shaped groove 32 at different depths, the suction cup 335 can still press the electronic component in the center of the substrate. The two sides of the bent plate 334 are uniformly deformed. Under the action of elastic force, the telescopic rod 333 is driven to move toward the two sides of the bent plate 334, thereby driving the positioning block 332 to abut against the inner side of the positioning groove 331 to reach a balanced state, so that the bent plate 334 will not move at will after deformation, thereby ensuring the positioning effect.

[0054] A protrusion 39 is fixedly connected to one side of the circular plate 31 close to the base plate 1, and an annular groove 310 is provided on one side of the base plate 1 close to the circular plate 31, and the inner side surface of the annular groove 310 is slidably adapted to the surface of the protrusion 39. The circular plate 31 rotates, driving the protrusion 39 to rotate, and the protrusion 39 slides inside the annular groove 310, thereby realizing the limited rotation of the circular plate 31, avoiding vibration when the circular plate 31 rotates, avoiding vibration causing vibration of the substrate, and avoiding affecting the positioning effect of the substrate and the pins of the electronic components.

[0055] The transmission assembly 35 includes a motor 351. A rotating shaft 352 is fixedly connected to one side of the motor 351 close to the bottom plate 1. The rotating shaft 352 is fixedly connected to the output end of the motor 351. The end of the rotating shaft 352 away from the motor 351 passes through the bottom plate 1 and is fixedly connected to the side of the circular plate 31 close to the bottom plate 1. The surface of the rotating shaft 352 is rotatably connected to the inner side surface of the bottom plate 1. When the motor 351 is started, the output end of the motor 351 drives the rotating shaft 352 to rotate. The rotation of the rotating shaft 352 drives the circular plate 31 to rotate, and drives the parts on the top of the circular plate 31 to rotate, thereby realizing continuous welding. A first fixing frame 353 is fixedly connected to the surface of the motor 351, and a side of the first fixing frame 353 away from the motor 351 is respectively fixedly connected to a side of a plurality of supporting legs 2 close to the center of the bottom plate 1, and a second fixing frame 354 is fixedly connected to a side of the bottom plate 1 close to the supporting legs 2, and an inner side surface of the second fixing frame 354 is rotatably connected to the surface of the rotating shaft 352. The first fixing frame 353 and the second fixing frame 354 can fix and limit the motor 351 and the rotating shaft 352, thereby reducing the vibration generated by the motor 351 when in use and improving the stability of the rotation of the circular plate 31.

[0056] Example 2, please refer to Figure 1-Figure 8 The welding assembly 34 includes a ring body 341, the inner side surface of the ring body 341 is fixedly connected to the surface of the bottom plate 1, the side of the ring body 341 away from the circular plate 31 is fixedly connected to a fixing block 342, the side of the fixing block 342 away from the circular plate 31 is fixedly connected to a wire 343, one end of the wire 343 away from the fixing block 342 is fixedly connected to a soldering iron 347, and the end of the soldering iron 347 away from the wire 343 is set to be inclined, start the soldering iron 347, the soldering iron 347 works, generates heat, and solders the pins of the electronic component to the top of the substrate, the inclined end of the soldering iron 347, its tip can solder a single pin, and its inclined side can solder multiple pins, and by changing the pressing angle, the welding of electronic components with different numbers of pins can be achieved, and the contact area with the pins can be changed, thereby avoiding contact between the soldering iron 347 and the substrate, and avoiding damage to the substrate during welding.

[0057] The outer side surface of the ring body 341 is fixedly connected to the fixing seat 344, the inner wall of the fixing seat 344 is fixedly connected to the elastic ring 345, the inner side surface of the elastic ring 345 is slidably connected to the outer surface of the electric wire 343, and a placement tube 348 is arranged on the outside of the electric soldering iron 347, the placement tube 348 is fixedly connected to the side of the ring body 341 away from the supporting leg 2, and the inner wall of the placement tube 348 is slidably connected to the surface of the electric soldering iron 347, and a sleeve 346 is arranged on the end of the electric wire 343 close to the electric soldering iron 347, the inner side surface of the sleeve 346 is fixedly connected to the surface of the electric wire 343, and the sleeve 346 is arranged in a curved shape for easy holding, and the worker holds the sleeve 346 to drive the electric wire 343 and the electric soldering iron 347 to move, and the electric soldering iron 347 leaves the placement tube 348, and after the soldering is completed, the electric soldering iron 347 is put back. The fixing seat 344 and the elastic ring 345 can limit the electric wire 343 to prevent the electric wire 343 from being entangled, and the elasticity of the elastic ring 345 can clamp the electric wire 343 to prevent the electric wire 343 from being pulled at will. A sleeve 346 is provided to facilitate human hand holding, and at the same time, the connection between the electric wire 343 and the electric soldering iron 347 is protected to prevent leakage. The placement tube 348 can be placed inside the placement tube 348 when the electric soldering iron 347 is idle to prevent the electric soldering iron 347 from falling and scalding the worker, and at the same time, it can free the worker's hands to complete other operations. At the same time, when the electric soldering iron 347 is heated, the electric soldering iron 347 can be placed inside the placement tube 348 for heating. In a small space, the electric soldering iron 347 can quickly reach a predetermined temperature, thereby reducing the startup time and improving the welding efficiency.

