Repair agent and preparation method and application thereof
Through the repairing agent of component A and component B, the combination of epoxy resin, polyurea and barium sulfate is used to achieve convenient repair of hollow tiles, solving the problems of inconvenience in construction and unstable effect, and providing repair effects with high compressive strength and low shrinkage.
Patent Information
- Application Number
- CN202411273859.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-12
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2044-09-12
AI Technical Summary
In the prior art, the phenomenon of hollowing of ceramic tiles is widely present, resulting in high construction costs and affecting surrounding ceramic tiles. The existing repair methods are inconvenient and unstable.
Components A and component B are used to repair agents, component A includes epoxy resin and epoxy resin curing agents, and component B includes polyurea, polyurea curing agent, barium sulfate and stabilizer. The hollowing is repaired through grouting. The bonding force of epoxy resin, the elastic modulus of polyurea and the filling property of barium sulfate are used to combine the stability of the stabilizer to achieve low shrinkage repair.
Convenient tile repair is achieved, secondary hollowing is avoided, and the repairing agent has high compressive strength and low shrinkage, and the surface effect of the tile is stable after construction.
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Figure CN118995108B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of repair materials, and in particular to a repair agent, a preparation method thereof and an application thereof. Background Art
[0002] Ceramic tile adhesives are typically made primarily of cement binders. However, the natural shrinkage of cement binders, coupled with the interplay of stresses at different interfaces and the differences and flaws in tile installation techniques, combined with the high density and low water absorption of modern ceramic tiles, which make them difficult to lay, has led to the widespread phenomenon of hollow tiles. Repairing hollow tiles is a challenge currently facing existing technologies.
[0003] When dealing with similar issues, tiles often need to be pried up and re-laid, which is not only time-consuming and costly, but also noisy and can affect surrounding tiles that have already been laid. The current problem that needs to be solved is to achieve convenient construction, minimal impact on tiles, and long-term stable results. Summary of the Invention
[0004] The purpose of the present invention is to overcome the above technical deficiencies, provide a repair agent and its preparation method and application, and solve the technical problem of how to repair hollow tiles in the prior art.
[0005] In order to achieve the above technical objectives, the technical solution of the present invention provides a repair agent, including component A and component B; the raw materials of component A, calculated by weight, include 50-60 parts of epoxy resin and 40-50 parts of epoxy resin curing agent; the raw materials of component B, calculated by weight, include 40-50 parts of polyurea, 10-15 parts of polyurea curing agent, 2-5 parts of barium sulfate and 2-5 parts of stabilizer.
[0006] In some embodiments, the A component further includes 2-5 parts of alumina ceramic microbeads.
[0007] In some embodiments, the alumina ceramic microbeads have a particle size of 0.1-0.5 mm in diameter.
[0008] In some embodiments, the B component further includes 3-5 parts of silicone oil.
[0009] In some embodiments, the A component further includes 2-4 parts of benzyl alcohol.
[0010] In some embodiments, the epoxy resin curing agent is an amine curing agent, and the amine curing agent is one or both of T31 and 650; and / or, the polyurea curing agent is 5240B polyurea curing agent; and / or, the stabilizer is 2-hydroxy-4-n-octyloxybenzophenone; and / or, the epoxy resin is bisphenol A epoxy resin, the model of the bisphenol A epoxy resin is E-51, the epoxy value is 0.51-0.54 mol / 100g, and the volatile content is ≤0.2%.
[0011] In addition, the present invention also provides a method for preparing the above-mentioned repair agent, comprising the following steps:
[0012] Mixing and stirring the epoxy resin and the epoxy resin curing agent to obtain component A;
[0013] Mixing and stirring polyurea, polyurea curing agent, barium sulfate and stabilizer to obtain component B;
[0014] Component A and component B are mixed and stirred to obtain the repair agent.
[0015] In some embodiments, in the preparation of the component A, the epoxy resin and the alumina ceramic microbeads are first mixed and stirred, and then further mixed and stirred with the epoxy resin curing agent to obtain the component A;
[0016] And / or, in the preparation of the component B, the step of first mixing and stirring the silicone oil, barium sulfate and a stabilizer is further performed, and then continuously mixing and stirring the polyurea and the polyurea curing agent to obtain the component B.
