A high and low temperature testing device for semiconductor chip detection and its operation method

Abstract

The present invention relates to the field of semiconductor chip detection technology, and in particular to a high and low temperature test device for semiconductor chip detection and an operation method thereof. It comprises a machine platform; an electric lifting frame, the electric lifting frame is installed on the machine platform; a switching mechanism, the electric lifting frame is used to drive the switching mechanism to rise and fall; the switching mechanism comprises: a special-shaped track, a plurality of guide blocks A, a plurality of slide bars and a plurality of temperature control plates, and the special-shaped track is provided with a first guide groove and a second guide groove that are interconnected. The present invention can quickly change the moving trajectory of the temperature control plate through the design of the first guide groove, the second guide groove and the guide block A, thereby quickly changing the test method for the chip. Compared with the temperature control of the inner cavity of the device when the high and low temperature test device for chip detection in the prior art is working, the present invention can make the temperature of the temperature control plate more accurately transmitted to the chip, and prevent the chip from having inaccurate test results due to uneven temperature.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip detection, and in particular to a high and low temperature testing device for semiconductor chip detection and an operating method thereof. Background Art

[0002] Chip testing is an indispensable and important part of semiconductor device production. Chip testing has very strict requirements on the testing environment. It requires testing not only at room temperature, but also at low and high temperatures, collectively referred to as three-temperature testing. The three-temperature testing is further divided into linear testing and transient testing.

[0003] The high and low temperature testing equipment for semiconductor chip detection in the prior art is divided into two situations when performing linear tests and instantaneous tests according to different devices. The first situation requires the device system to control the heating and cooling elements inside the device to make the temperature inside the device change linearly or instantaneously. The heating and cooling elements are easily damaged by the rapid temperature changes. The second situation requires the chip to be continuously installed in separate heating and cooling elements. During this process, the chip will be affected by the external temperature, resulting in inaccurate test results. Summary of the invention

[0004] In order to solve the above technical problem or at least partially solve the above technical problem, the present invention provides a high and low temperature testing device for semiconductor chip detection and an operating method thereof, which can conveniently switch the chip testing mode.

[0005] A high and low temperature testing device for semiconductor chip testing, comprising:

[0006] Machine;

[0007] An electric lifting frame, the electric lifting frame is installed on the machine platform;

[0008] The switching mechanism, the electric lifting frame is used to drive the switching mechanism to rise and fall;

[0009] The switching mechanism includes: a special-shaped track, a plurality of guide blocks A, a plurality of slide bars and a plurality of temperature control plates. The special-shaped track is provided with a first guide groove and a second guide groove which are interconnected. The plurality of temperature control plates are used to move along the second guide groove. The plurality of guide blocks A are used to change the movement paths of the plurality of slide bars so that the slide bars enter the first guide groove from the second guide groove to control the opening and closing of the plurality of temperature control plates. The opening and closing of the plurality of temperature control plates are used to change the test method of the chip.

[0010] Furthermore, the switching mechanism also includes a test frame, the test frame is installed on the machine platform, several of the temperature control plates are used in conjunction with the test frame, the tops of several of the guide blocks A are commonly fixed with a lifting plate, the lifting plate is slidingly connected to the electric lifting frame, the lifting plate is symmetrically fixed with protrusions, and the special-shaped track is symmetrically fixed with a first elastic clip used in conjunction with the protrusion.

[0011] Furthermore, it also includes a driving motor, which is installed on the electric lifting frame. The output shaft of the driving motor movably passes through the lifting plate and is fixedly connected to an elastic cross telescopic frame, and the telescopic ends of the elastic cross telescopic frame are respectively fixedly connected to the outer walls of several sliding rods.

[0012] Furthermore, it also includes a pull rod, one side of several of the temperature control plates is fixedly connected to the pull rod, a movable groove is opened in the middle of the pull rod, the bottom ends of several of the sliding rods are respectively inserted into the movable groove and slide in the movable groove, a first elastic member is arranged between the inner wall of the movable groove and the outer wall of several of the sliding rods, a limiting ring is arranged on the lower side of the special-shaped track, several evenly distributed sliding grooves are opened on the limiting ring, several of the pull rods are inserted into several sliding grooves and slide in several sliding grooves, a cam is fixedly connected to the top of the pull rod, several evenly distributed guide blocks B are fixedly connected to the outer wall of the limiting ring, the cam is used in conjunction with several of the guide blocks B, several of the guide blocks B are fixedly provided with second elastic clips used in conjunction with the cam, and a torsion rod is fixedly connected to the bottom end of the limiting ring.