[0058] When in use, the substrate of the circuit board is inserted into the V-shaped groove 32 of the circular plate 31 to fix the substrate. When processing a thinner substrate, the substrate is inserted into the V-shaped groove 32 to squeeze the spring plate 36, and the spring plate 36 enters the limiting groove 38. As the substrate continues to penetrate into the V-shaped groove 32 and is squeezed by the parabolic limiting groove 38, the two sides of the spring plate 36 gradually move closer, and the thinner substrate is gradually clamped and fixed by the spring plate 36. Then, the electronic component is adsorbed on the suction cup 335, and the bent plate 334 is moved. The bent plate 334 drives the telescopic rod 333 and the positioning block 332 to move. The positioning block 332 slides in the positioning groove 331 to adjust the position of the electronic component. The telescopic rod 333 is started, and the telescopic rod 333 drives the bent plate 334 to rise and fall, thereby driving the suction cup 335 to approach the substrate. The electronic component is pressed on the center of the substrate to achieve the positioning of the electronic component, and the electric soldering iron 347 is started. The electric soldering iron 347 works to generate heat. The worker holds the sleeve 346 to drive the wire 343 and the electric soldering iron 347 to move. The electric soldering iron 347 leaves the placement tube 348 and solders the pins to the top of the substrate. After the soldering is completed, the electric soldering iron 347 is put back, and then the motor 351 is started. The output end of the motor 351 drives the shaft 352 to rotate. The rotation of the shaft 352 drives the circular plate 31 to rotate, and drives the parts on the top of the circular plate 31 to rotate. The circular plate 31 rotates, driving the protrusion 39 to rotate, and the protrusion 39 slides inside the annular groove 310. When the next V-shaped groove 32 is in front of the worker, the above steps are repeated to weld the next group of substrates and electronic component pins, thereby achieving continuous processing.