[0017] In addition, the present invention also proposes an application of the above-mentioned repair agent or the repair agent prepared by the above-mentioned preparation method in repairing ceramic tiles.
[0018] In some embodiments, the steps include:
[0019] Use a 2-3mm drill bit to drill holes, with the interval between adjacent holes being at least 2cm;
[0020] Inject the repair agent into the drilled hole through the grouting machine, and knock on the surrounding area while grouting. Stop grouting when the repair agent is filled to the point of overflowing from the adjacent holes, and use a sharp object to temporarily plug the hole;
[0021] After the repair agent is completely dry, remove the sharp objects and use resin glue to repair the micropores of the tiles.
[0022] Compared with the prior art, the beneficial effects of the present invention include: the repair agent proposed in the present invention includes component A and component B; the raw materials of component A, calculated by weight, include 50-60 parts of epoxy resin and 40-50 parts of epoxy resin curing agent; the raw materials of component B, calculated by weight, include 40-50 parts of polyurea, 10-15 parts of polyurea curing agent, 2-5 parts of barium sulfate and 2-5 parts of stabilizer; with the cooperation of each component, the epoxy resin serves as the main bonding material to provide bonding force, while having low shrinkage and high strength; the epoxy resin curing agent plays a role in curing the epoxy resin, and the polyurea can increase the elastic modulus and improve the tensile strength; the polyurea curing agent can cure the polyurea, the barium sulfate plays a role in filling the system, increasing the density and weather resistance, and the stabilizer further improves the stability of the system after mixing and during the grouting process, thereby ensuring the fluidity of the repair agent, and hollow tiles can be repaired by grouting, and the shrinkage rate is low, avoiding the secondary hollowing problem, and the cured repair agent has high compressive strength. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 This is a photo of a construction site repaired using the repair agent of Example 1 in an application example of the present invention.
[0024] Figure 2 This is an on-site photo of the ceramic tile micropores repaired with resin glue after the repair agent of Example 1 was used in the application example of the present invention. DETAILED DESCRIPTION
[0025] The "ranges" disclosed herein are defined in terms of lower and upper limits, where a given range is defined by selecting a lower limit and an upper limit, and the selected lower and upper limits define the boundaries of the particular range. Ranges defined in this manner can be inclusive or exclusive of the end values and can be combined arbitrarily, i.e., any lower limit can be combined with any upper limit to form a range. For example, if ranges of 60 to 120 and 80 to 110 are listed for a particular parameter, it is understood that ranges of 60 to 110 and 80 to 120 are also contemplated. Furthermore, if minimum range values of 1 and 2 are listed, and if maximum range values of 3, 4, and 5 are listed, the following ranges are all contemplated: 1 to 3, 1 to 4, 1 to 5, 2 to 3, 2 to 4, and 2 to 5. In this application, unless otherwise indicated, the numerical range "a to b" is a shorthand representation of any combination of real numbers between a and b, where a and b are both real numbers. For example, a numerical range of "0-5" indicates that all real numbers between "0-5" are listed herein, and "0-5" is simply an abbreviation for these numerical combinations. Furthermore, when a parameter is expressed as an integer ≥ 2, this is equivalent to disclosing that the parameter is, for example, an integer of 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc.
[0026] Unless otherwise specified, the terms "include" and "comprising" used in this application may be open-ended or closed-ended. For example, "include" and "comprising" may mean that other components not listed may also be included or that only the listed components are included.
[0027] Unless otherwise specified, the term "or" is used in this application to be inclusive. For example, the phrase "A or B" means "A, B, or both A and B." More specifically, the condition "A or B" is satisfied if any of the following conditions are met: A is true (or exists) and B is false (or does not exist); A is false (or does not exist) and B is true (or exists); or both A and B are true (or exist).
[0028] This specific embodiment provides a repair agent, including component A and component B; the raw materials of component A, calculated by weight, include 50-60 parts of epoxy resin and 40-50 parts of epoxy resin curing agent; the raw materials of component B, calculated by weight, include 40-50 parts of polyurea, 10-15 parts of polyurea curing agent, 2-5 parts of barium sulfate and 2-5 parts of stabilizer.