[0013] Furthermore, it also includes a heat preservation mechanism, which includes a rotating frame, and the rotating frame is symmetrically hinged in a plurality of the temperature control plates, a second elastic member is arranged between the rotating frame and the plurality of the temperature control plates, a roller is rotatably connected to the rotating frame, a sliding ring used in conjunction with the roller is symmetrically slidably connected to the test frame, the roller and the sliding ring are used in conjunction with the sliding ring, a connecting rod is symmetrically slidably connected to the left and right of the test frame, the connecting rod is fixedly connected to the sliding ring, an insulation plate is fixedly connected to the end of the connecting rod away from the sliding ring, the insulation plate is slidably connected to the test frame, and a third elastic member is arranged between the insulation plate and the test frame, and chip slots are symmetrically opened on the test frame.

[0014] Furthermore, it also includes a temperature conduction mechanism, which includes an elastic telescopic frame, two of which are hinged in the test frame and are used in conjunction with a plurality of the temperature control plates, and two telescopic rods are fixed in the test frame, and the telescopic ends of the two elastic telescopic frames are respectively hinged to the telescopic ends of the two telescopic rods, and the fixed ends of the two telescopic rods are connected to an air supply pipe, and the top end of the air supply pipe is connected to an air storage airbag through a Z-shaped tube.

[0015] Further, the temperature conduction mechanism further includes a U-shaped tube. Two U-shaped tubes are fixedly connected inside the test frame. An impeller is rotatably connected inside each of the two U-shaped tubes. A plurality of evenly distributed air flow plates are fixedly connected to the outer wall of the rotating shaft of the impeller. The air delivery pipe is fixedly connected to the two U-shaped tubes in a penetrating manner and is rotatably connected to the outer wall of the rotating shaft of the impeller. The air storage airbag is fixedly connected to the outer wall of the U-shaped tube.

[0016] Further, the temperature conduction mechanism further includes a temperature control tube. Two temperature control tubes are fixedly connected inside the test frame. The two temperature control tubes are respectively communicated with the two U-shaped tubes. The inner cavities of the two temperature control tubes and the two U-shaped tubes are filled with liquid.

[0017] Further, the temperature conduction mechanism further includes an electromagnet. The electromagnet is fixedly connected to the bottom of the elastic cross telescopic frame. A plurality of evenly distributed elastic extension rods are fixedly connected to the outer wall of the electromagnet. A magnetic block used in cooperation with the electromagnet is arranged inside the elastic extension rod. The telescopic ends of the plurality of elastic extension rods are fixedly connected with a temperature conduction plate through a vertical plate. The temperature conduction plate is used in cooperation with the plurality of temperature control plates.

[0018] Further, an operation method of a high and low temperature test device for semiconductor chip detection includes the following steps:

[0019] S1: First, the staff puts the chip to be tested into the chip slot, starts the electric lifting frame, so that a plurality of temperature control plates descend, then拨动 the torsion rod, so that a plurality of temperature control plates are attached to the outer wall of the test frame. By starting the electromagnet, the temperature conduction plate is attached to a plurality of temperature control plates. Start the drive motor, so that a plurality of temperature control plates and the temperature conduction plate rotate along the track of the second guide groove to linearly test the chip;

[0020] S2: When a plurality of temperature control plates rotate, they contact and squeeze the elastic telescopic frame. The elastic telescopic frame is squeezed to make the liquid in the U-shaped tube and the temperature control tube flow at a high speed, so that the temperature of the chip slot rises or falls with the temperature of a plurality of temperature control plates and the temperature conduction plate;

[0021] S3: After the linear test is completed, turn off the electromagnet, so that the temperature conduction plate is far away from a plurality of temperature control plates, then press down the lifting plate, so that a plurality of guide blocks A are inserted into the special-shaped track to change the moving track of the sliding rod, so as to instantaneously test the chip.

[0022] The beneficial effects of the present invention are:

[0023] 1. The present invention can quickly change the moving trajectory of the temperature control plate through the design of the first guide groove, the second guide groove and the guide block A, thereby quickly changing the test method of the chip. Compared with the temperature control of the inner cavity of the high and low temperature test equipment for chip detection in the prior art, the present invention can make the temperature of the temperature control plate more accurately transmitted to the chip, preventing the chip from having inaccurate test results due to uneven temperature, and the present invention is more convenient for chip testing.

[0024] 2. The present invention can make the temperature of the chip slot rise or fall synchronously with the temperature of the temperature control board through the design of the temperature conduction mechanism, effectively reducing the influence of the chip slot on the chip test due to power consumption and heat generation, and improving the accuracy of the chip test results.