[0059] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. A pin welding device for electronic component production that is easy to position, characterized in that: include: A base plate (1), and supporting legs (2) arranged at the bottom of the base plate (1); A welding mechanism (3), the welding mechanism (3) having a rotating structure and used for continuous welding of a plurality of electronic component pins; The bottom of the base plate (1) is fixedly connected to the bottom of the support leg (2), and the side of the base plate (1) away from the support leg (2) is rotatably connected to the welding mechanism (3); Wherein, the welding mechanism (3) comprises: A circular plate (31), wherein a V-shaped groove (32) is provided on the surface of the circular plate (31), and the V-shaped groove (32) is used for limiting the position of the substrate; A positioning component (33), the positioning component (33) having a sliding structure, and used for limiting the electronic component at the center of the substrate; A soldering assembly (34), the soldering assembly (34) having a placement structure for placing a soldering iron when the pins are not being soldered; A transmission assembly (35), the transmission assembly (35) being arranged at the bottom of the base plate (1) and being used to drive the circular plate (31) to rotate; The bottom of the circular plate (31) is rotatably connected to the top of the bottom plate (1), the bottom of the bottom plate (1) is rotatably connected to the transmission assembly (35), the output end of the transmission assembly (35) passes through the bottom plate (1) and is fixedly connected to the center of the bottom of the circular plate (31), the surface of the output end of the transmission assembly (35) is rotatably connected to the inner side surface of the bottom plate (1), the positioning assembly (33) is slidably limited to a side of the circular plate (31) away from the bottom plate (1), and the positioning assembly (33) is arranged directly above the V-shaped groove (32), and the welding assembly (34) is fixedly connected to the outer side surface of the bottom plate (1); A plurality of the V-shaped grooves (32) are provided, and the plurality of the V-shaped grooves (32) are evenly distributed along the circumference of the circular plate (31); a plurality of the positioning components (33) are provided, and the plurality of the positioning components (33) are evenly distributed along the circumference of the circular plate (31); The positioning assembly (33) comprises telescopic rods (333), the telescopic rods (333) are symmetrically arranged on both sides of the V-shaped groove (32), and the telescopic rods (333) are fixedly connected to a side of the circular plate (31) away from the bottom plate (1), a bent plate (334) is arranged on the side of the telescopic rod (333) away from the circular plate (31), and the bent plate (334) is elastic, a side of the bent plate (334) close to the circular plate (31) is fixedly connected to one end of the two telescopic rods (333) away from the circular plate (31), and the bent plate (334) is arranged directly above the V-shaped groove (32), and a suction cup (335) is fixedly connected to the side of the bent plate (334) close to the V-shaped groove (32); The welding assembly (34) comprises a ring body (341), the inner side surface of the ring body (341) being fixedly connected to the surface of the bottom plate (1), a side of the ring body (341) away from the circular plate (31) being fixedly connected to a fixing block (342), a side of the fixing block (342) away from the circular plate (31) being fixedly connected to an electric wire (343), an end of the electric wire (343) away from the fixing block (342) being fixedly connected to an electric soldering iron (347), and an end of the electric soldering iron (347) away from the electric wire (343) being arranged in an inclined shape; The outer side surface of the ring body (341) is fixedly connected to a fixing seat (344), the inner wall of the fixing seat (344) is fixedly connected to an elastic ring (345), the inner side surface of the elastic ring (345) is slidably connected to the outer surface of the electric wire (343), a placement tube (348) is arranged outside the electric soldering iron (347), the placement tube (348) is fixedly connected to a side of the ring body (341) away from the supporting leg (2), and the inner wall of the placement tube (348) is slidably connected to the surface of the electric soldering iron (347), a sleeve (346) is arranged at one end of the electric wire (343) close to the electric soldering iron (347), the inner side surface of the sleeve (346) is fixedly connected to the surface of the electric wire (343), and the sleeve (346) is arranged in a curved shape for easy holding; Limiting grooves (38) are symmetrically provided on both sides of the V-shaped groove (32), a spring plate (36) is fixedly connected to the inner wall of the limiting groove (38), and the limiting groove (38) is arranged in a parabolic shape; A support block (37) is provided at the interval between the spring plate (36) and the limiting groove (38), and the surface of the support block (37) is fixedly connected to the spring plate (36) and the side of the limiting groove (38) close to each other, and the support block (37) is made of elastic material; A positioning groove (331) is provided on one side of the two telescopic rods (333) away from the bent plate (334); the inner walls of the two positioning grooves (331) are slidably connected with positioning blocks (332); and the two positioning blocks (332) are fixedly connected to one end of the two telescopic rods (333) away from the bent plate (334) at a side away from the bottom plate (1).

2. The pin welding equipment for electronic component production that is easy to position according to claim 1 is characterized in that: A protrusion (39) is fixedly connected to one side of the circular plate (31) close to the bottom plate (1), and an annular groove (310) is provided on one side of the bottom plate (1) close to the circular plate (31), and the inner side surface of the annular groove (310) is slidably matched with the surface of the protrusion (39).

3. The pin welding equipment for electronic component production that is easy to position according to claim 2 is characterized in that: The transmission assembly (35) comprises a motor (351), a rotating shaft (352) being fixedly connected to a side of the motor (351) close to the bottom plate (1), the rotating shaft (352) being fixedly connected to an output end of the motor (351), an end of the rotating shaft (352) away from the motor (351) passing through the bottom plate (1) and being fixedly connected to a side of the circular plate (31) close to the bottom plate (1), the surface of the rotating shaft (352) being rotatably connected to an inner side surface of the bottom plate (1), a first fixing frame (353) being fixedly connected to a surface of the motor (351), a side of the first fixing frame (353) away from the motor (351) being respectively fixedly connected to a side of a plurality of supporting legs (2) close to the center of a circle of the bottom plate (1), a second fixing frame (354) being fixedly connected to a side of the bottom plate (1) close to the supporting legs (2), the inner side surface of the second fixing frame (354) being rotatably connected to the surface of the rotating shaft (352).

Citation Information

Patent Citations

  • Three-dimensional mask ultrasonic edge welding machine

    CN212764833U