[0029] In some embodiments, the component A further comprises 2-5 parts of alumina ceramic microspheres, wherein the diameter of the alumina ceramic microspheres is 0.1-0.5 mm. The addition of alumina ceramic microspheres can improve the bonding strength between the repair agent and the tile after drying and increase the compressive strength.
[0030] In some embodiments, the B component also includes 3-5 parts of silicone oil. The addition of alumina ceramic microbeads affects the fluidity of the repair agent to some extent, making it easy to clog the injection hole during grouting. The hydrophobicity and lubricity of silicone oil improve the fluidity of the repair agent. However, while the addition of silicone oil can improve the fluidity of the repair agent and avoid clogging, it also reduces the adhesive strength and compressive strength of the repair agent and increases the shrinkage rate.
[0031] In some embodiments, 2-4 parts of benzyl alcohol are further included in component A. The addition of benzyl alcohol further improves the bonding strength and compressive strength of the repair agent while avoiding the problem of clogging the injection hole and also reduces the shrinkage rate.
[0032] In some embodiments, the epoxy resin curing agent is an amine curing agent, and the amine curing agent is one or both of T31 and 650; the polyurea curing agent is 5240B polyurea curing agent; the stabilizer is 2-hydroxy-4-n-octyloxybenzophenone; the epoxy resin is bisphenol A epoxy resin, and the model of the bisphenol A epoxy resin is E-51.
[0033] This specific embodiment also provides a method for preparing the above-mentioned repair agent, comprising the following steps:
[0034] Mixing and stirring the epoxy resin and the epoxy resin curing agent to obtain component A;
[0035] Mixing and stirring polyurea, polyurea curing agent, barium sulfate and stabilizer to obtain component B;
[0036] Component A and component B are mixed and stirred to obtain the repair agent.
[0037] In some embodiments, during the preparation of component A, epoxy resin and alumina ceramic microspheres are first mixed and stirred, and then further mixed and stirred with the epoxy resin curing agent to obtain component A. Mixing the alumina ceramic microspheres with the epoxy resin first and then with the epoxy resin curing agent results in a more uniform dispersion of the alumina ceramic microspheres compared to mixing them simultaneously.
[0038] In some embodiments, in the preparation of the component A, the epoxy resin, benzyl alcohol and alumina ceramic microbeads are first mixed and stirred, and then further mixed and stirred with the epoxy resin curing agent to obtain the component A.
[0039] In some embodiments, the preparation of component B further includes first mixing and stirring silicone oil, barium sulfate, and a stabilizer, and then continuing to mix and stir with the polyurea and the polyurea curing agent to obtain component B. Mixing silicone oil, barium sulfate, and stabilizer first also facilitates uniform dispersion of barium sulfate.
[0040] This specific embodiment also proposes an application of the above-mentioned repair agent or the repair agent prepared by the above-mentioned preparation method in repairing ceramic tiles, comprising the following steps:
[0041] Use a 2-3mm drill bit to drill holes, with the interval between adjacent holes being at least 2cm;
[0042] Inject the repair agent into the drilled hole through the grouting machine, and knock on the surrounding area while grouting. Stop grouting when the repair agent is filled to the point of overflowing from the adjacent holes, and use a sharp object to temporarily plug the hole;
[0043] After the repair agent is completely dry, remove the sharp object and use resin glue to repair the micropores of the tile; the sharp object can be a toothpick.
[0044] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
[0045] In the present invention, references to “some embodiments”, “this embodiment”, examples, etc. describe a subset of all possible embodiments, but it can be understood that “some embodiments” may be the same subset or different subsets of all possible embodiments, and may be combined with each other without conflict.
[0046] If similar descriptions of "first / second" appear in the application documents, the following explanation is added. In the following description, the terms "first\second\third" are merely used to distinguish similar objects and do not represent a specific order of the objects. It can be understood that "first\second\third" can be interchanged with the specific order or sequence where permitted, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein.
[0047] In this embodiment, the term "and / or" is merely a description of the association relationship between associated objects, indicating that three relationships may exist. For example, object A and / or object B may represent three situations: object A exists alone, object A and object B exist at the same time, and object B exists alone.
[0048] Below, the embodiment of the present application is described. The embodiment described below is exemplary and is only used to explain the present application, and is not to be construed as limiting the present application. Where specific techniques or conditions are not specified in the embodiments, the techniques or conditions described in the literature in this area or the product specifications are used. Reagents or instruments used that do not specify the manufacturer are conventional products that can be obtained commercially.