[0025] 3. The present invention, through the design of the temperature conduction plate, can make the temperature of the chip and the chip slot rise or fall more accurately and smoothly when the device performs linear testing, thereby further improving the accuracy of the chip test results. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0027] Figure 2 It is a structural schematic diagram of the switching mechanism of the present invention;

[0028] Figure 3 This is a schematic diagram of the installation of the first elastic clip of the present invention;

[0029] Figure 4 This is a schematic diagram of the installation of the guide block A of the present invention;

[0030] Figure 5 This is a schematic diagram of the installation of the elastic cross telescopic frame of the present invention;

[0031] Figure 6 It is a schematic diagram of the installation of the rotating frame of the present invention;

[0032] Figure 7 It is a structural schematic diagram of the heat preservation mechanism of the present invention;

[0033] Figure 8 It is a structural schematic diagram of the temperature conduction mechanism of the present invention;

[0034] Fig. 9 It is a schematic diagram of the installation of the air storage airbag of the present invention;

[0035] Fig.10 It is a schematic diagram of the installation of the airflow plate of the present invention;

[0036] Fig.11 It is the installation schematic diagram of the electromagnet of the present invention.

[0037] In the above figures: 1: machine platform, 101: test rack, 201: electric lifting frame, 202: special-shaped track, 203: first guide groove, 2031: second guide groove, 204: guide block A, 205: sliding rod, 206: temperature control plate, 301: lifting plate, 302: first elastic clip, 401: driving motor, 402: elastic cross telescopic frame, 501: pull rod, 502: limit ring, 503: guide block B, 504: second elastic clip, 505: torsion rod, 601: rotating frame, 602: sliding ring, 603: connecting rod, 604: heat preservation plate, 605: chip slot, 701: elastic telescopic frame, 702: telescopic rod, 703: air delivery pipe, 704: air storage air bag, 801: U-shaped pipe, 802: impeller, 803: air flow plate, 804: temperature control pipe, 901: electromagnet, 902: elastic extension rod, 903: temperature conduction plate. Detailed implementation mode

[0038] The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which the presently preferred embodiments of the invention are shown. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided for thoroughness and completeness and fully convey the scope of the invention to those skilled in the art. Embodiment

[0039] A high and low temperature test device for semiconductor chip detection, as Figure 1-Figure 11 shown, includes:

[0040] Machine platform 1; an electric lifting frame 201, and the electric lifting frame 201 is installed on the machine platform 1;

[0041] A switching mechanism, and the electric lifting frame 201 is used to drive the switching mechanism to lift;

[0042] The switching mechanism includes: a special-shaped track 202, a plurality of guide blocks A204, a plurality of sliding rods 205 and a plurality of temperature control plates 206. A first guide groove 203 and a second guide groove 2031 communicating with each other are formed in the special-shaped track 202. The plurality of temperature control plates 206 are used to move along the second guide groove 2031. The plurality of guide blocks A204 are used to change the movement paths of the plurality of sliding rods 205, so that the sliding rods 205 enter the first guide groove 203 from the second guide groove 2031 to control the opening and closing of the plurality of temperature control plates 206. The plurality of temperature control plates 206 move and open and close to change the test method for the chip.

[0043] The switching mechanism also includes a test frame 101, the test frame 101 is installed on the machine 1, the four temperature control plates 206 are used in conjunction with the test frame 101, the tops of the four groups of guide blocks A204 are commonly fixed with a lifting plate 301, the lifting plate 301 is slidingly connected to the electric lifting frame 201, the lifting plate 301 is symmetrically fixed with protrusions, the special-shaped track 202 is symmetrically fixed with a first elastic clip 302 used in conjunction with the protrusion, and the first elastic clip 302 is used to limit the height of the lifting plate 301.

[0044] It also includes a drive motor 401. The drive motor 401 is installed on the electric lifting frame 201. The drive motor 401 is located on the upper side of the lifting plate 301. The output shaft of the drive motor 401 movably passes through the lifting plate 301 and is fixedly connected to an elastic cross telescopic frame 402. The telescopic ends of the elastic cross telescopic frame 402 are respectively fixedly connected to the outer walls of the four sliding bars 205. The top ends of the four sliding bars 205 are all higher than the top surface of the elastic cross telescopic frame 402.