[0049] Example 1
[0050] This embodiment provides a repair agent, including component A and component B; the raw materials of component A, calculated by weight, include 55 parts of epoxy resin and 50 parts of epoxy resin curing agent; the raw materials of component B, calculated by weight, include 40 parts of polyurea, 13 parts of polyurea curing agent, 2 parts of barium sulfate, and 4 parts of stabilizer;
[0051] In this embodiment, the epoxy resin curing agent is T31; the polyurea curing agent is 5240B polyurea curing agent; the stabilizer is 2-hydroxy-4-n-octyloxybenzophenone; the epoxy resin is bisphenol A epoxy resin, and the model of the bisphenol A epoxy resin is E-51.
[0052] This embodiment also provides a method for preparing the above-mentioned repair agent, which includes the following steps:
[0053] Mixing the epoxy resin and the epoxy resin curing agent and stirring for 5 minutes to obtain component A;
[0054] Mixing polyurea, polyurea curing agent, barium sulfate and stabilizer and stirring for 8 minutes to obtain component B;
[0055] Component A and component B were mixed and stirred for 5 minutes to obtain the repair agent.
[0056] Example 2
[0057] This embodiment proposes a repair agent, including component A and component B; the raw materials of component A, calculated by weight, include 60 parts of epoxy resin and 45 parts of epoxy resin curing agent; the raw materials of component B, calculated by weight, include 50 parts of polyurea, 10 parts of polyurea curing agent, 3 parts of barium sulfate and 5 parts of stabilizer.
[0058] In this embodiment, the epoxy resin curing agent is T31; the polyurea curing agent is 5240B polyurea curing agent; the stabilizer is 2-hydroxy-4-n-octyloxybenzophenone; the epoxy resin is bisphenol A epoxy resin, and the model of the bisphenol A epoxy resin is E-51.
[0059] This embodiment also provides a method for preparing the above-mentioned repair agent, which includes the following steps:
[0060] Mixing the epoxy resin and the epoxy resin curing agent and stirring for 5 minutes to obtain component A;
[0061] Mixing polyurea, polyurea curing agent, barium sulfate and stabilizer and stirring for 8 minutes to obtain component B;
[0062] Component A and component B were mixed and stirred for 5 minutes to obtain the repair agent.
[0063] Example 3
[0064] This embodiment proposes a repair agent, including component A and component B; the raw materials of component A, calculated by weight, include 50 parts of epoxy resin and 40 parts of epoxy resin curing agent; the raw materials of component B, calculated by weight, include 45 parts of polyurea, 15 parts of polyurea curing agent, 5 parts of barium sulfate and 2 parts of stabilizer.
[0065] In this embodiment, the epoxy resin curing agent is 650; the polyurea curing agent is 5240B polyurea curing agent; the stabilizer is 2-hydroxy-4-n-octyloxybenzophenone; the epoxy resin is bisphenol A epoxy resin, and the model of the bisphenol A epoxy resin is E-51.
[0066] This embodiment also provides a method for preparing the above-mentioned repair agent, which includes the following steps:
[0067] Mixing the epoxy resin and the epoxy resin curing agent and stirring for 5 minutes to obtain component A;
[0068] Mixing polyurea, polyurea curing agent, barium sulfate and stabilizer and stirring for 8 minutes to obtain component B;
[0069] Component A and component B were mixed and stirred for 5 minutes to obtain the repair agent.
[0070] Example 4
[0071] This embodiment proposes a repair agent, including component A and component B; the raw materials of component A, calculated by weight, include 55 parts of epoxy resin, 50 parts of epoxy resin curing agent and 2 parts of alumina ceramic microbeads, and the particle size of the alumina ceramic microbeads is 0.1-0.5 mm in diameter; the raw materials of component B, calculated by weight, include 40 parts of polyurea, 13 parts of polyurea curing agent, 2 parts of barium sulfate and 4 parts of stabilizer.
[0072] In this embodiment, the epoxy resin curing agent is T31; the polyurea curing agent is 5240B polyurea curing agent; the stabilizer is 2-hydroxy-4-n-octyloxybenzophenone; the epoxy resin is bisphenol A epoxy resin, and the model of the bisphenol A epoxy resin is E-51.