[0045] It also includes a pull rod 501, one side of the four temperature control plates 206 is fixedly connected with the pull rod 501, the middle part of the pull rod 501 is provided with a movable groove, the bottoms of the four slide bars 205 are respectively inserted into the movable grooves and slide in the movable grooves, a first elastic member is arranged between the inner wall of the movable groove and the outer wall of the four slide bars 205, the first elastic member is a tension spring, a limit ring 502 is arranged on the lower side of the special-shaped track 202, four evenly distributed slide grooves are arranged on the limit ring 502, the four pull rods 501 are all inserted into the four slide grooves and slide in the slide grooves, a cam is fixedly connected to the top of the pull rod 501, four evenly distributed guide blocks B503 are fixedly connected to the outer wall of the limit ring 502, the cam is used in conjunction with the four guide blocks B503, the four guide blocks B503 are fixedly provided with a second elastic clip 504 used in conjunction with the cam, and a torsion rod 505 is fixedly connected to the bottom end of the limit ring 502.

[0046] The heat preservation mechanism is also included, which includes a rotating frame 601. The rotating frames 601 are symmetrically hinged in the four temperature control plates 206. The rotating frame 601 is tilted. A second elastic member is arranged between the rotating frame 601 and the four temperature control plates 206, and the second elastic member is a torsion spring. A roller is rotatably connected to the rotating frame 601. A sliding ring 602 is symmetrically slidably connected to the test frame 101. The roller and the sliding ring 602 are used together. A connecting rod 603 is symmetrically slidably connected to the left and right of the test frame 101. The connecting rod 603 is fixedly connected to the sliding ring 602. An insulation plate 604 is fixedly connected to the end of the connecting rod 603 away from the sliding ring 602. The insulation plate 604 is slidably connected to the test frame 101. A third elastic member is arranged between the insulation plate 604 and the test frame 101, and the third elastic member is a compression spring. A chip slot 605 is symmetrically opened at a position corresponding to the insulation plate 604 on the test frame 101, and the chip slot 605 is used to place the chip.

[0047] It also includes a temperature conduction mechanism, which includes an elastic telescopic frame 701. Two elastic telescopic frames 701 used in conjunction with four temperature control plates 206 are hinged in the test frame 101. Two telescopic rods 702 are fixedly connected in the test frame 101. The telescopic ends of the two elastic telescopic frames 701 are respectively hinged to the telescopic ends of the two telescopic rods 702. When the two elastic telescopic frames 701 rotate, they can respectively drive the telescopic ends of the two telescopic rods 702 to extend. The fixed ends of the two telescopic rods 702 are connected to the air supply pipe 703, and the top of the air supply pipe 703 is connected to the air storage airbag 704 through a Z-shaped tube.

[0048] The temperature conduction mechanism also includes a V-shaped tube 801. Two V-shaped tubes 801 are fixedly connected in the test frame 101. Impellers 802 are rotatably connected in the two V-shaped tubes 801. Six evenly distributed air flow plates 803 are fixedly connected to the outer wall of the rotating shaft of the impeller 802. The air supply pipe 703 is fixedly connected to the two V-shaped tubes 801 through a through-type, and is rotatably connected to the outer wall of the rotating shaft of the impeller 802. When the six air flow plates 803 are impacted by air, the impeller 802 can rotate at high speed. The air storage airbag 704 is fixedly connected to the outer wall of the V-shaped tube 801.

[0049] The temperature conduction mechanism also includes a temperature control tube 804. Two temperature control tubes 804 are fixedly connected to the test frame 101. The two temperature control tubes 804 are located on the outside of the chip slot 605. The two temperature control tubes 804 are respectively connected to the two U-shaped tubes 801. The inner cavities of the two temperature control tubes 804 and the two U-shaped tubes 801 are filled with liquid.

[0050] The temperature conduction mechanism also includes an electromagnet 901, the electromagnet 901 is fixedly connected to the bottom of the elastic cross telescopic frame 402, four evenly distributed elastic extension rods 902 are fixedly connected to the outer wall of the electromagnet 901, the four elastic extension rods 902 are staggered with the elastic cross telescopic frame 402, and a magnetic block used in conjunction with the electromagnet 901 is arranged inside the elastic extension rod 902. The telescopic ends of the four elastic extension rods 902 are fixedly connected to a temperature conduction plate 903 through a vertical plate, and the temperature conduction plate 903 is used in conjunction with four temperature control plates 206.

[0051] Initially, the guide block A204 is located on the upper side of the special-shaped track 202, and the two adjacent insulation plates 604 are against each other. When the chip needs to be tested, the staff first moves the two sliding rings 602 away from each other, and the sliding ring 602 drives the connecting rod 603 to slide, and the connecting rod 603 drives the insulation plate 604 to slide. At this time, the two adjacent insulation plates 604 slide away from each other, and the third elastic member between the insulation plate 604 and the test frame 101 is forced to shrink. After sliding, the insulation plate 604 no longer blocks the chip slot 605. Then the chip is placed in the chip slot 605, and the sliding ring 602 is released. At this time, the third elastic member is released to drive the insulation plate 604 to slide and reset. The insulation plate 604 drives the sliding ring 602 to slide and reset through the connecting rod 603, thereby completing the installation of the chip.

[0052] Then start testing the chip. The testing methods for the chip are divided into linear testing and instantaneous testing. When performing linear testing, start the electric lifting frame 201. The electric lifting frame 201 drives the special-shaped track 202 and the drive motor 401 to descend, thereby causing the four temperature control plates 206 to descend. After the four temperature control plates 206 descend, the central positions of their centers are at the same horizontal plane as the center position of the chip slot 605. Initially, the convex shafts on the four pull rods 501 are respectively in contact with the planes of the corresponding guide blocks B503 and are in contact with the second elastic clips 504 on the corresponding guide blocks B503. The second elastic clips 504 limit the convex shafts. The convex shafts drive the corresponding temperature control plates 206 to remain stable through the pull rods 501. The first elastic member between the movable slots of the pull rods 501 and the adjacent sliding rods 205 is in an extended state. At this time, the staff拨动 the torsion rod 505. The torsion rod 505 drives the limit ring 502 to rotate. The limit ring 502 drives the four guide blocks B503 to rotate. The four guide blocks B503 drive the second elastic clips 504 on them to respectively squeeze the convex shafts on the four pull rods 501. At this time, the telescopic end of the elastic cross-shaped telescopic frame 402 extends to the limit state, thereby making the pull rods 501 unable to move. At this time, the convex shafts on the four pull rods 501 squeeze the second elastic clips 504. The second elastic clips 504 are stressed and contract. After the second elastic clips 504 continue to move, they no longer contact the convex shafts and cross over. After the convex shafts cross over the second elastic clips 504, they contact the inclined surfaces of the adjacent guide blocks B503. At this time, the first elastic member contracts, thereby causing the pull rods 501 to drive the corresponding temperature control plates 206 to slide. At this time, the four temperature control plates 206 slide towards the side close to the test frame 101 and fit against the outer wall of the test frame 101. And two of the four temperature control plates 206 contact and squeeze the corresponding elastic telescopic frames 701. The elastic telescopic frames 701 are stressed and rotate around the connection point of the test frame 101, and drive the telescopic ends of the corresponding telescopic rods 702 to contract. The air in the inner cavity of the telescopic rod 702 enters the air storage airbag 704 through the air delivery pipe 703. During this process, the air passes through the six air flow plates 803 on the rotating shaft of the impeller 802 and impacts the six air flow plates 803. The six air flow plates 803 are impacted and drive the impeller 802 to rotate at high speed, causing the liquid in the U-shaped pipe 801 and the temperature control pipe 804 to circulate. Thus, the U-shaped pipe 801, the temperature control pipe 804, and the liquid in them can be evenly affected by the temperature of the temperature control plates 206 to increase or decrease in temperature. The temperature of the temperature control pipe 804 will be conducted into the corresponding chip slot 605, so that the temperature of the chip is the same as that of the temperature control plate 206. Then start the electromagnet 901. The electromagnet 901 attracts the magnetic blocks inside the four elastic extension rods 902. The telescopic ends of the four elastic extension rods 902 respectively drive the four temperature conduction plates 903 to move through the vertical plates. At this time, the four temperature conduction plates 903 are stuck into the gaps between the four temperature control plates 206 and fit against the side walls of the adjacent temperature control plates 206. Then start the four temperature control plates 206, and the temperatures of the four temperature control plates 206 respectively start to increase or decrease.At this time, there is a large temperature difference between the two temperature control plates 206 in contact with the temperature conduction plate 903. The part of the temperature conduction plate 903 close to the high-temperature temperature control plate 206 has a higher temperature, and the part close to the low-temperature temperature control plate 206 has a lower temperature. As a result, the temperature of the temperature conduction plate 903 changes linearly from high to low or from low to high. Then, the driving motor 401 is started. The output shaft of the driving motor 401 drives four sliding rods 205 to rotate through the elastic cross telescopic frame 402. The four sliding rods 205 rotate in a circular motion along the second guide groove 2031 in the special-shaped track 202. The four sliding rods 205 drive the four temperature control plates 206 to rotate. At the same time, the output shaft of the driving motor 401 drives the electromagnet 901 to rotate. The electromagnet 901 drives the four temperature conduction plates 903 to rotate through the four elastic extension rods 902. The four temperature control plates 206 and the four temperature conduction plates 903 rotate synchronously. At this time, the temperature of the temperature control plate 206 is conducted to the chip, causing the temperature of the chip to rise or fall. And the temperature of the temperature control plate 206 is conducted into the U-shaped tube 801. At this time, the temperature of the liquid in the U-shaped tube 801 rises or falls rapidly, and the temperature of the liquid in the temperature control tube 804 rises slowly. After the four temperature control plates 206 rotate, the two temperature control plates 206 in contact with the two elastic telescopic frames 701 no longer contact and cross the elastic telescopic frames 701. The two relatively arranged temperature conduction plates 903 rotate to fit the outer wall of the U-shaped tube 801. At this time, the temperature of the temperature conduction plate 903 is conducted to the liquid in the inner cavity of the U-shaped tube 801, and the elastic telescopic frame 701 is released from the restriction of the temperature control plate 206 and can move. At this time, the elastic telescopic frame 701 rotates and resets with the connection point of the test frame 101 as the center. During the reset process, the telescopic end of the elastic telescopic frame 701 releases and resets, driving the telescopic end of the telescopic rod 702 to reset. The telescopic rod 702 pumps out the air in the corresponding air storage airbag 704 through the air delivery pipe 703, thereby causing the impeller 802 to rotate at high speed again. The impeller 802 rotates at high speed again to make the liquid in the corresponding U-shaped tube 801 and the temperature control tube 804 flow. At this time, the temperature of the liquid in the temperature control tube 804 is the same as that in the corresponding U-shaped tube 801, so that the temperature of the chip slot 605 quickly approaches the temperature of the temperature conduction plate 903, preventing the heat generated by the power consumption of the chip slot 605 from affecting the chip test result. Then, the four temperature control plates 206 continue to rotate and repeat the above steps to linearly test the chip.,