[0073] This embodiment also provides a method for preparing the above-mentioned repair agent, which includes the following steps:
[0074] The epoxy resin and alumina ceramic microbeads were first mixed and stirred for 5 minutes, and then further mixed and stirred with the epoxy resin curing agent for 5 minutes to obtain the component A;
[0075] Mixing polyurea, polyurea curing agent, barium sulfate and stabilizer and stirring for 8 minutes to obtain component B;
[0076] Component A and component B were mixed and stirred for 5 minutes to obtain the repair agent.
[0077] Example 5
[0078] This embodiment proposes a repair agent, including component A and component B; the raw materials of component A, calculated by weight, include 60 parts of epoxy resin, 45 parts of epoxy resin curing agent and 3 parts of alumina ceramic microbeads, and the particle size of the alumina ceramic microbeads is 0.1-0.5 mm in diameter; the raw materials of component B, calculated by weight, include 50 parts of polyurea, 10 parts of polyurea curing agent, 3 parts of barium sulfate and 5 parts of stabilizer.
[0079] In this embodiment, the epoxy resin curing agent is T31; the polyurea curing agent is 5240B polyurea curing agent; the stabilizer is 2-hydroxy-4-n-octyloxybenzophenone; the epoxy resin is bisphenol A epoxy resin, and the model of the bisphenol A epoxy resin is E-51.
[0080] This embodiment also provides a method for preparing the above-mentioned repair agent, which includes the following steps:
[0081] The epoxy resin and alumina ceramic microbeads were first mixed and stirred for 5 minutes, and then further mixed and stirred with the epoxy resin curing agent for 5 minutes to obtain the component A;
[0082] Mixing polyurea, polyurea curing agent, barium sulfate and stabilizer and stirring for 8 minutes to obtain component B;
[0083] Component A and component B were mixed and stirred for 5 minutes to obtain the repair agent.
[0084] Example 6
[0085] This embodiment proposes a repair agent, including component A and component B; the raw materials of component A, calculated by weight, include 50 parts of epoxy resin, 40 parts of epoxy resin curing agent and 3 parts of alumina ceramic microbeads, and the diameter of the alumina ceramic microbeads is 0.1-0.5 mm; the raw materials of component B, calculated by weight, include 45 parts of polyurea, 15 parts of polyurea curing agent, 5 parts of barium sulfate and 2 parts of stabilizer.
[0086] In this embodiment, the epoxy resin curing agent is T31; the polyurea curing agent is 5240B polyurea curing agent; the stabilizer is 2-hydroxy-4-n-octyloxybenzophenone; the epoxy resin is bisphenol A epoxy resin, and the model of the bisphenol A epoxy resin is E-51.
[0087] This embodiment also provides a method for preparing the above-mentioned repair agent, which includes the following steps:
[0088] The epoxy resin and alumina ceramic microbeads were first mixed and stirred for 5 minutes, and then further mixed and stirred with the epoxy resin curing agent for 5 minutes to obtain the component A;
[0089] Mixing polyurea, polyurea curing agent, barium sulfate and stabilizer and stirring for 8 minutes to obtain component B;
[0090] Component A and component B were mixed and stirred for 5 minutes to obtain the repair agent.
[0091] Example 7
[0092] This embodiment proposes a repair agent, including component A and component B; the raw materials of component A, calculated by weight, include 55 parts of epoxy resin, 50 parts of epoxy resin curing agent and 2 parts of alumina ceramic microbeads, and the diameter of the alumina ceramic microbeads is 0.1-0.5 mm; the raw materials of component B, calculated by weight, include 40 parts of polyurea, 13 parts of polyurea curing agent, 2 parts of barium sulfate, 4 parts of stabilizer and 3 parts of silicone oil.
[0093] In this embodiment, the epoxy resin curing agent is T31; the polyurea curing agent is 5240B polyurea curing agent; the stabilizer is 2-hydroxy-4-n-octyloxybenzophenone; the epoxy resin is bisphenol A epoxy resin, and the model of the bisphenol A epoxy resin is E-51.