[0053] After the linear test of the chip is completed, the four slide bars 205 are controlled by the driving motor 401 to move to the four equal points of the second guide groove 2031 respectively, and then the driving motor 401 is turned off to make the slide bar 205 no longer move. At this time, the chip needs to be tested instantaneously. The electromagnet 901 is turned off first, and the electromagnet 901 no longer attracts the magnetic blocks inside the four elastic extension rods 902. The telescopic ends of the four elastic extension rods 902 are extended and reset, thereby moving the four temperature conduction plates 903 to reset. After the four temperature conduction plates 903 are reset, they are no longer in contact with the four temperature control plates 206. Then the staff presses the lifting plate 301 downward, and the lifting plate 301 drives the bumps and the four sets of guide blocks. A204 falls, and the protrusion squeezes the first elastic clip 302 when it falls. The first elastic clip 302 shrinks under the force. After the protrusion continues to fall, it no longer contacts and passes over the first elastic clip 302. After the four groups of guide blocks A204 fall, they are inserted into the special-shaped track 202. At this time, the bottom surface of the four groups of guide blocks A204 and the bottom surface of the special-shaped track 202 are at the same horizontal plane, and the connection between the first guide groove 203 and the second guide groove 2031 of the special-shaped track 202 is blocked. Then the drive motor 401 is turned on, and the output shaft of the drive motor 401 rotates, thereby making the four slide bars 205 slide along the first guide groove 203 of the special-shaped track 202. At this time, the four slide bars 205 drive the four temperature control plates 206 The temperature control plates 206 rotate and open and close once, and two of the temperature control plates 206 correspond to the positions of the two chip slots 605. When the temperature control plates 206 are away from the test rack 101, the temperature control plates 206 drive the two rotating racks 601 therein to move away from the two sliding rings 602. The rotating racks 601 are released to rotate and reset through the second elastic member, and the sliding rings 602 are free from the restriction of the rollers on the rotating racks 601 and can move. The heat preservation plates 604 are released to slide and reset through the third elastic member, thereby making the two sliding rings 602 slide and reset. At this time, the two adjacent heat preservation plates 604 abut against each other, thereby shielding the corresponding chip slots 605, preventing the chip slots 60 5 and the chip are exposed to the air, resulting in the chip slot 605 and the chip being affected by the external temperature, which affects the test result. When the temperature control plate 206 approaches the test frame 101, the roller on the rotating frame 601 contacts the sliding ring 602, so that the two adjacent insulation plates 604 slide away from each other, and the two adjacent insulation plates 604 no longer block the chip slot 605, and the temperature control plate 206 contacts the corresponding elastic telescopic frame 701, so that the liquid in the U-shaped tube 801 and the temperature control tube 804 flows quickly, so that the temperature of the chip slot 605 can be quickly increased or decreased according to the temperature of the temperature control plate 206, thereby further improving the accuracy of the result during the instantaneous test.

[0054] A method for operating a high and low temperature testing device for semiconductor chip detection comprises the following steps:

[0055] S1: First, the staff puts the chip to be tested into the chip slot 605, starts the electric lifting frame 201, and then makes the temperature control plates 206 fall down, then moves the torsion bar 505, and then makes the temperature control plates 206 fit with the outer wall of the test frame 101, starts the electromagnet 901, makes the temperature conduction plate 903 fit with the temperature control plates 206, starts the driving motor 401, makes the temperature control plates 206 and the temperature conduction plate 903 rotate along the track of the second guide groove 2031, and performs linear testing on the chip;

[0056] S2: When the plurality of temperature control plates 206 rotate, they contact and squeeze the elastic expansion frame 701. The elastic expansion frame 701 is squeezed to make the liquid in the U-shaped tube 801 and the temperature control tube 804 flow at a high speed, thereby making the temperature of the chip socket 605 increase or decrease along with the temperature of the plurality of temperature control plates 206 and the temperature conduction plate 903.

[0057] S3: After completing the linear test, turn off the electromagnet 901, so that the temperature conduction plate 903 is away from the temperature control plates 206, and then press the lifting plate 301 downward to insert the guide blocks A204 into the special-shaped track 202, changing the moving trajectory of the slide bar 205, so as to perform instantaneous testing on the chip.

[0058] While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

Claims

1. A high and low temperature testing device for semiconductor chip testing, characterized in that: include: Machine (1); An electric lifting frame (201), the electric lifting frame (201) being installed on the machine platform (1); A switching mechanism, wherein the electric lifting frame (201) is used to drive the switching mechanism to move up and down; The switching mechanism comprises: a special-shaped track (202), a plurality of guide blocks A (204), a plurality of slide bars (205) and a plurality of temperature control plates (206); the special-shaped track (202) is provided with a first guide groove (203) and a second guide groove (2031) which are connected to each other; the plurality of temperature control plates (206) are used to move along the second guide groove (2031) and the first guide groove (203); the plurality of guide blocks A (204) are used to change the movement paths of the plurality of slide bars (205) so that the slide bars (205) enter the first guide groove (203) from the second guide groove (2031) to control the opening and closing of the plurality of temperature control plates (206); the movement of the plurality of temperature control plates (206) to open and close is used to change the test mode of the chip; It also includes a pull rod (501), one side of a plurality of the temperature control plates (206) is fixedly connected to the pull rod (501), a movable groove is provided in the middle of the pull rod (501), and the bottom ends of a plurality of the sliding rods (205) are respectively inserted into the movable groove and slide in the movable groove.

2. A high and low temperature testing device for semiconductor chip detection according to claim 1, characterized in that: The switching mechanism also includes a test rack (101), the test rack (101) is installed on the machine platform (1), a plurality of the temperature control plates (206) are used in conjunction with the test rack (101), a lifting plate (301) is fixedly connected to the tops of a plurality of the guide blocks A (204), the lifting plate (301) is slidably connected to the electric lifting rack (201), the lifting plate (301) is symmetrically fixed with protrusions, and a first elastic clip (302) used in conjunction with the protrusions is symmetrically fixedly connected to the special-shaped track (202).

3. A high and low temperature testing device for semiconductor chip detection according to claim 2, characterized in that: It also includes a drive motor (401), the drive motor (401) being mounted on the electric lifting frame (201), the output shaft of the drive motor (401) movably passing through the lifting plate (301) and being fixedly connected to an elastic cross telescopic frame (402), the telescopic ends of the elastic cross telescopic frame (402) being respectively fixedly connected to the outer walls of a plurality of the sliding rods (205).

4. The high and low temperature testing equipment for semiconductor chip detection according to claim 3, characterized in that: A first elastic member is provided between the inner wall of the movable groove and the outer walls of the plurality of sliding rods (205); a limiting ring (502) is provided on the lower side of the special-shaped track (202); the limiting ring (502) is provided with a plurality of evenly distributed sliding grooves; the plurality of pull rods (501) are inserted into the plurality of sliding grooves and slide in the plurality of sliding grooves; a convex shaft is fixedly connected to the top of the pull rod (501); a plurality of evenly distributed guide blocks B (503) are fixedly connected to the outer wall of the limiting ring (502); the convex shaft is used in conjunction with the plurality of guide blocks B (503); a second elastic clip (504) used in conjunction with the convex shaft is fixedly connected to the plurality of guide blocks B (503); and a torsion rod (505) is fixedly connected to the bottom end of the limiting ring (502).