[0094] This embodiment also provides a method for preparing the above-mentioned repair agent, which includes the following steps:
[0095] The epoxy resin and alumina ceramic microbeads were first mixed and stirred for 5 minutes, and then further mixed and stirred with the epoxy resin curing agent for 5 minutes to obtain the component A;
[0096] First, the silicone oil, barium sulfate and stabilizer were mixed and stirred for 5 minutes, and then the polyurea and the polyurea curing agent were mixed and stirred for 8 minutes to obtain the component B;
[0097] Component A and component B were mixed and stirred for 5 minutes to obtain the repair agent.
[0098] Example 8
[0099] This embodiment proposes a repair agent, including component A and component B; the raw materials of component A, calculated by weight, include 60 parts of epoxy resin, 45 parts of epoxy resin curing agent and 5 parts of alumina ceramic microbeads, and the diameter of the alumina ceramic microbeads is 0.1-0.5 mm; the raw materials of component B, calculated by weight, include 50 parts of polyurea, 10 parts of polyurea curing agent, 3 parts of barium sulfate, 5 parts of stabilizer and 4 parts of silicone oil.
[0100] In this embodiment, the epoxy resin curing agent is T31; the polyurea curing agent is 5240B polyurea curing agent; the stabilizer is 2-hydroxy-4-n-octyloxybenzophenone; the epoxy resin is bisphenol A epoxy resin, and the model of the bisphenol A epoxy resin is E-51.
[0101] This embodiment also provides a method for preparing the above-mentioned repair agent, which includes the following steps:
[0102] The epoxy resin and alumina ceramic microbeads were first mixed and stirred for 5 minutes, and then further mixed and stirred with the epoxy resin curing agent for 5 minutes to obtain the component A;
[0103] First, the silicone oil, barium sulfate and stabilizer were mixed and stirred for 5 minutes, and then the polyurea and the polyurea curing agent were mixed and stirred for 8 minutes to obtain the component B;
[0104] Component A and component B were mixed and stirred for 5 minutes to obtain the repair agent.
[0105] Example 9
[0106] This embodiment proposes a repair agent, including component A and component B; the raw materials of component A, calculated by weight, include 50 parts of epoxy resin, 40 parts of epoxy resin curing agent and 3 parts of alumina ceramic microbeads, and the diameter of the alumina ceramic microbeads is 0.1-0.5 mm; the raw materials of component B, calculated by weight, include 45 parts of polyurea, 15 parts of polyurea curing agent, 5 parts of barium sulfate, 2 parts of stabilizer and 5 parts of silicone oil.
[0107] In this embodiment, the epoxy resin curing agent is T31; the polyurea curing agent is 5240B polyurea curing agent; the stabilizer is 2-hydroxy-4-n-octyloxybenzophenone; the epoxy resin is bisphenol A epoxy resin, and the model of the bisphenol A epoxy resin is E-51.
[0108] This embodiment also provides a method for preparing the above-mentioned repair agent, which includes the following steps:
[0109] The epoxy resin and alumina ceramic microbeads were first mixed and stirred for 5 minutes, and then further mixed and stirred with the epoxy resin curing agent for 5 minutes to obtain the component A;
[0110] First, the silicone oil, barium sulfate and stabilizer were mixed and stirred for 5 minutes, and then the polyurea and the polyurea curing agent were mixed and stirred for 8 minutes to obtain the component B;
[0111] Component A and component B were mixed and stirred for 5 minutes to obtain the repair agent.
[0112] Example 10
[0113] This embodiment proposes a repair agent, including component A and component B; the raw materials of component A, calculated by weight, include 55 parts of epoxy resin, 50 parts of epoxy resin curing agent, 2 parts of alumina ceramic microbeads and 3 parts of benzyl alcohol, and the particle size of the alumina ceramic microbeads is 0.1-0.5 mm in diameter; the raw materials of component B, calculated by weight, include 40 parts of polyurea, 13 parts of polyurea curing agent, 2 parts of barium sulfate, 4 parts of stabilizer and 3 parts of silicone oil.
[0114] In this embodiment, the epoxy resin curing agent is T31; the polyurea curing agent is 5240B polyurea curing agent; the stabilizer is 2-hydroxy-4-n-octyloxybenzophenone; the epoxy resin is bisphenol A epoxy resin, and the model of the bisphenol A epoxy resin is E-51.