5. The high and low temperature testing equipment for semiconductor chip detection according to claim 4, characterized in that: It further includes a heat preservation mechanism, which includes a rotating frame (601). The rotating frame (601) is symmetrically hinged in each of several temperature control plates (206). A second elastic member is provided between the rotating frame (601) and the several temperature control plates (206). A roller is rotatably connected to the rotating frame (601). A sliding ring (602) that cooperates with the roller is symmetrically slidably connected to the test frame (101). The roller and the sliding ring (602) cooperate with each other. Connecting rods (603) are symmetrically slidably connected to the left and right of the test frame (101). The connecting rods (603) are fixedly connected to the sliding ring (602). A heat preservation plate (604) is fixedly connected to one end of the connecting rod (603) away from the sliding ring (602). The heat preservation plate (604) is slidably connected to the test frame (101), and a third elastic member is provided between the heat preservation plate (604) and the test frame (101). Chip slots (605) are symmetrically formed in the test frame (101).

6. The high and low temperature testing equipment for semiconductor chip detection according to claim 5, characterized in that: It further includes a temperature conduction mechanism, which includes an elastic telescopic frame (701). Two elastic telescopic frames (701) that cooperate with the several temperature control plates (206) are hinged in the test frame (101). Two telescopic rods (702) are fixedly connected in the test frame (101). The telescopic ends of the two elastic telescopic frames (701) are respectively hinged to the telescopic ends of the two telescopic rods (702). The fixed ends of the two telescopic rods (702) are both communicated with an air delivery pipe (703). The top of the air delivery pipe (703) is communicated with an air storage airbag (704) through a Z-shaped pipe.

7. The high and low temperature testing equipment for semiconductor chip detection according to claim 6, characterized in that: The temperature conduction mechanism further includes a U-shaped pipe (801). Two U-shaped pipes (801) are fixedly connected in the test frame (101). Impellers (802) are rotatably connected in the two U-shaped pipes (801). A plurality of evenly distributed air flow plates (803) are fixedly connected to the outer wall of the rotating shaft of the impeller (802). The air delivery pipe (703) is fixedly connected to the two U-shaped pipes (801) in a penetrating manner and is rotatably connected to the outer wall of the rotating shaft of the impeller (802). The air storage airbag (704) is fixedly connected to the outer wall of the U-shaped pipe (801).

8. The high and low temperature testing equipment for semiconductor chip detection according to claim 7, characterized in that: The temperature conduction mechanism further includes a temperature control pipe (804). Two temperature control pipes (804) are fixedly connected in the test frame (101). The two temperature control pipes (804) are respectively communicated with the two U-shaped pipes (801). The inner cavities of the two temperature control pipes (804) and the two U-shaped pipes (801) are filled with liquid.

9. The high and low temperature testing equipment for semiconductor chip detection according to claim 8, characterized in that: The temperature conduction mechanism also includes an electromagnet (901), the electromagnet (901) is fixedly connected to the bottom of the elastic cross telescopic frame (402), a plurality of evenly distributed elastic extension rods (902) are fixedly connected to the outer wall of the electromagnet (901), a magnetic block for use with the electromagnet (901) is arranged inside the elastic extension rod (902), and the telescopic ends of the plurality of elastic extension rods (902) are fixedly connected to a temperature conduction plate (903) via a vertical plate, and the temperature conduction plate (903) is used in conjunction with the plurality of temperature control plates (206).

10. The method for operating a high and low temperature testing device for semiconductor chip detection according to claim 9, characterized in that: The following steps are included: S1: First, a staff member places a chip to be tested into the chip slot (605), starts the electric lifting frame (201), thereby causing a plurality of the temperature control plates (206) to descend, and then moves the torsion rod (505), thereby causing a plurality of the temperature control plates (206) to fit with the outer wall of the test frame (101), starts the electromagnet (901), causes the temperature conduction plate (903) to fit with a plurality of the temperature control plates (206), starts the drive motor (401), causes a plurality of the temperature control plates (206) and the temperature conduction plate (903) to rotate along the trajectory of the second guide groove (2031), and performs a linear test on the chip; S2: When the plurality of temperature control plates (206) rotate, they contact and squeeze the elastic expansion frame (701), and the elastic expansion frame (701) is squeezed to cause the liquid in the U-shaped tube (801) and the temperature control tube (804) to flow at a high speed, thereby causing the temperature of the chip slot (605) to increase or decrease along with the temperature of the plurality of temperature control plates (206) and the temperature conduction plate (903); S3: After the linear test is completed, the electromagnet (901) is turned off, so that the temperature conduction plate (903) is moved away from the plurality of temperature control plates (206), and then the lifting plate (301) is pressed downward, so that the plurality of guide blocks A (204) are inserted into the special-shaped track (202), and the moving trajectory of the slide bar (205) is changed, thereby performing an instantaneous test on the chip.

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