[0115] This embodiment also provides a method for preparing the above-mentioned repair agent, which includes the following steps:
[0116] The epoxy resin, alumina ceramic microbeads and benzyl alcohol were first mixed and stirred for 5 minutes, and then continued to be mixed and stirred with the epoxy resin curing agent for 5 minutes to obtain the component A;
[0117] First, the silicone oil, barium sulfate and stabilizer were mixed and stirred for 5 minutes, and then the polyurea and the polyurea curing agent were mixed and stirred for 8 minutes to obtain the component B;
[0118] Component A and component B were mixed and stirred for 5 minutes to obtain the repair agent.
[0119] Example 11
[0120] This embodiment proposes a repair agent, including component A and component B; the raw materials of component A, calculated by weight, include 60 parts of epoxy resin, 45 parts of epoxy resin curing agent, 5 parts of alumina ceramic microbeads, and 2 parts of benzyl alcohol, and the diameter of the alumina ceramic microbeads is 0.1-0.5 mm; the raw materials of component B, calculated by weight, include 50 parts of polyurea, 10 parts of polyurea curing agent, 3 parts of barium sulfate, 5 parts of stabilizer, and 4 parts of silicone oil.
[0121] In this embodiment, the epoxy resin curing agent is T31; the polyurea curing agent is 5240B polyurea curing agent; the stabilizer is 2-hydroxy-4-n-octyloxybenzophenone; the epoxy resin is bisphenol A epoxy resin, and the model of the bisphenol A epoxy resin is E-51.
[0122] This embodiment also provides a method for preparing the above-mentioned repair agent, which includes the following steps:
[0123] The epoxy resin, alumina ceramic microbeads and benzyl alcohol were first mixed and stirred for 5 minutes, and then continued to be mixed and stirred with the epoxy resin curing agent for 5 minutes to obtain the component A;
[0124] First, the silicone oil, barium sulfate and stabilizer were mixed and stirred for 5 minutes, and then the polyurea and the polyurea curing agent were mixed and stirred for 8 minutes to obtain the component B;
[0125] Component A and component B were mixed and stirred for 5 minutes to obtain the repair agent.
[0126] Example 12
[0127] This embodiment provides a repair agent, including component A and component B; the raw materials of component A, calculated by weight, include 50 parts of epoxy resin, 40 parts of epoxy resin curing agent, 3 parts of alumina ceramic microbeads and 4 parts of benzyl alcohol, and the diameter of the alumina ceramic microbeads is 0.1-0.5 mm; the raw materials of component B, calculated by weight, include 45 parts of polyurea, 15 parts of polyurea curing agent, 5 parts of barium sulfate, 2 parts of stabilizer and 5 parts of silicone oil.
[0128] In this embodiment, the epoxy resin curing agent is T31; the polyurea curing agent is 5240B polyurea curing agent; the stabilizer is 2-hydroxy-4-n-octyloxybenzophenone; the epoxy resin is bisphenol A epoxy resin, and the model of the bisphenol A epoxy resin is E-51.
[0129] This embodiment also provides a method for preparing the above-mentioned repair agent, which includes the following steps:
[0130] The epoxy resin, alumina ceramic microbeads and benzyl alcohol were first mixed and stirred for 5 minutes, and then continued to be mixed and stirred with the epoxy resin curing agent for 5 minutes to obtain the component A;
[0131] First, the silicone oil, barium sulfate and stabilizer were mixed and stirred for 5 minutes, and then the polyurea and the polyurea curing agent were mixed and stirred for 8 minutes to obtain the component B;
[0132] Component A and component B were mixed and stirred for 5 minutes to obtain the repair agent.
[0133] The performance of the repair agents prepared in Examples 1-12 was tested, and the results are shown in Table 1.
[0134] Description of relevant performance testing methods:
[0135] Drying time testing method: Spread the prepared repair agent on a glass plate to a thickness of 1mm ± 0.1mm and start timing. Terminate timing when the repair agent slurry completely loses its plasticity. The time taken during this period is the drying time.
[0136] Bond strength: After the repair agent is evenly mixed according to the ratio, the test is carried out according to the test method for bond strength in 7.6 of GB / T 23445-2009.
[0137] Shrinkage: Tested according to the shrinkage determination method in 7.13 of JC / T 2090-2011.
[0138] Flexural and compressive strength: measured in accordance with the test method for flexural and compressive strength in 7.3 of JC / T 1004-2017.
[0139] Table 1 Results of relevant performance tests of the repairing agents of Examples 1-12
[0140]
[0141] As can be seen from Table 1, the bonding ability and mechanical properties of the repair agents of Examples 4-6 are better than those of Examples 1-3. However, the repair agents of Examples 4-6 are prone to clogging the injection hole. Therefore, silicone oil was added in Examples 7-9. Although the addition of silicone oil solved the clogging problem, the bonding ability and mechanical properties of the repair agents were reduced, and the shrinkage rate was increased. Benzyl alcohol was added in Examples 10-12 to ensure the bonding ability and mechanical properties while reducing the shrinkage rate.
[0142] The alkali resistance, heat resistance and frost resistance of the repair agents of Examples 1-12 were tested according to the test methods in 7.10-7.12 of JC / T 2090-2011, and no cracking or peeling occurred.
[0143] Application Examples
[0144] The repairing agents of Examples 1, 7 and 10 were used to repair hollow ceramic tiles using the following steps:
[0145] Use a hollow hammer to detect the hollow areas and mark them;
[0146] Use a 2mm drill bit to drill holes, with the interval between adjacent holes being at least 2cm;
[0147] Combine Figure 1 , inject the repair agent into the drilled hole through the grouting machine, and knock on the surrounding area while grouting. When the repair agent is filled to the point of overflowing from the adjacent holes, stop grouting and use a toothpick to temporarily plug the hole;
[0148] After the repair agent is completely dry for about 40 minutes, remove the toothpick and use resin glue to repair the micropores of the tile. Figure 2 It can be seen that the surface of the repaired tile is partially covered with resin glue. After the resin glue dries, just wipe it off.
[0149] It should be noted that the resin glue comes from the existing technology.
[0150] After 6 months, the repaired tiles were observed and no hollowing problem occurred again.
[0151] The specific embodiments of the present invention described above do not limit the scope of protection of the present invention. Any other corresponding changes and modifications made based on the technical concept of the present invention should be included in the scope of protection of the claims of the present invention.
Claims
1. A repair agent, characterized in that The invention comprises component A and component B; wherein the raw materials of component A, calculated by weight, include 50-60 parts of epoxy resin and 40-50 parts of epoxy resin curing agent; the raw materials of component B, calculated by weight, include 40-50 parts of polyurea, 10-15 parts of polyurea curing agent, 2-5 parts of barium sulfate and 2-5 parts of stabilizer; The component A further comprises 2-5 parts of alumina ceramic microbeads and 2-4 parts of benzyl alcohol, wherein the diameter of the alumina ceramic microbeads is 0.1-0.5 mm; The B component also includes 3-5 parts of silicone oil; The stabilizer is 2-hydroxy-4-n-octyloxybenzophenone; the polyurea curing agent is 5240B polyurea curing agent; The repairing agent is prepared by the following steps: The epoxy resin and alumina ceramic microbeads are first mixed and stirred, and then further mixed and stirred with the epoxy resin curing agent to obtain the component A; First, the silicone oil, barium sulfate and stabilizer are mixed and stirred, and then the polyurea and the polyurea curing agent are mixed and stirred to obtain the component B; Component A and component B are mixed and stirred to obtain the repair agent.
2. The repairing agent according to claim 1, characterized in that The epoxy resin curing agent is an amine curing agent, and the amine curing agent is one or both of T31 and 650; and / or, the epoxy resin is a bisphenol A epoxy resin, the model of the bisphenol A epoxy resin is E-51, the epoxy value is 0.51-0.54 mol / 100g, and the volatile matter content is ≤0.2%.
3. Use of the repairing agent according to any one of claims 1 to 2 in repairing ceramic tiles.
4. The use according to claim 3, characterized in that The following steps are involved: Use a 2-3mm drill bit to drill holes, with the interval between adjacent holes being at least 2cm; Inject the repair agent into the drilled hole through the grouting machine, and knock on the surrounding area while grouting. Stop grouting when the repair agent is filled to the point of overflowing from the adjacent holes, and use a sharp object to temporarily plug the hole; After the repair agent is completely dry, remove the sharp objects and use resin glue to repair the micropores of the tiles.
Citation Information
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